MAGNETOM

MR

Classroom Training Document

Functional Description

Harmony syngo MR
Symphony syngo MR
Sonata syngo MR
© Siemens AG 2004
The reproduction, transmission
or use of this document or its
contents is not permitted
without express written
authority. Offenders will be
liable for damages. All rights,
including rights created by
patent grant or registration of a
utility model _or_ design,_are_
reserved.

English
Doc. Gen. 12/06
Document Revision Level
This is a document used for classroom training only and does not correspond to official version/revision
levels of the official documentation. Revisions to this document will not be distributed automatically.

Disclaimer
The installation and service of equipment described herein is to be performed by qualified personnel
who are employed by Siemens or one of its affiliates or who are otherwise authorized by Siemens or
one of its affiliates to provide such services.
Assemblers and other persons who are not employed by or otherwise directly affiliated with or autho-
rized by Siemens or one of its affiliates are directed to contact one of the local offices of Siemens or
one of its affiliates before attempting installation or service procedures.
 Section

1 Introduction 1

This Introduction is intended to familiarize you with the structure of the MAGNETOM Harmony, Symphony, Sonata documentation. Here will
also be explained the print format as well as the on-line documentation and how to use it.

Service Documentation 1.
Electronic Documentation 1. 2

All paper documents are also available in electronic form in the

Paper Documentation
The official service documents consist of the Functional Description
(FUN), the Trouble Shooting Guide (TSG) and the Replacement of
Parts (ROP) and are available in paper form as DIN A5 ring books
and on CD/DVD. These are handed out in the training course and
will be the ONLY hardcopy version you will get since all future
revisions will be available in electronic form ONLY. Remember this
when you make your notes ;-)
WARNING This document is for TRAINING only, will not be
updated and available in electronic form only.
In addition, there are 3 DIN A4 binders delivered with every
system which include:
• Diagrams
• Installation and Start Up instructions
• Preventative Maintenance and Safety Related Tests
• Protocols and records of service activities and modifications
1.1
HTML and PDF formats. Some of the documents have a built-in
navigation system to facilitate a quick navigation to the information
you are looking for. Text links are recognizable by their BLUE
color. Links within the graphics are usually denoted with a colored
triangle placed in the upper left corner of box within the graphic
that is linked. There are several cases where this could not be
realized so an attempt has been made to indicate a link using some
other means. In any case, almost all graphics will have at least one
link, so move the mouse over any graphic. If the cursor changes to
a hand anywhere, it’s a link.
Files in electronic format:
• Functional Description (FUN)
• Trouble Shooting Guide (TSG)
• Replacement of Parts (ROP)
• Planning Guide (PG)
• Diagrams (DIA)
• Maintenance Instruction (MI)
• Safety Information (SAFE)
In addition to these fundamental documents are also several
supplementary documents published on an irregular basis and
instrumental in keeping the CSE informed on service issues. These

3
Introduction - Service Documentation
 1
4

include: FUN 1.1.31

• Speed infos (SI)

• Update or Modification instructions (UI)
• Knowledge Database entries
• Quality Database
• Report Database
• Spare Parts List
This information is found under the CS INTRAnet portal and should
be consulted regularly. The CSE can be informed automatically via
e-Mail on the release of Speed Infos if he or she has an account on
the Knowledge Database. This functionality must be enabled.
Please refer to the information pages within the Knowledge
The Functional Description contains information on HOW the MR
system components and sub-components work. The FUN is usually
referred to when wanting to get detailed information on a particular
component and not necessarily used consistently in the service
workflow. The FUN serves as the basis for the training and is gone
into detail during the course. Hopefully it is also read at that time.
We doubt it, though. The Block Diagrams within the FUN are
especially useful to gain an overview of the functional blocks
(usually field replacable units, FRUs) and their inter connectivity.
TSG 1.1.32

Database on how to do this.

The TSG is the primary document referred to when dealing with
service-related problems. Each of the hardware sections contain
Document Structure 1.13
two sub-sections:
The above mentioned documents have a distinct structure which • Strategy : This section gives information, usually in the form
will now be explained here. of error lists or table of symptoms, to help determine WHERE
the problem is and WHICH test procedures can or should be
The three major service documents FUN, TSG and ROP have a performed to help isolate the defective or mal-functioning
common sub-division including 13 sections, or parts: component. Often times you will find useful information on
• Introduction the LEDs, switch functions, etc. that are not found elsewhere.
• System - general info regarding the system • Procedures : This section provides the instructions on
• Software performing both the automated test loops and manual testing
• Host / Imager procedures.
• Control
• RF System
• Patient Handling ROP 1.1.3

• Gradients The ROP gives instructions on replacing FRUs as well as the

• Magnet System removal of covers, the configuration of components and software
• Cooling System when necessary and a list of tune up or calibration procedures
• Power Distribution which must be performed after the replacement of any component.
• Tune Up
• Changes to last Version - a list changes made from the last version Other Service Documents 1. 3. 1

As you can see, these sections cover the major hardware sub- The structure of all other documents is specific to the type of
systems, software and Tune Up. document and is deemed unnecessary to explain in detail here.
Sources of Documentation 1.14

There are several sources available where the various documents

can be found.

CD-ROM 1. .41

All of the service documentation EXCEPT the Speed infos, Update

Instructions and Knowledge Database entries have been placed
onto a CD or DVD ROM. For CSEs who are entering the service for a
particular modality will be given this CD/DVD during their first
modality training course. Updates are issued automatically to CSEs
that have been entered into the distribution database. The
responsibility for entering CSEs into this database lies with the
countries and regional service offices within the countries, i.e.,
YOUR boss. If you are not getting CD/DVD updates, inform your
supervisor.

INTRANET 1. .42

The best source for the latest documentation and information is the
Siemens Intranet. All Siemens service employees will have access
to the intranet. A list of the links to this information cannot be
given here, since they do change from time to time. It is best if you
familiarize yourself with the CS web pages and where this
information can be found. Bookmarking these pages is
recommended, with the reminder that they can and will change
with time.

Training Course 1. .43

As mentioned, for CSEs entering the service field for a modality for
the first time will be given the FUN, TSG and ROP in ring book form
as well as a service CD/DVD.

5
Introduction - Service Documentation
 1
6

This page intentionally left blank.

 Section

2 System 2

The MAGNETOM Harmony, Symphony and Sonata represent a new generation of MR imaging systems designed to meet the specific needs of
radiologists and brings the new and improved technologies over previous MR product lines. Customer surveys provided many new ideas and
their wishes led to the appeareance and features of these machines.

Overview 2.1
software application improvments have accompanied these
systems over the years:
• Harmony / Symphony
The latest MR product line includes three machines sharing a • Symphony Quantum
common electronics platform:
• Harmony / Symphony / Sonata syngo
• MAGNETOM Harmony, a 1 Tesla system • Harmony / Symphony / Sonata Maestro
• MAGNETOM Symphony, a 1.5 Tesla system • Symphony, a Tim system (not described in this document)
• MAGNETOM Sonata, a 1.5 Tesla system with stronger
gradients
These systems were not only designed to improve the
performances of the major sub-systems - RF, gradients, magnet
and digital processing - with the latest technological
advancements, but to optimize both harware and software for
better image quality, higher resolutions, optimized radiological
workflows and improved patient comfort.
Since the initial introduction of the Harmony and Symphony
systems in 1997, they have since gone through two
metamorphasis that have not only changed their outward looks,
but also their peformance. New or improved hardware components
(gradient amplifier and coil, RF receive chain and RF coils) and

7
System - Overview
 2
8

Figure 1 System Block Diagram

System Block Diagram

Control Room Harmony / Symphony / Sonata
Alarm Equip Room
Intercom Host Console Software Box
Exam Room

CCA

Tune MSUP Monitoring

Imager
Up
LAN

PMU
Shim I
SHIM

PTAB
Filter Panel
MPCU 3 MC4C40 Rx4 MC1C40 IOP
BC, LC Control

MMC

RFCI
PCI-link
PCI-CAN

GCTX GPA_INT
CAN 1
CAN 2

Gradient /
Shim Coil
Cool Water

Compr. Gas
RFSU

Body
TX 2x
RX
2x
RX
GPA RCA BC_CTRL
Coil
Module
Module Mod
RFAS

4 4 Array
.
RF
pr

TALES
Coils

BCCS
Power
om

LCCS

BTB
Amplifier
C

TAS
LPD

16

LC_CTRL
16
Figure 2 Equipment Room Components

System
Diagram

Equipment Room
Components

GPA CCA RCA

MMC PS SPS
MSUP

RFSU
Controller

RFCI LEDs
CCS

MMC
Cooler 1

Blower Fans

RFCI RFCI PS

RFPA

MREF
(compressor)

LPD

9
System - Overview
 2
10

Figure 3 Exam Room Components

System
Exam Room Diagram
Filter Panel
Components

RF Cabin Gradient Coil

Magnet

RFAS Patient Table Control Unit

Magnet System
The magnet system generates the basic magnetic field. The
components required are described below. The electrical and
mechanical shim are integrated into the gradient coil.
Magnet
The magnet comprises the superconducting magnet including the
systems for cooling (interface for helium fill/refill, coldhead) and
monitoring the magnet during operation.
Refrigeration System
The magnet has two cryo-shields surrounding the helium vessel
containing the superconducting magnet for the purpose of reducing
the influx of radiated energy and thus reducing the helium boil off.
These shields are cooled by a conventional refrigeration system
consisting of a compressor and a 2 stage cold head which
maintains their temperatures at 80K and 20K respectively.
Magnet Supervision
Due to the potenial risks involved with a cryogen-filled magnet a
supervision unit is indespensible. The Magnet Supervision unit
supervises and controls the magnet during operation, ramps it
down in emergency situations (ERDU), and it provides user-
accessible operating controls for the magnet system.
Magnet Covers
The magnet covers consist of the front, back and side covers, the
turret covers, the apertures including all mechanisms required for
installing the covers, as well as the components located directly
underneath the covers. The equipment required for the tunnel
lighting, patient ventilation, and light localizer are integrated into
the magnet covers (fan, lamps, cables, light localizer).
2.1
Shim Power Supply - SPS 2.1. 5
An electrical shim system consisting of 5 shim coils, integrated into
every gradient coil, and a Shim Power Supply allow for interactive
fine-tuning of the B0-field to compensate local field
inhomogeneites caused by the patient and the surrounding
environment.
2.1.1
Passive Shim - PSHIM 2.1. 6
The passive shim consists of shim trays strategically placed within
the Gradient Coil, wherein iron shim plates can be placed to
"smooth out" the inherent static magnet inhomogeneities.
2.1.12
Shimming the magnet passively requires a special Array Shim
measuring device and shim hardware (shim and isolation plates).
Magnet Power Supply - MPS 2.1. 7
The Magnet Power Supply consists of the unit which energizes/
deenergizes the magnet, including the charge cable to the magnet,
the cabling for the voltage supply and Magnet Supervision.
2.1.13
As a service tool, the MPS is not part of the delivery volume of the
MR system and is brought on-site only as required. In contrast to
the previous MPS K2200 of Harmony/Symphony, cooling water is
no longer necessary. The power supply is also more robust and
easier to transport and handle.
Array Shim Device - SD 2.1. 8
2.1.14
The Array Shim Device is a service and installation tool for magnet
shimming. It consists of mechanical supports, MR probes,
preamplifier, multiplexer, etc., required to measure the magnetic
field via the shim plot. As a service tool, the Array Shim Device is
not part of the delivery volume of the MR system and is brought
on-site only as required.
11
System - Overview

Gradient System
In addition to the basic magnetic field, the gradient system
generates linear dynamic magnetic field gradients in the three
room orientations for spatial encoding. The gradient system
includes the gradient amplifier and the gradient coil.
Gradient Amplifier - GPA
The gradient amplifier consists of the components necessary for
generating and regulating the gradient currents. This includes the
electronics cabinet, the power-line filter, the gradient power-supply
lines and the electronics for monitoring the temperature of the
gradient coils.
Gradient Coil - GC
The gradient coil comprises the coil systems for generating the
gradient fields, the system for cooling the coil, as well as the
sensors for temperature monitoring plus the hardware for installing
the coil in the magnet. The gradient coil also includes the
compartments for passive shimming of the magnet's main field and
the electrical shim coils for active shimming.
RF System
The RF system generates the RF fields and transmits them to the
patient (transmit function). It also receives the MR signals emitted
by the patient and provides the signals in digital format for image
reconstruction (receive system).
RF Small Signal Unit - RFSU
The RFSU converts the digital transmit signal from the control unit
to an analog signal and mixes it up to the system frequency.
Parallel to this, the RFSU converts the analog MR signals picked up
by the local coils into an intermediate frequency and digitizes them
into digital format for demodulation and filtering by the receive
2
12
2.12
hardware in the Imager.
RF Power Amplifier - RFPA 2.1.32
The RFPA amplifies the RF signal processed in the RF small signal
unit to the amplitude necessary for exciting the hydrogen nuclei
(1H). For diagnostic applications, the defining parameters are peak
2.1.21
and continuous output as well as the reproducibility of pulse
patterns, i.e., temporal stability, since these parameters represent
the prerequisite technical conditions for realizable examination
protocols and the reproducibility of examination results.
RF Application System - RFAS 2.1.3
The RFAS is a group of components whose function is to interface
2.1.2
the common RF front-end to the various transmit and receive coils.
The TAS is a switch unit responsible for directing the transmit
signal to either the Body COil or a transmit-capable Local coil. The
BCCS provides the interface components required for the circular
polarized Body coil system and includes preamplifiers when the
Body coil is used to receive. THe BTB provides the impedance
matching components required to compensate patient influences
for optimzed RF transmit energy efficiency. The TALES is an RF
RMS voltmeter responsible for measuring the forward and reflected
2.13
going RF transmit energies. These values are used as the basis for
the SAR monitoring. The LCCS acts as a switchboard for the
various RF receive channels coming from the Local or Body coils
and includes preamplifiers for the MR signals as well as a signal
combining circuit to allow combination of adjacent coil elements to
a single receive channel for increased FoVs for a limited number of
receive channels. The RF cables routed to the resonators as well as
2.1.31
the transmit lines from the filter plate to the BCCS are also part of
the RF application system.
RF Coil Interface - RFCI 2.1.34
The RFCI provides the coil control signals for dynamic de-tuning
and the the necessary operating voltages for the RF components in
the examination room.
RF Filter - RFFIL
MR examinations are performed in an RF-shielded room or cabin
which protects against external interferences and unacceptable RF
exposure. This room as well as the RF-sealed feed-throughs for the
cables are part of the RF filter panel.
Body Coil - BC
The system includes a whole body transmit/receive coil for emitting
RF to the patient for the slice excitation and also as a receive coil
for producing full FOV scout scans used normally for slice
positioning. The body coil is impedance tuned to the patient before
the start of the sequence. Manual tuning elements are found within
the coils allowing an adjustment of the coil elements for service
purposes. The Body Coil also serves as the inner cover lining of the
magnet bore.
Local Coils
Anatomically optimzed receive coils pick up the sensitively small
MR echoes and preamplify them out of the noise floor. THese
signals are transferred to the RFAS over a connector-cable system
within the Patient Table. Most Local Coils are circular polarized for
optimized signal reception and all Local coils do not require patient-
related tuning.
Spectroscopy - MKO
The spectroscopy option allows the use of different nuclei
(standard imaging uses 1H) to perform Single Voxel Spectroscopy
(SVS) and Chemical Shift Imaging (CSI). The option requires
additional hardware (broadband RFPA, SAMI) and a software
package.
Patient Handling 2.14
The Patient Handling system provides components for interaction
2.1.35
with the patient such as the patient table, lighting, ventilation and
patient monitoring. Prior to the MR examination the patient is
positioned on the table using the positioning accessories for
additional comfort. The patient is then moved into the magnet
bore. During the examination the patient is monitored accordingly,
via a video camera and or physilogical monitoring equipment.
2.1.36
Patient Table - PTAB
2.1.41
The patient table is used to position as well as move the patient
into the magnet bore. The motor-assisted table movement is
controlled via the front side control units located at the magnet.
The standard positioning support (excluding the specific positioning
supports for the local coils) as well as the patient trolley are
components of the patient table. The standard patient table is
designed for partial body applications up to 140 cm. An optional
Panaromic patient table functionality is available for automated
table movements.
2.1.37
Patient Trolley - PTROL
2.1.42
To facilitate changing patients, a removable tabletop carrier and
corresponding trolley are also provided as an option. The patient
trolley together with the removable tabletop of the patient table
allows for patient positioning outside the RF room. In the
examination room, the patient lying on the removable tabletop is
lifted onto the patient table with the help of the trolley. No
2.1.38
additional patient positioning is required.
Intercom - COM
2.1.43
Since the patient is usually alone in the examination room during
the measurements, patient and physician communicate via the
intercom. The intercom consists of the configurations necessary in
the examination room and the operating console.
13
System - Overview

Patient Monitoring - VID
Whenever required (no direct face-to-face interaction between
physician and patient, e.g. through a window), the patient is
monitored during the examination via a video camera. The set-up
consists of the camera, the monitor as well as the cabling.
System Control
System control comprises all of the system's computer functions:
• Host computer
• image reconstruction system
• measurement control
• physiological signal acquisition.
The system control is the main communications interface for the
overall system. It converts examination protocols or user input to
the corresponding control signals and transmits these signals to
the affected components via a CAN (Controller Area Network)
communications bus. It also monitors the functional status of the
various subcomponents and processes these accordingly for
system monitoring.
Host Computer - HOST
The hardware comprising the host computer includes all processor
components required for patient data management, image
handling (image display, post-processing, evaluation, hardcopy
documentation, archiving), and measurement sequence
programming. This includes all elements of the processor's user
interface, e.g. monitors, satellite console, console table, power
distribution MRC, keyboards, mouse, and data carriers, etc.
Image Reconstruction System - MRIR
The image reconstruction system computes the final images from
the digitized receive signals of the RF small signal unit. Optional
software applications also allow automated image post-processing
functions to be performed by the Imager in real-time.
2
14
2.1.4 Measurement Control - MMC 2.1.53
The Modular Measurement Control has its own processor system
which performs the RF, gradient, timing and aquisition events
described within the sequence. It also provides the hardware for
signal generation and generation of the hardware specific dynamic
control signals as well as a communications network providing the
channels for controling the peripheral components and providing
2.15
status and error feedback. The cables and power supplies
necessary for controlling, communicating with and monitoring the
peripheral components are part of the measurement controller
package.
Physiological Signal Acquisition - PMU 2.1.54
The PMU acquires the ECG signals, the pulse and respiration of the
patient and forwards it to the measurement controller. The sensors
are cableless utilizing the Blue Tooth wireless interface for
transmitting the measured signals to the base station installed in
the patient table electronics which processes the signals before
sent to the measurement controller. The PMU electronics contains
all sensors, voltage supplies as well as the cables for
communication with the measurement controller.
2.1.51
In-Room MRC 2.1.5
With the optional In -Room MRC it is possible to st art
measurements inside the examinationroom and check the images
immediately for supporting interventional tasks.
2.1.52
System Environmentals
Line Power Distribution - LPD
The line power distribution (aka. Power Distribution System - PDS)
supplies the system components with electrical power. The power
distributor ensures that the system is connected at a central point
as specified to the power-supply side of the system. The power
distributor provides the different components with individually
fuse-protected supply voltages. The main power distributor is
located in the main electronics cabinet which includes space for
installing additional components.
Cabinet Cooling System - CCS
The CCS provides cooling of the electronic components with the
CCA and GPA cabinets. The CCS comes in two versions:
• water cooled - primary water is used to provide heat
exchange of warmed air. Air conditioning of the technical
room is not necessary.
• air cooled - uses cooled air from an air conditioned
environment for the internal cabinet cooling
Cooling System
The main power-consuming components of the system are
watercooled. Cooling is performed with water at a temperature of
20°C. This keeps condensation from building up on the cooled
electronics components and eliminates the need for complicated
insulation measures, as long as basic values for temperature and
humidity are maintained.
The water can be tempered using a water cooler (chiller = external
cooler) or chilled in-house water. A regulated water-water heat
exchanger (RCA) discharges lost heat via an existing cold water
pipe network (on-site primary cold water).
2.16
System Cabling - CABLE 2.1.64
The system cabling includes all control, signal, data,
2.1.61
communications and supply cables that have to be attached to the
system during onsite installation.
Software 2.17
The software used in the MAGNETOM Harmony, Symphony and
Sonata is NUMARIS 4. This is a completely new design, with
adoptions to the hardware, especially the MMC.
Options 2.18
2.1.62
To meet the customer´s needs in an optimal way, some additional
components will be available as options. Find here the UPS, in case
the power supply is not stable for the system. Patient Monitor, Patient
Camera and Printer are already known from other MAGNETOM
systems, as well as Digital Camera . An MPS , the magnet power
supply, can be ordered separately where it is necessary. A Shim
option is available for better magnetic field homogeneity and
subsequently better image quality. Five shim coils are already part
of the gradient coil. The shim option additionally delivers the
amplifiers for these channels. They are located behind the MMC, to
be seen after swinging out the complete MMC rack.
2.1.63
15
System - Overview
 2
16

List of Abbreviations: 2.19

BPL Backplane
BR Bildrechner (image reconstruction)
System Documentation Manuals: 2.1.91
BTB Body Tune Box
DIA Diagram Manual CAN Computer Area Network

FUN Functional Description CCA Control Cabinet

INS Installation Manual (2 volumes) CCS Cabinet Cooling System

LOG Logbook Codec Compressor and Decompressor

PGD Planning Guide Deutsch CORA Cost Optimized RF Amplifier

PGE Planning Guide English COV (Magnet)-cover

TSG Trouble Shooting Guide CORE Clinically Optimized Regional Exams
CP circular polarisized
CPU Central Processing Unit
General: 2.1.92 CSE Customer Service Engineer (replaces FSE)
ABT Advanced Bipolar CMOS Technology CV Coil Voltage (in RF small signal)
ACU Air Condition Unit CW Control Word
ACT Advanced CMOS Technology DaLi Data Link
ADC Analog Digital Converter DAC Digital Analog Converter
AGP Accelerated Graphics Port DB Database
ANSI American National Standard Institute DCL Demountable Current Lead (Magnet)
AS Active shielded coil DC Direct Current Input (RF small signal)
AS39s Active shielded coil for project 039 DDR SDRAM Double Data Rate Synchronous Dynamic RAM
ASIC Application specific IC DIMM Dual In-Line Memory Modules
AVC Active Vibration Control DORA Double Resonant RF Amplifier (RFPA)
BC Body Coil DICO Directional Coupler
BCCS Body Coil Channel Selector DSL digital subscriber line
BLOB binary large object DSP Digital Signal Processor
BNC Bayonet connector named after Neil-Concelman DSV Diameter Spherical Volume
DVD Digital Versatile Disk IDE Integrated Device Equipment
DYSCON Dynamic Switch Control (Pin-diodes) IDEA integrated development environment for
ECC eddy current compensation Application
IF Intermediate Frequency
ECG electro-cardiogram
Imager Image Processor (also MRIR)
ED DSP to calculate the ECC
EFI External Field Interference IMD Intermodulation Distortion
IOP Input/Output and Power-Board
EIS External Interference Shielding
IPA Integrated Panoramic Array
EPR electronic patient record
ERDU emergency run-down unit IQ Image Quality
ISA Industrial Standard Architecture
ETL ERDU test load
ISO International Standard Organization
FOC fiber optic cable
FoV Field of View LAN Local Area Network
LC Local Coil
FBG, pcb Printed circuit board (germ: Flachbaugruppe)
LCCS Local Coil Connector Switch
FRU Field Replaceable Unit
FSC Full Scale LO Local Oscillator
LP linear polarized
FWHM Full Width at Half Maximum
LPD Line Power Distribution
GAL Generic Array Logic
GC Gradient Coil LNA Low Noise Amplifier
LVD Low Voltage Differential
GC-DSP Gradient and Controlbits-DSP
LWL Lichtwellenleiter (fiber optic cable)
GCTX Board for gradient and TX-control (also RF!)
MC Measurement Control
GPA Gradient Power Amplifier
MC4C40 p.c.b. used in the MMC with 4 DSPs TMS320C40
GPS Gradient Power Supply
GSSU Gradient Small Signal Unit MDH Measurement Data Header
MHSEL measurement hybrid select (germ: Meßhybrid-
HDCL hardwired de-mountable current lead
Select)
HF High Frequency
MMC Modular Measurement Control
HN connector type for high voltages
MOFI ASIC for Modulation/Demodulation and Filtering
ICE Image Calculation Environment
MPS Magnet Power Supply

17
System - Overview
 2
18

MPCU Measurement, Physiological and Communication PF Power Forward

Unit PIO Port In Out
MRIR MR Image Reconstruction
PLL Phase Locked Loop
MRSIG Magnetic Resonance Signal
PMS Patient Monitoring System
MRSC MR Satellite Console PMU F Physiological Monitoring Unit Frontend
MSC Measurement System Control
PPC Power PC, used in MPCU
MSU Magnet Supervision Unit
PS Power Stage (gradient system)
MSUP Magnet Supervision PS Power Supply
MWS Mantelwelle Sperre (RF Trap)
PSHIM Passive Shim
N connector type named after Paul Neill
PR Power Reflected, Power Reverse
NCO Numeric Controlled Oscillator PT Patient Table
NF Line Filter (germ: Netz Filter)
PTAB Patient Table
NOE Nuclear Overhauser Effect
PTFE Polytetraflourethelene (teflon)
NUMARIS Nuclear Medicine Acquisition and Reconstruction psia pounds per square inch absolute
Imaging Software
psig pounds per square inch gauge
OCXO Oven Controlled Crystal Oscillator
QLA quick latch - subminiatur coax RF connector
OEM Original Equipment Manufacturer
RC Resonance Converter
OMT Oxford Magnet Technology
RCA Refrigerator Cabinet
OVC Outer Vacuum Chamber
RFAS RF Application System
OR24 1.0 T magnet type for MAGNETOM Harmony
RFCI RF Cabin Interface
OR70 1.5 T magnet type for MAGNETOM Symphony
RFPA RF Power Amplifier for 42MHz, 63MHz
PAT Parallel Acquisition Technique
RFSU RF Signal Unit
PCB Printed circuit board
RFSWD Radio Frequency Safety Watchdog
PCI Peripheral Component Interconnect-Bus
ROI Region of Interest
PCIx extended PCI bus
ROPE Respiratory Ordered Phase Encoding
PCU Physiological Communication Unit
RT51 Operating system of the intelligent CAN nodes
PD Phase Detector
RX Receiver
PDS Power Distribution System
RX4 Receive board for 4 RF channels WAN Wide Area Network
SAMI Spectroscopy Amplifier Interface
SCSI Small Computer System Interface
SCRU Screening Unit (see MSUP, Magnet Supervision)
SCT Sequence Control Task
SE Spin Echo...
S/E Transmit/receive... (germ: Sende/Empfang)
SeSo Service Software^
SGA switched gain amplifier
SIPMOS Siemens Power MOSFET
SLIO Serial Linked Input Output
SPS Shim Power Supply
SSB Single Side Band
STIMO stimulation monitor
TALES Transmit Antenna Level Sensor
TAS_C Transmit Antenna Selector Circular
TiP Table plate (germ: Tischplatte)
TP Carrying plate (germ: Trägerplatte)
TRA Transmitter
TX Transmit
UPS Uninterrupted Power Supply
USB Universal Serial Bus
VCCO Voltage Controlled Ceramic Oscillator
VCXO Voltage Controlled Crystal Oscillator
VM Virtual Machine
VPN virtual private network
VxWorks Operating system of MPCU

19
System - Overview
 2
20

This page intentionally left blank.

 Section

3 Software 3

This section covers the most expensive part of the system: software. You can’t see, smell, taste or feel it, yet it is a major cause of eye,
heart, lower back and stomach diseases as well as hair-loss and impotency. Scientific studies have found, however, that approx. 0.2% of the
population is immune to the side-effects of software. Through observation of this minority group it could be proved that these individuals
exhibit typical characteristics. It is not allowed to reveal these details to the general public, but we can say this much: they like to have all
their socks in one draw and feel an affiliation to the letter "C++". If you belong to this group, we know you’ll enjoy this section. The rest of
you, wear the appropriate safety gear, exercise due caution and visit your doctor regularly.

Introduction
This description will give a general overview of the syngo MR
software and its components. The main emphasis will be the
service relevant aspects of the software. In most cases, repairing
software problems will entail either fixing a bad configuration or re-
installing software entirely. But, to satisfy curiosities, some
background knowledge of the software and what is it SUPPOSED to
do will also be presented.
Overview
Software has now become, by far, the single most expensive
component of our MR systems. It has and is being developed by
more than 300 programmers across four continents and is
continually growing in functionality, size and number of unexpected
features.
To gain our bearings, lets first define the software components
running on the system. In general, the software components
running in the system can be classified into one of three groups:
3.1
• Operating System (OS)
• Applications (syngoMR)
• Scanner Peripheral Control (CPU and FPGA loadware)
Of course, there can be no software without hardware. The
hardware components running one or more of these software
groups :
• MRC and MRSC Host
• MR Image Reconstruction MRIR (Imager)
• Scanner hardware peripheral units such as the
3.1 Measurement, Physiological & Communication Unit (MPCU)
and various low-level hardware and peripheral controllers
The software components mentioned above which require
interaction from and with the user or service engineer will be
looked at more closely, that is primarily the software running on
the Host. The Imager software is invisible to the user and generally
does not require configuration or handling and therefore will not be
covered, although some tips will be given which may help
determine whether it is running properly. The scanner software is
discussed in the Control System section.

21
Software - Introduction
 3
22

Figure 4 System Software Overview

System
Diagram
Host Imager
Software Installation

Operating Application
System Software

VA25 Win XP syngoMR

VA30 SIENIX ICEMan

Scanner

System Software

Ethernet

A
CPU DSP CAN

G
FP
System
Software VxWorks Loadware
Config
Data Loadware
Overview
These Loadware and Configuration Data components are stored locally in
FLASH or EPROM, but can be refreshed or replaced by the Host. The Software
for the CPU on the MPCU board must be downloaded by each system start.
Imager Software 3.12
Raw Data Disk F: 3.1.24

The software for the Imager as such will not be covered since there Below is the contents of drive F:. You can see that each of the four
are no service actions involving direct interaction with the Imager raw data drives contains two 4GB raw exchange buffer files. The
software. There are some issues, however, that will be mentioned other files are also spread out over the four disks. This is what
here that could be helpful when dealing with the Imager. you’ll find on it:

Next
Remote Connection 3.1.21

One of the problems faced when dealing with imager problems is

the fact that it has no monitor or keyboard which would allow a
look "inside". A method of establishing a virtual remote connection
to the Imager is possible by using the Remote Desktop program
of Host’s OS Windows XP.
Using this remote connection requires that the LAN connection to
the Imager is working and the Imager is in a condition to accept
the connection. If the Imager’s software is out to lunch, then this
procedure will not be very helpful.

Direct Connection 3.1.2

If the remote connection over the Host is not possible, then the
only other alternative to see what is going on inside the Imager is
to connect a monitor and terminal to it.
A monitor is also necessary to determine whether all the raw drives
are being recognized. The raw drives can only be seen during the
boot of the Imager.

The Q Disk 3.1.23

Imager syngo General License 3.1.25

The presence of the Q Disk MED_SYSTEM Q:\"Imager IP number"
on the Host is an indication that the communication link to the
Imager was successfully started.
Grafik: Help > Info Disks... highlight Q
The Imager uses components from the general syngo package and
therefore requires a license. The license file is located on the Host
under the directory C:/MedCom/tftp and on the Imager under
C:\MedCom\config\licensing.
The Host copies this file to the Imager. If the Imager is changed, a
new license file will need to be installed on the Host. Follow the
replacement procedures correctly!

