A42022-L5958-D52-1-7630
Installation and Test Manual (ITMN) Commissioning
SURPASS hiT 7050 3.2
Trademarks:
All designations used in this document can be trademarks, the use of which by third parties for their
own purposes could violate the rights of their owners.
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This document consists of a total of 126 pages. All pages are issue 1.
Contents
1 Notes on this Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
1.1 Customer Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
1.2 Complementary Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
1.3 Symbols Used in the Customer Documentation . . . . . . . . . . . . . . . . . . . . . 12
1.3.1 Symbol for Warnings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
1.3.2 Symbols for Notes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
1.3.3 Symbols for Menu Displays and Text Inputs. . . . . . . . . . . . . . . . . . . . . . . . 12
1.4 Notes on Licensed Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
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10 Hardware Upgrade . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
11 LED Indications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
11.1 Main Board Cards (MFP1 and CC-CH cards). . . . . . . . . . . . . . . . . . . . . . . 84
11.2 Traffic Interface Cards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
11.2.1 OK and FAULT LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
11.2.2 Ethernet Connector LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
11.3 Fan Units. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
12 Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
12.1 MFP1 Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
12.1.1 TIF / Alarms Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
12.1.2 T3 / T4 Timing Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
12.1.3 Q Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
12.1.4 F Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
12.1.5 2-Wire EOW Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
12.1.6 SDI interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
12.1.7 Power Supply Input. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
12.1.8 SDI Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
12.2 P1-21 Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
12.2.1 2-Mbit/s Electrical Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
12.3 P1-42 Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
12.3.1 2-Mbit/s Electrical Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
12.4 P1P-42 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
12.4.1 2-Mbit/s Electrical Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
12.5 P3-3 and P3P-3 Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
12.5.1 34/45-Mbit/s Electrical Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
12.6 O155-2 and O622-2 Cards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
12.6.1 Optical Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
12.7 O155-4, O155P-4, O1000-4 and O1000P-4 Cards. . . . . . . . . . . . . . . . . . 104
12.7.1 Optical Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
12.8 O622C-2 and O622CP-2 Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
12.8.1 Optical Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
12.9 O2500P-1 Card. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
12.9.1 Optical Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
12.10 O2500VP-1 Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
12.10.1 Optical Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
12.11 E155-4 and E155P-4 Cards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
12.11.1 Electrical Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
12.12 E100-4 and E100-8 Cards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
12.12.1 Electrical 10/100BaseTX Fast Ethernet Interfaces . . . . . . . . . . . . . . . . . . 108
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14 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
15 Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
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Illustrations
Fig. 4.1 hiT 7050 FP subrack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Fig. 4.2 hiT 7050 FP subrack Mounting Example (hiT 70** RACK BASIC,
H=2200 MM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Fig. 4.3 hiT 7050 FP subrack and coax DDF (hiT 70** RACK BASIC,
H=2200 MM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Fig. 4.4 Configuration with 3 FP1, 1 CC with CC-ES Mounting Example
(hiT 70** RACK BASIC, H=2200 MM) . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Fig. 4.5 Configuration with 2 CC with CC-ES, Mounting Example
(hiT 70** RACK BASIC, H=2200 MM) . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Fig. 4.6 ETSI Subrack Type ( FP Subrack example ) . . . . . . . . . . . . . . . . . . . . . 33
Fig. 4.7 Fastening Angle for ETSI Racks (Top View) . . . . . . . . . . . . . . . . . . . . . 34
Fig. 4.8 hiT 70** RACK BASIC, H=2200 MM Subrack Type
(FP Subrack example ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Fig. 4.9 Fastening Angle for hiT 70** RACK BASIC, H=2200 MM Racks
(Top View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Fig. 4.10 Rack Equipment with one FP Subrack in a Rack . . . . . . . . . . . . . . . . . 37
Fig. 4.11 hiT 7050 CC and hiT 7050 CC-ES in a 19” Rack . . . . . . . . . . . . . . . . . 38
Fig. 4.12 Intra-Rack Power Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Fig. 4.13 Intra-rack Power Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Fig. 4.14 Intra-subrack Power Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Fig. 4.15 hiT 7050 FP subrack Fixed on a Wall . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Fig. 4.16 Fastening Angles for Fixing the hiT 7050 FP Subrack on a Wall. . . . . . 46
Fig. 4.17 Wall Mounting Dimensions (in mm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Fig. 5.1 Card Positions in the SURPASS hiT 7050 FP subrack . . . . . . . . . . . . . 50
Fig. 5.2 SURPASS hiT 7050, CC -Subrack . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Fig. 5.3 CC-ES unit - front view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Fig. 8.1 QST V2 Serial Line Channel Properties - General Tab . . . . . . . . . . . . . 60
Fig. 8.2 QST V2 Serial Line Channel Properties - QB3 Channel Tab . . . . . . . . 61
Fig. 8.3 QST V2 Serial Line NE Properties - General Tab . . . . . . . . . . . . . . . . . 61
Fig. 8.4 QST V2 Serial Line NE Properties - Security Tab . . . . . . . . . . . . . . . . . 62
