2016-01-27

High Power Infrared Emitter (850 nm)

Version 1.2

SFH 4052

Features:
• High optical power
• Small package (LxWxH): 3.2 mm x 1.6 mm x 1.1 mm
• CHIPLED with +/-40° halfangle

Applications
• Miniature photointerrupters
• Industrial electronics
• For control and drive circuits
• Sensor technology

Notes
Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which
can be hazardous to the human eye. Products which incorporate these devices have to follow the safety
precautions given in IEC 60825-1 and IEC 62471.

Ordering Information
Type: Radiant Intensity Ordering Code
Ie [mW/sr]
IF=70 mA, tp = 20 ms
SFH 4052 20 (≥ 10) Q65111A5376

Note: Measured at a solid angle of Ω = 0.01 sr

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Maximum Ratings (TA = 25 °C)

Parameter Symbol Values Unit
Operation and storage temperature range Top; Tstg -40 ... 85 °C
Reverse voltage VR 5 V
Forward current IF 70 mA
Surge current IFSM 1 A
(tp ≤ 10 µs, D = 0)
Power consumption Ptot 125 mW
ESD withstand voltage VESD 2 kV
(acc. to ANSI/ ESDA/ JEDEC JS-001 - HBM)
Thermal resistance junction - ambient 1) page 12 RthJA 540 K/W
Thermal resistance junction - soldering point RthJS 360 K/W
2) page 12

Characteristics (TA = 25 °C)

Parameter Symbol Values Unit
Peak wavelength (typ) λpeak 860 nm
(IF = 70 mA, tp = 20 ms)
Centroid wavelength (typ) λcentroid 850 nm
(IF = 70 mA, tp = 20 ms)
Spectral bandwidth at 50% of Imax (typ) ∆λ 30 nm
(IF = 70 mA, tp = 20 ms)
Half angle (typ) ϕ ± 40 °
Dimensions of active chip area (typ) LxW 0.3 x 0.3 mm x
mm
Rise and fall time of Ie ( 10% and 90% of Ie max) (typ) tr, tf 12 ns
(IF = 70 mA, RL = 50 Ω)
Forward voltage (typ (max)) VF 1.45 (≤ 1.75) V
(IF = 70 mA, tp = 20 ms)
Forward voltage (typ (max)) VF 2.4 V
(IF = 1 A, tp = 100 µs)
Reverse current IR not designed for µA
(VR = 5 V) reverse operation
Total radiant flux (typ) Φe 40 mW
(IF= 70 mA, tp=20 ms)

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Parameter Symbol Values Unit

Temperature coefficient of Ie or Φe (typ) TCI -0.5 %/K
(IF = 70 mA, tp = 20 ms)
Temperature coefficient of VF (typ) TCV -0.7 mV / K
(IF = 70 mA, tp = 20 ms)
Temperature coefficient of wavelength (typ) TCλ 0.3 nm / K
(IF = 70 mA, tp = 20 ms)

Grouping (TA = 25 °C)

Group Min Radiant Intensity Max Radiant Intensity Typ Radiant Intensity
IF=70 mA, tp = 20 ms IF=70 mA, tp = 20 ms IF = 1 A, tp = 25 µs
Ie, min [mW / sr] Ie, max [mW / sr] Ie, typ [mW / sr]
SFH 4052 - R 10 20 165
SFH 4052 - S 16 32 265
SFH 4052 - T 25 50 375

Note: measured at a solid angle of Ω = 0.01 sr

Only one group in one packing unit (variation lower 2:1).

Relative Spectral Emission 3) page 12 Radiant Intensity 3) page 12

Irel = f(λ), TA = 25°C Ie / Ie(70 mA) = f(IF), single pulse, tp = 25 µs,
100
OHF04132 TA= 25°C
OHF05631
102
I rel %
Ιe
80 Ι e (70 mA)
101

60
100

40
10-1

20
10-2

0
700 750 800 850 nm 950 10-3 0
λ 10 101 102 mA 103
IF

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Max. Permissible Forward Current Forward Current 3) page 12

IF, max = f(TA), RthJA = 540 K / W IF = f(VF), single pulse, tp = 100 µs, TA= 25°C
OHF05632 OHL01713
80 100
mA A
IF IF
70

60 10-1
5
50

40 10-2
5
30

20 10-3
5
10

0 10-4
0 20 40 60 80 ˚C 100 0 0.5 1 1.5 2 2.5 V 3
TA VF

Permissible Pulse Handling Capability Permissible Pulse Handling Capability

IF = f(tp), TA = 25 °C, duty cycle D = parameter IF = f(tp), T A = 85 °C, duty cycle D = parameter
OHF05633 OHF05634
1.1 1.0
tP tP
A t A t
IF D = TP IF I F 0.9 D = TP IF
T T
0.9 0.8
0.8
D= 0.7
0.7 0.005
0.01 0.6 D=
0.6 0.02 0.005
0.05 0.5 0.01
0.5 0.1 0.02
0.2 0.05
0.4
0.4 0.5 0.1
1 0.2
0.3 0.5
0.3
1
0.2 0.2