23
Software - Introduction
 3
24

Host Software 3.13

syngo Applications 3.1.3

The Host software includes a Microsoft OS and the syngo MR ®
software applications required for setting up scan protocols, image
pos t-processing, image arc hiving functions and other
organizational tasks such as providing the imager and hardware
controllers with software during the scanner boot up procedure.
The common syngo applications are the same for all syngo
implementations accross all modalities and include the Viewing,
Filming and 3D processing functionalities.
MR Specific syngo Applications 3.1.34

The software differences between MRC and MRSC are determined

The application software developed for MR systems includes:
by the configuration after a software installation.
• Exam - image producing application

syngo® 3.1.31
• Mean Curve • BOLD
syngo is a software platform developed especially for medical • ARGUS Flow • Spectroscopy Evaluation
systems and applications and provides the basis for modality • Perf MR - Neuro Perfusion • Nero 3D - 3D Offline fMRI
specific control and applications as well as applications for a wide
range of post-processing and other radiological workflow-related
functions. syngo has a modular structure and can be divided into syngo User Interface 3.1.35

these major functional blocks (refer to Figure 5):
• the syngo Platform
• the syngo Applications
• the syngo User Interface
syngo Platform
The syngo platform utilizes a Common Software Architecture (CSA)
which provides fundamental functionalities such as basic image
processing tools, a DICOM data model, an image database and
networking capabilities.
A Patient Browser enables access to and allows one to navigate
syngo provides a user friendly graphical interface providing a
common interface across all modalities, workstations, radiological
and clinical information systems implementing the syngo software.
The syngo software together with the MR specific application
packages is called syngo MR software
3.1.32
Much of the software just mentioned can be configured and
adapted to the workflow requirements and personal preferences.
This will be discussed throughout this section.
Scanner Software 3.14

through the patient Database. Images in the database can be sent,

exported and imported to and from remote network nodes or local The downloading of the scanner software is described in the
mass storage media. The Patient Browser is configurable to adapt CONTROL section.
to individual workflow preferences.
Figure 5 Host Software Overview

Main
Host Software Overview Host
Diagram

syng
o Us
er Inte
r face
Viewing
Exam

Filming

3D engine

Mean Curve
ARGUS

syng
o Pl Task Patient Exam *
atfo
rm Protocols*
Cards Browser Explorer

O pe
ratin
g Sy
stem
DICOM Database Transfer
...

Options
3D Vessel
Spectro.

Perfusion

System Configuration SeSo

Bold

Manager
syng
...

o an
d
App MR rel Help SRS
licat a
ions ted
* Not available on MRSC

25
Software - Introduction
 3
26

syngo MR 3.2
Figure 6 syngo MR Task Cards

Task Cards 3.21

Task Cards
Back

The syngo and syngoMR Applications are loaded onto Task Cards
(see Figure 6) which are automatically started when the Host is
booted or can be started manually.
Exam
The arrangement of the task cards reflects routine workflow in the A standard task card, developed by
hospital or practice and their layout supports the examination the MR business unit.
procedure.
Task Cards which are produced by the syngo software factory and
available on all syngo-based modalities are : Viewing
A standard task card, developed by
• Viewing • Filming • 3D (option) the syngo developers.

The Filming Task Card will only be loaded after a DICOM camera
has been configured. If a DICOM camera is not physically available,
it is possible to configure a dummy camera in order to get the Filming
Filming Task Card. This task card is an integral part of syngo and A standard task card, developed by
the syngo developers.
does not require additional licensing.
The 3D Task Card is an optional package requiring additional
licensing. 3D
An optional task card, developed by
syngo MR specific Task Cards
the syngo developers
3.2.1

• Exam • Argus • Bold

Optional 1
• Mean Curve • Spectroscopy • 3D Vessel View An optional task card, developed by
• Perfusion Task Cards in orange are optional the MR business unit.

The Exam Task Card is used to define and run MR examinations

and is only available on the MRC. All other MR specific task cards Optional 2
are optional and will require additional licenses to be enabled. An optional task card, developed by
the MR business unit.
Licensing 3.2.12

The 3D optional Task Card and optional software application

packages require licenses before they can be used. Licenses must
be ordered explicitly for the MRC or MRSC. A license issued for the
MRC will not run on the MRSC or vice versa.
Licenses can only be ordered from either the Licensing Center in
Forchheim, Germany or from your Uptime Service Center or
Regional Service Center in your country or time zone.

Task Card Menus 3.2.13

Patient Browser menu

Viewing Task Card menu bar

Filming Task Card menu bar

Although all the functions and commands found under these menus
are described in very minute detail in the Operators manual (print
number MR-05000.621.01) there are several functions that are
useful to know for Service engineers and will be discussed here :
• The Patient Browser • The System Menu
• The Transfer Menu • The Configuration Menu
• The Exam Explorer

27
Software - syngo MR
 3
28

The Patient Browser 3.2

reached their final destination and can now be deleted from the
modalities database to free up room for further images. The local
database should only be considered a t e m p o r a r y storage.
Overview 3.2.21

If the "Confirm Deletion" switch has been enabled, the software

The Patient Browser is a user interface for displaying patient
images stored on either the local patient database or stored on
external mass media (CD, DVD). The Patient Browser can also be
used to import and export images in the local database to and from
CD/DVD as well as initiating image transfers over a DICOM network
connection. These functions are described in the Image Transfer
section below.
Configuring the Patient Browser
The Patient Browser can be configured for numerous display
options, such as selecting to display the images in either a "tree"
will display a window when the user attempts to delete images
whose appropriate flags as set in the "Permit Delete" section
have not been set.
The "Show Work Status" section selects which work status flags
will be displayed in the Patient Browser, as shown in Figure 7.
THese flags are primarily grouped into "Reporting Workflow" and
Archiving Workflow". The Reporting workflow flags are set with
buttons on the Patient Browser. The Archiving flags are set
3.2.2
automatically by the software. More on this can be found in the
Image Transfer section below.
Image Protection Flags 3.2 2. 3

mode graphically or "list" form as a text list. It can also be

configured to display various patient and/or scanner information
and parameters as well as the Work Status flags, which is
described below.
In order to prevent unintentional deletion of patient images there is
a built-in protection mechanism using work status flags. Printed,
Archived, Sent and Received are set by the software automatically.

Opening the Configuration Mask

The work status flags are shown in the tree view of the patient
3.2 .21

The configuration mask for the Patient Browser is started under the
Options > Configuration menu. The window appearing will look
much like the Windows Control Panel, having several icons for the
various configurable entities. Under them you will find the Patient
Browser. Clicking it will call up the Browser configuration mask.
browser automatically. Additionally it can be configured, which of
the flags are displayed in the tree view and the list view of the
patient browser.

Setting Work Status Flags 3.2 .2

Figure 7 shows the top half of the General configuration mask with
the various Work Status flags that can be configured. The Work
Status flags serve to support the work flow of the imaging process.
Once images have been created, the will not stay indefinitely on
the modality, but will be printed, sent to an archive device or
archived locally to mass storage media. Flags can be set according
to the user’s work flow. Once images have been printed or sent to
archive, the flags are used to indicate that the images have
Figure 7 Work Status Flags

Work Status Flags Back

Browser C onfiguration Patient Browser

General

Confirm Deletion
Auto-update
on open Window

Completed

Committed

Committed
Archived +

Archived +

Received
Exported
Archived
Verified

Verified
Printed

History
Sent +
Read

Sent
Shown work status
Permit delete if

Completed Verified Read

Completed /com/ / / / /
Delete permission is not fulfilled for
Read /rea/ / / / /
Patient Argus Heart Reporting
Study Heart function Workflow Verified /ver/ / / / /
Series Archiving Printed / /P/ / / / / /p/ / / /
Instance Workflow
Archived / / /A/ / / / / /a/ / /
Missing states: Printed, Sent, Archived Archived + / / /AV/ / /
Would you like to delete anyway? Verified
Archived + / / /AC/ / /
Committed
Sent / / / / /S/ / / / / /s/
Sent + / / / / /SC/
Committed
Items checked under “Show work status” (highlighted in yellow)
will be displayed in the Patient Browser. The corresponding work Exported / / / /E/ / / / / /e/ /
status flags that will be displayed is shown in the yellow boxes
Received R/ / / / / / r/ / / / / /
above.
History / / / / / /H

29
Software - syngo MR
 3
30

Image Transfer 3.23

Work Status Flags 3.2.31

Transferring images to mass media or remote network nodes is Command Description Flag
performed via commands located under the Transfer menu found set
on the Viewing Task card or the Patient Browser. Used to archive images to the local CD ROM. The
Archive to CD burner is configured as an archive device A
CD-R during the software installation.
Figure 8 Transfer Menu
Used to archive data to computer systems over
the network which have been configured as a
Archive to A
Back DICOM archive node. When selected, a dialog box
opens with a list of the available archive nodes.

Send to Allows sending images over the network. S

Used to burn images in DICOM format to a CD-
Export to ROM, even if the DC ROM is not configured as an E
archive device.
If an import / export directory is configured in the
service software configuration the Import from
Off-line can be used to import patient data in
Import from DICOM format from this directory into the local
R
Off-line database. The import / export directory can be
defined as an internal directory at the own host or
as a remote directory shared at any other network
computer.
If an import / export directory has been
configured, this command can be used to export
Export to patient data in DICOM format to this directory.
none
Off-line The import / export directory can be defined as an
local directory or as a remote directory shared at
any other network computer.

The Flags that are set will only be displayed within the Patient
Browser if they have been set to be displayed which is described
under the Setting Work Status flags section on page 29.

There are several commands found under the Transfer menu to

allow transfer of images to other network nodes or mass storage
media. These are described in the following table.
Exam Explorer 3.24 Figure 9 Exam Explorer

The Exam Explorer is a program to view and manage

the examination protocols using a graphical interface, Exam Explorer Back

a la Microsoft’s Windows Explorer. With the Exam Protocol Tree Structure

Explorer it is possible copy or move protocols
between Regions, Exams and Programs using the
same drag and drop techniques know from the Microsoft Windows
operating system. Right-clicking the protocol brings up a context
menu providing commands to modify, rename, copy or delete
protocols.
SIEMENS
The Exam explorer can be opened from the Exam task card by
either select View > Exam Explorer from the main menu or via Region

the icon show above. Exam

Program
1 Protocol

The Protocol Trees 3.2.41

USERS
Protocols are found under two main groups: SIEMENS and USER.
The protocols located under the SIEMENS tree are factory defaults
and read only, they cannot be modified. The USER programs can be
modified and are used by the customers for their examinations.
Region
Protocols are organized within a strict hierarchy as shown in Figure
9. The top level consists of Regions. Regions correspond to the Exams
Protocols
anatomical region to be examined. Regions consist of Exams,
Programs
which in turn contain Programs which are a grouping of
Protocols.

31
Software - syngo MR

Protocol Management
A New Begin
After installing and configuring software during a new system
installation all the default SIEMENS protocols are copied to the
USER tree (refer to Figure 10). At the moment, this is
accomplished by starting the executable file
C:\medcom\bin\MRExamDbTool.exe and performing the "Copy
SIEMENS to USER tree" function. This simply copies the delivered
Siemens protocols to a customer directory. The Siemens default
protocols cannot be modified.
Backup of Protocols
After a new installation, application specialists will visit the
customer for training and to help the customer optimize the
protocols for the applications they will be using. Also, the
customers themselves will probably modify and save protocols in
the User tree as time goes on. Although it is part of the yearly
preventative maintenance to make a Backup of the customer
protocols it would, however, be a good idea to do this immediately
after the application specialists have made their visit and another
one or two months later since the customer will probably make
many protocol modifications themselves.
The N4Customer package in the Backup and Restore tool in SeSo
is used to make a backup of the customer (User) protocols. This
Backup routine performs a COMPLETE backup of ALL protocols
under the USER tree. That is, all standard (default) protocols that
were originally copied from the SIEMENS tree as well as protocols
that were copied or modified by application specialist and/or the
customer afterwards. The archive flag (see below) plays no role in
this Backup routine.
The Archive Flag
When the standard (default) Siemens protocols are modified in any
3
32
3.25
way and saved, an archive flag will be set. The purpose of the
archive flag is somewhat confusing and so will be explained. Unlike
the archive flag known under Windows and other operating
3.2.51 systems, the protocol archive flag is not used to make a delta copy
of modified protocols since the last backup. This flag is only
evaluated when protocols backed up from an earlier software
version are to be restored to a system that has been updated with
a newer software version (see below).
Restoring Protocols 3.2.54
When restoring protocols after a software re-installation or
software update (new software version) the User tree will have all
the protocols it had when the Backup was made. So far, so good.
3.2.52
If, however, a Restore is to be made because the customer
accidently deleted one or more protocols, keep in mind, that a
Restore simply restores EVERYTHING, including those protocols
that were not deleted or lost. In this case, the protocols in the
backup having the same names as those in the User tree will be
restored but given the extension 001. All of these protocols are
now doubled! Inform your customer about this.
When the time comes to install a new software version or update,
normally new and improved protocols will be included. Of course
the customer will want to keep the optimized protocols from the
previous version so a Restore of the protocols from the previous
version will be made to the new software version. As mentioned
above, only the protocols with the Archive flag set will be converted
and restored. Standard protocols not having the archive flag set
are not restored if there is a newer version.
If the customer decides it wants to keep the old protocols, then
someone (?) will have to MANUALLY set the archive flag for EVERY
protocol. We now have a similar situation as mentioned above:
many of the protocols in the old and new versions will have the
same name and when a Restore of the old protocols is made to the
3.2.53
new version you will have many protocols doubled. The old ones
will have the extension 001 as mentioned above.
Figure 10 Protocol Backup Flowchart

Back
of Protocols

New
Software Software New Software
Installation Re-installation Version

Siemens Siemens
It is not necessary to
copy the SIEMENS tree new!
to the User tree if a
new!
backup exists. If you
do, the Siemens
protocols in the backup
set will be restored and
C:\medcom\bin\MRExamDbTool.exe: given the extension
Copy SIEMENS to USER tree 001.

User Apps optimization of protocols, User User User

customer changes of protocols
Archive
Flag
Archive flags will be set
automatically when modified.

Backup - N4Customer Restore Restore

Only protocols from older sftwr

ALL protocols in the USER versions with the Archive flag set
tree are backed up, whether will be converted and included in
the Archive flag is set or not. the new USER tree.

33
Software - syngo MR
 3
34

Options > System Manager 3.26

Image Reconstruction System Card 3.2.62

The System Manager provides status information of the Host, The Image Reconstruction System card displays the applications
Imager and MR scanner. It is invoked over the menu: System > running on the Imager. From here you can reboot the imager
Control. hardware or attempt to restart the application servers. Use this
only if you are feeling lucky.

Host Card 3.2.61

The System Manager / Host card displays the status of the loaded
applications. The Exam-Task, Viewing-Task, Filming-Task and the
3D-Task are normally running (green arrow up). Optional tasks
which are not loaded are marked with a red arrow down.
Applications which are hanging and not responding can be closed
and restarted without having to shut down syngo MR or the
operating system. It may work. But then again, it may not.
MR Scanner Card 3.2.63
The state information is displayed for all monitored hardware
components (i.e., have CAN components (SLIOs or Modules) or
CPUs) within the MR scanner. These are listed under "Component
Name". The current status of the components (OK, Not OK) is
shown in the State column. The State flag here indicates that all
conditions required for an "OK" state have been met, i.e., no errors
or faults occurred or is in an undefined state. The list is updated
automatically. During the reboot phase, the message "The Scanner
is not online" will be displayed. When all scanner components are
up and running "MR scanner is ready" is displayed.
The System On and Stand By buttons can be used to turn the
scanner components on and off. The Reboot function is necessary
to reset the NOT OK state if an error occurred.
Tools Card 3.2.64
The Tools card is used to acquire diagnostic information or check
important system files. If a software error occurs during scanning,
it is recommended to create a MrSaveLog file immediately. It
contains valuable diagnostic information valid at the time the error
occurred. It is stored in the C:\MedCom\MriDiagnostic folder as a
ZIP file.
The MR Consistency-Checker checks the system files for changes
every time the system boots. The result is saved in a log file. You
can view the content of this file in the Support & Diagnostic Tools
window by clicking the View Consistency Log button.
CAUTION Never install additional software on the system.
Doing so could replace existing system files and
corrupt the scanner software.
35
Software - syngo MR
 3
36

Options > Configuration 3.27 Figure 11 Regional Settings

Regional Settings 3.2.71

Regional Settings Configuration Back

The user interface language and the keyboard settings can be

Options / Configuration
configured under Options > Configuration > Regional Settings.
The language selection made here in the Regional Settings menu
applies only for the Task Card menus, user interfaces and all fields
(depicted by the areas in red in Figure 11) within pop-up windows
as well as for the application online help.

NOTE An exception is the Service Software interfaces which UI language Keyboard

are available only in the english language.

The language of the data displayed within the white fields in the
Patient Browser and Patient Registration UIs is determined by the
DICOM Character Set.

Setting up the time, including the daylight saving time, is discussed

in Service Software.
Help > Info 3.28
System Card 3.2.82

syngo MR also displays information about your scanner system.
This includes information regarding memory capacity and
availability. Select the menu Help > Info menu item.
General Card 3.2.81
The System card provides further information about the scanner
system. Here you will find information about hardware and
software options installed as well as the available coils.
Also, the expiration date (if applicable) of software option licenses
are shown.

General system information is required, e.g. when a customer

contacts Siemens Service regarding problems. Problems can be
solved more quickly if we know the serial number of the system
and the software version.

37
Software - syngo MR
 3
38

Disk/Database Card 3.2.83 Network Card 3.2.84

The Disk list displays all physical and logical (network) drives as
well as their capacities and available space, expressed in MB and
number of images.
All local databases are listed under Database. You are also shown
how many images can still be stored in each matrix.
If your console or satellite console is connected to a network, you
may view network-specific information on the Network card such
as the node names (computer names) and IP addresses.

The following information is displayed:

• Name of the database
• Number of images 256 x 256 matrix images that can still be
stored
• Number of images 512 x 512 matrix images that can still be
stored
• Number of raw data sets that can still be stored
DICOM 3.
DICOM at MRC and MRSC 3.3.13

Digital Imaging and Communication in Medicine
Overview
This section provides some general DICOM information as it
pertains to syngo MR. Detailed information about DICOM can be
found any and everywhere else. The most comprehensive source of
DICOM materials within the organization will be found at the
Connectivity Competence Center (CCC) intrAnet page.
DICOM Services
If the MRSC has been configured to share the database with the
MRC, the transfer of images between the two units is NOT in the
DICOM format but the native format of the Versant database. If the
MRSC has been configured to have its own Local database,
3.31
communication of images between the two units is performed
using the DICOM protocol. In this case, both units must be properly
configured for DICOM.
The DICOM Conformance Statements should be referred to for
detailed information on the DICOM implementation i.e., which
DICOM services and objects are supported as well as useful
configuration information. The DICOM Conformance Statements
can be found on the Siemens Intra- and Internet pages.
3. .1

DICOM provides several services which allows communication with

other remote network devices for the purpose of sending, receiving
images or other DICOM objects, reporting actual examination
progress status and performed procedures (examinations, etc.),
archiving images or other objects to mass storage media (CD,
DVD, MOD) and also for printing hardcopy images to film. All of
these services are described and standardized by the DICOM
protocol.

Implemented DICOM Services 3. .12

The following DICOM services have been implemented in the

current version of syngo MR:
• Storage
• Storage Commitment
• Query/Retrieve
• Basic Print
• Basic Worklist
• Modality Performed Procedure Step
• Media Storage (CD, MOD and DVD)
These services allow for a full integration of this Magnetom system
into any radiological workflow scheme.

39
Software - DICOM
 3
40

Figure 12 Overview of DICOM Services

Back

A Radiological Workflow based on DICOM Services

Study Aquisition Postprocessing Archive

Basic
RIS Worklist Scanner Workstation Storage / Archive
Query / Storage
Retrieve Commitment
Performed
Procedures

Media
Basic Print Storage

DICOM
Configuration

Character Set Printer Media

Network Nodes

Print Devices
DICOM Configuration
Overview
The DICOM services of both the local and remote DICOM nodes are
configured under the Service Software (SeSo) configuration tool.
There are currently seven DICOM configuration pages :
• General
• Character Set (see Figure 13)
• Offline Devices
• Network Nodes (see Figure 14)
• Print Devices (see Figure 15)
• HC Overview LUT Files
• HIS/RIS Nodes
General
This mask provides several DICOM communication parameter
settings such as local AE titles, maximum number of associations
(simultaneous connections), protocol data unit sizes and time-outs.
These parameters are usually set to default values, but have been
provided to allow for "fine tuning" of DICOM communications to
equipment with older DICOM implementations.
Character Set
The DICOM Character Set mask allows you to determine the
character set which will be used for locally created objects, such as
patient records created using the local patient registration and
images created by the scanner (see Figure 13). Syngo, however, is
capable of displaying all character sets for objects created by
equipment using other character sets as those used in countries
with latin characters sets. So, for example, if images created by a
system in Japan using the Japanese character set where to be
imported onto a system in EUrope, the Japanese characters would
3.32
be properly displayed (not that it would do you any good...).
The DICOM character set is not to be confused with the fonts usage
by the Windows XP operating system. syngo is a program running
3. .21
under the Windows OS, so the text in the menus and program
fields will use the character set and language as defined in the
"Regional Settings".
Currently three DICOM character sets are available.
• ISO-IR6: 7Bit ASCII e.g. for the US
• ISO-IR100: 8Bit ASCII e.g. Latin1
includes special characters such as ä,ö,ü,ß, œ, é, ê and other
strange characters used in many foreign languages.
• ISO-IR13: Japanese character set
Look at the online help for the selection of "multiple character
sets". The selected character set will be written in the image
header as DICOM attribute 0008, 0005.
If a Radiological Information System (RIS) or Hospital Information
System (HIS) uses a different character set for patient registration,
3. .2
the character set of the worklists will be taken over so that the
patient records and images created by the modality will use that
character set. The local character set setting will be over-ridden.
This behavior is true for patient registration only.
Offline Devices 3.3.24
3. .23
This mask provides the configuration of the local mass storage
devices such as CD, floppies (!!!) and the older MOD optical drives.
DVDs will be supported soon. Real soon.
41
Software - DICOM
 3
42

Figure 13 DICOM Character Set

Back

DICOM Character Set Scanner

Image

t?
Se
RIS

ra
MWL

Ch
0
Local

10
R
Database

_I
Register

O
IS

t?
Patient

Se
Registration

ra
Ch
The character set of
the imported objects
will be used

Defines the character set which will be

used when a new patient record or
image is created on the local system.

All character sets will be displayed

Service Configuration
DICOM default character set

allow only one character set

allow multiple character sets

Latin Alphabet No. 1

ISO_IR 100
Lang. Char. Set
ISO_IR 6 ASCII ISO-IR6
ISO_IR 100 ANSI ISO-IR100
ISO_IR 13 Japan ISO-IR13
Network Nodes 3. .25

Figure 14 Configuration masks for DICOM nodes

Back

43
Software - DICOM
 3
44

Print Devices 3. .26

Figure 15 Configuration masks for DICOM cameras

.

Page 1
Back

Page 2

Page 3
Database
The database used by syngo has been structured to accommodate
both local storage of patient images and the transferring of patient
images and records to remote DICOM nodes. The database has
built-in translators for translating native database records into the
DICOM format and vice versa.
Overview 3.41
The database structure is seen in Figure 16. It consists of four
individual databases:
• the local database (indigenous - native - inherent)
• the scheduler
• the archive
• the exchange board
Database Structure 3.42
The Local database (D:\Database\Local) is the main database
containing the image header records as well as pointers to the
actual pixel files stored on drive "E".
Entries in the Scheduler database (D:\Database\SchedulerStore)
can be created by the pre-register dialog in the Patient Registration
window or are retrieved from a HIS/RIS system via the DICOM
Worklist service. These records are only temporary and will be
transferred to the Local database as soon as the patien t
examination is begun. Therefore, the records in this database have
no images and no pointers to drive "E".
The Archive database (D:\Database\ArchiveStore) is used as an
Input/Output interface of the Local database to external mass
media storage devices (CD, DVD, etc.).
When images in the Local database are to be written to mass
media, a list of the images to be written is created which contains
only pointers to the images in the Local database. The archive
procedure takes the image records from the Local database,
3.4
combines it with the pixel data to create DICOM files and writes
them to the chosen mass storage device (which, by the way, must
be p r o p e r l y configured in the Service Software). When the
procedure is finished, the entries in the archive store database are
deleted.
The archive store database is also used to import images from a
CD to the Local database. If the CD has a DICOM format, it will be
automatically mounted and the contents (DICOMDIR) displayed.
With the "Transfer > Import" command the image headers can be
imported into the local database and the pixel data are imported to
the pixel drive "E".
The Exchange Board database (D:\Database\Exchangeboard) is
an Input/Output interface to a network connection. When
transferring images over a network connection, the header
information and the pixel data is combined to produce a DICOM file
and placed in the exchange board database from where it can be
sent over the network. Also film jobs are placed in the exchange
board database. After a film job is finished the last X number of
film jobs are kept in the job list, where X is set in the "Print
Devices" section of the configuration . This allows to restart a job in
case of film jams or any other printer problems occur. When
images are displayed for evaluation the relevant information of
manipulations is stored in the exchange board database as well.
NOTE The host name is part of the image information in the
local database. Therefore all images have to be archived
and deleted on the local database before the host name
is changed!
45
Software - Database
 3
46

Figure 16 Database Structure

Database Structure Back

Local Query
Database

Local
Database Translation

Pre-register

Scheduler Basic Worklist

DICOM Network
Local Job Status (CTRL L)
Import

Archive Export

Local
Network Job Status (CTRL N)

Storage / Print
DICOM

Exchange Retrieve
Remote
Physical Arrangement of Database 3.43 Figure 17 Database Overview

Figure 17 shows the physical arrangement of the databases in

respect to hardware devices, namely disk drives and CD recorders Physical Arrangement Next
or DVD drives.
of the Database
MRC Database 3.4.31

On the MRC the database is distributed over two hard drives

Local
• drive "D" (disk 1) is used for the databases. Local database,
MRC MRSC
scheduler store, archive store and exchange board,
• drive "E" (disk 2) is used to store pixel data only, Scheduler

Database Translation

Database Translation
MRSC Database 3.4.32

Archive Archive
The MRSC uses two hard disks only:

• drive "C" (disk 0) is used as system software disk,

• drive "D" (disk 1) is used for the databases. Here just the Exchange Exchange
archive store and exchange board databases are available,

DICOM

DICOM
physical
• drive "S" (CD-R) is used to store patient data on CD-ROMs

logical
and
• drive "R" (DVD-ROM) is used to import patient data into the
database.
There are two different database configurations possible for the #0 C:\ system (Win XP, #0 C:\ system (Win XP,
MRSC. It can be configured to operate as a satellite of the database syngo MR) syngo MR)
running on the MRC Host or set up to operate as a stand-alone #1 D:\ database & Image #1 D:\ temporary database
database. headers queues only
These two configurations are described on the following pages. #2 E:\ pixel (image pixels) S:\ CD Recorder

* DVD -R recorder
S:\ CD Recorder
R:\ DVD
* DVD -R recorder
R:\ DVD
* Systems with R630 or newer
and supported with VB27
onwards

47
Software - Database
 3
48

Shared (Remote) Database 3.4.3

If the MRSC is configured to share the MRC database, there will be

only two databases present on the MRSC:
• archive store database (D:\Database\ArchiveStore)
• exchange board database (D:\Database\Exchangeboard)

In this configuration, the MRSC shares the Local database and the
Scheduler database of the MRC Host database. Data transferred
between the MRC database and the MRSC are NOT in DICOM
format, but in the native Versant format. This has the benefit that
images pulled from the MRC database do not have to be converted
into DICOM first before being transferred. Another benefit in this
configuration is, there is only one copy of images. The results of
post-process operations performed on images are stored directly to
the MRC database. There is also only ONE set of images and thus
no extra care has to be taken that images are actual and up-to-
date.

Setup of the MRC 3.43.31

The Console Options under the SeSo / Configuration / Local Host to

be set to "Has satellite consoles" to indicate that a satellite will be
accessing its database. The database index is set to zero
automatically

Setup of the MRSC: 3.43.32

- the "remote database" option must be set

- the database offset value set to 100

It is absolutely important to set up different database index values

for the MRC and MRSC. It has to do with the way the databases
communicate between themselves.
Figure 18 MRSC Database Configurations

Shared Database Next

MRSC
MRC
SeSo / Configuration / Local Host - Console Options SeSo / Configuration / Local Host - Console Type

Console Options Has satellite consoles Console Type Satellite Console

SeSo / Configuration / Database - MRC + MRSC SeSo / Configuration / Database - MRSC

Database Properties Database Type Local Database

Database Offset of local DB 0 Remote Database

Satellite console Database Properties

Database Offset of local DB 100

Select satellite console define new Add Del
For multiple satellite consoles please set the offset values with proper spacing
e.g. 100 for the first console and 200 for the second
Host Name mrsc Find Test Main console

Select main console define new Add Del

TCP/IP address 192 168 3 16

User Host Name mrc Find Test

Account meduser TCP/IP address 192 168 3 15

User
Password ******* Confirm *******
Account meduser
You must use identical account and password on satellite and main console
Password ******* Confirm *******

You must use identical account and password on satellite and main console

Local
Preregister
Scheduler

Archive Archive

Exchange Exchange

49
Software - Database
 3
50

Stand Alone (Local) Database 3.4.34

The second possibility is to configure the MRSC so that it has its

own database. This configuration practically turns the MRSC into a
workstation, much like a LEONARDO viewing station. In this case
there will be four databases at the MRSC:
• local database (D:\Database\Local)
• scheduler store database (D:\Database\SchedulerStore)
• archive store database (D:\Database\ArchiveStore)
• exchange board database (D:\Database\Exchangeboard)

Setup of the MRC 3.43.41

If the MRSC is being set up with a stand-alone database, then the

MRC must be configured to "Has no satellite consoles" under SeSo
/ Configuration / Local Host / Console Options.

Setup of the MRSC 3.43.42

The MRSC will be configured as a "Satellite Console" in the

c o n f i g u ra t i o n a n d th e d a t a b a s e i n d e x w i l l b e s et t o ze r o
automatically.
Of course, now that the MRSC is effect just another DICOM node, it
has to be configured as a DICOM node on the MRC and vice versa.

NOTE If the satellite console is configured as a workstation,

images transferred between the MRC and MRSC will be
made using DICOM. In this scenario the use of work and
status flags needs to be considered.
Figure 19 MRSC Database as Stand-Alone

Stand-Alone Database Next

MRSC
MRC
SeSo / Configuration / Local Host - Console Options SeSo / Configuration / Local Host - Console Type

Console Options Has no satellite consoles Console Type Satellite Console

SeSo / Configuration / Database - MRSC

Database Type Local Database

Remote Database

Database Properties

Database Offset of local DB 0

Satellite console

Select satellite console

nt
define new Add Del

Host Name

rta Find Test

TCP/IP address

po
m
User

t i
Account

noPassword Confirm

You must use identical account and password on satellite and main console

Local Local

Scheduler Scheduler

Archive Archive

Exchange Exchange

51
Software - Database
 3
52

Database Repair 3.4

Image Protection 3.4.51

The image header and image pixel data are stored on separate
disks, thus if one of the disks goes bad the whole database is
damaged. For this reason, there is NO database repair tool.
Due to the structure of the database, there are dependencies
between the Local and Scheduler databases so that if one of them
becomes corrupt it will be necessary to recreate them both.
Therefore, repairing the database involves deleting the defective
one and creating a new one. This procedure is described in the
TSG.
Exchange Database Repair
Due to the problematic of transferring DICOM data and print jobs
over a network connection it can happen that the Exchange Board
gets "stuck". It is now possible to delete this database part
s e p a rat e l y. T h i s i s p e r f or m e d b y s t a r t i n g t h e b a t c h f i l e :
C:medcom\utils\ExchbRemove_MR.bat. After deleting this
In order to prevent unintentional deletion of patient images there is
a built-in protection mechanism using work status flags. Printed,
Archived, Sent and Received are set by the software automatically.
The flags Completed, Read and Verified can be set by the operator
himself. Icons for doing this can be configured to be available in the
tool bar of the Patient Browser.
The work status flags are shown in the tree view of the patient
browser automatically. Additionally it can be configured, which of
the flags are displayed in the tree view and the list view of the
patient browser.
The patient browser configuration tools also allows to get a warning
3.4.41
message in case of operations not to be performed without
confirmation.
Database Status Request 3.46

database you must reboot. During the reboot, the system will There are different possibilities to check the size and status of the
recreate the Exchange Board automatically. databases.

via User Interface

Database Access 3.45
3.4 6.01

Use the main menu Help > Info and select the Disk/Database card.
The possible database access functions are shown in Figure 16.
Here you see two groups: internal accesses and external accesses. This command is available on the MRC and MRSC.

