Design Rules

FR4 – Semiflex
Application according to IPC 2223 Use A: Flex-to-install
UL-Label WE56 (UL94 V-0) on Request

Build-up: FR4 – Semiflex

TOP = Bending Layer
1
X
Prepreg 
2
Core  Y
3
L
Prepreg 
4

BOTTOM
C D
Reduced Thickness X is achieved by precision depth controlled milling process

Top View F G G

recommended:
R≥5mm

E
K

Partially application of flexible soldermask or Coverlay

F for purpose of stability: maximum copper design!

standard advanced
Symbol Beschreibung
requirements requirements
Only use of rigid material FR4 Tg130 On request
thickness of bending area incl. flexible soldermask/coverlay 1-layer: typ. 200 μm  50 µm
X
(depending on layer stack and copper thickness) 2-layers:  project specific “WE stack-up plan”
Y bevel 0,4 x 45°
C distance Copper on outer layer – outline of bending area (Bottom) ≥ 230 μm
D distance Cu on inner layers – outline of bending area ≥ 230 μm
E distance track – outline of bending area ≥ 300 μm
F distance of exposed copper – outside of bending area ≥ 230 μm
G distance exposed Copper – bending area (top) ≥ 1000 μm ≥ 800 μm
K Minimum width for „cut-in“ 1,6mm 1,1mm
„K“ Outline manufacturing: No scoring allowed!
L length of bending area: depending on bending angle See also page -2-
„L“ bending area: for purpose of stability: maximum copper design max. 200µm Isolation between lines
„L“ Bending direction: copper on outerlayer to tension See also page -2-
„L“ Minimum bending radius, 1 copper layer in bending area: 2 Layer pcb 5 mm Individ. qualification
„L“ Minimum bending radius, 1 copper layer in bending area: Multilayer cb 4 mm Individ. qualification
„L“ Minimum bending radius, 2 copper layers in bending area On Request with individual qualification
„L“ max. quantity of bending cycles (@ minimum bending radius) Typ. 10 Individ. qualification
-
- Finishes ENIG, imm. Ag, imm. Sn
Rules for line width/space, Via- and Pad-sizes, Soldermaskdesign see Basic Design Guide!
- combination with microvia- und buried via - Technology possible see HDI Design Guide!
 Enhanced specifications on request – please ask us ! 

Revision 06.08.2013 Sc page 1 of 2 www.we-online.com

 Design Rules
FR4 – Semiflex
Application according to IPC 2223 Use A: Flex-to-install
UL-Label WE56 (UL94 V-0) on Request

Additional Rules for Design and usage of FR4 Semiflex

Bending area with 1 copper layer: with 2 copper layers:

NO 7628 prepreg allowed in bending area! Recommendation: Ground plane outside (TOP),
signal routing on layer 2

Bending area: Calculation of Length „L“

Necessary length L of the bending area is:
L = angle  x radius R x Pi / 180° + 2 x 0.4mm (bevel Y)

Attention:
Bending is only allowed with bending area / copper outside in the bending area!

Important: Recommendation for box assembly

Before final Assembly you should perform a first preforming bend using a special bending tool which
ensures the minimum bending radius. This makes the final Assembly more easy and prevents damage
from the bending area!

Hint regarding Drying prior to Soldering

FR4 Semiflex-PCBs could be handled like Standard FR4 PCBs. A special drying process is not
required, as there is no usage of Polyimide Flex material.

Revision 06.08.2013 Sc page 2 of 2 www.we-online.com