Fig. 8.5 QST V2 Serial Line NE Properties - QST Tab . . . . . . . . . . . . . . . . . . . . 62
Fig. 8.6 OSI Stack Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Fig. 8.7 NE Properties - General Tab . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Fig. 8.8 NE Properties - Security Tab . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Fig. 8.9 NE Properties - QST Tab. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Fig. 11.1 Fault LED on the FFP1 Unit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Fig. 11.2 Fault LED on the FCC Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Fig. 12.1 Connector (and LED / Push Button) Locations on the MFP1 Card . . . . 87
Fig. 12.2 TIF / Alarms Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Fig. 12.3 Alarm Contacts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Fig. 12.4 T3 / T4 Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
Fig. 12.5 Impedance Configuration of the 2-kHz T3 Input . . . . . . . . . . . . . . . . . . 90
Fig. 12.6 Impedance Configuration of the 2-kHz T4 Output . . . . . . . . . . . . . . . . . 90
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Tables
Tab. 4.1 Rack Equipping Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Tab. 5.1 SURPASS hiT 7050, FP Subrack Equipping Options . . . . . . . . . . . . . . 50
Tab. 5.2 SURPASS hiT 7050, CC, Equipping Options . . . . . . . . . . . . . . . . . . . . 52
Tab. 5.3 SURPASS hiT 7050, CC-ES Equipping Options . . . . . . . . . . . . . . . . . . 53
Tab. 11.1 LEDs on the main board cards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Tab. 11.2 LEDs on the Traffic Interface Cards. . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Tab. 11.3 leds in the RJ45 Fast Ethernet Connectors . . . . . . . . . . . . . . . . . . . . . . 85
Tab. 11.4 Fault LED on the Fan Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Tab. 12.1 Pin Assignment of the TIF / Alarms Connector . . . . . . . . . . . . . . . . . . . 88
Tab. 12.2 Pin Assignment of the T3 / T4 Connector . . . . . . . . . . . . . . . . . . . . . . . 89
Tab. 12.3 Pin Assignment of the Q Connector. . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Tab. 12.4 Pin Assignment of the F Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Tab. 12.5 Pin Assignment of the 2-Wire EOW Connector . . . . . . . . . . . . . . . . . . . 93
Tab. 12.6 Pin Assignment of SDI interface connector . . . . . . . . . . . . . . . . . . . . . . 94
Tab. 12.7 Pin Assignment of the Power 48/60 V Connector . . . . . . . . . . . . . . . . . 95
Tab. 12.8 Pin Assignment of the 2-Mbit/s Connector. . . . . . . . . . . . . . . . . . . . . . . 97
Tab. 12.9 Pin Assignment of the Upper 2-Mbit/s Connector . . . . . . . . . . . . . . . . . 99
Tab. 12.10 Pin Assignment of the Lower 2-Mbit/s Connector . . . . . . . . . . . . . . . . . 99
Tab. 12.11 Pin Assignment of the Upper 2-Mbit/s Connector . . . . . . . . . . . . . . . . 101
Tab. 12.12 Pin Assignment of the Lower 2-Mbit/s Connector . . . . . . . . . . . . . . . . 101
Tab. 12.13 Pin Assignment of the 10/100BaseTX Fast Ethernet Connectors . . . . 109
Tab. 12.14 Pin Assignment of the 10/100Base TX Fast Ethernet Connector . . . . 111
Tab. 12.15 Pin Assignment of the 1000BaseT GB Ethernet Connector . . . . . . . . 112
Tab. 12.16 Power 48/60 Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
Tab. 12.17 Alarms and TIF Connector. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
Tab. 13.1 Rules of connections with LSC cables. . . . . . . . . . . . . . . . . . . . . . . . . 120
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Cross reference to other chapters in this manual or cross reference to other manuals.
Help Note on the online help system of the relevant application software concerned.
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If necessary, safety signs and markings Soweit notwendig, sind an den Geräten
according to IEC 1310-1 are fixed to the Sicherheitssymbole und Kennzeichnun-
devices. gen nach IEC 1310-1 angebracht.
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For this reason, before working on the Öffnen Sie deshalb, bevor Sie am
subrack, open the front door, raise it and Baugruppenträger arbeiten, dessen
then remove it. Vordertür, heben Sie sie an und nehmen
Sie sie ab.
Once the work has been completed, refit Bringen Sie nach Beendigung der Arbe-
the door belonging to this subrack and iten die zu diesem Baugruppenträger ge-
close it. hörende Vordertür wieder an und
schließen Sie sie.
When the front door is open − especially Bei geöffneter Vordertür − insbesondere
! when additional covers have been re- nach dem Öffnen von zusätzlichen Abde-
moved − components with high operating ckungen − können auch Teile mit hoher
temperatures may also become accessi- Betriebstemperatur zugänglich sein, sie-
ble, see Chapter 2.4.2! he Kapitel 2.4.2!
MAXIMUM
EQUIPMENT
WT ... KG
UNEQUIPPED
WT ... KG
The maximum weight to be lifted by one Das maximale Hebegewicht für eine Per-
person is fixed to 18 kg! son ist auf 18 kg festgelegt!
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⇒ After mounting the systems into the ⇒ Nach dem Einbau der Systeme in
rack, before attaching the connect- das Gestell sind – vor dem An-
ing cables, and before commission- schluss der Verbindungskabel und
ing, first check the grounding and vor der Inbetriebnahme – die Er-
potential balancing connections to dungs- und Potenzialausgleichs-
agree with EN50310 and ETSI EN verbindungen gemäß EN50310
300 253. und ETSI EN 300 253 zu über-
prüfen.
In both rack and wall mounted applica- Sowohl bei Gestellmontage als auch bei
! tions, the subrack protective grounding Wandmontage des Baugruppenträgers
must be assured by connecting a PE ca- muss die Schutzerdung dadurch sicher-
ble as depicted in the Cabling Plan docu- gestellt sein, dass ein Schutzerdungska-
ment. bel entsprechend dem Kabelführungsplan
angeschlossen ist.
The PE cable must be connected before Das Schutzerdungskabel muss als erste
each other cable connection, and discon- Verbindung (vor jeder anderen) ange-
nected last. schlossen und als letzte Verbindung ge-
trennt werden.
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⇒ Observe the above note especially ⇒ Beachten Sie den obigen Warnhin-
before connecting other equipment weis insbesondere, bevor Sie an-
to the user/customer interfaces! dere Geräte an die Anwender-/
Kunden-Schnittstellen an-
schließen!
You must observe without fail the pro- Beachten Sie unbedingt die Schutz-
tective grounding measures given in erdungsmaßnahmen entsprechend
Chapter 2.6! Kapitel 2.6!
