UNIVERSITI TEKNIKAL MALAYSIA MELAKA

FACULTY OF ELECTRICAL ENGINEERING

INDUSTRIAL TRAINING TECHNICAL REPORT

Student Name : Ooi Jia Sheng

Course : Bachelor of Electrical Engineering
Year : 2017
Training Period : 19 June 17 – 25 August 17
Company Name : WD Media (Malaysia) Sdn. Bhd.
INDUSTRIAL TRAINING TECHNICAL REPORT
AT
WD MEDIA (MALAYSIA) SDN BHD

Period of Training:
19/6/2017-25/8/2017

Submitted By:
Ooi Jia Sheng

This Technical Report for Industrial Training is submitted to

Faculty of Electrical Engineering,
Universiti Teknikal Malaysia Melaka
In partial fulfillment for Bachelor of Electrical Engineering

Faculty of Electrical Engineering

Universiti Teknikal Malaysia Melaka
(August 2017)

i
ii
 ABSTRACT
Western Digital (WD) is a well know international company and one of the largest
computer HDD manufactures in the world. I decided to join WD internship program for 10
weeks as it could be my stepping stone for my future career. During my internship period, I
was assigned to the R&D Sputter Department and my supervisor was Mohd Taufik Azmi. I
gained a lot of knowledges which include sputtering process, media structures, power supply,
process of making media and so on.

This report contains four chapters, which are introduction, training program, training
assignment and conclusion. The content of all chapters are broadly explained and they are
constructed from what I had learned. For the first chapter (introduction), I have further
explanation about company background which including company history, slogan, facilities,
IMS and so on. The second chapter is the most interesting chapter. This chapter includes all
the concepts and theories that I had learned during my internship. Technical issues and
problems can be solved by applying those knowledges. Chapter 3 will explain about the
assignment that I had involved. I assisted my supervisor in various ways. Chapter 4 will be
the last chapter and the content includes conclusion and individual comments. The
knowledges and experiences will eventually help us to get better ideas for final year project.

iii
 ACKNOWLEDGEMENTS
I successfully completed my industrial training at Western Digital. It was a great
chance for my learning. During my internship period, I have received generous help and
guidance from many wonderful people.

First of all, my special gratitude goes to Mr. Chan Ming Liang, the Senior Manager.
He gave me the opportunity to undergo industrial training at Western Digital. He arranged
En. Mohd Taufik Azmi, Senior Engineer as my supervisor and hoped I could learn from him.
I would like to express my deepest thanks to my supervisor. Without his constant support
and valuable advices from time-to-time, I would probably fail to complete the work in an
appropriate manner. I realized that learning theoretical is never the same when it comes to
practice. Other than that, I also appreciated the guidance and sharing given by Mus Aizat
Khairudin (Tech 4), Muhammad Faiz (Senior Principle Engineer), Kyongha Kang,D.Phil
(Managing Sr. Teachnologist), and Benjamin (Engineer). They enhanced my knowledge and
my practical skills.

Ten weeks of internship at Western Digital was a big milestone in my career

development. I wished I could continue cooperating with all of them in the future. Lastly, I
apologized to all other unnamed persons who had helped me in various ways to have a good
training.

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 TABLE OF CONTENTS
CHAPTER CONTENT PAGE
STUDENT DECLARATION ii
ABSTRACT iii
ACKNOWLEDGEMENTS iv
TABLE OF CONTENTS v-vi

1 INTRODUCTION
1.1 Company Background
1.1.1 History of Western Digital Corporation 1-4
1.1.2 Western Digital Slogan 5
1.1.3 Integrated Management System (IMS) 5
1.1.4 About Western Digital Penang (PN1 & PN2) 6-8
1.2 Scope of Training 9

2 THE TRAINING PROGRAM

2.1 Basic Knowledge About Media
2.1.1 Hard Disk Drive (HDD) Components 10
2.1.2 The Magnetic Storage 11-12
2.1.3 The M-H Curve 13-14
2.1.4 Grains 14
2.1.5 Areal density & Thermal Decay 15
2.1.6 Tri-Lemma 16
2.1.7 Media Structure 17-18
2.2 The Process of Making Media 19-20
2.3 Sputtering Process 21
2.3.1 DC Sputtering 21
2.3.2 DC Magnetron Sputtering 22
2.3.3 Cathode Magnet Design 23
2.3.4 Functions of Carrier 24

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 2.4 Power Supply 25
2.4.1 Method to Target The Critical Chambers 26-27
2.5 Type of Tester 28
2.5.1 VSM Tester 29-33
2.5.2 Guzik Tester 34-36

3 TRAINING ASSIGNMENT/PROJECT
3.1 Power Usage Trend 37-38
3.2 Analyze XRF Data 38-39
3.3 Start Up Checklist 40
3.4 Data Package 40-41
3.5 Adjustable Magpack & Adjustable Cathode Spacer 42-43
3.6 Auto Power Adjustment (APA) 44
3.7 Events and time planning 45

4 CONCLUSION AND SUGGESTION

4.1 Conclusions 46
4.2 Suggestions 47

APPENDICES
Reference 48
Poster 49

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 CHAPTER 1: INTRODUCTION
1.1 INDUSTRY BACKGROUND

Western Digital Corporation (commonly referred to as Western Digital, WDC or WD) is

an American computer data storage company and one of the largest computer hard disk
drive manufacturers in the world. WD has over 42,000 employees worldwide.

