1692mse r3 (1) .2a Technical Handbook PDF

Technical Handbook
Alcatel
1692MSE
8 Channels CWDM System
1692MSE REL.3.2A
3AL 97869 AAAA ED.01

3AL 97869 AAAA ED.01
1692MSE REL.3.2A TECHNICAL HDBK
CONTENTS
HANDBOOK GUIDE ........................................................................................................... 13

1 HANDBOOK STRUCTURE AND CONFIGURATION CHECK ........................................... 14
1.1 General information ......................................................................................................... 14
1.2 Handbook applicability..................................................................................................... 14
1.3 Product-release handbooks ............................................................................................... 15
1.4 Handbook Structure.......................................................................................................... 17
1.5 Handbook configuration check.......................................................................................... 18
1.5.1 List of the editions and modified parts........................................................................ 18
1.5.2 Notes on Release 1.0 ED.01...................................................................................... 19
1.5.4 Notes on Release 1.2A ED.01 ................................................................................... 19
1.5.5 Notes on Release 1.2A1 ED.01 ................................................................................. 20
1.5.9 Notes on Release 3.2A ED.01 ................................................................................... 21
2 COMPLIANCE WITH EUROPEAN NORMS. .................................................................... 22
2.1 Electromagnetic Compatibility (EMC) ................................................................................. 23
2.2 Safety............................................................................................................................... 23
2.3 Environmental constraints ................................................................................................. 23
3 SAFETY NORMS AND LEBELS ....................................................................................... 24
3.1 First aid for electric shock.................................................................................................. 24
3.2 Safety Rules ...................................................................................................................... 26
3.2.1 General rules ........................................................................................................... 26
3.2.2 Labels indicating Danger, Forbiddance, Command.................................................... 27
3.2.3 Dangerous electrical voltages.................................................................................... 28
3.2.4 Harmful optical signals ............................................................................................. 29
3.2.5 Risks of explosions .................................................................................................... 31
3.2.6 Moving mechanical parts .......................................................................................... 31
3.2.7 Heat-radiating mechanical parts ............................................................................... 31
3.2.8 Specific safety rules in this handbook ......................................................................... 32
4 OTHER NORMS AND LABELS ....................................................................................... 33
4.1 Electromagnetic Compatibility ........................................................................................... 33
4.1.1 General norms - Installation...................................................................................... 33
4.1.2 General norms - Turn-on, Tests & Operation ............................................................. 33
4.1.3 General norms - Maintenance................................................................................... 34
4.2 Electrostatic Dischargers (ESD)........................................................................................... 34
4.3 Suggestions, notes and cautions ........................................................................................ 35
4.4 Labels affixed to the Equipment ......................................................................................... 35
5 LIST OF ABBREVIATIONS ............................................................................................. 40
6 GENERAL ON ALCATEL CUSTOMER DOCUMENTATION............................................... 43
6.1 Products, product-releases, versions and Customer Documentation..................................... 43
6.2 Handbook supply to Customers......................................................................................... 43
6.3 Aims of standard Customer Documentation ....................................................................... 43
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6.4 Handbook Updating......................................................................................................... 44
6.4.1 Changes introduced in the same product-release (same handbook P/N) ..................... 44
6.4.2 Changes due to a new product-release...................................................................... 45
6.5 Customer documentation supply on CD-ROM.................................................................... 45
6.5.1 Contents, creation and production of a CD-ROM ....................................................... 45
6.5.2 Use of the CD-ROM.................................................................................................. 45
6.5.3 CD-ROM identification.............................................................................................. 46
6.5.4 CD-ROM updating ................................................................................................... 46
DESCRIPTIONS ................................................................................................................... 48
1 FUNCTIONAL DESIGN ................................................................................................. 49
1.1 Basic equipment configurations ......................................................................................... 51
1.1.1 Line terminal ............................................................................................................ 51
1.1.2 Optical Add and Drop Multiplexer (OADM)................................................................ 51
1.1.3 Regenerator ............................................................................................................. 53
1.1.4 CPE ......................................................................................................................... 53
1.2 Network architectures ....................................................................................................... 54
1.2.1 Ring networks ........................................................................................................... 54
1.2.2 Point to point links .................................................................................................... 54
1.2.3 CPE configuration in ring network.............................................................................. 55
1.2.4 CPE configuration in point to point links..................................................................... 55
1.3 Network protection ........................................................................................................... 56
1.4 Description of the functions ............................................................................................... 56
1.4.1 Main function in different configuration...................................................................... 56
1.4.2 Description of the functions ....................................................................................... 61
1.5 Device description ............................................................................................................ 72
1.5.1 Shelf list ................................................................................................................... 72
1.5.2 Shelf and boards designation and reference .............................................................. 73
1.5.3 Slot allocations ......................................................................................................... 78
1.6 System Configuration........................................................................................................ 80
1.6.1 Configuration criteria................................................................................................ 80
1.6.2 Terminal configuration.............................................................................................. 80
1.6.3 OADM configuration ................................................................................................ 85
1.6.4 Regenerator configuration......................................................................................... 87
1.6.5 CPE configuration..................................................................................................... 89
1.7 Optical safety ................................................................................................................... 91
1.7.1 General information ................................................................................................. 91
1.8 1692MSE System characteristics ........................................................................................ 92
1.8.1 Power supply ............................................................................................................ 92
1.8.2 Equipment and shelf control...................................................................................... 93
1.8.3 Management and monitoring interfaces..................................................................... 93
1.9 Environmental characteristics ............................................................................................ 95
1.9.1 ETSI compliancy........................................................................................................ 95
1.9.2 Environmental constraints ......................................................................................... 96
2 MECHANICAL DESCRIPTION ...................................................................................... 101
2.1 Rack design.................................................................................................................... 101
2.2 CO shelf ........................................................................................................................ 102
2.2.1 Shelf organization................................................................................................... 102
2.2.2 Shelf dimensions .................................................................................................... 103
2.3 Compact shelf ................................................................................................................ 103
2.3.1 Shelf organization................................................................................................... 104
2.3.2 Shelf dimensions .................................................................................................... 104
2.4 Unit front view ................................................................................................................ 105
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2.5 Power consumption and weight ....................................................................................... 108
2.5.1 Maximum power consumption and weight of the boards and units............................ 108
2.5.2 Maximum power consumption of the equipment ...................................................... 108
2.6 FIT of 1692 MSE............................................................................................................. 109
2.7 Equipment connections ................................................................................................... 110
2.7.1 Optical connections ................................................................................................ 110
2.7.2 Management connections ....................................................................................... 112
2.7.3 Power supply connections........................................................................................ 115
3 UNITS DESCRIPTION.................................................................................................. 116
3.1 Wavelength Adapter ....................................................................................................... 116
3.1.1 Description............................................................................................................. 117
3.1.2 Optical interfaces ................................................................................................... 118
3.1.3 WLA configurations................................................................................................. 119
3.1.4 Performance monitoring ......................................................................................... 124
3.1.5 Front panel description ........................................................................................... 125
3.2 10 Gbps Optical Channel Card (OCC10) ....................................................................... 128
3.2.1 Description............................................................................................................. 128
3.2.2 OCC10 configuration ............................................................................................. 129
3.2.3 Optical characteristics ............................................................................................. 131
3.3 2XGE-FC Unit ................................................................................................................ 134
3.3.1 Description............................................................................................................. 134
3.3.2 Optical interfaces ................................................................................................... 134
3.3.3 2XGE-FC configuration ........................................................................................... 134
3.4 MUX/DEMUX units (C-MDX)............................................................................................ 138
3.4.1 C-MDX-E-U-S ......................................................................................................... 138
3.4.2 C-MDX-U ............................................................................................................... 142
3.4.3 C-MDX-B-S ............................................................................................................ 146
3.4.4 C-MDX-B ............................................................................................................... 149
3.5 MUX/DEMUX units (C-MDX2).......................................................................................... 152
3.5.1 C-MDX2-E-U-S ....................................................................................................... 152
3.5.2 C-MDX2-U ............................................................................................................. 153
3.5.3 C-MDX2-E-1-S ....................................................................................................... 154
3.5.4 C-MDX2-E-2-XX-S .................................................................................................. 157
3.6 OADM units (C-OAD)..................................................................................................... 161
3.6.1 C-OAD-E-U-1-XX-S ................................................................................................ 161
3.6.2 C-OAD-U-1-XX ...................................................................................................... 165
3.6.3 C-OAD-E-U-2-XXXX-S............................................................................................. 168
3.6.4 C-OAD-U-2-XXXX................................................................................................... 172
3.6.5 C-OAD-B-1-XX-S .................................................................................................... 175
3.6.6 C-OAD-B-1-XX ....................................................................................................... 179
3.7 OADM2 units (C-OAD2)................................................................................................. 182
3.7.1 C-OAD2-E-U-1-XX-S .............................................................................................. 182
3.7.2 C-OAD2-U-1-XX .................................................................................................... 184
3.7.3 C-OAD2-E-U-2-XXXX-S........................................................................................... 185
3.7.4 C-OAD2-U-2-XXXX................................................................................................. 186
3.7.5 C-OAD2-E-U-4-XXXXXXXX-S.................................................................................... 187
3.7.6 C-OAD2-U-4-XXXXXXXX.......................................................................................... 191
3.8 ESC-LC board ................................................................................................................ 195
3.9 C-4xANY card................................................................................................................ 198
3.9.1 Description............................................................................................................. 198
3.9.2 C-4xANY optical characteristics ............................................................................... 201
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3.10 OSC unit........................................................................................................................ 206
3.10.1 Description…………………………........................................................................... 206
3.10.2 Functional description of the configurations.............................................................. 206
3.11 OMSP unit...................................................................................................................... 209
3.11.1 Description………………… ..................................................................................... 209
3.11.4 Front panel wiring .................................................................................................. 210
3.12 I-LINK-S unit................................................................................................................... 211
3.12.1 Description………………….. ................................................................................... 211
3.13 General user interfaces ................................................................................................... 214
3.13.1 Power Supply Card ................................................................................................. 214
3.13.2 Power Management Unit (PMU)............................................................................... 215
3.13.3 Housekeeping board (HK) ....................................................................................... 219
3.13.4 Rack Alarm Interface board (RAI) ............................................................................. 220
3.13.5 LAN-Q board…………….. ...................................................................................... 222
3.14 FANS unit....................................................................................................................... 224
3.14.1 FAN-CO unit………….. .......................................................................................... 224
3.14.2 FAN unit………. ..................................................................................................... 224
3.14.3 LEDs signification.................................................................................................... 225
MAINTENANCE ................................................................................................................ 227
4 MAINTENANCE .......................................................................................................... 228
4.1 Maintenance introduction................................................................................................ 228
4.1.1 General safety rules ................................................................................................ 228
4.1.2 General rules ......................................................................................................... 228
4.1.3 Maintenance - definitions ........................................................................................ 228
4.1.4 Instruments And Accessories.................................................................................... 229
4.2 Preventive maintenance .................................................................................................. 229
4.2.1 Routine maintenance every year .............................................................................. 229
4.2.2 Routine maintenance of fan filter ............................................................................. 229
4.3 Corrective maintenance (troubleshooting) ........................................................................ 230
4.4 Set of spare parts ........................................................................................................... 230
4.4.1 Suggested Spare Parts............................................................................................. 230
4.4.2 General rules on spare parts management .............................................................. 230
4.4.3 Particular rules on spare parts management ............................................................ 231
4.5 Operating advices .......................................................................................................... 231
4.6 Repair Form ................................................................................................................... 232
DISMANTLING & RECYLING............................................................................................. 234
5 DISMANTLING & RECYCLING .................................................................................... 235
5.1 WEEE general information .............................................................................................. 235
5.2 How to disassembly equipment ....................................................................................... 237
5.2.1 Waste codes detailed information............................................................................ 237
5.2.2 Tools necessary for disassembly .............................................................................. 242
5.2.3 Subrack disassembly............................................................................................... 242
5.2.4 Unit disassembly..................................................................................................... 249
5.2.5 Hazardous materials and components ..................................................................... 255
5.3 Eco declaration .............................................................................................................. 257
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FIGURES
Figure 1 Labels for units with stiffening bar...........................................................................36

Figure 2 Labels for units without stiffening bar ......................................................................37
Figure 3 Label identifying label on catalogue .......................................................................37
Figure 4 Label specifying serial No. .....................................................................................37
Figure 5 Labels on the SFP ..................................................................................................38
Figure 6 SFP label description ..............................................................................................38
Figure 7 SFP label example .................................................................................................38
Figure 8 CE label ................................................................................................................38
Figure 9 WEEE label............................................................................................................38
Figure 10 Electrostatic label...................................................................................................39
Figure 11 Labels on shelf ......................................................................................................39
Figure 12 1692MSE R3.2A in line terminal configuration ........................................................51
Figure 13 1692MSE R3.2A in OADM configuration ................................................................52
Figure 14 1692MSE R3.2A in back to back terminal configuration...........................................53
Figure 15 1692MSE R3.2A in regenerator configuration .........................................................53
Figure 16 Block diagram of CPE ............................................................................................53
Figure 17 1692MSE in ring networks .....................................................................................54
Figure 18 1692MSE in point to point configuration .................................................................54
Figure 19 1692MSE in ring networks with CPE .......................................................................55
Figure 20 1692MSE in point to point links with CPE ................................................................55
Figure 21 Functional synopsis in unidirectional Line Terminal configuration .............................56
Figure 22 Functional synopsis in bi-directional Line Terminal configuration ..............................57
Figure 23 Functional synopsis in unidirectional OADM configuration .......................................57
Figure 24 Functional synopsis in bi-directional OADM configuration........................................58
Figure 25 Functional synopsis in regenerator configuration (use MUX/DMUX) ..........................59
Figure 26 Functional synopsis in regenerator configuration (use OADM)..................................59
Figure 27 One-channel CPE configuration .............................................................................60
Figure 28 Two-channel CPE configuration ..............................................................................60
Figure 29 Transponder function.............................................................................................61
Figure 30 TDM concentration function....................................................................................62
Figure 31 CWDM MUX side...................................................................................................63
Figure 32 8:1 MUX used as MUX/DMUX ................................................................................63
Figure 33 CWDM DMUX side ................................................................................................63
Figure 34 1 ch Add/drop function in unidirectional transmission .............................................64
Figure 35 2 ch Add/drop function in unidirectional transmission .............................................64
Figure 36 1 ch add/drop function in bi-directional transmission ..............................................65
Figure 37 4 ch add/drop function ..........................................................................................65
Figure 38 1310nm circulator .................................................................................................66
Figure 39 1310nm broadband filter ......................................................................................66
Figure 40 Optical supervisory channel management in line terminal and OADM configuration.66
Figure 41 OMSP application without OADM...........................................................................67
Figure 42 OMSP application with OADM ...............................................................................67
Figure 43 SNCP in a ring network..........................................................................................68
Figure 44 Electrical SNCP......................................................................................................68
Figure 45 Optical SNCP ........................................................................................................69
Figure 46 BSNCP+EPS using two WLA3C...............................................................................69
Figure 47 C-4xANY with O-SNCP (use WLA-P) .......................................................................70
Figure 48 C-4xANY with O-SNCP (use OMSP)........................................................................70
Figure 49 C-4xANY with E-SNCP ...........................................................................................70
Figure 50 16 channels upgradable ........................................................................................71
Figure 51 Four compact shelves used in a NE (front view) .......................................................72
Figure 52 One CO shelf used in a NE (front view) ..................................................................73
Figure 53 An example for slot allocations in unidirectional application (only WLA)....................81
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Figure 54 An example for slot allocations in unidirectional application (using compact shelves,
only C-4xANY)...................................................................................................................82
Figure 55 An example for slot allocations in unidirectional application (using CO shelves, only
C-4xANY)..........................................................................................................................83
Figure 56 An example for slot allocations in unidirectional application (using CO shelves, mixed
WLA and C-4xANY) ...........................................................................................................84
Figure 57 Slot allocations in bi-directional application ............................................................85
Figure 58 An example for slot allocations in unidirectional OADM application (1 channel
add/drop) .........................................................................................................................85
Figure 59 An example for slot allocations in unidirectional OADM application (2 channels
add/drop) .........................................................................................................................86
add/drop) .........................................................................................................................86
Figure 61 An example for slot allocations in bi-directional OADM application..........................87
Figure 62 An example for slot allocations in regenerator applications (MUX/DMUX).................88
Figure 63 An example for slot allocations in regenerator application (OADM)..........................89
Figure 64 An example for slot allocations in one-channel CPE application ...............................90
Figure 65 An example for slot allocations in two-channel CPE application................................90
Figure 66 1692MSE input power stage (same as PSC2) ..........................................................92
Figure 67 Equipment and shelf control...................................................................................93
Figure 68 Climatogram for hazard level 1.2: no temperature controlled storage location .........97
Figure 69 Climatogram for hazard level 3.2: partly temperature controlled locations ...............99
Figure 70 Rack description ..................................................................................................101
Figure 71 Shelf organization................................................................................................102
Figure 72 Shelf front view with cover ....................................................................................102
Figure 73 Shelf dimensions .................................................................................................103
Figure 74 1692MSE single shelf...........................................................................................103
Figure 75 1692 MSE compact shelf mechanical structure ......................................................104
Figure 76 Shelf dimension and shelf partitioning ..................................................................104
Figure 77 ESC-LC front view................................................................................................105
Figure 78 LAN-Q board front view.......................................................................................105
Figure 79 PSC2 board front view .........................................................................................105
Figure 80 FAN board front view...........................................................................................105
Figure 81 FAN-CO board example......................................................................................105
Figure 82 OSC board front view ..........................................................................................106
Figure 83 OMSP board front view........................................................................................106
Figure 84 WLA3C board front view ......................................................................................106
Figure 85 WLA3COP board front view .................................................................................106
Figure 86 OCC10-NA board front view ...............................................................................106
Figure 87 2XGE-FC board front view ...................................................................................106
Figure 88 C-OAD-E-U-1-6161-S board front view................................................................106
Figure 89 C-OAD2-E-U-4-55575961-S board front view......................................................106
Figure 90 C-MDX-E-U-S board front view.............................................................................106
Figure 91 C-4xANY board front view ...................................................................................106
Figure 92 HK board front view.............................................................................................107
Figure 93 RAI board front view ............................................................................................107
Figure 94 I-LINK-S board front view .....................................................................................107
Figure 95 LC optical connectors...........................................................................................110
Figure 96 LC optical connectors...........................................................................................110
Figure 97 MU optical connectors .........................................................................................111
Figure 100 Block diagram of WLA3C boards .........................................................................116
Figure 101 Block diagram of WLA3COP boards.....................................................................117
Figure 102 Add and drop matrix configuration.......................................................................120
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Figure 103 Local loopback matrix configuration .....................................................................120
Figure 104 Remote loopback matrix configuration ..................................................................121
Figure 105 Local-remote loopback matrix configuration .........................................................121
Figure 106 Electrical SNCP matrix configuration .....................................................................122
Figure 107 Optical SNCP matrix configuration .......................................................................123
Figure 108 B-SNCP matrix configuration in one WLA3C .........................................................124
Figure 109 Front panel of WLA3C board ...............................................................................125
Figure 110 Front panel of WLA3COP board...........................................................................126
Figure 111 Block diagram of OCC10 board ..........................................................................128
Figure 112 Add/Drop configuration of OCC10 board ............................................................129
Figure 113 Client loopback configuration of OCC10 board....................................................130
Figure 114 Line loopback configuration of OCC10 board ......................................................130
Figure 115 Front panel of OCC10 board...............................................................................132
Figure 116 Block diagram of 2XGE-FC board ........................................................................134
Figure 117 Communication between two 2XGE-FC board (example) .......................................135
Figure 118 Local loopback configuration of 2XGE-FC board...................................................135
Figure 119 Remote loopback configuration of 2XGE-FC board ...............................................135
Figure 120 Front panel of 2XGE-FC board.............................................................................136
Figure 121 C-MDX-E-U-S block diagram ...............................................................................138
Figure 122 Front panel of C-MDX-E-U-S board ......................................................................140
Figure 123 C-MDX-U block diagram .....................................................................................142
Figure 124 Front panel of C-MDX-U board ............................................................................144
Figure 125 C-MDX-B-S block diagram ...................................................................................146
Figure 126 Front panel of C-MDX-B-S board..........................................................................147
Figure 127 C-MDX-B block diagram ......................................................................................149
Figure 128 Front panel of C-MDX-B board.............................................................................150
Figure 129 C-MDX2-E-U-S block diagram .............................................................................152
Figure 130 C-MDX2-U block diagram ...................................................................................153
Figure 131 C-MDX2-E-1-S block diagram..............................................................................154
Figure 132 Front panel of C-MDX2-E-1-S board ....................................................................155
Figure 133 C-MDX2-E-2-XX-S block diagram .........................................................................157
Figure 134 Front panel of C-MDX2-E-2-XX-S board................................................................159
Figure 135 C-OAD-E-U-1-XX-S block diagram.......................................................................161
Figure 136 Front panel of C-OAD-E-U-1-XX-S board..............................................................163
Figure 137 C-OAD-U-1-XX block diagram.............................................................................165
Figure 138 Front panel of C-OAD-U-1-XX board....................................................................166
Figure 139 C-OAD-E-U-2-XXXX-S block diagram ...................................................................168
Figure 140 Front panel of C-OAD-E-U-2-XXXX-S board ..........................................................170
Figure 141 C-OAD-U-2-XXXX block diagram .........................................................................172
Figure 142 Front panel of C-OAD-U-2-XXXX board ................................................................173
Figure 143 C-OAD-B-1-XX-S block diagram ..........................................................................175
Figure 144 Front panel of C-OAD-B-1-XX-S board .................................................................177
Figure 145 C-OAD-B-1-XX block diagram .............................................................................179
Figure 146 Front panel of C-OAD-B-1-XX board ....................................................................180
Figure 147 C-OAD2-E-U-1-XX-S block diagram.....................................................................182
Figure 148 C-OAD2-U-1-XX block diagram...........................................................................184
Figure 149 C-OAD2-E-U-2-XXXX-S block diagram .................................................................185
Figure 150 C-OAD2-U-2-XXXX block diagram .......................................................................186
Figure 151 C-OAD2-E-U-4-XXXXXXXX-S block diagram ..........................................................187
Figure 152 Front panel of C-OAD2-E-U-4-XXXXXXXX-S board.................................................189
Figure 153 C-OAD2-U-4-XXXXXXXX block diagram ................................................................191
Figure 154 Front panel of C-OAD2-U-4-XXXXXXXX board.......................................................193
Figure 155 Front panel of ESC-LC board ...............................................................................196
Figure 156 C-4xANY block diagram ......................................................................................198
Figure 157 VC-4 allocation ...................................................................................................199
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Figure 158 Front panel of C-4xANY board.............................................................................204
Figure 159 OSC board in Line Terminal configuration ............................................................206
Figure 160 OSC board in OADM or back to back configuration .............................................207
Figure 161 Front panel of OSC board ...................................................................................208
Figure 162 OMSP block diagram...........................................................................................209
Figure 163 Front panel of OMSP board .................................................................................210
Figure 164 I-LINK-S block diagram........................................................................................211
Figure 165 Front panel of I-LINK-S board ..............................................................................212
Figure 166 PMU cabling scheme ...........................................................................................215
Figure 167 PMU block diagram.............................................................................................216
Figure 168 Minimum configuration of the batteries in 1692MSE R3.0, rack version ..................217
Figure 169 Maximum configuration of the batteries in 1692MSE R3.0, table version ................217
Figure 170 PMU front panel ..................................................................................................217
Figure 171 Block diagram of control HK board ......................................................................219
Figure 172 Block diagram of RAI unit.....................................................................................220
Figure 173 Block diagram of control LAN-Q board ................................................................222
Figure 174 LAN-Q board settings ..........................................................................................223
Figure 175 Fan shelf description and rack partitioning............................................................224
Figure 176 FAN description and Shelf partitioning ..................................................................224
Figure 177 Repair form .........................................................................................................232
Figure 178 Put on the market date.........................................................................................236
Figure 179 Waste code interpretation ....................................................................................237
Figure 180 Subrack front view ...............................................................................................242
Figure 181 Subrack rear view ................................................................................................242
Figure 182 Top cover removing .............................................................................................243
Figure 183 Back cover removing ...........................................................................................244
Figure 184 Back board removing ..........................................................................................245
Figure 185 Guides removing .................................................................................................246
Figure 186 Dummy front panels and fixing bars removing ......................................................247
Figure 187 Side wall removing ..............................................................................................248
Figure 188 Unit view .............................................................................................................249
Figure 189 Bottom cover removing ........................................................................................250
Figure 190 Levers removal ....................................................................................................251
Figure 191 Front panel, fibers and gasket removing ...............................................................252
Figure 192 Heat sink removing..............................................................................................253
Figure 193 Barket removing ..................................................................................................254
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TABLES
Table 1 Handbooks related to the product’s hardware.........................................................15

Table 2 Handbook related to the specific product SW management and local product control ...
............................................................................................................................15
Table 3 Handbooks common to Alcatel network elements using 1320CT Rel.3.x platform .....16
Table 4 Documentation on CD-ROM ..................................................................................16
Table 5 Handbook configuration check...............................................................................18
Table 6 References and standards ......................................................................................22
Table 7 IEC 950 -Table 16: Over-temperature limits, Part 2.................................................32
Table 8 Label references ....................................................................................................35
Table 9 Frequency conversion of CWDM wavelengths .........................................................49
Table 10 Relationship between protection and network application ........................................56
Table 11 Shelf and boards designation and reference ...........................................................73
Table 12 Slot allocations for compact shelves in 1692MSE release 3.2A .................................78
Table 13 Slot allocations for CO shelf in 1692MSE release 3.2A ............................................79
Table 14 Wavelength combination for unidirectional application............................................86
Table 15 Wavelength combination for unidirectional application............................................86
Table 16 Wavelength combination for a bi-directional application .........................................87
Table 17 Valid tests and compliance criteria for immunity ......................................................95
Table 18 Requirements for RF emission .................................................................................95
Table 19 Main climatic conditions.........................................................................................97
Table 20 Main climatic conditions.........................................................................................98
Table 21 Main climatic conditions.......................................................................................100
Table 22 Maximum power consumption of the units ............................................................108
Table 23 Estimated maximum power consumption of the equipment ....................................108
Table 24 FIT of 1692 MSE..................................................................................................109
Table 25 Optical connections in 1692MSE ..........................................................................110
Table 26 Connector access ................................................................................................112
Table 27 Pins SUB-D connect access...................................................................................113
Table 28 Pins RJ11 connector access ..................................................................................113
Table 29 RJ 45 connector access ........................................................................................114
Table 33 Power supply 1 and 2: connector access ...............................................................115
Table 34 Optical parameters for SFP transceivers used in the user side.................................118
Table 35 Optical parameters for SFP transceivers used in the line side..................................119
Table 36 Alarms usage in add and drop configuration ........................................................119
Table 37 Alarms usage in the auto E-SNCP configuration ....................................................122
Table 38 Alarms usage in the auto O-SNCP configuration ...................................................123
Table 39 Alarms usage in the auto B-SNCP configuration ....................................................123
Table 40 Front panel wiring of WLA3C board .....................................................................127
Table 41 Front panel wiring of WLA3COP board.................................................................127
Table 42 Meaning of WLA board front panel LEDs ..............................................................127
Table 43 OCC10-NA optical characteristics ........................................................................131
Table 44 OCC10-EC optical characteristics ........................................................................131
Table 45 Front panel wiring of OCC10 board.....................................................................133
Table 46 Meaning of OCC10 board front panel LEDs .........................................................133
Table 47 Front panel wiring of 2XGE-FC board...................................................................137
Table 48 Meaning of 2XGE-FC board front panel LEDs .......................................................137
Table 49 C-MDX-E-U-S optical characteristics .....................................................................139
Table 50 Front panel wiring of C-MDX-E-U-S board ............................................................141
Table 51 Meaning of C-MDX-E-U-S board front panel LEDs.................................................141
Table 52 C-MDX-U optical characteristics ...........................................................................143
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Table 53 Front panel wiring of C-MDX-U board ..................................................................145
Table 54 Meaning of C-MDX-U board front panel LEDs.......................................................145
Table 55 C-MDX-B-S optical characteristics .........................................................................146
Table 56 Front panel wiring of C-MDX-B-S board................................................................148
Table 57 Meaning of C-MDX-B-S board front panel LEDs ....................................................148
Table 58 C-MDX-B optical characteristics ............................................................................149
Table 59 Front panel wiring of C-MDX-B board...................................................................151
Table 60 Meaning of C-MDX-B board front panel LEDs .......................................................151
Table 61 C-MDX2-E-1-S optical characteristics....................................................................154
Table 62 Front panel wiring of C-MDX2-E-1-S board ..........................................................156
Table 63 Meaning of C-MDX2-E-1-S board front panel LEDs ...............................................156
Table 64 Optical parameter of C-MDX2-E-2-XX-S ...............................................................158
Table 65 Front panel wiring of C-MDX2-E-2-XX-S board......................................................160
Table 66 Meaning of C-MDX2-E-2-XX-S board front panel LEDs ..........................................160
Table 67 1-channel C-OAD module for unidirectional application .......................................162
Table 68 C-OAD-E-U-1-XX-S optical characteristics.............................................................162
Table 69 Front panel wiring of C-OAD-E-U-1-XX-S board ...................................................164
Table 70 Meaning of C-OAD-E-U-1-XX-S board front panel LEDs ........................................164
Table 71 C-OAD-U-1-XX optical characteristics...................................................................165
Table 72 Front panel wiring of C-OAD-U-1-XX board .........................................................167
Table 73 Meaning of C-OAD-U-1-XX board front panel LEDs ..............................................167
Table 74 2-channel C-OAD modules for unidirectional applications.....................................169
Table 75 C-OAD-E-U-2-XXXX-S optical characteristics .........................................................169
Table 76 Front panel wiring of C-OAD-E-U-2-XXXX-S board................................................171
Table 77 Meaning of C-OAD-E-U-2-XXXX-S board front panel LEDs ....................................171
Table 78 C-OAD-U-2-XXXX optical characteristics ...............................................................172
Table 79 Front panel wiring of C-OAD-U-2-XXXX board ......................................................174
Table 80 Meaning of C-OAD-U-2-XXXX board front panel LEDs ..........................................174
Table 81 C-OAD modules for bi-directional application ......................................................175
Table 82 C-OAD-B-1-XX-S optical characteristics ................................................................176
Table 83 Front panel wiring of C-OAD-B-1-XX-S board .......................................................178
Table 84 Meaning of C-OAD-B-1-XX-S board front panel LEDs............................................178
Table 85 C-OAD-B-1-XX optical characteristics ...................................................................179
Table 86 Front panel wiring of C-OAD-B-1-XX board ..........................................................181
Table 87 Meaning of C-OAD-B-1-XX board front panel LEDs...............................................181
Table 88 1-channel C-OAD2 module for unidirectional application .....................................183
Table 91 Add & Drop Channels Sequence ..........................................................................188
Table 92 C-OAD2-E-U-4-XXXXXXXX-S board optical characteristics ......................................188
Table 93 Front panel wiring of C-OAD2-E-U-4-XXXXXXXX-S board.......................................190
Table 94 Meaning of C-OAD2-E-U-4-XXXXXXXX-S board front panel LEDs ...........................190
Table 95 4-channel C-OAD2 modules for unidirectional application ....................................191
Table 96 Add & Drop channels Sequence ...........................................................................192
Table 97 C-OAD2-U-4-XXXXXXXX board optical characteristics ............................................192
Table 98 Front panel wiring of C-OAD2-U-4-XXXXXXXX board.............................................194
Table 99 Meaning of C-OAD2-U-4-XXXXXXXX board front panel LEDs .................................194
Table 100 Front panel connectors of the ESC board ..............................................................197
Table 101 Meaning of ESC front panel LEDs signification ......................................................197
Table 102 Relation between alarm severity terminology displayed on C.T./O.S. and alarm severity
terminology used for the ESC-LC LEDs and ETSI market rack (TRU).....................................197
Table 103 Allowed drawers association in each 2xANY .........................................................200
Table 104 Client Data Type configuration for drawer.............................................................201
Table 105 User Rx specification 1310nm ..............................................................................201
Table 106 User Rx specification 1310nm ..............................................................................202
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Table 107 User Rx specification (850nm) ..............................................................................202
Table 108 User Tx specification (850nm) ..............................................................................203
Table 109 Meaning of C-4xANY card front panel LEDs .........................................................205
Table 110 Rx specification ....................................................................................................207
Table 111 Tx specification ....................................................................................................207
Table 112 Meaning of OSC board front panel LEDs ..............................................................208
Table 113 Absolute maximum ratings ...................................................................................209
Table 114 Front panel wiring of OMSP board .......................................................................210
Table 115 Meaning of OMSP board front panel LEDs............................................................210
Table 116 Front panel connectors of the I-LINK-S board ........................................................213
Table 117 Meaning of I-LINK-S front panel LEDs signification ................................................213
Table 118 Meaning of Power Supply Card LEDs signification .................................................214
Table 119 Meaning of PMU LEDs signification.......................................................................218
Table 120 Meaning of HK board LEDs signification ...............................................................219
Table 121 Meaning of RAI board LEDs signification...............................................................221
Table 122 Meaning of LAN-Q board LEDs signification .........................................................223
Table 123 Meaning of FAN/FAN-CO board LEDs signification...............................................225
Table 124 Items waste codes list ...........................................................................................238
Table 125 List of hazardous materials and components present in the equipment ...................255
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HANDBOOK GUIDE
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1 HANDBOOK STRUCTURE AND CONFIGURATION CHECK
1.1 General information
ALCATEL makes no warranty of any kind with regards to this manual, and specifically disclaims the
implied warranties of merchantability and fitness for a particular purpose. ALCATEL will not be liable
for errors contained herein or for damages, whether direct, indirect, consequential, incidental, or
special, in connection with the furnishing, performance, or use of this material.
NOTICE
The product specification and/or performance levels contained in this document are for information
purposes only and are subject to change without notice. They do not represent any obligation on the
part of ALCATEL.
COPYRIGHT NOTIFICATION
The technical information of this manual is the property of ALCATEL and must not be copied,
reproduced or disclosed to a third party without written consent.
1.2 Handbook applicability
This handbook applies to the following product-release:
Product Release Version ANV P/N Factory P/N

1692MSE 3.2A 01 3AL 97502 CCAA
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1.3 Product-release handbooks
The list of handbooks given here below is valid on the issue date of this
Handbook and
Some of the handbooks listed here below may not be available on the issue
date of this Handbook.
The standard Customer Documentation in the English language for the equipment whose
product-release-version is stated on the manual’s front page consists of the following handbooks:
Table 1 Handbooks related to the product’s hardware

Factory This
Ref Handbook ANV Part No.
Part No. HDBK
1692MSE Rel.3.2A
3AL 97869 AAAA
Technical Handbook
[1]
Provides information regarding Equipment description, Maintenance,
Hardware setting documentation.
1692MSE Rel.3.2A
3AL 97869 ABAA
Installation Handbook
[2] Provides step by step procedural instructions for unpacking, inspecting,
Alcatel Part Number, assembling, mounting and wiring bays, sub-frames,
I/O panels, ancillary items, and cabling.
1692MSE Rel.3.2A
Turn-up & Commissioning 3AL 97869 ACAA
Handbook
[3]
Provides procedures to support visual inspection, module installation,
Alcatel Part Number and provisioning; and local network element
verification tests and generic network tests.
Table 2 Handbook related to the specific product SW management and local product control
Factory This
Part No. HDBK
1692MSE Rel.3.2A
3AL 97869 ADAA
[4] Operator’s Handbook
Provide information regarding maintenance using the craft terminal.
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Table 3 Handbooks common to Alcatel network elements using 1320CT Rel.3.x platform
Factory This
Part No. HDBK
1320CT Rel.3.x
3AL 79551 AAAA
Basic Operator’s Handbook
[5]
Provides general information and operational procedures common to all
1320CT(Craft terminal) of Alcatel Info-Model Network Elements.
1330AS Rel.6.5
3AL 88876 AAAA
Operator’s Handbook
[6]
Provides detailed information and operational procedures regarding the
alarm Surveillance software embedded in the 1320CT software package.
ELB Rel.2.x Operator’s Handbook 3AL 88877 AAAA
[7] Provides detailed information and operational procedures regarding the
Event Log Management software embedded in the 1320CT software
package.
Table 4 Documentation on CD-ROM

