Residual Stress Analysis

ICON Analytical Equipment Pvt. Ltd

PULSTEC INDUSTRIAL CO., LTD

THE INDIAN INSTITUTE OF METALS

NMD ATM 2014 12-15 Nov. 2014
Agenda
 Introduction

 Principle of XRD residual stress analysis

 “Sin2(psi)” and “cos(alpha)” method

*** advantage of cos(alpha) technique ***

 Introduction portable XRD residual stress analyzer

based on cos(alpha) method

 Company introduction (PULSTEC Japan)

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Confidential
Introduction

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Confidential
Introduction “What’s residual stress ?”
What is “Residual Stress” ?
 Residual Stress is “Stress” inside of metal material that remains
after the original cause of stresses (example, external forces, heat
gradient) has been removed.

Steel materials

External forces External forces

TOP : compressive

Bottom tensile
After remove the force…
Residual Stress is remained.
Introduction “What’s residual stress ?”
■ Example by fatigue
If the residual stress remains in the material.
Stress affects to destruction.

Compressive

Tensile

■In General
Compressive is positive direction.
Tensile is negative direction.
Control the residual stress
(1) Heat treatment, Surface process, Peening process
⇒for Strength UP, Downsizing, Light, Cost down
→Car parts, Aerospace parts, etc..

(2) Welding, Plasticity (to avoid transformation)

⇒Safety management, higher quality delicate,
→Steel products, ships,

(3) Fatigue, Aging process, Repeated load,

⇒Safety management, long life,
→Plant, large tank, infrastructures, (bridge, steel constructions)

grasp and management of the

residual stress is important
Principle of XRD
residual stress analysis

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Confidential
X-ray diffraction (XRD)
• Bragg’s law
O
λ P

O’
P’
θ E
(hk
l) A
θ
d
B D
(hk
l) C

Bragg’s law (Diffraction the x-ray scattering from

plane of lattice that satisfy the Bragg
conditions.）
n  2dsin
n (an integer) is the "order" of reflection, λ is the
wavelength of the incident X-rays, d is the interplanar
spacing of the crystal and θ is the angle of incidence that
equals the angle of scattering (diffraction angle).Create New Value
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X-Ray Diffraction from polycrystalline material

• Illuminating polycrystalline material with X-rays

Incident X-ray
Incident X-ray
Debye ring

Diffracted
X-ray
Diffracted
X-ray
Sample

Crystal Sample surface

grain
（lattice）
X-ray diffraction occurs from the various orientation of the grain
crystals that satisfy Bragg’s law. The diffracted X-ray form as a
cone around the incident x-ray axis because of the variation in
crystal’s orientation.
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“Sin2(psi)” and “cos(alpha)” method

*** advantage of cos(alpha) technique ***

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Confidential
The Sin2ψ Method
• Outline of sin2ψ method
In the sin2ψ method the variation of the lattice interplanar
distance is detected by changing the angle of incident X-rays
(ψ0). (In the standard XRD measurement, 7 different angular
measurement is recommended.)
Z

Scan direction
X-ray incident angle
ε（Strain）
ψ0
η
1D or Line
ψ
η Detector
PSPC, etc
Diffracted
X-ray

Diffracted face 2θ sample

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The sin2ψmethod measurement
Xray(ψ00)

Measurement sample

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The Sin2ψ Measurement Method
Xray(ψ00)
Strain(0)

Strain(20)

Strain(40)

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 The Sin2ψ Measurement Method
Xray(ψ00)
Strain(0)

Strain(20)

Strain(40)

When the stress is applied

When the stress is applied, X-ray incident angle ψ0 is large,

Compressive stress apply strain’s change results d become
smaller  θ increases nλ=2dsinθ
Calculate the stress from the change of diffraction normal angle ψ.
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Calculation of sin2ψ Method
There is a linear relationship exhibited when plotting strain angle
(deg) on the vertical axis , and sin2ψ on horizontal axis. The slope
gives the stress value; this is the basis of the sin2ψ method.

This slope is stress.

On the assumption that the stress condition is on plane surface, stress σx is

calculated from the following formula.