1.1.1 HISTORY OF WESTERN DIGITAL CORPORATION

[ 1970s ]

Western Digital was founded on April 23, 1970, by Alvin B. Phillips. WD initially
financed with start-up capital provided by investors and Emerson Electric Company. In the
early years of 1970s, WD make profits by selling calculator chips and successfully transform
into largest independent calculator chip maker in the world in 1975. However, the oil crisis
(mid-1970) and bankruptcy of Bowmar Instrument (biggest calculator customer) caused WD
declared Chapter11 bankruptcy in 1976. After this, Emerson decided not to continue
cooperate with WD. WD introduced several landmark products during this time. The first
disk drive controller (1771 chip) was introduced and it was very successful and extremely
profitable.

[ 1980s ]

In the early 1980s, WD focus on making hard disk drive controllers. In 1982, WD
successfully won the contract to provide IBM with controllers for the PC/AT. The controller
(WD1003) became the basis of ATA interface. Throughout most of the 1980s, the family of
controllers based on the WD1003 provided the bulk of WDC's revenues and profits. WD
purchase a number of hardware companies during mid of 1980s. These included graphics
cards, core logic chipsets, SCSI controller for disk and tape devices, and networking. Besides,
WD also gained a foothold in this growing sector by acquiring Tandon drive manufacturers
in 1988. WD convert Tandon's production line into a smoother and more profitably run
facility.

1
[ 1990s ]

In the early years of 1990s, WD faced a lot of challenges and problems. The company
reported that large-scale layoffs, financial write-offs, and debt restructure were necessary to
keep Western Digital afloat. In 1992, WD hired Charles A. Haggarty and he filled variety of
executive management needs. He was the first elected director, then chairman, and then CEO
of the company. Under his leadership, WD switch to integrated disk drive storage. The first
3.5-inch, 1-GB, 3-platter Enhanced IDE drive was produced in 1994. Integrated Drive
Electronic (IDE) also known as hard drive interface, had more expansion options and faster.
A year later (1995), WD IDE storage was increased to 1.5 GB.

Besides, WD also become the first U.S.-headquartered, multinational company to be

awarded ISO 9001 status by the International Standards Organization in year 1994. However,
WD still facing some troubles such as overproduction, struggle to keep up with advanced
technology and so on.

[ 2000s ]

In 2003, WD acquired most of the assets of Read-Rite Corporation. In the same year,
WD offered the first 10,000 rpm Serial ATA HDD (Raptor), with a capacity of 36 GB. Soon,
the 74 GB WD740GD followed, which was also much quieter. In 2004, Western Digital
redesigned its logo. The design of new logo focusing on the company's initials ("WD"). In
2005, Western Digital released the 150 GB version, the WD1500, which was also available
in a special version with a transparent window.

In 2006, Western Digital introduced My Book line .My Book line is a desktop product
about the size of a medium-thickness paperback. WD has steadily built up its capacity and
speed from time to time. In 2007, WD acquired magnetic media maker, Komag. WD also
started to produce the Green Power (GP) hard drives which reduce energy consumption and
heat dissipation.

2
 In 2008, WD announced the next generation of Raptor series hard drives. The new
drives, called WD VelociRaptor, featured 300 GB capacity and 35 percent faster than the
previous generation. In March 2009, WD entered the solid-state drive market with the
acquisition of Siliconsystems Inc. On July 2009, WD announced the first 1 TB mobile hard
disk drive.

[ 2010s ]

In April 2010, WD acquired the magnetic glass media sputtering operations of HOYA
Corporation and HOYA Magnetics Singapore Pte. Ltd (HOMS). The purchase of HOMS
gave WD an opportunity to produce high-end hard disk drives using magnetic glass media.
In October 2010, Western Digital announced the first 3 TB internal hard disk drive. In March
2011, Western Digital agreed to acquire Hitachi Global Storage Technologies, for about $4.3
billion of which $3.5 billion was paid in cash and the rest with 25 million shares of Western
Digital. A year later, WD completed the acquisition and became the largest traditional hard
drive manufacturer in the world.

In July 2012, WD announced a "Red" series of drives. This series of drives has a
special firmware designed for Home/Small Business environments. In November 2012, WD
announced a 4 TB internal hard disk drive, 7200 rpm drive belonging to the "Black" series.
In 2013, WD invest US $200 million to expand in Thailand. Operations resumed in Thailand
after it recovered from damage during the 2011 floods. In November 2013, WD introduced
new helium-filled 6 TB Ultrastar He6 hard disk drives. In February 2014, WD announced a
new "Purple" series of hard disk drives for use in video surveillance systems, with capacities
from 1 to 4 TB. This line was later expanded to include 5 and 6 TB models. In September
2014, Western Digital's HGST division introduced new helium-filled 6 TB, 8 TB and 10 TB
HDDs. In the same year, WD also acquired Skyera, a flash-based storage development
company.

