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ED01 Eng

Mr. Dong-Cheol Shin


mr.shin@samsung.com
hi @
 WGW System Overview
 WGW Hardware Overview
 WGW Software Overview
 WGW Redundancy

Samsung Confidential Information. Official Commitment will be made in a formal form. Up to  the best of Samsung’s knowledge 2
WGW System Overview
i

Samsung Confidential Information. Official Commitment will be made in a formal form. Up to  the best of Samsung’s knowledge 3
Network configuration
SS7 Network oss

HLR SMC VMS SCP EMS

MAP MAP ISUP WIN

Cicuit Network
IOS4.X
ISUP
BSC MSC G-MSC SNMP,TL1

SS7
IOS4.X SS7 SS7

SG
sigtran
sigtran
ISUP
SIP-T
IOS5.0 WSS G-WSS
IP-BSC
IP BSC PSTN
Megaco Megaco

Bearer over IP
Signaling over IP WGW GWGW
Bearer over TDM
SS7

Samsung Confidential Information. Official Commitment will be made in a formal form. Up to  the best of Samsung’s knowledge 4
WGW System Architecture

Universal media gateway Platform
 TGW (Trunk GW) for wireline
 WGW (Wireless GW) for 3G mobile
 IMS‐MGW for IMS solution
Smooth migration toward All‐IP
 supports IP‐IP transcoding
Hybrid switching platform (TDM+Packet)
 TDM‐TDM switching supported
Advanced voice processing
 Flexible DSP Pool 
Fl ibl DSP P l
G.711, G.723.1, G.726, G.729A/B  MMG-300STM
(WGW)
EVRC, Q.CELP 13K, SMV, AMR

Samsung Confidential Information. Official Commitment will be made in a formal form. Up to  the best of Samsung’s knowledge 5
Performance & Capacity
• Performance
Performance Parameter Description
Maximum Call Processing Performance 1 M BHCA
Packet Processing Performance 24 k channel * 126.4 kbps = More than 3.034 Gbps
(Based on G.711 20 ms sampling)
More than 2.4 Mpps

• Capacity
Capacity Parameter Description
Maximum OC-3/STM-1 Mounting 24 OC-3/STM-1 ports(1:1 redundancy)
Capacity - 48 K DS0(1 + 1 APS configuration)
Maximum E1/T1 Mounting Capacity 832 E1 ports, 960 T1 ports(1 Rack/MGCR)
- 25 K DS0 with E1
E1, 23 K DS0 with T1(1 Rack)
Announcement Capacity 98 types
Maximum Announcement Recording 4,096 seconds
Duration
Voice Conference Call Three-party or Six-party call: 108 group
TDM Switching Capacity 256 K * 256 K DS0
Packet Traffic Capacity 4 Gbps

Samsung Confidential Information. Official Commitment will be made in a formal form. Up to  the best of Samsung’s knowledge 6
WGW Features (1/2)
• Carrier‐Class Design
– System Reliability
System Reliability
• Network Equipment Building Systems(NEBS) Level 3 compliance
• Five 9’s(99.999%) availability
( ) y
– Redundancy
• 1:1 or N:1 redundancy in the all system configuration unit
• Redundancy in Time Division Multiplexing(TDM) and packet 
interface
• The unit can be replaced while the system is operating using a hot 
The unit can be replaced while the system is operating using a hot
swappable card
– High Capacity Design
• IP interface capacity of 4 Gbps
• High capacity of TDM switch of 256 × 256 K DS0
• High capacity of packet switch of 48
Hi h i f k i h f 48 Gbps
Gb

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WGW Features (2/2)
• Scalability
– Partial Expansion of Only Required Elements
p y q
– Flexible capacity expansion
– Multi‐Shelf Structure

DSP
IP I/F
DSP
DTMF
TDM I/F
Packet DTMF TDM TDM I/F
IP I/F Packet Echo Canceller TDM TDM I/F
Echo
E h C Canceller
ll
Trunk Test
IP I/ Trunk Test
Transcoding TDM I/F

• Flexibility 
– Support to Various Service Scenario
• TDM‐to‐TDM, TDM‐to‐Packet, Packet‐to‐Packet
– Support to Wire/Wireless Voice Codec
– Support to Various Interfaces (TDM & IP interface)
Support to Various Interfaces (TDM & IP interface)

