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Commissioning

SURPASS hiT 7050 3.2

Installation and Test Manual (ITMN)

A42022-L5958-D52-1-7630
Installation and Test Manual (ITMN) Commissioning
SURPASS hiT 7050 3.2

f Important Notice on Product Safety


Elevated voltages are inevitably present at specific points in this electrical equipment. Some of the
parts may also have elevated operating temperatures. Systems with forced ventilation have rotating
items.
Non-observance of these conditions and the safety instructions can result in personal injury or in prop-
erty damage.
The system complies with the standard EN 60950 / IEC 60950. All equipment connected has to comply
with the applicable safety standards.
Mount the systems in areas with restricted access only. Only trained and qualified personnel may
install, operate, and maintain the systems.

The same text in German:


Wichtiger Hinweis zur Produktsicherheit
In elektrischen Anlagen stehen zwangsläufig bestimmte Teile der Geräte unter Spannung. Einige Teile
können auch eine hohe Betriebstemperatur aufweisen. Anlagen mit Zwangsbelüftung haben drehende
Teile.
Eine Nichtbeachtung dieser Situation und der Warnungshinweise kann zu Körperverletzungen und
Sachschäden führen.
Das System entspricht den Anforderungen der EN 60950 / IEC 60950. Angeschlossene Geräte
müssen die zutreffenden Sicherheitsbestimmungen erfüllen.
Die Anlagen dürfen nur in Betriebsstätten mit beschränktem Zutritt aufgebaut werden. Die Anlagen
dürfen nur durch geschultes und qualifiziertes Personal installiert, betrieben und gewartet werden.

Trademarks:
All designations used in this document can be trademarks, the use of which by third parties for their
own purposes could violate the rights of their owners.

Copyright (C) Siemens AG 2006.

Issued by the Communication Group


Hofmannstraße 51
D-81359 München

Technical modifications possible.


Technical specifications and features are binding only insofar as
they are specifically and expressly agreed upon in a written contract.

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SURPASS hiT 7050 3.2

This document consists of a total of 126 pages. All pages are issue 1.

Contents
1 Notes on this Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
1.1 Customer Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
1.2 Complementary Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
1.3 Symbols Used in the Customer Documentation . . . . . . . . . . . . . . . . . . . . . 12
1.3.1 Symbol for Warnings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
1.3.2 Symbols for Notes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
1.3.3 Symbols for Menu Displays and Text Inputs. . . . . . . . . . . . . . . . . . . . . . . . 12
1.4 Notes on Licensed Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

2 Protective Measures and Handling /


Schutzmaßnahmen und Handhabung . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.1 Basic Remarks / Grundsätzliche Hinweise . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.2 Mechanical Design / Mechanische Konstruktion . . . . . . . . . . . . . . . . . . . . 14
2.2.1 Front Door of the Device / Geräte-Vordertür. . . . . . . . . . . . . . . . . . . . . . . . 14
2.2.2 Card Shieldings / Schirmungen der Baugruppen . . . . . . . . . . . . . . . . . . . . 14
2.3 Weight / Gewicht. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.4 Temperature / Temperatur . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.4.1 Device Cooling / Gerätekühlung . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.4.2 Components Subject to High Operating Temperatures /
Komponenten mit hoher Betriebstemperatur . . . . . . . . . . . . . . . . . . . . . . . 15
2.5 Dust Filter / Staubfilter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
2.6 Grounding and Potential Balancing /
Erdung und Potenzialausgleich . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2.7 Protection Against Excessive Overvoltage on the
48/60-Volts Power Supply Input /
Schutz gegen Überspannungen beim
48/60-Volt-Stromversorgungseingang . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.8 Electrostatic Sensitive Components (ESD) /
Elektrostatisch gefährdete Bauteile (EGB) . . . . . . . . . . . . . . . . . . . . . . . . . 18
2.9 Fiber-optic Cables and Connectors /
Lichtwellenleiter und optische Steckverbinder . . . . . . . . . . . . . . . . . . . . . . 19
2.10 Laser Radiation / Laserstrahlung . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
2.10.1 Protection Against Extraneous Laser Light and
Protection of the Optical Modules Concerned /
Schutz gegen austretendes Laserlicht und
Schutz der betreffenden optischen Baugruppen. . . . . . . . . . . . . . . . . . . . . 20
2.10.2 Laser Safety Circuit / Lasersicherheitsabschaltung . . . . . . . . . . . . . . . . . . 22
2.11 Handling Batteries / Handhabung von Batterien. . . . . . . . . . . . . . . . . . . . . 23
2.12 Emergency Switching OFF / Notabschaltung . . . . . . . . . . . . . . . . . . . . . . . 24

3 Preconditions and Preparations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25


3.1 Declaration of CE Conformity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.2 Personnel Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.3 Required Tools and Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.4 As-delivered Condition, Checking for Intactness . . . . . . . . . . . . . . . . . . . . 26

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4 Mounting and Cabling the SURPASS hiT 7050 . . . . . . . . . . . . . . . . . . . . . . 27


4.1 Mounting SURPASS hiT 7050 FP subrack in a Rack . . . . . . . . . . . . . . . . . 27
4.2 Mounting hiT 7050 CC and hiT 7050 CC-ES Subrack in a Rack. . . . . . . . . 30
4.3 Rack Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
4.4 Subrack Positions in the Rack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
4.5 Subrack Fastening Angles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
4.5.1 Mounting of 19” rack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
4.6 Rack Grounding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
4.7 SURPASS hiT 7050 Grounding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
4.8 Rack Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
4.9 SURPASS hiT 7050 Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
4.10 Basic Cable Arrangement in the Rack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
4.11 Cabling Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
4.12 Intra-Rack Power Distribution (for FP Subrack) . . . . . . . . . . . . . . . . . . . . . . 40
4.13 Intra-rack Power Distribution for CC/CC-ES . . . . . . . . . . . . . . . . . . . . . . . . 41
4.14 Optical Cabling. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
4.14.1 SFP Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
4.15 Fiber Handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
4.16 Routing Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
4.16.1 Intra-Subrack Fiber Cabling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
4.16.2 Intra-Rack Fiber Cabling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
4.16.3 Rack External Fiber Cabling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
4.17 Fixing the hiT 7050 FP subrack on a Wall . . . . . . . . . . . . . . . . . . . . . . . . . . 45
4.17.1 Grounding of the Wall-Mounted Subrack . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
4.18 Electrical Potential of External Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
4.19 SURPASS hiT 7050 Equipping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

5 SURPASS hiT 7050 Equipping Overview . . . . . . . . . . . . . . . . . . . . . . . . . . 49


5.1 hiT 7050 FP subrack numbering of plug-in slot . . . . . . . . . . . . . . . . . . . . . . 50
5.2 SURPASS hiT 7050 CC-Subrack numbering of plug-in unit slot . . . . . . . . . 51
5.3 SURPASS hiT 7050 CC-ES numbering of plug-in unit slot . . . . . . . . . . . . . 53
5.4 Slot Covers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
5.5 Backup Battery. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53

6 Connecting and Configuring an Operating Terminal . . . . . . . . . . . . . . . . . . 54


6.1 PC Requirements for Use as an Operating Terminal. . . . . . . . . . . . . . . . . . 54
6.2 Connecting the Operating Terminal to the SURPASS
hiT 7050 FP, hiT 7050 CC and hiT 7050 CC-ES . . . . . . . . . . . . . . . . . . . . . 54
6.3 Element Manager Software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

7 Starting up the SURPASS hiT 7050. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56


7.1 Using an Operating Terminal during Start-Up . . . . . . . . . . . . . . . . . . . . . . . 56
7.2 Checking the Power Supply Voltages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
7.3 Switching ON the SURPASS hiT 7050 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
7.3.1 Forced Cooling. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
7.3.2 Automatic Start-up Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

8 Configuring the SURPASS hiT 7050 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59


8.1 Recommended Configuration Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
8.1.1 Connection to NE via TNMS CT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

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8.1.1.1 Connection to NE via F Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60


8.1.1.2 Connection to NE via Q Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
8.1.2 First Commissioning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

9 Initial Measurements and Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82


9.1 Measurements and Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
9.2 Test Reports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82

10 Hardware Upgrade . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83

11 LED Indications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
11.1 Main Board Cards (MFP1 and CC-CH cards). . . . . . . . . . . . . . . . . . . . . . . 84
11.2 Traffic Interface Cards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
11.2.1 OK and FAULT LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
11.2.2 Ethernet Connector LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
11.3 Fan Units. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85

12 Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
12.1 MFP1 Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
12.1.1 TIF / Alarms Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
12.1.2 T3 / T4 Timing Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
12.1.3 Q Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
12.1.4 F Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
12.1.5 2-Wire EOW Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
12.1.6 SDI interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
12.1.7 Power Supply Input. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
12.1.8 SDI Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
12.2 P1-21 Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
12.2.1 2-Mbit/s Electrical Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
12.3 P1-42 Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
12.3.1 2-Mbit/s Electrical Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
12.4 P1P-42 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
12.4.1 2-Mbit/s Electrical Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
12.5 P3-3 and P3P-3 Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
12.5.1 34/45-Mbit/s Electrical Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
12.6 O155-2 and O622-2 Cards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
12.6.1 Optical Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
12.7 O155-4, O155P-4, O1000-4 and O1000P-4 Cards. . . . . . . . . . . . . . . . . . 104
12.7.1 Optical Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
12.8 O622C-2 and O622CP-2 Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
12.8.1 Optical Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
12.9 O2500P-1 Card. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
12.9.1 Optical Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
12.10 O2500VP-1 Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
12.10.1 Optical Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
12.11 E155-4 and E155P-4 Cards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
12.11.1 Electrical Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
12.12 E100-4 and E100-8 Cards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
12.12.1 Electrical 10/100BaseTX Fast Ethernet Interfaces . . . . . . . . . . . . . . . . . . 108

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12.13 E100S-8 and E100SP-8 Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110


12.13.1 Electrical 10/100BaseTX Fast Ethernet Interfaces . . . . . . . . . . . . . . . . . . 110
12.14 PS300P-6 Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
12.14.1 Connector type and locations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
12.14.2 Electrical 10/100BaseTX Fast Ethernet Interfaces . . . . . . . . . . . . . . . . . . 111
12.14.3 Electrical 1000BaseT Gigabit Ethernet Interfaces . . . . . . . . . . . . . . . . . . . 112
12.15 CC-CH Card. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
12.15.1 Connector type. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
12.16 CC-TX Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
12.17 PCC Card. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
12.18 LSU1 Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
12.18.1 Connector type and location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
12.19 CC Subrack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
12.19.1 Power supply input. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
12.19.2 TIF/Alarm Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
12.19.3 Interface T3/T4 and Q connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
12.20 CC-ES Subrack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117

13 Physical connections of CC and CC-ES


Subracks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
13.1 Cabling rules for CC and CC-ES Subracks . . . . . . . . . . . . . . . . . . . . . . . . 120

14 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121

15 Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125

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Illustrations
Fig. 4.1 hiT 7050 FP subrack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Fig. 4.2 hiT 7050 FP subrack Mounting Example (hiT 70** RACK BASIC,
H=2200 MM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Fig. 4.3 hiT 7050 FP subrack and coax DDF (hiT 70** RACK BASIC,
H=2200 MM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Fig. 4.4 Configuration with 3 FP1, 1 CC with CC-ES Mounting Example
(hiT 70** RACK BASIC, H=2200 MM) . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Fig. 4.5 Configuration with 2 CC with CC-ES, Mounting Example
(hiT 70** RACK BASIC, H=2200 MM) . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Fig. 4.6 ETSI Subrack Type ( FP Subrack example ) . . . . . . . . . . . . . . . . . . . . . 33
Fig. 4.7 Fastening Angle for ETSI Racks (Top View) . . . . . . . . . . . . . . . . . . . . . 34
Fig. 4.8 hiT 70** RACK BASIC, H=2200 MM Subrack Type
(FP Subrack example ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Fig. 4.9 Fastening Angle for hiT 70** RACK BASIC, H=2200 MM Racks
(Top View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Fig. 4.10 Rack Equipment with one FP Subrack in a Rack . . . . . . . . . . . . . . . . . 37
Fig. 4.11 hiT 7050 CC and hiT 7050 CC-ES in a 19” Rack . . . . . . . . . . . . . . . . . 38
Fig. 4.12 Intra-Rack Power Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Fig. 4.13 Intra-rack Power Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Fig. 4.14 Intra-subrack Power Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Fig. 4.15 hiT 7050 FP subrack Fixed on a Wall . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Fig. 4.16 Fastening Angles for Fixing the hiT 7050 FP Subrack on a Wall. . . . . . 46
Fig. 4.17 Wall Mounting Dimensions (in mm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Fig. 5.1 Card Positions in the SURPASS hiT 7050 FP subrack . . . . . . . . . . . . . 50
Fig. 5.2 SURPASS hiT 7050, CC -Subrack . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Fig. 5.3 CC-ES unit - front view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Fig. 8.1 QST V2 Serial Line Channel Properties - General Tab . . . . . . . . . . . . . 60
Fig. 8.2 QST V2 Serial Line Channel Properties - QB3 Channel Tab . . . . . . . . 61
Fig. 8.3 QST V2 Serial Line NE Properties - General Tab . . . . . . . . . . . . . . . . . 61
Fig. 8.4 QST V2 Serial Line NE Properties - Security Tab . . . . . . . . . . . . . . . . . 62
Fig. 8.5 QST V2 Serial Line NE Properties - QST Tab . . . . . . . . . . . . . . . . . . . . 62
Fig. 8.6 OSI Stack Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Fig. 8.7 NE Properties - General Tab . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Fig. 8.8 NE Properties - Security Tab . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Fig. 8.9 NE Properties - QST Tab. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Fig. 11.1 Fault LED on the FFP1 Unit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Fig. 11.2 Fault LED on the FCC Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Fig. 12.1 Connector (and LED / Push Button) Locations on the MFP1 Card . . . . 87
Fig. 12.2 TIF / Alarms Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Fig. 12.3 Alarm Contacts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Fig. 12.4 T3 / T4 Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
Fig. 12.5 Impedance Configuration of the 2-kHz T3 Input . . . . . . . . . . . . . . . . . . 90
Fig. 12.6 Impedance Configuration of the 2-kHz T4 Output . . . . . . . . . . . . . . . . . 90