Internal access means the own Host software accesses to the MRC: the
database to import DICOM images from a CD-ROM or MOD, to
record or archive DICOM images on a CD-ROM using the CD-R via Service Software 3.4 6.02

drive, to prepare the virtual film sheet of the Filming task card, to Another way is to start the service software, select Utilities Source
register a patient or preregister a patient locally. Escape to OS and type in the command dblist and click Go.
External access means to send and receive images via DICOM These functionalities are available at the MRC and MRSC.
services storage and query / retrieve, to print images via DICOM
basic print or to preregister patients at a HIS or RIS and get that
patient data via DICOM service worklist.
Figure 20 Database Status

Back
MRC

MRSC

53
Software - Database
 3
54

Service Software (SeSo) 3.5

limited in time and must be renewed after a time period which is
determined by Siemens.

Overview 3.51
Local Access 3.5.21

After selecting Local Service in the menu Options Service and SAM password protects the different service levels which allows the
typing in the required password, the SeSo platform (shown below) access of the available features to certain persons only.
will be displayed.
Customer: The first level is accessible without password by the
Figure 21 Service Software User Interface
operator. Here only configuration parameters can be displayed.

SIEMENS Back In addition this level is used automatically if the operator selects
the Event Log in the menu Options Service Eventlog.
Home Menu Event Log Reports Documentation Help SAM also distinguishes between local access and remote access.
There is the service password only for local access which allows to
Service Software access the service software user interface without further
Training Center Erlangen limitations, since the CSE is at the system and has full control over
the system anyway.
NUMARIS/4 MR 22002

NUMARIS/4 syngo MR 2004A

Remote Access 3.5.2

If wanting to log onto a system remotely there are three modes the
*******
Configuration Tune Up Quality Assurance File & Image Tools

Test Tools Auto Report

Backup & Restore Shim
Magnet & Cooling DICOM Tests
Installation Protocol
SAM - Service Access Manager
SAM prevents or limits access to the various service functions via a
password protection. Figure 23 gives a list of the service levels and
the available service functions for each level which has its own
unique password. Services levels can be purchased from either the
customer or even third arty service organisations according to the
level of their expertise or competence. Service passwards are
local operator can select:
No Access - remote system access is denied and any pre-
Utilities
established connection will be immediately discontinued.
Limited Access - In this mode the remote connection is granted
access privileges that allow only read / look type functions e.g.
reading the Event Log, transfer images files etc.
Full Access - In this mode operator operator relinquishes control
3.52
and the remote connection is given full control over the system.
The mouse and keyboard will be locked and the screen will blocked.
In this mode the remote session can perform service tests and
system checks (QA). One limitation is no automated patient table
movements will be allowed, for obvious safety reasons.
Figure 22 Service Access Manager

Back
Syngo UI Service UI
Local Remote

SIEMENS SIEMENS
Authentication Authentication

Service Software Service Software

Training Center Erlangen Training Center Erlangen

NUMARIS/4 MR 22002 NUMARIS/4 MR 22002

Please enter password Please enter password

OK OK

Set as default Set as default

None Limited Full

Customer

Inhouse
SIEMENS
Service
Home Menu Event Log Reports Documentation Help
Password Protection
Service Software
201.1.145.111

Service Levels
Training Center Erlangen BASIC
NUMARIS/4 MR 22002 Remote Access Level is now: “limited access permanent”
NUMARIS/4 syngo MR 2004A
Service Level = 7
Service
ADVANCED
Configuration Tune Up
OK
Quality Assurance *******
File & Image Tools Access
Backup & Restore Shim Test Tools Auto Report
EXPERT Manager
Magnet & Cooling DICOM Tests Utilities

Installation Protocol

SIEMENS

55
Software - Service Software (SeSo)
 3
56

Figure 23 Service Levels

Back
Event Log 3.53
Post Filters 3.5.32

In order to understand the different possibilities which can be Several

selected in the Event Log, the following overview should be helpful.
Domain
Note there are three sources of event messages:
3.5 3.21

• the Windows OS With the Domain filter only messages from the selected message
• Remote service (SAM) source will be displayed.
• syngo MR Facility 3.5 3.2

Regardless of the source, all messages are written into the same
For the dis play fac ility Service i t depe nds on the service
Event Log.
configuration parameter "Display Service Messages" whether
service relevant Developer messages are displayed or not.
Pre-Filters 3.5.31

There is an additional pre-filter of the syngo MR messages that can

be configured in the service software (see figure below). Enabling
the "Log only Service messages" filter will block messages that are
not service relevant (this should ALWAYS be enabled). The "Display
service messages", when enabled, allows service messages to be
entered (should also ALWAYS be enabled). The "display sequence
number" will sort out the sequence of the error messages when
more than one message is created at the same time. This is very
useful since the first message is usually the one cased by the
actual error,all following are often only the result of the first.
Figure 24 syngo MR message filters

These switches are set per default in the SeSo Configuration. If

they are not set... well, we haven’t noticed any difference.

57
Software - Service Software (SeSo)
 syngo MR RDIAG Windows OS
Figure 25

Pre
Service

Filters
OS Events

Activities
Event Log
Overview of Event Log

Application Customer Security System Domain

Post
Filters

Customer Service Developer User defined NT Facility

bold normal italic Facility Mask Messages
3

Event Log Overview

Back
58
SeSo Configuration 3.54 Figure 26 SeSo Configuration Tool

When entering the SeSo / Configuration page a List of system Configuration Masks
options is displayed with corresponding check boxes that can set if Back Local Host
that option is to be configured (see Figure 26). The list of options is
Configuration Site Info
Console Type
shown on the config mask on the left side and the list of the Console Options
corresponding configuration pages on the right, with colored boxes Country Code
Main Configuration Page Life @ Your Scanner
showing the options to the corresponding configuration page(s). TCP/IP LAN
Users
Even if no options would be checked all the default configuration System MonitorType
MR
type
pages (pages in the list on without colored boxes in Figure 26) will Security
Settings
still be available and must be configured. Service
List of Mail
The following configuration masks will be discussed on the system FTP
following pages: options AutoTransfers

• Local Host - TCP/IP LAN (see Figure 27)

Eventlog
Backup/Restore
Attached to Network
• Measurement Settings (see Figure 29) Licensing
DICOM
Modem
• System Utilization (see Figure 28) General
DICOM Print Devices Character Set
Offline Devices
DICOM Offline Devices Network Nodes
Print Devices
DICOM Networking HC Overview
LUT Files
DICOM HIS/RIS HIS/RIS Nodes
Impor t /E xp or t
Image Import/Export Directories
Paper Printer EPRI
Server
EPRI External Devices
Paper Printer
System Management PS LUT Files
System Mgmt
Master
Agent Controls
Applications
Pat. Registration
Viewer
All configuration pages must be configured by CorRea
default with the exception of the options MPPS
Worklist Results
listed on the initial configuration page, shown
above. If the option is not checked, it will not Measu rement
System Type
appear in the configuration masks.
Meas. Settings
Avail. Coils
System Utilization
MR Statistics

59
Software - Service Software (SeSo)
 3
60

Local Hosts - TCP/IP LAN 3.5.41 Figure 27 Host Network Topology

There are two networks implemented on the MR system:
• internal: connects the MRS Host to the MR scanner Control Back
Unit and Imager.
• External: connects the MRC Host to the MRSC Host and
customer LAN MRSC or
The IP addresses of the internal syngo MR network should be Hospital LAN
192.168.2.x (as they are default). 192.168.2.1 is used by the Host,
192.168.2.2 is used by the MPCU and 192.168.2.3 is used by the
Imager. Only if these network IP addresses are used in the hospital
LAN the internal syngo MR IP addresses have to be changed.
External Network
Figure 27 shows the default network addresses and net mask for
the internal syngo MR network to communicate between the Host,
the AMC and Imager (MRIR). (192.168.1.1)

MRC
At the Host you have to configure an IP address and a net mask for
NIC1 (network interface controller 1, located on the Host 192.168.2.1
motherboard) and for NIC2 (PCI card in slot 1). NIC1 is used to Netmask:
communicate to the MRSC and hospital LAN, NIC2 is used to 255.255.255.248
communicate to the AMC and the Imager. The IP addresses and net
masks for the AMC (i.e. the MPCU) and for the Imager are loaded
Internal Network
automatically from the Host during boot of the MR scanner.

IP Conflicts 3.54.1

If there should be a conflict in the case the customer lAN is using

the same subnet, then you must change the IP address of the
MPCU. You just change the IP address for NIC2 at the Host and the
software automatically defines a new IP address for the MPCU and
192.168.2.2 192.168.2.3
for the Imager. One possibility would be to change the NIC2 IP at
the Host to 10.1.1.1 The MPCU IP will automatically be set to AMC MRIR
10.1.1.2 (next IP after 10.1.1.1) and the IP for the Imager set up
to 10.1.1.3 (second IP after 10.1.1.1). MPCU
Measurement Settings 3.5.42 Figure 29 Measurement Settings
Here you set up the MR specific measurement configuration.
Back
In the first mask the name of the MAGNETOM scanner has to be
selected.
The second mask is shown in Figure 29. Here you configure the
number of receiver channels, the gradient coil, the gradient power
amplifier, etc.
The third mask configures the coils available at your system to
show these coils in the QA platform afterwards.

System Utilization 3.5.43

In the mask MrStatistic you set up the region, the type of

institution and some more criteria and you activate the utilization
with the check box System Utilization Activated.
Figure 28 System Utilization

Back

61
Software - Service Software (SeSo)
 3
62

Backup & Restore 3.5

Running ..., now the backup file is restored at your system. While
the backup is running you get some text output and also time
stamps.
Using the Backup Tool 3.5.51

NUMARIS 4
The backup tool can be started in the service software Home menu
3.5 5.21

with the button Backup & Restore.
There are several predefined backup packages, some of the MR
specific packages are discussed here, see Using the Restore Tool.
To make a backup put in a CD-ROM into the CD-R drive, start the
service software and open the menu Backup & Restore. Then select
the Command Backup, select Drive [S] CD-R, select the right
backup package under Packages e.g., Numaris4 and click Go. In
the footer you see Backup/Restore Running ..., now the backup file
A restore of Numaris4 should be used after software re-installation
or software update only. All protocols from the user tree with and
without archive flag are backed up. Restoring Numaris4 after
software re-installation means all protocols are available again.
After a software update the protocols without archive flag are
deleted. In addition to the protocols other software parts will be
restored e.g. registry entries.
Customer Protocols 3.5 5.2

for the selected package is prepared and after a while it is burned
to the CD-ROM. While the backup is running you get some text
output and also time stamps like:
Start Backup: <day>, <data>, <time> and
A restore of a CustomerProtocols archive file should only be used if
all user protocols included in an older backup should be restored.
Note: All previous user protocols are deleted during restore!
ExamDB 3.5 5.23

End Backup: <day>, <data>, <time> Duration: <min:sec>

The customer can import and export protocols trough the Exam
After the backup has finished you see the message Ready and you Explorer and therefore this Backup package is no longer needed.
find the corresponding backup file:
<name of package>-<date>-<time>.ar
Example:
Numaris4-10-02-2004-10-11-37.ar.

Using the Restore Tool 3.5.52

The restore tool can be started in the service software Home menu
with the button Backup & Restore.
To restore, put in a backup CD-ROM into the DVD-ROM drive, start
the service software and open the menu Backup & Restore. Then
select the Command Restore, select Drive [R] DVD-ROM, select the
right backup file under Archive (e.g., Numaris4-10-02-2004-10-11-
37.ar) and under Groups select all groups or several groups or one
group only and click Go. In the footer you see Backup/Restore
Figure 30 Backup and Restore

Back
Backup & Restore

Drives
Command
Backup
Packages Backup & Restore Packages

SELECT
CustomerProtocols
Diagnostic
ExamDB
MriCVLicenseFile Customer Diagnostic ExamDB Numaris4 SW Settings
Numaris4
Security-Settings Protocols
SW-Settings02 N4Site User Configuration (Options / Configuration)
Backs up everything System specific params,
tune_up values, User Licenses
under
C:\MedCom\MriCustom hardware settings
SeSo Configuration :
er\examdb\Root. LocalHost
N4Customer Service
Same as Numaris4 - Customer protocols ExternalDevices
DICOM
N4Customer
EPRI\Server\
N4SeSoDB
Applications
QA reports Database
Shimreports TCPIP
Test Tool reports
Tune_up reports

Backup & Restore

Drives
Command
Restore
Archives

63
Software - Service Software (SeSo)

Siemens Remote Services
Overview
Siemens Remote Services, or SRS, provides several remote
services such as remote repair, diagnostics, phone support. event
monitoring and utilization management that allow our service
organization to attain higher efficiency in service delivery through
avoidance of on-site service calls as well as attaining better
planning, instruction and pre-clarification through SRS. These
benefits also translate into clear advantages to the customer. With
SRS we can help the customer to avoid system failures and
resulting down-time and even reduce repair times. The remote
technology employed by the SRS also makes future-oriented value-
added services such as online application support or optimization of
system usage through Utilization Management possible.
It is important to customers connected to SRS from the very
beginning, especially during the warranty period. This gives the
customer the opportunity to become acquainted with the
advantages of SRS services right from the start. The SRS
connection also allows us to perform more cost-effective services
internally during the warranty period.
The individual services and customer benefits of Siemens Remote
Services are being marketed through various features of our
Performance Plans service agreements. Guaranteed system
uptime, shorter response times, and application support are
currently being marketed. New modules such as Utilization
Management (regular evaluation of usage data, etc.), are already
demonstrating great potential in the pilot phase and will be
available soon. To be able to actually offer these services, and to
guarantee cost-effective service, the remote connection is
therefore a basic prerequisite for all service agreements.
One of the advantages of SRS is optimized system availability. For
example, we can realize an increase of system availability from
95% to 98% solely with SRS. Just what 3% more availability can
mean for the customer is illustrated in the following example.
3
64
3.6
Agreed service times:
250 work days with 9 hours (8:00 – 17:00) = 2250 hours
3% UPTIME = 67.5 hours (corresponds to 7.5 work days)
3.61
If one assumes an average number of exams per day at 20, then
the customer will be able to perform approximately 150 exams
with 3 percent more uptime.
The SRS solution has implemented the necessary technical and
organizational mechanisms to assure the protection of patient and
system data. This includes preventing unauthorized access (fire
w a l l s , p a s s w o r d s ) , p r o t e c t i n g d a t a d u r i n g t ra n s m i s s i o n
(encryption) and the logging of all remote activities (who, what,
where and when).
SRS not only helps on technical problems, usage-related problems
can be addressed as well. Transmitting images, for example,
ensures improved analysis and application advice. Future plans
include a remote desktop facility to allow real-time applications
help or usage-related trouble-shooting to support our customers
even faster and more effectively than before. An additional service
is Utilization Management which supports optimal of system
operation.
The routers and the cost for installing a dedicated telephone line is
assumed by Siemens. The SRS connection uses toll-free telephone
numbers so there are also no telephone costs incurred to the
customer.
SRS is mainly used by the support centers USC, TSC, HSC and
finally by the business units (BU) such as MR. The responsible
engineers will use the available SRS connections to access medical
systems via pre configured tools. Depending on the country
specific situation also CSEs can access medical systems via SRS.
Connections to SRS 3.62
Connections between the medical modalities and the SRS servers
are made using routers. Routers are intelligent devices providing
Level 3 (IP address) network communications and can be
programmed to allow or block certain IP addresses or ranges from
passing through the device. For this reason, they offer much more
security than MODEMS or other simple point-to-point
communication types. Routers also often include a built-in fire wall
so even Level 4 protection (TCP ports) is possible.
Routers, like switches, have the added advantage in that several
systems can be connected to a single router, the number only
being limited by the size of the router. Routers used for remote
connections come in different versions for use over the various
communications infrastructures available today. They are:
• ISDN a fully digital comms format found chiefly in Europe, but
also in other countries. The maximum transmit speed is 64k
bits/s.
• POTS (plain old telephone service) - a format that is available
throughout the world. Its bandwidth, however is very limited
from 36.6 to 56 k bits/s.
• DSL (Digital subscribe Line) - a relatively (2002) new comms
format that is fully digital and has high bandwidth. Max
transmit rates are in excess of 1M bit/s.
• VPN (virtual private network) - a comms format that is used
over internet connections. It enjoys the highest security and
its speed is only limited to the connection speed to the
provider.
The routers have to be configured by the Siemens Medical router
specialists, who work together with the network administrators in
the hospitals. The router must also be configured on the modality,
a procedure described in detail in the Software Installation, under
Remote Connectivity. This is a responsibility of the CSEs.
Authentication and Authorization 3.6.21
The central maintenance and dial-in platform (SRS portal) used by
the UPTIME Service Center is located on the company intranet and
cannot be accessed externally. Access requires a valid Siemens
Remote Service user ID and password.
A multi-level service domain concept defines which users are
permitted to access which systems. This means that Siemens
service engineers only access those customer systems for which
they are expressly authorized. Additionally, only those SRS
functions for which the engineer is explicitly authorized are
released. Other systems in the customer network not maintained
by Siemens Medical Solutions cannot be accessed via this platform.
Demilitarized Zone 3.6.2
To protect the Siemens intranet and that of the customer from
reciprocal problems and attacks the SRS access server, a Linux
server, is secured through a demilitarized zone (DMZ). Connections
from the Siemens service engineer to the customer system, and
vice versa, are not “put through directly.” They terminate in the
SRS access server using a reverse proxy function. This means that
a connection established from the Siemens intranet is terminated
in the SRS access server. This server then establishes the
c o n n e c t i o n t o t h e c u s t o m e r ’s s y s t e m a n d m i r r o r s t h e
communication coming from the customer back to the intranet.
The possibility of a communication between the Siemens intranet
and the customer’s network over not explicitly authorized protocols
is thereby prevented. Mirroring occurs for predefined protocols
only. This architecture is designed to prevent:
• Unauthorized access from one network to the other (e.g.,
hackers)
• Access from a third-party network (e.g., the Internet)
• Transmission of viruses or similar harmful programs from one
network to the other. In addition, we do not store any critical
data in the DMZ, in particular, customer access data.
65
Software - Siemens Remote Services
 3
66

Figure 31 SRS Access Server Structure SRS <> Modality Port Connects 3.63

SRS Portal Databases Figure 32 shows an overview of the protocols used for the various
users sites SRS functionalities such as File & Image Tools, Auto reporting,
System Utilization and other Value Added services.
Siemens intranet
How to test the ftp connection to the SRS Server is shown in the
stats images document Installation Software, section Remote Connectivity: Test
FTP login to the Remote server.
The figure below shows an overview of the SRS mail connection.

Mngr
How to test the mail connection to the SRS Server is shown in the

CA Asset Mngr
Router

Dist
Demilitarized zone
document Installation Software, section Remote Connectivity.:

CA Event

CA Sftwr
Testing connectivity from system to RDIAG server.

-
-
SRS
Firewall Acess
Server

Router

www | ISDN | POTS | VPN

Hospital/Practice Router
Figure 32 SRS Connection Protocols

Back

SRS
Server MR-System
File and Image (put)
FTP- FTP
Server Download (get) Client

Web Web

SAM
Browser Server
http

Email <Mail-Address> Email

Server & Client
Gateway Autoreport incl. attachment
smtp

67
Software - Siemens Remote Services
 3
68

Event Monitoring 3.64

these utilization reports to improve the usage of his MR scanner.
To be used, the Utilization Management has to be activated in
software under Configuration / System Utilization. Additionally an
Proactive Service 3.6.41

Autoreport template for Utilization Management has to be set up as

What does "pro-active" actually mean and how does this differ well.
from remote diagnostics?
In contrast to traditional remote diagnostics where the source of Virus Protection 3.6.52

errors must be analyzed reactively, Event-Management, enables

We’ll sell it only if the customer connects to SRS.
connected systems to be monitored continually and preventively.
Should a defined system parameter deviate from a pre-set value, a
message is automatically generated for the System Management Quality Database 3.6.53

Center. The deviation is communicated to the responsible USC,

corrected online there, or a planned service visit is scheduled. An extremely useful source of information concerning system
performance values of systems world-wide. Check it out!
Preventive online monitoring is currently employed using intelligent
software of the newest generation of syngo-based and non-syngo-
based systems and in PACS networks (CT, MR, AX, PACS, NM-PET).
The pro-active service approach and its implementation is
constantly being developed.

Magnet Monitoring 3.6.42

Magnet Monitoring via SRS provides several reports for:

• Helium/Shield Monitoring
• Helium Level Low
• Shield Temperature High
• No Data for 3 Weeks
• QDB Connectivity
• Country-Specific Connectivity

Value Added Services 3.65

Utilization Management 3.6.51

An additional service is Utilization Management which supports

optimal of system operation. Utilization Management reports are
created monthly and sent to the customer, the customer can use
Software Installation 3.7

Overview 3.71

Reloading software is described in the Installation Software syngo

MR 2004V document.
syngo MR is the name given to the complete software bundle for
the MRC Host and MRSC Hot consisting of the operating system
(Windows XP,) the general syngo software components and the MR
specific software components (NUMARIS/4).
The software bundle for the Imager consists of an operating
system (Windows or LINUX) and the MR imager specific software.

Software Reload 3.72

The software reload for the Imager is started during boot from CD-
ROM, everything else runs a u t o m a t i c a l l y. Any questions?

69
Software - Software Installation
 3
70

Figure 33 Software Installation

Installing syngo MR Software

Back

The S O F T W A R E The S O F T W A R E

Win XP syngoMR
BIOS Win XP syngo+N4

Installation

MRC MRSC Imager

- syngo license
- CV-License - syngo license *
- Service Key for Imager
Configuration

Tune-Up * only for

WinXP version

copy config data:

- site info
Restore

Restore
Backup

Backup
- DICOM config
Install Time Calculation
ncd
t install = Σ1 dt read • γ +k

where :
ncd = number of install CDs
tread = read time of each CD
Backup / - Numaris 4 γ = murphy’s constant, dependant on day of week
Restore - SW-Settings2 Mon-Thurs =1 Fri-Sun = 3
k = can be anywhere between 2 to 8 hours
 Section

4 Host / Imager 4

Introduction 4.1
Host (MRSC) 4.12

The MR satellite console (MRSC) is an option for

The Host interfaces to the MR scanner via the MPCU which also acts
as the main controlling unit for the scanner hardware. The MPCU is
located in the Advanced Measurement Control (AMC)
Although the Host and Imager components are individual
components they have been combined here in Part 4 since they
work very close together.
In addition to the MRC, there is also an optional satellite MR
console, or MRSC. Although practically the same as the MRC, it is
only intended for post-processing of images and thus may not
contain some hardware components found in the MRC. Also, there
will be some differences in the installed software since the MRSC
doesn’t require all that system control software! A description of
the main differences are given on the next page.
Host (MRC) 4.1
• image viewing
• post processing
• archiving images
The MRSC host connects to the Host MRC over an additional
ethernet switch, delivered with the MRSC option, and is required to
decouple the large volume of image data transfers from the
customer’s LAN. This network connection will be referred to as the
"outside network", or "Customer network".
The configuration of the MRSC computer is much the same as the
MRC Host with the following exceptions:
• NO hard drive pixel data (database and pixel data on one
hard disk)
• Only 1 network interface - to communicate to the MRC
• NO Moxa interface card.

The major tasks of the Host of the MRC are: Imager (MRIR - MR Image
• User Interface (syngo) Reconstruction) 4.13

• take sequence measurement parameters from user and pass

these on to the Measurement Control (AMC)
• image post-processing and image display functionalities
• archiving (mass storage, filming)
The MRC is connected to the MR system via an ethernet LAN
connection. This network connection will be referred to as the
"internal network".
The raw data coming from the MMC will be stored temporarily on
one or more pixel disks.
An Alpha- or Pentium processor performs the image reconstruction.
The Ethernet connection provides the link from/to the MRC host for
parameter downloading and uploading the image data for storage
on the MRC pixel disk.

71
Host / Imager - Introduction
 4
72

Figure 34 Host - Imager Overview

System
Alarm Box Diagram

Host & Imager

LPD
Overview

MRSC MRC Imager

Option
LAN Switch
Serial
Distributor

MMC

MPCU

LAN,
Hospital Network

Scanner
Host (MRC) 4.2
Primergy 470 Celsius 670 Celsius R610A/B

(discontinued) (discontinued)
The MR Console (MRC) and MR Satellite Console (MRSC) consist of Front-side Connections
the following components:
USB 2.0 0 0 2
• a high resolution LCD Display : output device
• keyboard and mouse: input devices Audio none none
Headphone out
Microphone in
• Host (Intel based PC) - basic model identical for both MRC
and MRSC, however, configurations are different. Rear-side Connections (see Figure 37)
Developments are rapid in the computer industry and therefore Line in (blue)
Audio none Line out (green) same
this description applies only for the current configuration of the Mic in (purple)
model implemented at the time of creation or modification of this 2x USB 2.0 4x USB 2.0 4x USB 2.0
document. Future versions of course will have faster processors, 1x IEE 1394
more memory, larger disk capacity and more software. 1x Parallel (DB-25) 1x Parallel (DB-25) 1x Parallel (DB-25)
I/O 2x PS/2 (Kybd, mouse) 2x PS/2 (Kybd, mouse) 2x PS/2 (Kybd, mouse)
1x RJ-45 LAN 1x RJ-45 LAN 1x RJ-45 LAN

Host Configurations 1x Serial (DB-9 pin) 2x Serial (DB-9 pin) 1x Serial (DB-9 pin)
4.21 1x VGA analog 1x VGA analog 1x VGA analog

The table below lists the main hardware features for the current PCI Slots
Host types. See below for information on discontinued Hosts. NIC2
1 MOXA MOXA
Intel Pro /1000MT
.
Figure 35 MR Console Hardware 2 Sound SCSI 29160N

NIC2
3
Intel Pro /1000

4 NIC1 (internal LAN) SCSI (MOD option) MOXA

5 NIC2 (external LAN)

Quadro 2 Pro or Quadro 4 980 XGL

6 SCSI (MOD option)
Elsa Gloria DCC AGP bus
R610A : empty
Celsius R610A/B 7 Matrox G200
Primergy 470 Celsius 670 R610B : SCSI Ctrl
(discontinued) (discontinued)

General
Intel P3 2x Intel Xeon 2 x Intel Xeon
CPU @ 1.7 / 2.2 GHz @ 3GHz
@ 550 / 850 MHz

Memory 2 GB (Rambus) 2 GB (2x 1GB)

73
Host / Imager - Host (MRC)
 4
74

Figure 36 Host CELSIUS 670, R610, R630

Foot Space

Imager
Main

Alarm

MPCU
Switch Mouse

Box
Diagram
MRSC or LAN, LCD
Hospital Network Display
MOD
Drive
(Option)

4 5 7

Hd p hon e
M i cr o
L i ne O ut

Graphic SCSI MOXA NIC2

P ar a l l el

Card 8x RS232 Network

M ou s e
Keyb d
port

Seria l
A udio

1Gbit
NIC1

Port

1394
Card

IE EE
U SB

MRC MRC
Rear-side Connections * * only only

RAM SCSI SCSI U320 LVD

USB

* *
Connections

* CPU CPU
Front- side

U320 LVD
PCI
A u dio

IDE
Motherboard Interface Boards

ID 0
System
C: Disk
ID 1
Host
S: R: Database
Floppy Celsius 670
D: Disk
Celsius R610
ID 2
CD-R DVD Pixel Disk
* DVD-R E: (MRC only)
Drives
* = for differences between models, see text
I/O Connection Plate 4.2 Drives 4.23

Figure 37 Host Motherboard Rear Panel The Motherboard provides four on-board drive controllers for:
• Floppy drive - is needed to install new licenses when
Primergy 470 Back purchasing additional options or to install licenses after a
software reload.
• CD Recorder (CD-R) - for image archiving and software
Parallel Ser 1 Ser 1
backups.
• DVD Recorder (DVD-R) - The R630 Hosts are configured
VGA Ser 2 Ser 2
with a DVD burner and which will also be supported with the
VB13 software.
• DVD Reader - An IDE device, the DVD-ROM drive is intended
for software installation, reloads and updates.
Celsius 670
• Hard Drives (HDD) - The drives are 16 bit SCSI U 320 (320
Parallel MB/s) LVD (Low Voltage Differential).
• MOD Drive option - is available for both the MRC and MRSC
Hosts and it is connected to the second on-board SCSI U320
Ser 1 Ser 2 LVD controller.

Disk Function Size I Bus

(GB) D Prim. 470 Cels. 670 Cel. R610
C System 36 (18/9) 0 SCSI U2W SCSI U160 SCSI U320
Celcius R610 SCA LVD LVD
D Database 36 (18/9) 1 SCSI U2W SCSI U160 SCSI U320
USB
Kybd Mouse

S/PDIF SCA LVD LVD

1394
IEEE

Parallel
Audio
E Pixel 73 (73/ 2 SCSI U2W SCSI U160 SCSI U320
LAN 36/ SCA LVD LVD
18)
Serial
R CD-ROM 5 SCSIU LVD IDE IDE
S CD-R 6 SCSIU LVD SCSI / IDE IDE
Celsius R630 F MOD (opt) 1.7 3 SCSI-2 SCSI-2 SCSI-2

LAN

75
Host / Imager - Host (MRC)
 4
76

External Devices 4.24 Host (MRSC) 4.25

The configuration of the satellite console is similar to the MRC. The

Device Description components not installed in the MRSC are marked with "MRC only"
Pioneer 1.7 GB, connected to the PCI bus of the Host via SCSI- in the block diagram shown in Figure 36:
2 interface allows importing of NUMARIS/3 and NUMARIS/3.5 • no MOXA 8 x Serial Interface
MOD images into the syngo MR database. The software defines
drive letter F: for that drive. This option is available for MRC • no Ethernet PCI card
and MRSC Hosts. • only two hard disks
A printer can be connected via the parallel port of the MRC or
Printer MRSC Host. It needs to be configured (SeSo / Configuration /
External Devices - Paper Printer
The service software and all software and hardware options
which require a license are keyed to a dongle with a unique ID.
The Dongle is connected to the right USB port at the rear side
Dongle of the Host. A separate Dongle is required for the MRC and
MRSC Host. The Dongle IDs can be read out with SeSo /
Utilities - flexid.
The headphone output and the microphone input of the Audio
Patient card at the MRC Host are connected to the Patient Intercom to
Intercom play music to the RF room and patients and for the voice
output option.
The Serial Distributor is available at the MRC Hosts only. It
Serial provides a 25 pin connector for each of these eight serial
Distributor interfaces found at the 8x Serial Interface reachable via slot 4
of the MRC Host.
This connection is used for the System Standby function. See
Alarm Box description in the LPD section.
Magellan The Magellan Space Mouse is used for real-time interactive
Space imaging.
Mouse
The Foot switch located in the RF room is used to start
Foot protocols which were already prepared at the MRC. It is also
Switch used to stop running protocols directly in the RF room.
Imager (MRIR) 4.3
Specifications 4.3.21

Celsius 460 Celsius 670 Celsius R610

Overview 4.31 CPU Pentium4 Pentium4 Pentium4
Clock 1.5 GHz 1.7/2.2 GHz 3 GHz
The task of the Imager (MRIR) is the collection of raw data and to
Cache 256/512 kB 512 kB
perform the image reconstruction.
Memory 1 or 2 GB 1 or 2 GB 1 or 2 GB
Three Imager types have been delivered: Graphics VGA VGA VGA
• Celsius 460 (Twin Tower)
• Celsius 670 (Single Tower) 1.7 and 2.2 GHz
• Celsius R610 Storage Devices 4.3.2

SCSI Size Bus

Disk Function
-ID GB Cel 460 Cel 670 Cel R610
Function 4.32 C System 0 9/18/ U160 LVD U160 LVD*3 U320 LVD
36
The digital raw data enters the PCI-Receiver via a fibre optic cable. F,G,H Pixel 1-4 9/18/ U160 SCA -"- -"-
Via DMA the raw data will be stored in the main RAM. The ,I 36
preprocessed data will be stored onto the Raw Data Disk(s) if the E CD-ROM IDE IDE IDE IDE
amount of data exceeds a certain amount (e.g. 600 MB).
After the measurement has finished, the image reconstruction will *3 other disk type than pixel disks
be performed. Depending on the sequence, this can be partially
done on the fly during the measurement.
The resulting images will be transferred via Ethernet to the pixel
disk of the MRC-Host.

