ASM Solutions in SiP Application

10.2017
ASM SMT Solutions: An influential part of ASM Pacific Technologies

ASM Pacific Technologies (ASM PT) today: Three successful business segments

ASM SMT Solutions ASM Materials ASM Back End Equipment

SMT Line Solution
Leadframes
Die & Flip-Chip Bonder

DEK Printing Solutions
Other Materials
Wire Bonder

SIPLACE Placement Solutions
Molded Interconnect Substrate (MIS)
Encapsulation Equipment

ASM Smart Factory Tools & Services
Tester & Sorter

Laser Dicing

LED Equipment

ASM Pacific Technologies “in a nutshell”:

>1,100 6
patents R&D centers
present in revenues
founded in headquartered in
> 30 >1,700 10 1.84 Bn US$
1975 Countries Singapore R&D engineers manufacturing facilities In calendar year 2016

The ASM PT Group is the world‘s largest supplier of assembly and packaging equipment
ASM Assembly Systems 10/10/2017 Page 2
System in Package
• Panels, strips or singulated
• Micro SMT
Intarsia RF
• Balls on component side module.
Integrated
passives
& wirebonded
die

Bluetooth Module
Key capability_ blue light camera for Cu pillar

ASM Assembly Systems 10/10/2017 Page 4

SIPLACE – Intelligent Height Learning
for Standard SMT Application

With Placement force

control

Machine will
automatically learn
component height and
PCB warpage

Continuous learning
from every placement,
every PCB

+ =

Component Height PCB Warpage Dynamic 3D Terrain

Learning Learning generated in machine

ASM Assembly Systems 10/10/2017 Page 5

 Precondition for soft and reliable component placement
Programmable z-axis (speed and force)
First PCB Second PCB

START VIDEO
Target level

Safety
distance

Page 6 ASM Assembly Systems 10/10/2017

 Self earning of placement level
Placement on upwards wrapped PCB
First PCB Second PCB

START VIDEO
Target level

Safety
distance

10/10/2017 Page 7 ASM Assembly Systems

 Self earning of placement level
Placement on downwards wrapped PCB
First PCB Second PCB

START VIDEO
Target level

Safety
distance

10/10/2017 Page 8 ASM Assembly Systems

PCB Handling during Production
PCB Oscillation self-healing

When ∆ > Allowed value, Self-Healing Oscillation

i.e. 0.2mm

Optimal placement

Machine will automati- process control
cally slow down the
Avoid defects like, solder
movement of Z axis beads, short after reflow

Or send out a warning
message on the screen

Or, if the process is
critical, stop the machine
∆= ?

Force feedback control

Z movement control

Speed control

ASM Assembly Systems 10/10/2017 Page 9

SIPLACE “0” Placement Force - ‘touchless’ placement
for Special Application*

“0” Placement force 2 Height measurement for

PCB leveling prior to placement

Application for very
fragile component

Accurate process control
of placement into the
flux/solder etc.

∆ Controlled

1 Vacuum tooling to make sure 3 Place component with accurate Z axis

PCB is flat positioned and supported height control based on PCB leveling
ASM Assembly Systems 10/10/2017 Page 10
TX Micron_ Key specification

SIPLACE TX Micron
Machine Configuration 2 gantries, 2 heads(TX2i micron / TX2 micron)

Placement heads SpeedStar (CP20M2) Multistar (CPP)

78000 cph@25µm, 71000 cph@20µm, 65000
Benchmark Up to 48000 CPH
cph@15µm
Accuracy 25/20 or 25/15 µm @ 3 σ

Board size Dual conveyor: 45 x 45 mm to 375 x 260 mm

Component range 0201 metric – 27 x 27 mm

Component Supply Up to 80 x 8 mm tapes, JEDEC tray

Clean Room Class 10000 / ISO 7 (standard)

Power Consumption Typical: 1,9 kW including vacuum pump

Machine
ASM AssemblyDimensions
Systems 1,00m x 2,3 m x 1,45m 10/10/2017 Page 11
TX Micron_ Accuracy measures
SIPLACE TX Micron fiducial bar (x)
Vaccum tooling with fiducial bar (y)
ASM Assembly Systems
SIPLACE TX Micron Standard Package
• Standard accuracy 25/20 µm @ 3 σ
• High resolution glass scales for gantry system (10nm)
• Additional fiducial bar (x)
• Individual accuracy setting on component level
SIPLACE TX Micron 15µm Package
• High accuracy 25/15 µm @ 3 σ
• High resolution glass scales for gantry system (10nm)
• Additional fiducial bar (x)
• Additional fiducial bars on vacuum tooling (y)
• Highly rigid conveyor system for substrate stabilization
• Special vacuum tooling with interchangeable vacuum plate
• Easy exchange via integration of positioning pins
• Individual accuracy setting on component level
10/10/2017 Page 12
Independent Operation with i-mode
• Teaching of
- fiducial
- barcode Independent operation
- component shape
- pickup/placement position
Improvement on OEE
- component tray, feeder pocket

