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Decoupled 4T dynamic CAM suitable for through the use of a high threshold transistor to prevent inadvertent

high density storage pull-down of ML. Subsequently, data is searched by either raising BL
or BLB. If a match occurs, the net2 stays low and the match-line is
M. Chae, J.-W. Lee and S.H. Hong kept floating at a high voltage. If the search fails, the net2 is raised
and ML pulled down. For instance, when net1 is high, M2 is on and
A new four-transistor dynamic CAM (DCAM) is introduced. The M3 is off. If the compared value is also high, forcing BL high and
DCAM design addresses the inherent data retention problem by pro- BLB low, will leave ML in the precharged state indicating a match. If
posing a modified sensing scheme. The results indicate over an order the compared value is low, the high value of BLB will raise net2
of magnitude improvement in data retention time. In addition, the through M2 and pull down ML, indicating a failed search.
DCAM structure realises a decoupled match-line structure, which
enables high density configurations not possible from previous 4T DCAM cell access circuitry: Fig. 2 shows the necessary sensing and
CAM approaches. driving circuitry to access the DCAM. For M2 and M3, each transistor
is illustrated with the parasitic gate-source and gate-drain capacitances
Introduction: The importance of a high density CAM is becoming more because they are the storage media and affect the data retention time.
pronounced as fast and accurate data search operations are the key The relative size difference of M2 (both width and length are proportion-
driving forces in the modern information technology era. It is well ally made large) and M3 in the Figure indicates the reliance of M2 gate
known that hardware search using a CAM or ternary CAM yields the capacitances for data storage on net1. This approach is necessary to both
fastest results. However, a conventional CAM has two major disadvan- maximise the gate capacitance for data storage on the M2 and minimise
tages. The first disadvantage is the large cell size of the CAM. A conven- the effect of gate-source capacitance coupling through M3. If the PMOS
tional CAM requires nine transistors and is larger than a conventional 6T M3 is not properly sized in relation to M2, the data on net1 is adversely
SRAM. The second disadvantage is the subthreshold leakage current, affected, if the net1 stores a low value and a logic 1 search operation is
which becomes worse as the technology is scaled for higher densities. performed. The BL high will be coupled through the gate-source capaci-
Although there are efforts to reduce leakage current using design tance of M3 and raise net1, which in turn prevents M3 from turning on.
approaches [1], the impact is not as high as resorting to costly modifi- But, since M2 is much larger than M3, the coupling effect on the M3
cation of the process technology. However, a possible solution to this side can be moderated such that the PMOS is kept turned off. The oppo-
problem was presented in [2]. Their approach was to use dynamic mem- site effect of M2 weakly turning on, owing to rising of BLB when the
ories. Since dynamic memories only have leakage through the transfer stored data is low, is effectively handled by the use of the high threshold
gates connected to the word-lines (WLs), the leakage can easily be con- transistor for M4. The BL is accessed through M6 and BLB is accessed
trolled by using higher threshold transistors for the transfer gates. through M5. Note that for BLB access, the BLB can be deliberately
Furthermore, a WL has a high capacitance owing to its global connec- forced low using the multiplexer shown in Fig. 2. This is necessary to
tion, and therefore, Vgs of the transfer gate is less susceptible to noise provide the initialisation sequence as well as a data retention improving
coupling. On the other hand, a static CAM cell has the leakage write scheme. The data retention is adversely affected by the capacitive
problem in the two cross-coupled inverters. The internal gates of the coupling between the BLB and the gate of M2. If the gate of M2 was
cross-coupled inverters are more susceptible to noise, owing to small storing a high value, a sudden rise of BLB from 0V to Vdd, pushes
capacitance. This leads to a significant subthreshold leakage current. the gate of M2 to a value much higher than Vdd. This causes a
The proposed DCAM solves these two disadvantages by implementing sudden increase in gate leakage through M2. This effect will be more
a new four-transistor cell in a dynamic configuration. However, using the pronounced as the gate oxide layer thickness is reduced with technology
DCAM creates a new problem of data retention. Therefore, this Letter scaling. On the other hand, gate leakage due to BL side lowering is neg-
focuses on describing the detailed functionality of the proposed ligible since the initial value of BL was 0. Thus, for the proposed
DCAM and on extending the data retention time. DCAM cell, it is important to keep BLB low, most of the time. This cri-
terion is enforced by keeping BLB low during the write operations.
BLB BL
There are, however, further circuit improvements that can be made for
WL refresh operations such as adding a bit-line isolation transistor at location
write (WL = 1)
X in Fig. 2 to limit the swing of BLB at the cell side (BLB above X)
logic1 logic0 while full sensing is allowed on the sensor side (BLB under X). Once
net1 M1
BL BLB BL BLB sensing is under way, the bit-line is cut off at X and the cell side of
1 X 0 X
M2 net2 M3
the BL is pulled down to ground. This will minimise the coupling
search (WL = 0) effect and the gate leakage.
ML
logic1 logic0
M4 BLB BL
BL BLB BL BLB write WL
val_select
1 0 0 1 net1 M1
keep_low G G
WL M2 net2 M3
Fig. 1 Proposed DCAM cell data
S
ML
D D S

datab M4
write
Vdd
4T DCAM cell: The concept of the dynamic CAM was first introduced search precharge ML sap
using five transistors [3]. Since then, efforts have been made to reduce val_select
initialise
X
further the transistor count. A 4T dynamic CAM which was presented keep_low

