B0193ab V

B0193AB
REV V
I/A Series A2™ System

Site Planning
March 28, 2003
Fan Assembly (vented enclosures)
2xMMS
Mounting
Structure
50 Series Model
51D Processor
50 Series Model
51E Processor
Filter DIN Rail

Assembly
(vented
enclosures)
10BaseT
A-, B-, and
(Twisted-Pair)
D-Size Modules
50 Series Model 51B/51B1/51C
DNBT
Processors (2 shown)
Invensys, Architecture By ArchestrA, Foxboro, FOXNET, I/A Series, I/A Series A2, INTERSPEC,
SPECTRUM, and TankExpert are trademarks of Invensys plc, its subsidiaries, and affiliates.
All other brand names may be trademarks of their respective owners.
Copyright 1990-2003 Invensys Systems, Inc.

All rights reserved
Contents
Figures.................................................................................................................................... xi
Tables.................................................................................................................................... xv
Preface................................................................................................................................. xvii
Who This Book is For ........................................................................................................... xvii
What You Should Know ....................................................................................................... xvii
How to Use This Book ........................................................................................................ xviii
Revision Information ........................................................................................................... xviii
Reference Documents .......................................................................................................... xviii
1. Environmental Considerations .......................................................................................... 1

Operating Environments ........................................................................................................... 1
Operating Environmental Specifications ................................................................................... 1
Heat Dissipation ....................................................................................................................... 2
2. Enclosures – General ......................................................................................................... 3

General Clearance Requirements ............................................................................................... 3
Enclosure Rear Access .......................................................................................................... 4
Exterior Heat Exchangers ..................................................................................................... 4
Auxiliary Cooling Assemblies ............................................................................................... 4
Customer-Supplied Equipment Racks .................................................................................. 5
Physical Characteristics ............................................................................................................. 5
Mass ..................................................................................................................................... 5
Height .................................................................................................................................. 5
Heat Dissipation ....................................................................................................................... 6
Calculating the Actual Heat Dissipated ................................................................................ 6
Thermal Loading on Enclosures ........................................................................................... 6
Power Cables ............................................................................................................................. 6
Floor Cutouts and Top Entry Panels ......................................................................................... 6
3. Field Enclosure 4 (FE4) ..................................................................................................... 9

FE4 Mounting .......................................................................................................................... 9
FE4 Pipe Mounting ............................................................................................................. 9
FE4 Wall Mounting ............................................................................................................. 9
FE4 Conduit Plate ............................................................................................................. 10
FE4 Field Input/Output Wiring ............................................................................................. 11
iii
B0193AB – Rev V Contents
FE4 Specifications ................................................................................................................... 11

FE4 Field Enclosure Heaters ................................................................................................... 11
FE4 Power Distribution .......................................................................................................... 12
4. Field Enclosure 8 (FE8) ................................................................................................... 13

FE8 Structural Foam Enclosure Mounting .............................................................................. 13
FE8 Floor Mounting .......................................................................................................... 13
FE8 Wall Mounting ........................................................................................................... 15
FE8 Structural Foam Cable Entry ...................................................................................... 16
Metal Field Enclosure 8 .......................................................................................................... 17
Metal FE8 Wall Mounting ................................................................................................. 18
Metal FE8 Cable Entry ...................................................................................................... 18
FE8 Specifications ................................................................................................................... 19
FE8 Heaters ............................................................................................................................ 20
FE8 Power Distribution .......................................................................................................... 20
5. Industrial Enclosure 16 (IE16) ........................................................................................ 21

IE16 Mounting ....................................................................................................................... 21
IE16 Floor Cutouts ............................................................................................................ 22
IE16 Top Entry Panels ....................................................................................................... 23
IE16 Specifications .................................................................................................................. 24
Calculating Heat Dissipation .............................................................................................. 24
IE16 Power Distribution ......................................................................................................... 25
6. Industrial Enclosure 32 (IE32) ........................................................................................ 27

IE32 Mounting ....................................................................................................................... 27
IE32 Single Enclosure ........................................................................................................ 28
Floor Mounting ............................................................................................................. 28
Floor Cutout ................................................................................................................. 29
IE32 Two Bridged Enclosures ............................................................................................ 29
Floor Mounting ............................................................................................................. 29
Floor Cutouts ................................................................................................................ 30
IE32 Three Bridged Enclosure ........................................................................................... 30
Floor Mounting ............................................................................................................. 30
Floor Cutout ................................................................................................................. 31
IE32 Top Entry Panels ............................................................................................................ 32
IE32 Specifications .................................................................................................................. 33
IE32 Power Distribution ......................................................................................................... 34
7. NEMA 4/4X Hardened Enclosure................................................................................... 35

NEMA 4/4X Hardened Enclosure Mounting ......................................................................... 35
Hardened Enclosure Specifications .......................................................................................... 37
iv
Contents B0193AB – Rev V
Hardened Enclosure Power Distribution ................................................................................. 37

Hardened Enclosure Air Cooling Systems Power Requirements ......................................... 37
Power Requirements ...................................................................................................... 37
8. Metal Industrial Enclosures IEMFA, IEMFR, and Metal Termination Enclosure ........... 39
Metal Industrial Enclosures, Mounting ................................................................................... 39
Floor Cutouts ..................................................................................................................... 40
Top Entry Panels ................................................................................................................ 42
Metal Industrial Enclosures Specifications ............................................................................... 43
Power Distribution ................................................................................................................. 44
9. Modular Industrial Workstation (MIW) ......................................................................... 45

MIW Mounting ...................................................................................................................... 45
Small Workstation .............................................................................................................. 46
Large Workstations ............................................................................................................ 47
MIW Floor Cutouts ................................................................................................................ 47
MIW Specifications ................................................................................................................ 48
MIW Power Distribution ........................................................................................................ 48
10. Modular Industrial Console (MIC) ............................................................................... 49

MIC Mounting ....................................................................................................................... 49
Small Console .................................................................................................................... 50
Large Consoles ................................................................................................................... 51
MIC Floor Cutouts ................................................................................................................. 51
MIC Specifications .................................................................................................................. 51
MIC Power Distribution ......................................................................................................... 52
11. Other Enclosures ........................................................................................................... 53

Fieldbus Cluster I/O Enclosures .............................................................................................. 53
Fiber Optic LAN Enclosures ................................................................................................... 53
12. Mounting Structures and Industrial Power Modules..................................................... 55

1x8 and 1x8 FBM Mounting Structures .................................................................................. 55
Outline and Dimensions .................................................................................................... 55
1x8 and 1x8 FBM MS Mounting Options ......................................................................... 57
1x8 and 1x8 FBM MS Specifications ................................................................................. 59
Industrial Power Modules .................................................................................................. 59
1x12 FBM Mounting Structure Packages ................................................................................ 61
Outline and Dimensions .................................................................................................... 61
1x12 FBM Mounting Structure Mounting Options ........................................................... 62
1x12 FBM MS Specifications ............................................................................................. 63
Modular Mounting Structures ................................................................................................ 63
v
MMS Outline and Dimensions .......................................................................................... 63

MMS Mounting Options ................................................................................................... 64
MMS Specifications ........................................................................................................... 64
13. Model P79 Workstation ................................................................................................ 65

Outline and Clearance Dimensions ......................................................................................... 67
P79 Workstation ................................................................................................................ 67
Keyboards, Mouse and Trackball ....................................................................................... 67
P79 Workstation Specifications ............................................................................................... 67
P79 Workstation Equipment and Peripherals .......................................................................... 68
P79 Workstation Environmental Considerations .................................................................... 69
P79 Workstation Physical Characteristics ............................................................................ 69

P80 Workstation ................................................................................................................ 73
Equipment and Peripherals ..................................................................................................... 74
P80 Physical Characteristics .................................................................................................... 75

P92 Workstation ................................................................................................................ 79
P92 Workstation Physical Characteristics ................................................................................ 81

P93 Workstation ................................................................................................................ 85
P93 Workstation Physical Characteristics ................................................................................ 87
vi
17. 70 Series Workstations .................................................................................................. 89

70 Series Workstations Outline and Clearance Dimensions .................................................... 89
Application Workstations and Workstation Processors ....................................................... 89
70 Series Workstations Specifications ...................................................................................... 90
Environmental Considerations ................................................................................................ 91
18. Server 70 Workstations ................................................................................................. 93

Server 70 Workstations Outline and Clearance Dimensions ................................................... 95
Server 70 Workstations Specifications ..................................................................................... 95
Environmental Considerations ................................................................................................ 97
19. 50 Series Processors and Modules.................................................................................. 99

50 Series Processors and Modules Outline and Clearance Dimensions .................................... 99
Application and Workstation Processors and Data Storage Devices .................................... 99
Keyboards, Mouse and Trackball ..................................................................................... 102
50 Series Processor and Module Specifications ...................................................................... 102
50 Series D-Size Module SCSI Cabling ............................................................................ 107
50 Series Processors and Modules, ac Input ...................................................................... 108
50 Series Processors and Modules, Power Switches ........................................................... 108
20. 10, 30, 40, 60 Series Communications and Control Processor Modules...................... 111
Specifications ........................................................................................................................ 111
21. Fieldbus Modules (FBMs) ........................................................................................... 117

Specifications ........................................................................................................................ 117
FBM Mass ........................................................................................................................ 118
FBM Relative Humidity ................................................................................................... 119
FBM Electromagnetic Interference ................................................................................... 119
FBM Vibration (g) ........................................................................................................... 120
FBM Heat Dissipation ..................................................................................................... 120
22. Workstation Displays .................................................................................................. 123

Workstation Displays’ Outline and Clearance Dimensions ................................................... 123
Workstation Displays’ Specifications ..................................................................................... 123
Power Distribution ............................................................................................................... 125
vii
23. Printers........................................................................................................................ 127

Printer Outline and Clearance Dimensions ........................................................................... 127
Printer Specifications ............................................................................................................. 127
24. Panel Display (PD) and Auto-Manual (A/M) Station.................................................. 131

PD and A/M Station Outline and Clearance Dimensions ..................................................... 131
PD and A/M Station Specifications ....................................................................................... 131
25. System Power and Earthing (Grounding) .................................................................... 133

Introduction .......................................................................................................................... 133
Power Facility ....................................................................................................................... 134
ac Transfer Switch ............................................................................................................ 134
Power Cables ......................................................................................................................... 134
I/A Series Equipment Earthing Requirements ....................................................................... 134
Isolation From SPECTRUM Systems ................................................................................... 139
Signal (Logic) Earthing Requirements ................................................................................... 139
High Performance System Network Earthing ........................................................................ 139
Carrierband LAN Cable System Earthing ............................................................................. 140
Nodebus Earthing ................................................................................................................. 141
Fieldbus Earthing .................................................................................................................. 142
Field Wire Earthing .............................................................................................................. 144
Uninterruptable Power Supply Sizing ................................................................................... 146
Receptacles ....................................................................................................................... 147
Power Cables .................................................................................................................... 147
Series 10, 30, 40 and 60 Modules ..................................................................................... 148
Battery Backup ............................................................................................................ 148
Backup ........................................................................................................................ 149
Non-Stop .................................................................................................................... 149
Workstations and Enclosures ....................................................................................... 150
Fieldbus Modules ........................................................................................................ 150
Power and Status Tap .................................................................................................. 151
External Battery Memory Protection ........................................................................... 151
Power Module Failure Detection ................................................................................. 151
Processors and Modules .................................................................................................... 151
Glossary of Power Terms ...................................................................................................... 152
26. Signal and Power Cabling ........................................................................................... 153

Routing ................................................................................................................................. 153
Wireways, Raised Floor, Overload Troughs, and Conduits .............................................. 153
viii
Enclosures and Workstations ............................................................................................ 153

Separation ............................................................................................................................. 154
Lengths ................................................................................................................................. 155
27. Electrical Power Requirements .................................................................................... 163

Loadable Mounting Structure Components .......................................................................... 166
Processor and Communications Modules ......................................................................... 166
Fieldbus Modules ............................................................................................................. 168
Modular Mounting Structure Components .......................................................................... 169
ac Transfer Switch ............................................................................................................ 170
Peripheral and Human Interface (HI) Devices ...................................................................... 171
Console/Workstation ............................................................................................................ 172
IE16 and IE32 Fan Power With 50 Series Components ........................................................ 172
Power to SCSI Devices in a Spacer ........................................................................................ 172
28. Field Input/Output Wiring ......................................................................................... 173

Field Enclosure 4 .................................................................................................................. 173
Other Enclosures ................................................................................................................... 173
Marshalling Cabinet .............................................................................................................. 175
Classification of Wires ........................................................................................................... 175
Number of Wires .................................................................................................................. 177
Wire Size .......................................................................................................................... 177
Wire Channel Area ........................................................................................................... 177
Termination Block Sites ................................................................................................... 177
Field Wiring Cross-Reference ........................................................................................... 178
Fieldbus Modules with Non-Incendive Field-Circuits ........................................................... 184
Canadian Standards Association (CSA) Requirements ...................................................... 184
Factory Mutual (FM) Requirements ................................................................................. 184
Shield Terminations .............................................................................................................. 188
DIN RAIL Mounted Modules .............................................................................................. 188
29. Fieldbus Communication ............................................................................................ 189

Local Fieldbus ....................................................................................................................... 190
Extended Fieldbus ................................................................................................................. 190
Typical Fieldbus Communication ......................................................................................... 190
30. Nodebus Communication ........................................................................................... 193

Local ..................................................................................................................................... 193
Local Extension ..................................................................................................................... 194
Remote Extension ................................................................................................................. 194
ix
Typical Coaxial (Copper) Nodebus Communications ........................................................... 194
31. Carrierband LAN Communications ............................................................................ 197

Fault-Tolerant Coaxial Carrierband LAN Interface ............................................................... 198
Non-Fault-Tolerant Coaxial Carrierband LAN Interface ...................................................... 198
Fiber Optic Carrierband LAN Interface ................................................................................ 201
32. Hydrostatic Tank Gauge Interface............................................................................... 203
33. Mass Flowmeter Interface............................................................................................ 205
34. Site Planning Checks................................................................................................... 207

Fire and Safety Precautions ................................................................................................... 207
Shipping and Handling Considerations ................................................................................. 207
Site Planning Checklist ......................................................................................................... 207
Appendix A. Equipment Physical Characteristics .............................................................. 209
Appendix B. Mounting Options........................................................................................ 215
Appendix C. Equipment Operating Environments ............................................................ 221
Appendix D. Contamination and Temperature Specifications........................................... 225
Appendix E. Relative Humidity and Altitude Specifications .............................................. 229
Appendix F. Electrical Power............................................................................................. 233
Appendix G. RFI, ESD, HFT, S/IL, and SWC Specifications ........................................... 237
Appendix H. Mechanical Specifications............................................................................. 241
Appendix I. Thermal Loading on HVAC Systems ............................................................. 243
Appendix J. Thermal Loading on Enclosures..................................................................... 247
Appendix K. SCSI Bus Configuration Guide..................................................................... 251
Index .................................................................................................................................. 253
x
Figures
3-1. Field Enclosure 4, Mounting (Wall Mounting) ........................................................... 10
3-2. Field Enclosure 4, Mounting (Conduit Plate) ............................................................. 10
3-3. Field Enclosure 4 Power Distribution, Typical ............................................................ 12
4-1. Field Enclosure 8, Mounting (Floor Mounting) .......................................................... 14
4-2. Field Enclosure 8, Mounting (Bottom Plate) ............................................................... 14
4-3. Field Enclosure 8, Mounting (Wall Mounting Unit) .................................................. 15
4-4. Field Enclosure 8, Floor Cutout .................................................................................. 16
4-5. Field Enclosure 8, Top Entry Panels (Enclosure Top Plate) ........................................ 16
4-6. Field Enclosure 8, Top Entry Panels (Wall Mounting Unit Top Cover) ..................... 17
4-7. Field Enclosure 8 (Metal), Mounting (Floor Mounting Bottom Base) ........................ 17
4-8. Field Enclosure 8 (Metal), Mounting (Wall Mounting Bracket) ................................. 18
4-9. Field Enclosure 8 (Metal), Bottom Cover, Cable Entry Area ....................................... 18
4-10. Field Enclosure 8 (Metal), Top Cover Cable Entry Area ............................................. 19
4-11. Field Enclosure 8 Power Distribution, Typical ............................................................ 20
5-1. Industrial Enclosure 16, Mounting (Floor Mounting for Vented or Sealed) ................ 21
5-2. Industrial Enclosures 16 (Sealed), Mounting (Bottom Plate) ....................................... 22
5-3. Industrial Enclosures 16, Floor Cutout ....................................................................... 22
5-4. Industrial Enclosures 16, Top Entry Panels (Sealed) ................................................... 23
5-5. Industrial Enclosures 16, Top Entry Panels (Vented) .................................................. 24
5-6. Power Distribution, Typical (Industrial Enclosure 16) ................................................ 25
6-1. Industrial Enclosure 32 (Sealed or Vented), Mounting (Floor Mounting) ................... 28
6-2. Industrial Enclosure 32 (Sealed), Mounting (Bottom Plate) ........................................ 28
6-3. Single Industrial Enclosures 32, Floor Cutout ............................................................. 29
6-4. Two (Bridged) Industrial Enclosure 32 (Vented or Sealed), Floor Mounting .............. 29
6-5. Two (Bridged) Industrial Enclosures 32, Floor Cutout ............................................... 30
6-6. Three (Bridged) Industrial Enclosure 32, Outline and Clearance (Vented or Sealed) .. 30
6-7. Three (Bridged) Industrial Enclosure 32 (Sealed or Vented), Mounting ...................... 31
6-8. Three (Bridged) Industrial Enclosure 32, Floor Cutout ............................................... 31
6-9. Industrial Enclosure 32, Top Entry Panels (Sealed) ..................................................... 32
6-10. Industrial Enclosure 32, Top Entry Panels (Vented) ................................................... 33
6-11. Industrial Enclosure 32 Power Distribution, Typical ................................................... 34
6-12. Multiple Industrial Enclosures 32 Power Distribution, Typical ................................... 34
7-1. NEMA 4/4X Hardened Enclosure Outer Dimensions ................................................ 36
8-1. Metal Industrial Enclosures, IEMFA (ME24), IEMFR (ME32), and
Metal Termination Enclosure, Mounting .................................................................... 39
8-2. Metal Industrial Enclosures, IEMFA (ME24) and IEMFR (ME32), Bottom Cover,
Cable Entry Area (Sealed Version) .............................................................................. 40
8-3. Metal Industrial Enclosures, IEMFA (ME24) and IEMFR (ME32), Bottom Cover,
Cable Entry Area (Vented Version) ............................................................................. 40
8-4. Termination Enclosure (Metal), Bottom Cover, Cable Entry Area (Sealed Version) .... 41
8-5. Termination Enclosure (Metal), Bottom Cover, Cable Entry Area (Vented Version) .. 41
8-6. Metal Industrial Enclosures, IEMFA (ME24) and IEMFR (ME32), Top Cover,
Cable Entry Area (Dimensions) ................................................................................... 42
8-7. Termination Enclosure (Metal), Top Cover, Cable Entry Area ................................... 43
xi
B0193AB – Rev V Figures
8-8. IEMFA (ME24) and IEMFR (ME32), Power Distribution, Typical ........................... 44
9-1. MIW, Outline and Clearance (Sample Arrangements) ................................................ 46
9-2. Typical Modular Industrial Workstation Bay, Mounting ............................................ 46
9-3. Example of Large Modular Industrial Workstation, Mounting ................................... 47
9-4. Modular Industrial Workstation, Floor Cutout ........................................................... 47
9-5. Power Distribution, Typical (Workstation Bay) .......................................................... 48
10-1. MIC, Outline and Clearance (Sample Arrangements) ................................................. 50
10-2. Typical Modular Industrial Console Bay, Mounting ................................................... 50
10-3. Example of Large Modular Industrial Console, Mounting .......................................... 51
10-4. Power Distribution, Typical (MIC Bay) ...................................................................... 52
12-1. 1x8 and 1x8 FBM Mounting Structures, Outline and Clearance (Side View) ............. 56
12-2. 1x8 and 1x8 FBM Mounting Structures, Outline and Clearance (Top View) ............. 56
12-3. 1x8 and 1x8 FBM Mounting Structures, Mounting (Front View) .............................. 57
12-4. 1x8 and 1x8 FBM Mounting Structures, Mounting (Top View) ................................. 58
12-5. 1x8 and 1x8 FBM Mounting Structures, Mounting (Side View, Example 1) .............. 58
12-6. 1x8 and 1x8 FBM Mounting Structures, Mounting (Side View, Example 2) .............. 59
12-7. 1x12 FBM Mounting Structure, Outline and Clearance (Side View) .......................... 62
12-8. 1x12 FBM Mounting Structures, Mounting (Front View) .......................................... 62
12-9. 50 Series 19-Inch Modular Mounting Structure (MS and 2xMMS),
Outline and Clearance ................................................................................................ 63
13-1. Distances for P79 Workstation Peripherals Connections ............................................. 66
13-2. P79 Outline and Clearance ......................................................................................... 67
14-1. Distances for Model P80 Peripherals Connections ...................................................... 72
14-2. Server 70 Outline and Clearance ................................................................................. 73
15-2. P92 Workstation Outline and Clearance ..................................................................... 79
16-2. P93 Workstation Outline and Clearance ..................................................................... 85
17-1. AW/WP70, Style A and AW70, Style B Outline and Clearance .................................. 89
18-1. Distances for Server 70 Peripherals Connections ......................................................... 94
18-2. Server 70 Outline and Clearance ................................................................................. 95
19-1. A-Size Processor (50 Series), Outline and Clearance .................................................... 99
19-2. B-Size Module (50 Series), Outline and Clearance .................................................... 100
19-3. C-Size Processor (50 Series) Outline and Clearance .................................................. 100
19-4. D-Size Module (50 Series) Outline and Clearance .................................................... 101
19-5. E-Size Processor (50 Series) Outline and Clearance ................................................... 101
19-6. F-Size Processor (50 Series) Outline and Clearance ................................................... 101
22-1. Power Distribution, Typical (Peripherals) ................................................................. 125
23-1. Power Distribution, Printers ..................................................................................... 129
25-1. I/A Series Power and Earth Distribution ................................................................... 135
25-2. I/A Series Power and Earth Distribution – First Option ............................................ 137
25-3. I/A Series Power and Earth Distribution – Second Option ....................................... 138
25-4. Carrierband LAN Cable System Earthing ................................................................. 141
25-5. Remote Nodebus Earthing ........................................................................................ 142
25-6. Remote Fieldbus Extension Earthing ........................................................................ 143
25-7. Field Wire Earthing .................................................................................................. 145
25-8. Typical Overall Power Distribution System Power Configurations ........................... 147
25-9. Battery Backup Power Configuration ........................................................................ 148
xii
Figures B0193AB – Rev V
25-10.Backup Power Configuration .................................................................................... 149

25-11.Nonstop Power Configuration .................................................................................. 150
28-1. Wiring Separation, Example ...................................................................................... 176
29-1. Typical Fieldbus Communication (Local Fieldbus) ................................................... 190
29-2. Typical Fieldbus Communication (Extended Fieldbus) ............................................. 191
30-1. Typical Nodebus Communication (Local Nodebus) ................................................. 195
30-2. Typical Nodebus Communication (Local Nodebus Extension) ................................. 195
30-3. Typical Nodebus Communication (Remote Nodebus Extension) ............................. 196
30-4. Nodebus Communication (Typical Node) ................................................................ 196
31-1. Fault-Tolerant Coaxial Carrierband LAN Interface, Cabling ..................................... 199
31-2. Non-Fault-Tolerant Coaxial Carrierband LAN Interface, Cabling (Single LAN) ...... 200
31-3. Non-Fault-Tolerant Coaxial Carrierband LAN Interface, Cabling (Dual LAN) ........ 200
32-1. Hydrostatic Tank Gauge Interface, Typical Cabling
(NR Tank Processor and NR Fieldbus) ..................................................................... 204
32-2. Hydrostatic Tank Gauge Interface, Typical Cabling
(NR Tank Processor and RD Fieldbus) ..................................................................... 204
33-1. Mass Flowmeter Interface, Typical Cabling (Non-Redundant Fieldbus) ................... 206
33-2. Mass Flowmeter Interface, Typical Cabling (Redundant Fieldbus) ............................ 206
xiii
B0193AB – Rev V Figures
xiv
Tables
8-1. Thermal Loading ........................................................................................................ 43
12-1. IPM dc V Tolerance Specifications ............................................................................. 60
12-2. IPM RFI, ESD and HFT Specifications ...................................................................... 60
12-3. IPM S/IL Transient and SWC Specifications .............................................................. 61
13-1. P79 Workstation Equipment and Peripherals .............................................................. 68
13-2. P79 Workstation Physical Characteristics .................................................................... 69
17-1. Equipment and Peripherals ......................................................................................... 90
17-2. 70 Series Workstations Physical Characteristics ........................................................... 92
18-1. Equipment and Peripherals ......................................................................................... 96
18-2. 70 Series Workstations Physical Characteristics ........................................................... 97
19-1. 50 Series Processors and Modules Physical Characteristics ........................................ 102
19-2. 50 Series Processors and Modules ac Interrupt Tolerance Specifications .................... 104
19-3. 50 Series Processors and Modules RFI, ESD, and HFT Specifications ...................... 104
19-4. 50 Series Processors and Modules S/IL Transient and SWC Specifications ............... 105
19-5. 50 Series Processors and Modules Vibration Specification ......................................... 106
19-6. 50 Series Processors and Modules Heat Dissipations Specifications ........................... 107
19-7. SCSI Cable Part Numbers ......................................................................................... 108
20-1. Communications and Control Module Loadable Mounting ..................................... 112
20-2. Communications and Control Module RFI, ESD, and HFT Specifications .............. 114
20-3. Communications and Control Module S/IL Transient and SWC Specifications ....... 114
20-4. Communications and Control Module Vibration Specifications ............................... 115
20-5. Communications and Control Module Heat Dissipation Specifications .................... 115
21-1. FBM Loadable Mounting ......................................................................................... 118
21-2. FBM RFI, ESD, and HFT Specifications .................................................................. 119
21-3. FBM S/IL Transient and SWC Specifications ........................................................... 119
21-4. FBM Heat Dissipation Specifications ........................................................................ 120
22-1. Workstation Displays RFI, ESD, and HFT Specifications ........................................ 124
22-2. Workstation Displays S/IL Transient and SWC Specifications .................................. 125
23-1. Printers’ ac Voltage, Frequency, and Distortion Specifications .................................. 127
23-2. Printers’ ac Interrupt Tolerance Specifications .......................................................... 128
23-3. Printers’ RFI, ESD, and HFT Specifications ............................................................. 128
23-4. Printers’ S/IL Transient and SWC Specifications ...................................................... 128
23-5. Printer Heat Dissipation Specification ...................................................................... 129
24-1. PD and A/M RFI, ESD, and HFT Specifications ...................................................... 131
26-1. Enclosure/Workstation Cable Entry .......................................................................... 153
26-2. Power and Signal Cable Classifications ...................................................................... 154
26-3. Floor-Mounted, Bottom-Cable Entry ....................................................................... 155
26-4. Floor-Mounted, Top-Cable Entry ............................................................................. 155
xv
B0193AB – Rev V Tables
26-5. Wall or Pipe, Mounted, Cable Entry ......................................................................... 156

26-6. Inter-Equipment Cables ............................................................................................ 156
26-7. Long-Length Cables -- Electrical Data ...................................................................... 160
26-8. Long-Length Cables -- Electrical Data ...................................................................... 161
26-9. Long-Length Cables -- Physical Data ........................................................................ 161
26-10. Long-Length Cables -- Physical Data ........................................................................ 162
27-1. IPM Power Configuration/IPM Cross-Reference ...................................................... 164
27-2. IPM Voltage and Frequency Input Requirements ..................................................... 164
27-3. IPM Power Consumption ......................................................................................... 165
27-4. 1x8 Mounting Structure ............................................................................................ 166
27-5. Processor and Communications Modules Power Consumption ................................ 166
27-6. Fieldbus Modules Power Consumption .................................................................... 168
27-7. Peripheral and High Devices Power Requirements .................................................... 169
27-8. Peripheral and Human Interface Devices Power Requirements ................................. 171
28-1. Burndy (or Equivalent) Connectors .......................................................................... 173
28-2. Burndy (or Equivalent) Sockets ................................................................................. 174
28-3. Discrete and Plug Connector Blocks ......................................................................... 174
28-4. Termination Block Sites ............................................................................................ 177
28-5. Fieldbus Wiring Cross-Reference .............................................................................. 179
28-6. Fieldbus Module Identification ................................................................................. 182
28-7. FBMs with CSA Certified I/O Circuits ..................................................................... 184
28-8. Non-Incendive Field FBM Entity Parameters ........................................................... 186
A-1. Equipment Physical Characteristics ........................................................................... 209
A-2. Loadable Mounting ................................................................................................... 212
A-3. Loadable Mounting – 50 Series ................................................................................. 214
B-1. Equipment Mounting Options ................................................................................. 215
C-1. Equipment Operating Environment ......................................................................... 221
D-1. Contamination and Temperature Specifications ........................................................ 225
E-1. Relative Humidity and Altitude Specifications .......................................................... 229
F-1. ac Voltage, Frequency, and Distortion Specifications ................................................ 233
F-2. dc V Tolerance and ac Interrupt Tolerance Specifications ......................................... 234
G-1. RFI, ESD, and HFT Specifications ........................................................................... 238
G-2. S/IL Transient and SWC Specifications .................................................................... 239
H-1. Mechanical Environment Specifications .................................................................... 241
I-1. Major Equipment Heat Dissipation Specifications .................................................... 243
J-1. Thermal Loading ...................................................................................................... 247
J-2. Processor Module Heat Dissipation Specifications .................................................... 248
J-3. Fieldbus Modules Heat Dissipation Specifications .................................................... 249
J-4. Magnetic Storage Module Heat Dissipation Specifications ........................................ 250
K-1. Equivalent SCSI Cable Lengths ................................................................................. 251
xvi
Preface
Site planning involves selecting and preparing the site to accommodate the I/A Series® systems
equipment. This book provides the information and/or references to the information for selecting
and preparing the site. The information is generic (that is, applicable to all configurations) and is
intended for use in:
♦ Determining interior and exterior space requirements
♦ Designing a floor plan
♦ Determining the adequacy of the environment
♦ Constructing an electrical power distribution system.
This document provides general guidelines and specific requirements for selecting and preparing a
site to accommodate 50 Series processors, 70 Series processors, P79, P80, P92 and P93 worksta-
tions and associated I/A Series system equipment. The information can help you determine inte-
rior and exterior space requirements, design a floor plan, determine the adequacy of the
environment, and construct an electrical power distribution system. This document also describes
equipment shipping and handling considerations, and contains a site-planning checklist. The
planning activities include the following major hardware elements:
♦ Structural foam and metal enclosures
♦ Mounting structures for the processors and modules
♦ Fieldbus Modules
♦ Modular Industrial Consoles/Workstations
♦ Processors, Integrator/Gateway, and Fieldbus modules
♦ Data storage modules
♦ Display monitors
♦ Keyboards, printers, and trackball devices
♦ Power and signal cables.
Who This Book is For

This book is intended for the use of process control engineers, maintenance, and other qualified
and authorized personnel involved in selecting and preparing a site to accommodate the I/A Series
systems equipment.
What You Should Know

Prior to using this book, you should be generally familiar with the I/A Series system. Detailed
information for the software and the hardware is found in the full documentation set for
I/A Series systems.
xvii
B0193AB – Rev V Preface
How to Use This Book

This book is organized in a modular fashion, that is, each chapter is a stand-alone module describ-
ing one subject/group of related equipment. This organization allows you to customize your doc-
ument to your site needs, by removing those chapters which are not applicable to the equipment
selected for your site. I/A Series Product Specification Sheets (PSSs) are referenced where the
information contained in the PSS(s) is required for site planning.
The appendixes consolidate the specifications for all equipment on a per subject basis, that is;
electrical requirements, heat dissipation, and other specifications.
Revision Information
For Release 7.1, the following changes were made to this document:
Preface
Added a reference to Modbus™ Communication Interface Module (FBM224) User’s Guide
(B0400FK).
Chapter 21 “Fieldbus Modules (FBMs)”
Added a reference to Modbus Communication Interface Module (FBM224) User’s Guide
(B0400FK).
Added a reference to Modbus Communication Interface Module (FBM224) (PSS 21H-2Z24 B4).
Chapter 28 “Field Input/Output Wiring”
Added references to Modbus Communication Interface Module (FBM224) User’s Guide
(B0400FK).
Chapter 29 “Fieldbus Communication”
Added a reference to Modbus Communication Interface Module (FBM224) User’s Guide
(B0400FK).
Appendix E “Relative Humidity and Altitude Specifications”
Added specifications for Model 51 Processors.
Reference Documents
The following documents provide primary coverage for each of their subject areas:
Part
Document Title Number
1x12 Fieldbus Module Configurable Mounting Structure Kit Installation and Wiring B0400PK
Instructions
ac Transfer Switch Installation B0193PS
(Supplied with Kits P0970WU/WV/WW)
Allen-Bradley® Station B0193MK
Appendix C in System Equipment Installation B0193AC
Control Processor 60 and Control Processor 60S Installation and Maintenance B0400FB
xviii
Preface B0193AB – Rev V
Part
Document Title Number
DIN Rail Mounted FBM Subsystem User’s Guide B0400FA
European Union CE-Mark Compliance Manual B0193UU
Fieldbus Cluster I/O User’s Guide B0193RB
FOUNDATION® fieldbus H1 Interface Module (FBM220/221) User Guide B0400FD
Hardware and Software Specific Instructions For 70 Series Processors (GX1 Pentium III) B0400RC
AW70A (P99*Q), WP70 (P98*N), and AW70B (P97*J)
Hardware and Software Specific Instructions For 70 Series Processors (GX1 Pentium III) B0400RL
AW70A (P99*T), WP70 (P98*R), and AW70B (P97*L)
Hardware and Software Specific Instructions for 70 Series Processors (GX1 B0400SA
Pentium) AW70A (P99*P), WP70 (P98*M), and AW70B (P97*H)
Hardware and Software Specific Instructions for 70 Series Processors (GXA Pentium II) B0400PV
AW70A (P99*N), WP70 (P98*L), and AW70B (P97*G)
Hardware and Software Specific Instructions for P93*A Workstation (GX240) B0400RU
Hardware and Software Specific Instructions for Server 70 Processors (PE2400) AW70C B0400SP
and WP70C (P95*A)
Hardware Descriptions B0193AE
Hardware Installation Procedures for Model P79 Workstation (Solaris® 8 Operating System) B0400SR
Hardware Installation Procedures for Model P80 Workstation (Solaris 8 Operating System) B0400SS
Hardware Installation Procedures for Model P92*A Workstation (PW340) B0400HD
Hardware Kit Installation Procedures for 50 Series Model 51, Style D Processors B0400PT
Hardware Kit Installation Procedures for 50 Series Model 51, Style E Processors B0400PJ
HART® Communication Interface Module (FBM214/215/216/218) User’s Guide B0400FF
High Performance System Network User’s Guide B0400DV
Integrators for Allen-Bradley Controllers B0193RG
Integrators for Modbus® and Modbus Plus Devices B0193RL
Modbus Communication Interface Module (FBM224) User’s Guide B0400FK
Modular Industrial Console Assembly B0193XF
Modular Industrial Console Installation B0193UV
Modular Industrial Workstation Installation B0193CE
Network Cable Systems Installation and Maintenance B0193UW
Network Cable Systems Planning B0193UX
PROFIBUS-DP™ Communication Interface Module (FBM223) User’s Guide B0400FE
SBus Card Kit Installation Procedures for 50 Series Processors B0193SC
System Equipment Installation B0193AC
xix
B0193AB – Rev V Preface
xx
1. Environmental Considerations
This section contains information on the operating environments and operating environmental
specifications for I/A Series system equipment. The heat dissipated by I/A Series equipment is
also explained in this section.
Operating Environments
I/A Series system equipment is individually designed to operate in a wide range of industrial envi-
ronments. The five most common environments generally are categorized by climatic conditions
as follows:
Computer Room Temperature, relative humidity, and airborne particulates are

controlled.
Control Room Temperature is controlled and relative humidity is indirectly controlled.
Airborne particulates and chemicals are attenuated but not controlled.
Process Area Climatic parameters are not controlled; condensation is possible.
Outdoor (Sheltered) Same as process area plus exposure to natural elements (rain, snow,
wind, etc.), but sheltered from exposure to direct sunlight.
Outdoor (Unsheltered) Same as process area plus exposure to natural elements (rain, snow,
wind, etc.), including exposure to direct sunlight.
Operating Environmental Specifications

The operating environmental specifications for I/A Series equipment include climatic (contami-
nation and temperature, relative humidity and altitude), and mechanical specifications. Each
chapter describing different equipment includes the environmental specifications for that equip-
ment and references to specifications contained in PSSs.
Airborne corrosive gas contaminants (hydrogen sulfide, chlorine, nitrogen dioxide, for example)
may exist in industrial environments. While high concentrations of an individual gas can damage
equipment, the interactive effects of certain gases coupled with temperature and humidity varia-
tions can greatly accelerate or retard the corrosive action of any gas.
Consequently, the best way to determine the corrosive nature of any particular industrial environ-
ment is to measure the rate of corrosion formation on a test strip of copper exposed to that envi-
ronment over a specific period. This method, known as reactivity monitoring and defined in
ISA® Standard S71.04, integrates all the corrosive effects in that environment. If corrosive gases
are known or suspected to be present where equipment will be located, a reactivity monitoring
test is recommended. (Invensys Foxboro provides such a test.)
1
B0193AB – Rev V 1. Environmental Considerations
Accordingly, I/A Series equipment is rated for service in the corrosive gas environments defined in
ISA Standard S71.04. These ratings (that is, contamination levels) are identified as follows:
I/A Series
Contamination Code ISA Standard
(CC) S71.04 Identification
1 Class G1 (Mild)
2 Class G2 (Moderate)
3 Class G3 (Harsh)
4 Class GX (Severe)
Heat Dissipation
The heat dissipated by I/A Series equipment is an important consideration when the equipment
will be located in an environment in which the temperature is controlled by a Heating, Ventilat-
ing and Air Conditioning (HVAC) system (that is, in a computer room or control room).
The heat dissipated by I/A Series equipment is partitioned into two categories: Thermal loading
on Heating, Ventilating, and Air Conditioning (HVAC) systems by major items (for example
enclosures, printers, displays); and thermal loading on individual enclosures by contained device
(such as Fieldbus modules, processor modules and so forth).
2
2. Enclosures – General
This section contains general information on enclosures including general clearance
requirements, physical characteristics, heat dissipation, power cables, floor cutouts, and top
entry panels.
Site location, floor area, and equipment arrangement depend on the quantity, outline dimensions,
clearance requirements (installation, operational, and servicing), and mounting options, as well as
other physical characteristics (for example, the mass) of the equipment to be installed. Additional
determinants are the cable routes and the maximum permissible signal cable lengths among the
pieces of equipment, as well as between the equipment and field devices. This chapter discusses
general requirements and characteristics in relation to Field Enclosures, Industrial Enclosures,
Termination Enclosures and Modular Industrial Consoles/Workstations, while other chapters dis-
cuss details specific to each particular enclosure. The following enclosures are covered in the fol-
lowing (subsequent) chapters:
♦ Chapter 3 “Field Enclosure 4 (FE4)”
♦ Chapter 4 “Field Enclosure 8 (FE8)”
♦ Chapter 5 “Industrial Enclosure 16 (IE16)”
♦ Chapter 6 “Industrial Enclosure 32 (IE32)”
♦ Chapter 7 “NEMA 4/4X Hardened Enclosure”
♦ Chapter 8 “Metal Industrial Enclosures IEMFA, IEMFR, and Metal Termination
Enclosure”
♦ and Chapter 11 “Other Enclosures” which includes:
♦ “Fieldbus Cluster I/O Enclosures” on page 53 and
♦ “Fiber Optic LAN Enclosures” on page 53.
NOTE
For information relating to the DIN rail FBM subsystem enclosures, refer to DIN
Rail Mounted FBM Subsystem User’s Guide (B0400FA).
General Clearance Requirements

The following paragraphs address the servicing clearances and related information for the rear
interior-access option that is available with some enclosures. It also addresses the operational clear-
ances for the heat exchangers at the front and/or rear of enclosures as well as the operational clear-
ances required when equipment is in a customer-supplied rack. This information is in addition to
the graphics presented under each specific type of enclosure.
The access clearances (that is, work envelopes) specified in this document typically are 607 mm
(24 in) or, in some instances, slightly less, and represent the minimum dimensions allowed by the
design of I/A Series enclosures. However, clearances of 1 m (39.4 in) are recommended to accom-
modate maintenance technicians in a bending or kneeling position.
3
B0193AB – Rev V 2. Enclosures – General
Some clearances are required specifically for accessing and servicing processor and Fieldbus Mod-
ules (FBMs). Processor modules plug directly into the mounting structures within applicable
enclosures. Fieldbus Modules require Y-Adapters in all enclosures except the Field Enclosure 4
and those enclosures that do not use FBM-specific mounting structures.
Enclosure Rear Access

Rear access to the interior of Field Enclosures and Industrial Enclosures is optional. The Multi-
Bridged Industrial Enclosure 32 (except for the Front Access-only metal types) requires 607 mm
(24 in) of clearance to access the interior of the bridging structure(s) for wiring purposes. This
option facilitates removal of dust from the processor and Fieldbus module heat exchanger fins,
which extend into the internal cooling region (referred to as the “chimney”) at the rear of these
enclosures. Removing the modules from the front of each enclosure allows access to the module
heat exchangers for routine maintenance.
When Industrial Enclosures or Field Enclosures are oriented back-to-back and rear access is either
selected or mandated, a 607 mm (24 in) clearance “corridor” at the rear of the enclosures is
required to permit one-at-a-time access to the rear of each opposing enclosure. To access opposing
enclosures simultaneously, the corridor width must be 1214 mm (48 in).
Exterior Heat Exchangers

The exterior heat exchangers on Field Enclosures and vented Industrial Enclosures require a min-
imum of 152 mm (6 in) of clearance close to the exchangers to ensure adequate air circulation at
the exchanger fins. In some instances, this requirement is satisfied automatically by the greater
clearance required to access to the interior of the enclosure during either installation or mainte-
nance activities.
Auxiliary Cooling Assemblies

The optional Auxiliary Cooling Assemblies (ACAs) on the front and rear exterior heat exchangers
of sealed Industrial Enclosures require a minimum of 457 mm (18 in) of clearance close to the
ACA to ensure adequate air circulation at the top and bottom of the exchanger plenum. In some
instances, this clearance requirement is automatically satisfied by the greater clearance required to
access to the interior of the enclosure during either installation or maintenance activities.
Auxiliary Cooling Assemblies (ACAs) are optionally available on sealed enclosures, which include
the Structural Foam IE16, IE32 and Bridged IE32 without peripheral devices. These assemblies
are fan-powered and mounted on the front and rear of the enclosures to produce forced-air circu-
lation within a created plenum at the heat exchanger fins.
NOTE
The Auxiliary Cooling Assemblies are required when peripheral devices (IE16 -
50 Series storage devices only) and processors (IE32 - 50 Series processors, 70 Series
processors, P79, P92, P93 workstations and storage devices) are used in a sealed
Industrial Enclosure that is not in an air-conditioned environment.
NOTE
Server 70 processors and P80 workstations cannot be used in an IE16/32.
4
2. Enclosures – General B0193AB – Rev V
Customer-Supplied Equipment Racks

When a 1x8, 1x8 FBM, or 1x12 FBM mounting structure is housed in a customer-supplied rack,
the operational clearances at the front and rear of the processor and Fieldbus modules must com-
ply with those indicated in the associated illustrations. These clearances allow air to circulate
freely around the module heat exchangers. However, it is recommended that forced air circulate at
a volumetric rate of 0.085 cubic meters (3 cubic feet) per second [that is, a speed of 3 meters
(10 feet) per second] to ensure adequate cooling of the modules.
NOTE
Depending on individual equipment configuration, all other I/A Series enclosures
provide adequate cooling of the modules with or without the use of fans. When fans
are used, cooling is achieved by internally circulating the air at a volumetric rate of
0.085 cubic meters (3 cubic feet) per second [that is, a speed of 3 meters (10 feet)
per second]. When fans are not used, cooling is achieved through an internal chim-
ney effect that causes air to rise at the front and rear of the enclosure.
Physical Characteristics
Mass
Shipping weights for the enclosures depend on the system configuration. The enclosures are typi-
cally shipped with the processor, FBM, and power modules mounted in the enclosures. The pro-
cessors and peripheral modules are not mounted in the enclosures. Refer to the configurations
developed during the site planning phase to identify components that are shipped separately and
installed on site.
The maximum (calculated) mass of the enclosures, workstation bays/spacers, and mounting struc-
tures are for worst-case loading with components (excluding the mass of customer-supplied power
cables and field signal wires). The actual mass is the shipping mass of the enclosure, workstation,
or mounting structure, plus the total mass of the components identified during the site planning
phase. The mass of each loadable component (excluding cables, buses, and Y-Adapters) should be
defined for each enclosure defined during site planning. The average mass of each Termination
Cable Assembly (TCA) is 1 kg (2 lb).
Height
The shipping container adds 254 mm (10 in) to the indicated height of each enclosure.
5
Heat Dissipation
Calculating the Actual Heat Dissipated
The actual heat dissipated by enclosures and by the 1x8 mounting structure can be calculated
using the following formula:
Total Heat Dissipated (in BTU/hour) = P + (Mx42.5), where
P = average heat (BTU/hour) dissipated by the power modules

M = total quantity of slots in the enclosure or mounting structure occupied by
processor and Fieldbus Modules
42.5 average heat (in BTU/hour) dissipated by processor and Fieldbus modules
=
Thermal Loading on Enclosures

The heat dissipated by processor modules, Fieldbus modules, and magnetic storage devices must
be considered to ensure that the module population within the enclosure does not exceed the
thermal capacity (heat dissipation ability) of the enclosure. When determining the thermal load-
ing of enclosures, the heat generated by fans and power supplies is included in the thermal loading
of the enclosure.
Power Cables
All customer-supplied power cables for interconnecting the power distribution panel and
I/A Series equipment must conform to National Electric Code (NEC) installation requirements,
or to the national code of practice for the country of installation. Power cables must be able to
conduct at least the rated current of the associated circuit breakers and must not exceed
6 square mm (10 AWG). Allow approximately 1 m (3 ft) at the factory power distribution panel
end of the power cable and 2 m (6 ft) at the I/A Series enclosure end of the power cable for rout-
ing in the panel and the enclosure.
Floor Cutouts and Top Entry Panels

When cables are routed below floor level, floor cutouts must be provided to allow entry/exit
to/from certain equipment. (Floor cutouts do not apply to FE4.) FE8 and FE8 Metal, IE16 and
IE32, IEMFA, IEMFR, Termination Enclosure (Metal), and Multiple (Bridged) Industrial
Enclosure 32 optionally support overhead cable-entry into the enclosure through a top-mounted
cover, panel, or plate.
! WARNING
Ensure 50 mm (2.0 in) minimum mutual separation among high-voltage
(≥ 30 V ac rms or 60 V dc) power, low-voltage (< 30 V ac rms or 60 V dc) power,
high-voltage (≥ 30 V rms or 60 V dc) signal, low voltage (< 30 V ac rms or 60 V dc)
signal, and non-incendive (energy level too low to cause spark) signal cables. Failure
to provide this separation may result in injury to personnel.
6
2. Enclosures – General B0193AB – Rev V
When power and signal cables are routed through the same cutout and/or opening, maintain
maximum possible separation between the cables to avoid electromagnetic interference (EMI)
induced noise on the signal lines. The minimum separation is 50 mm (2.0 in).
NOTE
If the site is to include FOXNET™ communications, the FOXNET station cables
and logic earth (dc earth) cables should be routed together but separated from the
FOXNET ac power and earth cables. [Refer to System Equipment Installation
(B0193AC) pertaining to SPECTRUM™ for additional information.]
NOTE
The customer is responsible for the size, location, creation, and sealing of all con-
duit holes in the supplied cover or plate, as well as for provision and utilization of
watertight fittings at all created holes.
7
8
3. Field Enclosure 4 (FE4)
In this section is information on Field Enclosure 4 (FE4) mounting, field input/output wiring,
specifications, heaters, and power distribution.
FE4 Mounting
Field Enclosure 4 can be mounted on a pipe or on a wall. Processor modules, disk drives and tape
storage drives cannot be used in the FE4.
NOTE
The information in “General Clearance Requirements” on page 3 applies to the
FE4.
FE4 Pipe Mounting

Pipe mounting of FE4 requires customer-supplied pipe with a nominal inside diameter of
50.8 mm (2.0 in) and a maximum outside diameter of 60 mm (2.37 in).
For the standard outline dimensions and clearance drawings refer to Molded Structural Foam
Enclosures (PSS 21H-5B1 B3).
FE4 Wall Mounting

Wall mounting of this enclosure requires two wall brackets (supplied) as shown in Figure 3-1. For
the standard outline dimensions and clearance drawings refer to Molded Structural Foam Enclo-
sures (PSS 21H-5B1 B3).
9
B0193AB – Rev V 3. Field Enclosure 4 (FE4)
15.75 Wall
95.25 0.62 Diameter
3.75 Upper Bracket*
Wall Mounting Hole
(2 Places)
Upper Wall
Bracket
751.3
29.58 736
29
Lower Wall
Bracket
15.75
145 0.62 Diameter
5.8 Wall Mounting Hole Lower Bracket*
(2 Places)
View Facing Wall Front View
* Used on Either Side
Figure 3-1. Field Enclosure 4, Mounting (Wall Mounting)
FE4 Conduit Plate

A conduit plate mounting applies to both pipe and wall mounting. Factory cut holes are shown.
The customer is responsible for the size, location, creation, and sealing of all other conduit holes.
37.6 Bolt Hole for Attaching

Internal Bus Bracket to
1.48
Plate
154.9
6.1
309.9
12.2
Bolt Holes (12 Places) for
25.4 Diameter Hole Attaching Plate to Bottom
1.0 for Input Power of Enclosure
Cable
292.1
11.5
Front
(Bottom View)
Figure 3-2. Field Enclosure 4, Mounting (Conduit Plate)
10
3. Field Enclosure 4 (FE4) B0193AB – Rev V
FE4 Field Input/Output Wiring

Field connections, to each Fieldbus module within Field Enclosure 4, use a direct connection
block containing individual screw-clamp terminals that accept discrete field wires. The block is
mounted immediately beneath the module, and is connected via a cable to a termination connec-
tor on the front of the module.
FE4 Specifications
For the standard specifications (such as operating temperature range, contamination class) refer to
Molded Structural Foam Enclosures (PSS 21H-5B1 B3) or to the appendixes in this document.
Additional specifications for the FE4 follow.
Relative Humidity: 5 to 100%, condensing, at 30°C (86°F) dry bulb. Depends on the limits of
the modules contained in the structure.
Vibration (g): 0.5 (15 to 200 Hz). The vibration specification for the enclosure must be down-
graded to reflect the specification for the enclosed peripheral device and the amplification of the
enclosure.
Heat Dissipation: 374 BTU per hour, maximum. The maximum (calculated) heat dissipated by
the FE4 is for worst case loading with components.
Heat Generated: 204 BTU per hour. Heat generated by a typical FE4 configuration, including
power modules and Fieldbus modules.
FE4 Field Enclosure Heaters

The extended temperature range versions of Field Enclosures 4 contain heaters that require sepa-
rate power inputs directly from the customer’s power source. (Refer to Figure 3-3.)
The power requirements for two daisy-chained heaters in an FE4 are as follows:
♦ Voltage: 120 or 240 V ac
♦ Consumption (total): 260 W.
11
FE4 Power Distribution

Figure 3-3 shows the typical power distribution for FE4.
L L
Field Field
N JB ac/dc Main N Enclosure 4
ac/dc Main Enclosure 4 JB
(Primary) E (Secondary) E
L L
110/220 V ac N JB Heaters ac/dc Main N Heater Heater
** JB ** **
from Circuit E ** (Backup) E
Breaker Panel
for Heater
Power only. PST PST
+ +
External External
Battery – Battery –
Backup* NON-REDUNDANT Backup*
REDUNDANT
JB = Junction Box; 2 (maximum) per input.