The subrack interfaces for alarms and TIF Die Baugruppenträger-Schnittstellen für
! contacts are supplied by external power. Alarme und TIF-Kontakte werden extern
The maximum allowable voltage must cor- versorgt. Die maximal zulässige Span-
respond to the SELV voltage limits (≤ 60 V nung muss den SELV-Spannungsgren-
DC) respectively to the 48V/60V DC bat- zen entsprechen (≤ 60 V
tery-based supply voltage according to Gleichspannung) bzw. den Spannungs-
ETSI EN 300 132-2! grenzen der batteriegestützten 48V-/60V-
Versorgungs-Gleichspannung gemäß
ETSI EN 300 132-2!
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You must always wear a grounding brace- Jeder, der Baugruppen mit EGB- / ESD-
! let that is connected properly when pack- Symbol aus- oder einpackt, berührt, zieht
ing, unpacking, touching, pulling, or oder steckt, muss stets ein vorschrifts-
inserting modules displaying the ESD mäßig angeschlossenes Erdungsarm-
symbol. This will ensure these modules band tragen. Dadurch ist sichergestellt,
not to be damaged by electrostatic dis- dass diese Baugruppen nicht durch elek-
charges. trostatische Entladungen beschädigt wer-
den.
Every printed circuit board has a ground- Jede Leiterplatte hat einen Erdungs-
ing outer edge, which is connected to the außenrand, der mit dem Masseanschluss
ground terminal of the module. The board der Baugruppe verbunden ist. Die Leiter-
is only allowed to be touched or handled platte darf - auch bei vorschriftsmäßiger
at this grounding edge - even if you are Körpererdung- nur am Erdungsaußen-
properly grounded. rand angefasst werden.
When pulling and inserting modules, only Verwenden Sie beim Ziehen und Stecken
use the integral plug and pull aids. von Baugruppen nur die daran ange-
brachten Zieh- und Steckhilfen.
Modules which are located in a screened, Baugruppen, die sich in einem abge-
unopened housing are protected at any schirmten, ungeöffneten Gehäuse befin-
rate against electrostatic discharges. den, sind in jedem Fall vor
elektrostatischen Entladungen geschützt.
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For this reason, do not expose the con- Vermeiden Sie deshalb Stoßbeanspru-
nectors to impact. chungen der Steckverbinder.
Always fit optical fiber connectors with Schützen Sie LWL-Steckverbinder grund-
protective caps to guard them against me- sätzlich mit einer Schutzkappe vor mech-
chanical damage and contamination. The anischen Beschädigungen und
protective dust caps should only be re- Verschmutzungen. Die Staubschutz-
moved immediately prior to installation. kappe soll erst unmittelbar vor dem Ein-
bau entfernt werden.
Once the protective dust caps have been Prüfen Sie nach Entfernen der Staub-
removed, you must check the surfaces of schutzkappen die Stirnflächen der LWL-
the optical fiber connectors to ensure that Stecker auf Sauberkeit und reinigen Sie
they are clean, and clean them if neces- sie gegebenenfalls.
sary.
For cleaning, a special optical fiber clean- Zum Reinigen kann ein spezielles LWL-
ing tool or a clean, lint-free cellulose cloth Reinigungswerkzeug oder ein einwand-
or a chamois leather is suitable. Freon TF, frei sauberes, fusselfreies Zellstofftuch
isopropyl alcohol (99 %), or white spirit oder Fensterleder verwendet werden. Als
can be used as cleaning fluids. Reinigungsflüssigkeit kann Freon TF, Iso-
propylalkohol (99 %) oder Spiritus ver-
wendet werden.
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Devices and modules displaying either of Geräte und Baugruppen, die eines der fol-
the following warning labels contain laser genden Warnzeichen tragen, enthalten
devices. Laser-Einrichtungen.
When operated in a closed system, the la- Bei Betrieb im geschlossenen System
ser equipment of the device conforms to entsprechen die Laser-Einrichtungen des
class 1 safety level. Gerätes der Gefährdungsklasse 1.
Nevertheless, in view of possible malfunc- Unter Berücksichtigung von vorherseh-
tions, transmission systems which are fit- baren Fehlerfällen sind mit optischen
ted with optical fiber amplifier modules are Lichtwellenleiter-Verstärkerbaugruppen
classified as hazard class 1M. This haz- bestückte Übertragungssysteme jedoch
ard class is also applicable if the device is der Gefährdungsklasse 1M zugeordnet.
opened. Diese Gefährdungsklasse gilt auch bei
geöffnetem Gerät.
This hazard class is labelled as follows: Die Gefährdungsklasse ist folgender-
maßen beschildert:
Warning Warnschild
Label nach
according to EN
EN 60825-1:2001 /
60825-1:2001 / IEC
IEC 60825-1:2001.
60825-1:2001.
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⇒ To ensure safe operation of the en- ⇒ Für den sicheren Betrieb der ge-
tire optical path, the laser safety samten optischen Strecke muss
shutdown must be activated, see die Lasersicherheitsabschaltung
Chapter 2.10.2. aktiviert sein, siehe Kapitel 2.10.2.
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However, all optical transmitters (except Als Schutz gegen eventuelle Gefährdun-
at the Ethernet interfaces) are fitted with gen sind alle optischen Sender (außer an
automatic laser shutdown circuits to safe- den Ethernet-Schnittstellen) mit einer au-
guard against any possible hazard. This tomatischen Laserabschaltung ausges-
shutdown circuit can be configured and is tattet. Diese Abschaltung kann
active in the basic state. It trips, if no input konfiguriert werden und ist grundsätzlich
signal is received by the optical receiver, aktiv. Sie löst aus, wenn ein Eingangssig-
i.e. if there is a break in the link. This pre- nal am zugehörigen optischen Empfänger
vents any uncontrolled laser emission if a fehlt, z. B. bei unterbrochener Verbind-
fiber-optic connector is faulty or not con- ung. Dies verhindert jede unkontrollierte
nected. Laserabstrahlung, wenn der optische
Steckverbinder fehlerhaft oder nicht an-
geschlossen ist.
⇒ To ensure safe operation of the en- ⇒ Für den sicheren Betrieb der ge-
tire optical path, the laser safety samten optischen Strecke muss
shutdown must be activated. die Laser-Sicherheitsabschal-
tung aktiviert sein.
