PROCIRC 9241

Etch

INTRODUCTION
Procirc 9241 is a highly stable, easy to operate sulphuric/peroxide etch for all stages of PCB production.
Procirc 9241 removes organic and inorganic soils such as fingerprints, light oils and oxides from copper
surfaces. This simple, versatile process consists of a make up component and a replenisher used based
on etch rate.

BENEFITS
• Ease of control.
• Ideal for immersion or spray use.
• Consistent etch rate and finish.

SOLUTION MAKE -UP

It is essential that the tanks to be used for Procirc 9241 are thoroughly cleaned and leached before any
product is introduced.

If in any doubt as to the cleaning procedure please contact PMD Technical Department.

Procirc 9241M 100%

OPERATING DATA

Sulphuric Acid (50%) 200 - 240ml/L

Hydrogen Peroxide (35%) 70 - 110ml/L
Copper 10 - 40g/L
Temperature 20 – 25°C

Agitation Air or mechanical

Time As required
Etch Rate 0.7 – 1.2µm/min
Extraction Required

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EQUIPMENT

Tanks Polypropylene, Polyethylene, stainless steel.

Heaters PTFE immersion heaters with thermostatic control.

MAINTENANCE AND CONTROL

The solution should be analysed regularly and replenished as necessary. (See analysis methods).

When copper reaches 40g/L the solution should be discarded.

Automatic colorimetric replenishment is recommended to maintain etch rate. More information is

available from your PMD representative.

ANALYSIS METHOD
1. Sulphuric acid Concentration

Reagents

1.0N sodium hydroxide (standard volumetric solution)

Methyl orange indicator

Method

1. Pipette a 10.0ml aliquot of the cooled working solution into a 250ml conical flask.
2. Add 100ml DI water.
3. Add 2 – 4 drops methyl orange indicator and titrate to an orange end point with 1.0N sodium
hydroxide.
4. Record titre = t mls.

Calculation

t x 7 = mls/L Sulphuric acid(50%).

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2. Hydrogen Peroxide Concentration

Reagents

0.1N ceric sulphate (standard volumetric solution)

Ferroin indicator

Method

1. Pipette a 2.0 ml aliquot of the cooled working solution into a 250 ml conical flask.
2. Add 100ml DI water.
3. Add 2 drops ferroin indicator and titrate with 0.1N ceric sulphate to a light green end point.
4. Record titre = t mls.

Calculation

t x 2.15 = mls/L hydrogen peroxide (35%)

3. Copper Concentration

Reagents

0.1M EDTA (standard volumetric solution)

Ammonium persulphate
Ammonia solution
PAR indicator

Method

1. Pipette a 2,0ml aliquot of the cooled working solution into a 250ml conical flask.
2. Add 100ml DI water.
3. Add 5g ammonium persulphate and allow to stand for 5 minutes.
4. Add 10ml ammonia solution.
5. Add 2 – 4 drops PAR indicator and titrate to a green end point using 0.1M EDTA.
6. Record titre = t mls.

Calculation

t x 3.18 = g/L copper.

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4. Etch Rate

Method

1. Clean a 10 x 10cm piece of copper laminate and dry.

2. Weigh the laminate to 0.01g and record weight as A gm
3. Etch the panel for 2 mins.
4. Rinse and dry.
5. Reweigh the panel and record weight as B gm

Calculation

(A-B) x 2.8 = Etch rate (µm/min)

NOTES
1. Etch Rate. Etch rate is dependant on the copper, acid and peroxide
concentrations as well as temperature and agitation. Higher
copper and acid concentrations lead to lower etch rates while
temperatures give increased rates.

Recommended etch rates are 0.7- 1.2µm/min.

2. Stabiliser A separate etch stabiliser is available if required.

DISPOSAL
Dispose of in accordance with local authority requirements.

PRODUCT FAMILIES
The following products are referred to in this data sheet.

PRODUCT NAME PRODUCT NUMBER

Procirc 9241 M 927009
Procirc 9241 R 927010

Whilst every endeavour has been made to ensure that the information given in this data sheet is correct, PMD (UK)
Limited gives no warranty, express or implied, relating to the use or performance of this product.

PMD (UK) Ltd

Broad Lane, Coventry, UK, CV5 7AY Page 4 of 4
Tel +44(0)24 7646 6691, Fax +44(0)24 7647 3034 9241-06/15
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