ANSI/ESD STM4.

2-2006
Reaffirmation of ANSI/ESD STM4.2-1998

For the Protection of Electrostatic

Discharge Susceptible Items

ESD Protective Worksurfaces

Charge Dissipation Characteristics

Electrostatic Discharge Association

7900 Turin Road, Bldg. 3
Rome, NY 13440

An American National Standard

Approved July 17, 2006
 ANSI/ESD STM4.2-2006

ESD Association Standard Test Method

for the Protection of Electrostatic Discharge Susceptible Items -

ESD Protective Worksurfaces

Charge Dissipation Characteristics

Approved February 26, 2006

ESD Association

®
 ANSI/ESD STM4.2-2006

ESD Association standards and publications are designed to serve the public interest by
CAUTION eliminating misunderstandings between manufacturers and purchasers, facilitating the
NOTICE interchangeability and improvement of products and assisting the purchaser in selecting
and obtaining the proper product for his particular needs. The existence of such
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by the Association preclude its voluntary use by non-members of the Association whether
the document is to be used either domestically or internationally. Recommended
standards and publications are adopted by the ESD Association in accordance with the
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Interpretation of ESD Association Standards: The interpretation of standards in-so-far as it

may relate to a specific product or manufacturer is a proper matter for the individual
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Limitation on ESDA’s Liability: Neither ESDA, nor its members, officers, employees or
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Published by:

Electrostatic Discharge Association

7900 Turin Road, Bldg. 3
Rome, NY 13440

Copyright © 2006 by ESD Association

All rights reserved

No part of this publication may be reproduced in any form, in

an electronic retrieval system or otherwise, without the prior
written permission of the publisher.

Printed in the United States of America

ISBN: 1-58537-104-1
 ANSI/ESD STM4.2-2006

(This foreword is not part of ESD Association Standard Test Method STM4.2-2006)

Foreword

The test methods outlined in this standard were developed to further characterize the ability of ESD
Control worksurfaces to dissipate static charge from conductive objects placed on them. Although
the resistive properties of worksurfaces give the user a "relative" indication of their ability to dissipate
charge, other factors such as contact resistance between the object and the worksurface,
worksurface hardness and surface finish, and ambient relative humidity also affect their charge
dissipation efficiency.

This standard test method provides for a worksurface test apparatus and conductive charged object
configuration designed to give a better perspective as to the charge dissipation characteristics of
worksurfaces based on the factors mentioned above. It is intended for qualification purposes only
and should only be used in a laboratory environment. Specific environments are required for both
conditioning and testing of samples.

This standard test method was originally designated ESD STM4.2-1998 and was approved on
February 8, 1998. This standard test method is a reaffirmation of ANSI/ESD STM4.2-1998 and was
approved on February 26, 2006. This standard test method was prepared by the 4.0 Worksurfaces
Subcommittee. The 1998 version was prepared by the 4.0 Worksurfaces Subcommittee. At that
time the 4.0 Worksurfaces Subcommittee had the following members:

Dale Parkin, Chair

IBM

Brent Beamer Larry Burich Larry Green

Static Control Components Lockheed-Martin USAF

Tim Jarrett William Klein Ron Schwartz

Guidant Corp. K&S Laboratories Stanley Storage Systems

Shane Wooldridge
Kewaunee Scientific

The following individuals made significant contributions to this document:

Steve Gerken Ron Gibson Ron Johnson Ben Baumgartner

USAF Celestica Intel Lockheed-Martin

Jim Horvat Dave Deigan

USAF AFM Inc.

Capt. Victoria Gerken

USAF

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ANSI/ESD STM4.2-2006

TABLE OF CONTENTS

1.0 PURPOSE AND SCOPE......................................................................................................... 1