Raw data will be only available for display when storage is enabled
before the measurement. The second possibility to display raw data
is a re-transformation from the images. This is always possible.

A serial communication line from the MRC to the Imager was

shipped with the older systems, but has never been used.

77
Host / Imager - Imager (MRIR)
 4
78

Figure 38 Imager (MRIR) Celsius 460

Main
Imager Overview Diagram Diagram

Celsius 460 (Twin Tower) Celsius

670

Celsius
Host

MPCU
RX_4

MMC
R610

Keyboard
& Mouse
Emulator

DB -25 p i n
D B -9p i n

Pa r all e l
S e ri a l
PS-2

Receiver

I n te rf ac e

In te r fac e
G r aph i c
NI C 1
S CS I
PCI
Motherboard
* *
CPU RAM Slot 1 Slot 3 Slot 4 Slot 6

PCI

IDE
Adapters

SCSI U2W LVD

CD-ROM
System Disk Raw Data Disks
Drives 18GB 18GB
Figure 39 Imager (MRIR) Celsius 670

Main
Imager Overview Diagram Imager Overview Diagram Diagram

Celsius 670 (Single Tower) 1,7 GHz Celsius 670 (Single Tower) 2,2 GHz Celsius
R610

Celsius
Host Host

MMC

MMC
MPCU

MPCU
RX_4 RX_4 460

Keyboard Keyboard
& Mouse & Mouse
Emulator Emulator

D B - 25 p in

DB - 25 p in
100 M b i t

1 00 M b i t
D B- 9 pin

D B- 9p in
Par a l l e l

P ar all el
S e r ial

S er ial
PS-2

P S- 2
G r a p hi c

Receiver
PCI

Int e rf ac e
NIC 1

NIC 1

2916 0N

G r a p hi c
I n t e rf a ce

SCSI
PCI
Receiver
Motherboard

Motherboard
* RAM * Slot 1 Slot 6 * RAM * Slot 1 Slot 2 Slot 6
CPU CPU
PCI PCI

AGP AGP
IDE SCSI IDE SCSI
Adapters

SCSI U160 LVD SCSI U160 LVD

CD-ROM CD-ROM
System Disk Raw Data Disks System Disk Raw Data Disks
Drives 18GB 18GB Drives 18GB 18GB

79
Host / Imager - Imager (MRIR)
 4
80

Figure 40 Imager (MRIR) Celsius R610

Main
Imager Overview Diagram Diagram

Celsius 610 Celsius

460

Celsius
Host

MMC

MPCU
RX_4 670

Keyboard
& Mouse
Emulator

D B - 25 p in
100 M b i t

D B - 9 pin

Par a l l e l
S e r ial
PS-2
PCI G r a p hi c

NIC 1
I n t e rf ac e
Receiver
Motherboard

* RAM * Slot 1 Slot 6

CPU
PCI

AGP
IDE SCSI
Adapters

SCSI U320 LVD

CD-ROM
System Disk Raw Data Disks
Drives 36GB 36GB
Keyboard / Mouse 4.3.23 Figure 41 PCI Receiver
Keyboard and mouse have to be connected temporarily, only RX4
during sw-installation and configuration. Back

NOTE The keyboard- and mouse adapter must be connected

always. It simulates keyboard and mouse, so that
V1
Windows can boot properly! Receiving
Receiver
V3 Transmission
Error
Monitor 4.3.24
V4
Overflow
The Monitor (CRT or LCD) is required only for sw-installation and
configuration. FIFO V5
Empty
The display is set for VGA (640x480). A number of LCDs SCD-
1897-M (type 2) can not be used.
V2
Bus
Bus Interrupt
Storage Devices 4.3.25
Interface
Besides the system hard drive, there are four hard drives for the
raw data buffering.
The CD-ROM - and floppy drives are used for software installation PCI - Bus Position of PCI Receiver in a Celsius towe
and -updates (Win NT and NUMARIS). (Position in the Alpha tower is upside dow

PCI Receiver 4.3.26

In the measurement mode, the raw data will be sent from the MMC v1 v5
via the Raw Link (piggy back on RX4) and the fibre optic cable to V1 V5
the PCI Receiver. Power On Test for a few seconds

Boot
The Data Receiver contains a 16 MB SDRAM, which works like a all off
FIFO and allows to buffer data.
during Win NT boot
Some LEDs indicate the functions, see Figure 41.

during Measurement (Adjustment)

during Imager test (Test Tools)

81
Host / Imager - Imager (MRIR)
 4
82

In-Room MRC 4.

The "In-Room MRC" option extends the monitor and mouse of the
MRC inside the exam room to allow the user to operate the system
in an interventional mode. A keyboard is not part of this option
since in all likely hood the Doctor’s hands are full of blood and
fleshy bits and pieces anyway.
There are two versions of the IN Room option which will be called
OLD and NEW. The diagram in Figure 42 shows the new version.
The old version can be Besides power supplies, there are only
cables for the LCD-display and the mouse connected to the
corresponding distribution box.

Function 4.41

Monitor 4. .1

The video signal to the MRC and In Room MRC monitors are
identical. The video signal from the Host is simply split and
amplified by either the Interconnect Box (new version) or a video
distributor (old version).

Mouse 4. .12

Control of the two mouses of the MRC and In Room MRC is

somewhat more complicated. As soon as one of the mouses is used,
the other is disabled. After a delay of appr. 5 seconds the other mouse
will be enabled again. THis function is also part of the Interconnect
Box of the new version or by an extra Mouse Distributor box of the
old version.
An additional (optional) display can be connected at the video
distributor. See diagrams for details
Figure 42 In-Room MRC (old)

Remote
In-Room MRC Monitor
Old version
FO
E

Video Distributor Exam Room

Input Ouput 1 Ouput 2

Out 1

LWL Outputs
R R R
In Room
Sync Sync Out 2 MRC
H G G H G H
Out 3
V B B V B V
AC AC

Mouse Multiplexer

Mouse AC

Out InRoom

Behind MRC Console Table

MRC 12V DC
Power
Supply

230V AC Z4,5
LPD

83
Host / Imager - In-Room MRC
 4
84

Figure 43 In-Room MRC (new)

In-Room MRC Remote

Monitor
New version
FO
E

Examination
Room

230V AC

Interconnet Box

DVI Z30,
12V DC Z31
PS2

FO

MRC
Video Distributor

LWL Outputs
Input Ouput 1 Ouput 2 Out 1
R R R
Sync Sync Out 2
H G G H G H Out 3

V B B V B V
AC AC
 Section

5 Control 5

You are now in the Control section of the Functional Description. It begins with an introduction to the MMC - Modular Measurement Control.
This is followed by a functional description of the software and then a description of the hardware components. You will find both text and
graphics in the descriptions. The pictures can be looked at in color (they will be shown only in black and white if printed, however). The text
can be read. Experience has shown that the maximum efficiency is achieved when combining the two.

Introduction 5.1
The Concept 5.1

The MMC hardware platform provides the computational power for

The Modular Measurement Control (MMC) is the name given the
component group responsible for exercising system and sequence
control. The MMC has two major tasks:
Sequence Control
Responsible for generating the gradient, RF and receive data
readout events (including pulse compensations necessitated by
system and site specific variables) as well as all sequence timing
signals required to generate and acquire image data in a slice or 3D
image volume. The resultant MR echoes are sampled under control
of the MMC and provided to the image processor for the final image
reconstruction.
Communications
As the system’s central intelligence unit, it has the further
responsibility to provide a communication interface to the
hardware periphery for supplying software, parameters, static
control for those requiring them and a status/error feedback path.
The industry standard CAN bus format is used for this.
running the sequences (C++ programs) in real-time and the signal
processing components in the form of DSPs to create the RF
pulses, gradient pulses (including signal compensations of
hardware and environmental variables), sequence timing signals as
well as RF SAR and gradient stimulation monitoring. Since the
advent of high-power DSP components it has been possible to
integrate the MMC components to just 5 boards allowing for a
relatively compact design. The MMC functional description has
been divided into two parts:
• Functional - describes in details the functions performed by
the MMC components.
• Hardware - describes the individual hardware components
and their tasks.

85
Control - Introduction

Functionality
In this section a description of the MMC’s functionality will be
presented. The Modular Measurement Control responsibilities can
be grouped into the following tasks:
• Scanner Software Download
• Sequence Control
• Supervision and Error Handling
• System Standby
Scanner Software Download (boot)
As seen in the Software section, there are several components
which require software. These components can be basically
grouped into two groups:
• CPUs, DSPs and FPGAs
• CAN Modules
CPUs, DSPs and FPGAs
The DSP and FPGA components on the MC4C40, MC1C40, and RX4
boards do not have, for various reasons, their software stored in
non-volatile memories. The MPCU has a boot PROM containing boot
protocols for establishing communications to the Host for
downloading its own software and the software for the other MMC
components. They have to be downloaded at each power-on or
scanner reboot.
CAN Modules
Many of the peripheral hardware units and sub-systems of the
scanner, (Gradient amplifier, RF System components, Patient Table,
etc.) have control components, either CAN Modules or CAN SLIOs,
that provide hardware control functions and a feedback path for
local monitoring. The programs for the CAN Modules are stored in
non-volatile memories - EEPROMs or Flash memory - and
programmed in the factory with the most current version. CAN
5
86
5.2
software updates delivered with newer software packages will
automatically be downloaded to the CAN Modules.
At power on, the CAN Modules software versions are checked and if
necessary (i.e., new software or parts replacement) will be updated
with actual versions. This task is performed by the MPCU. The
software modules for the scanner hardware are physically located
on the Host system disk. This process is described below and
shown in Figure 44.
MPCU Boot Procedure 5.2.13
5.21
POST 5.2 1.31
At power on, the MPCU performs an initialization and self test of its
on-board circuitry. During this test routine, the BIOS writes
progress codes, also known as POST codes, to LEDS connected on
the parallel port (X14 on the MPCU). The LEDs display these codes
in hex format.
Load Operating System 5.2 1.32
5.2.1
After the power on self-tests, the MPCU resets the other MMC
hardware components and starts the boot loader program in
EPROM. The boot loader contacts the Host and requests an IP
address and its OS. The Host responds, assuming its on and
running, and provides the MPCU with the name and location of the
requested files.
Startup Script 5.2 1.3
After the MPCU has loaded its OS, the next step is to perform a
5.2.12
start-up script. In this script all further steps are defined:
- Load and start MPCU tasks
- Boot the DSPs in MC4C40 (+MC1C40)
- Boot GCTX and RX4
- Check CAN units and load loadware if necessary
- Load parameters into CAN SLIOs
Figure 44 MMC Software Download The "start-up sc ript" executed by the MPCU contains the
instructions for downloading the software into the MMC units.
Host MPCU Scanner Status and error messages will be logged into the file
C:\Medcom\log\mpcu_startup.log . Interpretation of this file needs
reboot
detailed knowledge, but it could be helpful for support. This file will
Power on selftest selftest
scanner be overwritten by the start of the start-up scrip (e.g. with "System
/ Control, Reboot Scanner").
boot Host OS get IP addr For detailed messages of the MPCU activities another trace can be
boot OS
start network
started with System/Run -> StartMPCUTrace. Messages will be
processes boot
logged into C:\Medcom\log\MPCUTrace.log.
load VxWorks

perform Loadware 5.2.14

startup script: MC4C40 (DSPs)

download boot
[MC1C40]
PROMs are only used in the MPCU and in the intelligent CAN units.
GCTX, RX4 Loadware will be loaded into MPCU and the other units inside the
initialize
PMU PMU frontend MMC (e.g. MC4C40, [MC1C40], GCTX, RX4).
CAN units CAN units Loadware for the PMU and CAN units is initially loaded into
finished EEPROMs at the factory or during a software update. A unit will
NUMARIS only be downloaded if the version is not correct.
Y error on
Start up
?
Parameters 5.2.15

For most units parameters required for measurements will be

Load measurement MMC
parameters, request
distribute
CAN units supplied.
parameters
coil code GPA, RFPA

PALI Function Test 5.2.16

Y
error ?
A special measurement sequence will be started that should exceed
MC4C40, GCTX immediately some predefined low SAR limits for that
STIMO, PALI
Run Sequence GPA, RFPA, BCCS measurement. If is tested if the PALI can detect this problem.
functional test
TALES, RX4

Y
error ?
Indications 5.2.17

Unfortunately there are just a few indications for a loaded system:

• CLK_20 LED of the RX4 is on
Scanner NOT ready Scanner READY • All STAT LEDs on the MC4C40 are on
see Event Log for mesurement
• STAT LED on the MC1C40 is on
• RFPA_ON signal active (pull cable to check!)

87
Control - Functionality

Sequence Control
The sequence control tasks can be summarized as follows:
• RF Control
• RF Safety WatchDog (RFSWD)
• Gradient Control
• Gradient Safety WatchDog (GSWD)
• System Compensations
• Dynamic Control Signals
The sequence file is a compiled C-program, which is loaded into the
MPCU memory. In preparation for the measurement, the MPCU will
check for system readiness. If everything is ok, the SCT (Sequence
Control Task - the sequence generator program running on the
MPCU) will initiate the start of the sequence and begins feeding the
sequence information to the DSPs. During the measurement the
MPCU surveys for any error or status change from the MMC or
periphery hardware components, and in case of any errors the
sequence can be stopped and the operator informed.
RF Control
As the sequence progresses, the MPCU feeds the TX_DSP on the
MC4C40 board responsible for the generation of RF-pulses with the
corresponding requests and the RF pulse amplitudes are generated
(calculated) in real-time. The pulse generation must also include
system specific corrections and compensations such as correction
of RFPA non-linearities, B0 field correction.
Dynamic timing signals must also be provided for RF components
RFPA (unblanking), RFIS (coil detuning), RCCS (receive matrix
switching), BCCS (T/R switch) to name a few. These sequence
timing signals are generated by the PCI_TX DSPs on requests from
the MPCU.
RF Safety Watchdog (RFSWD)
The RF Safety WatchDog (RFSWD) - also called PALI: power absorption
5
88
5.2
limiter - provides patient safety monitoring by measuring the
specific absorption rate (SAR) of the RF energy being irradiated
into the patient. This energy causes warming of the patient both
locally and globally, that is, warming in the direct vicinity of the
transmitting coil and via blood circulatory a global warming of the
body results. The RFSWD must quantify the amount of heat-
causing energy being applied to the patient, calculate the
distribution of these energies throughout the body and check
irradiation limits which may have been exceeded. If any limit is
reached the RFSWD can disable the RF transmission.
The RFSWD is implemented as two independent processes:
Look-ahead Monitor 5.2 2. 1
The first is a software look-ahead monitor running on the Host
which evaluates the sequence and parameters (i.e. protocol) as
they are selected and entered by the user. If the look-ahead
monitor detects the protocol will cause excessive RF it issues
warnings to the effect and suggests new parameters to bring the
SAR under the limits. A sequence can only be loaded and started if
it will not exceed the prescribed SAR limits.
5.2.21
There are two levels of SAR limits: normal mode (NM) and first
level (FL). First level limits are higher than those of the normal
mode and may only be selected under the explicit allowance of the
user.
Online Monitor 5.2 2. 2
The second process is realized in hardware and monitors the RF in
real-time. The actual RF transmit pulses are sampled by directional
couplers located in the RF Power Amplifier and the TALES,
quantified by an ADC on the RX_Module and read in by the RX-DSP
on the MC4C40 via the RX4 board. The RFSWD program running on
the RX_DSP keeps a running tabulation of the applied RF pulses
and if limits are exceeded before the conclusion of the
measurement, the sequence will be immediately terminated. An
5.2.2 error message will inform the operator that the RF limit was
exceeded.
In case there is still outgoing RF measured in the next 1ms, the
RFPA_ON signal, will be disabled. In addition to the error message,
another pop-up window is shown instructing the operator to get the
patient out of the magnet.
Plausibility and Consistency Checks
After each sequence, the RFSWD makes a plausibility check of the
measured RF. If the measured RF values are outside some range,
the values are deemed non-realistic and an error will be generated.
Also, the calculated SAR values performed by the On-line monitor
are compared to the actual RF values measured during the
s e q u e n c e , i f t h e s e t wo val u e s d e v i a t e b y s o m e va l u e a n
"inconsistency" error will occur. Both of these error are assuming
there is anything wrong with the components used in measuring
the RF.
Gradient Control
The gradient pulses are generated in much the same way as those
for the RF. As the sequence progresses the MPCU supplies the
GC_DSP on the MC4C40 board with requests for pulse generation
of the logical slice selection, read-out and phase encoding
gradients. A rotation matrix is then sent so the GC_DSP can
calculate the logical amplitudes (SS, RO, PE) into the physical of X,
Y or Z. The resulting amplitude values are passed onto the
ECC_DSP which makes corrections for the eddy-current, cross-
term and B0 compensations before sending the data to the
gradient amplifier. The amplitude data is for each axis 18 bits wide
and some additional timing and control signals are sent as well.
There are more signals than pins in the cable to the gradient so the
data has to be multiplexed.
Gradient Safety Watchdog (GSWD) -Stimulation
Monitor
The GSWD is only implemented on all Sonata, Trio systems and
Symphony systems with the Quantum gradient option.
When applying strong gradient pulses during an MR examination
muscular stimulations of the patient can occur. The cause of these
stimulations is the development of electrical fields within the
patient’s nerve fibers which are induced by the dynamic magnetic
field generated by the gradient coil. The magnitude of these
5.2 .23 induced electrical fields is, for any given sequence type,
proportional to the change of the magnet field in time, expressed
otherwise as dB/dt.
A stimulation occurs when a characteristic threshold of the
electrical field is exceeded. The corresponding dB/dt value needed
to exceed this limit depends on the patient’s anatomy and
physiology, the geometrical and physical attributes of the gradient
coil and the position of the patient within this coil.
dB/dt is determined by the amplitude and rise time of the gradient
pulses. In actual imaging conditions, dB/dt is never constant, but is
dependant on the sequence type and sequence parameters (e.g.
5.2.23 slice thickness, FOV, Matrix size, TR, TE, number of slices, etc.).
The stimulation thresholds are further influenced by the timely
organization of the individual gradient pulses, the total number of
pulses their repetition time and the coincidence of any or all three
gradients at any one time.
The Gradient Safety WatchDog (GSWD), also called stimulation
Monitor (STIMO), provides the safety against patient stimulation.
The stimulations monitor (STIMO) is realized in three parts:
• a Look-ahead monitoring with a "SAFE Model"
• a Look-ahead monitoring using the legal dB/dt-Limits
• a run-time monitoring with a "SAFE Model"
Look-ahead Monitor 5.2 2.41
T h e l o o k- a h e a d m o n i t o r r u n s s i m u l t a n e o u s l y w i t h t h e
parameterization of a sequence. If sequence parameters are
chosen that will cause a stimulation, a warning message is issued
5.2.24
to the effect and eventually changes are suggested which will
prevent stimulations.
The "Safe Model"
89
Control - Functionality

In the SAFE-Model, the physiological stimulation is approximated
by filtering the differentiated gradient pulses. Each gradient pulse
is differentiated and then filtered by applying at least two
exponential functions using two time constants. The filtered signals
are then added together using a weighting function and then
compared to an established limit. The established limits have been
derived empirically through studies done on real people (they are
all still living). If these limits are exceeded, stimulations are to be
expected.
Online Monitor
The actual value gradient currents are sent to the first RX_Module
in the RFSU, digitized, and sent to the MC1C40 over the MMC
backplane.
The STIMO_DSP on the MC1C40 calculates the actual gradient
values and compares them to stimulation limits. If a limit is
exceeded, the GPA will be disabled via a signal.
System Compensations
Coil related Adjustments
Before a sequence measurement can begin there are some system
and patient dependent adjustments which must be performed.
These include:
• Body Coil tune (Adj/Tune)
• adjust frequency (Adj/Fre)
• adjust transmitter (Adj/Tra)
• adjust shim
All of these adjustments are in themselves sequences. The
sequence is loaded into the MPCU and performed as any other
sequence. The measured raw data will be transferred to the Imager
(MRIR) where the evaluation is performed.
3D Shim
The 3D Shim procedure is to compensate the inhomogeneities of
the magnetic field. A short sequence is used to determine the 1st-
5
90
order and 2nd-order distortions. In order to get the field
homogeneous, the 1st order terms are compensated by driving an
offset current to the gradient coils. For compensating the 2nd order
terms, all systems are already equipped with 5 shim coils in the
gradient coil assembly. To drive a current also through these coils,
you need to have the shim option installed. If no shim option is
present, the 3D Shim will only calculate the 3 linear gradient
offsets.
Eddy Current Compensation 5.2 2.53
5.2 .42
The eddy current compensation is performed digitally in the
ECC_DSP on the MC4C40 board. The correction values are
determined in the tune-up and are calculated online. The correction
also includes a B0-component, which is implemented by changing
the synthesizer frequency dynamically during the sequence.
Gradient Delay 5.2 2.54
The gradient delay compensation for the three axis is performed by
the TICO section of the GCTX. The necessary time parameters are
5.2.25
determined in the tune-up procedure.
Dynamic Control Signals
5.2 .51
5.2. 6
Control signals necessary for the dynamic detuning, are set by the
GC-DSP, respectively the ED-DSP via the backplane to the RFCI.
Remember, you need tune and detune signals for the body and
local coils.
Various dynamic control signals required by several RF components
and the gradient amplifier are generated by the TICO section of the
GCTX, converted to fiber optic signals by the IOP and distributed to
the components. The dynamic detuning signal for the local coils is
sent to the RFCI electrically over a cable from the MMC backplane.
NOTE This cable is NOT tested by SeSo!
5.2 .52
Supervision, Error Handling 5.23 System Standby Mode 5.24

During the sequence the MPCU also supervises the scanner

hardware for errors. There are two main events that can cause an System Power ON_OFF Control 5.2.41

abort of the sequence:

The Host is able to put the system into standby by sending a signal to the
• input of an error message from an unit appropriate relay in the Line Power Distribution via the serial connection
• the system state changes to ’not normal’ to the Alarm Box. In the Standby-mode all system components are
Error Messages can be generated by any of the units. If an error is switched off, with the exception of the MRC and MRSC Hosts.
detected, it will be classified and sent to the MPCU. Here,
dependent on the context the MPCU will take appropriate actions.
The following error classes are established:
- Warning
- Error and
- Alarm
In all cases the operator will be informed and there will be a new
entry in the NUMARIS Eventlog. A running sequence will be
stopped only in case there is an ’Error’ or an ’Alarm’ classification.
The SCT will stop feeding the DSPs.
In addition to the error messages, there is also the System State.
For each of the CAN units there can be up to 32 bit of status
information available, giving detailed unit status.
If a status bit changes, e.g. due to an over temperature in the
gradient coil or a malfunction in the chiller, the MPCU will be
informed automatically via the CAN bus. This new state will be
compared with the predefined patterns for each of the units,
representing the normal working state. This definition is stored in
the status file of NUMARIS and can not be changed by the operator.
If the comparison shows a discrepancy an error will be created.
There are some cases, where the peripheral unit already knows,
that the status change will lead to an error condition. In such a
case, the unit itself already will create an error message. So it can
happen, that an error condition results in two error messages sent to
NUMARIS!

91
Control - Functionality
 5
92

Hardware 5.3

Figure 45 MMC Layout

Block

MC4C40

MC1C40
Diagram

RX4

IOP
MPCU Box

PCI_Link

PCI_CAN
MPCU

MPCU
Figure 46 MMC Block Diagram

PMU Intercom Host option LPD System

(Advanced IPA) Diagram

Power

RX_Module

RX_Module

RX_Module

RX_Module
TX_Module
Parts
Supply Location
RF Room door /RFCI

RFSU

SYNTH 1

TX 1
X28-30,
X34-36

Fan_OK, N_PPC_Reset
X27

RFCI
Door-contact

X33 RFCI_CTRL
Physio Data

+12V, -12V

Ethernet
Beeper

Backplane

RFPA
RFPA_CTRL
X13 H1,H2 X3 X1 X15 RFPA_ON U1
EXT_TRIG_OUT U2 Customer device
RX4 RX4

GPA_INT
MC4C40

MC1C40
for fMRI
MPCU Box RFPA_UNB1 U3
CORA_UNBLK

GCTX
D12 D12 RFPA_UNB2 U4
MHSEL 0 U5
MPCU2/3 Advanced
IOP MHSEL 1 U6
(TALES)

D14 MHSEL 2 U7

RFAS
IPA
option SEQ_ON U8 RFAS_CTRL
D10 D11 D21 D22 D16 SE_CTRL U9 (BCCS)
(LCCS)
RFAS_SEL0 U10
(Quantum) U11
PCI (Sonata) U12

RAWLink

RAWLink
CAN PCI U13
U14
D28 Link CAN2 U15
MOD1

MOD0

D18 X4 X4 CAN2 U16

RFCI
CAN1 U17 RFCI_CAN
X1
X2 X4A X3 U1 X3 U1 X6 X4 CAN1 U18
CAN1
CAN2

Standby
D26 (NUM/3.5 only)

Raw
MMC
GPA_CTRL STIMO Data
Overview
CAN GPA MRIR LPD

93
Control - Hardware
 5
94

MPCU Box 5.31

The MPCU Box is a housing supplying mechanical and electrical

connections of the MPCU, PCI_CAN and PCI_Link boards as well as
providing connectors for external cabling to the MMC and
periphery.
The MPCU is a single-board industrial controller using the PowerPC
CPU with VxWorks as operating system. Standard interfaces
include an Ethernet adapter, a parallel port, and both electrical and
FO serial interfaces. Systems running syngo MR software (systems
produced after July 2000) are equipped with an MPCU2 and
systems after July 2001 with the MPCU3 board, while older
systems running NUMARIS 3,5 software will have a MPCU 1.
The PCI_Link and PCI_CAN interfaces are installed in slot 4 and slot
5 respectively.
X12 is currently not used.
A service terminal can be used at x13 for setup of boot parameters
in the BIOS.

PCI-Link Interface 5.3.1

This board provides a digital data interface between the MPCU and
the DSPs on the MC4C40. The bus drivers and monitoring of this
bus are found on the MC4C40 (see MC4C40 LED description).
Figure 47 MPCU Box Block Diagram

Main
Diagram

X27
FAN_OK

IOP
N_PPC_RES
X1 (at back side) MMC
Backplane
MPCU Box
MPCU 2/3

Host
X15 Ethernet

POST LEDs
X14 Backplane

Power PC

PMU
Physio_Data 603/750
32/64 MB
266/300 MHz
CAN1

PCI CAN
PCI Link
H2

CAN
Intercom

H1
Physio_Beeper
X3 CAN2
X13

X12
n.c.

MC4C40
X4A
X2

RFCI
Door Contact X2000

95
Control - Hardware
 5
96

PCI_CAN Interface 5.3.12 Figure 48 PCI_CAN Block Diagram

The PCI-CAN interface provides two electrical CAN busses and one
RS232 interface, which is not used. Main
Diagram
MPCU
CAN Controllers 5.31.21
Box MPCU
The CAN controllers provide two separate busses:
• Active - used to connect periphery that must remain active

PCI bus
CTRL
during the sequence
• Mute - used to connect peripheral devices that must be put Backplane
into standby during the sequence, in order to prevent noise
The ACTIVE bus is labelled as CAN Bus 1. PCI bus
PCI_CAN
The MUTE bus as CAN Bus 2

Outputs 5.31.2

Opto-couplers are used to provide galvanic isolation between the

MMC and the periphery. The output connectors are DB-9.
Full Full
The RS232 port is internally connected to X12 of the MPCU-Box RS232
CAN CAN
and is currently not used.

LEDs 5.31.23

Opto Opto
Only the CAN Bus 2 controller has LEDs: Coupler Coupler
MX3

• GREEN: BUS RUNNING, ON indicates Bus initialized

• RED : ERROR, is on during boot until the CAN controller has
been initialized

ISO ISO
Trx Trx

Module 1 Module 0
X12

CAN Bus 1 CAN Bus 2

CAN
Figure 49 CAN Bus Topology

Main
Diagram
BTB2 BTB1 LCCS PTAB (A514)

U3 U1 U3 U1 U3 U1 U3 U1
U4 U2 U4 U2 U4 U2 U4 U2
CAN Bus
Topology
Harmony : BTB1(42MHz)
RF Cabin Symphony: BTB1 + BTB2 (both 63MHz) Filterplate

Technical Room
MSUP & Shim TX_Module RFCI
Chiller
TX
GSU RX CAN1

Backplane
X402
U14
U15
Module 1 U15
U16

CAN 1
Master X5
X401
U17 U1
CANOpen
+CPU U18 U2
Module 0 RCA
CAN 2

CANprop
SLIO
U3
fibre U4
X6
optic PCI-CAN

electrical MPCU IOP

electrical
U2 U4
U3 U5

RFPA
GPA CCA

97
Control - Hardware
 5
98

CAN Bus 5.32

NOTE Troubleshooting hint:

The CAN Bus is a serial bus used for smaller computer networks. It Since the CAN bus is a bus, the cables can be connected
operates in our implementation with a speed of 100kbit/s. to different units.
E.g. at the IOP board there are the spare connectors x5
Figure 49 gives an overview of the components connected to the
(mini DIN) and J15, J16 (FOC) available.
CAN bus, and the connection type. There are two connection types:
Just keep in mind, that the CAN bus tests will abort if
an optical CAN bus, using a pair of fibre optic cables, and an
two subsequent units (as the test expects) are not
electrical connection, using a twisted pair cable.
responding.
There are two CAN busses leaving the CAN master.
• CAN1 is always alive, it connects MPCU, GSU (GPA), MSU and
RCA (Chiller).
• CAN2 connects MPCU, IOP, TX-module, RFCI, RFPA, PTAB,
LCCS, BTB1 and, in case of Symphony, BTB2. CAN2 will be
set into a ’sleep mode’ during a measurement, not to create
any image artifacts. The units can be wakened up via an
interrupt of the connected hardware, thus enabling error
messages to MPCU.

NOTE In the diagrams and on some hardware components you

will find the names ´CAN1´ and ´CAN2´ for the
connectors at one single unit. This is misleading. It just
shows the difference between "incoming" and "outgoing"
bus.

