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Service Manual

Internal Use Only

Service Manual
KP500

Model : KP500

Date: October, 2008 / Issue 1.0


REVISED HISTORY
Editor Date Issue Contents of Changes S/W Version

S.J.CHOI 4/10 0.1

* The information in this manual is subject to change without notice and should not be construed as a
commitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to
equipment design as advances in engineering and manufacturing methods warrant.

* This manual provides the information necessary to install, program, operate and maintain the KP500.

Copyright © 2008 LG Electronics. Inc. All right reserved. -3- LGE Internal Use Only
Only for training and service purposes
LGE Internal Use Only -4- Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Table Of Contents
1. INTRODUCTION .....................................7 5.10 SIM & uSD trouble .......................................87
1.1 Purpose .......................................................... 7 5.11 Touch pad trouble ........................................91
1.2 Regulatory Information.................................... 7 5.12 RTC trouble..................................................93
1.3 ABBREVIATION.............................................. 9 5.13 Tri-axial, digital acceleration sensor trouble.94
5.14 Trouble shooting of Receiver part ................95
2. PERFORMANCE ...................................11 5.15 Trouble Shooting of Transmitter Part .........101
2.1 H/W Features .................................................11
6. DOWNLOAD & S/W UPGRADE.............109
2.2 Technical specification ...................................12

3. TECHNICAL BRIEF ..............................19 7. CIRCUIT DIAGRAM ............................121


3.1 KP500 Functional Block diagram ...................19 8. BGM PIN MAP.....................................129
3.2 Baseband Processor (BBP) Introduction .......20
3.3 Power management IC ..................................32 9. PCB LAYOUT......................................135
3.4 Power ON/OFF ..............................................37
3.5 SIM & uSD interface.......................................39 10. RF Calibration ..................................139
3.6 Memory ..........................................................41
10.1 Test Equipment Setup................................139
3.7 LCD Display ...................................................42
10.2 Calibration Step..........................................139
3.8 Keypad Switching & Scanning .......................43
3.9 Keypad back-light illumination........................44 11. Stand-alone Test ..............................144
3.10 LCD back-light illumination...........................45 11.1 Test Program Setting .................................144
3.11 JTAG & ETM interface connector ................47 11.2 Tx Test .......................................................146
3.12 Audio ............................................................48 11.3 Rx Test.......................................................147
3.13 Charging circuit ............................................51
3.14 FM radio & BLUETOOTH.............................52 12. EXPLODED VIEW & REPLACEMENT
3.15 18pin Multi Media Interface connector .........55 PART LIST.........................................149
3.16 Tri-axial, digital acceleration sensor..............57 12.1 Exploded View ...........................................149
3.17 General Description .....................................59
12.2 Replacement Parts.....................................151
3.18 Receiver part................................................61
12.3 Accessory.................................................. 169
3.19 Transmitter part............................................62
3.20 RF synthesizer .............................................63
3.21 VCTCXO ......................................................63
3.22 Front End Module control.............................64
3.23 Power Amplifier Module ...............................65
3.24 PAM Schematic............................................66

4. PCB layout............................................67
4.1 Main PCB component placement...................67

5. Trouble shooting..................................69
5.1 Trouble shooting test setup............................69
5.2 Power on Trouble...........................................70
5.3 Charging trouble.............................................73
5.4 LCD display trouble........................................75
5.5 Camera Trouble .............................................77
5.6 Receiver & Speaker trouble ...........................79
5.7 Microphone trouble ........................................81
5.8 Vibrator trouble...............................................83
5.9 Keypad back light trouble...............................85

Copyright © 2008 LG Electronics. Inc. All right reserved. -5- LGE Internal Use Only
Only for training and service purposes
LGE Internal Use Only -6- Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION

1. INTRODUCTION

1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of the KP500.

1.2 Regulatory Information

A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges you’re your telecommunications
services. System users are responsible for the security of own system.
There are may be risks of toll fraud associated with your telecommunications system. System users
are responsible for programming and configuring the equipment to prevent unauthorized use. LGE
does not warrant that this product is immune from the above case but will prevent unauthorized use of
common-carrier telecommunication service of facilities accessed through or connected to it. LGE will
not be responsible for any charges that result from such unauthorized use.

B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long as
repair is not done.

C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure.
If these changes could reasonably be expected to affect the use of the KF600 or compatibility with the
network, the telephone company is required to give advanced written notice to the user, allowing the
user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations
Maintenance limitations on the KP500 must be performed only at the LGE or its authorized agents.
The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system
and may void any remaining warranty.

Copyright © 2008 LG Electronics. Inc. All right reserved. -7- LGE Internal Use Only
Only for training and service purposes
1. INTRODUCTION

E. Notice of Radiated Emissions


The KP500 complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.

F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.

G. Interference and Attenuation


An KP500 may interfere with sensitive laboratory equipment, medical equipment, etc.
Interference from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices

ATTENTION
Boards, which contains Electrostatic Sensitive Device(ESD), are indicated by the sign.
Following information is ESD handling: Service personnel should ground themselves by using a wrist
strap when exchange system boards.
When repairs are made to a system board, they should spread the floor with anti-static mat which is
also grounded. Use a suitable, grounded soldering iron. Keep sensitive parts in these protective
packages until these are used. When returning system boards or parts such as EEPROM to the
factory, use the protective package as described.

LGE Internal Use Only -8- Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION

1.3 ABBREVIATION
For the purposes of this manual, following abbreviations apply:

APC Automatic Power Control

BB Baseband

BER Bit Error Ratio

CC-CV Constant Current - Constant Voltage

CLA Cigar Lighter Adapter

DAC Digital to Analog Converter

DCS Digital Communication System

dBm dB relative to 1 milli-watt

DSP Digital Signal Processing

EEPROM Electrical Erasable Programmable Read-Only Memory

EGPRS Enhanced General Packet Radio Service

EL Electroluminescence

ESD Electrostatic Discharge

FPCB Flexible Printed Circuit Board

GMSK Gaussian Minimum Shift Keying

GPIB General Purpose Interface Bus

GPRS General Packet Radio Service

GSM Global System for Mobile Communications

IPUI International Portable User Identity

IF Intermediate Frequency

LCD Liquid Crystal Display

LDO Low Drop Output

LED Light Emitting Diode

Copyright © 2008 LG Electronics. Inc. All right reserved. -9- LGE Internal Use Only
Only for training and service purposes
1. INTRODUCTION

LGE LG Electronics

OPLL Offset Phase Locked Loop

PAM Power Amplifier Module

PCB Printed Circuit Board

PGA Programmable Gain Amplifier

PLL Phase Locked Loop

PSTN Public Switched Telephone Network

RF Radio Frequency

RLR Receiving Loudness Rating

RMS Root Mean Square

RTC Real Time Clock

SAW Surface Acoustic Wave

SIM Subscriber Identity Module

SLR Sending Loudness Rating

SRAM Static Random Access Memory

STMR Side Tone Masking Rating

TA Travel Adapter

TDD Time Division Duplex

TDMA Time Division Multiple Access

UART Universal Asynchronous Receiver/Transmitter

VCO Voltage Controlled Oscillator

VCTCXO Voltage Control Temperature Compensated Crystal Oscillator

WAP Wireless Application Protocol

8PSK 8 Phase Shift Keying

LGE Internal Use Only - 10 - Copyright © 2008 LG Electronics. Inc. All right reserved.
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2. GENERAL PERFORMANCE

2. GENERAL PERFORMANCE

2.1 H/W Feature


Item Feature Comment

Standard Battery Li-ion, 900mAh

AVG TCVR Current 270mA typ @PL5

Standby Current 2.3 mA typ @PP9

Talk time 3 hours (GSM TX Level 7)

Standby time Over 250 hours (Paging Period:9, RSSI: -85dBm)

Charging time Under 3 hours

RX Sensitivity EGSM/GSM850:-105dBm↓, DCS/PCS:-105dBm↓

TX output power EGSM/GSM850 : 33dBm (@PL 5)


DCS/PCS: 30dBm (@PL 0)

GPRS compatibility Class 10

SIM card type 3V Small

Display Main 240 x 400 pixels, 3” WQVGA, 262K color

Status Indicator Send Key, Shortcut Key, Volume Up/Down Key,


PWR Key, Camera Key, Lock Key

ANT Built in antenna

EAR Phone Jack 18pin multi port Headset jack

PC Synchronization Yes

Speech coding HR/EFR/FR/AMR

Data and Fax Yes

Vibrator Yes

Buzzer No

Voice Recoding Yes

C-Mic Yes

Receiver Yes

Travel Adapter Yes

Options Bluetooth hands-free kit, Data Kit

Copyright © 2008 LG Electronics. Inc. All right reserved. - 11 - LGE Internal Use Only
Only for training and service purposes
2. GENERAL PERFORMANCE

2.2 Technical specification

Item Description Specification


GSM900
TX: 890 + 0.2 x n MHz
RX: 935 + 0.2 x n MHz ( n = 1 ~ 124 )
EGSM
TX: 890 + 0.2 x (n-1024) MHz
RX: 935 + 0.2 x (n-1024) MHz ( n = 975 ~ 1023 )
1 Frequency Band
DCS1800
TX: 1710 + ( n-511 ) x 0.2 MHz (n = 512 ~ 885)
RX: TX + 95 MHz
PCS1900
TX: 1850.2 + ( n-512 ) x 0.2 MHz (n = 512 ~ 810)
RX: TX + 80MHz
RMS < 5 degrees
2 Phase Error
Peak < 20 degrees
3 Frequency Error < 0.1ppm
GSM900/EGSM
Level Power Toler. Level Power Toler.
5 33 dBm 2dB 13 17 dBm 3dB
6 31 dBm 3dB 14 15 dBm 3dB
7 29 dBm 3dB 15 13 dBm 3dB
8 27 dBm 3dB 16 11 dBm 5dB
9 25 dBm 3dB 17 9 dBm 5dB
10 23 dBm 3dB 18 7 dBm 5dB
11 21 dBm 3dB 19 5 dBm 5dB
12 19 dBm 3dB
4 Power Level DCS1800/PCS1900
Level Power Toler. Level Power Toler.
0 30 dBm 2dB 8 14 dBm 3dB
1 28 dBm 3dB 9 12 dBm 4dB
2 26 dBm 3dB 10 10 dBm 4dB
3 24 dBm 3dB 11 8 dBm 4dB
4 22 dBm 3dB 12 6 dBm 4dB
5 20 dBm 3dB 13 4 dBm 4dB
6 18 dBm 3dB 14 2 dBm 5dB
7 16 dBm 3dB 15 0 dBm 5dB

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2. GENERAL PERFORMANCE

Item Description Specification

GSM900/EGSM

Offset from Carrier (kHz). Max. dBc

100 +0.5

200 -30

250 -33

400 -60

600 ~ 1,200 -60

1,200 ~ 1,800 -60

1,800 ~ 3,000 -63

3,000 ~ 6,000 -65

Output RF Spectrum 6,000 -71


5
(due to modulation) DCS1800/PCS1900

Offset from Carrier (kHz). Max. dBc

100 +0.5

200 -30

250 -33

400 -60

600 ~ 1,200 -60

1,200 ~ 1,800 -60

1,800 ~ 3,000 -65

3,000 ~ 6,000 -65

6,000 -73

GSM900/EGSM

Offset from Carrier (kHz) Max. (dBm)

Output RF Spectrum 400 -19


6
(due to switching transient) 600 -21

1,200 -21

1,800 -24

Copyright © 2008 LG Electronics. Inc. All right reserved. - 13 - LGE Internal Use Only
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2. GENERAL PERFORMANCE

Item Description Specification


DCS1800/PCS1900
Offset from Carrier (kHz). Max. (dBm)
Output RF Spectrum 400 -22
6
(due to switching transient) 600 -24
1,200 -24
1,800 -27
7 Spurious Emissions Conduction, Emission Status
EGSM
BER (Class II) < 2.439% @-102dBm
8 Bit Error Ratio
DCS1800/PCS1900
BER (Class II) < 2.439% @-100dBm
9 Rx Level Report accuracy
10 SLR 8 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 0 -12
11 Sending Response 1,000 0 -6
2,000 4 -6
3,000 4 -6
3,400 4 -9
4,000 0 -
12 RLR 2 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 2 -7
500 * -5
13 Receiving Response 1,000 0 -5
3,000 2 -5
3,400 2 -10
4,000 2
* Mean that Adopt a straight line in between 300 Hz
and 1,000 Hz to be Max. level in the range.

LGE Internal Use Only - 14 - Copyright © 2008 LG Electronics. Inc. All right reserved.
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2. GENERAL PERFORMANCE

Item Description Specification


14 STMR 13 5 dB
15 Stability Margin > 6 dB
dB to ARL (dB) Level Ratio (dB)
-35 17.5
-30 22.5
-20 30.7
16 Distortion
-10 33.3
0 33.7
7 31.7
10 25.5
17 Side Tone Distortion Three stage distortion < 10%
System frequency
18 2.5ppm
(26 MHz) tolerance
19 32.768KHz tolerance 30ppm
Standby
20 Power consumption
- Normal 3 mA(@PP9)
EGSM/Lvl 7 (Battery Capacity 800mA):180 min
21 Talk Time
EGSM/Lvl12(Battery Capacity 800 mA):320min
Under conditions, at least 300 hours:
1. Brand new and full 800mAh battery
2. Full charge, no receive/send and keep GSM in idle mode.
22 Standby Time
3. Broadcast set off.
4. Signal strength display set at 3 level above.
5. Backlight of phone set off.
At least 65 dB under below conditions:
23 Ringer Volume 1. Ringer set as ringer.
2. Test distance set as 50 cm
Fast Charge : < 400 mA
24 Charge Current
Slow Charge: < 120 mA
Antenna Bar Number Power
7 >-92 dBm ~
5 -97dBm ~ -93dBm
4 -100dBm ~ -98dBm
25 Antenna Display
2 -103dBm ~ -101dBm
1 -105dBm ~ -104dBm
0 < -106 dBm
Off No Service

Copyright © 2008 LG Electronics. Inc. All right reserved. - 15 - LGE Internal Use Only
Only for training and service purposes
2. GENERAL PERFORMANCE

Item Description Specification

Battery Bar Number Voltage( 0.05V)


3 3.69V ~ 4.2V
26 Battery Indicator 2 3.53V ~ 3.69V
1 3.43V ~ 3.53V
0 3.30V ~ 3.43V
3.53V↓ 0.05V (Call)
27 Low Voltage Warning
3.43V ↓ 0.05V (Standby)
28 Forced shut down Voltage 3.3 0.05 V
Li-ion Battery
Standard Voltage = 3.7 V
29 Battery Type
Battery full charge voltage = 4.2 V
Capacity: 800mAh
Switching-mode charger
30 Travel Charger Input: 150 ~ 240 V, 50/60Hz
Out put: 5.6, 0.4A

LGE Internal Use Only - 16 - Copyright © 2008 LG Electronics. Inc. All right reserved.
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2. GENERAL PERFORMANCE

* EDGE RF Specification (Option: is not serviced for “EDGE mode”)

Item Description Specification


1 RMS EVM 9%
2 Peak EVM 30%
3 95th Percentile EVM 15%
4 Origin Offset Suppression ≥ 30dB
GSM900/EGSM
Level Power Toler. Level Power Toler.
5 27dBm 3dB 13 17dBm 3dB
6 27dBm 3dB 14 15dBm 3dB
7 27dBm 3dB 15 13dBm 3dB
8 27dBm 3dB 16 11dBm 5dB
9 25dBm 3dB 17 9dBm 5dB
10 23dBm 3dB 18 7dBm 5dB
11 21dBm 3dB 19 5dBm 5dB
5 Power Level 12 19dBm 3dB
DCS1800/PCS1900
Level Power Toler. Level Power Toler.
0 26/25dBm 3dB 8 14 dBm 3dB
1 26/25dBm 3dB 9 12 dBm 4dB
2 26/25dBm 3dB 10 10 dBm 4dB
3 24 dBm 3dB 11 8 dBm 4dB
4 22 dBm 3dB 12 6 dBm 4dB
5 20 dBm 3dB 13 4 dBm 4dB
6 18 dBm 3dB 14 2 dBm 5dB
7 16 dBm 3dB 15 0 dBm 5dB
6 Output RF Spectrum GSM900/EGSM
(due to modulation) Offset from carrier(kHz) Max. dBc
100 +0.5
200 -30
250 -33
400 -54
600 ~ <1,200 -60
1,200 ~ <1,800 -60
1,800 ~ <3,000 -63
3,000 ~ <6,000 -65
6,000 -71

Copyright © 2008 LG Electronics. Inc. All right reserved. - 17 - LGE Internal Use Only
Only for training and service purposes
2. GENERAL PERFORMANCE

Item Description Specification

6 Output RF Spectrum DCS1800/PCS1900


(due to modulation) Offset from carrier(kHz) Max. dBc
100 +0.5
200 -30
250 -33
400 -54
600 ~ <1,200 -60
1,200 ~ <1,800 -60
1,800 ~ <3,000 -63
3,000 ~ <6,000 -65
6,000 -71
7 Output RF Spectrum GSM900/EGSM
(due to switching transient) Offset from carrier(kHz) Max. dBm
400 -23
600 -26
1,200 -27
1,800 --30
DCS1800/PCS1900
Offset from carrier(kHz) Max. dBm
400 -23
600 -26
1,200 -27
1,800 -30

LGE Internal Use Only - 18 - Copyright © 2008 LG Electronics. Inc. All right reserved.
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3. TECHNICAL BRIEF

3. TECHNICAL BRIEF

3.1 KP500 Functional Block diagram


The functional component arrangement is mentioned below diagram.

