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transmission gates consist of 2 transistors. The voltage swing, P, is the probability of a switch, FClk is
transistor count for these XOR gates is provided in the clock frequency, I,, is the short-circuit current, I,eak
Figure 1. The last element of that table, (k), is the new is the leakage current and VDD is the supply voltage.
XOR gate that is presented in the next section. The main components of the power dissipation are the
is, and v , - ~ components.
~,~~ The ileakcomponent of the
111 DESIGN AND ANALYSIS OF NEW equation is very low and is sometimes omitted in
XORKNOR GATES literature.
A new XOR is presented in Figure 2. It is related The voltage swing of a circuit is the change in
to design (i) in Figure 3 and the only difference is that voltage that occurs during a transition. It is equal to the
the VDD connection in design (i) is connected to the voltage difference between a IogiQnd a logie
input A . Because it has no power supply, it is referred When the signal transmission is perfect, the logils
to as the Powerless XOR, or P-. Similarly, we propose equal to VDD and the log& equal to VSS. The
a new XNOR gate that is named Groundless XNOR, voltage swing is therefore equal to the supply voltage
or G-, because there is no ground. and so, a reduction in supply voltage results in lower
I
YOD
power dissipation.
The voltage swing is also reduced when the
signals are not fully transmitted. This occurs when an
NMOS transmits a logic '1' or a PMOS transmits a
m
rrI logic '0'. A circuit that has a lesser driving capability
Figure 2. New XOR/XNOR Gates often dissipates less power. CMOS designs usually
have several series connected transistors at the output.
In the following, we analyze the performance of This results in weaker driving capability than if it is
the different XOR gates shown in Figure 3 in terms of driven by an inverter or a buffer, but yet not as weak as
power consumption and propagation delay. The the previous case.
evaluation is done in both in theory and experimentally The short-circuit current is established by a direct
through simulations. path between VDD and VSS. The repeated presence of
Equation (3) [7] is used to estimate the power such connection causes higher power consumption. A
consumption of a circuit. large part of the power consumption is caused by the
* O*h' +,' * hm+Z%d * YDD (3)
PI,,,,,, = (IC,* F.txm"r frequent switching of inverters, in particular, ones that
are connected to the input ports. This part of the power
In this equation, C, is the load capacitance, V, is the
,A
.-
P-
"
m (D
26
is less when direct paths from VDD to VSS are limited
or become non-existent when either VDD or VSS is
not present, as in the case of the static energy-recovery
XOR (Figure 2) and P- XOR (Figure 3).
Figure 4 summarizes the key elements that
dissipate power. The Incomplete Voltage Swings
column only takes into consideration cases where a
logic '1' is transmitted through an NMOS and where a
'0' is transmitted through a PMOS.The Source of is,
column identifies the main transitions that cause short-
circuit current. These are the signals that momentarily
connect VDD and VSS every time the states change.
Only short-circuit currents generated by
comDlementary CMOS inverters are considered in
order
IV EXPERIMENT DESCRIPTION
The simulation environment is setup to measure
performance in terms of propagation delay and power
dissipation. Simulations are performed at varying
frequencies to take into account the fact that different
applications work at different frequencies. The same
applies to capacitive loading conditions. Simulation
conditions are shown in Figure 5 .
Lopd I OOlPP I oar@I omr@ I OlP I OJPp I OS@ I
-F 1% 5m 10- zm SO- I W m la*
27
T h e Second IEEE Asia Pacific Conference o n ASICs / Aug 28-30, 2000
:i
02
Figure 12. Ranking for XOR/XNOR Gates at O.OlpF
V CONCLUSIONS
In this paper, we proposed new 4-transistor XOR
and XNOR gates. The XOR gate was simulated and
the results, in terms of power consumption and
propagation delay, were compared with the
performance of 11 other XOR gates. The results show
that the new P-/G- XOR always consumes less power
than any other XOR gates. In terms of propagation
I L
'I delay, design (i) is the XOR gate that is the fastest. The
proposed P-/G- XOR is slower than the other 2 4-
transistor XOR gates.
REFERENCES
[ l ] J. Wang, S. Fang and W. Feng. New Eflcient
Designs for XOR and XNOR functions on the
Transistor Level. IEEE Joumal of Solid State Circuits
Vol. 29, NO. 7, pp. 780-786
[2] M. Izumikawa, et al. A 0 . 2 5 ~CMOS 0.9-V
IOOMHz DSP Core. IEEE Journal of Solid State
Circuits Vol. 32, No. 1, pp. 52-60.
[3] U. KO,P. T. Balsara and W. Lee. Low-Power
Design Techniques for High Performance CMOS
Adders. IEEE Transactions on VLSI Systems Vol. 3,
No. 2 June 1995, pp. 327-333
. ...... [4] R. Zimmermann and W. Fichtner. Low-Power
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IEEE Joumal of Solid State Circuits Vol. 32, No. 7, pp.
1079-1089.
[ 5 ] H. T. Bui, A. K. AI-Sheraidah and Y. Wang.
Design and Analysis of IO-transistor Full Adders
Using Novel XOR-XNOR Gates. Technical Report.
Florida Atlantic University, October 1999
[6] N. Weste and K. Eshraghian. Principles of CMOS
VLSI Design, A System Perspective. MA: Addison-
-F Mr) .
.r _
k Wesley, 1993
[7] A.P. Chandrakasan, S. Sheng and R. W.
Figure 11. Power-Delay Product at 0.OlpF
Brodersen. Low-Power CMOS Digital Design IEEE
Joumal of Solid State Circuits Vol. 27, No.:, pp. 473-
483
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