PST = Optional Power and Status Tap. (Status-Only Tap available
with Non-Stop Power Configuration).
* Not applicable to Non-Stop Power Configuration.

** Provided only with Extended Temperature Option.
Figure 3-3. Field Enclosure 4 Power Distribution, Typical
12
4. Field Enclosure 8 (FE8)
In this section is information on structural foam enclosure mounting, Metal Field Enclosure 8,
FE8 specifications, heaters, and power distribution for Field Enclosure 8 (FE8).
The FE8 may be a structural foam or metal enclosure. Disk and tape storage drives can be used in
Field Enclosure 8 provided the enclosure is not configured for extended temperature operation.
NOTE
E-size through L-size processors and Server 70 processors cannot fit or be used in an
FE8.
NOTE
FE8.
FE8 Structural Foam Enclosure Mounting

Field Enclosure 8 structural foam enclosure can be floor or wall mounted.
FE8 Floor Mounting

Floor mounting of Field Enclosure 8 (structural foam type) requires installing an elastomeric gas-
ket [supplied with enclosure(s)] between the bottom plate and the bottom of the enclosure base.
The customer is responsible for the size, location, creation, and sealing of any required cable pen-
etration area(s) in the bottom plate.
Figure 4-1 and Figure 4-2 show the floor mounting outline and dimensions for the FE8 structural
foam floor mounted enclosure.
13
275.6
10.85
76.2
3.0 22.53
22.23 0.887
0.875
565.2
14.22 Diameter Hole 22.25
0.560
(6 Places)
282.58
123.2 11.125
4.85
Front
Figure 4-1. Field Enclosure 8, Mounting (Floor Mounting)
275.6
10.85
76.2
3.0 24.05
23.75 0.947
0.935
565.2
22.25
14.22 Diameter Hole
0.560 (6 Places)
282.58
123.2 11.125
4.85
Front
NOTE: Factory cut holes are shown. The

customer is responsible for the size, location,
creation, and sealing of all conduit holes.
Figure 4-2. Field Enclosure 8, Mounting (Bottom Plate)
14
FE8 Wall Mounting

Wall mounting of Field Enclosure 8 (structural foam type) requires a wall-mounting unit and
associated filler panel. (The unit replaces one side door and the associated hinge strip on the
enclosure; the filler is substituted for the base of the enclosure.) For the standard outline dimen-
sions and clearance drawings refer to Molded Structural Foam Enclosures (PSS 21H-5B1 B3).
Figure 4-3 shows the additional outline and dimensions for the FE8 structural foam wall-
mounted enclosure.
216 152.4 284.5

8.5 6.0 11.2 162.6
6.4
Front Cover
226 (Top and Bottom)
8.9
Access Panel
(Front and Rear) 609.6*
24 15.2 228.6
1026 0.6 9.0
40.4
228.6
9.0
228.6
9.0
101.6*
4.0 375.9 167.6
Front View 12.7
14.8 6.6
* Opening Dimensions. 401 0.5
15.8
Side View
Figure 4-3. Field Enclosure 8, Mounting (Wall Mounting Unit)
15
FE8 Structural Foam Cable Entry

Top and/or bottom cable entries apply to the FE8 structural foam enclosure for wall or floor
mount. Figure 4-4 through Figure 4-6 detail the dimensions and usable cable feed-through area
within the top cover and bottom plate.
58.4 157.5
2.3 6.2
Cutout* 304.8
12.0
152.4
6.0
Front
* Cutout not required when enclosure is wall-mounted

or when cable entry is through the top of the enclosure
Figure 4-4. Field Enclosure 8, Floor Cutout
92.7 134.6
3.65 5.3
Top Plate *
228.6
9.0
Conduit Area
190.8
7.51
Front
* The customer is responsible for size, location, creation, and watertight integrity of all conduit
holes in the top plate. (The rim of the top plate contains factory cut holes that are used for attaching
the plate to the enclosure.) The top plate is not required when cable entry is through the bottom of
enclosure or through the wall mounting unit.
Figure 4-5. Field Enclosure 8, Top Entry Panels (Enclosure Top Plate)
16
This Side 247.4

Attaches to Wall 9.7
114.3 124.5
4.5 4.9
Top Cover *
Conduit Area
* The customer is responsible for size, location, creation, and watertight integrity of all conduit
holes in the top cover. (The rim of the top cover contains factory cut holes that are used for
attaching the cover to the Wall Mounting Unit.)
NOTE: The top and bottom covers are identical.
Figure 4-6. Field Enclosure 8, Top Entry Panels (Wall Mounting Unit Top Cover)
Metal Field Enclosure 8

The metal FE8 can be floor or wall mounted. For the standard outline dimensions and clearance
drawings refer to Metal Enclosures (PSS 21H-5C1 B3). Figure 4-7 shows the dimensions for the
FE8 base.
600
23.62
14.0 Diameter Holes 50.0
0.56 All Corners 1.97
475 550
525 500 21.65
20.6 18.7 19.68
Front
8.4 Diameter Holes 400
0.33 (9 Holes each side) 15.75
475
18.7
535
21.06
Figure 4-7. Field Enclosure 8 (Metal), Mounting (Floor Mounting Bottom Base)
17
Metal FE8 Wall Mounting

For the standard outline dimensions and clearance drawings refer to Metal Enclosures
(PSS 21H-5C1 B3). Figure 4-8 shows the dimensions for the metal FE8 wall brackets.
228 228 46.5

9.0 9.0 1.83
50
2.0
550
50 21.67
2.0 Front View
Side View
12.0 525
0.467 Dia. 20.7
5 Holes Top View 12.7
0.5
Figure 4-8. Field Enclosure 8 (Metal), Mounting (Wall Mounting Bracket)
Metal FE8 Cable Entry

Top and/or bottom cable entries apply to the Metal FE8 for floor or wall mount. Figure 4-9 and
Figure 4-10 detail the dimensions and usable cable feed-through area within the cover or bottom
plate.
89
3.5 312
12.25
228
50 9.0
550 2.0
21.6 Ground Stud
82.5
3.25
143
5.63
600
23.6
Cable Entrance Area*
Front
* The customer is responsible for size location, creation, and

watertight integrity of all conduit holes in the bottom cover.
Figure 4-9. Field Enclosure 8 (Metal), Bottom Cover, Cable Entry Area
18
89
3.5
50 Top Entrance Area*

550 2.0
21.6
178
7.0
600
23.6
Front
* The customer is responsible for size, location, creation, and
watertight integrity of all conduit holes in the top cover.
Figure 4-10. Field Enclosure 8 (Metal), Top Cover Cable Entry Area
FE8 Specifications
Metal Enclosures (PSS 21H-5C1 B3), or to Molded Structural Foam Enclosures (PSS 21H-5B1 B3),
or to the appendixes in this document.
Additional specifications for the FE8 follow.
enclosure.
Heat Dissipation: 544 BTU per hour, maximum. The maximum (calculated) heat dissipated by
an FE8 is for worst case loading with components.
Heat Generated: 204 BTU per hour. Heat generated by a typical FE8 configuration of power
modules.
Height (Structural Foam Enclosure):
Floor Mounted: 1241 mm (48.88 in)
Wall mounted: 1184 mm (46.63 in).
19
FE8 Heaters
The extended temperature range versions of Field Enclosure 8 contain heaters that require sepa-
rate power inputs directly from the customer’s power source.
The power requirements for these heaters are as follows:
♦ Field Enclosure 8 (four daisy-chained heaters)
♦ Voltage: 120 or 240 V ac
♦ Consumption (total): 520 W.
NOTE
The heater elements contain over-temperature fusible links that prevent a failure
from overheating the enclosure.
FE8 Power Distribution

Figure 4-11 shows the typical power distribution for Field Enclosure 8.
L Field
ac/dc Main N Enclosure 8
E JB
(Primary)
L
ac/dc Main N JB
(Secondary) E
L
110/220 V ac N JB Heaters
E ** **
from Circuit
Breaker Panel
for Heater
Power only. PST
+
External Battery
Backup* –

PST = Optional Power and Status Tap. (Status-Only Tap
available with Non-Stop Power Configuration).

** Provided only with Extended Temperature Option.
Figure 4-11. Field Enclosure 8 Power Distribution, Typical
20
5. Industrial Enclosure 16 (IE16)
In this section is information on mounting, specifications, heaters, and power distribution for
Industrial Enclosure 16 (IE16).
IE16 Mounting
Industrial Enclosure 16 may only be floor mounted, which requires installing an elastomeric gas-
ket [supplied with enclosure(s)] between the bottom plate and the bottom of the enclosure base.
The customer is responsible for the size, location, creation, and sealing of any required cable pen-
etration area(s) in the bottom plate.
NOTE
E-size through L-size processors and Server 70 processors cannot fit or be used in an
IE16.
Figure 5-1 and Figure 5-2 show the floor-mounting outline dimensions for the IE16.
NOTE
IE16.
453.4
17.85
76.2 22.53
22.23 0.887
0.875 3.0
14.22 565.2
0.560 Dia. 22.25
Holes
282.58
6 Places 11.125
301
11.85
Front
Figure 5-1. Industrial Enclosure 16, Mounting (Floor Mounting for Vented or Sealed)
21
B0193AB – Rev V 5. Industrial Enclosure 16 (IE16)
453.4
17.85
76.2 22.53
22.23 0.947
0.935 3.0
14.22 565.2
0.560 Dia. 22.25
Holes 282.58
6 Places
11.125
301
11.85
Front
NOTES:
1. This plate is used only when enclosure is sealed.
2. Factory cut holes are shown. The customer is responsible for the size, location, and creation
of all conduit holes.
Figure 5-2. Industrial Enclosures 16 (Sealed), Mounting (Bottom Plate)
IE16 Floor Cutouts

Figure 5-3 details the recommended dimensions and relative location of the floor cutout for the
IE16.
58.4 335.3
2.3 13.2
Cutout* 304.8
12.0
152.4
6.0
Front
* Cutout not through the top of the enclosure.
Figure 5-3. Industrial Enclosures 16, Floor Cutout
22
5. Industrial Enclosure 16 (IE16) B0193AB – Rev V
IE16 Top Entry Panels

The overhead cable-entry into IE16 is either through a top plate or a top-mounted conduit cap. If
the enclosure is sealed, entry is through a top plate. If the enclosure is vented, entry is through a
vented conduit cap.
! CAUTION
If the enclosure is sealed, the customer must provide and use watertight fittings at
all conduit holes in the plate. If the enclosure is vented, the customer must equip
the conduits with condensation traps to prevent drainage into the top of the
enclosure.
Figure 5-4 and Figure 5-5 detail the usable cable feed-through area within the cover (on plate)
including the dimensions.
92.7 312.4
3.65 12.3
Top Plate*
228.6
9.0
Conduit Area
190.8
7.5
Front
* The customer is responsible for size, location, creation, and watertight integrity of all holes in the
top plate. (The rim of the top plate contains factory cut holes that are used for attaching the plate to
the enclosure.)
Figure 5-4. Industrial Enclosures 16, Top Entry Panels (Sealed)
23
91.4 99 195.6 99
3.6 Top Vent 3.9 7.7 3.9
Area
Vented
Conduit Cap* Conduit
Area** 401.3 462.3
(Each Side) 15.8 18.2
320
12.6
Top Vent Vented

Top Vented
Area Conduit
Caps*
Front
* The customer is responsible for the size, location, and creation of all conduit holes in the conduit
caps. Each conduit cap attaches to the vented top and to the enclosure using factory provided
securement points and associated hardware.
** Maximum hole size allowed is 63.5 mm (2.5 in); 3 max. size holes allowed per conduit cap.
Figure 5-5. Industrial Enclosures 16, Top Entry Panels (Vented)
IE16 Specifications
Molded Structural Foam Enclosures (PSS 21H-5B1 B3), or to the appendixes in this document.
Additional specifications for the IE16 follow.
enclosure.
Heat Dissipation: 1088 BTU Per Hour, maximum. The maximum (calculated) heat dissipated
by an IE16 is for worst case loading with components.
Heat Generated: 408 BTU per hour. Heat generated by a typical IE16 configuration of power
modules.
Height (Structural Foam Enclosure):
Floor Mounted: 1241 mm (48.88 in)
Wall mounted: 1184 mm (46.63 in).
Calculating Heat Dissipation

The heat dissipation for an Industrial Enclosure 16 configured with seven Fieldbus modules and
two processor modules is calculated as follows:
Total BTU/hour = 408 + (9x42.5) = 790.5
24
IE16 Power Distribution

Figure 5-6 shows the typical power distribution for the IE16.
L Industrial
N Enclosure 16
ac/dc Main JB
(Primary) E
L
ac/dc Main N
E JB
(Secondary)
PST
+
External –
Battery
Backup*
* Not applicable to Non-Stop Power Configuration
JB = Junction Box, 2 (maximum) per input.
PST = Optional Power and Status Tap. (Status-Only Tap
available with Non-Stop Power Configuration.)
Figure 5-6. Power Distribution, Typical (Industrial Enclosure 16)
25
26
6. Industrial Enclosure 32 (IE32)
In this section is information on mounting, top entry panels, specifications, and power
distribution for Industrial Enclosure 32 (IE32).
IE32 Mounting
Industrial Enclosure 32 may only be floor mounted. Floor mounting of Industrial Enclosure 32
and Multiple (Bridged) Industrial Enclosures 32 requires installing an elastomeric gasket [sup-
plied with enclosure(s)] between the bottom plate and the bottom of the enclosure base. The cus-
tomer is responsible for the size, location, creation, and sealing of any required cable penetration
area(s) in the bottom plate.
NOTE
Server 70 processors and the Model P80 workstation cannot fit in an IE32.
Figure 6-1 through Figure 6-8 show the outline dimensions and clearance requirements for the
IE32.
NOTE
IE32.
27
IE32 Single Enclosure
Floor Mounting
Clearance dimensions for the IE32 enclosure floor mounting are shown in Figure 6-1 and
Figure 6-2.
453.4
17.85
22.23 76.2 22.53
0.875 3.0 0.887
14.22 565.2
0.560 Dia. 22.25
Holes 282.58
6 Places
11.125
301
11.85
Front
Figure 6-1. Industrial Enclosure 32 (Sealed or Vented), Mounting (Floor Mounting)
453.4
17.85
76.2 22.53
22.23 0.947
0.935 3.0
14.22 565.2
0.560 Dia. 22.25
Holes 282.58
6 Places 11.125
301
11.85
Front
NOTES:
1. This plate is used only when enclosure is sealed.
2. Factory cut holes are shown. The customer is responsible for the size, location,
and creation of all conduit holes.
Figure 6-2. Industrial Enclosure 32 (Sealed), Mounting (Bottom Plate)
28
Floor Cutout
Clearance dimensions for the IE32 enclosure floor cutout are shown in Figure 6-3.
58.4 335.3
2.3 13.2
304.8
Cutout* 12.0
152.4
6.0
Front
* Cutout not through the top of the enclosure.
Figure 6-3. Single Industrial Enclosures 32, Floor Cutout
IE32 Two Bridged Enclosures
Floor Mounting
Clearance dimensions for two bridged IE32 enclosures’ floor mounting are shown in Figure 6-4.
1247.1
49.1
22.23 76.2 340.36 76.2 22.53

0.875 3.0 13.5 3.0 0.887
565.2
22.25
14.22 Dia.
0.560 282.58
Hole 11.125
12 Places
76.2 301 301 76.2

3.0 11.85 11.85 3.0
NOTE: Bottom Plates are required. Front Bridging structure does not
secure to floor.
Figure 6-4. Two (Bridged) Industrial Enclosure 32 (Vented or Sealed), Floor Mounting
29
Floor Cutouts
Clearance dimensions for two bridged IE32 enclosures’ floor cutout are shown in Figure 6-5.
Cutout * Cutout *
304.8
12.0
152.4
6.0
58.4 335.3 459.7 335.3

2.3 13.2 18.1 13.2
* Cutouts not required when cable entry is
Front through the top of the enclosures.
Figure 6-5. Two (Bridged) Industrial Enclosures 32, Floor Cutout
IE32 Three Bridged Enclosure
Floor Mounting
Clearance dimensions for three bridged IE32 enclosures’ floor mounting are shown in Figure 6-6
and Figure 6-7.
Clearance for Access

196.9
7.75
412.8
16.25
609.6
24.0
412.8
16.25
400 412.8 381.8 412.8 381.8 412.8 400

15.75 16.25 15.03 16.25 15.03 16.25 15.75
Add 794.4 mm (31.3 in) to length for each additional bridged enclosure
Figure 6-6. Three (Bridged) Industrial Enclosure 32, Outline and Clearance (Vented or Sealed)
30
2041*
80.4
22.23 76.2 340.36 76.2 340.36 76.2 22.53
0.875 3.0 13.5 3.0 13.5 3.0 0.887
14.22 565.2
0.560 22.25
Dia.
Hole
18 Places
282.58
11.125
76.2 301 76.2 301 301 76.2

3.0 11.85 3.0 11.85 11.85 3.0
Front
Bridging Structures Do Not
* Add 793.8 mm (31.25 in) to length for each Secure to Floor.
additional bridged enclosure. Bottom plates are
required.
Figure 6-7. Three (Bridged) Industrial Enclosure 32 (Sealed or Vented), Mounting
Floor Cutout
Clearance dimensions for three bridged IE32 enclosures’ floor cutout are shown in Figure 6-8.
304.8
12.0
152.4
6.0
335.3 459.7 335.3 459.7 335.3

13.2 18.1 13.2 18.1 13.2
Front * Cutouts Not Required
Figure 6-8. Three (Bridged) Industrial Enclosure 32, Floor Cutout
31
IE32 Top Entry Panels

The overhead cable-entry into IE32 and IE32 Multiple (Bridged) is either through a top plate or
a top-mounted conduit cap. If the enclosure is sealed, entry is through a top plate. If the enclosure
is vented, entry is through a vented conduit cap.
! CAUTION
enclosure.
Figure 6-9 and Figure 6-10 detail the dimensions of and the usable cable feed-through area within
the plate (or conduit cap).
92.7 312.4
3.65 12.3
Top Plate*
228.6
9.0
Conduit Area
190.8
7.5
Front
* The customer is responsible for size, location, creation, and watertight

integrity of all holes in the top plate. (The rim of the top plate contains factory
cut holes that are used for attaching the plate to the enclosure.)
Figure 6-9. Industrial Enclosure 32, Top Entry Panels (Sealed)
32
91.4 99 195.6 99
3.6 Top Vent 3.9 7.7 3.9
Area
Vented
Conduit Cap*
(Each Side) Conduit
Area** 401.3 462.3
15.8 18.2
320
12.6
Top Vent Vented Vented

Area Top Conduit
Caps*
Front
* The customer is responsible for the size, location, and creation of all conduit holes in the
conduit caps. Each conduit cap attaches to the vented top and to the enclosure using factory
provided securement points and associated hardware.
** Maximum hole size allowed is 63.5 mm (2.5 in); 3 max. size holes allowed per conduit cap.
Figure 6-10. Industrial Enclosure 32, Top Entry Panels (Vented)
IE32 Specifications
Molded Structural Foam Enclosures (PSS 21H-5B1 B3), or to the appendixes in this document.
Additional specifications for the IE32 follow.
Mass: The mass of Multiple (Bridged) Industrial Enclosures 32 is determined by multiplying the
quantity of the enclosures that are bridged together by the mass of a single, free-standing IE32;
one bridging structure directly replaces, and approximately equals the mass of two side doors (that
is, one door per bridge attachment position on each bridged enclosure). For example, the mass of
a Multiple (Bridged) IE32 that is comprised of three IE32s joined by two bridging structures is:
3x235 kg (396 lb) = 540 kg (1188 lb) for shipping mass, and 3x241 kg (531 lb) = 723 kg
(1593 lb) for maximum (loaded) mass.
Relative Humidity: 5 to 95%, noncondensing, at 30°C (86°F) dry bulb. Depends on the limits of
enclosure.
Heat Dissipation: IE32: 2176 BTU per hour, maximum. IE32 Bridged: 4352 BTU per hour,
maximum BTU per hour for two Industrial Enclosures 32 joined by one bridging structure; add
2176 BTU per hour for each additional bridged Industrial Enclosure 32.
Heat Generated: Heat generated by a typical IE16 configuration of power modules. IE32:
816 BTU per hour. IE32 Bridged: 1632 BTU per hour, BTU per hour for two bridged Industrial
Enclosures 32; add 816 BTU per hour for each additional bridged Industrial Enclosure 32.
Height: Cable entry via vented-top configuration: 2078 mm (81.8 in). All other configurations:
1956 mm (77 in).
33
IE32 Power Distribution

Figure 6-11 and Figure 6-12 show the typical power distribution for the IE32.
L Industrial
N Enclosure 32
ac/dc Main JB JB
(Primary) E
L
ac/dc Main N
JB JB
(Secondary) E
PST
External +
Battery –
Backup*


Figure 6-11. Industrial Enclosure 32 Power Distribution, Typical
Multiple (Bridged) Industrial

Enclosures 32
L – External Battery
+ Backup*
ac/dc Main N JB JB PST
(Primary) E
L
ac/dc Main N
JB JB
(Secondary) E
L
ac/dc Main N JB JB
(Primary) E
L
ac/dc Main N
JB JB
(Secondary) E PST
– +
External Battery
Backup*

Figure 6-12. Multiple Industrial Enclosures 32 Power Distribution, Typical
34
7. NEMA 4/4X Hardened Enclosure
In this section is information on mounting, specifications, and power distribution for NEMA®
4/4X Hardened Enclosure.
NEMA 4/4X Hardened Enclosure Mounting

The hardened enclosure is floor mounted only, and requires a space of approximately
4 square meters (approximately 36 square feet). Although 20 cm (7.8 in) between the enclosure
and a wall is sufficient, Invensys Foxboro recommends that there be a clearance of approximately
70 cm (28 in) at each of the enclosure’s four sides to allow room to fully open the enclosure doors.
You must provide additional space so you can move around an enclosure when its doors are open.
For conduit entrance units, the customer is responsible for the size, location, creation, and sealing
of any required cable penetration area(s).
For the standard outline dimensions and clearance drawings refer to NEMA 4/4X Hardened
Enclosure (PSS 21H-4F1 B4).
NOTE
Processors, workstations and data storage devices can not be used in a NEMA4/4X.
Figure 7-1 shows the floor-mounting outline dimensions for the hardened enclosure.
NOTE
hardened enclosure.
35
B0193AB – Rev V 7. NEMA 4/4X Hardened Enclosure
DIMENSIONS – NOMINAL
100 100
4 4
185
20 7.25
Vortex Cooler * .8
Viewing
Window
300
1300 11.8
1600 51.2 Keyboard/Pointer
Shelf Rear
63
Air Conditioner *
1050
41
User Cable Port **
Power Port(s) **
100
3.9 Front View Side View
600 600
23.6 Rear 23.6
NOTE: This illustration does

not include the 4 lifting
eyebolts.
* NOTE: An enclosure can
have a vortex cooler or
an air conditioner, but
not both.
** NOTE: Only on
20 non- conduit systems.
.8
300
11.8
Bottom View
Figure 7-1. NEMA 4/4X Hardened Enclosure Outer Dimensions
36
7. NEMA 4/4X Hardened Enclosure B0193AB – Rev V
Hardened Enclosure Specifications

NEMA 4/4X Hardened Enclosure (PSS 21H-4F1 B4).
Additional specifications for the hardened enclosure follow.
Mass: The mass of the NEMA 4/4X hardened enclosure depends on whether it has been installed
with a vortex cooler, or an air conditioner. A NEMA 4/4X hardened enclosure installed with a
vortex cooler has a mass of 115 kg (253 lbs). A NEMA 4/4X hardened enclosure installed with an
air conditioner has a mass of 155 kg (341 lb). This assumes that the hardened enclosure does not
contain any equipment.
Relative Humidity: 100%. The NEMA 4/4X hardened enclosure is water-tight when properly
installed.
Vibration (g): 0.1 (5 to 200 Hz). The vibration specification for the enclosure must be set to
reflect the specification of the enclosed peripheral device and the amplification factor of the
enclosure.
Heat Dissipation: 2800 BTU per hour for a vortex cooler, or 2400 BTU per hour for an air con-
ditioner, maximum. The maximum (calculated) heat dissipated by a NEMA 4/4X hardened
enclosure is for worst case loading with recommended components. For the standard specifica-
tions (such as type of input air, or physical dimensions) refer to NEMA 4/4X Hardened Enclosure
(PSS 21H-4F1 B4).
Hardened Enclosure Power Distribution

These requirements are estimates. Exact values depend on your enclosure’s equipment.
Voltage: 120 or 240 V ac, +10%, -15%
Line frequency: 50 and 60 Hz (nominal), +-5%
ac Power: 1000 W (8 A at 120 V) maximum, running
For instructions and explanations of the NEMA 4/4X hardened enclosure power distribution sys-
tem, refer to System Equipment Installation (B0193AC), in the section “Connecting the Hardened
Enclosure to a Power Source.”
Hardened Enclosure Air Cooling Systems Power Requirements

For the complete specifications of the vortex cooler and air conditioner, refer to NEMA 4/4X
Hardened Enclosure (PSS 21H-4F1 B4).
Power Requirements
Additional specifications for the vortex cooler follow.
Power:
6.1 Watts.
For an enclosure configured with an air conditioner, use two separate 15 A (120 V ac)
circuits: one for the air conditioner, and one for the electronic equipment.
37
B0193AB – Rev V 7. NEMA 4/4X Hardened Enclosure
Additional specifications for the air conditioner follow.

Power:
Running: 6 A at 120 V, 4 A at 230 V
Starting surge: 35 A at 120 V, 15 A at 230 V
38
8. Metal Industrial Enclosures
IEMFA, IEMFR, and
Metal Termination Enclosure
In this section is information on mounting, specifications, and power distribution for Metal
Industrial Enclosures IEMFA, IEMFR, and Metal Termination Enclosure.
Metal Industrial Enclosures, Mounting

Metal Industrial Enclosures IEMFA (ME24), IEMFR (ME32), and Metal Termination Enclo-
sures are floor mounted enclosures.
For the standard outline dimensions and clearance drawings refer to Metal Enclosures
(PSS 21H-5C B3).
NOTE
Server 70 processors and the Model P80 workstation cannot fit in an ME16/24.
They fit in 800x800 enclosures.
Figure 8-1 shows the dimensions for the Metal Industrial Enclosures base.
NOTE
Metal Industrial Enclosures.
14.0
0.560 Dia. 800
31.5 50.0
(All Corners) 1.97
475 550
18.7 21.65
525 500
20.6 19.68
8.4
0.33 Dia.
Front
(9 holes each 600
side) 23.6
675
26.57
735
28.94
Figure 8-1. Metal Industrial Enclosures, IEMFA (ME24), IEMFR (ME32), and
Metal Termination Enclosure, Mounting
39
B0193AB – Rev V 8. Metal Industrial Enclosures IEMFA, IEMFR, and
Floor Cutouts
Figure 8-2, Figure 8-3, and Figure 8-4 detail the recommended dimensions and relative location
of the floor cutout for the enclosure.
155
Cable Access 6.1 115
Cover With 4.54
NEMA 4 Seal
320
12.6
Conduit Fitting 77
Zone 3.04
Front
Figure 8-2. Metal Industrial Enclosures, IEMFA (ME24) and IEMFR (ME32), Bottom Cover,
Cable Entry Area (Sealed Version)
Cable Entry
Plates* Plate Fasteners
183
* 4 equal sized slide-over or
7.2
removable plates
Front
Figure 8-3. Metal Industrial Enclosures, IEMFA (ME24) and IEMFR (ME32), Bottom Cover,
Cable Entry Area (Vented Version)
40
8. Metal Industrial Enclosures IEMFA, IEMFR, and Metal Termination Enclosure B0193AB – Rev V
Callout Area Allowed

Anywhere within Plate, Per
Discretion of Customer*
Front
* The customer is responsible for size, location,
creation, and water-tight integrity of all conduit
holes in the bottom cover.
Figure 8-4. Termination Enclosure (Metal), Bottom Cover, Cable Entry Area (Sealed Version)
Cable Entry
Plates*
Plate Fasteners
* 3 equal sized slide-over or

removable plates
Front
Figure 8-5. Termination Enclosure (Metal), Bottom Cover, Cable Entry Area (Vented Version)
41
Top Entry Panels

Depending on the configuration, the overhead cable-entry into ME24 and ME32 (IEMFA,
IEMFR), and Termination Enclosure (Metal) is either through a top plate or a top-mounted con-
duit cap. If the enclosure is sealed, entry is through a top plate. If the enclosure is vented, entry is
through a vented conduit cap.
! CAUTION
enclosure.
Figure 8-6 and Figure 8-7 detail the usable cable feed-through area within the plate (or
conduit cap). Figure 8-6 includes dimensions.
115 Fan Air 115

155 4.54 155 4.54
Exhaust
6.1 6.1
320 320
12.6 12.6
Top 77 Cable 77
Entrance 3.04 Access 3.04
Area* Cover
Front With Seal Front
* The customer is responsible for size, location,
creation, and water-tight integrity of all holes in
the top plate.
Sealed Version Vented Version
Figure 8-6. Metal Industrial Enclosures, IEMFA (ME24) and IEMFR (ME32), Top Cover,
Cable Entry Area (Dimensions)
42
8. Metal Industrial Enclosures IEMFA, IEMFR, and Metal Termination Enclosure B0193AB – Rev V
Callout Area Allowed

Anywhere within Plate Per Fan Air
Discretion of Customer* Vent
Cable Access
Area May Be
Anywhere In
Top Cover,
Around Air
Vent.
Front Front Customer Is

Responsible
* The customer is responsible for size location, For Size, &
creation and water-tight integrity of all holes in Location of
the top plate.
Cable Access
Sealed Version Vented Version
Figure 8-7. Termination Enclosure (Metal), Top Cover, Cable Entry Area
Metal Industrial Enclosures Specifications

For the standard specifications (such as, operating temperature range, contamination class, and so
forth) refer to Metal Enclosures (PSS 21H-5C1 B3), or to the appendixes in this document.
Additional specifications for the ME24/32 follow.
Location: CSA Ordinary Locations.
enclosure.
Heat Dissipation: See “Calculating the Actual Heat Dissipated” on page 6.
Heat Generated: Table 8-1 specifies the maximum thermal loading capacity (in watts) of each
enclosure.
Table 8-1. Thermal Loading
Maximum Thermal
Enclosure Name/Description Loading1 (Watts)
Metal Industrial Enclosure, Front Access Fully Loaded 378 Watts
Metal Industrial Enclosure, Front/Rear Access Fully Loaded 500 Watts
1.
The indicated watts (of thermal energy) are in addition to the heat generated
by fans and power supplies.
43
Power Distribution
Figure 8-8 shows the typical power distribution for the IEMFA (ME24), and IEMFR (ME32)
Enclosures.
JB = Junction Box.
PST = Optional Power and Status Tap.
(Status-Only Tap available with
IEMFA or Non-Stop Power Configuration).
L IEMFR
ac/dc Main N Enclosure
(Primary) E
JB
L
ac/dc Main N
(Secondary) E
PST
+
External Battery
– * Not applicable to non-stop power configurations.
Backup*
Figure 8-8. IEMFA (ME24) and IEMFR (ME32), Power Distribution, Typical
44
9. Modular Industrial Workstation
(MIW)
In this section is information on mounting, floor cutouts, specifications, and power distribution
for Modular Industrial Workstation (MIW).
MIW Mounting
Modular Industrial Workstation Bay(s) can only be floor mounted. The Modular Industrial
Workstation spacer does not contact the floor and must be supported at each end by a bay.
For the standard outline dimensions and clearance drawings refer to Modular Industrial
Workstations (PSS 21H-4D3 B4).
NOTE
Server 70 processors and the Model P80 workstation cannot fit inside an MIW.
They can be located on a tabletop surface of the MIW or in a separate enclosure.
Installation instructions for the MIW are located in Modular Industrial Workstation Installation
(B0193CE).
NOTE
MIW.
The arrangements in Figure 9-1 are presented as examples only; others are possible. The actual
arrangement and determination of the associated overall outline dimensions are the customer’s
responsibility.
45
B0193AB – Rev V 9. Modular Industrial Workstation (MIW)
2 Bays 3 Bays
Straight
Straight and Curved Combinations

2 Bays + 1 Spacer 5 Bays + 2 Spacers
5 Bays + 2 Spacers 5 Bays + 1 Spacer
Figure 9-1. MIW, Outline and Clearance (Sample Arrangements)
Small Workstation
Figure 9-2 shows the base mounting dimensions for a small (single) workstation.
649
25.55
111.3
4.38 609 20
23.98 0.79
690 467.6
27.17 18.41
Front
Figure 9-2. Typical Modular Industrial Workstation Bay, Mounting
46
Large Workstations
Figure 9-3 show an example of the base mounting dimensions for a large workstation
configuration.
40 559.6
1.58 22.03
20 325.9
0.79 609 609 12.83
111.3 23.98 23.98
4.38
150
467.6 5.9
18.41
111.3
4.38
13.2 Diameter Hole 467.6

0.52 20
(12 Places) 0.79 18.41
609
23.98
NOTE: The actual arrangement and determination of the associated over-

all mounting dimensions can be extrapolated from these dimensions.
Figure 9-3. Example of Large Modular Industrial Workstation, Mounting
MIW Floor Cutouts

Figure 9-4 details the recommended dimensions and relative location of the cutout for each floor-
mount MIW Bay.
482.6
19.0
69.9 127
2.75 5.0
381
15.0 Cutout 127 Diameter Hole (3 Places)
5.0
Front
Bay – Typical
Figure 9-4. Modular Industrial Workstation, Floor Cutout
47
B0193AB – Rev V 9. Modular Industrial Workstation (MIW)
MIW Specifications
For the standard specifications (such as, operating temperature range, contamination class) refer
to Modular Industrial Workstations (PSS 21H-4D3 B4), or to the appendixes in this document.
Additional specifications for the MIW follow.
Operating Environment: The operating environment for the 1x8 mounting structure is deter-
mined by the limits of the modules contained within it. Contamination class and operating tem-
perature range of the Modular Industrial Workstation depend solely on the limits of the devices
(such as, processor modules, disk drives) contained in the workstation.
the processors and modules contained in the structure.
Vibration (g): < 0.05 (5 to 200 Hz). The vibration specification for the enclosure must be down-
enclosure.
Heat Dissipation: The heat dissipation of a Modular Industrial Workstation is, as applicable,
determined by the dissipation of the following:
♦ 1x8 mounting structure(s) including the modules within
♦ Workstation display(s)
♦ Disk drive(s).
See “Calculating the Actual Heat Dissipated” on page 6.
MIW Power Distribution

Figure 9-5 shows the typical power distribution for Modular Industrial Workstation.
Workstation Bay MS = 1x8 Mounting Structure.

L (Status-Only Tap available with
From Power N JB To Workstation Non-Stop Power Configuration.)
Source E Displays**
Outlet
L
L
N ac/dc Main
ac/dc Main N
(Primary) E E (Primary)
JB JB L
L
ac/dc Main N N ac/dc Main
(Secondary) E E (Secondary)
MS** MS**
* Not applicable to Non-Stop Power
PST
Configuration.
+ ** When applicable.
External
Battery –
Backup* NOTE: Some configurations use the MS
junction box(es) for power connections
to Workstation Displays.
Figure 9-5. Power Distribution, Typical (Workstation Bay)
48
10. Modular Industrial Console
(MIC)
In this section is information on mounting, floor cutouts, specifications, and power distribution
for Modular Industrial Console (MIC).
MIC Mounting
Modular Industrial Console Bay(s) are floor mounted. The Modular Industrial Console spacers
do not contact the floor and must be supported at each end by a bay.
For the standard outline dimensions and clearance drawings refer to Modular Industrial Console
(PSS 21H-4D2 B4).
Assembly instructions for the MIC are located in Modular Industrial Console Assembly (B0193XF).
Instructions for populating and supplying power to the MIC are located in Modular Industrial
Console Installation (B0193UV).
NOTE
MIC.
Figure 10-1 provides examples of different arrangements of Modular Industrial Console bays,
used alone and in conjunction with the Modular Industrial Console spacers. The arrangements in
this figure are presented as examples only; others are possible. The actual arrangement and deter-
mination of the associated overall outline dimensions are the customer’s responsibility.
NOTE
Server 70 processors cannot fit in a MIC. They mount on the table top surface of
the MIC.
49
B0193AB – Rev V 10. Modular Industrial Console (MIC)
Spacer Sections
30° Wedge 30° Wedge 14-inch Straight 14-inch Straight 14-inch Straight
for Peripherals for Minitowers Spacer for Peripherals Spacer for Minitowers Spacer with Flat
Worksurface
Straight Combinations
2 Bays 3 Bays 3 Bays + 1 Straight Spacer
Straight and Curved Combinations

3 Bays + 1 30° Spacer 5 Bays + 2 30° Spacers 5 Bays + 1 30° Spacer +
1 Straight Spacer
5 Bays + 2 30° Spacers 5 Bays + 1 30° Spacer 5 Bays + 2 30° Spacers +

1 Straight Spacer
Figure 10-1. MIC, Outline and Clearance (Sample Arrangements)
Small Console
Figure 10-2 shows the outline dimensions and clearance requirements for a small (single)
console.
723.90
81.03 28.50
3.19
561.85
48.51
1.91 22.12 Floor Fastening
Bracket (Typical) 2 ea. Bay
746.51
29.39
424.94
16.73
Figure 10-2. Typical Modular Industrial Console Bay, Mounting
50
Large Consoles
Figure 10-3 shows an example of the outline dimensions and clearance requirements for a large
console configuration.
2631.69
704.85 103.61
Floor
27.75 Fastening
81.03
561.85 Brackets (Typ) 725.17 194.31
3.19
22.12 28.55 7.65
48.51
1.91
30°
746.51
29.39
1535.18
424.94
60.44
16.73
Figure 10-3. Example of Large Modular Industrial Console, Mounting
MIC Floor Cutouts

The MIC has open bay bottoms allowing power, signal, and field cables to be routed, with appro-
priate separation, at all four sides of the bottom into the console.
MIC Specifications
to Modular Industrial Console (PSS 21H-4D2 B4), or to the appendixes in this document.
Additional specifications for the MIC follow.
mined by the limits of the modules contained within it. Contamination class and operating tem-
perature range of the MIC depend solely on the limits of the devices (for example, Processor
modules, or disk drives) contained in the workstation.
Vibration (g): < 0.05 (5 to 200 Hz). The vibration specification for the enclosure must be down-
enclosure.
51
B0193AB – Rev V 10. Modular Industrial Console (MIC)
Heat Dissipation: The heat dissipation of a Modular Industrial Console is, as applicable, deter-
mined by the dissipation of the following:
♦ 1x8 mounting structure(s) including the modules within
♦ Workstation display(s)
♦ Disk drive(s).
See “Calculating the Actual Heat Dissipated” on page 6.
MIC Power Distribution

Figure 10-4 shows the typical power distribution for MIC.
Workstation Bay MS = 1x8 Mounting Structure.