Even with this safeguard, fiber-optic ca- Auch unter Beachtung dieser Vorsichts-
! bles which are open at one end should al- maßnahmen sollen Glasfaserkabel, die
ways be considered to be “live”. an einem Ende offen sind, immer so be-
handelt werden, als würden sie ständig
Laserlicht führen.
Never look into open fiber-optic cable Nie direkt in die Enden sehen, da sonst
ends, as this may damage your eyes. die Augen geschädigt werden können!
In case of doubt always use dedicated la- Tragen Sie im Zweifelsfall stets eine
! ser-protective goggles! Schutzbrille!
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Accumulators or batteries which are inte- Ins Gerät eingebaute Akkumulatoren oder
grated in the device should only be re- Batterien sollen nur beim Gerätehersteller
placed by the equipment manufacturer. ausgetauscht werden.
⇒ If replacement is necessary, do not ⇒ Wenn ein Austausch erforderlich
remove the accumulator or the bat- ist, dann bauen Sie nicht den Akku-
tery from the device, but send in the mulator oder die Batterie aus dem
complete device / the module Gerät aus, sondern schicken Sie
(card) or the removable battery das komplette Gerät / die
pack. Baugruppe oder das herausnehm-
bare Batteriepack ein.
In order to prevent loss of data, the battery Zur Vermeidung von Datenverlust soll die
should only be replaced by the equipment Batterie nur durch den Gerätehersteller
manufacturer. ausgetauscht werden.
There is risk of explosion if the battery is Wenn die Batterie nicht ordnungsgemäß
! not replaced correctly! ausgetauscht wird, besteht Explosionsge-
fahr!
Never short circuit batteries directly with- Schließen Sie niemals Batterien direkt
! out using a discharging resistor! Without a ohne Entladewiderstand kurz! Ohne Wi-
resistor very high current will flow causing derstand können so hohe Ströme fließen,
a risk of explosion! dass Explosionsgefahr besteht.
If you depollute batteries, you must ob- Beim Entsorgen von Batterien müssen
serve the local regulations applicable to die örtlichen Vorschriften über Beseiti-
hazardous waste. gung von Sondermüll eingehalten wer-
den.
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⇒ If possible, first switch OFF the pro- ⇒ Schalten Sie möglichst zuerst die
tection power supply and then the Ersatz-Stromversorgung aus, dann
working power supply. die Betriebs-Stromversorgung.
⇒ For this reason, shut down the de- ⇒ Nehmen Sie deshalb nur dann eine
vice only if it is inevitable. Other- Notabschaltung vor, wenn es un-
wise perform the normal switch-off umgänglich ist. Verfahren Sie sonst
procedure. entsprechend der normalen Ab-
schaltprozedur.
⇒ After the emergency shut-down, ⇒ Falls dies ohne Gefahr möglich ist,
and if it is possible without danger, überprüfen Sie nach dem Notab-
check if the device is dead − either schalten, ob das Gerät spannungs-
by using a measuring device or by frei ist − entweder mit einem
the LED display of the device, if ap- Messgerät oder gegebenenfalls
plicable. durch eine LED-Anzeige am Gerät.
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⇒ Particular attention should be paid to the connector pins at the cards, to ensure
that they are not damaged or bent.
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Rack Spacing
ETSI rack installation details can be found in the Transport Systems Installation Manual
(IMN) A42020-S178-H1-*-7431.
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Fig. 4.2 hiT 7050 FP subrack Mounting Example (hiT 70** RACK BASIC,
H=2200 MM)
Six FP1 can be fixed in one rack, if the rack equipment is done without cable compart-
ments.
In this case, the patch cords of every input and output port have to be stored in the dis-
tribution frame or in one of the racks next to the SURPASS hiT 7050 system!
If we use the P1-21 75 we could install in the same rack the DDF also (one DDF for each
P1-21 drawer).
The rack equipment with FP1and coax DDF is shown in Fig. 4.3
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Fig. 4.3 hiT 7050 FP subrack and coax DDF (hiT 70** RACK BASIC,
H=2200 MM)
The rack that meets ETSI specifications and measures 600 mm x 2200 mm x 300 mm
(W x H x D) is delivered in the form of individual parts and is constructed and screwed
together on site. Several racks can be installed individually or in combination. Indepen-
dent network elements can also be fitted into a rack.
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If the rack equipment is done without cable compartments, the patch cords of every in-
i put and output port have to be stored in the distribution frame or in one of the racks next
to the SURPASS hiT 7050 system!
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Cladding panels, consisting of a front door and a rear panel in each case, can be fitted.
The door can be opened by an angle of 165˚ and removed without any special tools.
In the base area, the rack can either be adapted to the Bw7R (Style 7R) infrastructure
(225 mm) (see above), or expanded, using the provided base extension, up to 300 mm.
The SURPASS hiT 7050 subrack has a build-in fan, since forced cooling is a mandatory
! condition for operating the SURPASS hiT 7050, regardless of the ambient temperature!.
Ensure for a sufficient cooling air flow!
A sensor on the MFP1 and CC-CH cards monitors the device temperature.
Below the rack, sufficient space must be left to let air enter.
! The vertical space between the SURPASS hiT 7050 subracks must be as a minimum
100 mm to allow sufficient air flow.
Do not remove any mounted air baffle plates!
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Particular articular fastening angles are available for fixing the hiT 7050 FP subrack on
a wall, see Fig. 4.12, Fig. 4.15, Fig. 4.16.
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Fig. 4.9 Fastening Angle for hiT 70** RACK BASIC, H=2200 MM Racks
(Top View)
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Fig. 4.11 hiT 7050 CC and hiT 7050 CC-ES in a 19” Rack
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The NUBAT 1 and NUBAT2 power supply inputs of the SURPASS hiT 7050 allow re-
dundant feeding using the Power 48/60 V connector (for pin assignment, see
Chapter 12.1.7). The second supply voltage NUBAT2 is only optional, supporting the
whole hiT 7050 FP subrack in case of a NUBAT1 failure.