Factory This
Part No. HDBK
1692MSERel.3.2A CD-ROM-DOC EN 3AL 97869 AEAA
[8] Contains, in electronic format, the following handbooks: REF. [1] to [4]
Envisaged after the release of all handbooks
1320CT Rel.3.x CD-ROM-DOC EN 3AL 79552 AAAA
[9] Contains, in electronic format, the following handbooks: REF. [5] to [7]
Envisaged after the release of all handbooks
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1.4 Handbook Structure
This handbook has been edited according to the suggestions given by the ”Code Of Practice” for
Instruction Handbooks issued by the European Broadcasting Union (EBU RECC. R29/82).
This handbook is divided into the following main topics as described in the table of contents:
HANDBOOK GUIDE: This section gives information on the whole handbook application,
composition and evolution. Moreover it lists the handbooks that the
Operator should have in order to carry out the tasks allowed by the
specific product-release this handbook refers to. It contains general
information on safety norms, EMC and type of labels that might be
affixed to the equipment.
DESCRIPTION: It contains all the equipment’s general and detailed system features
including its application in the telecommunication network.
Furthermore, it supplies the equipment description and
specifications (i.e., system, mechanical, electrical and/or optical).
MAINTENANCE: It contains all the details for periodic checks, fault location and
repair procedures and restoration to normal operation through the
removal of faulty units and their replacement with spares.
DISMANTLING & RECYLING: It contains information for subrack/units dismantling and recycling,
list of hazardous materials and waste code.
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1.5 Handbook configuration check
1.5.1 List of the editions and modified parts
The following table indicates the handbook parts new or modified with respect to the previous edition.
Legend
“N” =New part

“M” =Modified part
“” =Not changed
Table 5 Handbook configuration check
R1.0 R1.1 R1.2A R1.2A1 R1.4 R3.0 R3.1 R3.2A
EDITION
01 01 01 01 01 01 01 01
DESCRIPTIONS N M M M M M M M
1 FUNCTIONAL DESIGN N M M M M M M
2 MECHANICAL DESCRIPTION N M M M M M
3 UNITS DESCRIPTION N M M M M M M
MAINTENANCE N M M M M
4 MAINTENANCE N M M M M
DISMANTLING & RECYCLING N M
5 DISMANTLING & RECYCLING N M
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1.5.2 Notes on Release 1.0 ED.01
Release 1.0 Ed.01, created on May 15th, 2003, is the first validated and officially released issue.
This document contains the technical documentation and the user manual for the 1692MSE release
1.0.
Release 1.1 ED.01, created on January 3rd, 2004, is the third validated and officially released issue
for 1692MSE system.
1.1.
The release 1.1 contains the same features contained in 1.0A3, plus the following features:
Intershelf link master and intershelf link slave management

New Wavelength adapter management
New OMDX and OADM management
Multi-shelves managed as one NE
B&W SFP module used in C-4xANY
Performance monitoring
Back to back configuration as 1 NE
Security management
MIB Backup & Restore
Alarm Severity configurability
The following contents have been modified compared to Release 1.0A3:
Configuration in Operator’s handbook

Alarm handling in Operator’s handbook
Function design and system configuration in technical handbook
1.5.4 Notes on Release 1.2A ED.01
Release 1.2A ED.01, created on August 10th, 2004, is the fourth validated and officially released
issue for 1692MSE system.
1.2A.
The release 1.2A contains the same features contained in the release 1.1, plus the following features:
The application of low cost WLA (named as WLA1A)

The application of Centre Office shelf (for short: CO shelf)
Laser forced on/off
WEEE information
The following contents have been modified compared to Release 1.1:

Function design and system configuration in technical handbook
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1.5.5 Notes on Release 1.2A1 ED.01
Release 1.2A1 ED.01, created on December 10th, 2004, is a new validated and officially released
issue for 1692MSE system.
1.2A1.
The release 1.2A1 contains the same features contained in the release 1.2A, plus the following
features:
The application of B-SNCP

The application of user defined SFP
The following contents have been modified compared to release 1.2A:
Functional design
Operator’s handbook
Release 1.4 ED.01, created on March 10th, 2005, is a new validated and officially released issue for
1692MSE system.
1.4.
The release 1.4 contains the same features contained in the release 1.2A1, plus the following
features:
Abnormal conditions List (Protection, Loopback and Laser State)

Editing field (39 bytes long) for all the SFP
Display indication about main and spare ports of protection
Loopback warning message for adding/removing confirmation
The application of WLA2 in CO shelf
The following contents have been modified compared to release 1.2A1:
About the Graphical User Interface in Operator’s handbook

Alarm handling in Operator’s handbook
Release 3.0 ED.01, created on September 6th, 2005, is the first validated and officially released issue
for 1692MSE system.
3.0.
The release 3.0 contains the same features contained in the release 1.4, plus the following features:
Support SFP modules with DDM function on WLA1A(-P) and WLA2(-P).

Security management
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16 ch upgradable
ESC-LC replace ESC
Light RM management
The following contents have been modified compared to release 1.4:
Mechanical and Unit description in Technical handbook

Release 3.1 ED.01, created on April 6th, 2006, is the first validated and officially released issue for
1692MSE system.
This document contains the technical documentation for the 1692MSE release 3.1.
The release 3.1 contains the same features contained in the release 3.0, plus the following features:
Support 10 GbE signal transmission

Introduce new SFPs and board
The following contents have been updated compared to release 3.0:
Unit description
Optical parameter for units
1.5.9 Notes on Release 3.2A ED.01
Release 3.2A ED.01, created on July 6th, 2006, is the first validated and officially released issue for
1692MSE system.
This document contains the technical documentation for the 1692MSE release 3.2A.
The release 3.2A contains the same features contained in the release 3.1, plus the following features:
SDH B1 PM is supported on the line side of C-4xANY board

Introduce new items: L16.1, L16.2 and a SDH/SONET drawer
Introduce new boards: PSC3, 2XGE-FC, WLA3C and WLA3COP
The SDH/SONET drawer (P/N. 3AL86673AA**), C-WLA1(-P), C-WLA1a(-P) and C-WLA2-M(-P) are
cancelled in this release.
The following contents have been updated compared to release 3.1:
Unit description
Optical parameter for units
Performance monitoring description
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2 COMPLIANCE WITH EUROPEAN NORMS.
Table 6 References and standards

Ref. Standard document Date Description
[1] ITU-T Recommendation G.652 04/97 Characteristics of single mode optical fiber cable
[2] ITU-T Recommendation G.653 04/97 Characteristics of dispersion shifted optical fiber cable
[3] ITU-T Recommendation G.654 04/97 Characteristics of a cut-off shifted single mode optical fiber cable
[4] ITU-T Recommendation G.655 10/96 Characteristics of non-zero dispersion shifted optical fiber cable
[5] ITU-T Recommendation G.664 03/99 Optical safety procedures and requirements for optical transport systems
[6] Functional characteristics of inter-office and long-haul line systems using
ITU-T Recommendation G.681 10/96
optical amplifiers, including optical multiplexing
[7] Optical interfaces for single channel SDH systems with optical amplifiers,
and STM-64 systems
[8] ITU-T Recommendation G.692 10/98 Optical interfaces for multi-channel systems with optical amplifiers
[9] Optical interfaces for coarse wavelength division multiplexing
applications.
[10] ITU-T Recommendation G.671 01/2005 Transmission characteristics of optical components and subsystems.
[11] ITU-T Recommendation

Network node interface for the optical transport network
G.709-DRAFT
[12] ITU-T Recommendation Characteristics of optical transport network hierarchy: equipment

06/99
G.798-DRAFT functional blocks
[13] ITU-T Recommendation G.805 11/95 Generic functional architecture of transport networks
[14] ITU-T Recommendation G.813 08/96 Timing characteristics of SDH equipment slave clocks (SEC)
[15] The control of jitter and wander within digital networks which are based
on the synchronous digital hierarchy (SDH)
[16] ITU-T Recommendation
Framework for Optical Networking Recommendations
G.871-DRAFT
[17] ITU-T Recommendation G.872 02/99 Architecture of Optical Transport Networks
[18] ITU-T Recommendation G.873-

03/99 Optical Transport Networks requirements
DRAFT
[19] ITU-T Recommendation G.874-

06/99 Management aspect of the optical transport network element
DRAFT
[20] ITU-T Recommendation G.694.2 05/02 Spectral Grids for WDM Applications: CWDM Wavelength Grid
[21] Optical interfaces for equipment and systems relating to the
Synchronous Digital Hierarchy
[22] Digital line systems based on the Synchronous Digital Hierarchy for use
on optical fiber cables
[23] ITU-T Recommendation G.959.1 Optical network physical node interface
[24] Environmental conditions and environmental tests for
ETS 300 019-1-1 05/94
telecommunication equipment
[25] ETS 300 119 01/94 European Telecommunication Standards for Equipment Practice
[26] Transmission and multiplexing: Optical interfaces for equipment and
ETS 300 232 A1 06/93
systems relating to the Synchronous Digital Hierarchy
[27] Public Telecommunication Network Equipment - Electro-Magnetic
ETS 300 386 12/94
Compatibility Requirements
[28] Safety of Laser Products - Equipments classifications, requirements and
IEC 825-1 08/93
user's guide
[29] IEC 950 04/99 Safety of Information Technology Equipments
[30] Carrier sense multiple access with collision detection (CSMA/CD) access
IEEE802.3 98
method and physical layer specifications
[31] Network Equipment - Building System (NEBS) Requirements: Physical
GR - 63 - CORE 10/95
Protection
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[32] Electromagnetic Compatibility and Electrical Safety - Generic Criteria for
GR - 1089 - CORE 10/97
Network Telecommunication Equipment
[33] Synchronous Optical Network (SONET) Transport Systems: Common
GR - 253 - CORE 02/99
Generic Criteria
[34] Television - Bit Serial Digital Interface for High-Definition Television
SMPTE 292M-1998 98
Systems
[35] SMPTE RP184-1996 96 Specification of Jitter in Bit-Serial Digital Systems
[36] T11/98 - 055 98 Fiber Channel - Methodologies for Jitter Specification
2.1 Electromagnetic Compatibility (EMC)
The CE markings printed on the product denote compliancy with the following Directives:
89/336/EEC of May 3rd, 1989 (EMC directives), amended:

By the 92/31/EEC Directive issued on April 28Th, 1992
By the 93/68/EEC Directive issued on July 22Nd, 1993
Compliancy to EMC Norms is claimed in that the equipment satisfies standardized Norms
Issue requisites: EN 55022 “Limits and methods and measurement of radio disturbance
characteristics of information technology equipment”, August 1994 edition.
Compliancy Class: B
Immunity requisites: EN 50082-1 “Electromagnetic compatibility-Generic immunity standard,
Part 1: Residential, commercial and light industry”, January 1992 edition.
The equipment operates in the following environment: Telecommunication center.
WARNING
This is a class B product. In domestic, residential and light industry environments, this product may
cause radio interference in which case the user may be required to take adequate measures.
2.2 Safety
Compliancy to Safety Norms is claimed in that the equipment satisfies standardized Norms:
IEC 60950 (1993) +A1 +A2 +A3 + A4
2.3 Environmental constraints
Compliancy to Environmental Norms is claimed in that the equipment satisfies standardized Norms:
ETS 300 019-1-2 1992, hazard level 1.2: Storage

ETS 300 019-1-1 1992, hazard level 2.2: Transportation
ETS 300 019-1-3 1992, hazard level 3.2: Climatic
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3 SAFETY NORMS AND LEBELS
3.1 First aid for electric shock
Do not touch the victim with bare hands until the circuit has been opened.
Open the circuit by switching off the line switches. If that is not possible, protect yourself with dry
material and free the victim from the conductor.
ARTIFICIAL RESPIRATION
It is important to start mouth-to-mouth resuscitation at once and seek medical help immediately.
TREATMENT OF BURNS
This treatment should be used after the victim has regained consciousness. It can also be employed
while the artificial respiration is being applied (in this case there should be at least two persons
present).
WARNING:
Do not attempt to remove his clothing from the burnt parts.
Apply dry gauze on the burns.
Do not apply ointments or other oily substances.
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Mouth to mouth resuscitation method
Lie the victim supine with his arms parallel with the body. If the victim is lying on an inclined
1 plane, make sure that his stomach is slightly lower than his chest. Open the victim’s mouth
and check that there are no extraneous objects in his mouth (dentures, chewing-gum etc.).
Kneel beside the victim level with his head. Put a hand under
the victim’s head and one under his neck (see fig.) Lift the
2
victim’s head and let it recline backwards as far as
possible
Shift the hand from the victim’s neck to his chin: place your
thumb between his chin and his mouth, the index finger his
jawbone, and keep the other fingers closed together (see
3
fig.). While performing these operations take a good supply
of oxygen by taking deep breaths with your mouth open.
With your thumb between the victim’s chin and mouth keep
4
his lips together and blow into his nasal cavities (see fig.)
While performing these operations observe if the victim’s

chest rises (see fig.) If not, it is possible that his nose is
blocked: in that case open the victim’s mouth as much as
possible by pressing on his chin with your hand, place your
lips around his mouth and blow into his oral cavity. Observe
5
if the victim’s chest heaves. This second method can be used
instead of the first while the victim’s nose is kept closed by
pressing the nostrils together using the hand you were
holding his head with. The victim’s head must be kept
sloping backwards as much as possible.
Start with ten rapid exhalations; hence continue at a rate of twelve/fifteen exhalations per
6 minute. Go on like this until the patient has regained consciousness, or until a doctor has
determined his death.
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3.2 Safety Rules
3.2.1 General rules
Before carrying out any installation, turn-on, tests & operation and maintenance functions
carefully read the relevant Handbooks and chapters.
Observe safety rules
While equipment is operating no one is allowed to have access to the equipment parts that
are protected by Cover Plate Shields that are removable with tools.
In the case of absolute need to have access to the equipment parts while it is operating. Only
service personnel are allowed such access. By service personnel or technical assistance it
means:
”Personnel which have adequate technical knowledge and experience necessary to be aware
of the danger that they might face in carrying out an operation and of the necessary measure
to reduce or minimize the danger to themselves and to others”.
The Service Personnel can only replace the faulty units with spare parts. The Service Personnel
are not allowed to repair: hence the access to the parts not specified is not prohibited.
The keys and/or the tools used to open doors or hinged covers to remove parts which give
access to compartments in which there are highly dangerous voltages present must belong
exclusively to the service personnel.
For the eventual cleaning of the external parts of the equipment, absolutely do not use any
inflammable substance, which in some way may alter the markings, inscriptions etc. It is
recommended to use a slightly damp cleaning cloth.
The Safety Rules stated in the handbook describe the operations and/or precautions to observe to
safeguard service personnel during the working phases and to guarantee equipment safety, i.e.,
not exposing persons, animals, and things to the risk of being injured/damaged.
Whenever the safety protection features have been impaired, REMOVE POWER.
To cut off power, switch off the power supply units as well as cut off the power station upstream
(rack or station distribution frame).
Unless fitted into the equipment, an external protection device on power supply will be provided
in the building installation. The breaking capacity of the device will be adequate to the maximum
short circuit current which can flow.
The safety rules described in this handbook are distinguished by the following symbol and
statement:
SAFETY RULES
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3.2.2 Labels indicating Danger, Forbiddance, Command
It is of utmost importance to follow the instructions printed on the labels affixed to the units and
assemblies.
The labels are fully compliant with International Norms ISO 3846-1984. The symbols or statements
are enclosed in geometric shapes: ISO 3864-1984.
CONTAINS A SYMBOL STATEMENT
INDICATES FORBIDDANCE (WHITE BACKGROUND

WITH RED RIM–BLACK SYMBOL OR STATEMENT)
IT IS A COMMAND (BLUE BACKGROUND–WHITE

SYMBOL OR STATEMENT).
CONTAINS A SYMBOL
INDICATES WARNING OR DANGER (YELLOW
BACKGROUND–BLACK SYMBOL AND RIM)
CONTAINS A STATEMENT PROVIDING

INFORMATION OR INSTRUCTION.
(YELLOW BACKGROUND–BLACK STATEMENT AND
RIM)
The labels have been affixed to indicate a dangerous condition. They may contain any
standard-known symbol or any statement necessary to safeguard users and service personnel against
the most common dangers, specifically:
Dangerous electrical voltages
Harmful optical signals
Risk of explosion
Moving mechanical parts
Heat-radiating mechanical parts
Pay attention to the information stated in the following, and proceed as instructed
The symbols presented in para.3.2.3 through 3.2.7 are all the possible symbols that could be
present on Alcatel equipment, but are not all necessarily present on the equipment this
handbook covers.
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3.2.3 Dangerous electrical voltages
3.2.3.1 Labeling
The following warning label is affixed next to dangerous voltages (>42.4 Vp; >60 Vdc).
If it is a Class 1 equipment connected to mains, then the label associated to it will state that the
equipment will have to be grounded before connecting it to the power supply voltage, e.g.:
WARNING!
Ground protect the equipment before
connecting it to mains
Make sure that power has been cut off
before disconnecting ground protection.
3.2.3.2 Electrical safety: general rules
DANGER! Possibility of personal injury: Carefully observe the specific

procedures for installation / turn-up and commissioning / maintenance of equipment parts where A.C.
or D.C. power is present, described in the relevant installation / turn-up and commissioning /
maintenance documents and the following general rules:
a) Personal injury can be caused by -48 V dc (or by 220 V ac if envisaged in the equipment). Avoid
touching powered terminals with any exposed part of your body.
b) Short circuiting, low-voltage, low-impedance, dc circuits can cause severe arcing that can result
in burns and/or eye damage. Remove rings, watches, and other metal jewelry before working with
primary circuits. Exercise caution to avoid shorting power input terminals.
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3.2.4 Harmful optical signals
3.2.4.1 Labeling
If the assembly or unit is fitted with a LASER, the labels must comply with the IEC 825-1-1993
International Norms.
The symbol indicates the presence of a LASER beam. Danger level is stated within a rectangular label:
If the LASER is a class 1 product, the label depicting the symbol within a triangle is not compulsory.
The rectangular shaped label bears all the information needed, i.e.:
LASER class
Power emitted
Wavelength
Ref. Norm
Precautionary measures taken depend on LASER class
Indications given on openings, panels and safety interlocks
CAUTION LASER RADIATION

DO NOT STARE INTO BEAM OR VIEW
LASER RADIATION WHEN OPEN DIRECTLY WITH OPTICAL INSTRUMENTS
DO NOT STARE INTO BEAM OR VIEW
DIRECTLY WITH OPTICAL INSTRUMENTS
CLASS 3A LASER PRODUCT
P.MAX=31m...... =1300mm. IEC 825 1993
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3.2.4.2 Optical safety: general rules
When handling optical equipments or units or cables always check that laser labels are properly
affixed and that the system complies with applicable optical standards.
DANGER! Possibility of eyes damage: Invisible infrared radiations

emitted by the fiber optic transmitters can cause eyes damage. Carefully observe the specific
procedures for installation / turn-up and commissioning / maintenance of units containing laser
devices or cables transporting optical signals, described in the relevant installation / turn-up and
commissioning / maintenance documents and the following general rules:
a) Laser radiation is not visible by the naked eye or with laser safety glasses. Although it cannot be
seen, laser radiation may be present.
b) Never look directly into a not terminated fiber optic connector or into a broken optical fiber cable,
unless it is absolutely known that no laser radiation is present.
c) Never look at an optical fiber splice, cable or connector, unless it is absolutely known that no
laser radiation is present.
d) All optical connectors, terminating either fibers or transmitters/receivers, are provided with
protective covers that must always be used, as soon as possible, when any optical link is
disconnected for installation/test/maintenance purposes or whatever operation.
e) Never look directly into a not terminated fiber optic connector or into a broken optical fiber cable
by means of magnifiers/microscopes, unless it is absolutely known that no laser radiation is
present. A magnifier/microscope greatly increases the damage hazard to the eyes.
f) Never point a not terminated optical fiber splice, cable or connector at other persons, unless it is
absolutely known that no laser radiation is present.
g) Always remove electrical power from near and far optical transmitters before disconnecting
optical links between the transmitter and the receiver.
h) Wearing of laser safety goggles or eye shields is recommended for every person working on
optical devices, whenever the above listed rules cannot be followed.
3.2.4.3 Optical safety: equipment specific data
Refer to para. 1.7.
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3.2.5 Risks of explosions
3.2.5.1 Labeling and safety instructions
This risk is present when batteries are used, and it is shown as the following label:
Therefore, slits or apertures are made to let air circulate freely and allow dangerous gasses to down
flow (battery-emitted hydrogen). A 417-IEC-5641 Norm. A compliant label is affixed next to it
indicating that the openings must not be covered up.
3.2.6 Moving mechanical parts
The following warning label is affixed next to fans or other moving mechanical parts:
Before carrying out any maintenance operation see that all the moving mechanical parts have
stopped.
3.2.7 Heat-radiating mechanical parts
The presence of heat-radiating mechanical parts is indicated by the following warning label in
compliancy with IEC 417 Norm, Fig.5041:
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As stated by IEC 60950 Norm, para.1.4.7, the touchable mechanical parts carrying the above
depicted warning label, are those whose temperature T exceeds the limits established by the
following formula (temperatures in ℃ ):
(T-Tamb) ＜(ΔTmax + 25°-Tmra)

Where:
T Temperature of the mechanical part measured at ambient temperature Tamb.
Tamb Ambient temperature during the test.
ΔTmax Value defined by IEC 950 Norm, Table 16 part 2a, para.5.1, and specified in the
table below.
Tmra The maximum room ambient temperature permitted by the equipment
specification or 25℃, whichever is greater.
Table 7 IEC 950 -Table 16: Over-temperature limits, Part 2

Maximum over-temperature (℃)
Operator-accessible Parts Glass, Plastic,
Metal
Porcelain Rubber
Handle knob, etc., held or touched
35 45 60
for short periods
Handles, knobs, etc., regularly held 30 40 50
Outer surface of the equipment that
45 55 70
can be touched
Inner surface of the equipment that
45 55 70
can be touched
DANGER! Possibility of personal injury: Carefully observe the specific

procedures for installation / turn-up and commissioning / maintenance of equipment parts where
heat-radiating mechanical parts are present, described in the relevant installation / turn-up and
commissioning / maintenance documents and the following general rule:
Personal injury can be caused by heat. Avoid touching powered terminals with any
exposed part of your body.
3.2.8 Specific safety rules in this handbook
Specific safety rules are specified in the following paragraphs:
Para. 1.7.
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4 OTHER NORMS AND LABELS
4.1 Electromagnetic Compatibility
The equipment’s EMC norms depend on the type of installation being carried out (cable termination,
grounding etc.) and on the operating conditions (equipment, setting options of the electrical/electronic
units, presence of dummy covers, etc.).
Before starting any installation, turn-on, tests & operation and maintenance work refer to the
relevant Handbooks and chapters.
The norms set down to guarantee EMC compatibility are distinguished inside this handbook by
the symbol and term:
ATTENTION EMC NORMS
4.1.1 General norms - Installation
All connections (towards the external source of the equipment) made with shielded cables should
use only cables and connectors suggested in this technical handbook or in the relevant Plant
Documentation, or those specified in the Customer’s ”Installation Norms” (or similar documents).
Shielded cables must be suitably terminated.
Install filters outside the equipment as required.
Ground connect the equipment utilizing a conductor with proper diameter and impedance.
Mount shields (if utilized), previously positioned during the installation phase, but not before
having cleaned and degreased it.
Before inserting the shielded unit, proceed to clean and degrease all peripheral surfaces (contact
springs and connection points, etc.).
Screws fasten the units to the shelf.
To correctly install EMC compatible equipment, follow the instructions given.
4.1.2 General norms - Turn-on, Tests & Operation
Preset the electrical units as required to guarantee EMC compatibility.
Check that the equipment is operating with all the shields properly positioned (dummy covers,
ESD connector protections, etc.).
To properly use EMC compatible equipment observe the information given.
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4.1.3 General norms - Maintenance
Before inserting the shielded unit, which will replace the faulty or modified unit, proceed to clean
and degrease all peripheral surfaces (contact springs and connection points, etc.).
Clean the dummy covers of the spare units as well.
Screws fasten the units to the shelf.
4.2 Electrostatic Dischargers (ESD)
Before removing the ESD protections from the monitors, connectors etc., observe the precautionary
measures stated. Make sure that the ESD protections have been replaced after having terminated the
maintenance and monitoring operations.
Most electronic devices are sensitive to electrostatic discharges. To address this concern the following
warning label has been affixed:
Observe the precautionary measures stated when having to touch the electronic parts during the
installation/maintenance phases.
Workers are supplied with antistatic protection devices consisting of:
An elastic band worn around the wrist.
A coiled cord connected to the elastic band and to the stud on the shelf.
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4.3 Suggestions, notes and cautions
Suggestions and special notes are marked by the following symbol:
Suggestion or note…
Cautions to avoid possible equipment damage are marked by the following symbol:
Title…
(Caution to avoid equipment damage)

Statement…
4.4 Labels affixed to the Equipment
This paragraph indicates the positions and the information contained on the identification and
serial labels affixed to the equipment.
Labeling depicted hereafter is for indicative purposes and could be changed without any notice.
Table 8 Label references

Ref. No. Name of Label
1 Label specifying item on catalogue (P/N)
2 Serial number of item specified on catalogue
3 Final test certificate
4 SFP label
5 Simple label adhered on extraction handle
6 Label identifying compliancy with CE and WEEE Directives
7 Electrostatic label
On contract basis, customized labels can be affixed to the equipment.
Standard labels can be affixed to any position on the equipment, as required by the customer.
However, for each of the above are applied the rules defined by each individual customer.
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2
5
1
Figure 1 Labels for units with stiffening bar
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2
3
1
Figure 2 Labels for units without stiffening bar
ANV + IC S P/N
Bar code of ANV + IC S P/N

Figure 3 Label identifying label on catalogue
Serial No.
Bar code of the serial No.

Figure 4 Label specifying serial No.
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4
Figure 5 Labels on the SFP
B
A
01 21,5 28
0
3
5,5
6,5
C
B
Figure 6 SFP label description
Field Field Name

A Part number
B Alcatel Code
C Bar Code Alfa 39 (+*start, stop)
Figure 7 SFP label example
Figure 8 CE label
Figure 9 WEEE label
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Figure 10 Electrostatic label
6
7
Figure 11 Labels on shelf
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5 LIST OF ABBREVIATIONS
ACO Alarm Cut Off
A/D Add and Drop functionality
BER Bit Error Rate
B&W Black and White
CD-ROM Compact Disk Read Only Memory
Ch Channel
CO Centre Office
CPE Customer Premise Equipment
CT Craft Terminal
CWDM Coarse Wavelength Division Multiplex
DB Database
DDM Digital Diagnostic Monitoring
DMUX Demultiplexing
EC Equipment Controller
ECT Equipment Craft Terminal
EEPROM Electrically Erasable Programmable Read Only Memory
EMC Electromagnetic Compatibility
EOL End of Life
ESC-LC Low Cost Equipment and Shelf Controller
ESD Electrostatic Discharges
ETSI European Telecommunication Standard Institute
E-SNCP Electrical SubNetwork Connection Protection
FPGA Field Programmable Gate Array
Gbit/s Giga bit per second
HDBK Handbook
HK Housekeeping
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HW Hardware
IEC International Electro-technical Commission
IND Indeterminate
IS-IS Intermediate System-to-Intermediate System
I/O Input/Output
ILOS Input Loss of Signal
IP Internet Protocol
ISO International Standard Organization
ISPB Intra Shelf Parallel Bus
ISSB Intra Shelf Serial Bus
ITU-T International Telecommunication Union -Telecommunication
LAN Local Area Network
LAT Lamp Test
LED Light Emitting Diode
MAC Medium Access Control
NE Network Element
NES Network Element Synthesis
OAD Optical Add and Drop
OADM Optical Add and Drop Multiplexer
OCH Optical Channel
OCC10 10Gbps Optical Channel Card
OMDX Optical Multiplexer and Demultiplexer
OMS Optical Multiplex Section
OMSP Optical Multiplex Section Protection
OS Operation System
OSC Optical Supervisory Channel
O-SNCP Optical SubNetwork Connection Protection
PC Personal Computer
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PCB Printed Circuit Board
PDU Power Distribution Unit
PSC Power Supply Card
Q3 Interface with Protocol Q3
QECC Interface with Q protocol for Embedded Control Channel
RECT Remote Craft Terminal
RAM Random Access Memory
RAI Remote Alarm Interface card
RI Remote Inventory
RX Receiver
SC Shelf Controller
SD Shutdown
SDH Synchronous Digital Hierarchy
SNCP Sub-Network Connection Protection
SNMP Simple Network Management Protocol
SPI Serial Peripheral Interface
TMN Telecommunication Management Network
TRU Top Rack Unit
TX Transmitter
USM User Service Manager
WDM Wavelength Division Multiplex
WEEE Waste of Electrical and Electronic Equipment
WLA Wavelength Adapter Board
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6 GENERAL ON ALCATEL CUSTOMER DOCUMENTATION
6.1 Products, product-releases, versions and Customer Documentation
A ”Product” is defined by the network hierarchical level where it can be inserted and by the whole of
performance and services for which it is meant.
A ”Product” evolves through successive ”Product-releases” which are the real products marketed
for their delivery at a certain ”Product-release” availability date.
Therefore, a ”Product-release” defines a set of hardware components and a software package that, as
a whole, identify the possible network applications and the equipment performance which the
specific ”Product-release” has been designed, engineered and marketed for.
In some cases a ”Product-release” has further development steps, named ”Versions”, that are
developed to improve or add some performance (mainly software) with respect to the previous version,
or for bug correction purposes.
A ”Product-release” has its own standard Customer Documentation, composed of one or more
handbooks.
A new ”Version” of a ”Product-release” may or may not produce a change in the status of the
Customer Documentation set, as described in para.6.4.
6.2 Handbook supply to Customers
Handbooks are not automatically delivered together with the equipment they refer to.
The number of handbooks per type to be supplied must be decided at contract level.
6.3 Aims of standard Customer Documentation
Standard Customer Documentation, referred to hereafter, must be always be meant as

plant-independent. Plant-dependent documentation, if envisaged by the contract, is subjected to
commercial criteria as far as contents, formats and supply conditions are concerned (plant-dependent
documentation is not described here).
Standard hardware and software documentation is meant to give the Customer personnel the
possibility and the information necessary for installing, commissioning, operating and maintaining the
equipment according to Alcatel Laboratory design choices.
In particular: the contents of the handbooks associated to the software applications focus on the
explanation of the man-machine interface and of the operating procedures allowed by it;
maintenance is described down to faulty PCB location and replacement.
Consequently, no supply to the Customers of design documentation (like PCB hardware design and
production documents and files, software source programs, programming tools, etc.) is envisaged.
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6.4 Handbook Updating
The handbooks associated to with the “Product-release” are listed in para.1.3.
Each handbook is identified by:
The name of the ”Product-release” (and ”Version” when the handbook is applicable to the
versions starting from it, but not to the previous ones).
The handbook name
The handbook P/N
The handbook edition (usually first edition=01)
The handbook issue date. The date on the handbook does not refer to the date of print but to the
date on which the handbook source file has been completed and released for the production.
6.4.1 Changes introduced in the same product-release (same handbook P/N)
The edition and date of issue might change on future handbook versions for the following reasons:
Only the date changes (pointed out in the Table of Contents) when modifications are made to the
editorial system resulting no change the technical contents of the handbook.
The edition, hence the date, is changed because modifications made concern technical contents.
In this case:
The chapters modified with respect to the previous edition are listed in Table 5.
In affected chapters, revision bars on the left of the page indicate modifications in text
and drawings.
Changes concerning the technical contents of the handbook cause the edition number increase (e.g.
from Ed.01 to Ed.02). Slight changes (e.g. for corrections) maintain the same edition but with the
addition of a version character (e.g. from Ed.02 to Ed.02A). Version character can be used for draft or
proposal editions.
NOTES FOR HANDBOOKS RELEVANT TO SOFTWARE APPLICATIONS
Handbooks (or part of the handbook) relevant to software applications (typically the Operator’s
Handbooks) are not modified unless the new software ”Version” distributed to customers implies
man-machine interface changes or in case of slight modifications not affecting the understanding of
the explained procedures.
Moreover, should the screen prints included in the handbook contain the product-release’s ”Version”
marking, they are not replaced in the handbooks related to a subsequent version, if the screen
contents are unchanged.
6.4.1.1 Supplying updated handbooks to customers
Supplying updated handbooks to Customers who have already received previous issues is submitted
to commercial criteria.
By updated handbook delivery it is meant the supply of a complete copy of the new handbook
(supplying errata-corrige sheets are not envisaged).
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6.4.2 Changes due to a new product-release
A new product-release change the handbook P/N and the edition start from 01.
In this case the modified parts of the handbook are not listed.
6.5 Customer documentation supply on CD-ROM
In the following “CD-ROM” means “Customer Documentation on CD-ROM”.
6.5.1 Contents, creation and production of a CD-ROM
In most cases, a CD-ROM contains the documentation of one product-release (-version) in a certain
language.
In some other cases, the same CD-ROM can contain the documentation of different product-release
(-version) s in a certain language.
As a general rule:
CD-ROMs for Network Management products do not contain:

The Installation Guides.
The documentation of system optional features that customers could not buy from Alcatel
together with the main applicative SW.
CD-ROMs for Network Elements products do not contain:

The documentation of system optional features (e.g. System Installation Handbooks
related to racks that customers could not buy from Alcatel together with the main
equipment).
The Installation and Turn-up & Commissioning handbooks.
A CD-ROM is obtained collecting various handbooks and processing them by

Interleaf-World-View-Press after the manual addition of some hyperlinks, which make the navigation
through the various handbooks easier. No additional information is added to each handbook; so that
the documentation present in the CD-ROMs is exactly the same the customer would receive on paper.
The files processed in this way are then transferred on a PC where the viewer (Interleaf-World-View) is
added and a master CD-ROM is recorded.
Suitable checks are made in order to have a virus-free product.
After a complete functional check, the CD-ROM image is electronically transferred to the archive of
the Production Department, so that the CD-ROM can be produced and delivered to customers.
6.5.2 Use of the CD-ROM
The CD-ROM can be used both in PC and Unix environments.
The minimum configuration for World View (rel.2.2.2) utilization on a PC is:
Operative System: Windows 2000

Processor: Pentium
RAM: 128Mbyte
Free disk space: 20Mbyte
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The set-up procedure is present in the booklet included in the CD-ROM box.
After the set-up procedure, which installs the viewer in the PC or Unix WS environment, the customer is
allowed to read the handbooks on the PC/WS screen, using the navigation and zooming tools
included in the viewer, and to print selected parts of the documentation through a local printer.
N.B. Copyright notification
WorldView: Copyright 1981-1996