There are LEDs indicating bus activity on the CAN2 bus at the IOP,
RFPA and BTB. At the CAN1 bus there is no such an indication.
In the idle state there is no activity on the bus.
In the diagram you find that some CAN units are called SLIO and
some are called CAN Module.
• CAN SLIO is a serial-linked-IO, this means it just has input
and output ports, no intelligence.
• CAN Module has a CPU and a loadable software program.
SLIOs have to be polled by the MPCU, while the CAN+CPU units
can actively access the bus.
CAN Modules (CAN & CPU) 5.3.21 Figure 50 CAN Modules
CAN modules are relatively small piggy-back devices which contain
a CPU. There are five such modules used in the scanner, most of
which are identical. A CAN module is identified by a 4-bit unit ID
which is provided on the board into which the Can Module is
Found in these units:
plugged into. GSU, MSUP, RCA, RFCI, PTAB
As with all CPU circuits there is also some RAM and a PROM for
Firmware. The firmware is the same for all CAN modules and
contains only a boot, initialization and loader program. LW FW
LW FW

The application specific software for the CAN Modules (called RAM EEPROM PROM
CPU
loadware - LW) is contained in an EEPROM and will be downloaded
Reset &
during installation or software update. CAN

LED 5.32.1

After power ON, the CPU will boot and initialize its environment
with the Firmware contained in PROM. At this time the FW LED will CAN Module
blink. After completing the boot process it will load the Loadware
from the EEPROM, if available, and turn the LW LED on and the FW
Mini DIN
LED off. or ID
FOC
The FW / LW LEDs are used to indicated other conditions according (Isolation)
to the diagram at right.
With a reset button the CPU will be forced to restart like power ON.
After a reset a "Reload All" has to be performed, since unit specific
LW FW
NUMARIS parameters may be required.
Power OFF off
FW-mode blink
During a measurement all units at CAN bus 2 will be set into "sleep LW-mode (normal) on
mode" in order to avoid noise. This is indicated by a permanently lit
idle-mode (sleep mode)
LW LED. Any activity on the bus will wake up the SLIO units. The
CAN+CPU units will wake up when they are addressed by the Selftest failed
M P C U . T h i s i s n o r m a l l y t h e c a s e f o r t h e P TA B a f t e r t h e (blinking alternat.)
severe bus error
measurement but not for the RFCI.
erasing E2PROM

99
Control - Hardware
 5
100

Initialization of CAN Units 5.3.2 Figure 51 CAN Initialization

After power on (or reset) the FW on the CAN+CPU units perform a
LW FW
power up test. Power On
or Reset
Then the LW will be started if the checksum is ok.
The MPCU will check the LW version and compare it with the run selftest if Error
corresponding file on the system disk. In case of a difference the cold start
valid version will be downloaded. Normally this procedure will be
skipped.
send FW logon
After a status request the unit is waiting for commands from the request to MPCU
MPCU e.g. NUMARIS parameters for a measurement. for 1 sec.

start LW if Error
checksum was stay in FW
successful
NOTE The hardware of the piggy modules is identical but the
loadware is not! During power on, the CPU switches
from FW to LW. This LW is designed for a specific unit. wait for CAN
It is not predictable what this software will do in a commands
different environment. Therefore don’t swap the piggies!
MPCU requests Hard drive
LW version

no
up to date? Download LW

yes yes
possible errors
Flash blank
no
start LW checksum error

status request

yes RAM fault

error ? Flash blank
invalid LW lenght
no checksum error
Bus warning
wait for CAN Bus OFF
commands
MC4C40/GCTX 5.3
LEDs 5.3. 3

LED Description
MC4C40 5.3.31

Link error. THe data link between the MPCU/PCI_Link

ERR
The MC4C40 is a generic processor board with four C40 DSPs from and the MC4C40 DSP is not ok.
Texas Instruments. Each DSP is supplied with 128kByte of memory DIR direction of data flow to/from PCI_Link
and provided with links to all other DSPs and a RS485 interface for STAT status ok when on, must be on if software is running
out-going signals to the TX_Module. The gradient pulse amplitudes
are supplied over the GCTX board described below.
For the detailed description of the functions performed by the AMC
The DSPs are named according to their functions as follows: components, refer to the Functional section above.
• DSP1 for transmit amplitudes (TX)
• DSP2 for gradient amplitudes (GC)
• DSP3 for SAR calculation and image header (RX)
• DSP4 for eddy current compensation (ECC)

GCTX 5.3.32

The GCTX is a specially designed board realized as a piggy back (it

plugs on top of the MC4C40 board) containing all the functional
circuitry for the sequence RF pulse generation, the data delay
circuits and synchronization pipeline for the gradient pulses and the
TICO section which is responsible for providing the timing for the
sequence events. The main tasks are:
• The TICO generates the sequence timing for Grad, RF-TX (incl.
PFPA_UNBL) and RF-RX. Also the control signals for the RF
coil dynamic detuning are generated here. They are sent to
the RFCI via the backplane.
• The Grad unit synchronizes the prepared Grad amplitude
(from DSP2/4) with the delay generator.
• The RF-TX performs the digital modulation with the MOFI chip.
The NCO provides the carrier (Local Oscillator) for the
• TX_IF signal (slice position) and demodulation on the RX4
(RXLO_xx)
The gradient amplitudes are delivered to the Gradient Amplifier
over connector X4B.

101
Control - Hardware
 5
102

Figure 52 MC4C40 / GCTX Block Diagram

Main
MC4C40 GCTX Diagram

TX X1
Re

TX FIFO
ERR

TX_Mod
DIR TX_IF
STAT
Im TX_OFF
Test_En,
ASIC Test_Rd,
X4A
DSP 1 OutS,
TX Gain,
Res RXLO_Re

MMC backplane
RFON
NCO RXLO_Im

N_PCI_Reset Tx Control TX_CTRL

Register

Coil_Mask_Sel,
X33

RFCI
BC_Ctrl, LC_Ctrl,
DSP 2 Clock

TX_ON
MPCU Generator
Res GC CLK_10 RFPA_Unb, SE_Ctrl,
Box CLK_20 RFAS_Sel, Ext_Trig_Out
ERR Delay
DIR N_PCI_Reset
Generator

IOP
STAT N_SYS_Reset
PCI_Link

Grad Amplitudes

Control Word
RFPA_ON, MH_SEL 0:2
Pipeline
TX_ON, RX_ON
TICO

RX4
RXLO_Re,Im
ERR TX_OFF
DIR Grad delays RXIO_Bus
STAT

X2 DSP 4 Gradient GPA_CTRL

DAC
Res ECC Pipeline
X4
Grad
Res GPA
OSC 0-2
DSP 3
ERR SAR
DIR
STAT
MC1C40 / GPA_INT 5.34
LEDs 5.3.45

LED Description
Overview 5.3.41

Link error. THe data link between the MPCU/PCI_Link

ERR
The MC1C40 is in principle identical to the MC4C40 with the and the MC4C40 DSP is not ok.
exception that it contains only 1 C40 DSP. It is responsible for the DIR direction of data flow to/from PCI_Link
Gradient Safety Watchdog functionality (stimulation monitoring) for STAT status ok when on, must be on if software is running
Quantum gradient on the Symphony and Sonata systems.

MC1C40 5.3.42

The stimulation values are calculated on the MC1C40 using the

actual gradient values coming from the GPA. If limits are exceeded,
the GPA will be disabled.

GPA_INT 5.3.43

The GPA INT is connected to the MC1C40 as a piggy back. The only
used front connection is X4 which receives the actual current
values of the three gradient axes from the GPA.

Outputs 5.3.4

In addition two signals are control and status for the GPA:
• GPA_ON -> Enables gradients, but disables if stimulation limits
are exceeded
• WDG_ERR -> Watchdog error

103
Control - Hardware
 5
104

Figure 53 MC1C40 / GPA INT Block Diagram

Main
Diagram

MC1C40

MC1C40
D21
GPA INT GPA K2217
D22
Filter / AV_GX
ADC_X Amplifier
Reg.
Filter / AV_GY
ADC_Y Amplifier
AVA
D12

GCIO_Bus
ERR
DIR or
MC4C40 Filter / AV_GZ D124
STAT ADC_Z Amplifier

GPA INT I/O

Test
DSP 2 DSP 2 D17
DAC
GC STIMO

EMMI Modulator
D14

Control
SEQ_ON
GCTX

SEQ_CLK WDG_ERR CAN

D16
X4 X5

DAC
D11
RX4 5.35
LEDs 5.3.54

The RX4 board supplies four demodulator and filter circuits for up to LED Description
four RF channels. on when the 20 MHz clock (generated by the
CLK_20
The Advanced IPA option includes 4 additional RF channels synthesizer of the TX_Module in the RFSU) is available,
essential for the entire RF system and MMC
requiring a second RX4 board.
TX_ON transmitting of RF power is enabled, this signal is
necessary for PALI supervision
RECEIVE data are being received from RFSU
Inputs 5.3.51 TRANSMIT data are being transferred to the Imager (MRIR) for
image calculation
As the RX4 block diagram shows, the main task of the RX4 is to
WDOGEN the PALI watchdog is enabled
demodulate the receive signals. As input signals there are the 4
RBANK Read Bank, internal signal necessary for sorting the
digitized MR signals RX1_IF...RX4_IF coming from the RX_Module
data
in the RFSU and the digital demodulation signals RXLO_RE and
UNEXPRFERR there is RF from the RFPA without the TX_ON signal,
RXLO_IM generated from the 10MHz clock by the GCTX. And all this is an error condition.
signals are in 16 bit format. This explains the 435 pin (!!!)
PALIERR PALI watchdog error. PALI did not react to an watchdog
backplane connector. Don’t mess any up, with your luck they will all interrupt in less than 20µs. Software may have
be used... crashed.

Demodulation 5.3.52

Via the MOFI interface the data is sent into two ASICs called MOFI1
and MOFI2 (MOFI stands for modulator and filter). Here the
digitized MR signals will be demodulated, or better said, the
demodulation will be calculated. Digital demodulation has the
a d va n t a g e t h a t e x p e n s i ve a n a l o g c o m p o n e n t s ( L P f i l t e r,
demodulator, ADCs) are not required and there is absolutely no
distortion of the signal - one more step towards excellent image
quality.

Output 5.3.53

A high-speed glass fiber optic cable delivers the processed MR

signals (from this point on called raw data) to the Imager. If the
Advanced IPA option is installed, the data output of the first RX4
board is sent to the second RX4 board over a connection board
(D26) on the front side connector X3. The fiber optic link to the
imager is taken from the second RX4 board.

105
Control - Hardware
 5
106

Figure 54 RX4 Block Diagram

Main
Diagram

MMC
RFPA_ON CLK_20
Backplane
MH_SEL 0:2 TX_ON
TX_OFF RECEIVE
Rx_On, Tx_On, Control Event TRANSMIT
Clk_10, Clk_20 Interface Control
MC4C40 WDOGEN
GC_TX RF_ACT RBANK
UNEXPRFERR
PALIERR
RXIO_Bus DSP
N_SYS_Reset Interface

RAM

RX1,2_INS
U1 RX1_IF

MOFI Interface
RXLO_RE
RX2_IF
MOFI
RXLO_IM 1 Serial U1 Raw_data

MRIR
Rx4 Data Bus
Interface
LO_RE X4

RX1_IF
LO_IM RAWLink
RX_Module RX2_IF

RX3_IF RX3_IF
MOFI X3
RX_Module RX4_IF RX4_IF
2 RS-485
Interface
IOP
RX4

D26
RX5_IF
RX_Module RX6_IF

RX7_IF
RX_Module RX8_IF RX4 X3

U1
IOP 5.36 Figure 55 IOP Reset Circuit

The IOP board has three main functions:

• Conversion of electrical control and CAN signals to fiber optic IOP Back

• Voltage Monitoring Voltage

• Reset control Monitor

FOC outputs 5.36.01

N_Pow_Fail
x27
Reset MMC N_PPC_Res x1 MPCU
Some control signals for the RFPA, TALES and BCCS are connected
1 Box
at the IOP fiber optic connectors U1 to U14. A number of the
signals coming from GCTX and RX4 are not yet used.
MPCU Power-on
Box Reset
CAN Bus Interface 5.36.02
N_Sys_Res
via N_PCI_Res
1 MC4C40
The SLIO of the CAN bus (see next paragraph) mainly monitors the MC4C40
(SW-Reset)
MMC power supply and the MPCU fan status. Besides the external
CAN connections from MPCU and to RFCI, the TX_Module is
connected via the backplane. RX4

External Trigger Input 5.3.61

Is currently not supported by software. Power Monitoring. 5.3.63

At the left top the LEDs of the MMC power supplies must always be
on.

Reset
The Power On Reset or the manual Reset via the push button will
reset all MMC boards and MPCU via the backplane. The software
can reset the MMC via MPCU, MC4C40 and IOP.
5.3.62
A monitoring system checks for the +/- 5% limits. Since there is no
-5V supply, the jumper x13 (2-3) bypasses the check in order to
enable the LED and avoid an error message. Any power failure
would reset the MMC.

Standby 5.3.64

The Standby signal (X4) is used ONLY on NUMARIS 3.5 systems.

For syngo systems a system standby is performed by the Host over
a serial connection to the LPD over the Alarm Box. See HOST
section for details.

107
Control - Hardware
 5
108

Figure 56 IOP Block Diagram

IOP Main
D14 Diagram
+3,3V
±5, ±12, +3.3 +5V
RFPA_On Voltage
-5V
MH_Sel 0
N_Power_Good Monitor
+12V
N_Pow_Fail

RX4
MH_Sel 1
-12V
MH_Sel 2
N_SYS_Res
N_PCI_Res
Reset
N_PPC_Reset reset
Control
N_Sys_Res

MMC Backplane
RFPA_Unb X3
SE_Ctrl Ext_Trig_In (n.a.)
RFAS_Sel 0

MC4C40
RFPA_Ctrl U1, U6
Ext_Trig_Out RFPA_On U1 DORA
N_PCI_Res Customer device
Ext_Trig_Out U2
Res 0-2 for fMRI
RFPA_Unb U3
Ext_Trig_In
RFPA_Unb 2 U4 CORA
N_SYS_Res
MH_Sel 0 U5
MH_Sel 0:2 U1-U3
MH_Sel 1 U6 TALES
Tx_Mod

MH_Sel 2 U7
Seq_On U8 U1
RFAS_Ctrl BCCS
SE_Ctrl U9

X27
RFAS_Sel 0 U10 U5
LCCS
RFAS_Sel 1 U11
Fan_Ok Fan
4 1

N_PPC_Res monitor LPD

X4 Standby
NUM 3,5 X10
X1

Res 0 U12
Res 1 U13
Fan

Res 2 U14

MPCU CAN CAN Rx

Box SLIO
CAN Tx
PCI-CAN

CAN_LWL U15
X6
CAN_2 CAN_LWL U16

CAN_LWL U17 RFCI_CAN U1,U2

RFCI
CAN_LWL U18

X5
(D16 piggy back)
 Section
6 RF System
Introduction
RF Small Signal Unit - RFSU
The role of the RFSU has been reduced to that of a converter. The
RF pulse modulation and MR signal demodulation are performed by
DSPs of the GCTX and RX4 respectively. The Tx_Module must only
convert the digitally modulated RF pulses from the GCTX and then
mix the result up to the required system frequency. Conversely, the
Rx_Module mixes the MR signal down to about 1MHz and A/D
converts the 1MHz IF frequency for the RX4 which then does the
filtering and demodulation digitally.
There are no adjustments required and there are no filters to clean
and maintain.
The RFSU components are broad-band and are used for 0.2T
(8.25MHz), 1.0T (40.45MHz) and 1.5T (63.6MHz) systems.
RF Power Amplifier - RFPA
A new double-resonant RFPA has been designed for the Harmony,
Symphony product family. It is fully solid-state (no tube, no
external power supplies, no discharging points and no manual
adjustments), extremely small, is water cooled, can produce up to
15kW and can be used on both the 1 and 1.5 Tesla systems. The
amplifier recognizes the input frequency automatically and sets the
max power limit accordingly. Communication to the RFPA is
6
6.1
achieved with a CAN SLIO component.
For 1.5T systems a multi-nuclei spectroscopy option is available
which includes an additional 2kW solid state amplifier. We were in a
6.1
hurry, so we borrowed the CORA from the Open system. At
spectroscopy frequencies it produces more RF than we need.
RF Application System - RFAS 6.13
The functions are all there: T/R switch, pre-amps, impedance
matching networks. For the most part, the previous circuits have
been consolidated into a single unit to reduce the component
count. The BTB has grown somewhat from three fixed tuning
ranges of the Impact/Expert to 128 or 256 tuning positions. A
calibration program, similar to the one used in the Vision, will be
used to "map out" the tuning ranges so that the impedance
matching process (patient tuning) can be automated and
performed within seconds.
The SAMI is a new device for included in the spectroscopy option.
6.12
It allows fast switching of the RF transmit source (High Power RFPA
or Broad Band RFPA) for de-coupling experiments.
Control for these components is exercised by CAN controllers or
SLIOs. In its simplest form, a CAN SLIO is principally a
programmable I/O chip with a CAN bus serving as the
communication link to a CPU. A CAN controller has an integrated
CPU. Both types are used in the RFAS.
109
RF System - Introduction
 6
110

Local Coils 6.14

local coils are factory tuned and do not require a patient dependent
impedance matching.
Integrated Panoramic Array 6.14.01

A major technological advancement has been achieved in the Local The RF System Menu 6.15

Coil design concept which has been termed Integrated Panoramic The RF System hardware components have been placed into the
Array. The Integrated Panoramic Array, or IPA, is the latest
following blocks:
evolution in coil handling and CP array coil technology. The basic
• RF System Block Diagrams for:
approach is to:
- Harmony
• reduce patient setup time by having some coils integrated
- Symphony
into the patient table
- Symphony with Spectroscopy option
• reduce the number of individual coils
• increase flexibility and optimize image quality by the • RF Signal Unit (RFSU)
possibility of combining almost every single coil with others - TX_Module
for the intended application - TX_Module for Spectroscopy
- RX_Module
The advantage of the Integrated Panoramic Array is to reduce
patient setup times by leaving the head and spine array on the
• RF Power Amplifier (RFPA)
patient table for almost all examinations with the exception of - 15kW RF Power Amplifier (DORA)
female breast imaging. Therefore one has no longer a "Body Array - 2kW RF Power Amplifier (CORA)
Coil" or a "Neck Array Coil" as on Expert and Vision but the CP • RF Application System (RFAS)
Spine array serves as the lower part of these coils; they are used in - TAS for 42/63 MHz
conjunction with the CP Neck Array or the CP Body Array, - SAMI for 63 MHz
respectively. The user has to select the corresponding spine array - BCCS for 42 MHz
elements in these cases. The image area is not just where the coil - BCCS for 63 MHz
is located but it is variable.
- LCCS for 42/63 MHz
Harmony and Symphony systems can be equipped with IPA - TALES for 42/63 MHz
(standard) or Advanced IPA (option). In addition, both systems are - BTB for 42 MHz
using analog linear signal combination of elements as well as array - BTB for 63 MHz
image combination. This will be explained in more detail in the
• Antenna Systems
Local Coil section below.
- Body Coil for 42 MHz
- Body Coil for 63 MHz
All array coil resonator elements employ circular polarization - Local Coils
technology for optimized homogeneity and utilize built-in • RF Cabin Interface (RFCI)
preamplifiers for unparalleled S/N performance. The coil casings
use a specially formulated plastic with a high static load rating and
excellent RF permeability to ensure good RF field homogeneity. All
Figure 57 Harmony RF System Block Diagram

RF System Block Diagram Symphony Symphony System

w Spec Diagram
CCA Harmony RFAS

RFPA TAS_C BCCS TALES BTB

TX_Module
DICO
SSB1
Modulator
TTX1

50
PF PR
Loop1

Synthesizer RxLO

CV

MC4C40 RFCI
Backplane

MMC
Coil Control
RX4 Bodycoil
LCCS
RX_Module
Receiver A 1
PF
MR SIG 1 Test
SGA
PR
Receiver B CV 2
4

MR SIG 2 4
Switch 4
Array 3
4
RX_Module Tx/Rx
Local
RX_Module 4 Coils
16 x 8
RX_Module

111
RF System - Introduction
 6
112

Figure 58 Symphony/Sonata RF System Overview

RF System Block Diagram Symphony Harmony System

w Spec Diagram
CCA Symphony RFAS

RFPA TAS_C BCCS TALES BTB-2

TX_Module
DICO
SSB1
Modulator
90°
TTX1

50
PF PR
Loop1

90°
Synthesizer RxLO

CV
BC-47 BC-2
MC4C40 RFCI
Backplane

MMC
Coil Control
RX4 Bodycoil
LCCS
RX_Module
Receiver A 1
PF
MR SIG 1 Test
SGA
PR
Receiver B CV 2
4

MR SIG 2 4
Switch 4
Array 3
4
RX_Module Tx/Rx
Local
RX_Module 4 Coils
16 x 8
RX_Module
Figure 59 Symphony/Sonata RF System Overview

RF System Block Diagram Harmony Symphony

System
CCA Symphony with Multi-nucleus Spectroscopy
RFAS Diagram

DORA TAS_C BCCS TALES BTB-2

TX_Module
SSB1
Modulator
SSB2 90°

50
TTX1 PF PR
Loop1
CORA
90°
SAMI
Synthesizer RxLO

PF PR
CV
BC-47 BC-2
MC4C40 RFCI
Backplane

MMC
Coil Control
RX4 Bodycoil
LCCS
RX_Module
Receiver A 1
PF
MR SIG 1 Test
SGA
PR
Receiver B CV 2
4

MR SIG 2 4
Switch 4
Array 3
4
RX_Module Tx/Rx
Local
RX_Module 4 Coils
16 x 8
RX_Module

113
RF System - Introduction
 6
114

RF Signal Unit 6.2

Figure 60 TX_Module (left) and RX_Module

Overview 6.21

The RF Signal Unit consists of just two components:

• TX_Module
• RX_Module

Both modules are produced by Siemens Albis, a Swiss company

specializing in telecommunications hardware. One can see in the
picture at right that each module is comprised of two cassettes
which are assembled to form one plug in unit.
The TX_Module 42/63 MHz consists of a Synthesizer and a
Modulator.
The RX_Module consists of two identical Receivers.
These components are field replaceable units. They require no
maintenance and have no adjustments. Testing of these units is
performed through the Service Software (SeSo) platform.

TX_Module 42/63 MHz 6.2

Overview 6.2.21

The TX_Module consists of a modulator cassette and a synthesizer

cassette assembled together into a single module.
The Synthesizer generates the carrier signals for the mixers in the
Modulator and Receivers as well as synchronization clocks required
by the DSPs of the MC4C40 and RX4.
The Modulator, wrongly so called, is responsible for D/A conversion
of the digital SSB RF pulses from the GCTX and mixing the results
up to the required system frequency of 40.45 MHz or 63.6 MHz.
Modulation is performed digitally by a DSP on the GCTX.
Figure 61 TX_Module Overview

Parts Main

Mod 1
Rx
Location Diagram

Mod 2
10MHz_REC1
TX_Module Synthesizer
Rx

10MHz_REC2

Latch
RXLO1_1
10MHz_REC3

Mod 1
Fixed RXLO1_2

Rx
10MHz_REC4
285 MHz
Mod 3

Oscillator RXLO1_3
Rx

10MHz_DSP RXLO1_4
Reference

Mod 2
Counter

Rx
TX_20MHz Oscillator

Latch
Mod 4

20MHz_DSP
Rx

40MHz_DSP

Mod 3
Rx
295 MHz, RXLO2_1
RFCI PS

X13-17 Variable 325 MHz,

RXLO2_2
350 MHz
RFSU_PWR Oscillator RXLO2_3

Mod 4
Rx
Frequency Freq. VCCO
Selection Control RXLO2_4

8 MHz,
IOP

40 MHz,
CAN Bus Calibration
Control 63 MHz
PROM

RFON Output
OutS
Control

OutS Stage
MC4C40/GCTX

Gain Loop1
Gain

RFPA
Loop2
Test_En Loop3
Gain 0 Gain 1 Loop4
D
TX_IF 16 1. IF 2. IF 6 dB 12 dB SSB 1
A
Output SSB 2
TX_20MHz Input 1 Mixer 2 Mixer LP Attenuators Stage TTX
X60
Backplane
Modulator

LCCS
CCA X09 Filter
Roof Panel

115
RF System - RF Signal Unit

Synthesizer 6.23
The synthesizer has the task of producing stable clocks used by the
DSPs performing the modulation of RF excitation pulses and
demodulation of received MR signals as well as provide clock
signals used by other DSPs and control circuitry responsible for
sequence control and gradient signal generation.
Inputs 6.2.31
The frequency range selection is determined by the variable
oscillator which is set via the CAN SLIO in the Modulator half of the
TX_Module.
Function 6.2.32
Control 6.23.21
The synthesizer’s Variable Frequency Oscillator output frequency
and phase are selected via commands from the MMC over the CAN
unit in the modulator.
System Clock Generator
6.23.2
The various clocks used by the RFSU and MMC components are
derived from a central 10 MHz reference clock. The reference
frequency of 10 MHz is multiplied up to 80 MHz from which
40 MHz, 20 MHz and 10 MHz clocks are produced.
The clocks provide overall synchronization of the data
measurement system. The DSP clocks are used to synchronize the
digital RF modulation and demodulation by the GCTX and RX4
boards respectively and the generation of the gradient pulses. They
are also used to synchronize data transfer in general.
Outputs 6.2.3
The output level for RXLO1_1:4 and RXLO2_1:4 is typically
+7 dBm (500mV).
6
116
The 10MHz_REC 1:4 signals are used in the RX_Module by the A/D
converters for the acquisition of the MR signals. They are routed to
the RX_Module slots over the backplane.
LEDs 6.2.34
The software selected middle frequency of 63.6, 40.45, 8.25 MHz
will be indicated by a front panel LED.
Testing 6.2.35
Testing of the synthesizer is performed under the Quality
Assurance section of the service software. The test is conducted
using a phantom and a SE sequence. The frequency and phase are
varied during excitation and the received MR signals are evaluated
accordingly. Please be aware that this test is also sensitive to any
other system instabilities.
Modulator 6.24
Modulation of the SSB pulse is performed digitally by a DSP of the
GCTX. The digital data of the SSB pulse is then converted by the
Modulator to an analog signal and mixed up to the system
frequency of 40 or 64 MHz.
Inputs 6.2.41
The TX DSP on the MC4C40 computes the center frequency,
bandwidth, and pulse shape from the sequence parameters and
produces the digital amplitudes which are then digitally SSB
modulated on the GCTX module. The final pulse amplitudes, TX_IF
1:16, are clocked into the TX_Module over the backplane,
synchronized to a 20 MHz clock. Additionally, the dynamic control
signal RFON from the TICO is required for enabling the DAC.
Function 6.2.42
DAC 6.2 4.21
The digital amplitudes from the MC4C40 are converted to an Outputs 6.2.43

analog signal with a 16-bit DAC. The RF digital amplitudes are

varied to achieve the desired RF power at the transmit coil which is
required for the flip angles in the sequence.
Mixer Stages
The D/A converted RF signal 1. IF has a frequency of around 1
MHz. This has to be mixed up to the system frequency of 40,45 or
63,6 MHz. This is done by using two mixer stages instead of just
one in order to achieve a very clean output spectrum, i.e., free of
The modulator has seven outputs placed in two groups - imaging/
tuning and test - for increased isolation. Output selection is made
via OutS 0:2. The dynamic control signal RFON is required for
6.24.2
output and gives the SAR monitor a means to block the RF in the
event of a SAR error. Unused outputs are terminated internally with
50 ohm.
LEDs 6.2.4

harmonic distortions and spurious. In the first stage the 1. IF signal

is mixed with an LO frequency of 285 resulting in the sum and Power LED: Gain
Attenuator Coil (Max Output)
difference of 284 and 286 MHz. The difference signal is filtered out Level 1..............0
and the sum signal is applied to the next mixer stage (2.IF). In the 3 off off 0dB Body Coil (3dBm)
second stage the 2. IF is mixed with the variable LO frequency of 2 off on 6dB -3 dBm
325 or 350 MHz resulting in a sum of 611 or 636 MHz and the 1 on off 12dB -9 dBm
difference frequency of 40,45 or 63,6 MHz respectively. The 0 on on 18dB -15 dBm
following Lowpass filter filters out the sum signal and all harmonics
and spurious resulting in a clean, harmonic-free signal.
Specifications 6.2.45

Attenuators 6.24.23

Harmony Symphony
The RFPA gain is fixed at 70dB for 40.45 MHz or 71.8 dB for
63.6 MHz. The RF transmit pulse amplitude is determined by the Center Frequency 40.45 MHz 63.6 MHz
digital amplitudes and the output attenuators of the modulator. The 0.1dB Bandwidth ± 125 kHz ± 125 kHz
DAC has 16 bits of resolution providing a large dynamic range
Gain Asymmetry ≤ 0.1 dB ≤ 0.1 dB
eliminating the need for variable attenuators as in previous
designs. Instead, two series attenuators with values of 6 dB and
12 dB form four power levels in which the 16 bit DAC resolution Testing 6.2.46

can be scaled to achieve any output amplitude. The power level is

The data path between the GCTX and TX_Module can be tested via
coil dependant. Level 3 is used for the Body Coil and range 0 or 1
software. With the Test_En and Test_Rd signals the GCTX can
for the CP Extremity coil depending on required transmit voltage.
write and then read back a data pattern into the Rd/Wr Buffer over
The range is selected by the Gain 0:1 control signals from the
the TX_IF bus (see Figure 61) thus verifying the TX_Module input
GCTX and displayed with GAIN 0:1 LEDs on the front panel.
buffer and the complete data path to the GCTX.
The exact attenuator values are factory measured at all capable
The Output Select and Gain control buffers can also be read back
frequencies and stored in an on-board calibration PROM which
by the GCTX for testing purposes.
will be read out by the MMC for correcting the RF transmit pulse
amplitudes.

117
RF System - RF Signal Unit
 6
118

Synthesizer for Spectroscopy 6.25

that can be selected by a fast switch. It covers two frequency
ranges from 160MHz-275MHz and 295MHz-410MHz.
The Spectroscopy option includes a new TX_Module with a
Synthesizer part which is capable of a wider frequency spectrum
for the various nuclei frequencies at 1.5 Tesla. LEDs 6.2.52

Figure 62 TX_Module for Spectroscopy Option The software selected middle frequency is indicated by LEDs. The
LEDs indicate the actual status of the PLL. For example the
The LEDs of the Synthesizer half of the
frequency of 64 MHz will be indicated by 3 front panel LEDs 40MHz,
TX_Module are different to the normal
20MHz and 5MHz. In addition the status of the control line for fast
TX_Module. The frequency is selected via
switching of TX_FSEL and RX_FSEL is indicated.
a frequency cascade.

NOTE The TX_Modules for the 1.5T systems (Symphony and Sonata) support the following
Symphony/Sonata for Multi additional nuclei/frequencies:
Nuclei option and for the Trio
look alike but are not the total
Gamma Freq at Bandwidth
same! Element Isotope Bandwidth
[MHz/T] 1.494T (in kHz)
(kHz)
1
Hydrogen H 42,575 63,6 250 700
Fluorine 19F 40,053 59,833 50 288
3
Helium He 32,433 48,450 200 552
31
Phosphorus P 17,235 25,746 105 291
Lithium 7Li 16,546 24,717 105 288
129
Xenon Xe 11,776 17,591 35 125
32
Sodium Na 11,261 16,822 70 193
Function 6.2.51

13C
Carbon 10,705 15,992 70 190
The function of the spectroscopy Synthesizer is the same. the Oxygen 17
O 5,772 8,622 35 97
exceptions are described below.

Control 6.25.1

There are two Variable oscillators. The synthesizer’s 2 Variable

Frequency Oscillators output frequencies and phases are selected
via commands from the MMC over the CAN unit in the modulator. A
set of 7 select signals set the desired output frequency via a
frequency cascade.