in [4] suffered match-line leakage owing to match-line coupling WL


data
effects. This effect prevented their use as high density memories. The datab
same group later introduced dynamic CAMs with decoupled match- write
san
lines using more than four transistors [5]. Fig. 1 shows the proposed val_select
four-transistor DCAM cell which is suitable for the high density CAM keep_low M5 M6 write
systems. It also has the decoupled match-line configuration through datab 1
sel
smart_val data
the use of M4. There are basically two types of operation for a typical 0 bleq
Vdd/2 Vdd/2
CAM. One is data write and the other is data search. The data is
stored on the gates of M2 and M3. The tables in Fig. 1 show how the
bit-line values BL and BLB can be forced for write and search. Fig. 2 Proposed and implemented access scheme for DCAM cell
During the write operation, the word-line WL is raised high and BL
and BLB are forced according to the table for logic 1 or logic 0 Results: Fig. 3a shows the entire architecture of the DCAM chip. A 64-
storage. During the search operation, match-line ML is first precharged bit word can be searched from the stored 64 words. It is designed and
to a high value while WL, BL and BLB are held low. This event fabricated using a 0.13 mm seven-layer metal CMOS process. The cell
initialises net2 to a low value. The net2 will have at most |Vtp| (V), was conservatively drawn and was 3.3 × 3.9 mm. By sharing the
where Vtp is the threshold voltage of the PMOS transistor. Therefore, n-well area for PMOS between two cells, it is possible to significantly
the magnitude of the threshold voltage of M4 should be made higher reduce the size. As shown in the Figure, the digital control block

ELECTRONICS LETTERS 31st March 2011 Vol. 47 No. 7


allows a simple serial interface to the DCAM memory array. The chip Conclusion: A four-transistor dynamic CAM cell suitable for high
uses 4 bits of inputs which are ‘reset_n’, ‘clk’, ‘enable’ and ‘input’. density memory configuration is introduced. In addition, owing to the
The outputs are a serial data stream ‘output’ indicating the matched dynamic storage, the low standby power dissipation further helps in
result and a ‘fail’ bit indicating failure to find any matches. In the accommodating higher densities. The proposed DCAM cell, combined
case of multiple matches, the digital controller is designed to output with a modified bit-line control scheme, demonstrated a significant
only the lowest matched address. Two types of tests were performed. improvement in the data retention time.
One was a functionality test to verify write and search operations and
the other was a data retention test. The functionality test showed Acknowledgments: This work was supported by the Korea Science and
expected operation as shown in Fig. 3b. The top trace is the serial Engineering Foundation (KOSEF) grant funded by the Korea govern-
output of the DCAM chip, the second trace is the serial input stream. ment (MEST) (no. 2010-0015259). The CAD tools used in this work
The test involved seven consecutive writes followed by a search oper- was supported by the IDEC
ation. The searched data matches the 64-bit data of the sixth write
which was written in row address 5. The output correctly indicates a # The Institution of Engineering and Technology 2011
match at row address 5 as shown in the blown-up portion of the 17 November 2010
output trace. For the retention test, the ‘val_select’ signal of Fig. 2 is doi: 10.1049/el.2010.7283
used to either select the complementary data signal or zero. When
BLB was kept high, the retention time of data high in net1 was a M. Chae, J.-W. Lee and S.H. Hong (College of Electronics and
mere 83 ms using a 1.2 V power supply. On the other hand, with BLB Information, Kyung Hee University, 1, Seocheon-dong, Giheung-gu,
kept low, the retention time was significantly improved to 1ms. Yongin-si, Gyeonggi-do 446-701, Republic of Korea)
E-mail: daniel@khu.ac.kr

References
input

output 1 Chang, Y.-J.: ‘90 nm TCAM cell design with leakage suppression
write search
command address data technique’, Electron. Lett., 2009, 45, (6), pp. 300– 302
2 bit 6 bit 64 bit
input
2 Barth, J., Plass, D., Nelson, E., Hwang, C., Gredeman, G., Sperling, M.,
input result_n clk enable 0 1 2 3 4 5 6
1 1 1 1
reset_n
enable
Mathews, A., Reohr, W., Nari, K., and Cae, N.: ‘A 45 nm SOI embedded
1
fail
clk DRAM macro for POWER7TM 32MB on-chip L3 cache’. Int. Solid-
fail
digital block 1
output
State Circuits Conf., San Francisco, CA, USA, February 2010,
64 128 pp. 342– 343
ML data,
smart_val 3 Wade, J.P., and Sodini, C.G.: ‘Dynamic cross-coupled bit-line content
address
decision
64 addressable memory cell for high-density arrays’, IEEE J. Solid-State
DCAM
block WL
cell Circuits, 1987, 22, (1), pp. 119 –121
array
sense 128
output 4 Delgado-Frias, J.G., Yu, A., and Nyathi, J.: ‘A dynamic content
amp. BL, BLB
addressable memory using a 4-transistor cell’. 3rd Int. Workshop on
if address 5 matched,
input
Design of Mixed-Mode Integrated Circuits and Applications, Puerto
output
reset_n Vallarta, Mexico, 1999, pp. 110– 113
enable
fail
clk
5 Delgado-Frias, J.G., Nyathi, J., and Tatapudi, S.B.: ‘Decoupled dynamic
address
6 bit
ternary content addressable memories’, IEEE Trans. Circuits Syst. I,
2005, 52, (10), pp. 2139–2147

a b

Fig. 3 Memory system architecture, and write and search test result
a Memory system architecture
b Write and search test result

ELECTRONICS LETTERS 31st March 2011 Vol. 47 No. 7

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