Sie sind auf Seite 1von 15

To all our customers

Regarding the change of names mentioned in the document, such as Hitachi


Electric and Hitachi XX, to Renesas Technology Corp.

The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)
Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand
names are mentioned in the document, these names have in fact all been changed to Renesas
Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and
corporate statement, no changes whatsoever have been made to the contents of the document, and
these changes do not constitute any alteration to the contents of the document itself.

Renesas Technology Home Page: http://www.renesas.com

Renesas Technology Corp.


Customer Support Dept.
April 1, 2003
Cautions
Keep safety first in your circuit designs!
1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better
and more reliable, but there is always the possibility that trouble may occur with them. Trouble with
semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or
(iii) prevention against any malfunction or mishap.

Notes regarding these materials


1. These materials are intended as a reference to assist our customers in the selection of the Renesas
Technology Corporation product best suited to the customer's application; they do not convey any
license under any intellectual property rights, or any other rights, belonging to Renesas Technology
Corporation or a third party.
2. Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any
third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or
circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and
algorithms represents information on products at the time of publication of these materials, and are
subject to change by Renesas Technology Corporation without notice due to product improvements or
other reasons. It is therefore recommended that customers contact Renesas Technology Corporation
or an authorized Renesas Technology Corporation product distributor for the latest product information
before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss
rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corporation by various
means, including the Renesas Technology Corporation Semiconductor home page
(http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams,
charts, programs, and algorithms, please be sure to evaluate all information as a total system before
making a final decision on the applicability of the information and products. Renesas Technology
Corporation assumes no responsibility for any damage, liability or other loss resulting from the
information contained herein.
5. Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device
or system that is used under circumstances in which human life is potentially at stake. Please contact
Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor
when considering the use of a product contained herein for any specific purposes, such as apparatus or
systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
6. The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in
whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be
exported under a license from the Japanese government and cannot be imported into a country other
than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the
country of destination is prohibited.
8. Please contact Renesas Technology Corporation for further details on these materials or the products
contained therein.
HA17558 Serise
Dual Operational Amplifier

ADE-204-042 (Z)
Rev. 0
Dec. 2000

Description

HA17558 is dual operational amplifiers which provides internal frequency compensation and high
performance. It can be applied widely to measuring control equipment and to general Use. The two
amplifiers share a common bias network and power supply leads.

Features

• High voltage Gain: 104dB (Typ)


• High speed: 1V/µs
• Continuous short-circuit protection
• Low-noise operational amplifiers
• Internal frequency compensation

Ordering Information
Type No. Application Package
HA17558FP Industrial use FP-8D
HA17558F Commercial use FP-8D
HA17558 Commercial use DP-8
HA17558PS Industrial use DP-8
HA17558 Serise

Pin Arrangement

Vout1 1 8 VCC
1
– +
Vin(–)1 2 7 Vout2
2
+ –
Vin(+)1 3 6 Vin(–)2

VEE 4 5 Vin(+)2

(Top View)

Circuit Schematic (1/2)

VCC

Vin(+)

Vin(–)

Vout

to VCC

VEE

2
HA17558 Serise

Absolute Maximum Ratings (Ta = 25°C)


Ratings
HA17558 HA17558 HA17558 HA17558
Item Symbol PS F FP Unit
Supply voltage VCC +18 +18 +18 +18 V
VEE –18 –18 –18 –18 V
Differential input voltage VIN (diff) ±30 ±30 ±30 ±30 V
Common-mode input voltage VCM* 3
±15 ±15 ±15 ±15 V
1 1 2 2
Power dissipation PT 670* 670* 385* 385* mW
Operating temperature Topr –20 to –20 to –20 to –20 to –20 to
+75 +75 +75 +75 +75
Storage temperature Tstg –55 to –55 to –55 to –55 to °C
+125 +125 +125 +125
Notes: 1. These are the allowable values up to Ta = 45 °C. Derate by 8.3mW/°C above that temperature.
2. These are the allowable values up to Ta = 31 °C mounting on 30% wiring density glass epoxy
board. Derate by 7.14mW/°C above that temperature.
3. If the supply voltage is less than ±15V, input voltage should be less than supply voltage.

Electrical Characteristics (Ta = 25°C, VCC = +15V, VEE = –15V)


Item Symbol Min Typ Max Unit Test conditions
Input offset voltage VIO — 0.5 6 mV RS ≤ 10kΩ
Input offset current I IO — 5 200 nA
Input bias current I IB — 50 500 nA
Voltage gain AVD 86 104 — dB RL ≥ 2kΩ, VO = ±10V
Maximum output voltage Vop-p ±12 ±14 — V RL ≥ 10kΩ
Maximum output voltage Vop-p ±10 ±12.4 — V RL ≥ 2kΩ
Common mode input voltage VCM ±12 ±14 — V
range
Common mode rejection ratio CMR 70 100 — dB RS ≤ 10kΩ
Supply voltage rejection ratio PSRR — 10 150 µV/V RS ≤ 10kΩ
Power dissipation Pd — 90 170 mW 2-channel, No load
Slew rate SR — 1.0 — V/µs AVD = 1
Equivalent input noise voltage VNI — 6 — µVp-p RS = 1kΩ, f = 1HZ to 1kHZ
Channel separation CS — 105 — dB f = 1kHz