INTERLEAF Inc.
All rights reserved.
The use of WorldView is permitted only in association with the files contained
in the CD-ROMs officially supplied by Alcatel.
Alcatel documents: All rights reserved.
Passing and copying of documents and files contained in the CD-ROMs
officially supplied by Alcatel, use and communication of its contents are not
permitted without written authorization from Alcatel.
6.5.3 CD-ROM identification
Each CD-ROM is identified:
a) By the following external identifiers, that are printed both on the booklet and the CD-ROM
upper surface:
- The name of the ”Product-release(s)” (and ”Version” when the CD-ROM is applicable to.
- The versions starting from it, but not to the previous ones).
- A writing indicating the language(s)
- The CD-ROM P/N
- The CD-ROM edition (usually first edition=01)
b) And, internally, by the list of the source handbooks and documents (P/Ns and editions) by
whose collection and processing the CD-ROM itself has been created.
6.5.4 CD-ROM updating
The list of source handbook/document P/Ns-editions indicated in section 6.5.3 point 2), in association
with the CD-ROM’s own P/N-edition, is also loaded in the Alcatel-Information-System as a structured
list. Whenever a new edition of any of such handbooks/documents is released in the Alcatel archive
system, the Alcatel-Information-System automatically raises a warning toward the Customer
Documentation Department, indicating the list of CD-ROMs that must be updated to include the new
editions of these handbooks/documents.
This causes the planning and creation of a new edition of the CD-ROM. Updating of CD-ROMs
always follows, with a certain delay, the updating of the single handbooks composing the collection.
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DESCRIPTIONS
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1 FUNCTIONAL DESIGN
The 1692MSE product release 3.2A is CWDM equipment intended for the METRO ACCESS, enterprise
and METRO CORE in the small cities. It is compliant with both ETSI and NEBS (level3) standards. It is
designed for a small number of channels (8 in this version) and for very low cost application, without
amplifiers.
The 1692MSE is organized from transponder cards to which the user accesses are connected to
optical Mux/Demux cards to perform the main CWDM signal (combined signal) and launch into the
fiber. The 1692MSE release 3.2A has been designed to offer the following functions:
Multiple configurations and multiple network architectures

The 1692MSE R3.2A can be configured as a line terminal, a back to back terminal, a CPE, an
Optical Add and Drop Multiplexer (OADM) or Regenerator. These basic configurations cover
both point to point and ring network applications.
Multi-rate client signals

The 1692MSE R3.2A is equipped with multi-rate transponders. It supports both low bitrate signals
(from 125Mbps to 2.5Gbps) and high bitrate signals (9.95Gbps and 10.31Gbps).
Up to 8 optical channels in a single NE

There are up to 8 optical channels in a single NE. Each channel is associated to a CWDM
channel. The channels are 1470nm, 1490nm, 1510nm, 1530nm, 1550nm, 1570nm, 1590nm
and 1610nm.
N.B. Normally, the central wavelengths of laser under normal temperature (25 degree C) are
1470nm, 1490nm, 1510nm, 1530nm, 1550nm, 1570nm, 1590nm and 1610nm.
Due to the specific technology of CWDM, no temperature control, the wavelength of system
under the whole temperature range (0-70 degree C) should be 1471nm, 1491nm, 1511nm,
1531nm, 1551nm, 1571nm, 1591nm and 1611nm with ± 7nm deviation.
Table 9 Frequency conversion of CWDM wavelengths

Wavelength (nm) Frequency (THz)
1470 203.94
1490 201.20
1510 198.54
1530 195.94
1550 193.41
1570 190.95
1590 188.55
1610 186.21
Support up to four compact shelves or one CO shelf in a single NE

In 1692MSE R3.2A, a main shelf and up to three slave shelves or one CO shelf can be supported
in one NE.
Supervision
An extra channel at 1310nm, the Optical Supervision Channel (OSC), can be added to the
aggregate signal before being launched into the fiber.
Support unidirectional and Bi-directional transmission

Unidirectional transmission on single fiber is that 8 channels signal is transmitted in one direction,
while bi-directional transmission on single fiber are 4 channels in each direction.
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Client signals TDM concentration
Up to 4 client signals may be concentrated by Time Division Multiplexing, on a unique STM-16
transponder access, in order to optimize the use of each wavelength.
Protection
In unidirectional transmission, the 1692MSE R3.2A offers the Sub-Network Connection Protection
(SNCP) at the channel level and the Optical Multiplex Section Protection (OMSP); while in
bi-directional transmission, only SNCP protection is offered.
Performance Monitoring
Monitoring of the performances of the client signals and the WDM transmission is available for
SDH and GbE frames.
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1.1 Basic equipment configurations
The 1692MSE R3.2A design, allows these basic configurations of the equipment:
Line Terminal
Optical Add and Drop Multiplexer (OADM)
Regenerator
CPE
1.1.1 Line terminal
In line terminal configuration, the 1692MSE R3.2A connects client signals to an optical fiber CWDM
line.
In this configuration, the equipment takes place at both ends of point to point links.
Client signals
Up to 8 User channels
TPDs
Up to 8
MDX CWDM signals
a） Unidirectional transmission
Client signals
TPDs
MDX CWDM signals
b） Bi-directional transmission
Figure 12 1692MSE R3.2A in line terminal configuration
1.1.2 Optical Add and Drop Multiplexer (OADM)
In OADM configuration, the 1692MSE R3.2A may add and drop a part of the traffic of an optical
CWDM line, in both directions. In this configuration the equipment takes the place of a linear add and
drop multiplexer in:
Point to point links

Ring networks
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Client signals
x Add & drop

channels
West line TPD East line
n (up to 8) n (up to 8)
OAD n-x express channels OAD CWDM signal
CWDM signal
TPD
x Add & drop

channels
Client signals
a) Unidirectional transmission with x(x=1, 2 or 4) channels add & drop
Client signals
1 Add & drop 1 Add & drop

channel channel
TPD
West line OAD OAD East line
b) Bi-directional transmission
Figure 13 1692MSE R3.2A in OADM configuration
N.B. In this document, the definition about “East” and “West” is as follows:
East: From west to east;
West: From east to west;
“East” is on the right side of pages, while “West” on the left side.
The OADM configuration, especially in ring network, allows the Sub-Network Connection Protection
(SNCP) of the added and dropped channels.
Particular Case: When all the CWDM line channels are added and dropped, the 1692MSE R3.2A is
a back to back terminal or a hub node. There is no pass through channel. SNCP may be performed
on all the CWDM line channels.
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Client signals
x Add & drop

channels
TPDs TPDs
West line East line
nλ(up to 8) Mux Mux nλ(up to 8)

CWDM signal Dmux Dmux CWDM signal
Figure 14 1692MSE R3.2A in back to back terminal configuration
1.1.3 Regenerator
In the regenerator configuration, the CWDM line signals can be regenerated.
Dmux Mux
CWDM signals
CWDM signals TPDs
Mux Dmux
Figure 15 1692MSE R3.2A in regenerator configuration
1.1.4 CPE
For the CPE application, there are two different configurations: one-channel and two-channel CPE.
The OSC signal is used in both configurations.
O S C s ig n a l
1 o r 2 c lie n t MDX
TPD M ix e d s ig n a ls
s ig n a l(s )
O S C s ig n a l
Figure 16 Block diagram of CPE
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1.2 Network architectures
1.2.1 Ring networks
A two-fiber ring network is obtained with 1692MSE equipment in back to back terminal and OADM
configurations.
Client end traffic
B-TO-B
Client Client
Add & drop OADM OADM Add & drop
traffic traffic
OADM
Client Add & drop traffic

Figure 17 1692MSE in ring networks
1.2.2 Point to point links
A point to point link, based on 1692MSE, is obtained with:
A 1692MSE in line terminal configuration at each end of the link.

Eventually, one or more 1692MSE in OADM configuration.
Client Add and Drop traffic
Client Client
end end
traffic traffic
Line Line
OADM OADM
terminal terminal
a) Unidirectional transmission
Client Client
end end
traffic traffic
Line Line
OADM OADM
terminal terminal
b) Bi-directional transmission
Figure 18 1692MSE in point to point configuration
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1.2.3 CPE configuration in ring network
Client end traffic
B-TO-B
Client Client
traffic traffic
OADM
Client Client
drop add
traffic traffic
CPE
Client end traffic

Figure 19 1692MSE in ring networks with CPE
1.2.4 CPE configuration in point to point links

Client end traffic
Client Client
end Line Line
CPE OADM OADM end
traffic terminal terminal traffic
Client end traffic
Figure 20 1692MSE in point to point links with CPE
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1.3 Network protection
Two protection levels can be provided. The first one is SNCP, and the other one is OMSP. SNCP can be
divided into E-SNCP and O-SNCP. See the following table to know the relationship between protection
and network application.
Table 10 Relationship between protection and network application

Network Protection Comments
Unidirectional application
Point to point OMSP, E-SNCP or O-SNCP OMSP and SNCP can be offered at the same time,
but only one SNCP can be configured In one
Ring OMSP, E-SNCP or O-SNCP transponder.
Bi-directional application
Only one protection is available at one time In one
Point to point O-SNCP or E-SNCP
transponder.
1.4 Description of the functions
This section describes the main functions of 1692MSE.
1.4.1 Main function in different configuration
1.4.1.1 Terminal configuration
In line terminal configuration (unidirectional and bi-directional), these functions are the following:
Transponder
TDM concentrator
MUX
DMUX
Supervision management (in option)
OMSP (in option, only for unidirectional line terminal)
Equipment and shelf control
Power supply
OSC
CWDM
insertion line
TDM MUX
concentrator
OSC
Client extraction
OMSP
signals
Transponders
DMUX
LEGEND:
To borads
Optical link OSC 1310nm
Supervision
Electrical link SPI bus
Optional 3.6V
function
Equipment and To 5.5V Power Station
borads
shelf control supply batteries
Function 48V
or
LAN
NE management
application
Figure 21 Functional synopsis in unidirectional Line Terminal configuration
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TDM OSC
insertion
concentrators
Client
MUX CWDM
signals
Transponders line
LEGEND: OSC
To borads extraction
OSC 1310nm
Optical link Supervision

3.6V
Optional
function Equipment and To 5.5V Power Station
borads
shelf control 48V supply batteries
Function
or LAN
NE management application
Figure 22 Functional synopsis in bi-directional Line Terminal configuration
1.4.1.2 OADM configuration
In line OADM configuration (unidirectional and bi-directional), these functions are the following:
Transponder
TDM concentrator
OADM
OMSP (in option, only for unidirectional line terminal)
Power supply
Client signals East: 1, 2 or 4

West: 1, 2 or 4
channels channels
Add & Drop Add & Drop
TDM
concentrator
Transponders
CWDM CWDM
OSC
line OSC line
extraction insertio
(west) (East)
n
OMSP Pass through OSC

extractio
OMSP
OSC
traffic n
insertion
OSC Supervision OSC

1310nm 1310nm
LEGEND:
Optical link
Electrical link
Optional SPI
3.6V
function bus
To Equipment To Power
5.5V Station
borads and borads
Function shelf control 48V supply batteries
or
LAN
Figure 23 Functional synopsis in unidirectional OADM configuration
ED 01 RL
3AL 97869 AAAA 57/259

N.B. 3, 5 or 7 channels OADM can be realized via the combination of 1, 2 or 4 channels
OADM.
Client signals
West: 1 channel East: 1 channel
Add & Drop Add & Drop
TDM
concentrator
Transponders
OSC
OSC
insertion insertion
CWDM CWDM
line line
(West) (East)
Pass through traffic
OSC OSC
1310nm 1310nm
Supervision
OSC OSC
LEGEND: extraction extraction
To borads
Optical link
Optional 3.6V
function
borads
Function shelf control 48V supply
batteries
or
LAN
Figure 24 Functional synopsis in bi-directional OADM configuration
1.4.1.3 Regenerator configuration
In line regenerator configuration, these functions are the following:
Transponder
MUX/DMUX or OADM
Power supply
ED 01 RL
3AL 97869 AAAA 58/259

OSC
extraction OSC
insertion
DMUX MUX
T
CWDM P OSC
CWDM
line OSC line
(west) insertion D extraction
(East)
MUX DMUX
OSC 1310nm Supervision OSC 1310nm
To borads
LEGEND: SPI bus

Optical link 3.6V
Electrical link Equipment and To 5.5V Power Station

borads
shelf control 48V supply batteries
Optional
function LAN
Figure 25 Functional synopsis in regenerator configuration (use MUX/DMUX)
N.B. Up to 8 channels can be regenerated per direction in this configuration.
OSC
extraction OSC
insertion
DROP ADD
T
CWDM P OSC
CWDM
line OSC line
(west)
insertion D extraction
(East)
ADD DROP
OSC 1310nm Supervision OSC 1310nm
To borads
LEGEND: SPI bus

Optical link 3.6V
Electrical link Equipment and To 5.5V Power Station

borads
shelf control 48V supply
Optional batteries
function LAN
Figure 26 Functional synopsis in regenerator configuration (use OADM)
N.B. Only up to 4 channels can be regenerated in per direction in this configuration.
ED 01 RL
3AL 97869 AAAA 59/259

1.4.1.4 CPE configuration
In the CPE configuration, these functions are the following:
Transponder
TDM concentrator
MUX/DMUX
Supervision management
Power supply
a) One-channel CPE configuration
OSC
insertion
TDM
Client concentrator OSC
extraction CWDM
signal
line
Transponders
LEGEND:
To borads OSC 1310nm
Optical link
Electrical link SPI bus Supervision
Optional 3.6V
function To
Station
Equipment and 5.5V Power batteries
borads
or
LAN
Figure 27 One-channel CPE configuration
b) Two-channel CPE configuration
OSC
insertion
TDM MUX
concentrator
2 Client OSC CWDM
signals extraction
Transponders line
DMUX
LEGEND:
To borads OSC 1310nm
Optical link
Electrical link SPI bus Supervision
Optional 3.6V
function
borads
batteries
or
LAN
Figure 28 Two-channel CPE configuration
ED 01 RL
3AL 97869 AAAA 60/259

1.4.2 Description of the functions
1.4.2.1 Multi-rate transponder function
The transponder function is built with Wavelength Adapter Cards (WLA), one for two-client signal. The
role of this function is:
At the transmitting side (from client to CWDM line)

To adapt the client incoming optical signals to a dedicated wavelength and deliver those optical
signals to the multiplexer (MUX) function.
At the receiving side (from CWDM line to client)

To return the client optical signals from the signal delivered by the demultiplexer (DEMUX)
function.
Client Signals
User Tx User Tx User Rx User Rx
8X8 Matrix
WDM Rx WDM Rx WDM Tx WDM Tx
From DMUX function To MUX function

Figure 29 Transponder function
The typical client signals accepted by the WLA of the 1692MSE are:
125 Mbit/s signal: Fast Ethernet / FDDI

155.52 Mbit/s signal: STM-1 / OC-3
200 Mbit/s signal: ESCON
270 Mbit/s signal: Digital Video channel - HDTV
622.08 Mbit/s signal: STM-4 / OC-12
1.0625 Gbit/s signal: Fiber channel / FICON
1.25 Gbit/s signal: Gigabit Ethernet
1.24416Gbps: OC-24
2.125Gbps: 2 Fiber channel
2.48832 Gbit/s signal: STM-16 / OC-48
2.5Gbps: 2 Gigabit Ethernet
ED 01 RL
3AL 97869 AAAA 61/259

2.66606 Gbit/s signal: OC-48 (with FEC is 2666.06Mbps)
The 1692MSE supports up to 8 channels unidirectional transmission or 4-channel bi-direction

transmission on single fiber. The channels are 1470nm, 1490nm, 1510nm, 1530nm, 1550nm,
1570nm, 1590nm and 1610nm.
The transponder boards of the 1692MSE, also called Wavelength Adapter Cards (WLA), support two
channels each. 4 different WLAs are sufficient to cover the 8 channels.
1.4.2.2 TDM client signal concentrating (C-4xANY)
The aim of the C-4xANY TDM concentration is to save transponders and to optimize the use of each
WDM channel. Client signals from 100 Mbit/s to 1.25 Gbit/s can be concentrated in one STM-16. For
example, 4 STM-1 client signals can be concentrated on a unique STM-16 signal and applied on a
unique WDM channel.
1 Concentrator
C-4xANY
Up to 4 1 WDM
TDM
Client signals Optical channel
Concent
Figure 30 TDM concentration function
The available client signal accesses and their maximum number are:
Low bit rate

4 x Fast Ethernet
4 x FDDI
4 x ESCON
4 x Digital Video
SDH
4 x STM-1
3 x STM-4
High bit rate

2 x Gigabit Ethernet
2 x Fiber Channel or FICON
The following mixes are also possible:
3 x (FDDI or FE or DV or ESCON or STM-1) + 1 x STM-4

2 x (FDDI or FE or DV or ESCON or STM-1) + 1 x (FC or GbE or FICON)
1 x (FDDI or FE or DV or ESCON or STM-1) + 1 x STM-4 +1 x (FC or GbE or FICON)
2 x (FC or GbE or FICON)
Low bit rate and High bit rate signal is available at 1310nm and 850nm. SDH bit rate signal is only
available at 1310nm.
ED 01 RL
3AL 97869 AAAA 62/259

1.4.2.3 Wavelength division multiplexing/demultiplexing
The optical multiplexer receives the colored optical channels signal from the transponders, and
multiplexes them into a fiber.
The optical demultiplexer receives the CWDM line signal; demultiplexes this signal and sends the
recovered optical channels signal to the transponders.
a) Optical multiplexing
The multiplexer function may be obtained with the following 8:1 optical MUX:
Figure 31 CWDM MUX side
The multiplexer is able to multiplex 8 channel signals (in CWDM grid) issued from the transponder
function into one multi-wavelength single fiber transmission. This device is a 9 fibers passive optic
component: 8 channels add inputs, 1 output (common). The multiplexer can be used in a
unidirectional line terminal configuration.
Particular Case: The 8:1 multiplexer can also be used in a bi-directional line terminal configuration
to multiplex/demultiplex signals, see the following figure.
Add channels:
1...4 COM
Drop channels:
5...8
Figure 32 8:1 MUX used as MUX/DMUX
b) Optical demultiplexing
The demultiplexer function may be obtained with the following 1:8 optical DMUX:
Figure 33 CWDM DMUX side
ED 01 RL
3AL 97869 AAAA 63/259

The demultiplexer is able to demultiplex an input aggregate signal (n channels) into 8 channels
signals (in CWDM grid) and send to the transponder.
1.4.2.4 Optical add drop Multiplexing
In line OADM configuration, 1692MSE support unidirectional or bi-directional transmissions. 1 ch

add/drop, 2 ch add/drop or 4 ch add/drop; a OADM module can be used in a unidirectional
transmission, while only a 2 ch add/drop OADM module can be used in a bi-directional transmission.
a) 1 ch add/drop
The 1 ch add/drop OADM function may be obtained with the following scheme.
From West side To East side
Demux Mux
To West side From East side
Mux
Demux
Ch x Ch x
Figure 34 1 ch Add/drop function in unidirectional transmission
This scheme has been chosen to implement the extraction and the insertion of chX from and into the
WEST or EAST side of a CWDM protected network. In the figure only the OADM working on the WEST
side is shown.
b) 2 ch add/drop
The 2 ch add/drop OADM function may be obtained with the following scheme.
From West side To East side
Demux Mux
To West side From East side
Mux Demux
Ch x
Ch y
Figure 35 2 ch Add/drop function in unidirectional transmission
This scheme has been chosen to implement the extraction and the insertion of chX, Y from and into the
WEST or EAST side of a CWDM protected network. In the figure only the OADM working on the WEST
side is shown.
ED 01 RL
3AL 97869 AAAA 64/259

Particular case: The 1 ch add/drop OADM function can also be used in bi-directional transmission
to add & drop 1 ch signal.
From / To West Express
From / To East
Express
East Ch x West Ch y
Figure 36 1 ch add/drop function in bi-directional transmission
c) 4 ch add/drop
The OADM is used to Add/drop four CWDM signals to/from a multi-wavelength signal on a single
fiber transmission.
4 ch Add/Drop Module
IN CH4 CH1 OUT

CH4 filter CH1 filter
DROP ADD
CH3 CH2
DROP ADD
CH2 CH3
DROP ADD
CH1 CH4
DROP ADD
EXP out EXP in
Figure 37 4 ch add/drop function
1.4.2.5 1310nm circulator
The circulator is used to separate two reverse directional optical signals over 1310nm window.
The circulator function is the follow figure:
ED 01 RL
3AL 97869 AAAA 65/259

Port 1 Port 3
Port 2
Figure 38 1310nm circulator
1.4.2.6 1310nm broadband filter
This filter is used to add or drop 1310nm signal to or from 1310nm/1550nm mixed signal in
OADM/OMDX board of 1692MSE. The function is shown in the below figure:
1550nm Input
1310nm Input
Out
Figure 39 1310nm broadband filter
1.4.2.7 Optical parameters measurement (DDM)
The analogue parameters of SFP can be monitored through DDM function in SFP transceiver. It
includes Input Power, Input Power Type, Output Power, Bias Current, Power Supply Voltage,
Temperature and Calibration Mode.
In 1692MSE R3.2A, only DDM with External Calibration is supported.
1.4.2.8 Optical Supervisory Channel (OSC)
An optional channel named OSC is allocated to the transport of the supervision data.
WDM B-to-B WDM

terminal OADM terminal
D
M
OADM M
U
U
X
X
OSC OSC OSC
D M
M U
OADM
U X
X
Figure 40 Optical supervisory channel management in line terminal and OADM configuration
ED 01 RL
3AL 97869 AAAA 66/259

The OSC allows the remote monitoring of the NE in a network.
1.4.2.9 Optical Multiplex Section Protection (OMSP)
OMSP function performs optical multiplex section protection. On the transmitter side, with the optical
splitter, the signal from MUX output is broadcasted on the working fiber and protection fiber. On the
receiver side, the optical switch will select one of the optical signals coming from working fiber and
protection fiber under the control of board logic and send it into DEMUX. If a failure occurs on the
main path, the system switches on the signal of the spare path. The protection is non-revertive. In point
to point application, the optical multiplex section protection scheme is divided into the following two
sorts:
Mux splitter switch Demux
Demux switch splitter Mux
Figure 41 OMSP application without OADM
Mux splitter switch splitter switch Demux
OADM
Demux switch splitter switch splitter Mux
Figure 42 OMSP application with OADM
1.4.2.10 Sub-Network Connection Protection (with WLA)
In a ring network, the Sub-Network Connection Protection (SNCP) at optical channel level can be
provided either in “Back to Back” terminals or in OADM configuration.
The transponder cards (WLA) are duplicated for each protected channel. At the transmitting side, the
signal is broadcast on the two arms of the ring. At the receiving side one of the two available signals is
selected. If a failure occurs on the main path, the system switches on the signal of the spare path. The
ED 01 RL
3AL 97869 AAAA 67/259

protection is non-revertive.
Client end traffic
B-TO-B
Client Client
traffic traffic
OADM
Client Add & drop traffic

Figure 43 SNCP in a ring network
The ”Split & Select” function is performed either E-SNCP or O-SNCP.

In case of E-SNCP, a matrix inside the transponders board ensures the split and selects the
function.
control
LOS electrical
optical electrical optical optical
WDM Tx WDM Rx
user Rx WDM user Tx
WDM Tx WDM Rx
8x8 8x8
matrix matrix
Figure 44 Electrical SNCP
In case of O-SNCP, two optical splitters ensure the function. The selection is done by switching-off
ED 01 RL
3AL 97869 AAAA 68/259

the user Tx corresponding to the failing path and re-activating the protecting one, the protection
is performed at transponder level.
control
LOS electrical
optical electrical optical optical
user Rx WDM Tx WDM Rx user Tx
WDM
user Rx WDM Tx WDM Rx user Tx
optical optical
splitter coupler
Figure 45 Optical SNCP
1.4.2.11 Broadcast Sub Network Connection Protection (with WLA3C)
B-SNCP is used to protect broadcasted service. B-SNCP +EPS (equipment protection switch) are used
together, which need two WLA3C boards. In each board three SFP modules are needed. Signal from
the WDM is input in CWDM port 1 and broadcast to user port 1 and two WDM ports. The routing is
done electrically in the 8x8 matrix.
In one board, a SFP module is placed in CWDM port 1 as main, a B/W placed in CWDM port 2 as
spare. These two transponders are said to be twins. The system implements protective actions
according to the alarms and status information of both CWDM ports. If a failure occurs on the main
path, the system switches on the signal of the spare path. The protection is non-revertive. Only the user
port 1 is needed, it can be placed CWDM or B/W modules.
CWDM 1 CWDM 2 CWDM 1 CWDM 2
Main Spare
board board
User 1 User 1
Figure 46 BSNCP+EPS using two WLA3C
1.4.2.12 Sub-Network Connection Protection (with C-4xANY)
In release 3.2A, C-4xANY with O-SNCP and E-SNCP are supported. In O-SNCP, there are two types:
Use a WLA with O-SNCP board and place a B/W SFP in C-4xANY board.
Use OMSP and place a colored SFP in C-4xANY board.
ED 01 RL
3AL 97869 AAAA 69/259

In E-SNCP, only a WLA board can be used. In the meantime, place a B/W SFP in C-4xANY board.
See the following figures.
Drawer 1
User WDM
port 1 port 1
Drawer 2
Mother
B\W SFP
board
Drawer 3
User WDM
port 2 port 2
Drawer 4
C-4xANY WLA-P
Figure 47 C-4xANY with O-SNCP (use WLA-P)
Drawer 1
Drawer 2
Mother
Color SFP
board
Drawer 3
Drawer 4
C-4xANY OMSP
Figure 48 C-4xANY with O-SNCP (use OMSP)
Drawer 1
WDM
Drawer 2 port 1
Mother User
B\W SFP
board port 1
Drawer 3 WDM
port 2
Drawer 4
C-4xANY WLA
Figure 49 C-4xANY with E-SNCP
1.4.2.13 16 channels upgrade
In 1692MSE R3.2A, the OSC port can be used either to transmit 1310nm OSC signal, or to interface
with another aggregated 8 channels CWDM signal. Then the transmission channels can reach up to
16 channels. This is achieved by introducing a new 1310nm broadband filter.
All types of C-MDX2/C-OAD2/C-MDX-B/C-OAD-B boards have been upgraded with 1310nm filter
in order to support 16 channels upgrade in future. Furthermore, the improvement applied on 1310nm
ED 01 RL
3AL 97869 AAAA 70/259

filter is also for compliance with ITU Recommendation G.694.2 version 2.2 for crosswalk issue. The
upgraded C-MDX2/C-OAD2/C-MDX-B/C-OAD-B is software independent.
1471 1471
nm nm
MUX 1310nm filter 1310nm filter DMX

OAD OAD
1611
OSC transmission 1611
nm nm
OSC TX: 1280~1335nm OSC RX
1471 1471
nm nm
MUX 1310nm filter 1310nm filter DMX

OAD OAD
1611 16CWDM 1611

nm nm
channels
Aggregated signal comprising transmission Aggregated
CWDM wavelengths in O&E band signal
(1271~1451nm)
Figure 50 16 channels upgradable
ED 01 RL
3AL 97869 AAAA 71/259

1.5 Device description
1.5.1 Shelf list
In 1692MSE Release 3.2A, up to four compact shelves or one CO shelf are supported in one NE.
Slot 6
12 PSC2
Slot 5 11
FAN Slot 4 10
Slot 3 9
Slot 2 8
13
ESC-LC Slot 1 7 PSC2
446.2 mm
Slot 19
25 PSC2
Slot 18 24
FAN Slot 17 23
Slot 16 22
Slot 15 21
26
Slave I-LINK Slot 14 20 PSC2
Slot 32
38 PSC2
Slot 31 37
FAN Slot 30 36
Slot 29 35
Slot 28 34
39
Slave I-LINK Slot 27 33 PSC2
Slot 45
51 PSC2
Slot 44 50
FAN Slot 43 49
Slot 42 48
Slot 41 47
52 Slave I-LINK Slot 40 46 PSC2
Figure 51 Four compact shelves used in a NE (front view)
ED 01 RL
3AL 97869 AAAA 72/259

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
443mm
25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48
49
533.4mm
Figure 52 One CO shelf used in a NE (front view)
1.5.2 Shelf and boards designation and reference
Table 11 Shelf and boards designation and reference

Name Mnemonic ALCATEL Code
1692 Metrospan Edge Compact Shelf / 2 - 3AL 97679 AA**
1692 Metrospan Edge Compact Shelf / 3 - 3AL 97679 AB**
1692 Metrospan Edge CO shelf - 3AL 86607 AA**
Optinex rack with TRU & Door - 3AL 37952 AA**
Optinex rack with TRU - 3AN 44815 AA**
Low Cost Equipment and Shelf Controller ESC-LC 3AL 97690 AA**
Local Access Network card LAN-Q 3AL 86653 AA**
Power Supply Card PSC 3AL 86652 AA**
Power Supply Card2 PSC2 3AL 86888 AA**
Power Supply Card3 PSC3 3AL 86652 AB**
Power Management Unit PMU 3AL 86825 AA**
Compact FAN / 2 FAN 3AL 97682 AA**
CO FAN module FAN-CO 3AL 86625 AA**
ED 01 RL
3AL 97869 AAAA 73/259

Housekeeping card HK 3AL 86668 AA**
Rack Alarm Interface card RAI 3AL 87009 AA**
Intershelf Link Slave I-LINK-S 3AL 86808 AA**
Optical Multiplex Section Protection card OMSP 3AL 97541 AA**

Optical Supervision card OSC 3AL 97540 AA**
Wavelength Adaptor3 with PM WLA3C 3AL 97795 AA**

Wavelength Adapter3 with PM and O-SNCP WLA3COP 3AL 97795 AB**
OCC10-No Amplified Ch193.300 (1550) OCC10-NA-1550 (193.300) 3AL 95313 AA**

OCC10-No Amplified Ch 193.000 (1550) OCC10-NA-1550 (193.000) 3AL 95313 AB**
OCC10-No Amplified Ch193.100 (1550) OCC10-NA-1550 (193.100) 3AL 95313 AC**
OCC10-No Amplified Ch193.200 (1550) OCC10-NA-1550 (193.200) 3AL 95313 AD**
OCC10-No Amplified Ch195.900 (1530) OCC10-NA-1530 (195.900) 3AL 95314 AA**
OCC10-Enhanced-CWDM (1530) OCC10-EC-1530 8DG 81002 AA**
OCC10-Enhanced-CWDM (1550) OCC10-EC-1550 8DG 81002 AB**
2XGE - 3AL 97800 AA**

2XGE-FC - 3AL 97878 AA**
SFP transceiver L1.1 (1310nm) B&W L1.1 1AB194670002

SFP transceiver 2M (1310nm) B&W 2M 1AB209860001
SFP transceiver S1.1 (1310nm) B&W S1.1 1AB194670001
SFP transceiver S1.1 (1310nm) B&W with DDM S1.1_DDM 1AB194670004
SFP transceiver L1.2 (1310nm) B&W with DDM L1.2_DDM 1AB194670006
SFP transceiver S16.1 (1310nm) B&W with
S16.1_DDM 1AB196370006
DDM
SFP transceiver L16.1 (1310nm) B&W with
L16.1 1AB196370004
DDM
L16.2 1AB196370003
DDM
SFP transceiver S4.1 (1310nm) B&W with DDM S4.1_DDM 1AB196360004
SFP transceiver L4.2 (1310nm) B&W with DDM L4.2_DDM 1AB196360007
SFP transceiver I16 (1310nm) B&W I16 1AB196370002
SFP transceiver I16 (1310nm) B&W with DDM I16_DDM 1AB196370005
SFP transceiver 1000Base-SX (850nm) B&W GbE_SX 1AB187280002
SFP transceiver 1000Base-SX (850nm) B&W
GbE_SX_DDM 1AB187280033
with DDM
SFP transceiver 1000Base-LX (1310nm) B&W GbE_LX 1AB187280001
SFP transceiver 1000Base-LX (1310nm) B&W
GbE_LX_DDM 1AB187280031
with DDM
SFP transceiver 1000Base-ZX (1550 nm) B&W
GbE_ZX_DDM t.b.d
with DDM
SFP transceiver FC/2FC-SX (850nm) B&W with

2FC SX_DDM 1AB187280037
DDM
SFP transceiver FC/2FC-LX (1310nm) B&W
2FC LX_DDM 1AB187280038
with DDM
CWDM wavelength SFP transceiver with PIN
1470_Bronze 1AB196340001
receiver (1470nm)
ED 01 RL
3AL 97869 AAAA 74/259

1490_Bronze 1AB196340002
receiver (1490nm)
1510_Bronze 1AB196340003
receiver (1510nm)
1530_Bronze 1AB196340004
receiver (1530nm)
1550_Bronze 1AB196340005
receiver (1550nm)
1570_Bronze 1AB196340006
receiver (1570nm)
1590_Bronze 1AB196340007
receiver (1590nm)
1610_Bronze 1AB196340008
receiver (1610nm)
CWDM wavelength SFP transceiver with APD
1470_Silver 1AB196350001
receiver Standard (1470nm)
1490_Silver 1AB196350002
1510_Silver 1AB196350003
1530_Silver 1AB196350004
1550_Silver 1AB196350005
1570_Silver 1AB196350006
1590_Silver 1AB196350007
1610_Silver 1AB196350008
1470_Bronze_DDM 1AB196340009
receiver (1470nm) with DDM
1490_Bronze_DDM 1AB196340010
1510_Bronze_DDM 1AB196340011
1530_Bronze_DDM 1AB196340012
1550_Bronze_DDM 1AB196340013
1570_Bronze_DDM 1AB196340014
1590_Bronze_DDM 1AB196340015
1610_Bronze_DDM 1AB196340016
1470_Silver_DDM 1AB196350026
receiver Standard (1470nm) with DDM
1490_Silver_DDM 1AB196350027
1510_Silver_DDM 1AB196350028
1530_Silver_DDM 1AB196350029
ED 01 RL
3AL 97869 AAAA 75/259

1550_Silver_DDM 1AB196350030
1570_Silver_DDM 1AB196350031
1590_Silver_DDM 1AB196350032
1610_Silver_DDM 1AB196350033
4xANY Host card C-4xANY 3AL 95063 AA**

High speed 1310nm optical drawer HF_1310 Drawer 3AL 86672 AA**
Low speed 1310nm optical drawer LF_1310 Drawer 3AL 86674 AA**
High speed 850nm optical drawer HF_850 Drawer 3AL 86870 AA**
Low speed 850nm optical drawer LF_850 Drawer 3AL 86869 AA**
STM-1/4 optical drawer/2 SDH_1310 Drawer 3AL 95284 AA**
Unidirectional MUX/DEMUX without OSC filter C-MDX-U 3AL 97538 AB**

Unidirectional MUX/DEMUXE with OSC filter C-MDX-E-U-S 3AL 97769 AA**
Bi-directional MUX/DEMUX without OSC filter C-MDX-B 3AL 97538 AC**
Bi-directional MUX/DEMUX with OSC filter C-MDX-B-S 3AL 97538 AD**
Unidirectional MUX/DEMUX2 without OSC filter C-MDX2-U 3AL 97654 AA**

Unidirectional MUX/DEMUX2E with OSC filter C-MDX2-E-U-S 3AL 97772 AA**
1-channel unidirectional MUX/DEMUX2E with
C-MDX2-E-1-S 3AL 97772 BA**
OSC filter
C-MDX2-E-2-4749-S 3AL 97772 CA**
2-channel unidirectional MUX/DEMUX2E with C-MDX2-E-2-5153-S 3AL 97772 CB**
OSC filter C-MDX2-E-2-5557-S 3AL 97772 CC**
C-MDX2-E-2-5961-S 3AL 97772 CD**
C-OAD-U-1-4747 3AL 97539 AB**