3
 In 2015, Western Digital redesigned the My Passport Ultra series of portable hard
disk drives by adding a 3 TB storage capacity. In May 2015, WD also launched the “Blue”
series of solid-state hybrid drives, with a 4 TB desktop drive and a 1 TB laptop drive as the
first in the series. After 3 months, WD added higher-capacity (2–6 TB) 5400 rpm models to
“Blue” series. At the same time, WD also added 5 TB and 6 TB models to its “Black” and
“Red Pro” series of hard disk drive. In May 2016, Western Digital acquired SanDisk for
US$19 billion. In April 2017, WD moves its headquarters from Irvine California to San Jose
California.

4
1.1.2 WESTERN DIGITAL SLOGAN

1. Think Big

We have the courage to ask “What if” and “Why not”. We see beyond the here and now, and
ahead to future possibilities

2. Make it happened

We see challenges as opportunity and tackle them with optimism, we deliver excellence for
customers, partners, and each other.

3. Do it together

We embrace different perspectives, drawing expertise from across our businesses to deliver
stronger solutions. We win by building strong partnerships with each other, our customers
and our communities.

1.1.3 INTEGRATED MANAGEMENT SYSTEM (IMS)

1. Qualify Management System (ISO9001)

2. Environmental Management System (ISO14001)

3. Occupational Health and Safety Assessment Series (OSHAS)

5
1.1.4 ABOUT WESTERN DIGITAL PENANG (PN1 & PN2)

Figure 1 PN1 Figure 2 PN2

Western Digital has 2 plants located in Penang Malaysia, which are PN1 and PN2
(Figure 1 & Figure 2). Both plants are responsible to product good quality media. PN1 has
13 production line (MA17-MA29) and PN2 has 7 production line (MA10-MA16). Currently,
our company added 4 production lines (MA30-MA33) which resulted in a total of 24
production line. Figures 3 and Figure 4 below show the emergency escape route of PN1 and
PN2 respectively.

Figure 3 Escape route (PN1) Figure 4 Escape route (PN2)

6
Table below shows the facilities of Western Digital that located in Penang. (PN1)

Table 1 Facilities

WD Lobby WD Canteen

WD Office WD Clinic

WD Lecture Hall WD Meeting Room

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WD Gym Room Gym Restroom

WD Fitness arena WD Store

Production Line Call room

8
1.2 SCOPE OF TRAINING
1. Learn media manufacturing processes, sputter process in particular. Additionally,
learn about sputtering equipment.
2. Get familiarized with magnetic recording concept and basic knowledge of media.
3. Familiarize with various types of tester
4. Support in project –Power supply & Auto Power Adjustment (APA) development.
5. Support sputter process team in their engineering evaluations.
6. Documentation, data crunching and analyze data
7. Support startup machine after CU-- Power readback, XRF analysis, and Recipe
development.

9
 CHAPTER 2: TRAINING ACTIVITIES

2.1.1 HARD DISK DRIVE (HDD) COMPONENTS

A hard disk drive (Figure 5) is a non-volatile memory hardware device that

permanently stores and retrieves data on a computer. Hard disk drive can store a lot of data’s
such as operating system, personal files, videos, songs and so on. Nowadays, a hard disk
drive consists of one or more platters (disk/ media).

Figure 5 Hard disk drive

There are 4 major components inside the hard disk drive. Table 2 shows the functions of each
component.

Table 2 Major components

Components Functions
Platters Platters are circular and thin metal disk. Platters responsible for
storing data. Data is stored on the disk in track, sectors and cylinders.
Spindle The spindle keep the platters in position and rotate them as required.
The read/write arm The read/write arm also called as actuator arm. Actuator arm include
the read/write head that floats just microns away from the platter.
Actuator arm move the read/write head to the right position.
Meanwhile, the function of the head is to read and record magnetic
pattern which stored on the platter.
Actuator Actuator receives information form the device circuit board and
controls the movement of the read/write arm. Actuator positions the
actuator arm so it lines up with the platter to read and write data.

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2.1.2 THE MAGNETIC STORAGE

Magnetic storage (Figure 6) is the storage of data on a magnetized medium. Magnetic

storage is one of the most widely used types of digital data storages. Besides, magnetic
storage is a form of non-volatile storage. Because of that, no loss of data when the storage
device is not powered. Meanwhile, digital data consists of binary information, which is data
in the form of zero and one. There are two types of magnetic polarities (Table 3), each one
used to represent either one or zero.

Figure 6 Magnetic storage & polarities

Table 3 Blocks
Blocks Explanation
Red block  Represent “1” bits
 North pole facing up
 South pole facing down
Blue block  Represent “0” bits.
 North pole facing down
 South pole facing up

The read/write head is basically an electromagnet. The magnetic fields are produced
by the head and direct into a bit (single block). The block will eventually get magnetized.
When the direction of magnetic fields same as Figure 7, the block will get magnetized by
showing North Pole facing up and South Pole facing down. When the direction of magnetic
fields same as Figure 8, the block will get magnetized in opposite direction by showing North
Pole facing down and South Pole facing up.

11
Figure 7- Record bit 1

Figure 8 - Record bit 0

12
2.1.3 THE M-H CURVE

Iron (Fe), Nickel (Ni), and Cobalt (Co) are ferromagnetic elements. Their individual

atoms have a slightly higher degree of magnetism due to their configuration of electrons.

