Thermal Design
Considerations A COMPLETE
Often electrical or electronic engineers
would design an electrically efficient
layout, often without allowing an increase
in cabinet size, larger fan, or enough
power for a larger fan. This brought the
realization that liquid cooling offers a
better, and often the only feasible,
solution. The compactness of the cold
plates and the supply and return lines,
lower power consumption, and reduction
in noise levels are some of the attractive
features.
Currently the cold plates are used
extensively to provide cooling platforms
for electronic devices.
SMART, SIMPLE & PERFECT
Thermovac Aerospace Pvt. Ltd.
Plot No. 548, Sompura 2nd stage,
Beeragondanahalli, Thyamagondlu,
Nelamangala, Bangalore- 562111
Contact No.: 9986383353
THERMAL SOLUTIONS
http://www.thermovacaerospace.com
PROVIDER
Phone: 9986383353
THERMAL SOLUTIONS
Electronic devices are at the heart
of almost all major industrial
equipment. The high-power, high-
heat-flux demands on the cooling
system cannot be met with air
cooling, and advanced liquid
cooling solutions are necessary.
We look forward to providing
complete Thermal Solution!
A CUSTOM BUILD
LIQUID COLD PLATES
Thermovac Aerospace Pvt. Ltd.
#3,B-05, IIIrd Block,
M S Industrial Complex,
14th Cross, Peenya Industrial Area,
Bangalore - 560 058
Contact No.: 9986383353
http://www.thermovacaerospace.com/

Liquid Cold Plates
WHY?
Results show that using smaller channel
sizes yields better thermal performance.
Such optimization is necessary along with
a pressure drop and overall system level
analysis in deciding the channel
configuration.
Liquid metal cooling , double side cooling
of high-power IGBTs , and fin inserts and
other techniques in cooling hockey-puck
type semiconductor devices , a majority of
high-power devices utilize liquid cooled
cold plates.
CONSIDERATIONS
The IGBT and the silicon-controlled
rectifier (SCR) are both minority carrier
devices whose ultimate high-temperature
limit of operation is governed by intrinsic
carrier generation. which should be kept
cooler because of the large switching
pulses that are used in triggering.
For power applications, generally the
cooler a device can be maintained during
operation the better it will perform.
APPLICATIONS OF POWER DRIVES
Insulated-gate bipolar transistor (IGBT)
controllers,
Radio-frequency (RF) generators,
Magnetic resonance imaging (MRI)
machines,
Traction devices for locomotives,
Battery chargers,
UPS (uninterrupted power systems),
S o m e I G B T M o d ul e s S u i t s o u r c o l d pl a te s
DC-AC converters,
AC-DC inverters, and VACUUM BRAZING / JOINING
Army tanks (using transmission fluid
already at a high temperature).
TECHNIQUE
Vacuum brazing is done for joining for
the two base material where the liquid
DESIGN APPROACH flow takes place and as brazing in vacuum
brazing requires tight tolerances of
As the heat flux and power increase, it
becomes necessary to improve the temperatures, vacuum levels and post
thermal performance of the channels. In brazing procedures which gives an
this design, channels are machine-cut superior results . The Vacuum brazing is
into the base plate and a cover is soldered considered as strongest metal joining
in place to form the flow passages. technique.
Depending on the thermal performance
desired, these channels can be several Thermovac Aerosapace Pvt.
millimeters wide or as small as 200μm Ltd. Which is having an
wide microchannels for extremely high
preparatory process for
heat flux applications (over 100 W/cm2).
metal joining technique &
Cross-rib patterns, or other enhancement
features may be incorporated in the which gives an superior
channels, depending on the performance results for Thermal
requirements. Solutions for the electronics
INSPECTIONS
All cold plates are tested as per below
Pressure Test
Leak Test
Pressure Drop Test
Dimensions
For mechanical & metallurgical properties
which suits requirement