KP500 Block Diagram


ANT FEM PAM(SKY77340) BB IC(PMB8877) Memory
FM_ANT
DCS/PCS PA_LEVEL PA_LEVEL ADD(0:29) Pin.01
Match Match / (2G NAND + H/S MIC & HOOK_DET
Pin.02
DGM1110M014
TXON_PA TXON_PA DATA(0:15) 1G DDR SDRAM)
/
Controller PA_BAND PA_BAND Pin.03
I 2C H/S_LEFT
Pin.04
GSM850/900
PA_MODE PA_MODE I 2C / Touch Window H/S_RIGHT
FE1 FE2 Match Match Pin.05
I2C
I2C1 / LED Matrix Module USB_M
Pin.06
COL USB_P
KEY_COL Pin.07
KEY PAD

I/O CONNECTOR
ROW
KEY_ROW JACK_DETECT
Pin.08

KEY_EN VBAT
GPIO
KEY Back Light VBAT.
Pin.09

TRANSCEIVER I/I_/Q/Q_
/ GPIO VIB_EN Pin.10
Vibrator RPWRON
Pin.11
PMB6272 RF_EN VCHG
CAM_I2C CAM_I2C Pin.12
3-Axis Accelerometer
RF INTERFACE

RF_CLK
Pin.13
RF_DA
MMC I/F
DSR
MMC I/F / -SD + SIM Socket Pin14
VBUS_USB
VCHG Pin.15
26M_MCLK UART_TX
T_IN1
CHG_EN
Charging IC VUSB_USB
Pin.16
UART_RX
Pin.17

Pin.18
Battery
CAM_ I2C
AFC CIF / 3M CAM
I2C
26M_TCXO
BT ANT BT_CLK I2C1 / Charge Pump
(LED CTRL : 5 ea)
(SC654ULTRT)
UART UART LCD, 3.0"
BPF / DIF
FM ANT BT IC
DIF / 262K TFT WQVGA
I2S I2S
BCM2048SB0 /
AUIDO AMP(MAX9877)
VBAT FM EPN11
RXIN-
RADIO RXIN+ BYPASS
32kHz
EPP11 HPL HEADSET RECEIVER
PMB6821(PM IC) HPR
VBAT INA1
PRE-AMP

MIXER

EPPA11
INA2
SD1 (1.35V) VAUX (2.9V) VAUDIOa(2.5V) EPPA21 OUT- MAIN SPEAKER
I2C
END_KEY OUT+
SD2(1.8V) VIO(2.62V) VAUDIOb(2.5V) I2C1 /
INB1/2
SD2(1.8V) VSIM(2.9V) VRF1(2.85V) I2C
FM
RADIO
/ I2C1 VMICP/N
VPLL(1.35V) VMME (2.9V) VRF2(1.53V)
2V11_RTC
MAIN MIC
MIC1(P/N)
VRTC(2.0V) VUMTS(2.85V) VRF3(2.70V) 2V11_RTC
HEADSET MIC
VVIB(2.8V) VUSB(3.1V) VLED (2.9V) B/UP BAT.
MIC2(P/N)

Figure 1 KP500 Functional block diagram

Copyright © 2008 LG Electronics. Inc. All right reserved. - 19 - LGE Internal Use Only
Only for training and service purposes
3. TECHNICAL BRIEF

3.2 Baseband Processor (BBP) Introduction

Figure 3 Top level block diagram of the S-GOLD3™ (PMB8877)

3.2.1 General Description


S-GOLD3™ is a GSM/EDGE single chip mixed signal Baseband IC containing all analog and digital
functionality of a cellular radio. Additionally S-GOLD3™ Provides multimedia extensions such as
camera, software MIDI, MP3 sound. It is designed as a single chip solution, integrating the digital and
mixed signal portions of the base band in 0.09um, 1.2V technology.
The chip will fully support the FR, EFR, HR and AMR-NB vocoding.
S-GOLD3™ support multi-slot operation modes HSCSD (up to class 10), GPRS for high speed data
application (up to class 12) and EGPRS (up to class 12) without additional external hardware.

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3. TECHNICAL BRIEF

3.2.2 Block Description


• Processing core
ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU,
and the Jazelle Java extension for Java acceleration.
- TEAKLite DSP core
• ARM-Memory
- 32k Byte Boot ROM on the AHB
- 96k Byte SRAM on the AHB, flexibly usable as program or data RAM
- 16k Byte Cache for Program (internal)
- 8k Byte tightly coupled memory for Program(internal)
- 8k Byte Cache for Data(internal)
- 8k Byte tightly coupled memory for Data(internal)
• DSP-Memory
- 104K x 16bit Program ROM
- 8k x 16bit Program RAM
- 60k x 16bit Data ROM
- 37k x 16bit Data RAM
- Incremental Redundancy(IR) Memory of 35904 words of 16bit
• Shared Memory Block
1.5K x 32bit Shared RAM(dual ported) between controller system and TEAKLite.
• Controller Bus system
The processor cores and their peripherals are connected by powerful buses.
Multi-layer AHB for connecting the ARM and the other master capable building blocks with the
internal and external memories and with the peripheral buses.
• Clock system
The clock system allows widely independent selection of frequencies for the essential parts of the
S-GOLD3. Thus power consumption and performance can be optimized for each application.
• Functional Hardware block
- CPU and DSP Timers
- MOVE coprocessor performing motion estimation for video encoding algorithms (H.263, MPEG-4)
- Programmable PLL with additional phase shifters for system clock generation
- GSM Timer Module that off-loads the CPU from radio channel timing
- GMSK / 8-PSK Modulator according to GSM-standard 05.04 (5/2000)
- GMSK Modulator: gauss-filter with B*T=0.3
- EDGE Modulator: 8PSK-modulation with linearized GMSK-Pulse-Filter
- Hardware accelerators for equalizer and channel decoding.
- Incremental Redundancy memory for EDGE class 12 support
- A5/1, A5/2, A5/3 Cipher unit
- GEA1, GEA2, GEA3 Cipher Unit to support GPRS data transmission
- Advanced static and dynamic power management features including TDMA-Frame synchronous
low power mode and enhanced CPU modes(idle and sleep modes)

Copyright © 2008 LG Electronics. Inc. All right reserved. - 21 - LGE Internal Use Only
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3. TECHNICAL BRIEF

- Pulse Number Modulation output for Automatic Frequency Correction(AFC)


- Serial RF Control interface: support of direct conversion RF
- A Universal Serial Interface(USIF) enabling asynchronous (UART) of synchronous (SPI) serial
data transmission
- 1 Serial Synchronous SPI compatible interfaces in the controller domain
- 1 Serial Synchronous SPI compatible interface in the TEAKLite domain
- 2 USART with autobaud detection, hardware flow control and integrated IrDA controller
supporting IrDA’s SIR standard (up to 115.2Kbps)
- A dedicated Fas IfDA Controller supporting IrDA’s SIR,MIR and FIR standards (up to 4Mbps)
- I2C-bus interface (e.g. connection to S/M power)
- A fast display interface supporting serial and parallel interconnection
- An ITU-R BT.656 compatible Camera interface.
- Programmable clock output for a camera
- An multimedia/Secure Digital Card Interface (MMCI/SD: SDIO capable)

3.2.3 External Devices connected to memory interface


Table 1. Memory interface

Device Name Maker Remark


FLASH K5E1G12ACA-D075 Samsung Synchronous / A synchronous
DDR K5E1G12ACA-D075 Samsung Synchronous 133MHz
LCD IM200DST2A LGIT 8bit access 2 times transmission
Melody IC Not Used S/W Infineon Software CODEC

3.2.4 RF Interface (T_OUT)


S-Gold3 uses this interface to control RF IC and Peripherals. 13 signals are provided switch on/off RF
ICs Periodically each TDMA frame.

Table 2. RF Interface Spec.

T_OUT
Resource Interconnection Description
T_OUT0 TXON_PA PAM Power on
T_OUT1 Other function -
T_OUT2 PA_BAND TX RF band select
T_OUT3 ANT_SW1 FEM control
T_OUT4 ANT_SW2 FEM control
T_OUT5 ANT_SW3 FEM control
T_OUT6 MODE PAM Mode select

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3. TECHNICAL BRIEF

3.2.5 USIF Interface


KF350 have three USIF Drivers as follow :
- USIF1 : Hardware Flow Control / SW upgrade / Calibration
- USIF2 : MON used Rx, Tx and CTS, RTS use BT Interface
- USIF3 : BT Interface

Table 3. USIF Interface Spec.

Resource Name Remark


USIF1
USIF1_TXD UART_TX Transmit Data
USIF1_RXD UART_RX Receive Data
USIF1_CTS USB_DP
USIF1_RTS USB_DM
USIF2
USIF2_TXD NC NC
USIF2_RXD NC NC
USIF2_CTS BT_CTS
USIF2_RTS BT_RTS.
USIF3
USIF3_TXD BT_TX BT Transmit tx
USIF3_RXD BT_RX BT Receive rx

3.2.6 ADC channel


BBP ADC block is composed of 10 external ADC channel. This block operates charging process and
other related process by reading battery voltage and other analog values.

Table 4. S-Gold3 ADC channel usage


ADC channel
Resource Interconnection Description
M0 BAT_ID Battery temperature measure
M1 RF_TEMP RF block temperature measure
M2 N.C
M3 JACK_TYPE Accessory type detect
M4 N.C
M5 H/W VERSION S-Gold3 H/W version detect
M6 N.C
M7 ICLD
M8 VSUPPLY Battery supply voltage measure
M9 N.C
M10 N.C

Copyright © 2008 LG Electronics. Inc. All right reserved. - 23 - LGE Internal Use Only
Only for training and service purposes
3. TECHNICAL BRIEF

3.2.7 GPIO map


Over a hundred allowable resources, KF350 is using as follows except dedicated to SIM and Memory.
KF350 GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level,
is shown in below table

Table 5 S-Gold3 GPIO pin Map

Port Function Net Name Description


KEY MATRIX
KP_IN0 N/A
KP_IN1 N/A
KP_IN2 N/A
KP_IN3 KP_IN3
KP_IN4 N/A
KP_IN5 KP_IN5
KP_OUT5 KP_IN6
KP_OUT0 KP_OUT0
KP_OUT1 LIN_INVERT
KP_OUT2 KP_OUT2
KP_OUT3 KP_OUT3
USIF1
USIF1_RXD UART_RX UART, RS232 Data
USIF1_TXD UART_TX UART, RS232 Data
USIF1_RTS_N USB_DAT_VP USB Data
USIF1_CTS_N USB_SE0_VM USB Data
USIF2
USIF2 _RXD ACCEL_INT
USIF2 _TXD N/A Not used
USIF2_RTS_N UART_BT_RTS Bluetooth RTS
USIF2_CTS_N UART_BT_CTS Bluetooth CTS
USIF3
USIF3 _RXD UART_BT_RX Bluetooth RX
USIF3 _TXD UART_BT_TX Bluetooth TX
GPIO_21 N/A
MMCI2
MMCI2_CMD PCB_VER1 PCB Version1
MMCI2_DAT[0] PCB_VER2 PCB Version2
MMCI2_CLK VIB_EN Vibrator LDO Enable
CAMERA I/F
CIF_D0 CIF_D(0) Camera DATA[0]
CIF_D1 CIF_D(1) Camera DATA[1]

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3. TECHNICAL BRIEF

CIF_D2 CIF_DATA2 Camera DATA[2]


CIF_D3 CIF_DATA3 Camera DATA[3]
CIF_D4 CIF_DATA4 Camera DATA[4]
CIF_D5 CIF_DATA5 Camera DATA[5]
CIF_D6 CIF_DATA6 Camera DATA[6]
CIF_D7 CIF_DATA7 Camera DATA[7]
CIF_PCLK CIF_PCLK Camera pixel clock
CIF_HSYNC CIF_HSYNC Camera H sync
CIF_VSYNC CIF_VSYNC Camera V sync
CLKOUT CIF_MCLK Camera main clock
CIF_PD CIF_PD Camera power down(active high)
CIF_RESET CIF_RESET Camera reset
LCD I/F
DIF_D0 DIF_D0 LCD data[0]
DIF_D1 DIF_D1 LCD data[1]
DIF_D2 DIF_D2 LCD data[2]
DIF_D3 DIF_D3 LCD data[3]
DIF_D4 DIF_D4 LCD data[4]
DIF_D5 DIF_D5 LCD data[5]
DIF_D6 DIF_D6 LCD data[6]
DIF_D7 DIF_D7 LCD data[7]
DIF_D8 CAM_LDO_EN Camera LDO Enable
DIF_CS1 DIF_MAIN_CS MAIN LCD chip select
DIF_CS2 IF_MODE Interface mode
DIF_CD DIF_CD Command Data switch
DIF_WR DIF_WR LCD Write
DIF_RD DIF_RD LCD Read
EINT7 HOOK_DETECT Ear-Mic hook detection
GPIO_100 DIF_VSYNC LCD Sync
GPIO_27 _ DIF_RESET LCD Reset
EINT5 TOUCH_INT Touch Sensor INT
#I2C1
I2C_SCL I2C_SCL For Touch LDO/PMIC/Audio Amp
I2C_SDA I2C_SDA For Touch LDO/PMIC/Audio Amp
USIF2_RTS_N UART_BT_RTS Bluetooth RTS
USIF2_CTS_N UART_BT_CTS Bluetooth CTS
USIF3
USIF3 _RXD UART_BT_RX Bluetooth RX
USIF3 _TXD UART_BT_TX Bluetooth TX
GPIO_21 N/A
MMCI2

Copyright © 2008 LG Electronics. Inc. All right reserved. - 25 - LGE Internal Use Only
Only for training and service purposes
3. TECHNICAL BRIEF

MMCI2_CMD PCB_VER1 PCB Version1


MMCI2_DAT[0] PCB_VER2 PCB Version2
MMCI2_CLK VIB_EN Vibrator LDO Enable
CAMERA I/F
CIF_D0 CIF_DATA0 Camera DATA[0]
CIF_D1 CIF_DATA1 Camera DATA[1]
CIF_D2 CIF_DATA2 Camera DATA[2]
CIF_D3 CIF_DATA3 Camera DATA[3]
CIF_D4 CIF_DATA4 Camera DATA[4]
CIF_D5 CIF_DATA5 Camera DATA[5]
CIF_D6 CIF_DATA6 Camera DATA[6]
CIF_D7 CIF_DATA7 Camera DATA[7]
CIF_PCLK CIF_PCLK Camera pixel clock
CIF_HSYNC CIF_HSYNC Camera H sync
CIF_VSYNC CIF_VSYNC Camera V sync
CLKOUT CIF_MCLK Camera main clock
CIF_PD CIF_PD Camera power down(active high)
CIF_RESET CIF_RESET Camera reset
LCD I/F
DIF_D0 DIF_D0 LCD data[0]
DIF_D1 DIF_D1 LCD data[1]
DIF_D2 DIF_D2 LCD data[2]
DIF_D3 DIF_D3 LCD data[3]
DIF_D4 DIF_D4 LCD data[4]
DIF_D5 DIF_D5 LCD data[5]
DIF_D6 DIF_D6 LCD data[6]
DIF_D7 DIF_D7 LCD data[7]
DIF_D8 CAM_LDO_EN Camera LDO Enable
DIF_CS1 DIF_MAIN_CS MAIN LCD chip select
DIF_CS2 IF_MODE Interface mode
DIF_CD DIF_CD Command Data switch
DIF_WR DIF_WR LCD Write
DIF_RD DIF_RD LCD Read
EINT7 HOOK_DETECT Ear-Mic hook detection
GPIO_100 DIF_VSYNC LCD Sync
GPIO_27 _DIF_RESET LCD Reset
EINT5 TOUCH_INT Touch Sensor INT
#I2C1
I2C_SCL I2C_SCL For Touch LDO/PMIC/Audio Amp
I2C_SDA I2C_SDA For Touch LDO/PMIC/Audio Amp
PM_INT (EINT) PM_INT

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3. TECHNICAL BRIEF

#I2C2
I2C2_SCL CIF_SCL For Camera
I2C2_SDA CIF_SDA For Camera
SIM I/F
CC_IO SIM_IO SIM CARD I/O
CC_CLK SIM_CLK SIM CARD CLOCK
CC_RST SIM_RST SIM CARD RESET
IrDA
USB_OEn USB_OEn
EINT3 N/A
External Memory
MMCI_CMD MMC_CMD T-flash
MMCI_DAT[0] MMC_D0 T-flash
MMCI_CLK MMC_CLK T-flash
MMCI1_DAT[1] MMC_D1 T-flash
MMCI1_DAT[2] MMC_D2 T-flash
MMCI1_DAT[3] MMC_D3 T-flash
I2S1
I2S2_CLK0 I2S1_CLK Bluetooth Clock
GPIO_102 MMC_DETECT T-flash Detect
I2S2_RX I2S1_RX Bluetooth PCM RX
I2S2_TX I2S1_TX Bluetooth PCM TX
I2S2_WA0 2S1_WA0 Bluetooth Clock
I2S2
EINT4 CHG_EOC Charger
GPIO_102 LCD_ID LCD ID
CC0CC1IO _PPR Charger
CC0CC7IO BT_INT Bluetooth INT
CC0CC3IO N/A
GPIO_103 KEY_EN
Audio I/F
EPN1 EAR_N For Receiver
EPP1 EAR_P For Receiver
EPPA1 BB_SND_L For Speaker
EPREF Reference
EPPA2 BB_SND_R For Speaker
MICN1 MAIN_MIC_N For Mic
MICP1 MAIN_MIC_P For Mic
MICN2 HS_MIC_N For Headset Mic
MICP2 HS_MIC_P For Headset Mic
VMICP VMIC_P Power for MIC

Copyright © 2008 LG Electronics. Inc. All right reserved. - 27 - LGE Internal Use Only
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3. TECHNICAL BRIEF

VMICN VMIC_N Power for MIC


#I/Q-Signale
PAOUT1 PA_LEVEL
BB_I I
BB_IX IX
BB_Q Q
BB_QX QX
ADC
M0 BAT_ID Battery temperature measure
M1 RF_TEMP RF block temperature measure
M2 PCB_VER
M3
M7
M8
M9 LOAD Current consumption measure
M10 N.C
Reference
VREFP VREFN
IREF
JTAG I/F
TDO TDO JTAG
TDI TDI JTAG
TMS TMS JTAG
TCK TCK JTAG
TRST_n TRSTn JTAG
RTCK RTCK JTAG
#Debug
TRIG_IN TRIG_IN ETM (Embedded Trace Macro Cell)
MON1 2V62_VIO ETM
MON2
TRACESYNC TRACESYNC ETM
TRACECLK TRACECLK ETM
PIPESTAT[2] PIPESTAT[2] ETM
PIPESTAT[1] PIPESTAT[1] ETM
PIPESTAT[0] PIPESTAT[0] ETM
TRACEPKT[0] TRACEPKT[0] ETM
TRACEPKT[1] TRACEPKT[1] ETM
TRACEPKT[2] TRACEPKT[2] ETM
TRACEPKT[3] TRACEPKT[3] ETM
TRACEPKT[4] TRACEPKT[4] ETM
TRACEPKT[5] TRACEPKT[5] ETM

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3. TECHNICAL BRIEF

TRACEPKT[6] TRACEPKT[6] ETM


TRACEPKT[7] TRACEPKT[7] ETM
Memory
MEM_ADV_n BA1
MEM_RDN _RD Read
MEM_AD[0] DATA0
MEM _AD[1] DATA1
MEM _AD[2] DATA2
MEM _AD[3] DATA3
MEM _AD[4] DATA4
MEM _AD[5] DATA5
MEM _AD[6] DATA6
MEM _AD[7] DATA7
MEM _AD[8] DATA8
MEM _AD[9] DATA9
MEM _AD[10] DATA10
MEM _AD[11] DATA11
MEM _AD[12] DATA12
MEM _AD[13] DATA13
MEM _AD[14] DATA14
MEM _AD[15] DATA15
MEM_CS0_n _NAND_CS
MEM_CS1_n _RAM_CS
MEM_WRN _WR
MEM_A[16] ADD[16]
MEM_A[17] ADD[17]
MEM_A[18] ADD[18]
MEM_A[19] ADD[19]
MEM_A[20] ADD[20]
MEM_A[21] ADD[21]
MEM_A[22] ADD[22]
MEM_A[23] ADD[23]
MEM_A[24] ADD[24]
MEM_A[25] ADD[25]
MEM_A[26] ADD[26]
MEM_CSA0_n ADD[27]
MEM_CSA1_n ADD[28]
MEM_CSA2_n ADD[29]
MEM_CSA3_n BA0
MEM_BFCLKO1
MEM_BFCLKO2 SDCLKI

Copyright © 2008 LG Electronics. Inc. All right reserved. - 29 - LGE Internal Use Only
Only for training and service purposes
3. TECHNICAL BRIEF

MEM_SDCLKO SDCLKO
MEM_BC0_n _BC0
MEM_BC1_n _BC1
MEM_BC2_n LDQS
MEM_BC3_n UDQS
MEM _A[0] ADD[0]
MEM _A[1] ADD[1]
MEM _A[2] ADD[2]
MEM _A[3] ADD[3]
MEM _A[4] ADD[4]
MEM _A[5] ADD[5]
MEM _A[6] ADD[6]
MEM _A[7] ADD[7]
MEM _A[8] ADD[8]
MEM _A[9] ADD[9]
MEM _A[10] ADD[10]
MEM _A[11] ADD[11]
MEM _A[12] ADD[12]
MEM _A[13] ADD[13]
MEM _A[14] ADD[14]
MEM _A[15] ADD[15]
MEM_RAS_n _RAS
MEM_CAS_n _CAS
MEM_CKE CKE
FCDP_RBn FCDP
FWP _WP
T_OUT0 TXON_PA
T_OUT1 FE2
T_OUT2 PA_BAND
T_OUT3 FE1
GPIO_47 BT_WAKEUP Bluetooth wakeup
GPIO_48 VBUS_OVP
T_OUT6 PA_MODE
GPIO_50 For Vibrator
GPIO_51 DSR UART DSR
GPIO_52 LCD_BACKLIGHT_EN LCD Backlight Enable
CC1CC7IO JACK_DETECT Jack Detect
GPIO_54 BT_LDO_EN Bluetooth LDO Enable
#SPCU
SPCU_RQ_IN0
GPIO_118 BT_RESETn Bluetooth Reset

LGE Internal Use Only - 30 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF

SPCU_RC_OUT0 VCXO_EN VCXO Enable


SPCU_RQ_IN2 RESOURCE_CTRL
#RF Control Unit
RF_STR0 RF_EN
RF_STR1 LIN_PWM_MAG For Vibrator
RF_DATA RF_DA
RF_CLK RF_CLK
other
AFC
GPIO_58 RPWRON
F26M 26MHZ_MCLK 26MHz Clock
F32K F32K
OSC32K OSC32K
RESET_n _RESET
RTC_OUT RTC_OUT
#Extra I/Os
CLK32K CLK32K For FM Radio, BT CLK32K
DSPOUT1 WDOG

Copyright © 2008 LG Electronics. Inc. All right reserved. - 31 - LGE Internal Use Only
Only for training and service purposes
3. TECHNICAL BRIEF

3.3 Power management IC

3.3.1 General Description


SM-POWER is a highly integrated Power and Battery Management IC for mobile handsets. It has
been specially designed for usage with S-Gold3. Although optimized for usage with the Infineon S-
GOLD baseband device it is suitable for the S-GOLDlite and the E-GOLD+ baseband devices as well.
It also supports the cellular RF devices like SMARTi-DC, SMARTi-DC+, SMARTi-SD and the
Bluemoon Single, Infineon s single chip solution for Bluetooth. If used with S-GOLD3 it provides all
power supply functions (except for the RF PA) for a complete advanced GSM Edge smart phone
minimizing external device count.