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SURPASS hiT 7050 3.2

Fig. 12.7 Q Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91


Fig. 12.8 F Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Fig. 12.9 2-Wire EOW-HS Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
Fig. 12.10 SDI connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
Fig. 12.11 Power 48/60 V Connector. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
Fig. 12.12 Connector (and LED) Locations on the P1-21 Card . . . . . . . . . . . . . . . . 96
Fig. 12.13 2-Mbit/s Connector on the P1-21 Card . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Fig. 12.14 Connector (and LED) Locations on the P1-42 Card . . . . . . . . . . . . . . . . 98
Fig. 12.15 2-Mbit/s Connectors on the P1-42 Card . . . . . . . . . . . . . . . . . . . . . . . . . 98
Fig. 12.16 Connector (and LED) Locations on the P1P-42 Card. . . . . . . . . . . . . . 100
Fig. 12.17 2-Mbit/s Connectors on the P1P-42 Card . . . . . . . . . . . . . . . . . . . . . . . 100
Fig. 12.18 Connector (and LED) Locations on the P3-3 Card and P3P-3Card . . . 102
Fig. 12.19 Connector and leds locations on the O155-2 and O622-2 cards . . . . . 103
Fig. 12.20 Optical Line 1 / Line 2 and Input / Output Location Scheme
(Side View of the Card). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
Fig. 12.21 Connector (and LED) Locations on the O155-4, O155P-4,
O1000-4 and O1000P-4 Cards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
Fig. 12.22 Connector (and LED) Locations on the O622C-2 and
O622CP-2 Cards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
Fig. 12.23 Connector and LEDs on the O2500P-1 card . . . . . . . . . . . . . . . . . . . . 105
Fig. 12.24 O2500VP-1 - front view. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
Fig. 12.25 Connector (and LED) Locations on the E155-4 and E155P-4 Cards . . 107
Fig. 12.26 Connector and leds locations on the E100-4 Card . . . . . . . . . . . . . . . . 108
Fig. 12.27 Connector and led locations on the E100-8 Card . . . . . . . . . . . . . . . . . 108
Fig. 12.28 10/100BaseTX Fast Ethernet Connector . . . . . . . . . . . . . . . . . . . . . . . 109
Fig. 12.29 Connector and leds locations on the E100S-8 and E100SP-8 Cards. . 110
Fig. 12.30 Connecotors and leds location on the PS300P-6 Card . . . . . . . . . . . . 110
Fig. 12.31 10/100Base TX Fast Ethernet Connector . . . . . . . . . . . . . . . . . . . . . . . 111
Fig. 12.32 1000Base T Gb Ethernet Connector. . . . . . . . . . . . . . . . . . . . . . . . . . . 112
Fig. 12.33 Connector (and LED/Push button) location on the CC-CH card . . . . . . 112
Fig. 12.34 CC-TX front view. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
Fig. 12.35 CC front view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
Fig. 12.36 LSU1 front view. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
Fig. 12.37 CC-Subrack front view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
Fig. 12.38 Power 48/60 Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
Fig. 12.39 TIF/Alarm Connector. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
Fig. 12.40 CC-ES Subrack front view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
Fig. 13.1 Connections Example, CC Subrack with CC-ES Subrack . . . . . . . . . . 119

8 A42022-L5958-D52-1-7630
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SURPASS hiT 7050 3.2

Tables
Tab. 4.1 Rack Equipping Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Tab. 5.1 SURPASS hiT 7050, FP Subrack Equipping Options . . . . . . . . . . . . . . 50
Tab. 5.2 SURPASS hiT 7050, CC, Equipping Options . . . . . . . . . . . . . . . . . . . . 52
Tab. 5.3 SURPASS hiT 7050, CC-ES Equipping Options . . . . . . . . . . . . . . . . . . 53
Tab. 11.1 LEDs on the main board cards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Tab. 11.2 LEDs on the Traffic Interface Cards. . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Tab. 11.3 leds in the RJ45 Fast Ethernet Connectors . . . . . . . . . . . . . . . . . . . . . . 85
Tab. 11.4 Fault LED on the Fan Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Tab. 12.1 Pin Assignment of the TIF / Alarms Connector . . . . . . . . . . . . . . . . . . . 88
Tab. 12.2 Pin Assignment of the T3 / T4 Connector . . . . . . . . . . . . . . . . . . . . . . . 89
Tab. 12.3 Pin Assignment of the Q Connector. . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Tab. 12.4 Pin Assignment of the F Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Tab. 12.5 Pin Assignment of the 2-Wire EOW Connector . . . . . . . . . . . . . . . . . . . 93
Tab. 12.6 Pin Assignment of SDI interface connector . . . . . . . . . . . . . . . . . . . . . . 94
Tab. 12.7 Pin Assignment of the Power 48/60 V Connector . . . . . . . . . . . . . . . . . 95
Tab. 12.8 Pin Assignment of the 2-Mbit/s Connector. . . . . . . . . . . . . . . . . . . . . . . 97
Tab. 12.9 Pin Assignment of the Upper 2-Mbit/s Connector . . . . . . . . . . . . . . . . . 99
Tab. 12.10 Pin Assignment of the Lower 2-Mbit/s Connector . . . . . . . . . . . . . . . . . 99
Tab. 12.11 Pin Assignment of the Upper 2-Mbit/s Connector . . . . . . . . . . . . . . . . 101
Tab. 12.12 Pin Assignment of the Lower 2-Mbit/s Connector . . . . . . . . . . . . . . . . 101
Tab. 12.13 Pin Assignment of the 10/100BaseTX Fast Ethernet Connectors . . . . 109
Tab. 12.14 Pin Assignment of the 10/100Base TX Fast Ethernet Connector . . . . 111
Tab. 12.15 Pin Assignment of the 1000BaseT GB Ethernet Connector . . . . . . . . 112
Tab. 12.16 Power 48/60 Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
Tab. 12.17 Alarms and TIF Connector. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116
Tab. 13.1 Rules of connections with LSC cables. . . . . . . . . . . . . . . . . . . . . . . . . 120

A42022-L5958-D52-1-7630 9
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10 A42022-L5958-D52-1-7630
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SURPASS hiT 7050 3.2

1 Notes on this Documentation

1.1 Customer Documentation


The Customer Documentation of the SURPASS hiT 7050 comprises the following de-
scriptions and manuals:

• Technical Description (TED)


The Technical Description TED gives an overview of the application, performance
features, interfaces and functions of the SURPASS hiT 7050. It also contains the
most important technical data.
The Technical Description does not contain any instructions to be carried out.
i
• Installation and Test Manual (ITMN)
The Installation and Test Manual ITMN contains instructions on mounting, connect-
ing and commissioning the SURPASS hiT 7050, and connecting and commissioning
the LCT and NCT operating terminals.
Any work using the Installation and Test Manual ITMN presumes knowledge of the
Operator Guidelines OGL.

• Operator Guidelines (OGL)


The Operator Guidelines provide information on how to operate, monitor and main-
tain the SURPASS hiT 7050 using the Element Manager software (Application Soft-
ware) running on the LCT or NCT operating terminal.
Besides the OGL, the Online Help of the SURPASS hiT 7050 software is of high impor-
i tance for the operator.
In addition to GUI window descriptions and task instructions, the Operator Guidelines
describe remedial actions to be followed in the case of alarms.

• Graphical User Interface Manual (GUIMN)


The contents of the Graphical User Interface Manual are identical to the complete
online help, but converted to a printable PDF file. In addition, every GUI-related help
window is supplemented by a sample screenshot.

1.2 Complementary Documents


In addition to the SURPASS hiT 7050 customer documentation listed in Chapter 1.1,
there is further documentation:

• SURPASS hiT 7050 Release Note


This document identifies the specific version of the SURPASS hiT 7050 and pro-
vides information on HW, SW, LCT/NCT components and the limitations of the re-
lease as well as important notes concerning the customer documentation.

• TNMS CT User Manual


This manual provides information about the TNMS CT software, integrating descrip-
tion, installation, operation and a graphical user interface explanation.

A42022-L5958-D52-1-7630 11
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SURPASS hiT 7050 3.2

• SURPASS hiT 7050 Cabling Plan


This document provides detailed information about the external interfaces and the
external cabling of the SURPASS hiT 7050 subrack. The Cabling Plan is supplied
with the separate Complementary Documentation of the SURPASS hiT7050 (CD-
ROM ordering number S42022-D5006-R1).

1.3 Symbols Used in the Customer Documentation

1.3.1 Symbol for Warnings


This symbol identifies notes which, if ignored, can result in personal injury or in perma-
! nent damage to the equipment.

1.3.2 Symbols for Notes


This symbol identifies notes providing information which extends beyond the immediate
i context.

⇒ Denotes a point in the text which contains specific handling instructions.

Cross reference to other chapters in this manual or cross reference to other manuals.

Help Note on the online help system of the relevant application software concerned.

1.3.3 Symbols for Menu Displays and Text Inputs


Menu options from pop-up menus or inputs to be made by the user (texts, commands)
are displayed consecutively in their hierarchical sequence in pointed brackets:
<Menu> <Menu item> <Command text> <Parameter> etc.

1.4 Notes on Licensed Software


This documentation refers to software products which were taken over from other com-
panies as licenses.
Should problems arise, you should contact Siemens AG as the licensee and not the rel-
evant licenser.

12 A42022-L5958-D52-1-7630
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SURPASS hiT 7050 3.2

2 Protective Measures and Handling /


Schutzmaßnahmen und Handhabung

2.1 Basic Remarks / Grundsätzliche Hinweise


If the following rules are not observed, Bei Nichtbeachtung der nachfolgenden
! and if equipment damages or person- Vorschriften und daraus resultieren-
nel injuries are the result, the manufac- den Personen- oder Sachschäden wird
turer assumes no liability, and the keine Haftung seitens des Herstellers
warranty will expire! übernommen, und die Gewährleistung
erlischt!
If you replace any parts of devices or ca- Falls Sie an den Geräten oder an der Ver-
! bles, you must only use original spare kabelung irgendwelche Teile ersetzen,
parts or parts which are explicitly licensed dann dürfen Sie nur Original-Ersatzteile
by the manufacturer. oder solche Teile verwenden, die vom
Hersteller ausdrücklich zugelassen sind.
Changes or modifications not expressly Änderungen oder Modifikationen, die vom
! approved by the manufacturer could void Hersteller nicht ausdrücklich zugelassen
the user’s authority to operate the equip- wurden, können zum Erlöschen der allge-
ment. meinen Betriebsgenehmigung für das
Gerät führen.

If necessary, safety signs and markings Soweit notwendig, sind an den Geräten
according to IEC 1310-1 are fixed to the Sicherheitssymbole und Kennzeichnun-
devices. gen nach IEC 1310-1 angebracht.

Important Note: Wichtiger Hinweis:


i If no date is specified, the norms men- Wenn kein Datum angegeben ist, bezie-
tioned in the following (EN, IEC, UL, etc.) hen sich die Normen (EN, IEC, UL usw.),
refer to the latest issue of the respective die im folgenden erwähnt werden, auf die
norm in each case. jeweils neueste Ausgabe der entsprech-
enden Norm.

Additional (more specific) safety re- Zusätzliche (speziellere) Sicherheits-


marks may also be included in the fol- hinweise können auch in den nachfol-
lowing main chapters of this manual. genden Hauptkapiteln dieses
Handbuches enthalten sein.

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SURPASS hiT 7050 3.2

2.2 Mechanical Design / Mechanische Konstruktion

2.2.1 Front Door of the Device / Geräte-Vordertür


A subrack being fitted with a front door Baugruppenträger, die eine Vordertür ha-
! must only be operated with this door ben, dürfen nur betrieben werden, wenn
closed. There is danger of personal injury, diese Tür geschlossen ist. Bei geöffneter
if the door of the subrack is open. Vordertür des Baugruppenträgers besteht
Verletzungsgefahr.

For this reason, before working on the Öffnen Sie deshalb, bevor Sie am
subrack, open the front door, raise it and Baugruppenträger arbeiten, dessen
then remove it. Vordertür, heben Sie sie an und nehmen
Sie sie ab.

Once the work has been completed, refit Bringen Sie nach Beendigung der Arbe-
the door belonging to this subrack and iten die zu diesem Baugruppenträger ge-
close it. hörende Vordertür wieder an und
schließen Sie sie.
When the front door is open − especially Bei geöffneter Vordertür − insbesondere
! when additional covers have been re- nach dem Öffnen von zusätzlichen Abde-
moved − components with high operating ckungen − können auch Teile mit hoher
temperatures may also become accessi- Betriebstemperatur zugänglich sein, sie-
ble, see Chapter 2.4.2! he Kapitel 2.4.2!

2.2.2 Card Shieldings / Schirmungen der Baugruppen


Do not touch the contact springs of the Berühren Sie die Kontaktfedern der
card shieldings with the fingers or with the Baugruppen-Schirmungen nicht mit den
hand. Fingern oder mit der Hand.

2.3 Weight / Gewicht

Warning Labels Warnschilder


at the subrack in case of heavy am Baugruppenträger bei hohem
weight. Gewicht.

MAXIMUM
EQUIPMENT
WT ... KG

UNEQUIPPED

WT ... KG

The maximum weight to be lifted by one Das maximale Hebegewicht für eine Per-
person is fixed to 18 kg! son ist auf 18 kg festgelegt!

14 A42022-L5958-D52-1-7630
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SURPASS hiT 7050 3.2

2.4 Temperature / Temperatur

2.4.1 Device Cooling / Gerätekühlung


The built-in ventilation installations must Vorhandene Lüftungseinrichtungen dür-
! not be modified, and there must be suffi- fen nicht verändert werden, und die aus-
cient air flow! reichende Luftzirkulation darf nicht
behindert sein.

Attention! Air condition devices have Achtung! Lüfterbaugruppen haben ro-


! rotating items! tierende Teile!

2.4.2 Components Subject to High Operating Temperatures /


Komponenten mit hoher Betriebstemperatur
Warning Label Warnschild
! for equipment components (e. g. für Geräteteile (z. B. Kühlkörper),
heat sinks) which may attain high die hohe Betriebstemperaturen
operating temperatures. erreichen können.

Touching these components is lia- Beim Berühren solcher Teile be-


ble to result in personal injury! steht Verletzungsgefahr!

2.5 Dust Filter / Staubfilter


Each fan unit can be equipped with a dust Jede Lüftereinheit kann mit einem Staub-
filter that cleans the cooling air from dust filter ausgestattet werden, welches die
particles. Kühlluft von Staubpartikeln reinigt.

Provided that the environmental condi- Vorausgesetzt, dass die Umweltbedin-


! tions (defined in ETS 300 019 class 3.1E) gungen (entsprechend ETS 300 019
are fulfilled, replace the dust filter every class 3.1E) erfüllt sind, ist das Staubfilter
three months. alle drei Monate auszuwechseln.
In addition, pay attention to possible notes Außerdem sind gegebenenfalls die Hin-
from the filter manufacturer. weise des Filterherstellers zu beachten.