Samsung Confidential Information. Official Commitment will be made in a formal form. Up to  the best of Samsung’s knowledge 8
Media Processing Features
Function Description
• Packetization, Transcoding.
Bearer call processing • TDM interoperation: Supports channelized STM‐1 and E1/T1.
• IP interoperation: RTP processing.
p p g
• Makes an announcement stored in flash memory.
Announcement
• Downloading or deleting an announcement is available during operation.
Tone • DSP generates a tone.
COT function
COT function • Provides the Continuity Check Tone service.
Provides the Continuity Check Tone service
CMX function • Provides the conference call function.
• Manages the ARP.
IP routing • Performs port binding and static routing.
• Processes IPv4 forwarding
Processes IPv4 forwarding
Loopback during call • Provides the loopback function during call for each subscriber.
TrFO • Transcoder Free Operation function is provided without passing through the DSP.
• Jitter buffer modes: fixed and adaptive
Jitter buffer
Jitter buffer
• Jitter buffer size: different depending on the codec. It can be adjusted in units of 5ms.
• Complies with the ITU Rec. G.164, G.165, and G.168 (2000). 
Echo canceller • Enables/disables the Echo canceller.
• Echo canceller tail size: 8, 16, 24, 32, 64, or 128 ms.
VAD & PLC • Enables/disables Voice Activity Detection and Packet Loss Concealment.
DTMF • Detects and sends Dual Tone Multi‐Frequency (DTMF) signals.
• Wireline codecs: G.711, G.726, G.729A, and G.723.1
Codecs
• Wireless codecs: EVRC, and  QCELP 13k, GSM, AMR
RFC 2833 • Sends and receives digit information for the named telephony events of RFC2833.

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WGW Hardware Overview
d i

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Physical Specification
600 mm

Equipment cabinet dimensions
• 600mm x 800mm x 2000mm (W x D x H)
( ) PDP U
Unit
it

FAN
Weight Blank

• 142.2 Kg/Rack
g/
• 284.4 Kg/System
Power & Fans
• PDP (Power Supply Unit, 4U) 2,000 mm
(with Feet)
• Dual inlet DC : ‐48V (‐40.5 ~ ‐57.0)
Air Baffle
• Load Sharing/Hot Swap support
• FAN (1.5U)
• 2‐Tray, 3‐Unit /Tray, 2‐Fan / Unit
Environmental
• Operating Temp. : 5 ~ 40°C
• Humidity : 5 ~ 85%

800 mm

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Rack Configuration
MGSR: Media Gateway SMS Rack (SMS + SMS)
MGCR: Media Gateway Combination Rack (SMS + IES)

PDP Unit
PDP Unit PDP Unit

FAN

4U Units
FAN

Blank(17U) 4U Units 4U Units

10U Units 10U

4U Units 4U Units

Air Baffle(3U) Air Baffle Air Baffle

Upper FAN(1.5U)

Units(4U) 4U Units 4U Units

10U Units 10U Units


Units(10U)

Lower FAN(1.5U)

MGSR MGCR
Single Shelf Configuration
M lti Sh
Multi Shelf
lf C
Configuration
fi ti

Samsung Confidential Information. Official Commitment will be made in a formal form. Up to  the best of Samsung’s knowledge 12
Cooling Architecture
• Air flows
– System
System wide cooling system 
wide cooling system
– Inhalation from front panel or bottom 
of the rack
– Exhalation toward back and ceiling side
E h l ti t d b k d ili id
– Filtering inhaling dust using bottom side 
fan and filter for each shelf

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Power Distribution 
Power Distribution Pannel
Pannel (PDP‐
(PDP‐402)

Circuit Breaker
Name Capacity Description

SH0 100 A Power supply to/cut-off from lower shelf

SH1 100 A Power supply to/cut-off from upper shelf

FAN0 10 A Power supply to/cut-off from the fan under the


shelf

FAN1 10 A Power supply to/cut-off from the fan over the


shelf

CLK0 5A Power supply to/cut-off from lower shelf clock


board

CLK1 5A Power supply to/cut-off from upper shelf clock


board

LED Status Description


 Green LED Circuit Breaker ON, Power supply
 Led turns off. Circuit Breaker OFF, Power cut-off and
power failure

Fuse Indicator
LED Status Description
 Green LED Power entrance(both A and B sides)
 LED turns off Disconnection of Fuse

Samsung Confidential Information. Official Commitment will be made in a formal form. Up to  the best of Samsung’s knowledge 14
SMS Specification

System Main Shelf (SMS)
‐ Main multifunction shelf
‐ System Controller, Call Processor, Clock,  754.80 mm
TDM Switch (17U)

‐ Packet Interface Card
‐ TDM Interface Card
557.4 mm
‐ Vocoder, Media Service Module 482.6 mm(19”)

Shelf architecture:  Fan tray

k l / d l
Backplane/Mid‐plane Unit(4U)

Shelf width: 19"
Number of slots in a  SMBB-2
shelf: 14 slots
shelf: 14 slots
Unit(10U) Reinforce
Slot width: 30 mm
Two shelves/rack DCRA-2

Fan tray
Cable tray Air Filter
Rear
Front

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Slot Numbers for SMS

19”
19

1.5U FAN/Cable Duct

14 15 16 17 18 19 20 21 22 23 24 25 2627 19181716 151413121110 090807 0605040302 0100


