AO4813

30V Dual P-Channel MOSFET

General Description Product Summary

The AO4813 combines advanced trench MOSFET VDS -30V

technology with a low resistance package to provide ID (at VGS=-10V) -7.1A
extremely low RDS(ON). This device is ideal for load switch RDS(ON) (at VGS=-10V) < 25mΩ
and battery protection applications.
RDS(ON) (at VGS = -4.5V) < 40mΩ

100% UIS Tested

100% Rg Tested

SOIC-8

Top View Bottom View D D

Top View

S2 1 8 D2
G2 2 7 D2
S1 3 6 D1
G1 4 5 D1 G G

S S
Pin1

Absolute Maximum Ratings TA=25°C unless otherwise noted

Parameter Symbol Maximum Units
Drain-Source Voltage VDS -30 V
Gate-Source Voltage VGS ±20 V
Continuous Drain TA=25°C -7.1
ID
Current TA=70°C -5.6 A
C
Pulsed Drain Current IDM -40
Avalanche Current C IAS, IAR -27 A
Avalanche energy L=0.1mH C EAS, EAR 36 mJ
TA=25°C 2
PD W
Power Dissipation B TA=70°C 1.3
Junction and Storage Temperature Range TJ, TSTG -55 to 150 °C

Thermal Characteristics
Parameter Symbol Typ Max Units
Maximum Junction-to-Ambient A t ≤ 10s 48 62.5 °C/W
RθJA
Maximum Junction-to-Ambient A D Steady-State 74 90 °C/W
Maximum Junction-to-Lead Steady-State RθJL 32 40 °C/W

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 AO4813

Electrical Characteristics (TJ=25°C unless otherwise noted)

Symbol Parameter Conditions Min Typ Max Units

STATIC PARAMETERS
BVDSS Drain-Source Breakdown Voltage ID=-250µA, VGS=0V -30 V
VDS=-30V, VGS=0V -1
IDSS Zero Gate Voltage Drain Current µA
TJ=55°C -5
IGSS Gate-Body leakage current VDS=0V, VGS= ±20V ±100 nA
VGS(th) Gate Threshold Voltage VDS=VGS ID=-250µA -1.5 -2.0 -2.5 V
ID(ON) On state drain current VGS=-10V, VDS=-5V -40 A
VGS=-10V, ID=-7.1A 17 25
mΩ
RDS(ON) Static Drain-Source On-Resistance TJ=125°C 24 33
VGS=-4.5V, ID=-5.6A 27 40 mΩ
gFS Forward Transconductance VDS=-5V, ID=-7.1A 24 S
VSD Diode Forward Voltage IS=-1A,VGS=0V -0.75 -1 V
IS Maximum Body-Diode Continuous Current -2.5 A
DYNAMIC PARAMETERS
Ciss Input Capacitance 1040 1250 pF
Coss Output Capacitance VGS=0V, VDS=-15V, f=1MHz 180 pF
Crss Reverse Transfer Capacitance 125 175 pF
Rg Gate resistance VGS=0V, VDS=0V, f=1MHz 2 4 6 Ω
SWITCHING PARAMETERS
Qg(10V) Total Gate Charge 19 nC
Qg(4.5V) Total Gate Charge 9.6 nC
VGS=-10V, VDS=-15V, ID=-7.1A
Qgs Gate Source Charge 3.6 nC
Qgd Gate Drain Charge 4.6 nC
tD(on) Turn-On DelayTime 10 ns
tr Turn-On Rise Time VGS=-10V, VDS=-15V, RL=2.2Ω, 5.5 ns
tD(off) Turn-Off DelayTime RGEN=3Ω 26 ns
tf Turn-Off Fall Time 9 ns
trr Body Diode Reverse Recovery Time IF=-7.1A, dI/dt=500A/µs 11.5 ns
Qrr Body Diode Reverse Recovery Charge IF=-7.1A, dI/dt=500A/µs 25 nC
A. The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The
value in any given application depends on the user's specific board design.
B. The power dissipation PD is based on TJ(MAX)=150°C, using ≤ 10s junction-to-ambient thermal resistance.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep
initialTJ=25°C.
D. The RθJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-ambient thermal impedence which is measured with the device mounted on 1in2 FR-4 board with
2oz. Copper, assuming a maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse ratin g.

THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.

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 AO4813

TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS

60 40
-10V -7V VDS=-5V
50 -5V
30
40
-4.5V
-ID (A)

-ID(A)
30 20

20 -3.5V
10 125°C 25°C
10
VGS=-3.0V

0 0
0 1 2 3 4 5 0 1 2 3 4 5

-VDS (Volts) -VGS(Volts)

Fig 1: On-Region Characteristics (Note E) Figure 2: Transfer Characteristics (Note E)

35 1.8

Normalized On-Resistance
30 1.6 VGS=-10V
ID=-7.1A
RDS(ON) (mΩ )

25 VGS=-4.5V 1.4
17
5
20 1.2 2
10
VGS=-4.5V
15 1
VGS=-10V ID=-5.6A

10 0.8
0 5 10 15 20 0 25 50 75 100 125 150 175
-ID (A)
Temperature (°C) 0
Figure 3: On-Resistance vs. Drain Current and Figure 4: On-Resistance vs. Junction Temperature
Gate Voltage (Note E)
18
(Note E)

60 1.0E+02
ID=-7.1A
1.0E+01
50
40
1.0E+00
RDS(ON) (mΩ )

40 1.0E-01 125°C
-IS (A)

125°C

1.0E-02
30
1.0E-03 25°C
20 25°C 1.0E-04

10 1.0E-05
2 4 6 8 10 0.0 0.2 0.4 0.6 0.8 1.0 1.2
-VGS (Volts) -VSD (Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage Figure 6: Body-Diode Characteristics (Note E)
(Note E)

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 AO4813

TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS

10 1600
VDS=-15V
ID=-7.1A 1400
8
1200 Ciss

Capacitance (pF)
1000
-VGS (Volts)

6
800
4 600
Coss
400
2
200
Crss
0 0
0 5 10 15 20 0 5 10 15 20 25 30
Qg (nC) -VDS (Volts)
Figure 7: Gate-Charge Characteristics Figure 8: Capacitance Characteristics

100 TA=25°C
100.0
-IAR (A) Peak Avalanche Current

TA=100°C
TA=150°C

10.0 RDS(ON) 10µs

limited 100µs
-ID (Amps)

10 TA=125°C
1.0
1ms
10ms
0.1 TJ(Max)=150°C
10s
TA=25°C
DC
1 0.0
1 10 100 1000 0.01 0.1 1 10 100
µs)
Time in avalanche, tA (µ -VDS (Volts)
Figure 9: Single Pulse Avalanche capability (Note Figure 10: Maximum Forward Biased Safe
C)
Operating Area (Note F)

10000
TA=25°C

1000
Power (W)

100

10

1
0.00001 0.001 0.1 10 1000
Pulse Width (s)
Figure 11: Single Pulse Power Rating Junction-to-Ambient (Note F)

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 AO4813

TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS

10
D=Ton/T In descending order
Zθ JA Normalized Transient

TJ,PK=TA+PDM.ZθJA.RθJA D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse

Thermal Resistance

1 RθJA=90°C/W

0.1

PD
0.01
Single Pulse
Ton
T
0.001
0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000
Pulse Width (s)
Figure 12: Normalized Maximum Transient Thermal Impedance (Note F)

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 AO4813

Gate Charge Test Circuit & Waveform

Vgs
Qg
- -10V
VDC
-
+ Vds Qgs Qgd
VDC
+
DUT
Vgs

Ig

Charge

Resistive Switching Test Circuit & Waveforms

RL
Vds ton toff

td(on) tr t d(off) tf
Vgs
-
Vgs DUT VDC
Vdd 90%
Rg
+

Vgs 10%
Vds

Unclamped Inductive Switching (UIS) Test Circuit & Waveforms

2
L E AR= 1/2 LIAR
Vds

Id Vds
- BVDSS
Vgs
Vgs VDC
Vdd
Rg
+ Id
I AR
DUT
Vgs Vgs

Diode Recovery Test Circuit & Waveforms

Vds + Q rr = - Idt
DUT
Vgs

t rr
Vds - L -Isd -I F
Isd dI/dt
+ Vdd -I RM
Vgs VDC
Vdd
Ig
- -Vds

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