A42022-L5958-D52-1-7630 15
Installation and Test Manual (ITMN) Commissioning
SURPASS hiT 7050 3.2

2.6 Grounding and Potential Balancing /


Erdung und Potenzialausgleich
Especially when running a combination of Insbesondere bei gemeinsamer Verwen-
! different communications equipment, it is dung verschiedener Kommunikations-
important to establish correct grounding geräte ist es wichtig − abhängig von den
and potential balancing between them − örtlichen Erdungsmaßnahmen − auf kor-
depending on the local grounding mea- rekten Erdungs- und Potenzialausgleich
sures. zu achten.

⇒ After mounting the systems into the ⇒ Nach dem Einbau der Systeme in
rack, before attaching the connect- das Gestell sind – vor dem An-
ing cables, and before commission- schluss der Verbindungskabel und
ing, first check the grounding and vor der Inbetriebnahme – die Er-
potential balancing connections to dungs- und Potenzialausgleichs-
agree with EN50310 and ETSI EN verbindungen gemäß EN50310
300 253. und ETSI EN 300 253 zu über-
prüfen.

⇒ The grounding must be effective as ⇒ Die Erdung muss bestehen blei-


long as external cables are con- ben, solange Kabel von außen an
nected to the equipment. die Geräte angeschlossen sind.

If a subrack is not installed in a system Wenn die Baugruppenträger bzw. Ein-


rack you must ensure that it is properly sätze nicht in einem Systemgestell mon-
grounded in some other way (according to tiert werden, müssen Sie auf andere
ETSI EN 300 253). Weise für geeignete Erdung sorgen
(gemäß ETSI EN 300 253).
Grounding or potential balancing points Erdungs- oder Potenzialausgleichspunkte
i are normally labeled with one of the signs sind normalerweise mit einem der nach-
shown below. folgend dargestellten Zeichen gekennze-
ichnet.

Protective ground (PE) Schutzerde (PE)

Ground (E) Erde (E)

In both rack and wall mounted applica- Sowohl bei Gestellmontage als auch bei
! tions, the subrack protective grounding Wandmontage des Baugruppenträgers
must be assured by connecting a PE ca- muss die Schutzerdung dadurch sicher-
ble as depicted in the Cabling Plan docu- gestellt sein, dass ein Schutzerdungska-
ment. bel entsprechend dem Kabelführungsplan
angeschlossen ist.
The PE cable must be connected before Das Schutzerdungskabel muss als erste
each other cable connection, and discon- Verbindung (vor jeder anderen) ange-
nected last. schlossen und als letzte Verbindung ge-
trennt werden.

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2.7 Protection Against Excessive Overvoltage on the


48/60-Volts Power Supply Input /
Schutz gegen Überspannungen beim
48/60-Volt-Stromversorgungseingang
A protection against excessive voltage is Ein Schutz gegen Überspannung auf der
built in on the 48/60-Volts power supply Stromversorgungs-Eingangsseite
input. 48/60 V ist eingebaut.
The equipment must only be operated at a Das Gerät darf nur an einer batteriege-
! 48V/60V DC battery-based supply volt- stützten, mit positivem Pol geerdeten
age, grounded at its positive pole and cor- 48V-/60V-Versorgungs-Gleichspannung
responding to ETSI EN 300 132-2 and entsprechend ETSI EN 300 132-2 und
EN60950! EN60950 betrieben werden!

⇒ Observe the above note especially ⇒ Beachten Sie den obigen Warnhin-
before connecting other equipment weis insbesondere, bevor Sie an-
to the user/customer interfaces! dere Geräte an die Anwender-/
Kunden-Schnittstellen an-
schließen!
You must observe without fail the pro- Beachten Sie unbedingt die Schutz-
tective grounding measures given in erdungsmaßnahmen entsprechend
Chapter 2.6! Kapitel 2.6!

The subrack interfaces for alarms and TIF Die Baugruppenträger-Schnittstellen für
! contacts are supplied by external power. Alarme und TIF-Kontakte werden extern
The maximum allowable voltage must cor- versorgt. Die maximal zulässige Span-
respond to the SELV voltage limits (≤ 60 V nung muss den SELV-Spannungsgren-
DC) respectively to the 48V/60V DC bat- zen entsprechen (≤ 60 V
tery-based supply voltage according to Gleichspannung) bzw. den Spannungs-
ETSI EN 300 132-2! grenzen der batteriegestützten 48V-/60V-
Versorgungs-Gleichspannung gemäß
ETSI EN 300 132-2!

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2.8 Electrostatic Sensitive Components (ESD) /


Elektrostatisch gefährdete Bauteile (EGB)
ESD Symbol EGB/ESD-Symbol
Modules displaying this label are Baugruppen, die dieses Zeichen
fitted with electrostatically-sensi- tragen, sind mit elektrostatisch
tive components, i.e. they must be gefährdeten Bauteilen bestückt,
handled in accordance with the d. h. beim Umgang damit müssen
necessary safety measures. die erforderlichen Sicherheits-
maßnahmen eingehalten werden.

You must always wear a grounding brace- Jeder, der Baugruppen mit EGB- / ESD-
! let that is connected properly when pack- Symbol aus- oder einpackt, berührt, zieht
ing, unpacking, touching, pulling, or oder steckt, muss stets ein vorschrifts-
inserting modules displaying the ESD mäßig angeschlossenes Erdungsarm-
symbol. This will ensure these modules band tragen. Dadurch ist sichergestellt,
not to be damaged by electrostatic dis- dass diese Baugruppen nicht durch elek-
charges. trostatische Entladungen beschädigt wer-
den.

Every printed circuit board has a ground- Jede Leiterplatte hat einen Erdungs-
ing outer edge, which is connected to the außenrand, der mit dem Masseanschluss
ground terminal of the module. The board der Baugruppe verbunden ist. Die Leiter-
is only allowed to be touched or handled platte darf - auch bei vorschriftsmäßiger
at this grounding edge - even if you are Körpererdung- nur am Erdungsaußen-
properly grounded. rand angefasst werden.

When pulling and inserting modules, only Verwenden Sie beim Ziehen und Stecken
use the integral plug and pull aids. von Baugruppen nur die daran ange-
brachten Zieh- und Steckhilfen.

Modules which are located in a screened, Baugruppen, die sich in einem abge-
unopened housing are protected at any schirmten, ungeöffneten Gehäuse befin-
rate against electrostatic discharges. den, sind in jedem Fall vor
elektrostatischen Entladungen geschützt.

The European Standards EN 61340- Die Europa-Normen EN 61340-5-1


5-1 and -2 contain additional instruc- und -2 geben zusätzliche Anleitungen
tions on how to handle electrostatical- zum sachgemäßen Umgang mit
ly-sensitive devices properly. elektrostatisch gefährdeten Bauele-
menten.

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2.9 Fiber-optic Cables and Connectors /


Lichtwellenleiter und optische Steckverbinder
For laser safety remarks, see Chapter Laser-Sicherheitshinweise siehe
2.10. Kapitel 2.10.

Optical connectors are precision-made Optische Steckverbindungen sind


components and must be handled ac- Präzisionsteile und müssen dem-
cordingly. To ensure faultless func- entsprechend behandelt werden. Eine
tioning, the following points must be einwandfreie Funktion ist nur dann
observed. sichergestellt, wenn nachfolgende
Punkte berücksichtigt werden.
The minimum bending radius for optical fi- Für LWL-Leitungen darf ein Biegeradius
! bers is 30 mm! von 30 mm nicht unterschritten werden!

Mechanical damage to the surfaces of op- Mechanische Beschädigungen der Stirn-


tical connectors impairs transmission flächen von optischen Steckverbindungen
quality by higher attenuation. erhöhen die Dämpfung und mindern des-
halb die Übertragungsqualität.

For this reason, do not expose the con- Vermeiden Sie deshalb Stoßbeanspru-
nectors to impact. chungen der Steckverbinder.

Always fit optical fiber connectors with Schützen Sie LWL-Steckverbinder grund-
protective caps to guard them against me- sätzlich mit einer Schutzkappe vor mech-
chanical damage and contamination. The anischen Beschädigungen und
protective dust caps should only be re- Verschmutzungen. Die Staubschutz-
moved immediately prior to installation. kappe soll erst unmittelbar vor dem Ein-
bau entfernt werden.

Once the protective dust caps have been Prüfen Sie nach Entfernen der Staub-
removed, you must check the surfaces of schutzkappen die Stirnflächen der LWL-
the optical fiber connectors to ensure that Stecker auf Sauberkeit und reinigen Sie
they are clean, and clean them if neces- sie gegebenenfalls.
sary.
For cleaning, a special optical fiber clean- Zum Reinigen kann ein spezielles LWL-
ing tool or a clean, lint-free cellulose cloth Reinigungswerkzeug oder ein einwand-
or a chamois leather is suitable. Freon TF, frei sauberes, fusselfreies Zellstofftuch
isopropyl alcohol (99 %), or white spirit oder Fensterleder verwendet werden. Als
can be used as cleaning fluids. Reinigungsflüssigkeit kann Freon TF, Iso-
propylalkohol (99 %) oder Spiritus ver-
wendet werden.

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2.10 Laser Radiation / Laserstrahlung

2.10.1 Protection Against Extraneous Laser Light and


Protection of the Optical Modules Concerned /
Schutz gegen austretendes Laserlicht und
Schutz der betreffenden optischen Baugruppen
Depending on the device type, the la- Je nach Gerätetyp kann die Laserstrah-
! ser radiation may also be invisible for lung für das menschliche Auge auch
the human eye! unsichtbar sein!

Devices and modules displaying either of Geräte und Baugruppen, die eines der fol-
the following warning labels contain laser genden Warnzeichen tragen, enthalten
devices. Laser-Einrichtungen.

Warning Label Warnschild


according to nach
EN 60825 / IEC 60825. EN 60825 / IEC 60825.

Warning Label Warnschild


for laser equipment für Laser-Einrichtungen
as per EN 60825-1 / LASER CLASS 1 entsprechend EN 60825-1 /
IEC 60825-1. IEC 60825-1.

When operated in a closed system, the la- Bei Betrieb im geschlossenen System
ser equipment of the device conforms to entsprechen die Laser-Einrichtungen des
class 1 safety level. Gerätes der Gefährdungsklasse 1.
Nevertheless, in view of possible malfunc- Unter Berücksichtigung von vorherseh-
tions, transmission systems which are fit- baren Fehlerfällen sind mit optischen
ted with optical fiber amplifier modules are Lichtwellenleiter-Verstärkerbaugruppen
classified as hazard class 1M. This haz- bestückte Übertragungssysteme jedoch
ard class is also applicable if the device is der Gefährdungsklasse 1M zugeordnet.
opened. Diese Gefährdungsklasse gilt auch bei
geöffnetem Gerät.
This hazard class is labelled as follows: Die Gefährdungsklasse ist folgender-
maßen beschildert:

Warning Warnschild
Label nach
according to EN
EN 60825-1:2001 /
60825-1:2001 / IEC
IEC 60825-1:2001.
60825-1:2001.

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⇒ To ensure safe operation of the en- ⇒ Für den sicheren Betrieb der ge-
tire optical path, the laser safety samten optischen Strecke muss
shutdown must be activated, see die Lasersicherheitsabschaltung
Chapter 2.10.2. aktiviert sein, siehe Kapitel 2.10.2.

⇒ Commissioning should be per- ⇒ Die Inbetriebnahme soll abge-


formed with fuse protection in the sichert im geschlossenen System
closed system. erfolgen.
To avoid damage to health, you must Zur Vermeidung gesundheitlicher
observe the regulations regarding pro- Schäden müssen Sie die Vorschriften
tection against radiation from laser de- zur Strahlungssicherheit von Lasere-
vices (EN 60825 / IEC 60825). inrichtungen (EN 60825 / IEC 60825)
beachten.

If it cannot be avoided − in an exceptional Falls die Gefährdungsklasse 1M im Aus-


! case − to apply the hazard class 1M regu- nahmefall nicht vermieden werden kann
lations (see above), you always must use (siehe oben), müssen Sie stets eine La-
dedicated laser-protective goggles. ser-Schutzbrille tragen.

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2.10.2 Laser Safety Circuit / Lasersicherheitsabschaltung


Under normal operating conditions, the Unter normalen Betriebsbedingungen
maximum transmit levels of the optical in- bleiben die maximalen Übertragungspe-
terface units stay below the limit values gel der optischen Anschlussbaugruppen
defined in EN 60825 / IEC 60825, Laser unterhalb der Grenzen, die nach EN
Class 1. 60825 / IEC 60825, Laser-Klasse 1, er-
laubt sind.

However, all optical transmitters (except Als Schutz gegen eventuelle Gefährdun-
at the Ethernet interfaces) are fitted with gen sind alle optischen Sender (außer an
automatic laser shutdown circuits to safe- den Ethernet-Schnittstellen) mit einer au-
guard against any possible hazard. This tomatischen Laserabschaltung ausges-
shutdown circuit can be configured and is tattet. Diese Abschaltung kann
active in the basic state. It trips, if no input konfiguriert werden und ist grundsätzlich
signal is received by the optical receiver, aktiv. Sie löst aus, wenn ein Eingangssig-
i.e. if there is a break in the link. This pre- nal am zugehörigen optischen Empfänger
vents any uncontrolled laser emission if a fehlt, z. B. bei unterbrochener Verbind-
fiber-optic connector is faulty or not con- ung. Dies verhindert jede unkontrollierte
nected. Laserabstrahlung, wenn der optische
Steckverbinder fehlerhaft oder nicht an-
geschlossen ist.

⇒ To ensure safe operation of the en- ⇒ Für den sicheren Betrieb der ge-
tire optical path, the laser safety samten optischen Strecke muss
shutdown must be activated. die Laser-Sicherheitsabschal-
tung aktiviert sein.
Even with this safeguard, fiber-optic ca- Auch unter Beachtung dieser Vorsichts-
! bles which are open at one end should al- maßnahmen sollen Glasfaserkabel, die
ways be considered to be “live”. an einem Ende offen sind, immer so be-
handelt werden, als würden sie ständig
Laserlicht führen.
Never look into open fiber-optic cable Nie direkt in die Enden sehen, da sonst
ends, as this may damage your eyes. die Augen geschädigt werden können!

In case of doubt always use dedicated la- Tragen Sie im Zweifelsfall stets eine
! ser-protective goggles! Schutzbrille!

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2.11 Handling Batteries / Handhabung von Batterien


Some equipment may contain accumula- Bestimmte Geräte können Akkumulatoren
! tors or batteries of different technologies − oder Batterien verschiedener Technolo-
e. g. lithium batteries or others. gien enthalten − z. B. Lithium-Batterien
oder andere.

