Beruflich Dokumente
Kultur Dokumente
INTERNATIONAL JOURNAL
Proceedings of the 2 International OF MECHANICAL
Conference on Current Trends in Engineering and ENGINEERING
Management ICCTEM -2014
17 – 19, July 2014, Mysore, Karnataka, India
AND TECHNOLOGY (IJMET)
ABSTRACT
The present work investigates the numerical simulation of thermal analysis of mixed convection air flow in a
CPU Cabinet. The simulation is focused on the non-uniformly heated mother board temperature distribution. In the
present work three cases have been studied, 1) Placing the CPU in vertical position, 2) Placing the CPU in horizontal
position and 3) Providing exhaust fan on top. The work also includes studies of effectiveness of different inlets provided.
The temperature distribution of the components and streamlines were investigated in order to get a clear picture of which
case is more effective for cooling of the mother board. The simulation was carried out using a standard commercial CFD
code-ANSYS-Fluent. It is found that horizontal position results in reduction of motherboard average temperature of 0.1
0
C as compared to vertical position. It is also observed that bottom opening has very less effect on motherboard
temperature.
Keywords: CPU Cooling, Electronic Cooling, Forced Cooling of Electronic Devices and Mixed Convection.
1. INTRODUCTION
Every system has a critical temperature and it is very crucial to avoid reaching this critical temperature. When
passing the manufacturer's critical temperature, the system starts to fail or even make the system to work off. As a result,
the heat transfer in the electronic systems must be examined before designing the application [1]. There are many ways in
which possible air-cooling design can fail; inadequate coolant flow, poor flow distribution, poor mixing and low heat
transfer coefficient or power dissipation higher than the expected. To analyze these types of causes CFD approach is
good [2]. The cooling of electronic systems is essential in controlling the temperature and avoiding any hot spots.
Cooling of electronic equipment is one of the most important factors to be considered in designing electronic devices and
in making them energy efficient. Desktop computers are one among the most commonly used devices in the world.
Hence making the desktop computers, energy efficient can effectively reduce the electricity consumption.
The power consumption due to exhaust fans being used in the cabinets becomes significant when considered in
mass. The maximum amount of heat dissipation in the CPU cabinet is because of processor, chipset and hard disk drive.
Many researchers have studied heat transfer effects around the electronic devices. T. Y. Tom Lee, used the CFD
technique to evaluate the temperature and velocity fields of air flow in a computer system enclosure [3]. Yu and Webb
have mentioned total cabinet power dissipation being 313 W [4]. They have also given the details of power dissipation
from individual components such as Memory, Chipset, AGP and PCI cards.
Another computational study has been carried out by Konstantinos-Stefanos P.NIKA’S and Andreas D.
PANAGIOTOU [1]. In this study the investigation has been made regarding the air flow circulation, and the temperature
distribution profiles occurred over non-uniformly heated printed circuit board. Based on the position, geometrical
characteristics and the number of fans have been altered to study the thermal effects. In their study the inlet fans and their
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Proceedings of the 2nd International Conference on Current Trends in Engineering and Management ICCTEM -2014
17 – 19, July 2014, Mysore, Karnataka, India
geometrical characteristics have been altered in order to identify which is the best case that produced the maximum heat
transfer results [1]. In past studies some people have tried with structured grid for their simulation [3, 5] only a few of
them have used unstructured grid [1]. The structured mesh has been given better results as compared to unstructured
mesh. Different turbulence models have been tested and compared [1] [6], for these kind of problems k-ɛ Turbulence
model produces the best approach as far as the comparison between numerical and experimental data [1].
From the literature survey it is found that there are no studies on the heat dissipation and fluid flow variations
inside the CPU cabinet in vertical and horizontal positions and there are no studies on which inlet opening is more
effective for cooling of the motherboard. This is the motivation of the present work.
In the present work, we have considered the 3-D, steady state, mixed convection air cooling of a non-uniformly
heated mother board inside the cabinet. Heat dissipation from the mother board and hard disk drive have been studied.
The simulations are carried out using industrial standard commercial CFD code ANSYS-Fluent.
2. PROBLEM DESCRIPTION
The objective of the present work is to analyze the airflow pattern in a CPU Cabinet and temperature
distribution of motherboard for different orientation and different location of openings. The problem essentially needs
geometry simplification to reduce the complexities which may arise in grid generation. It is also required to use
multiblock approach for grid generation since the problem involves many heat sources and boundary conditions. The
orientation of the CPU Cabinet will be altered in order to identify which orientation is the best case that produced the
maximum heat dissipation. The inlet opening of the CPU-Cabinet will be altered in order to identify which inlet opening
is more effective for cooling of the mother board. The detailed geometry is shown in Fig.1.
3. NUMERICAL METHODOLOGY
ANSYS-FLUENT 14.5 commercial package software has been used for simulation. The current study uses the
finite volume method and the equations solved are the continuity, momentum and energy equation. From the past studies,
we have considered k-ε is the best turbulence model for this kind of problem as compared to the other turbulence models
and the same has been used in the present work.
The present study is performed under steady state conditions and air is assumed as incompressible. Boussinesq
approximation is used to account buoyancy. SIMPLE algorithm is used for pressure-velocity coupling.
4. GOVERNING EQUATIONS
RANS (Reynolds-averaged Navier-Stroke) equations are solved for steady state flow. The equations for
continuity, momentum and energy are shown below. Where equations 1 is the continuity equation and equations 2, 3 and
4 are the momentum equation in x, y and z direction respectively and the equation 5 is the energy equation:
=0 (1)
(2)
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Proceedings of the 2nd International Conference on Current Trends in Engineering and Management ICCTEM -2014
17 – 19, July 2014, Mysore, Karnataka, India
(3)
(4)
(5)
Where in equation 3 is a source term which takes gravity effects into account.