C-OAD-U-1-4949 3AL 97539 AC**
C-OAD-U-1-5151 3AL 97539 AD**
1-channel unidirectional OADM without OSC C-OAD-U-1-5353 3AL 97539 AE**
filter C-OAD-U-1-5555 3AL 97539 AF**
C-OAD-U-1-5757 3AL 97539 AG**
C-OAD-U-1-5959 3AL 97539 AH**
C-OAD-U-1-6161 3AL 97539 AJ**
C-OAD-E-U-1-4747-S 3AL 97770 AA**

C-OAD-E-U-1-4949-S 3AL 97770 AB**
C-OAD-E-U-1-5151-S 3AL 97770 AC**
1-channel unidirectional OADME with OSC C-OAD-E-U-1-5353-S 3AL 97770 AD**
filter C-OAD-E-U-1-5555-S 3AL 97770 AE**
C-OAD-E-U-1-5757-S 3AL 97770 AF**
C-OAD-E-U-1-5959-S 3AL 97770 AG**
C-OAD-E-U-1-6161-S 3AL 97770 AH**
1-channel unidirectional OADM2 without OSC C-OAD2-U-1-4747 3AL 97653 AA**

filter C-OAD2-U-1-4949 3AL 97653 AB**
C-OAD2-U-1-5151 3AL 97653 AC**
C-OAD2-U-1-5353 3AL 97653 AD**
C-OAD2-U-1-5555 3AL 97653 AE**
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C-OAD2-U-1-5757 3AL 97653 AF**
C-OAD2-U-1-5959 3AL 97653 AG**
C-OAD2-U-1-6161 3AL 97653 AH**
C-OAD2-E-U-1-4747-S 3AL 97771 AA**

C-OAD2-E-U-1-4949-S 3AL 97771 AB**
C-OAD2-E-U-1-5151-S 3AL 97771 AC**
1-channel unidirectional OADM2E with OSC C-OAD2-E-U-1-5353-S 3AL 97771 AD**
filter C-OAD2-E-U-1-5555-S 3AL 97771 AE**
C-OAD2-E-U-1-5757-S 3AL 97771 AF**
C-OAD2-E-U-1-5959-S 3AL 97771 AG**
C-OAD2-E-U-1-6161-S 3AL 97771 AH**
C-OAD-U-2-47474949 3AL 97539 PA**

2-channel unidirectional OADM without OSC C-OAD-U-2-51515353 3AL 97539 QA**
filter C-OAD-U-2-55555757 3AL 97539 RA**
C-OAD-U-2-59596161 3AL 97539 SA**
C-OAD-E-U-2-47474949-S 3AL 97770 BA**

2-channel unidirectional OADME with OSC C-OAD-E-U-2-51515353-S 3AL 97770 BB**
filter C-OAD-E-U-2-55555757-S 3AL 97770 BC**
C-OAD-E-U-2-59596161-S 3AL 97770 BD**
C-OAD2-U-2-47474949 3AL 97653 BE**

2-channel unidirectional OADM2 without OSC C-OAD2-U-2-51515353 3AL 97653 BF**
filter C-OAD2-U-2-55555757 3AL 97653 BG**
C-OAD2-U-2-59596161 3AL 97653 BH**
C-OAD2-E-U-2-47474949-S 3AL 97771 BA**

2-channel unidirectional OADM2E with OSC C-OAD2-E-U-2-51515353-S 3AL 97771 BB**
filter C-OAD2-E-U-2-55555757-S 3AL 97771 BC**
C-OAD2-E-U-2-59596161-S 3AL 97771 BD**
4-channel unidirectional OADM2 without OSC C-OAD2-U-4-47495153 3AL 97653 CA**

filter C-OAD2-U-4-55575961 3AL 97653 CC**
4-channel unidirectional OADM2E with OSC C-OAD2-E-U-4-47495153-S 3AL 97771 CA**

filter C-OAD2-E-U-4-55575961-S 3AL 97771 CB**
C-OAD-B-1-4755 3AL 97539 FA**

1-channel bi-directional OADM without OSC C-OAD-B-1-4957 3AL 97539 GA**
filter C-OAD-B-1-5159 3AL 97539 HA**
C-OAD-B-1-5361 3AL 97539 JA**
C-OAD-B-1-4755-S 3AL 97539 BA**

C-OAD-B-1-4957-S 3AL 97539 CA**
1-channel bi-directional OADM with OSC filter
C-OAD-B-1-5159-S 3AL 97539 DA**
C-OAD-B-1-5361-S 3AL 97539 EA**
N.B. 2XGE board and 2XGE-FC board have the same function. 2XGE with P/N 3AL97800AA**
only support DC48V, while 2XGE-FC with P/N 3AL97878AA** can support DC48/60V.
N.B. PSC3 board is only used on CO shelf.
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1.5.3 Slot allocations
1.5.3.1 Slot allocations for compact shelf
The board composition and placement in a shelf has some constraints at the hardware, software and
functional levels.
In the 1692MSE release 3.2A, up to four compact shelves are supported in a NE. For Hardware
and/or Software organization, some boards are located on dedicated slots.
Mandatory boards are: ESC-LC, LAN-Q, PSC, PSC2 and FAN.
Table 12 Slot allocations for compact shelves in 1692MSE release 3.2A

Allowed unit types in master shelf
Units
1 2 3 4 5 6 7 8 9 10 11 12 13
ESC-LC x
MDX x x x x x
OAD* x x x x x
C-OAD2-4 x
WLA x x x x x
OCC10 x x x x x
2XGE-FC x x x x x
C-4xANY x x
OMSP x x
LAN-Q x
PSC x x
PSC2 x x
OSC x x
FAN x
HK x
RAI x x
Allowed unit types in slave shelves
Units
1 2 3 4 5 6 7 8 9 10 11 12 13
MDX x x x x x
OAD* x x x x x
C-OAD2-4 x
WLA x x x x x
OCC10 x x x x x
2XGE-FC x x x x x
C-4xANY x x
I-LINK-S x
OMSP X** x x
PSC2 x x
FAN x
HK x
* Except C-OAD2-U-4-XXXX and C-OAD2-E-U-4-XXXX-S.

** Due to the hardware limitation, the slot 9 in the third expansion shelf can’t be provisioned when
PSC is used in master shelf. If PSC2 is used, there is no such constraint.
N.B. The WLA includes WLA3C and WLA3COP. The OCC10 includes OCC10-NA and
OCC10-EC.
N.B. The OAD includes C-OAD and C-OAD2. The MDX includes C-MDX and C-MDX2. The
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C-OAD, C-OAD2, C-MDX and C-MDX2 respectively include many kinds of board according to
different wavelengths and other features.
N.B. OSC cards can be placed in slots 9 or 11 of the master shelf. When the OSC board is
plugged in slot 9, the MDX/OAD board must be placed in slot 2. If only one OSC is used, slot 11 is
preferred.
N.B. Only one HK board can be configured in a NE.
1.5.3.2 Slot allocations for CO shelf
In the 1692MSE release 3.2A, only one CO shelf is supported in a NE.
Mandatory boards are: ESC-LC, LAN-Q, PSC/PSC3 and FAN-CO.
Table 13 Slot allocations for CO shelf in 1692MSE release 3.2A

Units 1 2 3 4 5 6 7 8 9 10 11 12 13
ESC-LC x
MDX x x x x x x x x x x x x
OAD* x x x x x x x x x x x x
C-OAD2-4 x
WLA x x x x x x x x
OCC10 x x x x x x x x
2XGE-FC x x x x x x x x
C-4xANY x x x x x x
14 15 16 17 18 19 20 21 22 23 24
MDX x x x x x x x x x x
OAD* x x x x x x x x x x
C-OAD2-4 x
WLA x x x x x x x x
OCC10 x x x x x x x x
2XGE-FC x x x x x x x x
C-4xANY x x x x x
25 26 27 28 29 30 31 32 33 34 35 36 37
PSC/PSC3 x
LAN-Q x
OSC x
OMSP x x x x x x x x
HK x
RAI x
38 39 40 41 42 43 44 45 46 47 48 49
PSC/PSC3 x
OSC x
OMSP x x x x x x x x
FAN-CO x
* Except C-OAD2-U-4-XXXX and C-OAD2-E-U-4-XXXX-S.
N.B. The WLA includes WLA3C and WLA3COP. The OCC10 includes OCC10-NA and
OCC10-EC.
N.B. The OAD includes C-OAD and C-OAD2. The MDX includes C-MDX and C-MDX2. The
C-OAD, C-OAD2, C-MDX and C-MDX2 respectively include many kinds of board according to
different wavelengths and other features.
N.B. The OSC must host in slots 35 and 43. If the OSC is put in slot 35, slot 10 must be plugged
with MDX/OAD. If the OSC is put in slot 43, slot 18 must be plugged with MDX/OAD.
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1.6 System Configuration
1.6.1 Configuration criteria
The basic configuration of the 1692 MSE relies on the following criteria:
The network architecture and the position of the equipment in the network define the NE type (line
terminal, OADM, back to back terminal, regenerator or CPE).
Optical power budget limitations
Need for upgrading
Further need for the Optical Supervision Channel
The initial cost
Once the basic configuration is defined, secondary criteria will be determinant to define the optional
features:
TDM concentrator (C-4xANY)

Up to 4 client signals may be multiplexed on a single STM-16. The concentration of 4 client
signals on a unique CWDM channel requires a C-4xANY board but saves up to 3 CWDM
channels.
Optical Sub-Network Connection Protection (O-SNCP)

In ring networks, channels that carry important or priority traffic can be individually protected.
The protection of a channel requires a WLA3COP board.
Supervision function
The supervision feature requires an OSC board. The feature also requires the OSC insertion MUX
and the OSC extraction DMUX implemented in some OAD and MDX boards.
1.6.2 Terminal configuration
1.6.2.1 Unidirectional application
For release 3.2A product, a NE is composed of up to four compact shelves or one CO shelf. The
equipment can be configured as 3 typical terminals.
1.6.2.1.1 Only WLA
For multi-compact shelves application, the WLA/OCC10/2XGE-FC cards are placed in slot 2, 3, 4, 5
or 6 of master or slave shelves.
The C-MDX cards are placed in slot 2, 3, 4, 5 or 6 of master or slave shelves.
The OSC board (if needed) should be placed in slot 9 or slot 11 of master shelf.
The OMSP card is placed in slot 9 or 10 of master shelf or 9, 10 or 11 of slave shelves.
Following configuration is just an example.
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WLA3C
Slot 6 12 PSC2
WLA3C Slot 5 11 (OSC)
FAN WLA3C Slot 4 10
WLA3C Slot 3 9 (OMSP)
C-MDX-U/C-MDX-E-U-S Slot 2 8 LAN-Q

13
(): Selectable
Figure 53 An example for slot allocations in unidirectional application (only WLA)
1.6.2.1.2 Only C-4xANY
a) Using compact shelves

For release 3.2A products, when compact shelves are used, up to 8 C-4xANY boards can be
supported in one NE.
The C-4xANY cards are placed in slot [3,4] or [5,6] of master or slave shelf.
The C-MDX cards are placed in slot 2, 3, 4, 5 or 6 of master or slave shelves.
The following configuration is just an example.
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Slot 6 12 PSC2
C-4xANY
11 (OSC)
Slot 5
FAN 10
Slot 4
C-4xANY
Slot 3 9

13
Slot 6 12 PSC2
C-4xANY
Slot 5 11
FAN Slot 4 10
C-4xANY
Slot 3 9
Slot 2 8
13
I-LINK-S Slot 1 7 PSC2
Slot 6 12 PSC2
C-4xANY
Slot 5 11
FAN 10
Slot 4
C-4xANY
Slot 3 9
Slot 2 8
13
Slot 6 12 PSC2
C-4xANY
Slot 5 11
FAN Slot 4 10
C-4xANY
Slot 3 9
Slot 2 8
13
(): Selectable
Figure 54 An example for slot allocations in unidirectional application (using compact shelves,
only C-4xANY)
b) Using CO shelf
For release 3.2A, when CO shelf is used, up to 8 C-4xANY can be supported in one NE.
Following configuration is just an example.
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C-
ESC- MDX
LC C-4xANY C-4xANY C-4xANY C-4xANY 11 12 13 C-4xANY C-4xANY C-4xANY C-4xANY 22 23 24
-E-U
-S
LAN
PSC 27 28 29 30 31 32 33 34 OSC 36 37 38 39 40 41 42 43 44 45 46 47 PSC
Q
FAN-CO
Figure 55 An example for slot allocations in unidirectional application (using CO shelves, only
C-4xANY)
1.6.2.1.3 Mixing WLA and C-4xANY
Either compact shelves or CO shelves can be used to provide 8 λ unidirectional terminals. An

example with CO shelf is as follows:
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C-
ESC WLA WLA MDX
2 3 6 7 8 9 11 12 13 C-4xANY C-4xANY C-4xANY C-4xANY 22 23 24
-LC 3C 3C -E-U
-S
LAN
PSC 27 28 29 30 31 32 33 34 OSC 36 37 38 39 40 41 42 43 44 45 46 47 PSC
Q
FAN-CO
Figure 56 An example for slot allocations in unidirectional application (using CO shelves, mixed
WLA and C-4xANY)
1.6.2.2 Bi-directional terminal configuration
In this case, there are only 4 channels per direction available. When compact shelves are used:
The WLA/OCC10/2XGE-FC cards are placed in slot 2, 3, 4, 5 or 6 of master or slave shelves.
The C-MDX-B- (S) cards are placed in slot 2, 3, 4, 5 or 6 of the master or slave shelves.
The OSC board (if needed) should be placed in slot 9 or slot 11 of the master shelf.
The OMSP cannot be used in the bi-directional configuration.
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WLA3C
Slot 6 12 PSC2
FAN Slot 4 10
Slot 3 9
C-MDX-B-(S) Slot 2 8 LAN-Q

13
Figure 57 Slot allocations in bi-directional application
1.6.3 OADM configuration
When compact shelves are used:
The WLA/OCC10/2XGE-FC cards are placed in slot 2, 3, 4, 5 or 6 of master or slave shelves.
The C-OAD cards are placed in slot 2, 3, 4, 5 or 6 of master or slave shelves.
The OMSP card is placed in slot 9 or 10 of the master shelf or 9, 10 or 11 of slave shelves.
N.B. C-OAD2-4 only can be placed [2,3] of the master or slave shelf.
1.6.3.1 1-channel OADM
Any wavelength among the eight CWDM wavelengths can be added and dropped. So, there are 8
types of 1-channel OADM modules according to the different wavelengths.
WLA3C
Slot 6 12 PSC2
Slot 5 11 (OSC)
FAN Slot 4 10
Slot 3 9
C-OAD-E-U-1-XX-S/C-OAD-U-1-XX Slot 2 8 LAN-Q

13
(): Selectable
Figure 58 An example for slot allocations in unidirectional OADM application (1 channel
add/drop)
In this case, only 2 channels per direction can be added and dropped. Depending on different
wavelength combinations, there are four kinds of OADM boards.
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Table 14 Wavelength combination for unidirectional application
Number 1 2 3 4
Channels (nm) 1470,1490 1510,1530 1550,1570 1590,1610
WLA3C Slot 6 12 PSC2
FAN Slot 4 10
Slot 3 9
C-OAD-E-U-2-XXXX-S/C-OAD-U-2-XXXX Slot 2 8 LAN-Q

13
(): Selectable
add/drop)
In this case, only 4 channels per direction can be added and dropped. Depending on different
wavelength combinations, there are two kinds of OADM boards.
Table 15 Wavelength combination for unidirectional application

Number 1 2
Channels (nm) 1470,1490,1510,1530 1550,1570,1590,1610
Slot 6 12 PSC2
FAN WLA3C Slot 4 10
Slot 3 9
C-OAD2-E-U-4-XXXXXXXX-S/C-OAD2-U-4-XXXXXXXX
Slot 2 8 LAN-Q
13
WLA3C
Slot 6 12 PSC2
WLA3C Slot 5 11
FAN Slot 4 10
Slot 3 9
Slot 2 8
13
(): Selectable
add/drop)
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1.6.3.4 Bi-directional transmission in one fiber
In this case, only 1 channel per direction can be added and dropped. Depending on different
wavelength combinations, there are four kinds of OADM boards.
Table 16 Wavelength combination for a bi-directional application

Number 1 2 3 4
Channels (nm) 1470,1550 1490,1570 1510,1590 1530,1610
WLA3C
Slot 6 12 PSC2
Slot 5 11 (OSC)
FAN Slot 4 10
Slot 3 9
C-OAD-B-1-XX-S/C-OAD-B-1-XX Slot 2 8 LAN-Q

13
(): Selectable
Figure 61 An example for slot allocations in bi-directional OADM application
1.6.4 Regenerator configuration
As mentioned before, up to 8 channels can be regenerated in per direction in one NE when

MUX/DMUX is used; up to 4 channels can be regenerated in per direction in one NE when OADM is
used.
The WLA/2XGE-FC cards are placed in slot 2, 3, 4, 5 or 6 of the master or slave shelves.
The C-4xANY cards are placed in slot [3,4] or [5,6] of the master or slave shelf.
The C-MDX-U/ C-MDX-E-U-S cards are placed in slot 2, 3, 4, 5 or 6 of the master or slave shelf.
The C-OAD2-4 can be placed in slot [2,3] of the master or slave shelf.
The OSC board (if needed) should be placed in slot 9 or slot 11 of the master shelf.
1.6.4.1 Regenerator configuration (using MUX/DMUX)
In this configuration, three shelves are needed.
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Slot 6 12 PSC2
C-MDX-E-U-S Slot 5 11 OSC
FAN WLA3C Slot 4 10
WLA3C Slot 3 9
C-MDX-E-U-S Slot 2 8 LAN-Q

13
WLA3C
Slot 6 12 PSC2
WLA3C Slot 5 11
FAN WLA3C Slot 4 10
WLA3C Slot 3 9
Slot 2 8
13
WLA3C
Slot 6 12 PSC2
WLA3C Slot 5 11
FAN Slot 4 10
Slot 3 9
Slot 2 8
13
Figure 62 An example for slot allocations in regenerator applications (MUX/DMUX)
N.B. In above figure, set WLA3C remote loopback (loopback on line side).
1.6.4.2 Regenerator configuration (using OADM)
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Slot 6 12 PSC2
WLA3C Slot 5 11 OSC
FAN WLA3C Slot 4 10
Slot 3 9
C-OAD2-E-U-4-XXXXXXXX-S
Slot 2 8 LAN-Q
13
WLA3C
Slot 6 12 PSC2
WLA3C Slot 5 11
FAN Slot 4 10
Slot 3 9
Slot 2 8
13
Figure 63 An example for slot allocations in regenerator application (OADM)
N.B. In above figure, set the WLA3C remote loopback (loopback on line side).
1.6.5 CPE configuration
There are two types of CPE, one-channel CPE and two-channel CPE. In both types only a master shelf
is needed.
1.6.5.1 One-channel CPE
The WLA/OCC10/2XGE-FC cards are placed in slot 2, 3, 4, 5 or 6 of the master shelf.
The C-MDX2-E-1-S cards are placed in slot 2, 3, 4, 5 or 6 of the master shelf.
The OSC board should be placed in slot 9 or slot 11 of the master shelf.
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Slot 5 11 OSC
FAN Slot 4 10
Slot 3 9
C-MDX2-E-1-S Slot 2 8 LAN-Q

13
Figure 64 An example for slot allocations in one-channel CPE application
1.6.5.2 Two-channel CPE
The WLA/OCC10/2XGE-FC cards are placed in slot 2, 3, 4, 5 or 6 of the master shelf.
The C-MDX2-E-2-XX-S cards are placed in slot 2, 3, 4, 5 or 6 of the master shelf.
The OSC board should be placed in slot 9 or slot 11 of the master shelf.
Slot 5 11 OSC
FAN Slot 4 10
Slot 3 9
C-MDX2-E-2-XX-S Slot 2 8 LAN-Q

13
Figure 65 An example for slot allocations in two-channel CPE application
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1.7 Optical safety
1.7.1 General information
1.7.1.1 Hazard level
HAZARD LEVEL 1M, according to IEC 60825-1 (1998), and IEC 60825-2 (2000) requirements, can
be assigned to all ports of the system.
1.7.1.2 Location type
The equipment shall be installed in “Restricted Location” (industrial and commercial premises) or
controlled locations (optical cable ducts and switching centers).
1.7.1.3 Labeling
The labels reported below are applied during factory settings. The labels are affixed on all front covers
that protect optical connectors. They are on the front side plate of all the units involved in optical
transmission:
HAZARD symbol:
Example of EXPLANATORY label:
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1.8 1692MSE System characteristics
1.8.1 Power supply
Two PSC or PSC2 cards are in charge of feeding the shelf.
Input power stage

The following figure shows the equipment input power stage housed on the two PSC/PSC2/PSC3. It
provides adaptation to the customer central power bus by a main power block and supplies all the
SPIDER FPGA by means of an on-board converter.
Distributed power stage

All the boards receive the +3.6 V and the 5.5 V voltages to power the SPIDER FPGA present on each
card. Moreover, some boards receive the +BATT –BATT voltages generated by the input stage of the
PSC/PSC2/PSC3.
Normal service range

The normal input voltage range of the power supply module is either:
-36V～-72V
Figure 66 1692MSE input power stage (same as PSC2)
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Normal service range
DC/DC Power supply units output voltages: + 3.6 V ± 3%

+ 5.5 V ± 3%
PSC/PSC2/PSC3 is used in 1692MSE system, slot 7 and slot 12. Its main purpose is to:
Supply and distribute -48/-60V filtered and protected voltage to all the boards in the shelf of the
1692MSE.
Supply and distribute 3V service voltage dedicated to SPIDER circuitry in all the boards.
Supply and distribute 5V auxiliary voltage.
Make a termination of ISPB bus, ISSB bus (GTLP Levels) and SPI bus (TX side).
Give alarms on fault battery and voltages loss.
The PSC/PSC2/PSC3 boards work in “1 + 1” protection.
1.8.2 Equipment and shelf control
It is important to note that management is performed by SNMP protocol. The physical link is obtained
by ESC-LC EC/ESC-LC SC dialog through the ISSB Bus.
SHELF PDU/
TRU
Power supply
PSC/ PSC/
PSC2 Power supply
PSC2
ESC-LC
EC SNMP
LAN
HK
O
W O O M HK
M PDU/TRU
L S A D SC
S RAI
A C D X
P
SPI--A
SPI--B
Figure 67 Equipment and shelf control
1.8.3 Management and monitoring interfaces
The 1692MSE also provides the management and monitoring functions:
Interface SNMP with a personal computer (ECT or RECT function) and 1353SH Network
Management System (on terminal)
Station alarms
Alarm status of the equipment and monitoring (indicated by the front cover LEDs)
Visual indications for the card failure.
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The 1692MSE supports the following interfaces:
SNMP: For connection to Equipment Craft Terminal (ECT) or Remote Craft Terminal
(RECT)
Ethernet: For connection to OS 1353SH and other ALCATEL Nes with ETHERNET Interface
QECC: For connection to other WDM Nes
Local/Remote: Craft Interface
RS232 9-pin D, PC compatible 38400 bit/s (Personal Computer)
Protocol Stack/Information Model messages
SNMP
Local and remote management interfaces functions
Alarms status checks, equipment, connection & TMN configurations, and maintenance memory for all
the equipment events.
Equipment software download (local and remote) on non-volatile memories without traffic
interruption.
Unit and equipment acknowledgement
Through Remote Inventory Company ID, Unit type. Unit part number, Software part number,
Manufacturing Plant, Data Identifier, Date.
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1.9 Environmental characteristics
The 1692MSE is designed to be compliant with both ETSI and ANSI standards.
The technical data of this chapter refers to ITU-T Recommendations, ETSI Standards or Telcordia
(former Bellcore) Standards.
1.9.1 ETSI compliancy
The electromagnetic compatibility requirements for the system are specified in the pr ETS 300 386.
The following features are applicable:
Environmental class 1
Normal priority of service
Immunity
The following table specifies the valid tests and their compliance criteria for immunity. All the items
make reference to the chapters of the pr ETS 300 386.
Table 17 Valid tests and compliance criteria for immunity

Coupling Test Compliance
Phenomenon Test Level
(Port) Method Criterion
Electrostatic 4 Kv (contact) / 4 Kv (air) NP
- -
Discharge 6 Kv (contact) / 8 Kv (air) LFS
DC power - 500V NP
Electrical Fast Transients 500V NP
Signal -
1KV LFS
Radiated 3V/m NP
- -
Electromagnetic Field 10 V/m LFS
Continuous DC power - 3V NP
Conducted Signals Signal - 3V NP
NP: Normal performance within specified limits

LFS: Loss of function (self recovery)
No corruption of data management
Temporary loss of function following application of test
Self recovery to normal performance occurs at the cessation of the test
Emission
The following table specifies the requirements for the RF emissions of the equipment. All the items
make reference to the chapters of the pr ETS 300 386.
Table 18 Requirements for RF emission

Phenomenon Coupling (Port) Test Method Maximum Level
DC power - -
Conducted emissions
Signal - Hazard level A
Radiated emissions - - Hazard level A
The designation “Hazard Level A” is defined in the EN 55 022 document.
The electromagnetic compatibility requirements for the system are specified in the GR-1089. The
recommendation related to immunity and the radiated emissions are located on 3-1 & 3-2.
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1.9.1.1 ANSI compliancy
The electromagnetic compatibility requirements for the system are specified in the GR – 1089 (see
note). The recommendation related to immunity and the radiated emissions is located section 3-1 &
3-2.
N.B. GR – 1089 – CORE

Electromagnetic Compatibility and Electrical Safety – Generic Criteria for Network
Telecommunication equipment issue 2, December 1997
1.9.2 Environmental constraints
The technical data for this chapter js, where it is possible, refers to ITU-T Recommendations or ETSI
Standards.
The system is designed for indoor operation with controlled air temperature. The complete
environmental conditions, including climatic, atmospheric and mechanical conditions, are specified in
the ETS 300 019. The following environmental hazard levels of this standard apply.
1.9.2.1 Storage
The equipment meets the following requirements involving Storage:
ETS 300 019-1-2: 1992, hazard level 1.2
Hazard level 1.2: weatherproofed, not temperature controlled storage location.
This hazard level applies to weatherproofed storage having neither temperature nor humidity control.
The location may have openings directly to the open air, i.e., it may be only partly weatherproofed.
This hazard level applies to storage locations:
Where equipment may be exposed to solar radiation and temporarily to heat radiation: They
may also be exposed to movements of the surrounding air due to draughts, e.g. through doors,
windows or other openings. They may be subjected to condensed water, dripping water and to
icing. They may also be subjected to limited wind driven precipitation, including snow.
Where mould growth or attacks by animals, except termites, may occur.
With normal levels of contaminants experienced in urban locations with industrial activities
scattered over the whole area, and/or with heavy traffic.
In areas with sources of sand or dust, including urban areas
With vibration of low significance and insignificant shock
The conditions of this hazard level may occur in:
Unattended buildings
Some entrances of buildings
Some garages and shacks
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Table 19 Main climatic conditions
Main Climatic Conditions Unit Value
Low air temperature ℃ -25
High air temperature ℃ 55
Low relative humidity % 10
High relative humidity % 100
3
Low absolute humidity G/m 0.5
High absolute humidity G/m3 29
Rain intensity mm/Min No
Rate of change of temperature ℃/Min 0.5
Low air pressure kPa 70
High air pressure kPa 106
Solar radiation W/m2 1120
Movement of the surrounding air m/s 30
Condition of condensation - Yes
Condition of precipitation - Yes, wind-driven precipitation
Condition of icing and frosting - Yes
Climatogram - 2 (ETS 300 019-1-1)
Figure 68 Climatogram for hazard level 1.2: no temperature controlled storage location
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1.9.2.2 Transportation
The equipment meets the following requirements involving transportation:
ETS 300 019-1-1: 1992, hazard level 2.2 (Careful transportation)
This hazard level applies to transportation where special care has been taken e.g. with respect to low
temperature and handling.
Hazard level 2.2 covers the condition of hazard level 2.1. In addition hazard level 2.2 includes
transportation in all types of trucks and trailers in areas with a well-developed road system.
It also includes transportation by ship and by train specially designed with shock-reducing buffers.
Manual loading and unloading of up to 20 Kg is included.

Environmental Parameter Unit Value
High air temperature, air in unventilated enclosures ℃ 70
High air temperature, air in ventilated enclosures or outdoor air ℃ 40
Relative humidity % 95
3
Absolute humidity g/m 60
Rain intensity mm/Min 6
2
Solar radiation W/m 1120
2
Heat radiation W/m 600
1.9.2.3 Climatic conditions for operating
The Equipment meets the requirements of ETSI Stand. The functionality of the Equipment, in relation to
Temperature, is in compliance with:
ETS 300 019-1-3: 1992, hazard level 3.2
Hazard level 3.2: Partlial temperature-controlled locations.
This hazard level applies to locations:
Where installed equipment may be exposed to solar radiation and heat radiation. They may also be
exposed to movements of the surrounding air due to draughts in buildings, e.g. through open
windows. They may be subjected to condensed water and to water from sources other than rain and
icing. They are not subjected to precipitation:
Where mould growth or attacks by animals, except termites, may occur.

With normal levels of contaminants experienced in urban locations with industrial activities
scattered over the whole area and/or with heavy traffic.
In close proximity to sources of sand or dust.
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With vibration of low significance, e.g. for products fastened to light supporting structures
subjected to negligible vibrations.
The conditions of this hazard level may be found in:
Entrances and staircases of buildings

Garages
Cellars
Certain workshops
Buildings in factories and industrial process plants
Unattended equipment stations
Certain telecommunication buildings
Ordinary storage rooms for frost resistant products and farm buildings…
Figure 69 Climatogram for hazard level 3.2: partly temperature controlled locations
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Environmental Parameter Unit Value
High air temperature ℃ 45
Low relative humidity % 5
High relative humidity % 95
3
Low absolute humidity G/m 1
3
High absolute humidity G/m 29
Rate of change of temperature ℃/Min 0.5
High air pressure kPa 106
2
Solar radiation W/m 700
2
Heat radiation W/m 600
Condition of wind-driven rain, snow - No
Condition of icing - Yes
Climatogram 2 (ETS 300 019-1-3)
1.9.2.4 Waste of Electrical and Electronic Equipment (WEEE)
The marking printed on the subrack denotes compliancy with the Directive 2002/96/EC on
Waste of Electrical and Electronic Equipment.
The general principle is the producer responsibility in the management of the products he puts on the
market when discarded by the owner. The producer responsibility now covers the end of life of the
products sold.
The European directive is effective in a country once transposed. The starting date for the producer
responsibility for the European text is 13th August 2005.
All Alcatel products fall under in Category 3 of Annex 1A of the WEEE directive (Directive 2002/96/
EC). I.e. ”IT and Telecommunication equipment” under item ”Other products transmitting sound,
images or other information by telecommunications”.
Alcatel products fall under WEEE directive name: “Other product or equipment of transmitting
sound, images or other information by telecommunications” in Annex 1B.
This mark will not cause any responsibility as all responsibilities will be defined by contract.
1.9.2.5 Acoustical noise
The acoustical noise level of the product complies with:
ETS 300 753 Environmental Class 3.1 for attended telecommunication equipment rooms
(maximum sound level 7.2 bels).
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2 MECHANICAL DESCRIPTION
In 1692MSE release 3.2A, compact shelves or CO shelf can be used in a NE. A fully loaded 1692MSE
system can be housed in a single standard ETSI or ANSI rack (compact shelf can also be placed on the
desk).
2.1 Rack design
The 1692MSE mechanical design allows to put up to four CO shelves or up to 12 compact shelves in a
single rack. It is compatible with the following mechanical standards:
A 2000 mm high ETSI rack

A 2150 mm high ANSI rack
A 1950 mm high NEBS 2000 rack
Figure 70 Rack description
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2.2 CO shelf
Only one CO shelf can be managed in a 1692MSE NE.
2.2.1 Shelf organization
The CO shelf is divided into 49 board or unit slots, grouped in three parts:
The main part, which is the upper part and which comprises the slots from 1 to 24.
The first extension part, which is the middle part and which comprises the slots from 25 to 48.
The second extension part, which is the bottom part and which comprises the slot 49.
Figure 71 Shelf organization
Figure 72 Shelf front view with cover
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2.2.2 Shelf dimensions
Figure 73 Shelf dimensions
2.3 Compact shelf
The 1692MSE shelf is “Compact WDM” architecture. The following is the mechanical photo for single
shelf (main or slave).
The operator must wear a wrist-strap bracelet connected to the mechanical ground (available on
the rear of the shelf) for each handling a board, optical connectors or a part of the shelf.
Figure 74 1692MSE single shelf
Main features provided by the 1692MSE shelf:
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It is very easy to use due its small size.
Up to 12 shelves can be set in a 2000 mm high ETSI rack, or a 2150 mm high ANSI rack, or
1950 mm high NEBS 2000 rack.
It can be placed on the outside of rack, such as on the desk.
N.B. For compact shelf, the front cover can not be installed when the slave shelves are used.
2.3.1 Shelf organization
The 1692MSE single compact shelf is divided into 13 board or unit slots, grouped in three parts:
The main part comprises the slots from 1 to 6 used for the main boards.
The right side part comprises the slots from 7 to 12 used for the small boards.
The left side part comprises the slot 13 available for the FAN board.
Second extension part (slot 13) First extension part (slot 7 to 12)
Main part (slot 1 to 6)

Figure 75 1692 MSE compact shelf mechanical structure
2.3.2 Shelf dimensions
Shelf size:
The size of the 1692 MSE shelf is 446.2 (width) x 274mm (depth with cover) x 132.4 mm (height).
The depth is compliant with the 300 mm deep ETSI rack (no limitation in ANSI rack).
On the Release 3.2A, up to four compact shelves can be is managed in one NE. The dimension for the
four shelves is the same. See the following figure.
Slot 6 12 PSC2
132.4 mm
Slot 5 11
FAN Slot 4 10
Slot 3 9
Slot 2 8 LAN-Q
13 ESC-LC Slot 1 7 PSC2
446.2mm
Figure 76 Shelf dimension and shelf partitioning
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2.4 Unit front view
Figure 77 ESC-LC front view
Figure 78 LAN-Q board front view
Figure 79 PSC2 board front view
Figure 80 FAN board front view
Figure 81 FAN-CO board example
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Figure 82 OSC board front view
Figure 83 OMSP board front view
Figure 84 WLA3C board front view
Figure 85 WLA3COP board front view
Figure 86 OCC10-NA board front view
Figure 87 2XGE-FC board front view
Figure 88 C-OAD-E-U-1-6161-S board front view
Figure 89 C-OAD2-E-U-4-55575961-S board front view
Figure 90 C-MDX-E-U-S board front view
Figure 91 C-4xANY board front view
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Figure 92 HK board front view
Figure 93 RAI board front view
Figure 94 I-LINK-S board front view
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2.5 Power consumption and weight
2.5.1 Maximum power consumption and weight of the boards and units
Table 22 Maximum power consumption of the units

Unit Maximum Power Consumption (W) Weight Indication (kg)
ESC-LC 10 0.85
LAN-Q 2.4 0.13
PSC 0.4 + Psec (*) 0.28
PSC2 1.4 0.30
FAN 14 0.33
FAN-CO 20 2.1 (Fan module +filter)
WLA3C/WLA3COP 19.7 0.73/0.74
OCC10-NA 22.65 0.97
OCC10-EC 20.9 (with XFP) 0.87 (without XFP)
2XGE-FC 21.5 0.91
OSC 4 0.2
OMSP 4 0.3
HK 2.5 0.13
RAI 2 0.12
OAD/MDX 3 1.2
I-LINK-S 2.8 0.6
C-4xANY without drawers 20 1.25
C-4xANY with 4 drawers 32 1.65
Drawer 3(each) 0.1(each)
(*) For each PSC board, Psec = 1/2_(Pshelf 5V + Pshelf 3.3V)_(1-0.85).

