Data Driven Framework for Degraded Pogo Pin Detection in
Semiconductor Manufacturing
Theint Theint Aye, Feng Yang, Long Wang, Gary
Kee Khoon Lee
Institute of High Performance Computing, A*STAR
1 Fusionopolis Way, Singapore 138632
{ayett, yangf, wangle, leekk}@ihpc.a-star.edu.sg
Abstract—Integrated Circuit (IC) product test in
semiconductor manufacturing industry is commonly
conducted through the socket pogo pins contacting with the IC
products. The socket pogo pins can be degraded due to
repeatedly plugging-into and pulling-out from the socket.
Degradation in socket pogo pins will greatly affect the
accuracy of final test in semiconductor manufacturing, which
in turn results in economic and reputation losses of
manufacturers. How to rapidly and accurately detect the
degraded pogo pins is still unresolved. In addition, the very
huge data produced by a large amount of tester machines will
further bring difficulties into degradation detection of socket
pogo pins. Focusing on those existing problems in
semiconductor manufacturing, this paper proposed a data
driven framework with adopting data mining techniques to
tackle them. This framework transforms the test data
generated by manufacturing machines into human readable
format and then analyzes them by data mining techniques,
which empowers the manufacturing engineers to automatically
detect the degraded socket pogo pins from the test data.
Extensive experimental studies with real data were carried out
and the results show great application prospect of the proposed
framework.
Keywords- pogo pin, degradation detection, data-driven
framework, data mining techniques, semiconductor
manufacturing
I. INTRODUCTION
The powerful intelligent and smart devices for personal
and industrial use such as smart phones and tablets are
widespread and proliferating at an accelerated rate day by
day. These smart devices are connected by powerful back-
end software intelligent systems. The semiconductor
manufacturing industry is a major enabler for these
intelligent systems. However, the increasing design
complexity such as multi-core processors, embedded
memory caches and System-on-a-Chip are making
semiconductor manufacturing more difficult and leading to a
rapid complexity increase in manufacturing processes.
The multiple numbers of manufacturing stations,
requiring hundreds of process steps and increasing number
of related parameters collection, return a flood of
multivariate data, the processing of which is becoming a
great challenge in semiconductor test processes today. One
of the major data resources in semiconductor manufacturing
978-1-4799-8389-6/15/$31.00 2015
c IEEE
Xiang Li, Jinwen Hu, Manh Cuong Nguyen
Singapore Institute of Manufacturing Technology,
A*STAR
71 Nanyang Drive, Singapore 638075
{xli, jwhu, nguyenmc}@SIMTech.a-star.edu.sg
is in the product testing process where floods of data from
each testing product are generated in a real-time manner.
However, many manufacturing engineers will confirm that
90 percent of the test data they store are not utilized for the
purposes such as improving yield, throughput, efficiency,
and product quality, and how to expand the use of the
collected and stored data is still a crucial thing that many
companies have been seeking to do [1].
In the product testing in semiconductor manufacturing
industry, a socket is a critical element and it must survive the
rigorous demands of a production floor. Different types of
sockets provide specialized electrical and mechanical
parameters needed for specific stages in the product testing
process. Within each socket, several hundred of pogo pins
are deployed and they are now performing the direct
connection between testing machines and products to collect
testing data for over 90 percent of real applications.
Therefore, the quality of connection will play a crucial role
for the whole product testing. However, each pogo pin, made
of solid hard alloy metal, has its own life time as its quality
will degrade over time due to repeatedly plugging-in and
pulling-out of the testing products. Low quality or failure of
pogo pins in semiconductor test environment affects the
quality of signals collected and hence the accuracy of die (a
semi-finished product) testing, which could then lead to a
level of unacceptable false rejection in testing processes. All
of those rejected dies are needed to be re-tested and as a
result, the testing will incur higher cost including a lot more
money and more time. In order to overcome these problems
resulted from low quality of pogo pins, testing engineers
need to inspect, maintain and replace pogo pins before the
test cycle starts. Traditionally, the engineer detects the
degraded pogo pins by carefully observing the tip of each
pogo pin through a microscope. This way is very time
consuming, costly and inefficient in practice where one
semiconductor test machine generally contains 8 sockets
with each socket consisting of over 400 pogo pins. Thus, the
manual detection of degraded pogo pins becomes challenges
and bottleneck in semiconductor industry.
How to utilizing the collected data from pogo pins to
determine the quality of pogo pins is the focus of this study.
In this study, a data driven framework for degraded pogo
pins detection is proposed. The proposed framework
empowers the manufacturing engineers by auto-detection of
degraded pogo pins applying data mining techniques such as
345
 linear regression and classification. There are some
challenges in this project such as the unlim mited number of
test data files with respect to one pogo pin and no
standardization in test data files size. Moreover, all
manufacturing test data files are in machinee readable format
(.std). Thus, the following steps are neededd to perform prior
to auto-detect the degraded pogo pins: (i) traansform machine
readable test data to human readable filee format such as
comma separated value (.csv); (ii) analyzee all transformed
csv files to find out degraded pogo pins bby applying data
mining techniques; and (iii) return the rannks of pogo pins
which have relatively higher probabilities off degradation.
The remainder of this paper is organnized as follows.
Section II describes an overview and complexity of
semiconductor manufacturing test data and Section III
presents the proposed framework architectuure, technologies’
outcomes and discussions and finally Sectiion IV concludes
the paper and discusses for further study.
II. OVERVIEW AND COMPLEXITY OF SEEMICONDUCTOR
MANUFACTURING TEST DATTA
Modern semiconductor manufacturing pprocesses feature
an increasing number processing steps with an exponentially