0.1 0.1

0 -5 0 -5
10 10-4 10-3 10-2 10-1 100 101 s 102 10 10-4 10-3 10-2 10-1 100 101 s 102
tp tp

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Version 1.2 SFH 4052

Radiation Characteristics 3) page 12

Irel = f(ϕ), TA= 25°C
40˚ 30˚ 20˚ 10˚ 0˚ OHF04263

ϕ 1.0
50˚

0.8

60˚
0.6

70˚ 0.4

80˚ 0.2

0
90˚

100˚
1.0 0.8 0.6 0.4 0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚
Package Outline

Dimensions in mm.
Package
Chipled

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Version 1.2 SFH 4052

Approximate Weight:
5.4 mg
Note:
Colour: colourless clear
Recommended Solder Pad

Dimensions in mm.

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Version 1.2 SFH 4052

Reflow Soldering Profile

Product complies to MSL Level 3 acc. to JEDEC J-STD-020D.01
OHA04525
300
˚C
T 250
240 ˚C Tp 245 ˚C
217 ˚C tP
200
tL

150
tS

100

50
25 ˚C
0
0 50 100 150 200 250 s 300
t

OHA04612

Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit

Profil-Charakteristik Symbol Minimum Recommendation Maximum Einheit
)
Ramp-up rate to preheat* 2 3 K/s
25 °C to 150 °C
Time tS tS 60 100 120 s
TSmin to TSmax
Ramp-up rate to peak*) 2 3 K/s
TSmax to TP
Liquidus temperature TL 217 °C
Time above liquidus temperature tL 80 100 s

Peak temperature TP 245 260 °C

Time within 5 °C of the specified peak tP 10 20 30 s
temperature TP - 5 K
Ramp-down rate* 3 6 K/s
TP to 100 °C
Time 480 s
25 °C to TP
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range

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Version 1.2 SFH 4052

Taping

Dimensions in mm [inch].

Tape and Reel

8 mm tape with 2000 pcs. on ∅ 180 mm reel
W1

D0 P0
P2
13.0 ±0.25
E
F

A
W

P1 Label
Direction of unreeling Direction of unreeling
W2
Leader: min. 400 mm *
Trailer: min. 160 mm *
*) Dimensions acc. to IEC 60286-3; EIA 481-D
OHAY0324

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Version 1.2 SFH 4052

Tape dimensions [mm]

Tape dim ensions in m m

W P0 P1 P2 D0 E F
8 + 0.3 / -0.1 4 ± 0.1 2 ± 0.05 2 ± 0.05 1.5 ± 0.1 1.75 ± 0.1 3.5 ± 0.05
or
4 ± 0.1

Reel dimensions [mm]

Reel dim ensions in m m

A W Nmin W1 W2max
180 8 60 8.4 + 2 14.4

Barcode-Product-Label (BPL)
OSRAM Opto

EX
LX XXXX BIN1: XX-XX-X-XXX-X
Semiconductors
RoHS Compliant
(6P) BATCH NO: 1234567890

(1T) LOT NO: 1234567890

A MP
(9D) D/C: 1234
ML Temp ST
X XXX °C X

Pack: RXX

(X) PROD NO: 123456789(Q)QTY: 9999 (G) GROUP:

DEMY

LE
XX-XX-X-X
XXX
X_X123_1234.1234 X

OHA04563

Dry Packing Process and Materials

Moisture-sensitive label or print

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Humidity indicator
Barcode label
Do not eat.
Avoid metal contact.
Discard if circles overrun.
bag opening.
Please check the HIC immidiately after

check dot WET

Comparator

bake units
examine units, if necessary 15%
If wet,

bake units
examine units, if necessary 10%
If wet,

change desiccant
parts still adequately dry. 5%
If wet,

MIL-I-8835
Humidity Indicator

AM
Desiccant OSR

OHA00539

Note:
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card.
Regarding dry pack you will find further information in the internet. Here you will also find the normative
references like JEDEC.

2016-01-27 9
Version 1.2 SFH 4052

Transportation Packing and Materials

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Packing
Sealing label OHA02044

Dimensions of transportation box in mm

Width Length Height

200 ± 5 195 ± 5 30 ± 5

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Version 1.2 SFH 4052

Disclaimer
Language english will prevail in case of any discrepancies or deviations between the two language wordings.

Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version in the Internet.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any
costs incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose!
Critical components* may only be used in life-support devices** or systems with the express written approval of
OSRAM OS.

*) A critical component is a component used in a life-support device or system whose failure can reasonably be
expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that
device or system.
**) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or
maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be
endangered.

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Version 1.2 SFH 4052

Glossary
1)
Thermal resistance: junction -ambient, mounted on PC-board (FR4), padsize 5 mm2 each
2)
Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g. metal block)
3)
Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or
calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily
correspond to the actual parameters of each single product, which could differ from the typical data and calculated
correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data
will be changed without any further notice.

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Published by OSRAM Opto Semiconductors GmbH

Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.

2016-01-27 13