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2 RDY/BSY
• Fast Read Access Time—150 ns RDY/BSY •1 28 Vcc
3 A12
32 Vcc
31 WE
1 NU
30 NC
• CMOS Technology for Low Power Dissipation A12 2 27 WE
4 A7
A7 3 26 NC
- 30 mA Active A6 4 25 A8 A6 5 29 A8
- 100 µA Standby A5 5 24 A9
DIP/SOIC
A5 6 28 A9
PLCC
A3 7 22 OE A3 8 26 NC
• Data Retention >200 years A2 8 21 A10 A2 9 25 OE
A1 10 24 A10
• High Endurance - Minimum 100,000 Erase/Write A1 9 20 CE
A0 11 23 CE
A0 10 19 I/O7
Cycles I/O0 11 18 I/O6
NC 12 22 I/O7
I/O0 13 21 I/O6
• Automatic Write Operation I/O1 12 17 I/O5
14
15
16
17
18
19
20
- Internal Control Timer I/O2 13 16 I/O4
I/O1
I/O2
Vss
NU
I/O3
I/O4
I/O5
VSS 14 15 I/O3
- Auto-Clear Before Write Operation
- On-Chip Address and Data Latches • Pin 1 indicator on PLCC on top of package
• Data Polling OE 1 28 A10
A11 2 27 CE
• Ready/Busy A9 3 26 I/07
• Chip Clear Operation A8 4 25 I/06
NC 5 24 I/05
• Enhanced Data Protection WE 6 23 I/04
TSOP
- VCC Detector Vcc 7 22 I/03
VCC and input voltages w.r.t. VSS ....... -0.6V to + 6.25V A0 - A12 Address Inputs
Voltage on OE w.r.t. VSS ..................... -0.6V to +13.5V CE Chip Enable
Voltage on A9 w.r.t. VSS ...................... -0.6V to +13.5V
OE Output Enable
Output Voltage w.r.t. VSS ................ -0.6V to VCC+0.6V
WE Write Enable
Storage temperature .......................... -65˚C to +125˚C
I/O0 - I/O7 Data Inputs/Outputs
Ambient temp. with power applied ....... -50˚C to +95˚C
*Notice: Stresses above those listed under “Maximum Ratings” RDY/Busy Ready/Busy
may cause permanent damage to the device. This is a stress rat-
VCC +5V Power Supply
ing only and functional operation of the device at those or any
other conditions above those indicated in the operation listings of VSS Ground
this specification is not implied. Exposure to maximum rating con-
ditions for extended periods may affect device reliability. NC No Connect; No Internal Connection
NU Not Used; No External Connection is
Allowed
AC Testing Waveform: VIH = 2.4V; VIL = 0.45V; VOH = 2.0V; VOL = 0.8V
Output Load: 1 TTL Load + 100 pF
Input Rise and Fall Times: 20 ns
Ambient Temperature: Commercial (C): Tamb = 0˚C to +70˚C
Industrial (I): Tamb = -40˚C to +85˚C
VIH
Address Address Valid
VIL
VIH
CE
VIL
t CE(2)
VIH
OE
VIL t OFF(1,3)
t OE(2) t OH
VOH
Data High Z High Z
Valid Output
VOL
t ACC
VIH
WE
VIL
AC Testing Waveform: VIH = 2.4V; VIL = 0.45V; VOH = 2.0V; VOL = 0.8V
Output Load: 1 TTL Load + 100 pF
Input Rise/Fall Times: 20 ns
Ambient Temperature: Commercial (C): Tamb = 0˚C to +70˚C
Industrial (I): Tamb = -40˚C to +85˚C
VIH
Address
VIL
t AS t AH
VIH
CE, WE t WPL
VIL t DH
t DV t DS
VIH
Data In
VIL
t OES
VIH
OE
VIL
t OEH
VOH
Rdy/Busy Busy Ready
VOL t DB
t WC
VIH
CE
VIL
VH
OE
VIH
tS tH
tW
VIH
WE
VIL tW = 10ms
tS = tH = 1µs
VH = 12.0V ±0.5V
28C64A F T – 15 I /P
Package: L = Plastic Leaded Chip Carrier (PLCC)
P = Plastic DIP (600 mil)
SO = Plastic Small Outline IC (600 mil)
TS = Thin Small Outline Package (TSOP) 8x20mm
VS = Very Small Outline Package (VSOP) 8x13.4mm
Temperature Blank = 0°C to +70°C
Range: I = -40°C to +85°C
Access Time: 15 150 ns
20 200 ns
25 250 ns
Shipping: Blank Tube
T Tape and Reel “L” and “SO”