Observe the following international Beachten Sie gegebenenfalls auch


standards, if applicable: folgende internationale Normen:

IEC 60130-17 (device interconnec- IEC 60130-17 (Geräteverbindungen)


tions) IEC 61429 (Recyclingsymbol)
IEC 61429 (recycling symbol) IEC 61438 (Sicherheits- und
IEC 61438 (safety and health haz- Gesundheitsrisiken)
ards) IEC 60086-4 (Umgang mit Lithium-
IEC 60086-4 (handling lithium batter- Batterien)
ies)

⇒ Pay attention to error messages re- ⇒ Achten Sie auf Fehlermeldungen,


ferring to the accumulator or the die sich auf den Akkumulator bzw.
battery. die Batterie beziehen.

Accumulators or batteries which are inte- Ins Gerät eingebaute Akkumulatoren oder
grated in the device should only be re- Batterien sollen nur beim Gerätehersteller
placed by the equipment manufacturer. ausgetauscht werden.
⇒ If replacement is necessary, do not ⇒ Wenn ein Austausch erforderlich
remove the accumulator or the bat- ist, dann bauen Sie nicht den Akku-
tery from the device, but send in the mulator oder die Batterie aus dem
complete device / the module Gerät aus, sondern schicken Sie
(card) or the removable battery das komplette Gerät / die
pack. Baugruppe oder das herausnehm-
bare Batteriepack ein.
In order to prevent loss of data, the battery Zur Vermeidung von Datenverlust soll die
should only be replaced by the equipment Batterie nur durch den Gerätehersteller
manufacturer. ausgetauscht werden.

There is risk of explosion if the battery is Wenn die Batterie nicht ordnungsgemäß
! not replaced correctly! ausgetauscht wird, besteht Explosionsge-
fahr!

Never short circuit batteries directly with- Schließen Sie niemals Batterien direkt
! out using a discharging resistor! Without a ohne Entladewiderstand kurz! Ohne Wi-
resistor very high current will flow causing derstand können so hohe Ströme fließen,
a risk of explosion! dass Explosionsgefahr besteht.

If you depollute batteries, you must ob- Beim Entsorgen von Batterien müssen
serve the local regulations applicable to die örtlichen Vorschriften über Beseiti-
hazardous waste. gung von Sondermüll eingehalten wer-
den.

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2.12 Emergency Switching OFF / Notabschaltung


⇒ Especially if smoke or fire escapes ⇒ Insbesondere falls Rauch oder
from the device (or in other emer- Feuer aus dem Gerät austritt (oder
gency situations), switch OFF the in anderen Notsituationen), schal-
device immediately − by all rele- ten Sie das Gerät sofort aus − mit
vant circuit breakers in the con- allen zugehörigen Sicherungs-
nector panel of the rack. automaten im Gestell-
Anschlussfeld.

⇒ If possible, first switch OFF the pro- ⇒ Schalten Sie möglichst zuerst die
tection power supply and then the Ersatz-Stromversorgung aus, dann
working power supply. die Betriebs-Stromversorgung.

⇒ However, consider that such an ⇒ Bedenken Sie jedoch, dass durch


emergency shut-down can discon- solch eine Notabschaltung wichtige
nect important communication lines Kommunikationsleitungen unter-
which may be required just in the brochen werden können, die
case of emergency. gerade im Notfall eventuell drin-
gend benötigt werden.

⇒ For this reason, shut down the de- ⇒ Nehmen Sie deshalb nur dann eine
vice only if it is inevitable. Other- Notabschaltung vor, wenn es un-
wise perform the normal switch-off umgänglich ist. Verfahren Sie sonst
procedure. entsprechend der normalen Ab-
schaltprozedur.

⇒ After the emergency shut-down, ⇒ Falls dies ohne Gefahr möglich ist,
and if it is possible without danger, überprüfen Sie nach dem Notab-
check if the device is dead − either schalten, ob das Gerät spannungs-
by using a measuring device or by frei ist − entweder mit einem
the LED display of the device, if ap- Messgerät oder gegebenenfalls
plicable. durch eine LED-Anzeige am Gerät.

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3 Preconditions and Preparations

3.1 Declaration of CE Conformity


Attention!
! The CE Declaration of Conformity for the product will be fulfilled if the construction and
cabling is undertaken in accordance with the manual and the documents listed therein,
e.g. mounting instructions, cable lists. Where necessary account should be taken of
project-specific documents.
Deviations from the specifications or unstipulated changes during construction, e.g. the
use of cable types with lower screening values, can lead to violation of the CE require-
ments. In such cases the conformity declaration is invalidated and the responsibility
passes to those who have caused the deviations.

3.2 Personnel Requirements


The personnel responsible for the installation of the equipment must meet the following
requirements:
• Training as service technician or equivalent training in telecommunications;
• Sound basic knowledge of transmission technology and the construction of ex-
changes;
• Relevant, practical training by the equipment manufacturer, including knowledge ac-
quisition of the equipment and systems required for the planned activity;
• PC knowledge, basic familiarity with the operation of MS-Windows;
• Basic knowledge of test engineering, familiarity with the operation of test equipment;
• Familiarity with handling electrostatically-sensitive components;
• Familiarity with handling optical fibres and laser sources;
• Familiarity with handling high temperature electronic modules having heat-sinks and
components conducting heat above 45 degrees Celsius (113 degrees Fahrenheit).

3.3 Required Tools and Accessories


• ESD grounding bracelet,
• Isopropanol 99 % and lint-free cloth for cleaning optical connectors,
• Cleaning device for SFP modules (e. g. CLETOP stick from ExceLight Communica-
tions, Inc.),
• Special cotton gloves for touching high temperature equipment between 45 and 85
degrees Celsius (113 to 185 degrees Fahrenheit),
• Assembly/unassembly tool.

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3.4 As-delivered Condition, Checking for Intactness


⇒ Prior to commissioning and starting up the SURPASS hiT 7050, it is advisable
to check the delivered equipment, including provided accessories, to ensure
that
- The correct items have been delivered with assembled customized
hardware,
- The delivered items correspond to the information on the delivery docu-
ments, and
- None of the items is damaged − as far as outwardly visible.

⇒ Particular attention should be paid to the connector pins at the cards, to ensure
that they are not damaged or bent.

The MFP1 and CC-CH cards contain a backup battery.


See Chapters 5.5 and 2.11 for notes on how to activate and handle that battery.

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4 Mounting and Cabling the SURPASS hiT 7050


In case of handling any hardware, you must observe the protective measures given in
! Chapter 2.

4.1 Mounting SURPASS hiT 7050 FP subrack in a Rack


hiT 7050 FP subrack can be mounted in an ETSI rack or in the very similar hiT 70**
RACK BASIC, H=2200 MM (see Fig. 4.2).

Fig. 4.1 hiT 7050 FP subrack

Rack Spacing

Fuse panel 100 mm


Space for cable handling min. 100 mm
FP1 160 mm
Space for cable handling min. 100 mm
FP1 160 mm
Space for cable handling min. 100 mm
FP1 160 mm
Space for cable handling min. 100 mm
FP1 160 mm
Space for cable handling min. 100 mm
FP1 160 mm
Space for cable handling min. 100 mm
FP1 160 mm
Space for cable handling min. 100 mm

Tab. 4.1 Rack Equipping Scheme

ETSI rack installation details can be found in the Transport Systems Installation Manual
(IMN) A42020-S178-H1-*-7431.

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Suggested hole numbers

Fig. 4.2 hiT 7050 FP subrack Mounting Example (hiT 70** RACK BASIC,
H=2200 MM)

Six FP1 can be fixed in one rack, if the rack equipment is done without cable compart-
ments.
In this case, the patch cords of every input and output port have to be stored in the dis-
tribution frame or in one of the racks next to the SURPASS hiT 7050 system!
If we use the P1-21 75 we could install in the same rack the DDF also (one DDF for each
P1-21 drawer).
The rack equipment with FP1and coax DDF is shown in Fig. 4.3

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Suggested hole numbers

Fig. 4.3 hiT 7050 FP subrack and coax DDF (hiT 70** RACK BASIC,
H=2200 MM)

The rack that meets ETSI specifications and measures 600 mm x 2200 mm x 300 mm
(W x H x D) is delivered in the form of individual parts and is constructed and screwed
together on site. Several racks can be installed individually or in combination. Indepen-
dent network elements can also be fitted into a rack.

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4.2 Mounting hiT 7050 CC and hiT 7050 CC-ES Subrack in a


Rack
SURPASS hiT 7050 CC and CC-ES subracks can be mounted in an ETSI rack or in the
very similar hiT 70** RACK BASIC, H=2200 MM (see Fig. 4.4, Fig. 4.5).

Suggested hole numbers

Fig. 4.4 Configuration with 3 FP1, 1 CC with CC-ES Mounting Example


(hiT 70** RACK BASIC, H=2200 MM)

If the rack equipment is done without cable compartments, the patch cords of every in-
i put and output port have to be stored in the distribution frame or in one of the racks next
to the SURPASS hiT 7050 system!

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Suggested hole numbers

Fig. 4.5 Configuration with 2 CC with CC-ES, Mounting Example


(hiT 70** RACK BASIC, H=2200 MM)

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4.3 Rack Assembly


The rack is installed and attached below a planar cable shelf (2645 mm or 2800 mm),
or to the wall (2300 mm), depending on the local circumstances. To allow this, the rack
has a height-adjustable adapter. The lower part of the rack is fixed to the bottom rails
with two pins or alternatively screwed to the floor. Height-adjustable feet can compen-
sate for unevenness in the floor of up to 25 mm.
Attachment kits are available for mounting below a planar cable shelf.
The necessary vertical stability will only be ensured if the rack is attached to a planar
! cable shelf, or wall mounted.

Cladding panels, consisting of a front door and a rear panel in each case, can be fitted.
The door can be opened by an angle of 165˚ and removed without any special tools.
In the base area, the rack can either be adapted to the Bw7R (Style 7R) infrastructure
(225 mm) (see above), or expanded, using the provided base extension, up to 300 mm.
The SURPASS hiT 7050 subrack has a build-in fan, since forced cooling is a mandatory
! condition for operating the SURPASS hiT 7050, regardless of the ambient temperature!.
Ensure for a sufficient cooling air flow!

A sensor on the MFP1 and CC-CH cards monitors the device temperature.

Consequent actions in case of system overtemperature conditions are described in


Chapter 7.3.1.

4.4 Subrack Positions in the Rack


Each rack is supplied with a pack of captive nuts for attaching the subracks. These must
be inserted from behind into the vertical front side rails in the required numbers and at
the required height into the openings provided on the rack sides, and depending on the
subracks to be installed. Furthermore, the bolts supplied as installation aids must be fit-
ted with a captive nut in the necessary height unit, and fixed with an additional hexago-
nal nut. When the subrack is mounted, it will be pushed onto the bolts.
The holes for fixing the subracks are numbered (starting from the top) on the front of the
rack uprights (with height unit numbers). An example is shown in Fig. 4.1.
Fastening angles must be mounted on each side of the subrack. They are used to attach
it to the rack rails (see Chapter 4.5).
The subracks are to be inserted into the rack from the front, prior to being equipped (onto
the supplied mounting bolts), and secured at the relevant mounting height.
Note the weight information given on the subrack label!
! Maximum weight 1 person can lift = 18 kg.

Below the rack, sufficient space must be left to let air enter.
! The vertical space between the SURPASS hiT 7050 subracks must be as a minimum
100 mm to allow sufficient air flow.
Do not remove any mounted air baffle plates!

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4.5 Subrack Fastening Angles


Two different types of fastening angles are available for mounting the SURPASS hiT
7050 subrack in an ETSI rack or in an hiT 70** RACK BASIC, H=2200 MM (see Fig. 4.7
and Fig. 4.9).

Particular articular fastening angles are available for fixing the hiT 7050 FP subrack on
a wall, see Fig. 4.12, Fig. 4.15, Fig. 4.16.

Fig. 4.6 ETSI Subrack Type ( FP Subrack example )

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Fig. 4.7 Fastening Angle for ETSI Racks (Top View)

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Fig. 4.8 hiT 70** RACK BASIC, H=2200 MM Subrack Type


(FP Subrack example )

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Fig. 4.9 Fastening Angle for hiT 70** RACK BASIC, H=2200 MM Racks
(Top View)

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4.5.1 Mounting of 19” rack


One MSI FP1 in a 19" Rack
The rack equipment is shown in Fig. 4.10.

Fig. 4.10 Rack Equipment with one FP Subrack in a Rack

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CC and CC-ES in a 19" Rack


The rack equipment is shown in Fig. 4.11.

Fig. 4.11 hiT 7050 CC and hiT 7050 CC-ES in a 19” Rack

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4.6 Rack Grounding


The rack is grounded by multiple mechanical connections to the grounded planar cable
shelf, or by a grounding cable connected to the grounding bolt in the upper section of
the rack.

For basic grounding information, see Chapter 2.6.

4.7 SURPASS hiT 7050 Grounding


The SURPASS hiT 7050 including its cards are grounded by multiple mechanical con-
nections to the grounded rack, and / or by the power supply cable connected to the Pow-
er 48/60 V connector on the MFP1 card.

4.8 Rack Power Supply


The rack is supplied with a DC voltage of 48 V or 60 V from the telecommunications cen-
ter. Two separate power supply lines (NUBAT1 and NUBAT2) are provided for redun-
dant feeding.
The power supply cables are connected to the distribution panel at the top of the rack.
They are to be laid from there via circuit breakers (fuses) to the Power 48/60 V connector
on the MFP1 card of the FP Subrack.

4.9 SURPASS hiT 7050 Power Supply


Applying power to the SURPASS hiT 7050 for the first time demands some precaution-
! ary measures, as described in Chapters 7.2 and 7.3.

The NUBAT 1 and NUBAT2 power supply inputs of the SURPASS hiT 7050 allow re-
dundant feeding using the Power 48/60 V connector (for pin assignment, see
Chapter 12.1.7). The second supply voltage NUBAT2 is only optional, supporting the
whole hiT 7050 FP subrack in case of a NUBAT1 failure.

4.10 Basic Cable Arrangement in the Rack


All electrical lines (connection lines for the telecommunications center, cabling between
the subracks and the rack terminal panel) as well as the fiber optic (FO) lines will be rout-
ed using the upright rails of the rack and are secured with cable ties.
FO lines, near the subrack frames, can be tightened on a plastic comb-like railing locat-
ed on both frame bars headed over the cards.

Connecting the FO Lines


A hinge-out mechanism, which is readily accessible from the front, makes it easier to
connect and disconnect the optical connections on the cards. No adjustment of the FO
cable is required and the minimum bending radius is always adhered to.

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4.11 Cabling Restrictions


The cabling areas in the rack cable ducts are:
– 4000 mm2 in front of the rack beams for electrical and/or optical cabling,
– 12,000 mm2 behind the rack beams for electrical cabling.
So, an adequate cabling can only be guaranteed with a strict limitation of the rack equip-
i ping.