increasing complexity of the steps themselves and generate a
flood of multivariate monitoring data. Typpically, there are
two main stages in semiconductor prodduction; frontend
(fabrication or “fab”) and backend (“assemb mbly and test”) by
Shott [2]. During frontend process (wafer ffabrication), bare
silicon wafers up to 8 inches diameter, is connverted to wafers
and repetitively processing them by adding llayers of material
to produce multiple copies of an integratedd circuit or “die”
on the wafer. During backend process (asssembly and test
activities), the good dies are put throough a multiple
processing sequence to create neceessary electrical
connections for the device to function after ddies are separated
and sorted. The completed product is com mmonly known as
“dies” that are packaged for use in an electroonic system.
Data collected during manufacturing is aavailable from a
variety of sources [4]. In this study, the final test data is
analyzed to achieve the degraded pogo pin information as it
includes thousands of highly correlated meaasurements taken
on millions of die.
In the manufacturing process, the fiinal test data is
generated as the standard test data format (STDF) in machine
readable format. The STDF is a proprietarry file format for
semiconductor test information originallyy developed by
Teradyne, a leading supplier of Automatic Test Equipment
used to test semiconductors, wireless produucts, data storage
and so on [4]. In this section, the complexxity of STDF file
such as its various record types and brief deescription of each
record type are explained. Besides, tthe fundamental
knowledge to perform data analysis such ass STDF file size,
how many tested die per day and each pogoo-pin life span are
also mentioned.
(i)Complexity of STDF
The STDF is a set of logical record types and those
record types can be used as the underlying data abstraction,
346 2015 IEEE 10th Conference on Industrial Electronics and Applications (ICIEA)
whether the data resides in a data d buffer, or is being
propagated in a network message by b [5]. There are several
record types in one STDF. Tablee I illustrates the STDF
record name, its attributes and frequencies of record per
STDF file and per dice/part that aree seen in one STDF. Each
die test record is recorded from PIR
R till PRR and this loop is
repeated until no more die to be testted in one semiconductor
machine. The brief description of each
e record type is as the
followings.
TABLE I STDF RECORD NAME AND FREQUENCY
R OF EACH RECORD
File Attributes Record (FAR) is required as the first
record of STDF file and Master In nformation Record (MIR)
contains all information related to a tested lot of die such as
test program name, lot id, tester id, i data and time of job
setup, test temperature and prroduct family id. Pin
Information Record (PIR) performss as a marker to indicate
where a particular part testing beg gins and Parametric Test
Record (PTR) consists of the resu ults of a tested dice/part
against a specification for a measured electrical
characteristics or quantity such as voltage,
v current, low limit
and high limit. Each PTR is assocciated with one pogo pin
information such as pin name, ch hannel name, site/socket
number, test name and test numb ber. Part Results Record
(PRR) contains the result informatio on relating to each tested
dice such as hardware bin and softw ware bin number, dice/part
information and elapsed time. Part Count
C Record (PCR) will
appear near the end of STDF file an nd it contains the dice/part
count totals for one or all test sitess. Master Results Record
(MRR) is the last record in STDF file and it contains date
and time of last tested dice/part.
According to various record types’ information, identical
tests are performed by each site and d one site corresponds to
each socket on semiconductor mach hine. Each socket contains
identical set of pins and each pin iss identified by site/socket
number, pin (logical) name and chaannel name. Fig.1 shows
the example of 4 sockets with set off pogo pins.
Figure 1. Example of test socketss with set of pogo pins
(ii) Fundamental Knowledge for Data Analyysis information from PTR and numberr of die/parts information
To perform semiconductor test datta analysis, the from PRR respectively.
fundamental knowledge such as test data ffile size per day,
how many die are tested per day and life sspan of pogo pin (iii)Data Analysis
have to be known. In this stage, the generated csv files from previous stage
The life span of a pogo pin can predict bbased on the total are directly utilized. Each row in csv
c file represents all the
time of use and how many times are usedd per day. As an testing readings of a particular dice d with all pogo pin
example, the total time of use of a pogo pinn is 150,000 times information, while each column con ntains the testing readings
and 2,500 times are used per day, the llife span of this of all tested die related to a speecific pogo pin. Due to
particular pogo pin is 60 days. In order to deetect the degraded different number of die tested in eacch STDF file, the number
pogo pin from STDF test data files, 60 dayys STDF test data of rows in each csv file is differeent. In current study, we
files are accumulated. As a consequence, the accumulated analyzed 18 test data files. Table II shows the statistics of 18
STDF data file size will be a few hundredd GBs. Thus, the csv files including the minimum, maximum,
m mean rows, the
data mining techniques that we utilized in thhis study might be total number of rows and columns.
robust and provide the ranks of pogo ppins with higher In order to analyze a complicatted test data files, firstly
probability of degradation. data correlation is used and don ne among the different
columns of csv files. The purpose off correlation analysis is to
III. DATA DRIVEN FRAMEWORK ARC CHITECTURE, reduce the data complexity by filtering
f out the highly
TECHNOLOGIES’ OUTCOME AND DISC
CUSSIONS correlated columns. Then data normalization and two
In order to auto-detect the higher possibilities of methods of data modelling: (i) lin near regression and, (ii)
degraded pogo pins, a Data Driven Fram mework (DDF) is classification are performed. The detail
d explanation of each
proposed. Fig. 2 illustrates the propoosed framework Data Analysis step is as follows.
architecture comprising of STDF data, Dataa Transformation TABLE II: STATISTICS OF SEMICON
NDUCTOR TEST DATA
and Preprocessing, Data Analysis Algorithm
ms and Discussion Min Max. Mean Total Total Columns
based on Data Analysis outcomes. The detaailed explanation Rows Rows Rows Rows
of each component is as follows. 62 677 272 4904 1553