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The Cos α Method (μ-X360)
• Outline of the cosα method
Acquire full Debye-Scherrer ring; by a single short duration X-
ray exposure. Determination of the residual stress achieved by
accurately measuring the position of the Debye-Scherrer rings;
their positions are a direct measure of strain.
Incident angle
Debye ring
α ε（Strain）
Z
ψ0
η
ψ
η

Diffracted X-ray

Diffracted face 2θ Sample

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Principal of the Cosα Method
X-ray

Debye-Scherrer ring

２D detector

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Principal of the Cosα Method
Incident X-rays

Debye-Scherrer

When stress is ２D detector

applied

Green face -
the lattice planes are orientated close to the stress direction and the crystal lattice
spacing become smaller in response to the applied stress, therefore θ increases.
Blue face -
the lattice planes are orientated close the direction parallel to the stress direction. The
interval of the crystal lattice increases (Poison’s ratio) crystal lattice spacing increases
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and θ becomes smaller.
The Cosα Calculation Formulae
• Residual stress calculation （σ） by the Cosα method
Acquire the full Debye-Sherrer
ring. The magnitude of strain is
determined from the detected 1
position of the Debye-Scherrer
 1  {(－   ) ＋ (   －   )}
ring. Calculate using the following
2
formula.
1
ε-α εα  2  {(－   ) － (   －   )}
2
α
E 1 1   1 
x   ･ ･ ･ 
1  sin2 sin2 0  cos 
Elastic constant K Slope M
E 1 1   2 
txy  ･ ･ ･ ÷
επ+α επ-α 2(1  ) sin2 sin 0  sin 
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The Cos α Method
Horizontal axis is cos α [α is the Azimuth angle of Debye-
Sherrer ring], vertial axis is εα1 calculated using the
formulae in the previous slide. As with the sin2ψ method, the
slope of the line gives the stress value.
This is the cos α method.
(cosα line)

This slope is stress.

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 The Cos α & Sin2ψ Methods compared
Comparison between the Sin2ψ and Cos α techniques – the Cos α
requires only a single angular measurement for complete analysis .

Sin2ψ technique (existing) COS α technique (μ-X360)

(Multi-positions of (Single position of detector)
detector)
X-ray beam

Z
R**(Japan)
Debye ring
scan S**(Finland)
X-ray beam B**(Germany) ε (strain)
Z
ε (strain)
ψ0
ψ0
η η
ψ ψ
η η
Detector
(PSPC)
diffracted Diffracted
X-ray X-ray

diffraction 2θ sample diffraction 2θ sample

surface surface

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 Comparison between Sin2ψ & Cos α Methods
Sin2ψ method Cos α method
(Conventional) (μ-X360)
X-ray tube 40 kV & 40 mA △ 30 kV & 1 mA 〇
(typical) (Safety & Ecology)
X-ray detector Point, 1D and part 2D △ Full 2 D ◎
(visual analysis)
Precision mech. Mandatory × Not necessary 〇
Data 5-7point △ Max 125 point 〇
（Debye-Scherrer ring)
Permissible ±50 µm × ±5 mm 〇
range (complicated setting) (easy setting)
Measurement time 5-20 min. △ 90 sec. 〇
Cost Expensive × Lower 〇
FWHM repeatability △ ◎
On-site × ◎
Portable Water cooling & △ Air cooling, ◎
Goniometer stage Goniometer not
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Introduction of
portable XRD
residual stress analyzer
based on cos(alpha) method

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Confidential
μ-X360: Sensor Unit

Uses a single incident angle measurement

cosα method Create New Value 24
μ-X360n

Sensor unit
PC(USB) Approx.4kg Power supply unit
Approx.6kg

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Portable for ‘On-site’ Analysis

Tripod & Arm

PC

Battery

power
supply

6 hours life enabling

around 100 individual point measurements
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Feature of μ-X360
◎ Easy and fast
Easy to setup the measurement samples
LED marker and CCD camera support to setup
measurement time : 90 seconds
(Ferrite based material by standard collimator)

◎ Compact and light, for on-site

Sensor unit 4kg, Power unit 6kg (without optinal parts.)
Portable : Air cooling, Goniometer stage less
On-site measurement
Portable battery is available

Easy to setup & measure

Various kind of work (large size, outdoor target)
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μ-X360 basic specifications
Measurement item
X-ray tube target
Measurement target
Measurement area
(by standard collimator)
Measurement time
Voltage / current (X-ray tube)
Cooling system
Sensor unit size and weight
Power unit size and weight
Power supply
Residual stress, FWHM (full width at half maximum) , Retained
austenite (optional)
Cr V
Ferrite based materials, etc. Titan, etc.
X-ray range : φ2mm
X-ray estimated depth : about 10um
About 90 seconds (depends n the material)
30kV ・ 1.0mA max
Air cooling
W311mm H154mm D123mm /4.7kg
W150mm H176mm D255mm /6kg
AC100V～240V,50/60 Hz or DC24V (Battery option)
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 Application Software

 Procedure
Sample positioning
（Captured by CCD ① ②
camera) Residual stress

[-] compressive
Measurement [+] tensile

(X-ray incidence &

detection)
③ FWHM

Calculation
（Residual stress）
①Display diffraction ring, residual stress
②Measurement log : easy and fast to
retrieve past data
Data output ③Captured by the CCD camera : confirms
（Residual stress & sample position and recorded image
FWHM） stored for future reference Create New Value 29
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μ-X360 Various Analysis Images
Calculate the stress from the slope
■μ-X360’s results
2D Debye ring 3D Debye ring Peak position

cosα
line[max125point]