Pshelf 5V is the power consumption of the 5V feed,
Pshelf 3.3V is the power consumption of the 3.3V.
2.5.2 Maximum power consumption of the equipment
The following table gives an estimation of maximum power consumption of the 1692MSE for different
typical configuration (just for examples).
Table 23 Estimated maximum power consumption of the equipment

Item Number of Units Power Dissipation Per Item (w)
Configuration 1: 8 lambda with WLA3C in one compact shelf
ESC-LC 1 10
LAN-Q 1 2.4
FAN 1 14
PSC2 2 1.4
C-MDX2-E-U-S 1 3
WLA3C 4 19.7
OSC 1 4
OMSP 1 4
Total Power Consumption 119W
Configuration 2: 8 lambda with mixed 4xANY cards with 4 cartridges and WLA3C in CO shelf
ESC-LC 1 10
LAN-Q 1 2.4
FAN-CO 1 20
PSC 2 0.4 + Psec
C-MDX2-E-U-S 1 3
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C-4xANY 2 32
WLA3C 3 19.7
OSC 1 4
OMSP 1 4
Total Power Consumption 171.5W
2.6 FIT of 1692 MSE
The following table lists the FIT of some units used in 1692MSE.
Table 24 FIT of 1692 MSE

Unit FIT Unit FIT Unit FIT
L1.1 351 C-4xANY 5868 C-OAD2-E-U-1-XX-S 491
L1.2_DDM 356 HF_1310 1350 C-OAD-U-2-XXXX 307
L4.2_DDM 356 SDH_1310 1050 C-OAD-E-U-2-XXXX-S 387
2M 107 LF_1310 1070 C-OAD2-U-2-XXXX 456
S1.1* 232 HF_850 800 C-OAD2-E-U-2-XXXX-S 537
S16.1* 351 LF_850 528 C-OAD2-U-4-XXXX 547
L16.1 351 WLA3C 2291 C-OAD2-E-U-4-XXXX-S 627
L16.2 356 WLA3COP 2306 C-OAD-B-1-XX 257
S4.1* 232 OCC10-EC 2502 C-OAD-B-1-XX-S 350
I16* 107 2XGE-FC 2292 ESC-LC 3219
GbE_SX* 61 C-MDX-U 387 LAN-Q 1050
GbE_LX* 107 C-MDX-E-U-S 427 PSC 1300
GbE_ZX_DDM 356 C-MDX-B 299 PSC2 1320
2FC SX_DDM 75 C-MDX-B-S 343 HK 1500
2FC LX_DDM 75 C-MDX2-U 480 RAI 1100
PIN* 313 C-MDX2-E-U-S 510 I-LINK-S 1170
APD* 275 C-MDX2-E-1-S 325 OMSP 500
XFP 754 C-MDX2-E-2-XX-S 375 OSC 449
- - C-OAD-U-1-XX 262 FAN-CO 6504
- - C-OAD-E-U-1-XX-S 342 FAN 2166
- - C-OAD2-U-1-XX 406 - -
* It includes two types of SFPs: with or without DDM function.
N.B. The FIT of WLA only includes one channel in the WLA board, but the one of WLA-P includes
both channels of the board.
N.B. The above FIT values are deduced from the corresponding MTBF values.
N.B. 4 main contribution are not taken into account in the FIT calculation:
1) Mechanical damage
These failures could be caused for example by poor handling, wrong packaging or incorrect
transportation.
2) Problems of diagnostic leading to NFF (No Failure Found) A certain number or units returned to
Alcatel have been declared in failure after an error of diagnostic. These units are not in failure and are
declared NFF after the reparation process. From our experience of major networks, this NFF rate is
generally around 20% of returns. A higher NFF rate would mean that the diagnostic process has to be
revised.
3) FIT values do not apply to Installation/Commissioning failures and to the first months of the
network operation.During this period, failures (reported as “Early Life Failures” or “Infant Mortality”)
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happen at higher rates than calculated FITs, due either to incorrect installation or to the presence of
weak components. It is reasonable to assume that during the first 6 months of operation, the observed
failure rate can be up to twice the predicted value
4) FITs do not take into account punctual defects that cannot be predicted, like a wrong component
lot/batch coming from our suppliers manufacturing process.
2.7 Equipment connections
The external connections of the 1692MSE may be divided into the following categories:
Optical
Management
Power supply
2.7.1 Optical connections
In 1692MSE, two kinds of optical connectors are used: LC and MU.
Table 25 Optical connections in 1692MSE

Unit LC MU Direction
WLA/2XGE-FC √ Inclined
OSC √ Straight
MDX/OAD √ Inclined
OMSP √ Straight
OCC10-NA √ Inclined
OCC10-EC √ √ Inclined
a) WLA/2XGE-FC board
Figure 95 LC optical connectors
b) OSC board
Figure 96 LC optical connectors
c) OMSP board
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Figure 97 MU optical connectors
d) OAD and MDX board
e) OCC10-NA board
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2.7.2 Management connections
2.7.2.1 Housekeeping
The housekeeping alarm signals are available on the front panel connector of the HK board. It is a 25
pin SUB-D Female connector.
Table 26 Connector access

Number Name Description Connector
1 Common out Common Output
2 OUT1 Output
3 OUT2 Output
4 OUT3 Output
5 OUT4 Output
6 OUT9_1 Output
7 OUT9_2 Output
8 OUT9_3 Output
9 IN1 Input
10 IN2 Input
11 IN3 Input
12 IN4 Input
13 GNDP Input Signal Ground
14 Common out Common Output
15 OUT8 Output
16 OUT7 Output
17 OUT6 Output
18 OUT5 Output
19 IN9_1 Input
20 IN9_2 Input
21 IN8 Input
22 IN7 Input
23 IN6 Input
24 IN5 Input
25 GNDP Input Signal Ground
26 GNDM Mechanical Ground
27 GNDM Mechanical Ground
N.B. The 25 pin SUB-D connector is connected to GNDM through the 2 screw holes called pin 26
and pin 27.
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2.7.2.2 Rack Alarm Interfaces
The rack alarm interface signals are available on the two front panel connectors of the RAI board. The
two interfaces are:
A 9 pins SUB-D female connector, which provides the interface between the master shelf and the
TRU (or PDU).
A 6 pins connector, which provides the interface between two shelves.
Master shelf - TRU interface

Table 27 Pins SUB-D connect access
1 CRI _AL_UP Critical (or Urgent) Alarm Output
2 GNDP Common Inputs
3 MAJ_AL_UP Major (or Non-Urgent) Alarm Output
4 RACK_AL_UP Rack (or Up) Alarm Output
5 MIN_AL_UP Minor (or Non-Urgent) Alarm Output
6 AL_IN_COM Common Outputs
7 PRM_AL_UP Primary Alarm Input
8 SEC_AL_UP Secondary Alarm Input
9 FAN-AL_UP Fan Alarm Input
Master shelf - shelf interface

Table 28 Pins RJ11 connector access
1 CRI_AL_DOWN Critical (or Urgent) Alarm Input
2 MAJ_AL_DOWN Major (or Non-Urgent) Alarm Input
3 RACK_AL_DOWN Rack (or Up) Alarm Input
4 MIN_AL_DOWN Minor (or Non-Urgent) Alarm Input
5 AL_IN_COM Common Inputs
6 AL_IN_COM Common Inputs
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2.7.2.3 LAN accesses
The LAN-Q board can be accessed by the RJ-45 connector on its front panel.
Table 29 RJ 45 connector access

1 RX-P Reception-Positive
2 RX-N Reception-Negative
3 TX-P Transmission-Positive
4 Not Used -
5 Not Used -
6 TX-N Transmission-Negative
7 Not Used -
8 Not Used -
2.7.2.4 “F” interface
At the ESC-LC front panel, a 9-pin SUB-D female connector provides an access to an ”F” interface. It
allows connection to a Craft Terminal.

1 F_DCD F_DATA Carrier Detect
2 F_RXD F_Received Data
3 F_TXD F_Transmitted Data
4 F_DTR F_Data Terminal Ready
5 GND Signal Ground
6 F_DSR F_Data Set Ready
7 F_RTS F_Request To Send
8 F_CTS F_Clear To Send
9 Not Used -
2.7.2.5 “DBG” interface connector
The 8-pin RJ45 connector on the front-panel of the ESC-LC board gives an access to the “DBG”
interface.

1 Not Used -
2 Not Used -
3 D_TXD SC/EC DBG_Transmit Data
4 Not Used -
5 D_RXD SC/EC DBG_Receive Data
6 Not Used -
7 D_DTR SC/EC DBG_Data Terminal Ready
8 GND Ground
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2.7.2.6 RS485 connector
There are three RS485 connectors (I-LINK interface) on the front panel of the ESC-LC board and one
connector on the front panel of the I-LINK-S board.

1 SPI_MODE_SLAVE_DP SPI_MODE Positive
2 SPI_CLK_SLAVE_DP SPI_CLK Positive
3 SPI_TXD_SLAVE_DP SPI_TXD Positive
4 SPI_RXD_SLAVE_DP SPI_RXD Positive
5 CARD_PRES_SLAVE_DP CARD_PRES Positive
6 Not Used -
7 Not Used -
8 Not Used -
9 SPI_MODE_SLAVE_DN SPI_MODE Negative
10 SPI_CLK_SLAVE_DN SPI_CLK Negative
11 SPI_TXD_SLAVE_DN SPI_TXD Negative
12 SPI_RXD_SLAVE_DN SPI_RXD Negative
13 CARD_PRES_SLAVE_DN CARD_PRES Negative
14 ID4 Slot ID4
15 ID5 Slot ID5
2.7.3 Power supply connections
The power supply voltage is distributed to the shelves on a 3 pin SUB-D connector, on the front panel
of each PSC/PSC2/PSC3.
Table 33 Power supply 1 and 2: connector access

Number Name Connector
1 (Male) + PVBATT
2 (Female) GND
3 (Male) - NVBATT
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3 UNITS DESCRIPTION
This chapter describes the cards and units of the 1692MSE Release 3.2A. It provides for each card:
Functional diagram and description

Interface definitions
Front panel description
3.1 Wavelength Adapter
There are 2 kinds of wavelength adapters in this release:
WLA3C: WLA3 without O-SNCP

WLA3COP: WLA3 with O-SNCP
SDH and GbE

performance monitoring
8X8
User MATRIX CWDM CWDM
Input BW Rx
Tx Output
User CWDM CWDM

Output BW Tx Input
Rx
User CWDM
Input BW Rx CWDM Output
Tx
User CWDM
Output BW Tx CWDM Input
Rx
Alarm&Control
Unit
Figure 100 Block diagram of WLA3C boards
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SDH and GbE
performance monitoring
User 8X8
Input
MATRIX CWDM CWDM
BW Rx
Tx Output
User
Output
CWDM CWDM
BW Tx Input
Rx
User
Input CWDM CWDM
BW Rx Tx Output
User
Output CWDM CWDM
BW Tx Rx Input
User Input
Alarm&Control
O-SNCP Unit
module
User Output
Figure 101 Block diagram of WLA3COP boards
3.1.1 Description
The WLA unit is a bidirectional multi-rate interface. The block-diagrams are shown on the above
figures.
The electrical matrix provides some flexibility and additives features:

Add and Drop
Client (local) loopback
Line (remote) loopback
Local-Remote loopback
E-SNCP
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The alarm and control unit ensures the following functions:
Matrix management interface
Clock and Data Recovery (CDR) units management
Alarms collection and interface to the craft terminal via the shelf controller
Optical Channel protection control (configuration, switch decision unit) if an Optical-SNCP
(O-SNCP): user Tx ON/OFF control
Optical module information collection
Performance monitoring result collection
The SDH and GbE performance-monitoring units complete the following functions:
SDH B1 performance monitoring
SDH J0 performance monitoring
Gigabit Ethernet performance monitoring
3.1.2 Optical interfaces
3.1.2.1 B&W module
The optical performances for the SFP transceivers are as follows. In this release, these SFP transceivers
can be used in the user side and line side of WLA board:
Table 34 Optical parameters for SFP transceivers used in the user side
Output Sensitivity Overload
Item Fiber type
(dBm,EOL) (dBm,EOL) (dBm,EOL)
S1.1 -15~-8 -29 -8 9/125µm SMF
S4.1 -15~-8 -29 -8 9/125µm SMF
S16.1 -5~0 -19 0 9/125µm SMF
I16 -10~-3 -19 -3 9/125µm SMF
L16.1 -2~+2 -28 -8 9/125µm SMF
L16.2 -2~+2 -29 -8 9/125µm SMF
GbE_SX -9.5~-4 -18 0 50/62.5/125µm MMF
GbE_LX -11~-3 -20 -3 9/125µm SMF
S1.1_DDM -15~-8 -29 -8 9/125µm SMF
L1.2_DDM -5~0 -34 -10 9/125µm SMF
S4.1_DDM -15~-8 -29 -8 9/125µm SMF
L4.2_DDM -3~+2 -28 -8 9/125µm SMF
I16_DDM -10~-3 -19 -3 9/125µm SMF
S16.1_DDM -5~0 -19 0 9/125µm SMF
GbE_SX_DDM -9.5~-4 -18 0 50/62.5/125µm MMF
GbE_LX_DDM -11~-3 -20 -3 9/125µm SMF
GbE_ZX_DDM 0~+5 -24 0 9/125µm SMF
2FC_SX_DDM -10~-3 2FC: -16; FC: -18 0 50/62.5/125µm MMF
2FC_LX_DDM -9.5~-3 -21 -3 9/125µm SMF
3.1.2.2 Colored modules
In this release, there are 2 kinds of colored SFP that can be selected to meet the requirement of each
application. They are SILVER, BRONZE SFPs.
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The two modules are:
SFP with PIN receiver, for distances up to 40 Km, an operating bitrate from 125Mbps to 2.7Gbps
(called hereafter the BRONZE version).
“Standard” SFP with APD receiver, for distances up to 70 Km, an operating bitrate from 125Mbps
to 2.7Gbps (called hereafter the SILVER version).
Table 35 Optical parameters for SFP transceivers used in the line side
Parameter Unit Symbol Bronze Silver Note
Min 0 0 -
Output Optical Power
dBm POUT Type - - -
(EOL)
TX Side Max +5 +5 -
SMSR dB SMSR Min 30 30 -
Extinction Ratio dB ER Min 8.2 8.2 -
Average Rx
dBm RSENS Max -18 -28 1
RX Side Sensitivity@OC-48
Maximum Input Power dBm PMAX Min -3 -9 -
N.B. For the BRONZE, SLIVER SFPs, the sensitivity is measured with a PRBS 223-1 test pattern,
@2.5Gb/s, BER<10-12, EOL.
N.B. For the BRONZE, SILVER SFPs, all parameters at lower supported bitrates are better than
those at STM-16.For all these SFPs, all parameters are guaranteed under all operating
conditions, EOL.
The colored SFP also can be configured on the user side of WLA3C boards for broadcast application.
The colored SFP modules with DDM function have the same optical characteristic as the colored SFP
module without DDM function.
3.1.3 WLA configurations
3.1.3.1 Default configuration (add and drop configuration)
This configuration applies when a WLA3C board is used as a stand alone Add and Drop unit. And this
configuration is the default configuration of WLA3C.
The traffic received from a CWDM receiver is dropped on the user network, i.e. sent to a B&W
transmitter. Meanwhile the traffic received from the B&W receiver is added on to the CWDM line via
the CWDM transmitter.
The 8x8 matrix is configured as follows (example with channel 1):
Table 36 Alarms usage in add and drop configuration

Alarms
Consecutive Action
WDM Rx1 User Tx1 User Rx 1 WDM Tx1
ILOS SD of the WDM Tx1
ILOS SD of the User Tx1
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user BW CWDM CWDM
input Rx1 Tx1 output
user BW CWDM CWDM

output Tx1 Rx1 input
8 X8
Matrix
user BW CWDM CWDM
user BW CWDM CWDM

Figure 102 Add and drop matrix configuration
3.1.3.2 Local loopback configuration
This configuration is used for testing purposes on the user side. The B&W transponder on the WLA
board is configured as a loopback. In this configuration, the 8x8 matrix configuration is shown in the
next figure. Traffic received on a B&W receiver is sent to the corresponding B&W transmitter to be
tested. In this way, users can receive traffic sent by themselves. The local loopback configuration is not
allowed in the E-SNCP mode.
user BW CWDM CWDM

user BW CWDM CWDM

8 X8
Matrix
user BW CWDM CWDM
user BW CWDM CWDM

Figure 103 Local loopback matrix configuration
3.1.3.3 Remote loopback configuration
This configuration is used for testing purposes on the CWDM Side and the regenerator application. In
this configuration, the 8x8 matrix configuration is shown in the next figure (example with channel 1).
Traffic received from the CWDM receiver is sent to the corresponding CWDM transmitter to be tested.
ED 01 RL
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user BW CWDM CWDM
user BW CWDM CWDM

8X8
Matrix
user BW CWDM CWDM
user BW CWDM CWDM

Figure 104 Remote loopback matrix configuration
3.1.3.4 Local-remote loopback
This configuration is used for testing purposes on the user and CWDM side simultaneously. In this
configuration, the 8x8 matrix configuration is shown in the next figure (example with channel 1).
Traffic received from the receiver is sent to the corresponding transmitter to be tested.
user BW CWDM CWDM

user BW CWDM CWDM

8 X8
Matrix
user BW CWDM CWDM
user BW CWDM CWDM

Figure 105 Local-remote loopback matrix configuration
3.1.3.5 E-SNCP
The WLA3C boards perform the E-SNCP function.
They accept two kinds of operation mode: force and auto.
The E-SNCP protection is achieved through a technique called “Parallel Transmit And Best One
Receive” strategy on an electrical level. At the transmit side, the signal is broadcast on the two arms of
the ring and the available signal is selected at the receive side. The routing is done electrically in the
8x8 matrix, see next figure. In this kind of application, only one user channel, such as channel 1, is
ED 01 RL
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equipped.
Table 37 Alarms usage in the auto E-SNCP configuration

Alarms
Consecutive Action
Direction Channel WDM Rx User Tx User Rx WDM Tx
West to East 1 ILOS SD of WDM TX1 and WDM Tx2
1 ILOS
Switch WDM RX2 to User TX1
2
1
East to West Switch WDM RX1 to User TX1
2 ILOS
1 ILOS
No action
2 ILOS
user input
BW
Rx1
CWDM CWDM CWDM CWDM

output Tx1 Tx2 output
8X 8
Matrix
CWDM CWDM CWDM CWDM
input Rx1 Rx2 input
BW
Tx1
user output
Figure 106 Electrical SNCP matrix configuration
3.1.3.6 O-SNCP
The WLA3COP boards achieve the O-SNCP function.
They accept 2 kinds of operation mode: force and auto.
The auto O-SNCP protection is achieved through a technique called “Parallel Transmit And Best One
Receive” strategy on an optical level. At the transmit side, the signal is broadcast on the two arms of
the ring and the available signal is selected at the receive side. The splitter and the coupler are used to
route optical signals in this application, see next figure.
ED 01 RL
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Table 38 Alarms usage in the auto O-SNCP configuration
Alarms
Consecutive Action
Direction Channel WDM Rx User Tx User Rx WDM Tx
1 ILOS SD of WDM TX1
West to East
2 ILOS SD of WDM TX2
1 ILOS SD of User TX1 and
2 Enable User TX2
1 SD of User TX2 and
East to West
2 ILOS Enable User TX1
1 ILOS
No Action
2 ILOS
BW CWDM CWDM
user Splitter Rx1 Tx1 output
input
BW CWDM CWDM
Tx1 Rx1 input
8 X8
Matrix
BW CWDM CWDM
Rx2 Tx2 output
user Coupler BW CWDM

output CWDM
Tx2 Rx2 input
Figure 107 Optical SNCP matrix configuration
3.1.3.7 B-SNCP
B-SNCP (Broadcast Sub-Network Connection Protection) is the protection for broadcast services,
which is only supported by WLA3C.
Signals from the WDM are input in CWDM port 1 and broadcast to user port 1 and two WDM ports.
The routing is done electrically in the 8x8 matrix.
WLA3C accepts 2 kinds of operation mode: force and auto.
In force mode, the network management can command the Matrix to switch the CWDM RX1 or
CWDM RX2 to connect user TX1 unconditionally. In auto mode, WLA3C can command the Matrix to
switch the CWDM RX1 or CWDM RX2 to user TX1 and WDM TX1/TX2 (see table below for details).
Table 39 Alarms usage in the auto B-SNCP configuration

CWDMRX1_LOS CWDMRX2_LOS Action
1 1 Shut down CWDM TX1 TX2 and user TX1
1 0 Switch CWDM RX2 to user TX1, and shut down CWDM TX1 TX2
0 1 Switch CWDM RX1 to user TX1
0 0 No Action
ED 01 RL
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8X8 MATRIX
USER RX In 1 Out1 CWDM
CDR3
1 TX 1
USER TX Out2 In 2 CWDM

CDR1
1 RX 1
Main
In 4
CWDM
Out3 CDR4
CDR2 Out 0 Spare TX 2
In 0 CWDM
RX 2
Out7 Out5 Out6 Out4
SDH SDH GE GE
MONI 1 MONI 2 MONI 1 MONI 2
Figure 108 B-SNCP matrix configuration in one WLA3C
3.1.4 Performance monitoring
In WLA3C and WLA3COP boards, the following performances can be monitored:
SDH signal
For the SDH signal, the following performances will be monitored:
B1 errors monitoring
J0 monitoring
Gigabit Ethernet signal

For the Gigabit Ethernet signal, the following performances will be monitored:
TRCO (Total Received Correct Octets)
TRCF (Total Received Correct Frames)
TRCF_Unicast (Total Received Correct Frames Unicast)
TRCF_Multicast (Total Received Correct Frames Multicast)
TRCF_Broadcast (Total Received Correct Frames Broadcast)
TRSEF (Total Received Service Error frames)
In R3.2A, performance monitoring of SDH and GbE signal can be set on the two channels of one
board at the same time.
ED 01 RL
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3.1.5 Front panel description
Extraction
Handle
PWR Power Failure LED

OOS Out of Service LED
CH1 Channel1 Abnormal LED
CH2
Channel2 Abnormal LED
Hardware Failure LED
W2
CWDM Tx2
CWDM Rx2
W2
W1
CWDM Tx1
CWDM Rx1
W1
U2
BW Tx2
BW Rx2
U2
U1
BW Tx1
BW Rx1
U1
Optical Safety
Label
Electrostatic Discharge
Label
Extraction
Handle
Figure 109 Front panel of WLA3C board
ED 01 RL
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Extraction
Handle
PWR Power Failure LED

OOS Out of Service LED
C
USER O
USER I
S
S2
SPID O2
COUP I2
C2
S1
SPID O1
COUP I1
C1
W2
CWDM Tx2
CWDM Rx2
W2
W1
CWDM Tx1
CWDM Rx1
W1
U2
BW Tx2
BW Rx2
U2
U1
BW Tx1
BW Rx1
U1
Optical Safety
Label
Label
Extraction
Handle
Figure 110 Front panel of WLA3COP board
ED 01 RL
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3.1.5.1 Front panel wiring
Table 40 Front panel wiring of WLA3C board

Name Signal
B&W Rx1 User Reception: client input signal (channel 1, from client)
B&W Tx1 User Transmission: client output signal (channel 1, to client)
B&W Rx2 User Reception: client input signal (channel 2, from client)
B&W Tx2 User Transmission: client output signal (channel 2, to client)
WDM Rx1 WDM Reception: WDM input signal (channel 1, from C-MDX or C-OAD board)
WDM Tx1 WDM Transmission: WDM output signal (channel 1, to C-MDX or C-OAD board)
Table 41 Front panel wiring of WLA3COP board

Name Signal
B&W Rx1 B&W signal Reception: (channel 1)
B&W Tx1 B&W signal Transmission: (channel 1)
COUP I1 Couple Input: (channel 1, from B&W Tx1)
SPID O1 Splitter Output: (channel1, to B&W Rx1)
COUP I2 Couple Input: (channel 2, from B&W Tx2)
SPID O2 Splitter Output: (channel2, to B&W Rx2)
USER I User Reception: client input signal (from client to Splitter in board)
USER O User Transmission: client output signal (from Couple in board to client)
3.1.5.2 LEDs meaning
Table 42 Meaning of WLA board front panel LEDs

Name LED Color Meaning
PWR Green ON when the power supply is in standard range.
OOS Yellow LED is on when the board is un-configured or mismatching.
Channel1 Abnormal: problem on the channel1.
LED is on when:
CH1 Yellow Rx alarm, Tx alarm or Bitrate_Threshold alarm
Unit type mismatch
Not configured in software
Channel1 Abnormal: problem on the channel2.
LED is on when:
CH2 Yellow Rx alarm, Tx alarm or Bitrate_Threshold alarm
Unit type mismatch
Not configured in software
Red LED is Red before software configuring is finished, and becomes Green
Green when board is configured correctly. When the board is downloading
Orange FPGA or after pressing LAT button, LED will be Orange.
ED 01 RL
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3.2 10 Gbps Optical Channel Card (OCC10)
The following OCC10 boards are used in R3.2A release:

OCC10-NA-1530 (195.900)
OCC10-NA-1550 (193.000)
OCC10-NA-1550 (193.100)
OCC10-NA-1550 (193.200)
OCC10-NA-1550 (193.300)
OCC10-EC-1530
OCC10-EC-1550
3.2.1 Description
The OCC10 unit transponder is a bidirectional multi–clock interface for 10 Gbps native signals. It is
hardware compliant with ITU-T G.709 Rec.
This transponder can be provisioned to accept any digital signal at the nominal bit rate of
9.953 Gbps (STM-64/OC-192/10 GBE WAN)
10.3125 (GBE LAN).
To/from
To/from
To/fromfuture
future twin OCC10 To/from future
matrix copy 0 matrix copy 1
USER GREYHOND USER

USER CDR 10G 8x8 CDR
CDR USER
RX CDR 10G 8x8 TX
RX 8102 MATRIX
MATRIX 8102 TX
WDM FRAMER
FRAMER FRAMER
FRAMER
WDM
WDM WDM
RX 8512 8512 TX
RX TX
JTAG
JTAG
ALARM &
ALARM &
CONTROL
CONTROL
UNIT (FPGA
UNIT (FPGA)
ABBESSES)
ABBESSES
BATT A SPI
SPI
BATT
BATT
+BATT
A
A- Power
Power interface
interface
BATT
A-
B conversion
conversion
BATT B
BATT
+ B- block
block Additional
Additional Remote
Remote
BATT B-
+3.6 VS
information
information inventory
inventory
+3.6VS EEPROM
EEPROM EEPROM
EEPROM
Figure 111 Block diagram of OCC10 board
ED 01 RL
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OCC10-NA board is used as CWDM 10G transponder. Only 2 CWDM channels are available:
1530nm and 1550 nm.
For CWDM 1530nm channel, at DWDM channel 195.9THz is used for OCC10-NA. For CWDM
1550nm channel, any one of the 4 DWDM channels can be selected: 193.0THz, 193.1THz,
193.2THz and 193.3THz.
And in 1692MSE R3.2A, OCC10-NA is configured with fixed B&W and colored module. The DDM
and Optical Measurement function are supported on line side.
For OCC10-EC board, there are also 2 channels for CWDM application: 1530nm and 1550nm,
which are compliant with G.694.2. With respect to OCC10-NA, XFP at user side can be plugged on
the front panel of OCC10-EC. And the VCC & XFP temperature measurements are not supported.
3.2.2 OCC10 configuration
There are only 2 channels available at CWDM grids for OCC10-NA/EC: 1530nm and 1550nm. Due
to the limitation of OADM wavelength plan, OCC10-NA/EC cannot support the following
applications:
Unidirectional 2ch 10G OADM
Unidirectional 4ch 10G OADM
Bidirectional 1ch 10G OADM
2ch 10G CPE
N.B. For unidirectional 2ch and 4ch OADM application, only one 10G service transmission can
be supported by OCC10.
The following matrix configurations are supported in 1692MSE R3.2A: Add/Drop, Client loopback,
Line loopback. And Client loopback and Line loopback can’t be configured simultaneously.
8x8 MATRIX
GREYHOND
USER USER
CDR 10G 8x8 CDR
RX MATRIX TX
WDM FRAMER FRAMER WDM

RX TX
JTAG
ALARM &
CONTROL UNIT
(FPGA
ABBESSES)
Figure 112 Add/Drop configuration of OCC10 board
ED 01 RL
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8x8 MATRIX
GREYHOND
USER USER
CDR 10G 8x8 CDR
RX MATRIX TX

RX TX
JTAG
ALARM &
CONTROL UNIT
(FPGA
ABBESSES)
Figure 113 Client loopback configuration of OCC10 board
8x8 MATRIX
GREYHOND
USER USER
CDR 10G 8x8 CDR
RX MATRIX TX

RX TX
JTAG
ALARM &
CONTROL UNIT
(FPGA
ABBESSES)
Figure 114 Line loopback configuration of OCC10 board
ED 01 RL
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3.2.3 Optical characteristics
Table 43 OCC10-NA optical characteristics

User side
Item Value Unit
User Tx output power -6~-1 dBm
User Rx sensitivity including path penalty @1E-12 <-14 dBm
User Rx overload at 1E-12 >-1 dBm
Target Transmission Distance 20 km
WDM side
Item Value Unit
Tx output power +1.5～+7 dBm
Rx sensitivity including path penalty without Noise
<-23 dBm
@1E-12, FEC
Rx overload at 1E-12 >-9 dBm
Dispersion Tolerance 0~1600 ps/nm
Table 44 OCC10-EC optical characteristics

User side
Item Value Unit
User Tx output power -6~-1 dBm
User Rx sensitivity including path penalty @1E-12 <-14 dBm
User Rx overload at 1E-12 >-1 dBm
Target Transmission Distance 20 km
WDM side
Item Value Unit
Tx output power +3～+7 dBm
Rx sensitivity including path penalty without Noise dBm
<-23
@1E-12, FEC
Rx overload at 1E-12 >-9 dBm
Dispersion Tolerance 0~1600 ps/nm
ED 01 RL
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OCC10-NA OCC10-EC
Extraction Handle Extraction Handle
PWR Power Failure LED PWR Power Failure LED

OOS Out of Service LED OOS Out of Service LED
RXA Abnormal Rx LED RXA Abnormal Rx LED
TXA Abnormal Tx LED TXA Abnormal Tx LED
Hardware Failure LED Hardware Failure LED
MF APSD Restart button MF APSD Restart button

Not used Not used
U
User Tx
User Rx
U User Rx
User Tx
WDM Rx WDM Rx
W W
WDM Tx WDM Tx
P P
10Gbps Rx 10Gbps Rx
Not used Not used
N N
P P
10Gbps Tx 10Gbps Tx
Not used Not used
N N
Optical Safety Label Optical Safety Label
Extraction Handle Extraction Handle
Figure 115 Front panel of OCC10 board
ED 01 RL
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Table 45 Front panel wiring of OCC10 board
Name Optical Signal
User Rx User Reception: client input signal (from client)
User Tx User Transmission: client output signal (to client)
WDM Rx WDM Reception: WDM input signal from MDX/OAD
WDM Tx WDM Transmission: WDM output signal to MDX/OAD
LEDs signification
Table 46 Meaning of OCC10 board front panel LEDs

POWER Green Managed by HW. ON when the board is plugged and no HWF
OOS Yellow LED ON when the board plugged but not configured by the SW
RXA Yellow RX Abnormal: problem on the Egress side. Managed by the SW.
TXA Yellow TX abnormal: problem on the ingress side. Managed by the SW.
Hardware Failure. Managed by the SW.
Red
LED is Red before software configuring is finished and becomes
HWF Green
Green when board is configured correctly. After pressing LAT
Orange
button, it turns Orange.
ED 01 RL
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3.3 2XGE-FC Unit
2XGE-FC board is one slot wide board implement GbE aggregation with standard GFP-T
encapsulation. See the following.
Client Line
2
Mapper
+
Framer
Not used
Figure 116 Block diagram of 2XGE-FC board
3.3.1 Description
In R3.2A, it can support two clients aggregation/extraction into/from 1 STM-16/OC-48 Frame.
At client side, there are four client interfaces. Only two of them are available in this release. GE can be
supported in R3.2A.
3.3.2 Optical interfaces
In this release, the following SFPs can be used in the subslots of 2XGE-FC board.
For client side:
GbE_SX, GbE_LX, GbE_SX_DDM, GbE_LX_DDM and GbE_ZX_DDM.
For line side:
I16, S16.1, L16.1, L16.2, I16_DDM, S16.1_DDM, PIN and APD (with or without DDM).
Please refer to 3.1.2 for optical parameters of SFPs.
3.3.3 2XGE-FC configuration
From client Rx to line Tx side, after O-E converting, the two serial signals are sent to the mapper. After
internal processing in the mapper, the client service are encapsulated into GFP frame and framed into
STM-16/OC-48 frame. The STM-16/OC-48 signal is sent to the two line side transceivers and muxed
into serial signals.
From line Rx to client Tx side, the signal flow is reverse and E-SNCP is configured to protect the line
port.
The SFPs plugged on CWDM1 and CWDM2 are set as main SFP and slave SFP respectively. As above
said, the serial Tx data is transmitted to both CWDM sides via CDR. Received signal from two SFP line
side can be selected automatically according to the received signals status. Rx_LOS or SFP missing is
the switching criteria. The protection is non-revertive.
If Rx_LOS or LOF occurs on the local client Rx, the opposite client Tx of 2XGE-FC will shut down
automatically. See the following.
ED 01 RL
3AL 97869 AAAA 134/259

Client Line Line Client Laser shut
LOS/ LOF Rx Tx down
Tx 1 1 Rx
1 1
2 Mapper Mapper 2
+ +
Framer Framer
2 2
Not used Not used
Local Remote
Figure 117 Communication between two 2XGE-FC board (example)
Loopback configuration on client side and line side are supported on 2XGE-FC board. They can be set
at the same time.
Client
1
Line
Client 1
2
Mapper+Framer
Line
2
Not used
Figure 118 Local loopback configuration of 2XGE-FC board
Client
1
Line
Client 1
2
Mapper + Framer
Line
2
Not used
Figure 119 Remote loopback configuration of 2XGE-FC board
The default laser state of SFP on line side is on. Please pay attention to that the laser status of user side
should be set as forced on when local loopback configuration. It is suggested to perform remote
loopback on one of the line sides because of the E-SNCP.
In R3.2A, performance monitoring is not supported on 2XGE-FC.
ED 01 RL
3AL 97869 AAAA 135/259

Extraction
Handle
DBG Interface RJ45

Not Used
W-P
CWDM Tx2
CWDM Rx2
CWDM Tx1
W
CWDM Rx1
U4
BW Tx4
BW Rx4
BW Tx3
U3
BW Rx3
BW Tx2
U2
BW Rx2
BW Tx1
U1
BW Rx1
RST RESET Push Button

Not Used
Optical Safety Label
Extraction
Handle
Figure 120 Front panel of 2XGE-FC board
ED 01 RL
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Table 47 Front panel wiring of 2XGE-FC board
Name Optical Signal
B&W Rx3 Not used
B&W Tx3 Not used
B&W Rx4 Not used
B&W Tx4 Not used
LEDs signification
Table 48 Meaning of 2XGE-FC board front panel LEDs

Red LED is Red before software configuring is finished, and becomes Green
Green when board is configured correctly. When the board is downloading
Orange FPGA or after pressing LAT button, LED will be Orange.
ED 01 RL
3AL 97869 AAAA 137/259