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The power cable from the power connector shall be laid under the subrack (as shown
schematically in Fig. 4.9) and not along the front plates.
For detailed information about Pin assignment, see Chapter 12.1.7.
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For an overview of the cards and their mounting positions in the SURPASS hiT 7050,
see Chapter 5.
For more information about the optical connector type, see Chapter 12.8.1.
You can add or remove SFP modules or traffic cards (O622-2, O155-2, E100-4, E100-
8, P1-21) during operation without interference to unaffected traffic.
Insert the SFP module carefully at the front of the cards, otherwise they can be dam-
! aged!
⇒ Particularly pay attention to the electrical connector pins of the SFP modules, to
ensure that they are not damaged or bent.
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Keep in mind that the minimum bending radius of the optical cables is 30 mm.
!
⇒ To fix the cables in the rack, mount cable holders at the rack beams, above or
below the cable outlets of the FP and CC subracks and cable compartments.
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⇒ Distribute the fiber cables in the cable ducts symmetrically, i.e. check with every
fiber cable if the left of right side of the rack is to be used.
⇒ You must place the fiber cables at the cable holder, which have been fixed at
the rack beams (see Para 4.15).
⇒ You must place the fiber cables at the cable holders, which have been fixed at
the rack beams (see Para 4.15).
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Air flow
FP Subrack
Wall
Cable
guiding
recom-
mendation
Fan
Minimum 50 mm space
for air flow
Air flow
Neighbouring
equipment
The particular fastening angles for fixing the hiT 7050 FP subrack on a wall are shown
in Fig. 4.16. The dimensions are shown in Fig. 4.17.
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Fig. 4.16 Fastening Angles for Fixing the hiT 7050 FP Subrack on a Wall
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In case of handling any hardware, you must observe the protective measures given in
Chapter 2.
SURPASS hiT 7050 subrack can be mounted in an ETSI rack or in the very similar hiT
70** RACK BASIC (see Fig. 4.1, Fig. 4.2, Fig. 4.3, Fig. 4.7).
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In case of handling any hardware, you must observe the protective measures given in
! Chapter 2.
The MFP1 and CC-CH card contains a backup battery. Activating that battery is de-
scribed in Chapter 5.5.
For connector designations and pin assignment tables, see Chapter 12.
The functions of the cards are described in the Techical Description (TED) of the SUR-
PASS hiT 7050.
If any remedial actions are necessary in case of alarms or malfunctions of the SUR-
PASS hiT 7050, see the Operator Guidelines (OGL) and the online help:
Help In the main menu, click <Help> <Contents...> or <On Window...>.
The SURPASS hiT 7050 does not provide automatic equipment protection functions
that make use of different cards, i.e. there are no dedicated “protecting” cards. Never-
theless, particular parts of the equipment are automatically protected by traffic protec-
tion functions such as MSP or SNCP.
You can add or remove traffic cards or SFP modules during operation without interfer-
ence to unaffected traffic.
Since severe hardware damage is possible without forced cooling, the fan unit should
! be inserted first when equipping the FP and CC subrack.
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During the TNMS CT Installation procedure, the system license number is requested.
For details on how to install, start and configure the necessary software components,
see the TNMS CT User Manual (UMN) mentioned in Chapter 1.2.
Starting and configuring of the installed SURPASS hiT 7050 software are described in
Operator Guidelines (OGL) and in the online help system of the SURPASS hiT 7050.
Help
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⇒ Remove the power supply connector from the power supply input at the FP and
CC subracks.
⇒ Reconnect the power supply connector to the power supply input at the SFP1
and CC subracks.
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Therefore, the SURPASS hiT 7050 monitors the system temperature and the fan per-
formance.
In case of a fan failure or high temperature condition, a corresponding equipment alarm
will be generated, and the speed of the (remaining) fans will be increased. In extreme
overtemperature conditions, the SURPASS hiT 7050 switches OFF the power supply for
all cards except fan unit and main board cards (MFP1, CC-CH and CC-TX).
The permissible environmental conditions for operating the SURPASS hiT 7050 are list-
ed in the Technical Description (TED).
If both CC-TX units are miss in the subrack, the system shall be switched OFF and, then
i switched ON with at least one CC-TX unit, for a correct behaviour.
For remedial actions in case of alarms, refer to the online help (if it is already available)
and the Operator Guidelines (OGL) for the SURPASS hiT 7050.
Help
If a fault occurs after communication has already been established between the SUR-
PASS hiT 7050 and the LCT/NCT, the SURPASS hiT 7050 TNMS CT software displays
more detailed alarm information.
During the automatic start-up procedure, the MFP1 and CC-CH card performs − among
other functions − the following start-up steps:
• Testing hardware and software;
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Details on the menu and window structures of the SURPASS hiT 7050 TNMS CT soft-
ware (application software) as well as the correct use of the left-hand and right-hand
Help mouse buttons, can be found in the Operator Guidelines (OGL) and the online help sys-
tem of the SURPASS hiT 7050.
In case of handling any hardware, you must observe the protective measures given in
! Chapter 2.
⇒ If any feature is already set properly, or is not applicable, skip that item.
⇒ With many features, you can leave the default settings as they are, at least with
this initial configuration.
⇒ Before closing any configuration window, always check all the settings in it and
make sure that they match the given network and SURPASS hiT 7050 require-
ments.
All settings which are not yet applied or not accepted by the NE are shown in blue bor-
ders.
In the following instructions, the steps are illustrated by sample screenshots.
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When using the connection via F interface, a PPP connection is required, as described
in the UMN of the TNMS CT.
TNMS CT Settings
⇒ In the DCN Management window, select Serial Line Server -> QST V2 Serial
Line Channel and click the Properties button.
