Beruflich Dokumente
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Opti o na l Modules
n Automatic loader/unloader
n 2DID readers
n Auxiliary lamp for automated calibration
rƒsco jƒguƒr led
High Performance Full Flux Test Handler
Specifications
Performance Characteristics ESD Protection
Tile Index Time down to 7.0 sec Field strength at device: 100 Volt/in (max.)
0.3 sec Device Index Time Ground strap jack: 1 M-Ohm to ground
MTBF: > 1,000 hr, MTTR: < 30 min, MTBA: > 4 hr Device path: conductive and grounded
Jam Rate < 1: 1,000 tiles
Physical Dimensions (Width x Depth x Height) 7
Tile Dimensions Basic Handler: 1,200 x 1,084 x 1,040 mm
Length: 76.2 mm to 104 mm; Width: 25.4 mm to 104 mm Handler with slotted Cassette Modules:
Body Height : 3 mm (typ. max.) 1 2,400 x 1,254 x 1,225 mm
Devices per tile: 5,000 (max.)
Electrical Interfaces
Tile warpage: ≤ 0.2 mm (max.)
TTL parallel standard, RS 232 standard, IEEE 488 (optional),
Temperature Characteristics Network standard, USB at OPI (standard)
Base Handler ambient to 85°C capable 2 Strip Mapping: SECS/GEM and XML, SEMI G84/G85, E142
Accuracy: down to ± 2°C @ 85°C 3
Time to Temp : ≤ 30 min 4 Contactors or Probe Cards
Soak Capacity: up to 3 tiles Integrated Pogo Pin Solutions
Facility Requirements
Nominal supply voltage 5: 208 - 230 VAC
Standard Air Pressure: 5.5 bar (80 psi)
Air Consumption6: 100 to 450 l/min
Advanced Configurations
LED Test Configuration
Single - variable size
Complete Tile Test
Thermographic Test Correlated Color Test
Chip on Board Test
LED Module Test
LED Strip Test