A. Correlation Analysis
(ii) Data (iii) Data Analysis (iv)Results Fig. 3 shows the HeatMap off the absolute Pearson’s
(i)STDF Transformation Discussion correlation among all the columns ofo csv files after filtering
Data and Preprocessing
out the highly correlated columns. From
F this figure, it can be
observed that a large amount of columns are highly inter-
correlated (the red area in Fig.3).

A. Correlation B. Data C
C. Data Modelling
Analysis Normalization i. Linear
(Difference-based reegression
normalization)
ii..Classification

Figure 2. Proposed data driven framework (DDF) foor pogo pin anslysis

(i) Standard Test Data Format (STDF)

As mentioned in Section II, STDF file coonsists of various
record types and all records types have the information that
related to tested die/parts, hardware configuurations and pogo Figure 3. HeatMap of the absolutee Pearson’s correlation
pin information.
Based on their inter-correlatioons of the columns, the
(ii) Data Transformation and Preprocessingg filtering process is done as the following. (i) Setting a
correlation threshold (0.9 in this study),
s (ii) Grouping the
During data transformation and prepprocessing stage,
columns by clustering those who ose inter-correlations are
DDF not only transforms machine readable file format (.std)
greater than the threshold and then (iii) Selecting a
to human readable comma separated valuee files (.csv) but
representative from each group an nd the others are filtered
also performs data preprocessing such as cappturing the useful
out. As a result of the filtering prrocess, 389 columns are
information from different record types. F For example, test
selected from the total of 1553 columns in csv file. The
start date and time, test program name, testeer name are from
ducing the computational
filtering process is greatly helps red
MIR, test finished date and time from MRR, pogo pin
complexity in the following analy ysis: Data Normalization
and Data Modelling.

