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Vishay Semiconductors
High Speed Optocoupler, 1 MBd,
Photodiode with Transistor Output
FEATURES
• Isolation test voltages: 5300 VRMS
• TTL compatible
• High bit rates: 1 Mbit/s
NC 1 8 C (VCC)
• High common-mode interference immunity
A 2 7 B (VB)
• Bandwidth 2 MHz
C 3 6 C (VO)
• Open-collector output
NC 4 5 E (GND)
• External base wiring possible
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
AGENCY APPROVALS
• UL1577 file no. E52744, double protection
• DIN EN 60747-5-5 (VDE0884-5) available with option 1
DESCRIPTION
• cUL components acceptance service no. 5A
The 6N135 and 6N136 are optocouplers with a GaAIAs
• CQC GB8898-2011, GB4943.1-2011
infrared emitting diode, optically coupled with an integrated
photo detector which consists of a photo diode and a
high-speed transistor in a DIP-8 plastic package.
Signals can be transmitted between two electrically
separated circuits up to frequencies of 2 MHz. The potential
difference between the circuits to be coupled should not
exceed the maximum permissible reference voltages.
ORDERING INFORMATION
DIP-8 Option 6
6 N 1 3 # - X 0 # # T
AND
Option 7 Option 9
REEL
100 25
Tamb = 100 °C IF = 35 mA
IF = 30 mA
IF - Forward Current (mA)
Tamb = -40 °C
1 0
1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 0 5 10 15 20 25
VF - Forward Voltage (V) VO - Output Voltage (V)
Fig. 1 - LED Forward Current vs. Forward Voltage Fig. 4 - Output Current vs. Output Voltage
30 6
at VO = 0.4 V, VCC = 5 V
IF = 20 mA
IO - Output Current (mA) 5
IF - LED Current (mA)
IF = 16 mA
20 4
3 IF = 10 mA
10 2 IF = 5 mA
1 IF = 2 mA
IF = 1 mA
0 0
0 20 40 60 80 100 - 60 - 40 - 20 0 20 40 60 80 100 120
i6n135_04 Tamb - Ambient Temperature (°C) 20987 Tamb - Temperature (°C)
Fig. 2 - Permissible Forward LED Current vs. Temperature Fig. 5 - Output Current vs. Temperature
120 900
tP - Propagation Delay Time (ns)
6N136 at VCC = 5 V
800
100 IF = 16 mA, RL = 1.9 kΩ
700
Total Power (mW)
Detector
80 600 tPLH at 3 V tPLH at 1.5 V
500
60
400
40 300 tPHL at 1.5 V
Emitter 200
20 tPHL at 3 V
100
0 0
0 20 40 60 80 100 - 60 - 40 - 20 0 20 40 60 80 100
i6n135_05 Tamb - Ambient Temperature (°C) i6n135_08 Tamb - Temperature (°C)
Fig. 3 - Permissible Power Dissipation vs. Temperature Fig. 6 - Propagation Delay vs. Ambient Temperature
1400 0.6
tP - Propagation Delay Time (ns)
Transfer Ratio
0.4
800
tPLH 0.3
600
0.2
400
tPHL
0.1
200
0 0
- 60 - 40 - 20 0 20 40 60 80 100 0 5 10 15 20 25
i6n135_09 Tamb - Temperature (°C) i6n135_11 IF - Forward Current (mA)
Fig. 7 - Propagation Delay vs. Ambient Temperature Fig. 9 - Small Signal Current Transfer Ratio vs.
Quiescent Input Current
100
10
IOH - Collector, IC (nA)
VCC = VO = 15 V
1
VCC = VO = 5 V
0.1
0.01
0.001
- 60 - 40 - 20 0 20 40 60 80 100
i6n135_10 Tamb - Temperature (°C)
Pulse generator
IF
Z O = 50 Ω
t r ,t f = 5 ns
duty cycle 10 %
t ≤ 100 µs t
1 8 5V
VO
IF 5V
2 7 RL
IF monitor 1.5 V
3 6 VO VOL
t
4 5
100 Ω
ı CL tPHL tPLH
15 pF
i6n135_01
VCM
10 V 90 % 10 %
IF 1 8 5V
10 % 90 %
2 7 0V
RL t
A
tr tf
B VO
3 6 VO
VFF
4 5 5V
A: IF = 0 mA
t
+VCM Pulse generator VO
Z O = 50 Ω
t r,t f = 8 ns B: IF = 16 mA
VOL
i6n135_02
t
3.10 ± 0.25
9.75 ± 0.15 6.70 ± 0.15
0.95 ± 0.20
3.55 ± 0.20
6.00 ± 0.25
0.70 ± 0.20
1.27 ± 0.10
0.50 ± 0.10
2.54 nom. .10
7° typ. 0.25 ± 0
3 x 2.54 = 7.62
8 7 6 5
1 2 3 4
3.55 ± 0.20
0.1 min.
1.27 ± 0.10
8 7 6 5
1 2 3 4
DIP-8, Option 7
10.05 ± 0.25
10.16 max. 7.62 typ.
9.75 ± 0.15
6.70 ± 0.15
0.95 ± 0.20
3.55 ± 0.20
0.25 ± 0.10
8.00 min.
8.40 min.
0.70 ± 0.20
Recommended Footprint
8 7 6 5
0.76
R0.250
2.54
1 2 3 4
PIN ONE I.D.
1.78
0.25 ± 0.10
3.55 ± 0.20
0.18 ± 0.08
8.00 min.
0.75 ± 0.20
1.27 ± 0.10 Leads coplanarity
2.54 nom. 0.10 max.
3 x 2.54 = 7.62
Recommended Footprint
8 7 6 5
0.76
R0.250
2.54
1 2 3 4
PIN ONE I.D. 1.78
PACKAGE MARKING
6N135 6N136
V YWW 68 V YWW 68
SOLDER PROFILES
300 300
5s
Lead temperature max. 260 °C
250 255 °C
250 240 °C 245 °C
235 °C to
260 °C second full line: typical
wave 217 °C
Temperature (°C)
Temperature (°C)
0 0
0 50 100 150 200 250 0 50 100 150 200 250 300
94 8626 Time (s) 19841 Time (s)
Fig. 14 - Wave Soldering Double Wave Profile According to Fig. 15 - Lead (Pb)-free Reflow Solder Profile According to
J-STD-020 for DIP-8 Devices J-STD-020 for SMD-8 Devices
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