4.12 Intra-Rack Power Distribution (for FP Subrack)


Fig. 4.12 shows the power distribution from the rack fuse panel to the FP Subrack.

Fig. 4.12 Intra-Rack Power Distribution

The power cable from the power connector shall be laid under the subrack (as shown
schematically in Fig. 4.9) and not along the front plates.
For detailed information about Pin assignment, see Chapter 12.1.7.
i

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4.13 Intra-rack Power Distribution for CC/CC-ES


Fig. 4.13 shows the power distribution from the rack fuse panel to the CC/CC-ES.

Fig. 4.13 Intra-rack Power Distribution

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Fig. 4.14 Intra-subrack Power Distribution

For detailed information about Pin assignment, see Chapter 12.


i

4.14 Optical Cabling

4.14.1 SFP Modules


Each optical interface requires a pluggable transponder module (SFP-Small Form factor
Pluggable) to be inserted at the front of the optical card. The SFP must be of correct
type, depending on the bit rate (eg. 155 Mbit/s or 622 Mbit/s) and the short or long haul
application.

For an overview of the cards and their mounting positions in the SURPASS hiT 7050,
see Chapter 5.

For more information about the optical connector type, see Chapter 12.8.1.

You can add or remove SFP modules or traffic cards (O622-2, O155-2, E100-4, E100-
8, P1-21) during operation without interference to unaffected traffic.
Insert the SFP module carefully at the front of the cards, otherwise they can be dam-
! aged!

⇒ Particularly pay attention to the electrical connector pins of the SFP modules, to
ensure that they are not damaged or bent.

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4.15 Fiber Handling


Put the cables carefully into the cable guiding parts, otherwise the cables can be dam-
! aged!

Keep in mind that the minimum bending radius of the optical cables is 30 mm.
!

Do not squeeze fiber cables when closing the front cover.


!

4.16 Routing Recommendations


All optical and electrical interfaces are placed at the front sides of the FP and CC plug-
in cards.
The cabling is carried out via the subrack cable duct and the rack cable duct, which is
at the front of the rack beams.

⇒ To fix the cables in the rack, mount cable holders at the rack beams, above or
below the cable outlets of the FP and CC subracks and cable compartments.

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The fiber-optic cabling should be carried out in the following order:


1. Intra-subrack cabling,
2. Intra-rack cabling,
3. Rack external cabling.

4.16.1 Intra-Subrack Fiber Cabling


⇒ Connect the fiber-optic cables to the plug-in cards and direct them through the
cable slots.

⇒ Bend the cables sideward to the cable outlets of the subrack.


In order to avoid cable squeezing, bend the cables over plastic parts.
It is recommended that the intra-subrack cables are guided in the cable ducts of the sub-
rack.

4.16.2 Intra-Rack Fiber Cabling


Overlength (slack) must be stored in the cable compartment.

Fiber Cabling between two SURPASS hiT 7050 Subracks

⇒ Distribute the fiber cables in the cable ducts symmetrically, i.e. check with every
fiber cable if the left of right side of the rack is to be used.

Fixing the Fiber Cables at the Rack

⇒ You must place the fiber cables at the cable holder, which have been fixed at
the rack beams (see Para 4.15).

4.16.3 Rack External Fiber Cabling


Cabling space is provided in front of the rack beams and behind the rack beams. The
cables are guided by means of attaching.
Overlength (slack) can stored in one of the cable compartments.

⇒ You must place the fiber cables at the cable holders, which have been fixed at
the rack beams (see Para 4.15).

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4.17 Fixing the hiT 7050 FP subrack on a Wall


Fig. 4.15 shows the air flow and cable guiding conditions in case the hiT 7050 FP sub-
rack is fixed on a wall.

Air flow

FP Subrack

Wall

Cable
guiding
recom-
mendation

Fan

Minimum 50 mm space
for air flow

Air flow

Neighbouring
equipment

Fig. 4.15 hiT 7050 FP subrack Fixed on a Wall

The particular fastening angles for fixing the hiT 7050 FP subrack on a wall are shown
in Fig. 4.16. The dimensions are shown in Fig. 4.17.

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Fig. 4.16 Fastening Angles for Fixing the hiT 7050 FP Subrack on a Wall

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Fig. 4.17 Wall Mounting Dimensions (in mm)

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4.17.1 Grounding of the Wall-Mounted Subrack

For basic grounding information, see Chapter 2.6.

4.18 Electrical Potential of External Devices


The hiT 7050 FP subrack and external devices must operate at the same electrical po-
! tential, i.e. normally in the same room.

In case of handling any hardware, you must observe the protective measures given in
Chapter 2.

4.19 SURPASS hiT 7050 Equipping


The SURPASS hiT 7050 is supplied to the customer in a fully configured state (i.e. with
i assembled customized hardware and installed software).
If a change is necessary in the configuration, Chapter 5 gives an equipping overview of
the SURPASS hiT 7050 − as a basis for possible hardware changes.

SURPASS hiT 7050 subrack can be mounted in an ETSI rack or in the very similar hiT
70** RACK BASIC (see Fig. 4.1, Fig. 4.2, Fig. 4.3, Fig. 4.7).

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5 SURPASS hiT 7050 Equipping Overview


All hardware units are supplied to the customer in a fully configured state (i.e. with
i assembled customized hardware and installed software) and are clearly labelled with
product number and serial number. Nevertheless, the following chapters deal with the
standard hardware and software configuration work for the SURPASS hiT7050 − as a
basis for any subsequent customizations or extensions.

In case of handling any hardware, you must observe the protective measures given in
! Chapter 2.

The MFP1 and CC-CH card contains a backup battery. Activating that battery is de-
scribed in Chapter 5.5.

For connector designations and pin assignment tables, see Chapter 12.

n overview of the LED indications is given in Chapter 11.

The functions of the cards are described in the Techical Description (TED) of the SUR-
PASS hiT 7050.

If any remedial actions are necessary in case of alarms or malfunctions of the SUR-
PASS hiT 7050, see the Operator Guidelines (OGL) and the online help:
Help In the main menu, click <Help> <Contents...> or <On Window...>.

The SURPASS hiT 7050 does not provide automatic equipment protection functions
that make use of different cards, i.e. there are no dedicated “protecting” cards. Never-
theless, particular parts of the equipment are automatically protected by traffic protec-
tion functions such as MSP or SNCP.
You can add or remove traffic cards or SFP modules during operation without interfer-
ence to unaffected traffic.
Since severe hardware damage is possible without forced cooling, the fan unit should
! be inserted first when equipping the FP and CC subrack.

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5.1 hiT 7050 FP subrack numbering of plug-in slot

Fig. 5.1 Card Positions in the SURPASS hiT 7050 FP subrack

Slot Possible Equipping Explanations


101 P1-21
P1-42
202 P3-3
E100-4
E100-8
E100S-8
Working
O155-2
O155-4
E155-4
O1000-4
O622-2
O622C-2
102 P1-21
P1-42
103 P3-3
E100-4
E100-8
E100S-8
O155-2 Working
O155-4
E155-4
O1000-4
O622-2
O622C-2
PS300P-6
201 FFP Mandatory
203 MFP1 Mandatory

Tab. 5.1 SURPASS hiT 7050, FP Subrack Equipping Options

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5.2 SURPASS hiT 7050 CC-Subrack numbering of plug-in unit


slot
The CC subracks have six fans (installed in only one fan unit).

Fig. 5.2 SURPASS hiT 7050, CC -Subrack

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Slot Possible Equipping Explanations


101
102 PCC Mandatory
103
O622CP-2
O155P-4
104 E155P-4 Working
E100SP-8
O1000P-4
P3P-3
PS300P-6
O622CP-2
O155P-4
E155P-4
E100SP-8
105 O1000P-4 Working
P3P-3
PS300P-6
106 CC-TX Working
107 CC-TX Cp Protection
108 CC-CH Working
O622CP-2
O155P-4
109 E155P-4 Working
O2500VP-1
O2500P-1
O622CP-2
O155P-4
110 E155P-4 Working
O2500VP-1
O2500P-1
201 P1P-42 Cp Protection
O622CP-2
O155P-4
E155P-4
202 E100SP-8 Working
O1000P-4
P3P-3
P1P-42
O622CP-2
O155P-4
E155P-4
203 E100SP-8 Working
O1000P-4
P3P-3
203 P1P-42 Working
O622CP-2
O155P-4
E155P-4
204 E100SP-8 Working
O1000P-4
P3P-3
P1P-42
O622CP-2
O155P-4
E155P-4
205 E100SP-8 Working
O1000P-4
P3P-3
P1P-42
301 FCC Mandatory

Tab. 5.2 SURPASS hiT 7050, CC, Equipping Options

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5.3 SURPASS hiT 7050 CC-ES numbering of plug-in unit slot

Fig. 5.3 CC-ES unit - front view

Slot Possible Equipping Explanations


101 LSU1 Working
102 LSU1 Working
103 LSU1 Working
104 LSU1 Working
105 LSU1 Working
106 LSU1 Working
107 LSU1 Working
108 LSU1 Working
109 EMPTY
110 EMPTY
111 EMPTY

Tab. 5.3 SURPASS hiT 7050, CC-ES Equipping Options

5.4 Slot Covers


For EMC compatibility reasons, covers (empty drawers) must be mounted at all card
slots that are not equipped, and the front door must be closed during operation.

5.5 Backup Battery


The MFP1 and CC-CH cards contain a backup battery, necessary for free-running clock
operation when the MFP1 and CC-CH cards are out of the subrack.
In the as-delivered condition of the MFP1 and CC-CH cards, that battery is not active.
To utilize the backup function, you must activate the battery manually.

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6 Connecting and Configuring an Operating


Terminal
The components of the SURPASS hiT 7050 Element Manager software should be in-
stalled on the LCT or NCT operating terminal.
For example, a notebook may be used as an LCT, or a desktop PC may be used as an
NCT.

6.1 PC Requirements for Use as an Operating Terminal


1. Notebook for use as an LCT:
– SIEMENS Fujitsu Mobile notebook or similar (min. Pentium III),
Windows 2000 compatible;
RAM: 512 Mbyte or more; available free hard disk capacity: 1 Gbyte minimum,
– CD-ROM drive,
– Floppy disk drive (optional),
– V.24 cable, 4 m,
– Ethernet Card 10/100BaseT, Fast Ethernet,
– RJ45 cable.

2. Desktop PC for use as an NCT:


– SIEMENS Fujitsu Desktop or Tower or similar (min. Pentium III),
Windows 2000 compatible;
RAM: 512 Mbyte or more; available free hard disk capacity: 1 Gbyte minimum,
– CD-ROM drive,
– Floppy disk drive (optional),
– V.24 cable, 4 m,
– Ethernet Card 10/100BaseT, Fast Ethernet,
– RJ45 cable,
– Minimum 17-inch monitor.

6.2 Connecting the Operating Terminal to the SURPASS


hiT 7050 FP, hiT 7050 CC and hiT 7050 CC-ES
⇒ It is recommended to begin the commissioning of the SURPASS hiT 7050 by
connecting the operating terminal the F interface of the SURPASS hiT 7050 and
to leave the Q interface unconnected − since the precondition for using the Q
interface is a properly configured NSAP address, as indicated in Chapter 8.1.
Note the restricted functionality with some Config DB settings when using the F inter-
face.

6.3 Element Manager Software


The installation of the Element Manager software (on the operating terminal) is an inte-
gral part of the TNMS CT installation procedure.

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During the TNMS CT Installation procedure, the system license number is requested.

For details on how to install, start and configure the necessary software components,
see the TNMS CT User Manual (UMN) mentioned in Chapter 1.2.

Starting and configuring of the installed SURPASS hiT 7050 software are described in
Operator Guidelines (OGL) and in the online help system of the SURPASS hiT 7050.
Help

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7 Starting up the SURPASS hiT 7050


Start-up includes all activities until the normal operating status of the SURPASS hiT
7050 network element is achieved.
Basically, there are two different kinds of starting up a network element:
• A cold start-up is initiated automatically whenever power is applied or the particular
card is inserted into the subrack.
• A warm start can be initiated during operation − in case of an error − automatically
by the software watchdog (time-out).
The following chapters only deal with the cold start-up of the SURPASS hiT 7050.

7.1 Using an Operating Terminal during Start-Up


During the start-up process, an LCT or NCT operating terminal is not necessarily re-
quired, since the start-up progress and possible faults during start-up are also indicated
by LEDs on the SURPASS hiT 7050 front.
However, an operating terminal should be connected to the SURPASS hiT 7050 before
start-up, giving more detailed information during that process.

Connecting and configuring the operating terminal is described in Chapter 6.

7.2 Checking the Power Supply Voltages


Before you supply power to the SURPASS hiT 7050, you should check the power supply
voltage(s).

⇒ Remove the power supply connector from the power supply input at the FP and
CC subracks.

⇒ Switch ON the power supply that feeds the unplugged cable.

⇒ Measure the supply voltage(s) at the cable connector contacts.


For pin assignment, see Chapter 12.1.7.
Note the reversed pin image of the cable-mounted connector! In case of doubt,
compare the pin numbering.
The measured voltage must be 48 V or 60 V.

⇒ Make sure that the polarity is correct − as explained in Tab. 12.7.

⇒ Switch OFF the power supply.

⇒ Reconnect the power supply connector to the power supply input at the SFP1
and CC subracks.

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7.3 Switching ON the SURPASS hiT 7050


⇒ Switch ON the power supply that feeds the SURPASS hiT 7050.
If applicable, first switch ON the protection power supply, then switch ON the
working power supply.
As soon as the SURPASS hiT 7050 is powered, it automatically performs a start-up
(cold start).
Do not disconnect or switch OFF the power supply during the start-up of the network
! element. This may cause damage to the software.

7.3.1 Forced Cooling


Forced cooling is a mandatory condition for operating the SURPASS hiT 7050, regard-
less of the ambient temperature.
If the forced cooling of the SURPASS hiT 7050 is not working properly, severe hardware
! damage is possible.

Therefore, the SURPASS hiT 7050 monitors the system temperature and the fan per-
formance.
In case of a fan failure or high temperature condition, a corresponding equipment alarm
will be generated, and the speed of the (remaining) fans will be increased. In extreme
overtemperature conditions, the SURPASS hiT 7050 switches OFF the power supply for
all cards except fan unit and main board cards (MFP1, CC-CH and CC-TX).

The location of the cards is shown in Fig. 5.1, Fig. 5.2.

The permissible environmental conditions for operating the SURPASS hiT 7050 are list-
ed in the Technical Description (TED).

7.3.2 Automatic Start-up Procedure


As a basic principle, no alarms should be displayed during start-up.
For a correct behaviour of system, when switch ON the CC subracks, at least one CC-
i TX unit, shall be plugged in (working side).