2015 IEEE 10th Conference on Industrial Electronics and Applications (ICIEA) 347
 B. Data Normalization
Due to the distinction between the tested products (e.g.
different types of dies), the readings recordeed from the same
pogo pin in a tester machine could be inn different scale,
which will bring difficulty in analyzing the signals. An
example of the distinction in scale is depiccted in Fig. 4(a).
The curve in the Fig. 4(a) contains all readiings in a specific
column in csv file. It is observed that there is a segment (x-
axis value between around 3100 and 44000) where the
readings are much higher than the rest. Thiss inconsistency in
scale makes the traditional and popular trend detection
algorithms (e.g. linear regression based treend detection) [6,
7] unavailable.
In order to avoid this difficulty inccurred by scale
inconsistency, normalization to the origginal signals is
required. There are a lot of traditional tecchniques for data
normalization and standardization, such as z-score and min-
max [8]. However, for time series where thhe future statistics
are unforeseen (in the tester’s signals, this iss due to unknown
information to the future tested products as well as their
characteristics), those traditional data noormalization and
standardization techniques are not suitablle. Alternatively,
some derived signals may be used which arre in the common
scale.
In this study, the continuous difference ssignal s (t+1)-s (t)
will be used for the rest analysis, where s ((t) is the original
reading at time t. The assumption of using difference signal
is that, the readings from a pogo pin testing different types of
die have the same variation. In fact, this assuumption has been
verified to be true based on experimental results on test data.
Fig. 4(b) illustrates the difference of thee original signal
shown in Fig. 4(a) and it can be observed that all values in
the difference signal are located in the same scale.
(a)
(b)
Figure 4. Example of (a) orignal signal and (b) their difference signals of
test data
C. Data Modelling
In this section, two methods of dataa modelling are
applied for the detection of degraded pogo pins: regression-
based method and classification-based meethod. These two
348 2015 IEEE 10th Conference on Industrial Electronics and Applications (ICIEA)
methods description and the corrresponding experimental
results are given as follows.
1) Regression-based method
This section is presented how to detect the pogo pins
with quality degradations based on their collected signals. A
preliminary analysis has been carried out in the followings.
The pin degradation in a tester machine
m is that the contact
quality between the pogo pin and the dice will become worse
with time due to, for example, the oxidization on the pogo
pin. A degraded pogo pin will then result
r in inaccuracy in the
signals measured from it, which will finally affect the
decision (accept or reject) made to the
t corresponding dice in
manufacturing test. The ultimatee purpose of pogo pin
degradation detection is to reduce as much as possible the
decision error made due to degradatiion in pogo pins.
Even tested on the same kind off dies with perfect contact
to pogo pin, the measured reading gs will still be different.
This may due to uncertainties existed in the system, for
example, the uncertainties in sensorrs measuring instruments,
the environmental noises and the t difference between
individual die. The difference signals
s are the overall
reflection of those uncertainties (sh
hown in Fig. 4 (b)). With
increase of the degradation in a poggo pin, more uncertainties
will be added in. This study will start
s from the normalized
difference signals as introduced in seection B.
The following assumption to the t degradation of pogo
pins can be reasonably made: the quality
q of a pogo pin will
degrade gradually rather than in an n abrupt manner, i.e., the
measured signals will not change ab bruptly and sharply. There
are a lot of methodologies for trendd analysis in such kind of
signals, and the linear regression is one of the most popular
methods [10].
A simple description to the convventional linear regression
is as below:
‫ݕ‬௜ ൌ ߚ଴ ൅ ߚଵ ‫ݐ‬௜ ൅ ߝ௜ (1)
where ‫ݕ‬௜ is the response variablle observed at time ‫ݐ‬௜ ,
ߝ௜ ̱ܰሺͲǡ ߪఌଶ ሻ are residual variablees and independent for
݅ ൌ ͳǡ ʹǡ ǥ ǡ ݊. The parameter ߚଵ in Eq.
E (1) represents the rate
of change of ‫ ݕ‬with respect to time,, which is also used to as
the indicator for trend detection in time series. The general
way of computing ߚଵ is by least squares estimator [9].
In this study, the linear regreession was not directly
applied to the difference signals buut to their derived energy
signals. A sliding window with win ndow length of 10 is first
put onto the difference signal; the averaged energy in that
window is then calculated. With thee sliding step length of 1,
an energy signal can be generated d. The basic thought of
using this kind of averaged energ gies is that, energy is a
common and generally good represeentation of the changings
in a signal. In addition, the movingg average is able to filter
out the bursts in the signals whicch can be considered as
noises. An example of the corresp ponding energy signal is
shown in Fig. 5.