Ferromagnetic able to retain magnetic properties after external magnetic field is removed.

This is useful as a magnetic memory device. Figure 9 shows the M-H curve and the Table 4

shows the explanations of the curve.

Figure 9 M-H Curve.

Table 4 Explanation for M-H Curve

Figure Explanation
When a ferromagnetic material is in the unmagnetized condition, the
magnetic domains are randomly oriented.

Domains start to rotate when apply magnetic field. Meanwhile, this is the
minimum magnetic field to change the magnetization direction (Hc).

13
 When increase the strength of magnetic field until certain value (Hs), the
domains will have the same direction and parallel to the magnetic field.
The “1” bit successfully stored in the media.

2.1.4 GRAINS

1 bit consists of many small magnetic grains. The bit size is 80nm x 20nm, which is 1000
times smaller than diameter of human hair. Figure 10 shows the relationship of grains and
bit.

Figure 10 Grains

Once data stored in the media, the data will remain in the media until it is overwritten. Figure
11 shows the process of overwrite.

Figure 11 Overwrite

14
2.1.5 AREAL DENSITY AND THERMAL DECAY

Table 5 Areal density & Thermal Decay

Track Bit
length
Track
width
(MTW)

Formula
 Areal density = (bit density) x (track density)
 Shorter bit length = Higher bit density
 Narrower Track width = Higher track density

In this industry, size of a bit must as small as possible because smaller bit can increase
the capacity of storage. A smaller bit will eventually reduce the bit length, narrower track
width and reduce the size of grains. Based on the formula given (Table 5), a smaller bit will
have higher areal density. The recorded magnetic grains were stable when areal density is
low.

When the areal density is getting higher, small grains will degrade magnetization.
High temperature is easy to degrade the magnetization and cause the small grains to change
direction easily. Hence, the signals will disappear (loss of data) after some time. Thermal
Decay occurred. Figure 12 shows the result of thermal decay.

Figure 12 Thermal Decay

To increase the stability, higher energy materials are needed for smaller grains.
However, higher energy materials will directly increase the difficulty of overwrite.

15
2.1.6 TRI-LEMMA

There are four main factors (Table 6) that need to consider when design media.
However, it is impossible to improve all the factors at the same time. This is due to Tri-
Lemma theory (Figure 13).

Table 6 Media/disk factors

Four main factors to design a better media/disk:
 Increase capacity of storage
 Increase writability (overwrite)
 Increase thermal Stability
 Increase S/R ratio

S/N ratio can be increased by strengthening the signals as much as possible. Hence,
smaller grains are required to reduce the noise. When reduce the size of the grains, the grains
become not stable and easy to decay. Because of that, higher energy material is needed for
stability. However, higher energy materials will directly increase the difficulty of overwrite.

As a conclusion, there is a strong connection between S/N ratio, thermal stability and
overwrite. These factors will eventually affect each other’s when making adjustment. Hence,
engineers are required to find a balanced point between these 3 factors.

Overwrite

Thermal
Grain
Stability
size

Figure 13 Tri-Lemma

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2.1.7 MEDIA STRUCTURE

Figure 14 Media structure

Table 7 Media Layers

LAYERS FUNCTIONS
Carbon  To protect the magnetic layer of the media
Protective  Thickness of the layer will eventually affect the performance of Read Write.
Layer
Cap Layer  Control the exchange coupling between grains.
Exchange  EBL between Granular Magnetic Layers
Brake Layer Controlling magnetic coupling between lower and upper magnetic layers.
(EBL)  EBL between Granular Magnetic Layers and Cap Layer
Controlling magnetic coupling between magnetic layer and the cap layer
Granular  The most important layer for media
Magnetic  Magnetic performance, Ku, Hc, and etc depend on composition and structure.
Layer
Grain  Control of initial growth of Granular Magnetic Layer
Isolation  Reduce the media noise due to strong magnetic coupling between neighboring
Intermediate grains
Layer  Support grain boundary of Granular Magnetic Layer
(GIIL)

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Ru Layer  Making bumped structure for grain isolation
 Low pressure layer: Making initial growth of Ru(hcp) layer
High pressure layer: Making bumped structure for grain isolation
Seed Layer  Crystal Seed Layer : Promotion of Ru initial growth
 Amorphous Seed Layer : To smoothen the SUL surface
Soft Under  Focusing writing field to on track
Layer
(SUL)

 Current SUL using Anti Ferro Coupling (AFC) structure. AFC structure able
to cancels spike noise.
 Spike noise is caused by Bloch wall.

18
2.2 THE PROCESS OF MAKING MEDIA

Wash the substrate Sputtering Lube Test

(glass/ aluminum)

Table 8 Process of making media

Wash the substrate
 Before undergo sputtering process, the disk need to be cleaned so that it’s free of any
particle, scratches or contaminants.
 Immerse the disk into soapy solutions for cleaning, follow by multiple rinses in
deionized water. After that, the machines will dry out the disk.

Sputtering
 Undergo sputtering process.
 Sputtering have high deposition rate and also easy to control.
 Electric discharge make Ar plasma. Ar+ ions hit the surface of the target. Hence, the
target materials deposited on the substrate.
 There are many chambers (P1-P21) in one system.(Figure 15)
 Each chamber will sputter different materials on the substrate.