If both CC-TX units are miss in the subrack, the system shall be switched OFF and, then
i switched ON with at least one CC-TX unit, for a correct behaviour.

For remedial actions in case of alarms, refer to the online help (if it is already available)
and the Operator Guidelines (OGL) for the SURPASS hiT 7050.
Help

If a fault occurs after communication has already been established between the SUR-
PASS hiT 7050 and the LCT/NCT, the SURPASS hiT 7050 TNMS CT software displays
more detailed alarm information.
During the automatic start-up procedure, the MFP1 and CC-CH card performs − among
other functions − the following start-up steps:
• Testing hardware and software;

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– If a severe hardware fault is detected, the start-up procedure is aborted. The


MFP1 card falls back into the Fail state and indicates the fault by its red FAULT
LED.
– If the APS is not valid, the start-up procedure is aborted. The MFP1 and CC-CH
cards fall back into the Fail state and indicate the fault by its red FAULT LED.
• Starting up the SURPASS hiT 7050 software;
– If a severe software fault is detected, the start-up procedure is aborted. The MFP1
and CC-CH cards fall back into the Fail state and indicate the fault by its red
FAULT LED.
• Activating the SURPASS hiT 7050 application software;
• Identifying automatically all traffic interface cards inserted into the SURPASS hiT
7050 subrack, and supplying them with configuration and software data as neces-
sary, so that they can start up themselves.
– If a severe software fault is detected in an traffic interface card, its start-up proce-
dure is aborted. The traffic interface card falls back into the Fail state and indi-
cates the fault by its red FAULT LED.

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8 Configuring the SURPASS hiT 7050


All hardware units are supplied to the customer in a fully configured state (i.e. with
i assembled customized hardware and installed software). Nevertheless, this chapter
deals with the standard software configuration sequence for the SURPASS hiT7050 −
as a basis for any subsequent customizations or extensions.

Details on the menu and window structures of the SURPASS hiT 7050 TNMS CT soft-
ware (application software) as well as the correct use of the left-hand and right-hand
Help mouse buttons, can be found in the Operator Guidelines (OGL) and the online help sys-
tem of the SURPASS hiT 7050.

In case of handling any hardware, you must observe the protective measures given in
! Chapter 2.

As a precondition for the software configuration procedures described below, the


SURPASS hiT 7050 and the operating terminal must have been set up according to the
preceding chapters, so that the communication between them is working properly.
Each network element (such as SURPASS hiT 7050) must be configured and operated
separately, since each one has its own communications interfaces and its own network
address. For configuration purposes, the network elements must be connected in turn
(one after the other) to the operational terminal. However, after having finished the con-
figuration for one NE, it is possible, by uploading and downloading the VCDB, to transfer
the configuration settings to other similar elements in the network. Note that the link has
to be restored manually in case of using the F interface.

8.1 Recommended Configuration Sequence


⇒ When performing the initial software configuration, you should follow the order
listed below. It contains the most important and frequently used settings − to be
carried out previous to any user data related or overhead configurations (such
as port allocations or cross connection configurations).

⇒ If any feature is already set properly, or is not applicable, skip that item.

⇒ With many features, you can leave the default settings as they are, at least with
this initial configuration.

⇒ Before closing any configuration window, always check all the settings in it and
make sure that they match the given network and SURPASS hiT 7050 require-
ments.

All settings which are not yet applied or not accepted by the NE are shown in blue bor-
ders.
In the following instructions, the steps are illustrated by sample screenshots.

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8.1.1 Connection to NE via TNMS CT

8.1.1.1 Connection to NE via F Interface

The connection to NE via Q interface is described in Chapter 8.1.1.2

When using the connection via F interface, a PPP connection is required, as described
in the UMN of the TNMS CT.

TNMS CT Settings

⇒ In the TNMS CT, click the DCN Mgm button.

⇒ In the DCN Management window, select Serial Line Server -> QST V2 Serial
Line Channel and click the Properties button.

⇒ Make the settings according to Fig. 8.1 and Fig. 8.2.

Fig. 8.1 QST V2 Serial Line Channel Properties - General Tab

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Fig. 8.2 QST V2 Serial Line Channel Properties - QB3 Channel Tab

⇒ In the DCN Management window, select Serial Line Server -> QST V2 Serial
Line Channel -> QST V2 Serial Line NE and click the Properties button.

⇒ Make the settings according to Fig. 8.3 to Fig. 8.5.

Fig. 8.3 QST V2 Serial Line NE Properties - General Tab

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Fig. 8.4 QST V2 Serial Line NE Properties - Security Tab

The default password is NEPASSWORD.

Fig. 8.5 QST V2 Serial Line NE Properties - QST Tab

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OSI Stack Settings

⇒ Open the OSI Stack Configuration window using the Start menu:
Start -> Settings -> Control Panel -> OSI Stack icon.

⇒ In the OSI Stack Configuration window, make the settings according to Fig. 8.6.

Fig. 8.6 OSI Stack Configuration

NE Connection

⇒ Connect to NE, as described in the UMN of the TNMS CT.

⇒ Proceed with Chapter 8.1.2.

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8.1.1.2 Connection to NE via Q Interface


TNMS CT Settings

⇒ In the TNMS CT, click the DCN Mgm button.

⇒ In the DCN Management window, select the NE from the TNMS-CT Server en-
tries and click the Properties button.

⇒ Make the settings according to Fig. 8.7 to Fig. 8.9.

Fig. 8.7 NE Properties - General Tab

Fig. 8.8 NE Properties - Security Tab

The default password is NEPASSWORD.

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Fig. 8.9 NE Properties - QST Tab

⇒ The default area address is the SIEMENS proprietary address:


495349454D454E534147000001.
Enter it into the QST Properties window (see Fig. 8.9, left-hand address part).

⇒ Read the MAC address of the main controller (MFP1) on the TQM860 module
from the card extraction aid and add it (e.g. 00D093010CD9).

⇒ At the end of the NSAP/IP address, add the NSAP selector 01.

⇒ Enter the T selector QST.


The MC address is supplied with main boards (MFP1 for FP1 and CC-CH for CC).
i
NE Connection

⇒ Connect to NE, as described in the UMN of the TNMS CT.

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8.1.2 First Commissioning


1. In case the NE is in “read only” mode, requesting write access to that NE:
TNMS CT <Network View> <Access Control> <Request Write Access>

Write access allows the user to perform configuration changes.


Only one user can have write access to the NE at the same time.

⇒ Start the Element Manager.

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2. Entering NE location and name


<Module View> <NE / Subrack> <Configuration> <Network Element...>

An individual NE name is the precondition for setting the SURPASS hiT 7050 to the
Active state (see step #3.).

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3. Activating the NE
<NE State> <Set to Active>

Changing from Idle to Active state is only possible if the NE name is not the default
name (see step #2.).

After activating the NE, it starts a reboot. This will take some minutes.

⇒ In the TNMS CT, connect again to the NE and start the Element Manager.

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4. Entering subrack data


<Module View> <NE / Subrack> <Configuration> <Subrack Data...> <Customer
Specific>

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5. Setting the NE Date and Time


<Module View> <NE / Subrack> <Configuration> <NE Time...>

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Date and time are controlled by the internal clock of the operating system. The net-
work element time is configured with an offset relative to GMT.

6. Configuring MCF stack parameters


<Module View> <CC-CH> <Configuration> <MCF...> <Stack Parameters>
<Configuration...>

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Configuration of MCF parameter has to be done according DCN planning.


i

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⇒ If requested, modify the NSAP address data in the Layer 3 (NSAP) area.
Please note in case of changing the NSAP address: The settings in the DCN Manage-
i ment window (TNMS CT) also have be changed according to the chosen values. If the
area has been modified, the OSI stack parameters have to be adapted.
The TNMS CT connection will be lost.

⇒ In the TNMS CT, connect again to the NE and start the Element Manager.

7. Switching the NE to the “Operation” state


<NE State> <Set to Operation>

8. Setting the alarm severity threshold and the toolbar display


<Options> <Settings...>

Particularly check that “warning” is selected in the Alarm Severity Threshold area,
so that all alarms will be displayed.

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9. Entering the existing cards in the subrack


<Module View> <[slot number]>

Note that the above screenshot is only a sample. Each slot has a specific card list.
i

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If Empty-Auto is selected, it is not necessary to configure the traffic interface cards


explicitly. When a traffic interface card is plugged in, the SURPASS hiT 7050 (in ac-
tive NE state, see step # 3.) will automatically detect its hardware type, add the card
to the Required Equipping list and perform the software start-up, after a function test.

10. Configuring the DCC channels


<Module View> <card name> <Configuration> <MCF...> <DCC> <Configura-
tion...>

⇒ In case the customer requires DCN interworking, configure the settings acord-
ing to the DCN plan.

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11. Configuring the synchronization


<Module View> <MFP1> <Configuration> <SEC...>

⇒ Configure the synchronization according to the customer specific synchroniza-


tion plan.

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12. Configuring the card features


<Module View> <[card name]> <Configuration> <Card...>

The card user label is intended for entering network-specific information about the
card.

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13. Configuring traffic flow features


<Module View> <[interface card name]> <[symbol in the port list]> (<Sub-
view...> <[traffic flow symbol]>) <Configuration...>

Depending on the selected card and traffic flow symbol, various supervision param-
eters related to that card can be configured.

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14. Performing a backup of the configuration data


<Module View> <NE / Subrack> <Config DB Management...>

⇒ You can store the current configuration settings in a file by pressing the
Upload... button - also as a fall-back copy for possible future use.
Chose a filename and the directory where to store it.

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⇒ Press the Start button to upload the VCDB database.

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9 Initial Measurements and Tests


During commissioning of the SURPASS hiT 7050, measurements and function tests are
required in order to ensure that no damage has occurred during transport and assembly,
and that the equipment has been correctly installed.
When handling any hardware, you must observe the protective measures given in
! Chapter 2.

Electrical and optical parameters of the individual cardcard and of the complete system
are listed in the Technical Description (TED) of the SURPASS hiT 7050.

9.1 Measurements and Tests


Local measurements, line measurements, and Ethernet tests are part of the Field Test
Protocol (see Chapter 9.2).

⇒ Perform the required measurements and tests as described in the Field Test
Protocol.

9.2 Test Reports


The results of the commissioning measurements are to be recorded in Field Test Proto-
cols. Appropriate forms can be ordered separately.
Being the basis for future comparison measurements, the Field Test Protocols should
be archived thoroughly.

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10 Hardware Upgrade
When handling any hardware, you must observe the protective measures given in
! Chapter 2.

In Release 3.2 of the SURPASS hiT 7050, no special upgrade procedures are provided
for interface cards.
Inserting new interface cards does not effect existing traffic within the system.

Before changing the MFP1 and CC-CH cards, see Chapters 5.5 and 2.11 for notes on
how to activate and handle the backup battery.

Before replacing the MFP1, the APS version of spare part must be aligned with the run-
ning one. In case of discrepancy between MIB version (stored into the backplane flash)
and APS version (loaded in the MFP1) the NE will be continuously rebooting.

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11 LED Indications
This chapter gives an overview of the card front LEDs, which provide information for ser-
vice and maintenance purposes.

The functions of the LEDs are explained in detail in the Technical Description
(TED) of the SURPASS hiT 7050.

11.1 Main Board Cards (MFP1 and CC-CH cards)


The main board cards have seven leds, see Tab. 11.1.

The LED locations on the MFP1/CC-CH cards are shown in Fig. 12.1 and Fig. 12.33.

MFP1 and CC-CH Cards

LED Name LED Color Explanation

MAJOR • Red Major alarm


MINOR • Yellow Minor alarm
ACO • Blue Acknowledged alarm
OK • Green Service LED
FAULT • Red Fault alarm LED
UBAT1 • Green Power supply UBAT1 is working
UBAT2 • Green Power supply UBAT2 is working
EOW-HS • Green EOW
The LED indication is explained in the Operator Guide-
lines (OGL) of the SURPASS hiT 7050.

Tab. 11.1 LEDs on the main board cards

11.2 Traffic Interface Cards

11.2.1 OK and FAULT LEDs


All traffic interface cards have at least the two LEDs shown in Tab. 11.2.

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Traffic Interface Cards

LED Name LED Color Explanation

OK • Green Service LED


FAULT • Red Fault alarm LED

Tab. 11.2 LEDs on the Traffic Interface Cards

The LED locations on the cards are shown in Chapter 12.2 and the following.

11.2.2 Ethernet Connector LEDs


In addition to the LEDs described in Chapter 11.2.1, each RJ45 Fast Ethernet connector
on the Fast Ethernet cards is equipped with another two LEDs, as explained in
Tab. 11.3.

RJ45 Connectors on the E100-4, E100S-8, E100SP-8 and PS300P-6 Cards

LED Name LED Color Explanation

Active • Yellow Data is being transmitted or received


Link • Green Line is connected

Tab. 11.3 leds in the RJ45 Fast Ethernet Connectors

The positions of these leds are shown in Fig. 12.28.

11.3 Fan Units


Each fan unit has one LED, see Tab. 11.4.

Fan Unit

LED Name LED Color Explanation

Fault • Red At least one fan is at low speed or failed

Tab. 11.4 Fault LED on the Fan Unit

The LED locations on the fan units (for hiT 7050 FP and hiT 7050 CC) are shown in
Fig. 11.1, Fig. 11.2.

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Fig. 11.1 Fault LED on the FFP1 Unit

Fig. 11.2 Fault LED on the FCC Unit

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12 Pin Assignments
Technical data are listed in the Technical Description (TED) of the SURPASS hiT 7050.

12.1 MFP1 Card

EOW

Fig. 12.1 Connector (and LED / Push Button) Locations on the MFP1 Card

12.1.1 TIF / Alarms Interface


Connector type and location: 15-pin male Sub-D (DB-15) connector on the MFP1
card (see Fig. 12.1).
GND
TIF_COM2
TIF_COM1
AND_BATT

MINOR_NOT
MINOR

15 14 13 12 11 10 9
Front view
8 7 6 5 4 3 2 1
MAJOR_NOT

MAJOR_REF
MINOR_REF

TIF_OUT
TIF_IN3
TIF_IN2
TIF_IN1
MAJOR

Fig. 12.2 TIF / Alarms Connector

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TIF / Alarms

Pin Signal Explanation

1 TIF_IN1 TIF input #1 (sensor)


2 TIF_IN2 TIF input #2 (sensor)
3 TIF_IN3 TIF input #3 (sensor)
4 TIF_OUT TIF output (actor)
5 MAJOR_REF Major alarm
6 MAJOR Major alarm
7 MAJOR_NOT Major alarm The circuitry
is shown
8 MINOR_REF Minor alarm
in Fig. 12.3
9 MINOR Minor alarm
10 MINOR_NOT Minor alarm
11 --- Not connected
12 AND_BATT Battery alarm
13 TIF-COM1 TIF return signal #1
14 TIF-COM2 TIF return signal #2
15 GND Ground

Tab. 12.1 Pin Assignment of the TIF / Alarms Connector

SFP1 TIF / Alarms


connector

MAJOR_REF
5
MAJOR_NOT
MAJOR 7
MAJOR
relay contact 6

MINOR_REF
8 The relay contacts correspond to
MINOR_NOT the MAJOR and MINOR LEDs
MINOR 10 (see Tab. 11.1).
MINOR
relay contact 9
The relay contact positions are
shown without alarms.