3.4 MUX/DEMUX units (C-MDX)
The following C-MDX boards are used:
MUX/DMX with OSC for unidirectional system: C-MDX-E-U-S

MUX/DMX without OSC for unidirectional system: C-MDX-U
MUX/DMX with OSC for bi-directional system: C-MDX-B-S
MUX/DMX without OSC for bi-directional system: C-MDX-B
3.4.1 C-MDX-E-U-S
1470
1490
1510
1530 MUX out
MUX
1550 1310nm
Line Tx
Filter
1570 out
1590
1610
OSC Tx
in
OSC Rx
out
1470
1490
1310nm 1510
Line Rx
Filter DEMUX in 1530
in
DEMUX
1550
1570
1590
1610
Figure 121 C-MDX-E-U-S block diagram
ED 01 RL
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3.4.1.1 Description
a) MUX side
The MUX component multiplexes 8 channels (CWDM grid) signals into an optical fiber. The 1310nm
filter couples the MUX out signal and OSC signal into the line fiber.
b) DEMUX side
At the receive side, the 1310nm filter splits the line signal into two channel signals. One is sent to the
OSC board, the other is demultiplexed into 8 channel signals by a DEMUX component.
3.4.1.2 Optical characteristics
Table 49C-MDX-E-U-S optical characteristics

MUX Side
Insertion Losses Value Unit
OSC In (1310nm)->Line out (Max) 1 dB
CH1 In ->LINE OUT (1470nm) (Max) 1.4 dB
Channel passband at -0.5dB (include channel center
14 nm
wavelength -6～+8 range)
DEMUX Side
LINE IN->OSC Out (1310nm)(Max) 1 dB
LINE IN->CH1 Out (1470nm) (Max) 1.4 dB
14 nm
Fiber Specs Type

Fiber type 0.9/2mm SMF28
Connector type MU
Reflectance Value Unit
All input ports (Max) -40 dB
ED 01 RL
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3.4.1.3 Front panel description
Extraction
Handle
Optical Safety
Label
Label
s OSC Tx in
OSC Rx out
Line Rx in
Line Tx out
1470nm signal in
47
1470nm signal out
1490nm signal in
49
1490nm signal out

1510nm signal in
51
1510nm signal out
1530nm signal in
53
1530nm signal out

1550nm signal in
55
1550nm signal out
1570nm signal in
57
1570nm signal out
1590nm signal in
59
1590nm signal out
1610nm signal in
61
1610nm signal out
Extraction
Handle
Figure 122 Front panel of C-MDX-E-U-S board
ED 01 RL
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Table 50 Front panel wiring of C-MDX-E-U-S board

Name Signal
OSC Tx in Supervision transmission input signal (from OSC board)
OSC Rx out Supervision reception output signal (to OSC board)
Line Rx in Line Reception input signal (from line)
Line Tx out Line Transmission output signal (to line)
## nm signal in WDM transmission input signal (from corresponding transponder)
## nm signal out WDM reception output signal (to corresponding transponder)
N.B. ## means from 1470 to 1610.
LEDs signification
Table 51 Meaning of C-MDX-E-U-S board front panel LEDs

Red LED is Red before software configuring is finished and becomes
Green Green when board is configured correctly. After pressing LAT
Orange button, it turns Orange.
ED 01 RL
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3.4.2 C-MDX-U
1470
1490
1510
1530 Line Tx
MUX
1550 out
1570
1590
1610
1470
1490
1510
1530
Line Rx DEMUX
1550
in
1570
1590
1610
Figure 123 C-MDX-U block diagram

3.4.2.1 Description
a) MUX side
The MUX component multiplexes 8 channel (CWDM grid) signals into an optical fiber.
b) DEMUX side
The DEMUX component demultiplexes the line signal into 8 channel signals.
ED 01 RL
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Table 52
C-MDX-U optical characteristics
MUX Side
CH8 In ->LINE OUT (1610nm) (Max) 3 dB
14 nm
DEMUX Side
LINE IN->CH2 Out (1490nm) (Max) 3 dB
14 nm
Fiber Specs Type

Connector type MU
ED 01 RL
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Extraction
Handle
Optical Safety
Label
Label
Line Rx in
Line Tx out
1470nm signal in
47
1470nm signal out
1490nm signal in
49
1490nm signal out

1510nm signal in
51
1510nm signal out
1530nm signal in
53
1530nm signal out

1550nm signal in
55
1550nm signal out
1570nm signal in
57
1570nm signal out
1590nm signal in
59
1590nm signal out
1610nm signal in
61
1610nm signal out
Extraction
Handle
Figure 124 Front panel of C-MDX-U board
ED 01 RL
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Table 53 Front panel wiring of C-MDX-U board

Name Signal
Line Rx in Line Reception input signal (from line)
Line Tx out Line Transmission output signal (to line)
## nm signal in WDM transmission input signal (from corresponding transponder)
## nm signal out WDM reception output signal (to corresponding transponder)
LEDs signification
Table 54 Meaning of C-MDX-U board front panel LEDs

ED 01 RL
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3.4.3 C-MDX-B-S
OSC Rx out 1310nm

OSC Tx in Circulator
1310nm
Line
Filter
CH 1
CH 2
CH 3
CH 4
MUX
CH 5
CH 6
CH 7
CH 8
Figure 125 C-MDX-B-S block diagram

3.4.3.1 Description
As mentioned before, the 8:1 multiplexer can also be used in bi-directional line terminal configuration
to multiplex/demultiplex signals. In this application, 1310nm circulators are used to
multiplex/demultiplex bi-directional 1310nm wavelengths of the OSC. An extra 1310±30nm filter is
also used to avoid the 1310nm multiplexing affecting the 1550nm transmission.
Table 55 C-MDX-B-S optical characteristics

I/O <->OSC channel (1310nm)(Max) 2 dB
I/O <->CH1 (1470nm) (Max) 1.4 dB
I/O <->CH2 (1490nm) (Max) 1.7 dB
I/O <->CH3 (1510nm) (Max) 2.0 dB
I/O <->CH4 (1530nm) (Max) 2.3 dB
I/O <->CH5 (1550nm) (Max) 2.6 dB
I/O <->CH6 (1570nm) (Max) 2.9 dB
I/O <->CH7 (1590nm) (Max) 3.2 dB
I/O <->CH8 (1610nm) (Max) 3.5 dB
14 nm
Fiber Specs Type

Connector type MU
ED 01 RL
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Extraction
Handle
s OSC Tx in
OSC Rx out
LINE
Not used
47 49 5153 55 57 5961
1470 nm signal in or out



Optical Safety
Label
Label
Extraction
Handle
Figure 126 Front panel of C-MDX-B-S board
ED 01 RL
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Table 56 Front panel wiring of C-MDX-B-S board

Name Signal
OSC Tx in Supervision transmission input signal (from OSC board)
OSC Rx out Supervision reception output signal (to OSC board)
Line Line signal (from/to line)
Not used -
## nm signal in or out WDM signal (from/to corresponding transponder)
LEDs signification
Table 57 Meaning of C-MDX-B-S board front panel LEDs

ED 01 RL
3AL 97869 AAAA 148/259

3.4.4 C-MDX-B
CH 1
CH 2
CH 3
CH 4
MUX Line
CH 5
CH 6
CH 7
CH 8
Figure 127 C-MDX-B block diagram
Table 58 C-MDX-B optical characteristics

I/O <->CH1 (1470nm) (Max) 0.9 dB
I/O <->CH2 (1490nm) (Max) 1.2 dB
I/O <->CH3 (1510nm) (Max) 1.5 dB
I/O <->CH4 (1530nm) (Max) 1.8 dB
I/O <->CH5 (1550nm) (Max) 2.1 dB
I/O <->CH6 (1570nm) (Max) 2.4 dB
I/O <->CH7 (1590nm) (Max) 2.7 dB
I/O <->CH8 (1610nm) (Max) 3 dB
14 nm
Fiber Specs Type

Connector type MU
ED 01 RL
3AL 97869 AAAA 149/259

Extraction
Handle
LINE
Not used
47 49 5153 55 57 59 61


Optical Safety
Label
Label
Extraction
Handle
Figure 128 Front panel of C-MDX-B board
ED 01 RL
3AL 97869 AAAA 150/259

Table 59 Front panel wiring of C-MDX-B board

Name Signal
Line Line signal (from/to line)
Not used -
## nm signal in or out WDM signal (from/to corresponding transponder)
LEDs signification
Table 60 Meaning of C-MDX-B board front panel LEDs

ED 01 RL
3AL 97869 AAAA 151/259

3.5 MUX/DEMUX units (C-MDX2)
The following C-MDX2 boards are used:
MUX/DMX2 with OSC for unidirectional system: C-MDX2-E-U-S

MUX/DMX2 without OSC for unidirectional system: C-MDX2-U
1-channel MUX/DMX2 with OSC for unidirectional system: C-MDX2-E-1-S
2-channel MUX/DMX2 with OSC for unidirectional system: C-MDX2-E-2-XX-S
3.5.1 C-MDX2-E-U-S
1470
1490
1510
1530 MUX out
MUX
1550 1310nm Line Tx
1570 Filter out
1590
1610
OSC Tx
in
OSC Rx
out
1470
1490
95% 1510
1310nm
Line Rx 5:95 TAP Filter
in DEMUX in 1530
DEMUX
1550
5%
1570
1590
PIN AMP 1610
Figure 129 C-MDX2-E-U-S block diagram

3.5.1.1 Description
a) MUX side
The MUX component multiplexes 8 channel (CWDM grid) signals into an optical fiber. The 1310nm
filter couples the MUX out signal and OSC signal into the line fiber.
b) DEMUX side
At the receive side, the 5:95 TAP splits the line signal into two channels. One (95%) is sent to 1310nm
filter splitter; the other (5%) is sent to a PIN & amplification circuit for LOS detection. The 1310nm filter
splits the input signal into two channel signals. One is sent to OSC board, the other is demultiplexed
into 8 channels signals by the DEMUX component.
The front panel and front panel wiring are the same as the C-MDX-E-U-S unit.
ED 01 RL
3AL 97869 AAAA 152/259

3.5.2 C-MDX2-U
1470
1490
1510
1530
MUX Line Tx
1550 out
1570
1590
1610
1470
1490
1510
95% 1530
Line Rx 5:95 TAP DEMUX
in 1550
1570
5% 1590
1610
PIN AMP
Figure 130 C-MDX2-U block diagram
3.5.2.1 Description
a) MUX side
The MUX component multiplexes 8 channel (CWDM grid) signals into an optical fiber.
b) DEMUX side
At the receive side, the 5:95 TAP splits the line signal into two channels. One (95%) is sent to the
DEMUX component; the other (5%) is sent to a PIN & amplification circuit for LOS detection. The
DEMUX component demultiplexes the line signal into 8 channel signals.
The front panel and front panel wiring are the same as the C-MDX-U unit.
ED 01 RL
3AL 97869 AAAA 153/259

3.5.3 C-MDX2-E-1-S
CH1
input 1310nm Mux
Filter output
1310nm
input
95% 1310nm
Demux 1310nm Filter 1310nm
input
5:95 TAP Filter output
CH1
5% output
PIN
AMP
Figure 131 C-MDX2-E-1-S block diagram
3.5.3.1 Description
The C-MDX2-E-1-S boards are only for the CPE application.

This board is designed to multiplex/demultiplex one channel wavelengths to/from a fiber. It provides
insertion/extraction of the 1310nm OSC signal or the 1310nm SDH signal. Input optical signal LOS
detection is integrated into the unit.
Table 61 C-MDX2-E-1-S optical characteristics

MUX Side
OSC In->MUX (1310nm)(Max) 1 dB
CH1 In->MUX (Max) 0.9 dB
DEMUX Side
DEMUX->OSC Out (1310nm)(Max) 1.5 dB
DEMUX->CH1 Out (Max) 1.9 dB
Temperature Specs Value Unit

Operating temperature 0～70 ℃
Storage temperature -40～+85 ℃
Fiber Specs Type
Connector type MU
ED 01 RL
3AL 97869 AAAA 154/259

Extraction
Handle
s 1310nm signal input

1310nm signal output
DMX signal input
MUX signal output
CH1 signal input
CH
CH1 signal output
Optical Safety
Label
Label
Extraction
Handle
Figure 132 Front panel of C-MDX2-E-1-S board
ED 01 RL
3AL 97869 AAAA 155/259

Table 62 Front panel wiring of C-MDX2-E-1-S board

Name Signal
1310nm signal input Supervision transmission input signal (from OSC board) or other1310nm input
1310nm signal output Supervision reception output signal (to OSC board) or other1310nm output
DMX signal input Line Reception input signal (from line)
MUX signal output Line Transmission output signal (to line)
CH1 signal input WDM transmission input signal (from corresponding transponder)
CH1 signal output WDM reception output signal (to corresponding transponder)
LEDs signification
Table 63 Meaning of C-MDX2-E-1-S board front panel LEDs
ED 01 RL
3AL 97869 AAAA 156/259

3.5.4 C-MDX2-E-2-XX-S
CH1 input
OADM
CH2 input
1310nm MUX output
Filter
OSC input
OSC output
95%
DEMUX input 5:95 TAP 1310nm
Filter
CH1 output
OADM
5%
CH2 output
PIN AMP
Figure 133 C-MDX2-E-2-XX-S block diagram
3.5.4.1 Description
The C-MDX2-E-2-XX-S boards are only for the CPE application.
This board is designed to multiplex/demultiplex two channels wavelengths to/from a fiber. It provides
insertion/extraction of the 1310nm OSC signal or the 1310nm SDH signal.
Input optical signal LOS detection is integrated into the unit.
ED 01 RL
3AL 97869 AAAA 157/259

Table 64 Optical parameter of C-MDX2-E-2-XX-S

MUX Side
OSC In->MUX (1310nm)(Max) 1 dB
CH1/2 In->MUX (Max) 1.8 dB
Channel passband at -0.5dB(include channel center
14 nm
DEMUX Side
DEMUX->OSC Out (1310nm)(Max) 1.5 dB
DEMUX->CH1/2 Out (Max) 2.3 dB
14 nm

Fiber Specs Type
Connector type MU
ED 01 RL
3AL 97869 AAAA 158/259

Extraction
Handle
s 1310nm signal input

1310nm signal output
DMX signal input
MUX signal output
CH1 signal input
CH
CH1 signal output

CH2 signal input
CH
CH2 signal output
Optical Safety
Label
Label
Extraction
Handle
Figure 134 Front panel of C-MDX2-E-2-XX-S board
ED 01 RL
3AL 97869 AAAA 159/259

Table 65 Front panel wiring of C-MDX2-E-2-XX-S board

Name Signal
1310nm signal input Supervision transmission input signal (from OSC board) or other1310nm input
1310nm signal output Supervision reception output signal (to OSC board) or other1310nm output
DMX signal input Line Reception input signal (from line)
MUX signal output Line Transmission output signal (to line)
N.B. CH1 can be 1470nm, 1510nm, 1550nm, or 1590nm.

CH2 can be 1490nm, 1530nm, 1570nm, or 1610nm.
LEDs signification
Table 66 Meaning of C-MDX2-E-2-XX-S board front panel LEDs

ED 01 RL
3AL 97869 AAAA 160/259

3.6 OADM units (C-OAD)
The following C-OAD boards are used:
UNIDIRECTIONAL 1 Add & Drop C-OAD with OSC: C-OAD-E-U-1-XX-S

UNIDIRECTIONAL 1 Add & Drop C-OAD without OSC: C-OAD-U-1-XX
UNIDIRECTIONAL 2 Add & Drop C-OAD with OSC: C-OAD-E-U-2-XXXX-S
UNIDIRECTIONAL 2 Add & Drop C-OAD without OSC: C-OAD-U-2-XXXX
Bi-directional 1 Add/Drop C-OAD with OSC: C-OAD-B-1-XX-S
Bi-directional 1 Add/Drop C-OAD without OSC: C-OAD-B-1-XX
3.6.1 C-OAD-E-U-1-XX-S
Drop Express Ch Express Ch Add

Channel Output Input Channel
OADM
X1
West to East 1310nm Filter 1310nm Filter West to East

in O1 O2 out
Drop OSC Add OSC
Add OSC Drop OSC
East to West 1310nm Filter 1310nm Filter East to West

out O3 O4 in
OADM
X2
Add Express Ch Express Ch Drop

Channel Input Output Channel
Figure 135 C-OAD-E-U-1-XX-S block diagram
ED 01 RL
3AL 97869 AAAA 161/259

3.6.1.1 Description
This board (C-OAD-E-U-1-XX-S) is used to add and drop ONE Channel per direction in the
unidirectional CWDM system; the added/dropped channel is from/to the WLA (or OCC10, 2XGE-FC,
C-4xANY) board. The other channels are passed through the C-OAD board.
The OSC 1310nm signal is also added/dropped by this board. The dropped OSC signal is sent to the
OSC board; the added OSC signal comes from the OSC board.
All channels can be added and dropped. There are 8 different 1-channel C-OAD boards according to
the different wavelengths; the wavelengths are defined as in the following table.
Table 67 1-channel C-OAD module for unidirectional application

Number (XX) 4747 4949 5151 5353 5555 5757 5959 6161
Add/Drop Channels (nm) 1470 1490 1510 1530 1550 1570 1590 1610
There are two OADM modules (one OADM module for each direction) in the board.
Table 68 C-OAD-E-U-1-XX-S optical characteristics

IN->Exp Ch OUT (Max) 1.3 dB
Exp Ch IN->OUT (Max) 1.3 dB
IN->DROP (Max) 1.5 dB
ADD->OUT (Max) 1.5 dB
IN->OSC DROP (Max) 1 dB
OSC ADD->OUT (Max) 1 dB
Fiber Specs Type
Connector type MU
ED 01 RL
3AL 97869 AAAA 162/259

Extraction
Handle
S-E
East OSC Tx in
East OSC Rx out
West OSC Tx in
S-W West OSC Rx out
East line Rx in
E East line Tx out
YY-E East YY nm signal add

East YY nm signal drop
E East express signal add

East express signal drop
W West line Rx in
West line Tx out
YY-W West YY nm signal add

West YY nm signal drop
W West express signal add

West express signal drop
Optical Safety
Label
Label
Extraction
Handle
Figure 136 Front panel of C-OAD-E-U-1-XX-S board
ED 01 RL
3AL 97869 AAAA 163/259

Table 69 Front panel wiring of C-OAD-E-U-1-XX-S board

Name Signal
East OSC Tx in East Supervision transmission input signal (from OSC board)
East OSC Rx out East Supervision reception output signal (to OSC board)
West OSC Tx in West Supervision transmission input signal (from OSC board)
West OSC Rx out West Supervision reception output signal (to OSC board)
East Line Rx in East Line Reception input signal (from line)
East Line Tx out East Line Transmission output signal (to line)
East YY nm signal add East YY nm signal add (from corresponding transponder)
East YY nm signal drop East YY nm signal drop (to corresponding transponder)
East express signal add East express signal add (from East express signal drop)
East express signal drop East express signal drop
West Line Rx in West Line Reception input signal (from line)
West Line Tx out West Line Transmission output signal (to line)
West YY nm signal add West YY nm signal add (from corresponding transponder)
West YY nm signal drop West YY nm signal drop (to corresponding transponder)
West express signal add West express signal add (from West express signal drop)
West express signal drop West express signal drop
N.B. YY is one of the CWDM wavelengths (1470, 1490, 1510, 1530, 1550, 1570, 1590, 1610).
N.B. “East” means from west to east, while “West” means from east to west.
LEDs signification
Table 70 Meaning of C-OAD-E-U-1-XX-S board front panel LEDs

ED 01 RL
3AL 97869 AAAA 164/259

3.6.2 C-OAD-U-1-XX

OADM
X1
West to East West to East

in out
East to West East to West

out in
OADM
X2

Figure 137 C-OAD-U-1-XX block diagram
3.6.2.1 Description
This board (C-OAD-U-1-XX) is used to add and drop ONE Channel per direction in the
unidirectional CWDM system, and the added/dropped channel is from/to the WLA (or OCC10,
2XGE-FC, C-4xANY) board. The other channels are passed through the C-OAD board. The OSC
1310nm signal is NOT added and dropped by this board.
All channels can be added and dropped. There are 8 different 1-channel C-OAD boards according to
the different wavelengths; the wavelengths are defined the same as in table 60. There are two OADM
modules (one OADM module for each direction) in the C-OAD board.
Table 71 C-OAD-U-1-XX optical characteristics

IN->DROP (Max) 1 dB
ADD->OUT (Max) 1 dB
Fiber Specs Type
Connector type MU
ED 01 RL
3AL 97869 AAAA 165/259

Extraction
Handle
S-E
S-W
East line Rx in
E East line Tx out


W West line Rx in
West line Tx out


Optical Safety
Label
Label
Extraction
Handle
Figure 138 Front panel of C-OAD-U-1-XX board
ED 01 RL
3AL 97869 AAAA 166/259

Table 72 Front panel wiring of C-OAD-U-1-XX board

Name Signal
N.B. YY is one of the CWDM wavelengths (1470, 1490, 1510, 1530, 1550, 1570, 1590, 1610).
LEDs signification
Table 73 Meaning of C-OAD-U-1-XX board front panel LEDs

ED 01 RL
3AL 97869 AAAA 167/259

3.6.3 C-OAD-E-U-2-XXXX-S
Drop Drop Add Add

Ch1 Ch2 Express Ch Express Ch Ch1 Ch2
Output Input
OADM
X1
1310nm Filter 1310nm Filter

O1 O2
in out
Drop OSC Add OSC
Add OSC Drop OSC

O3 O4
out in
OADM
X2
Express Ch Express Ch
Add Add Input Output Drop Drop
Ch1 Ch2 Ch2 Ch1
Figure 139 C-OAD-E-U-2-XXXX-S block diagram
3.6.3.1 Description
This board (C-OAD-E-U-2-XXXX-S) is used to add and drop TWO Channels per direction in the
unidirectional CWDM system and the added/dropped channels are to/from the WLA (or OCC10,
2XGE-FC, C-4xANY) board. The other channels are passed through the C-OAD board.
There are 4 types of 2-channel C-OAD boards. The wavelengths are defined as in the following table.
There are two OADM modules (one OADM modules for each direction) in the C-OAD board.
ED 01 RL
3AL 97869 AAAA 168/259

Table 74 2-channel C-OAD modules for unidirectional applications
Number (XX) 47474949 51515353 55555757 59596161
Add/Drop Channels (nm) 1470,1490 1510,1530 1550,1570 1590,1610
Table 75 C-OAD-E-U-2-XXXX-S optical characteristics

IN->OSC DROP (Max) 1 dB
Fiber Specs Type
Connector type MU
ED 01 RL
3AL 97869 AAAA 169/259

Extraction
Handle
Optical Safety
Label
Label
S-E
East OSC Tx in
East OSC Rx out
West OSC Tx in
S-W West OSC Rx out
East line Rx in
E East line Tx out

ZZ-E East ZZ nm signal add

East ZZ nm signal drop

W West line Rx in
West line Tx out

ZZ-W West ZZ nm signal add

West ZZ nm signal drop

Extraction
Handle
Figure 140 Front panel of C-OAD-E-U-2-XXXX-S board
ED 01 RL
3AL 97869 AAAA 170/259

Table 76 Front panel wiring of C-OAD-E-U-2-XXXX-S board

Name Signal
East ZZ nm signal add East ZZ nm signal add (from corresponding transponder)
East ZZ nm signal drop East ZZ nm signal drop (to corresponding transponder)
West ZZ nm signal add West ZZ nm signal add (from corresponding transponder)
West ZZ nm signal drop West ZZ nm signal drop (to corresponding transponder)
N.B. (YY, ZZ) is one of the CWDM wavelengths combinations [(1470, 1490), (1510, 1530),
(1550, 1570), (1590, 1610)].
LEDs signification
Table 77 Meaning of C-OAD-E-U-2-XXXX-S board front panel LEDs

ED 01 RL
3AL 97869 AAAA 171/259

3.6.4 C-OAD-U-2-XXXX
Drop
Drop Express Ch Express Ch Add Add
Ch1 Ch2 Ch1 Ch2
Output Input
OADM
X1

in out

out in
OADM
X2
Add Add Express Ch Express Ch Drop Drop

Ch1 Ch2 Input Output Ch2 Ch1
Figure 141 C-OAD-U-2-XXXX block diagram
3.6.4.1 Description
This board (C-OAD-U-2-XX) is used to add and drop TWO Channels per direction in the
2XGE-FC, C-4xANY) board. The other channels are passed through the C-OAD board.
The OSC 1310nm signal is NOT added/dropped by this board. There are 4 types of 2-channel
C-OAD boards, the wavelengths are defined the same as in Table 74.There are two OADM modules
(one OADM modules for each direction) in the C-OAD board.
Table 78 C-OAD-U-2-XXXX optical characteristics

IN↔Exp Ch OUT (Max) 1.0 dB
Exp Ch IN↔ OUT (Max) 1.0 dB
Fiber Specs Type
Connector type MU
ED 01 RL
3AL 97869 AAAA 172/259

Extraction
Handle
Optical Safety
Label
Label
S-E
S-W
East line Rx in
E East line Tx out

ZZ-E East ZZ nm signal add

East ZZ nm signal drop

W West line Rx in
West line Tx out

ZZ-W West ZZ nm signal add

West ZZ nm signal drop

Extraction
Handle
Figure 142 Front panel of C-OAD-U-2-XXXX board
ED 01 RL
3AL 97869 AAAA 173/259

Table 79 Front panel wiring of C-OAD-U-2-XXXX board

Name Signal
West ZZ nm signal add West ZZ nm signal add (from corresponding transponder)
West ZZ nm signal drop West ZZ nm signal drop (to corresponding transponder)
(1550, 1570), (1590, 1610)].
LEDs signification
Table 80 Meaning of C-OAD-U-2-XXXX board front panel LEDs

ED 01 RL
3AL 97869 AAAA 174/259

3.6.5 C-OAD-B-1-XX-S
Drop East Add Drop West Add

OSC West OSC OSC East OSC
1310nm Circulator 1310nm Circulator

O3 O4
Add/Drop Add/Drop
OSC OSC

Line I/O 1 O1 O2 Line I/O 2
OADM
Drop Add I/O I/O Drop Add
East Ch West Ch West Ch East Ch
Figure 143 C-OAD-B-1-XX-S block diagram
3.6.5.1 Description
This board (C-OAD-B-1-XX-S) is used to add and drop only ONE channel per direction in the
Bi-directional CWDM system. A west added/dropped channel is to/from a WLA board and an east
added/dropped channel is to/from a WLA board. The other channels are passed through the C-OAD
board.
The OSC 1310nm signals (including east and west directions) are also added and dropped by this
board. The east/west added OSC signals come from the east/west OSC modules and the east/west
dropped OSC signals are sent to the east/west OSC modules.
There are 4 types of Bi-directional C-OAD boards. The wavelengths are defined as in the following
table.
There is only one 2-channel C-OAD module (one add & drop channel for each direction) in the
board.
Table 81 C-OAD modules for bi-directional application

Number (XX) 4755 4957 5159 5361
ED 01 RL
3AL 97869 AAAA 175/259

Table 82 C-OAD-B-1-XX-S optical characteristics

I/O<->Exp Ch I/O (Max) 1.5 dB
I/O->DROP (Max) 1.8 dB
ADD->I/O (Max) 1.8 dB
Insertion loss (I/O->OSC Drop, OSC Add->I/O)(Max) 2 dB
Fiber Specs Type
Connector type MU
ED 01 RL
3AL 97869 AAAA 176/259

Extraction
Handle
S-E
East OSC Tx in
East OSC Rx out
West OSC Tx in
S-W
West OSC Rx out
Line I/O 2
Line I/O 1
YY
West YY nm signal add
ZZ
East ZZ signal add
East ZZ signal drop
Express signal I/O 2

Optical Safety
Label
Label
Extraction
Handle
Figure 144 Front panel of C-OAD-B-1-XX-S board
ED 01 RL
3AL 97869 AAAA 177/259

Table 83 Front panel wiring of C-OAD-B-1-XX-S board

Name Signal
Line I/O 2 Line signal 2 (from/to line)
Express signal I/O 2 Express signal I/O 2 add/drop (connected with express signal I/O 1)
Express signal I/O 1 Express signal I/O 1 add/drop
(1510, 1590), (1530, 1610)].
LEDs signification
Table 84 Meaning of C-OAD-B-1-XX-S board front panel LEDs

ED 01 RL
3AL 97869 AAAA 178/259

3.6.6 C-OAD-B-1-XX
Line Line
OADM
Drop Add Express Ch Express Ch Drop Add

East Ch West Ch I/O I/O West Ch East Ch
Figure 145 C-OAD-B-1-XX block diagram
3.6.6.1 Description
This board (C-OAD-B-1-XX) is used to add and drop only ONE channel per direction in the
Bi-directional CWDM system. A west added/dropped channel is to/from a WLA board and an east
added/dropped channel is to/from a WLA board. The other channels are passed through the C-OAD
board.
The OSC 1310nm signal is NOT added and dropped by this board.
There are 4 types of Bi-directional C-OAD boards; the wavelengths are defined the same as in Table
81.
There is only one 2-channel C-OAD module (one add & drop channel for each direction) in the
board.
Table 85 C-OAD-B-1-XX optical characteristics

IN<->Exp Ch OUT (Max) 1 dB
Fiber Specs Type
Connector type MU
ED 01 RL
3AL 97869 AAAA 179/259

Extraction
Handle
S-E
S-W
Line I/O 2
Line I/O 1
YY West YY nm signal add

ZZ
East ZZ signal add
East ZZ signal drop

Optical Safety
Label
Label
Extraction
Handle
Figure 146 Front panel of C-OAD-B-1-XX board
ED 01 RL
3AL 97869 AAAA 180/259

Table 86 Front panel wiring of C-OAD-B-1-XX board

Name Signal
Express signal I/O 2 Express signal I/O 2 add/drop (connected with express signal I/O 1)
Express signal I/O 1 Express signal I/O 1 add/drop
(1510, 1590), (1530, 1610)].
LEDs signification
Table 87 Meaning of C-OAD-B-1-XX board front panel LEDs

ED 01 RL
3AL 97869 AAAA 181/259

3.7 OADM2 units (C-OAD2)
The following C-OAD2 boards are used:
UNIDIRECTIONAL 1 Add & Drop C-OAD2 with OSC: C-OAD2-E-U-1-XX-S

UNIDIRECTIONAL 1 Add & Drop C-OAD2 without OSC: C-OAD2-U-1-XX
UNIDIRECTIONAL 2 Add & Drop C-OAD2 with OSC: C-OAD2-E-U-2-XXXX-S
UNIDIRECTIONAL 2 Add & Drop C-OAD2 without OSC: C-OAD2-U-2-XXXX
UNIDIRECTIONAL 4 Add & Drop C-OAD2 with OSC: C-OAD2-E-U-4-XXXXXXXX-S
UNIDIRECTIONAL 4 Add & Drop C-OAD2 without OSC: C-OAD2-U-4-XXXXXXXX
3.7.1 C-OAD2-E-U-1-XX-S

PIN AMP OADM

X1
5%
West to East 95% 1310nm Filter 1310nm Filter West to East

in 5:95 TAP O1 O2 out
Drop OSC Add OSC
Add OSC Drop OSC
East to West 1310nm Filter 1310nm Filter 95% East to West

out
5:95 TAP
O3 O4 in
5%
OADM
X2
PIN AMP

Figure 147 C-OAD2-E-U-1-XX-S block diagram
ED 01 RL
3AL 97869 AAAA 182/259

3.7.1.1 Description
This board (C-OAD2-E-U-1-XX-S) is used to add and drop ONE Channel per direction in the
unidirectional CWDM system; the added/dropped channel is to/from the WLA (or OCC10, 2XGE-FC,
C-4xANY) board. The other channels are passed through the C-OAD2 board.
All channels can be added and dropped. There are 8 different 1-channel C-OAD2 boards according
to the different wavelengths; the wavelengths are defined as in the following table.
Table 88 1-channel C-OAD2 module for unidirectional application

Number (XX) 4747 4949 5151 5353 5555 5757 5959 6161
Add/Drop Channels (nm) 1470 1490 1510 1530 1550 1570 1590 1610
There are two OADM modules (one OADM module for each direction) in the board.
At each receiving direction, a 5:95 TAP is used to split the line signal into two channels. One (95%) is
sent to the 1310nm filter splitter; the other (5%) is sent to a PIN & amplification circuit for LOS
detection.
The front panel and front panel wiring are the same as C-OAD-E-U-1-XX-S unit.
ED 01 RL
3AL 97869 AAAA 183/259

3.7.2 C-OAD2-U-1-XX

PIN AMP
OADM
X1
5%
West to East 95% West to East

in
5:95 TAP out
95%
East to West 5:95 TAP East to West
out in
OADM 5%
X2
PIN AMP

Figure 148 C-OAD2-U-1-XX block diagram
3.7.2.1 Description
This board (C-OAD2-U-1-XX) is used to add and drop ONE Channel per direction in the
unidirectional CWDM system and the added/dropped channel is to/from the WLA (or OCC10,
2XGE-FC, C-4xANY) board. The other channels are passed through the C-OAD2 board.
The OSC 1310nm signal is NOT added and dropped by this board.
All channels can be added and dropped. There are 8 different 1-channel C-OAD2 boards according
to the different wavelengths; the wavelengths are defined the same as in Table 88.
There are two OADM modules (one OADM module for each direction) in the C-OAD2 board.
sent to the OADM module; the other (5%) is sent to a PIN & amplification circuit for LOS detection.
The front panel and front panel wiring are the same as C-OAD-U-1-XX unit.
ED 01 RL
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3.7.3 C-OAD2-E-U-2-XXXX-S
Drop Drop Add Add

Ch1 Ch2 Express Ch Express Ch Ch1 Ch2
Output Input
PIN AMP
OADM
X1
5%
95% 1310nm Filter 1310nm Filter

West to East 5:95 TAP West to East
O1 O2
in out
Drop Add
OSC OSC
Add Drop
OSC OSC
1310nm Filter 1310nm Filter 95%

out O3 O4 in
5%
OADM
X2
PIN AMP
Add Add Input Output Drop Drop
Ch1 Ch2 Ch2 Ch1
Figure 149 C-OAD2-E-U-2-XXXX-S block diagram
3.7.3.1 Description
This board (C-OAD2-E-U-2-XXXX-S) is used to add and drop TWO Channels per direction in the
There are 4 types of 2-channel C-OAD2 boards; the wavelengths are defined as the following table.
There are two OADM modules (one OADM modules for each direction) in the C-OAD2 board.
sent to the 1310nm filter splitter; the other (5%) is sent to a PIN & amplification circuit for LOS
detection.

