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Mapúa Institute of Technology

Muralla St., Intramuros, Manila


School of Mechanical and Manufacturing Engineering

Test Machines
(semiconductor / electronics mfg.)

Garcia, Jan Philip D. Date: Jan. 20, 2018


2013104556 Research # 1
Gravity fed machines

A machine that uses gravity


to move objects within.
Normally with a tube-in to
tube-out handling are made
with a simple and fast
changeover kits for high
speed device testing, sorting
and more. It is used for
surface mount devices as
well as through-hole
technology.
Pick and Place machine

SMT (surface mount technology)


component placement systems,
commonly called pick-and-place
machines or P&Ps,
are robotic machines which are used to
place surface-mount devices (SMDs)
onto a printed circuit board(PCB). They
are used for high speed, high precision
placing of broad range of electronic
components,
like capacitors, resistors, integrated
circuits onto the PCBs which are in turn
used in computers, consumer electronics
as well as industrial, medical,
automotive, military and
telecommunications equipment.
Turret type machine

A type of machine that


has multiple tools to make
a piece faster without
using any other
equipments.
Tape and Reel

It is specifically
designed for the
process reliable and
position-accurate
delivery of adhesive
components, which are
supplied on reel tapes.
Electric components
can be removed from a
reel by the peel-off
carriage and positioned
accurately. It can be
integrated directly into
your assembly
machine.
Automated Optical Inspection

Automated Optical
Inspection (AOI) systems are
commonly used in PCB
manufacturing. The use of this
technology has been proven as highly
efficient for process improvements
and quality
achievements.[1] Automated optical
inspection (AOI) is an automated
visual inspection of printed circuit
board (PCB) (or LCD, transistor)
manufacture where a camera
autonomously scans the device under
test for both catastrophic failure (e.g.
missing component) and quality
defects (e.g. fillet size or shape or
component skew). It is commonly
used in the manufacturing process
because it is a non-contact test
method. It is implemented at many
stages through the manufacturing
process including bare board
inspection, solder paste inspection
(SPI), pre-reflow and post-reflow as
well as other stages.
References:

https://en.wikipedia.org/wiki/SMT_placement_equipment

http://pdf.directindustry.com/pdf/deprag-schulz-gmbh-u-co/tape-on-reel-
feeder/15675-244929.html

https://en.wikipedia.org/wiki/Automated_optical_inspection

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