BLU STUDIO 5.

0 CE
SERVICE MANUAL

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CAUTIONS

Please refer to the phone’s user’s guide for instructions relating to operation, care, and maintenance, which include
important safety information.
Servicing and alignment must be undertaken by qualified personnel only.
Ensure all work is carried out at an anti-static workstation and that an anti-static wrist strap is worn.
Use only approved components as specified in the parts list.
Ensure all components, modules, screws, and insulators are correctly re-fitted after servicing and alignment
Ensure all cables and wires are repositioned correctly
Electrostatic discharge can easily damage the sensitive components of electronic products. Therefore, every service
supplier must observe the precautions which mentioned above.

CONTENTS
Content

1. Brief Introduction….……………………………………………………………………………….….3

2. Tools……………………………………………………………………………………………………..5

3. Assemble & Dissemble

Dissembly..................…………………………………………………………………………...6～11

Assembly………………………………………………………………………………………...12～17

4. Picture of main board

A&B side of PCBA .…………….…………………………………………………….…………..18

A&B of PCBA Layout………….….………….…………………………….………………….…....19

5. System Block Chart…………………………………………………………………………………...20

6. Unit Circuit Map ..….........................................................................................................21～27

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 CHAPTER 1 INTRODUCTION

Main Function

Dual Card Full Touch Smartphone

OS4.4

CPU MT 6571 (1.3GHz Dual core)

5 " FWVGA480*854

Back camera 3.2M FF，Mega, Compatible2 MP，

Front camera 0.3 Mega

WIFI: 802.11n, 802.11g, 802.11b

4GB+512MB Compatible512M+256MB

SPEC： Dual SIM

Network：GSM Band: 850MHz/900MHz/1800MHz/1900MHz

Size：145*73*9.7

Camera: Back camera 3.2M FF，Mega, Compatible2 MP，Front camera 0.3 Mega

Battery: 1800 MAH

BT:4.0

USB: Micro USB 2.0

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 CHAPTER 2 SERVICE TOOLS

Iron Hot air gun

Voltage regulator Multimeter Solder wire, soldering paste

Tweezers Driver

SW
upDownlo
ad cable Wrist
groun
ding
strap
Pick
Antistatic
gloves
Computer and software download cable Metal tweezers, Screw driver etc..

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 CHAPTER 3 DISASSEMBLY AND ASSEMBLY
3.1 DISASSEMBLY

Remove the Battery cover…….……..………………... 1 Unfasten the 11 screws…….…………..…2

Remove the back cover….……………..………..3 Remove the vibrator………………………4

Remove the TP FPC…..………...………..5 Take out the camera..…………….……... 6

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Remove the LCD FPC……………..........................……7 Remove the speaker FPC…………………............……..8

Take out the PCBA…………………...........................……..9 Remove the speaker FPC by iron.....……………..…..10

Take out the receiver.....………………………………..…..11 Take out the light sensation seal rubber…………….12

Use heat gun to heat aound the TP 200°C……….13 Remove the TP by port…………………………………..….14
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 Stick the protection film onto LCD……………………..15 Stick the protection film onto TP……………………….16

Take out the LCD…………………………………………….….17

Finished。。。。。。。

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3.2 ASSEMBLY

Install the LCD..…..……….……………………………………..…1 Remove the protection film………….……………………….2

Remove the protection film……..……………….......……3 Install the TP……………..……………………………….………..4

Impact the LCD………………………………………….………...5 Install the receiver…………………………………….……...... 6

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Install the Light sensation seal rubber……………..... 7 Solder the speaker FPC……………………………………...... 8

Install the PCBA………………………………………………...... 9 Install the speaker FPC…………………………………….... 10

Install the LCD FPC….............................................. 11 Install theTP FPC……………………………………………...... 12

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 Install the camera ….............................................. 13 Solder the vibrator by iron …................................. 14

Install the back cover…....................................... 15 Fasten the 11 screws…........................................... 16

Install the battery cover…………………………………..... 17

Finished……

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 CHAPTER 4 SYSTEM BLOCK DIAGRAM

4.1、PCBA A-Side
J1003 Earphone connector. J1203 I/O Connector
bug by damaged. bug by damaged No charge in,
U701 BT/WIFI/FM/GPS
Earphone no sound Cannot upgrade Software
IC. Buy by damaged.
BT/WIFI/FM/GPS Not
work U101 CPU Bug by damaged

U501 RF IC Cannot power on. No RF

Bug by damaged. signal. No display or display

No signal abnormality

Can’t power on.

U301 Flash Bug by damaged
Cannot power on, cannot
U605 GSM PA
upgrade software.
Bug by damaged.
No signal. Large current
J1205 Battery connector
Bug by damaged.
U401 Power IC Buy by Not power on.
damaged,Cannot power on. Not charge in
No charge in.
Speaker no sound.

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PCBA-B-Side

J802 TP Connector
Bug by damaged.
TP not work.

J901 Camera connector

Bug by damaged.
Can’t take photos.

J1201 J1202 SIM

J1204 T-Flash connector
connector
Bug by damaged.
Bug by damaged.
Can't Access T-Flash
Cannot the SIM card.
Card.