Variable Local Oscillator 6.25.12

The Variable Local Oscillator is generated by two identical PLLs,

Figure 63 TX_Module for Spectroscopy

Parts Main

Mod 1
Rx 10MHz_REC1
TX_Module Location Diagram

10MHz_REC2 RXLO1_1

Latch

Mod 1
Fixed
Mod 2
10MHz_REC3

Rx
RXLO1_2
Rx

10MHz_REC4 Oscillator 285 MHz

RXLO1_3
RXLO1_4

Mod 2
Mod 3

10MHz_DSP

Rx
Reference

Counter
Rx

TX_20MHz
Oscillator Var. Osc.1

Latch
20MHz_DSP
VCO1

Mod 3
40MHz_DSP
Mod 4

Rx
RXLO2_1
Rx

VCO2 RXLO2_2
160

RX_FSEL
TX_FSEL

Mod 4
80 RXLO2_3

Rx
40
20 Var. Osc.2 RXLO2_4
10 RX_FSEL
VCO1
Synthesizer 5
2,5
MC4C40/GCTX

VCO2
Frequency Frequency TX_FSEL
Selection Control

CAN Bus Calibration

Control PROM

RFON Output
OutS

DORA
Control

OutS Stage
RFCI PS

X13-17 Gain Loop1

Gain
RFSU_PWR Loop2
Test_En

CORA
Loop3
Test_Rd Gain 0 Gain 1 Loop4
D
TX_IF 16 1. IF 2. IF 6 dB 12 dB
A SSB 1

Backplane TX_20MHz Output SSB 2

Input 1 Mixer 2 Mixer LP Attenuators Stage TTX X60

LCCS
Modulator
CCA X09 Filter
Roof Panel

119
RF System - RF Signal Unit

RX_Module
Overview
The RX_Module consists of two identical Receiver channels. Each
cassette provides one high resolution RF receive channel. The
RX_Module is in essence, as is the TX_Module, an analog to digital
converter. The receiver reduces the MR signal frequency down to
about 1.8MHz via two mixer stages, and digitizes the resultant at a
fixed sampling rate of 10MHz. The increased sampling rate,
together with the digital decimation filter of the RX_4, the effective
ADC resolution is increased to between 21-24 bits depending on
the pixel bandwidth. This translates into a dynamic range of about
130dB, an increase of 40dB over older systems. It is this effective
increase in dynamic range that eliminates the need for a receiver
adjustment.
The receivers also provide inputs for various other sources e.g.,
RFPA output forward and reflected waves, service loop inputs for
testing purposes and an input for the TALES used for power
monitoring.
The basic system configuration will contain two RX_Modules
providing four receivers supporting up to four local coil elements.
Additional two RX_Modules expand the receive capability by
allowing four additional coil elements to actively receive without
combining the MR signals.
Inputs
Inputs Used for
MRSIG MR echo from receive coils
PF, PR loop test of RFPA and verification of TALES values.
Loop loop testing of RFSU components
DC Gradient service loop input
CV forward and reflected transmit values (from TALES)
6
120
6.26
Differential Input (DC) 6.2 6.21
The differential input (DC+, DC-) with a high common mode
rejection for direct measurement of DC signals from the Gradient
6.2.61
System is filtered and fed through a de-coupling amplifier to a
dedicated 12 bit ADC. The digital output is selected by test
software via the output MUX. This input is used for making stability
and linearity tests of the gradient power amplifier.
CV 6.2 6.2
The CV input originates from the TALES. The TALES is a precision
RF voltmeter which measures the amount of RF power into the
Body Coil or Local-TX coil (e.g. CP extremity coil). The TALES
converts the power levels into DC voltages which are digitized by
the RX_Module. The digital values are used for the SAR monitoring.
As a means of verifying the validity of the CV signal, a 500mV DC
reference is used.
RX1_RFACT
6.2 6.23
Over and above the normal SAR monitoring of the RF power by the
MMC, a “RF present” detector has been incorporated into the
receiver A of the RX_Module. When RF is present, the RX1_RFACT
signal will be active. It is used to verify the presence or absence of
RF at the output of the RFPA. A simple check is made: if the RFON
signal is active (transmitting) and the RX1_RFACT signal also can
be (should be) active. If the RFON signal is NOT active (we should
not be transmitting), and the RX1_RFACT IS active (but we are
transmitting).... oops. The software will take the appropriate action
6.2.62 of disabling the RFPA.
Figure 64 RX_Module Overview

Parts Main
Location Diagram

Receiver A
100 kHz
DC+

GPA
DC-
Tx Mod

RX1_IF Output
MUX PF

RFPA
2. IF 1. IF MRSIG1
Loop
Digitizer 2. Mixer 1. Mixer
RX1_Test_En,
RX1_InS Switch

Tx Mod
Control
285 MHz RXLO_1
10MHz_REC1 295-350 MHz RXLO_2
RX4

RX2_Test_En,
RX2_InS Switch
Control

LCCS
2. IF 1. IF MRSIG2
PR
RFCI PS

X13-17
RX2_IF Digitizer 2. Mixer 1. Mixer
RFSU_PWR
Output
MUX

TALES
CV X59 X10

RX1_RFACT Ref
Backplane

Receiver B CCA Filter

Roof Panel

121
RF System - RF Signal Unit
 6
122

Function 6.2.63
designed to test functionality and performance - linearity and
stability - can be configured and started from the service software
Mixers Stages 6.26.31 platform. Results are displayed graphically and alpha-numerically
with tolerances and performance data being given.
The mixer stages of the receiver reduce the MR signal down to a
frequency of around 1.8MHz in preparation for digitized by the
ADC.

Digitizer 6.26.32

The 1.8MHz IF signal is digitized at a constant rate of 10 MHz. The

extra

Outputs 6.2.64

The digitized MR signals are sent to the RX4 board in the MMC over
the backplane via opto-couplers which maintain the electrical
isolation between the MMC and RFSU.

LEDs 6.2.65

Indicate the selected RF input.

Specifications 6.2.6

1 Tesla 1.5 Tesla

Center Frequency 40.45 MHz 63.6 MHz
0.1dB Bandwidth ± 250 kHz ± 250 kHz
Max Input Level ± 1.2 dBm ± 1.2 dBm
Stability (5 min.) ≤ 0.01 dB ≤ 0.01 dB

Testing 6.2.67

Built-in test loops covering all of the RF System hardware

components have been incorporated into the RF System to
facilitate testing and trouble shooting. Test sequences specially
RF Power Amplifier DORA
Figure 65 The DORA RFPA
The DORA (DOuble Resonant RF Amplifier) is a solid-state power
amplifier capable of operating at the two frequencies of 40,45 and
63,6 MHz.
Inputs
Signal Description
AC_IN The three-phase AC primary voltage of 93V (measured
phase/neutral) for the RFPA is tapped off the main
system transformer. The internal power supply generates
all the required voltages from this.
RF_IN Input of RF signal to be amplified. The nominal input
level for the full output power level of 15kW is 0dBm.
RFPA_UNB To reduce noise and loss of the MR echo during reception
the amplifier is blanked during the receive cycle. When
signal is active (light on), the amplifier is activated.
RFPA_ON An enable signal allowing the SAR monitor to shut the
amplifier down independently from the CAN bus
controller. If the signal is missing (light out), the
amplifier shuts down.
Enable_Out A copy of the RFPA_On signal as output to an additional
RF amplifier.
CAN1, 2 Fiber optic CAN bus communication interface.
6.3
NOTE CAN1 and CAN2 are labels on the RFPA, but don’t
confuse it with the CAN1 and CAN2 busses!
NOTE There are two RFPA types. All RFPA’s with ODD
NUMBERED REVISION LEVELS have CAN bus connectors
reversed and REQUIRE ADAPTORS. Adapters are
delivered with these RFPAs.
Function 6.32
Power Up 6.3.21
To bring the amplifier up to operating condition, the Power Supply
requires two inputs: the internal enable signal from the CAN SLIO
which will be set via a command sent from the MPCU over the CAN
6.31
bus during the system start up, and the RFPA_ON signal from the
IOP. When both signals are present, the Start Up LED will light and
stay on until the power supply voltages have reached their proper
levels. This takes only a couple of seconds. After a successful
power up, the Start Up LED goes OUT and the Ready LED lights
and to signify the amplifier is operational.
Bias Control 6.3.2
The bias control circuitry is responsible for blanking the amplifier
(put the amplifiers into cut-off, i.e. disables it) when not in use and
for regulating the bias of the driver amplifier and power stage
amplifiers during the transmit cycle for a stable amplification. The
RFPA UNB signal determines the blanked (disabled) or unblanked
(active) state. An LED is supplied to display the state of this signal.
123
RF System - RF Power Amplifier DORA
 6
124

Amplifiers 6.3.23
Outputs 6.3

The amplifier consists of a driver and a power stage amplifier. In

Signal Description
total, the two amplifier stages are capable of producing a
Enable Out Can be used to cascade the RFPA_ON enabling signal to
maximum power of 15kW at 63,6 MHZ or 10kW at 40,45 MHz.
an additional RFPA. Is not used on current system
configurations.
Monitoring 6.3.24
PF, PR Outputs of the internal Directional coupler (DICO)
representing the forward and reflected output power
The RFPA has several internal monitoring circuits monitoring levels of the RFPA. These signals are read in over the
several vital functions: RX_Module and used to:
• over voltage or over current of the power supply • monitor the reflection factor
• excessive forward (5%) or reflected (approx 30%) output • verify the power level measurements made by the
power levels (RF Power) TALES
• provide test loop feedback to test RFPA
• unblank duty-cycle (6-8%)
• power stage temperature (50°C) RF_OUT This is hopefully where the amplified RF comes out.
In the event of an internal failure or an operational limit of the
amplifier has been exceeded the amplifier provides a status report
via the CAN bus and the READY LED goes out.
LEDs 6.34

LED Description
UNBLK Lights when being unblanked (i.e., when transmitting)
Start Up Indicates the RFPA is being enabled via a command over
the CAN. This LED is only temporary and will go out when
the Ready condition is reached.
READY Amplifier power supplies OK.
CAN TX, RX Indicates activity on CAN bus.
L1-L3 AC Power supplied to unit.

Testing and Tune Up 6.35

Testing of the RFPA is performed through the service platform. A

correction of the non-linearities in amplitude and phase will be
compensated via calibration software in the Tune Up section.
Figure 66 RF Power Amplifier Overview

Parts Main
Location Diagram

RFPA DORA CCA

U4
Roof

RF power
U5
CAN temperature
CAN2 SLIO
U2
CAN

Monitor

duty cycle

enable
ready

over I, under V
W342 U3 Power
Stage

Driver RF_Out
Tx Mod

RF_IN
X1
Mon. X2 (SSB1_2) X1
X62

TAS
(SSB1_1)
W309 W319 W019

DICO
(SSB1_3)
Monitor
RFPA_UNB U1 Bias
W340
Control
Unblank X3
PF

Mod 1
W308

Rx
IOP

Ready 2 PR
W307
Start up X4

Enable_Out U7

RFPA_ON U6
Monitor
W345
AC_IN X16 Power
Supply
L1
L2
LPD

L3 Water_IN Water_OUT
X5 X6

125
RF System - RF Power Amplifier DORA
 6
126

RF Power Amplifier (CORA) 6.4

Inputs
Signal Description
AC_IN The one-phase AC primary voltage of 230V. An internal
power supply generates all required voltages.
RF_IN Input of RF signal to be amplified. The nominal input
level for the full output power level is 0dBm.
RFPA_UNB To reduce noise and loss of the MR echo during reception
the amplifier is blanked during the receive cycle. This is
accomplished with the fiber optic signal RFPA_UNB.
When signal is active (light on), the amplifier is
activated.
PA_ON An enable signal (light on) required to bring the
functions. If any of these monitored functions fails, the Ready
condition is extinguished (LED goes out) and fiber optic signal to
DORA RFPA is removed (light out).
6.41
Two LEDs represent temperature related errors TS-ERR and HOT-
Sink.
In case of an error the Ready fiber optic signal to the RFPA_ON
input of the DORA RFPA will be set low (light out) causing the
DORA RFPA to shut down. This will be reported by the DORA’s CAN
unit back to the MPCU. Currently, the MPCU will react by setting the
PA_ON signal to CORA low and hence disable CORA and DORA.
Outputs 6.43

amplifier to operating condition. The purpose of this

signal is to be able to disable the amplifier, a Signal Description
requirement for the SAR monitoring. PF, PR Directional coupler (DICO) outputs of the forward and
reflected power levels of the RFPA output
RF_OUT This is hopefully where the amplified RF comes out
Function 6.42

The function of the CORA (Cost Optimized RF Amplifier) is

principally the same as the DORA. Differences are mentioned
below.
LEDs 6.4

LED Description
Power Up 6.4.21 DC AC Power supplied to unit
PA_ON Remote power on signal present
To bring the amplifier up to operation the PA_ON signal must be
applied. When the amplifier is ready, it will set the Ready signal READY Amplifier start-up completed, system ready
(light on). This signal is routed to the RFPA_On input of the DORA UNBLK Lights when being unblanked (i.e., when transmitting)
amplifier. This will tell the MPCU via CAN bus CORA is okay and TS-ERR Transistor junction temperature too high (non-latched)
MPCU will enable the DORA amplifier via CAN bus; the Start up - HOT-TSINK Heat sink temperature too high (non-latched)
LED in DORA lights up. Finally the Start up - LED switches off and
the Ready LED in the DORA lights up. Both RFPAs are ready now.

Monitoring 6.4.2

The CORA has integrated monitoring circuitry for various internal

Figure 67 RFPA Configuration for Spectroscopy Option

CCA
F1 X15
U2, DORA 230V 230VAC
U3
CAN

U4, CAN F2
160V
U5 SLIO

RF_Out
F3
RF_IN X1 X38 X1 15V1

TAS
Highpass
Filter
F4
15V2
Rx_Mod 1

PR X3
PF X4

RFPA_UNBLK U1

RFPA ON U6
P.S. Filter
SSB_1 Panel
Tx_Mod

SSB_2 CORA X1
U730 U710 U720 U700 V711 V702 V600
V712 V722 V701 X5 X4 X2
Ready U710

RF_Out
Monitoring

SAMI
X1 X50 X1
RF_IN
RF IN UNBLK READY UN BLK PA ON POWR POWF
RF OUT
Rx_Mod 2

OUT

PR X5
-30dB LED Name Descrip tion
PF X4 Sink
-30dB V 712 (HOT -Sink) heat sink temp too high (not latched)
Overtemp
U3 Junction
V 711 (T S-ERR) transistor junction temperature too high (non-latched)
U720 Overtemp
U4 CORA_UNBLK
lights indicating the amplifier is being unblanked, i.e., system is
IOP

V 722 UNBLK
transmitting
U1 PA_ON U700 lights when start-up of amplifier completed. Only goes out when an
P.S. V 702 Read y
error present
lights indicating the amplifier is being enabled, i.e., no RFSW D error
V 701 PA_ON
has occurred.
V 600 DC lights indicating the internal power supplies are ok

127
RF System - RF Power Amplifier (CORA)
 6
128

RFAS - RF Application System 6.5

Figure 68 RFAS Parts Location

Overview 6.51

The RFAS is a group of components whose functions are to

interface the RF front-end electronics to the individual transmit and
receive coils. In such a system where a wide variety of antenna
types are employed, the RFAS must provide several functional
components to support the various coil requirements. In all, five
components (or six if the spectroscopy option is installed) are
involved. These are located at the rear of the magnet on the right
side (the TAS, not shown, is located in the filter panel). If you can’t
find them there, then try the other rear right side of the magnet.

These are the components that make up the RFAS:

• Transmit Antenna Selector (TAS)
• SAMI
• Body Coil Channel Selector (BCCS) Harmony
• Body Coil Channel Selector (BCCS) Symphony
• Transmit Antenna LEvel Sensor (TALES)
• Body Tune Box (BTB) Harmony
• Body Tune Box (BTB) Symphony LCCS
Body Coil
• Local Coil Channel Selector (LCCS)
BCCS BTB

TALES

TAS
TAS - Transmit Antenna Selector 6.52 Figure 69 Transmit Antenna Selector

The TAS primary function is to route the RFPA output to the body
coil or TX-local coil (e.g. CP Extremity). Secondly, it has a built-in Parts
Location
Main
Diagram
50 Ohm dummy load to terminate the 90° hybrid of the BCCS_63

RFCI P.S.
(Symphony) and the RFPA when running test loops. X22 X22
Z1,
<W042> Z2 <W145>

Function 6.5.21

X8
TAS_C
Relay Control 6.52.1

UB+
The switches are actuated with DC relays operating at 15 volts Power

X10
which is supplied by the RFCI power supply.The control signals for

LCCS
CCA Relay X7 TAS_PWR
S1 and S2 are applied by the CAN controller of the LCCS. LEDs on Control <W1500>
both the LCCS and TAS provide the actual select status.
S1 Service
S2 local

LEDs 6.5.2

X62 X1

RFPA
LED State Description X4 BC_TX X1
ON power present (15V OK) SSB1_3
UB

BCCS
<W019>
ON Service (RFPA out to Dummy) S1 S2 X7
S1
OFF Imaging (RFPA out to S2)
ON TX to Local coil
S2
OFF TX to Body coil

TALES
X5 LC_TX X5

X6
Dummy
(Symphony)

Dummy

Grad Coil
X2 X3
Load

RCA
Water Water
Out In

Filter
Panel

129
RF System - RFAS - RF Application System
 6
130

SAMI for 63MHz 6.53 Figure 70 SAMI for 63MHz Systems

For broad-band spectroscopy applications the Local Coil transmit

path must be able to operate, in addition to the 1H frequency of CCA
63,6 MHz, also over the various spectroscopy frequencies. At the
higher spectral frequencies for the 3He and 19F nuclei, the X62 TAS_C

DORA
X1 X4
standard DORA RFPA can be used. For the lower spectral SSB1_3 SSB1_4 X1

BCCS
frequencies of the 13C, 23Na, 129Xe, 7Li and 31P nuclei an <W019> <W119>
X7
additional RFPA must be used. The Spectroscopy AMplifier
Interface allows the use of both amplifiers over the same Local Coil
transmit path without interfering with each other. X6 Dummy
<W123>
X7
Function

LCCS
TAS_CTRL X10
6.5.31

<W143>
The Frequency Switch prevents feeding the high frequency Pwr
X8
(63 MHz) output of the DORA RFPA from into the broad band RFPA
and to prevent feeding the x-nucleus low-frequency RF pulse into
X5 <W145>
the DORA RFPA.

RFCI PS
X22 Z1,
<W012> Z2

<W124>

X2

SAMI

CORA
X61 X1 Frequency
SSB2_3
<W020> Duplex

Filter X3

TALES
Panel TX_LC X5
<W125>
Application of SAMI 6.5.32 Figure 71 Decoupling Experiment
Decoupling experiment: during receiving the x-nucleus
Main
s p ec t r um p r o t o n R F i s t ra n s m i t t e d : s p e c t ra b e c o m e l e s s Diagram
complicated, fewer lines with better signal-to-noise result.
Decoupling Experiment
The Decoupling works as follows: A local Tx/Rx dual resonance Transmitting

DORA
c o i l i s u s e d . T h e b r o a d b a n d R F PA g e n e ra t e s x- n u c l e u s
magnetization and during receiving the x-nucleus signal the DORA TAS
RFPA applies a proton frequency RF pulse to the local coil in order
to decouple the spectra and hence getting a better signal to noise x-nucleus
coil
ratio.

CORA
proton
coil

SAMI

Receiver
LCCS

Decoupling Experiment
Receiving

DORA
TAS

x-nucleus
coil

CORA
proton
coil

SAMI
Receiver
LCCS

131
RF System - RFAS - RF Application System
 6
132

BCCS_42 6.54 Figure 73 BCCS for the Harmony

The Body Coil Channel Selector for the Harmony provides the IOP
components to allow using the Body Coil as a transmit and a U21
receive coil. The T/R switch connects the Body Coil to the transmit
or receive path, a directional coupler provides a tuning and testing SE_CTRL

RFCI PS
X23 BCCS_PWR
port and a pre-amplifier for the receive signal from the Body Coil.
X6 U1
Function 6.5.41
Filter
Panel
BCCS_42
Transmit / Receive Switch 6.54.1

The T/R switch is required when imaging with the Body Coil. It is T/R Switch
actively switched to provide a linear feed-through characteristic. X1 X2 X1
SSB_4 TX_BC1

TAS
Figure 72 T/R Switch action
)

TALES
When transmitting, the SE_CTRL is active
and X1 is connected to X2.The path X1 to X3
is electrically isolated (very high Z). If the
SE_CTRL signal is missing, the switch will
still work, but non-linear however.
When receiving, the SE_CTRL is inactive
(0V) and X2 is connected to X3.
Path X1-X2 is electrically isolated. LNA
.
31dB
Pre-amplifier (LNA) 6.54.12

The narrow-band, low noise amplifier has a fixed gain of 31dB.

Directional Coupler 6.54.13

X5 X4 X3
The directional coupler provides a port for tuning. A tune signal is
applied alternatively to both the forward and reflected side of the
directional coupler. The ratio of the amount of tune signal being

RX_BC1
coupled in the forward and reflected directions between the body

TU1R

TU1F
coil and the amplifier is influenced by the impedance of the body
coil. These signals are measured are compared to a matrix
acquired during the tune_up and |r| values then determined.
X32 X31 X9
LCCS
BCCS_63 - Body Coil Channel Selector 6.5 Figure 74 BCCS Symphony

The BCCS_63 version is in fact a double BCCS_42 with a hybrid at IOP

Main
the input and output. The hybrids are required to set up a 90° U21 Diagram
phase shift for the circular polarization of the body coil.
Parts

RFCI PS
X23
SE_CTRL
BCCS_PWR Location

Function 6.5.51

U1
X6
The T/R switch, preamplifiers and directional couplers are
Filter
described in the BCCS_42. Panel
BCCS_63
TX_Hybrid 6.5 .1
TX 90° T/R Switch
Hybrid
The Symphony/Sonata systems employ a circular polarized body TX_BC1
SSB4 0°
coil which require two 90° phase-shifted signals. The TX_Hybrid is

TALES
X1
a passive-reactive device which provides the 90° phase shifting X4 X1 X2

TAS
and splitting of the transmit signal required by the two CP Body dummy 90° TX_BC2
Coil systems. Assuming both 0° and 90° Body Coil systems are
X2
equally loaded and have the same impedance the power draw will X6 X7 X8

also be equal.

RX_Hybrid 6.5 .12

A part of the MR signal is received (picked up) by each of the two LNA
Body Coil 0° and 90° resonator systems and needs to be combined 31dB
to one coherent MR signal. This is achieved with the RX Hybrid. For
imaging the output is taken from X3. The output at X9 will be
RX 90°
terminated by the input of the LCCS Switch Matrix. The output at Hybrid
X9 is for BC Tuning and BTB/BC TestTools.hhh

X5 X4 X3 X9 X10 X11

RX_BC1

RX_BC2
TU1R

TU2R
TU1F

TU2F
X32 X31 X9 X10 X33 X34
LCCS

133
RF System - RFAS - RF Application System
 6
134

TALES - Transmit Antenna Level Sensor 6.56 Figure 75 TALES

The TALES is an RMS RF voltmeter for measuring forward and

Parts Main
reflected RF levels into the transmit coils. The measured values are Location Diagram
used as the basis of the SAR calculations.

Function TALES

X2.1
6.5.61

X2 X1 X3
TX_BC1 HF_1
Demodulation, Power Scaling

BCCS
W539 W519

BTB
6.56.1

X4
T h e R F s ig na l s p ic ke d up b y t he d i r ec t io nal c o upl e r s a r e X8 TX_BC2 X2 HF_2
demodulated and filtered to produce a DC voltage proportional to W538 W518

X2.2
the RF levels. The power scaling circuitry linearizes the measured
values to correct the demodulator’s non-linearities. See note

Pat. Tab.
X1
X5 X6
below.

TAS
X5 TX_LC TX_LC
W120 W515

Ref. Volt.
500mV
MUX 6.56.12

Body 90
During sequence activity, the MMC reads out all six values in

Body 0

Local
regular intervals, whether transmitting or not. The measured
Filter
values are read out over a MUX which is addressed by the MH_SEL Panel
select signals. The resulting CV signal is output to the RX_Module

Range
PF PR PF PR PF PR

Low
where it is digitized and sent to the MMC. A comparator in the
Receiver is connected to the CV input and will generate a signal Demodulation &
when the CV signal level indicates RF is being transmitted. THis Power Scaling
signal informs the SAR monitor U1-
U3

IOP
MH_SEL
W030 U1- MUX
LEDs 6.5.62 U3

The LEDs display the selected signal being measured by the MMC. +15V
–15V

RFCI PS
PWR_TALES
Outputs 6.5.63
W550

X23
X11
In addition to the RF signal being measured, the TALES outputs a
control dc reference voltage of 500mV. The reference is used to RX_Module
X7

X10A
verify the accuracy of the signal coming from the TALES.
CV
W121
Accuracy of TALES 6.5.64

1. Directional coupler Body Coil

The voltage error is 2% at 700V, i.e. +-14V. This deviation is an
absolute number. For example when measuring 40V, it is possible
to get values from 26V to 54V.

2. Directional coupler Local Coil Transmit Path.

Here are two measurement ranges: Low Range from 0 to 100V,
Medium Range from 100V to maximum voltage.
Voltage error for Low Range: 3% at 100V, i.e. +-3V.
Voltage error for Medium Range: 2% at 100V, i.e. +-2V.
The accuracies given above hold for proton frequency. For lower
frequencies, for example 25MHz (31P) the voltage error is about
1% higher.

NOTE Note: The accuracy of the DICO (directional coupler in

the RFPA) is better. But the DICO is calibrated by means
of the TALES at a voltage of about 400V. Assuming, at
400V the TALES has an error of 14V, this corresponds to
an error of 3.5%. In that case all measurement values of
the DICO have an error of 3.5%. At a level of 10V this is
0.35V deviation.

Service Requirements 6.5.65

NOTE The TALES will be replaced every two years with a newly
calibrated one. The old TALES will be sent to Erlangen
for re-calibration.

135
RF System - RFAS - RF Application System
 6
136

BTB_42 - Body Tune Box Harmony 6.57 Figure 76 BTB Harmony

For the 63MHz version go here. Parts Main

The BTB provides impedance matching between the 50 ohm of the Location Diagram

RF transmit path and the body coil whose impedance varies with
patient size and condition.
Those of you interested in a great explanation of the characteristics Static
BTB
CS5
of the BTB should go here. CS4
Detune
CP4
10
CS3 CP3
Relay Control 6.57.01
CS2 CP2

PTAB
The control signals for the relays are generated by the internal CAN U2 U5
CS1 CP1

controller. LEDs are provided to indicate the selected capacitors. Cool F VCC

D9
TX RX
Vcc
Relay Power Supply 6.57.02

U3,U4
The switches are actuated with DC relays. The relay control voltage
CAN
is generated by a +/-15 volts regulator on board that is supplied by

LCCS
CAN
the RFCI power supply. U1,U2
Dynamic
Static Detune 6.57.03 Detuning
X5
When transmitting with a transmit-capable local coil, the body coil

TALES
will be statically detuned by clamping the coil to ground, thus /4
preventing and absorption of the transmit energy into the body
coil.

BC_PIN
TX_BC
5 Relay
Dynamic Detuning 6.57.04
Control
4
Signals
When used in conjunction with the receive local coils, the body coil X2
3
will be tuned only when transmitting the excitation pulse. During X1

Body Coil
reception it will be detuned to prevent absorbing any MR-signal. A 2

fast switching PIN diode circuit on a λ/4 line is used for quick 1

RFCI
dynamic detuning. D15
Cs Cp static

Panel
Filter
1 2 3 4 detuning
LEDs 6.57.05

At the moment there are fourteen of them.

RFCI PS
X23 X4 P15V
Vcc
N15V Reg.
BTB relay
voltage
PWR
Body Tune Box Symphony 6.58 Figure 77 BTB Symphony

The BTB_63 provides impedance matching between the 50 ohm of

Main
the RF transmit path and the body coil whose impedance varies
U3,U4
CAN BTB 90 Diagram
with patient size and shape. U1,U2
Parts
Location
Function 6.5.81
BTB 0
Static
CS5
The BTB_63 is functionally identical to and performs in the same
Detune
CS4 CP4
10
way as the BTB_42 version, but has two matching networks, called CS3 CP3
BTB1 and BTB2, one for 0° and one for 90°, to support the circular CS2 CP2

PTAB
polarized body resonator. U2 U5
CS1 CP1
Cool F VCC
Although not visible in the diagram, BTB2 has the same BC_PIN,

D9
TX RX
TX_BC and BTB_PWR connections as BTB1. Vcc

U3,U4
CAN

LCCS
CAN
LEDs 6.5.82 U1,U2
Dynamic
There are twice as many as the Harmony version. Detuning
The BTB 90° on older systems may always show a Cooling Fault X5

TALES
(Cool_F LED always on). That does not indicate a system deficiency /4
since the monitoring is done at BTB 0° only. On newer BTBs the
Cool_F at BTB 90° is jumpered out.

BC_PIN
TX_BC
5 Relay
4 Control
Signals
X2
3
X1

Body Coil
2

RFCI
D15 90°
Cs Cp static

Panel
Filter
1 2 3 4 detuning

RFCI PS
X23 X4 P15V
Vcc
N15V Reg.
BTB relay
voltage
PWR

137
RF System - RFAS - RF Application System
 6
138

Body Coil 6.
Figure 78 Body Coil Harmony

BTB
The Body coil is used for whole-body imaging and for transmission
Body Coil 42 Parts
Location
Main
Diagram
of the excitation pulses when using the specialized local coil LP Aldermann/Grant
antennas for reception. The fact that practically all clinical Harmony
examinations are using the specialized local coils the role of the Faraday (foil layer glued
to inside surface
body coil is mainly to acquire scout scans and for use as transmit Shield of gradient coil)

coil.
The Body Coil employs a Alderman-Grant design. With this design,
it is not necessary to phase split the input signal. The coil is fed at
a single point.
ground
capacitors
The body coil comes in three flavors: straps
to magnet
• Body Coil 42 - Harmony
galvanic
• Body Coil 63 - Symphony isolation
• Body Coil-2 - Symphony
end ring

Body Coil 42 - Harmony 6.61

resonator cooling tubes

The body coil for the Harmony is a linear polarized (LP) resonator
assembly. RF feed point

When the incoming RF signal is at the resonant frequency of the

coil, the current flow through the coil resonator halves is inherently
distributed between each resonator half over the end-rings. Due to
high currents flowing over the capacitors, they are kept cold by the
secondary cool water.

cool water
RCA

Flow Temp D9 PTAB

Body Coil Symphony 6.62 Figure 79 Body Coil Symphony

The body coil for the Symphony employes a circular polarized (CP) BTB
coil. A CP coil has been chosen for its higher efficiency which is
Body Coil 63 Parts
Location
Main
Diagram
necessary to keep the SAR limits within tolerances due to higher RF CP Aldermann/Grant
transmit pulse amplitudes required by 1.5T systems. It is primarily Symphony
used for whole-body imaging and for transmission in conjunction Faraday (foil layer glued
to inside surface
with the specialized local coil antennas. Shield of gradient coil)

The Body Coil employs a Alderman-Grant design. The coil is fed at

two points placed at 90° distances, and thus the reason for the 90° 90°/2
Hybrid phase shifter in the BCCS. This coil was in production up ground
until August 2002, at which time it was replaced wiht the BC-2 coil straps
capacitors to magnet
(see below)
0° Resonator
When the incoming RF signal is at the resonant frequency of the 0°/1 end ring
coil, the current flow through the coil resonator halves is inherently
distributed between each resonator half over the end-rings. Very galvanic
high voltages and currents exist over the capacitors and require cooling tubes
isolation
cooling. The capacitors are placed on top of copper tubes carrying
RF feed point
secondary cool water.
90°/1
90°
Since this Body Coil is a circular polarized coil, decoupling is an
important issue. Strong coupling between the two resonator
systems leads to high transmitter reference values and hence
reduces the performance of the RF-transmit path. Decoupling is
checked with SESO RF-Testtools, "BTB/BC Test" and can only be 0°/2
corrected mechanically by evenly mounting both sides.

One principal advantage of all Harmony/Symphony body coils cool water

compared with Impact/Expert and Vision is the fact, that the
amplitude of the RF field outside the 500mm imaging values drops
very quickly to low values. Hence there will be no more field
RCA

ambiguity artifact (also called "third arm artefact").

Flow Temp D9 PTAB

139
RF System - Body Coil
 6
140

Body Coil Cool-water Monitoring 6.63 Figure 80 Monitor for Body Coil chill water

The Harmony Body Coil and the first version of Symphony Body BC BC
Coils (BC-47) use cooling water. The flow and temperature of this Harmony Symphony
water is monitored on the D9 in the Patient Table Control Unit.