Figure 15 Chambers in one system

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 Lube
 Apply a lubricant layer to the media.
 Surface roughness limits how low a head can approach the media and also increase the
noise.
 By applying a lubricant layer, the surface of the media could become smoother.

Test
 The final step of making the media.
 Type of test  Performance test and quality test
 Figure 16 shows Glide test (quality test). During the glide process, a specially made
head is 'glided' over the surface of the platter to detect any remaining asperity on the
media.
 This process is to ensure the head will be able to fly over the surface of the disk without
crashing into any projections.
 Besides, use Guzik (performance test) to test performance of the disk.

Figure 16 Glide test

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2.3 SPUTTERING PROCESS

Sputtering is a process whereby particles are ejected from a solid target material due
to bombardment of the target by energetic particles. Sputtering have high deposition rate for
metal layers. Figure 17 shows the sputtering chambers.

Figure 17 Sputtering Chambers

2.3.1 DC SPUTTERING

DC Sputtering (Figure 18) is a Thin Film Physical Vapor Deposition (PVD) Coating
technique where the target material to be used as the coating. There are 2 major advantages
of DC as a power source, which are easy to control and low cost. The vacuum chamber is
evacuated to a base pressure removing H2O, Air, and then backfilled with a high purity inert
process gas (Argon, Ar). Supply DC electrical current to the target coating material (cathode).
Ionized gas molecules (Ar+) will bombard with the target. The particles ejected from the
target will deposit on the substrate (anode).

Figure 18 DC Sputtering
21
2.3.2 DC MAGNETRON SPUTTERING

DC Magnetron sputtering (Figure 19) uses a closed magnetic field to trap electrons,
enhancing the efficiency of the initial ionization process. DC Magnetron Sputtering allows
for higher current at lower gas pressure that achieves an even higher thin film deposition rate.

Figure 19 DC Magnetron Sputtering

Based on Figure 20, Path Through Flux (PTF) is the flux from magnet to the surface
of target. Higher PTF makes higher plasma density. The deposition rate also will increase.
But, the highest PTF will have the deepest erosion. Higher PTF design is important as it can
increase the deposition rate and also utilize the target.

Figure 20 PTF

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2.3.3 CATHODE MAGNET DESIGN

a) Higher PTF

Reduce target thickness and use stronger magnet are required to obtain higher PTF (Figure
21).

Figure 21 Higher PTF

b) Wide erosion magnet design

By moving the magnet positions, the target will have wider erosion. This design increases
the target lifespan, produces uniform thickness at the substrate (anode), and particle
reduction.

Figure 22 Wide erosion

Currently, media sputtering machine uses circle shape target, which is Rotation Magnet
Cathode (Figure 23).

Figure 23 Rotation Magnet Cathode (RMC)

23
2.3.4 FUNCTION OF CARRIER

Figure 24 Carriers

Figure 24 shows the structure of carrier. A carrier is provided to hold a disk while
magnetic materials is plated simultaneously on the two surfaces of the disk. 30 carriers will
be prepared for one system. Extra carriers are prepared for backup purpose.

The carriers will get deposited when undergo sputtering process. Eventually, flaking
occurred when the carries getting thicker and thicker. The flake materials will contaminated
the chambers and also the disks. To overcome this issue, carriers need to be change after 5-
6days (maintenance). Besides that, engineers are required to use digital calipers to measure
the gap between the disk and the carrier. This action is needed to ensure the disk always place
in center position.

Current top gripper support (D2) that allows certain flex will cause the disk offset from
centering. Hence, engineers suggest to make some improvements by extending the shoulder
(Figure 25) to limit the gripper flexing distance.

Figure 25 Extending the shoulder

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2.4 POWER SUPPLY

POWER
COP CC LINK TARGET
SUPPLY

Sputtering process required power supply (Figure 26). For an example, a specific
chamber with power supply of 3kW requires 100W for sputtering process. Theoretically, the
3kW power supply will generate exactly 100W to the specific chamber for sputtering process.
But, the resolution of the power supply will cause the power supply fail to generate a stable
100W.

Low power supply will definitely have better resolution. Hence, the objective of my
supervisor's project is to improve process variation by using better resolution of power
supply. There are 3 categories for power supply, which are 500W, 1.5kW, and 3kW.
Nowadays, Pinnacle (1.5kW) is the most common power supply that can be found in the
markets. Hence, my supervisor requires to change the 3kW power supply to 1.5kW.

There are plenty of chambers in one sputtering system and each chamber has its own
power supply. It is not possible to change all the power supply to 1.5kW at the same time
because it could easily affect the result of overwrite, S/N ratio, and so on. Hence, only
selected chambers are required to change power supply from 3kW to 1.5kW

Figure 26 Power Supply

25
2.4.1 METHOD TO TARGET THE CRITICAL CHAMBERS

Example 1

Figure 27 5N5
Table 9 Steps to target chambers (5N5)
Step 1
Target the specific chamber with the P/S rating of 3kW.
Step 2
Split into 2 group SUL1-GIIL (P1-P9)  Set the specific chamber to 2nd priority
 2nd priority
Mag 1- Cap (P10-  Set the specific chamber to 1st priority
P20) when respond coefficient is high (> 0.05).
1st priority
 Set the specific chamber to 2nd priority
when respond coefficient is low (<0.05).