5. BASIC ASSUMPTIONS
In order to simplify the present work the following basic assumptions made are.
6. BOUNDARY CONDITIONS
The exhaust fan and processor fan are 80 mm in diameter. As per the manufacturer specifications the velocity of
the 80 mm diameter fan is 2.85 m/s. The cabinet is simulated as zero wall thickness, but only the wall-faces to form the
boundary with no slip condition. The maximum amount of heat dissipation from the CPU is 80 W and the chipset is 10
W. The hard disk drive dissipates 20 W of heat.
A grid dependence study has been carried out successfully based on the following parameters. Motherboard
average temperature, Exhaust fan average temperature, velocity; SMPS exhaust average temperature, velocity and inlet
average velocity.
In the present case, the multiblock structured grid has been used. Total 9 different grid was tested, out of them 4-
cases with first element height from the wall is 0.5mm and 5-cases with first element height from the wall is 0.1mm with
growth rate at 1.2.
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Proceedings of the 2nd International Conference on Current Trends in Engineering and Management ICCTEM -2014
17 – 19, July 2014, Mysore, Karnataka, India
Average Temperature in
0.1mm first element
32 height
0C
31
30
0 5 10 15 20 25
Number of Elements in Lakhs
The cells were denser in the region near to the boundary surfaces and coarse in the middle region of the domain.
Finally the 5-Lakh element denser grid has been used for further study, since it was found to take less computational
space and time. Fig.3. shows the variation of average motherboard temperature for different grid size. It can be seen that
there will not be much change of the results after increasing the mesh elements above 5-Lakhs.
In this work three different cases have been studied by placing the CPU in vertical and horizontal orientations,
the details of the cases studied are listed in TABLE 1. Temperature distribution and corresponding streamlines are used
for the thermal analysis of CPU cabinet.
Figure 4: Temperature distribution contours for Figure 5: Air streamlines for vertical orientation
vertical orientation
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Proceedings of the 2nd International Conference on Current Trends in Engineering and Management ICCTEM -2014
17 – 19, July 2014, Mysore, Karnataka, India
Figure 6: Temperature distribution contours Figure 7: Air streamlines for horizontal orientation
for horizontal orientation
8.3 Case C: Simulation of CPU Cabinet-vertical orientation and changing exhaust fan location
In case A and B, the maximum quantity of hot air after hitting the surface of the motherboard and hard disk
drive will move towards the top portion of the cabinet. So we think that instead of placing an exhaust fan at the back side
of the cabinet, placing it at the top portion of the cabinet then the fresh air comes in giving better cooling effect. The
temperature distribution and airflow inside the cabinet in this case is illustrated in Fig.8 and Fig.9 respectively. The total
average temperature of the motherboard that can be obtained is 37.7 0C.
Figure 8: Temperature distribution contours Figure 9: Air streamlines for exhaust fan on top
for exhaust fan on top
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Proceedings of the 2nd International Conference on Current Trends in Engineering and Management ICCTEM -2014
17 – 19, July 2014, Mysore, Karnataka, India
fan. The Fig.10 shows the distribution of air inside the cabinet. These stream lines show that the left side inlet is mainly
helpful for cooling of the motherboard, not much affecting for cooling of the hard disk drive.
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Proceedings of the 2nd International Conference on Current Trends in Engineering and Management ICCTEM -2014
17 – 19, July 2014, Mysore, Karnataka, India
CONCLUSION
This case study demonstrates the capability of computational fluid dynamics software in predicting flow field
and heat transfer in an air-cooled computer system. The conclusions from the present case study are:
• Horizontal case shows average motherboard temperature 0.1 0C, chipset average temperature 0.20C less than that
in the vertical case. The study suggests less fan power requirements in case of horizontal position as compared to
vertical position.
• Left side inlet is mainly helpful for cooling of the motherboard and not much affecting for cooling of the hard disk
drive. Bottom side inlet is mainly helpful for cooling of the hard disk drive and not affecting for cooling of the
motherboard.
• Top exhaust fan case shows average motherboard temperature is same as in the vertical case and 0.1 0C more than
that in the horizontal case; processor average temperature is 0.40C less than that in the vertical case and 0.50C less
than that in the horizontal case; chipset average temperature 0.20C less than that in the vertical case and is same as
that in horizontal case. The study suggests less fan power requirements in case of a top exhaust fan as compared to
the existed a vertical case and more fan power requirements in case of a top exhaust fan as compared to the
existed horizontal case.
REFERENCES
[1] Konstantinos-Stefanos P. Nikas and Andreas D. Panagiotou, Numerical Investigation of Conjugate Heat Transfer
in a Computer Chassis, Columbia International publishing journal of Advanced Mechanical Engineering, (2013)1,
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[2] Robert J. Moffat, Getting the Most out of your CFD Program, The Eighth Inter Society Conference on Thermal
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[3] T. Y. Tom Lee, and Mali Mahalingam, Application of a CFD Tool for System-Level Thermal Simulation, IEEE
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[4] C. W. Yu, and R. L. Webb, Thermal Design of a Desktop Computer System Using CFD Analysis, Semiconductor
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[6] Masud Behnia, Wataru Nakayama, and Jeffrey Wang, CFD Simulations of Heat Transfer from a Heated Module in
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[8] Seri Lee, Optimum Design and Selection of Heat Sinks, Eleventh IEEE SEMI-THERM Symposium, 1995.
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