Flow 6. .31 Temp Sensor

Flow Sensor
The cooling water flow is adjusted with the valve until the Flow
sensor has reached an output of 70Hz. The D9 monitors this 70Hz
±3Hz. When the flow becomes too low (refer to RF-repair
instructions for adjustment) LED V 83 (left) lights up.
V63
D9
Temperature 6. .32
Frequency
flow V83
Measurement of the cooling water temperature sensor resistance in 70Hz ±3Hz
the body resonator (return cooling water flow) can be done at U2
&

BTB
connector X21/D9 between Pins 9 and 10.
Resistance values of the temperature sensor:
temp
• R = 2000 Ohm at 20 °C R < 2140

• R > 2140 Ohm -> over temperature

• R < 2000 Ohm -> OK

V4
V12
V20 Gradient Coil erors
V28
V36
V55 18V supply ok
V63 na/water temp
V83 water flow/No errors

U1
U2
Gradient Coil
Supervision
Board D9
Body Coil-2 Symphony 6.64 Figure 81 Body Coil-2 Symphonys

In spring 2002 a new version for the 63 MHz Body Coil was
BTB Body Coil -2
introduced. The principal change is the capacitors being built in the Parts Main
Location Diagram
end-rings. This design is called "high-pass birdcage". This coil CP Birdcage
requires a new Body Tune Box (BTB 047-2) which uses different Symphony
capacitor values. The advantages compared to the first version 63 Faraday (foil layer glued
to inside surface
MHz body coil are: Shield of gradient coil)
• much less RF losses in the coil now, the value being about
500 to 600W, in the first version the losses were about
capacitors
1200W
• consequently the transmitter reference values (Adjust/ BC 0° T1
Transmitter) will be much lower, typically values of about 300 Tuning Cap ground
V will be measured for loader and large spherical phantom straps
to magnet
(360V for the old Body Coil)
• better signal to noise compared with the old Body Coil 0°
• no water cooling necessary
Resonator
Element
The following 63MHz Body Coils are delivered:

System "Old BC" "New BC" RF feed point

Symphony BC 047 BC 047-2
Sonata BC Sonata BC Sonata-2
90°
Decoupling
NOTE You have to configure the 63 MHz Body Coil type in the Capacitor TD
Service Software.
BC 90° T2
Tuning Cap

141
RF System - Body Coil
 6
142

LCCS - Local Coil Channel Selector 6.65 Figure 82 LCCS

BCCS
Overview 6. 5.01
Main
Diagram

X11
X3
X5
X10

X9
X4
The LCCS is a multi-channelled pre-amplifier providing receive

TX_Module
inputs for up to 16 local coil elements and 2 inputs for the Body Parts

RX_BC1
RX_BC2
X09
TTX3 Location
Coil. All inputs can be routed to one of 8 output preamplifiers via a

TU1R

TU2R
TU1F

TU2F
programmable switch matrix. This offers the maximum routing
flexibility. The pattern of switch selection depends on coil and

X10
hardware configuration. See IPA for more info. Filter

X31
X32
X33
X34
X9
Panel
X30
Switch Control 6. 5.02

The switch matrix is configured by the sequence according to user’s +15V OK

selection of connected coil elements. Although many selection –15V OK

RFCI P.S.
coil
possibilities are available, certain combinations should be adhered +10V OK preamp
supply
to in order to assure good IQ. See IPA for more info. X23 Test

X36
Amplifiers 6. 5.03
12
SGA
Each of the output channels has its own amplifier stage switchable
X01 X1 Switch
1

1. Rx
Mod
between 0dB (no gain) and +20dB. The gain level is set by the CAN
2
Matrix
or can be switched dynamically during the sequence via RFAS_SEL X11 X1

2. Rx
3
signal (for 3D sequences only).

Mod
4
3
Coil Supply Voltage 5 4

3. Rx
6. 5.04

Mod
Most local coils contain their own pre-amplifiers and are fed with a 6
+10V supply over the connecting coax cables. This 10V coil preamp X12 X2

4. Rx
7

Mod
supply is generated in the LCCS from the +15V. X08
8
X8
LEDs 6. 5.05
RFAS_SEL

IOP
To facilitate testing of the amplifiers several loops have been
U5 S1 ON
incorporated into the switch array. It is possible to switch the S2 ON
incoming tune signal output of the TX_Module to all of the eight S1 ON (SAMI)
amplifier stages but the first one for testing gain linearity and
BTB
2 U3
U4
stability. Also, the service software is able to test all of the switches TAS_CTRL

TAS
of the array. CAN
2 X35
PT

U1
U2
LCCS
Local Coils
The Siemens Integrated Panoramic Array™ concept for the
MAGNETOM Harmony and the MAGNETOM Symphony is the latest
evolution in coil handling and CP Array technology in the industry.
Integrated Panoramic Array
T h e m o d u l a r c o n c e p t o f c o m b i n i n g C P a r ra y c o i l s i n t o a
sophisticated Panoramic coil increases productivity, expands
anatomical coverage, and streamlines examinations – thus having
a tremendous impact on clinical efficiency.
Increases Productivity 6.7.1
• The new coil design by Siemens Medical Engineering allows
you to image the patient panoramically from head to thigh.
Multiple CP array coils can be used simultaneously without
having to reposition.
• To increase patient throughput and reduce set up time, the
lower section of the CP head array coil and the whole CP
spine array coil are integrated into the patient table. The coils
remain on the table for almost all examinations except for
knee (or other extremities) and breast imaging.
• These unique Siemens MAGNETOM features greatly
accelerate patient set-up times, coil handling, patient
throughput, and patient comfort.
6.7
Flexibility and Image Quality 6.7.12
• Up to four coils can be placed on the patient, largely
eliminating patient and coil repositioning.
• This panoramic combination of individual coil elements into
new configurations is the key to higher flexibility and
excellent image quality.
• This increased flexibility for large field of view imaging is
6.71
highly advantageous for head/neck imaging, whole spine
examinations, body screening and peripheral MR
Angiography.
The selection of local coil elements is achieved through the
sequence change platform.
Trend setting developments in the CP Array coil arena have lead to
the production of antenna assemblies which can cover a very wide
area and at the same time provide excellent signal quality.
An array coil consists of several resonator elements in an array
configuration the elements of which can be variably selected. Array
antennas have the main advantage that through their combination
larger FOVs can be achieved while maintaining the S/N advantages
smaller antenna exhibit.
All array coils employ circular polarized antenna elements for good
RF-field homogeneity and preamplifiers built into the coils thereby
increasing the signal to noise separation for unparalleled S/N
performance.
143
RF System - Local Coils
 6
144

Figure 83 The use of Array Coils in the Integrated Panoramic Array Concept

The IPA
Coils

The IPA Concept

Figure 84 Local Coils

IPA Compatible Coils IPA Coil

Internals

CP Head Array Dedicated Coils

HE
ID 22
CP Extremety

EX
CP Neck Array ID 2B
N1-N2
ID B5

CP Body Array
B1-B2 CP Spine Array CP Breast
ID 95 S1-S6
ID 25,D5
M1-M2
ID 58

LP Loop, lg
CP Flex, lg CP Flex, sm
Flex Coil Interface LP Loop, sm

LF SF LL SL
ID 89 ID 98 ID BD ID D9

145
RF System - Local Coils
 6
146

Coil Connector 6.72 Large FOV Adapter 6.74

The RF coil connectors are integrated within the socket elements of
the patient table. Each socket/plug element itself has four RF
Receive pins (RX1, RX2, RX3, RX4) and various Control pins.
The transmit RF Pin (A1 TX/TX_GND) is available and active for
socket element 1 only. In Magnetom Trio the transmit RF pin is
reversed: male is on top. Therefore you cannot use the same
Service Plug for tests, see below.
Involved in Coil Code Detection are Pins CODE1, CODE2 and
CODE_GND. If no Coil is connected, you will measure
approximately 9.07V between Pins 12 and 05 and between Pins 17
and 05. If the 10V generated on the RFCI motherboard is missing
or faulty an error message will be displayed on the LCD Display and
no measurement will be possible.
The Large FOV Adapter shifts the CP Spine Array Coil by 36cm out
of the bore allowing MR Angiography from kidneys to feet with one
coil setup. You can connect the Body Extender Coil + the CP Body
Array Coil (connected to the CP Spine Array) + the CP Spine Array
+ the 8 element Peripheral Angio Array-Coil (PAA).
The blue connector is only to connect the Body Array Extender,
other coils (for example the Large Flex coil) are not supported.
When the Body Extender is connected, the CP Spine Array
elements SP1 and SP2 are automatically disconnected and not
selectable, see the switches on the right hand graphics.
Figure 85 The Large FOV Adapter

The output control signals LCx_PIN_1-4 (for local coil connector Connector for Body Array Extender Back
x=1, 2, 3, and 4) are applied to the local coils over the local coil
connectors on the patient table, see the description "Dyscon
Module A and B", this chapter.
The Service Plug has to be connected to local coil connectors 1,2,3
and 4, respectively. It is used for many functional test in the Test
Tools. Besides this you can measure voltage levels with a DVM
(RFCI Interactive Tests, see TSG):
• control signals LCx_PIN_1-4 Connectors for connected to coil
• the 10V for the preamplifiers located in the surface coils CP Spine Array connectors 2 and 3

Internal Wiring of CP Array Coils 6.73

The diagram above shows the internal wiring of CP Spine Array

Coil, CP Neck Array Coil and CP Body Array Coil and its connections
to the coil connectors. The CP Body Array Extender is normally
connected to connector 1.
Figure 86 Coil Connector

1 2 LC Connectors 3 4 Main

IPA Coil RX4

RX3
RX2
Diagram

LCCS
Internals RX1

CP Body Array RFCI

Extension TALES

B3
LC Connector Pinout
RX4
RX3
RX2
10 B4 RX1
20 Rx4
RX_GND4
PIN4
RX_GND3
Rx3 RX4
PIN3 RX3
Code Low RX2 Large FOV
RX1
Adapter

PR1
PL1
PIN_GND1
Transmit
PIN_GND2
Code_GND
CP Neck Array
PIN2
Rx2 S1 N1

Peripheral Angio Array

RX_GND2 ID B5
Code High

PR2
PL2
PIN1
RX_GND1
11 Rx1 N2
1 CP S2

Spine
Array CP Body Array
S3
ID 25,D5

PR3
PL3
B1
ID 95
S4

B2

S5
LP

PR4
PL4
S6
CP

147
RF System - Local Coils
 6
148

RF Cabin Interface (RFCI) 6.8

Figure 87 RFCI Parts Location

Block
Before you get confused, RF Cabin interface has nothing to do with Diagram
the RF cabin (and thus the name). The RFCI is the control
electronics for the dynamic detuning of the Body Coil and local
coils. What you’ll find in this chapter:
• Overview
• CAN Module Interface
• Motherboard
- Voltage Monitoring
- Coil Code Detection
- Body Coil Detuning
• DYSCON Module A
DYSCON Module B
• RFCI Power Supply

Overview 6.81

RFCI Motherboard
The RFCI’s provides the tasks of generating the control signals for
the PIN diodes in the local coils and the BTB for static and dynamic
detuning of the Local coils and Body Coil and to recognize the coil RFCI Service Board
code. On-board monitoring supervises all power supplies and
detects if a coil change occurs during a sequence.
Figure 88 RFCI Overview

RFCI Parts Main

DysCon_A DysCon_B Service Location Diagram
Block Board
Diagram I I
LEDs

CAN test
Module -V -V points

X8/X9 X10/X11 X14-17

CAN

W344 U1,2 PIN Status from

CAN Coil Mask Voltage
Monitor
Interface Coil Code
W342 U3,4
Bodycoil
MC4C40

W373 Detune
X33
to
X1 Service Board

LC_PIN 9-16
BC_PIN

LC_PIN 1-8
MMC
Backplane Coil
Voltage
Code
Monitoring

RFCI
Motherboard
X5 X4 X2 X3 Exam Room
X2000
W354

W370

W371
W057 W376 Local Coil
Filter X5 BTB Connectors
W375

X23
W376

Panel
CCA
X1 X2 X20 Roof X21 W146
RF Cabin D15-2
W041 X2 W516 X2
Door Contact MPCU
CCA BC_PIN
RFCI W040 W515 X1
Power D15-1 X1
X3 X22 RFAS_Pwr PTAB
Supply W374 W042 W142 W550
RFAS
X22 X23 X23 X24

149
RF System - RF Cabin Interface (RFCI)
 6
150

CAN Module 6.82 Figure 89 CAN Module Interface

The CAN Module acts as the principle controller for the RFCI CAN
electronics. The CAN Module employs a CAN microcontroller whose Module
functions are:
• CAN Bus communication X2 X1

• Local Coil Code recognition

N_INT
LC_Code
• Error Interrupt Handling
• Coil Detune Signal Masking CS Ctrl

Door_Contact_Int
Coil_Change_Int
Power_Fail_Int
CAN Unit
ID

Unit Code

DTC/DFC
6.82.01

This CAN Module is also used in other components. The Unit code is CAN
an identifier byte used to identify the component in which the CAN Coil Interface
Module is plugged. Code

N_INT 6.82.02

CS
Two error interrupts, power_fail, coil_change, will cause an Ctrl
immediate stop of the sequence. Voltage Power Status
Monitoring
Status LED 6.82.03

CS
The CPU will activate the FW LED on the service board if the CPU is
Ctrl
in the firmware mode, the LW LED when in the loadware mode. DYSCON A Coil_Mask

CAN Module Interface 6.8.21

CS
DYSCON B
The CAN Module interface provides hardware specific interface Ctrl
circuitry for the CAN Module which has been designed as a general PIN Status
control unit for use in any sub-system. Bodycoil
Detune
DTC/DFC 6.82.1

The Data To Can (DTC) and Data From Can (DFC) busses transfer X4
X14-17
the various status information and coil masks to and from the CAN Service Board
RF Cabin
Module. LEDs on the Service board show the digital state of each of Door Contact DFC 1:8
these busses. DTC 1:8
Voltage Monitoring 6.83 Figure 90 Voltage Monitoring

To assure proper coil control and operation, all powers supply Main
voltages are monitored. Voltage Monitor Diagram

The Service Board indicates voltages are ok by green LEDs, the

voltage levels can be measured at test points also (see TSG).
P5V

Power Supply Failure 6.8.31

N5V
All voltages are monitored for under voltage. A failing or weak volt-
age will generate an interrupt to the CAN Module. Subsequently the
sequence will be stopped.

1
X1

_
V
The failing voltage is also read in by the CAN Module and status Power_Fail_Int

5
1

CAN Module
P
sent to the NUMARIS error log.
7
X5

2
_
RFCI Power Supply

V
5
1
P
DTC

N15V

N31V
X2
Service
Board
7 LEDs

X4 AC28V
Testpoints
7

151
RF System - RF Cabin Interface (RFCI)
 6
152

Coil Code Detection 6.84 Figure 91 Coil Code

The coil section has two functions: Main

• Coil code detection RFCI Diagram

• Coil code change recognition Coil Code

Detection
Coil Code Detection 6.8.41
10V
CCA Filter
To recognize the matrix or local coils that are connected, a coil 1.5kW Rc Roof Panel
Local coil
Plug
code recognition circuit has been realized using resistive coding. A 8 10W
10V source with an internal impedance of 1.5 kΩ is terminated with Rt
X2
the code resistors located inside every coil connector. These coding X3 21kW
Rid

resistors have 13 defined values and since each coil connector is

provided with two code lines a coil code, 2 to the power of 14 coil X20 D15 Local coil
8
code combinations are possible. A list of the Local coil codes can be X21 Connectors
Code
found in the “Listing of Coil Codes” table below. Resistor

A current source generates a constant current that is fed to the coil Change
connector. The local coils are equipped with one or more resistors Detector CAN
connected to the 8 code signal lines. Where a resistor is found, a Bus
voltage drop is generated which is read and recognized by the CAN Coil_Change_Interrupt
Module controller.

Coil Code Change 6.8.42

During the sequence, the coil code is continuously monitored. If it

changes (e.g. the patient pulls a coil connector), an interrupt to the
CAN Module will be generated. This will cause the sequence to be A CAN
stopped. D Module
List of Coil Code Resistor Values 6.8.43
Short Name Coil Name Coil Code
WT MAI Wrist Array 34
Coil code Resistance in Voltage at Notes
in Hex Ohm MUX WR Wrist 44
0 <63 0,314 Signifies a short = error! SH CP Shoulder Array 4a
1 132 - 162 0,938 HB MRIDC High Res.Head/Brain 4b
2 256 - 291 1,564 Shim Shim Device 55
3 402 - 444 2,19 BR CP Breast Array 58
4 577 - 627 2,816 PR PAA Peripheral Angio Array (right side) 73
5 790 - 853 3,442 PL PAA Peripheral Angio Array (left side) 83
6 1056 - 1135 4,066 LF CP Flex Large 89
7 1397 - 1500 4,692 FL7 Flex Loop 7 8b
8 1849 - 1989 5,318 BO CP Body Array (connected to Spine coil) 95
9 2478 - 2680 5,944 SF CP Flex Small 98
A 3412 - 3729 6,570 EN Endorectal 9d
B 4946 - 5511 7,196 FH1 FMRI Head Array a4
C 7930 - 9207 7,82 FH2 FMRI Head Array aa
D 16259 - 21493 8,446 LL Flex Loop Large bd
E 22000 9,072 signifies no coils connected C1 Customer Coil 1 (RX - Coil) c1
F 37572 9,698 signifies an open = error! C2 Customer Coil 2 (Tx/Rx - Coil) c2
SP2 CP Spine Array (connector 2) d5
SL Flex Loop Small d9
Listing of Coil Codes
BC Integrated Body resonator ee
6.8.4

Short Name Coil Name Coil Code Ser._P Service Plug TX mode = CC
RX mode = CD
CP Neck 11
SF CP Flex Small 98
HLS Heart Liver (Spec.) 12
EN Endorectal 9d
USI USAI Head Spec 14
HE CP Head Coil 22
SP1 CP Spine Array (Connector 1) 25
EX Extremity Coil 2b
DL Double Loop Array Left 2c
DR Double Loop Array Right 2d
CA MAI Carotid Array 31
UE MAI Upper Extremity Flex 32
LE MAI Lower Extremity Flex 33

153
RF System - RF Cabin Interface (RFCI)
 6
154

Body Coil Detuning 6.85 Figure 92 Body Coil Dynamic Detuning Control

The dynamic detuning of the Body Coil is accomplished with a λ/

MC4C40 Main
4 line tied to a PIN diode. The diode, when shorted (600mA), is Body Coil Diagram
transformed by the λ/4 line to a high impedance and the de-tuning MMC

circuit is without effect: the Body Coil will be tuned. When the
Backplane Dynamic
X33
diode is opened (-30V) the Body Coil will be detuned. Detuning
Dynamic
The dynamic control signal IN_BC is produced by the two dynamic Control
signals Tx_Rx, Dyn_Stat and a digital memory consisting of 2
X1
sets of 2 bits each. This allows the CAN module to freely program
the diode state for tuning or detuning according to coil or coil RFCI Motherboard

Tx_Rx

Dyn_Stat
combination. This concept offers the greatest flexibility and is
easily programmable. 600mA

The level of the output signal BC_PIN is determined by IN_BC X2

according to the table below. For the Symphony/Sonata systems

Tx
with two BTBs the signal is doubled. Rx
IN_BC
Switch
For trouble shooting purposes the status of the dynamic tuning/ & BC_PIN
detuning signals is indicated by LEDs at the service board. Tx
Monitor X3

Additionally, test points are available. Rx

LEDs

Mask
Coil -30V

Coil
U_On_I_
IN_BC BC_PIN Off_BC UR_On IF_On State
H 600mA OFF OFF ON tuned PIN
CAN Status
L -30V ON ON OFF detuned Interface

The monitor checks the output voltage and current levels. The
UR_On and IF_On LEDs signify that the current or voltage level of
the output signal are ok.

UR_On_BC
CAN +5
Module U_On_I_Off_BC
IF_On_BC

Out_BC
Service Bd.
DYSCON Module A 6.86 Figure 93 Local Coil Dynamic Detuning Control

The dynamic detuning of the local coils is accomplished using PIN

diodes which are strategically placed in the coil.
MC4C40 Lo cal Coil Main
Diagram
MMC
The dynamic control signal IN_LC is produced by the two dynamic Backplane Dynamic
signals Coil_Mask_Sel, LC_Ctrl and a digital mask from the CAN X33
Detuning
module. This allows the CAN module to freely program the diode Dynamic
state for tuning or detuning according to coil or coil combination. Control
This concept offers the greatest coil programming flexibility.
X1
The output signals LC1_PIN_1-4 (local coil connector 1) and
RFCI Motherboard

Tx_Rx
Dyn_Stat
LC2_PIN_1-4 (local coal connector 2) are applied to the local coil
over the local coil connectors on the patient table. 100mA
For trouble shooting purpose the status of the dynamic tuning/ LC1_PIN_1-4
detuning signals is indicated by LEDs at the service board.
LC2_PIN_1-4
Additionally, test points are available. Tx
X2
Rx Switch
IN_1-8
LEDs &
U_On_I_O
Monitor
Tx
IN_LC LC_PIN ff_LC UR_On IF_On Coil Rx
H 100mA OFF OFF ON detuned
DYSCON

Mask
-30V

Coil
L -30V ON ON OFF tuned Module A

PIN
As seen in the table above, the IN_LC signal controls the output of CAN Status
the PIN driver circuit. A monitor is also built in which checks the Interface
output voltage or current levels. The UR_On and IF_On LEDs
signify that the current or voltage level of the output signal is ok.
8
NOTE The table above applies for ALL Siemens coils, but not
necessarily for third party coils where the tune logic may
UR_On_1-8
be opposite. CAN +5
Module U_On_I_Off_1-8
IF_On_1-8

NOTE The cable from the MMC delivering the dynamic control
signals is NOT tested by the service software Service Bd.
Out_1-8

155
RF System - RF Cabin Interface (RFCI)
 6
156

DYSCON Module B 6.87 Figure 94 Local Coil Dynamic Detuning Control

The dynamic detuning of the local coils is accomplished using PIN

diodes which are strategically placed in the coil electronics.
MC4C40 Lo cal Coil Main
Diagram
MMC
The dynamic control signal IN_LC is produced by the two dynamic Backplane Dynamic
signals Coil_Mask_Sel, LC_Ctrl and a digital mask from the CAN X33
Detuning
module. This allows the CAN module to freely program the diode
Dynamic
state for tuning or detuning according to coil or coil combination. Control
This concept offers the greatest programming flexibility.
X1
The output signals LC1_PIN_1-4 (local coil connector 1) and
RFCI Motherboard

Tx_Rx
Dyn_Stat
LC2_PIN_1-4 (local coal connector 2) are applied to the local coil
over the local coil connectors on the patient table.
100mA
For trouble shooting purpose the status of the dynamic tuning/
LC3_PIN_1-4
detuning signals is indicated by LEDs at the service board.
LC4_PIN_1-4
Additionally, test points are available. Tx
X3
Rx Switch
LEDs IN_9-16
&
U_On_I_O Monitor
Tx
IN_LC LC_PIN ff_LC UR_On IF_On Coil Rx
H 100mA OFF OFF ON detuned
DYSCON

Mask
L -30V ON ON OFF tuned -30V

Coil
Module B

PIN
As seen in the table above, the IN_LC signal controls the output of CAN Status
the PIN driver circuit. A monitor is also built in which checks the Interface
output voltage or current levels. The UR_On and IF_On LEDs
signify that the current or voltage level of the output signal is ok.
8
NOTE The table above applies for ALL Siemens coils, but not
necessarily for third party coils where the tune logic may
be opposite. CAN +5
UR_On_9-16

Module U_On_I_Off_9-16
IF_On_9-16

NOTE The cable from the MMC delivering the dynamic control
signals is NOT tested by the service software Service Bd.
Out_9-16
RFCI Power Supply 6.8 Figure 95 RFCI Power Supply

The power supply is an OEM component. It has built-in monitoring LPD

Water_OUT
Water_IN
for protection against short circuit, over voltage and over RFCI P.S.
temperature. And it’s water cooled. E4 K2204
LEDs 6.8.81
X900

LED Description
I fold back Indicates normal operation
I Constant Indicates an error. Output current will be limited.
Overtemp 1 >50°C - Warning
Overtemp 2 >60°C - Fatal. Power supply shuts down
Output Voltage One for each output voltage. Indicates only that a
voltage is present. Level monitoring is done on the
RFCI motherboard.
Output Error Indicates that any error has occurred.
Crow bar Active Indicates that an over voltage has occurred. It will Overcurrent I I I I I
stay on until the power supply has been turned off. protection

V V V V V
Voltage
The Overtemp status signal going to the CAN Module on the RFCI Regulator
will generate an error to the MMC. N31V N15V P15V N5V P5V

Overtemp disable
Overvoltage
protection

AC28V

Distribution / Connectors

Overtemp
_warn
X1 X2 X3
RFCI RFCI RFSU & RFAS

157
RF System - RF Cabin Interface (RFCI)
 6
158

This page intentionally left blank.

 Section

7 Patient Handling 7

Introduction 7.1
Figure 96 Horizontal Motor Interconnections

The Patient Handling system includes all those components which

in any way interact with the patient and consists of these functional
blocks: Video Monitoring Intercom
• Patient Table
• Trolley (Option)
• Intercom and Patient Video Monitor
• Physiological Monitor (PMU)

Physiological Patient Table

Monitoring

159
Patient Handling - Introduction
 7
160

Figure 97 Patient Handling Overview Diagram

Patient Handling Parts

Location
System
Diagram

Overview
W54908 TULI TULI Patient
PTAB Control Unit A5198 A5198 Fan
A510
W54909
Coil Temp W54906 Camera
X38 W561 A5196
D9 X37
W5192
X21 W552 Grad Coil Body Coil
X20
Temp Water
MPCU

PMU FO
Converter Control Panel Display
X28 W5464 W5467
W5181
A5162 A517

W5465 Control Panel W5467 Display Light

CAN

Controller X27
A5161 A517 Marker
W5140

X23 W??? MIC Control Panel

W5466
Horizontal A5162 Magnet Cover
Endstage
A512
Backplane
A515
Tunnel Light PMU
Controller
W5182 W549051 NC/HP
X22
A5195
X35 W5421
Power W5422
Supply X32
W54231
X31
W5132
Intercom

X29 W5413
W5415 Micro Micro Micro
X30 Switches Switches Switches
X25
W140 X36
W5453
X33
X39

W5412 Vertical Horizontal

X5 X2 Drive Drive
LPD

X100 W5411
X3
W160 Power A531 A532
Supply X51 Frequency
Xformer X4A A5131 Converter Table
A5131-T1 X52 A511 Lifting Column Support Frame Top
Patient Table 7.2
Figure 98 Patient Table Parts Location

Integrated Panoramic Positioning (IPP) allows remote patient Block

Diagram
handling at the syngo Acquisition Workplace for optimized workflow
efficiency.
In combination with the automatic table move and a scan range of
up to 154 cm, IPP allows the planning of whole examination series
and automates the dynamic acquisition process, e.g. peripheral
angiography.
• Remote coil selection graphically on screen
• Remote table move
• Simultaneous setup of multiple exams Display
• Ultra-light weight coils
• Imaging with optimized surface coil quality
All examinations of the lower extremities including pelvis can be
performed in the feet first position, reducing the level of anxiety Control
experienced by highly claustrophobic patients. Panel
Free-floating table: Free foot room for the attending staff and
better access to the patient (cantilevered table design) Table
extends approx. 42 cm beyond the back of the system for
additional patient access Removable tabletop and trolley (optional)
Second removable tabletop and trolley (optional)

Specification Value
Max. patient weight 200kg (440 lbs)
Max scan range 154 cm (5’11")
Control Unit Support Frame Table Top
Horizontal table movement 212 cm (7’)

Lifting Column

161
Patient Handling - Patient Table
 7
162

Lifting Column 7.21 Figure 99 Lifting Column

The Patient Table lifting column is a mechanical assembly using a

motor driven screw-spidle to move a drive nut in the vertical Back

direction. The drive nut pushes up or lets down the attached

Lifting
support frame. The Support Frame is not mechanically fixed to the Column
drive nut but is resting upon it through its own weight. The support
Frame is sliding on guide rails attached on either side of the lifting
column. Guide
Rails
The lifting column is fixed to the magnet over an adjustable frame
that is attached to the front and left side of the magnet frame. The
Patient Table can be de-attached from this frame to facilitate
installation in tight rooms conditions.

Spindle

Vertical
Slide Motor
Plate

Drive
Nut

Support Frame
Support Frame 7.2 Figure 100 Support Frame

The support frame must support the weight of the patient (plus his
clothes) and the Patient Table top. The components located within Back
the support frame: Support
• Horizontal Drive motor. Frame
• Acoustic Transducer (see Intercom section)
• cable guide
• several table position switches top side
Cable
Guide

Acoustic
Transducer

Horizontal
Motor

under side
drive table
belt belt

transfer
pulley

163
Patient Handling - Patient Table
 7
164

Control Unit 7.23 Figure 101 Support Frame

The Control Unit contains the electronic control components and Block Parts
consists of the Control Unit rack, Control Unit backplane, Power Diagram Location
Supply A5131 and transformer.
backplane Power Supply A5131
These components are described in detail in further pages. Go to
the Block Diagram for details.

Power Supply A5132

Tunnel Light Controller A5182

Horizontal Motor End Stage A512

Controller A5140

PMU FO Converter A5181

Coil Temp Monitor D9 A5192

Vertical Drive 7.24
frequency and phase rotation, the Converter can control direction
and speed of the Vertical Motor.
The Vertical Drive mechanics consists of a vertical screw spindle
driven by a 3 phase AC motor Control signals for the Frequency Converter are generated by the
Main Controller and distributed via X33 Patient-Handling Control-
Backplane to X501 at the Converter.
Function 7.2.41

The vertical motion is realized on a three phase asynchronous

motor that drives a self-locking spindle assembly via toothbelt. The
motor is controlled by a programmable Frequency Converter. The
parameter set of the Converter is programmed/checked by the
Main Controller. In case of parameter set differences the Main
Controller is reloading the Converter automatically.
After replacement the Frequency Converter has to be initialized
(see TSG, Mode M7, parameterizing the converter).
Vertical motion is enabled only if the table top is completely out of
the magnet bore. This condition is detected by the SZ10 switch.The
actual vertical position of the table is detected by the SY0 - SY5
switches.
The SY6 and the two (A/B) SZ15 switches composing an interlock
interrupting the vertical motion in case of a mechanical blockage
(i.e. something is below the table).

NOTE For detailed description of switches see TSG.