J801 LCD Connector

Bug by damaged.
LCD No display or
display abnormality

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4.2:Side A layout

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Side B layout

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CHAPTER 5 CIRCUIT INSTRUCTION

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 CHAPTER 6 UNIT CIRCUIT PRINCIPLE INTRODUCTION

6.1 Studio Ce INTRODUCTION

System Overview
Studio Ce is a highly integrated baseband platform incorporating both modem and application
processing subsystems to enable 3G smart phone applications, with integrated Bluetooth, WILAN
and GPS modules. The chip integrates a Dual-core ARM○
R cortex-A7 MPcoreTM operating up to
1.2Ghz,an ARM Cortx-R4 MCU and a powerful multi-Standard Video accelerator. MT6572 supports
various interfaces, including parallel/serial NAND flash memory and 32-bit LPDDR2

Baseband CPU circuit introduction for power supply

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6.1.1: Introduction for baseband chip CPU part circuit

Base station
interface

RF TX
Control

Camera
Control

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6.2 Power management IC MT6323

General Descriptions

MT6323 is a power management system chip optimized for 2G/3G handsets and
smart phones, especially based on the Mt6572 system solution. MT6323 contains 3
buck converters and 24 LDOs, which are optimized for specific 2G/3G/smart phone
subsystems. MT6323 provides mono 0.7W into 8Ω, high efficiency Class AB/D audio
amplifiers and flexibility for various applications of indicator LED drivers. It supports up
to 4 channel LEDs with independent controlled. Flexible control includes: register
mode, PEM mode and breath mode.

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6.3 System Overview

The MT6166 is a RF transceiver targeted at high speed 2G/3G-FDD/TDD multi-mode smart

phone and tablet computers implanted in 40nm CMOS. The RF transceiver function is fully
integrated. This document briefly introduces the RF macros in MT6166.

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6.4: RF -MT6166

6.5 I/O connector (5PIN)

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6.6 Four in one chip MT6627

MT6627 is a 4-in-1 connectivity chip which contains a WIFI/Bluetooth Transceiver, a GPS receiver, and a FM
receiver front-ends, along with integrated passive device(IPD) in a QFN40 package. Simplified block diagram and
how MT6627 connects to a companion modem is shown in Figure 1. In Figure 1, RF input/output are, respectively.
An always on low-dropout regulator (ALDO) provides supply voltage to top control logics in MT6627.The top
control logics can control each subsystem independently. Each subsystem also has dedicated LDOs, too. A thermal
sensor and its ADC (analog=to-digital converter) is provided to monitor MT6627 temperature variation. MT6627
does not have its dedicated crystal oscillator. It either uses an extremely (maybe temperature compensated)
oscillator, or uses the clock source from companion chips in the platform such as MT6166.
For WIFI and Bluethooth, MT6627 provides an advanced switching mechanism which allows fast switching
between WIFI and BT modes. Hardware sharing and reuse is maximized. The transceiver front-ends are on
MT6627 while the ADC/DAC (analog-to-digital converter/digital-to-analog converter) are in the companion
modem chip. The interface driver/receiver buffer are designed to drive PCB trace loading. The GPS/Glonass IP in
MT6627 supports both standards, depending on if the companion modem supports Glonass or not. Its partition is
similar to WIFI/Bluetooth such that the ADC/DAC is in the companion modem chip. In contrast, the FM system
intearates the modem and ADC in MT6627. And no interface drivers/buffers are required.

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6.7: Four in one MT6627

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SKY7775XX POWER AMPLIFIER MODULE FOR

CDMA/WCDMA/HSDPA/HSUPA/HSPA+/LTE- DAND

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 CHAPTER 6 TROUBLESHOOTING

CANNOT POWER ON-CURRENT SWING

INSTABILITY

Cannot power on

Upgrade the software

NO

Check the power manage

supply output：
VIO 18 NO Replace or
Check and
DVDD 2.8V NO re-weld
replace the I/O
VIO 28 power
connector
VTCXO 2.8V manage IC
VEMC 3.3V
VRTC 1.2V

NO

26MHZ&32.768KHZ
Check and replace
system clock：26MHz
&32.768KHz

NO

Replace or re-weld
flash
NO

Replace U101
MT6572

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CANNOT POWER ON-LARGE CURRENT

Make the phone connect the power

supply and then press power key
find large current make the phone
heat

Check if the phone

leakage (current 0mA is
normal)

Use the touch method

to check and replace
the heat spare parts

Check and replace Check and

RF IC, BT IC, WiFi replace RF PA,
IC, FM IC, CPU Audio PA, PM IC
Check if the
capacitance,
varistor, LDO tube
leakage

END

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REPAIR FLOW FOR PHONE DEAD

Phone dead

Upgrade the software can

settle the defect issue?

Check battery connector

and battery touch point if
is dropped or dirty?
YES Clean or replace
the battery or
battery connector.
Check the keypad if stuck
or touch panel do not work
to make the phone “dead”?

Check and reinstall YES

the keypad or replace
the touch panel.
Check the flash if is rosin
joint or damage?