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Fig. 8.2 QST V2 Serial Line Channel Properties - QB3 Channel Tab
⇒ In the DCN Management window, select Serial Line Server -> QST V2 Serial
Line Channel -> QST V2 Serial Line NE and click the Properties button.
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⇒ Open the OSI Stack Configuration window using the Start menu:
Start -> Settings -> Control Panel -> OSI Stack icon.
⇒ In the OSI Stack Configuration window, make the settings according to Fig. 8.6.
NE Connection
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⇒ In the DCN Management window, select the NE from the TNMS-CT Server en-
tries and click the Properties button.
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⇒ Read the MAC address of the main controller (MFP1) on the TQM860 module
from the card extraction aid and add it (e.g. 00D093010CD9).
⇒ At the end of the NSAP/IP address, add the NSAP selector 01.
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An individual NE name is the precondition for setting the SURPASS hiT 7050 to the
Active state (see step #3.).
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3. Activating the NE
<NE State> <Set to Active>
Changing from Idle to Active state is only possible if the NE name is not the default
name (see step #2.).
After activating the NE, it starts a reboot. This will take some minutes.
⇒ In the TNMS CT, connect again to the NE and start the Element Manager.
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Date and time are controlled by the internal clock of the operating system. The net-
work element time is configured with an offset relative to GMT.
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⇒ If requested, modify the NSAP address data in the Layer 3 (NSAP) area.
Please note in case of changing the NSAP address: The settings in the DCN Manage-
i ment window (TNMS CT) also have be changed according to the chosen values. If the
area has been modified, the OSI stack parameters have to be adapted.
The TNMS CT connection will be lost.
⇒ In the TNMS CT, connect again to the NE and start the Element Manager.
Particularly check that “warning” is selected in the Alarm Severity Threshold area,
so that all alarms will be displayed.
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Note that the above screenshot is only a sample. Each slot has a specific card list.
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⇒ In case the customer requires DCN interworking, configure the settings acord-
ing to the DCN plan.
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The card user label is intended for entering network-specific information about the
card.
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Depending on the selected card and traffic flow symbol, various supervision param-
eters related to that card can be configured.
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⇒ You can store the current configuration settings in a file by pressing the
Upload... button - also as a fall-back copy for possible future use.
Chose a filename and the directory where to store it.
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Electrical and optical parameters of the individual cardcard and of the complete system
are listed in the Technical Description (TED) of the SURPASS hiT 7050.
⇒ Perform the required measurements and tests as described in the Field Test
Protocol.
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10 Hardware Upgrade
When handling any hardware, you must observe the protective measures given in
! Chapter 2.
In Release 3.2 of the SURPASS hiT 7050, no special upgrade procedures are provided
for interface cards.
Inserting new interface cards does not effect existing traffic within the system.
Before changing the MFP1 and CC-CH cards, see Chapters 5.5 and 2.11 for notes on
how to activate and handle the backup battery.
Before replacing the MFP1, the APS version of spare part must be aligned with the run-
ning one. In case of discrepancy between MIB version (stored into the backplane flash)
and APS version (loaded in the MFP1) the NE will be continuously rebooting.
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11 LED Indications
This chapter gives an overview of the card front LEDs, which provide information for ser-
vice and maintenance purposes.
The functions of the LEDs are explained in detail in the Technical Description
(TED) of the SURPASS hiT 7050.
The LED locations on the MFP1/CC-CH cards are shown in Fig. 12.1 and Fig. 12.33.
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The LED locations on the cards are shown in Chapter 12.2 and the following.
Fan Unit
The LED locations on the fan units (for hiT 7050 FP and hiT 7050 CC) are shown in
Fig. 11.1, Fig. 11.2.
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12 Pin Assignments
Technical data are listed in the Technical Description (TED) of the SURPASS hiT 7050.
EOW
Fig. 12.1 Connector (and LED / Push Button) Locations on the MFP1 Card
MINOR_NOT
MINOR
15 14 13 12 11 10 9
Front view
8 7 6 5 4 3 2 1
MAJOR_NOT
MAJOR_REF
MINOR_REF
TIF_OUT
TIF_IN3
TIF_IN2
TIF_IN1
MAJOR
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TIF / Alarms
MAJOR_REF
5
MAJOR_NOT
MAJOR 7
MAJOR
relay contact 6
MINOR_REF
8 The relay contacts correspond to
MINOR_NOT the MAJOR and MINOR LEDs
MINOR 10 (see Tab. 11.1).
MINOR
relay contact 9
The relay contact positions are
shown without alarms.
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The impedance configuration (120 Ω balanced / 75 Ω single ended) of the timing inter-
face is shown in Fig. 12.5 and Fig. 12.6.
T41CO_A
GND
GND
T31CI_C
GND
T31DI_C
9 10 11 12 13 14 15
Front view
1 2 3 4 5 6 7 8
T41CO_B
T31CI_B
T31CI_A
T31DI_B
T31DI_A
GND
GND
T3 / T4
1 GND Ground
2 T41CO_B T4 clock output B
3 --- Not connected
4 GND Ground
5 T31CI_B T3 clock input B
6 T31CI_A T3 clock input A
7 T31DI_B T3 data input B
8 T31DI_A T3 data input A
9 T41CO_A T4 clock output A
10 GND Ground
11 --- Not connected
12 GND Ground
13 T31CI_C T3 clock input C
14 GND Ground
15 T31DI_C T3 data input C
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T3 / T4 Impedance Configuration
The impedance of the T3 / T4 timing interface depends on which interface pins are con-
nected to the cable, as shown in Fig. 12.5 and Fig. 12.6. For better understanding,
some details of the SURPASS hiT 7050 internal circuitry are added to these figures.
120 Ω 75 Ω
T31CI_A
6 6 6
GND
12 12
2048 kHz
or T31CI_C 79 Ω
13 13
T31CI_B
5 5
120 Ω 75 Ω
T41CO_A
9 9 9
GND
1 1
2048 kHz
or
T41CO_B
2 2 2
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12.1.3 Q Interface
Connector type and location: 8-pin shielded RJ45 connector on the MFP1 card
(see Fig. 12.1).