1.1 PURPOSE ............................................................................................................................. 1
1.2 SCOPE ................................................................................................................................. 1
2.0 REFERENCE PUBLICATIONS .............................................................................................. 1
3.0 DEFINITIONS.......................................................................................................................... 1
4.0 REQUIRED EQUIPMENT ....................................................................................................... 1
4.1 TEST APPARATUS ................................................................................................................. 1
4.1.1 Disk Assembly.............................................................................................................. 1
4.1.2 Test Sample Support Table ......................................................................................... 2
4.1.3 Disk Raising/Lowering Mechanism (RLM) ................................................................... 2
4.1.4 Control Panel and Contact Timer................................................................................. 2
4.1.5 Test Cabling ................................................................................................................. 2
4.1.6 Disk Suspension Cord ................................................................................................. 2
4.1.7 Apparatus Housing....................................................................................................... 2
4.2 CHARGE PLATE MONITOR ..................................................................................................... 3
4.3 COULOMB METER AND VOLTAGE SOURCE.............................................................................. 3
4.4 OHMMETER .......................................................................................................................... 3
4.5 ENVIRONMENTAL CHAMBER................................................................................................... 3
5.0 TEST SAMPLES ..................................................................................................................... 3
6.0 TEST SAMPLE PREPARATION / CONDITIONING .............................................................. 3
7.0 TEST PROCEDURES ............................................................................................................. 3
7.1 MEASUREMENT OF DISK ASSEMBLY CAPACITANCE ................................................................. 3
7.2 DISK ISOLATION AND SYSTEM VERIFICATION .......................................................................... 4
7.3 SAMPLE TESTING .................................................................................................................. 5
7.3.1 Pretest Preparations .................................................................................................... 5
7.3.2 Charge Dissipation Test............................................................................................... 5
8.0 DATA REPORTING ................................................................................................................ 5
8.1 SAMPLE DATA REPORTING SHEET ......................................................................................... 6
8.2 DATA REPORTING SHEET ...................................................................................................... 7

FIGURES
Figure 1: Charge Dissipation Test Apparatus ................................................................................ 8
Figure 2: Disk Assembly................................................................................................................. 9
Figure 3: Charge Plate Detail ....................................................................................................... 10

TABLES
Table 1: Summary of Results of Capacitance Calculation ............................................................. 4

ANNEX A....................................................................................................................................... 11
ANNEX B....................................................................................................................................... 12

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ESD Association Standard Test Method ANSI/ESD STM4.2-2006

ESD Association Standard Test Method for the Protection of Electrostatic Discharge
Susceptible Items - ESD Protective Worksurfaces Charge Dissipation Characteristics

1.0 PURPOSE AND SCOPE

1.1 Purpose
The purpose of this standard test method is to aid in determining the ability of ESD protective
worksurfaces to dissipate charge from a conductive test object placed on them. This ability may not
be revealed through standard resistance measurements as outlined in ANSI/ESD S4.1.

1.2 Scope
This document provides a test method that measures the charge dissipation characteristics of
worksurfaces. To accomplish this, a conductive test object is charged, placed on the worksurface
under test, then removed. The resultant charge on the test object is an indicator of the ability of the
tested worksurface to dissipate charge from the test object placed on it. This is only applicable
however for the test object specified within this document. This standard test method is designed for
use in a laboratory environment for qualification, evaluation or acceptance of worksurfaces and not
for periodic testing.

2.0 REFERENCE PUBLICATIONS

ANSI/ESD STM3.1, Standard for Protection of Electrostatic Discharge Susceptible Items - Ionization1
ANSI/ESD S4.1, Standard for Protection of Electrostatic Discharge Susceptible Items -
Worksurfaces-Resistive Characterization1
ANSI/ESD S6.1, Standard for Protection of Electrostatic Discharge Susceptible Items - Grounding -
Recommended Practice1
ESD ADV1.0, ESD Association Glossary of Terms1
MIL-T-43435-1989, Tape, Lacing & Tying2
ANSI/ESD STM11.11, Standard for Protection of Electrostatic Discharge Susceptible Items - Surface
Resistance Measurement of Static Dissipative Planar Materials1

3.0 DEFINITIONS
The terms used herein are defined in the ESD Association Glossary of Terms.

4.0 REQUIRED EQUIPMENT

4.1 Test Apparatus

The test apparatus and configuration used in this standard test method is shown in Figure 1. It
includes a disk assembly, test sample support table, disk raising/lowering mechanism (RLM), control
panel and contact timer, test cabling, disk suspension cord and apparatus housing.