Dynamic editing on one head,
- etc the rest of the line are still
running; works for NPI, mass
production as well

ASM Assembly Systems 10/10/2017 Page 13

SIPLACE BulkFeeder X
Overview

Pick up window Cartridge

Control panel

7 segment display

Forward Button

Backward Button

Cartridge removal

Camera

EDIF

Page 14 ASM Assembly Systems 10/10/2017

SIPLACE BulkFeeder X
Cartridge overview

Container
Pick up window with
shutter
Refill

RFID

0402 0201 01005

Container Capacity Up to 110.000 Up to 500.000 Up to 1.500.000

Page 15 ASM Assembly Systems 10/10/2017

SIPLACE BulkFeeder X
Component analysis
Legend

Pickable components are marked green

Tiled components are marked orange

Component clusters are marked blue

Components laying too close are marked red

Always enough components for 20 pick up’s

Page 16 ASM Assembly Systems 10/10/2017

SIPLACE BulkFeeder X

#1 supply form for high volume applications

Reduce Manual work

No reels – No splicing – No waste

Up to 90% less material logistics

Higher pickup reliability

Better placement quality, especially
for narrow gap placement

ASM Assembly Systems 10/10/2017 Page 17

Bad Mark Recognition with SIPLACE Machine
PCB bad mark detection in the production
Bad marks (or Inkspots) on PCBs are required to avoid placing expensive components on a defect board

Inkspot detection with SIPLACE machine

Inkspot is programmed in SIPLACE Pro and assigned to each sub-panel of a board

Inkspots are read by the PCB camera prior to placement in each machine

Only the good panels (with good inkspot recognition) will be populated

Time needed for inkspots reading is added to cycle time
SIPLACE Virtual Inkspot Handling – System Overview
System workflow (from Station SW 707)
 External system provides Virtual Inkspot file that describes the circuits to be produced per board
identified by a barcode
 1st SIPLACE machine scans barcode of board (scanner or camera)
 Barcode is send via OIB Interface of SIPLACE Board Gate Keeper (BGK) to external system
 External system returns inkspot data with the circuits to be produced (name of subpanels defined
in SIPLACE Pro)
 Inkspot data are transferred to the next SIPLACE machine by the Whisper Down The Line option
External
System
(MES)
Inkspot Board ID
Data
BGK

Board ID + Board ID +
SIPLACE Line Controller
Inkspot Data Inkspot Data
Product overview
Model Name: XXXX-601402-XXXX
Side: Top Dipping Component Qty : 10
Size: 260x100mm
Placements: 9450
Panels: 105

ASM Assembly Systems 10/10/2017 Page 20

SiP Assembly Line Overview

Current Line Configuration

Proposed Line Configuration:

2*NeoHorizon03iX and 3*X4iS-M

ASM Assembly Systems 10/10/2017 Page 21

Alternating mode
Results - Dipping Process vs Flux Printing Process
Performance

Feeder demand Increased ~ 20% productivity

Nozzle demand

ASM Assembly Systems 10/10/2017 Page 22

SIPLACE CA

Accuracy

Chip shooter with integrated wafer system

Supports SMT, flip chip (DCA) & die attach (COB)
on a single platform

ASM Assembly Systems 10/10/2017 Page 23

SIPLACE Wafer System (SWS)
Standard

Handling of wafers from 4” up to 12”

Hoop ring handling capability

8”/12” Wafer Expansion Unit / Stretcher

Automatic wafer exchange

Multi Die Capability

Wafer magazine for up to 25 wafers

Supports Linear Dipping Unit

ALPS electronic wafer map

Setup verification for SWS

New products or changed packaging (e.g. wafer, T&R) can easily be

adopted.

ASM Assembly Systems 10/10/2017 Page 24

Introduction eWLB

FC

FC+ SMD
LED

large Panel
SIPLACE CA
FC (LED) + SMD

For Advanced Packaging Chip 2 Wafer
market
FC

Flip Chip & Die Attach from
DA with DAF
wafers combined with SMD
Cap wafer
with DAF

Suitable for

High Placement
Accuracy, High Volume
Production.
SiP / Hybrid Embedded PCB

DA with SP + SMD
FC

FC + SMD
FC + SMD

Multi DA with SP + SMD
DA with DAF

Multi FC + SMD
ASM Assembly Systems 10/10/2017 Page 25
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