Figure 5. : Example of the averaged energiess of test data
Figure 6. Slops of the selected 389 columnss of test data
After generation of the energy siggnal, the linear
regression is applied to fit a linear model. Thhe rate of change
(i.e. slop) parameter ߚଵ is then used as the indicator of
degradation: if there is no degradation, ߚଵ wiill be at around 0.
In other words, the greater of |ߚଵ |, the highher probability of
degradation occurs. Fig. 6 illustrates (with sttem plot) the slop
values of the linear regression models fitteed on each of the
389 columns selected from the real data. It can be observed
that some of the columns in the data have rrelatively steeper
slops (see for example the columns betweenn 300 and 350 in
the figure).
The columns of the data are then sortted based on the
absolute slop values in descending order. Taable III shows the
top 10 pogo pins that will be thought too have relatively
higher probabilities of degradation. Howeever, how those
pogo pins degrade over time will need fuurther exploration
and confirmation with help from domain expperts.
TABLE III: TOP 10 POGO PINS BY LINEAR REGRESSSION METHOD
Rank Pin Rank Pin
1 'P1_an12_OFFSET' 6 'P1_aan11_OFFSET'
2 'P1_an11_GAIN' 7 'P1_aan7_OFFSET'
3 'P0_an13_OFFSET' 8 'P1_aan15_OFFSET'
4 'P1_an3_OFFSET’ 9 'P0_aan15_OFFSET'
5 'P1_an6_OFFSET' 10 'P0_aan2_OFFSET'
2) Classification-based method
As mentioned as above, a pogo pin has a trend of
degradation over time, in which the correesponding signals
(time series) collected from a specific pin shhould be different
between the beginning and ending parts. T he classification-
based method is to identify this differencce and hence to
discover the potentially degraded pogo pinss. Fig.7 illustrates
a trend of a pogo pin degradation from m normal status
degrading to a faulty status.
2015 IEEE 10th Conference on Industrial Electronics and Applications (ICIEA)
Figure 7. Trend of degradation off a pogo pin over time
To identify the difference by classification-based method,
a flowchart shown in Fig.8 is propo osed. With the input time
series, segmentation is first conduccted to segment the time
series into pieces and feature extraaction is applied on each
piece to generate an instance. Instaances from the beginning
and ending part of the input time seeries will then be used to
build a 2-class classifier and the training
t accuracy can be
obtained. The higher the accuracy is, the greater is the
difference between the beginning and ending part. Hence,
ranking can be finally carried out to get the top pogo pins
which are having higher possibilitiess of degradation.
Segmentation Instan Output
Time
/Feature
Accura
Ranking
Series ces Classificatio
on
cy
Extraction
Figure 8. Process flow of classifiication-based method
For the segmentation/feature exxtraction in this study, a
time series is consecutively segm mented into pieces with
length of 10 points and the popular 11 time domain statistics
are produced as the features [10]. Fig. 9 demonstrates the
segmentation/feature extraction proocess and the names and
equations of 11 features are shown in TABLE IV.
There are totally 4904 data po oints (i.e. 4094 dies are
tested) in test data. In order to appply 2-class classifier, the
first 500 and last 500 data pointts were selected as the
beginning and ending parts in the experimental studies. In
the feature space after feature extraction,
e there are 50
instances in both beginning an nd ending parts. After
calculating the classification accuraccy for each column of the
data, all columns are ranked and the t details of the top 10
columns are shown in Table V. Please note that all pin
names are dummy names duee to consideration of
confidentiality.
Figure 9. The segmentation/featu
ure extraction process
349