L (Status-Only Tap available with
From Power N JB To Workstation Non-Stop Power Configuration.)
Source E Displays**
Outlet
L L
(Primary) E E (Primary)
JB JB
L L
(Secondary) E E (Secondary)
MS** MS**
PST
+
External –
Battery * Not applicable to Non-Stop Power Configuration.
Backup* ** When applicable.
NOTE: Some configurations use the MS junction box(es)
for power connections to Workstation Displays.
Figure 10-4. Power Distribution, Typical (MIC Bay)
52
11. Other Enclosures
In this section is information on other enclosures including Fieldbus Cluster I/O and Fiber
Optic LAN Enclosures.
Fieldbus Cluster I/O Enclosures

For the standard outline dimensions, clearance drawings, and specifications refer to the following:
♦ Fieldbus Cluster I/O Subsystem (PSS 21H-2T1 B3)
♦ Fieldbus Cluster I/O User’s Guide (B0193RB).
Fiber Optic LAN Enclosures

For the standard outline dimensions, clearance drawings, and specifications refer to the
following documents:
♦ Local Area Network (PSS 21H-7F1 B3)
♦ Fiber Optic LAN Converter (PSS 21H-7F3 B4)
♦ Network Cable Systems Planning (B0193UX).
53
B0193AB – Rev V 11. Other Enclosures
54
12. Mounting Structures and
Industrial Power Modules
The 19-inch 1x8 and 1x8 FBM mounting structures (MS), and Modular Mounting Structures
(MMS) which can be installed in customer-supplied enclosures or Invensys Foxboro Metal
Industrial Enclosures are described in this chapter. Industrial Power Modules, which are used
in 1x8 and 1x8 FBM MSs and Invensys Foxboro enclosures, and the 1x12 FBM mounting
structure packages are also described in this chapter.
NOTE
modular mounting structures.
1x8 and 1x8 FBM Mounting Structures

Outline and Dimensions
For the standard outline dimensions and clearance drawings refer to 1x8 Mounting Structure and
1x8 FBM Mounting Structure (PSS 21H-5B9 B4).
Figure 12-1 and Figure 12-2 show the outline dimensions and clearance requirements for the 1x8
and 1x8 FBM MSs excluding equipment designed to reside exclusively within a mounting struc-
ture or enclosure.
55
B0193AB – Rev V 12. Mounting Structures and Industrial Power Modules
297.2 Clearance for Module

11.7 Heat Exchangers
127 12.7
63.5 266.7
5.0 10.5 5.0
2.5
266.7
10.5 265.4
Front
10.45
457.2 Clearance for

Clearance for Module
18 Module Removal
Heat Exchangers
447 Clearance for Front of

17.6 Modules
482.6
19
Top View Side View

Front
Figure 12-1. 1x8 and 1x8 FBM Mounting Structures, Outline and Clearance (Side View)
297.2
11.7
Heat Exchangers
(Chimney Area)
Customer-Supplied
Rack * 127
1 x 8 or 1 x 8 FBM 5.0
Mounting Structure
Clearance for
Front of Modules
(Minimum with 101.6 63.5

Front Door) ** 4.0 2.5
Front
* Standard 482.6 mm (19 in) wide frame
** 0.0 mm (0.0 in) without door.
Figure 12-2. 1x8 and 1x8 FBM Mounting Structures, Outline and Clearance (Top View)
56
12. Mounting Structures and Industrial Power Modules B0193AB – Rev V
1x8 and 1x8 FBM MS Mounting Options

The 1x8 and 1x8 FBM MS can be mounted in a rack, MIW/MIC, FE8, and Metal Industrial
Enclosures.
Rack mounting of the 1x8 MS requires the following customer-supplied items:
1. Standard 483 mm (19 in) wide equipment frame.
2. Symmetrical mounting rail; 35 mm (1.378 in) wide (DIN type 46277 Part 3). The
rail is used to mount the Termination Cable Assembly connector blocks associated
with Fieldbus modules. The rail length required is determined by multiplying by
50.8 mm (2.0 in) the total number of discrete wire connector blocks used and multi-
plying by 27.9 mm (1.1 in) the total number of plug connector blocks used.
3. Forced (that is, fan-powered) air circulation at a volumetric rate of 0.085 cubic meters
(3 cubic feet) per second (that is, a speed of 3 m (10 ft) per second) is recommended
to ensure adequate cooling of the modules.
Rack mounting the 1x8 FBM MS requires the following customer-supplied items:
1. Standard 483 mm (19 in) wide equipment frame mounted in wider rack.
2. Symmetrical mounting rail, 35 mm (1.378 in) wide (DIN type 46277 Part 3). The
rail is used to mount the Termination Cable Assembly connector blocks associated
with Fieldbus modules. The rail length required is determined by multiplying by
50.8 mm (2.0 in) the total number of discrete wire connector blocks used and multi-
plying by 27.9 mm (1.1 in) the total number of plug connector blocks used.
Mounting dimensions for the 1x8 and 1x8 FBM MS are shown in Figure 12-3 through
Figure 12-6.
228.2 266.7
9.0
10.5
171
6.73
95.25
3.75
37.7 460.2
1.48 18.1
482.6
19.0
Figure 12-3. 1x8 and 1x8 FBM Mounting Structures, Mounting (Front View)
57
Access Panel
(Recommended)
1x8 Mounting Structure

Customer-Supplied Rack
266.7
10.5
13.97
0.55
101.6
4.0 With Door
13.97 Without Door 482.6

0.55 19.0 Door
Front
Figure 12-4. 1x8 and 1x8 FBM Mounting Structures, Mounting (Top View)
Module Front Heat MS

Exchanger
25.4 Module Rear Heat
558.8 1.0 TYP. Exchanger
22.0 266.7 RP TCA Discrete
10.5 MS Block with 1
RP
Customer-Supplied
Rack (2EZ, AMCO or
Equivalent)
850.9 266.7 RP TCA Discrete
Block with 2
33.5 10.5 RPs
266.7 RP
10.5 MS Rear
558.8
22.0 266.7 UP TCA Discrete MS = 1x8 Mounting Structu
Block with 1
10.5 RP RP = Rack Panel
TCA = Termination Cable
Assembly
Figure 12-5. 1x8 and 1x8 FBM Mounting Structures, Mounting (Side View, Example 1)
58
Module Front Heat

Exchanger MS
25.4 TYP. Module Rear Heat

469.9 1.0 Exchanger
18.5 177.8 RP TCA Bulk
Connection
7.0 MS with 1 RP
Customer-Supplied
Rack (2EZ, AMCO,
or Equivalent)
673.1 177.8 RP
26.5 TCA Bulk
7.0 Connection
RP with 2 RPs
177.8
7.0 MS Rear
469.9
18.5 177.8 RP TCA Bulk
7.0 Connection MS = 1x8 Mounting Structure
with 1 RP RP = Rack Panel
TCA = Termination Cable
Assembly
Figure 12-6. 1x8 and 1x8 FBM Mounting Structures, Mounting (Side View, Example 2)
1x8 and 1x8 FBM MS Specifications

For the standard 1x8 and 1x8 FBM specifications (such as, operating temperature range, contam-
ination class), refer to 1x8 Mounting Structure and 1x8 FBM Mounting Structure (PSS 21H-5B9
B4), or to the appendixes in this document.
Additional specifications for the 1x8 and 1x8 FBM MSs follow.
mined by the limits of the modules contained within it.
NOTE
If the 1x8 MS is located in the lower part of an MIC/MIW bay, and a personal
workstation (PW) is also included in the MIC/MIW, the power loading for the
1x8 MS is limited to 60 W.
Vibration (g): 0.5 (5 to 200 Hz). The vibration specification must be downgraded to reflect the
specification for the enclosed devices and the amplification of the enclosure.
Industrial Power Modules

For the standard Industrial Power Modules (IPMs) specifications (such as, operating temperature
range, contamination class, and so forth), refer to Industrial Power Modules (PSS 21H-5D1 B4),
or to the appendixes in this document.
Additional specifications for the IPMs follow.
IPM ac Harmonic Distortion: 10%, up to third harmonic.
59
IPM dc Voltage Tolerance:
Table 12-1. IPM dc V Tolerance Specifications
dc Voltage Tolerance as
applicable at 24 or 125 V dc
Name (nominal) (%)
Industrial Power Module 02 ± 20
Industrial Power Module 03A ± 20
Industrial Power Module 03D ± 16
Industrial Power Module 04 -16, +20
Industrial Power Module 05 ± 16
Industrial Power Module 06A, 06D ± 20
IPM Electromagnetic Interference: The parameters for the electromagnetic interference (EMI)
environment are radio frequency interference (RFI) susceptibility, electrostatic discharge (ESD),
high-frequency transients (HFT), switching/indirect lightning (S/IL) transients, and surge with-
stand capability (SWC) for damped oscillatory surges. Table 12-1 and Table 12-1 contain the spec-
ifications for these parameters for I/A Series IPMs.
Table 12-2. IPM RFI, ESD and HFT Specifications
RFI1 ESD2 (kV) HFT3 (kV)

Sustained
Name/Description (V/m) S1 S2 Power
Industrial Power Modules 10 8 4 2.0
Wide Input Power Module 10 8 4 2.0
1.
RFI = radio frequency interference susceptibility for the frequency range of 27 to
1000 MHz.
2.
ESD = electrostatic discharge (reference IEC 801-2); S1 = operator accessible surface;
S2 = any other surface.
3.
HFT = high frequency transients (reference IEC 801-4); Power = main power lines.
60
Table 12-3. IPM S/IL Transient and SWC Specifications
S/IL1
Transients (kV) SWC2 (kV)
Equipment
Name Power Power
Industrial Power Modules 2 2.5
Wide Input Power Modules 2 2.5
1.
S/IL = switching/indirect lightning; Power = main power lines (reference
IEC 801-5 and ANSI/IEEE C62.41 – 1980).
2.
SWC = surge withstand capability for 1 MHz damped oscillatory wave
(reference ANSI/IEEE C37.90 – 1978); Power = main power lines.
1x12 FBM Mounting Structure Packages

The 1x12 FBM mounting structure provides slots, power connections, and communications con-
nections for twelve Fieldbus modules. This structure is included as part of two packages, which
also include all necessary equipment to support the FBMs:
♦ 1x12 FBM Configurable Mounting Structure Kit (includes up to five 1x12 FBM
mounting structures)
♦ Fieldbus Module Metal Enclosure 60 (includes five 1x12 FBM mounting structures in
a specially-designed metal enclosure).
Refer to 1x12 Fieldbus Module Configurable Mounting Enclosure Kit Installation and Wiring
Instructions (B0400PK) for a complete overview and installation procedures for these packages.
Outline and Dimensions

For the standard outline dimensions and clearance drawings refer to 1x12 FBM Configurable
Mounting Structure Kit (PSS 21H-5B2 B4), and Fieldbus Module Metal Enclosure 60
(PSS 21H-5C1 B4).
Figure 12-7 show the outline dimensions and clearance requirements for the 1x12 FBM mount-
ing structures excluding the Fieldbus modules.
61

Heat Exchangers
411
16.2 74.4 275.0 110
110 2.9 10.9 4.3
4.3
275.0
266.0
10.9 Front
10.45
406 Clearance for

Module Removal Clearance for Module
16 Heat Exchangers
Clearance for Front of

427 Modules
482.6 16.8
19.0
Top View Side View
Front
Figure 12-7. 1x12 FBM Mounting Structure, Outline and Clearance (Side View)
1x12 FBM Mounting Structure Mounting Options

The 1x12 FBM Configurable Mounting Structure Kit must be installed in a vented metal enclo-
sure which meets the requirements listed in 1x12 Fieldbus Module Configurable Mounting Enclo-
sure Kit Installation and Wiring Instructions (B0400PK).
The Fieldbus Module Metal Enclosure includes a 800 x 800 x 2000 mm (31.5 x 31.5 x 86.6 in)
vented metal enclosure which contains five 1x12 FBM mounting structures and all equipment
required to provide power and communications for up to 60 FBMs.
Mounting dimensions for the 1x12 FBM mounting structure are shown in Figure 12-8.
228.2
9.0 192 266
7.5 10.45
460.2
37.7 18.1
1.48
482.6
19.0
Figure 12-8. 1x12 FBM Mounting Structures, Mounting (Front View)
62
1x12 FBM MS Specifications

For the standard 1x12 FBM specifications (such as, operating temperature range, contamination
class), refer to 1x12 FBM Configurable Mounting Structure Kit (PSS 21H-5B2 B4), and Fieldbus
Module Metal Enclosure 60 (PSS 21H-5C1 B4).
Additional specifications for the 1x12 FBM MSs follow.
Mass: 4.95 kg (10.9 lb) maximum when empty.
Operating Environment: The operating environment for the 1x12 FBM mounting structure is
determined by the limits of the modules contained within it.
Vibration (g): 0.5 (5 to 200 Hz). The vibration specification must be downgraded to reflect the
specification for the enclosed devices and the amplification of the enclosure.
Shock (Normal Operating Conditions): 0.5 g peak for 11 milliseconds.
Shock (Transportation and Storage Limits): 10 g peak for 11 milliseconds.
Modular Mounting Structures

For the standard Modular Mounting Structures (MMS) outline dimensions and clearance
requirements and specifications, refer to 19-Inch Modular Mounting Structure Assembly
(PSS 21H-5B4 B4).
MMS Outline and Dimensions

Figure 12-9 shows the outline dimensions and clearance requirements for the mounting structures
(MMS and 2xMMS) excluding equipment designed to reside exclusively within a mounting
structure or enclosure.
6.1
Clearance for 0.24
Rear Module
258.0
10.16 Top View
Clearance for
Modular Module
264.0
10.4 428.2
16.86
482.6
19.00
Front
Figure 12-9. 50 Series 19-Inch Modular Mounting Structure (MS and 2xMMS),
Outline and Clearance
63
MMS Mounting Options

The MMS can be mounted in a standard 483 mm (19-inch) rack or in a vented I/A Series Indus-
trial Metal Enclosure.
Rack mounting of the MMSs requires the following customer-supplied items:
a. Standard 483 mm (19 in) wide equipment frame mounted in wider rack.
b. Forced (fan-powered) air circulation at a volumetric rate of 0.085 cubic meters
(3 cubic feet) per second (that is, a speed of 3 m [10 ft] per second) is required to
ensure adequate cooling of the A-size, B-size, C-size, D-size, E-size, H-size, G-size
processors and modules, and J-, K-, and L-size Ethernet switches.
NOTE
19-inch MMS houses A- or B-size modules. 2xMMS houses A-size, B-size, C-size,
D-size, E-size, H-size, G-size processors and modules, and J-, K-, and L-size Ethernet
switches.
MMS Specifications
For the standard MMS specifications (such as, operating temperature range, contamination class),
refer to 19-Inch Modular Mounting Structure Assembly (PSS 21H-5B4 B4), or to the appendixes in
this document.
Additional specifications for the MMSs are:
Mass:
♦ MMS, 19-inch: 26 kg (58 lb) maximum
♦ 2xMMS, 19-inch: 52 kg (116 lb) maximum
NOTE
The maximum (calculated) mass of the mounting structures are for worst-case load-
ing with components (excluding the mass of customer-supplied power cables and
field signal wires).
64
13. Model P79 Workstation
This section provides information on the P79 workstation including its specifications,
environmental considerations, equipment and peripherals.
The P79 workstation can be mounted:
♦ as part of a Modular Industrial Console (MIC)
♦ as part of a Modular Industrial Workstation (MIW)
♦ as part of a Command Center
♦ on a desk/printer table, provided there is adequate space for the P79 base and cabling
♦ in 2xMMS mounting structures in enclosures.
♦ on a desk/printer table, provided there is adequate space for the P79’s base and
cabling.
Also, it can be placed on flat surfaces in commercially-available enclosures that have provisions for
adequate ventilation and cooling to ensure the ambient temperature inside the enclosure does not
exceed 95°F.
Figure 13-1 shows the maximum distances for connecting the following peripheral devices to the
P79 workstation:
♦ Mouse or trackball ♦ Annunciator and ♦ Touchscreens

annunciator/numeric keyboards
♦ Keyboard ♦ Serial and parallel printers ♦ RCNI/Ethernet switch
♦ Single or multi- ♦ Single or dual GCIOs ♦ AIT and/or RAID drives.
head monitors
The peripherals shown in Figure 13-1 are representative and specific models may be subject to
change.
NOTE
For hardware and software installation procedures for your P79 workstation, refer to
the Hardware Installation Instructions for P79 Workstation document included with
your processor.
65
RAID
66
AIT
SCSI Devices
1.2 m (3 ft)
2nd Monitor
B0193AB – Rev V
30 m (100 ft)
Serial Printers P8
P7
To ac
Power
P6 Monitor
or P5
P4
10.0 m (50 ft) P3
P2
P1
30 m (100 ft) 30 m (100 ft) Parallel Printers
Dual GCIO Set-up
or
15 m (50 ft)
RCNI
-610 mm (24 in) -610 mm (24 in)
91 m (300 ft)
or
-500 mm (20 in) -500 mm (20 in)
91 m (300 ft) Ethernet Switch
Figure 13-1. Distances for P79 Workstation Peripherals Connections

100M
COLLISION
1 2 3 4 5 6 7 8 To PC
FULL DUPLEX
To Hub
ACTIVITY
8 PORT ETHERNET SWITCH
LINK
POWER 1 2 3 4 5 6 7 8
X X X X X X X
Mouse Keyboard
-500 mm (20 in) -500 mm (20 in)
380 mm (15 in) 30 m (100 ft)

with extender
13. Model P79 Workstation B0193AB – Rev V
Outline and Clearance Dimensions

P79 Workstation
Figure 13-2 shows the outline dimensions and clearance requirements for the P79 workstation.
NOTE
The information in “General Clearance Requirements” on page 3 applies to the P79
workstations.
Side View
Front View
445
17.5
464
118 18.3
4.6
118
4.6
Figure 13-2. P79 Outline and Clearance
Keyboards, Mouse and Trackball

For the standard outline dimensions and clearance drawings refer to the following Product Speci-
fications Sheets:
♦ Annunciator Keyboard/Panel (PSS 21H-4E1 B4)
♦ Alphanumeric Keyboard, Mouse, and Trackball (PSS 21H-4E4 B4).
P79 Workstation Specifications

For the standard P79 workstation specifications (such as, operating temperature range, contami-
nation class), refer to the appendixes in this document or to the Product Specifications Sheet
I/A Series Model P79 Workstation (Solaris 8 Operating System) (PSS 21H-4R7 B4).
67
B0193AB – Rev V 13. Model P79 Workstation
P79 Workstation Equipment and Peripherals

Table 13-1 lists equipment and peripherals for the P79 workstation.
Table 13-1. P79 Workstation Equipment and Peripherals
Optional or
Function Standard
UltraSPARC® III processor Standard
Solaris 8 Operating System Standard
128 MB RAM (basic system) Standard1
Alphanumeric keyboard Standard
Mouse Standard
21-inch monitor Standard
20-inch monitor Optional
42-inch Plasma overview monitor Optional
Serial- and parallel-port printers Optional
Trackball Optional
GCIO interface with one or two annunciator keyboards Optional
and an optional touchscreen controller
External RAID1 or RAID5 drive Optional
25/50 GB external AIT tape drive Optional
20/40 GB DDS4 tape drive Optional
Internal 3.5-inch, 1.44 MB disk drive Standard
Internal CD-ROM drive Standard
Eight-Port Serial Controller Card (PCI) Optional
Twisted-Pair 10/100 Mbps Ethernet Interface plus Ultra Optional
Wide SCSI Controller (PCI)
Twisted-Pair 10/100 Mbps Ethernet Interface with MII Optional
Connector (PCI)
PGX64 Graphics Card (PCI) Optional2
1.
Kits are available to upgrade to 2 GB maximum.
2.
Required for second monitor in dual-head configurations.
68
P79 Workstation Environmental Considerations

All equipment listed below is specified to operate in either a computer room or a control room
with class G1 (mild) rating code (ISA Standard S71.04). The equipment is not specified to oper-
ate outdoors, or in a harsh indoor area.
Refer to the following Product Specification Sheets (PSS) for further information:
♦ I/A Series Model P79 Workstation (Solaris 8 Operating System) (PSS 21H-4R7 B4).
♦ I/A Series Hard Copy Devices (PSS 21H-4B1 B3)
♦ Color PostScript® Printer (PSS 21H-4B2 B4)
♦ Color PCL3 Printer (PSS 21H-4B4 B4)
♦ 21-Inch Workstation Display (PSS 21H-4D11 B4)
♦ 21-Inch Workstation Display With/Without Touchscreen (PSS 21H-4D6 B4)
♦ Advanced Intelligent Tape (AIT) Subsystem (PSS 21H-3E3 B4)
♦ Redundant Array of Independent Disks (PSS 21H-3E2 B4).
P79 Workstation Physical Characteristics

The physical characteristics for P79 workstation are shown in Table 13-1.
Table 13-2. P79 Workstation Physical Characteristics
Mass Height Width Depth

Equipment Name kg lb mm in mm in mm in
P79 Workstation 15.5 34.2 118.0 4.6 445.0 17.5 464.0 18.3
21-Inch Color Video Monitor 14.0 30.8 381.0 15.0 362.0 14.2 400.0 15.7
Mouse 0.1 0.2 38.0 1.5 64.0 2.5 114.0 4.5
Alphanumeric Keyboard 1.8 4.0 41.0 1.6 483.0 19.0 213.0 8.4
69
70
♦ on the 14” wide straight spacer work surface
♦ in the 14” wide straight spacer section for minitowers
♦ on a processor tray in a console bay, or
♦ on the desk/printer table, provided there is adequate space for the P80’s base and
cabling
♦ in an 800 x 800 enclosure.
exceed 104°F.
NOTE
Custom enclosures must accommodate a depth of at least 27 in (685 mm) to allow
space for cables at the back of the unit. Because of the large depth, the P80 worksta-
tion cannot be mounted inside the standard Invensys Foxboro enclosures, such as
the Industrial Enclosure 16/32, Metal Enclosure 24/32, and Modular Industrial
Workstations.
P80 workstation:
♦ Mouse or trackball ♦ Serial and parallel printers ♦ RCNI/Ethernet switch

♦ Keyboard ♦ Single or dual GCIOs ♦ DDS4 tape and/or RAID
drives
♦ Single or multi-head ♦ Touchscreens ♦ External expansion disk
monitors drive.
♦ Speakers ♦ Annunciator and
change.
71
72
Parallel Printers
RCNI
B0193AB – Rev V
or
91 m (300 ft)
P8 15 m (50 ft)
P7 Dual GCIO Set-up
Ethernet Switch
P6
100M
COLLISION
1 2 3 4 5 6 7 8 To PC

FULL DUPLEX
ACTIVITY
To Hub
or P5
LINK
POWER 1 2 3 4 5 6 7 8
X X X X X X X
91 m (300 ft) P4
RAID P3
P2 30 m (100 ft)
P1 or or -610 mm (24 in) -610 mm (24 in)
1.2 m (3 ft)
SCSI -500 mm (20 in) -500 mm (20 in)

Devices
DSS4 AIT To ac Power
-500 mm (20 in) -500 mm (20 in)
380 mm (15 in)
30 m (100 ft)
Serial Printers
30 m (100 ft)
Keyboard
2 m (6 ft)
Figure 14-1. Distances for Model P80 Peripherals Connections

2nd Monitor Monitor 15 m (50 ft)
or
30 m (100 ft)*
Mouse
2m (6 ft)
30 m (100 ft)*
*Using Extender Kit
NOTE
Hardware Installation Instructions for P80 Workstation included with your processor.

P80 Workstation
Figure 14-2 shows the outline dimensions and clearance requirements for the P80 workstation.
NOTE
workstation.
Top View Rear View
256 455
10.1 17.9
127 610 76
5 24.0 3
Allowance for CDROM Drive Tray Allowance for Cabling

Figure 14-2. Server 70 Outline and Clearance

fications Sheets:

nation class), refer to the appendixes in this document or to I/A Series Model P80 Workstation for
Solaris 8 Operating System (PSS 21H-4R8 B4).
73
Equipment and Peripherals

Table 14-1 lists equipment and peripherals for the Model P80 Workstation.
Optional or
Equipment Standard
1 GB RAM memory Standard1
Internal 73 GB system hard drive Standard
Internal 73 GB expansion hard drive Optional
External 36 GB expansion hard drive Optional2
Internal DVD-ROM drive Standard
Internal 3.5-inch, 1.44 MB floppy disk drive Standard
10/100BaseT Ethernet port Standard
Ultra SCSI port Standard
Two RS-232C/RS423 serial ports Standard
Four USB ports Standard
One IEEE 1284 parallel port Standard
21-inch workstation monitor Default
20-inch LCD workstation monitor Optional
42-inch plasma overview display Optional
Mouse Standard
Trackball Optional
GCIO interface with one or two annunciator keyboards and an optional Optional
touchscreen controller
PGX64 Video Card (PCI) Optional3
Eight-Port Serial Controller PCI Card Yes
Twisted-Pair 10/100 Mbps Ethernet interface PCI card with MII connector Yes
Twisted-Pair 10/100 Mbps Ethernet Interface with MII Connector PCI Yes
Card and the MII-to-AUI Converter
Twisted-Pair 10/100 Mbps Ethernet interface plus Ultra-Wide SCSI Yes
controller PCI Card
External RAID drive Optional
20/40 GB external DDS-4 tape drive Optional
1.
Options for up to 8 GB of RAM. Kits are available for upgrading to 8 GB maximum.
2.
The Model P80 Workstation supports a maximum of two internal or two external hard drives.
3.
The standard PGX64 graphics card is installed in PCI slot 4. A second PGX64 video card is
optional for dual-head configurations.
74

♦ I/A Series Model P80 Workstation for Solaris 8 Operating System (PSS 21H-4R8 B4)
♦ Color PostScript Printer (PSS 21H-4B2 B4)
♦ 20-Inch Flat Panel Workstation Display (PSS 21H-4D10 B4).
P80 Physical Characteristics

The physical characteristics for the P80 workstation are shown in Table 14-2.

P80 31.8 70.0 455.0 17.9 256.0 10.1 610.0 24.0
Mouse 0.1 0.2 38.0 1.5 64.0 2.5 114.0 4.5
75
76
♦ on the desk/printer table, provided there is adequate space for the P92 base and
cabling
exceed 95°F.
P92 workstation:
♦ Mouse or trackball ♦ Serial and parallel printers ♦ RCNI/Ethernet switch

♦ Keyboard ♦ Single or dual GCIOs ♦ AIT.
♦ Single or multi-head ♦ Touchscreens
monitors
change.
NOTE
the Hardware and Software Specific Instructions for P92 Workstation document
included with your processor.
77
78
Parallel Printers
Serial Printers
B0193AB – Rev V
or
RCNI or
7.5 m (25 ft) To ac Power

15 m (50 ft)
91 m (300 ft)
Keyboard
Ethernet Switch
100M
COLLISION
1 2 3 4 5 6 7 8 To PC
FULL DUPLEX

ACTIVITY
To Hub
91 m (300 ft)
LINK
POWER 1 2 3 4 5 6 7 8
X X X X X X X
or
or Mouse Speakers
2 m (6 ft) 2m (6 ft)
Dual GCIO Set-up
30 m (100 ft)
30 m (100 ft) Monitor
or
30 m (100 ft)
-610 mm (24 in) -610 mm (24 in)
AIT
P4 1.2 m (3 ft)
or 30 m (100 ft)
P3
-500 mm (20 in) -500 mm (20 in)
P2
Serial Printers
P1
-500 mm (20 in) -500 mm (20 in)

or Multiple-Head

380 mm (15 in) Monitors
7.5 m (25 ft)


P92 Workstation
Figure 15-2 shows the outline dimensions and clearance requirements for P92 workstation.
NOTE
workstation.
Top View Rear View
190 426
7.5 16.8
127 447 76
5 17.6 3

Figure 15-2. P92 Workstation Outline and Clearance

fications Sheets:

nation class), refer to the appendixes in this document or to the Product Specification Sheet
I/A Series P92 Workstation for Windows® (Windows XP Operating System) (PSS 21H-4D13 B4).
79

Table 15-1 lists equipment and peripherals for P92 workstation.
Optional or
Function Standard
Pentium 4 processor Standard
Windows XP Operating System Standard
Mouse Standard
21-inch monitor Standard2
Trackball Optional
Internal tape backup drive Optional
Multi-Port Serial Card Optional
Ultra 160 SCSI Controller (PCI) Optional
Integrated Network Interface Card (NIC) Standard
Ethernet 3Com 3C900B (secondary) (PCI) Optional
G200 MMS Video Card (PCI) Dual Optional3
Allen-Bradley PKTX Interface Card Optional
Integrated Audio Standard
1.
2.
Other monitor sizes are available as options.
3.
For multi-head configurations.
80

♦ I/A Series P92 Workstation for Windows (Windows XP Operating System) (PSS 21H-
4D13 B4)
♦ 17-Inch Workstation Display (PSS 21H-4E2 B4).
♦ Advanced Intelligent Tape (AIT) Subsystem (PSS 21H-3E3 B4).


P92 Workstation 12.7 28.0 426.0 16.8 190.0 7.5 447.0 17.6
Mouse 0.1 0.2 38.0 1.5 64.0 2.5 114.0 4.5
81
82
♦ on the desk/printer table, provided there is adequate space for the P93 base and
cabling
exceed 95°F.
P93 workstation:
♦ Mouse or trackball ♦ Serial and parallel printers ♦ DBNI/DBNT Interface

♦ Keyboard ♦ Single or dual GCIOs ♦ AIT.
monitors
change.
NOTE
the Hardware and Software Specific Instructions for P93 Workstation document
included with your processor.
83
84
Parallel Printers
Serial Printers
B0193AB – Rev V
450 m (1477 ft) or

DBNX or
7.5 m (25 ft) To ac Power

15 m (50 ft)
45 m (150 ft) or
DBNI or DBNT or Keyboard
or
and/or 2 m (6 ft) Mouse Speakers
2m (6 ft)
Dual GCIO Set-up
30 m (100 ft)
Monitor
or
30 m (100 ft)
-610 mm (24 in) -610 mm (24 in)
AIT
P4 1.2 m (3 ft)
or 30 m (100 ft)
P3
-500 mm (20 in) -500 mm (20 in)
Modbus P2
Serial Printers
P1
-500 mm (20 in) -500 mm (20 in)

or Multiple-Head
380 mm (15 in) Monitors
PKTX
7.5 m (25 ft)

P93 Workstation
Figure 16-2 shows the outline dimensions and clearance requirements for P93 workstation.
NOTE
workstation.
Top View Rear View
190 426
7.5 16.8
127 447 76
5 17.6 3

Figure 16-2. P93 Workstation Outline and Clearance

fications Sheets:

nation class), refer to the appendixes in this document.
85

Table 16-1 lists equipment and peripherals for P93 workstation.
Optional or
Function Standard
Pentium 4 processor Standard
Windows NT® Operating System Standard
Mouse Standard
21-inch monitor Standard2
Trackball Optional
Internal tape backup drive Optional
Multi-Port Serial Card Optional
Ultra 160 SCSI Controller (PCI) Optional
Integrated Network Interface Card (NIC) Standard
Ethernet 3Com 3C900B (secondary) (PCI) Optional
G200 MMS Video Card (PCI) Dual Optional3
Allen-Bradley PKTX Interface Card Optional
Integrated Audio Standard
1.
2.
3.

86

♦ 17-Inch Workstation Display (PSS 21H-4E2 B4)
♦ Advanced Intelligent Tape (AIT) Subsystem (PSS 21H-3E3 B4).


P93 Workstation 12.7 28.0 426.0 16.8 190.0 7.5 447.0 17.6
Mouse 0.1 0.2 38.0 1.5 64.0 2.5 114.0 4.5
87
88
17. 70 Series Workstations
This section provides information on the 70 Series workstation including its specifications,
70 Series Workstations Outline and Clearance

Dimensions
Application Workstations and Workstation Processors
Figure 17-1 shows the outline dimensions and clearance requirements for 70 Series Application
Workstations, Style A and B, and Workstation Processor.
NOTE
70 Series workstations.
Rear View
Top View
206
8.1
444
17.5
437
17.2
Figure 17-1. AW/WP70, Style A and AW70, Style B Outline and Clearance

fication Sheets:
89
B0193AB – Rev V 17. 70 Series Workstations
70 Series Workstations Specifications

For the standard 70 Series processor specifications (such as, operating temperature range, contam-
ination class), refer to the appendixes in this document or to the following Product Specification
Sheets:
♦ 70 Series Application Workstation Model AW70 (PSS 21H-4U1 B3)
♦ Application Workstation 70, Style A (PSS 21H-4U2 B4)
♦ Application Workstation 70 Style B (PSS 21H-4U4 B4)
♦ Workstation Processor 70 (PSS 21H-4U3 B4).

Table 17-1 lists equipment and peripherals for AW/WP70, Style A and AW70, Style B
workstations.
Table 17-1. Equipment and Peripherals
Function AW70A WP70A AW70B

AW70 and WP70, Style A: GX1 Pentium II 350 MHz Yes Yes No
processor
AW70, Style B: GX1 Pentium II 450 MHz processor No No Yes
Windows NT Operating System (V 4.0 or later) Yes Yes Yes
RAM (Basic System) 64 MB1 64 MB2 64 MB3
Alphanumeric Keyboard Yes Yes Yes
Mouse Yes Yes Yes
Trackball (optional) Yes Yes Yes
4.3 GB EIDE Hard Drive (standard) Yes Yes Yes
4.3 GB EIDE Hard Drive (expansion)4 Yes No Yes
4.3 GB SCSI Hard Drive (standard) No No Yes
Second 4.3 GB SCSI Hard Drive (optional) No No Yes
15-inch monitor (other sizes are optionally available) Yes Yes Yes
4.0/8.0 GB5 EIDE-based Tape Drive (optional) Yes Yes No
4.0/8.0 GB5 SCSI-based Tape Drive (optional) No No Yes
Internal 3.5-inch Disk Drive Yes Yes Yes
Internal CD-ROM Drive Yes Yes Yes
PC-FB Interface Card (optional) Yes No Yes
6
Serial Interface for Two Dot-Matrix Printers Yes Yes
6
Parallel Interface Port for Color Printer Yes Yes
Allen-Bradley KTX Interface ISA Card (optional)7 Yes No Yes
Allen-Bradley PKTX Interface PCI Card (optional)8 Yes No Yes
DigiBoard® PC Interface Card and Cabling (optional) Yes No Yes
Ethernet Adapter Card ISA (optional) - 3Com® 3C509 Yes Yes Yes
90
17. 70 Series Workstations B0193AB – Rev V
Table 17-1. Equipment and Peripherals (Continued)
Function AW70A WP70A AW70B

Ethernet Adapter Card PCI (optional) - 3Com 3C900B Yes Yes Yes
Colorgraphics Evolution 2 Video Card8 Yes Yes Yes
Colorgraphics Evolution 4 Video Card8 Yes Yes Yes
Integrated Sound Function and Onboard Video Yes Yes Yes
Function
1.
Kits are optionally available to upgrade the AW70A to 96 MB, 128 MB, or 192 MB.
2.
Kits are optionally available to upgrade the WP70A to 64 MB or 96 MB.
3.
Kits are optionally available to upgrade the AW70B to 128 MB or 256 MB or 384 MB.
4.
Any hard drives used in the GX1 Pentium II processor must derive from the same manufac-
turer. If multiple hard drives from different manufacturers are installed in the GX1
Pentium II processor, the processor may not recognize them and may crash.
5.
The tape drive can hold up to 4 GB of data uncompressed, and 8 GB of data compressed.
6.
Available, but not used in standard I/A Series configurations.
7.
For use with all Zenith-based, PowerMate-based, and GXa-based 70 Series processors.
8.
For use with GX1-based or later 70 Series processors.
Environmental Considerations
♦ Dot-Matrix Printer 80 (PSS 21H-4B3 B4)
♦ Application Workstation 70, Style A1 (PSS 21H-4U2 B4)
♦ Application Workstation 70, Style B1 (PSS 21H-4U4 B4)
♦ Workstation Processor 70, Style A1 (PSS 21H-4U3 B4)
1.
These documents include information pertaining to the 15-inch monitor.
91
B0193AB – Rev V 17. 70 Series Workstations
70 Series Workstation Physical Characteristics: the physical characteristics for 70 Series proces-
sors are shown in Table 17-2.
Table 17-2. 70 Series Workstations Physical Characteristics

AW/WP70, Style A 14.3 33 444 17.5 206 8.1 437 17.2
AW70, Style B 14.3 33 444 17.5 206 8.1 437 17.2
15-Inch Color Video Monitor 14.0 30.8 381 15 362 14.2 400 15.7
Mouse 0.1 0.2 38 1.5 64 2.5 114 4.5
Alphanumeric Keyboard 1.6 to 1.8 3.5 to 4 41 1.6 483 19 213 8.4
92
18. Server 70 Workstations
This section provides information on the Server 70 workstation including its specifications,
The Server 70 processor can be mounted:
♦ on the 14” wide straight spacer work surface
♦ in the 14” wide straight spacer section for minitowers, or
♦ on the desk/printer table, provided their is adequate space for the Server 70’s base and
cabling.
exceed 95°F.
NOTE
Custom enclosures must accommodate a depth of at least 27 in (685 mm) to allow
space for cables at the back of the unit. Because of the large depth, the Server 70
processors cannot be mounted inside the standard Invensys Foxboro enclosures,
such as the Industrial Enclosure 16/32, Metal Enclosure 24/32, and Modular Indus-
trial Workstations.
Server 70:
♦ Mouse or trackball ♦ Serial and parallel printers ♦ DNBT/DNBX

♦ Keyboard ♦ Single or dual GCIOs ♦ AIT and/or RAID drives.
monitors
change.
NOTE
For hardware and software installation procedures for your Server 70 processor,
refer to the Hardware and Software Specific Instructions for Server 70 Processors docu-
ment included with your processor. If you are not sure which document this is, refer
to Appendix C of System Equipment Installation (B0193AC).
93
WP 70 Parallel Printers
94
or
B0193AB – Rev V
External Ethernet Hub

AIM RAID5 or 10BaseT or ThinNet -
and/or 15 m (50 ft)
91 m (300 ft)
RAID Serial Printers
1.5 m (5 ft) To AC Power
RAID1 AIM or
DNBT 7.5 m (25 ft)

91 m (300 ft)
or Keyboard
DNBX
350 m (1500 ft)
Mouse
Dual GCIO Set-up Monitors

or
30 m (100 ft)
P4
-610 mm (24 in) -610 mm (24 in) Multiple-Head Monitors
30 m (100 ft) P3
P2 /4
To
-500 mm (20 in)
Figure 18-1. Distances for Server 70 Peripherals Connections

-500 mm (20 in) P1 Telephone
Serial Printers Lines
-500 mm (20 in) -500 mm (20 in) or Speakers
380 mm (15 in) 30 m (100 ft)

18. Server 70 Workstations
7.5 m (25 ft)

18. Server 70 Workstations B0193AB – Rev V
Server 70 Workstations Outline and Clearance

Dimensions
Figure 18-2 shows the outline dimensions and clearance requirements for Server 70 processors.
NOTE
Server 70 workstations.
Top View Rear View
266 444
10.5 17.5
127 615 76
5 24.2 3

Figure 18-2. Server 70 Outline and Clearance

fications Sheets:
Server 70 Workstations Specifications

For the standard Server 70 processor specifications (such as, operating temperature range, con-
tamination class), refer to the appendixes in this document or to the Product Specification Sheet
I/A Series Server 70, Style C (PSS 21H-4U5 B4).
95
B0193AB – Rev V 18. Server 70 Workstations

Table 18-1 lists equipment and peripherals for Server 70, AW and WP functionality.
Table 18-1. Equipment and Peripherals
Function Optional
PowerEdge 2400 Pentium III 866 MHz processor N/A
Windows NT Server 4.0, Terminal Server Edition (TSE) N/A
Operating System
256 MB RAM (basic system) No1
Alphanumeric keyboard No
Mouse No
21-inch monitor No2
Serial- and parallel-port printers Yes
Trackball Yes
GCIO interface with one or two annunciator keyboards Yes
Quad port modem Yes
Up to six internal SCSI hard drives of 18 GB each No3
Internal RAID1 or RAID10 drive Yes
10/20 GB TR5 internal tape drive with SCSI interface Yes
25/50 GB external AIT tape drive Yes
Internal 3.5-inch, 1.44 MB disk drive No
Internal CD-ROM drive No
Multi-Port Serial Card Yes
Ultra 160 SCSI Controller (PCI) Yes
Integrated Network Interface Card (NIC) No
Ethernet 3Com 3C900B (secondary) (PCI) Yes
G200 MMS Video Card (PCI) Dual Yes4
G200 MMS Video Card (PCI) Quad Yes4
Sound Card No
1.
2.
3.
Any hard drives used in the Server 70 processor must derive from
the same manufacturer. If multiple hard drives from different man-
ufacturers are installed in the Server 70 processor, the processor
may not recognize them and may crash.
4.
96
18. Server 70 Workstations B0193AB – Rev V
Environmental Considerations
♦ I/A Series Server 70, Style C Windows NT Server 4.0, Terminal Server Edition
(PSS 21H-4U5 B4)
Server 70 Physical Characteristics: the physical characteristics for Server 70 processors are shown
in Table 18-1.
Table 18-2. 70 Series Workstations Physical Characteristics

Server 70 35.0 75.0 444.0 17.5 266.7 10.5 615.0 24.2
Mouse 0.1 0.2 38.0 1.5 64.0 2.5 114.0 4.5
97
B0193AB – Rev V 18. Server 70 Workstations
98
19. 50 Series Processors and
Modules
In this section is information on the two categories of 50 Series devices: processors and modules.
50 Series processors are workstations and 50 Series modules are external data storage devices for
these workstations.
50 Series Processors and Modules Outline and

Clearance Dimensions
Application and Workstation Processors and Data Storage
Devices
Figure 19-1 through Figure 19-6 show the outline dimensions and clearance requirements for
50 Series Application and Workstation Processors, and data storage devices.
NOTE
50 Series processors.
Top View
117
264 4.6
10.4
Side View
244 Application Processor 50/51A

9.6 Workstation Processor 50/51A
Application Workstation 50/51A
Front
Figure 19-1. A-Size Processor (50 Series), Outline and Clearance
99
B0193AB – Rev V 19. 50 Series Processors and Modules
Top View
264
10.4
Side View 71
2.8
424 MB Hard Disk Drive

244
9.6 535 MB Hard Disk Drive
1.3 GB Hard Disk Drive
Front
Figure 19-2. B-Size Module (50 Series), Outline and Clearance
Top View
Side View 78
409 3.07
16.1 Application Processor 51B
Application Processor 51B1
Workstation Processor 51B
Workstation Processor 51B1
Application Workstation 51B
417
16.4 Application Workstation 51B1
Application Workstation 51C
X Terminal*
Front
* The X Terminal is a user-supplied device.
Figure 19-3. C-Size Processor (50 Series) Outline and Clearance
100
19. 50 Series Processors and Modules B0193AB – Rev V
Top View
71
2.8
310 Side View

12.2

644 MB CD-ROM
190 2.5 GB QIC Streaming Tape Drive
7.5 5 GB 4 mm Tape Drive
12 GB 4 mm Tape Drive
Front
Figure 19-4. D-Size Module (50 Series) Outline and Clearance
Front View Side View
450 450
17.7 17.7
Application Processor 51E

190 Workstation Processor 51E 498
7.5 Application Workstation 51E 19.6
Figure 19-5. E-Size Processor (50 Series) Outline and Clearance
Side View
Front View
112
4.4
430
16.9
436
17.1
Application Processor 51D

Workstation Processor 51D
Application Workstation 51D 436
17.1
Figure 19-6. F-Size Processor (50 Series) Outline and Clearance
101

fication Sheets:
♦ Annunciator Keyboard, Annunciator/Numeric Keyboard (PSS 21H-4E1 B4)
♦ Alphanumeric Keyboard, Mouse and Trackball (PSS 21H-4E4 B4)
50 Series Processor and Module Specifications

For the standard 50 Series processor and module specifications (such as, operating temperature
range, contamination class), refer to the appendixes in this document or to the following Product
Specification Sheets:
♦ Alphanumeric Keyboard, Mouse, and Trackball (PSS 21H-4E4 B4)
♦ 50 Series Application Processor Model AP51 (PSS 21H-3B9 B4)
♦ 50 Series Application Workstation Processor Model AW51 (PSS 21H-4R3 B4)
♦ 50 Series Workstation Processor Model WP51 (PSS 21H-4E9 B4)
♦ 50 Series Workstation Processor WP51, Styles B and B1 (PSS 21H-4E8 B4)
♦ 50 Series Application Processor AP51, Styles B and B1 (PSS 21H-3B8 B4)
♦ 50 Series Application Workstation Processor AW51, Styles B and B1 (PSS 21H-4R4 B4)
♦ 50 Series Application Workstation Processor AW51, Style C (PSS 21H-4R5 B4)
♦ 50 Series Application Processor AP51, Style D (PSS 21H-3B5 B4)
♦ 50 Series Application Workstation Processor AW51, Style D (PSS 21H-4R2 B4)
♦ 50 Series Workstation Processor WP51, Style D (PSS 21H-4E10 B4)
♦ 50 Series Application Processor AP51, Style E (PSS 21H-3B6 B4)
♦ 50 Series Application Workstation Processor AW51, Style E (PSS 21H-4R6 B4)
♦ 50 Series Workstation Processor WP51, Style E (PSS 21H-4E6 B4).
Additional specifications not contained in the Product Specification Sheets for 50 Series proces-
sors and modules follow.
50 Series Processors and Modules Physical Characteristics: The physical characteristics for
50 Series processors and modules are shown in Table 19-1.
Table 19-1. 50 Series Processors and Modules Physical Characteristics
Mass
Shipping1 Maximum Height
Form
Equipment Name kg lb kg lb mm in Factor
Alphanumeric Keyboard, 50 Series 2.3 4.5 2.0 4.0 51.0 2.0 -
Annunciator or Ann./Numeric Keyboard 2.7 6.0 2.8 5.0 56.0 2.2 -
Mouse, 50 Series 0.2 0.5 0.2 0.5 30.0 1.2 -
Trackball, 50 Series 0.5 1.0 0.5 1.0 60.0 2.4 -
102
Table 19-1. 50 Series Processors and Modules Physical Characteristics (Continued)
Mass
Shipping1 Maximum Height
Form
Equipment Name kg lb kg lb mm in Factor
Industrial Pointing Device for use in hostile - - - 2.0 25.4 1.0 -
environments for 50 Series
Processor 50 Series, AP50, WP50, AW50 4.5 10.0 3.2 7.0 116 4.6 A
Processor 50 Series, AP51, WP51, AW51, - - 12. 27 116 4.6 A
Model 51A 2
Processor 50 Series, Model 51B or 51C 13. 30.0 11. 25.0 78.0 3.1 C
5 3
Processor, X Terminal2 10. 23.0 8.1 18.0 78.0 3.0 C
4
Processor 50 Series, Model 51E 22. 50.0 17. 38.9 450 17.7 E
7 6
Processor 50 Series, Model 51D 18. 39.6 10. 22.0 112 4.4 F
0 0
535 MB Hard Disk Drive, 50 Series 4.5 10.0 3.8 8.3 71.0 2.8 B
2.1 GB Hard Disk Drive, 50 Series 9.0 20.0 5.5 7.0 117. 4.6 D
0
4.2 GB Hard Disk Drive3, 50 Series - - - - 70.0 2.8 D
9.1 GB Hard Disk Drive3, 50 Series - - - - 70.0 2.8 D
150 MB 0.25-inch Streaming Tape Drive, 4.5 10.0 3.8 8.3 71.0 2.8 B
50 Series
2.5 GB Tape Drive 5.0 11.0 3.5 7.6 70.0 2.8 D
5.0 GB 8 mm Streaming Tape Drive, 5.9 13.0 6.1 11.2 70.0 2.8 A
50 Series
5.0 GB 4 mm DAT Tape Drive, 50 Series 5.0 11.0 3.5 7.6 70.0 2.8 D
12.0 GB 4 mm DAT Tape Drive, 50 Series - - - - 70.0 2.8 D
644 MB CD-ROM Drive, 50 Series 4.4 10.0 3.8 8.3 70.0 2.8 D
5
1.
The 50 Series processors and peripheral modules are not shipped mounted in the enclosures. This
information is developed during the site planning phase.
2.
The X Terminal is a user-supplied device. This information is provided for your convenience.
3.
The 4.2 and 9.1 GB hard drives are supported by the Model 51, Style D and E processors with ver-
sions 4.2.x or later of I/A Series; they are supported by all 50 Series processors with versions 6.0 or
later of I/A Series.
NOTE
The shipping container can add up to 254 mm (10 in) to the height indicated in
the table.
103
50 Series Processors and Modules Electrical Power: Table 19-2 lists the ac input interruption
tolerance.
Table 19-2. 50 Series Processors and Modules ac Interrupt Tolerance Specifications
ac Voltage Interruption
Equipment Name Tolerance (ms)
50 Series Processor >66 (4 cycles at 60 Hz)
X Terminal1
535 MB Hard Disk Drive, 50 Series
2.1 GB Hard Disk Drive, 50 Series
4.2 GB Hard Disk Drive2, 50 Series
150 MB 0.25-inch Streaming Tape Drive, 50 Series
2.5 GB Streaming Tape Drive
5.0 GB 8 mm Streaming Tape Drive, 50 Series
5.0 GB 4 mm DAT Tape Drive, 50 Series
644 MB CD-ROM Drive, 50 Series
1.
2.
The 4.2 and 9.1 GB hard drives are supported by the Model 51, Style D and E processors with
versions 4.2.x or later of I/A Series; they are supported by all 50 Series processors with versions
6.0 or later of I/A Series.
50 Series Processors and Modules Electromagnetic Interference: The parameters for the electro-
magnetic interference (EMI) environment are radio frequency interference (RFI) susceptibility,
electrostatic discharge (ESD), high-frequency transients (HFT), switching/indirect lightning
(S/IL) transients, and surge withstand capability (SWC) for damped oscillatory surges. Table 19-3
and Table 19-4 contain the specifications for these parameters in relation to the 50 Series processors
and modules.
Table 19-3. 50 Series Processors and Modules RFI, ESD, and HFT Specifications
ESD2 HFT3
RFI1
(kV) (kV)
Sustained
Name/Description (V/m) S1 Power Signal
4
50 Series Processor (or X Terminal ) 10 15 2.0 1.0
535 MB Hard Disk Drive, 50 Series 10 15 2.0 1.0
2.1 GB Hard Disk Drive, 50 Series 10 15 2.0 1.0
4.2 GB Hard Disk Drive5, 50 Series 10 15 2.0 1.0
9.1 GB Hard Disk Drive5, 50 Series 10 15 2.0 1.0
150 MB 0.25-inch Streaming Tape Drive, 50 Series 10 15 2.0 1.0
2.5 Streaming Tape Drive 10 15 2.0 1.0
104
Table 19-3. 50 Series Processors and Modules RFI, ESD, and HFT Specifications (Continued)
ESD2 HFT3
RFI1
(kV) (kV)
Sustained
5.0 GB 8 mm Streaming Tape Drive, 50 Series 3 15 2.0 1.0
5.0 GB 4 mm DAT Tape Drive, 50 Series 3 15 2.0 1.0
12.0 GB 4 mm DAT Tape Drive, 50 Series 3 15 2.0 1.0
644 MB CD-ROM Drive, 50 Series 10 15 2.0 1.0
1.
RFI = radio frequency interference susceptibility for the frequency range of 27 to 1000 MHz. The
5.0 GB Tape Drive RFI is for a frequency of 10 to 1000 MHz.
2.
ESD = electrostatic discharge (reference IEC 801-2); S1 = operator accessible surface.
3.
HFT = high frequency transients (reference IEC 801-4); Power = main power lines; Signal = I/O,
control, signal, data/communication lines.
4.
5.
I/A Series V4.2.x or later; they are supported by all 50 Series processors with I/A Series V6.0 or later.
Table 19-4. 50 Series Processors and Modules S/IL Transient and SWC Specifications
S/IL1
Transients(kV) SWC2(kV)
Equipment Name Power Power
50 Series Processor (or X Terminal3) 2 2.5
535 MB Hard Disk Drive, 50 Series
2.1 GB Hard Disk Drive, 50 Series
150 MB 0.25-inch Streaming Tape Drive, 50 Series
2.5 GB Tape Drive
5.0 GB 8 mm Streaming Tape Drive, 50 Series
644 MB CD-ROM
1.
S/IL = switching/indirect lightning; Power = main power lines (reference IEC 801-5 and
ANSI/IEEE C62.41 – 1980).
2.
SWC = surge withstand capability for 1 MHz damped oscillatory wave (reference ANSI/IEEE
C37.90 – 1978); Power = main power lines.
3.
4.
I/A Series V4.2.x or later; they are supported by all 50 Series processors with I/A Series V6.0 or
later.
105
50 Series Processors and Modules Vibration Specification: Table 19-5 contains the vibration
specification for 50 Series modules.
Table 19-5. 50 Series Processors and Modules Vibration Specification
Equipment Name Vibration (g)1