4U

17
U
10 00 01 02 03 04 05 06 07 08 09 10 11 1213
U

1.5U FAN/Cable Duct

- Numbering scheme for front side - - Numbering scheme for rear side -

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SMS Configuration

 TDM Switch in center pposition


 Free slot for TDM interface
cards : STM-1/OC-3, E1/T1
E EE EE E T TT TT TT T
T TT TT T G GS SS SS S
1 1 1 1 1 1 SS1 1 1 1 1 1
A AA AA A AAA AA AA A

754.80mm VVVVVV
(17u) SSI I PPSS  SCMA in center position
PPPPPP
CCSS EECC
PPPPPP  SCGA in leftmost position
GGHH GG MM
AAAAAA (front-view)
AASA AAAA
-6 -6 -6 -6 -6 -6  Free slot for call control, packet
interface and DSPs

557.4mm

482.6mm
482 6mm
(19”)

Samsung Confidential Information. Official Commitment will be made in a formal form. Up to  the best of Samsung’s knowledge 17
Board Description
Unit Type Redundancy Name and Function
SCMA-T 10U 1:1 System Main Shelf (SMS) Control and Management Board Assembly
- System and SMS Shelf OAM function
- Operation management interface (EMS interface)
- Clock distribution in the SMS Shelf, Packet Switch
ISHA 10U 1:1 IP Signaling Handler Board Assembly
- Megaco processing
- Internal Call processing
processing, Resource manager
VPPA-6 10U N:1 Voice Processing Pool Board Assembly
(Max N=5) - Service (Tone, Announcement, N-way calling, Echo Canceller)
- DTMF Tone Detection & Generation
PEGA 10U 11
1:1 Packet
P k t Engine
E i with ith GE switch
it h iinterface
t f b
board
dAAssembly
bl
- Packet bearer interface
- Call Control (Megaco) interface (MGC interface)
- GE via single/multi mode fiber
TGSA 4U 1:1 TDM & GE Switch Board Assembly
- 256k DS0 x 256k DS0 non-blocking TDM switching
SCGA 10U 1:1 System Clock Generation Board Assembly
- Stratum 2/ 3 Clock, - Clock distribution in the system
TS1A 4U 1:1 TDM OC3/STM-1 Interface Board Assembly
(1+1 APS) - Four channelized OC3/STM-1 connection via single/ multi-mode fiber
ET1A-T4 4U N:1 E1/T1 Interface Board Assembly-TDM I/F
(Max N=5) - Two 16 E1/T1 TDM connection via champ type connector
CSHA-4 4U N/A Channel Signaling Handler board Assembly
- IWF interworking (Frame Relay, PRI)
- M2UA
Samsung Confidential Information. Official Commitment will be made in a formal form. Up to  the best of Samsung’s knowledge 18
Board Configuration
340 mm PBA
27

Slim Ejector
2A

Face
411.15 mm Plate Connector
442 mm (10U)

Lever for
Detecting Unit
M
Mounting/
ti /
Dismounting

340 mm

144.45 mm 175.3 mm
(4U)

144.45 mm
175.3 mm (4U)

100 mm

Front Unit Rear Unit


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Smooth migration to All
Smooth migration to All‐‐IP
• Smooth migration from pure TDM to All‐IP network
– Pure TDM switching for initial deploy (1:1 Replacement of legacy MSC)
– TDM‐IP switching with additional DSP pools
– All‐IP based transcoding without TDM intarfces
ET1A
ET1A
ET1A
ET1A
ET1A
ET1A TDM I/F
TDM I/F VPPA
TDM I/F SCMA PEGA
TGSA CODEC
VPPA
TDM I/F
TDM I/F CODEC
VPPA
TS1A TDM I/F ANM Paket
TDM NPU
Switch CODEC Switch
TS1A ANM
CMX
Pkt I/F
ANM
CMX

CMX
TDM I/F

TDM I/F TDM IP


 
TDM IP IP

TDM TDM IP N/W
Legacy N/W

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WGW Software Overview
f i

Samsung Confidential Information. Official Commitment will be made in a formal form. Up to  the best of Samsung’s knowledge 21
Software Architecture

WGW Software

Call Control Subsystem
y OAM&P Subsystem
y Network Subsystem
y
Media R

Board C

Configu

Fault Mgmt

Diagnosstic

Redund

Statisticc

UI and EEMS

Packer H
Call Con

MeG
GaCo/H.248

uration Mgm

dancy Contrrol
Control
ntrol

Resource M

Handling
Mgmt

mt

Samsung Confidential Information. Official Commitment will be made in a formal form. Up to  the best of Samsung’s knowledge 22
Call Processing System

Module Full Name and Function
CPMB Call Processing Management Block
‐ Megaco processing and bearer call processing control in WGW. 
MRMB MGW Resource Management Block
‐ Megaco resources and board level resources management 
(including DSP, TDM links, RTP ports)
MEGACO H.248 Stack processing
H.248 Stack processing
‐ Megaco message Encoding/Decoding
‐ Transaction Id management
Board Call 
Board Call ‐ Block to process calls uploaded to each board
Block to process calls uploaded to each board
processing ‐ The main call processing block sets up a call in each hardware chip 
of a board by exchanging messages with CPMB.