26
Example 2

Figure 28 5E4
Table 10 Steps to target chambers (5E4)
Step 1
Target the chamber with P/S rating which is 3kW.
Step 2
Split into 2 SUL1-Heater  Set that specific chamber to 2nd priority
group (P1-P10)
Special case **
 2nd priority Set chamber P9 (GIIL) to 1st priority. From previous
experience, P9 always affect the result of overwrite.
This issue can be solved by changing the power
supply to 1.5kW.
Mag 1- Cap 1  Set the specific chamber to 1st priority when
(P11-P21) respond coefficient is high (> 0.05).

1st priority  Set the specific chamber to 2nd priority when

respond coefficient is low (<0.05).

27
2.5 TYPE OF TESTER
Table 11 Type of tester

Type of Tester
1. VSM 2. Guzik
Functions : Functions :
Test the SUL layer. Test the magnetic layers. Require longer
time but more accurate readings.

3. Polar Kerr 4. Ellipsometer

Functions : Functions :
Test static(Hc , Hn, Hs, S*, IDOD) and Test the carbon thickness.
KuVkT (thermal decay)

5. Raman 6. XRD,XRF,XRR
Functions : Functions :
Test the carbon thickness XRD- Test the orientation of the disk
XRF,XRR - Test the thickness of each layer

28
2.5.1 VSM TESTER
a) Steps to use VSM Tester.

Table 12 Steps to use VSM Tester

Step 1
Use drilling machine to drill the sample disk to obtain small piece of sample.
2 type of drilling machine (type A and type B)
Type A drilling machine responsible to drill the disk which made of aluminum.
Type B drilling machine responsible to drill the disk which made of glass.

Type A Type B
Step 2
Remove another side of magnetic layer by using sanding machine.

Step 3
Place the small sample in the VSM and run the test.

29
 Step 4
Wait patiently. The results can be obtained in couple of minutes. Collect and analyze the
results through computer.

b) Steps to check VSM data & update data online

Type of sample disk: MA26-5N5C VSM SAMPLE

Table 13 Steps to check VSM data & upload data

Step 1
1. Enter the template. (Same as Figure below)
2. Select the column “SUL and Hex For EV series (9.09d)”.
3. Select Normal recipe.
4. Select VSM2.

30
 Step 2
The system will pop up another tab ( Prodcution and Characterize )
1. Select Product type : 5N5
2. Select Alumi (PN1)
3. Select System Anelva: MA26
4. Select System update product : MA26 5QW
5. Double click sample text box
6. Select “Prod”
7. Double click Remark box
8. Select Insert

Step 3
Data obtained for position 1 surface A and surface B.
a) Position 1 Surface A

31
b) Position 1 Surface B

Step 5
Follow the step :
Internet explorer  WDMOApplications Penang Data analysis  PN
mOLSPSC(new)  Status/Chart Page  Sputter  MA26 VSM

32
 Terms Definition SUL A/B Pos1 HEX A/B Pos1
UCL Upper Control Line 32 30
CL Centre Line 27 20
LCL Lower Control Line 22 10
Surface A
The reading of SUL (26.42nm) fall in the range bewteen UCL and LCL.
The reading of Hex (50Oe) does not fall in the range bewteen UCL and LCL.
Surface B
The reading of SUL (28.44nm) fall in the range bewteen UCL and LCL.
The reading of Hex (40Oe) does not fall in the range bewteen UCL and LCL.
Step 4
Upload the data by follow the steps below.
Internet explorer  WDMOApplications Penang Data analysis  PN
mOLSPSC(new)  Data Collector  VSM Data Collector  VSM

1.Fill in the details.

2.Select save.

33
2.5.2 GUZIK TESTER

Guzik is a magnetic recording tester. Guzik provides a test solutions aimed at

verifying signal and overall magnetic recording integrity for disk drive head and media.
Guzik tester is commonly used in research and development of hard disk drives and drive
components. By using Guzik tester, engineers able to predict the drives performance. Figure
29 shows the average data for Reference disk, ride along disk and slot in.

Figure 29 Average data (Guzik)

By comparing the data of reference disk, the changes (∆) of ride along disk, sample
disk, and slot in disk can be obtained. Based on Figure 30, the overwrite of reference disk is
28.5dB and the ride along disk is 27.9dB. Hence, the changes (∆) will be -0.6.

Figure 30 The changes (∆) based on reference disk

34
 To improve the accuracy of the results, two or more disks (same build) will undergo
Guzik test (Figure 31). The readings of average, standard deviation, standard error,
minimum, maximum, range, and count can be obtained easily.

Figure 31 Disk (same build) data

Types of disks

When undergo Guzik test, 4 types of disk can be found, which are reference disk, ride along
disk, sample disk and slot in.

Figure 32 Disk category

35
Disk code

Table 14 shows the explanations of the disk code. Each chamber contains two disks (P1 &
P2) that will undergo sputtering process at the same time. Meanwhile, each disk have two
surfaces, which are front (S1) and back (S2).