50 Series Processor (or X Terminal2) 0.1 (5 to 500 Hz)
535 MB Hard Disk Drive, 50 Series 0.1 (5 to 500 Hz)
2.1 GB Hard Disk Drive, 50 Series 0.1 (5 to 500 Hz)
4.2 GB Hard Disk Drive3, 50 Series 0.1 (5 to 500 Hz)
9.1 GB Hard Disk Drive3, 50 Series 0.1 (5 to 500 Hz)
150 MB 0.25-inch Streaming Tape Drive, 50 Series 0.25 (5 to 500 Hz)
2.5 GB Tape Drive 0.1 (5 to 500 Hz)
5.0 GB 8 mm Streaming Tape Drive, 50 Series 0.256
5.0 GB 4 mm DAT Tape Drive, 50 Series 0.1 Random
644 MB CD-ROM Drive, 50 Series 0.2 (5 to 500 Hz)
1.
When a peripheral device is installed in an enclosure, the vibration specification
for the enclosure must be downgraded to reflect the specification for the
peripheral device and the amplification of the enclosure.
2.
The X Terminal is a user-supplied device. This information is provided for your
convenience.
3.
The 4.2 and 9.1 GB hard drives are supported by the Model 51, Style D and E
processors with I/A Series V4.2.x or later; they are supported by all 50 Series
processors with I/A Series V6.0 or later.
50 Series Processors and Modules Heat Dissipation: The heat dissipated by processors and mag-
netic storage modules must be considered to ensure that the processor and module population
within Industrial Enclosures 16 and 32 does not overload the thermal capacity (heat dissipation
ability) of the enclosure. The heat dissipation specification (in watts) for each 50 Series processor
and module is provided in Table 19-6.
NOTE
The heat generated by fans and power supplies are included in the thermal loading
value and you need not consider the value when determining the thermal loading of
enclosures.
106
Table 19-6. 50 Series Processors and Modules Heat Dissipations Specifications
Maximum Heat
Processor Dissipation
Equipment Name Types (Watts)
50 Series Processor Model 51A AP, WP, AW 49.0
50 Series Processor Model 51B AP, WP, AW 60
50 Series Processor Model 51C AW 110
50 Series Processor Model 51D AP, WP, AW —
50 Series Processor Model 51E AP, WP, AW 175
X Terminal1 — 70
535 MB Hard Disk Drive, 50 Series — 15.0
2.1 GB Hard Disk Drive, 50 Series — 53.0
4.2 GB Hard Disk Drive2, 50 Series — 30 (Startup); 20 (Running)
9.1 GB Hard Disk Drive2, 50 Series — 40 (Startup); 25 (Running)
150 MB 0.25-inch Streaming Tape Drive, 50 Series — 12.0
2.5 Streaming Tape Drive — —
5.0 GB 8 mm Streaming Tape Drive, 50 Series — 25.0
5.0 GB 4 mm DAT Tape Drive, 50 Series — 15.6
12.0 GB 4 mm DAT Tape Drive, 50 Series — 15.6
644 MB CD-ROM Drive, 50 Series — 10.0
1.
2.
versions 4.2.x or later of I/A Series; they are supported by all 50 Series processors with versions 6.0
or later of I/A Series.
50 Series D-Size Module SCSI Cabling

The D-size modules, E-size and F-size processors have 68 pin, SCSI-3 connectors whereas the A-,
B-, and C-size processors and modules have 50 pin, SCSI-2 connectors. This difference in signal
connectors must be accommodated by using the proper mix of SCSI cables.
There are four SCSI cables available to connect the 50 Series processors and modules to the D-size
modules.
♦ 68 pin connector on both ends
♦ Two of different lengths, each with a 50 pin connector on one end and a 68 pin con-
nector on the other
♦ 50 pin connector on both ends.
Any A- or B-size peripherals with 50 pin connectors must have a terminator module attached to
the last open SCSI connector in the daisy chain in order to terminate the SCSI bus. In contrast,
the D-size modules, which use 68 pin SCSI-3 connectors, are self-terminating.
107
The peripherals, which are connected in a serial chain, may be attached in any order within the
chain as long as certain rules are followed, as indicated in the following NOTES.
NOTE
Refer to the following notes before proceeding:
1. An external system disk must be the first device in line connected to the
processor.
2. The maximum length of the SCSI network for any processor except the
Model 51, Style E processor must be as near to six meters as is reasonably obtain-
able. This includes the cable lengths internal to the devices. Refer to Appendix K
“SCSI Bus Configuration Guide” for specific information.
3. The Model 51, Style D and E processors (F-size and E-size processors, respec-
tively) can only have two data storage devices connected to each external SCSI-3
port, because the high speed ultra-wide SCSI-3 network is limited to a total length
of three meters, not six.
By using the appropriate SCSI cables, using the proper termination technique, and setting unique
SCSI addresses on each peripheral, any mixture of units may be accommodated.
Table 19-7 lists cable part numbers if they need to be ordered separately. Terminator modules and
50/50 pin cables come with the B-size peripheral devices. D-size modules come packaged with
68/68 pin cables or 50/68 pin cables, depending on the part number specified.
Table 19-7. SCSI Cable Part Numbers
Part Part Number

50 pin to 50 pin, 0.8 meter SCSI-2 cable P0970QS
50 pin to 68 pin, 0.8 meter SCSI-2 cable P0971RH
50 pin to 68 pin, 1.2 meter SCSI-2 cable P0971MK
68 pin to 68 pin, 0.8 meter SCSI-3 cable1 P0971ML
68 pin to 68 pin, 1.2 meter SCSI-3 cable P0971MY
1.
Supplied with D-size module.
50 Series Processors and Modules, ac Input

The ac power input to each 50 Series processor and module is supplied directly by the ac power
input to the enclosure (mounting structure) power outlets. An optional 50 Series ac transfer
switch allows two separate and independent sources of ac input to power 50 Series modules.
50 Series Processors and Modules, Power Switches

The customer should be aware that the power switches on the Model 51B1 and X Terminal pro-
cessors do not operate in the same manner as those on the Model 51B, Model 51C, Model 51D,
and Model 51E processors. The Model 51B1 and X Terminal 50 Series processors have momen-
tary contact power switches, which do not remain in the “ON” position if the processors experi-
ence a power failure. The Model 51B, Model 51C, Model51D, and Model 51E processors have
latching rocker power switches, which remain in the “ON” position (if the switches are set to
“ON”) when the processors experience a power failure.
108
When power is restored to these processors, the Model 51B, Model 51C, Model 51D, and
Model 51E processors reboot automatically, whereas the Model 51B1 and X Terminal remain off
until their power switches are manually activated. A system containing both Model 51B1 and
X Terminal processors and Model 51B, Model 51C, Model51D, and Model 51E processors
would not be completely self-recoverable, since the Model 51B1 and X Terminal processors
would remain off, while the Model 51B, Model 51C, Model 51D, and Model 51E processors
would immediately reboot when power was restored.
109
110
20. 10, 30, 40, 60 Series
Communications and Control
Processor Modules
This section contains information on the 10, 20, 30, 40 and 60 Series Communications and
Control Processor Modules including mass, RFI, ESD, and HFT specifications, S/IL transient
and SWC specifications, vibration specifications, and heat dissipation specifications.
NOTE
For installation information on the Control Processor 60 refer to Control Processor
60 and Control Processor 60S Installation and Maintenance (B0400FB).
Specifications
to the appendixes in this document or the following Product Specifications Sheets:
Product Specification Sheet (PSS) Title PSS Number

Control Processor 10 Hardware PSS 21H-1B1 B3
Control Processor 10 275 Block Software PSS 21H-1B1 B4
Control Processor 30, Style B Hardware PSS 21H-1B4 B3
Control Processor 30, Style B 1000 Block Software PSS 21H-1B4 B4
Control Processor 40, Style B Hardware PSS 21H-1B5 B3
Control Processor 40, Style B 2000 Block Software PSS 21H-1B5 B4
Control Processor 60 PSS 21H-1B7 B3
Tank Processor 10 PSS 21H-1E1 B3
Allen-Bradley Station PSS 21H-1F1 B3
Nodebus, Nodebus Extender, and Nodebus Interface PSS 21H-7B1 B4
Dual Nodebus Interface and Dual Nodebus Interface Extender PSS 21H-7B2 B4
Communications Processor 10 PSS 21H-7D1 B3
Information Network Interface 15 PSS 21H-7E2 B3
Carrierband LAN Interface PSS 21H-7F1 B4
Fiber Optic LAN Converter PSS 21H-7F3 B4
Carrierband LAN Interface PSS 21H-7F4 B4
111
B0193AB – Rev V 20. 10, 30, 40, 60 Series Communications and Control Processor Modules

Fiber Optic Carrierband LAN Interface PSS 21H-7F5 B4
Active Concentrator PSS 21H-7F6 B4
Splitter/Combiner PSS 21H-7F7 B4
Passive Star PSS 21H-7F8 B4
INTERSPEC™ Integrator 30 PSS 21H-7G1 B3
Integrator 30 PSS 21H-7G1 B4
Integrator 30 for Allen-Bradley Programmable Logic Controllers PSS 21H-7G2 B3
Device Integrator 30 PSS 21H-7G3 B3
Integrator 30 for Modbus Devices PSS 21H-7G4 B3
Integrator for Modbus Plus Devices PSS 21H-7G5 B3
Instrument Gateway PSS 21H-7J1 B4
Gateway for Modbus Devices PSS 21H-7K1 B3
Allen-Bradley Data Highway™ Gateway PSS 21H-7L1 B4
Fiber Optic Fieldbus PSS 21H-7P1 B3
A summary of additional specifications for the 10, 30, 40 and 60 Series communications and con-
trol modules follow.
Mass: The physical characteristics for the communications and control modules are shown in
Table 20-1.
Table 20-1. Communications and Control Module Loadable Mounting
Module Mass
Form
Name/Description Factor1, 2 kg lb
Control Processor 10 or Fault-Tolerant CP X 2.2 4.9
Control Processor 30 or Fault-Tolerant CP Z 1.2 2.7
Communications Processor 10 Z 1.2 2.7
SPECTRUM Slave Gateway 2X 4.4 9.8
Instrument Gateway Z 1.2 2.7
Device Integrator 15 Z 1.2 2.7
Allen-Bradley Data Highway Gateway Z 1.2 2.7
Modicon® Gateway Z 1.2 2.7
Integrator 30 for Allen-Bradley PLCs, Redund. Z 1.2 2.7
Integrator 30 for Modicon and Modicon Plus Devices Z 1.2 2.7
112
20. 10, 30, 40, 60 Series Communications and Control Processor Modules B0193AB – Rev V
Table 20-1. Communications and Control Module Loadable Mounting (Continued)
Module Mass
Form
Name/Description Factor1, 2 kg lb
INTERSPEC Integrator 30 Z 1.2 2.7
INTERSPEC Integrator Translator P Adapter 4.4 9.8
Information Network Interface 15 Z 1.2 2.7
SPECTRUM Interface Processor Z 1.2 2.7
Carrierband LAN Interface Z 1.2 2.7
Fiber Optic Carrierband LAN Interface Z 1.2 2.7
Nodebus Interface Z 1.2 2.7
Nodebus Extender (Copper cable) Z 1.2 2.7
Fiber Optic Nodebus Extender Z 1.2 2.7
Dual Nodebus Interface and Extender Z 0.9 2.1
1.
Each module with an X form factor is individually shipped in a container that is
508 mm (20 in) long, 95.25 mm (3 3/4 in) wide, and 288.93 mm (11 3/8 in) high.
2.
Each module with a 2X form factor is individually shipped in a container that is
692.15 mm (27 1/4 in) long, 447.68 mm (17 5/8 in) wide, and 254 mm (10 in) high.
Refer to Network Cable Systems Planning (B0193UX) for information pertaining to the fiber
optics enclosure (4, 6, or 8), fiber optics converter, active concentrator, splitter/combiner, passive
star, fiber optic mid-bus modem, fiber optic end-bus modem, and fieldbus power distribution
unit.
Electromagnetic Interference: The parameters for the electromagnetic interference (EMI) envi-
ronment are radio frequency interference (RFI) susceptibility, electrostatic discharge (ESD), high-
frequency transients (HFT), switching/indirect lightning (S/IL) transients, and surge withstand
capability (SWC) for damped oscillatory surges.
Table 20-2 and Table 20-3 contain the specifications for these parameters for the communication
and control modules.
113
Table 20-2. Communications and Control Module RFI, ESD, and HFT Specifications
RFI1 ESD2 (kV) HFT3(kV)

Sustained
Name/Description (V/m) S1 S2 Power Signal
Carrierband LAN Interface 10 8 4 1.0 0.5
Fiber Optic Carrierband LAN Interface 10 8 4 1.0 0.5
Nodebus Interface and Extender 10 8 4 1.0 0.5
Dual Nodebus Interface and Extender 10 8 4 1.0 0.5
10, 30, 40 60 Series Processors, Integrators, 10 8 4 1.0 —
Gateways, and Control Processor Modules
1.
RFI = radio frequency interference susceptibility for the frequency range of 27 to 1000 MHz.
2.
ESD = electrostatic discharge (reference IEC 801-2); S1 = operator accessible surface; S2 =
any other surface.
3.
HFT = high frequency transients (reference IEC 801-4); Power = main power lines; Signal =
I/O, control, signal, data/communication lines.
Table 20-3. Communications and Control Module S/IL Transient and SWC Specifications
S/IL1 Transients SWC2

(kV) (kV)
Equipment Name Power Signal Power
Carrierband LAN Interface 2 1.0 2.5
Fiber Optic Carrierband LAN Interface 2 1.0 2.5
Nodebus Interface and Extender 2 1.0 2.5
Dual Nodebus Interface and Extender 2 1.0 2.5
10, 30, 40 60 Series Processors, Integrators, 2 — 2.5
Gateway, and Control Processor Modules
1.
S/IL = switching/indirect lightning; Power = main power lines (reference
IEC 801-5 and ANSI/IEEE C62.41 – 1980); Signal = I/O, control, signal,
data, and communication lines.
2.
SWC = surge withstand capability for 1 MHz damped oscillatory wave (refer-
ence ANSI/IEEE C37.90-1978); Power = main power lines.
114
20. 10, 30, 40, 60 Series Communications and Control Processor Modules B0193AB – Rev V
Vibration: Table 20-4 contains the vibration specification for communications and control
modules.
Table 20-4. Communications and Control Module Vibration Specifications
Equipment Name Vibration (g)

Carrierband LAN Interface 0.5 (5 to 200 Hz)
Fiber Optic Carrierband LAN Interface
Nodebus Interface and Extender
Dual Nodebus Interface and Extender
10, 30, 40 60 Series Processors, Integrators, Gateways,
and Control Processor Modules
Heat Dissipation: The heat dissipation for each communications and control module is listed in
Table 20-5.
Table 20-5. Communications and Control Module Heat Dissipation Specifications
Maximum Heat Dissipation

Module Name Type (Watts)
Control Processor 10 CP10 14.0 non-fault-tolerant,
28.0 fault-tolerant
Control Processor 30 CP30, CP30FT 14.0 non-fault-tolerant,
28.0 fault-tolerant
34.0 fault-tolerant
30.0 fault-tolerant
Communication Processor 15 COMM15 11.0
SPECTRUM Slave Gateway SSG 23.0
Instrument Gateway 760G 11.0
Device Integrator 15 FDG 11.0
Allen-Bradley Data Highway Gateway ABDH 11.0
Modicon Gateway MODG 11.0
Device Integrator 30 DI30, DI30FT 16.0 non-fault-tolerant,
32.0 fault-tolerant
Integrator 30 for Allen-Bradley PLCs ABDH-R 16.0 non-fault-tolerant,
AB30, AB30FT 32.0 fault-tolerant
Integrator 30 for Modicon and MI30, MI30FT 16.0 non-fault-tolerant,
Modicon Plus Devices 32.0 fault-tolerant
INTERSPEC Integrator 30 IS30 16.0
INTERSPEC Integrator Translator IIT 17
115
Table 20-5. Communications and Control Module Heat Dissipation Specifications (Continued)
Maximum Heat Dissipation

Information Network Interface 15 INI15 11
SPECTRUM Interface Processor SIP 11
Carrierband LAN Interface CLI 16.0 non-fault-tolerant,
32.0 fault-tolerant
Fiber Optic Carrierband LAN Interface FOCLI 32.0 fault-tolerant
Nodebus Interface NBIF 8.0
Nodebus Extender NBE 8.0
Dual Nodebus Interface DNBI 8.0
Dual Nodebus Interface Extender DNBX 8.0
Workstation Processor 30 WP30 16.0
116
21. Fieldbus Modules (FBMs)
This section contains specifications, including mass, relative humidity, electromagneitc
interference, vibration and heat dissipation for Fieldbus Modules (FBMs).
NOTE
For information on fieldbus modules used with DIN rail mounted FBM equipment
(FBM201, FBM202, and so forth), refer to DIN Rail Mounted FBM Subsystem
User’s Guide (B0400FA), FOUNDATION fieldbus H1 Interface Module (FBM220/221)
User Guide (B0400FD), PROFIBUS-DP Communication Interface Module (FBM223)
User’s Guide (B0400FE), HART Communication Interface Module
(FBM214/215/216/218) User’s Guide (B0400FF), and Modbus Communication Inter-
face Module (FBM224) User’s Guide (B0400FK).
Specifications
For the standard specifications (that is, operating temperature range, contamination class, and so
forth) refer to the Appendixes in this document or the following Product Specifications Sheets:

0 to 10 V dc, Contact/dc Input/Output Interface Module (FBM17) PSS 21H-2D3 B4
0 to 20 mA I/O Interface Module (FBM04) PSS 21H-2B7 B4
0 to 20 mA Input Interface Module (FBM01) PSS 21H-2B1 B4
0 to 20 mA Output Interface Module (FBM37) PSS 21H-2D9 B4
120 V ac Input Interface Module (FBM08) and 120 V ac Expansion Input PSS 21H-2C5 B4
Interface Module (FBM13)
120 V ac Input/Output Interface Module (FBM10) and 120 V ac Expansion PSS 21H-2C9 B4
Input/Output Interface Module (FBM15)
240 V ac Input Interface Module (FBM20) and 240 V ac Expansion Input PSS 21H-2D7 B4
240 V ac Input/Output Interface Module (FBM11) and 240 V ac Expansion PSS 21H-2D1 B4
Contact/125 V dc I/O Interface Module (FBM26) and Contact/125 V dc PSS 21H-2E6 B4
Expansion I/O Interface Module (FBM27)
Contact/125 V dc Input Interface Module (FBM24) and Contact/125 V dc PSS 21H-2E4 B4
Expansion Input Interface Module (FBM25)
Contact/dc Input Interface Module (FBM07) and Contact/dc Expansion Input PSS 21H-2C3 B4
Contact/dc Input/Output Interface Module (FBM09) and Contact/dc Expansion PSS 21H-2C7 B4
117
B0193AB – Rev V 21. Fieldbus Modules (FBMs)

Copper RTD Input Interface Module (FBM33) PSS 21H-2E7 B4
Dual Baud Rate Intelligent Transmitter Interface Module (FBM43) PSS 21H-2D8 B4
Dual Baud Rate Intelligent Transmitter/0 to 20 mA Output Interface Module (FBM44) PSS 21H-2D4 B4
HART Communication Input Interface Module (FBM214) PSS 21H-2Z14 B4
HART Communication Input Interface Module (FBM215) PSS 21H-2Z15 B4
HART Communication Redundant Input Interface Module (FBM216) PSS 21H-2Z16 B4
HART Communication Redundant Input Interface Module (FBM218) PSS 21H-2Z18 B4
High Power Contact/dc Input/Output Interface Module (FBM41) and PSS 21H-2C6 B4
High Power Contact/dc Expansion Input/Output Interface Module (FBM42)
Intelligent Transmitter Interface Module (FBM18) PSS 21H-2D5 B4
Intelligent Transmitter/0 to 20 mA Output Interface Module (FBM39) PSS 21H-2C4 B4
Modbus Communication Interface Module (FBM224) User’s Guide PSS 21H-2C4 B4
Output Bypass Station (4 to 20 mA) PSS 21H-2S2 B4
Platinum and Nickel RTD Input Interface Module (FBM03) PSS 21H-2B5 B4
PROFIBUS-DP Communication Interface Modules (FBM223) PSS 21H-2Z23 B4
Pulse Input, 0 to 20 mA Output Interface Module (FBM06) PSS 21H-2C1 B4
Redundant 0 to 20 mA I/O Interface (FBM05) PSS 21H-2B8 B4
Redundant Dual Baud Rate Interface to Intelligent Transmitters and Redundant PSS 21H-2D2 B4
Analog Outputs (FBM46)
Single 0 to 20 mA I/O Auto/Manual Interface Module (FBM22) PSS 21H-2E1 B4
Thermocouple/mV Input Interface Module (FBM02) PSS 21H-2B3 B4
Type R Thermocouple/mV Input Interface Module (FBM36) PSS 21H-2E8 B4
A summary of additional specifications for the FBMs follows.
FBM Mass
The physical characteristics for FBMs are shown in Table 21-1.
Table 21-1. FBM Loadable Mounting
Mass
Module
Name Form Factor kg lb
Fieldbus Modules (each)1, 2 Y 1.0 2.2
Fieldbus Isolator2, 3 1/2 Y 0.3 0.7
1.
Each Fieldbus Module is individually shipped in a container that is 508 mm
(20 in) long, 79.4 mm (3 1/8 in) wide, and 187.3 mm (7 3/8 in) high.
2.
Y-Adapters are required when Y-Modules are installed in any enclosure with-
out an FBM-specific mounting structure, other than Field Enclosure 4.
3.
Fieldbus Isolators are shipped two isolators to a container. Dimensions of the
container are the same as in Footnote 1, above.
118
21. Fieldbus Modules (FBMs) B0193AB – Rev V
FBM Contamination and Temperature Specification

Fieldbus Modules: Operating: 0 to 60°C (32 to 140°F); Storage: -40 to 70°C (-40 to 158°F)
Fieldbus Isolator: Operating: 0 to 60°C (32 to 140°F); Storage: -40 to 70°C (-40 to 158°F)
Contamination: Class G3 (Harsh as defined in ISA Standard, S71.04)
FBM Relative Humidity

5 to 95%, noncondensing, at 30°C (86°F) dry bulb
FBM Electromagnetic Interference

Table 21-2 and Table 21-3 list the specifications for electromagnetic interference.
Table 21-2. FBM RFI, ESD, and HFT Specifications
ESD2(kV) HFT3(kV)
RFI1 Sustained
Fieldbus Isolator 10 8 4 1.0 0.5
Fieldbus Modules 10 8 4 2.0 1.0
1.
RFI = radio frequency interference susceptibility for the frequency range of
27 to 1000 MHz.
2.
ESD = electrostatic discharge (reference IEC 801-2); S1 = operator accessible
surface; S2 = any other surface.
3.
HFT = high frequency transients (reference IEC 801-4); Power = main power
lines; Signal = I/O, control, signal, data/communication lines.
Table 21-3. FBM S/IL Transient and SWC Specifications

(kV) (kV)
Equipment Name Power Signal Power Signal
Fieldbus Isolator 2 1.0 2.5 —
Fieldbus Modules 3 1.5 2.5 2.5
1.
S/IL = switching/indirect lightning (reference IEC 801-5 and
ANSI/IEEE C62.41 – 1980); Power = main power lines, Signal = I/O, con-
trol, signal, data, and communication lines.
2.
SWC = surge withstand capability for 1 MHz damped oscillatory wave (refer-
ence ANSI/IEEE C37.90 – 1978); Power = main power lines; Signal = I/O,
control, signal, data, and communication lines.
119
FBM Vibration (g)

Fieldbus Isolator: 0.5 (5 to 200 Hz); Fieldbus Modules: 0.75 (5 to 200 Hz)
FBM Heat Dissipation

The heat dissipation specification (in watts) for each Fieldbus Module is provided in Table 21-4.
Table 21-4. FBM Heat Dissipation Specifications
Maximum Heat
Module Name Type Dissipation (Watts)
Fieldbus Isolator — 6.4
0 to 20 mA Input Interface FBM01 12.0
Thermocouple/Millivolt Input Interface FBM02 9.0
RTD Input Interface (0 to 320 W) FBM03 9.0
0 to 20 mA I/O Interface FBM04 12.0
0 to 20 mA I/O Interface, Redundant FBM04A,X 14.0
0 to 20 mA I/O Interface, Redundant FBM05,X 14.0
Pulse Input, 0 to 20 mA Output Interface FBM06 12.0
Contact/dc Input Interface FBM07 12.0
120 V ac Input Interface FBM08 11.0
Contact/dc I/O Interface FBM09 11.0
120 V ac I/O Interface FBM10 12.0
Contact/dc Expansion Input Interface FBM12 10.0
120 V ac Expansion Input Interface FBM13 7.0
Contact/dc Expansion I/O Interface FBM14 7.0
120 V ac Expansion I/O Interface FBM15 8.0
0 to 10 V dc, Contact/dc I/O Interface FBM17 9.0
Intelligent Transmitter Interface FBM18 9.0
Single 4 to 20 ma I/O A/M Interface FBM22 6.0
Contact/125 V dc Input Interface FBM24 15.0
Contact/125 V dc Expansion Input Interface FBM25 12.0
Contact/125 V dc I/O Interface FBM26 15.0
Contact/125 V dc Expansion I/O Interface FBM27 12.0
Type R Thermocouple/mV Input Interface FBM36 9.0
0 to 20 mA Output Interface FBM37 12.0
Intelligent Transmitter/0 to 20 mA Interface FBM39 11.0
120
21. Fieldbus Modules (FBMs) B0193AB – Rev V
Table 21-4. FBM Heat Dissipation Specifications (Continued)
Maximum Heat
Module Name Type Dissipation (Watts)
High Power Contact/dc I/O Interface FBM41 13.0
High Power Contact/dc I/O Expansion Interface FBM42 10.0
Dual Baud Rate Intelligent Transmitter Interface Module FBM43 8.0
Dual Baud Rate Intelligent Transmitter 0 to 20 mA FBM44/46 7.0
Output Interface
121
122
22. Workstation Displays
This section contains information on workstation displays’ outline and clearance dimensions,
display specifications, and power distribution.
Workstation Displays’ Outline and Clearance

Dimensions
fications Sheets:
♦ 17-Inch Workstation Display (PSS 21H-4E2 B4)
♦ 20-Inch Flat Panel Workstation Display (PSS 21H-4D10 B4).
The 15-inch workstation display is described in the following Product Specifications Sheets:
♦ Application Workstation 70, Style A (PSS 21H-4U2 B4)
♦ Application Workstation 70, Style B (PSS 21H-4U4 B4)
♦ Workstation Processor 70, Style A (PSS 21H-4U3 B4)
♦ VT100 Compatible Terminal (PSS 21H-4T1 B3).
NOTE
workstation displays.
Workstation Displays’ Specifications

to the appendixes in this document or the Product Specification Sheets listed above.
Harmonic Distortion: VT100 Compatible Terminal: 10% up to third harmonic
ac Voltage Interruption Tolerance (ms): VT100 Compatible Terminal: > 66 (4 cycles at 60 Hz)
Electromagnetic Interference: Electromagnetic fields are generated by all electrical cables and
equipment like monitors, power supplies, or motors. The generated field has the frequency of the
power running the equipment, 60 Hz or 50 Hz.
The equipment generating the field can usually be detected by noticing changes in a Workstation
Processor’s display image when equipment is being turned on or off.
This interference can often be reduced or avoided by changing the location or orientation of the
monitor or of the equipment generating the field. The interference can be reduced or avoided by
shielding either the monitor or equipment with metal without EMI generating conductors.
Also, interference can be induced on the video signal cable. If possible, the cable should be
rerouted away from power cables and equipment generating EMI or run in conduit.
123
B0193AB – Rev V 22. Workstation Displays
If you experience EMI interference on station monitors you should make every effort to meet the
site planning specifications and avoid the EMI interference, as described above. If this is impossi-
ble, contact your Invensys Foxboro representative to investigate a possible custom site solution.
Some success has been seen in customizing Workstation Processors to run at the same refresh rate
as the EMI interference thereby masking the problem.
For persistent EMI interference locations, substituting a CRT monitor with a LCD flat panel
monitor eliminates screen distortion. The 20.1-inch LCD flat panel monitor is highly resistant to
ambient magnetic fields.
The parameters for the electromagnetic interference (EMI) environment are radio frequency
interference (RFI) susceptibility, electrostatic discharge (ESD), high-frequency transients (HFT),
switching/indirect lightning (S/IL) transients, and surge withstand capability (SWC) for damped
oscillatory surges. Table 22-1 and Table 22-2 contain the specifications for these parameters in rela-
tion to the workstation displays.
Table 22-1. Workstation Displays RFI, ESD, and HFT Specifications
RFI1 ESD2 (kV) HFT3 (kV)

Sustained
17-inch Workstation Display 1 15 1.0 1.0
21-inch Workstation Display4 1 15 1.0 1.0
VT100 Compatible Terminal 3 8 2.0 1.0
1.
RFI = radio frequency interference susceptibility for the frequency range of 27 to
1000 MHz.
2.
ESD = electrostatic discharge (reference IEC 801-2); S1 = operator accessible surface.
3.
HFT = high frequency transients (reference IEC 801-4); power = main power lines;
signal = I/O, control, signal, data/communication lines.
4.
Magnetic Field Effects: All 19- and 21-inch monitors using Trinitron tubes
(P0911VD/VE/VG) that are subject to varying magnetic fields greater than > 0.01
gauss peak-to-peak may develop unreasonable visual effects to a displayed image. Trin-
itron-based displays should not be used in an environment where the varying magnetic
fields exceed 0.01 gauss. The maximum ambient magnetic/EMI field specifications are:
Stray Magnetic Fields Immunity Fields below 200 Hz and 0.01 gauss peak-to-
peak cause no unreasonable visible effect to a
displayed image.
EMI Immunity (1 MHz to 1 GHz) 1 Voltmeter with no visible effect greater
than 0.1 mm peak-to-peak displacement or
better.
124
22. Workstation Displays B0193AB – Rev V
Table 22-2. Workstation Displays S/IL Transient and SWC Specifications

(kV) (kV)
17-inch Workstation Display 2 2.5
20.1-inch LCD Flat Panel Display
21-inch Workstation Display
VT100 Compatible Terminal
1.
S/IL = switching/indirect lightning; power = main power lines (reference
IEC 801-5 and ANSI/IEEE C62.41 – 1980).
2.
SWC = surge withstand capability for 1 MHz damped oscillatory
wave (reference ANSI/IEEE C37.90 – 1978); Power = main power lines.
Vibration (g): 0.05 (5 to 200 Hz). When a peripheral device is installed in an enclosure, the
vibration specification for the enclosure must be downgraded to reflect the specification for the
peripheral device and the amplification of the enclosure.
Thermal Loading on HVAC Systems: 17-inch workstation display: 655 BTU per hour, maxi-
mum. 20.1-inch LCD flat panel display: 25 BTU per hour, maximum. 21-inch workstation dis-
play: 655 BTU per hour, maximum.
Power Distribution
Power is supplied to each workstation display (refer to Figure 22-1) via a three-prong earthed
(grounded) outlet. The outlet should be grounded in accordance with I/A Series grounding
requirements. [Refer to Chapter 25 “System Power and Earthing (Grounding)”.]
VT100
Compatible
Terminal
Connect
to Power 21-Inch
Workstation
Source
Display
Outlets
17-Inch
Workstation
Display
Figure 22-1. Power Distribution, Typical (Peripherals)
125
B0193AB – Rev V 22. Workstation Displays
126
23. Printers
This section contains information on printer outline and clearance dimensions, printer
specifications, and power distribution.
Printer Outline and Clearance Dimensions

fication Sheets:
♦ Dot-Matrix Printer 80 (PSS 21H-4B3 B4)
♦ Color Dot-Matrix Printer 132 (PSS 21H-4B5 B4)
NOTE
Workstation Displays.
Printer Specifications
to the appendixes in this document or the Product Specification Sheets listed above.
Additional specifications for the printers follow.
Printer Electrical Power: Table 23-1 lists the ac power specification for ac voltage,
ac frequency, and harmonic distortion. Table 23-2 lists the ac input interruption tolerance.
Table 23-1. Printers’ ac Voltage, Frequency, and Distortion Specifications
Harmonic
Frequency Distortion
Equipment Name ac Voltage Hz (%)
Color Dot-Matrix Printer 132 99 to 126.5 47 to 63 —
Dot-Matrix Printer 80 108 to 132 47 to 53 5
198 to 242 57 to 63
216 to 264
Color PostScript Printer 108 to 132 47 to 53 —
198 to 242 57 to 63
216 to 264
Color PCL3 Printer 90 to 264 47 to 63 —
127
B0193AB – Rev V 23. Printers
Table 23-2. Printers’ ac Interrupt Tolerance Specifications
ac Voltage Interruption
Equipment Name Tolerance (ms)
Color Dot-Matrix Printer 132 > 33 (2 cycles at 60 Hz)
Dot-Matrix Printer 80 > 33 (2 cycles at 60 Hz)
Color PostScript Printer —
Color PCL3 Printer —
ronment are radio frequency interference (RFI) susceptibility, electrostatic discharge (ESD), high-
frequency transients (HFT), switching/indirect lightning (S/IL) transients, and surge withstand
capability (SWC) for damped oscillatory surges. Table 23-3 and Table 23-4 contain the specifica-
tions for these parameters in relation to the printers.
Table 23-3. Printers’ RFI, ESD, and HFT Specifications
ESD2 (kV) HFT3 (kV)

RFI1 Sustained
Color Dot-Matrix Printer 132 3 10 4 2.0 1.0
Dot-Matrix Printer 80 3 8 4 2.0 1.0
Color PostScript Printer 10 8 4 2.0 —
Color PCL3 Printer — — — — —
1.
RFI = radio frequency interference susceptibility for the frequency range of 27 to 1000 MHz.
2.
ESD = electrostatic discharge (reference IEC 801-2); S1 = operator accessible surface;
3.
HFT = high frequency transients (reference IEC 801-4); Power = main power lines;
Signal = I/O, control, signal, data/communication lines.
Table 23-4. Printers’ S/IL Transient and SWC Specifications

(kV) (kV)
Color Dot-Matrix Printer 132 2 —
Dot-Matrix Printer 80 2 2.5
Color PostScript Printer 2 2.5
Color PCL3 Printer — —
1. S/IL = switching/indirect lightning; Power = main power lines (reference IEC 801-5 and
ANSI/IEEE C62.41 – 1980).
2. SWC = surge withstand capability for 1 MHz damped oscillatory wave (reference ANSI/IEEE
C37.90 – 1978); Power = main power lines.
128
23. Printers B0193AB – Rev V
Heat Dissipation: Table 23-5 contains the heat dissipation specification (in BTUs) for each
printer.
Table 23-5. Printer Heat Dissipation Specification
Equipment Name BTU Per Hour

Color Dot-Matrix Printer 132 68 (standby); 511 (printing)
Dot-Matrix Printer 80 19 (standby); 79 (printing)
Color PostScript Printer 5 (standby); 48 (printing)
Color PCL3 Printer 164 (printing)
Power Distribution
Power is supplied to each printer via a three-prong earthed (grounded) outlet. The outlet should
be grounded in accordance with I/A Series system grounding requirements.
Dot-Matrix
Printer 80
Connect Color
to Power Postscript
Source Printer
Outlets
Color
Dot-Matrix
Printer 132
Figure 23-1. Power Distribution, Printers
129
B0193AB – Rev V 23. Printers
130
24. Panel Display (PD) and Auto-
Manual (A/M) Station
This section contains information on panel display (PD) and auto/manual (A/M) station,
including station outline and clearance dimensions and station specifications.
PD and A/M Station Outline and Clearance

Dimensions
fications Sheets:
♦ Panel Display Station (PSS 21H-1C1 B4)
♦ Auto/Manual Station (PSS 21H-1C3 B4).
PD and A/M Station Specifications

to the appendixes in this document or the Product Specifications Sheets listed above.
Additional specifications for the Panel Display and Auto/Manual Station follow.
Relative Humidity: 5 to 95%, noncondensing, at 30°C (86°F) dry bulb.
ronment are radio frequency interference (RFI) susceptibility, and electrostatic discharge (ESD).
Table 24-1 contains the specifications for these parameters in relation to the Panel Display Station
and Auto/Manual Station.
Table 24-1. PD and A/M RFI, ESD, and HFT Specifications
RFI1
Sustained ESD2
Name/Description (V/m) (kV)
Panel Display Station 10 8
Auto/Manual Station 10 8
1.
RFI = radio frequency interference susceptibility for the frequency range
of 27 to 1000 MHz.
2.
ESD = electrostatic discharge (reference IEC 801-2). Operator accessible
surface.
131
B0193AB – Rev V 24. Panel Display (PD) and Auto-Manual (A/M) Station
132
25. System Power and Earthing
(Grounding)
This chapter defines the power and signal earthing guidelines for the I/A Series enclosures and
peripheral devices, such as a workstation, Carrierband LAN, Nodebus, Fieldbus, and field
wiring (to/from field instruments).
Introduction
I/A Series system units must be earthed (grounded) according to prevailing electrical codes. The
particular application and the international (IEC), national (NEC), regional, and local electrical
codes dictate the specific earthing configuration. The safety earth (green wire or green/yellow
wire), required to protect personnel, must be installed according to international, national,
regional, and local electrical codes. Installing the safety earth is the customer’s responsibility.
The following objectives must be met when implementing I/A Series earthing:
♦ Safety – Ensure that all exposed non-current carrying conductive surfaces are effec-
tively interconnected and tied to earth per local code.
♦ I/A Series Equipment Protection – Ensure the protection of the electrical system and
equipment, and establish a zero-voltage reference point (system earth) for I/A Series
system operation.
Some general earthing considerations follow:
♦ The particular application and international/national/regional/local electrical codes
dictate the specific earthing requirements. In the United States, the National Electrical
Code (NEC) and building codes are the governing documents.
♦ In the I/A Series system, dc logic earth and ac safety earth are common.
♦ I/A Series system dc logic and ac safety earths are returned to an earthing point typi-
cally consisting of a plant earth grid, building steel, driven earth rods, or other
acceptable zero voltage reference.
♦ Sources of electrical noise should be kept to a minimum, and it is important to under-
stand where noise can be produced and its impact. An example of a noise source is
power line transients, which, can occur due to lightning, line switching, load switch-
ing, and so on.
NOTE
Equipment used in the European community requires shielded power cables. Refer
to European Union CE-Mark Compliance Manual (B0193UU).
133
B0193AB – Rev V 25. System Power and Earthing (Grounding)
Power Facility
The customer must supply all power distribution panels, circuit breakers, fuses, interconnecting
power cables, connection equipment and safety devices, according to international, national,
regional, and local electrical codes. Unless otherwise indicated, all wire sizes must meet local elec-
trical codes. The voltage drop along the length of any power distribution wire must not exceed
three percent of nominal V ac. Refer to the appropriate sections in this document for the maxi-
mum wire size for each device.
When planning for uninterruptable power supply (UPS) requirements (if applicable), refer to
“Uninterruptable Power Supply Sizing” on page 146.
When planning for Division 2 requirements (if applicable), refer to the appropriate chapters in
this document for required application specifications.
ac Transfer Switch
The voltage drop along the length of any power distribution wire must not exceed two percent
when using an ac Transfer Switch. Refer to ac Transfer Switch (PSS 21H-5F1 B3).
Power Cables
Power wiring (cabling) is divided into two classifications that, for safety reasons, must be physi-
cally isolated from each other and from all signal cables by mutually exclusive pipe, conduit,
troughs, raceways and/or runs, and by separate cable entries into enclosures. These cable classifi-
cations are:
♦ High-Voltage Power – wires carrying power at voltage levels equal to or greater than
30 V rms or 60 V dc.
♦ Low-Voltage Power – wires carrying power at voltage levels less than 30 V rms or
60 V dc.
Refer to “Separation” on page 154 for additional information concerning separation of power and
signal wiring.
! WARNING
Failure to separate the two classifications of power wiring from each other and from
signal wiring, as described herein, may result in injury to personnel.
I/A Series Equipment Earthing Requirements

I/A Series equipment is earthed via the green wire (or green/yellow wire) provided in the
customer-installed power lines. Figure 25-1 shows a typical I/A Series power and earth distribu-
tion configuration. A configuration (network) of this type is intended for installations where
power and earth distribution are dedicated solely to the I/A Series equipment, including a metal
enclosure, and peripheral devices such as a workstation.
Two variations of the power and earth network shown in Figure 25-1 are available for those cases
where the power and earth network cannot be dedicated solely to the I/A Series equipment. The
first option, shown in Figure 25-2, is used when non I/A Series equipment is connected to the
same power and earth network as the I/A Series system, and electrical noise from this equipment
134
25. System Power and Earthing (Grounding) B0193AB – Rev V
prevents achieving a zero voltage earth reference. (This option typically can be employed when an
existing power distribution panel is being used with the I/A Series system.)
The second option, shown in Figure 25-3, is used when the electrical noise levels generated by the
non I/A Series equipment are so high that the measures taken in the first option (Figure 25-2) are
not sufficient to achieve the required zero voltage earth reference.
All I/A Series equipment in a node, including associated peripheral devices, should be connected
to the same system earth. However, with communication processor modules, the connected
peripherals may be referenced to plant utility earth, provided that the same plant utility earth is
used for all (a maximum of four) connected devices.
Using Power Distribution Panel

Equipment
Dedicated to I/A Series Equipment Enclosure Enclosure
Earth Bus
Power Distribution
Note 7 Panel (Typical)
Notes 5 & 7 L N E
Line
L LNE *
Neutral L
To
Plant Earth N N Note 9 Note 8
Utility (Ground) E E
Earth L LNE Peripheral
Device
N (Typical)
E
L LNE Note 1
E
L N E
Enclosure
Earth Bus
Note 2 Note 1
Equipment
Enclosure
See Note 10
To Plant Note 3 System Earth (Plant Earth Grid,

Utility Earth Driven Earth Rod, or other
Note 4 Note 6 acceptable Earth)
*Earth connection made at

factory (installer does not
make this connection).
Figure 25-1. I/A Series Power and Earth Distribution
Notes to Figure 25-1:

1. The symbol represents an isolated component.
2. Earth per local code.
135
3. Insulated wire, size per local code.

4. When using a dedicated system earth (for example, a driven earth rod), and when gal-
vanic connection to plant utility earth is required, this connection must have an
inductance of > or = to 20µH, with low stray capacitance. A suitable high frequency
choke, or an insulated conductor of 6 AWG (16 mm2) minimum, with a length of
20 m (60 ft), may be used for this purpose.
5. Power cables must be run in separate trays or conduits from communication circuit
signal cables to avoid exposing the signal cables to electromagnetic fields produced by
the power cables. Refer to National Electrical Code Para. 800-52(c).
6. Each separately derived power source for I/A Series equipment must return to a single
earthing point (plant earth grid or other acceptable earth). The following earth resis-
tance values must be adhered to and maintained per IEEE std. 142 – 1972:
♦ For power plant applications, earth resistance must be 1 Ω or less.
♦ For industrial plants, earth resistance must be 5 Ω or less.
7. Refer to the appropriate section of this document for I/A Series equipment power
consumption and maximum wire size restrictions.
8. Peripherals connected to the Communications Processor 10/15 must derive power
from the same source. This avoids different earth potentials between the attached
peripherals.
9. Use receptacles with isolated earth terminals (that is, earth terminal not connected to
metal housing). National Electrical Code Para. 250-74, Exception Number 4,
describes the use of receptacles with isolated earths. This provides for running the iso-
lated earth conductor with the branch circuit conductors to the power panel.
10. In noisy environments (that is, power distribution panels with branch circuits supply-
ing power other than I/A Series equipment, and where a zero-voltage reference cannot
be achieved), the following apply: (1) In the United States, refer to the exception to
the 1996 National Electrical Code Para. 384-20; (2) In Canada, refer to the Canadian
Electrical Code, CSA® Standard C22. 1 – 1994, Section 10-906(9). Under these con-
ditions, the power distribution panel is earthed to building steel or per local code.
Where I/A Series system branch circuits are mixed with other branch circuits in the
power distribution panel, the I/A Series earth conductors can pass through the panel
without being terminated at the ground bus bar and can be connected directly to the
power system earthing point. The text, Figure 25-2 and Figure 25-3 do not show the
power equipment ground conductor being eliminated. The “separate conductor”
shown in Figure 25-3 is in addition to the existing power equipment ground
conductor.
136
Using Power Distribution Panel

with I/A Series Equipment
Power Distribution
Panel (Typical)
L LNE
Branch Circuit to Non
L N I/A Series Equipment
N E
E L LNE
Branch Circuit to
N I/A Series Equipment
E
L LNE
N
Receptacle for
E
I/A Series Equipment
Note 1
Note 2
System Earth (Plant Earth Grid,
Driven Earth Rod, or other
acceptable Earth)
Figure 25-2. I/A Series Power and Earth Distribution – First Option
Notes to Figure Figure 25-2:

1. In noisy environments (that is, power distribution panels with branch circuits supply-
ing power other than I/A Series equipment, and where a zero-voltage reference cannot
be achieved), the following apply: (1) In the United States, refer to the exception to
the 1996 National Electrical Code Para. 384-20; (2) In Canada, refer to the Canadian
Electrical Code, CSA Standard C22. 1 – 1994, Section 10-906(9). Under these con-
ditions, the power distribution panel is earthed to building steel or per local code.
Where I/A Series system branch circuits are mixed with other branch circuits in the
power distribution panel, the I/A Series earth conductors can pass through the panel
without being terminated at the ground bus bar and connected directly to the power
system earthing point. The text, Figure 25-2 and Figure 25-3 do not show the power
equipment ground conductor being eliminated. The separate conductor shown in
Figure 25-3 is in addition to the existing power equipment ground conductor.
137
2. As an alternative to making earth connections at the system earth point, these

connections may be made to a strap inside the power distribution panel, where per-
mitted by local code. This earth strap must be (1) isolated from the power distribution
panel, (2) solely dedicated to the I/A Series equipment, and (3) connected to system
earth using an insulated wire, whose size is specified by local code.
Using Existing Power Distribution

Panel in a High-Noise Environment
Equipment
Enclosure Enclosure
Earth Bus
Power Distribution To Non

Panel (Typical) I/A Series
Equipment L NE
L LNE
*
L N
N E
L LNE
E
N Run #8 AWG (10 mm2) insulated green
E wires as close as possible to power
L wiring to minimize ground loop effects.
LNE
N *
See Note 1 E L NE
Enclosure
Earth Bus
Equipment
Enclosure
Note 2
*Earth connection made at

factory (installer does not
make this connection).
System Earth (Plant Earth Grid,
Driven Earth Rod, or other
acceptable Earth)
Figure 25-3. I/A Series Power and Earth Distribution – Second Option

1. Refer to the appropriate section of this document for I/A Series equipment power
consumption and maximum wire size restrictions.
2. For Figure 21-3 only. Use this option when the option defined in Figure 25-2 (also
read Note 1) does not satisfy the zero-voltage reference requirement. It is intended for
high noise environments (that is, power distribution panels with branch circuits sup-
plying power to other than I/A Series equipment). The additional grounds in
Figure 25-3 are supplemental to the existing power equipment ground.
138
! WARNING
Each enclosure and panel display station in the I/A Series system is equipped with a
safety (green wire or green/yellow wire) earth (ground) connection point. All other
system units are equipped with safety earth conductors in their power cords. All
safety connection points and cables must be connected to the system earth (plant
earth grid, driven earth rod, or other acceptable earth) by qualified personnel and in
strict accordance with applicable national, regional, and local electrical safety codes
and regulations. Failure to comply may result in serious injury to personnel and
damage to the equipment.
Isolation From SPECTRUM Systems