EQOUT_A
EQOUT_B
EQIN_A
EQIN_B
1 2 3 4 5 6 7 8
Front view
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12.1.4 F Interface
Connector type and location: 9-pin male Sub-D (DB-9) connector on the MFP1 card
(see Fig. 12.1).
CTS
RTS
DSR
9 8 7 6
5 4 3 2 1 Front view
GND
DTR
CD
RX
TX
1 CD Carrier detect
2 RX Receive data
3 TX Transmit data
4 DTR Data terminal ready
5 GND Ground
6 DSR Data set ready
7 RTS Ready to send
8 CTS Clear to send
9 --- Not connected
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WIRE A
WIRE B
1 2 3 4
Front view
2-Wire EOW
1
2 1 --- Not connected
3 2 WIRE_A Handset wire A
4 3 WIRE_B Handset wire B
5 4 --- Not connected
6
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SDI
1 MSDI-TX
2 MSDI-RX
3 PASDI-TX
4 PASDI-RX
5 PBSDI-TX
6 PBSDI-RX
7 GND
8 GND
PUBAT
NUBAT2
NUBAT2
NUBAT1
NUBAT1
NUBAT1
25 24 23 22 21 20 19 18 17 16 15 14
12 11 10 9 8 7 6 5 4 3 2 Front view
Pin Pin
missing missing
NUBAT2
NUBAT2
NUBAT2
NUBAT1
NUBAT1
PUBAT
PUBAT
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Power 48/60 V
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21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
B For pin
C
assignment,
see Tab. 12.8.
D
Front view
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21 20 19 18 • • • 4 3 2 1
Explanation
Row Signal
120 Ω balanced 75 Ω unbalanced
A IN IN IN IN • • • IN IN IN IN Negative input Input ground
21 20 19 18 4 3 2 1 signals
B IP IP IP IP • • • IP IP IP IP Positive input Input signals
21 20 19 18 4 3 2 1 signals
C --- --- --- --- • • • --- --- --- --- Not connected Not connected
D ON ON ON ON • • • ON ON ON ON Negative output Output ground
21 20 19 18 4 3 2 1 signals
E OP OP OP OP • • • OP OP OP OP Positive output Output signals
21 20 19 18 4 3 2 1 signals
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21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
B For pin
C
assignments,
see Tab. 12.9
D and
E Tab. 12.10.
Front view
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21 20 19 18 • • • 4 3 2 1
Channel Number
21 20 19 18 • • • 4 3 2 1
Explanation
Row Signal
120 Ω balanced 75 Ω unbalanced
A IN IN IN IN • • • IN IN IN IN Negative input Input ground
21 20 19 18 4 3 2 1 signals
B IP IP IP IP • • • IP IP IP IP Positive input Input signals
21 20 19 18 4 3 2 1 signals
C --- --- --- --- • • • --- --- --- --- Not connected Not connected
D ON ON ON ON • • • ON ON ON ON Negative output Output ground
21 20 19 18 4 3 2 1 signals
E OP OP OP OP • • • OP OP OP OP Positive output Output signals
21 20 19 18 4 3 2 1 signals
21 20 19 18 • • • 4 3 2 1
Channel Number
42 41 40 39 • • • 25 24 23 22
Explanation
Row Signal
120 Ω balanced 75 Ω unbalanced
A IN IN IN IN • • • IN IN IN IN Negative input Input ground
42 41 40 39 25 24 23 22 signals
B IP IP IP IP • • • IP IP IP IP Positive input Input signals
42 41 40 39 25 24 23 22 signals
C --- --- --- --- • • • --- --- --- --- Not connected Not connected
D ON ON ON ON • • • ON ON ON ON Negative output Output ground
42 41 40 39 25 24 23 22 signals
E OP OP OP OP • • • OP OP OP OP Positive output Output signals
42 41 40 39 25 24 23 22 signals
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12.4 P1P-42
22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
A
For pin
assignments,
B see
C Tab. 12.11
and
D
Tab. 12.12.
E
Front view
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22 21 20 19 18 ••• 4 3 2 1
Channel Number
22 21 20 19 18 ••• 4 3 2 1
Row Explanation
Signal
120 Ω balanced 75 Ω balanced
A IDC IN IN IN IN • • • IN IN IN IN Negative input Input ground
M_0 21 20 19 18 4 3 2 1 signals
B IDC IP IP IP IP • • • IP IP IP IP Positive input Input signals
M_1 21 20 19 18 4 3 2 1 signals
C GND GND GND GND GND • • • GND GND GND GND Not connected Not connected
D IDC ON ON ON ON • • • ON ON ON ON Negative output Output ground
M_2 21 20 19 18 4 3 2 1 signals
E IDC OP OP OP OP • • • OP OP OP OP Positive output Output signals
M_3 21 20 19 18 4 3 2 1 signals
22 21 20 19 18 • • • 4 3 2 1
Channel Number
43 42 41 40 39 • • • 25 24 23 22
Row Explanation
Signal
120 Ω balanced 75 Ω balanced
A IDC IN IN IN IN • • • IN IN IN IN Negative input Input ground
S_0 42 41 40 39 25 24 23 22 signals
B IDC IP IP IP IP • • • IP IP IP IP Positive input Input signals
S_1 42 41 40 39 25 24 23 22 signals
C GND GND GND GND GND • • • GND GND GND GND Not connected Not connected
D IDC ON ON ON ON • • • ON ON ON ON Negative output Output ground
S_2 42 41 40 39 25 24 23 22 signals
E IDC OP OP OP OP • • • OP OP OP OP Positive output Output signals
S_3 42 41 40 39 25 24 23 22 signals
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Fig. 12.18 Connector (and LED) Locations on the P3-3 Card and P3P-3Card
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Fig. 12.19 Connector and leds locations on the O155-2 and O622-2 cards
Fig. 12.20 Optical Line 1 / Line 2 and Input / Output Location Scheme
(Side View of the Card)
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Fig. 12.25 Connector (and LED) Locations on the E155-4 and E155P-4 Cards
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8 7 6 5 4 3 2 1 Front view
RX+
TX+
RX-
TX-
Fig. 12.28 10/100BaseTX Fast Ethernet Connector
The green and yellow LEDs in the 10/100BaseTX Fast Ethernet connector are ex-
plained in Tab. 11.3.