 TABLE IV: Details of 11 Time Domain Features over time. Further verification and checking by domain
Feature Equation experts will be needed.
௡
Average amplitude of ଵ IV. CONCLUSIONS
‫݌‬ଵ ൌ ௡ ෍ ‫ݔ‬ሺ݅ሻ
vibration ௜ୀଵ
σ೙
೔సభሺ௫ሺ௜ሻି௣భ ሻ
మ ଵȀଶ Focusing on the pogo pin degradation issue in semi-
Standard deviation ‫݌‬ଶ ൌ ቀ ቁ
௡ିଵ conductor manufacturing, this paper proposed a data driven
ଵȀଶ
ଵ
೙ framework for detecting degraded pogo pins. Two different
Root-mean-square amplitude ‫݌‬ଷ ൌ ൭௡ ෍ ௫ሺ௜ሻమ ൱
೔సభ
methods, namely regression-based method and
௡ ଶ classification-based method, are proposed and tested on the
Square of mean of rooted ଵ real data and their results are discussed. Common top-ranked
absolute amplitude ‫݌‬ସ ൌ ൭௡ ෍ ඥȁ‫ݔ‬ሺ݅ሻȁ൱
௜ୀଵ pogo pins were identified by both methods, which indicate
Peak value ‫݌‬ହ ൌ ݉ܽ‫ݔ‬ȁ‫ݔ‬ሺ݅ሻȁ
high possibility of the pins’ degradation. Further verification
of the detected pogo pins with our industrial partner on their
σ௡௜ୀଵሺ‫ݔ‬ሺ݅ሻ െ ‫݌‬ଵ ሻଷ degrees of degradation will be in the future work.
Skewness coeƥcient ‫ ଺݌‬ൌ
ሺ݊ െ ͳሻ‫݌‬ଶଷ
REFERENCES
σ௡௜ୀଵሺ‫ݔ‬ሺ݅ሻ െ ‫݌‬ଵ ሻସ
Kurtosis coeƥcient ‫ ଻݌‬ൌ
ሺ݊ െ ͳሻ‫݌‬ଶସ
‫݌‬ହ [1] T.Morrow. "Big Data Comes to Semiconductor Test,"
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‫݌‬ହ comes-to-semiconductor-test.php , 24 April 2013.
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‫݌‬ସ [2] B. B. Shott. "Treatment of Semiconductor Assembly and Test
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TABLE V:TOP 10 POGO PINS BY CLASSIFICATION-BASED METHOD [4] Teradyne-Leading Supplier of Automatic Test Equipment:
http://www.teradyne.com.
Rank Pin Name Rank Pin Name
[5] STDF - Engineering Technology & Industrial Distribution,
1 'P0_an3_OFFSET' 6 'P0_an6_OFFSET' http://etidweb.tamu.edu/cdrom0/image/stdf/spec.pdf
[6] Katharine Lynn Gray, Comparisn of Trend Detection Methods, PhD
2 'Pl1' 7 'P0_an13_OFFSET'
Thesis, University of Montana, USA, 2007.
3 'P0_an2_OFFSET' 8 'P0_an15' [7] Melek, W.W.; Lu, Z.; Kapps, A; Fraser, W.D., "Comparison of trend
detection algorithms in the analysis of physiological time-series data,"
4 'P0_an4_OFFSET' 9 'P0_an13_GAIN'
Biomedical Engineering, IEEE Transactions on , vol.52, no.4,
5 'P1_an7_OFFSET' 10 'V0' pp.639,651, April 2005
[8] Anil Jaina, Karthik Nandakumara, Arun Rossb, “Score normalization
D. Results Discussion in multimodal biometric systems,” Pattern Recognition, Volume 38,
Issue 12, December 2005, Pages 2270–2285.
In the experiment study for degraded pogo pin detection,
[9] T. Hastie, R. Tibshirani, J. Friedman, The Elements of Statistical
two different data modelling methods were applied: linear Learning: Data Mining, Inference, and Prediction, Springer Series in
regression and classification. From the top 10 pogo pins Statistics, 2001.
shown in Table III and Table V, it is discovered that three [10] Q. Wu, X. Yang, and Q. Zhou, “Pattern Recognition and Its
pogo pins, i.e. ‘P0_an2_OFFSET’, ‘P0_an13_OFFSET’ and Application in Fault Diagnosis of Electromechanical System”,
‘P1_an7_OFFSET’, are the common pins. For the other Journal of Information and Computational Science, vol. 9, no. 8, pp.
2221–2228, 2012.
number of top pogo pins and the number of common pins,
please refer the following Table VI.
TABLE VI: NUMBER OF TOP AND COMMON POGO PINS RANKED BY LINEAR
REGRESSION AND CLASSIFICATION METHOD

Number of top pins 10 30 50 100

Number of common pins 3 8 13 34

Among the lists of top ranked pogo pins (from 10 to 100

top pogo pins) by two data modelling methods, around 30%
of the pogo pins are appeared on both lists, which indicates
there is a discrepancy between both results. However, the
common pogo pins observed by two methods will gain
higher confidence that their contact quality has degraded

350 2015 IEEE 10th Conference on Industrial Electronics and Applications (ICIEA)