When an I/A Series system is configured to operate with a SPECTRUM system, SPECTRUM
Slave Gateway provides total isolation from the FOXNET Communications Rack. Thus, special
earthing of I/A Series equipment specifically to accommodate the SPECTRUM system is not
required.
Signal (Logic) Earthing Requirements

Signal (that is, dc logic) earthing is inseparable from power (that is, safety) earthing and, thus,
fundamentally is accomplished when the power earthing is completed. However, if a shared power
facility (a facility that supplies power to I/A Series equipment as well as to non I/A Series equip-
ment) is used, and electrical noise from the non I/A Series equipment prevents a zero voltage earth
reference from being achieved, then additional earthing connections are required for I/A Series
equipment.
The additional earthing involves connecting a 10 sq. mm (8 AWG) insulated green wire between
the earth bus in each I/A Series enclosure and the system earth (plant earth grid, driven earth rod,
or other acceptable earth). These additional earth wires should be run as close as possible to the
power wiring to minimize ground loop effects. Refer to System Equipment Installation (B0193AC)
for information on where to make earth connections.
NOTE
Signal wires may enter the applicable equipment using the same route as the power
cables, provided that separation of the signal and power cables is maintained.
Achieving a zero voltage earth reference at the earth bus, as described above, is essential to proper
Nodebus and Fieldbus earthing, which is described in the following paragraphs.
High Performance System Network Earthing

For High Performance System network earthing requirements, refer to the following:
♦ Redundant Control Network Interface (PSS 21H-7B6 B4)
♦ Nodebus/Control Network Interface (PSS 21H-7B5 B4)
♦ High Performance System Network User’s Guide (B0400DV).
139
Carrierband LAN Cable System Earthing

Figure 25-4 shows the I/A Series coaxial Carrierband LAN cable system earthing concepts. The
LAN couplers and trunk cables must be installed per NEC, Community Access Television
(CATV), and international/national/regional/local codes. All elements of the coaxial Carrierband
LAN cabling and earthing are your responsibility or that of your installation representative.
NOTE
For earthing information pertaining to the fiber optic Carrierband LAN, refer to
Network Cable Systems Planning (B0193UX) and Network Cable Systems Installation
and Maintenance (B0193UW).
The Carrierband LAN coaxial cable shields are automatically earthed to their respective devices
(such as passive taps, or coax termination assemblies) when the cable connections to these devices
are made. As illustrated in Figure 25-4 you must make the following earth wire connections:
♦ Connect each passive tap to the system earth. (Daisy-chain connections between pas-
sive taps are not allowed.)
♦ If the system earth is more than 200 feet away, consider connecting the passive tap
ground to the enclosure system ground where the LAN module is installed, and from
which it is powered. This ensures that the passive tap ground is never longer than the
drop cable (100 ft). When using this method, be aware of the possible sources of fac-
tory or plant noise. To minimize the passive tap ground cable distance, locate the
passive tap near the I/A Series enclosure.
♦ Connect each coaxial termination assembly to its respective enclosure earth bus.
♦ At the entry point into the building, earth the trunk cable to the plant utility earth. In
the example shown in Figure 25-4, a splice is connected to the trunk cable at the
building entry point specifically for this purpose.
Network Cable Systems Planning (B0193UX) and Network Cable Systems Installation and
Maintenance (B0193UW) provide more detailed information.
140
Passive
Taps Splice
(5 Shown) (See Note 4)
Carrierband LAN Note 1 Note 1 Building

Trunk Cables Entry Point
(see Note 3)
To Plant
Utility Earth
Coax Termination Assy

Coax Termination Assy
Note 5 Note 1 Note 1
Equipment Equipment
Enclosure Enclosure
Carrierband Carrierband
LAN Interface LAN Interface
Module Module
Enclosure Enclosure
Earth Bus * * Earth Bus
*Earth connection made at System Earth (Plant Earth
factory (installer does not Grid, Driven Earth Rod, or
make this connection). other acceptable Earth)
Figure 25-4. Carrierband LAN Cable System Earthing

1. The symbol represents an isolated component. In a high noise environment,
where passive taps secured to building steel may induce noise into the LAN system, it
is recommended that the passive taps be electrically isolated from building steel, where
allowed by code.
2. LAN trunk cables, passive taps, and terminators are to be installed and earthed per
Network Cable Systems Planning (B0193UX).
3. The splice at the building entry point is used for cable connection purposes only.
4. Each passive tap actually contains two or four drop-cable connectors. For simplicity,
only one is shown.
This LAN contains some insulated wire, not smaller than 14 AWG (2.5 mm2). Refer to National
Electrical Code Para. 820-22.
Nodebus Earthing
Earthing considerations for the Nodebus involve two types of Nodebus configurations:
♦ Local Nodebus (the configuration is located within an enclosure or between
enclosures).
♦ Remote Nodebus (the configuration uses Nodebus Extender Module pairs).
141
Local Nodebus earthing is accomplished inside the enclosure(s), when the installer makes the
cable connections to the associated brackets and/or mounting structure buses. [Refer to System
Equipment Installation (B0193AC) for details.]
Figure 25-5 illustrates the remote Nodebus earthing concepts. The installer connects a Nodebus
cable shield earthing strap to the enclosure earth bus at only one end of the Nodebus. [Refer to
System Equipment Installation (B0193AC) for details.] To run the remote Nodebus cable outdoors
(that is, between buildings), take these precautions:
♦ Invensys Foxboro recommends that a common earth be provided between both Node-
bus segments. If a common plant earth grid is not available, it is possible to bond the
two plant earth systems if the distance between the two is short enough to provide an
effective earth. This common earth avoids the possibility of any differential earth
potentials where the remote Nodebus cable is connected.
♦ Install the extended Nodebus cable, Invensys Foxboro Part Number P0170LT, in steel
conduit throughout the full run, and bond the conduit to the plant earth at each
building entry point.
♦ Install the extended Nodebus cable, Invensys Foxboro Part Number P0170LT, in a
weathertight and watertight environment.
Nodebus
Termination
Assemblies
Equipment Equipment
Enclosure Enclosure
Nodebus Nodebus
Interface Interface
Modules Modules
(Pair) (Pair)
See
Note
Enclosure Nodebus Shield Earthing Strap

Earth Bus (used only at one end of Nodebus)
Note: The symbol represents an isolated component.
Figure 25-5. Remote Nodebus Earthing
Fieldbus Earthing
There are two types of I/A Series Fieldbus extension configurations:
♦ Local Fieldbus extension which connects Fieldbus extension cables between mounting
structure buses in an enclosure to provide a Fieldbus length of 10 m (30 ft) maximum.
♦ Remote Fieldbus extension which uses termination cable assemblies (TCAs) and
Fieldbus Isolators to provide cable connections between primary and extended Field-
bus segments, for a maximum Fieldbus length of 1800 m (6000 ft).
142
NOTE
This maximum cabling length assumes that Invensys Foxboro Part Number
P0170GF or P0170GG twinaxial cable is used.
The local Fieldbus extension is used only in the same enclosure or adjacent enclosures, and is
earthed by internal enclosure earth connections.
Figure 25-6 illustrates the remote Fieldbus extension earthing concepts. The installer daisy-chains
all remote Fieldbus shields, and connects an earth cable between the shield terminal on the last
TCA to the enclosure earth bus. [Refer to System Equipment Installation (B0193AC) for details.]
Equipment Equipment
Enclosure Note 1 Enclosure
Control T T Fieldbus
Processor C C Isolator
Module A A Module
Equipment
Enclosure
T Fieldbus
C Isolator
A Module
Note 2
Enclosure
Earth Bus
Figure 25-6. Remote Fieldbus Extension Earthing

1. The shield or third conductor of extended or remote Fieldbus communication cable
provides the reference for the isolated power supplies in the related modules. Accord-
ing to the E.I.A. RS-485 specification, these shields or third conductors must be
daisy-chained between modules and then single-point earthed at the enclosure farthest
from the I/A Series communication source (such as a control processor).
2. Connect an insulated 14 AWG (2.5 mm2) green wire from the shield connection
point in the last I/A Series enclosure to the enclosure earth bus in that enclosure. For
detailed information, refer to System Equipment Installation (B0193AC).
143
Field Wire Earthing

Figure 25-7 illustrates three configurations for terminating the field wiring shields. It is preferable
to earth the field wiring shields at the system end. If no marshaling rack is used, you must supply
an isolated shield bus bar. (Contact an Invensys Foxboro Field Service representative for informa-
tion on the mounting location of the isolated shield bus bar.) The isolated shield bus bar must
then be connected with an 8 AWG (10 mm2) insulated green wire or green/yellow-wire to plant
utility earth. The shields must not be terminated directly at the I/A Series enclosure DIN rail, as
this potentially can inject noise into the I/A Series equipment.
If a marshaling cabinet is used, the shield bus bar can be located in the cabinet. Using shielded
cables between the marshaling cabinet and the I/A Series enclosure is not required, but if shielded
cables are used, the shields must be connected in the marshaling cabinet only.
For information on field connections to I/A Series equipment, refer to System Equipment
Installation (B0193AC).
144
(1) Field Device Powered by Customer Source

Note 2
Equipment Enclosure
Field
FBM TCA Device
FBM TCA Field Notes to Figure 21-7:

Device
1. Connecting I/O signal shields to
the I/A Series enclosure DIN rails or
enclosure earth bus is not permitted.
(2) Field Device Power at I/A Series End
Equipment Enclosure Note 1 2. If the field device is not earthed,
connect the I/O signal shield to the
Field
FBM TCA Device plant safety earth at a point
near the field device.
FBM TCA Field
Device
*Isolated Shield To Plant Utility Earth

Bus Bar
(3) Field Device Wired via Marshalling Cabinet

Equipment Enclosure Marshalling
Cabinet
Field
FBM TCA Device
FBM TCA Field

Device
To Plant Utility Earth

*Customer-supplied. For installation
location, contact Invensys Foxboro Field
Service representative.
Figure 25-7. Field Wire Earthing
145
Uninterruptable Power Supply Sizing

When sizing an uninterruptable power supply (UPS) for the I/A Series equipment, two major fac-
tors must be considered: the crest factor and the volt ampere (VA) values (power consumption
values).
The crest factor is determined by the design of the equipment. It is defined as the ratio of the peak
(crest) current to the root mean squared (rms) current drawn by the equipment. The crest factors
for the ac industrial power modules (IPMs) used in the I/A Series enclosures are as follows:
Crest Factor
Type of IPM (crest/rms)
IPM02 -
IPM03A 2.0
IPM06A -
IPM07 -
For specifications on peak and rms currents and VA specifications for I/A Series equipment, refer
to the appropriate chapters of this document.
Consult with your UPS vendor for crest factor effects relating to specific UPS vendor require-
ments or specifications.
Power Distribution
Figure 21-8 shows a typical power distribution configuration for an I/A Series system.
NOTE
All enclosures housing Series 10, 30, 40 and 60 modules (except Field Enclosure 4)
in Figure 25-8 are depicted in the redundant power input configuration; that is,
with primary and backup ac or dc main power inputs. Field Enclosure 4 is depicted
in both the non-redundant and redundant configurations. Enclosures or MIW bays
with 50 Series processors, 70 Series processors, and P79, P80, P92, or P93 worksta-
tions may use an optional ac Transfer Switch to switch two separate and indepen-
dent power sources.
Factory power for I/A Series systems must be divided into branch circuits in a user-supplied
power distribution panel (load control center). Design of the power distribution network prima-
rily should take in account the quantity and type of equipment requiring power.
! WARNING
When 220 or 240 V ac power is provided to I/A Series systems, the ac supply must
have a neutral (earthed) conductor (N) with the 220 or 240 V ac potential between
the line (L) and neutral (N) conductors. Failure to comply may result in injury to
personnel and damage to the equipment.
146
EBB EBB EBB
Industrial Industrial Industrial

Enclosure 16 Enclosure 32 Enclosure 64
Factory Primary
Power Backup
P 1x8 Mounting
Workstation Field Enclosure 4 Field Enclosure 8
Structure
P P P
EBB EBB EBB
Color
Dot-Matrix Color InkJet
Dot-Matrix
Printer 80 Printer
Printer 132
21-inch VT 100
P Display P Compatible
Workstation Terminal
EBB = Optional external battery backup power

P = Factory power from outlets
H = Factory power from circuit breaker panel
Figure 25-8. Typical Overall Power Distribution System Power Configurations
Receptacles
Use compatible power receptacles for equipment having power cords with 3-prong National Elec-
trical Manufacturers’ Association (NEMA) plugs, or remove the plugs from the cords and replace
with plugs appropriate to the receptacles.
The receptacles must have isolated earth (ground) terminals (that is, the earth terminal not con-
nected to metal housing). National Electrical Code Paragraph 250-74, Exception Number 4,
describes the use of receptacles with isolated earth terminals. This involves running the isolated
earth conductor along with the branch circuit conductors back to the power distribution panel.
Power Cables
All customer-supplied power cables for interconnecting the power distribution panel and
I/A Series equipment must conform to National Electric Code (NEC) installation requirements,
or to the national code of practice for the country of installation. Power cables must be able to
conduct at least the rated current of the associated circuit breakers and must not exceed 6 mm2
(10 AWG). Allow approximately 1 m (3 ft) at the factory power distribution panel end of the
power cable and 2 m (6 ft) at the I/A Series enclosure end of the power cable for routing in the
panel and the enclosure.
147
Series 10, 30, 40 and 60 Modules

There are three separate configurations of power redundancy for each I/A Series enclosure hous-
ing 10, 30, 40 and 60 Series modules and workstation, as well as for the 1x8 and 1x8 FBM
Mounting Structure. These are identified as:
♦ Battery Backup Power Configuration
♦ Backup Power Configuration
♦ Nonstop Power Configuration.
Each of these configuration options is described in the following paragraphs. To select the specific
option for each piece of equipment, refer to the configuration documentation.
Battery Backup
The battery backup power configuration is used with a single (that is, non-redundant) input
power source. An Industrial Power Module (type IPM06A or IPM06D) is used singly or multiply,
providing battery backup power for the Random Access Memory (RAM) in Fieldbus Modules
(FBMs). If the input power source fails, the IPM06A or IPM06D module(s) automatically sup-
plies power to the FBM RAMs. One IPM06A or IPM06D module provides backup power for a
maximum of 30 minutes; multiple modules provide backup power for a slightly longer period. If
longer backup time is required, external batteries can be connected via the optional Power and
Status Tap for backup and battery backup power configurations.
Figure 25-9 is a simplified diagram of the battery backup power configuration. (Associated power
buses and external batteries are not shown.)
NOTE
The IPM06D battery backup power configuration is not allowed with a dc input
power source greater than 30 V, and cannot be used as a backup power source for
processor modules.
Single Input Junction Box

Power Source
IPM02 IPM02 IPM02 IPM02 IPM07
OR OR OR OR OR
*
Enclosure
IPM07
IPM06 IPM06 IPM06 IPM06
or
(A or D) (A or D) (A or D) (A or D) IPM09
*
Junction Box
IPM02 for ac power input with 100 ms additional holdup time.

Main Backup
IPM04 for 24 V dc power input.
Power Modules
IPM06 (A or D) for memory battery backup (30 minutes max).
*Optional for
NOTE: Optional Power and Status Tap can be used with this configuration. fan power.
Figure 25-9. Battery Backup Power Configuration
148
Backup
The backup power configuration is used with a single (that is, non-redundant) input power
source. A single Industrial Power Module (type IPM03A or IPM03D) provides backup power for
an associated group of four main power modules. If any main power module in the group fails,
the IPM03A or IPM03D module automatically takes over for the failed module by supplying
power to the Fieldbus Modules (FBMs) for all FBM power needs. In addition, another power
module (IPM06A or IPM06D), used singly or multiply, provides battery backup power to the
FBM RAMs. If the input power source fails, the module(s) automatically supplies power to the
FBM RAMs for a maximum of 30 minutes. If longer backup time is required, external batteries
can be connected via the optional Power and Status Tap.
Figure 25-10 is a simplified diagram of the backup power configuration. (Associated power buses
and external batteries are not shown.)
NOTE
The IPM03D backup power configuration is not allowed with a dc input power
source greater than 30 V, and cannot be used as a backup power source for processor
modules.
Single Input Junction Box

Power Source
OR OR OR OR OR
*
Enclosure
IPM07
IPM03 IPM06 IPM06 IPM06
OR
(A or D) (A or D) (A or D) (A or D) IPM09
*
Junction Box
IPM02 for ac power input with 100 ms additional holdup time. *Optional for
Main Backup IPM03 (A or D) for backup if a main power module fails. fan power.
Power Modules IPM04 for 24 V dc power input.
IPM06 (A or D) for memory battery backup (30 minutes max).
NOTE: Optional Power and Status Tap can be used with this configuration.
Figure 25-10. Backup Power Configuration
Non-Stop
The nonstop power configuration is used with a dual (redundant) input power source. The Indus-
trial Power Modules supplied by one input source provide backup power for the power modules
supplied by the other source. If one input source fails, the power modules supplied by the other
source automatically take over. In addition, if any power module supplied by one source fails, the
modules supplied by the other source automatically take over. However, separate internal or exter-
nal batteries cannot be used to provide backup power to the memory in the event that both input
power sources fail.
149
Figure 25-11 is a simplified diagram of the nonstop power configuration. (Associated power buses
are not shown.)
Primary Input Junction Box

Power Source
or or or or or
Enclosure *

or or or or or
*
Secondary Input Junction Box
Power Source
*Optional for
IPM02 for ac power input with 100 ms additional holdup time. fan power.
Main Backup
Power Modules
NOTE: Status Tap can be used with this configuration.
Figure 25-11. Nonstop Power Configuration
Workstations and Enclosures

Battery backup power for all workstations and enclosures housing 10, 30, 40 and 60 Series
modules can be internally or externally supplied with the following exception: when the non-stop
power configuration is used, the Memory Backup Power Module (type IPM06A or IPM06D) is
not required. This configuration does not allow using external batteries to provide backup power
for memory protection in the event that both factory power sources fail.
Fieldbus Modules
Battery backup power for Fieldbus Modules (FBMs) is provided by the power converters in the
associated Control Processor. The backup power is distributed via the mounting structure bus(es)
to all FBMs on the local Fieldbus that is connected to the associated Control Processor. When the
FBMs are remote from the associated Control Processor (that is, connected via an extended Field-
bus to the processor), memory battery backup power to the FBMs is provided by the Fieldbus Iso-
lator Module. The backup power is distributed via the mounting structure bus(es) to all FBMs on
the extended Fieldbus.
NOTE
The FBMs automatically switch to memory backup power upon loss of the 5 V dc
logic power within the FBMs.
150
Power and Status Tap

A combination Power and Status Tap is optionally available with battery backup and backup
power configurations in any workstation or enclosure. This tap, which connects to the intermedi-
ate power bus, supports the use of external battery backup power for memory protection and
power failure detection.
A Status Only Tap is optionally available with the nonstop power configuration in any worksta-
tion or enclosure. This tap connects to the intermediate power bus and enables power failure
detection only; it does not support the use of external battery backup power for memory
protection.
NOTE
Separate connector blocks are used for the power tap and the status tap. Each block
occupies one site on the DIN rail.
External Battery Memory Protection

The Power and Status Tap has an integral fuse for over-current protection, allows positive (+) or
negative (-) earthing and permits use of an external battery to provide extended backup power (for
periods exceeding 30 minutes) in case the single (non-redundant) power source fails.
NOTE
The external battery must provide a nominal output voltage of 18 V dc ±
10 percent.
Power Module Failure Detection

The Power and Status Tap and Status Only Tap can monitor the normally closed dry contacts in
Industrial Power Modules (IPMs) to report failures of the IPMs. The taps couple the contacts of
all the IPMs on a parallel power bus. The contacts (rated +30 V dc maximum at 100 mA maxi-
mum) can be wired to a customer-supplied external alarm or to the input of a digital Fieldbus
Module to subsequently generate a process alarm message.
Processors and Modules

The ac power input to each 50 Series processor, 70 Series processor, and P79, P80, P92, or P93
workstation and their peripherals is supplied directly by the ac power input to the enclosure
(mounting structure) power outlets. An optional ac transfer switch allows two separate and inde-
pendent sources of ac input to power processors and modules.
151
Glossary of Power Terms

Common Mode Noise
Noise that appears between both the input lines and a common reference
plane (ground), causing the potential of both lines to change simulta-
neously and by the same amount relative to the common reference plane.
Crest Factor The ratio of peak (crest) current value to the rms value of the current.
(Refer to “Uninterruptable Power Supply Sizing” on page 146.)
Earth Ground. Per National Electrical Code (NEC), a conducting connection,

whether intentional or accidental, between an electrical circuit or equip-
ment and the earth, or to some conducting body that serves in the place of
earth.
Earthed Grounded. Per NEC, connected, intentionally or unintentionally, to the

earth or to some conductive body that serves in the place of the earth.
Earthing Grounding. Per NEC, conductively connecting to the earth.
152
26. Signal and Power Cabling
This section contains information on signal and power cabling including routing, separation,
and lengths.
The physical arrangement of the equipment itself must be considered during site planning. Fac-
tors in determining this include:
♦ The routing method for the interconnecting signal and power cables,
♦ The length of the interconnecting signal and power cables, and
♦ The requirement for floor cutout areas (applicable to some enclosures and to the
Modular Industrial Console/Workstation).
Each of these factors is individually addressed in the following sections.
Routing
Wireways, Raised Floor, Overload Troughs, and Conduits
Power cables and inter-equipment signal cables are typically routed in wireways beneath a raised
floor, in overhead troughs, or in conduits imbedded in a solid floor. In computer and control
rooms, the raised-floor method offers inherent aesthetic value and relatively easy access to cables.
In other areas, overhead troughs or floor-imbedded conduits are more appropriate. However, both
site conditions and equipment design may require using a combination of these methods. The
recommended minimum requirements for each of these routing methods are as follows:
♦ Raised-floor height – 300 mm (12 in)
♦ Overhead trough size – 150 mm (6 in) by 150 mm (6 in)
♦ Conduit area1 – 232 cm2 (36 in2).
Enclosures and Workstations

Cables can be routed through either the bottom or top of enclosures and workstations as listed in
Table 26-1:
Table 26-1. Enclosure/Workstation Cable Entry
Cable Entry
Equipment Bottom Top
Field Enclosure 4 Yes No
Field Enclosure 81 Yes Yes
Field Enclosure 8 (Metal)1 Yes Yes
Industrial Enclosure 16 Yes Yes
Industrial Enclosure 32 Yes Yes
1.
Total area provided by multiple conduits of various diameters.
153
B0193AB – Rev V 26. Signal and Power Cabling
Table 26-1. Enclosure/Workstation Cable Entry (Continued)
Cable Entry
Equipment Bottom Top
Industrial Enclosure, Metal, Front Access Yes Yes
Industrial Enclosure, Metal, Front/Rear Access Yes Yes
Termination Enclosure, Metal Yes Yes
Multiple (Bridged) Ind. Enclosure 322 Yes Yes
Modular Industrial Console/Workstation Yes No
1.
Cables can also be routed into Field Enclosure 8 via the top or bot-
tom of the wall-mounted unit.
2.
Cables cannot be routed through the bottom or top of bridging
structure(s).
Separation
Power and signal wiring (cabling) is segregated into five classifications that, for safety reasons,
must be physically isolated from one another by mutually exclusive conduits, pipes, troughs, race-
ways and/or runs, and by using separate cable entries into enclosures. These cable classifications
are as follows:
Table 26-2. Power and Signal Cable Classifications
High Voltage Power Wires carrying power at voltages above 30 V ac rms (42.4 V peak)
or 60 V dc.
Low Voltage Power Wires carrying power at voltages below 30 V ac rms (42.4 V peak)
or 60 V dc.
High Voltage Signal Wires carrying signals at voltages above 30 V ac rms (42.4 V peak)
or 60 V dc.
Low Voltage Signal Wires carrying signals at voltages below 30 V ac rms (42.4 V peak)
or 60 V dc.
Non Incendive Signal Signal wires that enter or leave the equipment enclosure and, under
normal operating conditions, when shorted, opened, or grounded are
not capable, due to arcing or thermal effects, of igniting the specified
flammable gas/vapor-in-air mixture or combustible dust.
The minimum allowable distance between wires or groups of wires in different classifications is
50 mm (2 in) at all points along the wire run.
Refer to “Classification of Wires” on page 175 for additional information concerning
separation of wiring.
154
26. Signal and Power Cabling B0193AB – Rev V
! WARNING
Failure to separate wires by classification, as described herein, may result in injury to
personnel.
! CAUTION
Signal cables should not be routed in troughs, wireways, pipes, or conduits contain-
ing power cables, nor routed close to electric motors, welding machines, or other
equipment capable of generating significant amounts of electromagnetic interfer-
ence (EMI). Failure to comply may result in improper system operation.
Lengths
Determine the length of each cable required for interconnection as follows.
1. If the equipment is floor mounted with cable entry at the bottom, add the length
indicated in Table 26-3 to allow for routing within the equipment.
Table 26-3. Floor-Mounted, Bottom-Cable Entry
Equipment Maximum Length1

Field Enclosure 8 1372 mm (54 in)
Field Enclosure 8 (Metal) 1000 mm (39 in)
Industrial Enclosure 16 1372 mm (54 in)
Industrial Enclosure 32 2058 mm (81 in)
Ind. Enclosure, Metal, Front Access 2058 mm (81 in)
Ind. Enclosure, Metal, Front/Rear Access 2058 mm (81 in)
Termination Enclosure (Metal) 2058 mm (81 in)
Multiple (Bridged) Ind. Enclosure 32 2058 mm (81 in)
Modular Industrial Console/Workstation Bay 1067 mm (42 in)
1.
Measured from floor surface.
2. If the equipment is floor mounted with cable entry at the top, add the length
indicated in Table 26-4 to allow for routing within the equipment.
Table 26-4. Floor-Mounted, Top-Cable Entry

Field Enclosure 8 1372 mm (54 in)
Industrial Enclosure 16 1372 mm (54 in)2
Industrial Enclosure 32 2058 mm (81 in)2
155
Table 26-4. Floor-Mounted, Top-Cable Entry (Continued)

Ind. Enclosure, Metal, Front Access 2058 mm (81 in)
Ind. Enclosure, Metal, Front/Rear Access 2058 mm (81 in)
Termination Enclosure (Metal) 2058 mm (81 in)
Multiple (Bridged) Ind. Enclosure 32 2058 mm (81 in)
Modular Industrial Workstation Bay (side entry) 1067 mm (42 in)
1.
Measured from top surface of enclosure.
2.
Add 123 mm (4.8 in) if top is vented.
3. If the equipment is wall mounted or pipe mounted, add the length indicated in
Table 26-5 to allow for routing within the equipment.
Table 26-5. Wall or Pipe, Mounted, Cable Entry
Equipment Maximum Length

Field Enclosure 4 2260 mm (89 in)1
Field Enclosure 8 1372 mm (54 in)2
1.
Includes recommended distance of 1219 mm (48 in) from floor
surface to bottom of enclosure.
2.
Does not include distance from floor surface to bottom of enclo-
sure.
4. If the cable path is for a signal cable, ensure that the proposed final cable length does
not exceed the maximum allowable, as specified in Table 26-6, Table 26-7,
Table 26-8, and Table 26-9. Excess cable lengths are stored (at each end) external to
the applicable equipment.
Table 26-6. Inter-Equipment Cables
Maximum Cable
Length2
From1 To1 Meters Feet
Redundant Control Network P79, P80 or P92 workstation 30 100
Interface, or Fiber to Copper Wire
Converter
Carrierband LAN interface Carrierband LAN passive tap3, 4 30 100
module in any I/A Series enclosure
Nodebus in any I/A Series enclosure Extended Local Nodebus in any 30 100
other I/A Series enclosure4, 5
Nodebus Extender Module in any Nodebus Extender Module in any 300 1000
I/A Series enclosure other I/A Series enclosure3
156
Table 26-6. Inter-Equipment Cables (Continued)
Maximum Cable
Length2
Fieldbus in any I/A Series enclosure Extended Local Fieldbus in the same 10 30
enclosure
Fieldbus in any I/A Series enclosure Extended Remote Fieldbus in any 1800 6000
other I/A Series enclosure
SPECTRUM Interface Processor SPECTRUM Database Processor 150 500
(part of SPECTRUM Master (part of SPECTRUM Master
Gateway) in any I/A Series Gateway)
enclosure
SPECTRUM Slave Gateway in any SPECTRUM Linkport3 150 500
I/A Series enclosure
Integrator 30 for Modicon or J478 or J878 Modem (for — —
Modicon Gateway in any I/A Series Modicon Modbus)3
enclosure
Integrator 30 for Modicon or Modicon 584 Programmable — —
Modicon Gateway in any I/A Series Controller (direct connect)3
enclosure
Integrator 30 for Modicon or Modicon 984-380 or 984-680 — —
Modicon Gateway in any I/A Series Programmable Controller (direct
enclosure connection)3
Integrator 30 for Modicon or Modicon 884, 984A, or 984B — —
Modicon Gateway in any I/A Series Programmable Controller (direct
enclosure connection)3
Integrator 30 for Allen-Bradley Allen-Bradley Communications 12 40
Data Highway or ABDH Gateway Module3
in any I/A Series enclosure
Instrument Gateway Model F6501A Converter3 — —
Device Integrator 30 or Device RS-232-C compatible device — —
Gateway in any I/A Series enclosure
Model CFT10 Mass Flowmeter Control Processor in any I/A Series 1800 6000
enclosure
Model 760 and 761 Controllers Model F6501A Converter — —
Hydrostatic Interface Unit Control Processor in any I/A Series 1800 6000
enclosure
Control Processor in any I/A Series Panel Display Station 9 30
enclosure
FBM22 Fieldbus Module in any Auto/Manual Station 300 1000
Information Network Interface 10 Host computer (not I/A Series)3 12 40
or 15 in any I/A Series enclosure
157
Maximum Cable
Length2
INTERSPEC Integrator 30 in any INTERSPEC Integrator Translator — —
Dual Nodebus Interface (DNBI) 50 Series or 70 Series processor (AP, 45 150
module in any I/A Series enclosure AW, or WP) in any other I/A Series
enclosure, or to an Allen-Bradley
Station3
Dual Nodebus 10Base-T Interface 50 Series or 70 Series processor (AP, 91 300
(DNBT) module in any I/A Series AW, or WP) in any other I/A Series
enclosure enclosure
Dual Nodebus 10Base-T Interface Server 70 91 300
(DNBT) module in any I/A Series
enclosure
Dual Nodebus Interface Extender 50 Series processor (AP, AW, or WP) 500 1477
(DNBX) module in any I/A Series in any other I/A Series enclosure3 (10Base 2)
enclosure
Dual Nodebus Interface Extender Server 70 350 1500
(DNBX) module in any I/A Series
enclosure
Dual Nodebus Interface Extender Allen-Bradley Station3 120 400
(DNBX) module in any I/A Series (10Base 5)
enclosure
Model 51 X Terminal 50 Series processor (AP51B, 4.5 15
WP51B, AW51B, or AW51C)5
Any I/A Series serial printer 10 or 20 Series processor (CMP10 12 40
or AP20) in any I/A Series
enclosure3
Any I/A Series parallel printer, 50 Series processor (AP or AW), 70 4.6 15
without extender Series processor, or P79, P80, P92,
P93 workstations in any I/A Series
enclosure
Any I/A Series parallel printer, 50 Series processor (AP or AW), 70 15 50
with extender Series processor, or P79, P80, P92,
enclosure
Any I/A Series printer 50 Series processor (AP or AW), 70 15 50
Series processor, or P79, P80, P92
enclosure
158
Maximum Cable
Length2
VT100-Compatible Terminal 10 or 20 Series processor (CMP10 12 40
or AP20) in any I/A Series
enclosure3
VT100-Compatible Terminal 50 Series processor (AP or AW), 70 15 50
Series processor, P79, P80 worksta-
tion in any I/A Series enclosure3
21-Inch Standard Display Workstation Processor 30 or Video 150 500
Isolator in any I/A Series enclosure3
21-Inch Workstation Display 50 Series processor, 70 Series proces- 30 100
sor (AW or WP direct connection),
or P79, P80, P92, or P93 worksta-
tions in any I/A Series enclosure
21-Inch Workstation Display Server 70 30 100
21-Inch Workstation Display Customer power source 1.8 6
20.1-Inch LCD Flat Panel Customer power source 1.8 6
Tabletop Display
I/A Command Center 70 Series processor (AW or WP 15 50
LCD Flat Panel monitor direct connection) in any I/A Series
(18.1-inch x 20.1-inch) enclosure
I/A Command Center Server 70 15 50
LCD Flat Panel monitor
(18.1-inch x 20.1-inch)
17-Inch Workstation Display 50 Series processor (AW51B1 or 0.6 2
WP51B1, direct connection)
17-Inch Workstation Display Customer power source 1.8 6
Alphanumeric Keyboard 50 Series processor (AW or WP 30 100
direct connection) or 70 Series pro-
cessor, in any I/A Series enclosure6
Alphanumeric Keyboard P79, P80, P92 workstation (direct 2 6
connection)
Alphanumeric Keyboard P79 or P80 workstation (remote 30 100
connection)
Alphanumeric Keyboard Workstation Processor 30 (direct — —
connection) in any I/A Series enclo-
sure
21-Inch Workstation Display GCIO interface module in or on a 0.6 2
workstation bay, or on a table top
Annunciator or GCIO interface module in or on a 1.8 6
Annunciator/Numeric Keyboard workstation bay, or on a table top
159
Maximum Cable
Length2
Annunciator or Annunciator or 1.8 6
Annunciator/Numeric Keyboard annunciator/numeric keyboard
GCIO Interface Module in or on a 50 and 70 Series processors (AW or 30 100
workstation bay, or on a tabletop WP), or P79, P80, P92, or P93
workstations in a Workstation Bay,
or in any I/A Series enclosure7
GCIO Interface Module in or on a Server 70 30 100
workstation bay, or on a tabletop
GCIO Workstation Bay GCIO workstation bay 30 100
GCIO Interface Module on a table Customer power source 1.8 6
or workstation top
Alphanumeric Keyboard Mouse or trackball 0.3 1
Alphanumeric Keyboard Industrial pointing device for use in 1.8 6
hostile environments
1.
Any I/A Series enclosure” refers to any one of the enclosures that can contain the applicable device. For
example, one end of the Carrierband LAN drop cable is connected inside the I/A Series enclosure that
houses the Carrierband LAN interface module, and the other end is connected to a passive tap on the
LAN. This information is developed during the site planning phase.
2.
Signal cables only (except when otherwise indicated).
3.
Maximum cable length does not include interface cable(s) inside the enclosure(s).
4.
RG-6 type cable; maximum length permitted is 50 m (165 ft) for customer-supplied cable.
5.
The maximum total cable length of a Nodebus segment (that is, of local Nodebus A or B) is 30 m
(100 ft), and is achieved by using the extension cable coupler to interconnect the local Nodebus exten-
sion cables. This maximum length does not include the mounting structure bus lengths.
6.
X Terminal to processor cabling is made via the 4.5 m (15 ft) cable supplied with the X Terminal. For
greater cabling lengths, you may fashion or purchase separately a cable of specific length required for the
application.
7.
Maximum cable length does not include the 1.2 m (4 ft) interface cable at the 50 Series processor, or
the 1.8 m (6 ft) interface cable at the keyboard
Table 26-7. Long-Length Cables -- Electrical Data
Specification Remote
1
Type Nodebus Fieldbus2
Capacitance – 65.6 pF/m
(20 pF/ft) max.
Impedance 50 ± 2 Ω 100 ± 10Ω
Loop Resistance 10 mΩ/m (3.04 mΩ/ft) —
Velocity of Propagation 77% —
160
Table 26-7. Long-Length Cables -- Electrical Data (Continued)
Specification Remote
Type Nodebus1 Fieldbus2
Attenuation 18 dB/km (11.2 dB/mi) measured with —
10 MHz sine wave; 12 dB/km
(7.5 dB/mi) measured with 5 MHz sine wave
1.
Compatibility: ANSI/IEEE Std. 802.3; ISO/DIS 8802/3
2.
Compatibility: IEEE RS 485
Table 26-8. Long-Length Cables -- Electrical Data
Specification Type Remote Fieldbus1

Capacitance 65.6 pF/m
(20 pF/ft) max.
Impedance 100 ± 10 Ω
Loop Resistance –
Velocity of Propagation –
Attenuation –
1.
Compatibility: IEEE RS 485
Table 26-9. Long-Length Cables -- Physical Data
Specification Type Nodebus Remote Fieldbus

Center Conductor 2.18 ± 0.013 mm (12 AWG) 0.322 mm diameter (22 AWG)
diameter solid copper Twinaxial
Nominal Diameter 6.27 mm (0.247 in) 5.33 mm (0.210 in)
Over Dielectric
Overall Cable Diameter 9.5 ± 0.25 mm (0.375 ± 0.010 in) 7.5 mm (0.295 in) maximum
flouropolymer
Outer Shield Diameter 8.25 ± 0.18 mm (0.325 ± 0.007 in) 6.62 mm (0.261 in)
Outer Shield Coverage > 80% 100%
Bending Radius 152 mm (5.98 in) minimum 76.2 mm (3.0 in) minimum
Safe Pulling Tension 116 kg (225 lbs) maximum 3.8 kg (8.5 lbs) maximum
Jacket 56 mm (0.022 in) flouropolymer 0.89 mm (0.035 in) nominal w
all thickness (XLPE)
Operating and Storage -70 to 200 °C (-94 to 392 °F) -40 to 125 °C
Temperature (-40 to 257 °F)
Invensys Foxboro P/N N/A P0170GF (PVC),
P0170GG (XLPE)
161
Table 26-10. Long-Length Cables -- Physical Data
Specification Type Remote Fieldbus

Center Conductor 0.322 mm diameter (22 AWG) Twinaxial
Nominal Diameter Over Dielectric 5.33 mm (0.210 in)
Overall Cable Diameter 7.5 mm (0.295 in) maximum
Outer Shield Diameter 6.62 mm (0.261 in)
Outer Shield Coverage 100%
Bending Radius 76.2 mm (3.0 in) minimum
Safe Pulling Tension 3.8 kg (8.5 lbs) maximum
Jacket 0.89 mm (0.035 in) nominal wall thickness (XLPE)
Operating and Storage Temperature -40 to 125° C
(-40 to 257° F)
Invensys Foxboro P/N P0170GF, P0170GG (XLPE)
For Carrierband LAN cables, or fiber optic LAN or fiber optic Fieldbus cables, refer to
Network Cable Systems Planning (B0193UX).
162
27. Electrical Power Requirements
The following sections describe the power requirements for each enclosure and for the 1x8 and
1x8 FBM mounting structures and the power requirements for each component that can be
loaded into a mounting structure. Also listed are the power requirements (voltage, frequency
and consumption) for the 50 Series devices and the power requirements (voltage, frequency and
consumption) for peripheral and human interface devices.
The power requirements for each enclosure, workstation, and 1x8 mounting structure vary with
the configuration and are determined by the type of Industrial Power Modules (IPMs) required to
satisfy the power redundancy requirements. Conversely, the power requirements for each other
type of module as well as each peripheral and human-interface device are fixed within predeter-
mined limits. However, the input operating voltage for some peripheral devices is selectable
within the specified ranges.
For further information on satisfying the requirements of the European Community Electromag-
netic Compatibility (EMC) Directive as they apply to the I/A Series product line, refer to Euro-
pean Union CE-Mark Compliance Manual (B0193UU).
The power requirements for each enclosure and for the 1x8 and 1x8 FBM mounting structures
are a function of the power configuration, as indicated in Table 27-1. (Refer to the configuration
documentation for identification of the specific power configuration selected for each piece of
equipment.)
NOTE
In addition to the power requirements addressed in the following tables,
Field Enclosures 4 and 8 also contain heaters which, in some configurations, require
separate power inputs directly from the customer’s power source. Refer to “FE4
Field Enclosure Heaters” on page 11 and “FE8 Power Distribution” on page 20 for
additional information.
163
B0193AB – Rev V 27. Electrical Power Requirements
Table 27-1. IPM Power Configuration/IPM Cross-Reference
Industrial Power Module Options

Power Power Source
Configuration1 Type2 Function Type3
Battery Backup4 Single Main Backup IPM02 or IPM04, IPM06 (A or D) only
Backup4 Single Main Backup IPM02 or IPM04, IPM03 (A or D) and
IPM06 (A or D), IPM05
Non-Stop5 Dual Main Backup IPM02, IPM04, or IPM05, IPM02, IPM04,
or IPM05
1.
The three power configurations are described in Chapter 25 “System Power and Earthing (Ground-
ing)”.
2.
Customer power source: single = non-redundant; dual = redundant.
3.
The type code is a convenient identifier only; it is not a model number. Refer to Table and Table for
power specifications on each Industrial Power Module.
4.
The battery backup and backup power configurations can accommodate an optional Power and
Status Tap. This tap enables power module failure to be detected, and allows external batteries to be
connected and used as additional backup power for memory only.
5.
The Non-Stop power configuration can accommodate an optional Status Tap. This tap only enables
power module failure to be detected; it does not allow external batteries to be used for memory
backup power.
Table 27-2. IPM Voltage and Frequency Input Requirements
Voltage1
Frequency Range
Type Name Type Range (Hz)
IPM02 Extended Ride-Through ac Power Module ac 85 to 110 47 to 63
ac 102 to 132 47 to 63
ac 187 to 242 47 to 63
ac 204 to 264 47 to 63
IPM03A ac Power Module (Backup) ac 85 to 110 47 to 63
ac 102 to 132 47 to 63
ac 187 to 242 47 to 63
ac 204 to 264 47 to 63
IPM03D 24 V dc Power Module (Backup) dc 19 to 29 —
IPM04 24 V dc Power Module dc 19 to 29 —
IPM05 125 V dc Power Module dc 108 to 145 —
IPM06A Memory Backup Power Module (ac input) ac 85 to 110 47 to 63
(See Note) ac 102 to 132 47 to 63
ac 187 to 242 47 to 63
ac 204 to 264 47 to 63
IPM06D Memory Backup Power Module dc 19 to 29 —
(24 V dc input) (See Note below)
164
27. Electrical Power Requirements B0193AB – Rev V
Table 27-2. IPM Voltage and Frequency Input Requirements (Continued)
Voltage1
Frequency Range
Type Name Type Range (Hz)
IPM07 ac Fan Power Module ac 85 to 110 47 to 63
ac 102 to 132 47 to 63
ac 187 to 242 47 to 63
ac 204 to 264 47 to 63
IPM08 125 V dc Fan Power Module dc 108 to 145 —
IPM09 24 V dc Fan Power Module dc 19 to 29 —
1.
Only one input voltage range is specified during configuration for modules having multiple input
ranges.
NOTE
Batteries for the Memory Backup Power Module (IPM06A and IPM06D) are
shipped disconnected, and must be connected during equipment installation.
Table 27-3. IPM Power Consumption
Maximum Power
Consumption
Type Name Watts VA
IPM02 Extended Ride-Through ac Power Module 81 132
IPM03A ac Power Module 90 152
IPM03D 24 V dc Power Module 76 —
IPM04 24 V dc Power Module 75 —
IPM05 125 V dc Power Module 79 —
IPM06A/D Memory Backup Power Module(s) 7 9
IPM07 ac Fan Power Module 19 30
IPM08 125 V dc Fan Power Module 11 —
IPM09 24 V dc Fan Power Module 10 —
165
Refer to Table 27-1 and to the configuration documentation for the type of Industrial Power
Modules used in each equipment. The maximum number of IPMs that can used in each enclo-
sure and in the 1x8 mounting structure is as follows:
Table 27-4. 1x8 Mounting Structure
Enclosure IPM Quantity

Field Enclosure 4 6 (includes 2 for fan power)
Field Enclosure 8 4
Industrial Enclosure 16 12 (includes 4 for fan power)
Industrial Enclosure 32 20 (includes 4 for fan power)
Mult. (Bridg.) Ind. Enclosure 32 20 (includes 4 for fan power) within each enclosure
1x8 Mounting Structure 4
1x8 FBM Mounting Structure 4
Loadable Mounting Structure Components

The following sections describe the power requirements for each component that can be loaded
into a mounting structure.
Processor and Communications Modules

Table 27-5 lists the power requirements for the processor and communications modules.
Each module requires a 26 to 42 V dc input voltage which is provided by the IPMs.
Table 27-5. Processor and Communications Modules Power Consumption
Maximum Power
Module Name Type Consumption (Watts)
Application Processor 20 AP20 14.0 non-fault-tolerant,
28.0 fault-tolerant
Control Processor 10 or Fault-Tolerant CP10 CP10 14.0 non-fault-tolerant,
28.0 fault-tolerant
Control Processor 30 or Fault-Tolerant CP30 CP30, CP30FT 14.0 non-fault-tolerant,
28.0 fault-tolerant
34.0 fault-tolerant
34.0 fault-tolerant
Tank Processor 10 TP 14.0
166
Table 27-5. Processor and Communications Modules Power Consumption (Continued)
Maximum Power
Module Name Type Consumption (Watts)
Device Integrator 30 or Fault-Tolerant DI30 DI30, DI30FT 15.0 non-fault-tolerant,
30.0 fault-tolerant
Allen-Bradley DH Integrator 30 or AB30, AB30FT 15.0 non-fault-tolerant,
Fault-Tolerant AB30 30.0 fault-tolerant
Allen-Bradley DH Integrator 30, Redundant ABDH-R 30.0
Modicon Integrator 30 or Fault-Tolerant MI30 MI30, MI30FT 15.0, non-fault-tolerant,
30.0 fault-tolerant
INTERSPEC Integrator Translator IIT 11.0
Information Network Interface 10 INI10 11.0
Information Network Interface 15 INI15 11.0
SPECTRUM Interface Processor SIP 11.0
Carrierband LAN Interface CLI 16.0 non-fault-tolerant,
32.0 fault-tolerant
Fiber Optic Carrierband LAN Interface FOCLI 16.0 non-fault-tolerant,
32.0 fault-tolerant
Nodebus Extender (coaxial) NBE 8.0
Nodebus Extender (fiber optic) FONBE —
Dual Nodebus Interface DNBT 8.0
167
Fieldbus Modules
Table 27-6 lists the power requirements for the Fieldbus Modules. Each module requires an input
voltage range of 26 to 42 V dc, which is provided by the Industrial Power Modules.
NOTE
For power consumption information on modules used with DIN rail mounted
FBM equipment, refer to DIN Rail Mounted FBM Subsystem User’s Guide
(B0400FA).
Table 27-6. Fieldbus Modules Power Consumption
Power
Consumption
Type Module Name (Watts)
FBM01 0 to 20 mA Input Interface 14.0
FBM02 Thermocouple/Millivolt Input Interface 9.0
FBM03 RTD Input Interface (0 to 320 ohms) 9.0
FBM04 0 to 20 mA I/O Interface 14.0
FBM04 Redundant 0 to 20 mA I/O Interface 14.0
FBM05 Redundant 0 to 20 mA I/O Interface 14.0
FBM06 Pulse Input, 0 to 20 mA Output Interface 15.0
FBM07 Contact/dc Input Interface 7.0
FBM08 120 V ac Input Interface 5.0
FBM09 Contact/dc I/O Interface 8.0
FBM10 120 V ac I/O Interface 7.0
FBM11 240 V ac I/O Interface 7.0
FBM12 Contact/dc Expansion Input Interface 5.0
FBM13 120 V ac Expansion Input Interface 2.0
FBM14 Contact/dc Expansion I/O Interface 3.0
FBM15 120 V ac Expansion I/O Interface 4.0
FBM16 240 V ac Expansion I/O Interface 4.0
FBM17 0 to 10 V dc, Contact/dc I/O Interface 11.0
FBM18 Intelligent Transmitter Interface 11.0
FBM20 240 V ac Input Interface 5.0
FBM21 240 V ac Expansion Input Interface 2.0
FBM22 Single 4 to 20 ma I/O A/M Interface 10.0
FBM24 Contact/125 V dc Input Interface 8.0
FBM25 Contact/125 V dc Expansion Input Interface 5.0
FBM26 Contact/125 V dc I/O Interface 8.0
FBM27 Contact/125 V dc Expansion I/O Interface 5.0
FBM33 RTD Input Interface (0 to 30 ohms) 9.0
168
Table 27-6. Fieldbus Modules Power Consumption (Continued)
Power
Consumption
Type Module Name (Watts)
FBM36 Type R Thermocouple/mV Input Interface 9.0
FBM37 0 to 20 mA Output Interface 14.0
FBM39 Intelligent Transmitter/0 to 20 mA Interface 13.0
FBM41 High Power Contact/dc I/O Interface 9.0
FBM42 High Power Contact/dc I/O Expansion Interface 6.0
FBM43 Dual Baud Rate Intelligent Transmitter Interface Module 11.0
FBM44, Dual Baud Rate Intelligent Transmitter 13.0
FBM46 0 to 20 mA Output Interface Module
FBI Fieldbus Isolator 3.5
Modular Mounting Structure Components