Block Description
• Highly efficient step-down converter for main digital baseband supply including Core, DSP and
memory interface (External Bus Unit).
• Support of S-GOLD standby power-down concept
• Low-drop-out (LDO) regulators for Flash and mobile RAM memory devices
• Voltage independent switching of two SIM cards
• LDO regulators for baseband I/O supply
• LDO regulator for analog mixed-signal section of S-GOLD
• Low-noise LDO regulators for RF devices
• Supply for Bluemoon Single, Infineon s single chip solution for Bluetooth
• Audio amplifier 8 Ohms for handsfree operation and ringing
• Charge Control for charging Li-Ion/Polymer batteries under software control
• Pre-charge current generator with selectable current level
• RTC regulator with ultra-low quiescent current
• USB interface support for peripheral and mini-host mode
• Backlight LEDs driver with current selection and PWM dimming function
• Two single LED driver outputs for signaling
• Vibrator driver with adjustable voltage
• Fully controlable by software via I2C - Bus
• Temperature and battery voltage sensors
• Interrupt channels for peripherals
• System debug mode
• VQFN 48 package with heat sink and non-protruding leads
• Compatible with the Infineon E-GOLD+ V2 and V3

LGE Internal Use Only - 32 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF

SM-POWER is a further step on the successful E-Power product line with enhanced and optimized
functionality.
SM-POWER features a baseband supply concept with a DC/DC step-down converter cascaded by two
linear regulators
- SM-POWER’s DC/DC converter makes up to 40 % reduction of battery current for smart phone
functions (e.g. organizer functions, games, MP3 decoding) possible.
- SDBB has high efficiency up to 95% and also a power save mode.
- Memory Interface is directly supported by the SDBB
- SDBB can also act as main supply voltage for E-GOLD+ or S-GOLDlite baseband devices.
- For S-GOLD two linear regulators for DSP and Core are cascaded after the SDBB.

SM-POWER supports the standby power-down concept of S-GOLD by temporarily switching off the
linear regulator for the DSP during mobile standby whenever this subsystem is not used. In this phase
the ARM controller and most peripherals including parts of the on-chip SRAM are kept powered-up
withpower being supplied by the other linear regulator.
SM-POWER includes a fully differential audio amplifier able to drive loads down to a nominal value of
8 Ohm for usage in hands-free phones and for ringing
- 450 mW maximum output power
- adjustable gain
- mute switch SM-POWER also integrates a charging function for Li-Ion, Li-Polymer batteries
- click and pop -protection SM-POWER also integrates a charging function for Li-Ion, Li-Polymer
batteries
- Precharge current source with two current levels
- Constant current / constant voltage charging with 3 different termination voltages
- Programable charge current limitation for use with different batteries
- Freely programable pulse charging to reduce the thermal power dissipation in the constant voltage
charging phase
- Top-off charge current sensing SM-POWER completes the USB interface of S-GOLD
- Regulated voltage for S-GOLD USB interface including reverse current and overvoltage protection
- Switch to supply USB pull-up resistor
- Mini-host pull down resistor functionality
- Charge pump with internal switching capacitor for USB host VBUS supply voltage SM-POWER fully
supports LED and Vibra Motor functionality
- no external components needed
- driver for backlight LEDs adjustable in steps up to 140mA and with soft turn on and off by PWM
dimming
- two driver outputs for single LEDs for precharge indication and signaling with i.e. change of colour
- driver for Vibra Motor with adjustable voltages, soft startup / shutdown and current limitation SM-
POWER offers several control functions

Copyright © 2008 LG Electronics. Inc. All right reserved. - 33 - LGE Internal Use Only
Only for training and service purposes
3. TECHNICAL BRIEF

- Power-on Reset Generator with logic state machine


- I2C bus interface
- I2C bus configurable mode control logic with ON (push-button or RTC), VCXOEN and LRF3EN
(wake-up by Bluetooth) inputs
- Programable interrupt channels to handle peripherals like SIM, MMC and USB
- Monitoring of charging functions
- Undervoltage Shut-Down
- Errorflags (volatile or non-volatile) from many power-supply functions and thermal sensor in order to
debug system
- Overtemperature Shut-Down
- Overtemperature Warning
- Support of S-GOLD standby power-down concept
- Support of S-GOLD Power-Down Pad Tristate Function

Table 6. LDO Output Table of SM-Power

LDO Net name Output Voltage Output Current Usage


SD1 1V35_Core 1.35V 600mA Core & for LDO
SD2 1V8_SD 1.8V 300mA Memory
VAUX 2V85_VAF 2.85V 100mA Cam Auto Focus
VIO 2V62_VIO 2.62V 100mA Peripherals
VSIM 2V9_SIM 2.9V 70mA SIM card
VMME 2V8_VMME 2.9V 150mA u-SD
VUMTS 2V85_AMP 2.85V 110mA Headset AMP
VUSB VUSB 3.1V 40mA Not used
VLED VLED 2.9V 10mA Not used
VAUDIOa 2V5_VAUDA 2.5V 200mA Stereo headset, Mono earpiece
VAUDIOb 2V5_VAUDB 2.5V 50mA Analog parts of S-Gold
VRF1 2V85_VRF 2.85V 150mA 2.85 V supply for SMARTi-PM RF transceiver
VRF2 1V5_VRF 1.53V 100mA 1.5 V supply for SMARTi-PM RF transceiver
VRF3 2V65_VBT 2.7V 150mA Bluetooth
VPLL 1V35_VPLL 1.35V 30mA S-GOLD3 PLL
VRTC 2V11_RTC 2.11V 4mA Real Time Clock
VAFC VAFC 2.65V 5mA Not used
VVIB 2V8_CAM_A 2.8V 140mA LCD

LGE Internal Use Only - 34 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF

RESOURCE_CTRL
R300
RTC_OUT ON_OFF2

LIN_PWM_MAG
SPOWER_INT
27K
VUSB VBAT R301
VPLL_1V35 VIO_2V62

ON_OFF2

I2C_SDA
I2C_SCL
PWRON
DNI
PMIC

WDOG
VBAT VBAT VIO_2V62
VBAT
C301 C300

KEY_EN
VBAT VBAT

KEY_BL
2. 2u 0. 1u D3 0 0

C303 2.2u

C304 2.2u

4.7K
4.7K
4.7K
1u
2
3 VCHG_OVP
C305

DNI
TP301

C302
1

R305 4.7K
R306 4.7K
R323 VBUS_OVP
2. 2u C307 C308

R302
R303
R304
R307 100K
C306 0.1u
100K KDR331V

1u
1u 2. 2u

R322
SP_INT
USB_OEn TP300
USB_DAT_VP

C309
USB_SE0_VM
C310
SD_1V8 VAUDB_2V5 VBAT TXON_PA 0. 1u CORE_1V35 CAM_A_2V8 VSIM_2V9 VBT_2V65 SD_1V8

FLASH_ON B10

B11
A10

A11

K10

L11
VBAT
C3

C4

C5

C7

C8

FLASH_SHINK C9
B2

B3

B5

B6

B7

B8

B9

B4

K3

K4

K5
I2C_INT K6

BL1_PWM K7

K8

K9
A2

A3

A4

A5
A7

A6

A9

A1

A8
L1

L3

L4
L5

L6

L7

L8

L9
J4

J5

I2C_DAT J7

BL2_PWM J8

J9
L300 D3 0 1
VAUDA_2V5 VFM_2V9 VBAT CAM_2V85 RTC_2V11 VRF_2V85 VRF_1V5 VMME_2V9

TXONPA

CH_SOURCE

VDD_CHARGE
DAT_VP

OUTPORT

ON_OFF_OUT
OE_N

MONO_INP
MONO_INN

MONO_OUTP

MONO_OUTN

I2C_CLK
SE0_VM

VREFEX_M

PUMS3
PUMS2
PUMS1
VUSB

BL3_PWM
VDD_USB

RREF

VPLL
SUSPEND

VDD_MONO

VSS_MONO

VDDPLLIO

POWER_ON
VIO

WDOG

CH_CNTRL
VREF

RESOURCE_CRTL

VDD_REF
CHARGE_UC

VLED
VSD2

VSD1
ON_OFF1
ON_OFF2

SENSE_IN1
SENSE_IN2
AC+

10uH
AC-

KDS160E
U_RCV B1
RCV
U_PMIN C2
VPIN
U_VMIN D3 C11
VMIN VMME
C1 C10
USB_DP D+ VDDMME
D2
USB_DM D-
D1 0
PMRSTn VDDRF2
E3 D1 1
FB300

PMRSTn RESET_N VRF2


D1
RESET2_N
E2 E10
VCXO_EN SLEEP1_N VRF3
E1 E11
BT_VCXO_EN SLEEP2_N VDDRF13_AFC
F2
F1
VAUDIOA
VDDAUDIOA
U300 VRF1
VVIB
F10
F11

G2
VDDAUDIOB
PMB6821 VDDSIMVIB
G11

G1
VAUDIOB EUSY0323901 VSIM
G10

H2 H1 1
VAUX VAFC
H1
VDDAUX
C311 C312 C313 D3 0 2 H1 0
VRTC
J1
2. 2u 2. 2u 1u L301 SU1_GATE
J2 H9
KDS160E SU1_GND VDDUMTS
10uH H3 J1 1
SU1_FB VUMTS
J3 FB301
SU1_ISENSE
K11
VDDSD1
K1 J1 0
VDDSD2 SD1_FB
K2 L10
SD2_FB SD1_FBL
L2
VSS_VREF

SD2_FBL
VSS_SD1
VSS_SD2
C317

C314
C315
C316
VSS10
VSS11
VSS12
VSS13
VSS14
VSS15
VSS16
VSS17
VSS18
VSS19
VSS20
VSS21
VSS22
VSS23
VSS24
VSS25
VSS26
VSS27
VSS28
VSS29
VSS30
VSS1
VSS2
VSS3
VSS4
VSS5
VSS6
VSS7
VSS8
VSS9

0. 1u
C319 C325 C326 C327 C328 C329 C330 C331 C332 C333 C334
C320 C321 C318 C322 C323 C324

10u
10u
10u
C6
D4
D5
D6
D7
D8

J6

D9
E4
E5
E6
E7
E8
E9
F3
F4
F5
F6
F7
F8
F9
G3
G4
G5
G6
G7
G8
G9
H5
H6
H7

H8
H4

22u 2. 2u 10u 2. 2u 0. 1u 2. 2u 10u 2. 2u 1u 1u 1u 2. 2u 2. 2u 2. 2u 2. 2u 2. 2u 2. 2u

ECCH0005604

Figure 3. SM-Power Circuit Diagram of KP500

Battery Connector & Current Monitor


VSUPPLY VBAT
OVP Charging IC
VIO_2V62 VBUS_USB VBAT VBUS_OVP

VCHG U401
VCHG_OVP
R427 R426 13
C413 C414 C415 1
PGND
100K 100K VDC
12
100p 2. 2u 100p 2
VDC_BYP
VUSB
11
TP400 BAT
3
_PPR _PPR
10
USB_BYP
4
R412 U400 CHG_EOC _CHG
IVDC
9
CN402 47m o hm 5 1 CHG_EN
TP401 5
_EN
LOAD NC 8
D1 2 6
GND
GND IMIN
1 4 3 7
VIN IOUT LOAD IUSB
2
R414 ISL9221
3
BAT_ID ZXCT1010E5TA C417 R416 R430 C439 R431 R433 R434 R432 C440 C441 C442
D2 1K EUSY0286901 EUSY0351601
1u 2. 2K 100K 1u 5. 6K 20K DNI 15K 0. 1uF 0. 1uF 0. 1uF
( 1%) ( 1%)
R415 C419
HSBC- 3P30- 18
ENZY0019401 DNI 100p R432 15K o hm : 450mA

Figure 4 SM-Power Circuit Diagram with charging part

Copyright © 2008 LG Electronics. Inc. All right reserved. - 35 - LGE Internal Use Only
Only for training and service purposes
3. TECHNICAL BRIEF

3.3.2 Charging
SM-POWER provides together with an external p-channel FET Siliconix Si3455 an external AC-
adapter a complete charge control function for charging of Li-Ion or Li-Ion-Polymer batteries. Either a
1-cell Li-Ion or Li-Ion-Polymer battery with 4.1, 4.2 or 4.4 Volts may be used.

4.2V~3.69V 3.69V~3.53V 3.53V~3.43V 3.43V~3.35V

Figure 5 Battery Block Indication

1. Charging method : CC-CV


2. Charger detect voltage : 4.0 V
3. Charging time : 2h 40m
4. Charging current : 380 mA
5. CV voltage : 4.2 V
6. Cutoff current : 110 mA
7. Full charge indication current (icon stop current) : 110 mA
8. Recharge voltage : 4.16 V
9. Low battery alarm
a. Idle : 3.43 V ~ 3.3 V
b. Dedicated : 3.53 V ~ 3.3 V
10. Low battery alarm interval
a. Idle : 3 min
b. Dedicated : 1 min
11. Switch-off voltage : 3.3 V
12. Charging temperature adc range
a. ~ -5°C : low charging voltage operation (3.6 V ~ 3.9 V) .
b. -5°C ~ 50°C : standard charging (up to 4.2 V)
c. 50°C ~ : low charging voltage operation (3.6V ~ 3.9V)

LGE Internal Use Only - 36 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF

3.4 Power ON/OFF


KP500 Power State : Defined 3cases as follow
] Power-ON : Power key detect (SM-Power’s ON port)
] Power-ON-charging : Charger detect.

Figure 6 Power on application.

Input ON is a power-on input for SM-POWER with 2 active high levels (see Figure 6). It might be
triggered by a push button or by the RTCOUT output of the S-GOLD device as well. To detect if the
push-button is pressed during system operation the logical level at pin ON or its change (if Bit 1 EION
in INTCTRL2 is asserted) is recorded in bit LON of the ISF register. If the high level of voltage at pin
ON does not reach VIHdet (Vbat-0.8 ~ Vbat-0.3) the above-mentioned bit won t be set.
To support Remote power on function for factory mass production, applied an analog switch as
following figure. As monitoring the RPWRON and Key matrix KP_OUT(2) & KP_IN (0), KF350 system
recognize whether remote power on or End-key pushed

Copyright © 2008 LG Electronics. Inc. All right reserved. - 37 - LGE Internal Use Only
Only for training and service purposes
3. TECHNICAL BRIEF

Power On RTC_2V11
RPWRON_EN

R215 R213
R214
2K 330K
2K
RPWRON
PWRON
R220 C231 R217
1 2 3
100K 10u 3. 3M

U203
6 5 4
EMX18
EQBN0013701
END_KEY_IN

wer On RTC_2V11

END_KEY_IN

KP_IN( 6)

R218 Q200
END
1 2 3 10K KTC4075E
R219
KP_OUT( 2)
100K

U203
6 5 4
EMX18
N0013701
Figure 7 Remote power on and End-key power on circuit

LGE Internal Use Only - 38 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF

3.5 SIM & uSD interface


KP500 supports 1.8V & 2.9V plug in SIM, SIM interface scheme is shown in (Figure 8).
SIM_IO, SIM_CLK, SIM_RST ports are used to communicate with BBP(S-Gold3) and the SIM power
supply enabled by PMIC.

SIM Interface
SIM_CLK : SIM card reference clock
SIM_RST : SIM card Async /sync reset
SIM_IO : SIM card bidirectional reset

micro SD & SIM(Hybrid Socket) VSIM_2V9

R204
10K
VMME_2V9
VIO_2V62 SIM_IO
SIM_CLK
SIM_RST

R206 R207 R208 R209 R210 R211 C226 C227 C228


C7
C3
C6
C2
C5
C1

100K 47K 47K 47K 47K 47K 0. 1u 22p 150p


C7
C3
C6
C2
C5
C1

1
MMC_D2 1
2
MMC_D3 2
3
MMC_CMD 3
4 16
R212 47 4 U202 GND1
5 15
MMC_CLK 5 GND2
6 14
6 GND3
7 13
MMC_D0 7 GND4
8 12
MMC_D1 8 GND5
11
GND6
9
MMC_DETECT SWB
10
SWA
C229 C230
1743733- 2
DNI 1u
ENSY0017901

Figure 8 SIM & Micro SD Circuit

Copyright © 2008 LG Electronics. Inc. All right reserved. - 39 - LGE Internal Use Only
Only for training and service purposes
3. TECHNICAL BRIEF

The MicroSD Memory Module has eight exposed contacts on one side. The S-Gold3 is connected
to the module using a dedicated eight-pin connector

Micro SD Memory Card Detection Scheme

Table 7 Micro SD memory pad assign.

SD mode
Pin No. Name Type Description
1 DAT2 I/O Data bit [2]
2 CD/DAT3 I/O Data bit [3]
3 CMD I/O Command response
4 VDD Power Power supply
5 CLK I Clock
6 VSS Ground Power ground
7 DAT0 I/O Data bit [0]
8 DAT1 I/O Data bit [1]

LGE Internal Use Only - 40 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF

3.6 Memory
2Gbit NAND & 1Gbit DDRSDRAM employed on KF500 with 8 & 16 bit parallel data bus thru ADD(0) ~
ADD(29). The 1Gbit Nand Flash memory with DDRAM stacked device family offers multiple high-
performance solutions.