3
HA17558 Serise

Characteristic Curves

Open Loop Voltage Gain vs. Frequency Maximum Output Voltage vs. Frequency
Open Loop Voltage Gain AV(OL) (dB)

Maximum Output Voltage VOP-P (V)


120 36
VCC = 15 V VCC = 15 V
32
100 VEE = –15 V VEE = –15 V
RL = 2 kΩ 28 RL = 2 kΩ
80 24
20
60
16
40 12
8
20
4
0 0
1 10 100 1 k 10 k 100 k 1 M 10 M 100 1k 10 k 100 k 1M
Frequency f (Hz) Frequency f (Hz)

Power Supply Rejection Ratio Voltage Gain vs. Ambient Temperature


vs. Ambient Temperature
Power Supply Rejection Ratio PSRR (dB)

120 130
VCC = 15 V VCC = 15 V
VEE = –15 V VEE = –15 V
110 120
Voltage Gain AVD (dB)

100 110

90 100

80 90

70 80
–20 0 20 40 60 80 –20 0 20 40 60 80
Ambient Temperature Ta (°C) Ambient Temperature Ta (°C)

4
HA17558 Serise

Power Supply Rejection Ratio vs. Frequency

120

Power Supply Rejection Ratio PSRR (dB)


VCC = 15 V
VEE = –15 V
100

80

60

40

20

0
100 300 1k 3k 10 k 30 k 100 k 300 k 1M
Frequency f (Hz)

Common-mode Rejection Ratio vs. Frequency

120
Common–mode Rejection Ratio CMR (dB)

VCC = 15 V
VEE = –15 V
100 Ta = 25°C
RL = ∞

80

60

40

20

0
100 300 1k 3k 10 k 30 k 100 k 300 k 1M
Frequency f (Hz)

5
HA17558 Serise

Maximum Output Voltage


Transient Response vs. Ambient Temperature
10 40

Maximum Output Voltage VOP-P (VP-P)


VCC = 15 V VCC = 15 V
VEE = –15 V VEE = –15 V
Output Voltage VO (V)

RL = 2 kΩ
5 32

0 24

–5 16

–10 8
0 10 20 30 40
Time t (µs)
0
–20 0 20 40 60 80
Ambient Temperature Ta (°C)

Power Dissipation vs. Ambient Temperature Maximum Output Voltage vs. Load Resistance

100 30
Maximum Output Voltage VOP-P (VP-P)

VCC = 15 V
VEE = –15 V
Power Dissipation Pd (mW)

90 RL = ∞ 25

VCC = 15 V
80 20 VEE = –15 V
f = 1 kHz

70 15

10
60

5
50 100 200 500 1k 2k 5k 10 k
–20 0 20 40 60 80
Load Resistance RL (Ω)
Ambient Temperature Ta (°C)

6
HA17558 Serise

Common-mode Input Voltage vs.


Supply Current vs. Supply Voltage
Supply Voltage
5 20
RL = ∞

Common-mode Input Voltage VCM (V)


Supply Current ICC (mA)

4
10

0
2

1 –10

0
±4 ±6 ±9 ±12 ±15 ±18
–20
Supply Voltage VCC, VEE (V) ±4 ±8 ±12 ±16 ±18
Supply Voltage VCC, VEE (V)

Input Bias Current vs. Ambient Temperature


100
VCC = 15 V Slew Rate vs. Supply Voltage
VEE = –15 V 1.2
Input Bias Current IIB (nA)

80
Slew Rate SR (V/µs)

1.0
60

0.8
f = 1 kHz
40
RL = 2 kΩ
0.6 CL = 100 pF
20 Ta = 25°C
AV = 1
0.4
±4 ±6 ±9 ±12 ±15 ±18
0
–20 0 20 40 60 80 Supply Voltage VCC, VEE (V)
Ambient Temperature Ta (°C)

7
HA17558 Serise

Input Offset Current vs. Ambient Temperature


40 Input Offset Voltage vs. Supply Voltage
VCC = 15 V
VEE = –15 V 4
Input Offset Current IIO (nA)

Input Offset Voltage VIO (mV)


20

2
0

0
–20

–2
–40

–4
–4 –6 –9 –12 –15 –18
–20 0 20 40 60 80
Supply Voltage VCC, VEE (V)
Ambient Temperature Ta (°C)

Slew Rate vs. Ambient Temperature


Voltage Gain vs. Supply Voltage 1.4
120 VCC = 15 V
VEE = –15 V
1.2 RL = 2 kΩ
Voltage Gain AVD (dB)

Slew Rate SR (V/µs)

100 CL = 100 pF
f = 10 Hz AV = 1
1.0
RL = 2 kΩ
80
0.8
60
0.6

40
–4 –6 –9 –12 –15 –18 0.4
Supply Voltage VCC, VEE (V) –20 0 20 40 60 80
Ambient Temperature Ta (°C)