Table 27-7 lists the power requirements (voltage, frequency and consumption) for the processors
and devices. The consumption specifications are typical.
Table 27-7. Peripheral and High Devices Power Requirements
Consumption (Typical)
Voltage Frequency
Equipment Name Range (V ac) Range (Hz) Watts VA
50 Series Processor Model 51A 100 to 120 47 to 63 49 89
200 to 240 47 to 63
50 Series Processor Model 51B 100 to 120 47 to 63 65 118
200 to 240 47 to 63
50 Series Processor Model 51C 100 to 120 47 to 63 106 196
200 to 240 47 to 63
50 Series Processor Model 51D 100 to 120 47 to 63 — 300
200 to 240 47 to 63
50 Series Processor Model 51E 100 to 120 47 to 63 120 —
200 to 240 47 to 63
70 Series Processors 100 to 120 47 to 63 120 —
200 to 240 47 to 63
P79 Workstation 100 to 120 47 to 63 300
200 to 240 47 to 63
P80 Workstation 100 to 120 47 to 63 400 390
220 to 240 47 to 63
P92 Workstation 100 to 120 47 to 63 250 —
200 to 240 47 to 63
Model 51 X Terminal 100 to 120 47 to 63 106 196
200 to 240 47 to 63
169
Table 27-7. Peripheral and High Devices Power Requirements (Continued)
Consumption (Typical)
Voltage Frequency
Equipment Name Range (V ac) Range (Hz) Watts VA
2.5 Streaming Tape Drive 100 to 120 47 to 63 2.5 —
200 to 240 57 to 63
535 MB Hard Disk Drive 102 to 132 47.5 to 52.5 21 38
187 to 264 57 to 63
2.1 GB Hard Disk Drive 100 to 120 47 to 63 82 149
200 to 240 57 to 63
200 to 240 57 to 63
200 to 240 57 to 63
4.3 or 18 GB Optional RAID1 115 to 230 50 to 60 — —
External Hard Drive +/- 15 percent
72, 90 or 108 GB Optional 115 to 230 47 to 63 150 —
RAID5 External Hard Drive +/- 15 percent
5.0 GB 4 mm Tape Drive 102 to 132 47.5 to 52.5 25 45.5
187 to 264 57 to 63
12.0 GB 4 mm Tape Drive 102 to 132 47.5 to 52.5 — —
187 to 264 57 to 63
150 MB Streaming Tape Drive 102 to 132 47.5 to 52.5 33 (max) 60
187 to 264 57 to 63
644 MB CD-ROM Drive 102 to 132 47.5 to 52.5 10 18.2
187 to 264 57 to 63
ac Transfer Switch
The ac power input to each 50 Series processors and modules, 70 Series processors and P79, P80,
P92, or P93 workstation is supplied directly by the ac power input to the enclosure (mounting
structure) power outlets. An optional ac transfer switch allows two separate and independent
sources of ac input to power processors and modules (because power sources can be out of phase).
Two independent circuit breakers/switches provide protection and allow switching of
primary/secondary power loads. One ac transfer switch can normally power all the configurable
modules in a mounting structure/enclosure or MIW bay. You should check the power require-
ments for each processor/module connected to the ac transfer switch. For further information
refer to ac Transfer Switch (PSS 21H-5F1 B3).
170
Peripheral and Human Interface (HI) Devices

Table 27-8 lists the power requirements (voltage, frequency and consumption) for peripheral and
human interface devices.
Table 27-8. Peripheral and Human Interface Devices Power Requirements
Voltage Consumption
Equipment Range Frequency Range
Name (V ac) (Hz) Watts VA
17-Inch Workstation 90 to 132 48 to 63; 57 to 63 150 Maximum inrush
Display 198 to 264 48 to 63; 57 to 63 current for the 17-Inch
workstation display at
120 V ac nominal is
approximately 40 A.
1
19/21-Inch 90 to 132 48 to 63; 57 to 63 158
Workstation Display 198 to 264 48 to 63; 57 to 63
VT100-Compatible 98 to 132 57 to 63 40 57
Terminal 196 to 264 47 to 53 40 57
Color Dot-Matrix 90 to 260 47 to 63 150 printing, —
Printer 132 20 standby
Dot-Matrix 108 to 132 49 to 51; 59 to 61 23 printing, 33 printing,
Printer 80 198 to 242 49 to 51; 59 to 61 5.7 standby 8 standby
216 to 264 49 to 51; 59 to 61
Color PostScript 90 to 132 48 to 52; 57 to 63 190 28
Printer 198 to 264 48 to 52; 57 to 63 (normal)
1.
The Sony® GDM-1937 maximum inrush current at 120 V nominal is approximately 78 A.
(The maximum inrush current at 120 V nominal for the GDM-20E01 is 50 A.) The following typical
power consumption data is for the Sony display, and a GCIO unit powering the following peripherals:
touchscreen, trackball, AT QWERTY keyboard, two annunciator keyboards with all 80 LEDs on
steady and the alarm horn on (low):
Frequency V (rms) I (A rms) Watts

60 Hz 120 V 2.0 A 157
60 Hz 220 V 1.3 A 158
For just the monitor, typical power specifications are:
Typical Power Measurement 19/21-Inch Monitor

Typical operating power 210 VA
130 Watts
Power factor 0.6
Typical operating current 1.7 A (120 V)
0.9 A (220 V)
171
Console/Workstation
The power requirements for each Modular Industrial Console/Workstation reflect (as applicable)
the power requirements for the configuration (specified in the configuration documentation) of
the following items:
♦ 1x8 mounting structure(s)
♦ Loadable Mounting Structure components
♦ Loadable Modular Mounting Structure components
♦ Workstation display(s).
IE16 and IE32 Fan Power With 50 Series Components

Industrial Enclosures 16 and 32, vented configuration only, contain an additional fan unit
mounted in the top section of the enclosure. The fan unit receives power directly from the
enclosure’s ac input power outlet via an attached power cord.
The IE16 sealed configuration/ACAs containing 50 Series components continue to employ the
standard IPM fan modules to circulate air within the enclosure.
Power to SCSI Devices in a Spacer

If SCSI devices, such as a streaming tape or disk, are installed in a spacer, Invensys Foxboro rec-
ommends that the same power feed serve both the spacer and the 1x8 mounting structure that
contains the associated AP module and hard disk drives. If a separate power source is used for the
SCSI devices in the spacer, and that power source fails, the SCSI bus fails. The AP module (using
a separate power feed) continues to communicate with the network, but cannot access the file
system.
172
28. Field Input/Output Wiring
This section contains information on field input/output wiring including classification and
numbers of wires, Fieldbus Modules with non-incendive field-circuits, and shield termination.
Field connections between process sensors/actuators and an associated standard-density Fieldbus
Module are facilitated by a Termination Cable Assembly (TCA) applicable to the enclosure con-
taining the module. Each cable assembly is equipped with a connector appropriate to the module
function with respect to the field wiring requirements. Termination Cable Assemblies are identi-
fied under two implementation categories defined as: those used when the Fieldbus Modules are
installed in Field Enclosure 4, and those used when the modules are installed in any other
I/A Series enclosure or in a 1x8, 1x8 FBM, or 1x12 FBM mounting structure (provided the
mounting structure does not reside in a Modular Industrial Console/Workstation).
NOTE
1x8 mounting structures used in Modular Industrial Consoles/Workstations cannot
be configured with Fieldbus Modules and LANs.
Field Enclosure 4
Field connections to each Fieldbus Module within Field Enclosure 4 are made to a direct
connection block containing individual screw-clamp terminals that accept discrete field wires.
The block is mounted immediately beneath the module, and is connected via a cable to a termi-
nation connector on the front of the module.
Other Enclosures
Field connections to each Fieldbus Module within any I/A Series enclosure (other than those
identified in “Field Enclosure 4” on page 173) are made to either a discrete wire block or plug
connector block. The discrete wire block contains individual screw-clamp terminals that accept
discrete field wires. The plug connector block is a multi-conductor connector that accommodates
field wire termination in a marshalling cabinet, with subsequent connection to the plug via any
Burndy (or equivalent) mating connectors listed in Table 28-1.
Table 28-1. Burndy (or Equivalent) Connectors
Connector Part Number Description

MSD 34 PM 118 Plug with bar-type cable clamp
MSD 34 PM 124 Plug with clam shell hood
MSD 34 PM 824 Plug with suitcase hood
173
B0193AB – Rev V 28. Field Input/Output Wiring
Each connector listed can accommodate as many as 34 of any one Burndy (or equivalent) sockets
(pins) as listed in Table 28-2.
Table 28-2. Burndy (or Equivalent) Sockets
Socket Part Number Wire Size (Range)

RC 24M 9D28 0.40 to 0.51 mm dia. (26 to 24 AWG)
Each Termination Cable Assembly (TCA) is now equipped with flat braided cables between the
termination connector and either the plug or discrete wire connector block. The flat cables are
electrically and functionally identical to the previous round cables.
The applicability of the discrete and plug connector blocks is listed in Table 28-3.
Table 28-3. Discrete and Plug Connector Blocks
Enclosure Discrete Plug

IE16, IE32, IEMFA (Metal), IEMFR (Metal) Yes Yes
Termination Enclosure (Metal) Yes Yes
Multiple (Bridged) Industrial Enclosure 32 No Yes
FE8 and FE8 (Metal) Yes Yes
1x8 mounting structure Yes Yes
1x8 FBM mounting structure Yes Yes
NOTE
1. The connector blocks used within any one enclosure are uniform (that is, either
all discrete or all plug). Enclosures utilizing TCAs with discrete wire connector
blocks are equipped with DIN mounting; those utilizing TCAs with plug connector
blocks are equipped with plug connector mounting plates.
2. FBM04 and FBM05 redundant configurations use discrete wire type termina-
tions only.
Each discrete wire or plug connector block is mounted on a rail or plate in a designated area on
either side of the enclosure.
NOTE
The plug connector blocks used in Multiple (Bridged) Industrial Enclosures 32 also
are mounted on plates located in designated areas on the sides that are surrounded
by the bridging structure.
Each discrete wire and plug connector block is connected via an individual cable to a termination
connector that mounts on the front of the associated Fieldbus Module.
174
28. Field Input/Output Wiring B0193AB – Rev V
Marshalling Cabinet
If a customer-supplied marshalling cabinet is used to terminate field wires for thermocouple input
Fieldbus Modules (types FBM02 and FBM36), then a customer-supplied four-wire or three-wire,
100 Ω, platinum RTD (DIN 43760 Class B) must be installed in the cabinet for reference junc-
tion temperature compensation. The RTD must have a good thermal contact with the terminals
used for thermocouple or extension leads.
Classification of Wires
Field (signal) wiring is segregated into three classifications that, for safety reasons, must be physi-
cally isolated from one another by mutually exclusive conduits, pipes, troughs, raceways and/or
runs, and by using separate cable entries into enclosures. These classifications are:
High-Voltage (HV) Wires carrying voltages above 30 V rms (42.4 V peak) or 60 V dc. If the
wiring is to an FBM having inputs that are isolated in pairs, both channels
of a pair must be used for the hazardous voltage. (Refer to Table 24-5 for
identification of applicable FBMs.)
Low-Voltage (LV) Wires carrying voltages at or below 30 V rms (42.2 V peak) or 60 V dc.
These are termed “Class 2” circuits in the U.S. and Canada. See Note.
Non-Incendive (NI) Wires that enter or leave the equipment enclosure and, under normal
operating conditions, when shorted, opened, or grounded are not capable
due to arcing or thermal effects of igniting the specified flammable
gas/vapor-in-air mixture or combustible dust.
NOTE
The power sources in the FBM are voltage and power limited to Class 2 levels as
defined in the National Electrical Code (NFPA®-70), Article 725 and the Canadian
Electrical Code, Section 16 (CSA C22.1). Field circuits that are connected to only
the FBM power sources are, by definition, Class 2 circuits. Field circuits that con-
nect to an external, non-FBM power source will only be Class 2 if the external
power source is listed/certified as Class 2. This is important to understand because
the U.S. National and the Canadian electrical codes have specific requirements that
apply to wiring methods used for Class 2 circuits.
The minimum allowable distance between wires or groups of wires in different classifications is 50
mm (2 in) at all points along the wire run.
! WARNING
Failure to separate these classifications of field wiring, as described herein, may
result in injury to personnel.
175
! CAUTION
Signal cables should not be routed in troughs, wireways, pipes, or conduits contain-
ing power cables, nor routed close to electric motors, welding machines, or other
equipment capable of generating significant amounts of electromagnetic interfer-
ence (EMI). Failure to comply may result in improper system operation.
Separating the three classifications of signal wiring, as well as the two classifications of power wir-
ing (high- and low-voltage), is covered in “Separation” on page 154 (see also Figure 28-1).
NOTE
The separation barriers shown in Figure 28-1 are an integral part of the enclosures.
Steps should be taken to bypass field outputs in case of an FBM Termination Cable
Assembly (TCA) failure. The bypass capability can be placed in marshalling cabi-
nets or junction blocks on the field side of the TCA. This allows replacing of failed
TCAs while maintaining output signals.
Input Non-Hazardous Environment

Power Any Incendive Signal
Enclosure Wiring Sensors and/or
Actuators
Incendive Signal
Any Wiring Sensors and/or
Enclosure Actuators
Input
Power
Non-Incendive
Signal Wiring
SB Sensors and/or
Actuators
Field Non-Incendive
Enclosure Signal Wiring
Input 4 or 8 Sensors and/or
Power Actuators
Incendive Signal
SB Wiring Sensors and/or
Actuators
SB = Separation Barrier Hazardous Environment

Figure 28-1. Wiring Separation, Example
176
Number of Wires
The maximum number of field input/output wires allowed inside Field Enclosure 8 and each
Industrial Enclosure is a function of the sizes of the wires in conjunction with the available cross-
sectional area of the I/O wire channel(s), the number of termination block sites within the enclo-
sure, and (when applicable) the requirement to separate the different classifications of field wires
(as described in “Classification of Wires” on page 175).
These factors must be considered to avoid having too many I/O wires within an applicable enclo-
sure. You are responsible for determining the quantity of, and selecting sizes for, the field wires
scheduled for connection within any enclosure.
Wire Size
The wire size is a soft limit, meaning the limit is flexible to a certain degree. When allowed by
local codes, the size of the wire can be reduced to fit more wires in the enclosure, to easily fit your
requirements. The minimum recommended wire size is 0.64 mm diameter (22 AWG) and the
maximum permitted wire size is 2.05 mm diameter (12 AWG).
Wire Channel Area

The available cross-sectional area of the field input/output wire channel(s) within Field
Enclosure 8 and the Industrial Enclosures (structural foam type) is a hard limit. It cannot be
increased to accommodate more wires. The maximum cross-sectional area of the wire channels
within Field Enclosure 8 and Industrial Enclosures 16 and 32 is 6774 mm2 (10.5 in2) per side.
The maximum cross-sectional area of the wire channels within Multiple (Bridged) Industrial
Enclosures 32 is 6774 mm2 (10.5 in2) per unbridged side, and 19,353 mm2 (30 in2) within the
bridging structure (that is, on the enclosure sides surrounded by the bridging structure).
NOTE
Although the depth of the side doors allows the field wiring to extend beyond the
channels, channels provide barriers that partially support the wire separation
requirements addressed in “Classification of Wires” on page 175.
Termination Block Sites

The number of sites available within each enclosure for the Termination Cable Assembly
connector blocks are as follows:
Table 28-4. Termination Block Sites
Enclosure Sites1 Location

Field Enclosure 8:
– Floor Mounted 26 13 per side
– Wall Mounted 13 On one side only
FE8, Floor or Wall (Metal) 16 16 in front only
Industrial Enclosures 16 26 13 per side
Industrial Enclosures 32 44 22 per side
177
Table 28-4. Termination Block Sites (Continued)
Enclosure Sites1 Location

Industrial Enclosure IEMFA (Metal) 48 front only
(Sites depend on the 1x8 mounting structure
configuration of the enclosure.)
Industrial Enclosure IEMFR (Metal) 64 rear only
(Sites depend on the 1x8 mounting structure
configuration of the enclosure.)
Termination Enclosure (Metal) Per Customer Configuration
Multiple (Bridged) Industrial Enclosure 32 64 (Total for two bridged enclo- 16 per side
sures. Add 32 sites (16 per side (Unbridged side)
plus 16 in the bridge) for each 32 in bridge
additional bridged enclosure.)
1.
Each site accepts one plug or one discrete wire connector block, except that Multiple (Bridged) IE32
uses plug connector blocks only.
Field Wiring Cross-Reference

NOTE
For field wiring information relating to the DIN rail mounted subsytem FBMs
(FBM201-FBM243), refer to DIN Rail FBM Subsystem User’s Guide (B0400FA),
FOUNDATION fieldbus H1 Interface Module (FBM220/221) User Guide (B0400FD),
PROFIBUS-DP Communication Interface Module (FBM223) User’s Guide (B0400FE),
HART Communication Interface Module (FBM214/215/216/218) User’s Guide
(B0400FF), and Modbus Communication Interface Module (FBM224) User’s Guide
(B0400FK).
To facilitate field wiring planning, refer to Table 28-5 for the required Fieldbus Modules, Termi-
nation Cable Assemblies, and maximum number of I/O wires (that is, conductors).
Note that only one Termination Cable Assembly connector block type (that is, direct, discrete, or
plug) is used with a module at any one time. Discrete 1 and discrete 2, respectively, indicate Ter-
mination Cable Assemblies with one and two discrete wire connector blocks. Each Termination
Cable Assembly that is equipped with a plug or discrete wire connector block uses a cable
1117 mm (44 in) long between the block (mounted on a termination site) and termination con-
nector (attached to the front of a Fieldbus Module). Consequently, the routing between the
selected termination site and the associated Fieldbus Module must not exceed the cable length.
This is crucial for IE32 (bridged and unbridged), where the possible cable routes can easily exceed
the 1117 mm (44 in) limit. Avoid cable length limitation problems in IE32 by placing connector
blocks on termination sites that are located in the same half (upper or lower) of the enclosure as
the mounting structure that contains the associated Fieldbus Modules.
Customer-supplied field wires can be separate or bundled but must comply with the safety
requirements for the different classifications of wires, as specified in “Classification of Wires” on
page 175.
178
NOTE
Other documents sometimes refer to the Termination Cable Assemblies (TCAs) as
Termination Assemblies (TAs).
Table 28-5. Fieldbus Wiring Cross-Reference
Fieldbus Termination Cable Maximum

Module Assembly Number
Type Connector Block Type I/O Wires Notes
FBM01 Direct, discrete 1, plug 16 Requires kit P/N P0902VY.
Optional conversion kit converts the
mounting bracket of the discrete type TCA
for use with the original flat style enclosure
doors and maintains its uniform appearance
with other TCAs within an enclosure. The
conversion removes the standard snap-on
DIN rail foot attached to the TCA, and
replaces it with a low-profile bracket.
FBM02 Direct, discrete 1, plug 16 —
FBM03 Direct, discrete 1 or 2, 24, 32 Optional conversion kit converts the
plug mounting bracket of the discrete type TCA
FBM04A Direct, discrete 1, plug 16 Optional conversion kit converts the
FBM04X Discrete 2 24 Redundant FBMs use direct “wire” TCAs
only.
FBM05 Discrete 2, plug 16 Redundant FBM05s use direct “wire” and
plug TCAs only. The plug TCA is DIN rail
mountable with right angle plug connector.
179
Table 28-5. Fieldbus Wiring Cross-Reference (Continued)

FBM07 Direct, discrete 2, plug 32 Contact inputs are isolated in pairs (for
example, channels 1 and 2 are isolated from
channels 3 and 4). When the inputs are
used with hazardous voltages (that
is, > 60 V dc), use both channels of a pair
for the hazardous voltages.
FBM10 Direct, discrete 2, plug 32 Use external fusing, if a short circuit current
greater than 50 A peak is possible. Short cir-
cuit currents in excess of 50 A damage the
module.
greater than 50 A peak is possible. Short
circuit currents in excess of 50 A damage
the module.
greater than 50 A peak is possible. Short
circuit currents in excess of 50 A damage
the module.
greater than 50 A peak is possible. Short cir-
cuit currents in excess of 50 A damage the
module.
180

FBM22 Direct, discrete 2, plug 32 FBM22 uses a unique discrete and plug
connector block arrangement: the discrete 2
termination cable assembly contains one
plug in combination with one discrete
block, and both blocks are used
simultaneously.
FBM26 Direct, discrete 2, plug 16 When using the output function with an
inductive load, connect a diode across the
load. The diode must conduct 30 A and
have a voltage rating greater than 1.3 times
the supply voltage.
the supply voltage.
FBM33 Direct, discrete 1 or 2, 24, 32 Optional conversion kit converts the
plug mounting bracket of the discrete type TCA
181

FBM37 Discrete 1 16 Optional conversion kit converts the
load. The diode must conduct 15 A, and
the supply voltage.
the supply voltage.
FBM46 Discrete 2, plug 16 Redundant FBM46s use direct “wire” and
plug TCAs only. The plug TCA is DIN rail
mountable with right angle plug connector.
Table 28-6. Fieldbus Module Identification
Type Name
1
FBM01 0 to 20 mA Input Interface
FBM021 Thermocouple/Millivolt Input Interface
FBM031 RTD Input Interface (0 to 320 ohms)
FBM04A1 0 to 20 mA Input/Output Interface (8 inputs, 8 outputs)
FBM04X1 Redundant 0 to 20 mA I/O (8 inputs, 8 outputs)
FBM051 Redundant 0 to 20 mA I/O (4 inputs, 4 outputs, redundant)
FBM061 Pulse Input, 0 to 20 mA Output Interface
FBM071 Contact/dc Input Interface
FBM08 120 V ac Input Interface
FBM091 Contact/dc Input/Output Interface
FBM10 120 V ac Input/Output Interface
FBM11 240 V ac Input/Output Interface
182
Table 28-6. Fieldbus Module Identification (Continued)
Type Name
1
FBM12 Contact/dc Expansion Input Interface
FBM13 120 V ac Expansion Input Interface
FBM141 Contact/dc Expansion Input/Output Interface
FBM15 120 V ac Expansion Input/Output Interface
FBM16 240 V ac Expansion Input/Output Interface
FBM171 0 to 10 V dc Contact/dc Input/Output Interface
FBM181 Intelligent Transmitter Interface2
FBM20 240 V ac Input Interface
FBM21 240 V ac Expansion Input Interface
FBM221 Single 4 to 20 mA I/O Auto/Manual Interface
FBM241 Contact/125 V dc Input Interface3
FBM251 Contact/125 V dc Expansion Input Interface3
FBM261 Contact/125 V dc I/O Interface3
FBM271 Contact/125 V dc Expansion I/O Interface3
FBM33 RTD Input Interface (0 to 30 ohms)
FBM361 Type R Thermocouple/mV Input Interface
FBM371 0 to 20 mA Output Interface (8 outputs)
FBM411 High Power Contact/dc I/O Interface4
FBM421 High Power Contact/dc I/O Expansion Interface4
FBM431 Dual Baud Rate (600 or 4800 Baud) Intelligent Transmitter Interface2, 5
FBM441 Dual Baud Rate (600 or 4800 Baud) Intelligent Transmitter/0 to 20 mA Output
Interface5
FBM461 Dual Baud Rate (600 or 4800 Baud) Intelligent Transmitter/0 to 20 mA Output
Interface (Redundant IT/AO5
1.
Fieldbus Module with non-incendive field circuit.
2.
Interfaces to the following I/A Series intelligent devices: Mass Flowmeter, Pressure Transmitter,
Vortex Flowmeter, Temperature Transmitter, Magnetic Flowmeter.
3.
Contact inputs are not isolated.
4.
All contact input channels are isolated. You may combine isolated [unearthed (ungrounded)] and
non-isolated [earthed (grounded)] contact inputs.
5.
When multiple FBM43, 44, or 46 loops are powered by a common external power supply, these
FBMs require a Cable Balun Module (P0903SV), consisting of 4 baluns, to maintain digital line
balance. The module mounts on a DIN rail, near the TCAs, at the system end of the lines.
183
Fieldbus Modules with Non-Incendive Field-Circuits

Some Fieldbus Modules (FBMs) have field circuits that are non-incendive when installed accord-
ing to this chapter. This allows the use of ordinary location wiring methods (for example, the field
wiring not being enclosed in a conduit) in Division 2 hazardous locations. There are two sets of
requirements that apply: Canadian Standards Association (CSA), which apply to Canadian instal-
lations, and Factory Mutual (FM), which apply to U.S. installations. CSA/FM
certification/approval applies only when you use the FBMs in defined systems that have
approval/certification markings on the overall system enclosures.
Canadian Standards Association (CSA) Requirements

The Canadian Electrical Code allows non-incendive circuits for use in Class I, Division 2, hazard-
ous locations. CSA does not allow the use of the “entity parameter” concept for field apparatus
other than non-energy generating or storing devices, such as RTDs, thermocouples, switches, and
the associated interconnecting wiring. Table 28-7 lists the FBMs that currently have CSA certified
I/O circuits.
Table 28-7. FBMs with CSA Certified I/O Circuits
FBM Type Voc Isc Ca La

Fieldbus Isolator 5.0 V dc 0.5 A 1000 µF 0.2 mH
FBM02 1.0 V dc 1.0 mA 1000 µF 1000 mH
FBM03 6.0 V dc 1.0 mA 1000 µF 1000 mH
FBM33 6.0 V dc 1.0 mA 1000 µF 1000 mH
FBM36 1.0 V dc 1.0 mA 1000 µF 1000 mH
NOTE
For the Fieldbus Isolator module, the values of Ca and La are satisfied when
Invensys Foxboro specified twinaxial cable (P/N P0170GG or P0170GF) is used to
interconnect two Fieldbus Isolator modules. This cable, at any length, has sufficient
inherent series resistance to offset its internal inductance and capacitance.
Factory Mutual (FM) Requirements

The National Electrical Code (NFPA 70) allows the use of non-incendive circuits in Class I,
Division 2 Groups A through D; Class II, Division 2, Group G (and Groups E and F dusts with
resistivities greater than 100,000 ohms/centimeters); and Class III Division 2 hazardous loca-
tions. FM allows the use of entity parameters in determining the suitability of connected field cir-
cuits/devices to individual FBM I/O terminals. The following information applies to the use of
Factory Mutual approved FBMs.
The two basic types of non-incendive FBM field circuits are:
♦ S – those deriving their energy from the FBMs
♦ R – those suppling energy to the FBMs.
184
Type S
Type S field circuits are restricted by the maximum allowable connected capacitance (Ca) and
maximum allowable connected inductance (La). These are determined from the maximum open
circuit voltage (Voc) and the maximum short circuit current (Isc) available at the FBM terminals.
Examples include:
♦ Internally powered 0 to 20 mA and 0 to 50 mA I/O
♦ Thermocouple inputs
♦ RTD inputs
♦ Contact sensor inputs
♦ Internally powered output switches
♦ Internally powered pulse inputs
♦ Intelligent Transmitter Interface.
Type R
Type R input field circuits have (with the exception of the FBM17) essentially zero input capaci-
tance (Ci) and inductance (Li). The non-incendivity of the field circuits is purely a function of the
parameters of the customer-connected field devices, power sources, and wire. (You must deter-
mine these limits by referring to published ignition curves, and incorporating the applicable safety
factor for voltage or current per Factory Mutual Research Corporation Approval Standard 3611.)
Examples include:
♦ Voltage monitoring circuits
♦ Externally powered 0 to 20 mA I/O
♦ Externally powered output switching
♦ Externally powered pulse inputs
♦ 0 to 50 mA inputs.
NOTE
Some FBMs have field circuits that cannot be made non-incendive (for example,
240 V load switching). FBMs that have any of these types of field circuits cannot be
considered as being non-incendive.
185
Table 28-8 specifies the “Entity Parameters” for each Fieldbus Module that can be connected to
non-incendive field circuits. For additional information concerning the Entity Parameter concept
see Factory Mutual Research Corporation Approval Standards, numbers 3610 and 3611.
Table 28-8. Non-Incendive Field FBM Entity Parameters
Entity Parameters3
TCA Field Field Circuit (S) Voc (S) Isc (S) Ca (S) La
Type Terminal1 Type2 (R) Vmax (R) Imax (R) Ci (R) Li
FBM01 + to +P Input (S) 25 32 0.4 60
FBM01 + to - Input (R) 60 –4 0 0
FBM02 + to - Input (S) 1 1 1000 1000
FBM03A,B +\C to - Input (S) 0 1 1000 1000
FBM03B +\C to -\-S Input (S) 4 1 1000 1000
FBM03B +\C to -S Input (S) 6 1 1000 1000
FBM04A,X + to P Input (S) 25 32 0.4 60
FBM04A,X + to - Input (R) 60 –4 0 0
FBM04A,X + to - Output (S) 24 21 0.4 150
FBM05 O+ to O- I/P (S) 38 64 0.15 15
FBM05 +P to +I Xmtr (S) 25 64 0.5 15
FBM05 + to - Output (S) 24 21 0.4 150
FBM06 +P to - Pulse In (S) 25 43 0.4 30
FBM06 + to - Pulse In (R) 27 –4 0 0
FBM06 + to - Output (S) 24 21 0.4 150
FBM07A C to + Volt Mon (R) 130 –4 0 0
FBM07B5 CS to + Con Sen (S) 24 3 0.4 1000
FBM09A,B + to C In-VM (R) 130 –4 0 0
FBM09A,C C to K O-Ext P (R) 60 –4 0 0
FBM09B,D K to S O-Int P (S) 13 18 5 150
FBM09C,D CS to + In-CS (S) 24 3 0.4 1000
FBM12A C to + Volt Mon (R) 130 –4 0 0
FBM12B CS to + Con Sen (S) 24 3 0.4 1000
FBM14A,B + to C In-VM (R) 130 –4 0 0
FBM14A,C C to K O-Ext P (R) 60 –4 0 0
FBM14B,D K to S O-Int P (S) 13 18 5 150
FBM14C,D CS to + In-CS (S) 24 3 0.4 1000
FBM17A,B,C,D + to - AI-VM (R) 10 –4 1 0
FBM17A,B,C,D P to - AI-Pot (S) 10 32 10 60
FBM17A,B,C,D + to - AO-Drvr (S) 10 32 10 60
FBM17A,B C to + DI-VM (R) 130 –4 0 0
FBM17A,C C to K DO-Ext P (R) 60 –4 0 0
186
Table 28-8. Non-Incendive Field FBM Entity Parameters (Continued)
Entity Parameters3
FBM17B,D S to K DO-Int P (S) 13 18 5 150
FBM17C,D CS to + DI-CS (S) 24 3 0.4 1000
FBM18 + to - Itel Xtr (S) 25 44 0.4 4
FBM22 I+ to I- Input (R) 60 –4 0 0
FBM22 P to I- Input (S) 25 31 0.4 60
FBM22 O+ to O- Output (S) 26 21 0.4 150
FBM22 L+ to L- Loop (R) 60 –4 0 0
FBM24A,C + to C Vol Mon (R) 150 –4 0 0
FBM24B + to CS Con Sen (S) 55 3 0.05 1000
FBM25A + to C Vol Mon (R) 150 –4 0 0
FBM25B + to CS Con Sen (S) 55 3 0.05 1000
FBM26A,C + to C In-VM (R) 150 –4 0 0
FBM26B + to CS In-CS (S) 54 3 0.05 1000
FBM26A,B,C K to C Output (R) 150 –4 0 0
FBM27A,C + to C In-VM (R) 150 –4 0 0
FBM27B + to CS In-CS (S) 54 3 0.05 1000
FBM27A,B,C K to C Output (R) 150 –4 0 0
FBM033A,B +\C to - Input (S) 0 1 1000 1000
FBM033B +\C to -\-S Input (S) 4 1 1000 1000
FBM033B +\C to -S Input (S) 6 1 1000 1000
FBM36 + or - Input (S) 1 1 1000 1000
FBM37 + or - Output (S) 24 21 0.4 150
FBM41A + to C In-VM (R) 60 –4 0.025 0
FBM41A,C C to K O-Ext P (R) 60 –4 0.017 0
FBM41C CS to + In-CS (S) 27 4 0.4 1000
FBM42A + to C In-VM (R) 60 –4 0.025 0
FBM42A,C C to K O-Ext P (R) 60 –4 0.017 0
FBM42C CS to + In-CS (S) 27 4 0.4 1000
FBM43 +P to + Intelligent 25 42 0.7 8
Transmitter (S)
FBM43 + to - Intelligent 60 –4 0.15 56
Transmitter (R)
FBM44 +P to + Intelligent 25 42 0.7 8
Transmitter (S)
Transmitter (R)
187
Table 28-8. Non-Incendive Field FBM Entity Parameters (Continued)
Entity Parameters3
FBM44 + to - Output (S) 24 21 0.7 150
FBM44 0+ to - I/P (S) 38 64 0.15 15
(Redundant)
FBM46 0+ to 0- I/P (S) 38 64 0.15 15
(Redundant)
(Redundant)6 Transmitter (R)
1.
The “\” symbol means the two terminals are connected (for example, +\C means + is tied to C).
2.
(S) = the FBM terminals’ supply energy; (R) = the FBM terminals’ receive energy. This defines whether
to use Voc or Vmax, Isc or Imax, Ca or Ci, and La or Li in the entity parameter columns.
3.
Units are expressed as follows: Voc and Vmax in dc Volts; Isc and Imax in dc mA; Ca and Ci in µF; La
and Li in mH.
4.
The FBM is self-protecting up to the value stated for Vmax; it will not be damaged by direct application
of voltages up to Vmax.
5.
The CS terminal is positive with respect to the + terminal.
6.
The self-powered redundant FBM46 Intelligent Transmitter configuration is not non-incendive.
Shield Terminations
When applicable, field wiring shields must be terminated using one of the following methods
(with the preferred method listed first):
1. At the earth (ground) plate or bus bar within a customer-supplied marshalling cabinet
2. At a customer-supplied isolated shield bus bar. The bar must be connected to plant
utility earth using an 8 AWG (10 mm2) insulated green wire or green-yellow wire.
! CAUTION
Shields must not be terminated at the DIN rail within an I/A Series enclosure. Fail-
ure to comply may introduce noise to the I/A Series equipment.
DIN RAIL Mounted Modules

Refer to the following documents for DIN rail mounted modules:
♦ DIN Rail Mounted FBM Subsystem User’s Guide (B0400FA)
♦ PROFIBUS-DP Communication Interface Module (FBM223) User’s Guide (B0400FE)
♦ HART Communication Interface Module (FBM214/215/216/218) User’s Guide
(B0400FF)
♦ FOUNDATION fieldbus H1 Interface Module (FBM220/221) User Guide (B0400FD)
♦ Modbus Communication Interface Module (FBM224) User’s Guide (B0400FK).
188
29. Fieldbus Communication
This section contains information on Fieldbus communication including local Fieldbus,
extended Fieldbus, and typical Fieldbus communication.
NOTE
For Fieldbus communication information relating to the DIN rail mounted sub-
system FBMs (FBM201-FBM243), refer to DIN Rail FBM Subsystem User’s Guide
(B0400FA), FOUNDATION fieldbus H1 Interface Module (FBM220/221) User Guide
(B0400FD), PROFIBUS-DP Communication Interface Module (FBM223) User’s
Guide (B0400FE), HART Communication Interface Module (FBM214/215/216/218)
User’s Guide (B0400FF), and Modbus Communication Interface Module (FBM224)
User’s Guide (B0400FK).
This chapter presents site planning information for the coaxial Fieldbus extension. For site plan-
ning information regarding the fiber optic Fieldbus extension refer to the following:
♦ Fiber Optic Fieldbus (PSS 21H-7P1 B3)
Communication between Fieldbus Modules is accomplished via either of the following
configurations of the Fieldbus:
♦ Local Fieldbus (single or redundant)
♦ Extended Fieldbus (single or redundant).
Local and extended Fieldbus circuits are non-incendive when used with other I/A Series
system elements, or when connected via Invensys Foxboro specified twinaxial cable to
external field instruments that are approved for use with the I/A Series Fieldbus. The
entity parameters (explained in “Fieldbus Modules with Non-Incendive Field-Circuits” on
page 184) associated with twinaxial cable interface are:
♦ Voc = 5.0 V dc
♦ Isc = 0.5 A
♦ Ca = 1000 mF
♦ La = 0.2 mH.
NOTE
The values of Ca and La apply only to the field instrument itself, provided
Invensys Foxboro specified twinaxial cable (P/N P0170GG or P0170GF) is used.
Both the twinaxial and fiber optic cables have sufficient inherent series resistance to
offset their internal inductance and capacitance; cable length is not affected by
non-incendive conditions. (Refer to “Fieldbus Modules with Non-Incendive Field-
Circuits” on page 184 for detailed information concerning Division 2 hazardous
location applications.)
189
B0193AB – Rev V 29. Fieldbus Communication
Local Fieldbus
The local Fieldbus has a maximum length of 10 m (30 ft) in any one path, and is used to commu-
nicate with Fieldbus Modules located within:
♦ The same enclosure or mounting structure as the associated control processor.
♦ An enclosure or mounting structure that is adjacent to the enclosure or mounting
structure containing the associated control processor.
Extended Fieldbus
The extended Fieldbus is used to communicate with Fieldbus Modules located in enclosures,
mounting structures, or mounting structure containing the associated control processor. The
extended Fieldbus is used to communicate with Fieldbus Modules located in the
enclosure/mounting structure where the FBM interface to a workstation connects to the bus. The
maximum length of an extended Fieldbus bus is 1800 m (6000 ft) using twinaxial cable, and this
extension requires a Fieldbus Isolator at each drop of the Fieldbus cable.
Typical Fieldbus Communication

To facilitate planning, Figure 29-1 and Figure 29-2 show a simplified communication network
using the Fieldbus configurations that apply to the system.
Enclosure A Enclosure B
Nodebus Local
Fieldbus
** Fieldbus
Module
Control (25)
Processor
*
Fieldbus Fieldbus
Module Module
(1) (26)
Local
Fieldbus I/O Signals
** To/From
Fieldbus I/O Signals
Module Field
To/From
(2) Fieldbus Devices
Field
Devices Module
(63)
Fieldbus Fieldbus
Module Module
(24) (64)
* Can directly support up to 24 Fieldbus Modules.

** 10 meters (30 feet) maximum length.
Figure 29-1. Typical Fieldbus Communication (Local Fieldbus)
190
29. Fieldbus Communication B0193AB – Rev V
Enclosure C Fieldbus Extension ***

To Additional
Enclosure D Fieldbus Isolators
Nodebus Fieldbus in Other Enclosures
Isolator
*
Control Fieldbus
Processor Module
* (1)
Fieldbus
Fieldbus Module
Extension *** (2)
I/O Signals
To/From
Field
* Can support up to 16 Fieldbus Devices
Isolators connected to a combined Fieldbus
total of 64 (max) Fieldbus Modules. Module
** Can support up to 24 Fieldbus main (23)
Modules.
*** 1800 m (6000ft) maximum length Fieldbus
using twinaxial cable. Up to 20 km Module
(12.4 mi) using fiber optic cable. Extended (24)
Fieldbus
Figure 29-2. Typical Fieldbus Communication (Extended Fieldbus)
191
B0193AB – Rev V 29. Fieldbus Communication
192
30. Nodebus Communication
This chapter contains information on Nodebus communication including local, local
extension, remote extension, and typical coaxial (copper) Nodebus communications.
This chapter presents site planning information for the coaxial Nodebus.
For site planning information regarding the High Performance System network, refer to the
following:
♦ High Performance System Network (PSS 21H-7C1 B3)
♦ High Performance System Network User’s Guide (B0400DV).
For site planning information regarding the fiber optic Nodebus, refer to the following:
♦ Nodebus (PSS 21H-7B1 B3)
♦ Nodebus, Nodebus Extender, and Nodebus Interface (PSS 21H-7B1 B4)
Any one node can handle communication among as many as 64 stations (such as communication
processors, Integrators, or Gateways) with AP20 or 50 Series processors (AW or AP), 70 Series
workstations, or a Server 70. Due to a limit of 32 stations per system monitor, two 50 Series (AW
or AP) or 70 Series workstations are required to support 64 stations. Nodebus Extenders (if used)
count as two stations when used with the 50 Series or 70 Series processors. This communication
is accomplished via the following configurations of the redundant Nodebus:
♦ Local
♦ Local Extension
♦ Remote Extension.
Local
The local Nodebus is used for communication between stations that are located in the same
mounting structure or in different mounting structures within the same enclosure but are part of
the same segment; a segment can consist of a maximum of five stations residing in up to five
mounting structure buses. (Local Nodebus connections are typically performed at the factory
prior to shipment.)
The local Nodebus is used to communicate between stations (modules) that are located in the
same mounting structure or in different mounting structures within the same enclosure, but are
part of the same segment. (See Figure 30-1.) A segment consists of a maximum of 32 stations
residing in as many as six mounting structure buses. (Local Nodebus connections are typically
performed at the factory prior to shipment.)
193
B0193AB – Rev V 30. Nodebus Communication
Local Extension
The local Nodebus extension is used to communicate between stations that are part of the same
segment but in different enclosures that are relatively close to each other (that is, in the same or an
adjacent room). (See Figure 30-2.) This extension does not expand the maximum number of sta-
tions or mounting structure buses that can be supported, as identified in the section titled “Local”
on page 193 discussed previously.
Remote Extension
The remote Nodebus extension is used to communicate between stations in enclosures or mount-
ing structures that are in different segments but are part of the same node. (See Figure 30-3.) A
node consists of a maximum of three segments. A single segment may consist of a DNBX, NBE,
and FONBE. Using a 50 Series processor with a DNBX limits the number of segments to two
and the maximum cable length of a remote extension between the two segments is 300 m
(1000 ft) excluding the segment lengths.
A pair of Nodebus Extenders is required at each end of a Nodebus Extension cable to maintain
the redundancy of the Nodebus. Any one path between segments contains a maximum of four
Nodebus Extenders (two pairs of Nodebus Extenders, one pair at each end).
Typical Coaxial (Copper) Nodebus Communications

To facilitate planning, Figure 30-1 through Figure 30-4 show a simplified communications
network.
194
30. Nodebus Communication B0193AB – Rev V
Enclosure
Station Station
Local Nodebus
Station Station
L L
Station Station
Local Nodebus
Station Station
L = Local Nodebus cables; 0.9 meters (3 feet)

maximum length.
Figure 30-1. Typical Nodebus Communication (Local Nodebus)
Enclosure 1 Enclosure 2
Station Station Station Station
I I
Local Nodebus* Local Nodebus*
I I
Station Station Station Station
E E I = Interface cables
E E E = Extension cables
Optional Couplings
* Maximum length of the local extension (that is, one segment) is 30 meters (100 feet)
when optional couplings are used to interconnect extension cables.
Figure 30-2. Typical Nodebus Communication (Local Nodebus Extension)
195
B0193AB – Rev V 30. Nodebus Communication
Enclosure 1
Station Nodebus I
Station Extender
Local Nodebus
I = Interface cables
E = Extension cables
Nodebus I
Station Station
Extender
E
E
Enclosure 2
Nodebus Station Station

Extender
Maximum length of the remote
extension is 300 m (1000 ft) for
copper cable and for fiber-optic
cable, between segments [that Extended Nodebus
is, 2 extender pairs]; 3 segments
maximum [that is, 4 extender
pairs] with 300 m (1000 ft) sepa- Nodebus
ration for both copper and fiber. Station Station
Extender
Figure 30-3. Typical Nodebus Communication (Remote Nodebus Extension)
Node
Segment 1 Segment 2 Segment 3
Enclosure Enclosure Enclosure Enclosure
NE NE NE NE
N N
NE NE NE NE
Local Remote Remote

Extension Extension Extension
N = Nodebus
NE = Nodebus Extender
Figure 30-4. Nodebus Communication (Typical Node)
196
31. Carrierband LAN
Communications
This chapter contains information on communications including fault-tolerant coaxial
carrierband lan interface, non-fault-tolerant coaxial carrierband lan interface, and fiber optic
carrierband lan interface.
This chapter presents site planning information for the coaxial type LAN. For site planning infor-
mation regarding the fiber optic LAN, refer to the following:
♦ Local Area Network (PSS 21H-7F1 B3)
♦ Carrierband LAN Interface (PSS 21H-7F1 B4)
♦ Fiber Optic LAN Converter (PSS 21H-7F3 B4)
♦ Carrierband LAN Interface (PSS 21H-7F4 B4)
♦ Fiber Optic Carrierband LAN Interface (PSS 21H-7F5 B4)
Communication among nodes [that is, among stations connected to one Nodebus and stations
connected to one (or more) other Nodebus(es) across a carrierband Local Area Network (LAN)] is
enabled by one of the following configurations of the communication interface:
♦ Fault-tolerant coaxial Carrierband LAN Interface
♦ Non-fault-tolerant coaxial Carrierband LAN Interface
♦ Fault-tolerant fiber optic Carrierband LAN Interface
♦ Non-fault-tolerant fiber optic Carrierband LAN Interface.
The coaxial Carrierband LAN cable can be either 1.9 mm (0.75 in) CATV or RG-11-type foam
dielectric; both types have a characteristic impedance of 75 ohm. The allowable number of nodes
depends on the cable type (CATV or RG-11), number and type of passive taps, total carrierband
LAN cabling distance, and software address limit (100 nodes).
Fiber optic LAN cabling transmits data at a wavelength of 1300 nm over a maximum distance of
20 km with an attenuation of 1 db per km. This distance is directly affected by the number of
links and types of equipment attached to the fiber optic LAN cabling. Refer to Network Cable Sys-
tems Planning (B0193UX) for detailed information on both the coaxial cabling and fiber optic
cabling.
197
B0193AB – Rev V 31. Carrierband LAN Communications
Fault-Tolerant Coaxial Carrierband LAN Interface

The fault-tolerant coaxial Carrierband LAN Interface (CLI) is used in conjunction with a dual
LAN cable system to provide redundant communication (that is, LAN fault-tolerance) between a
node and the LAN. This configuration consists of:
♦ A pair of fault-tolerant coaxial Carrierband LAN Interface modules. Each of these is a
single-width Z-type module that must be located adjacent to its companion in a com-
mon mounting structure in an enclosure.
♦ Four coaxial interface cables, each 607 mm (24 in) long.
♦ Two coaxial termination assemblies (for coupling interface cables to drop cables).
♦ Mounting brackets* for the coaxial termination assemblies. Mounting brackets attach
to either the DIN rail or to the plug connector mounting plate, whichever is applica-
ble to the enclosure.
♦ Four drop cables: 15 m (50 ft) or 30 m (100 ft) long.
NOTE
Maximum permitted drop cable length is 30 m (100 ft).
To facilitate planning, Figure 31-1 shows a simplified example of the fault-tolerant coaxial Carri-
erband LAN Interface configuration.
Non-Fault-Tolerant Coaxial Carrierband LAN

Interface
The non-fault-tolerant coaxial Carrierband LAN Interface (CLI) is used in conjunction with a
dual or single LAN cable system to provide non-redundant communication (that is, no LAN
fault-tolerance) between a node and the LAN.
The configuration used with a dual LAN cable system consists of:
♦ A non-fault-tolerant coaxial Carrierband LAN Interface module (a single-width
Z-type module).
♦ Two coaxial interface cables: each 607 mm (24 in) long.
♦ A coaxial termination assembly (for coupling the interface cable to the drop cable)
♦ A mounting bracket for the coaxial termination assembly which attaches to either the
DIN rail or to the plug connector mounting plate, whichever is applicable to the
enclosure.
♦ Two drop cables: 15 m (50 ft) or 30 m (100 ft) long.
NOTE
198
31. Carrierband LAN Communications B0193AB – Rev V
Passive ‘A’ Cable

Carrierband Tap
LAN Trunk
Cables ‘B’ Cable Passive
Tap
Drop Cables*
Coaxial
Termination
Assembly
IC IC IC IC
Carrierband Carrierband
LAN Interface LAN Interface
Nodebus
Enclosure
* 15 m (50 ft) or 30 m (100 ft) long.
IC = Interface Cables, 607 mm (2 ft) long
Figure 31-1. Fault-Tolerant Coaxial Carrierband LAN Interface, Cabling
The configuration used with a single LAN cable system consists of:
♦ A non-fault-tolerant coaxial Carrierband LAN Interface module (a single-width
Z-type module).
♦ An interface cable 607 mm (2 ft) long.
♦ A coaxial termination assembly.
♦ A mounting bracket for the coaxial termination assembly which attaches to either the
DIN rail or to the plug connector mounting plate, whichever is applicable to the
enclosure.
♦ A drop cable 15 m (50 ft) or 30 m (100 ft) long.
NOTE
199
To facilitate planning, Figure 31-2 and Figure 31-3 show simplified examples of the non-fault-tol-
erant coaxial Carrierband LAN Interface configuration for a single and a dual LAN system.
Passive
Carrierband
Tap
LAN Trunk
Cables
Unused Port
Drop Cable*
Coaxial
IC Termination
Assembly
Carrierband
LAN Interface
Nodebus
Enclosure
* 15 m (50 ft) or 30 m (100 ft) long.