G10
H11
C11
C12
B10
B11
B12
A10
A11
A12

G6
G9
C1
C2
C3

D1
D2
D3

H3
H4
H5
H6
H7
H8
H9
B1
B2
B3
A1
A2
A3

E2

F2
F9

J2
NC1
NC2
NC3
NC4
NC5
NC6
NC7
NC8
NC9
NC10
NC11
NC12
NC13
NC14
NC15
NC16
NC17
NC18
NC19
NC20
NC21
NC22
NC23
NC24
NC25
NC26
NC27
NC28
NC29
NC30
NC31
NC32
NC33
NC34
NC35
ADD( 16: 29) ADD( 16) D4
ADD( 17) A0 DATA( 0) DATA( 0: 15)
E4 P10
ADD( 18) A1 I_O0 DATA( 1)
F4 N10
ADD( 19) A2 I_O1 DATA( 2)
G4 M10
ADD( 20) A3 I_O2 DATA( 3)
G8 L10
ADD( 21) A4 I_O3 DATA( 4)
F8 F10
ADD( 22) A5 I_O4 DATA( 5)
E8 E10
ADD( 23) A6 I_O5 DATA( 6)
D8 D10
ADD( 24) A7 I_O6 DATA( 7)
D9 C10
ADD( 25) A8 I_O7 DATA( 8)
G7 N11
ADD( 26) A9 I_O8 DATA( 9)
G5 M11
ADD( 27) A10 I_O9 DATA( 10)
F7 L11
ADD( 28) A11 I_O10 DATA( 11)
E7 K11
ADD( 29) A12 I_O11 DATA( 12) SD_1V8
E9 G11
ADD( 0: 15) ADD( 0) A13 I_O12 DATA( 13)
L4 F11
ADD( 1) DQ0 I_O13 DATA( 14)
M4 E11
ADD( 2) DQ1 I_O14 DATA( 15)
N4 D11
ADD( 3) DQ2 I_O15
L5
DQ3
U201

3.3K
10K
ADD( 4) M5 G3 TP200
ADD( 5) DQ4 _CE TP201 _NAND_CS
N5 M3
ADD( 6) DQ5 _WEN TP202 _WR
ADD( 7)
M6
DQ6
H8BCS0SI0MAP_56M _RE
F3
_RD

R202
R203
N6 L3
ADD( 8) DQ7 ALE ADD( 16)
M7 K3
ADD( 9)
ADD( 10)
N7
L8
DQ8
DQ9
DQ10
EUSY0347503 CLE
R__B
_WP
E3
N3
ADD( 17)
FCDP
_WP
ADD( 11) M8
ADD( 12) DQ11
N8 H2
ADD( 13) DQ12 VCCN1 SD_1V8
L9
ADD( 14) DQ13
M9 C5
ADD( 15) DQ14 VSS1
N9 C9
DQ15 VSS2
K6 G2

C215 0.01u
_BC0 LDQM VSS3
K7 H10 C214 0.1u
_BC1 UDQM VSS4
L6 P7
LDQS LDQS VSS5 SD_1V8
L7 P9
UDQS UDQS VSS6
C6
SDCLKI _CLK
C7 P5
SDCLKO CLK VSSQ
D7
CKE TP203 CKE
E5 C4
BA0 TP204 BA0 VDD1
F5 C8
BA1 BA1 VDD2
F6 P6
_RAS _RAS VDD3
E6
_CAS _CAS
D6 P4
_WR TP205 _WED VDDQ1
D5 P8
_RAM_CS _CS VDDQ2
NC36
NC37
NC38
NC39
NC40
NC41
NC42
NC43
NC44
NC45
NC46
NC47
NC48
NC49
NC50
NC51
NC52
NC53
NC54
NC55
NC56
NC57
NC58
NC59
NC60
NC61
NC62
NC63
NC64
NC65
NC66
NC67
NC68
NC69
NC70

C217 0.01u

C219 0.01u

C221 0.01u

C223 0.01u

C225 0.01u
C216 0.1u

C218 0.1u

C220 0.1u

C222 0.1u

C224 0.1u
J3
J4
J5
J6
J7
J8
J9

K2
K4
K5
K8
K9

P11
P12

T10
T11
T12
J10
J11

K10
L2
M2
N2
P1
P2
P3

Q1
Q2
Q3
Q10
Q11
Q12
T1
T2
T3

Figure 9 Flash memory & DDR RAM MCP circuit diagram

Copyright © 2008 LG Electronics. Inc. All right reserved. - 41 - LGE Internal Use Only
Only for training and service purposes
3. TECHNICAL BRIEF

3.7 LCD Display


LCD module include:
- Main LCD: 3.0” 240x400 WQVGA, 262K color TFT
- Backlight : 5 piece of white LED
LCD FPC Interface Spec:

Table 9 LCD FPC Interface Spec.

LGE Internal Use Only - 42 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF

3.8 Keypad Switching & Scanning


The keypad interface is a peripheral which can be used for scanning keypads up to 3 rows (outputs
from Port Control Logic) and 2columns (inputs to PCL). The number of rows and columns depend on
settings of the PCL.

KEY PAD

CAM HOLD

KP_OUT( 0)

UP CLR

KP_OUT( 2)

DN SEND

KP_OUT( 3)

VBAT

END
KP_IN( 3)

KP_IN( 5)
END

Figure 10 Key pad part key matrix

Copyright © 2008 LG Electronics. Inc. All right reserved. - 43 - LGE Internal Use Only
Only for training and service purposes
3. TECHNICAL BRIEF

3.9 Keypad back-light illumination


There are 2 snow white color LEDs on Key FPCB for keypad illumination. Keypad Back-light is
controlled by SM-Power Flash LED port which has constant current control function. The whole
configuration of the SM-POWER Flash LED drivers is shown in below Figure11.

Figure 11 Keypad Back-light LEDs

LGE Internal Use Only - 44 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF

KEY LED

VBAT

R106 R107 R108


120 120 120

TWH104- HS

TWH104- HS

TWH104- HS
LD101 LD102 LD103

LED_R
VA105

EVL5M02200

Figure 11 Keypad Back-light LEDs

3.10 LCD back-light illumination


The SC654 is a high efficiency charge pump LED driver using Semtech s proprietary charge pump
technology. Performance is optimized for use in single-cell Li-ion battery applications.

LCD Backlight

VBAT
U500
C503 4 7 C504
C1+ C2+
1u 5 8 1u
C1- C2-
6
OUTCP MLED
9
IN
11
D1 MLED1
12
D2 MLED2
3 13
LCD_BACKLIGHT_EN EN_SET D3 MLED3
14
D4 MLED4
10 1
GND D5 MLED5
15 2
PGND D6 C502
C500 R504
1u
AAT3169IFO- T1
100K EUSY0336502 1u

Figure 12 LCD Back light unit and Flash LED charge pump IC

Copyright © 2008 LG Electronics. Inc. All right reserved. - 45 - LGE Internal Use Only
Only for training and service purposes
3. TECHNICAL BRIEF

The SC654 is a write-only single wire interface. It provides access to up to 32 registers that control
device functionality.In this system, two sets of pulse trains are transmitted via the SPIF pin. The first
pulse set is used to set the desired address. After the bus is held high for the address hold period, the
next pulse set is used to write the data value. After the data pulses are transmitted the bus is held high
again for the data hold period to signify the data write is complete. At this point the slave device
latches the data into the address that was selected by the first set of pulses. The protocol for using this
interface is described in the following subsection.

Figure 13 I2C Serial data port control method

LGE Internal Use Only - 46 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF

3.11 JTAG & ETM interface connector

SD_1V8

VIO_2V62
CN100
G1 G2
1 30
2 29
TRACECLK
3 28
TRACEPKT7
4 27
TRSTn TRACEPKT6
5 26
TDI TRACEPKT5
6 25
TMS TRACEPKT4
7 24
TCK TRACEPKT3
8 23
RTCK TRACEPKT2
9 22
TDO TRACEPKT1
10 21
EXTRSTn TRACEPKT0
11 20
TRIG_IN PIPESTAT2
12 19
PIPESTAT1
13 18
PIPESTAT0
14 17
TRACESYNC
15 16

G3 G4
AXT430124
ENBY0029001

Figure 15 JTAG & ETM(Embedded Trace Module) interface connector

In case of KP500 mass production, the JTAG & ETM interface connector will not be mount on board.
That is only for developing and software debugging purpose.( It will not be mounted on mass
production PCB)

Copyright © 2008 LG Electronics. Inc. All right reserved. - 47 - LGE Internal Use Only
Only for training and service purposes
3. TECHNICAL BRIEF

3.12 Audio
KP500 Audio signal flow diagram as following diagram.

MIC

BBP
PMB8877
SPK
RCV

MAX
9877

FM

18pin/ IO
BT+FM
EarMIC

Figure 16 Audio signal flow diagram

LGE Internal Use Only - 48 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF

3.12.1 Audio amplifier


Audio amplifier sub system IC is an audio power amplifier capable of delivering 1.2 W of continuous
average power into a mono 8Ω load, 50mW per channel of continuous average power into stereo 32Ω
single-ended (SE) loads. The MAX9877 features a 32-step digital volume control and ten distinct
output modes. The digital volume control, output modes (mono/SE/OCL) are programmed through a
two-wire I2C interface that allows flexibility in routing and mixing audio channels.

AUDIO AMP SUB SYSTEM & SIGNAL DISTRIBUTOR


VBAT VBAT

C200 C201 C202


C5
B1
A3

2. 2u 1u 2. 2u
VSS

C203
VDD

PVDD

A4
C1N
1u A5 A1
C1P HPR HSO_R
A2
C206 1u HPL HSO_L
BB_SND_R
D1
INA2 U200
C207 1u D2
BB_SND_L INA1 MAX9877AEWP_TG45
C208 1u C1 EUSY0360201
FM_SND_R C209 1u INB2
C2 D5
FM_SND_L INB1 OUT+ SPK_RCV_P
C210
B2 B5
BIAS OUT- DNI
SPK_RCV_N
B3
I2C_SDA SDA
C3
I2C_SCL SCL
R200 8. 2 D4
EAR_P RXIN+
PGND

R201 8. 2 B4
GND

EAR_N RXIN-

C211 C212 C213


D3

C4

1u 27p 27p

Figure 17 Audio amplifier PMIC

Copyright © 2008 LG Electronics. Inc. All right reserved. - 49 - LGE Internal Use Only
Only for training and service purposes
3. TECHNICAL BRIEF

3.12.2 Microphone circuit

20 Pin Connector Pin15 : MAIN_MIC_N


Pin14 : MAIN_MIC_P
VBAT Pin13 : VMIC_P
CN101 Pin12 : VMIC_N
1 20
2 19
KP_OUT( 0)
3 18
END KP_OUT( 2) MIC101
4 17
KP_OUT( 3)
5 16 1 SPM0204HE5- PB- 3
LED_R O
6 15 2 SUMY0010603
G1
7 14 3
KP_IN( 3) G2
8 13 4
KP_IN( 5) P
9 12
10 11

AXK820145WG
ENBY0020101 C101 C102 C106 VA101 VA102 R109

27p 27p 1u DNI

SEVY0003901
EVL5M02200

Figure 18 Microphone circuit

LGE Internal Use Only - 50 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF

3.13 Charging circuit


ISL9221 accepts two power inputs, normally one from a USB (Universal Serial Bus) port and the other
from a desktop cradle.
The ISL9221 features 28V and 7V maximum voltages for the cradle and the USB inputs respectively.
Due to the 28V rating for the cradle input, low-cost, large output tolerance adapters can be used
safely.

OVP Charging IC
VIO_2V62 VBUS_USB VBAT VBUS_OVP

VCHG U401
VCHG_OVP
R427 R426 13
PGND
1
100K 100K VDC
12
VDC_BYP
2
VUSB
11
TP400 BAT
3
_PPR _PPR
10
USB_BYP
4
CHG_EOC _CHG
9
TP401 IVDC
5
CHG_EN _EN
8
GND
6
IMIN
7
IUSB
ISL9221
R430 C439 R431 R433 R434 R432 C440 C441 C442
EUSY0351601
100K 1u 5. 6K 20K DNI 15K 0. 1uF 0. 1uF 0. 1uF
( 1%) ( 1%)

R432 15K o hm : 450mA

Figure 19 Charging circuit

Copyright © 2008 LG Electronics. Inc. All right reserved. - 51 - LGE Internal Use Only
Only for training and service purposes
3. TECHNICAL BRIEF

3.14 FM radio & BLUETOOTH


FM radio
Simultaneous operation with Bluetooth
• Support of US/Europe (87.5 to 108 MHz) and Japanese (76 to 90 MHz) FM band
• Wide dynamic range AGC
• Soft mute and stereo blend
• Adjustment-free stereo decoder and AFC
• Autonomous search tuning function (up/down) with programmability (threshold setting)
• RDS demodulator
• Audio output available over Bluetooth audio interface or dedicated audio output
• Control of FM via Bluetooth HCI or I2C
• Adaptive filter to suppress narrow band interference in the FM channel

Bluetooth
General Features
• Small outline by LTCC substrate built-in RF function and Resin mold
• Integrated top BPF for Bluetooth and FM radio
• Integrated RDS/RBDS demodulator and decoder
• Bluetooth® 2.1+EDR conformity
• Secure Simple Pairing (SSP)
• Encryption Pause Resume (EPR)
• Enhance Inquiry Response (EIR)
• Link Supervision Time Out (LSTO)
• Sniff Sub Rating (SSR)
• Erroneous Data (ED)
• Packet Boundary Flag (PBF)
• WLAN coexistence including 802.15.2 three-wire coexistence support
• UART Interface
• PCM Interface
• I2S Interface
• I2C Interface

LGE Internal Use Only - 52 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF

ANT400 (1%) VIO_2V62


FL400 R417
GND1 R418
GND2 FEED IN OUT 150K
0 GND1 GND2
AMAN802012LG13 R420 R421
LFB212G45SG8A166 H2 F7 TP408
SNMF0036201 SFCY0000901 RES UART_CTS_N UART_BT_RTS
DNI DNI F1 C9 TP409
C422 10p RFIOP UART_RTS_N TP410 UART_BT_CTS
G1 J9
RFION UART_RXD TP411 UART_BT_TX
K10
UART_TXD UART_BT_RX
L407 D4
C423 1000p NC
D1 J6
FM_ANT 100nH FMRF_INP TM3
C1 F6
L408 56 nH A3 FMRF_INN TM2 VBAT
C424 C425 J7
FMVCO_LP TM1
C426 C427 A2 K7
DNI DNI FMVCO_LN TM0 VIO_2V62
A1
C428 0. 1u FM_CVAR TP412
47p 47p K6 D5
FM_SND_R C429 0. 1u AUDIOR VREG_CTL BT_LDO_EN
K5 B5
FM_SND_L AUDIOL VREG_BT
J5 A5 C433
AUDIOGND VREGFM_DAC FB405
C430 C431 A6
C432 1000p VDDR5V VBT_2V65 1u
K2 B6
DNI DNI 26M_BT XTALP VDDR3V
K3 K8
C434 0. 1u XTALN VDDO18_1
B4 A8
FM Radio & Bluetooth CLK32K LPOIN VDDO18_2
VDDO18_3
F9
D10 G5
GPIO7 VDDC1
B8 D9 FB406 C436 C437 C438
GPIO6 VDDC2
BT_VCXO_EN
G6
GPIO5 U402 VDDC3
G7
1u 0. 1u 1u
E6 A7
C435 G9
GPIO4 BCM2048SB0 VDDC4
J10
GPIO3 VDDC5 R429 DNI
F10
GPIO2 EUSY0365201 VDDTF
E1
DNI TP402 H9 E2
BT_INT TP403 GPIO1 VDDRF
H10 K1
BT_WAKEUP GPIO0 VDDPLL
E7 J3
A_GPIO7 VDDXO
B7 J1 C443 C444 C445
A_GPIO6 VDDLO
K9 A4
A_GPIO5 VDDFM1 1u 1u 1. 8p
E9 B1
A_GPIO4 VDDFM2
TP404 A10 B3
I2S1_TX A_GPIO3 VDDFM3
TP405 B10 J4
I2S1_RX A_GPIO2 VDDFM4
TP406 C10 K4
I2S1_WA0 A_GPIO1 VDDFM5
TP407 B9 A9
I2S1_CLK A_GPIO0 VDDO33_1
E10
VDDO33_2
D6 J8
BT_RESETn RST_N VDDO33_3

VSS10
VSS11
VSS12
VSS13
VSS14
C446
VSS1
VSS2
VSS3
VSS4
VSS5
VSS6
VSS7
VSS8
VSS9
DNI
B2
C2
D2
D7

G10

J2
E4
E5
F2
F4
F5
G2
G4

H1

C447 0. 1u

C448 C449
0. 1u 1u

Figure 20. Bluetooth / FM Radio Circuit Diagram

Bluetooth Radio
• Common TX/RX teminal simplifies external matching, eliminates external antenna switch
• No external trimming is required In production
• Bluetooth v2.0 + EDR Specification compliant

Bluetooth Transmitter
• +6 dBm RF Transmit power with level control from on-chip 6-bit DAC over a dynamic range >
30dB
• Class 2 and Class 3 support without the need for an external power amplifier or TX/RX switch.