4.1.1 Disk Assembly

The disk assembly used in this standard is shown in Figure 2. It consists of a 15.24 cm
± .254 cm (6 inches ± 1/10 inch) circular, conductive disk (i.e. non-anodized aluminum) and a
support structure used to suspend it from the disk RLM. The disk assembly shall have a maximum
1
ESD Association, 7900 Turin Road, Bldg. 3, Ste. 2, Rome, NY 13440-2069, 315-339-6937
2
Defense Printing Service Detachment Office, Bldg. 4D (NPM-DODSSP), 700 Robbins Ave., Philadelphia,
PA 19111-5094, 215-697-5164

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ANSI/ESD STM4.2-2006

capacitance of 15 pF as measured in accordance with (IAW) Annex B of ANSI/ESD STM3.1. It shall

have a weight of 227 grams (± 5 grams). Dimensional tolerances of the disk assembly and its
components are shown in Figure 2.

4.1.2 Test Sample Support Table

The support table is used to support the tested worksurface material and provide parallelism
between the tested worksurface material and the lowered/raised disk assembly. The support table
should be capable of adjusting test sample height such that a common distance is maintained
between the disk assembly and the worksurface prior to charge dissipation and triboelectrification
testing. It must be made of a electrically insulative material (> 1.0 x 1012 ohms, in accordance with
ANSI/ESD STM11.11) and have sufficient thickness to rigidly support the test sample. It shall be
60.96 cm ± 1.27 cm (24 inches ± 0.5 inches) square.

4.1.3 Disk Raising/Lowering Mechanism (RLM)

The test apparatus shall contain a mechanism used to lower and raise the disk assembly to and from
the tested worksurface. Any process may be used to accomplish this task (i.e. hydraulic, pneumatic,
etc.) as long as the raising/lowering speed is controllable and provides uniform stroke movement and
stability to the suspended disk assembly. The RLM must also be capable of suspending the disk
assembly above the tested work surface while being electrically isolated from it. The RLM must be
controlled such that a specified contact time between the disk assembly and the tested worksurface
is maintained.

4.1.4 Control Panel and Contact Timer

A control panel and contact timer shall be used to activate the RLM and control the time in which the
disk assembly is in contact with the test sample. Contact time shall be specified in the test procedure.

4.1.5 Test Cabling

The specified test voltage is applied to the disk assembly from a charge plate monitor through test
cabling. The test cabling also provides the electrical connection between the disk assembly and the
charge plate monitor when monitoring the resultant disk assembly voltage after it is raised from the
sample. The entire cable length shall be no greater than 121.92 cm (4 feet) in length and consist of
two bonded portions. The first portion shall consist of 1 meter of insulated high voltage wire
(40KV minimum). It shall be electrically bonded to a smaller 30 cm (11.7 inches) section of insulated
(28 gauge or greater) wire. The high voltage wire end of the cable is connected to the isolated plate
of the charge plate monitor and the smaller wire end is connected to the disk assembly. The cable
shall not contact any portion of the test apparatus between the disk assembly and the charge plate
monitor. This can be accomplished through an electrically insulative standoff material clamped to the
test apparatus housing. The use of this isolation technique as well as the specified wire types
ensures electrical isolation of the disk assembly. Test cable acceptability is verified through the Disk
Isolation/System Verification Test outlined herein.

4.1.6 Disk Suspension Cord

The disk assembly shall be suspended and electrically isolated from the RLM. Braided nylon lacing
tape / Cord IAW MIL-T-43435, Type I, Size 5, Finish B or equivalent is recommended.

4.1.7 Apparatus Housing

It is recommended that the suspended disk assembly, test sample support table and test sample be
contained within a grounded conductive housing. The housing provides some limited shielding from
external noise or EMI sources and a ground point for the worksurface test samples. Its size is
dependent on overall system design but must accommodate all test apparatus components, as a
minimum, the disk assembly, test sample support table and test sample.

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 ANSI/ESD STM4.2-2006

4.2 Charge Plate Monitor

A) The conductive plate shall be 15.24 cm by 15.24 cm (6 inches by 6 inches) with a minimum
capacitance of 15 pF when mounted in the test fixture without electrical hookups. The total
capacitance of the test circuit, with plate, shall be 20 pF ± 2 pF.
B) There shall be no objects, grounded or otherwise, closer than dimension "A" of the conductive
plate except the supporting insulators or plate voltage contacts as shown in Figure 3.
C) The isolated conductive plate, when charged to the desired test voltage, shall not discharge
more than 10% of the test voltage within 5 minutes.
D) The voltage on the plate shall be monitored in such a way that the system conforms to
paragraphs A, B and C above. The response time of the monitoring device shall be sufficient to
accurately measure changing plate voltage.