Example 1: PNLEU1.1 (CS5)-31A Example 2: 23J25P1S1

Code Explanation
Exp 1: PNLEU1.1 (CS5) Models/Type/build of the disk
Exp 2: 23J25
31 ID of sample disk
P1 Position 1
P2 Position 2
S1 / A Surface 1 ( front )
S2 / B Surface 2 ( back )

Table 14 Disk code

36
 CHAPTER 3: TRAINING ASSIGNMENT/PROJECT

3.1 POWER USAGE TREND

Engineers need to analyze the power usage trend and make prediction for the next
cycle. Meanwhile, events such as Carrier change Youtec (CCYT), Carrier Change on the fly
(CCOTF) and Clean Up (CU) able to affect the power usage trend. Figure 33 shows the data
of power usage of MA23 (example) in one cycle. Summaries and simplified the data are
needed before plot graph.

Figure 33 Data of power usage of MA23 (P1-P20)

Table 15 Steps (power usage trend)

Objective
Analyze the power usage trend and make prediction for the next cycle.
Steps
1. Separate into 4 categories
2. Mag1-Mag5, ECL1-ECL5, Others, and Mapack (EBL2 & EBL3)
3. Create own template.
4. Obtain power usage for each category (1 cycle)
5. Plot graph for each category , DET# (X-axis) and power usage (Y-axis)
6. Obtain maximum target life for each category (1cycle)
7. Plot graph. DET# (X-axis) and max target life ( Y-axis)
8. Analyze the power usage trend.

37
Figure 34 shows the example of summarize data and graph.

Figure 34 Data and graph after summarize (power usage trend)

3.2 ANALYZE XRF DATA

Function of XRF tester is to measure the thickness of each layer. Thickness of each
layer must fullfill the requirements to maintain the performance of the media. Figure 35
shows the raw data of XRF.

Figure 35 XRF Raw data

38
 Table 16 Steps (XRF)
Objectives
- Summarize the XRD raw data based on media layers
- Plot graph for each layer
- Analyse the graph for APA purpose.
Steps
1. Obtain max target life, average XRF (OD) , average XRF power for each layer.
2. Create own templates for better understanding.
3. Plot the gragh (scatter) for each layers.
4. Each graph must include max target life (X-axis), average XRF (Primary Y-axis) and
average XRF power (secondary Y-axis) .
5. Analyse the graph.

Figure 36 shows the example of summarize data and graph for single layer.

Figure 36 Summarize data and graph for single layer (XRF)

39
3.3 START UP CHECKLIST
Figure 37 shows the example of start up checklist. Start up checklist must include the

composition , target, SV at COP , cathode spacer,power supply , magpack,and APA of each

chamber. Each settings and requirements must exactly same as the checklist before start a

new cycle. Engineers are required to buy off before start a new cycle.

Figure 37 Start up checklist

3.4 DATA PACKAGE

Figure 38 shows the example of the raw data. Each layer (ID, MD, OD) will have their

own raw data which including Hc, Hn, S*, IDOD, KuVkT.

Figure 38 Raw data

40
 Figure 39 shows the example of Static summary. Summaries the data from the raw

data by calculating the standard deviation and average of Hc, Hn, Hs, S*, IDOD, KuVkT for

OD, MD, ID layer. Besides, static summary also can consider as KPOV of that build. Every

build will have their own static summary.

Figure 39 Static Summary

Figure 40 shows the example of process setting. Each chamber (P1-P20) will have their

own power settings (Recipe). Target life, cathode spacer, SV, Dur, and pressure of each

chamber also included in the table of process setting.

Figure 40 Process Settings

41
3.5 ADJUSTABLE MAGPACK & ADJUSTABLE CATHODE SPACER
Adjustable Magpack and adjustable cathode spacer are used to control the ramp of
media. Table 17 shows the differences between adjustable Magpack and adjustable cathode
spacer.

Table 17 Differences of adj. Magpack & adj. cathode spacer

Adjustable Magpack Adjustable cathode spacer
Mostly used in the production line. Mostly used in the NPI (new product )
Mostly for Mag and EBL layers. Mostly for EBL layers only.

Table 18 shows the types of ramp and the formulas. Figure 41 shows the curve of
Mag1 and ECL. The behaviors of overwrite (OW2) and coercivity (Hc) can be observed
form the graph.

Table 18 Type of ramp

RAMP = OD – ID

Types of ramp Formulas

Static ramp Hc of OD - Hc of ID
Guzik ramp OW2 of OD - OW2 of ID
.
XRF ramp Thickness of OD - Thickness of ID

40 MAG 1 40 ECL

20 20

0 0
0 5 10 15 0 5 10 15
Power
Hc OW2 Power OW2
Hc

Figure 41 Curve of Mag 1 and ECL

42
 Table 19 shows the XRF ramp and Table 20 shows the Static ramp and Guzik ramp.
XRF ramp, Static ramp and Guzik ramp are controllable by adjusting the Magpack or
Cathode spacer at different layer . Meanwhile, adjust Magpack or Cathode spacer at different
layer will eventually affect the reading of Hc and OW2.