Bluetooth Receiver
• Integrated channel filters
• Digital demodulator for improved sensitivity and co-channel rejection
• Real time digitized RSSI available on HCI interface
• Fast AGC for enhanced dynamic range
• Channel classification for AFH

Copyright © 2008 LG Electronics. Inc. All right reserved. - 53 - LGE Internal Use Only
Only for training and service purposes
3. TECHNICAL BRIEF

Synthesiser
• Fully integrated synthesizer requires no external VCO varactor diode, resonator or loop filter
• Compatible with crystals between 7.5 and 40MHz(in multiples of 250KHz) or an external clock

Audio
• Single-ended stereo analogue output
• 16-bit 48 kHz digital audio bit stream output

Baseband and Software


• Internal 48Kbyte RAM, allows full speed data transfer, mixed voice and data, and full piconet
operation, including all medium rate packet types
• Logic for forward error correction, header error control, access code correlation. CRC,
demodulation, encryption bit stream generation, whitening and transmit pulse shaping. Supports
all Bluetooth v 2.0 + EDR features incl. ESCO and AFH
• Transcoders for A-law, u-law and linear voice from host and A-law, u-law and CVSD voice over air

Physical Interfaces
• Synchronous serial interface up to 4Mbits/s for system debugging
• UART interface with programmable baud rate up to 4Mbits/s with an optional bypass mode
• USB v1.1 interface
• I2C slave for FM
• Two audio PCM interfaces (input and output)
• Analogue stereo (output only)

Figure 21. Bluetooth / FM Radio Block Diagram

LGE Internal Use Only - 54 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF

3.15 18pin Multi Media Interface connector


Table 8. Multi media interface pin assign

KM380 series MMI


Pin Function Description
1 FM_ANT FM radio antenna / Audio ground
2 HS_MIC Headset microphone signal
3 JACK_TYPE Accessory type detect
4 HSO_L Headset left sound
5 HSO_R Headset Right sound
6 UART_TX/USB_DP/ UART / USB/ Remote control interrupt
REMOTE_INT
7 UART_RX/USB_DM/ UART / USB/ Remote control Key ADC
REMOTE_ADC
8 JACK_DETECT Headset detect (active low)
9 VSUPPLY Battery voltage
10 VSUPPLY Battery voltage
11 RPWRON Remote power on (active high. 2.8V)
12 VCHG Charger voltage
13 VCHG Charger voltage
14 DSR N.C.
15 VBUS_USB USB VBUS
16 TX UART TX data
17 RX UART RX data
18 GND Power GND

Copyright © 2008 LG Electronics. Inc. All right reserved. - 55 - LGE Internal Use Only
Only for training and service purposes
3. TECHNICAL BRIEF

VIO_2V62

R400
1M L401
U403
5 4 VIN- 18Pin IO Connector 100nH FM_ANT
R401 1 VCC
C400
HOOK_DETECT L402
47 OUT GND 3 VIN+ VBUS_USB VIO_2V62 VCHG VSUPPLY
C402 2 VAUDA_2V5 100nH 24p
R403
NCS2200SQ2T2G 220K
120p EUSY0250501 VUSB

R402
1. 5K
CN401
C406 0. 1u R406 2. 2K C407 24p R407 R404 R436 R405
HS_MIC_N
C408 0. 1u 4. 7K 10K DNI 100K 19
HS_MIC_P
L404 100nH 1
C410 C411 C409 C412 2 1 : FM Rad io ANT
3 2 : Head set MIC
27p 27p 10u 100p 4
FB400
5 4: Head set _L
FB401
R408 36 6 5: Head set _R
USB_DP R409 36 6: USB+
7
USB_DM R410 47 7: USB-
8
JACK_DETECT 8: JACK_Det ec t
9
10 9, 10 : BATT
11
RPWRON_EN 11 : Remo t e Po wer ON
FB402 12
FB403 13 12, 13 : Charg ing
R435 47 14
DSR 14 : DSR
FB404 15
R411 47 16 15 : VUSB
UART_TX R413 47 16 : UART_TX
17
UART_RX 17 : UART_RX
18

VA402 VA403 VA404 VA405 VA406 VA407 VA408 20


C416
C418 24p
1u

ICVS0505500FR
ICVS0505500FR
HSO_L HSEJ- 18S04- 25PC
L405 100nH
ENRY0006501
C420 24p
HSO_R
VA409 VA410 C421
L406 100nH
1u
Close to 18Pin Conn.

Figure 22. MMI 18Pin Connector circuit

LGE Internal Use Only - 56 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF

3.16 Tri-axial, digital acceleration sensor


General description
The BMA150 is a tri-axial, low-g acceleration sensor IC with digital output for consumer market
applications. It allows measurements of acceleration in perpendicular axes as well as absolute
temperature measurement.
An evaluation circuitry converts the output of a three-channel micromechanical acceleration sensing
structure that works according to the differential capacitance principle.
Package and interface have been defined to match a multitude of hardware requirements.
Since the sensor IC has small footprint and flat package it is attractive for mobile applications.
The sensor IC can be programmed to optimize functionality, performance and power consumption in
customer specific applications.
The BMA150 senses tilt, motion and shock vibration in cell phones, handhelds, computer peripherals,
man-machine interfaces, virtual reality features and game controllers.
The BMA150 is the LGA package version of the SMB380 triaxial acceleration sensor which is available
in a 3mm x 3mm x 0.9mm QFN package.

Axes orientation of the BMA150

THREE- AXIS ACCELEROMETER


VIO_2V62

U302
1 10
NC1 NC2
2 9
VDD VDDIO
3 8
GND SDI CIF_SDA
4 7
NOT1
NOT2

ACCEL_INT INT SDO


5 6
CSB SCK CIF_SCL
22n
390

11
12

BMA150
C339
R317

EUSY0345201 C340
0. 1u

Copyright © 2008 LG Electronics. Inc. All right reserved. - 57 - LGE Internal Use Only
Only for training and service purposes
3. TECHNICAL BRIEF

RF Block Diagram

ANT
FEM

Mobile Switch

PAM(SKY77340)

Figure 23 KF500 RF part Block Diagram

LGE Internal Use Only - 58 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF

3.17 General Description


The RF transceiver (PMB 6272 SMARTi-PM) is an integrated single chip, quad-band transceiver for
GSM850/GSM900/GSM1800/GSM1900 designed for voice and data transfer applications.
The transceiver provides an analog I/Q baseband interface and consists of a direct conversion
receiver and a quad-band polar transmitter for GSM and EDGE with integrated PGA functionality.
Further on a completely integrated SD-synthesizer with HSCSD and GPRS/EDGE capability, a
digitally controlled reference oscillator with three outputs, a fully integrated quad-band RF oscillator
and a three wire bus interface with all necessary control circuits complete the transceiver.

Figure 24 RF transceiver PMB6272 SMARTi-PM functional block diagram

Copyright © 2008 LG Electronics. Inc. All right reserved. - 59 - LGE Internal Use Only
Only for training and service purposes
3. TECHNICAL BRIEF

G
VRF_1V5 VRF_2V85 VRF_2V85
C615 C616 C617 C618 C643 C644 C645 C646
5. 6p 5. 6p 3. 9p 3. 9p 3. 3p 3. 3p 3. 9p 3. 9p
L610 L611 L612 L613
C629 C630
0. 1u 4. 7n 18nH 18nH 5. 1nH 5. 1nH
GSM850 GSM900 DCS1800 PCS1900

VRF_1V5 VRF_2V85 VRF_2V85

C634 C635 C636 C637


32
31
30
29
28
27
26
25
24
23
22
21
0. 1u 0. 1u 0. 1u 0. 1u
RX1X

RX2X

RX3X

RX4X
FE1
VDDBIAS2V8

RX1

RX2
GND2

RX3

RX4
VDDLNA1V5
FE2
33
VBIAS
34
VDDTX1V5 U601 VDDRX2V8
35 20
LBAND_PAM_IN TX1 PMB6272 VDDRX1V5
36 19
HBAND_PAM_IN TX2 EUSY0274801 VCO_RC
37 18
VDDTX2V8 VDDVCO2V8
38 17
VDDMIX2V8 EN RF_EN
C639 R606 39 16
GND3 VDDXO2V8
VDDDIG2V8

VDDDIG1V5

220n 10 40 15
FSYS1 26MHZ_MCLK
14 C638 1000p
GND4 GND1
FSYS3
FSYS2

41 13
XOX
CLK

R607 C640
XO
DA
BX
AX

VRF_1V5
A

VRF_2V85 820 47n


10
11
12
1
2
3
4
5
6
7
8
9

R608 X600 TSX- 3225


4
GND2 HOT2 3
10 1 HOT1 GND1 2
26MHz
C641 C642
220n 0. 1u

26M_BT
RF_CLK

RF_DA

QX
Q
IX
I

Figure 25 RF transceiver PMB6272 SMARTi-PM schematic

LGE Internal Use Only - 60 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF

3.18 Receiver part

Figure 26 Receiver part block diagram

The constant gain direct conversion receiver contains all active circuits for a complete receiver chain
for GSM/GPRS/EDGE (see Figure 39). The GSM850/900/DCS1800/ PCS1900 LNAs with balanced
inputs are fully integrated. No inter-stage filtering is needed. The orthogonal LO signals are generated
by a divider-by-four for GSM850/900 band and a divider-by-two for the DCS1800/PCS1900 band.
Down conversion to baseband domain is performed by low/high band quadrature direct down
conversion mixers. The baseband chain contains a LNB (low noise buffer), channel filter, output buffer
and DC-offset compensation. The 3rd order low pass filter is fully integrated and provides sufficient
suppression of blocking signals as well as adjacent channel interferers and avoids anti-aliasing
through the baseband ADC. The receive path is fully differential to suppress on-chip interferences.
Several gain steps are implemented to cope with the dynamic range of the input signals. Depending
on the baseband ADC dynamic range, single- or multiple gain step switching schemes are applicable.
Furthermore an automatic DC-offset compensation can be used (depending on the gain setting) to
reduce the DC-offset at baseband-output. A programmable gain correction can be applied to correct
for front end- and receiver gain tolerances.

Copyright © 2008 LG Electronics. Inc. All right reserved. - 61 - LGE Internal Use Only
Only for training and service purposes
3. TECHNICAL BRIEF

3.19 Transmitter part


The GMSK transmitter supports power class 4 for GSM850 and GSM900 as well as power class 1 for
DCS1800 and PCS1900. The digital transmitter architecture is based on a very low power fractional-N
Sigma-Delta synthesizer without any external components (see Figure39). The analog I/Q modulation
data from the baseband is converted to digital, filtered and transformed to polar coordinates. The
phase/frequency signal is further on processed by the Sigma-Delta modulation loop. The output of its
associated VCO is divided by four or two, respectively, and connected via an output buffer to the
appropriate single ended output pin. This configuration ensures minimum noise level. The 8PSK
transmitter supports power class E2 for GSM850 and GSM900 as well as for DCS1800 and PCS1900.
The digital transmitter architecture is based on a polar modulation architecture, where the analog
modulation data (rectangular I/Q coordinates) is converted to digital data stream and is subsequently
transformed to polar coordinates by means of a CORDIC algorithm. The resulting amplitude
information is fed into a digital multiplier for power ramping and level control. The ready processed
amplitude signal is applied to a DAC followed by a low pass filter which reconstructs the analog
amplitude information.
The phase signal from the CORDIC is applied to the Sigma-Delta fractional-N modulation loop. The
divided output of its associated VCO is fed to a highly linear amplitude modulator, recombining
amplitude and phase information. The output of the amplitude modulator is connected to a single
ended output RF PGA for digitally setting the wanted transmit power. The PA interface of SMARTi-PM
supports direct control of standard dual mode power amplifiers (PA s) which usually have a power
control input VAPC and an optional bias control pin VBIAS for efficiency enhancement. In GMSK
mode, the PA is in saturated high efficiency
mode and is controlled via its VAPC pin directly by the baseband ramping DAC. In this way both up- /
down-ramping and output power level are set. In 8PSK mode, the ramping functionality is assured by
an on-chip ramping generator, whereas output power is controlled by the PGA s as described above.

Figure 27 Transmitter part block diagram

LGE Internal Use Only - 62 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF

3.20 RF synthesizer
The transceiver contains a fractional-N sigma-delta synthesizer for the frequency synthesis in the RX
operation mode. For TX operation mode the fractional-N sigma-delta synthesizer is used as Sigma-
Delta modulation loop to process the phase/frequency signal. The 26MHz reference signal is provided
by the internal crystal oscillator. This frequency serves as comparison frequency of the phase detector
and as clock frequency for all digital circuitry.The divider in the feedback path of the synthesizer is
carried out as a multi-modulus divider (MMD). The loop filter is fully integrated and the loop bandwidth
is about 100 kHz to allow the transfer of the phase modulation. The loop bandwidth is automatically
adjusted prior to each slot (OLGA2). To overcome the statistical spread of the loop filter element values
an automatic loop filter adjustment (ALFA) is performed before each synthesizer startup. The fully
integrated quad-band VCO is designed for the four GSM bands (850, 900, 1800, 1900 MHz) and
operates at double or four times transmit or receive frequency. To cover the wide frequency range the
VCO is automatically aligned by a binary automatic band selection (BABS) before each synthesizer
startup.

3.21 VCTCXO
The SMARTiPM contains a fully integrated 26MHz digitally controlled crystal oscillator (DCXO) with
three outputs for the system clock, one output for the GSM baseband and two additional for other
U601 etc.).The only external part of the oscillator is the crystal itself. The
subsystems (GPS, Bluetooth,
PMB6272along the selected subrange by programming the frequency control
frequency tuning is performed
EUSY0274801
word (XO_TUNE) via the three wire bus (“3Wbus”)
39 6
GND3 VDDXO2V8
VDDDIG2V8

VDDDIG1V5

40 15
FSYS1
14
GND4 GND1
FSYS3
FSYS2

41 13
XOX
CLK

R607
XO
DA
BX
AX
A

VRF_2V85 820
10
11
12
1
2
3
4
5
6
7
8
9

X600 TSX- 3225


4
GND2 HOT2 3
1 HOT1 GND1 2
26MHz
642
1u

Figure 28 DCXO Schematic

Copyright © 2008 LG Electronics. Inc. All right reserved. - 63 - LGE Internal Use Only
Only for training and service purposes
3. TECHNICAL BRIEF

3.22 Front End Module control


Implemented in the S-Gold3 (FL600) are two outputs which are FE1, FE2 for direct control of front end
modules with two logic input pins to select RX and TX mode as well as low and high band operation.
FEM need 2V85_VRF supply.

Table 12 FEM Control Logic

MODE Tx 1GHz Tx 2GHz Rx 1GHz Rx 2GHz

VDD ON ON ON ON

VC1 OFF ON OFF ON

VC2 ON ON OFF OFF

RF
VRF_2V85

C600 R609
GND600 GND601
DNI
0 C602 C603
R610 C601
1u 39p
0 DNI FE1
FE2
C604 C605
14
13

12

11
16
18
19
20

47p 47p
9
VDD

GND1
GND2
GND3
GND4
GND5
GND6
VC1
VC2

FL600
ANT

SW600 C606
DGM1110M014
R611 L603
GSM1800_1900_TX

G2 17 SFAY0011101
GSM850_900_TX

ANT RF
ENWY000 6301

G1
2. 2nH
GSM1800_RX1
GSM1800_RX2
GSM1900_RX1
GSM1900_RX2
GRS302- 2S- H22- E3000

GSM850_RX1
GSM850_RX2
GSM900_RX1
GSM900_RX2

0 180p
L601
12nH C609

DNI
10
15
1
2
3
4
5
6
7
8

L
1
C611
DNI

C61

Figure 29 FEM schematic

LGE Internal Use Only - 64 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF

3.23 Power Amplifier Module


The SKY77340 Power Amplifier Module(PAM) is designed in a compact from fact for quad-band
cellular handsets comprising GSM850/900,DCS1800,PCS1900,supporting GMSK and linear EDGE
modulation.
Class12 General Packet Radio Service(GPRS) multi-slot operation is also supported.
The module consists of a GSM850/900 PA block and a DCS1800/PCS1900 PA block,impedance
matching circuitry for 50ohm input and output impedances, and a Multi-function Power Amplifier
Control(MFC) block. A custom CMOS integrated circuit provides the internal MFC function and
interface circuitry.
Two separate Heterojunction Bipolar Transistor(HBT) PA blocks are fabricated onto InGaP die; one
supports the GSM850/900 bands, the other supports the DCS1800 and PCS1900 bands. Both PA
blocks share common power supply pins to distribute current. The InGaP die, the silicon die, nad the
passive components are mounted on a multi layer laminate substrate. The assembly is encapsulated
with plastic overmold.
RF input and output ports are internally matched to 50ohm to reduce the number of external
components Extremely low leakage current(2.5uA) maximizes handset standby time. Band select(BS)
circuitry select GSM transmit frequency band(logic0) and DCS/PCS transmit frequency(logic1). MODE
circuitry selects GMSK modulation (logic0) or EDGE modulation(logic1). VRAMP controls the output
power for GMSK modulation and provides bias optimization for EDGE modulation depending on the
state of MODE control.
The integrated multi-function(MFC) provides envelope amplitude control in GMSK mode, reducing
sensitivity to input drive, temp, power supply, and process variation. In EDGE mode, the MFC
configures the PA for fixed gain, and provides the ability to optimize the PA bias operation at different
power levels, This circuitry regulates PA bias conditions, reducing sensitivity to temp., power supply,
and process variation. The Enable input signal(pin8) provides a standby state to minimize battery
drain.

Table 13 PAM pin description

Pin Mame Description


1 MODE GMSK/EDGE Power control mode. L=GMSK, H=EDGE
2 DCS/PCS_IN RF input(DCS/PCS) DC Blocked
3 BS Band Select
4 VBIAS Analog PA Bias Control(All Bands, EDGE Mode)
5 VBATT DC Supply
6 VRAMP Analog Output Power Control(All Bands, GMSK Mode)
7 GSM_IN RF input(CEL/EGSM) DC Blocked
8 EN Transmit Enable/Disable. Low=Disable
9 GSM_OUT RF Output(CEL/EGSM) DC Blocked
*12 REVD2 Reserved
*10,11,13-15 GND Ground
*16 DCS/PCS_OUT RF Output(DCS/PCS) DC Blocked
Pad GND PAD GRID Ground pad grid is device underside.

Copyright © 2008 LG Electronics. Inc. All right reserved. - 65 - LGE Internal Use Only
Only for training and service purposes
3. TECHNICAL BRIEF

3.24 PAM Schematic

VSUPPLY
U600
GND25 GND15
27 26
GND24 GND14
28 25
GND23 GND13 R600 22K
29 24
GND22 GND12 RF_TEMP
30 23
GND21 GND11
31 22
GND20 GND10 R601 10K
32 21
GND19 GND9
33 20
GND18 GND8
34 19
GND17 GND7
35 18
GND16 GND6
L604 36 17
R602 47
GSM_OUT EN C610 100p TXON_PA
1nH 9 8
GND5 GSM_IN R603 47 LBAND_PAM_IN
C611 C612 10 7
GND4 VRAMP PA_LEVEL
11 6
DNI DNI RSVD2 VBATT
12 5
GND3 RSVD1 R604 47
13 4
GND2 BS C613 100p PA_BAND
14 3
GND1 DCS_PCS_IN HBAND_PAM_IN
C614 15 2
DCS_PCS_OUT MODE PA_MODE
16 1 R605 47
68p SKY77340
SMPY0012301 C619 C620 C621 C622 C623 C624 C625 C626
L609
C627
22nH 39p 39p 39p 39p DNI DNI DNI DNI
DNI

C631 C628 C632 C633


1u 33 uF 39p 27p

Figure 30 PAM schematic

LGE Internal Use Only - 66 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
4. PCB layout

4. PCB layout

4.1 Main PCB component placement

Main PCB Top placement

Copyright © 2008 LG Electronics. Inc. All right reserved. - 67 - LGE Internal Use Only
Only for training and service purposes
4. PCB layout

Main PCB bottom placement

LGE Internal Use Only - 68 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting

5. Trouble shooting

5.1 Trouble shooting test setup

Equipment setup
Power on all of test equipment
- Connect PIF-UNION JIG or dummy battery to the DUT for power up.
- Connect mobile switch cable between Communication test set and DUT when you need to make a
phone call.
- Follow trouble shooting procedure

Copyright © 2008 LG Electronics. Inc. All right reserved. - 69 - LGE Internal Use Only
Only for training and service purposes
5. Trouble shooting

5.2 Power on Trouble


Check Points
- Battery Voltage( Need to over 3.35V)
- Power-On Key detection (PWRON signal)
- Outputs of LDOs from PMIC

Power On RTC_2V11
RPWRON_EN

R215 R213
TP1 R214
2K 330K
2K
RPWRON
PWRON
R220 C231 R217
1 2 3
100K 10u 3. 3M

U203
6 5 4
EMX18
END_KEY_IN
EQBN0013701

VIO_2V62
External Reset
R216 RTC_2V11

100K

U204
7 8
EXTRSTn 6 A1 VCC 1
SPOWER_INT 5 B1 Y1 2 PM_INT
_RESET 4 Y2 B2 3 PMRSTn
GND A2
C232
TP2 NC7WZ08L8X 0. 1u
EUSY0102802

LGE Internal Use Only - 70 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting

RESOURCE_CTRL
R300
RTC_OUT ON_OFF2

LIN_PWM_MAG
SPOWER_INT
27K
VUSB VBAT R301
VPLL_1V35 VIO_2V62

ON_OFF2

I2C_SDA
I2C_SCL
PWRON
DNI
PMIC

WDOG
VBAT VBAT VIO_2V62
VBAT
C301 C300

KEY_EN
VBAT VBAT

KEY_BL
2. 2u 0. 1u D3 0 0

C303 2.2u

C304 2.2u

4.7K
4.7K
4.7K
1u
2
3 VCHG_OVP
C305

DNI
TP301

C302
1

R305 4.7K
R306 4.7K
R323 VBUS_OVP
2. 2u C307 C308

R302
R303
R304
R307 100K
C306 0.1u
100K KDR331V

1u
1u 2. 2u

R322
SP_INT
USB_OEn TP300
USB_DAT_VP

C309
USB_SE0_VM
C310
SD_1V8 VAUDB_2V5 VBAT TXON_PA 0. 1u CORE_1V35 CAM_A_2V8 VSIM_2V9 VBT_2V65 SD_1V8

FLASH_ON B10

B11
A10

A11

K10

L11
VBAT
C3

C4

C5

C7

C8

FLASH_SHINK C9
B2

B3

B5

B6

B7

B8

B9

B4

K3

K4

K5
I2C_INT K6

BL1_PWM K7

K8

K9
A2

A3

A4

A5
A7

A6

A9

A1

A8
L1

L3

L4
L5

L6

L7

L8

L9
J4

J5

I2C_DAT J7

BL2_PWM J8

J9
L300 D3 0 1
VAUDA_2V5 VFM_2V9 VBAT CAM_2V85 RTC_2V11 VRF_2V85 VRF_1V5 VMME_2V9

TXONPA

CH_SOURCE

VDD_CHARGE
DAT_VP

OUTPORT

ON_OFF_OUT
OE_N

MONO_INP
MONO_INN

MONO_OUTP

MONO_OUTN

I2C_CLK
SE0_VM

VREFEX_M

PUMS3
PUMS2
PUMS1
VUSB

BL3_PWM
VDD_USB

VPLL
RREF
SUSPEND

VDD_MONO

VSS_MONO

VDDPLLIO

VIO

POWER_ON
WDOG
VREF

RESOURCE_CRTL

CH_CNTRL

VDD_REF
CHARGE_UC

VLED
VSD2

VSD1
ON_OFF1
ON_OFF2

SENSE_IN1
SENSE_IN2
AC+

10uH
AC-

KDS160E
U_RCV B1
RCV
U_PMIN C2
VPIN
U_VMIN D3 C11
VMIN VMME
C1 C10
USB_DP D+ VDDMME
D2
USB_DM D-
D1 0
PMRSTn VDDRF2
E3 D1 1
FB300

PMRSTn RESET_N VRF2


D1
RESET2_N
E2 E10
VCXO_EN SLEEP1_N VRF3
E1 E11
BT_VCXO_EN SLEEP2_N VDDRF13_AFC
F2
F1
VAUDIOA
VDDAUDIOA
U300 VRF1
VVIB
F10
F11

G2
VDDAUDIOB
PMB6821 VDDSIMVIB
G11

G1
VAUDIOB EUSY0323901 VSIM
G10

H2 H1 1
VAUX VAFC
H1
VDDAUX
C311 C312 C313 D3 0 2 H1 0
VRTC
J1
2. 2u 2. 2u 1u L301 SU1_GATE
J2 H9
KDS160E SU1_GND VDDUMTS
10uH H3 J1 1
SU1_FB VUMTS
J3 FB301
SU1_ISENSE
K11
VDDSD1
K1 J1 0
VDDSD2 SD1_FB
K2 L10
SD2_FB SD1_FBL
L2
VSS_VREF

SD2_FBL
VSS_SD1
VSS_SD2

C317

C314
C315
C316
VSS10
VSS11
VSS12
VSS13
VSS14
VSS15
VSS16
VSS17
VSS18
VSS19
VSS20
VSS21
VSS22
VSS23
VSS24
VSS25
VSS26
VSS27
VSS28
VSS29
VSS30
VSS1
VSS2
VSS3
VSS4
VSS5
VSS6
VSS7
VSS8
VSS9

0. 1u
C319 C325 C326 C327 C328 C329 C330 C331 C332 C333 C334
C320 C321 C318 C322 C323 C324

10u
10u
10u
C6
D4
D5
D6
D7
D8

J6

D9
E4
E5
E6
E7
E8
E9
F3
F4
F5
F6
F7
F8
F9
G3
G4
G5
G6
G7
G8
G9
H5
H6
H7

H8
H4

22u 2. 2u 10u 2. 2u 0. 1u 2. 2u 10u 2. 2u 1u 1u 1u 2. 2u 2. 2u 2. 2u 2. 2u 2. 2u 2. 2u

ECCH0005604

LDO Net name Output Voltage Output Current Usage


SD1 CORE_1V35 1.35V 600mA Core & for LDO
SD2 SD_1V8 1.8V 300mA Memory
VAUX VFM_2V9 2.9V 100mA Touch, LCD
VIO VIO_2V62 2.62V 100mA Peripherals
VSIM VSIM_2V9 2.9V 70mA SIM card
VMME VMME_2V9 2.9V 150mA u-SD
VUMTS CAM_2V85 2.85V 110mA Camera
VUSB VUSB 3.1V 40mA USB
VLED VLED 2.9V 10mA Not used
VAUDIOa 2.5V 200mA Stereo headset, Mono earpiece
VAUDIOb VAUDB_2V5 2.5V 50mA Analog parts of S-Gold
VRF1 VRF_2V85 2.85V 150mA 2.85 V supply for SMARTi-PM
RF transceiver
VRF2 VRF_1V5 1,53V 1 00mA 1.5 V supply for SMARTi-PM
RF transceiver
VRF3 VBT_2V65 2.7V 150mA BT/FM Radio
VPLL VPLL_1V35 1.35V 30mA S-GOLD3 PLL
VRTC VRTC_2V11 2.11V 4mA Real Time Clock
VAFC VAFC 2.65V 5mA Not used
VVIB CAM_A_2V8 2.8V 140mA Camera

Copyright © 2008 LG Electronics. Inc. All right reserved. - 71 - LGE Internal Use Only
Only for training and service purposes
5. Trouble shooting

START
TP1

Connect power
supply to the DUT
U203
Vbat = over 3.35V

Yes

ìPWRONî signal No Check the U204


Check 3 pin of U203
(High Low)
RPWRON,
replace U203

Yes

TP2
ì_RESETî signal No Check solder
Check 5 pin of U204 U300
U204 or replace it

Yes

Check the all LDOís No Check solder


output
U300 or replace it
Is it correct?

Yes

Check solder X600


Is the 26MHz No or replace it
clock From X600
signal correct? Check 1 pin of X600
Or Check C638 of U601
Yes

Replace main PCB


U601 C638 of U601

1 Pin X600

LGE Internal Use Only - 72 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting

5.3 Charging trouble


Check Points
- Connection of TA (check TA voltage 5.1V)
- Charging Current Path component voltage drop
- Battery voltage

1 Charging method : CC-CV


2 Charger detect voltage : 4.0 V
3 Charging time : 2h 20m
4 Charging current : 550 mA
5 CV voltage : 4.2 V
6 Cutoff current : 110 mA
7 Full charge indication current (icon stop current) : 110 mA
8 Recharge voltage : 4.16 V

4.2V~3.71V 3.70V~3.55V 3.54V~3.46V 3.45V~3.31V

OVP Charging IC
VIO_2V62 VBUS_USB TP1 VBAT VBUS_OVP

VCHG U401
TP2
VCHG_OVP
R427 R426 13
PGND
1
100K 100K VDC
12
VDC_BYP
2
VUSB
11
TP400 BAT
3
_PPR _PPR
10
USB_BYP
4
CHG_EOC _CHG
9
TP401 IVDC
5
CHG_EN _EN
8
GND
6
IMIN
7
IUSB
ISL9221
R430 C439 R431 R433 R434 R432 C440 C441 C442
EUSY0351601
100K 1u 5. 6K 20K DNI 15K 0. 1uF 0. 1uF 0. 1uF
( 1%) ( 1%)

R432 15K o hm : 450mA

Copyright © 2008 LG Electronics. Inc. All right reserved. - 73 - LGE Internal Use Only
Only for training and service purposes
5. Trouble shooting

START

18pin IO(CN401) No Resolder the


Is soldered ? CN401

Yes 18pin IO
(CN401)
The TA can be
Source pin No broken
of U401 = 5.1V ? Change other TA
then retest

Yes

Check solder
Output pin No U401 or replace it
of U401 =4.2V?

Yes

Waiting until
No
Battery voltage battery
is over 3.4V? Voltage goes up
to 3.4V

Yes

Battery thermistor No Change the


value
is about 68K? Battery
After check
thermistor
Yes

Charge is operating

U401

TP1: Source pin

U401
TP2: Output pin

LGE Internal Use Only - 74 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting

5.4 LCD display trouble


Check Points
- LCD assembly status ( LCD FPCB, Connector on FPCB)
- EMI filter soldering
- Connector combination

LCD Connector

Pin2 : LCD_VSYNC_I
Pin3 : MAKER_ID VFM_2V9
Pin11 : IF_MODE( IF1)
Pin18 : OPEN( OTP)
Pin19 : IF_MODE( IF0)
R516
VFM_2V9 VFM_2V9
10K
CN502
40 1 R517
R512 DNI
10

39 2
5

38 3 DNI
G1
G2

LCD_ID
37 4
DIF_D0 INOUT_A4 INOUT_B4 MLED IF_MODE
4 6 36 5
DIF_D1 INOUT_A3 INOUT_B3 MLED1
3 7 35 6 R518
DIF_D2 INOUT_A2 INOUT_B2 MLED2
2 8 34 7
DIF_D3 INOUT_A1 INOUT_B1 MLED3 DNI
1 9 33 8
MLED4
FL503 EVRC14S03Q030100R 32 9
MLED5 FL504

10
31 10

5
30 11

G2
G1
TP501 29 12
TP502
INOUT_B4 INOUT_A4 DIF_CD
10

28 13 6 4
5

TP503
INOUT_B3 INOUT_A3 DIF_MAIN_CS
27 14 7 3
G1
G2

TP504 _DIF_RESET INOUT_B2 INOUT_A2 DIF_RD


26 15 8 2
DIF_D4 INOUT_A4 INOUT_B4
TP505
INOUT_B1 INOUT_A1 _DIF_WR
4 6 25 16 9 1
DIF_D5 INOUT_A3 INOUT_B3
TP506
3 7 24 17
DIF_D6 INOUT_A2 INOUT_B2
TP507 DIF_VSYNC EVRC14S03Q030100R
2 8 23 18 TP508
DIF_D7 INOUT_A1 INOUT_B1
TP509
1 9 22 19
FL505 EVRC14S03Q030100R 21 20
C518
VA508 LCD Interf ac e Mo d e
1u Maker IF1 Maker ID
GB042- 40S- H10- E3000 EVLC14S02050
SHARP H L
ENBY0036001
LGIT L H

- Check the connection LCD FPCB


Connector(CN502)
- Check signal flow via EMI filter
(FL503, FL504, FL505)

FL505

FL504
FL503

FL504

Charge Pump(U500)

Copyright © 2008 LG Electronics. Inc. All right reserved. - 75 - LGE Internal Use Only
Only for training and service purposes
5. Trouble shooting

START

Check LCD connector


combination then LCD test
with New LCD

No Replace LCD FPCB


Is LCD FPCB
normal?

Yes

Check solder and


Signal is normal on No repair
DIF Signal Damaged filter
FL503, FL504, FL505

Yes

Assemble

LGE Internal Use Only - 76 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting

5.5 Camera Trouble


Check Points
- Connectors combination
- FPCB status

CMA_A_2V8
3M F/ F Camera Connector (FB500)
FL500 CAM_A_2V8
1 9
CIF_D7 2
INOUT_A1 INOUT_B1
8 VCAM_CORE_1V8 CAM_2V85
CIF_D6 3
INOUT_A2 INOUT_B2
7
CIF_D5 4
INOUT_A3 INOUT_B3
6
CIF_D4
FB500

INOUT_A4 INOUT_B4
CN500
G1
G2

ICVE10184E070R101FR 1 24
10
5

2 23
CIF_SCL
3 22
CIF_SDA FL501
4 21
FL502 5 20 1 9
INOUT_A1 INOUT_B1 CIF_VSYNC
1 9 6 19 2 8
CIF_D3 INOUT_A1 INOUT_B1 INOUT_A2 INOUT_B2
R501 0 CIF_HSYNC
2 8 7 18 3 7
CIF_D2 INOUT_A2 INOUT_B2 INOUT_A3 INOUT_B3
R502 0 CIF_MCLK
3 7 8 17 4 6
CIF_D1 INOUT_A3 INOUT_B3 INOUT_A4 INOUT_B4 CIF_PCLK
4 6 9 16
CIF_D0 INOUT_A4 INOUT_B4

G1
G2
10 15
G1
G2

11 14 ICVE10184E070R101FR

10
5 4 Pin U501
ICVE10184E070R101FR 12 13 SFEY0011401
10
5

C501
CIF_RESET VBAT VCAM_CORE_1V8
CIF_PD ENBY0034201 DNI

VA500
GB042- 24S- H10- E3000 U501
C505 1 5
CAM_LDO_EN STBY NC
2 6
EVLC5S02100 DNI C506 C507 C508 C509 C510 C511 GND BGND
3 4
VIN VOUT
56p 0. 1u 56p 0. 1u 56p 0. 1u
R505 C512 BH18LB1WHFV C513
100K 1u
EUSY0223006 1u

- Check the connector combination(CN500)

CN500

4 Pin U501

CMA_A_2V8
(FB500)

Copyright © 2008 LG Electronics. Inc. All right reserved. - 77 - LGE Internal Use Only
Only for training and service purposes
5. Trouble shooting

START

Check camera connector,


24pin main PCB connector
combination then Camera test
with equipped camera module

Yes

Replace New No
Camera module Replace
Working properly? Main
PCB

Yes

Replace Camera module

Yes

Assemble

LGE Internal Use Only - 78 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting

5.6 Receiver & Speaker trouble


Check Points
- Speaker soldering status
- Audio amp & Analog switch soldering status

AUDIO AMP SUB SYSTEM & SIGNAL DISTRIBUTOR


VBAT VBAT

C200 C201 C202

C5
B1
A3

2. 2u 1u 2. 2u
TP1
VSS

C203
VDD

A4 PVDD
C1N
1u A5 A1
C1P HPR HSO_R
A2
C206 1u HPL HSO_L
BB_SND_R
D1
INA2 U200
C207 1u D2
BB_SND_L INA1 MAX9877AEWP_TG45
EUSY0360201
TP3
C208 1u C1
FM_SND_R C209 1u INB2
C2 D5
FM_SND_L INB1 OUT+ SPK_RCV_P
C210
B2 B5
BIAS OUT- DNI
TP2 I2C_SDA
B3
SDA
SPK_RCV_N
C3
I2C_SCL SCL
R200 8. 2 D4
TP4
EAR_P RXIN+
PGND

R201 8. 2 B4
GND

EAR_N RXIN-

C211 C212 C213


D3

C4

1u 27p 27p

Receiver & Speaker


L400
SPK_RCV_N CN400
100nH
C401
2
39p
L403
SPK_RCV_P 1
VA400 VA401 100nH
C404 C405
24- 8000- 002- 000- 829
ENEY0003801
22p 22p

TP1
U200
TP2

TP3
TP4

Copyright © 2008 LG Electronics. Inc. All right reserved. - 79 - LGE Internal Use Only
Only for training and service purposes
5. Trouble shooting

Speaker contact

L400 L403

START

Check Speaker ís No
Contacts are clear. Resolder/Replace
Speaker

Yes

Input Signal is No
High(TP1 C206, Replace Main Board
TP2 C207) ?

Yes

Output Signal is No Replace Audio


High(TP3 C212, AMP(U200).
TP4 C213)?

Yes

Signal is No
High(L400, Replace L400 , L403
L403)?

Yes

Assemble

LGE Internal Use Only - 80 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting

5.7 Microphone trouble


Check Points
- Microphone hole
- Mic. Bias & signal line
VBAT
CN501
1 20

2 19 R506 680
KP_OUT( 0)
3 18 R507 680
KP_OUT( 2)
4 17 R508 680
KP_OUT( 3) TP1
5 16

6 15 FB501
C514 22n
MAIN_MIC_N
7 14 FB502
C515 22n
MAIN_MIC_P
8 13
L500
TP2
9 12
VMIC_P
10 11 100nH
02 C521 VA503 VA504 VA505 VA506 VA507 C516 C517 TP3
1u 2. 2u 27p
AXK720147G
ENBY0019501 VMIC_N
ICVL0505101V150FR
ICVL0505101V150FR

20 Pin Connector Pin15 : MAIN_MIC_N


Pin14 : MAIN_MIC_P
VBAT Pin13 : VMIC_P
CN101 Pin12 : VMIC_N
1 20
2 19
KP_OUT( 0)
3 18
END KP_OUT( 2) MIC101
4 17
KP_OUT( 3)
5 16 1 SPM0204HE5- PB- 3
LED_R O
6 15 2 SUMY0010603
G1
7 14 3
KP_IN( 3) G2
8 13 4
KP_IN( 5) P
9 12
10 11

AXK820145WG
ENBY0020101 C101 C102 C106 VA101 VA102 R109

27p 27p 1u DNI

SEVY0003901
EVL5M02200

MIC101

Copyright © 2008 LG Electronics. Inc. All right reserved. - 81 - LGE Internal Use Only
Only for training and service purposes
5. Trouble shooting

TP1 TP2

TP3

CN101 CN501

START

Check microphone sound


hole

Mic bias ON No Check mic. Bias


(2.5V)when line
call? (TP3)

Yes

No Repair the 44pin


44pin connector
(CN501)is good? conn. (CN501)

Yes

Check Signal No Replace


TP1, TP2 (2.5V)? microphone
(MIC101)

Yes

No Replace KEY FPCB


Check All of
CN101 solder?

Yes

Assemble

LGE Internal Use Only - 82 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting

5.8 Vibrator trouble


Check Points
- Vibrator soldering
- IC is working correct

Vibrator
VBAT 3V0_VMOT
TP2
TP1 U301
4 1
VDD VOUT
PGND

3 2
VIB_EN CE_NC GND
C335
R308 C336
1u 3V0_VMOT
5

100K 1u RP104K301D C337 2200p


EUSY0353901
R310 100K
C338
3V0_VMOT U304 1u
TPA6205A1ZQVR CLOSE TO
U303 C3 A3
CONNECTOR
1 5
LIN_INVERT L302
2 IN_B VCC IN- VDD CN300
LIN_PWM_FRQ C2 B3 100nH
3 IN_A 4 R316 120K 1
GND OUT_Y IN+ VO+
TC7SZ86FU B1 A1 2
VIB_EN _SHUTDOWN VO-
EUSY0140901 C1 B2 L303
BYPASS GND 100nH
24- 8000- 002- 000- 829
ENEY0003801
C341

0. 01u
EUSY0349001
U305
1 5
2 IN_B VCC
LIN_PWM_MAG 3 IN_A 4 R320 R321 100K
GND OUT_Y
120K
TC7SZ86FU C342 2200p
EUSY0140901

- +

TP1

U301 U304

TP2

Copyright © 2008 LG Electronics. Inc. All right reserved. - 83 - LGE Internal Use Only
Only for training and service purposes
5. Trouble shooting

START

Check Vibrator contacts are


clear

No Replace U100
TP1(VIB_EN) is
high?