Samsung Confidential Information. Official Commitment will be made in a formal form. Up to  the best of Samsung’s knowledge 23
OAM Subsystem
Module Full Name and Function
g
Loading and  ‐ Load OS, application image by board
, pp g y
Configuration ‐ Manages the WGW configuration in DB, and add/delete 
configuration
Fault and Status
Fault and Status ‐ Collects an alarm by each board and manages the  board status
Collects an alarm by each board and manages the board status
‐ Manages the CPU/memory/process resources by board
‐ Reports and controls overload, if it occurs
Diagnosis and ‐ Device/IPC/path diagnosis by board
Device/IPC/path diagnosis by board
Test ‐ Automatic/manual diagnosis
Redundancy ‐ Manages the status of redundancy board
‐ Data synchronization
D h i i
Statistics  ‐ Collects various statistics (system load/protocol/resource/IPC/traffic)
UI and EMS
UI and EMS ‐ EMS interworking and CLI function
EMS interworking and CLI function

Samsung Confidential Information. Official Commitment will be made in a formal form. Up to  the best of Samsung’s knowledge 24
WGW Redundancy
d d

Samsung Confidential Information. Official Commitment will be made in a formal form. Up to  the best of Samsung’s knowledge 25
Board Redundancy
Board Redundancy
System Control Processor
System Control Processor‐1:1
1:1 (Active/Standby)
(Active/Standby)
S
SCMA‐T Ethernet Switch‐Dual Active
TGSA 1:1 (Active/Standby)

SCGA 1:1 (Active/Standby)
/

ISHA 1:1 (Active/Standby)

PEGA 1:1 (Active/Standby)

VPPA N:1 (Active/Standby)

SSPA 1+1 Load Share

TS1A 1+1 (APS Protection)

ET1A‐T4 N:1 (Active/Standby)

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Vocoder Redundancy
• N:1 Redundancy for DSP Module
– Protection Board backups all traffic information 
 Vocoder setup time is reduced for switchover 
– Reduced failover time and failure rate

N
Normal
lOOperation
ti S it h Over
Switch O R
Revertible
tibl Switch
S it h Over
O
Working Working Protection
Active Active Standby AF A S A F A A AS

VPPA0 VPPA1 ● ● ● VPPAn


X
VPPA0 VPPA1 ● ● ● VPPAn VPPA0 VPPA1 ● ● ● VPPAn

Backup
T k over
Take R
Revert
t

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STM‐‐1 Redundancy
STM
Transmitter
Active port 1 FDF STM1
Send
Port1 0
TGSA TS1A Receive
(TDM switch) (STM-1)
Active • Port1 1


VPPA •
(DSP Pool)

TGSA TS1A Send


(TDM switch) (STM-1)
• Port2 0
Standby Receive


• Port2 1
VPPA : N:1 Redundancy
TGSA : Act/Stb Redundancy Standby port 1
y
TS1A : Act/Stb Redundancy

 APS
APS redundancy for STM‐1 Optic Line
redundancy for STM 1 Optic Line
• Protection Type : 1+1 APS
• Non‐Revertive Mode

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Network Clock Redundancy
DOTS
TIP/RING_1 TIP/RING_2

DCRA-2

Trunk
Trunk 복구 Clock
Recovery Clock TIP/RING_1
TIP/RING_2  ITU‐T G.812 Standard
 Stratum‐2 level
 Clock fail : hold‐over mode 
외부 DOTS
External Clock
DOTS Clock
SCGA SCGA
 2 types external clock input
– DOTS/BITS 2 line (HDB3 
DOTS/BITS 2 li (HDB3
10U Slot Framed all ‘1’ signal) 
SCMA – trunk recovery clock 
8KHz 4 line
8KHz 4 line
4U Slot
VPPA  1:1 unit redundancy
TGSA

ISHA TS1A

•••

PEGA TS1A

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Fan Redundancy
Fan Cover(Front)
Fan Control Board
Fan Module

Fan Tray

Power Switch Fan Cover(Rear)

F Tray(Top)
Fan T (T )

Fan Tray(Bottom)

 Top and Bottom fan tray for each shelf
Top and Bottom fan tray for each shelf
 3 fan units in each fan tray
 2 fans in each fan unit
 Each fan can be operated independently
Each fan can be operated independently
 In case of single fan failure, RPM of fan is controlled with higher speed

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Thank You!

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