Number (XX) 47474949 51515353 55555757 59596161
The front panel and front panel wiring are the same as in a C-OAD-E-U-2-XXXX-S unit.
ED 01 RL
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3.7.4 C-OAD2-U-2-XXXX
Drop
Drop Express Ch Express Ch Add Add
Ch1 Ch2 Ch1 Ch2
Output Input
PIN AMP
OADM
5% X1
95%
in out
95%
out in
OADM 5%
X2
PIN AMP
Add Add Express Ch Express Ch Drop Drop

Ch1 Ch2 Input Output Ch2 Ch1
Figure 150 C-OAD2-U-2-XXXX block diagram
3.7.4.1 Description
This board (C-OAD2-U-2-XXXX) is used to add and drop TWO Channels per direction in the
The OSC 1310nm signal is NOT added/dropped by this board.
There are 4 types of 2-channel C-OAD2 boards. The wavelengths are defined the same as in Table
89.
sent to the OADM module; the other (5%) is sent to a PIN & amplification circuit for LOS detection.
The front panel and front panel wiring are the same as in a C-OAD-U-2-XXXX unit.
ED 01 RL
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3.7.5 C-OAD2-E-U-4-XXXXXXXX-S
Drop Add
Ch1～4 Ch1～4
Output Input
PIN AMP
OADM
X1
5%
95% 1310nm Filter 1310nm Filter

O1 O2
in out
Drop OSC Add OSC
Add OSC Drop OSC
1310nm Filter 1310nm Filter 95%

out O3 O4 in
5%
OADM
X2
PIN AMP

Ch1～4 Input Output Ch1～4
Figure 151 C-OAD2-E-U-4-XXXXXXXX-S block diagram
3.7.5.1 Description
This board (C-OAD2-E-U-4-XXXXXXXX-S) is used to add and drop FOUR Channels per direction in
the unidirectional CWDM system and the added/dropped channels are to/from the WLA (or OCC10,
2XGE-FC, C-4xANY) board. The other channels are passed through the C-OAD2-E-U-4-XXXXXXXX-S
board.
There are 2 types of 4-channel C-OAD2 boards; the wavelengths are defined in the following table.
The “XXXXXXXX” can be the values listed in the following table.

Number (XXXXXXXX) 4747494951515353 5555575759596161
Add/Drop Channels (nm) 1470,1490,1510,1530 1550,1570,1590,1610
Thus there are two kinds of C-OAD2-E-U-4-XXXXXXXX-S board.
ED 01 RL
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The C-OAD2-E-U-4-XXXXXXXX-S unit’s add & drop channels sequence is defined by the following
table.
Table 91 Add & Drop Channels Sequence

Add & Drop Wavelength (nm) Channel
C-OAD2-E-U-4-4747494951515353-S C-OAD2-E-U-4-5555575759596161-S Number
1470 1550 1
1490 1570 2
1510 1590 3
1530 1610 4
The optical characteristics of the board are as follows:
Table 92 C-OAD2-E-U-4-XXXXXXXX-S board optical characteristics

In->CH1 Drop (Max) 2.8 dB
CH1 Add->Out (Max) 1.4 dB
IN->OSC DROP (Max) 1.5 dB
Fiber Specs Type
Connector type MU
ED 01 RL
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Extraction
Handle
Hardware Failure
LED
East OSC add

East OSC drop S-E
West OSC add

West OSC drop S-W
Line East in Line West in

Line East out E W Line West out
East A nm signal add West A nm signal add

A-E A-W
East A nm signal drop West A nm signal drop
East B nm signal add West B nm signal add
East B nm signal drop B-E B-W West B nm signal drop
East C nm signal add West C nm signal add

C-E C-W
East C nm signal drop West C nm signal drop
East D nm signal add West D nm signal add
East D nm signal drop D-E D-W West D nm signal drop
East express signal add E W West express signal add

East express signal drop West express signal drop
Optical Safety
Label
Label
Extraction
Handle
Figure 152 Front panel of C-OAD2-E-U-4-XXXXXXXX-S board
ED 01 RL
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Table 93 Front panel wiring of C-OAD2-E-U-4-XXXXXXXX-S board

Name Signal
OSC Add (East) East OSC signal input (From OSC board)
OSC Drop (East) East OSC signal output (to OSC board)
OSC Add (West) West OSC signal input (From OSC board)
OSC Drop (West) West OSC signal output (to OSC board)
Input (East) East Line signal input (from line)
Output (East) East Line signal output (to line)
Add A (East) East A nm signal add (from corresponding transponder)
Drop A (East) East A nm signal drop (to corresponding transponder)
Add B (East) East B nm signal add (from corresponding transponder)
Drop B (East) East B nm signal drop (to corresponding transponder)
Add C (East) East C nm signal add (from corresponding transponder)
Drop C (East) East C nm signal drop (to corresponding transponder)
Add D (East) East D nm signal add (from corresponding transponder)
Drop D (East) East D nm signal drop (to corresponding transponder)
Express Ch In (East) East express signal input
Express Ch Out (East) East express signal output
Input (West) West Line signal input (from line)
Output (West) West Line signal output (to line)
Add A (West) West A nm signal add (from corresponding transponder)
Drop A (West) West A nm signal drop (to corresponding transponder)
Add B (West) West B nm signal add (from corresponding transponder)
Drop B (West) West B nm signal drop (to corresponding transponder)
Add C (West) West C nm signal add (from corresponding transponder)
Drop C (West) West C nm signal drop (to corresponding transponder)
Add D (West) West D nm signal add (from corresponding transponder)
Drop D (West) West D nm signal drop (to corresponding transponder)
Express Ch In (West) West express signal input
Express Ch Out (West) West express signal output
N.B. (A, B, C and D) can respectively be (1470, 1490, 1510 and 1530) or (1550, 1570, 1590
and 1610).
LEDs signification
Table 94 Meaning of C-OAD2-E-U-4-XXXXXXXX-S board front panel LEDs

ED 01 RL
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3.7.6 C-OAD2-U-4-XXXXXXXX

Ch1～4 Output Input Ch1～4
PIN AMP
OADM
X1
5%
95%
in out
95%
out in
5%
OADM
X2
PIN AMP

Ch1～4 Input Output Ch1～4
Figure 153 C-OAD2-U-4-XXXXXXXX block diagram
3.7.6.1 Description
This board (C-OAD2-U-4-XXXXXXXX) is used to add and drop FOUR Channels per direction in the
There are 2 types of 4-channel C-OAD2 boards; the wavelengths are defined in the following table.
The “XXXXXXXX” can be the values listed in the following table.
Table 95 4-channel C-OAD2 modules for unidirectional application

Number (XXXXXXXX) 4747494951515353 5555575759596161
Add/Drop Channels (nm) 1470,1490,1510,1530 1550,1570,1590,1610
Thus there are two kinds of C-OAD2-U-4-XXXXXXXX boards.
ED 01 RL
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The C-OAD2-U-4-XXXXXXXX unit’s add & drop channels sequence is defined by the following table:
Table 96 Add & Drop channels Sequence

Add & Drop Wavelength (nm) Channel
C-OAD2-U-4-4747494951515353 C-OAD2-U-4-5555575759596161 Number
1470 1550 1
1490 1570 2
1510 1590 3
1530 1610 4
The optical characteristics of the board are as follows:
Table 97 C-OAD2-U-4-XXXXXXXX board optical characteristics

Fiber Specs Type
Connector type MU
ED 01 RL
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Extraction
Handle
Line East in Line West in

E W
Line East out Line West out
East A nm signal add A-E A-W West A nm signal add

East A nm signal drop West A nm signal drop
East B nm signal add West B nm signal add
East B nm signal drop B-E B-W
West B nm signal drop
East C nm signal add West C nm signal add
C-E C-W
East C nm signal drop West C nm signal drop
East D nm signal add West D nm signal add
East D nm signal drop D-E D-W
West D nm signal drop
East express signal add E W West express signal add

East express signal drop West express signal drop
Optical Safety
Label
Label
Extraction
Handle
Figure 154 Front panel of C-OAD2-U-4-XXXXXXXX board
ED 01 RL
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Table 98 Front panel wiring of C-OAD2-U-4-XXXXXXXX board

Name Signal
Input (East) East Line signal input (from line)
Output (East) East Line signal output (to line)
Add A (East) East A nm signal add (from corresponding transponder)
Drop A (East) East A nm signal drop (to corresponding transponder)
Add B (East) East B nm signal add (from corresponding transponder)
Drop B (East) East B nm signal drop (to corresponding transponder)
Add C (East) East C nm signal add (from corresponding transponder)
Drop C (East) East C nm signal drop (to corresponding transponder)
Add D (East) East D nm signal add (from corresponding transponder)
Drop D (East) East D nm signal drop (to corresponding transponder)
Express Ch In (East) East express signal input
Express Ch Out (East) East express signal output
Input (West) West Line signal input (from line)
Output (West) West Line signal output (to line)
Add A (West) West A nm signal add (from corresponding transponder)
Drop A (West) West A nm signal drop (to corresponding transponder)
Add B (West) West B nm signal add (from corresponding transponder)
Drop B (West) West B nm signal drop (to corresponding transponder)
Add C (West) West C nm signal add (from corresponding transponder)
Drop C (West) West C nm signal drop (to corresponding transponder)
Add D (West) West D nm signal add (from corresponding transponder)
Drop D (West) West D nm signal drop (to corresponding transponder)
Express Ch In (West) West express signal input
Express Ch Out (West) West express signal output
N.B. (A, B, C and D) can respectively be (1470, 1490, 1510 and 1530) or (1550, 1570, 1590
and 1610).
LEDs signification
Table 99 Meaning of C-OAD2-U-4-XXXXXXXX board front panel LEDs

ED 01 RL
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3.8 ESC-LC board
The ESC-LC is low cost ESC (Equipment and Shelf Controller) and integrated function of I-LINK-M. It is
the hardware platform designed to support the Equipment Controller (EC) functions and the Shelf
Controller (SC) functions.
The EC functions are the processing activities concerning the ”Virtual Equipment Control Element”
(VECE) function:
Virtual Machine Management Function (VMMF)

Message Communication Function (MCF)
The SC functions are the processing activities concerning the ”Physical Equipment Control Element”
(PECE) function:
Physical Machine Management Function (PMMF)

Basic Process Control Function (BPCF)
It provides the resources to support the SW functions related to the physical machine control and
management and configuration provisioning.
The ESC-LC consists in a double processor board. It is mainly composed of:
An ESC-LC mother board

A daughter board achieving the EC function and SC function in two processors.
A non-volatile mass storage device PCMCIA 2.1 compatible (compact flash card).
Both EC and SC functions are realized using a daughter card. They are plugged on the ESC-LC
mother board. The daughter card is developed in order to provide a common HW (and SW) platform
for different applications requiring a Shelf Controller (SC) function. The processors used are members
of Motorola MPC860 family.
Various kinds of serial communication channels and parallel I/O ports for alarm & status signals are
provided by the ESC-LC card.
ED 01 RL
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URG LED(Red) URG/SC SC (Red/Green)

NURG LED(Red) NUR/EC EC (Red/Green)
ATTD LED(Yellow) ATD/S1 Slave 1(Yellow)
ABN LED(Yellow) ABN/S2 Slave 2(Yellow)
IND LED(Yellow) IND/S3
Slave 3(Yellow)
ACO ALARM Cut Off Push Button
LAT Lamp Test Push Button
RST RESET Push Button
CONN S1
CONN S2 I-LINK Slave1 connector
I-LINK Slave2 Connector

CONN S3
I-LINK Slave3 Connector

CRAFT
F Interface Connector
SC_DBG Interface RJ45
EC_DBG Interface RJ45
Figure 155 Front panel of ESC-LC board
ED 01 RL
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3.8.1.1 Front panel connectors
Table 100 Front panel connectors of the ESC board

Name Type
I-LINK Slave 1 RS485 connector (I-LINK interface) (see section 2.7.2.6)
F Interface SUB-D 9 pins connector (see section 2.7.2.4)
DBG_SC RJ45 connector (see section2.7.2.5)
DBG_EC RJ45 connector (see section2.7.2.5)
3.8.1.2 LEDs signification
Table 101 Meaning of ESC front panel LEDs signification

URG Red Critical or major alarm appears.
NURG Red Major alarm appears.
ATTD Yellow After pressing ACO or LAT button.
Abnormal condition appears or after pressing LAT
ABN Yellow
button.
IND Yellow Non-alarmed event is declared.
Green: SC/EC is in normal operation.
SC
Red: hardware failure on SC/EC.
Green, Red, Yellow
Yellow: SC/EC is booting or restarting, or after
EC
pressing the LAT button.
S1
The slave shelf is powered on and the I-LINK
S2 Yellow
connection is correct.
S3
N.B. Before the communication between EC and SC is established:
When the RST push button is pressed, EC & SC LED’s status doesn’t change.
When the SC is restarted and the communication between EC and SC is not established, the EC LED is
red and the SC LED is green.
N.B. When the communication between EC & SC is re-established, both EC & SC LEDs are green.
N.B. On the Craft Terminal (C.T.) and on the Operation System (O.S), the application of the
URGENT (URG), NOT URGENT (NURG) and INDICATIVE alarm are named in a different
way; the relation between this two terminology is explained in the following table.
Table 102 Relation between alarm severity terminology displayed on C.T./O.S. and alarm severity
terminology used for the ESC-LC LEDs and ETSI market rack (TRU)
Alarm severity terminology on C.T. and Alarm severity terminology used for ESC
O.S. LEDs and for TRU in the rack
CRITICAL or MAJOR URG, T*URG, T*RURG
MINOR T*NURG, T*RNURG
WARNING INDICATIVE
INDETERMINATE (not used) -
ED 01 RL
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3.9 C-4xANY card
2.5G
Signal
Figure 156 C-4xANY block diagram
3.9.1 Description
The 4xANY unit is a TDM concentrator that enables to the multiplexing in the time domain of up to
4 ”Low Bit-rate” signals into one at 2.5 Gbit/s:
4 x Fast Ethernet
4 x FDDI
4 x ESCON
4 x Digital Video
4 x STM-1
3 x STM-4
2 x Gigabit Ethernet
2 x Fiber Channel or FICON
Some mixes are also possible:
ED 01 RL
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2 x (FDDI or FE or DV or ESCON or STM-1) + 1 x (FC or GbE or FICON)
1 x (FDDI or FE or DV or ESCON or STM-1) + 1 x STM-4 +1 x (FC or GbE or FICON)
2 x (FC or GbE or FICON)
The architecture of the TDM concentrator board is based on the concept of virtual concatenation, and
on the mapping of SDH on OTN:
The data traffic is packed into VC-4 structures (virtually concatenated).

The VC-4s are groomed into a STM-16 structure.
The next figure explains the allocation of the VC-4.
Figure 157 VC-4 allocation

The board is divided into:
One mother board

One daughter board
1 to 4 drawers plugged into the mother or daughter board (2 on each one).
The board consists essentially of:
Slots for bi-directional client optical interfaces

One 2.5 Gbit/s transceiver
FPGAs for the mapping function:
Two dedicated to the concatenation into virtual VC-4 structures (2xANY)
One dedicated to the STM-16 frame termination (Pontaccio)
One STM-6 regenerator section termination (Passtru)
One alarm and control unit (Mascon)
Receivers and transmitters can be locked to either the received clock or the local clock:
Default configuration: Tx locked to the local clock and Rx locked to the received clock.
Loopback configuration. Loopback and Continue managed.
ED 01 RL
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Three different kinds of drawers are provided:
High frequency 1310nm optical interface drawers (Gigabit Ethernet, Fiber Channel), which can
be plugged only into the ports #3 & #4 (HF_1310_DRAWER).
STM-1/4 drawers, which can be plugged into any slots. But, the STM-4 Bit rate can only be set for
ports #3 and #4 (SDH-SONET_1310_DRAWER).
Particular Case: For the 3 STM-4 configuration, slot #1 is exceptionally occupied by a STM-4
bit rate.
Low frequency drawers (Fast Ethernet, FDDI, ESCON, Digital Video) with 1310nm optical
interfaces, which can be plugged in any slots (LF_1310_DRAWER).
High frequency drawers are equipped with 850nm detectors and lasers. The following rules for
the position of these drawers are only imposed due to the high frequency nature of the drawer
(HF_850_DRAWER).
Low frequency drawers are equipped with 850nm detectors and lasers. The rules followed for the
position of these drawers are only imposed due to the low frequency nature of the drawer
(LF_850_DRAWER).
Furthermore, a limited number of configurations of drawers can be provided. Rules must be followed:
If High Frequency drawer is plugged into ports #3, port #1 must be non-provisioned.
If High Frequency drawer is plugged into ports #4, port #2 must be non-provisioned.
For each 2xANY, the following table lists the allowed configurations. Configurations for the two
2xANY are independent.
Table 103 Allowed drawers association in each 2xANY

2xANY #1 2xANY #2
Drawer #1 Drawer #3 Drawer #2 Drawer #4
Not Provisioned High Frequency Not Provisioned High Frequency
Low Frequency / STM-1 Low Frequency / STM-1
Low Frequency / STM-1 Low Frequency / STM-1
/ STM-4 / STM-4
High Frequency / Low
Low Frequency / STM-1
Not Provisioned Frequency / STM-1 / Low Frequency / STM-1
/ STM-4
STM-4
High Frequency / Low
Low Frequency / STM-1
Low Frequency / STM-1 Not Provisioned Frequency / STM-1 /
/ STM-4
STM-4
STM-4 STM-4 Not Provisioned STM-4
Any couple (DRW#1; DRW#3) can be associated to any couple (DRW#2; DRW#4) except for the last
Line (3 x STM-4 configuration is fixed for the 4 drawers).
ED 01 RL
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The following table shows the allowed data type for each kind of drawer:
Table 104 Client Data Type configuration for drawer

LF_1310_ LF_850_ HF_1310_ HF_850_ STM-1/4_
Drawer Drawer Drawer Drawer Drawer
Other Y Y Y Y Y
FastEthernet100 Y Y N N N
ESCON Y Y N N N
DigitalVideo Y Y N N N
FiberChannel N N Y Y N
GigabitEthernet N N Y Y N
FICON N N Y Y N
FDDI Y Y N N N
STM-1 N N N N Y
STM-4 N N N N Y*
3.9.2 C-4xANY optical characteristics
User Rx (1 to 4 on the board)
Table 105 User Rx specification 1310nm

Multi-mode
Fiber type
62.5 / 125 µm
High Frequency
Sensitivity @ BER = 10-10 -20 dBm
Overload @ BER = 10 -10
-3 dBm
Maximum optical path penalty NA dB
Maximum receiver reflectance 12 dB
STM-1, STM-4
-8 dBm
Maximum receiver reflectance - dB
Low Frequency
-8 dBm
Maximum receiver reflectance 12.5 dB
User Tx (1 to 4 on the board)
ED 01 RL
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Table 106 User Rx specification 1310nm
Fiber type Single-mode
High Frequency
Maximum RMS width 4 nm
Minimum side mode suppression ratio NA dB
Optical output power Min: -12; Max:-3 dBm
Minimum extinction ratio 9 dB
Shutdown time <5 ms
Re-activation time <30 ms
STM-1, STM-4
Maximum RMS width 2.5 nm
Optical output power Min: -15; Max: -8 dBm
Minimum extinction ratio 8.2 dB
Shutdown time <5 ms
Low Frequency
Maximum RMS width 2.5 nm
Optical output power Min: -15; Max: -8 dBm
Minimum extinction ratio 8.2 dB
Shutdown time <5 ms
In the following table, the specifications of optical ports used in 850nm drawers are displayed.
User Rx (1 to 4 on the board)
Table 107 User Rx specification (850nm)

Fiber type Multi-mode, 62.5 / 125 µm
High Frequency
Sensitivity @ BER = 10 -10
-17 dBm
Overload @ BER = 10-10 0 dBm
Maximum receiver reflectance -12 dB
Low Frequency
0 dBm
Maximum receiver reflectance 12 dB
ED 01 RL
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User Tx (1 to 4 on the board)
Table 108 User Tx specification (850nm)

Fiber type Multi-mode, 62.5 / 125 µm
High Frequency
Optical output power Min: -9.5; Max: -1.5 dBm
Shutdown time <0.5 ms
Low Frequency
Optical output power Min: -9.5; Max: -1.5 dBm
Shutdown time <0.5 ms
The laser state of drawer should be set forced on when setting local loopback.
On the CWDM side of the C-4xANY board, I16, S16.1, L16.1, L16.2, I16_DDM, S16.1_DDM, PIN
and APD can be set. Please refer to chapter 3.1.2 for the optical parameters.
In R3.2A, B1 monitoring can be performed on the line side of C-4xANY board. But the J0 processing
is not supported.
ED 01 RL
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CWDM signal
Figure 158 Front panel of C-4xANY board
ED 01 RL
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Table 109 Meaning of C-4xANY card front panel LEDs
PWR Green This LED is ON when the power supply is in range of standard.
OOS Yellow LED is on when the board is un-configured or mismatching.
Rx Abnormal: problem on the receive side.
Board is un-configured or mismatching.
RXA Yellow ILOS on STM-16 side
ILOS on drawers
Managed by the SW.
Tx Abnormal: problem on the transmit side. Managed by the SW.
LED is on when:
TXA Yellow
Drawer of Line SFP module laser is forced off.
Tx Fault alarm is present.
Hardware Failure:
Green Green when the board is plugged, configured and without failure.
Orange Orange when the board is in downloading state or after pressing LAT button.
Red Red when the On Board Power Supply (OBPS) is in failure (or on the power
supply alarms).
ED 01 RL
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3.10 OSC unit
The OSC board receives data from the ESC-LC board, and transmits it to the optical fiber line; On the
other hand, OSC board receives data from the optical fiber line and transmits it to the ESC-LC board.
The supervision unit is composed of two optical transceivers (OSC channel receiver and transmitter)
and a FPGA dedicated to the supervision frames management and OSC alarms and status collection.
Thus the OSC board can deal with two data communication channels (DCC1 and DCC2), one for
each direction.
3.10.1 Description
For this release, the functionalities supported by the OSC board are the following:
Management of one or two bidirectional supervision streams at 2048 Kbit/s. For Line terminal
applications. There is one supervision stream. For back to back or OADM applications, there are
two.
Management of Data Communication Channels DCC1 and DCC2.
The configurations of Line Terminal or back to back terminals and OADM are done by software.
3.10.2 Functional description of the configurations
As described in the two following figures, the data of OSC channel at 1310nm are sent to the matrix in
a 2 Mbit/s signal to the supervision frame management functional block. This block generates one/or
two TDM signals according to the NE configuration.
SFP
module
Tx 1
optical
transmitter C-MDX
or C-OAD
Rx 1 board
optical
Matrix
receiver
Supervision frame
management
TDM1
ESC-LC
board
Figure 159 OSC board in Line Terminal configuration
ED 01 RL
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West East
SFP
SFP module module
Tx 2 Tx 1
optical optical
C-MDX OSC2 transmitter transmitter OSC1 C-MDX
or C-OAD 1310nm 1310nm or C-OAD
board Rx 2 Rx 1 board
optical optical
Matrix
receiver receiver
Supervision frame
management
TDM2 TDM1
ESC-LC board
Figure 160 OSC board in OADM or back to back configuration
Receiver:
Table 110 Rx specification

Fiber type 9/125 Single-mode
Sensitivity @ BER=10-10 -35 dBm
Overload @ BER=10-10 -10 dBm
Maximum receiver reflectance -14 dB
Transmitter:
Table 111 Tx specification

Fiber type 9/125 Single-mode
Maximum -20 dB width 1nm
Minimum side mode suppression ratio 30 dB
Min: -5 dBm
Optical Output power
Max: 0 dBm
Minimum Extinction Ratio 10 dB
N.B. The optical characteristics of these WDM interfaces correspond to the ones of the L-1.1
interfaces.
N.B. All the figures are EOL.
ED 01 RL
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Hardware failure LED OSC2 OSC2 OSC1 OSC1 Extraction hole

Tx Rx Tx Rx
2 1
Electrostatic Discharge Optical Safety

Label Label
Figure 161 Front panel of OSC board
LEDs signification
Table 112 Meaning of OSC board front panel LEDs

Green Green when board is configured correctly. It turns Orange when
Orange in downloading state or after pressing LAT button.
ED 01 RL
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3.11 OMSP unit
OMSP performs optical multiplex section protection.
50/50 Splitter
Rx in Tx out line 1
Tx out line 2
Optical
Switch
Tx out F1 F2 Rx in line 1
F4 F3 Rx in line 2
N.B. The F4 port of optical switch is not used.
Figure 162 OMSP block diagram
3.11.1 Description
An optical signal is received on Rx link coming from the C-MDX/C-OAD board and is split into two
channels (channel 1 and 2) to send towards the CWDM line in the board by a 3dB splitter.
The two optical signals received on CWDM line Rx link are sent to an optical switch. Under the control
of board logic, the optical switch will select one channel optical signal to send towards the
C-MDX/C-OAD board.
The LOS detection is made on each of the two CWDM line RX input channels.
Both splitter and optical switch are double-windows (1270～1350nm, 1460～1620nm) optical
components.
Table 113 Absolute maximum ratings

Symbol Parameter Value Unit
Insertion Loss
IL (Min) dB
West to east IL
IL (Max) 4.0* dB
IL (Min) dB
IL (Max) @ 1270 to
1.9* dB
East to west IL 1350nm
IL (Max) @ 1460 to
2.3* dB
1620nm
* Including connectors and splices
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Rx in Rx in Tx out Tx out
Hardware failure LED line 1 line 2 line 1 line 2 Tx out Rx in Extraction hole
Electrostatic Discharge Optical Safety

Label Label
Figure 163 Front panel of OMSP board
3.11.4 Front panel wiring
Table 114 Front panel wiring of OMSP board

Name Signal
Rx in line 1 CWDM line input signal 1 (from line)
Rx in line 2 CWDM line input signal 2 (from line)
Tx out line 1 CWDM line output signal 1 (to line)
Tx out line 2 CWDM line output signal 2 (to line)
Tx out Selected optical signal output (to C-MDX or C-MDX)
Rx in Protected optical signal input (from C-MDX or C-MDX)
LEDs signification
Table 115 Meaning of OMSP board front panel LEDs

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3.12 I-LINK-S unit
The I-LINK Slave is designated to connect the SPI bus from the Slave shelves only to the ESC-LC unit
only provided in the Master shelf.
SPI BUS
RS485 transcievers
BACK
Alarm & Control RS485

Connector
PANEL
Card
Presence bus RS485 transcievers
and Card Presence
Identification
Figure 164 I-LINK-S block diagram
3.12.1 Description
The I-LINK Slave is designated to be plugged into slot 1 of the slave shelf. The link to the SPI bus is
made via an interface RS485.
The I-LINK Slave unit can be inserted into a shelf (hot insertion) without causing any damage to itself
or to any other unit.
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Extraction
Handle
SP Always off
Always off
Always off
PWR
Power supply alarm LED
Hardware failure LED
Connector for master shelf
Extraction
Handle
Figure 165 Front panel of I-LINK-S board
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3.12.2.1 Front panel connectors
Table 116 Front panel connectors of the I-LINK-S board

Name Type
- RS485 connector (see section 2.7.2.6)
Table 117 Meaning of I-LINK-S front panel LEDs signification

Name Meaning
LED orange ON if there is an alarm on power supply on board. Otherwise LED
PWR
orange off.
Used by SPIDER: The Red LED is turned on (pin set low) by software during software
HWF reset. The Green LED is turned on (pin set low) by software when card configuring is
finished. After pressing LAT button, it turns Orange.
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3.13 General user interfaces
Two main functions are supported by vary small units:
Provide the power supply to the other units

Provide the electrical interface to operators
3.13.1 Power Supply Card
Two power supply units are used: a) working and b) protecting. They are located in the slots 7 and 12
of the compact shelf or slot 25 and 48 of the CO shelf. These boards provide some +3.6 V and +5.5
V for service use to all units and a -48/-60 V power supply when needed.
The input voltage range of the Power Supply Cards is -36 / -72 V.
Front panel Connector: Sub-D 3 poles
LEDs signification
Table 118 Meaning of Power Supply Card LEDs signification

Hardware Failure:
GREEN when the board is plugged, configured and without failure
RED when one of the On Board Power Supply (OBPS) is in failure (or on the power
supply alarms).
ORANGE after pressing LAT button.
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3.13.2 Power Management Unit (PMU)
The PMU is strictly dedicated to the 1692MSE compact shelf.

It is an external shelf able to feed the compact shelf providing the -48/-60Vdc to the power supply
cards.
Hence the 1692MSE compact shelf can be fed
By the classical -48/-60Vdc provided by the telecom rack,
By the -48V/-60Vdc provided by the PMU, able to deliver this powering from any alternative
voltage source.
The PMU is an external shelf of the same size that the 1692MSE compact shelf, which can be installed
in 19“ and 21“racks. This additional shelf is 1U high (1U = 44.45mm).
The PMU works in a worldwide environment, which applies to the following requirements:
US requirements: NEBS compliant (115V/ 60Hz),
Europe requirements (230V/ 50Hz).
PSC boards are connected to the rectifiers of the PMU which provide the power.
Figure 166 PMU cabling scheme

3.13.2.1 Description
The PMU architecture is made up of:

2 VAC inputs
2 VDC outputs without fuses
1 battery connection
One control unit
2 rectifiers modules
On DC voltage outputs, no fuses are required because the 1692MSE compact shelf has on his PSC
unit fuses on inputs. The outputs are connected together, so they can protect the DC outputs.
Two rectifiers modules are present in one PMU. Each module is able to supply with power up to 4
stacked 1692MSE compact shelf.
One module enables to supply the 4 stacked shelves. If one module fails, the other one can still supply
the 4 shelves.
The Control Unit must be able to provide the following functions:

Deliver 2 outputs -48/-60Vdc
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Manage the battery
Manage Status LEDs.
Figure 167 PMU block diagram
3.13.2.2 Batteries for PMU
Batteries are optional units used with the PMU in order to supply the -48/-60V to the 1692MSE
compact shelf in case of power outage of the alternative power source (100V/115V/220V supply).
Battery units are linked to the Control unit of the PMU by cascading the units.
The first battery gives a temperature measurement of the unit to the PMU so as to generate an alarm
when out of the range.
It is possible to add up to three optional batteries. This depends of the current consumption of the
shelves (150W per battery).
Performance.
The battery must be charged in a maximum of 15 hours with 1 PMU and 1 shelf.
The battery must be charged in a maximum of 60 hours with 1 PMU and 4 shelves.
The battery duration for 150W must be of 3 hours.
Mechanical dimension of each battery: W = 446.02 mm; L = 284 mm; H = 133.35 mm.
Batteries can be inserted in a 19“ and 21“ (ETSI) rack or put on table.
In Rack Version, the batteries are located below the PMU.
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Figure 168 Minimum configuration of the batteries in 1692MSE R3.0, rack version
In table version, batteries are located and stacked besides the PMU and 1692MSE compact shelves;
only this configuration is supported since a battery is not likely to hold the full stack of batteries, PMU
and shelves.
Figure 169 Maximum configuration of the batteries in 1692MSE R3.0, table version
The following figure is the front panel of PMU.
Figure 170 PMU front panel
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Connectors:
5) Battery connector. It has to be connected to the (optional) back-up battery.

6) Output power connector. Sub-D 3p to be connected to the two PSC(2) cards.
7) Not used in this release.
8) AC input power connector. To be connected to the primary AC power supply (100V/50–60Hz,
115V/60Hz, 230V/50Hz)
LEDs signification
Table 119 Meaning of PMU LEDs signification

Name Meaning
MAJOR alarm. The LED is
– GREEN when the board is plugged and without failure
1) – RED when the alarm is present (raised only if PMU_Presence). It is the OR of
Green/Red • Both rectifiers are missing or both rectifiers input voltage < 85V rms
• Both rectifiers output voltage <38V or >60V
• Both rectifiers temperature >55 C or output current < 12A
MINOR alarm. The LED is
– GREEN when the board is plugged and without failure
2) – RED when the alarm is present (raised only if PMU_Presence). It is the OR of
Green/Red • One rectifier is missing or one rectifier input voltage < 85V rms
• One rectifier output voltage <38V or >60V
• Battery present but battery breaker open
3) BATTERY CONNECTED. The LED is RED if battery connection is failed.
Green/Red The LED is GREEN if battery is connected.
4) TEST BATTERY. The LED is RED if test battery is failed.
Green/Red The LED is GREEN if test battery is OK. The LED is LIT OFF if no battery connected
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3.13.3 Housekeeping board (HK)
1692MSE may interface itself with the user's environment and/or another WDM system to build up
operations maintenance.
To allow these exchanges of information, HK (Housekeeping) unit may be mounted in slot 11 of the
compact shelf or slot 36 of the CO shelf. Its main purpose is to:
Send and receive data, to/from master cards via the SPI bus and to/from the user or another
WDM system throughout the protected I/O interface.
Alarms are provided on failed battery and voltages losses.
Figure 171 Block diagram of control HK board
8 housekeeping accesses are provided in both directions (8 inputs and 8 outputs).