Yes

TP2 is 3.0V? No Replace U301

Yes

Replace Vibrator

Assemble

LGE Internal Use Only - 84 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting

5.9 Keypad back light trouble


Check Points
- Signal path is connected well

KEY Backlight LED Main FPCB

LED_R
R324
KEY_BL
TP500
0
R325
DNI

3
R309 Q300
KEY_EN 2
DNI 1 KTC4075E
EQBN0007601
R313 R312
100K 10
CN501

KEY LED KEY FPCB

VBAT

R106 R107 R108


120 120 120
TWH104- HS

TWH104- HS

TWH104- HS

CN101

LD101 LD102 LD103

LED_R
VA105
TP1
EVL5M02200

Copyright © 2008 LG Electronics. Inc. All right reserved. - 85 - LGE Internal Use Only
Only for training and service purposes
5. Trouble shooting

START

Check All of LEDs solder

No Check Q300 of main


Check TP500 is
board
2.62V?

Yes

20pin connector No
(Main CN501, KEY Replace 20pin
FPCBCN101) is conn.
good? (CN501, CN101)

Yes

Replace KEY FPCB

Assemble

TP1

LGE Internal Use Only - 86 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting

5.10 SIM & uSD trouble


SIM Check Points
- Power is working
- Socket soldering
- Proper SIM is used

Copyright © 2008 LG Electronics. Inc. All right reserved. - 87 - LGE Internal Use Only
Only for training and service purposes
5. Trouble shooting

micro SD & SIM(Hybrid Socket) VSIM_2V9

R204
10K
VMME_2V9
VIO_2V62 SIM_IO
SIM_CLK
SIM_RST

R206 R207 R208 R209 R210 R211 C226 C227 C228

C7
C3
C6
C2
C5
C1
100K 47K 47K 47K 47K 47K 0. 1u 22p 150p

C7
C3
C6
C2
C5
C1
1
MMC_D2 1
2
MMC_D3 2
3
MMC_CMD 3
4 16
R212 47 4 U202 GND1
5 15
MMC_CLK 5 GND2
6 14
6 GND3
7 13
MMC_D0 7 GND4
8 12
MMC_D1 8 GND5
11
GND6
9
MMC_DETECT SWB
10
SWA
C229 C230
1743733- 2
DNI 1u
ENSY0017901

START

Check All of SIM card voltage


KP500 support
2.9V SIM only

No Resolder pin
6 pins are
soldered well?

Yes

Check Proper Yes Replace Main Board


SIM Card

Assemble

LGE Internal Use Only - 88 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting

uSD Check Points


- Power is working
- Socket soldering
- Card detect is working

TP3

TP4
TP1
MMC-DETECT PIN
TP2

MMC_DETECT SIGNAL

Card insert Card Deject

micro SD & SIM(Hybrid Socket) VSIM_2V9

R204
10K
VMME_2V9
VIO_2V62 SIM_IO
SIM_CLK
SIM_RST

R206 R207 R208 R209 R210 R211 C226 C227 C228


C7
C3
C6
C2
C5
C1

100K 47K 47K 47K 47K 47K 0. 1u 22p 150p


C7
C3
C6
C2
C5
C1

1
MMC_D2 1
2
MMC_D3 2
3
MMC_CMD 3
4 16
R212 47 4 U202 GND1
5 15
MMC_CLK 5 GND2
TP3 6
6 GND3
14
MMC_D0 TP4 7
7 GND4
13
8 12
MMC_D1 8 GND5
11
GND6
9
MMC_DETECT SWB
10
TP1C229 C230
SWA

TP2 1743733- 2
DNI 1u
ENSY0017901

Copyright © 2008 LG Electronics. Inc. All right reserved. - 89 - LGE Internal Use Only
Only for training and service purposes
5. Trouble shooting

START

Check Micro SD card voltage


(VMME_2V9)

Resolder it
No (check data line
TF socket pins
are well soldered TP 1~4 is 2.9V
Signal)

Yes

Check proper Yes Replace Main Board


uSD?

Assemble

LGE Internal Use Only - 90 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting

5.11 Touch pad trouble


SIM Check Points
- Touch driver IC soldering`
- Touch FPCB Crack

TOUCH SCREEN DRIVER IC


VFM_2V9

C519 C520 R515


1u 0. 1u DNI
TSC2007IYZGR
U502 EUSY0337101
CN503 A1 C1
G1 G2 AUX SDA I2C_SDA
A2 C2
VDD_REF A1
1 10 A3 C3
X+ X-
2 9 B1 D1
Y- X+ TOUCH_INT PENIRQ- SCL I2C_SCL
3 8 B2 D2
A0 GND
4 7 B3 D3
X- Y+ Y+ Y-
5 6
X+
G3 G4
Y+
AXK7L10227G X-
ENBY0018601 Y-

VA509 VA510 VA511 VA512

EVLC14S02050 EVLC14S02050
EVLC14S02050 EVLC14S02050

Copyright © 2008 LG Electronics. Inc. All right reserved. - 91 - LGE Internal Use Only
Only for training and service purposes
5. Trouble shooting

START

PinA2 of Touch driver No Check the PMIC


IC(U502) is high(2.9v)? U300(PMB6821)
CN503 (touch connector)
Yes

No Check the
PinA3 of U502 is
high? U502(touch IC)
solderin g

Yes

No Check the Touch


FPCB is Crack?
window FPCB
connection
Yes

Replace Touch window with


Front Case

U502 (touch driver IC)

LGE Internal Use Only - 92 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting

5.12 RTC trouble

BACKUP BATTERY
2V 0.5mAh R500
TP1
RTC_2V11
SBCL0 00170 1| batt_n bl414r_f9j

RTC_2V11 RTC_2V11

R500 BAT500
TP1 4. 7K

BAT500
NBL414R- F9J

START

Check All of BAT500 solder

No Change BAT500
Check TP1 is
high (1.0V)?

Yes

Check RTC_2V11 No Change R500 or


is high?(2.0v) Change U300,
Change Main PCB

Yes

Assemble

Copyright © 2008 LG Electronics. Inc. All right reserved. - 93 - LGE Internal Use Only
Only for training and service purposes
5. Trouble shooting

5.13 Tri-axial, digital acceleration sensor trouble

THREE- AXIS ACCELEROMETER


VIO_2V62

TP1 U302
TP2
1
2
NC1 NC2
10
9
U302
VDD VDDIO
3 8
GND SDI CIF_SDA
4 7
NOT1
NOT2

ACCEL_INT INT SDO


5 6
CSB SCK CIF_SCL
22n
390

11
12

BMA150
C339
R317

EUSY0345201 C340
0. 1u

TP1 TP2

START

Check All of U302 solder

No Change U300 or
Check TP1 is
Change Main PCB
high (2.6V)?

Yes

Acceleration No
sensor operated Change R500
Check TP2 is
high?(2.6v)

Yes

Assemble

LGE Internal Use Only - 94 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting

5.14 Trouble shooting of Receiver part

Checking Flow

START

Setup Test Equipment


Cell Power : ñ74dBm
EGSM CH30
DCS CH699
Checking Points

Figure 1. Main PCB


Check point
DCXO

Check point
PLL Control

Check point
Mobile SW & FEM

Check point
RX I/Q Signal

Re-Download S/W & CAL

Copyright © 2008 LG Electronics. Inc. All right reserved. - 95 - LGE Internal Use Only
Only for training and service purposes
5. Trouble shooting

5.14.1 Checking DCXO Circuit

Checking Points Checking Flow

Is the waveform No Replace X600


of TP1(C638) similar to Fig.4?

X600

Yes

DCXO Circuit is OK.


See next page to check
TP1(C638) : 26MHz PLL Circuit.

Figure2. DCXO

Waveform
DCXO Circuit Diagram
U601
PMB6272
EUSY0274801 VCO_RC
18
VDDVCO2V8
17
EN RF_EN
16
VDDXO2V8
VDDDIG1V5

15
FSYS1 26MHZ_MCLK
14 C638 1000p
GND1
FSYS3
FSYS2

13
XOX
CLK

R607 C640
XO
DA

820 47n
10
11
12
6
7
8
9

X600
4
TSX- 3225 TP1
GND2
1 HOT1
HOT2 3 TP1 (C638)
GND1 2
26MHz

Figure
2 6 M BT
3. DCXO Cicuit

Figure 4. DCXO Waveform

LGE Internal Use Only - 96 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting

5.14.2 Checking PLL Control signals

Checking Points Checking Flow

TP1 (RF_EN) TP3 (RF_CLK)


No Check U601
EN Signal(TP1) is OK ?

Yes

TP2 (RF_DATA) No Check U601


DA(Data,TP2) is Normal ?

?
Yes
U601
No Check U601
CLK(Clock,TP3) is Normal ?

?
Figure 5. Transceiver Yes

Control Signal is OK.


See next page to check
Mobile SW & FEM.

RF Transceiver Circuit Diagram Waveform

C634 C635 C636 C637


32
31
30
29
28
27
26
25
24
23
22
21

0. 1u 0. 1u 0. 1u 0. 1u
RX1X

RX2X

RX3X

RX4X
FE1
VDDBIAS2V8

RX1

RX2
GND2

RX3

RX4
VDDLNA1V5

FE2
33
VBIAS
34
35
VDDTX1V5 U601 VDDRX2V8
20
RF_DATA(TP3)
TX1 PMB6272 VDDRX1V5
36 19
TX2 EUSY0274801 VCO_RC
37 18
VDDTX2V8 VDDVCO2V8
38 17
VDDMIX2V8 EN RF_EN
39 16
GND3 VDDXO2V8
VDDDIG2V8

VDDDIG1V5

40 15
FSYS1 26MHZ_MCLK
GND4 GND1
14 C638 1000p
RF_CLK(TP2)
FSYS3
FSYS2

41 13
XOX
CLK

R607 C640
XO
DA
BX
AX
A

VRF_2V85 820 47n


10
11
12
1
2
3
4
5
6
7
8
9

X600
4
TSX- 3225 RF_EN(TP1)
GND2 HOT2 3
1 HOT1 GND1 2
26MHz
C642
0. 1u

26M_BT
RF_CLK

RF_DA

QX
Q
IX
I

Figure 6. Transceiver Circuit Figure 7. PLL Control Waveform

Copyright © 2008 LG Electronics. Inc. All right reserved. - 97 - LGE Internal Use Only
Only for training and service purposes
5. Trouble shooting

5.14.3 Checking Mobile SW & FEM

Mobile SW & FEM Circuit Diagram


RF
VRF_2V85 TP4
C600 R609
TP3 VC1
PIN 14
VC2
PIN 13
GND600 GND601
DNI GSM850_EGSM TX L H
0 C602 C603
R610 C601 DCS_PCS TX H H
1u 39p
0 DNI FE1
FE2 GSM850_EGSM RX L L

TP1 TP2 C604 C605 DCS_PCS RX H L

14
13

12

11
16
18
19
20
47p 47p

9
VDD

GND1
GND2
GND3
GND4
GND5
GND6
VC1
VC2
FL600 U600
ANT

SW600 C606
DGM1110M014 27
GND25
R611 L603

GSM1800_1900_TX
17 SFAY0011101 GND24
G2 28

GSM850_900_TX
ANT RF GND23
ENWY000 6301

G1 29
2. 2nH
GSM1800_RX1
GSM1800_RX2
GSM1900_RX1
GSM1900_RX2
GRS302- 2S- H22- E3000

GND22
GSM850_RX1
GSM850_RX2
GSM900_RX1
GSM900_RX2

0 180p 30
GND21
L601 31
GND20
32
12nH GND19
C609 33
GND18
34
GND17
DNI 35
GND16
36
10
15
1
2
3
4
5
6
7
8

L604
GSM_OUT
1nH 9
GND5
C611 C612 10
GND4
11
DNI DNI RSVD2
12
GND3
13
GND2
14
GND1
C614 15

Figure 8. Mobile SW & FEM Circuit

Checking Points
TP1

TP4_C605 (FE2)
TP5 ~ 8

TP3_C604 (FE1)
FL600

TP2

Figure 9. Mobile SW & FEM

EGSM/GSM850 DCS/PCS

FE1 OFF ON

FE2 OFF OFF

Table 2. FEM RX Control Logic

LGE Internal Use Only - 98 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting

Checking Flow

Check TP1 of SW600


with RF Cable and TP2 of C606

No
TP1 Signal same Repl ace Mobil e SW
as TP2? (SW600)

Yes

Check TP3, TP4 of FL600


Yes

No Replace BB CHIP (U100)


Control Signal is
OK

Yes

TP5 Sig nal is No


Replace FEM (FL600)
OK ?

Yes

Mobil e SW & FEM is OK.


Check Antenna.

EGSM TX

TP2(ANT SW2)

TP1(ANT SW1)

Figure 30 Mobile SW Figure 31 FEM Control Signals

Copyright © 2008 LG Electronics. Inc. All right reserved. - 99 - LGE Internal Use Only
Only for training and service purposes
5. Trouble shooting

5.14.4 Checking RX I/Q Signals

Checking Flow
C634
32
31
30
29
28
27
26
25
24
23
22
21

0. 1u
Check RX I/Q signals(TP1~TP4)
RX1X

RX2X

RX3X

RX4X
FE1
VDDBIAS2V8

RX1

RX2
GND2

RX3

RX4
VDDLNA1V5

FE2
33
VBIAS
34
VDDTX1V5 U601 VDDRX2V8
35 20
TX1 PMB6272 VDDRX1V5
36 19
TX2 EUSY0274801 VCO_RC
37 18
VDDTX2V8 VDDVCO2V8
38 17
VDDMIX2V8 EN
39
GND3 VDDXO2V8
16
Signals are No Replace
VDDDIG2V8

VDDDIG1V5

40 15
FSYS1
GND4 GND1
14
Normal? Transceiver
FSYS3
FSYS2

41 13
XOX
CLK

R607 C64 PMB6272(U601)


XO
DA
BX
AX
A

VRF_2V85 820 47
10
11
12
1
2
3
4
5
6
7
8
9

Yes
X600 TSX- 3225
4
GND2 HOT2 3
1 HOT1 GND1 2
RX Part is OK.
C642 TP4(QX) 26MHz
0. 1u TP1(I) Check Base Band Circuit
TP3(Q) or
Re-Download S/W and Cal
TP2(IX) 26M_BT
RF_CLK

RF_DA

QX
Q
IX
I

Figure 12. RX I/Q Circuit

Checking Points

Q
TP4
TP3
TP2
TP1

RX
I
Figure 13. RX I/Q
Q

Figure 14. RX I/Q Waveform

LGE Internal Use Only - 100 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting

5.15 Trouble Shooting of Transmitter Part


Checking Flow

Checking Points

Figure 15. Main PCB

Figure 16. Main PCB

5.15.1. Checking VCTCXO Circuit


See RX Part “1. Checking DCXO Circuit”

5.15.2. Checking PLL Control Signal


See RX Part “2. Checking PLL Control Signal”

Copyright © 2008 LG Electronics. Inc. All right reserved. - 101 - LGE Internal Use Only
Only for training and service purposes
5. Trouble shooting

5.15.3. Checking TX I/Q Signals

Checking Flow
C634
32
31
30
29
28
27
26
25
24
23
22
21

0. 1u
RX1X

RX2X

RX3X

RX4X
FE1
VDDBIAS2V8

RX1

RX2
GND2

RX3

RX4
VDDLNA1V5

FE2
Check TX I/Q Signals(TP1~TP4)
33
VBIAS
34
VDDTX1V5 U601 VDDRX2V8
35 20
TX1 PMB6272 VDDRX1V5
36 19
TX2 EUSY0274801 VCO_RC
37 18
VDDTX2V8 VDDVCO2V8
38 17
39
VDDMIX2V8 EN
16 No Replace
GND3 VDDXO2V8 Signals are
VDDDIG2V8

VDDDIG1V5

40
FSYS1
15 Transceiver
GND4 GND1
14 Normal ?
PMB6272(U401)
FSYS3
FSYS2

41 13
XOX
CLK

R607 C64
XO
DA
BX
AX
A

VRF_2V85 820 47
10
11
12
1
2
3
4
5
6
7
8
9

Yes
X600 TSX- 3225
4
HOT2 3
GND2
1 HOT1 GND1 2
TX Part is OK.
26MHz Check Base Band Circuit
C642 TP4(QX)
0. 1u TP1(I) or
TP3(Q) Re-Download S/W and Cal

TP2(IX) 26M_BT
RF_CLK

RF_DA

QX
Q
IX
I

Figure 17. TX I/Q

Checking Points
Checking Points

Q
TP4
TP3
TP2
TP1

TX
I

Figure 18. TX I/Q Q

Figure 19. TX I/Q Waveform

LGE Internal Use Only - 102 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
G
5. Trouble shooting

VRF_1V5 VRF_2V85 VRF_2V85


5.15.4 Checking Transceiver Output Signals

C634

32
31
30
29
28
27
26
25
24
23
22
21
0. 1u
TP1(LBNAD_PAM_IN)

RX1X

RX2X

RX3X

RX4X
FE1
VDDBIAS2V8

RX1

RX2
GND2

RX3

RX4
VDDLNA1V5
FE2
33
VBIAS
34
VDDTX1V5 U601 VDDRX2V8
35 20
LBAND_PAM_IN TX1 PMB6272 VDDRX1V5
36 19
HBAND_PAM_IN TX2 EUSY0274801 VCO_RC
37 18
VDDTX2V8 VDDVCO2V8
38 17
VDDMIX2V8 EN
C639 R606 39 16
TP2(HBNAD_PAM_IN) GND3 VDDXO2V8

VDDDIG2V8

VDDDIG1V5
220n 10 40 15
FSYS1
14
GND4 GND1

FSYS3
FSYS2
41 13

XOX
CLK
R607 C640

XO
DA
BX
AX
VRF_1V5
A

B
VRF_2V85 820 47n

10
11
12
1
2
3
4
5
6
7
8
9
R608 X600 TSX- 3225
4
GND2 HOT2 3
10 1 HOT1 GND1 2
26MHz
C641 C642
220n 0. 1u

Figure 20. Transceiver Output Circuit

Checking Points

TP1(LBNAD_PAM_IN)

TP2(HBNAD_PAM_IN)

Figure 21. Transceiver Output

MODE Transceiver Output

GSMK Fixed

8PSK Ramp Burst Control

Table 3. Transceiver Output Operation

Copyright © 2008 LG Electronics. Inc. All right reserved. - 103 - LGE Internal Use Only
Only for training and service purposes
5. Trouble shooting

Checking Flow

Chec k Output Signal


(TP1, TP2)

No Replace
Signals are PMB6272(U601)
Norm al ?

Yes

Transce iver is OK.


See next page to check
PAM Con tr ol Circ ui t.