Fig. 12.3 Alarm Contacts

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12.1.2 T3 / T4 Timing Interface


Connector type and location: 15-pin female Sub-D (DB-15) connector on the MFP1
card (see Fig. 12.1). Two 15-pin female Sub-D (DB-15) connector on the CC Subrack
(see Fig. 12.37)

The impedance configuration (120 Ω balanced / 75 Ω single ended) of the timing inter-
face is shown in Fig. 12.5 and Fig. 12.6.
T41CO_A
GND

GND
T31CI_C
GND
T31DI_C
9 10 11 12 13 14 15
Front view
1 2 3 4 5 6 7 8
T41CO_B

T31CI_B
T31CI_A
T31DI_B
T31DI_A
GND

GND

Fig. 12.4 T3 / T4 Connector

T3 / T4

Pin Signal Explanation

1 GND Ground
2 T41CO_B T4 clock output B
3 --- Not connected
4 GND Ground
5 T31CI_B T3 clock input B
6 T31CI_A T3 clock input A
7 T31DI_B T3 data input B
8 T31DI_A T3 data input A
9 T41CO_A T4 clock output A
10 GND Ground
11 --- Not connected
12 GND Ground
13 T31CI_C T3 clock input C
14 GND Ground
15 T31DI_C T3 data input C

Tab. 12.2 Pin Assignment of the T3 / T4 Connector

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T3 / T4 Impedance Configuration
The impedance of the T3 / T4 timing interface depends on which interface pins are con-
nected to the cable, as shown in Fig. 12.5 and Fig. 12.6. For better understanding,
some details of the SURPASS hiT 7050 internal circuitry are added to these figures.

120 Ω 75 Ω

T31CI_A
6 6 6
GND
12 12
2048 kHz
or T31CI_C 79 Ω
13 13

T31CI_B
5 5

Fig. 12.5 Impedance Configuration of the 2-kHz T3 Input

120 Ω 75 Ω

T41CO_A
9 9 9
GND
1 1
2048 kHz
or

T41CO_B
2 2 2

Fig. 12.6 Impedance Configuration of the 2-kHz T4 Output

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12.1.3 Q Interface
Connector type and location: 8-pin shielded RJ45 connector on the MFP1 card
(see Fig. 12.1).

EQOUT_A
EQOUT_B
EQIN_A

EQIN_B
1 2 3 4 5 6 7 8
Front view

Fig. 12.7 Q Connector

Pin Signal Explanation

1 EQOUT_A Ethernet Q output A


2 EQOUT_B Ethernet Q output B
3 EQIN_A Ethernet Q input A
4 --- Not connected
5 --- Not connected
6 EQIN_B Ethernet Q input B
7 --- Not connected
8 --- Not connected

Tab. 12.3 Pin Assignment of the Q Connector

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12.1.4 F Interface
Connector type and location: 9-pin male Sub-D (DB-9) connector on the MFP1 card
(see Fig. 12.1).

CTS
RTS
DSR

9 8 7 6
5 4 3 2 1 Front view
GND
DTR

CD
RX
TX

Fig. 12.8 F Connector

Pin Signal Explanation

1 CD Carrier detect
2 RX Receive data
3 TX Transmit data
4 DTR Data terminal ready
5 GND Ground
6 DSR Data set ready
7 RTS Ready to send
8 CTS Clear to send
9 --- Not connected

Tab. 12.4 Pin Assignment of the F Connector

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12.1.5 2-Wire EOW Interface


Connector type and location: 4-pin, 6-position RJ11 connector on the NEAP
(see Fig. 12.1).

WIRE A
WIRE B

1 2 3 4
Front view

Fig. 12.9 2-Wire EOW-HS Connector

2-Wire EOW

Position Pin Signal Explanation

1
2 1 --- Not connected
3 2 WIRE_A Handset wire A
4 3 WIRE_B Handset wire B
5 4 --- Not connected
6

Tab. 12.5 Pin Assignment of the 2-Wire EOW Connector

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12.1.6 SDI interface

Fig. 12.10 SDI connector

SDI

Pin Signal Explanation

1 MSDI-TX
2 MSDI-RX
3 PASDI-TX
4 PASDI-RX
5 PBSDI-TX
6 PBSDI-RX
7 GND
8 GND

Tab. 12.6 Pin Assignment of SDI interface connector

12.1.7 Power Supply Input


Connector type and location: 25-pin male Sub-D (DB-25) connector on the MFP1
card (see Fig. 12.1).
GND
GND
GND
PUBAT
PUBAT
PUBAT

PUBAT
NUBAT2
NUBAT2
NUBAT1
NUBAT1
NUBAT1

25 24 23 22 21 20 19 18 17 16 15 14
12 11 10 9 8 7 6 5 4 3 2 Front view

Pin Pin
missing missing
NUBAT2
NUBAT2
NUBAT2
NUBAT1
NUBAT1
PUBAT
PUBAT

Fig. 12.11 Power 48/60 V Connector

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Power 48/60 V

Pin Signal Explanation

(1) --- Pin missing (coding element)


2 NUBAT1 Negative UBAT1 input
3 NUBAT1 Negative UBAT1 input
4 NUBAT2 Negative UBAT2 input
5 NUBAT2 Negative UBAT2 input
6 NUBAT2 Negative UBAT2 input
7 PUBAT Common positive input = +/- 0 V
8 PUBAT Common positive input = +/- 0 V
9 --- Pre-wired but not used
10 --- Pre-wired but not used
11 --- Not connected
12 --- Not connected
(13) --- Pin missing (coding element)
14 NUBAT1 Negative UBAT1 input
15 NUBAT1 Negative UBAT1 input
16 NUBAT1 Negative UBAT1 input
17 NUBAT2 Negative UBAT2 input
18 NUBAT2 Negative UBAT2 input
19 PUBAT Common positive input = +/- 0 V
20 PUBAT Common positive input = +/- 0 V
21 PUBAT Common positive input = +/- 0 V
22 PUBAT Common positive input = +/- 0 V
23 GND Ground = +/- 0 V
24 GND Ground = +/- 0 V
25 GND Ground = +/- 0 V

Tab. 12.7 Pin Assignment of the Power 48/60 V Connector

12.1.8 SDI Interface


Connector type and location: 8-pin SDI connector on the MFP1 card (see Fig. 12.1).
This interface is intended only for service purposes at the factory and not to be used by
i the customer.

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12.2 P1-21 Card

Fig. 12.12 Connector (and LED) Locations on the P1-21 Card

12.2.1 2-Mbit/s Electrical Interfaces


Connector type and location: One 125-pin male 90˚ Z-Pack connector on the P1-21
card. Only 21 of the 25 connector columns are used, as shown in Fig. 12.13.

21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

B For pin
C
assignment,
see Tab. 12.8.
D

Front view

Fig. 12.13 2-Mbit/s Connector on the P1-21 Card

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P1-21 Card, 2 Mbit/s

Connector Column Number = Channel Number

21 20 19 18 • • • 4 3 2 1

Explanation
Row Signal
120 Ω balanced 75 Ω unbalanced
A IN IN IN IN • • • IN IN IN IN Negative input Input ground
21 20 19 18 4 3 2 1 signals
B IP IP IP IP • • • IP IP IP IP Positive input Input signals
21 20 19 18 4 3 2 1 signals
C --- --- --- --- • • • --- --- --- --- Not connected Not connected
D ON ON ON ON • • • ON ON ON ON Negative output Output ground
21 20 19 18 4 3 2 1 signals
E OP OP OP OP • • • OP OP OP OP Positive output Output signals
21 20 19 18 4 3 2 1 signals

Tab. 12.8 Pin Assignment of the 2-Mbit/s Connector

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12.3 P1-42 Card

Fig. 12.14 Connector (and LED) Locations on the P1-42 Card

12.3.1 2-Mbit/s Electrical Interfaces


Connector type and location: Two 125-pin male 90˚ Z-Pack connectors on the P1-42
card. With both connectors, only 21 of the 25 connector columns are used, as shown in
Fig. 12.15.

21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

B For pin
C
assignments,
see Tab. 12.9
D and
E Tab. 12.10.

Front view

Fig. 12.15 2-Mbit/s Connectors on the P1-42 Card

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P1-42 Card, 2 Mbit/s, Upper Connector

Connector Column Number

21 20 19 18 • • • 4 3 2 1

Channel Number

21 20 19 18 • • • 4 3 2 1

Explanation
Row Signal
120 Ω balanced 75 Ω unbalanced
A IN IN IN IN • • • IN IN IN IN Negative input Input ground
21 20 19 18 4 3 2 1 signals
B IP IP IP IP • • • IP IP IP IP Positive input Input signals
21 20 19 18 4 3 2 1 signals
C --- --- --- --- • • • --- --- --- --- Not connected Not connected
D ON ON ON ON • • • ON ON ON ON Negative output Output ground
21 20 19 18 4 3 2 1 signals
E OP OP OP OP • • • OP OP OP OP Positive output Output signals
21 20 19 18 4 3 2 1 signals

Tab. 12.9 Pin Assignment of the Upper 2-Mbit/s Connector

P1-42 Card, 2 Mbit/s, Lower Connector

Connector Column Number

21 20 19 18 • • • 4 3 2 1

Channel Number

42 41 40 39 • • • 25 24 23 22

Explanation
Row Signal
120 Ω balanced 75 Ω unbalanced
A IN IN IN IN • • • IN IN IN IN Negative input Input ground
42 41 40 39 25 24 23 22 signals
B IP IP IP IP • • • IP IP IP IP Positive input Input signals
42 41 40 39 25 24 23 22 signals
C --- --- --- --- • • • --- --- --- --- Not connected Not connected
D ON ON ON ON • • • ON ON ON ON Negative output Output ground
42 41 40 39 25 24 23 22 signals
E OP OP OP OP • • • OP OP OP OP Positive output Output signals
42 41 40 39 25 24 23 22 signals

Tab. 12.10 Pin Assignment of the Lower 2-Mbit/s Connector

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12.4 P1P-42

Fig. 12.16 Connector (and LED) Locations on the P1P-42 Card

12.4.1 2-Mbit/s Electrical Interfaces


Connector type and location: Two 125-pin male 90˚ Z-Pack connectors on the P1P-
42 card. With both connectors, only 21 of the 25 connector columns are used, as shown
in Fig. 12.17.

22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1

A
For pin
assignments,
B see
C Tab. 12.11
and
D
Tab. 12.12.
E

Front view

Fig. 12.17 2-Mbit/s Connectors on the P1P-42 Card

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P1P-42 Card, 2 Mbit/s, Upper Connector

Connector Column Number

22 21 20 19 18 ••• 4 3 2 1

Channel Number

22 21 20 19 18 ••• 4 3 2 1

Row Explanation
Signal
120 Ω balanced 75 Ω balanced
A IDC IN IN IN IN • • • IN IN IN IN Negative input Input ground
M_0 21 20 19 18 4 3 2 1 signals
B IDC IP IP IP IP • • • IP IP IP IP Positive input Input signals
M_1 21 20 19 18 4 3 2 1 signals
C GND GND GND GND GND • • • GND GND GND GND Not connected Not connected
D IDC ON ON ON ON • • • ON ON ON ON Negative output Output ground
M_2 21 20 19 18 4 3 2 1 signals
E IDC OP OP OP OP • • • OP OP OP OP Positive output Output signals
M_3 21 20 19 18 4 3 2 1 signals

Tab. 12.11 Pin Assignment of the Upper 2-Mbit/s Connector

P1P-42 Card, 2 Mbit/s, Lower Connector

Connector Column Number

22 21 20 19 18 • • • 4 3 2 1

Channel Number

43 42 41 40 39 • • • 25 24 23 22

Row Explanation
Signal
120 Ω balanced 75 Ω balanced
A IDC IN IN IN IN • • • IN IN IN IN Negative input Input ground
S_0 42 41 40 39 25 24 23 22 signals
B IDC IP IP IP IP • • • IP IP IP IP Positive input Input signals
S_1 42 41 40 39 25 24 23 22 signals
C GND GND GND GND GND • • • GND GND GND GND Not connected Not connected
D IDC ON ON ON ON • • • ON ON ON ON Negative output Output ground
S_2 42 41 40 39 25 24 23 22 signals
E IDC OP OP OP OP • • • OP OP OP OP Positive output Output signals
S_3 42 41 40 39 25 24 23 22 signals

Tab. 12.12 Pin Assignment of the Lower 2-Mbit/s Connector

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12.5 P3-3 and P3P-3 Card

Fig. 12.18 Connector (and LED) Locations on the P3-3 Card and P3P-3Card

12.5.1 34/45-Mbit/s Electrical Interfaces


Connector type and location: Three electrical Micro Coax connectors (type 1.0/2.3)
on the P3-3 and P3P-3 card.

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12.6 O155-2 and O622-2 Cards

Fig. 12.19 Connector and leds locations on the O155-2 and O622-2 cards

12.6.1 Optical Interfaces


Connector type and location: Two optical LC connectors (SFP module) on the O155-2
or O622-2 card.
Fig. 12.20 shows a side view of the O155-2 or O622-2 card, explaining the optical line 1
/ line 2 and input / output location scheme.

Fig. 12.20 Optical Line 1 / Line 2 and Input / Output Location Scheme
(Side View of the Card)

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12.7 O155-4, O155P-4, O1000-4 and O1000P-4 Cards

Fig. 12.21 Connector (and LED) Locations on the O155-4, O155P-4,


O1000-4 and O1000P-4 Cards

12.7.1 Optical Interfaces


Connector type and location: Four optical LC connectors on the O155P-4, O1000-4
and O1000P-4 card.

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12.8 O622C-2 and O622CP-2 Card

Fig. 12.22 Connector (and LED) Locations on the O622C-2 and


O622CP-2 Cards

12.8.1 Optical Interfaces


Connector type and location: Two optical LC connectors on the O622C-2 and
O622CP-2 cards.

12.9 O2500P-1 Card

Fig. 12.23 Connector and LEDs on the O2500P-1 card

12.9.1 Optical Interfaces


Connector type and location: one optical LC connector on the O2500P-1 card.