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Fig. 12.29 Connector and leds locations on the E100S-8 and E100SP-8 Cards
The green and yellow LEDs in the 10/100BaseTX Fast Ethernet connector are ex-
plained in Tab. 11.3.
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Front view
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The green LEDs on the Ethernet interface connector are explained in Tab. 11.3.
Fig. 12.33 Connector (and LED/Push button) location on the CC-CH card
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The green and red LEDs are the same explained in Tab. 11.2.
The green and red LEDs are the same explained in Tab. 11.2.
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12.19 CC Subrack
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UBAT1/UBAT2
Pin Name
A1 N. C.
A2 NUBATE
A3 PUBATE
TIF-COM2
P5V
12C_SDA
AC3
AC2
AC1
TIF-IN4
ML/Q
N. C.
N. C.
GND
25 24 23 22 21 20 19 18 17 16 15 14
13 12 11 10 9 8 7 6 5 4 3 2 1 Front view
MAJOR_NOT
MINOR_NOT
MAJOR_REF
MINOR_REF
TIF-COM1
AND_BAT
TIF_OUT
TIF_IN1
TIF_IN3
TIF_IN2
MAJOR
MINOR
N.C.
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TIF/Alarms
Pin Name
1 TIF_IN1
2 TIF_IN2
3 TIF_IN3
4 TIF_OUT
5 MAJOR_REF
6 MAJOR
7 MAJOR_NOT
8 MINOR_REF
9 MINOR
10 MINOR_NOT
11 N.C.
12 AND_BAT
13 TIF-COM1
14 TIF-COM2
15 GND
16 N. C.
17 N. C.
18 ML/Q
19 TIF-IN4
20 AC1
21 AC2
22 AC3
23 12C_SCL
24 12C_SDA
25 P5V
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The pin assignment of connectors 1…10 is the same of P1P-42, see Chapter 12.4.1.
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All the necessary cables (for Intra-subrack Power Distribution) are supplied with system.
The CC_ES can be added also when the main shelf CC is working with traffic. In this
! case it is strongly recommended to use only one power cable between CC and CC_ES.
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To CC-ES (COPA)
Conn. Conn. Conn. Conn. Conn. Conn. Conn. Conn. Conn. Conn.
n. 1 n. 2 n. 3 n. 4 n. 5 n. 6 n. 7 n. 8 n. 9 n. 10
from CC (P1P-42)
Slot 201 x x
Slot 202 x x
Slot 203 x x
Slot 204 x x
Slot 205 x x
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14 Abbreviations
ACO Alarm Cut Off
Bw7R Style 7R
CC Compact Core
CC-CH System Controller Card of Network Element
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HW Hardware
IEC International Electrotechnical Commission
ITMN Installation and Test Manual
LCT Local Craft Terminal
LED Light Emitting Diode
LSU1 Line switch Unit (E1 level)
LWL Lichtwellenleiter (optical fiber)
MFP1 Main Board
MSI Multi Service Integrator
MSP Multiplex Section Protection
NCT Network Craft Terminal
NUBAT Negative Power Supply Voltage
O1000-4 Traffic Interface Card 4x1000 Base SX/LX
O1000P-4 Traffic Interface Card 4x1000 Base SX/LX
O155-2 Traffic Interface Card 2x155 Mbit/s (STM-1)
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15 Index
A batteries and accumulators 23
Accumulator handling 23 ESD components 18
Air filter 15 fiber-optic cables and connectors 19
Angles for fastening the subrack in a rack 33 subrack front door 14
Hardware Impedance configuration, T3 / T4 90
High operating temperature
B
system response 57
Backup battery 53 warning label 15
Battery handling 23, 53
Bending radius of optical fibers 19
I
Impedance configuration (hardware), T3 / T4 90
C
Installation aid for the subrack 32
CE conformity declaration 25
Checking the device for intactness 26
L
Cleaning fluids for optical connectors 19
Compact Core 30 Laser class 20
Compact Core Extension Shelf 30 Laser devices 20
Configuring sequence 66 Laser safety shutdown 21
Configuring the T3 / T4 impedance (hardware) 90 Laser warning label 20
Connectors of optical fibers, handling 19 LED explanations 84
Cooling, fan 57 Lithium batteries 23
D M
Declaration of CE conformity 25 Measuring
Delivery check 26 see also Testing
Device checking for intactness 26
Dust filter 15 O
Optical connectors, handling 19
E Optical fiber
Earthing bending radius 19
see Grounding Overtemperature 57
Emergency switching OFF 24 Overvoltage on the power supply input 17
ESD components 18
ESD warning label 18 P
External devices, electrical potential 48 Planar cable shelf 32
Plug and pull aids with modules 18
F Potential (electrical) with external devices 48
Fan 57 Power supply check 56
Fan unit 49 Protection against
Fastening angles for the subrack 33 laser light 20
Faults during start-up 58 power supply input overvoltage 17
Field Test Protocol 82 Protective caps for optical connectors 19
Floor rails 32
Front door handling (at the subrack) 14 R
Rack mounting of the subrack 32
G
Grounding bracelet 18 S
Grounding the subrack 16 Safety shutdown of the laser 22
SFP modules 42
H Start-up procedure 57
Handling Subrack fastening in a rack 33
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T
T3 / T4 impedance configuration 90
Temperature of the system 57
Temperature warning label 15
Test reports 82
Tests (automatic) during start-up 57
Tests and measurements 82
W
Wall mounting of the subrack 45
Warning labels
heavy weight 14
high operating temperature 15
laser devices 20
Weight information 32
Weight of the subrack, warning label 14
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