LBAND_PAM_IN (MODE: GMSK) : TP1 LBAND_PAM_IN (MODE: 8PSK) : TP1

Figure 22. Transceiver Output (GMSK) Figure 23. Transceiver Output (8PSK)

LGE Internal Use Only - 104 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting

5.15.5 Checking PAM Control Signals

R602 47
C610 100p TXON_PA
8 TP2(TXON PA)
SM_IN R603 47 LBAND_PAM_IN
7
VRAMP PA_LEVEL
6
VBATT
5
RSVD1 R604 47
4
BS C613 100p PA_BAND
3
PCS_IN HBAND_PAM_IN
2
MODE PA_MODE
1 R605 47
C622 C623 C624 C625 C626
TP3(PA_MODE) 39p DNI DNI DNI DNI TP1(PA LEVEL)

Figure 24. PAM Control Signals

Checking Points

TP3(PA MODE) TP2(TXON PA)

TP1(PA LEVEL )

Figure 25. Transceiver Output

Table 4. PAM Mode Operation


MODE MODE PA_LEVEL TXON_PA
MODE MODE PA_LEVEL TXON_PA

GMSK LOW Ramp Burst Control HIGH

8PSK HIGH Control Amp bias HIGH

Copyright © 2008 LG Electronics. Inc. All right reserved. - 105 - LGE Internal Use Only
Only for training and service purposes
5. Trouble shooting

Checking Flow

Check Cont rol Signals


(TP1, TP2, TP3)

No Check
Signal s are PMB8877(U100)
Normal ?

Yes

PAM Control Signal is


OK.
See next page to chec k
FEM & Mobile SW Circuit.

Figure 26. GSMK Control Signal Figure 27. 8PSK Control Signal

TP2(TXON PA)
TP1(PA LEVEL)
TP1(PA LEVEL)
TP2(TXON PA)
TP3(PA MODE)
TP3(PA MODE)

TP3(PA MODE) : R605


TP1(PA_LEVEL) : R403
TP3(PA MODE) : R605
TP2(TXON_PA) : R602
TP1(PA LEVEL)
TP1(PA_LEVEL) : R403
TP2(TXON_PA) : R602
TP2(TXON PA)
TP3(PA MODE)

LGE Internal Use Only - 106 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
5. Trouble shooting

5.15.6 Checking FEM & Mobile SW

Mobile SW & FEM Circuit Diagram

RF
VRF_2V85

C600 R609
TP3 VC1 VC2
PIN 14 PIN 13
GND600 GND601
DNI
0
C601
TP5 C602 C603
GSM850_EGSM TX L H

R610 1u 39p DCS_PCS TX H H


0 DNI FE1
FE2 GSM850_EGSM RX L L
TP2 C604 C605 DCS_PCS RX H L

14
13

12
TP4

11
16
18
19
20
47p 47p

9
TP1

VDD

GND1
GND2
GND3
GND4
GND5
GND6
VC1
VC2
ANT FL600 U600
SW600 C606
DGM1110M014 27
GND25
R611 L603

GSM1800_1900_TX
17 SFAY0011101 GND24
G2 28

GSM850_900_TX
ANT RF GND23
ENWY000 6301

G1 29
2. 2nH

GSM1800_RX1
GSM1800_RX2
GSM1900_RX1
GSM1900_RX2
GRS302- 2S- H22- E3000

GND22
GSM850_RX1
GSM850_RX2
GSM900_RX1
GSM900_RX2
0 180p 30
GND21
L601 31
GND20
32
12nH GND19
C609 33
GND18
34
GND17
DNI 35
GND16
10 36
15
1
2
3
4
5
6
7
8

L604
GSM_OUT
1nH 9
GND5
C611 C612 10
GND4
11
DNI DNI RSVD2
12
GND3
13
GND2
14
GND1
C614 15

Figure 28. Mobile SW & FEM Circuit

Checking Points

TP4_R605 (FE2)

SW600
TP3_R604 (FE1)
FL600

TP1
TP5

TP2
Figure 29 Mobile SW & FEM

EGSM/GSM850 DCS/PCS

FE1 OFF ON

FE2 ON ON

Table 5. FEM TX Control Logic

Copyright © 2008 LG Electronics. Inc. All right reserved. - 107 - LGE Internal Use Only
Only for training and service purposes
5. Trouble shooting

Checking Flow

Check TP1 of SW600


with RF Cable and TP2 of C606

No
TP1 Signal same Repl ace Mobil e SW
as TP2? (SW600)

Yes

Check TP3, TP4 of FL600


Yes

No Replace BB CHIP (U100)


Control Signal is
OK

Yes

TP5 Sig nal is No


Replace FEM (FL600)
OK ?

Yes

Mobil e SW & FEM is OK.


Check Antenna.

EGSM TX

TP2(ANT SW2)

TP1(ANT SW1)

Figure 30 Mobile SW Figure 31 FEM Control Signals

LGE Internal Use Only - 108 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. DOWNLOAD & S/W UPGRADE

6. DOWNLOAD & S/W UPGRADE

KP500

KP500

KP500

Copyright © 2008 LG Electronics. Inc. All right reserved. - 109 - LGE Internal Use Only
Only for training and service purposes
6. DOWNLOAD & S/W UPGRADE

KP500

KP500

KP500

LGE Internal Use Only - 110 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. DOWNLOAD & S/W UPGRADE

Copyright © 2008 LG Electronics. Inc. All right reserved. - 111 - LGE Internal Use Only
Only for training and service purposes
6. DOWNLOAD & S/W UPGRADE

LGE Internal Use Only - 112 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. DOWNLOAD & S/W UPGRADE

Copyright © 2008 LG Electronics. Inc. All right reserved. - 113 - LGE Internal Use Only
Only for training and service purposes
6. DOWNLOAD & S/W UPGRADE

LGE Internal Use Only - 114 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. DOWNLOAD & S/W UPGRADE

Copyright © 2008 LG Electronics. Inc. All right reserved. - 115 - LGE Internal Use Only
Only for training and service purposes
6. DOWNLOAD & S/W UPGRADE

KP500

KP500
KP500

KP500

KP500

KP500

KP500

LGE Internal Use Only - 116 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. DOWNLOAD & S/W UPGRADE

KP500

KP500

KP500 KP500

Copyright © 2008 LG Electronics. Inc. All right reserved. - 117 - LGE Internal Use Only
Only for training and service purposes
6. DOWNLOAD & S/W UPGRADE

KP500 KP500

LGE Internal Use Only - 118 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
6. DOWNLOAD & S/W UPGRADE

KP500 KP500

Copyright © 2008 LG Electronics. Inc. All right reserved. - 119 - LGE Internal Use Only
Only for training and service purposes
LGE Internal Use Only - 120 - Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
7. CIRCUIT DIAGRAM

VMME_2V9 RTC_2V11 VAUDB_2V5

CORE_1V35 SD_1V8 SD_1V8 VIO_2V62 VSIM_2V9 VPLL_1V35 VAUDA_2V5

BASE BAND PROCESSOR

TRACEPKT0
TRACEPKT1
TRACEPKT2
TRACEPKT3
TRACEPKT4
TRACEPKT5
TRACEPKT6
TRACEPKT7
VREFN
0.01u

0.01u
0.1u

0.1u

0.1u

C122 0.1u
ON BOARD ARM9 JTAG & ETM INTERFACE

C107 0.1u
C108 0.1u

C109 0.1u

C115 0.1u

C117 0.1u

C118 0.1u

C119 0.1u

C121 0.1u
C110 0.1u
C111 0.1u

C112 0.1u
C113 0.1u
C114 0.1u
1u

1u

C106 1u

C120 1u

C123 1u
1
C100

C101

C102

C103

C104

C105

C116

R100
SD_1V8

CORNER_AA1 AA19

AA10

AA13
AA14

AA12
AA11
W10

W13

W15

W19
M11
M10
CORNER_A2 AA1

AA3
AA6

C17

U13

U14

U17

AA8

AA9
N11

N10

N16

N18
N17
B10

R17
CORNER_A1 A19

A16

A13
K12
K11
K10

K19

P15

P16

Y10

Y15
Y11
Y12
F17

T12

T16
T14

T13

T17
L12
L11
L10

L15
J11
J10

J17

J15
W1
VIO_2V62

M9
M8

H2

H1
N9

U1

B2
A1

P1

A5

A7
K9
K8

Y1

V2
L9
L8

L2
J9
CN100
G1 G2

VDDP_DIGE

VDD_FUSE_FS

VDDA_BG

VDDA_VBT
VSSA_VBT
VDDP_DIGA

VDDP_SIM

VDDA_M
VSSA_M
NC

VDDP_MMC

VDD_RTC

VDD_PLL
VSS_PLL

VSSA_D

VREFN
AGND
VSSA_BG
VDDA_BB
CORNER_AA2

VDD_MAIN1
VDD_MAIN2
VDD_MAIN3
VDD_MAIN4
VDD_MAIN5
VDD_MAIN6
VDD_MAIN7
VDD_MAIN8
VDD_MAIN9

VDDP_MEM_ETM1
VDDP_MEM_ETM2
VDDP_MEM_ETM3
VDDP_MEM_ETM4
VDDP_MEM_ETM5

VDDP_DIGC1
VDDP_DIGC2
VDDP_DIGD
VSSP_DIG2
VSSP_DIG1
VSSP_DIG3

VSSP_DIG4

VSS_RTC

VDDA_D

GUARD

VSSA_VBR1

VSSA_VBR2
VDDP_DIGB

VSSA_BB
VDD_MAIN10

VSS_MAIN1
VSS_MAIN2
VSS_MAIN3
VSS_MAIN4
VSS_MAIN5
VSS_MAIN6
VSS_MAIN7
VSS_MAIN8
VSS_MAIN9

VSSP_MEM_ETM1
VSSP_MEM_ETM2
VSSP_MEM_ETM3
VSSP_MEM_ETM4

VDDA_VBR1

VDDA_VBR2

TRACEPKT0
TRACEPKT1
TRACEPKT2
TRACEPKT3
TRACEPKT4
TRACEPKT5
TRACEPKT6
TRACEPKT7
VBAT VBAT 1 30
U8 ADD( 0)
ADD( 0: 26) 2 29
MEM_A0 TRACECLK
W4 ADD( 1) 3 28
MEM_A1 TRACEPKT7
T8 ADD( 2) 4 27
MEM_A2 TRSTn TRACEPKT6
R101 U6 ADD( 3) 5 26
MEM_A3 TDI TRACEPKT5
W18 W5 ADD( 4) 6 25
390K BAT_ID M_0 MEM_A4 TMS TRACEPKT4
V17 AA4 ADD( 5) 7 24
RF_TEMP M_1 MEM_A5 TCK TRACEPKT3
Y19 T7 ADD( 6) 8 23
* M2 : PCB Versio n Y18
M_2 MEM_A6
U7 ADD( 7)
RTCK
9 22
TRACEPKT2
M_3 MEM_A7 TDO TRACEPKT1
W17 Y5 ADD( 8) 10 21
M_4 MEM_A8 EXTRSTn TRACEPKT0
R102 AA18 AA5 ADD( 9) 11 20
M_5 MEM_A9 TRIG_IN PIPESTAT2
R103 Y17 W6 ADD( 10) 12 19
M_6 MEM_A10 PIPESTAT1
390K W16 T9 ADD( 11) 13 18
100K M_7 MEM_A11 PIPESTAT0
AA17 W7 ADD( 12) 14 17
M_8 MEM_A12 TRACESYNC
Y16 Y6 ADD( 13) 15 16
LOAD M_9 MEM_A13
R104 U15 U9 ADD( 14)
M_10 MEM_A14
W9 ADD( 15) G3 G4
100K MEM_A15
K16 V1 ADD( 16) AXT430124
PA_LEVEL PAOUT11 MEM_A16
M12 N5 ADD( 17)
N15
PAOUT12 MEM_A17
U2 ADD( 18)
ENBY0029001
I BB_I MEM_A18
M15 W2 ADD( 19)
IX BB_IX MEM_A19
M16 R5 ADD( 20)
Q BB_Q MEM_A20
K15 T1 ADD( 21)
QX BB_QX MEM_A21
R4 ADD( 22)
MEM_A22
E13 T2 ADD( 23)
TXON_PA T_OUT0 MEM_A23
B14 P5 ADD( 24)
FE2 T_OUT1 MEM_A24
F11 T3 ADD( 25)
PA_BAND T_OUT2 MEM_A25
A15 T4 ADD( 26)
FE1 T_OUT3 MEM_A26
E11
BT WAKEUP
_
F12
T_OUT4
M2 DATA( 0) DATA( 0: 15)
LIN_PWM_MAG T_OUT5 MEM_AD0 DATA( 1)
B13 L3
PA_MODE T_OUT6 MEM_AD1 DATA( 2)
C1 1 J3
LIN_PWM_FRQ T_OUT7 MEM_AD2 DATA( 3)
E12 L5
DSR T_OUT8 MEM_AD3 DATA( 4)
C1 2 M3
LCD_BACKLIGHT_EN T_OUT9 MEM_AD4 DATA( 5)
B12 N1
JACK_DETECT T_OUT10 MEM_AD5 DATA( 6)
B15 P2
BT_LDO_EN T_IN0 MEM_AD6 DATA( 7)
C1 3 N2
CHG_EN T_IN1 MEM_AD7 DATA( 8)
J4
VBUS_OVP MEM_AD8 DATA( 9)
K4
MEM_AD9 DATA( 10)
U100 MEM_AD10
MEM_AD11
K5
L4
R1
DATA( 11)
DATA( 12)
R105
9. 1K
PMB8877 MEM_AD12
MEM_AD13
MEM_AD14
M5
M4
DATA( 13)
DATA( 14)
RF_EN
D17
D18
RF_STR0
RF_STR1
EUSY0322801 MEM_AD15
P4 DATA( 15)

E15 R2
RF_DA RF_DATA MEM_CS0_N _NAND_CS
R106 B17 P3
RF_CLK RF_CLK MEM_CS1_N _RAM_CS
N3 TP100
10K MEM_CS2_N
C1 8 N4
AFC MEM_CS3_N
W12 U3
RPWRON CLKOUT0 MEM_CSA0_N ADD( 27)
U12 U4
26MHZ_MCLK F26M MEM_CSA1_N ADD( 28)
H15 T6
SWIF_TXRX MEM_CSA2_N ADD( 29)
T5
MEM_CSA3_N BA0
H16
SIM_IO CC_IO
K18 T11
SD_1V8 SIM_CLK CC_CLK FCDP_RBN FCDP
K17
SIM_RST CC_RST
K2
MEM_WAITN
E10 M1
MMC_CMD MMCI1_CMD MEM_ADVN BA1
A12 L1
* PCB Versio n MMC_CLK
B11
MMCI1_CLK MEM_RDN
R3
_RD
MMC_D0 MMCI1_DAT0 MEM_WRN _WR
R118 R119 C9
D2 D3 Versio n MMC_D1
F10
MMCI1_DAT1
W3
100K DNI MMC_D2 MMCI1_DAT2 MEM_BFCLKO1
A14 Y3
H H V 1. 1 MMC_D3
D3
MMCI1_DAT3 MEM_BFCLKO2
Y2
SDCLKI
MMCI2_CMD MEM_SDCLKO SDCLKO
D2 AA2
H L V 1. 0 F6
MMCI2_DAT0 MEM_BC0_N
V3
_BC0
VIB_EN MMCI2_CLK MEM_BC1_N _BC1
R120 R121 W11 U5
L H Rev. B _WP FWP MEM_BC2_N
Y4
LDQS
DNI 10K TP101 MEM_BC3_N UDQS
F2
L L V 1. 2 USB_OEn
G2
IRDA_TX
Y7
VIO_2V62 IRDA_RX MEM_RAS_N _RAS
W8
MEM_CAS_N _CAS
A18 U10
TDO TDO MEM_CKE CKE
B18
TDI TDI
C1 5 AA16 32. 768KHz
TMS TMS F32K
C1 6 AA15 2 1
TCK TCK OSC32K
R107 R108 F13 W14
TRSTn TRST_N RESET_N _RESET
* Bo o t Mo d e RTCK
F16
RTCK RSTOUT_N
H1 8 C1 2 5
X100
C1 3 2
1K 1K Y14
RTC_OUT RTC_OUT 15p 15p
TRIG_IN E14 R16 C124 220n
TRIG_IN TRIG_IN VREFP VREFN
Larg e Blo c k P/ U 1K B16 R15
MON1 IREF
C1 0
MON2 R111
Small Blo c k P/ D 10K TRACESYNC
AA7
TRACESYNC SPCU_RQ_IN0
J18
R109 R110 U11 J19
TRACECLK TRACECLK SPCU_RQ_IN1 22K
Y9 H1 7
DNI 10K PIPESTAT2 PIPESTAT2 SPCU_RC_OUT0
T10 G18

USIF1_RXD_MRST

USIF2_RXD_MRST

USIF3_RXD_MRST
USIF1_TXD_MTSR

USIF2_TXD_MTSR

USIF3_TXD_MTSR
PIPESTAT1 PIPESTAT1 SPCU_RQ_IN2
Y8
PIPESTAT0 PIPESTAT0

USIF1_CTS_N

USIF2_CTS_N
USIF1_RTS_N

USIF2_RTS_N

USIF3_SCLK
DIF_RESET1
DIF_RESET2

CIF_HSYNC
CIF_VSYNC

CIF_RESET

I2S1_CLK0
I2S1_CLK1

I2S2_CLK0
I2S2_CLK1

I2C1_SDA

I2C2_SDA
CIF_PCLK

I2S1_WA0

I2S2_WA0
I2S2_WA1

DSPOUT1
I2C1_SCL

I2C2_SCL
CLKOUT2

KP_OUT0
KP_OUT1
KP_OUT2
KP_OUT3

TRACE32(14 Pin)
AUXGND
DIF_CS1
DIF_CS2

I2S1_RX

I2S2_RX
I2S1_TX

I2S2_TX
DIF_WR

EPREF1
EPREF2
EPPA11
EPPA12

EPPA21
EPPA22
DIF_CD

DIF_HD

PM_INT

DSPIN0
DSPIN1
DIF_RD

CIF_PD
DIF_VD
DIF_D0
DIF_D1
DIF_D2
DIF_D3
DIF_D4
DIF_D5
DIF_D6
DIF_D7
DIF_D8

CIF_D0
CIF_D1
CIF_D2
CIF_D3
CIF_D4
CIF_D5
CIF_D6
CIF_D7

KP_IN0
KP_IN1
KP_IN2
KP_IN3
KP_IN4
KP_IN5
KP_IN6

AUXN1

AUXN2
AUXP1

AUXP2

VMICN
EPN11
EPN12

VMICP
MICN1

MICN2
EPP11
EPP12

MICP1

MICP2
F7

B5

B3
B4

B1

D1
F8

F9
A11

B8
B9

B7

B6

A10

F1

R18
R19
T18
T19
U18
U19

M18
M17
L17
M19
L19
L18
L16
T15
U16

E16

E18
E17

G19
G15

E19

G17

A17
Y13

F5
F3

F4
H19
J16
G16
C6

E7
A3
A2

C2
C1
E5
C5
C3

C4

C7

A9
C8

A8
E8

E9
A4

A6

G1
J5
H3
H5
J2
J1
K3
G4
G3

G5

P17
P18

V18
V19
N19
P19

D19

F18

F19

C14

C19
F15

E1

F14
E3
E2
E4

H4
K1
E6
B19

VCHG VBUS_USB
UART1
HOLE VSUPPLY J- TAG

TP103

TP104
TP102

C1 2 6 3G 2.5G
1
0. 1u GND GND
2 TP_RX
RX RX UART_RX
3 TP_TX
TX TX UART_TX
4
VCHAR NC1
5 TP_RPON
ON_SW ON_SW RPWRON_EN
6 TP_VSUPPLY
BB_SND_R

_PPR

UART_TX
DIF_MAIN_CS
IF_MODE

CIF_PCLK