YES Re-weld or replace

Flash.

Check the CPU if is rosin

joint or damage?

Re-weld or replace YES

CPU.

Upgrade the software

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NO DISPLAY OR DISPLAY ABNORMALITY

No display or display
abnormality after power on

Check LCD if damage or

liquid flow out

Yes
Change LCD

Check LCD connector

is OK or not

Clean or re-weld Yes

the LCD connector

Change LCD connector

can settle the defect
issue?
No
Upgrade software

Change the LCD can

settle the defect
issue?

Change or re-weld CPU

MT6572

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INSERT SIM REPAIR PROCESS

Insert SIM

Check if all the SIM

pins are clean

NO Clean or replace
SIM connector.

Check SIM connector OK

is OK or not

Clean or re-weld the NO

SIM connector

Check FPC on SIM

connector is OK or not

NO NO Replace FPC
Replace SIM card

Upgrade software can

settle the defect issue?

NO

MT6572 may be
defective

Re-solder or
replace CPU
MT6572

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N0/WEAK SIGNAL TROUBLE SHOOING

No or weak
signal

Inspect the antenna and

antenna connector to see
if there’s any distortion
YES Replace the
defective
components.
Check and replace RF
coaxial line to see if there’s
any signal .
Replace RF YES
coaxial line

Put a false antenna at RF PA

IC to see if there’s any signal

YES Replace RF PA
IC

Make a false antenna at

RF filter, check if
there’s any signal
Saw filter is Yes
damaged,
replace it.
Replace 26M oscillator
to check if the problem
is solved.
No

Re-solder or
replace CPU
MT6572

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NO/LOW SOUND FROM SPEAKER

No sound or noise

Remove the speaker and

measure with multimeter
to see if there’s any
sound.

NO

The phone is in
Silent mode.
Yes
Set the phone as Replace speaker.
normal mode
Turn on the speaker,
measure the wave signal
by oscillograph

NO

Replace power IC or
MT6572

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RECEIVER LOW VOICE OR NO VOICE

Receiver is low.

Check if the receiver is

broken or damaged

Yes Replace the

receiver .

Check if receiver
connector is damaged.
Re-solder or clean the YES
receiver connector.

Measure the signal

with oscillograph
under calling mode
NO

Re-solder or replace
power IC is ok or not.

NO

Replace CPU
U101 MT6572

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NO/LOW SOUND FROM MIC

No/Low sound from

MIC

Check if there’s
MIC cover
No Install the MIC
cover.

Press power on and side

button to test mode and
activate echo loop,
measure MIC voltage is
1.5V、0.7V

Yes Replace the MIC

Replace FPC to check if

the problem is solved

Replace the YES

FPC

Measure C1124、C1125
with multimeter to see if
there’s 0.5V offset voltage

NO

Re-solder or replace
CPU MT6572

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Microphone circuit

Main related component: BBIC(U101),power IC(U401),microphone

From power IC To microphone

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DOES NOT CHARGE – NO CHARGE IN

No charge

Change battery

NO

Check charger and cable without

problem, or change good one

NO NO
Upgrade the software

Check if I/O connector

works normal
NO Re-solder or replace
the I/O connector

Check and replace

FPC is ok or not?

Replace the FPC NO

Replace the charge IC

is ok or not?

NO

Replace or re-solder
power IC

NO

Replace or re-solder
CPU MT6572

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CAN’T READ T-FLASH CARD

Can’t read
T-Flash card

Check if T-Flash slot

appearance was ok?
YES Replaced the
T-Flash slot

Measure if T-Flash
slot pin 4 VMC was
2.8V.
Re-solder or NO
replace
Power IC
Check if the voltage of T-Flash
pin3/pin5/pin7 to the ground was
around 0.7V with multimeter diode
column
Measure if there is pin
NO YES
short for the T-flash
adjacent pins
CPU MT6572
YES
solder poor or
damaged
Check if replace
T-Flash slot can
fix this problem?
Re-solder or
replace CPU
MT6572 NO

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 T-Flash connector circuit
Main related component: BBIC(U101),T-Flash connector(J1203)

T-Flash connector
From BBIC

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WIFI、BT、FM 、GPS DEFECT REPAIR FLOW CHART
 WIFI can’t open，
Can’t work normal

Software update and check

the function is OK or not

YES Software update

Check 4 in 1 IC 29#.33#.36#40# pin

have 1.8V, 3.3BVsupply voltage or
not

Check power IC have VBATT

V supply voltage or not

YES Replace U701

Check U701 10pin have

32KHZ clock signal
output or not by
oscilloscope (OSC)
NO

Replace Y701 NO

Re-solder or Replace
U701 4 in 1 IC

Re-solder or Replace
CPU MT6572

WIFI BT FM GPS 4 in 1 circuit

Main related component: BBIC(U101),power IC(U401),4 in 1 IC(U701), antenna.
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 WIFI&BT& control line
From BBIC
WIFI&BT IQ RX/TX
(From BBIC)
WIFI&BT

MF control line
From BBIC
GPS IQ RX
From BBIC GPS ANT

FM ANT From
Earphone connector

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