IC = Interface Cable, 607 mm (2 ft) long
Figure 31-2. Non-Fault-Tolerant Coaxial Carrierband LAN Interface, Cabling (Single LAN)
Passive ‘A’ Cable

Carrierband Tap
LAN Trunk
Cables ‘B’ Cable Passive
Tap
Unused Port
Drop Cables* Unused Port
Coaxial
IC IC Termination
Assembly
Carrierband
LAN Interface
Nodebus
Enclosure
* 15 m (50 ft) or 30 m (100 ft) long.

IC = Interface Cables, 607 mm (2 ft) long
Figure 31-3. Non-Fault-Tolerant Coaxial Carrierband LAN Interface, Cabling (Dual LAN)
200
31. Carrierband LAN Communications B0193AB – Rev V
Fiber Optic Carrierband LAN Interface

The non-fault-tolerant fiber optic Carrierband LAN Interface (FOCLI) is used in conjunction
with a dual or single LAN cable system to provide non-redundant communication (that is, no
LAN fault-tolerance) between a node and the LAN.
The fault-tolerant fiber optic Carrierband LAN Interface (FOCLI) is used in conjunction with a
dual LAN cable system to provide redundant communication (that is, LAN fault-tolerance)
between a node and the LAN.
Fiber optic LAN configurations can consist of:
♦ Fiber optic Carrierband LAN Interface modules. Either:
♦ Fault-tolerant: each of these is a single-width Z-type module that must be located
adjacent to its companion in a common mounting structure in an enclosure
-or-
♦ Non-fault-tolerant: a single-width Z-type module.
♦ Four fiber optic interface cables: up to 10 km in length.
♦ Active concentrators and/or passive stars which work as junction points for the fiber
optic cabling.
♦ Splitter/combiners (if the fiber optic LAN allows their use) to reduce the amount of
fiber optic cabling.
Fiber optic LANs can be arranged in a variety of configurations to meet your specific require-
ments. Refer to Network Cable Systems Planning (B0193UX) for detailed information on setting
up a fiber optic LAN.
201
202
32. Hydrostatic Tank Gauge
Interface
This chapter presents site planning information for the Hydrostatic Tank Gauge interface with
control processors. For site planning information regarding the Hydrostatic Tank Gauge
interface, refer to the Tank Inventory Management Systems (PSS 21H-4H1 B3) and Intelligent
Transmitter Maintenance Workbench and Configurator (B0193MW).
The Hydrostatic Tank Gauge interface consists of cabling that supports communication between
a control processor module and one or more Model 880PFC Hydrostatic Interface Units (HIUs),
as well as between that processor and one or more Fieldbus Modules (FBMs). The HIUs and
FBMs connect to the control processor via an extended Fieldbus.
The cabling required to interface as many as 24 HIUs or FBMs (in any combination) to a single
control processor is determined by the configuration of the Fieldbus. Since the Fieldbus can be
either Non-Redundant (NR) or Redundant (RD), two configurations of processor and Fieldbus
are supported.
Control Processor Fieldbus

Non-Redundant Non-Redundant
Redundant Redundant
Any FBM can be interfaced to the processor.

To facilitate planning, Figure 32-1 and Figure 32-2 show the signal cabling among the control
processor, HIUs, and FBMs.
NOTE
Refer to MI 020-057, TankExpert™ Hydrostatic Gauging and Inventory Management
System, for information pertaining to signal cabling between the HIUs and their
associated pressure and temperature sensors.
203
B0193AB – Rev V 32. Hydrostatic Tank Gauge Interface
Control Fieldbus
Processor TCA* TCA* Isolator
HIU HIU FBMXX FBMXX

(1) (n) (1) (n)
From Tank Pressure and I/O Signals (Used for HTG

* Requires termination resistor. Temperature Sensors Alarm Functions)
TCA = Termination Cable Assembly
HIU = Hydrostatic Interface Unit
FBM = Fieldbus Module
n = Last module in enclosure
Figure 32-1. Hydrostatic Tank Gauge Interface, Typical Cabling

(NR Tank Processor and NR Fieldbus)
Enclosure A Fieldbus A Enclosure B

A
TCA* TCA*
Control Fieldbus B
Processor B
TCA* TCA*
Nodebus FBI FBI
HIU HIU FBMXX FBMXX

(1) (n) (1) (n)
From Tank Pressure and I/O Signals (Used for HTG

FBM = Fieldbus Module Temperature Sensors Alarm Functions)
HIU = Hydrostatic Interface Unit
FBI = Fieldbus Isolator
n = Last module in enclosure
* Requires termination resistor.
Figure 32-2. Hydrostatic Tank Gauge Interface, Typical Cabling

(NR Tank Processor and RD Fieldbus)
204
33. Mass Flowmeter Interface
This chapter presents site planning information for the Mass Flowmeter interface. For
additional information regarding the Mass Flowmeter interface refer to Measurement
Integration (B0193RA).
The Mass Flowmeter interface consists of cabling that supports communication between a control
processor module and one or more Model CFT10 Mass Flow Transmitters, as well as between
that processor and one or more Fieldbus Modules (FBMs). The transmitters and FBMs connect
to the control processor via an extended Fieldbus.
The cabling required to connect transmitters or FBMs to a single control processor is determined
by the configuration of the Fieldbus. Since the Fieldbus can be either Non-Redundant (NR) or
Redundant (RD), the following configurations (combinations) of processor and Fieldbus are
supported.
Control Processor Fieldbus

Non-Redundant Non-Redundant
Redundant Redundant
To facilitate planning, Figure 33-1 and Figure 33-2 show the signal cabling between the control
processor, transmitters, and FBMs.
NOTE
Refer to MI 019-121, I/A Series Mass Flowmeter CFT10 Mass Flow Transmitter Instal-
lation and Maintenance, for information pertaining to signal cabling between the
transmitters and their associated Model CFS10 Mass Flowtubes.
205
B0193AB – Rev V 33. Mass Flowmeter Interface
Control Fieldbus
TCA* TCA* Isolator
Processor
CFT10 CFT10
Mass Flow Mass Flow
Transmitter Transmitter FBMXX FBMXX
(1) (n) (1) (n)
To/From To/From
Mass Flowtubes Process Devices
* Requires termination resistor.

FBM = Fieldbus Module
n = Last module associated with
enclosure
Figure 33-1. Mass Flowmeter Interface, Typical Cabling (Non-Redundant Fieldbus)
Enclosure A Fieldbus A Enclosure B

A
TCA* TCA*
Control Fieldbus B
Processor B
TCA* TCA*
Nodebus FBI FBI
CFT10 CFT10
Mass Flow Mass Flow
Transmitter Transmitter FBMXX FBMXX
(1) (n) (1) (n)
To/From To/From
Mass Flowtubes Process Devices
* Requires termination resistor. FBM = Fieldbus Module

FBI = Fieldbus Isolator
n= Last module associated with
enclosure
Figure 33-2. Mass Flowmeter Interface, Typical Cabling (Redundant Fieldbus)
206
34. Site Planning Checks
This section contains site planning checks which will help you comply with local building codes
and regional safety standards. Fire and safety precautions and shipping and handling
considerations are described below.
Fire and Safety Precautions

Protection of personnel and equipment is a prime consideration for site planning. Site safety pre-
cautions must comply with local building codes and regional safety standards. For example, if the
site is located in the United States, refer to the U.S. Department of Labor General Industrial Stan-
dards. Similarly, fire and lightning protection must also conform to local and regional codes and
standards. In the United States, refer to the National Fire Protection Association (NFPA)
Standards.
! WARNING
Each enclosure and Panel Display Station in the I/A Series system is equipped with
a safety (green wire or green/yellow wire) earth (ground) connection point. All other
system units are equipped with safety earth conductors in their power cords. All
safety connection points and cables must be connected to system earth (plant earth
grid, driven earth rod, or other acceptable earth) by qualified personnel and in strict
accordance with applicable national/regional/local electrical codes and regulations.
Failure to comply may result in serious injury to personnel and damage to the
equipment.
Shipping and Handling Considerations

In most cases, tractor-trailers (air-ride type) are used to ship systems. These vans require a rela-
tively large area for maneuvering, and the unloading site should be large enough to accommodate
them.
Examine the route between the unloading site and the installation site to ensure that the equip-
ment can move easily. If shipping from the unloading site to the installation site uses U.S. public
roads, it must comply with Department of Transportation (DOT) requirements. If an elevator is
used, ensure that it has the size and capacity to accommodate the equipment.
Site Planning Checklist

Prior to the system arriving at the installation site, check to ensure the following conditions are
satisfied:
1. There is sufficient space for moving the equipment from the transportation vehicle to
the installation area.
2. There is adequate equipment and personnel to unload and move the equipment.
207
B0193AB – Rev V 34. Site Planning Checks
3. There is adequate space for all equipment.

4. The installation environment conforms with the specifications cited in this
document.
5. The floor covering at the installation site suppresses generation of static electricity.
6. The following five classifications of wiring (as defined within this document) are sepa-
rated from each other at all points along the cable paths:
♦ High-Voltage Power
♦ Low-Voltage Power
♦ High-Voltage Signal
♦ Low-Voltage Signal
♦ Non-Incendive Signal.
7. Appropriate power (voltage, frequency, and current rating) is available for the system.
8. A power distribution panel with properly rated circuit breakers is provided for the
system.
9. Power (ac) receptacles are provided (where required) for applicable peripheral
equipment.
10. All safety (green wire or green/yellow wire) connection points and earth cables are
connected to system earth (plant earth grid, driven earth rod, or other acceptable
earth).
11. Process field wiring is properly sized for the connecting block(s) on the
Termination Cable Assemblies.
12. A Cable Balun Module (P0903SV) is specified for use with common externally-
powered FBM Intelligent Transmitter loops.
13. Conduits (for example, EMT) are large enough to accommodate system cables.
14. Lengths of ordered cables are sufficient and consistent with constraints addressed in
this document.
208
Appendix A. Equipment Physical
Characteristics
This section contains information on the equipment’s physical characteristics (mass and height).
Site selection and floor planning are influenced by the equipment’s height (for overhead
clearance) and mass (for floor load-bearing capacity), as well as by the methods of mounting
(freestanding, tabletop, and so on). The physical characteristics for each major piece of equipment
applicable to the system are listed in Table A-1, Table A-2, and Table A-3.
NOTE
For DIN rail mounted FBM equipment, refer to DIN Rail Mounted FBM Subsystem
User’s Guide (B0400FA).
Table A-1. Equipment Physical Characteristics
Mass
Shipping1 Maximum2 Height
Equipment Name kg lb kg lb mm in
Field Enclosure 4 — — 23 50 736 29.0
Field Enclosure 8
Wall Mounted — — 71 157 1184 46.6
Floor Mounted — — 71 157 1241 48.9
Field Enclosure 8, Metal — — 71 157 800 31.5
Industrial Enclosure 16 (mass listed is for sealed configurations)
Cable Entry via Vented-Top Configuration — — 129 285 1405 55.3
All other configurations — — 129 285 1283 50.3
Industrial Enclosure 32 (mass listed is for sealed configurations)
Industrial Enclosure, Metal, Front Access — — 243 536 2000 78.5
(CSA ordinary locations)
Industrial Enclosure, Metal, Front/Rear Access — — 263 580 2000 78.5
(CSA ordinary locations)
Termination Enclosure, Metal 176 388 176 388 2000 78.5
(CSA Ordinary Locations)
209
B0193AB – Rev V Appendix A. Equipment Physical Characteristics
Table A-1. Equipment Physical Characteristics (Continued)
Mass
Multiple (Bridged) Industrial Enclosure 32 Determine the mass of Multiple (Bridged)
(mass listed is for sealed configurations) IE32 by multiplying the quantity of the
enclosures that are bridged together by the
mass of a single, free-standing IE32; one
bridging structure directly replaces, and
approximately equals the mass of, two side
doors (that is, one door per bridge attach-
ment position on each bridged enclosure).
For example, the mass of three IE32s joined
by two bridging structures is: 3x180 kg
(396 lb) = 540 kg (1188 lb) for shipping
mass, and 3x241 kg (531 lb) = 723 kg
(1593 lb) for maximum (loaded) mass.
Fieldbus Cluster I/O Subsystem enclosures Refer to Fieldbus Cluster I/O User’s Guide
(B0193RB)
1x8 Mounting Structure, 19-inch 18 40 36 80 267 10.5
1x8 FBM Mounting Structure, 19-inch 18 40 26 58 267 10.5
1x12 FBM Mounting Structure, 19-inch 4.95 10.9 17.0 37.3 267 10.5
Modular Mounting Structure, 50 Series MMS, 19-inch 4.5 10 26 58 264 10.3
Modular Mounting Structure, 50 Series 2xMMS, 19- 9.0 20 52 116 528 20.6
inch
Fiber Optics Enclosure 4, 6, 8 Refer to Network Cable Systems Planning
(B0193UX).
Modular Industrial Workstation Bay — — — — 935 36.8
Bay quantity and identification depend on the MIW
configuration.
Modular Industrial Workstation Spacer — — — — — —
Spacer quantity and identification depend on the MIW
configuration.
17-inch Workstation Display 22 60 19 48 430 17
20.1-inch LCD Flat Panel Tabletop Display 32.5 71 12.5 27.6 581 19
21-inch Workstation Display 32.5 71 32.5 71 483 19
VT100 Compatible Terminal 14 30 14 30 343 13.5
VT100-Keyboard 2.3 4.5 2 4 57 2.3
Color Dot-Matrix Printer — — 21.8 48 215.9 8.5
Dot-Matrix Printer 80 4 9 4 9 80 3.2
210
Appendix A. Equipment Physical Characteristics B0193AB – Rev V
Mass
Color PostScript Printer — — 12.3 27 286 11.3
Alphanumeric Keyboard 2.3 4.5 2 4 51 2.0
Annunciator or Annunciator/Numeric Keyboard 2.7 6 2.8 5.0 56 2.2
Mouse 0.2 0.5 0.2 0.5 30 1.2
Trackball 0.5 1 0.5 1 60 2.4
Industrial Pointing Device — — — 2.0 25.4 1.0
(for use in hostile environments for 30 Series, 50 Series,
70 Series, and Server 70)
Panel Display Station 3.0 6.6 3.0 6.6 165 6.5
Mass and height for Panel Display Station only. When
close coupled, add mass and height of Auto/Manual
Station.
Auto/Manual Station 1.4 3.1 1.4 3.1 69 2.7
Fiber Optics Converter
Fiber Optic Mid Bus Modem Refer to Network Cable Systems Planning
(B0193UX).
Fiber Optic End Bus Modem
Fieldbus Power Distribution Unit
Processor, 50 Series, A-size Module 4.5 10 3.2 7.0 117 4.6
Processor, 50 Series, Model 51B or 51C 13.5 30 11.3 25 78 3.07
Processor, 50 Series, Model 51 X Terminal 10.4 23 8.1 18 78 3
Processor, 50 Series, Model 51E 22.7 50 17.6 38.9 450 17.7
Processor, 50 Series, Model 51D 18.0 39.6 10.0 22.0 112 4.4
Processor, 70 Series, AW70A or WP70A 14.3 33 14.3 33 444 17.5
Processor, 70 Series, AW70B 14.3 33 14.3 33 444 17.5
Workstation P79 18 39 18 40 11.8 4.6
Workstation P80 35 75 35 75 455 17.9
Workstation P92 13.5 30 14.3 33 423 16.8
Workstation P93 13.5 30 14.3 33 423 16.8
Server 70 35 75 35 75 444 17.5
535 MB Hard Disk Drive, 50 Series 4.5 10 3.8 8.3 71 2.8
2.1 GB Hard Disk Drive, 50 Series 9 20 5.5 7.0 117 4.6
4.2 GB Hard Disk Drive3, 50 Series — — — — 70 2.8
9.1 GB Hard Disk Drive3, 50 Series — — — — 70 2.8
150 MB 0.25-inch Streaming Tape Drive, 50 Series 4.5 10 3.8 8.3 71 2.8
5.0 GB 8 mm Streaming Tape Drive, 50 Series 5.9 13 6.1 11.2 70 2.8
5.0 GB 4 mm DAT Tape Drive, 50 Series 5 11 3.5 7.6 70 2.8
211
Mass
12.0 GB 4 mm DAT Tape Drive, 50 Series — — — — 70 2.8
644 MB CD-ROM Drive, 50 Series 4.45 10 3.8 8.3 70 2.8
4.3 or 18 GB Optional RAID1 External Hard Drives 11.1 24.6 9.9 21.6 618 24.3
72, 90 or 108 GB Optional RAID5 External Hard Drive 54 120 50 110 508 20
1.
Shipping weights for enclosures depend on the system configuration. Enclosures are typically shipped
with processor, FBM, and power modules mounted in the enclosures. 50 Series processors and peripheral
modules are not mounted in the enclosures.
2.
Maximum (calculated) mass of the enclosures, workstation bays/spacers, and mounting structures are for
worst case loading with components (excluding the mass of customer-supplied power cables and field sig-
nal wires). The actual mass is the shipping mass of the enclosure, workstation, or mounting structure,
plus the total mass of the components. The mass of each loadable component (excluding cables, buses,
and Y-adapters) is provided in Table A-2 and Table A-3, which correlate to those developed during the
site planning phase. The average mass of each termination cable assembly (TCA) is 1 kg (2 lb).
3.
The 4.2 and 9.1 GB hard drives are supported in I/A Series 4.2.x only by the Model 51, Style D and E
processors; they are supported in I/A Series 6.0 by all 50 Series processors.
NOTE
The shipping container adds 254 mm (10 in) to the height indicated in the table.
Table A-2. Loadable Mounting
Module Mass
Form
Name/Description Factor1 kg lb
Workstation Processor 302 Z 1.2 2.7
Control Processor 10 or Fault-Tolerant CP2 X 2.2 4.9
Control Processor 30 or Fault-Tolerant CP2 Z 1.2 2.7
SPECTRUM Slave Gateway3 2X 4.4 9.8
Instrument Gateway2 Z 1.2 2.7
212
Appendix A. Equipment Physical Characteristics B0193AB – Rev V
Table A-2. Loadable Mounting (Continued)
Module Mass
Form
Name/Description Factor1 kg lb
2
Allen-Bradley Data Highway Gateway Z 1.2 2.7
Modicon Gateway2 Z 1.2 2.7
Allen-Bradley DH Integrator 302 Z 1.2 2.7
Allen-Bradley DH Integrator 30, redundant2 Z 1.2 2.7
Modicon Integrator 30 or Fault-Tolerant MI302 Z 1.2 2.7
INTERSPEC Integrator 302 Z 1.2 2.7
INTERSPEC Integrator Translator2 P-adapter 4.4 9.8
Information Network Interface 152 Z 1.2 2.7
SPECTRUM Interface Processor2 Z 1.2 2.7
Carrierband LAN Interface Z 1.2 2.7
Fiber Optic Carrierband LAN Interface Z 1.2 2.7
Nodebus Interface2 Z 1.2 2.7
Nodebus Extender (Copper cable)2 Z 1.2 2.7
Fiber Optic Nodebus Extender2 Z 1.2 2.7
Dual Nodebus Interface2 Z 0.9 2.1
Dual Nodebus Interface Extender2 Z 0.9 2.1
Fieldbus Modules (each)4 Y 1.0 2.2
Fieldbus Isolator/Fieldbus Isolators5 1/2 Y 0.3 0.7
1.
The type and quantity of components to be loaded into each enclosure, workstation,
or structure are identified during planning. The mass of cables, buses, junction boxes,
and the Y-adapter is relatively insignificant and, therefore, need not be considered.
2.
Modules with an X or Z form factor are individually shipped in a container that is
508 mm (20 in) long, 95.25 mm (3 3/4 in) wide, and 288.93 mm (11 3/8 in) high.
3.
Modules with a 2X form factor are individually shipped in a container that is
692.15 mm (27 1/4 in) long, 447.68 mm (17 5/8 in) wide, and 254 mm (10 in)
high.
4.
Fieldbus Modules are individually shipped in a container that is 508 mm (20 in)
long, 79.4 mm (3 1/8 in) wide, and 187.3 mm (7 3/8 in) high.
5.
Fieldbus Isolators are shipped two isolators to a container. Dimensions of the con-
tainer are the same as in Note 2.
213
Table A-3. Loadable Mounting – 50 Series
Module Mass
Form
Name/Description Factor kg lb
Processor, AP50, WP50, AW50 A 3.2 7.0
Processor, AP51, WP51, AW51, Model 51A A 4.6 10.3
Processor, Model 51B and 51C C 11 25
Processor, Model 51 X Terminal C 7.9 17.6
Processor, Model 51E E 17.6 38.9
Processor, Model 51D F 10.0 22.0
535 MB Hard Disk Drive B 2.9 6.3
2.1 GB Hard Disk Drive D — —
4.2 GB Hard Disk Drive1, 50 Series D — —
36 GB Hard Disk Drive1, 50 Series D — —
150 MB 0.25-inch Streaming Tape Drive B 3.6 8.0
2.5 GB QIC Streaming Tape Drive D — —
5.0 GB 8 mm Streaming Tape Drive A 6.1 11.2
5.0 GB 4 mm DAT Tape Drive D — —
12.0 GB 4 mm DAT Tape Drive, 50 Series D — —
644 MB CD-ROM Drive D — —
1.
The 4.2 and 9.1 GB hard drives are supported in I/A Series 4.2.x only by
the Model 51, Style D and E processors; they are supported in I/A Series
6.0 by all 50 Series processors.
214
Appendix B. Mounting Options
Table B-1 identifies each mounting option. Mounting dimensions for each I/A Series
equipment are listed in the individual equipment chapter in this document.
NOTE
Table B-1. Equipment Mounting Options
Method
Hardware Enclosure
Mounting Structure
Table, Desk Shelf
IE16 and IE32
FE4 and FE8

MIW/MIC
Metal
Panel
Floor
Rack
Wall
Pipe
Name/
Description
Field Enclosure 4 X X X
Pipe mounting of Field Enclosure 4 requires
customer-supplied pipe with a nominal inside diame-
ter of 50.8 mm (2.0 in) and a maximum outside
diameter of 60 mm (2.37 in). Wall-mounting of
enclosure requires two wall brackets (supplied).
Field Enclosure 8 X X X
Floor mounting requires installing an elastomeric
gasket [supplied with enclosure(s)] between bottom
plate and bottom of the enclosure base. Customer is
responsible for size, location, creation, and sealing of
any required cable penetration area(s) in bottom
plate.
Wall mounting of FE8 (structural foam type),
requires a Wall-Mounting Unit and associated Filler
Panel. (WM Unit replaces one side door and associ-
ated hinge strip on enclosure; the filler is substituted
for base of enclosure.)
Industrial Enclosure 16 X X
gasket [supplied with enclosure(s)] between bottom
plate and bottom of the enclosure base. Customer is
plate.
215
B0193AB – Rev V Appendix B. Mounting Options
Table B-1. Equipment Mounting Options (Continued)
Method
Hardware Enclosure
Mounting Structure
Table, Desk Shelf
IE16 and IE32
FE4 and FE8

MIW/MIC
Metal
Panel
Floor
Rack
Wall
Pipe
Name/
Description
Industrial Enclosure 32 X X
gasket (supplied with enclosure[s]) between bottom
plate and bottom of enclosure base. Customer is
plate.
Industrial Enclosure, Metal Front and Front/Rear X X
Access
Multiple (Bridged) Industrial Enclosure 32 X X
gasket (supplied with enclosure[s]) between bottom
plate and bottom of enclosure base. Customer is
plate.
1x8 Mounting Structure X X X X X
Rack mounting requires the following customer-sup-
plied items:
a. Standard 483 mm (19 in) wide equipment frame.
b. Symmetrical mounting rail, 35 mm (1.378 in)
wide (DIN type 46277 Part 3), to mount the Termi-
nation Cable Assembly connector blocks associated
with Fieldbus Modules. Determine the rail length
required by multiplying by 50.8 mm (2.0 in) the
total number of discrete wire connector blocks used
and multiplying by 27.9 mm (1.1 in) the total num-
ber of plug connector blocks used.
c. Forced (fan-powered) air circulation at a volumet-
ric rate of 0.085 cubic meters (3 cubic feet) per sec-
ond (that is, a speed of 3 m (10 ft) per second) is
recommended to ensure adequate module cooling.
216
Appendix B. Mounting Options B0193AB – Rev V
Method
Hardware Enclosure
Mounting Structure
Table, Desk Shelf
IE16 and IE32
FE4 and FE8

MIW/MIC
Metal
Panel
Floor
Rack
Wall
Pipe
Name/
Description
1x8 FBM Mounting Structure X X X X X
Rack mounting requires the following customer-
supplied items:
a. Standard 483 mm (19 in) wide equipment frame.
b. Symmetrical mounting rail, 35 mm (1.378 in)
wide (DIN type 46277 Part 3) to mount the Termi-
nation Cable Assembly connector blocks associated
with Fieldbus Modules. Determine the rail length
required by multiplying by 50.8 mm (2.0 in) the
total number of discrete wire connector blocks used
and multiplying by 27.9 mm (1.1 in) the total num-
ber of plug connector blocks used.
Modular Mounting Structure MS and 2xMMS X X X
Rack mounting of Modular Mounting Structures
requires the following customer-supplied items:
a. Standard 483 mm (19 in) wide equipment frame
mounted in wider rack.
b. Forced (fan-powered) air circulation at a
volumetric rate of 0.085 cubic meters (3 cubic feet)
per second (that is, a speed of 3 m [10 ft] per second)
is required to ensure adequate cooling of A-, B-, C-,
and D-size modules.
Fiber Optic Enclosure 4, 6, or 8 X
Refer to Fiber Optic Network System Planning
(B0193UX) for details
Fiber Optic Converter X
Fiber Optic Mid Bus Modem X X X X
Fiber Optic End Bus Modem X X X X
Processor Modules, 10, 30, 40, 60 Series. Processor X X X X
modules cannot be used in Field Enclosure 4.
217
Method
Hardware Enclosure
Mounting Structure
Table, Desk Shelf
IE16 and IE32
FE4 and FE8

MIW/MIC
Metal
Panel
Floor
Rack
Wall
Pipe
Name/
Description
Nodebus Interface X X X
Nodebus Extender (Cable or Fiber) X X X
Dual Nodebus Interface X X X
Dual Nodebus 10Base-T Interface X X X
Dual Nodebus Interface Extender X X X
Fieldbus Modules X X X
Y-adapters are required when Y-Modules are installed
in any enclosure without an FBM-specific mounting
structure, other than Field Enclosure 4.
Fieldbus Isolator X X X
Y-adapters are required when Y-Modules are installed
in any enclosure without an FBM-specific mounting
structure, other than Field Enclosure 4.
Modular Industrial Workstation Bay X
Modular Industrial Workstation Spacer X
The Modular Industrial Workstation Spacer does not
contact the floor and must be supported at each end
by a bay.
21-inch Workstation Display X X
20.1-inch LCD Flat Panel Display X
17-inch Workstation Display X
Video Isolator X
VT100 Compatible Terminal and Keyboard X X
Color Dot-Matrix Printer X
Dot-Matrix Printer 80 X
Color PostScript Printer X
Alphanumeric Keyboard X X
Annunciator, Annunciator/Numeric Keyboards X X
Mouse X X
Trackball X X
Industrial Pointing Device X X
218
Appendix B. Mounting Options B0193AB – Rev V
Method
Hardware Enclosure
Mounting Structure
Table, Desk Shelf
IE16 and IE32
FE4 and FE8

MIW/MIC
Metal
Panel
Floor
Rack
Wall
Pipe
Name/
Description
Panel Display Station X
Panel Display Station and Auto/Manual Station can
be mounted separately or in a close-coupled (paired)
arrangement.
Auto/Manual Station X
Processors, 50 Series X X X X X X X
Processors, 70 Series X X X X X X X
Workstation P79 X X X X X X X
Workstation P80 X X
Server 70 X X
4.2 GB Hard Disk Drive1, 50 Series X X X X X X X
150 MB 0.25-inch Streaming Tape Drive, 50 Series X X X X X X X
2.5 GB 0.25-inch Streaming Tape Drive, 50 Series X X X X X X X
5.0 GB 8 mm Streaming Tape Drive, 50 Series X X X X X X X
5.0 GB 4 mm DAT Drive, 50 Series X X X X X X X
12.0 GB 4 mm DAT Drive, 50 Series X X X X X X X
644 MB CD-ROM, 50 Series X X X X X X X
1.
The 4.2 and 9.1 GB hard drives are supported in I/A Series 4.2.x only by the Model 51, Style D and
E processors; they are supported in I/A Series 6.0 by all 50 Series processors.
219
220
Appendix C. Equipment Operating
Environments
Table C-1 cross-references the six most common operational environments and each piece of
equipment. This table is a quick application guide only; detailed environmental specifications
for each piece of equipment are presented elsewhere in this document.
NOTE
Table C-1. Equipment Operating Environment
Environment
Outdoor
Computer Control Process Hardened
Equipment Name/Description Room Room Area Enclosure Shelter Unshel
Field Enclosure 4: (rated NEMA 4)
♦ Sealed doors X X X X X
♦ Sealed doors and extended X X X X X
temperature.
No peripheral devices.
Field Enclosure 8:
♦ Sealed doors, rated NEMA 4 X X X X X
temperature, rated NEMA 4.
No peripheral devices.
♦ Sealed doors (Metal), rated X X X X X
NEMA 4
(IEC-IP66)
temperature, rated NEMA 4
(IEC-IP66). No peripheral
devices.
Industrial Enclosure 16: (rated NEMA 12)
♦ Vented doors X X X X
♦ Vented doors, 50 Series X X X X
♦ Sealed doors and fan X X X X
♦ Sealed doors and fan, X X X
50 Series
221
B0193AB – Rev V Appendix C. Equipment Operating Environments
Table C-1. Equipment Operating Environment (Continued)
Environment
Outdoor
Industrial Enclosure 32: (rated NEMA 12)
configuration with 2x8
mounting structures and
modular mounting struc-
ture combinations.
Multiple (Bridged) Industrial Enclosure 32: (rated NEMA 12)

configuration with 2x8
mounting structures and
modular mounting struc-
ture combinations.
Metal Industrial Enclosures: X X X X X
Vented (NEMA 12, IEC-IP52);
Sealed (NEMA 4 IEC-IP56)
Termination Enclosure (Metal): X X X X X
Vented (NEMA 12, IEC-IP52);
Sealed (NEMA 4 IEC-IP56)
1x8 Mounting Structure (MS), X X X X
19-inch:
Operating environment deter-
mined by the limits of modules
contained within it.
1x8 FBM Mounting Structure, X X X X
19-inch
1x12 FBM Mounting Structure, X X X X
19-inch
Modular Mounting Structure X X X X
Modular Industrial X X
Console/Workstation:
MIW Bay with/without Spacer.
Modular Industrial X X
Console/Workstation, 50 Series:
MIW Bay with/without Spacer.
222
Appendix C. Equipment Operating Environments B0193AB – Rev V
Environment
Outdoor
VT100 Compatible Terminal X X
with VT100 Keyboard
Color Dot-Matrix Printer 132 X X
Dot-Matrix Printer 80 X X
Color PostScript Printer X X
Alphanumeric Keyboard, 30 or X X
50 Series
Annunciator or X X
Annunciator/Numeric Keyboard
Mouse X X
Trackball X X
Industrial Pointing Device X X X X X X
Panel Display Station X X
Auto/Manual Station X X
50 Series Processor (or X X
X Terminal)
70 Series Processor X X
P79 Workstation X X
P80 Workstation X X
P92 Workstation X X
P93 Workstation X X
Server 70 X X
535 MB Hard Disk Drive, X X
50 Series
2.1 GB Hard Disk Drive, X X
50 Series
50 Series
50 Series
150 MB 0.25-inch Streaming X X
Tape Drive, 50 Series
2.5 GB 0.25-inch Streaming X X
Tape Drive, 50 Series
223
B0193AB – Rev V Appendix C. Equipment Operating Environments
Environment
Outdoor
5.0 GB 8 mm Streaming Tape X X
Drive, 50 Series
5.0 GB 4 mm DAT Drive, X X
50 Series
12 GB 4 mm DAT Drive, X X
50 Series
644 MB CD-ROM Drive, X X
50 Series
224
Appendix D. Contamination and
Temperature Specifications
This section contains information on contamination and temperature specifications for Field
Enclosures, Industrial Enclosures, Termination Enclosures and Modular Industrial
Consoles/Workstations.
NOTE
Table D-1. Contamination and Temperature Specifications
Temperature
Storage Operating
Name/Description CC1 °C °F °C °F
Field Enclosure 4 (no peripheral devices) (FE4):
♦ Sealed 4 -40 to 70 -40 to 158 0 to 50 32 to 122
♦ Sealed and extended temperature 4 -40 to 70 -40 to 158 -30 to 50 -22 to 122
Field Enclosure 8 (FE8):
♦ Sealed without peripheral devices 4 -40 to 70 -40 to 158 0 to 50 32 to 122
♦ Sealed with peripheral devices 4 -40 to 70 -40 to 158 0 to 30 32 to 86
♦ Sealed and extended temperature 4 -40 to 70 -40 to 158 -30 to 50 -22 to 122
(no peripheral devices)
♦ Sealed (Metal) without peripheral devices 4 -40 to 70 -40 to 158 0 to 50 32 to 122
♦ Sealed (Metal) with peripheral devices 4 -40 to 70 -40 to 158 0 to 30 32 to 86
♦ Sealed and extended temp. (Metal) 4 -40 to 70 -40 to 158 -30 to 50 -22 to 122
(no peripheral devices)
Industrial Enclosure 16 (IE16):
♦ Vented 3 -40 to 70 -40 to 158 0 to 50 32 to 122
♦ Vented (with peripheral devices) 1 -40 to 70 -40 to 158 0 to 40 32 to 104
♦ Vented (with 50 Series products) 1 -40 to 70 -40 to 158 0 to 35 32 to 95
♦ Sealed and fan (no peripheral devices) 4 -40 to 70 -40 to 158 0 to 40 32 to 104
♦ Sealed, fan, and ACA (without 4 -40 to 70 -40 to 158 0 to 50 32 to 122
peripheral devices)
♦ Sealed, fan, and ACA (with peripheral 4 -40 to 70 -40 to 158 0 to 35 32 to 95
devices)
225
B0193AB – Rev V Appendix D. Contamination and Temperature Specifications
Table D-1. Contamination and Temperature Specifications (Continued)
Temperature
Storage Operating
♦ Sealed, fan, and ACA (with 50 Series 4 -40 to 70 -40 to 158 0 to 30 32 to 86
products)
Industrial Enclosure 32 (IE32):
♦ Vented 3 -40 to 70 -40 to 158 0 to 40 32 to 104
♦ Vented (50 Series products without 1 -40 to 70 -40 to 158 0 to 35 32 to 95
processors)
♦ Vented (50 Series products with 1 -40 to 70 -40 to 158 0 to 30 32 to 86
processors)
peripheral devices)
devices or 50 Series products)
Multiple (Bridged) IE32:
♦ Vented 3 -40 to 70 -40 to 158 0 to 40 32 to 104
♦ Vented (50 Series products without 1 -40 to 70 -40 to 158 0 to 35 32 to 95
processor module)
♦ Vented (50 Series products with 1 -40 to 70 -40 to 158 0 to 30 32 to 86
processor module)
peripheral devices)
devices or 50 Series products)
Metal Industrial Enclosures:
♦ Vented (without peripheral devices) 3 -40 to 70 -40 to 158 0 to 50 32 to 122
♦ Vented (with 50 Series products) 1 -40 to 70 -40 to 158 0 to 35 32 to 95
♦ Sealed (without peripheral devices) 4 -40 to 70 -40 to 158 0 to 40 32 to 104
♦ Sealed (with peripheral devices) 4 -40 to 70 -40 to 158 0 to 30 32 to 86
1x8 mounting structure -40 to 70 -40 to 158 — —
Contamination class and operating
temperature range solely depend on the limits
of the modules contained in the enclosure or
structure.
226
Appendix D. Contamination and Temperature Specifications B0193AB – Rev V
Temperature
Storage Operating
1x8 FBM Mounting Structure 3 -40 to 70 -40 to 158 0 to 60 32 to 140
1x12 FBM Mounting Structure -40 to 85 -40 to 185 0 to 60 32 to 140
Industrial Power Modules 3 -40 to 85 -40 to 185 0 to 60 32 to 140
10, 30, 40 and 60 Series processors, control 3 -40 to 70 -40 to 158 0 to 60 32 to 140
processors, gateways, and integrator modules
Fieldbus Modules 3 -40 to 70 -40 to 158 0 to 60 32 to 140
Fieldbus Isolator 3 -40 to 70 -40 to 158 0 to 60 32 to 140
Modular Industrial Workstation (MIW) 1 Contamination class and operating temperature
range of the MIW solely depend on the limits of
the devices (such as processors, modules, disk
drives) contained in the workstation.
17-inch Workstation Display 1 0 to 60 32 to 140 10 to 40 50 to 104
20.1-inch LCD Flat Panel Tabletop Display 1 0 to 60 32 to 140 10 to 40 50 to 104
21-inch Workstation Display 1 0 to 60 32 to 140 10 to 40 50 to 104
VT100 Compatible Terminal and Keyboard 1 -40 to 60 -40 to 140 10 to 40 50 to 104
Color Dot-Matrix Printer 132 1 -20 to 60 -4 to 140 7 to 46 45 to 115
Dot-Matrix Printer 80 1 -40 to 70 -40 to 158 5 to 40 40 to 104
Color PostScript Printer 1 -40 to 70 -40 to 158 15 to 30 59 to 86
Alphanumeric Keyboard, 30, 50, or 70 Series 1 -20 to 60 -4 to 140 10 to 40 50 to 104
Annunciator Keyboard 1 -25 to 75 -13 to 167 5 to 50 40 to 122
Annunciator/Numeric Keyboard 1 -25 to 75 -13 to 167 5 to 50 40 to 122
Mouse 1 -20 to 60 -4 to 140 10 to 40 50 to 104
Trackball 1 -25 to 60 -13 to 140 5 to 40 40 to 104
Industrial Pointing Device 3 -40 to 85 -40 to 185 0 to 60 32 to 140
Panel Display Station 1 -40 to 85 -40 to 185 0 to 60 32 to 140
Auto/Manual Station 1 -40 to 85 -40 to 185 0 to 60 32 to 140
50 Series Processor (or X Terminal) 1 -20 to 60 -4 to 140 0 to 40 32 to 104
50 Series Model 51, Style D Processor 1 -20 to 60 -4 to 140 10 to 35 50 to 95
70 Series Processor 1 -40 to 65 -40 to 140 10 to 35 50 to 95
P79 Workstation 1 -45 to 65 -30 to 140 5 to 35 41 to 95
P92 Workstation 1 -45to 65 -30 to 149 5 to 35 41 to 95
535 MB Hard Disk Drive, 50 Series 1 -20 to 60 -4 to 140 10 to 40 50 to 104
2.1 GB Hard Disk Drive, 50 Series 1 -40 to 70 -40 to 158 5 to 40 41 to 104
4.2 GB Hard Disk Drive2, 50 Series 1 -40 to 70 -40 to 158 5 to 40 41 to 104
227
B0193AB – Rev V Appendix D. Contamination and Temperature Specifications
Temperature
Storage Operating
9.1 GB Hard Disk Drive2, 50 Series 1 -40 to 70 -40 to 158 5 to 40 41 to 104
150 MB 0.25-inch Tape Drive, 50 Series 1 -40 to 75 -40 to 167 0 to 40 32 to 104
2.5 GB 0.25-inch Tape Drive, 50 Series 1 -20 to 60 -4 to 140 5 to 45 41 to 113
5.0 GB 8 mm Tape Drive, 50 Series 1 -20 to 60 -4 to 140 10 to 40 32 to 104
5.0 GB 4 mm DAT Tape Drive, 50 Series 1 -20 to 60 -4 to 140 0 to 40 32 to 104
12.0 GB 4 mm DAT Tape Drive, 50 Series 1 -20 to 60 -4 to 140 0 to 40 32 to 104
644 MB CD-ROM Drive, 50 Series 1 -40 to 60 -40 to 160 5 to 40 41 to 104
Microsoft® Mouse 1 -15 to 60 5 to 140 0 to 40 32 to 104
1.
The conversion from I/A Series contamination rating code (CC) to ISA Standard S71.04 identification is as
follows:
1 = Class G1 (Mild)
2 = Class G2 (Moderate)
3 = Class G3 (Harsh)
4 = Class GX (Severe).
2.
The 4.2 and 9.1 GB hard drives are supported in I/A Series 4.2.x only by the Model 51, Style D and E
processors; they are supported in I/A Series 6.0 by all 50 Series processors.
228
Appendix E. Relative Humidity and
Altitude Specifications
This section contains information on relative humidity and altitude specifications for Field
Enclosures, Industrial Enclosures, Termination Enclosures and Modular Industrial
Consoles/Workstations.
NOTE
Table E-1. Relative Humidity and Altitude Specifications
Relative Humidity Operating Altitude

(%) at 30°C (86°F) dry
Name /Description bulb Meters Feet
Field Enclosure 4 5 to 100, condensing Altitude specifications solely
Field Enclosure 8 5 to 100, condensing depend on the limits of the mod-
ules contained in the structure.
Metal Field Enclosure 8 5 to 100, condensing
Industrial Enclosure 16 5 to 95, noncondensing
Industrial Enclosure 32 5 to 95, noncondensing
Multiple (Bridged) 5 to 95, noncondensing
Industrial Enclosure 32
Metal Industrial Enclosures 5 to 95, noncondensing
1x8 Mounting Structure Relative humidity and altitude specifications solely depend on
the limits of the modules contained in the structure.
1x8 FBM Mounting Structure 5 to 95, noncondensing -300 to 3000 -1000 to 10000
1x12 FBM Mounting Structure 5 to 95, noncondensing -300 to 3000 -1000 to 10000
Industrial Power Modules 5 to 95, noncondensing -300 to 3000 -1000 to 10000
10, 30, 40, 60 Series, Gateway, Integra- 5 to 95, noncondensing -300 to 3000 -1000 to 10000
tor and Control Processor modules
Fieldbus Modules 5 to 95, noncondensing -300 to 3000 -1000 to 10000
Fieldbus Isolator 5 to 95, noncondensing -300 to 3000 -1000 to 10000
Modular Industrial Workstation 5 to 95, noncondensing — —
(Bay alone or with Spacer)
17-inch Workstation Display 10 to 80, noncondensing — —
20.1-inch LCD Flat Panel Display 30 to 80, noncondensing — 0 to 10000
21-inch Workstation Display 10 to 80, noncondensing — —
VT100 Compatible Terminal 20 to 80, noncondensing — —
229
B0193AB – Rev V Appendix E. Relative Humidity and Altitude Specifications
Table E-1. Relative Humidity and Altitude Specifications (Continued)

(%) at 30°C (86°F) dry
Color Dot-Matrix Printer 132 10 to 90, noncondensing — -100 to 10,000
Dot-Matrix Printer 80 20 to 90, noncondensing — —
Color PostScript Printer 20 to 80, noncondensing — —
Alphanumeric Keyboard 20 to 80, noncondensing 0 to 3000 0 to 10000
Annunciator Keyboard 5 to 95, noncondensing — —
Annunciator/Numeric Keyboard 5 to 95, noncondensing — —
VT100 Keyboard 20 to 80, noncondensing — —
Mouse 20 to 80, noncondensing — —
Trackball 20 to 80, noncondensing — —
Industrial Pointing Device — — —
Panel Display Stations 5 to 95, noncondensing -300 to 12000 -1000 to 40000
Auto/Manual Station 5 to 95, noncondensing -300 to 12000 -1000 to 40000
50 Series Processor (or X Terminal) 8 to 80 at 40°C (104°F) 0 to 3000 0 to 10000
dry bulb, noncondensing
51 Series Processor, Model A 20 to 80 at 40°C (104°F), 0 to 3000 0 to 10000
noncondensing
51 Series Processor, Model B 5 to 95, noncondensing 0 to 3000 0 to 10000
51 Series Processor, Model C 93 at 40°C (104°F) 0 to 3000 0 to 10000
51 Series Processor, Model D 80 (max) at 35°C (95°F), 0 to 3000 0 to 10000
noncondensing
51 Series Processor, Model E 20 to 80 at 27°C (81°F) 0 to 3000 0 to 10000
wet bulb,
51 Series Processor, Model F 10 to 90 at 27°C (81°F) 0 to 3000 0 to 10000
wet bulb, noncondensing
51 Series Processor, Model G 5 to 90 at 40°C (104°F), 0 to 3000 0 to 10000
noncondensing
70 Series Processor 20 to 80 at 40°C (104°F) -16 to 3048 -50 to 10000
P79 Workstation 20 to 80 at 27°C (81°F) -16 to 3048 -50 to 10000
P80 Workstation 20 to 80 at 27°C (81°F) -16 to 3048 -50 to 10000
P92 Workstation 20 to 80 noncondensing -16 to 3048 -50 to 10000
P93 Workstation 20 to 80 noncondensing -16 to 3048 -50 to 10000
70 Server 8 to 80, noncondensing -16 to 3048 -50 to 10000
535 MB, 2.1 GB, 4.2 GB, 9.1 GB, and 20 to 80 at 40°C (104°F) 0 to 3000 0 to 10000
18.2 GB Hard Disk Drives, 50 Series dry bulb, noncondensing
230
Appendix E. Relative Humidity and Altitude Specifications B0193AB – Rev V
Table E-1. Relative Humidity and Altitude Specifications (Continued)