2D development 3D development Profile

・Display the various Debye-Scherrer rings

・Display the diagram of residual stress & FWHM Create New Value 30
 Advantage of the Full 2D detection
■Advantage 2D Full data of Debye-Scherrer ring (500 points)
→High repeatability and reliability because of max. 500 points data

①Debye-Scherrer ring
２D sensor intensity distribution ②Result (Example)

③Cos α line
125points

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 Advantage of the Full 2D detection

Grain coarsening
e.g. Bead on Plate of
stainless steel weld

Grain orientation
(texture)
e.g. Influence of rolling
direction

visual analysis
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Automobile parts
①Gear
②Wheel
③Crankshaft
④Exhaust manifold
⑤Suspension
⑥Bearing
⑦Conrod
⑧Chassis
➈Screw カセット溶接HAZ部測定

⑩Ball screw
⑪Muffler

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 On-site measurements
■Plant maintenance
Welds＆Shot-peening effect
Check aging degradation
Weld bead

■Tank
Welds, Tempering effect

■Tube
Welds＆Heat treatment

Weld bead

Weld bead

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On-site measurements
①Railway

②Road construction

③Water plant

④Bridge
Retained Austenite Analysis
Displays the percentage of the retained austenite that has
not transformed even at ambient temperature.

α211 γ220

341.28 deg.
272.16 deg.

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X & Y Stage – stress mapping
■Stress mapping by controlling X & Y axis stage.
『Stress mapping come true.』
□Measure 25mm(1inch) by
1mm(0.04inch)Step.
26p×26p＝676point
Mapping result

Weld bead

*２ axis stage(X/Y) + Application software

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Correlation with strain gauge; by 4 point

Strain gauge

External External
μ-X360
force force

Strain
gauge

Strain gauge
Data comparison between “Strain gauge” & “u-X360” using stress-
free sample piece.
(sample piece : SS400, Gauge : KYOWAKFG-2-120-C1- 38
11L30C2R)
Correlation with a sin2Ψ based analyzer

y = 1.087 x - 65.319
Correlation
R² = 0.998
0
-200
-400
-600
Other Analyzer

-800
-1000
-1200
-1400
-1600
-1600 -1400 -1200 -1000 -800 -600 -400 -200 0

μ -X360

(sample : Ferrous test piece)

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Company
introduction

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Confidential
 Company Information
• Company Name Pulstec Industrial Co.,Ltd.
• Headquarters Hamamatsu-city Shizuoka Pref. Japan
• Establishment November 1, 1969
• Capital Stock 1,491M JPY (14.9M USD)
• Employee 151 employees
• Primary Business Manufacture and sales of electronic applied
equipment and system
• Subsidiaries PULSTEC USA
• Base PULSTEC UK

• Agent in India ICON Analytical

1
 Location (PULSTEC HQ)

Kyoto Fukushima

Tokyo Mt.Fuji was registered as a

World Heritage Site in June

Mt.Fuji
PULSTEC
Osaka

2
 Location (Subsidiaries, Base, Agencies)

ICON
Analytical

3
 Core technologies
PULSTEC has released various electrical equipment and measuring systems.
PULSTEC provides products to meet customer’s demands, using our core
technologies, “Electronics”, Mechanics”, Optics”, and “Software”, etc..

Environment
Mechanical
Electrical circuit design
電源ユニット
design センサユニッ USB付きPC
6.3kg ト
4.0kg
(昇降ｽﾃｰｼﾞ含ま
ず)
Optical design Software design
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4
 Products - 3D laser scanners
3D laser scanners
Close range : car parts, Sheet metals,
various parts,
 Application software

Middle range : cars, buildings, monuments

Comparison to CAD data

電源ユニット USB付きPC
6.3kg
Facial imaging & other anatomical
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Weld components Size
inspection

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 Products - Nano scale lithography & fabrication

Nano lithography & fabrication system: the NEO series. Nano scale Lithography &
fabrication on resist coated surfaces.
Example of photo-resist exposure
NEO-1000

Hole diameter : 40nm,

Pitch : 600nm, Thickness 900nm

電源ユニット USB付きPC
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Line width : 1um, Pitch : 3um, Thickness :

1.3um

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6
 Products - Bio tech, Health care & others
OCT scanner Fluorescence detector
OCT: Optical Coherence Tomography

Micro Plasma module Solar panel lighting  Optical Wave front

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Thank you for your attention.

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