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2. A 1.0 m × 1.5 m double-pane window consists of two 4-mm-thick layers of glass (k = 0.78
W/m·K) that are separated by a 5-mm air gap (kair = 0.025 W/m·K). The heat flow through the
air gap is assumed to be by conduction. The inside and outside air temperatures are 20°C and
220°C, respectively, and the inside and outside heat transfer coefficients are 40 and 20
W/m2·K. Determine (a) the daily rate of heat loss through the window in steady operation
and (b) the temperature difference across the largest thermal resistance.
3. Consider a 1.2-m-high and 2-m-wide glass window whose thickness is 6 mm and thermal
conductivity is k = 0.78 W/m·K. Determine the steady rate of heat transfer through this glass
window and the temperature of its inner surface for a day during which the room is
maintained at 24°C while the temperature of the outdoors is 25°C. Take the convection heat
transfer coefficients on the inner and outer surfaces of the window to be h1 = 10 W/m2·K and
h2 = 25 W/m2·K and disregard any heat transfer by radiation.
4. A 4-m-high and 6-m-wide wall consists of a long 18-cm × 30-cm cross section of horizontal
bricks (k = 0.72 W/m·K) separated by 3-cm-thick plaster layers (k = 0.22 W/m·K). There are
also 2-cm-thick plaster layers on each side of the wall, and a 2-cmthick rigid foam (k = 0.026
W/m·K) on the inner side of the wall. The indoor and the outdoor temperatures are 22°C and
24°C, and the convection heat transfer coefficients on the inner and the outer sides are h1 =
10 W/m2·K and h2 = 20 W/m2·K, respectively. Assuming one-dimensional heat transfer and
disregarding radiation, determine the rate of heat transfer through the wall.
8. A 0.3-cm-thick, 12-cm-high, and 18-cm-long circuit board houses 80 closely spaced logic chips
on one side, each dissipating 0.04 W. The board is impregnated with copper fillings and has
an effective thermal conductivity of 30 W/m·K. All the heat generated in the chips is
conducted across the circuit board and is dissipated from the back side of the board to a
medium at 40°C, with a heat transfer coefficient of 40 W/m2·K. (a) Determine the
temperatures on the two sides of the circuit board. (b) Now a 0.2-cm-thick, 12-cm-high, and
18-cmlong aluminum plate (k = 237 W/m·K) with 864 2-cm-long aluminum pin fins of diameter
0.25 cm is attached to the back side of the circuit board with a 0.02-cm-thick epoxy adhesive
(k = 1.8 W/m·K). Determine the new temperatures on the two sides of the circuit board.