4.3 Coulomb Meter and Voltage Source

The coulomb meter with a resolution of ± 0.02 nanocoulombs on an appropriate scale (at least
3 nanocoulombs full scale). A voltage source with a recommended output voltage V, that is within
± 20% of 100 volts. The voltage source should be current limited to a maximum of
100 microamperes.

4.4 Ohmmeter
An ohmmeter is required to ensure electrical continuity between the charge plate and disk assembly
as specified in 7.2.

4.5 Environmental Chamber

An environmental chamber that can accommodate the test apparatus and test samples is required.
It shall be capable of controlling relative humidity to 12% ± 3% RH at a temperature of 23 °C ± 2 °C
(73 °F ± 3 °F) (-7 °C dewpoint). It must also be capable of controlling relative humidity to
50% ± 5% RH at a temperature of 23 °C ± 2 °C (73 °F ± 3 °F) (12 °C dewpoint).

5.0 TEST SAMPLES

Worksurface test samples shall be 600 mm x 600 mm (± 12 mm) and have a ground connection
installed. A minimum of three test samples of each worksurface material tested shall be used.

6.0 TEST SAMPLE PREPARATION / CONDITIONING

All test samples shall be cleaned within the test environment with a minimum 70% isopropanol-water
solution using a clean, lint-free cloth. Cleaning shall be done at the beginning of the conditioning
period. Sample conditioning shall be done in two environments. The first is 23 °C ± 2 °C
(73 °F ± 3 °F) and 12 ± 3% RH (-7 °C dewpoint) for a minimum of 48 hours. The second is
23 °C ± 2 °C (73 °F ± 3 °F) and 50% ± 5% RH (12 °C dewpoint) for a minimum of 48 hours.

7.0 TEST PROCEDURES

All test procedures with the exception of 7.1 shall be performed simultaneously in each of the
conditioned environments specified in paragraph 6.

7.1 Measurement of Disk Assembly Capacitance

Charge the plate to V by momentarily touching it with the probe from the voltage source. Then
remove the charge on the plate by touching it with the probe from the coulomb meter. Record the
charge reading. The experiment should be repeated 10 times so that the average value and
standard deviation can be determined. The following is an example of the type of data that can be
expected by using this procedure on a 15.24 cm x 15.24 cm (6 inch x 6 inch) conductive plate. If the

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ANSI/ESD STM4.2-2006

experiment is performed in a repeatable manner, the standard deviation should be less than 0.5 pF.

Example
This technique was used to measure the capacitance of an isolated conductive plate with the
dimensions of 15.24 cm x 15.24 cm x 0.625 cm (6 inches x 6 inches x 0.25 inches) located 1.875 cm
(.075 inches) above a 15.24 cm x 15.24 cm (6 inch x 6 inch) ground plane. All measurements are
referenced to the electrical ground at the ground plane. Ten measurements were taken for the value
of a charge Q (listed below) on the plate when it is charged to V (100 volts). The calculated values
for the plate capacitance using the equation (C = Q/V) are listed in Table 1.

Table 1. Summary of Results of Capacitance Calculation

V Q Cap
volts nC pF
100 1.75 17.5
100 1.71 17.1
100 1.73 17.3
100 1.74 17.4
100 1.73 17.3
100 1.76 17.6
100 1.75 17.5
100 1.70 17.0
100 1.75 17.5
100 1.73 17.3

The average capacitance and standard deviation calculated from Table 1 are:
Capacitance = 17.33 pF
Standard deviation = 0.206 pF

7.2 Disk Isolation and System Verification

The following procedures shall be used to verify adequate isolation of the disk assembly and the
charge plate prior to charge dissipation and triboelectric contribution testing.
A) Connect the test cabling to the disk assembly and charge plate monitor as outlined in
paragraph 4.1.5. Verify electrical continuity between the disk assembly and the charge plate
using an ohmmeter connected between the two items. The measured resistance shall be 1 ohm
or less.
B) Zero or ground the charge plate and disk assembly to remove any residual charge.
C) Apply +1,000 volts (positive) to the disk assembly and charge plate using the charge plate
monitor. Verify that the initial voltage does not decay by more than 10% of the initial value after
5 minutes. Repeat the process for an initial disk/plate voltage of -1,000 (negative) volts. Record
the resultant voltages for each polarity after the 5 minute waiting period.
NOTE: If the disk/plate voltage decays by more than 10%, the charge dissipation test cannot be
conducted. Reasons for this problem could be related to the charge plate functionality, insufficient
cable insulation or isolation of the cable from the conductive elements of the test apparatus.