(%) at 30°C (86°F) dry
150 MB 8 mm, 2.5 GB and 5.0 GB 20 to 80 at 40°C (104°F) 0 to 3000 0 to 10000
0.25-inch Streaming Tape Drives, dry bulb, noncondensing
50 Series
5.0 GB 4 mm and 12.0 GB 4 mm 20 to 80 at 40°C (104°F) 0 to 3000 0 to 10000
DAT Tape Drives, 50 Series dry bulb, noncondensing
644 MB CD-ROM Drive, 50 Series 5 to 95 at 40°C (104°F) 0 to 3000 0 to 10000
231
B0193AB – Rev V Appendix E. Relative Humidity and Altitude Specifications
232
Appendix F. Electrical Power
The parameters for the electrical power environment are ac voltage and frequency, harmonic
distortion, dc voltage tolerance, and ac input interruption tolerance. Table F-1 lists the
specifications for ac voltage, frequency and harmonic distortion. Table F-2 lists the
specifications for dc voltage tolerance and ac input interruption tolerance for I/A Series
equipment.
NOTE
Table F-1. ac Voltage, Frequency, and Distortion Specifications
Harmonic
Distortion
Frequency (%) (Up to third
Equipment Name ac Voltage Hz harmonic)
Industrial Power Modules (IPMs) – 85 to 110 47 to 63 10
used in 1x8 mounting structures and 102 to 132
all enclosures. 187 to 242
-also- 204 to 264
Wide IPM. Used only in MIW Spacer
to power magnetic storage drives.
17-inch Workstation Display Auto select: 47 to 63 —
20.1-inch LCD Flat Panel Display 100 to -120 V ac —
220 to -240 V ac
21-inch Workstation Display —
90 to 132 V ac;
198 to 264 V ac
VT100 Compatible Terminal 98 to 132 47 to 53 10
196 to 264 57 to 63
Color Dot-Matrix Printer 132 99 to 126.5 47 to 63 —
Dot-Matrix Printer 80 108 to 132 47 to 53 5
198 to 242 57 to 63
216 to 264 57 to 63
Color PostScript Printer 108 to 132 47 to 53 —
198 to 242 57 to 63
216 to 264 57 to 63
Color PCL3 Printer 90 to 264 47 to 63 —
233
B0193AB – Rev V Appendix F. Electrical Power
Table F-1. ac Voltage, Frequency, and Distortion Specifications (Continued)
Harmonic
Distortion
Frequency (%) (Up to third
Equipment Name ac Voltage Hz harmonic)
50 Series Processors 100 to 120 V ac 47 to 63 Hz —
X Terminal 200 to 240 V ac —
Applicable to 120, 220,
70 Series Processors —
and 240 V ac (nomi-
P79 and P80 Workstations nal) inputs. Automatic
Server 70 selection over voltage —
535 MB Hard Disk Drive, 50 Series range of 90 to 250 V ac —
2.1 GB Hard Disk Drive, 50 Series at 50 Hz or 60 Hz. —
4.2 GB Hard Disk Drive, 50 Series —
2.5 GB Streaming Tape Drive —
150 MB 0.25-inch Streaming Tape —
Drive, 50 Series
5.0 GB 8 mm Streaming Tape Drive, —
50 Series
5.0 GB 4 mm DAT Tape Drive, —
50 Series
12.0 GB 4 mm DAT Tape Drive, —
50 Series
644 MB CD-ROM Drive, 50 Series —
P92 and P93 Workstations 120 V ac or 240 V ac 47 to 63 Hz —
(nominal), switch
selectable
Table F-2. dc V Tolerance and ac Interrupt Tolerance Specifications
dc
Voltage ac Voltage
Tolerance Interruption
(%) As applicable at 24 Tolerance
Equipment Name or 125 V dc (nominal) (ms)
Industrial Power Module ± 20 —
Industrial Power Module ± 16 —
VT100 Compatible Terminal — > 66 (4 cycles at 60 Hz)
Color Dot-Matrix Printer 132 — > 33 (2 cycles at 60 Hz)
Dot-Matrix Printer 80 — > 33 (2 cycles at 60 Hz)
50 Series Processor — > 66 (4 cycles at 60 Hz)
234
Appendix F. Electrical Power B0193AB – Rev V
Table F-2. dc V Tolerance and ac Interrupt Tolerance Specifications (Continued)
dc
Voltage ac Voltage
Tolerance Interruption
(%) As applicable at 24 Tolerance
Equipment Name or 125 V dc (nominal) (ms)
X Terminal — > 66 (4 cycles at 60 Hz)
70 Series Processor — > 66 (4 cycles at 60 Hz)
535 MB Hard Disk Drive, 50 Series — > 66 (4 cycles at 60 Hz)
2.1 GB Hard Disk Drive, 50 Series — > 66 (4 cycles at 60 Hz)
4.2 GB Hard Disk Drive, 50 Series1 — > 66 (4 cycles at 60 Hz)
150 MB 0.25-inch Streaming Tape Drive, — > 66 (4 cycles at 60 Hz)
50 Series
2.5 GB Streaming Tape Drive — > 66 (4 cycles at 60 Hz)
5.0 GB 8 mm Streaming Tape Drive, 50 Series — > 66 (4 cycles at 60 Hz)
5.0 GB 4 mm DAT Tape Drive, 50 Series — > 66 (4 cycles at 60 Hz)
12.0 GB 4 mm DAT Tape Drive, 50 Series — > 66 (4 cycles at 60 Hz)
644 MB CD-ROM Drive, 50 Series — > 66 (4 cycles at 60 Hz)
1.
The 4.2 and 9.1 GB hard drives are supported in I/A Series 4.2.x only by the Model 51, Style D and
E processor; they are supported in I/A Series 6.0 by all 50 Series processors.
235
B0193AB – Rev V Appendix F. Electrical Power
236
Appendix G. RFI, ESD, HFT, S/IL,
and SWC Specifications
This section contains the RFI, ESD, HFT, S/IL, and SWC specifications parameters in relation to
the applicable I/A Series equipment.
Electromagnetic fields are generated by all electrical cables and equipment (such as monitors,
power supplies, and motors). The generated field has the frequency of the power running the
equipment, 60 Hz or 50 Hz.
The equipment generating the field can usually be detected by noticing changes in a workstation
processor’s display image when equipment is being turned on or off.
This interference can often be reduced or avoided by changing the location or orientation of the
monitor or of the equipment generating the field. The interference may be reduced or avoided by
shielding either the monitor or equipment with metal.
Also, interference can be induced on the video signal cable. The cable must be routed away from
power cables and equipment generating EMI or run in conduit.
The parameters for the electromagnetic interference (EMI) environment are radio frequency
interference (RFI) susceptibility, electrostatic discharge (ESD), high-frequency transients (HFT),
switching/indirect lightning (S/IL) transients, and surge withstand capability (SWC) for damped
oscillatory surges.
♦ RFI = radio frequency interference susceptibility for the frequency range of 27 to
1000 MHz. The 5.0 GB Tape Drive RFI is for a frequency of 10 to 1000 MHz.
♦ ESD = electrostatic discharge (reference IEC 801-2); S1 = operator accessible surface;
♦ HFT = high frequency transients (reference IEC 801-4); power = main power lines;
signal = I/O, control, signal, data/communication lines.
♦ S/IL = switching/indirect lightning; power = main power lines (reference IEC 801-5
and ANSI/IEEE C62.41 – 1980); signal = I/O, control, signal, data, and communica-
tion lines.
♦ SWC = surge withstand capability for 1 MHz damped oscillatory wave (reference
ANSI/IEEE C37.90 – 1978); power = main power lines; signal = I/O, control, signal,
data, and communication lines.
237
B0193AB – Rev V Appendix G. RFI, ESD, HFT, S/IL, and SWC Specifications
Table G-1 and Table G-2 contain the specifications for these parameters in relation to the applicable
I/A Series equipment.
Table G-1. RFI, ESD, and HFT Specifications
ESD (kV) HFT (kV)

RFI Sus.
Industrial Power Modules. Used in 1x8 mounting 10 8 4 2.0 —
structures and in all enclosures.
Wide Input Power Module. Used in MIW to 10 8 4 2.0 —
power magnetic storage drives.
10, 30, 40, 60 Series, Integrator, Gateway, and 10 8 4 1.0 —
Control Processor Modules.
Coaxial Carrierband LAN Interface 10 8 4 1.0 0.5
Fiber Optic Carrierband LAN Interface 10 8 4 1.0 0.5
Nodebus Interface 10 8 4 1.0 0.5
Nodebus Extender 10 8 4 1.0 0.5
Dual Nodebus Interface 10 8 4 1.0 0.5
Dual Nodebus 10Base-T Interface 10 8 4 1.0 0.5
Dual Nodebus Interface Extender 10 8 4 1.0 0.5
Fieldbus Isolator 10 8 4 1.0 0.5
Fieldbus Modules 10 8 4 2.0 1.0
17-inch Workstation Display 1 15 — 1.0 1.0
20.1-inch LCD Flat Panel Display1 1 15 — 1.0 1.0
21-inch Workstation Display1 1 15 — 1.0 1.0
VT100 Compatible Terminal 3 8 — 2.0 1.0
Color Dot-Matrix Printer 132 3 10 4 2.0 1.0
Dot-Matrix Printer 80 3 8 4 2.0 1.0
Color PostScript Printer 10 8 4 2.0 —
Alphanumeric Keyboard, 30 or 50 Series — 8 — — —
Annunciator Keyboard — 8 — — —
Annunciator/Numeric Keyboard — 8 — — —
VT100 Keyboard 3 8 — 1.0 0.5
Mouse, 30 or 50 Series — 8 — — —
Trackball, 30 or 50 Series — 8 — — —
Industrial Pointing device — — — — —
Panel Display Station 10 8 — — —
Auto/Manual Station 10 8 — — —
50 Series Processor (or X Terminal) 10 15 — 2.0 1.0
70 Series Processor 10 15 — 2.0 1.0
535 MB Hard Disk Drive, 50 Series 10 15 — 2.0 1.0
238
Appendix G. RFI, ESD, HFT, S/IL, and SWC Specifications B0193AB – Rev V
Table G-1. RFI, ESD, and HFT Specifications (Continued)
ESD (kV) HFT (kV)

RFI Sus.
2.1 GB Hard Disk Drive, 50 Series 10 15 — 2.0 1.0
4.2 GB Hard Disk Drive, 50 Series2 10 15 — 2.0 1.0
150 MB 0.25-inch Streaming Tape Drive, 10 15 — 2.0 1.0
50 Series
2.5 Streaming Tape Drive 10 15 — 2.0 1.0
5.0 GB 8 mm Streaming Tape Drive, 50 Series 3 15 — 2.0 1.0
5.0 GB 4 mm DAT Tape Drive, 50 Series 3 15 — 2.0 1.0
12.0 GB 4 mm DAT Tape Drive, 50 Series 3 15 — 2.0 1.0
644 MB CD-ROM Drive, 50 Series 10 15 — 2.0 1.0
1.
Magnetic Field Effects: All 19- and 21-inch monitors using Trinitron® tubes (PO911VD/VE/VG)
that are subject to varying magnetic fields greater than > 0.01 Gauss peak-to-peak may develop
unreasonable visual effects to a displayed image. Trinitron based displays should not be used in an
environment where the varying magnetic fields exceed 0.01 gauss. The maximum ambient mag-
netic/EMI field specifications are below.
2.
The 4.2 and 9.1 GB hard drives are supported in I/A Series 4.2.x only by the Model 51, Style D
and E processors; they are supported in I/A Series 6.0 by all 50 Series processors.
Stray Magnetic Fields Immunity Fields below 200 Hz and 0.01 Gauss peak-to-peak cause
no unreasonable visible effect to a displayed image.
EMI Immunity (1MHz to 1GHz) 1 Voltmeter with no visible effect greater than 0.1 mm
peak-to-peak displacement or better.
Table G-2. S/IL Transient and SWC Specifications
S/IL Transients SWC

(kV) (kV)
Industrial Power Modules 2 — 2.5 —
Wide Input Power Modules 2 — 2.5 —
10, 30, 40 Series, Integrators Gateway, and Control 2 — 2.5 —
Processor Modules
Coaxial Carrierband LAN Interface 2 1.0 2.5 —
Fiber Optic Carrierband LAN Interface 2 1.0 2.5 —
Nodebus Interface 2 1.0 2.5 —
Nodebus Extender 2 1.0 2.5 —
239
B0193AB – Rev V Appendix G. RFI, ESD, HFT, S/IL, and SWC Specifications
Table G-2. S/IL Transient and SWC Specifications (Continued)
S/IL Transients SWC

(kV) (kV)
Dual Nodebus Interface 2 1.0 2.5 —
Dual Nodebus 10Base-T Interface 2 1.0 2.5 —
Dual Nodebus Interface Extender 2 1.0 2.5 —
Fieldbus Isolator 2 1.0 2.5 —
Fieldbus Modules 3 1.5 2.5 2.5
17-inch Workstation Display 2 — 2.5 —
20.1-inch LCD Flat Panel Display 2 — 2.5 —
21-inch Workstation Display 2 — 2.5 —
VT100 Compatible Terminal 2 — 2.5 —
Color Dot-Matrix Printer 132 2 — — —
Dot-Matrix Printer 80 2 — 2.5 —
Color PostScript Printer 2 — 2.5 —
Panel Display Station — — — —
Auto/Manual Station — — — —
50 Series Processor (or X Terminal) 2 — 2.5 —
70 Series Processor 2 — 2.5 —
535 MB Hard Disk Drive, 50 Series 2 — 2.5 —
2.1 GB Hard Disk Drive, 50 Series 2 — 2.5 —
150 MB 0.25-inch Streaming Tape Drive, 50 Series 2 — 2.5 —
2.5 GB Tape Drive 2 — 2.5 —
5.0 GB 8 mm Streaming Tape Drive, 50 Series 2 — 2.5 —
5.0 GB 4 mm DAT Tape Drive, 50 Series 2 — 2.5 —
12.0 GB 4 mm DAT Tape Drive, 50 Series 2 — 2.5 —
644 MB CD-ROM 2 — 2.5 —
240
Appendix H. Mechanical
Specifications
Table H-1 lists the mechanical vibration specification for I/A Series equipment. When a
peripheral device is installed in an enclosure, the vibration specification for the enclosure must
be downgraded to reflect the specification for the peripheral device and the amplification of the
enclosure.
NOTE
Table H-1. Mechanical Environment Specifications

Field Enclosure 4 0.5 (15 to 200 Hz)
Field Enclosure 8 0.5 (15 to 200 Hz)
Metal Field Enclosure 8 0.5 (15 to 200 Hz)
Industrial Enclosure 16 0.1 (5 to 200 Hz)
Industrial Enclosure 32 0.1 (5 to 200 Hz)
Multiple (Bridged) Industrial Enclosure 32 0.1 (5 to 200 Hz)
Metal Industrial Enclosures 0.1 (5 to 200 Hz)
Termination Enclosure (Metal) —
1x8 Mounting Structure 0.5 (5 to 200 Hz)
1x8 FBM Mounting Structure 0.5 (5 to 200 Hz)
1x12 FBM Mounting Structure 0.5 (5 to 200 Hz)
Modular Mounting Structure, 50 Series, 19-inch —
Modular Industrial Workstations < 0.05 (5 to 200 Hz)
17-inch Workstation Display < 0.05 (5 to 200 Hz)
20.1-inch LCD Flat Panel Display < 0.05 (5 to 200 Hz)
21-inch Workstation Display < 0.05 (5 to 200 Hz)
VT100 Compatible Terminal —
Color Dot-Matrix Printer —
Dot-Matrix Printer 80 —
Color PostScript Printer —
Panel Display Station —
Auto/Manual Station —
241
B0193AB – Rev V Appendix H. Mechanical Specifications
Table H-1. Mechanical Environment Specifications (Continued)

Industrial Power Modules. Used in 1x8 mounting structures and in all 0.5 (5 to 200 Hz)
enclosures. See Table 23-2
10, 30, 40 Series Integrator, Gateway, and Control Processor Modules 0.5 (5 to 200 Hz)
Coaxial Carrierband LAN Interface 0.5 (5 to 200 Hz)
Fiber Optic Carrierband LAN Interface 0.5 (5 to 200 Hz)
Nodebus Interface 0.5 (5 to 200 Hz)
Nodebus Extender 0.5 (5 to 200 Hz)
Dual Nodebus Interface 0.5 (5 to 200 Hz)
Dual Nodebus Interface Extender 0.5 (5 to 200 Hz)
Fieldbus Isolator 0.5 (5 to 200 Hz)
Fieldbus Modules 0.75 (5 to 200 Hz)
50 Series Processor (or X Terminal) 0.1 (5 to 500 Hz)
70 Series Processor 0.25 (3 to 200 Hz)
Server 70 0.25 (3 to 200 Hz)
535 MB Hard Disk Drive, 50 Series 0.1 (5 to 500 Hz)
150 MB 0.25-inch Streaming Tape Drive, 50 Series 0.25 (5 to 500 Hz)
2.5 GB Tape Drive 0.1 (5 to 500 Hz)
12 GB 4 mm DAT Tape Drive, 50 Series 0.1 Random
644 MB CD-ROM Drive, 50 Series 0.2 (5 to 500 Hz)
242
Appendix I. Thermal Loading on
HVAC Systems
The heat dissipated by I/A Series equipment is an important consideration when you are is
planning on locating the equipment in an environment in which the temperature is controlled
by a heating, ventilating, and air conditioning (HVAC) system (that is, in a computer room or
control room). Table I-1 contains the heat dissipation specification (in BTUs) for each major
piece of equipment.
NOTE
Table I-1. Major Equipment Heat Dissipation Specifications
BTU Per Hour

Equipment Name Maximum1 Actual
2
Field Enclosure 4 374
2
Field Enclosure 8 544
2
Metal Field Enclosure 8 544
2
Industrial Enclosure 16 1088
2
2
Multiple (Bridged) Industrial Enclosure 32 (IE32) 4352
For two IE32s joined by one bridging structure; add 2176
BTU/hour for each additional bridged IE32.
Metal Industrial Enclosures — —
2
1x8 Mounting Structure (MS) 544
2
Modular Mounting Structure, 50 Series, 19-inch — —
Modular Industrial Workstation Bay — —
Heat dissipation of an MIW is determined by the dissipation of:
a. 1x8 MS(s) including the modules within
b. Workstation display(s)
c. Disk drive(s)
Modular Industrial Workstation Wedge — —
The heat dissipation of a Modular Industrial Workstation is deter-
mined by the dissipation of the following:
a. 1x8 mounting structure(s) including the modules within
b. Workstation display(s)
c. Disk drive(s)
243
B0193AB – Rev V Appendix I. Thermal Loading on HVAC Systems
Table I-1. Major Equipment Heat Dissipation Specifications (Continued)
BTU Per Hour

Equipment Name Maximum1 Actual
VT100 Compatible Terminal 136 —
Color Dot-Matrix Printer 132 68 (standby); 511 (printing)
Dot-Matrix Printer 80 19 (standby); 79 (printing)
Color PostScript Printer 5 (standby); 48 (printing)
Color PCL3 Printer 164 —
17-inch Workstation Display 655
20.1-inch LCD Flat Panel Display 25
21-inch Workstation Display 655
70 Series Processor 913 —
P79 Workstation 600 —
Server 70 600
1.
The maximum (calculated) heat dissipated by enclosures and by the 1x8 mounting structures is for
worst case loading with components.
2.
The actual heat dissipated by enclosures and by the 1x8 mounting structure can be calculated using the
formula:
Total Heat Dissipated (in BTU/hour) = P + (Mx42.5).
The following provides an example of calculating actual heat dissipated as described in Note 2.
Total Heat Dissipated (in BTU/hour) = P + (Mx42.5), where

P= average heat (BTU/hour) dissipated by the power modules.
M= total quantity of slots in the enclosure or mounting structure occupied by processor
and Fieldbus Modules.
42.5 = average heat (in BTU/hour) dissipated by processor and Fieldbus Modules.
EXAMPLE – Calculating Actual Heat Dissipation

The heat dissipation for an Industrial Enclosure 16 configured with seven Fieldbus Modules and
two processor modules is calculated as follows:
Total BTU/hour = 408 + (9x42.5) = 790.5.
244
Appendix I. Thermal Loading on HVAC Systems B0193AB – Rev V
The heat generated by typical configurations of power modules in each enclosure and by the 1x8
mounting structures is as follows:
Enclosure/Mounting Structure BTU/Hour

Field Enclosures (structural foam) 204
Metal Field Enclosure 8 204
Metal Industrial Enclosures —
Multiple (Bridged) Industrial Enclosure 32 1632
BTU/hour for two bridged Industrial Enclosures 32; add 816
BTU/hour for each additional bridged Industrial Enclosure 32.
1x8 Mounting Structure 204
also used (when applicable) within workstation bays.
1x12 FBM Mounting Structure — (No IPMs)
Modular Mounting Structure, 50 Series, 19-inch —
245
B0193AB – Rev V Appendix I. Thermal Loading on HVAC Systems
246
Appendix J. Thermal Loading on
Enclosures
Consider the heat dissipated by processors, processor modules, Fieldbus modules, and heat
intensive data storage devices (such as magnetic storage modules) to ensure that the module
population within Industrial Enclosures 16 and 32 does not overload the thermal capacity
(heat dissipation ability) of the enclosure. Table J-1 specifies the maximum thermal loading
capacity (in watts) of each enclosure. The heat dissipation specification (in watts) for each
processor module is listed in Table J-2 on page 248. Table J-3 on page 249 lists the Fieldbus
Modules. Table J-4 on page 250 lists the magnetic storage modules.
NOTE
1. The heat generated by fans and power supplies is included and does require con-
sideration by the user when determining the thermal loading of enclosures.
2. For heat dissipation information relating to the FBMs used in the DIN rail sub-
system, refer to DIN Rail FBM Subsystem User’s Guide (B0400FA) and FOUNDATION
fieldbus H1 Interface Module (FBM220/221) User Guide (B0400FD).
Table J-1. Thermal Loading
Maximum Thermal Loading (Watts)

Without With
Magnetic Magnetic With
Storage Storage 50 Series
Enclosure Name/Description Modules1 Modules2 Modules
Industrial Enclosure 16 with:
♦ Vented Doors 195 195 250
♦ Sealed Doors and Fans 195 — —
♦ Sealed Doors, Fans, and Auxiliary Cooling Assembly 195 225 140
(ACAs)
Industrial Enclosure 32 with:
♦ Vented Doors 420 420 500
♦ Sealed Doors and Fans 420 — —
♦ Sealed Doors, Fans, and ACAs 420 420 —
Metal Industrial Enclosure, Front Access (IEMFA) Fully Loaded 378 Watts
Metal Industrial Enclosure, Front/Rear Access (IEFMR) Fully Loaded 500 Watts
1.
The value reflects loading only with processor modules and/or Fieldbus modules.
2.
The value reflects loading with magnetic storage modules only, or in conjunction with Processor
modules and/or Fieldbus modules.
247
B0193AB – Rev V Appendix J. Thermal Loading on Enclosures
Table J-2. Processor Module Heat Dissipation Specifications
Maximum Heat
Dissipation
Control Processor 10 CP10 14.0 non-fault tolerant,
28.0 fault tolerant
Control Processor 30 or Fault-Tolerant CP30 CP30, CP30FT 14.0 non-fault tolerant,
28.0 fault tolerant
34.0 fault tolerant
34.0 fault tolerant
Device Integrator 30 or Fault-Tolerant DI30 DI30, DI30FT 16.0 non-fault tolerant,
32.0 fault tolerant
Allen-Bradley DH Integrator 30 or Fault- AB30, 16.0 non-fault tolerant,
Tolerant AB30 AB30FT 32.0 fault tolerant
Allen-Bradley DH Integrator 30, Redundant ABDH-R 16.0
Modicon Integrator 30 or Fault-Tolerant MI30 MI30, MI30FT 16.0 non-fault tolerant,
32.0 fault tolerant
INTERSPEC Integrator Translator IIT 17
Information Network Interface 15 INI15 11
SPECTRUM Interface Processor SIP 11
Coaxial Carrierband LAN Interface CLI 16.0 non-fault tolerant,
32.0 fault tolerant
Fiber Optic Carrierband LAN Interface FOCLI 16.0 non-fault tolerant,
32.0 fault tolerant
Nodebus Extender NBE 8.0
Dual Nodebus 10Base-T Interface DNBT 8.0
50 Series Processor Model 51A AP, WP, AW 49.0
248
Appendix J. Thermal Loading on Enclosures B0193AB – Rev V
Table J-2. Processor Module Heat Dissipation Specifications (Continued)
Maximum Heat
Dissipation
50 Series Processor Model 51B AP, WP, AW 60
50 Series Processor Model 51C AW 110
50 Series Processor Model 51D AP, WP, AW —
50 Series Processor Model 51E AP, WP, AW 175
X Terminal X Terminal 70
70 Series Processor WP, AW 250
P79 Workstation 300
P80 Workstation 875
P92 Workstation 250
P93 Workstation 250
Server 70 175.7
Table J-3. Fieldbus Modules Heat Dissipation Specifications
Max. Heat Dissipation

Fieldbus Isolator — 6.4
0 to 20 mA Input Interface FBM01 12.0
Thermocouple/Millivolt Input Interface FBM02 9.0
0 to 20 mA I/O Interface FBM04 12.0
0 to 20 mA I/O Interface, Redundant FBM04A, X 14.0
0 to 20 mA I/O Interface, Redundant FBM05, X 14.0
Pulse Input, 0 to 20 mA Output Interface FBM06 12.0
Contact/dc Input Interface FBM07 12.0
Contact/dc I/O Interface FBM09 11.0
Contact/dc Expansion Input Interface FBM12 10.0
Contact/dc Expansion I/O Interface FBM14 7.0
0 to 10 V dc, Contact/dc I/O Interface FBM17 9.0
Intelligent Transmitter Interface FBM18 9.0
249
B0193AB – Rev V Appendix J. Thermal Loading on Enclosures
Table J-3. Fieldbus Modules Heat Dissipation Specifications (Continued)
Max. Heat Dissipation

Single 4 to 20 ma I/O A/M Interface FBM22 6.0
Contact/125 V dc Input Interface FBM24 15.0
Contact/125 V dc Expansion Input Interface FBM25 12.0
Contact/125 V dc I/O Interface FBM26 15.0
Contact/125 V dc Expansion I/O Interface FBM27 12.0
Type R Thermocouple/mV Input Interface FBM36 9.0
0 to 20 mA Output Interface FBM37 12.0
Intelligent Transmitter/0 to 20 mA Interface FBM39 11.0
High Power Contact/dc I/O Interface FBM41 13.0
High Power Contact/dc I/O Expansion Interface FBM42 10.0
Dual Baud Rate Intelligent Transmitter Interface Module FBM43 8.0
Dual Baud Rate Int. Trans 0 to 20 mA Output Interface FBM44/46 7.0
Table J-4. Magnetic Storage Module Heat Dissipation Specifications
Maximum Heat
Module Name Dissipation (Watts)
535 MB Hard Disk Drive, 50 Series 15.0
2.1 GB Hard Disk Drive, 50 Series 53.0
4.2 GB Hard Disk Drive, 50 Series 30 (Startup); 20 (Running)
9.1 GB Hard Disk Drive, 50 Series 40 (Startup); 25 (Running)
150 MB 0.25 inch Streaming Tape Drive, 50 Series 12.0
5.0 GB 4 mm DAT Tape Drive, 50 Series 15.6
12.0 GB 4 mm DAT Tape Drive, 50 Series 15.6
644 MB CD-ROM Drive, 50 Series 10.0
250
Appendix K. SCSI Bus
Configuration Guide
This section gives the equivalent SCSI length for each device and cable.
When choosing components for connection on a SCSI bus for any processor, the user must be
aware of the limits within which a SCSI bus operates properly. The Model 50/51, Style A, B, and
C processors have a SCSI-2 bus, which must be equal to or less than six meters.
The Model 51, Style E processor has a high speed, ultra-wide SCSI-3 bus, which must be equal to
or less than three meters.
The Model 51, Style D processor requires a “Twisted-Pair 10/100Mbps Ethernet Interface plus
Ultra-Wide SCSI-3” PCI card to support SCSI functionality. This card provides an external high
speed, ultra-wide SCSI-3 bus for this processor, which must be equal to or less than three meters.
It should be noted that the sum of the physical lengths of the interconnecting cables is only one
factor in the total equivalent SCSI bus length. Each device on the SCSI bus, including the proces-
sor, adds a portion to the overall length.
! CAUTION
Due to these limitations, the Model 51, Style D and E processors cannot have more
than two SCSI devices on their SCSI-3 bus. If you plan to include an external tape
drive on the SCSI-3 bus to back up the processor’s hard drive(s), this tape drive
must be included as one of the two SCSI devices.
Table K-1 gives the equivalent SCSI length for each device and cable. The sum of the equivalent
SCSI lengths of all of the components that reside on the SCSI bus must be less than six meters for
the SCSI-2 bus, and three meters for the SCSI-3 bus. In practice, the system does not cease to
function at lengths just beyond the total equivalent SCSI length, but reliability of the bus begins
to erode beyond that point.
Table K-1. Equivalent SCSI Cable Lengths
Equivalent SCSI
Device Length (Meters)
Model 50 Processor 0.5
Model 51A Processor 0.71
Model 51B Processor 1.6
Model 51B1 Processor 1.6
Model 51C Processor 1.6
Model 51D Processor with 0.0
“Twisted-Pair 10/100 Mbps
Ethernet Interface plus Ultra-Wide
SCSI” PCI card
251
B0193AB – Rev V Appendix K. SCSI Bus Configuration Guide
Table K-1. Equivalent SCSI Cable Lengths (Continued)
Equivalent SCSI
Device Length (Meters)
Model 51E Processor 0.91
A-Size Peripheral 0.16
A-Size Peripheral Cable 0.8
B-Size Peripheral 0.16
B-Size Peripheral Cable 0.8
D-Size Peripheral 0.40
D-Size Peripheral 50/68 Pin Cable 1.2
D-Size Peripheral 68/68 Pin Cable 0.8
P0170NX SCSI Cable 1.5
P0970JR SCSI Cable 0.56
P0970KF SCSI Cable 1.3
P0970KG SCSI Cable 0.6
P0970KJ SCSI Cable 0.6
P0970QS SCSI Cable 0.8
P0971FZ SCSI Cable 1.3
P0971MK SCSI Cable 1.2
P0971ML SCSI Cable 0.8
P0971MX SCSI Cable 1.5
P0971MY SCSI Cable 1.5
P0971RH SCSI Cable 0.8
P0970KH SCSI Cable 1.7
1.
This information is provided for reference only. The
SCSI-3 bus cannot maintain more than two external
data storage devices.
252
Index
10, 30, and 40 Series modules 146, 148, 150, 166

contamination and temperature specifications 227
mounting options 217
1x12 FBM mounting structure 55, 62, 173
humidity and altitude specifications 229
outline and clearance 62
physical characteristics 210
specifications 63
1x8 FBM mounting structure 55
heat dissipation 243
1x8 mounting structure 5, 48, 52, 55, 56, 57, 148, 163, 172, 173, 174, 216, 244
FBM specifications 59
heat generated 245
operating environments 222
2X form factor 213
30 Series
50 Series
ac Transfer Switch 146
ac transfer switch 134
CD-ROM drives 103, 104, 105, 170
dc V tolerance and ac interrupt tolerance specifications 235
maximum heat dissipation 250
physical characteristics 212, 214
voltage, frequency, and distortion specifications 234
DAT tape drives 103, 105
dc V tolerance and ac interrupt yolerance specifications 235
253
B0193AB – Rev V Index

disk drives 103, 104
F-size (Style D) processor
keyboards 102
modular mounting structures
power requirements 168
mouse 102
processors 99, 103, 104, 193, 234
ac input 108
power switches 108
tape drives 103, 104
trackball 102, 171
workstations 99
70 211, 230
70 Series
hardware 90
keyboards 89
mouse 89
processors 89, 234
254
Index B0193AB – Rev V

trackball 89
workstations 89
environmental considerations 91
880PFC Hydrostatic interface units (HIUs) 203
A
ac input
50 Series processors 108
ac Transfer Switch 134, 146, 170
ACA 4, 225, 226
Air conditioning 2, 243
ANSI guidelines 105, 128, 237
Auto/Manual station
specifications 131
Auxiliary cooling assemblies 4, 225, 226
AW70, Style A
dimensions 89
hardware 80, 86, 90, 96
AW70, Style B
dimensions 89
hardware 80, 86, 90, 96
B
Backup power modules 149
IPM06A 149
IPM06D 149, 150
Battery backup 150
Battery backup power 148, 149, 151, 164
Bridged enclosures 4, 27, 29, 30, 31, 32, 33, 241, 243, 245
Bridged IE32 enclosure 4, 32
Bridged Structures
cooling 4
Building codes 133, 207
C
Cables
coaxial 140
drop 140, 141, 198, 199
floor cutouts 6, 22, 47, 51
power 6, 134, 135, 147
power cable separation requirements 6, 147
remote extension 194, 196
routing 6, 147, 153, 155, 156, 178
SCSI 107
separation 154
255
trunk 140, 141

Carrierband LAN
coaxial cable shields 140
coaxial interface 113, 114, 115, 116, 167
fault-tolerant 198
non-fault-tolerant 198
communications 197
fiber optic 140
fiber optic interface 113, 114, 115, 116, 167
fault-tolerant 201
non-fault-tolerant 201
interface 197, 242
trunk cable 140
CD-ROM drives
50 Series 103, 104, 105, 170
Checklist
site planning 207
Chimney 4, 5
Clearance dimensions
50 Series 99
70 Series 89
Server 70 95
Coaxial (copper) Nodebus communications 194
Communications modules 166
Crest factor 146, 152
CSA
requirements 184
Customer supplied products
circuit breakers 134
connection equipment 134
field signal wires 64
field wires 178
field wiring shields 188
power cables 64, 134
power distribution panels 134
racks 5, 64
safety devices 134
watertight fittings 32, 42
256
Cutouts 6, 22, 47, 51
D
DAT tape drives
50 Series 103, 105
Disk and tape storage drives 170, 172
Disk drives 9, 13, 170, 172
50 Series 103, 104
Displays, workstation
maximum cable lengths 159
Drop cable 140, 141, 198, 199
Dual Nodebus 10Base-T Interface 167
Dual Nodebus Interface 167
257
E
Earthing
concepts 140, 142, 143
green/green-yellow earth wire 133, 134, 139, 144, 207, 208
power distribution panels 134, 136, 137, 138
requirements 133, 139
zero voltage earth reference 133, 135, 136, 137, 138, 139
Electrical noise 133, 135, 139
Electrical power requirements 163
fan power 165, 166, 168, 172
fieldbus modules 168
loadable mounting structure components 172
magnetic storage modules 106, 247
processor modules 166
SCSI spacer 172
Electromagnetic interference 7, 60, 104, 113, 119, 124, 131, 155, 176, 237, 239
displays 123, 131
printers 128
Enclosures
bridged 30, 33, 241, 243, 245
bridged IE32 4, 32
bridged multiple industrial 29, 31
exterior heat exchangers 4
fiber optic LAN enclosures 53
field connections between 173
fieldbus cluster I/O enclosures 53
floor cutout 41
floor cutouts 6, 22, 29, 30, 31, 40, 47
floor mounting 21, 27, 39
general clearance requirements 3
hardened, NEMA 4/4X 35
power distribution 37
specifications 37
heat dissipation 6, 243
heat generated 245
IE16 specifications 24
IE32 specifications 33
maintenance 3, 4
maximum thermal loading 247
memory protection 150, 151
other 173
pipe mounting 9, 215
power cables 6
rack mounting 57, 216, 217
rear access 4
258
structural foam IE16 and IE32 4

termination 39
wall mounting 9, 15, 18
Entity parameters 184, 186, 189
Environmental considerations 1
electromagnetic interference 7, 60, 104, 113, 119, 123, 124, 128, 131, 237
mechanical 106, 115, 241
outdoor 1, 221
process area 1
Exterior heat exchangers 4
External battery memory protection 151
F
Factory power 6, 146, 147
power cable 6, 135, 147
Failure detection 151
Fan power 165, 166, 172
Fiber optic LAN
references 197
Fiber optic LAN enclosure references 53
Field enclosures
heat exchangers 4
mounting 9, 13
Field input/output wiring
channel area 177
marshalling cabinet 144, 175
maximum number of wires 177
non-incendive circuits 184
shield terminations 188
termination block sites 177
wire size 134, 136, 138, 177
Field wiring 175, 178
Fieldbus
cable P0170GF 143, 184, 189
cable P0170GG 143, 184, 189
communications 190
earthing 142
extended 190
local 190
local extension 142, 143
wiring 179
Y-module 213
Fieldbus cluster I/O 210
Fieldbus enclosures
FE4 specifications 11
FE8 specifications 19
Fieldbus modules
battery backup 148
259
communications 189
earthing 143
extended fieldbus 190
field connections between 173
identification 182
local fieldbus 190
non-incendive circuits 184
with non-incendive field-circuits 184
Fire and safety precautions 207
Floor cutouts 6, 29, 30, 31, 40, 47, 51
IE16 22
Floor mounting
modular industrial console bay 49
modular industrial workstation bay 45
Floor mounting enclosures 21, 27, 39
FM requirements 184
For use with all Zenith-based, PowerMate-based, and GXa-based 70 Series processors. 91
Form factor X and 2X 213
FOXNET 7, 139
F-size processor (50 Series Style D)
G
General clearance requirements 3
ACA 4
exterior heat exchangers 4
Green/green-yellow earth wire 139, 207, 208
Grounding
earthing 133
H
Handling considerations xvii, 207
Hardened enclosures, NEMA 4/4X 35
power distribution 37
specifications 37
Heat dissipation 2
HVAC systems, thermal loading 125, 243
Hydrostatic Interface Units (HIUs) 203
Hydrostatic tank gauge interface 203, 204
I
IE16 enclosures
specifications 24
IE16, IE32 fan power 11, 165, 166, 171, 172
IE32 enclosures
260
specifications 33
Interfaces
carrierband LAN
coaxial Carrierband LAN 113, 114, 115, 116
fiber optic Carrierband LAN 113, 114, 115, 116
hydrostatic tank gauge 203
mass flowmeter 205
nodebus
IPM03A/D backup power configuration 149
IPM06A backup power module 149, 150
IPM06D backup power module 149, 150
K
Keyboards 67, 73, 79, 85, 89, 95, 102
alphanumeric 102, 227
annunciator 171
annunciator/numeric 102, 223
maximum cabling lengths 159
VT100 227
L
LAN
fault-tolerant coaxial interface 198
fault-tolerant fiber optic interface 201
non-fault-tolerant coaxial interface 198
Loadable mounting structure components 172
Local Nodebus 141, 142, 193, 194, 195
M
Magnetic storage modules 106, 247
Maintenance
261
I/A Series enclosures 3

IE32 4
Marshalling cabinet 144
Mass flowmeter interface 205, 206
Mechanical specifications 106, 115, 241
Memory battery backup 150
Memory protection 150, 151
Metal industrial enclosures
additional specifications 43
specifications 43
Model 72
Model P80 Workstation
equipment and peripherals 74
hardware 74
Modular industrial console
floor cutouts 51
Modular industrial console bay
floor mounting 49
specifications 51
Modular industrial workstation
bay
floor mounting 45
specifications 48
bay or spacer
spacer
Modular industrial workstation bay
floor cutouts 47
Modular mounting structure 55
options 64
specifications 64
Modules
10, 30 and 40 Series 112
backup power 149
fieldbus 4, 118, 218
IPMs
262

processor 9, 135
Y-module 213
Mounting 10
1x12 FBM mounting structure packages 62
1x8 FBM mounting options 57
1x8 mounting structure 5, 172, 174, 178
field enclosures 10
loadable mounting structure 172
options 64, 215
pipe 9, 15, 57, 215
Mounting options 63
Mounting structures
magnetic storage modules 106, 247
Mouse 67, 73, 79, 85, 89, 95, 102
Microsoft, contamination and temperature specifications 228
Multiple industrial enclosure
bridged 4, 27, 29, 30, 31, 33, 241, 243, 245
N
National Electrical Code 133, 147, 152, 184
NEMA
NEMA 4, 4 IEC, 4X and 12 221
NEMA 4/4X 35
NFPA codes 184, 207
Nodebus
earthing 141
interface 167
local 141, 142, 193, 194, 195
Non-incendive circuits 184
O
Operating environment 221
Outdoor area considerations 1, 221
Outline dimensions
50 Series 99
263
70 Series 89
Server 70 95
P
P Series
processors
P79 66
hardware 68
keyboards 67
mouse 67
trackball 67
workstations 65
P80 73
keyboards 73
mouse 73
trackball 73
workstations 71
P92 80, 81
keyboards 79, 85
mouse 79, 85
trackball 79, 85
workstations 77, 83
environmental considerations 81, 86
P93 86, 87
Panel display station 139
fire and safety precautions 207
specifications 131
Passive taps 141
Physical considerations
general clearance requirements 3
Pipe mounting 9, 57, 215
Planning
site planning checklist 207
Plug connector blocks 174
Power
cable 6, 135, 147
factory power distribution 6, 146, 147
Power and status tap 148, 149, 151
Power distribution
hardened enclosures, NEMA 4/4X 37
panels 134, 136, 137, 138
264
Power module, failure detection 151

Power requirements
electrical 163
field enclosure heater 11
fieldbus module 168
IE16 and IE32 fan 172
loadable mounting structure components 166
peripheral and human interface devices 171
processor module 166
SCSI devices in wedge 172
workstation 172
Power switches
50 Series processors 108
Precautions, fire and safety 207
Printers
specifications 127
Process area 1
Processor modules 166
Processors
50 Series 99, 103, 104, 169, 193
ac input 108
power switches 108
70 Series 89
P Series
265
P79 65
P80 71
P92 77, 83
Server 70 93
R
Rack mounting enclosures 57, 216, 217
Rear access, enclosure 4
Remote extension 194, 196
Requirements
CSA 184
FM 184
Routing, cables 6, 147
S
Safety earth 133
Safety standards 207
SCSI spacer, power requirements 172
Separation of cables 154
Server 93, 94, 95, 96, 97, 211, 219, 223, 234, 242, 244
Server 70
hardware 80, 86, 96
keyboards 95
mouse 95
trackball 95
workstations 93
Shield terminations 144, 188
Shipping and handling considerations xvii, 207
Signal and power cabling
floor cutouts 6, 22, 47, 51
routing 6, 147, 153, 155, 156, 178
top entry panels 16, 17, 23, 24, 32, 33, 42
Site planning checklist 153, 207
Specifications
mechanical 106, 115, 241
SPECTRUM Slave Gateway (SSG) 139
Structural foam
field enclosures 16
IE16 and IE32 enclosures 4
System elements
Carrierband LAN interface 197, 242
carrierband LAN interface 197, 242
coaxial carrierband LAN interface 167
drop cable 140
266
fiber optic carrierband LAN interface 167

trunk cable 140
System power configurations
battery backup 148, 151, 164
external battery 151
power and status tap 148, 149, 151
System power requirements
power module failure 151
System, earthing (grounding) 133
T
Tank Processor 203
Tape drives 13, 103, 104, 170, 172
Termination block sites 177
Termination cable assembly (TCA) 173, 174
sites available 177
Termination enclosure 39
floor cutout 41
specifications 43
top cover 43
Terminations, shield 188
Thermal loading
on enclosures 247
on HVAC systems 125, 243
Top entry panels 16, 17, 23, 24, 32, 33, 42
Trackball 67, 73, 79, 85, 89, 95, 102, 171, 223
Trunk cable 140
installation
earthing requirements 133, 139
U
Uninterruptable power supply (UPS) sizing 146
267
V
Ventilation 2, 243
W
Wall mounting enclosures 9, 15, 18
Wire size 134, 136, 138
Wiring
channel area 177
fieldbus 179
marshalling cabinet 144, 175
number of wires 177
shield terminations 188
termination block sites 177
wire size 134, 136, 138
Work envelopes 3
Workstations
50 Series
application 99
70 Series
application 89
displays 172
specifications 123
P Series
P79
P80
application 71
P92
application 77, 83
environmental considerations 81, 86
Server 70
application 93
Workstations P79
268
application 65
WP70, Style A
dimensions 89
hardware 80, 86, 90, 96
X
X form factor 213
Y
Y-adapter 4, 213
Z
Zero-voltage earth reference 133, 135, 136, 137, 138, 139
269
33 Commercial Street
Foxboro, Massachusetts 02035-2099
United States of America
www.foxboro.com
Inside U.S.: 1-866-746-6477
Outside U.S.: 1-508-549-2424 or contact your local Foxboro representative.
Facsimile: 1-508-549-4999
Printed in U.S.A. 0303

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B0193AB

I/A Series A2™ System

Fan Assembly (vented enclosures)

Filter DIN Rail

Copyright 1990-2003 Invensys Systems, Inc.

1. Environmental Considerations .......................................................................................... 1

2. Enclosures – General ......................................................................................................... 3

3. Field Enclosure 4 (FE4) ..................................................................................................... 9

FE4 Specifications ................................................................................................................... 11

4. Field Enclosure 8 (FE8) ................................................................................................... 13

5. Industrial Enclosure 16 (IE16) ........................................................................................ 21

6. Industrial Enclosure 32 (IE32) ........................................................................................ 27

7. NEMA 4/4X Hardened Enclosure................................................................................... 35

Hardened Enclosure Power Distribution ................................................................................. 37

9. Modular Industrial Workstation (MIW) ......................................................................... 45

10. Modular Industrial Console (MIC) ............................................................................... 49

11. Other Enclosures ........................................................................................................... 53

12. Mounting Structures and Industrial Power Modules..................................................... 55

MMS Outline and Dimensions .......................................................................................... 63

13. Model P79 Workstation ................................................................................................ 65

14. Model P80 Workstation ................................................................................................ 71

15. Model P92 Workstation ................................................................................................ 77

16. Model P93 Workstation ................................................................................................ 83

17. 70 Series Workstations .................................................................................................. 89

18. Server 70 Workstations ................................................................................................. 93

19. 50 Series Processors and Modules.................................................................................. 99

21. Fieldbus Modules (FBMs) ........................................................................................... 117

22. Workstation Displays .................................................................................................. 123

23. Printers........................................................................................................................ 127

24. Panel Display (PD) and Auto-Manual (A/M) Station.................................................. 131

25. System Power and Earthing (Grounding) .................................................................... 133

26. Signal and Power Cabling ........................................................................................... 153

Enclosures and Workstations ............................................................................................ 153

27. Electrical Power Requirements .................................................................................... 163

28. Field Input/Output Wiring ......................................................................................... 173

29. Fieldbus Communication ............................................................................................ 189

30. Nodebus Communication ........................................................................................... 193

Typical Coaxial (Copper) Nodebus Communications ........................................................... 194

31. Carrierband LAN Communications ............................................................................ 197

32. Hydrostatic Tank Gauge Interface............................................................................... 203

33. Mass Flowmeter Interface............................................................................................ 205

34. Site Planning Checks................................................................................................... 207

Appendix A. Equipment Physical Characteristics .............................................................. 209

Appendix B. Mounting Options........................................................................................ 215

Appendix C. Equipment Operating Environments ............................................................ 221

Appendix D. Contamination and Temperature Specifications........................................... 225

Appendix E. Relative Humidity and Altitude Specifications .............................................. 229

Appendix F. Electrical Power............................................................................................. 233

Appendix H. Mechanical Specifications............................................................................. 241

Appendix I. Thermal Loading on HVAC Systems ............................................................. 243

Appendix J. Thermal Loading on Enclosures..................................................................... 247

Appendix K. SCSI Bus Configuration Guide..................................................................... 251

Index .................................................................................................................................. 253

25-10.Backup Power Configuration .................................................................................... 149

26-5. Wall or Pipe, Mounted, Cable Entry ......................................................................... 156

Who This Book is For

What You Should Know

How to Use This Book

Computer Room Temperature, relative humidity, and airborne particulates are

Operating Environmental Specifications

General Clearance Requirements

Enclosure Rear Access

Exterior Heat Exchangers