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12.10 O2500VP-1 Card

Fig. 12.24 O2500VP-1 - front view

12.10.1 Optical Interfaces


Connector type and location: one optical LC connector on the O2500VP-1 card.

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12.11 E155-4 and E155P-4 Cards

Fig. 12.25 Connector (and LED) Locations on the E155-4 and E155P-4 Cards

12.11.1 Electrical Interfaces


Connector type and location: Four electrical Micro Coax connectors (type 1.0/2.3) on
the E155-4 and E155P-4 cards.

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12.12 E100-4 and E100-8 Cards

Fig. 12.26 Connector and leds locations on the E100-4 Card

Fig. 12.27 Connector and led locations on the E100-8 Card

12.12.1 Electrical 10/100BaseTX Fast Ethernet Interfaces


Connector type and locations:Four 8-pin RJ45 connectors on the E100-4 card
(see Fig. 12.26)
or
eight 8-pin RJ45 connectors on the E100-8 card
(see Fig. 12.27).
The 10/100BaseTX Fast Ethernet connectors on the E100-4 and E100-8 cards have the
same pin assignment.

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8 7 6 5 4 3 2 1 Front view

RX+

TX+
RX-

TX-
Fig. 12.28 10/100BaseTX Fast Ethernet Connector

10/100BaseTX Fast Ethernet

Pin Signal Explanation

1 TX+ Ethernet output +


2 TX- Ethernet output
3 RX+ Ethernet input +
4 --- Not connected
5 --- Not connected
6 RX- Ethernet input
7 --- Not connected
8 --- Not connected

Tab. 12.13 Pin Assignment of the 10/100BaseTX Fast Ethernet Connectors

The green and yellow LEDs in the 10/100BaseTX Fast Ethernet connector are ex-
plained in Tab. 11.3.

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12.13 E100S-8 and E100SP-8 Card

Fig. 12.29 Connector and leds locations on the E100S-8 and E100SP-8 Cards

12.13.1 Electrical 10/100BaseTX Fast Ethernet Interfaces


Connector type and locations:Eight 8-pin RJ45 connectors on the E100S-8 card.
The 10/100BaseTX Fast Ethernet connectors on the E100S-8 card have the same pin
assignment as shown in Fig. 12.28 and Tab. 12.13.

The green and yellow LEDs in the 10/100BaseTX Fast Ethernet connector are ex-
plained in Tab. 11.3.

12.14 PS300P-6 Card

Fig. 12.30 Connecotors and leds location on the PS300P-6 Card

12.14.1 Connector type and locations


Six 8-pin RJ45 connectors on the PS300P-6 card (see Fig. 12.30).
They are two different pin assignments depicted in the following chapters.

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12.14.2 Electrical 10/100BaseTX Fast Ethernet Interfaces


The pin assignment of 10/100BaseTX Fast Ethernet connectors, position 1 up 4, on the
PS300P-6 card is shown in Fig. 12.31 and Tab. 12.14.

Front view

Fig. 12.31 10/100Base TX Fast Ethernet Connector

10/100BaseTX Fast Ethernet

Pin Signal Explanation

1 TX+ Ethernet output +


2 TX- Ethernet output
3 RX+ Ethernet input +
4 --- Not connected
5 --- Not connected
6 RX- Ethernet input -
7 --- Not connected
8 --- Not connected

Tab. 12.14 Pin Assignment of the 10/100Base TX Fast Ethernet Connector

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12.14.3 Electrical 1000BaseT Gigabit Ethernet Interfaces


The pin assignment of 1000BaseT Gigabit Ethernet connectors, position 5 and 6, on the
PS300P-6 card is shown in Fig. 12.31 and Tab. 12.14.

Fig. 12.32 1000Base T Gb Ethernet Connector

1000BaseT Gigabit Ethernet

Pin Signal Explanation

1 1+ Ethernet bidirectional port


2 1- Ethernet bidirectional port
3 2+ Ethernet bidirectional port
4 3+ Ethernet bidirectional port
5 3- Ethernet bidirectional port
6 2- Ethernet bidirectional port
7 4+ Ethernet bidirectional port
8 4- Ethernet bidirectional port

Tab. 12.15 Pin Assignment of the 1000BaseT GB Ethernet Connector

The green LEDs on the Ethernet interface connector are explained in Tab. 11.3.

12.15 CC-CH Card

Fig. 12.33 Connector (and LED/Push button) location on the CC-CH card

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12.15.1 Connector type


Four different type of connectors are located in the CC-CH card, please refer to Chap-
ters 12.1.3, 12.1.4, 12.1.5 and 12.1.6 for details of schemes and pin assignment.

12.16 CC-TX Card

Fig. 12.34 CC-TX front view

The green and red LEDs are the same explained in Tab. 11.2.

12.17 PCC Card

Fig. 12.35 CC front view

The green LED is the same explained in Tab. 11.2.

12.18 LSU1 Card

Fig. 12.36 LSU1 front view

The green and red LEDs are the same explained in Tab. 11.2.

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12.18.1 Connector type and location


One 125-pin male 90˚ Z-Pack connectors on the LSU1 card. The pin assignment is the
same as with P1P-42 please refer to Chapter 12.4.1.

12.19 CC Subrack

Fig. 12.37 CC-Subrack front view

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12.19.1 Power supply input


Connector type and location: 3w3 male Sub-D connector on the CC subrack

Fig. 12.38 Power 48/60 Connector

UBAT1/UBAT2

Pin Name

A1 N. C.
A2 NUBATE
A3 PUBATE

Tab. 12.16 Power 48/60 Connector

12.19.2 TIF/Alarm Interface


Connector type and location: 25-pin male Sub-D (DB-25) connector on the CC sub-
rack.
12C_SCL

TIF-COM2
P5V
12C_SDA

AC3

AC2
AC1

TIF-IN4
ML/Q
N. C.
N. C.
GND

25 24 23 22 21 20 19 18 17 16 15 14
13 12 11 10 9 8 7 6 5 4 3 2 1 Front view
MAJOR_NOT
MINOR_NOT

MAJOR_REF
MINOR_REF
TIF-COM1
AND_BAT

TIF_OUT

TIF_IN1
TIF_IN3
TIF_IN2
MAJOR
MINOR
N.C.

Fig. 12.39 TIF/Alarm Connector

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TIF/Alarms

Pin Name

1 TIF_IN1
2 TIF_IN2
3 TIF_IN3
4 TIF_OUT
5 MAJOR_REF
6 MAJOR
7 MAJOR_NOT
8 MINOR_REF
9 MINOR
10 MINOR_NOT
11 N.C.
12 AND_BAT
13 TIF-COM1
14 TIF-COM2
15 GND
16 N. C.
17 N. C.
18 ML/Q
19 TIF-IN4
20 AC1
21 AC2
22 AC3
23 12C_SCL
24 12C_SDA
25 P5V

Tab. 12.17 Alarms and TIF Connector

12.19.3 Interface T3/T4 and Q connector


The pin assignments of interface T3/T4 and Q interfaces are the same as listed in Chap-
ters 12.1.2 and 12.1.3 respectively.

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12.20 CC-ES Subrack


The CC-ES subrack layout is depicted in Fig. 12.40.

Fig. 12.40 CC-ES Subrack front view

The pin assignment of connectors 1…10 is the same of P1P-42, see Chapter 12.4.1.

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13 Physical connections of CC and CC-ES


Subracks
The example of configuring are depicted in the Fig. 13.1.

All the necessary cables (for Intra-subrack Power Distribution) are supplied with system.

Fig. 13.1 Connections Example, CC Subrack with CC-ES Subrack

The CC_ES can be added also when the main shelf CC is working with traffic. In this
! case it is strongly recommended to use only one power cable between CC and CC_ES.

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13.1 Cabling rules for CC and CC-ES Subracks


The LSC (Line Switch Cable) connections from the P1P-42 on the CC subrack to the
connecting panel on the CC-ES subrack are fixed:

To CC-ES (COPA)

Conn. Conn. Conn. Conn. Conn. Conn. Conn. Conn. Conn. Conn.
n. 1 n. 2 n. 3 n. 4 n. 5 n. 6 n. 7 n. 8 n. 9 n. 10

from CC (P1P-42)

Slot 201 x x
Slot 202 x x
Slot 203 x x
Slot 204 x x
Slot 205 x x

Tab. 13.1 Rules of connections with LSC cables

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14 Abbreviations
ACO Alarm Cut Off
Bw7R Style 7R
CC Compact Core
CC-CH System Controller Card of Network Element

CC-ES Compact Core Extension Shelf


CC-TX Timing Generator Card
CD-ROM Compact Disc Read Only Memory
CE Communauté Européenne
DB Data Base
DC Direct Current
DCC Data Communication Channel
E100-4 Traffic Interface Card 4x10/100Base-TX
E100-8 Traffic Interface Card 8x10/100Base-TX
E100S-8 Traffic Interface Card 8 Fast Ethernet with
VC-12 mapping
E100SP-8 Traffic Interface Card 8 Fast Ethernet with
VC-12 mapping
E155-4 4x155 Mbit/s (STM-1 el.)
E155P-4 Traffic Interface Card 4x155 Mb/s (STM-1
el.)
EGB Elektrostatisch Gefährdete Bauteile
EMC Electromagnetic Compatibility
EN European Standard
EOW Engineering Order Wire
ESD Electrostatic Sensitive Device
ETS European Telecommunication Standard
ETSI European Telecommunications Standards
Institute
F Standardized interface for connection of a
local terminal
FAULT Fault Alarm LED
FCC Fan Unit (for SURPASS hit 7050 CC)
FFP1 Fan Unit (for SURPASS hit 7050 FP1)
FO Fiber Optic
FP1 Flat Pack
GMT Greenwich Mean Time
GND Ground
GUI Graphical User Interface
GUIMN Graphical User Interface Manual
HS Handset

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HW Hardware
IEC International Electrotechnical Commission
ITMN Installation and Test Manual
LCT Local Craft Terminal
LED Light Emitting Diode
LSU1 Line switch Unit (E1 level)
LWL Lichtwellenleiter (optical fiber)
MFP1 Main Board
MSI Multi Service Integrator
MSP Multiplex Section Protection
NCT Network Craft Terminal
NUBAT Negative Power Supply Voltage
O1000-4 Traffic Interface Card 4x1000 Base SX/LX
O1000P-4 Traffic Interface Card 4x1000 Base SX/LX
O155-2 Traffic Interface Card 2x155 Mbit/s (STM-1)

O155-4 Traffic Interface Card 4x155 Mbit/s (STM-1)

O155P-4 Traffic Interface Card 4x155 Mbit/s (STM-1)

O2500P-1 Traffic Interface Card 1x2,5 Gb/s (STM-16)


O2500VP-1 Traffic Interface Card 1x2,5 Gb/s (STM-16)
very long haul
O622-2 Traffic Interface Card 2x622 Mbit/s (STM-4)

O622C-2 Traffic Interface Card 2x622 Mbit/s (STM-4)

O622CP-2 Traffic Interface Card 2x622 Mbit/s (STM-4)

OGL Operator Guidelines


OK Service LED
P1-21 Traffic Interface Card 21x2 Mbit/s
P1-42 Traffic Interface Card 42x2 Mbit/s
P1P-42 Traffic Interface Card 42x2 Mbit/s
P3-3 Traffic Interface Card 3x34/45 Mbit/s
P3P-3 Traffic Interface Card 3x34/45 Mbit/s
PCC Power Supply Card (for SURPASS hit 7050
CC)
PDF Portable Document Format
PE Protective Earth (Ground)
PPP Point to Point Protocol
PS300P-6 Traffic Interface Card L2 Switch (up to 2
STM-1)
PUBAT Positive Power Supply Voltage

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RAM Random Access Memory


Rx Received signal
SDI Serial Debug Interface
SEC SDH Equipment Clock
SELV Separate Extra-Low Voltage
SFP Small Form Factor Pluggable (Module)
SFP1 Subrack Flat Pack 1
SNCP Sub-Network Connection Protection
SW Software
T3 Clock input
T4 Clock output
TED Technical Description
TIF Telemetry Interface
TNMS CT Telecommunication Network Management
System Craft Terminal
Tx Transmitted signal
UMN User Manual
VCDB Variable Configuration Data Block

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15 Index
A batteries and accumulators 23
Accumulator handling 23 ESD components 18
Air filter 15 fiber-optic cables and connectors 19
Angles for fastening the subrack in a rack 33 subrack front door 14
Hardware Impedance configuration, T3 / T4 90
High operating temperature
B
system response 57
Backup battery 53 warning label 15
Battery handling 23, 53
Bending radius of optical fibers 19
I
Impedance configuration (hardware), T3 / T4 90
C
Installation aid for the subrack 32
CE conformity declaration 25
Checking the device for intactness 26
L
Cleaning fluids for optical connectors 19
Compact Core 30 Laser class 20
Compact Core Extension Shelf 30 Laser devices 20
Configuring sequence 66 Laser safety shutdown 21
Configuring the T3 / T4 impedance (hardware) 90 Laser warning label 20
Connectors of optical fibers, handling 19 LED explanations 84
Cooling, fan 57 Lithium batteries 23

D M
Declaration of CE conformity 25 Measuring
Delivery check 26 see also Testing
Device checking for intactness 26
Dust filter 15 O
Optical connectors, handling 19
E Optical fiber
Earthing bending radius 19
see Grounding Overtemperature 57
Emergency switching OFF 24 Overvoltage on the power supply input 17
ESD components 18
ESD warning label 18 P
External devices, electrical potential 48 Planar cable shelf 32
Plug and pull aids with modules 18
F Potential (electrical) with external devices 48
Fan 57 Power supply check 56
Fan unit 49 Protection against
Fastening angles for the subrack 33 laser light 20
Faults during start-up 58 power supply input overvoltage 17
Field Test Protocol 82 Protective caps for optical connectors 19
Floor rails 32
Front door handling (at the subrack) 14 R
Rack mounting of the subrack 32
G
Grounding bracelet 18 S
Grounding the subrack 16 Safety shutdown of the laser 22
SFP modules 42
H Start-up procedure 57
Handling Subrack fastening in a rack 33

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Subrack fixing on a wall 45


Subrack front door handling 14
Subrack grounding 16
Subrack weight 14
Switching OFF in case of emergency 24
Switching ON 57

T
T3 / T4 impedance configuration 90
Temperature of the system 57
Temperature warning label 15
Test reports 82
Tests (automatic) during start-up 57
Tests and measurements 82

W
Wall mounting of the subrack 45
Warning labels
heavy weight 14
high operating temperature 15
laser devices 20
Weight information 32
Weight of the subrack, warning label 14

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