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 ANSI/ESD STM4.2-2006

7.3 Sample Testing

7.3.1 Pretest Preparations

A) Connect the test cabling to the disk assembly and charge plate monitor as outlined in
paragraph 4.1.5.
B) Place the conditioned test sample on the support table and ground it through its ground
connection to the apparatus housing.
C) Adjust the disk suspension cable and support table as necessary to ensure that the entire weight
of the disk assembly rests on the test sample when the RLM is in the "lowered" position.
D) Raise the disk assembly from the test sample using the RLM to the "raised" position. Adjust only
the disk suspension cable at this point to ensure a minimum clearance between the test sample
and the disk assembly of 7.62 cm (3 inches) and that they are approximately parallel.
E) Set the contact timer to a cycle time necessary to ensure a contact time between the disk
assembly and the test sample of 5.0 seconds (± 0.1 seconds). This may require several cycles
of the RLM and adjustments of the timer to achieve the specified contact time.

7.3.2 Charge Dissipation Test

NOTE: Resultant voltage may be affected by triboelectrification. Refer to Annex B for triboelectric
contribution test.
A) Ensure that the disk assembly is in the "raised" position. Zero or ground the charge plate and
disk assembly to remove any residual charge.
B) Apply +1,000 volts (positive) ± 10% to the disk assembly using the charge plate monitor.
C) Activate the RLM through one cycle (lower/contact/raise). Record the resultant voltage and
polarity on the disk assembly from the charge plate monitor. This measurement shall be
recorded within 10 seconds of cycle completion.
D) Repeat steps A through C two more times.
E) Repeat steps A through D for an initial applied disk assembly voltage of -1,000 volts (negative).
F) Place next test sample on support table and repeat steps A through E.
G) Repeat A through E for the second environmental condition specified in paragraph 6.

8.0 DATA REPORTING

Report all data taken in paragraph 7. The data sheet provided is recommended for data
recording.

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ANSI/ESD STM4.2-2006

8.1 Sample Data Reporting Sheet

Date 29 Nov. 94

Temperature (F) 70° Relative Humidity (%) 10%

Material Type Sample #15

Calculate the average voltage for each polarity.

Positive

1) 385

2) 432 Average: 403.67

3) 394

Negative

1) -401

2) -413 Average. -403.67

3) -397

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 ANSI/ESD STM4.2-2006

8.2 Data Reporting Sheet

Date ____________

Temperature (F) _______ Relative Humidity (%) ______

Material Type _______________________________

Calculate the average voltage for each polarity.

Positive

1) _________

2) _________ Average ___________

3) _________

Negative

1) _________

2) _________ Average ____________

3) _________

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ANSI/ESD STM4.2-2006

Figure 1: Charge Dissipation Test Apparatus

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 ANSI/ESD STM4.2-2006

Figure 2: Disk Assembly

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ANSI/ESD STM4.2-2006

Figure 3: Charge Plate Detail

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 ANSI/ESD STM4.2-2006

ANNEX A
Interpretation of Data

Materials that exhibit lower retained charge, as indicated by lower average voltages, have better
decay properties and are preferred.

Relative rankings of material can be developed by comparing the average voltages.

Any two materials with voltage differences of less than 50 volts should be considered equivalent.

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ANSI/ESD STM4.2-2006

ANNEX B
Triboelectric Contribution Test

Voltage readings may be affected by triboelectrification. This procedure will determine if tribocharging
is making a significant contribution to voltage values. A result of 50 volts or less should be
considered insignificant.

Procedure

A) Lower the disk assembly to the contact position using the RLM. Ensure that the charge plate
monitor reads 0 volts ± 5 volts.

B) Raise the disk assembly from the test sample using the RLM. Record the resultant voltage
displayed on the charge plate monitor. Again, record this measurement within 10 seconds of
cycle completion.

C) Repeat steps A and B two more times.

D) Average all three voltages.

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