Connector: Sub-D 25 pins
LEDs signification
Table 120 Meaning of HK board LEDs signification

Hardware Failure:
supply alarms).
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3.13.4 Rack Alarm Interface board (RAI)
The Remote Alarm Inventory Card receives signals from the ESC-LC and signals from the Bus Alarm
(FAN-CO alarms and PSC/PSC2/PSC3 alarms). This information is sent to the PDU or the TRU card,
and receives alarm signals from the PDU or TRU card to alert the ESC-LC.
Figure 172 Block diagram of RAI unit
The RAI board can be plugged in the slot 9/10 of the compact shelf or slot 37 of the CO shelf.
2 ways of working are available:
For Interfacing with the PDU

The RAI cards in the same rack are linked to each other. And the RAI card in the master shelf is linked
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with the PDU.
For Interfacing with the TRU

The same methods can be utilized but, in addition, a direct link between each shelf and the TRU can
be used.
The RAI card inputs are alarms coming from the FAN-CO card, from the PSC and from the Equipment
Controller. Taking the various inputs into account the rack lamps are light on or off.
Electrical characteristics:
OPEN: Vmax=72 Volts
CLOSE: Imax=100mA
Voltage difference between Common out and OUT*< 2.5 Volts
Resistance of the closed relay= 300 M.(Max)
Connectors:
SUB-D 9 pins female

RJ11 6pins female
Table 121 Meaning of RAI board LEDs signification

Hardware Failure:
supply alarms).
Rack lamps are different in ETSI and ANSI worlds. The RAI card is made to interface with both
standards.
The available alarms are the following.
PDU Front Panel LED Markings (ANSI):
CRI: Critical alarm from one of the shelves in the rack

MAJ: Major alarm from one of the shelves in the rack
MIN: Minor alarm from one of the shelves in the rack
RACK: Alarm storing from one of the shelves in the rack
TRU Front Panel LED Markings (ETSI):
URG: Urgent: major alarm input from one of the shelves in the rack
NURG: Non urgent: minor alarm input from one of the shelves in the rack
ATTD: Attended: acknowledged URG or NURG alarm
SIG PRES: Signal presence (power on)
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3.13.5 LAN-Q board
IE-LAN INPUT
Ethernet TP-RJ45
IE-LAN OUT
interface
adapter
COAX
TRANSC
Hex rotary switches
EQTYPE
SHELF-ID N.B. If a wire is plugged on RJ45, BNC is
unavailable.
Figure 173 Block diagram of control LAN-Q board
3.13.5.1 Purposes
The purposes of the LAN-Q board are the following:
To provide the physical layer for the QB interface between the Equipment shelf (ESC-LC board)
and an external supervisor (e.g. 1353SH).
To provide the 4 bits Equipment type Codification, necessary for the application stored in the
Equipment Controller.
To provide the 8 bits Shelf Identification number (i.e.: MAC address necessary to build up the IP
address of the shelf where the LAN-Q board is installed.
3.13.5.2 Description
The LAN-Q board has to be plugged in slot #8 of the 1692MSE compact shelf or slot #26 of the CO
shelf. It is linked to the ESC-LC board by a backpanel link.
The link to external supervision equipment is ensured by 2 BNC connectors or by one RJ 45 connector.
The Equipment Type Codification is ensured by the hexadecimal rotary switch CW3.
The Shelf Identification is ensured by the two hexadecimal rotary switches CW1 and CW2.
For a 1692MSE NE, the switches setting values are mandatory (B, F, 5).
Jumper configuration
For operation with the ESC-LC, only the following jumper settings are permitted:
No jumper
Jumper between pins A-D
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Front panel Back panel
6 pins host for jumper
Rotary wheels
Figure 174 LAN-Q board settings
Table 122 Meaning of LAN-Q board LEDs signification

Hardware Failure:
supply alarms).
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3.14 FANS unit
If the power consumption of the WLA is high enough, fans are necessary to dissipate the heat.
3.14.1 FAN-CO unit
The fan is located at the bottom of the shelf. The use of fans requires an air filter be placed just below.
This is shown in the following figure.
ESC-LC
LAN
PSC
PSC
Air filter FAN-CO
Figure 175 Fan shelf description and rack partitioning
One FAN-CO module is placed at the bottom of the shelf, in the slot 49.
The FANS are monitored via SPI bus and some direct wires are sent to the Housekeeping/Remote
Alarms module to monitor a possible failure of the cooling system.
Max Power dissipation per shelf: 400 W.
3.14.2 FAN unit
On the 1692MSE shelf, FAN unit is located on the left side of the compact shelf. The use of fans
requires putting an air filter just aside.
Air
filter
WLA-P/WLA Slot 6 12 PSC2

WLA-P/WLA Slot 5 11 OSC
FAN WLA-P/WLA Slot 4 10
WLA-P/WLA Slot 3 9 OMSP
13 ESC-LC Slot 1 7 PSC2
Figure 176 FAN description and Shelf partitioning

The FAN unit is placed in the left slot of the 1692MSE shelf and is equipped with two fans with
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speedometer sensors to essentially dissipate the heat coming from WLA and C-4xANY boards
essentially. The FAN board is mandatorily provided.
3.14.3 LEDs signification
One bi-color LED on the front-panel of the FAN/FAN-CO card is available.
Table 123 Meaning of FAN/FAN-CO board LEDs signification

Hardware Failure:
GREEN when Power is on.
RED when Hardware failure (HWF).
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MAINTENANCE
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4 MAINTENANCE
ATTENTION EMC NORMS
WHEN CARRYING OUT THE GIVEN OPERATIONS OBWERVE THE NORMS STATED IN PARA.
4.1.2.IN HANDBOOK GUIDE
4.1 Maintenance introduction
4.1.1 General safety rules
SAFETY RULES
Carefully observe the front panel warning labels prior to working on optical connections
while the equipment is in–service.
Should it be necessary to cut off power during the maintenance phase, proceed to switch
off the power supply units as well as cut off power station upstream (rack or station
distribution frame)
SAFETY RULES
DANGER: Possibility of personal injury. Personal injury can be caused by -48 V dc.
DANGER: Possibility of personal injury. Short circuiting, low-voltage, low-impedance,
dc circuits can cause severe arcing that can result in burns and/or eye damage. Remove
rings, watches, and other metal jewelry before working with primary circuits. Exercise
caution to avoid shorting power input terminals.
SAFETY RULES
DANGER: Possibility of eyes damage: read carefully and strictly observe the rules pointed
out in para.3.2.4.2 in Handbook guide.
4.1.2 General rules
Check that the equipment is operating with all the shields properly positioned (dummy covers, ESD
connector protections, etc).
In order to reduce the risk of damage the electrostatic sensitive devices, is mandatory to use the
elasticized band (around the wrist) and the coiled cord joined connect with the ground rack during the
touching of the equipment.
4.1.3 Maintenance - definitions
Maintenance consists of a set of operation which maintain or bring back the assembly to optimum
operating conditions in a very short time, with the aim of obtaining maximum operational availability.
Maintenance is classified as:
ROUTINE (PREVENTIVE)
Routine (preventive) maintenance consists in carrying out a number of periodic operations to minimize
the risk of a failure on a link.
These operations can be scheduled or initiated by the equipment supervision system.
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CORRECTIVE
Corrective maintenance consists in carrying out a minimum number of operations to repair a fault as
rapidly as possible.
These operations are initiated by the equipment supervision system and limited to replacement of
boards.
Definition of the technical level of the maintenance agent:

It is mandatory for the technicians in charge of the equipment maintenance to be familiar with the
measurement techniques used on equipment fitted with optical connectors.
4.1.4 Instruments And Accessories
There is a local terminal (PC) which permits to display all the alarms and manages the Equipment.
The relative processing is described in the operator’s handbook.
Where TMN is implemented, an Operation System displays alarms and manages all the connected
Equipments of the network. Refer to the relevant handbooks.
The need of special tools and accessories to perform possible routine and corrective maintenance
procedures is described inside the procedures themselves.
4.2 Preventive maintenance
The ALCATEL1692MSE equipment requires no systematic preventive maintenance.
4.2.1 Routine maintenance every year
SAFETY RULES
DANGER: Possibility of personal injury. Personal injury can be

caused by –48 V dc.
DANGER: Possibility of personal injury. Short circuiting, low-voltage,

low-impedance, dc circuits can cause severe arcing that can result in
burns and/or eye damage. Remove rings, watches, and other metal
jewelry before working with primary circuits. Exercise caution to avoid
shorting power input terminals.
It is suggested to carry out the following operations yearly:
Check that the power cable is perfectly safety grounded.

Make sure that the shelf has been tightly fastened to the rack with screws to guarantee grounding
(the rack is connected to the station ground).
4.2.2 Routine maintenance of fan filter
According to the filter type, it is suggested to carry out the following operations:
Fan filter cleaning (3AL_86633_AA**) for 1692 CO shelf;
Fan filter cleaning (3AN_51151_AA**) for 1692 compact shelf
The fan filter is the practice adopted for equipment installed in locations where the environmental
conditions are compliant to EN 300 019-1-3 edition: 2004, class 3.1 and 3.2.
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SAFETY RULES
DANGER: Possibility of personal injury. Personal injury can be caused

by the rotating fans.
Replace the “Fan filter” from the FAN Shelf as follows:

Unscrew the screws that ensure the fan filter to the fans shelf
Extract the fan filter
Clean the fan filter removing the dust using a brush. It's not recommend to use water (to avoid
rusting the metal parts).
Insert and ensure the “Fan filter” to the “FAN shelf“ using the relevant screw.
N.B. It is required to clean the fan filter every 3 to 6 months. And the fan filter should be replaced
at least once a year. The period can be shorter depending on the location environmental conditions.
4.3 Corrective maintenance (troubleshooting)
Since the troubleshooting procedure is carried out with the use of the Craft Terminal, for details,
please refer to the Maintenance section of 1692MSE R3.2A Operator’s Handbook
(3AL_97869_ADAA) or Troubleshooting Handbook.
ATTACHING THE UNITS (AND MODULES) INTO THE SUBRACK

The screw tightening torque for attaching the units (and modules, if any and if fixed by
screws) into the shelf must be:
2.8 kg x cm (0.28 Newton x m)± 10 %
Exceeding this value may result in the screw breaking.
4.4 Set of spare parts
4.4.1 Suggested Spare Parts
The overall number of spares depends on Customer requirements, and should be based on the
average amount of transmission circuits available to be accounted for not only during MTBF but also
during MTTR; the latter depending on the amount of spare parts available.
4.4.2 General rules on spare parts management
Before storing the spare units make sure that they are working by inserting them in an operating
equipment It is suggested to periodically check those spare units have not been utilized for over a year.
If the spare parts and the equipment are stored in the same environment, make sure that the spare
parts are placed in cabinets to safeguard them from dust and damp.
Moreover, they should also be well grounded to avoid electrostatic discharges.
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If the spare parts are stored in another room, or have to be moved from another place, building or site,
make sure that the following is observed:
The spare parts must be wrapped in anti–static and padded envelopes;

The spare parts must not touch wet surfaces or chemical agents that might damage them (e.g.,
gas);
If during transport the temperature is lower than that of the room where they had been kept,
make sure that before using them they pass a certain period in a climatic chamber to prevent
thermal shocks and/or the possibility of steaming up.
When replacing a unit/sub–unit, make sure that the spare unit/sub–unit is set exactly as the
replaced one.
4.4.3 Particular rules on spare parts management
Whenever some units with flash-memories are common to different kinds of equipment or to different
versions of the same type of equipment, it is possible to maintain one spare part only: this allows spare
part stock saving, even though software downloading will be necessary when the software loaded into
the unit (program part or data part) is different from that necessary in the equipment where the spare
unit must be used.
At the end of the commissioning phase or after an equipment data change, it is suggested to save the
equipment data, e.g. on floppy disk, and store this floppy disk in the spare part stock pointing out the
equipment it refers to.
4.5 Operating advices
For this release 3.2A the user should take into account the following advice about the Equipment.
Software management
At the occurrence of one of the following things, select the CT Environment→Process control from
the main menu to first close the EML-USM process and then restart the NE.
Having changed the IP address if the corresponding IP access mode has been used to manage
the NE.
The EML-USM doesn’t work anymore.
The WLA will not lock frequency when the signal frequency changes from higher to lower, if the higher
frequency is times of lower one, e.g. change from STM-4 to STM-1, the bit rate read for FPGA is till
STM-4 because of the chip's feature. This rule applies on SDH, GE and Fiber channel.
The 3 STM-4 drawer configurations are the only configuration, which support a STM-4 rate in the first
drawer position. Consequently, there is a STM-4 configurations order to respect to avoid having only
one STM-4 drawer left in position 1. This should be followed by a STM-4 drawer de-configuration
order for the same reasons, which is not the case.
Others
The time zone on PC should be set as "(GMT) Casablanca, Monrovia.” This time zone needn't be
changed for daylight savings time.
The button label's language on info-box is the same as the OS default language.
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4.6 Repair Form
To facilitate repair operation, data on the faulty unit must be reported on the form shown in the
following figure. The repair form must be filled-in with as much data as possible and returned to
Alcatel together with the faulty unit.
Figure 177 Repair form
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DISMANTLING & RECYLING
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5 DISMANTLING & RECYCLING
5.1 WEEE general information
A new European directive was published on the 13th of February 2003 on wastes of electrical and
electronic equipment (Directive 2002/96/EC).
The general principle promoted by this directive is the producer responsibility in the management of
the wastes coming from the products he puts on the market. The producer responsibility now covers
the end of life of the products sold.
This new split of responsibility will have impacts on Alcatel practices both as a producer of EEE
equipment but also as an owner of EEE equipment.
From August 13th 2005, Waste electrical and Electronic equipment (e-Waste) directive sets rules in
terms of operational and financial responsibility for the collection and treatment of electrical and
electronic equipment in Europe.
Two responsibility regimes have been defined:
Waste of household equipment. Alcatel only household implication is through its Joint
Venture with TCL on mobile phone ”TAMP”. Alcatel will check the appropriate consideration of
the WEEE directive in the Joint Venture which covers the subject by itself independently from the
Alcatel e-waste implementation project.
Waste of professional equipment. Alcatel owns and produces professional equipment; As a
consequence this Chapter 12 of this handbook focuses on professional equipment responsibility
regime.
There are two e-waste streams to be considered:
Historical e-waste or waste of equipment put on the market before August 13th 2005 Two
possible regimes left open to implementation in each member state:
either the owner of the equipment is responsible
or
the producer of a new equipment which is purchased to replace an old equipment
Future waste or waste of equipment put on the market after August 13th 2005.The producer
of the equipment being sold is responsible unless otherwise specified in contract with Customer.
In order to know when a unit or subrack has been put on the market it is necessary to read the date
present on the Label affixed on the product (refer to para. 4.4 for Label position and type). In the
following figure an example is given:
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FA011963580
Year Week
Alcatel
Location Company Date of production Progressive Number
Example:
FA Alcatel Italy – Città Ducale
01 Last two digits of production year; in the example is 2001
19 Week 19 in year 2001
63580 Product progressive number
Figure 178 Put on the market date
In next paragraphs is given a description example of how to disassemble an equipment; the same
principle can be applied to all the subracks and units composing the equipment.
The unit chosen for disassembly is one of the most complex.
Para. 5.2 describes the equipment disassembly; in detail:
Para. 5.2.1 lists all the units composing the equipment with the relevant Waste code.
Waste code permits to know the weight of the Subrack or Unit and the percentage of
material composing the single item.
Para. 5.2.2 lists the tools necessary for disassembly
Para. 5.2.3 describes the subrack disassembly
Para. 5.2.4 describes the unit disassembly
Para. 5.2.5 describes the procedure to apply in order to manage Hazardous materials and
components (example battery)
Para. 5.3 reports the ECO declaration information.
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5.2 How to disassembly equipment
This equipment is designed for easy disassembly, by using screws and rivets for mechanical assembly
of subracks and modules. The variety of screw types is minimized.
Tools necessary for subrack and units disassembly are reported in para. 5.2.2.
The disassembly process depends on the respective recycling methods and can be derived from the
delivered assembly instructions of the product.
Table 124 and Table 125 list all the units composing the equipment with the relevant Waste code.
Waste code allows to know the weight of the Subrack or Unit and the percentage of material utilized
for the single item.
5.2.1 Waste codes detailed information
In Table 124 and Table 125 are listed all the items composing this equipment.
In the column “Waste Code” it is possible to find the weight and the materials composing each “Part
Number” according to the following rule:
Material Types:
A Alluminium
B Stainless Steel
C Steel
E Cables
F Motors
G Plastic
H Back Panel
J Generic PCB
K PCB with electronic Capacitors
L LCD display ( major than 100 cm2)
M Cathode Ray Tube (Lead, Mercury, Phosfhors)
N Battery (Lithium, Cadmium, Mercury)
X Others
Example:
W1000J60A20X20 Means:
W1000=Overall Weight of the item in grams
J60= 60% Generic PCB = 600 grams
A20= 20% Alluminium = 200 grams
X20= 20% Other materials =200 grams
Figure 179 Waste code interpretation
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Table 124 Items waste codes list
Name Mnemonic ALCATEL Code Waste Code
1692 Metrospan Edge Compact Shelf / 2 - 3AL 97679 AA** t.b.d
1692 Metrospan Edge Compact Shelf / 3 - 3AL 97679 AB** t.b.d
1692 Metrospan Edge CO shelf - 3AL 86607 AA** t.b.d
Optinex rack with TRU & Door - 3AL 37952 AA** t.b.d
Optinex rack with TRU - 3AN 44815 AA** t.b.d
Low Cost Equipment and Shelf Controller ESC-LC 3AL 97690 AA** t.b.d
Local Access Network card LAN-Q 3AL 86653 AA** t.b.d
Power Supply Card PSC 3AL 86652 AA** t.b.d
Power Supply Card2 PSC2 3AL 86888 AA** t.b.d
Power Supply Card3 PSC3 3AL 86652 AB** t.b.d
Compact FAN / 2 FAN 3AL 97682 AA** t.b.d
CO FAN module FAN-CO 3AL 86625 AA** t.b.d
Housekeeping card HK 3AL 86668 AA** t.b.d
Rack Alarm Interface board RAI 3AL 87009 AA** t.b.d
Intershelf Link Slave I-LINK-S 3AL 86808 AA** t.b.d
Optical Multiplex Section Protection card OMSP 3AL 97541 AA** t.b.d
Supervision Management card OSC 3AL 97540 AA** t.b.d
Wavelength Adaptor3 Without O-SNCP WLA3C 3AL 97795 AA** t.b.d

Wavelength Adapte3 With O-SNCP WLA3COP 3AL 97795 AB** t.b.d
OCC10-No Amplified Ch193.300 (1550) OCC10-NA-1550 (193.300) 3AL 95313 AA** t.b.d
OCC10-No Amplified Ch193.000 (1550) OCC10-NA-1550 (193.000) 3AL 95313 AB** t.b.d
OCC10-No Amplified Ch193.100 (1550) OCC10-NA-1550 (193.100) 3AL 95313 AC** t.b.d
OCC10-No Amplified Ch193.200 (1550) OCC10-NA-1550 (193.200) 3AL 95313 AD** t.b.d
OCC10-No Amplified Ch195.900 (1530) OCC10-NA-1530 (195.900) 3AL 95314 AA** t.b.d
OCC10-Enhanced-CWDM (1530) OCC10-EC-1530 8DG81002AA** t.b.d
OCC10-Enhanced-CWDM (1550) OCC10-EC-1550 8DG81002AB** t.b.d
2XGE - 3AL 97800 AA** t.b.d

2XGE-FC - 3AL 97878 AA** t.b.d
SFP transceiver L1.1 RT (1310nm) L1.1 1AB194670002 t.b.d

SFP transceiver 2M (1310nm) 2M 1AB209860001 t.b.d
SFP transceiver S1.1 (1310nm) B&W S1.1 1AB194670001 t.b.d
S1.1_DDM 1AB194670004 t.b.d
DDM
L1.2_DDM 1AB194670006 t.b.d
DDM
S16.1_DDM 1AB196370006 t.b.d
DDM
L16.1 1AB196370004 t.b.d
DDM
L16.2 1AB196370003 t.b.d
DDM
S4.1_DDM 1AB196360004 t.b.d
DDM
L4.2_DDM 1AB196360007 t.b.d
DDM
SFP transceiver I16 (1310nm) B&W I16 1AB196370002 t.b.d
SFP transceiver I16 (1310nm) B&W with DDM I16_DDM 1AB196370005 t.b.d
SFP transceiver 1000Base-SX (850nm) B&W GbE_SX 1AB187280002 t.b.d
SFP transceiver 1000Base-SX (850nm) B&W
GbE_SX_DDM 1AB187280033 t.b.d
with DDM
SFP transceiver 1000Base-LX (1310nm) B&W GbE_LX 1AB187280001 t.b.d
SFP transceiver 1000Base-LX (1310nm) B&W
GbE_LX_DDM 1AB187280031 t.b.d
with DDM
SFP transceiver 1000Base-ZX (1550nm) B&W
GbE_ZX_DDM 1AB187280042 t.b.d
with DDM
SFP transceiver FC/2FC-SX (850nm) B&W
2FC SX_DDM 1AB187280037 t.b.d
with DDM
SFP transceiver FC/2FC-LX (1310nm) B&W
2FC LX_DDM 1AB187280038 t.b.d
with DDM
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1470_Bronze 1AB196340001 t.b.d
receiver (1470nm)
1490_Bronze 1AB196340002 t.b.d
receiver (1490nm)
1510_Bronze 1AB196340003 t.b.d
receiver (1510nm)
1530_Bronze 1AB196340004 t.b.d
receiver (1530nm)
1550_Bronze 1AB196340005 t.b.d
receiver (1550nm)
1570_Bronze 1AB196340006 t.b.d
receiver (1570nm)
1590_Bronze 1AB196340007 t.b.d
receiver (1590nm)
1610_Bronze 1AB196340008 t.b.d
receiver (1610nm)
1470_Silver 1AB196350001 t.b.d
1490_Silver 1AB196350002 t.b.d
1510_Silver 1AB196350003 t.b.d
1530_Silver 1AB196350004 t.b.d
1550_Silver 1AB196350005 t.b.d
1570_Silver 1AB196350006 t.b.d
1590_Silver 1AB196350007 t.b.d
1610_Silver 1AB196350008 t.b.d
1470_Bronze_DDM 1AB196340009 t.b.d
1470_Silver_DDM 1AB196350026 t.b.d
4xANY Host card C-4xANY 3AL 95063 AA** t.b.d

High speed 1310nm optical drawer HF_1310 Drawer 3AL 86672 AA** t.b.d
Low speed 1310nm optical drawer LF_1310 Drawer 3AL 86674 AA** t.b.d
High speed 850nm optical drawer HF_850 Drawer 3AL 86870 AA** t.b.d
Low speed 850nm optical drawer LF_850 Drawer 3AL 86869 AA** t.b.d
STM-1/4 optical drawer/2 SDH_1310 Drawer 3AL 95284 AA** t.b.d
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Unidirectional MUX/DEMUX without OSC
C-MDX-U 3AL 97538 AB** t.b.d
filter
Unidirectional MUX/DEMUXE with OSC filter C-MDX-E-U-S 3AL 97769 AA** t.b.d
Bi-directional MUX/DEMUX without OSC filter C-MDX-B 3AL 97538 AC** t.b.d
Bi-directional MUX/DEMUX with OSC filter C-MDX-B-S 3AL 97538 AD** t.b.d
Unidirectional MUX/DEMUX2 without OSC filter C-MDX2-U 3AL 97654 AA** W885A5B36E7G5J47
Unidirectional MUX/DEMUX2E with OSC
C-MDX2-E-U-S 3AL 97772 AA** W880A5B36E7G5J47
filter
1-channel unidirectional MUX/DEMUX2E with
C-MDX2-E-1-S 3AL 97772 BA** W700A7B45E2G4J42
OSC filter
C-MDX2-E-2-4749-S 3AL 97772 CA** W775A6B41E4G3J46
2-channel unidirectional MUX/DEMUX2E with C-MDX2-E-2-5153-S 3AL 97772 CB** W775A6B41E4G3J46
OSC filter C-MDX2-E-2-5557-S 3AL 97772 CC** W775A6B41E4G3J46
C-MDX2-E-2-5961-S 3AL 97772 CD** W775A6B41E4G3J46
C-OAD-U-1-4747 3AL 97539 AB** t.b.d

C-OAD-U-1-4949 3AL 97539 AC** t.b.d
C-OAD-U-1-5151 3AL 97539 AD** t.b.d
1-channel unidirectional OADM without OSC C-OAD-U-1-5353 3AL 97539 AE** t.b.d
filter C-OAD-U-1-5555 3AL 97539 AF** t.b.d
C-OAD-U-1-5757 3AL 97539 AG** t.b.d
C-OAD-U-1-5959 3AL 97539 AH** t.b.d
C-OAD-U-1-6161 3AL 97539 AJ** t.b.d
C-OAD-E-U-1-4747-S 3AL 97770 AA** t.b.d

C-OAD-E-U-1-4949-S 3AL 97770 AB** t.b.d
C-OAD-E-U-1-5151-S 3AL 97770 AC** t.b.d
1-channel unidirectional OADME with OSC C-OAD-E-U-1-5353-S 3AL 97770 AD** t.b.d
filter C-OAD-E-U-1-5555-S 3AL 97770 AE** t.b.d
C-OAD-E-U-1-5757-S 3AL 97770 AF** t.b.d
C-OAD-E-U-1-5959-S 3AL 97770 AG** t.b.d
C-OAD-E-U-1-6161-S 3AL 97770 AH** t.b.d
C-OAD2-U-1-4747 3AL 97653 AA** W867A5B37E6G5J47

C-OAD2-U-1-4949 3AL 97653 AB** W867A5B37E6G5J47
C-OAD2-U-1-5151 3AL 97653 AC** W867A5B37E6G5J47
1-channel unidirectional OADM2 without C-OAD2-U-1-5353 3AL 97653 AD** W867A5B37E6G5J47
OSC filter C-OAD2-U-1-5555 3AL 97653 AE** W867A5B37E6G5J47
C-OAD2-U-1-5757 3AL 97653 AF** W867A5B37E6G5J47
C-OAD2-U-1-5959 3AL 97653 AG** W867A5B37E6G5J47
C-OAD2-U-1-6161 3AL 97653 AH** W867A5B37E6G5J47
C-OAD2-E-U-1-4747-S 3AL 97771 AA** W880A5B36E7G5J47

C-OAD2-E-U-1-4949-S 3AL 97771 AB** W880A5B36E7G5J47
C-OAD2-E-U-1-5151-S 3AL 97771 AC** W880A5B36E7G5J47
1-channel unidirectional OADM2E with OSC C-OAD2-E-U-1-5353-S 3AL 97771 AD** W880A5B36E7G5J47
filter C-OAD2-E-U-1-5555-S 3AL 97771 AE** W880A5B36E7G5J47
C-OAD2-E-U-1-5757-S 3AL 97771 AF** W880A5B36E7G5J47
C-OAD2-E-U-1-5959-S 3AL 97771 AG** W880A5B36E7G5J47
C-OAD2-E-U-1-6161-S 3AL 97771 AH** W880A5B36E7G5J47
C-OAD-U-2-47474949 3AL 97539 PA** W885A5B36E7G5J47

2-channel unidirectional OADM without OSC C-OAD-U-2-51515353 3AL 97539 QA** W885A5B36E7G5J47
filter C-OAD-U-2-55555757 3AL 97539 RA** W885A5B36E7G5J47
C-OAD-U-2-59596161 3AL 97539 SA** W885A5B36E7G5J47
C-OAD-E-U-2-47474949-S 3AL 97770 BA** W905A5B35E9G5J46

2-channel unidirectional OADME with OSC C-OAD-E-U-2-51515353-S 3AL 97770 BB** W905A5B35E9G5J46
filter C-OAD-E-U-2-55555757-S 3AL 97770 BC** W905A5B35E9G5J46
C-OAD-E-U-2-59596161-S 3AL 97770 BD** W905A5B35E9G5J46
C-OAD2-U-2-47474949 3AL 97653 BE** W885A5B36E7G5J47

2-channel unidirectional OADM2 without C-OAD2-U-2-51515353 3AL 97653 BF** W885A5B36E7G5J47
OSC filter C-OAD2-U-2-55555757 3AL 97653 BG** W885A5B36E7G5J47
C-OAD2-U-2-59596161 3AL 97653 BH** W885A5B36E7G5J47
2-channel unidirectional OADM2E with OSC C-OAD2-E-U-2-47474949-S 3AL 97771 BA** W900A5B35E8G5J47
filter C-OAD2-E-U-2-51515353-S 3AL 97771 BB** W900A5B35E8G5J47
ED 01 RL
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C-OAD2-E-U-2-55555757-S 3AL 97771 BC** W900A5B35E8G5J47
C-OAD2-E-U-2-59596161-S 3AL 97771 BD** W900A5B35E8G5J47
4-channel unidirectional OADM2 without C-OAD2-U-4-47495153 3AL 97653 CA** t.b.d

OSC filter C-OAD2-U-4-55575961 3AL 97653 CC** t.b.d
4-channel unidirectional OADM2E with OSC C-OAD2-E-U-4-47495153-S 3AL 97771 CA** t.b.d
filter C-OAD2-E-U-4-55575961-S 3AL 97771 CB** t.b.d
C-OAD-B-1-4755 3AL 97539 FA** W933A5B34E9G4J48

1-channel bi-directional OADM without OSC C-OAD-B-1-4957 3AL 97539 GA** W933A5B34E9G4J48
filter C-OAD-B-1-5159 3AL 97539 HA** W933A5B34E9G4J48
C-OAD-B-1-5361 3AL 97539 JA** W933A5B34E9G4J48
C-OAD-B-1-4755-S 3AL 97539 BA** W948A5B33E8G5J49

1-channel bi-directional OADM with OSC C-OAD-B-1-4957-S 3AL 97539 CA** W948A5B33E8G5J49
filter C-OAD-B-1-5159-S 3AL 97539 DA** W948A5B33E8G5J49
C-OAD-B-1-5361-S 3AL 97539 EA** W948A5B33E8G5J49
N.B. 2XGE board and 2XGE-FC board have the same function. 2XGE with P/N 3AL97800AA**
only support DC48V, while 2XGE-FC with P/N 3AL97878AA** can support DC48/60V.
N.B. PSC3 board is only used on CO shelf.
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5.2.2 Tools necessary for disassembly
The following tools are necessary for unit disassembly:
# T9 TORX screw driver

# T20 TORX screw driver
Crosshead screwdriver
Wrench #
Scissors
Protection gloves
5.2.3 Subrack disassembly
Figure 180 and Figure 181 is shown an example of subrack.
The same rules can be applied to the specific equipment to be dismantled. The front panel of the
subrack can be removed by loosing the two handles.
Figure 180 Subrack front view
Figure 181 Subrack rear view
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Procedure:
Remove the screws in order to disassemble the top cover as reported in the following figure.
Figure 182 Top cover removing
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Unscrew all the screws present on back cover as reported in the following figure.
Remove the rear cover in order to access the subrack Back Panel.
Figure 183 Back cover removing
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Unscrew all the screws fastening the back board to the mechanical structure of the subrack as
indicated in the following figure.
Remove the back board from the subrack mechanical structure.
Figure 184 Back board removing
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Remove the guides from the subrack as indicated in the following figure.
Figure 185 Guides removing
ED 01 RL
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Unscrew the screws fastening the dummy front panel to the mechanical structure of the subrack.
And pick out the fixing bars as indicated in the following figure.
Figure 186 Dummy front panels and fixing bars removing
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Remove the side wall by unscrewing all the relevant screws as indicated in the following figure.
1 Fixing bars 2
3 4
Figure 187 Side wall removing
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5.2.4 Unit disassembly
Figure 188 Unit view
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Procedure:
Remove the two screws from the bottom cover as indicated in the following figure.
Figure 189 Bottom cover removing
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Remove the screws that fix the two levers and subsequently pull out them from the front plate as
indicated in the following figure.
Figure 190 Levers removal
ED 01 RL
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Extract the front panel from board as indicated in the following figure.
Extract the fibers from the adapters as indicated in the following figure.
Extract the fibers from the fiber supports as indicated in the following figure.
Extract the gasket from the front panel as indicated in the following figure.
Extract
Figure 191 Front panel, fibers and gasket removing
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Remove the screws from PCB as indicated in the following figure.
Remove the heat sink from the PCB board as indicated in the following figure.
Figure 192 Heat sink removing
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Remove the screws that fix the barket to board and pull it out from the board (refer to Figure
193).
Figure 193 Barket removing
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5.2.5 Hazardous materials and components
Table 125 lists the presence (or not) of hazardous substance/components.
N.B. The system cabling is designed for reduced halogen content. All the traffic cabling is fully
PVC free.
Table 125 List of hazardous materials and components present in the equipment
Presence
Materials/Substances In The Where
Equipment
Batteries External
NO
(Mercury/NiCad/Lithium/Other)
Batteries Internal
NO
(Mercury/NiCad/Lithium/Other)
Mercury NO
Cadmium NO
Capacitors with PCB’s
Capacitors with substances of concern +
height > 25 mm, diameter > 25 mm or NO
proportionately similar volume
Gas discharge lamps NO
Mercury containing Backlighting lamps NO
Plastic containing brominated flame
retardants other than in Printed Circuit NO
Assemblies.
Liquid Crystal Displays with a surface
NO
greater than 100 cm2
Asbestos NO
Refractory ceramic fibers NO
Protective plastic gloves must be used in
order to avoid contact between hands
Thermal conductive paste YES and thermal conductive paste.
Pay attention to avoid contact of thermal
conductive paste with eyes.
Radio-active substances NO
Beryllium Oxide NO
Refer to Figure 191.
N.B.: Copper-beryllium contact spring
Other forms of Beryllium YES must be separated from other material
and must be fused in a specific
regulated environment.
Pressure volume NO
Liquids Volume NO
Gasses Volume NO
”Hidden” mechanical springs or other
NO
equivalent parts.
Ozone depleting substances, according to
those categories that are already banned in NO
the Montreal protocol.
Chloroparaffins with chain length 10-13 C
atoms, chlorination greater than 50%
NO
contained in mechanical plastic parts
heavier than 25g.
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Lead contained in mechanical parts heavier
NO
than 25g.
Polychlorinated biphenyls (PCB) or
NO
polychlorinated terphenyls (PCT)
Polybrominated biphenyl’s and their
others (CAS no. 32534-81-9, CAS no.
32536-52-0, CAS no 1163-19-5, CAS no.
NO
13654-09-6) contained in mechanical
parts heavier than 25g, in concentrations
exceeding the natural background levels.
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5.3 Eco declaration
The 1692MSE product release 3.2A is CWDM equipment intended for the METRO ACCESS, enterprise
and METRO CORE in the small cities. It is compliant with both ETSI and NEBS (level3) standards. It is
designed for a small number of channels (8 in this version) and for very low cost application, without
amplifiers.
Key features
Refer to para. 1.4 for details.
Dimensional and Weight Characteristics

Refer to para. 2.2, 2.3 and 2.5.1 for details.
EXTENSION OF SYSTEM LIFETIME

The product is designed to ensure an outstanding quality of services through very high traffic
transmission, connection and protection performances and minimum service interruption.
The life utility is at least 5 years. This means that maintenance will be assured for at least 5 years. The
system architecture facilitates future extensibility and upgradability:
On-site configuration changes as for example the extension of the node traffic capacity without
re-cabling of interconnections.
Implementation of new features and functionalities by remote Software download.
The terms and conditions of warranty, service availability and spare parts availability are individually
agreed between Alcatel and the Customer and are part of the relevant contractual commitments.
POWER CONSUMPTION
Refer to para. 2.5 for details.
RADIO FREQUENCY EMISSION

Regarding compliance with radio frequency emission requirements refer to para. 1.9.
ACOUSTICAL NOISE
Refer to para. 1.9.2.5 for details.
MATERIALS
Refer to paragraph 5.2.5 for details.
DISASSEMBLY
Refer to paragraph 5.2 for details.
BATTERIES
The product requires no backup batteries.
PACKAGING
The packaging of this Alcatel equipment complies with the directive 94/62/EEC concerning packaging
and packaging waste. Depending on the means of transportation, the racks are packed in a
cardboard or wooden box, which can easily be recycled after use. Environmentally harmful materials
are not used for packaging. The packaging materials are marked according to ISO 11 469. If
required by the Customer and agreed by both parties, Alcatel can take care of the proper disposal of
all packaging materials.
ED 01 RL
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For details refer to” Installation Handbook”.
TAKE BACK INFORMATION

On request of customers, Alcatel can take care of the take back of depreciated equipment and of the
ecological safe and appropriate disposal under conditions to be agreed.
For that purpose Alcatel co-operates with qualified companies.
DOCUMENTATION
In order to reduce paper consumption for Customer Documentation, Alcatel delivers the Generic
Customer Documentation on a CD-ROM. The CD-ROM contains interactive HW Descriptions, SW
Descriptions, Functional Descriptions, Maintenance Manuals and User Guides. This allows the
operator to put the documentation on a server accessible by all relevant people in the organization
without any additional paper copies.
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END OF DOCUMENT
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1692mse r3 (1) .2a Technical Handbook PDF

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Technical Handbook

3AL 97869 AAAA ED.01

HANDBOOK GUIDE ........................................................................................................... 13

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Figure 1 Labels for units with stiffening bar...........................................................................36

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Table 1 Handbooks related to the product’s hardware.........................................................15

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1.1 General information

1.2 Handbook applicability

This handbook applies to the following product-release:

Product Release Version ANV P/N Factory P/N

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Table 1 Handbooks related to the product’s hardware

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Table 4 Documentation on CD-ROM

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1.5.1 List of the editions and modified parts

“N” =New part

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1.5.3 Notes on Release 1.1 ED.01

Intershelf link master and intershelf link slave management

The following contents have been modified compared to Release 1.0A3:

Configuration in Operator’s handbook

1.5.4 Notes on Release 1.2A ED.01

The application of low cost WLA (named as WLA1A)

The following contents have been modified compared to Release 1.1:

Configuration in Operator’s handbook

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The application of B-SNCP

The following contents have been modified compared to release 1.2A:

1.5.6 Notes on Release 1.4 ED.01

Abnormal conditions List (Protection, Loopback and Laser State)

The following contents have been modified compared to release 1.2A1:

About the Graphical User Interface in Operator’s handbook

1.5.7 Notes on Release 3.0 ED.01

Support SFP modules with DDM function on WLA1A(-P) and WLA2(-P).

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The following contents have been modified compared to release 1.4:

Mechanical and Unit description in Technical handbook

1.5.8 Notes on Release 3.1 ED.01

Support 10 GbE signal transmission

The following contents have been updated compared to release 3.0:

1.5.9 Notes on Release 3.2A ED.01

SDH B1 PM is supported on the line side of C-4xANY board

The following contents have been updated compared to release 3.1:

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Table 6 References and standards

[11] ITU-T Recommendation

[12] ITU-T Recommendation Characteristics of optical transport network hierarchy: equipment

[18] ITU-T Recommendation G.873-

[19] ITU-T Recommendation G.874-