8
HA17558 Serise

Output Short Current vs. Ambient Temperature


60
VCC = 15 V

Output Short Current IOS (mA)


VEE = –15 V
50

Sink
40

30
Source

20

10
–20 0 20 40 60 80
Ambient Temperature Ta (°C)

Input Noise Voltage vs. Frequency


100
RS = 100 Ω
Hz)
Input Noise Voltage VNI (nV/√

30

10

1
10 30 100 300 1k 3k 10 k
Frequency f (Hz)

9
HA17558 Serise

Common-mode Rejection Ratio


Input Offset Voltage vs. Ambient Temperature vs. Ambient Temperature

Common-mode Rejection Ratio CMR (dB)


140
VCC = 15 V VCC = 15 V
4 VEE = –15 V VEE = –15 V
Input Offset Voltage VIO (mA)

120
2
100
0
80
–2
60
–4
40
–20 0 20 40 60 80 –20 0 20 40 60 80
Ambient Temperature Ta (°C) Ambient Temperature Ta (°C)

10
HA17558 Serise

Circuit Example

RIAA Pre-amplifier
+15 V
0.0022 µF 0.01 µF

+
100 µF

36 kΩ 390 kΩ

– 33 µF
Otuput
Input 2.2 kΩ 33 µF HA17558
+

+ 10 kΩ
47 µF

56 kΩ
1 kΩ –
100 µF
+
–15 V

T.H.D. vs. Output Voltage (RIAA Pre-Amp) T.H.D. vs. Output Voltage (RIAA Pre–Amp)
1.0 60
VCC = 15 V
VEE = –15 V
0.3 50
Voltage Gain AVD (dB)

0.1 40
20 kHz
T.H.D (%)

0.03 30

10 kHz
0.01 20
1 kHz

0.003 10
20 kHz

0.001 0
0.01 0.03 0.1 0.3 1.0 3 10 10 30 100 300 1k 3k 10 k 30 k 100 k
Output Voltage (Vrms) Frequency f (Vrms)

11
HA17558 Serise

Package Dimensions

Unit: mm

9.6
10.6 Max
8 5

7.4 Max
6.3
1 4
0.89 1.3

1.27 Max 2.54 Min 5.06 Max 7.62


0.1 Min

+ 0.10
0.25 – 0.05

2.54 ± 0.25 0.48 ± 0.10 0° – 15°

Hitachi Code DP-8


JEDEC Conforms
EIAJ Conforms
Mass (reference value) 0.54 g

Unit: mm

4.85
5.25 Max
8 5
4.4

1 4
*0.22 ± 0.05
0.20 ± 0.04
2.03 Max

6.50 +– 0.15
0.25
0.75 Max
1.05

0° – 8°
0.10 ± 0.10

1.27 0.60 +– 0.18


0.25

*0.42 ± 0.08
0.40 ± 0.06
0.15

0.12 M
Hitachi Code FP-8D
JEDEC —
*Dimension including the plating thickness EIAJ Conforms
Base material dimension Mass (reference value) 0.10 g

12
HA17558 Serise

Cautions

1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.

Hitachi, Ltd.
Semiconductor & Integrated Circuits.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URL NorthAmerica : http://semiconductor.hitachi.com/
Europe : http://www.hitachi-eu.com/hel/ecg
Asia : http://sicapac.hitachi-asia.com
Japan : http://www.hitachi.co.jp/Sicd/indx.htm
For further information write to:
Hitachi Semiconductor Hitachi Europe GmbH Hitachi Asia Ltd. Hitachi Asia (Hong Kong) Ltd.
(America) Inc. Electronic Components Group Hitachi Tower Group III (Electronic Components)
179 East Tasman Drive, Dornacher Straβe 3 16 Collyer Quay #20-00, 7/F., North Tower,
San Jose,CA 95134 D-85622 Feldkirchen, Munich Singapore 049318 World Finance Centre,
Tel: <1> (408) 433-1990 Germany Tel : <65>-538-6533/538-8577 Harbour City, Canton Road
Fax: <1>(408) 433-0223 Tel: <49> (89) 9 9180-0 Fax : <65>-538-6933/538-3877 Tsim Sha Tsui, Kowloon,
Fax: <49> (89) 9 29 30 00 URL : http://www.hitachi.com.sg Hong Kong
Tel : <852>-(2)-735-9218
Hitachi Europe Ltd. Hitachi Asia Ltd.
Electronic Components Group. Fax : <852>-(2)-730-0281
(Taipei Branch Office) URL : http://www.hitachi.com.hk
Whitebrook Park 4/F, No. 167, Tun Hwa North Road,
Lower Cookham Road Hung-Kuo Building,
Maidenhead Taipei (105), Taiwan
Berkshire SL6 8YA, United Kingdom Tel : <886>-(2)-2718-3666
Tel: <44> (1628) 585000 Fax : <886>-(2)-2718-8180
Fax: <44> (1628) 585160 Telex : 23222 HAS-TP
URL : http://www.hitachi.com.tw
Copyright  Hitachi, Ltd., 2000. All rights reserved. Printed in Japan.
Colophon 2.0

13

Das könnte Ihnen auch gefallen