Table 19 XRF ramp

Move ID thickness Increase Decrease

Out increased Hc of ID OW2 of ID
Magpack
ID thickness Decrease Increase
Move In decreased Hc of ID OW2 of ID
Mag 1
Move ID thickness Decrease Increase
Cathode Out decreased Hc of ID OW2 of ID
Spacer ID thickness Increase Decrease
Move In increased Hc of ID OW2 of ID
XRF ramp
Move ID thickness Decrease Increase
Out increased Hc of ID OW2 of ID
Magpack
ID thickness Increase Decrease
Move In decreased Hc of ID OW2 of ID
ECL
Move ID thickness Increase Decrease
Cathode Out decreased Hc of ID OW2 of ID
Spacer ID thickness Decrease Increase
Move In increased Hc of ID OW2 of ID

Table 20 Static ramp and Guzik ramp

Mag 1 ECL
Magpack Cathode Spacer Magpack Cathode Spacer
+ Increase Hc of ID move Out move In move In move Out
Static ramp
- Decrease Hc of ID move In move Out move Out move In

Mag 1 ECL
Magpack Cathode Spacer Magpack Cathode Spacer
+ Increase OW2 of ID move In move Out move Out move In
Guzik ramp
- Decrease OW2 of ID move Out move In move In move Out

Mag 1 ECL
Magpack Cathode Spacer Magpack Cathode Spacer
move In move Out move Out move In
move Out move In move In move Out

43
3.6 AUTO POWER ADJUSTMENT (APA)

Auto Power Adjustment (APA) is a system that will constantly increase the power
(every hour) for the specific chamber. When undergo sputtering process, the thickness of the
target will reduce from time to time. This is due to the erosion of the target. Because of that,
the thickness and the uniformity of the media will eventually get affected. By increasing the
power, the thickness and uniformity of the media can be sustained. Hence, APA play an
important role when undergo sputtering process. APA is required for every chamber in one
system. Each chamber will have their own APA settings.

Before making any adjustment on APA settings, data crunching and data analysis are
required. Figure 42 shows the trend of specific chamber. The thickness of the media
decreasing when target life increase. Hence, engineers are required to tune the APA setting
in order to sustain the thickness of the media.

Figure 42 Trend of specific chambers

44
3.7 EVENTS & TIME PLANNING

Figure 43 shows the events and time planning.This is one of the assignment provided by my
superviosr. The objective of this assignment is to understand every details of the event.

Figure 43 Events & time planning

45
 CHAPTER 4 CONCLUSION AND SUGGESTION

4.1 CONCLUSION

This internship was a great experience for me. It was a real pleasure working in
Western Digital R&D Sputtering Department. During my internship, I worked with helpful
people in a good atmosphere. They are willing to share their experience and knowledge with
me.

The main objective of an internship is to provide an opportunity for undergraduates

to identify, observe and practice how engineering is applicable in the real industry. My
supervisor, En. Mohd Taufik Azmi was always very enthusiastic on giving me the best
training experience. He prepared different tasks and assignments for me during my
internship. It was really helpful to build up my engineering knowledge. I also learned how to
work perfectly based on the instructions given. Understand the requirements and follow the
rules able to minimize my mistakes while finishing my task. I gained a lot of confidence and
courage in this industry after completing my internship.

In a nutshell, I thoroughly enjoyed the challenges that came along every single day.
This is just the beginning of my career and I wish I could transform into a successful person
in my future.

46
4.2 SUGGESTION

Internships can be the most valuable learning experience that a student can have.
There are several ways to improve the quality of internship. In my opinion, UTeM should
extend the period of internship. Interns are unable to gain extra knowledge due to limitation
of time. Besides, students should also always attend career talks and fair that are being
organized by UTeM. These could help students gain additional information. Juniors also need
to communicate with seniors when they are looking for internship. Based on the
recommendations and guidance form seniors, juniors are able to choose the company with
good reputations. Other than that, I suggest UTeM set up a venue for interns to do
presentations. Interns work very hard at completing their work and are generally proud of
their accomplishments. Hence, interns are able to demonstrate their achievements through
presentations.

47
 APPENDIX

REFERENCES

1. PC Plus, How the humble hard drive is made. Retrieved on January 2010. From
http://www.techradar.com/news/computing-components/storage/how-the-humble-hard-
drive-is-made-667183/2

2. Alex Taratorin, Perpendicular Recording. Retrieved on January 2005. From

http://www.guzik.com/product/guzik-magnetic-recording-systems-and-measurements-
chapter-7/

3. Writer name not stated. Western Digital Corp. Date not stated. From
http://www.referenceforbusiness.com/history2/76/Western-Digital-Corp.html

4. Matt Hughes, What is DC Sputtering? Retrieved on November 2016. From

http://www.semicore.com/news/94-what-is-dc-sputtering

5. Margaret Rouse. Hard disk. Date not stated. From

http://searchstorage.techtarget.com/definition/hard-disk

6. Writer name not stated, Western Digital. Date not stated. From
https://en.wikipedia.org/wiki/Western_Digital

7. Writer name not stated. Magnetic recording medium with grain isolation magnetic
anisotropy layer. Retrieved on September 2008. From
https://www.google.com/patents/US8488276

8. Writer name not stated. Magnetic recording medium having a carbon protective layer
and method for manufacturing the same Retrieved on November 1998. From
https://www.google.com/patents/US5837357

48
49