Interconnections 7.2.42

The power for the Patient Table is supplied by the Power

Distribution system in the CCA (Fuse breaker F15) via connector
X100 at the Power Supply backplane.
The Frequency Converter converter can be switched on or off with
help of the INV_SUPPLY signal from the Main Controller and relay
K4, located at the Power Supply Backplane.
By generating a three-phase AC voltage that can be changed in

165
Patient Handling - Patient Table
 7
166

Figure 102 Vertical Drive Control

Main
Vertical Drive Diagram

Manual

X27 2
I C bus
CAN
Vertical Collision
X30
SpindleNut_Reactor Microswitches
X29 SY6 Support frame collision
Vertical Control Switches
SZ15 Table Top collision
X36 Thermal Switch

Controller X33 Vertical Position

Converter_Control
A5140 Microswitches
SY1 Table lower position
SY5 Trolley docked
Power 10V_Sens SY4 Patient tray capture
Supply SY3 Patient tray release
A5132 Backplane SY2 Table slow
SY0 Table upper position
A515
SZ10 Home position (K4 enable)
X39
X501
X5

X100 X51 Vertical Motor

LPD

POWER

F7 K4

X52
MOTOR
Frequency 3 AC
Converter motor
X4
Power
Transform er Supply X3 POWER_VERTICAL_MOTOR

A5131-T1 A5131 A531

Figure 103 Vertical Drive Interconnections

LPD F15
Frequency Power Supply Back
A5131
Converter W5451 X51 X100
Gnd 6 6

N 5 5
K4 F7 15A/M
L 4 4
Vertical Motor
INV_SUPPLY
W5414 X52 X3 W5411 Motor in connection
Gnd 6 6

BK
W1 V2
U 2 2

RD
V1 U2
V 5 5

YE U1 V1 W1
W U1 W2
8 8
X5 M
3~
Gnd
X39
Backplane
W5453 A515 YE U2 V2 W2
X501 X33
Gnd BK 8 RD

Serial A BN 9 BK
Serial B RD 10
W5412
DIM 1 OR 19 CAN X36
DIM 2 16 1 BK
YE
DIM 3 GN 15 T1 Thermal
DIM 4 BU 2 Switch
3 BN
Sparc VT 20
T2
RL 1A GY 23 Controller
RL 2B WH 24 A5140
A511 A531

167
Patient Handling - Patient Table
 7
168

Horizontal Drive Control 7.25

Figure 104 Horizontal Motor Interconnections

Function 7.2.51
Back

Horizontal motion of the patient table is enabled if the table has

reached the vertical top position (detected by toggle switch SY0).
The Main Controller A5140 and the Horizontal Power Stage A512

Backplane
are responsible for the horizontal movement control. Horizontal

PTAB
The Horizontal Drive motor is a DC type with integrated gearbox Motor
and electro-mechanical brake (brake impedance 100 Ohms, to be
measured at X1, Pin 5/6). An incremental encoder is coupled to the Assembly
motor detecting the relative motion of the table. X35 X1
6 - Mot 4
During horizontal positioning stops the table plate is locked actively
Horizontal 7
by delta-position detection and motor force (the electro- Endstage
mechanical brake is not active yet). After start of measurement,
the Main Controller A5140 turns into a sleep mode and switches-off A512
8
9
+Mot 3
M
the horizontal motor. The electro-mechanical brake gets active
4 Gnd 8
now, the table plate is locked again (~20 VDC from A5140, applied
via connector X1 Pin 5/6). 2 Brake 6

In vertical mode, the electro-mechanical brake is always active. 1 Gnd 5

W5421

LEDs 7.2.52
X32 X2
7 5V_ENC 1
LED
15 ENC_A 3
POWER 38 V_AC - Power supply for end stage
16 ENC_/A 7
SUPPLY Power supply off during MR measurement
19 ENC_B 4
RUN End stage is enabled and no error present
20 ENC_/B 8
ERROR_C Over current: Motor A532, cable W5421, end stage A512
ERROR_S Over or under voltage or overtemperature of the end stage Controller 23 ENC_N 5
24 ENC_/N 9
A5140

8 0V 6
W5422
Increment-Encoder
Figure 105 Horizontal Drive Control

Horizontal Drive Main

Diagram

X27 2
FW I C bus
LW
Horz Fault
Horz Ok

Controller Horizontal
A5140 Position
X31 Microswitches

Power Error SZ10 Home position

X32 SZ11 Obstacle present
Supply
Run PWM, Enable Encoder SZ12 Trolley present
Over_Cur SZ15 Table top collision
Over_Volt_Temp
X35 Motor_Brake
Motor Drive SZ13 Patient tray docked
Horizontal
SZ14 Pateint tray latched
Endstage
A512

Horizontal
5V
Power
Motor Assy.
Supply 10V_Sens Optical Encoder
X2
A5132
Backplane
38V_AC A515
X1
X39

X5

X4
Power
Transform er Supply
A5131-T1 A5131 A532

169
Patient Handling - Patient Table
 7
170

Figure 106 Patient Table Microswitch locationsl

Microswitch Vertical
Drive
Horizontal
Drive

Locations

Cam SY4

Cam SY3 SZ14A,B

Cam SY2
Cam SY0
SZ13

SY1,SY5,SY4,SY3,SY2,SY0

SZ12 SZ15A,B

SY6
SZ10
SZ11

Switches in BLUE are for the Trolley option

Power Supply A5131 7.26

Figure 107 Power Supply A5131 Layout

The Power Supply A5131, also called Power Supply backplane,
provides the interconnections between the mains power from the Block
Diagram
Line Power Distribution, transformer, Frequency Converter and X52 X3
Patient Table Control Unit as well as provide relay circuitry for
powering the Frequency converter on and off and control the X5 Power
Patient Fan speed. Supply X51
X4
A5131
Function 7.2.61

X2 X100
Transformer Interface 7.26.1

The A5131 provides the interconnects for the 230V AC mains from
the LPD to the transformer. The transformer secondary voltages
F5 F6 F7
are fed back to the A5131 board and passed on to the Power F1 F2 F3 F4

Supply within the Control Unit. SOme of these voltages are fused
(see diagram below).
K3 K2 K1 K4
Fan Control 7.26.12

THe fan speed is controlled by varying the applied voltage to the

fan via relays K1-K3. The relays are activated by the Controller.

C1 C2 C3 C4 C5

X100 Mains input

X2 Patient Fan
X3 Vertical Motor
X4 transformer secondary
X5 connection to PTAB
X51 Freq Converter
X52 Freq Converter

171
Patient Handling - Patient Table
 7
172

Figure 108 Power Supply A5131

X4 Main
X100 F5 A5131-T1 Diagram
L
1 1
4 2 230V
7 3 Parts
N 4 Location
2
5 5
F7 F6 18V
8 6
3 7
8 38V
6
9 9
K4 10 13,5V
11
10V
X51 12
L 13
1 F4 F3 16,5V_1
14
4 15
7 16 16,5V_2
N
W5451 2 F2 F1

Tunnel Light
5
Power
Frequency Converter

A5182
8 X5 18V

Backplane
A515
3
6 Supply 18V
9
12
9
A5131 38V
15
18

Horz End
X52 8 X39
13.5V

A512
U 17 38V
1
2 16
V 10V
13
4 C1-3 C4,5 Fan 10
5 16.5V
W5414 Control 14

PMU
W 13.5V
7 11
8 R1 R3 16.5V
K1 7 10V
3

PwrSply
Fan_Speed_0

A5132
6 K2 2 16.5V
Fan_Speed_1 16.5V
9 R2 R4 K3 3
Fan_Speed_2
5
K4 FreqCon_Supply
6
X3 GND
1

A5140
K1 K2 K3 W5452

Cont.
1 4
2
Vert Motor

4 X2
5
W5414

Patient
7 1

Fan
2 W54909
8
3
3 5
6
9 A5199
Power Supply A5132 7.27

The Power Supply A5132, provides the various operating voltages

required by the Control Unit, Intercom components on the magnet
and PMU. See diagram below.

Function 7.2.71

Voltage monitoring 7.27.1

All voltages are monitored directly by the Controller. The controller

can read the voltages in via the I2C bus. A seperate monitor is
monitoring the +10V_DC voltage and will issue the Power_Fail
error signal if this voltage fails.

173
Patient Handling - Patient Table
 7
174

Figure 109 Power Supply A5132

Main
Diagram

F12 13.5V_VID X37

Camera
REG A5196

F11 X29-31 Micro

16.5V_1 18V_Sens
Switches
+ F18
18V 18V_TMP
Coil Temp
F16 18V_PMU D9
W5192

16.5V_2 F19 -18V_TMP

PMU FO
F17 -18V_PMU Converter
W5181
X27
F13 10.5V_PAN Control Panels
and Display
X28
F15 10.5V_PMU
10V X32 Horizontal
5V_ENC
+ F14 7.5V_CON
Drive
REG A532

5V 2
REG I C Controller
I/O
W5140

Power_Fail
Mon
Horizontal
Power Supply A5132 Endstage
A512

Tunnel Light
Power Controller
LPD

PWR_RF Room X100 13.5VAC

W5182
Supply
Xformer X4A A5131 X39 Backplane
X5
A5131-T1 A515
Tunnel Light 7.28

The Tunnel Light board provides the circuitry that enables the
controller to vary the intensity of the tunnel lights.

Function 7.2.81

The tunnel lights are 12V halogen lamps. The voltage to the lamps
is varied by the Controller with the signals Light_0 and Light_1:

Light Level light_0 light_1

light off 0 0
LOW light level 1 0
MEDIUM light level 0 1
HIGH light level 1 1

Heat sink thermal switch 7.28.1

The driver elements are mounted on a heat sink the temperature of

which is monitored by a thermal switch. If the heat sink temp
opens the thermal switch, the 12V is removed from the OP-Amp
and the lights are turned off. The TEMP LED will also light.

175
Patient Handling - Patient Table
 7
176

Figure 110 Tunnel Light

Main
Diagram
F21
Power
+ +12V
18V_AC
X38
TULI
-12V A5198
Lamp 1

Heat Sink
TULI
Lamp 2 A5198

Temp +12V

LSB Light_0

Controller
MSB Light_1 W5140

Tunnel Light A5182

Power
LPD

PWR_RF Room X100

Supply
Xformer X4A A5131 X39 Backplane
X5
A5131-T1 A515
Control Panel and Display 7.29

NOTE Left buttons for patient convenience, right buttons for

patient positioning.
Interconnections 7.2.91

Up to three operating panels can be connected to the system. The Figure 112 Patient Table Display
number of connected Control Panels is recognized automatically
during powerup of Patient Table electronics. Block Parts
Diagram Location
Front Panels PAN_0 and PAN_2 and Front Display DISPLAY_0 are
connected in series to X27 at the Patient Handling Control 12
Backplane. An optional Back Panel PAN_1 and DISPLAY_1 can be 1
11
connected to X28. 2
1 2 3 4
An Operating Panel can be removed from the HW-configuration
(e.g. for troubleshooting). In that case the two free cable ends
10
(connectors X1/female and X2/male) have to be connected
together. mm
9
Figure 111 Patient Handling Control Panel (left)

Block Parts 8
Diagram Location
STOP

START STOP 7
Headphone
Speaker Volume
Volume Patient Table 3 4 5 6
Air Tunnel Table HOME
Light STOP 1 Text field for displaying status messages
2 Coil socket assignments
3,4 Start and Stop
5 Status of laser light localizer
6 Table Stop
7 Center Position
8 Home Position
9 Current tabletop movement
10 Relative position of the tabletop
Measurement
to 11 Tunnel ventilation
Joystick Light Isocenter 12 Tunnel lighting
start/stop
Measurement Marker

177
Patient Handling - Patient Table
 7
178

Figure 113 Operating Panel and Display interconnections

DISP_0 (front) PAN_2(front right) Main

Light X1 X2 X1 X2
PAN_0 (front left)
Diagram
Marker
1 1 ID_0
X3
1 ID_1 2 X1 X27
3 3 3 3 3 3 7
GND
5 4 4 4
5V
Reg 5 5 5 5 5 6
10.5V_PAN
6 6 6 6 6 9

I C bus
/WAKE_UP

2
X4 7 7 7 7 7 1
1 2 SCL_PAN
I C 8 8 8 8 8 2
3 SDA_PAN
9 9 9 9 9 5
5 10.5V_PAN
10 10 10 10 10 8
SHIELD
11 11 11 11 3
LOOP_0
12 STOP 12 12 STOP 12 4
LOOP_1
13 12
1 2 3 4
W5467 POT_GND
A517mm W5466 14 13
POT_HP
15 10
POT_VCC
(back opt.)
STOP
16 15
START STOP POT_LSP
A5162 A5161
W5465

PAN_1 (back opt.)

X1 X2 X1 X28
DISP_1 1 1 1
ID_0

3 3 3 7 GND
4 4 4
5 5 5 6 +10.5_DC_PAN
6 6 6 9 /WAKE_UP
7 7 7 1
SCL_PAN
8 8 8 2 SDA_PAN
9 9 9 5 +10.5_DC_PAN
10 10 10 8
SHIELD
A517 11 11 3
LOOP_0
W5467 12 12 4
STOP LOOP_1
W5464

Backplane
A5162 A515
 Grad

X1
X20
Coil
D9 Coil Temp Monitor A5192
Body
HP
NC/
X22

X21
Coil

1
2

Mic
Mic

X2
X23
X24

PMU Converter A5181

Intercom
X25

spare Control

X3
X26
X27

Panel F
Figure 114 Control Unit Backplane

spare
Control
Panel R
X28

X4
spare Switch
X29

Vertical

Switch
X30

Spindel
X5

Switch
X31

Horizontal
X6
PTAB

A5115

Controller A5140
Horizontal
Backplane

Encoder
X32

Vert Mot
X33

Control
X7

Horizontal Endstage A512

spare
X34
X36

X35

Motor Dr
Horizontal

Vert Mot
X8

Therm Sw
X37

Tunnel Light Controller A5182

Camera
Power
X38

Lights
Tunnel

X9
S1

Power Supply A5132

Power,
Fan Ctrl
S2

X39

Patient Handling - Patient Table

Main
Diagram

179
 7
180

Intercom System 7.3

Figure 115 Operating Unit Intercom.

The Intercom system contains the following standard components: Back

• Central Unit Intercom K2201. This box is mounted at rear 5
of the operator’s console. Here an audio source, e.g. a CD
player or a walkman can be connected. R1 is a potentiometer 6
to adjust the level of the speech from Control Room to RF
7
cabin (Operator speakes) in order to avoid acoustic feedback
when the door is opened, R2 is a potentiometer to adjust the 8
level of speech from RF cabin to Control Room (Patient
4
speaks, Noise of Coldhead, Gradient Noise) to avoid acoustic 9
feedback when the door is opened.
• Operating Unit Intercom. Contains a red table stop button 3
10
on top. Pressing this button twice will stop a running
sequence. For the functions see graphics on the right. 11
2
• Microphone board. Located in magnet front cover.
• Squezze Bulb. For nurse call. Pressing the bulb an audible 12
signal sounds on the Operating Unit Intercom. 1
• Head Phone. Via head phone the patient can hear operator’s
anouncements and music. The music is interrupted for 13
anouncements.
• Wall Loud Speaker, mounted on magnet frame. Plays music
and operator’s anouncements.
1) Volume in RF cabin (speech only)
• 2) Volume console (listening)
Additional options are: 3) CV/CBT switch (Computer Voice or background music)
• CCD Camera at rear side of magnet. The image is 4) Physio beeper volume trigger (4 levels)
transferred via fiber optic to the 5) Table stop/sequence stop button
• Patient Monitor. The monitor is adjustable, see description 6) Microphone
system manual. 7) LED listening is on
8) Button listening on/off
9) LED music on
10) Button play music in cabin on/off
11) LED squeeze bulb active
12) Speak button and squeeze bulb reset button
13) Loudspeaker
Figure 116 Intercom Overview Diagram

System
Intercom and Patient Monitor Overview Diagram

Control Room RF-Cabin

Patient Table
Central Unit X10 Magnet
Loud Connections

Music In
Mic out
Intercom Speaker

CV In
Microphone
X11 X12 Squeeze
R1 R2 Line Head
Bulb
Phone
out

X23

X101
X1 X2 X25 X22
W058 W140 W549051

D15-4
Physio Beeper

Acoustic
W047

W074
Power
PTAB Transducer
A515

X37 Patient Table

Filter Panel
X33 X100
Operating Unit CCD Camera
Power
Intercom CCA Patient Monitor W54906
Roof

X3 Com 1 Video
W035
MPCU

MMC

181
Patient Handling - Intercom System
 7
182

Central Unit Intercom 7.5.3 7.3.01

Figure 140 shows a simplified logic. The real logic is more complex
and realized in ICs, so it is not possible to measure any "switch".
Anyway the drawing shows more details than described above or in
the Operating Instruction.
Figure 117 Central Unit Intercom Overview Diagram

Main
Diagram

green
Playback Physio
red Beeper
Record

MIC CV Music Line

out in X10 in out
X11

TRIGG OSC
0123

CV CBT

R1
Head
Phone

R S
Squeeze Bulb
R2
Microphone

OSC
X12

Table
Stop

Central Unit Intercom K2201

183
Patient Handling - Intercom System
 7
184

PMU 7.4
External Trigger Output is currently not supported.
• Option PMU display, located in the magnet front cover. It
provides for a lead select facility and the display of the
Overview 7.41 physiological signals ECG, Pulse and Respiration, as well as
for a symbolic display of the External Trigger input (Every
Some kind of MRI needs physiological trigger signals for the
low-to-high transition is displayed as a blinking " * ").
improvement of image quality and of the diagnostic value of the
• Option Active ECG Electrodes.
images. For example, when running a heart study, it is very
important to know, whether specific images have been measured
during the diastolic phase (heart muscle relaxed) or during the
systolic phase (heart muscle contracted).
All components of the PMU are options. It comprises:
• the sensory elements to measure ECG, pulse and respiration,
• amplifiers,
• electrical/optical converters,
• display units.
The MMC uses the pysiological signals in order to trigger the
corresponding protocols or the signals simply serve for monitoring
the patient’s well-being.
The PMU Display offers a new functionality: the lead select
facility. Once the operator has positioned the 4 electrodes on the
patient’s back or chest, the lead facility (activated via push buttons
at the PMU display) will evaluate the small voltages in different
ways to get the optimum result for a clear identification of the R-
Wave and a correct evaluation of the heart frequency.

The PMU Option consists of the following parts:

• PMU Frontend,
• ECG-leads (the leads are made of high impedance carbon for
connection of four disposable electrodes),
• Pulse sensor (fiber optic cable),
• Respiratory bellows (pneumatic),
• PMU Converter A5181.

The PMU Frontend also provides for an External Trigger Input. The
Figure 118 PMU Overview

System
PMU Overview Diagram

PMU

Backplane
PMU

A515
Converter +10.5V
+-18.5V
X9 X2B 13.5VAC
MMC

U1, U2 H1,H2 MPCU

ETH
U3,U4

X5B

W553
PWR

W543
Respiration
ECG-Leads Belt X1

U3,U4
Pulse Sensor

PMU Display
(option)
RF-Cabin

185
Patient Handling - PMU
 7
186

PMU Frontend 7.42

• switching ON/OFF the beeper.
The ECG-signals measured at the patient are amplified and filtered
in the PMU Frontend. The pulse-signals and the respiratory-signals
are preprocessed in special analogue units. The galvanic isolation TESTS 7.4.21

happens in the Frontend. After A/D-Conversion the signals are

processed by a DSP. There is an EPROM in the PMU Frontend
containing the Loadware. The current Frontend Loadware is
downloaded from the MPCU upon startup, if necessary.
The 24-wire-connection between Frontend and Converter is for
signals, communication and the 15Volts for the Frontend. In the
case of the "Standard Patient Table" this is a one piece 6m long
cable, in case of the removable patient table an intermediate
connector (ODU-Connector) is required.
• Test tool under SESO: Function, Communication and
Interactive. For the Function test the test signal is generated
on the Frontend and the complete path PMU-Frontend, PMU
Converter, MPCU and Host is tested.
• There is a "hidden button" on the PMU display left of the
control buttons for the User. A test signal can be activated by
pressing the "hidden button" shortly and the "lead select"
button afterwards. After the test press the "lead select"
button again to switch to the default mode lead II.

The communication links provide for the transmission of the NOTE The ECG-Test Phantom used in Vision and Impact/Expert
physiological signals to the MPCU and the PMU Display, as well as cannot be used, because the connector does not fit
for status messages and controls in the opposite direction (e.g.
ECG lead selection).
The PMU Conve rt er board A5 18 1 pe rform s R S48 5- opti cal
conversion and vice versa. From the Converter the signal are fed:
• via FOC to the MPCU-Box. The PMU software on the MPCU
provides for the computation needed for the transmission of
the signals to the host, where they are displayed. In addition
the signals - as selected by the USER - are processed in the
PMU Software for the physiological control of the
measurement.
• via FOC to the PMU-Display. The Graphic Controller in the
PMU-Display calculates the graphics which are displayed by
means of a TFT display.
Further functions of the PMU-Display are:
• Display of the curves and output of frequencies of ECG, pulse
and respiration,
• selection of scroll speed,
• lead select facility. The different ECG-lead positions are: I, II,
III, AVR, AVL, AVF or test signal,
Figure 119 PMU Block Diagram

Lead_Select
1 mV Back

Input Test
Memory
Amp

+ 12V
DSP

PMU Connections
ECG-Leads - 12V A
- 5V MUX
Pulse Pulse D
Sensor Analog Processing

Respiratory Respiration
Belt Analog Processing
PMU
Ext. Trigger External Trigger Frontend
Input Processing

X9

X2

U3 U3
PMU_DISP_COM
RS485

U4 U4 FOC
PMU_DISP U1
(Power) Physio_Data
X5 To
X1 U2 MPCU Box
Power
U1
MPCU_INT
+-18V
U2
Backplane
U5
U6
PMU Converter A5181

187
Patient Handling - PMU
 7
188

PMU Display (option) 7.43 Figure 120 Active ECG electrodes, Block Diagram

The PMU Display is able to display the Physiological signal curves

inside the examination room to facilitate the correct positioning of Back
sensors to the patient. The PMU Display is mounted at the top-left
side of the magnet front cover.
A 13.8 VAC supply voltage for the PMU Display is derived by
connector X5 at the PDAU. The bidirectional Fiber-optic interface
(FOC-connectors U3 and U4) supplies communication to the PDAU.
Four signals can be displayed:
• ECG
• Pulse
• Respiratory signal
• External Triggering signal
ECG, Pulse and Respiratory signal are displayed simultaneously in
real time curves, the External-Triggering signal is indicated as
blinking "*" symbol for each low-to-high transition.
The PMU Display is equipped with three touchscreen buttons to
adjust:
• ECG Channel Select (I or AVF for best R-wave signal)
• Scroll Speed (three speeds)
• Acoustic Signal (beeper activate/deactivate)

ECG Scroll Acoustic

Channel Speed Signal on/off
Select
Active ECG Electrodes 7.4 Figure 121 Active ECG electrodes, Block Diagram

The acquisition and quality of the received ECG can be affected by

interferences caused by gradient switching. The level of such Active Back
interference depends on the amplitude and the slewrate of the
applied gradient fields. These undesired interferences can cause ECG Amplifier
additional peaks in the ECG and consequently incorrect triggering Carbon
and poor image quality (blurring, ghosting). The use of active ECG cables
electrodes can help overcome such effects.
ECG Amplifier
Buttons: 7.4 .01
disposable
electrode FO
RF
Button 1: to switch on and off, the active ECG switches off Filter FO
automatically, if an electrode fault is detected for about 10
minutes.
Button 2: for lead selection. One push switches one ECG lead
Battery
further. Only the leads I,II,III are available, compared to 6 leads
with the standard cable.

ECG Amplifier Battery 7.4 .02

The battery lifetime depends on the use. As a guideline, use of 15 Glass Fiber
hours per week results in about 2 years lifetime, a use of 60 hours cables

per week in about 1 year lifetime.

NOTE The Active ECG is an FRU. The battery can not be

Electronics
replaced, because the ECG amplifier box is sealed with User Interface
against liquids.
Plug

LEDs: 7.4 .03

LED Electrode contact: lights up intermittently, if the electrodes

have no proper contact to the patient’s skin.
LED Battery of the amplifier: lights up intermittently when the On / Off Lead Poor Battery
battery is low (about 100 hours use left). Selection Lead Low
Contact

PMU Sensor Conections 7.45

189
Patient Handling - PMU
 7
190

Figure 122 Connections found at foot of Patient Table

1 2 3 4 5 6 7 8

PMU Intercom

Pos. 1 ECG (green) Pos. 7 Headphones (yellow)

Pos. 2 Pulse Sensor (orange) Pos. 8 Nurse Call / Squeeze bulb (red)
Pos. 3 Respiratory Belt (blue)
Pos. 4 Input for external trigger signal
Pos. 5 Output for external trigger signal (not supported)
Pos. 6 Vacuum pump (black)
 Section

8 Gradient System 8

The gradient systems of the MAGNETOM Harmony/Symphony/Sonata are based on switched mode current generators and actively shielded
gradient coils. In order to achieve a compact design at the required high performance both components are water cooled.
The type of gradient system used depends on the MAGNETOM system, the NUMARIS software version (NUMARIS 3.5 or syngo MR) and the
options bought by the customer. The following description covers the first generation of the Gradient System used in the
MAGNETOM Harmony/Symphony (K2209) and the newer Cascade-gradient system (K2217) first used in the MAGNETOM Sonata, then in all
new systems delivered from August 1999 onwards.

Introduction 8.1
overall performance of both the gradient amplifier and gradient coil
and is calculated from the maximum gradient field (coil) and the
minimum time needed to reach this field (rise time as a factor of
This chapter serves as a general introduction to the hardware the applied voltage) by the formula:
components of the gradient systems.
The majority of the Field Replaceable Units (FRU) in the gradient max. gradient field
system are integrated into the left part of the twin cabinet called
SR = -----------------------------------------
min. rise time
GPA.
For example, a system with a 33mT/m coil and a GPA capable of
Gradient System Performance 8.1
ramp voltages needed for a 264 µs rise time, the SR would be:

The performance and power of the gradient system is described by

a variety of different parameters: mT mT T
• Maximum gradient amplitude in mT/m 33 ------ ------ ---
m m m
• Effective gradient amplitude GRADeff. = GRADmax. ⋅ 3 SR = --------------------w = 125 -------w = 125 ----
0.264 ms ms s
• Minimum rise time to maximum gradient amplitude
• Maximum voltage
• Slew rate SR

The SR value is a bottom-line performance quotient expressing the

191
Gradient - Introduction
 8
192

Gradient Configurations 8.12

• The Cascade Gradient Amplifier K2217 replaces the K2209
Gradient Amplifier. As can be seen in the table above, this
The table below gives an overview of the components, options and amplifier comes in two variants: Cascade light and Cascade
configurations and their performance values for the various Quantum.
gradient systems implemented in the MAGNETOM systems. • The Cascade Quantum Gradient Amplifier hardware is
standard for all MAGNETOM Symphony and Sonata systems.

Gmax in mT/m
The performance level options are realized in software

Geff in mT/m
(licensing and configuration).
•

Amplifier
The AS39S coil replaces the and AS39R, but has the same

Risetime
Gradient

Gradient
System

Option
specifications and performance characteristics.

Vmax
Igrad
FoV
Coil

SR
800 Click below to jump to the Functional Description
400 V Turbo 25
K2209 µs
20 35 300 A
K2209
Symphony

see note 400

Harmony

AS39R 800 V Ultra 50

µs
(old)
500

800
AS39S K2217 500 V Turbo 25
µs
Cascade 20 35 300 A
1000 400
Light Ultra 50
V µs
1000 400
20 35 300 A Ultra 50
V µs
Symphony

1500 400
K2217 30 52 380 A Sprint 75
V µs
only

500

AS39T Cascade
125
Quantum
2000 300 (Z)
30 52 380 A Quantum
V µs 100
(X,Y)
K2217
Sonata

2000 200
400

AS85T Cascade 40 69 500 A Quantum 200

V µs
Quantum

* Notes:
• There are two different K2209 Power Stages. The Papillon400
K2217
is a new gradient Power Stage replacing the older ones which
are no longer in stock. This new power stage uses IGBT
switching elements instead of FETs increasing its reliability.
They are pin-compatible and can be mixed with the older
Power Stages.
Gradient System K2209 8.2
Figure 123 Gradient System K2209

Introduction 8.21
Driver Supply K2209
Current Sensor Assembly

The K2209 Gradient Amplifier is the first amplifier designed for the
MAGNETOM Harmony and Symphony systems. It can be called the GSSU Power Supply
"classic" gradient system. Its performance stats :
GSSU
Turbo Ultra Option
Max Gradient Field 20 mT/m 20mT/m

Max Current 300 A 300 A

Max Voltage 400 V 800 V Output Choke

Min Rise Time 800 µs 400 µs

Power Stage
Slew Rate in T/m/s 25 50

Power Stage connectors

Power Stage Power Supply

(Resonant Converter - MK I)

Power Stage Power Supply

(Resonant Converter - MK II)

193
Gradient - Gradient System K2209
 8
194

Figure 124 K2209 Block Diagram

Parts System
GSSU Location Diagram
AVA
MMC

X
MC4C40

D Delay 5
PI Reg PWM 5

Control
A
X Supervision 5
Y & Display
Z
Control and
Clock monitoring logic

D1 D2 D4
DAC Regulator X Modulator X

Status
Signals
CAN

5
CAN 5
D3 D5 5
Communication
& Test-
Sync Turbo Mod Z
Supervision signals
RX_Module

Loop
MUX
D7
I/O X

6
D10
D6 CAN & Service Driver PS Power Stages
CSA Filter Grad
Panel Coil
X100
F14
GSSU
Terminal
PS 3 x 400 VDC
LPD
Gradient System
Line
Resonant
3 x 400 VDC
K2209
F9 Converter
Filter
Gradient Small Signal Unit (GSSU) 8.2 Figure 125 GSSU Layout

D5 Turbo Modulator
D3 Synchronisation
General 8.2.21

D6 Service/CAN

D2 Y Regulator
The GSSU is generating the pulse width modulated control signals

D7 Light Board
D4 Modulator
for the switches in the Power Stage based on the digital data
coming from the MMC. It’s additional task is the overall supervision
of the GPA.

D1 DAC

D2 X

D2 Z
The PCBs or FRUs (field replaceable units) of the GSSU connected
to the one common backplane (D8) are listed below:

• Service/CAN D6
• DAC D1
• Regulator D2 (3x)
• Synchronization D3
• Modulator D4
• Turbo-Modulator D5 (only Ultra-gradient option)
• Light board D7

Backplane D8 8.2.2

The backplane is the interconnection between the components of

the GSSU and the rest of the gradient system. It is part of the
GSSU-rack mounted to the cabinet frame by four quick release
screws.

195
Gradient - Gradient System K2209
 8
196

D1 DAC 8.2.23 Figure 126 D1 DAC Block Diagram

The DAC-board contains the DA convertors for all three X, Y, and Z GCTX Parts Main
channels. The digital data supplied by the MMC contains the Location Diagram
gradient pulse amplitude data including the eddy current pre- GPA_CTRL

distortion and the gradient delay. X3

Control Logic 8.2 .31 D1

The 18 bit digital data GRAD_D and data latch signals G_SEL_ DAC Test
from the MC4C40/GCTX to the Control Logic section are simply 4MHz clock Control Logic
buffered and passed through to the DACs as long as the Test signal SU_GRAD GRAD_D G_SEL0(1, 2)
is not active.
If the Test signal is activated (MC4C40 test is SeSo) the data in
the X DAC latch (SU_GRAD) is read back to the MC4C40. This is S1
S3
intended to check the data bus cable connection. X Y
D
F0

4 MHz
A
Nominal Value 8.2 .32
7
Z
F0 S2
The output voltage of the DACs (DAC_ X, Y and Z) is ± 10 V at full 2
50 kHz Unfiltered X85 (X)
scale. It corresponds to the maximum gradient strength of 20mT. Offset
X86 (Y)
S4 R153 (X)
Switches S1 and S2 are used to zero the DAC outputs to allow the Frequency R177 (Y)
X87 (Z)
R200 (Z)
adjusting the DAC offsets with potentiometers R153(X), R177(Y) Divider
filtered X81 (X)
and R200(Z). See TSG for the procedure. X82 (Y)
X83 (Z)
Umax ±10 V
Monitoring 8.2 .3

The DAC output signals (DAC_X, Y, Z) are available for monitoring X4

via QLA-connectors (X4, X5 and X6) and test pins (X81-83; GND X5
on X9) on the front panel of the board and they are also connected X X6
Y
to the loop multiplexer on the Service/CAN board (S_DAC_X, Y, Z) Z
for the automated gradient test loops in SeSo.

S_DAC_X(Y,Z)
DAC_X(Y,Z)
Frequency Divider 8.2 .34

FSYNC
Also a 4 MHz clock signal is connected to the board via the same
connector. This clock signal is divided by a frequency divider to
selectable 25 kHz, 50 kHz (FSYNC) or 100 kHz. The division ratio
can be adjusted by two rotary switches S3 and S4.
D3 Sync D2 Regulator D6 Service
)
Switches 8.2 .35
Figure 127 D1 Front View
Switches S1 and S2 are used to zero the DAC inputs and outputs
for the offset adjustment. When set to the upper position, the Block
Diagram
Offset potentiometers R153(X), R177(Y) and R200(Z) are
adjusted for 0V ±50µV at connectors X4(X), X5(Y), X6(Z).

18 bit Gradient Data input From MC4C40/GCTX

Switch Description Position
4MHz synchronization clock
S1 left DAC_X enable/disable down/up Test-Read signal
S1 right DAC_Y enable/disable down/up
S2 left DAC_Z enable/disable down/up
S2 right not used not used
X Y
Potentiometers 8.2 .36
off
S1 DAC enable
on
The static DAC offset can be adjusted with potentiometers. During The DAC inputs are set to ZERO
the adjustment the corresponding DAC has to be disabled by using off
on S2
when in the off position.

DIP-switches S1 and S2. See above. Z

X R153
Potentiometer Description DAC
Y R177 Offset
R 153 DAC_X offset adjustment
Z R200
R 177 DAC_Y offset adjustment
R 200 DAC_Z offset adjustment

X
Y DAC
Z
Test Points 8.2 .37
X DAC
Y
no filt
The DAC output signals (DAC_X, Y, Z) are available for monitoring Z

via QLA-connectors (X4, X5 and X6) and test pins X81-X88 with Ana gnd
ground connection X9 at the front panel of the board.
X

Z
DAC
Output

197
Gradient - Gradient System K2209
 8
198

) D2 Regulator 8.2.24 Figure 128 D2 Regulator Block Diagram

CSA Parts Main
General 8.2 .41
Location Diagram

+15V_Ret
C-Con1/2
The Regulator Board D2 is divided into four functional blocks:
• Actual Value Amplifier,
• P-I Regulator X707 (LEM 1)
• Modulator D2 X709 (LEM 2)
2
Regulator
Actual Value Amplifier 8.2 .42
V24

Monitor
Actual
The current sensors in the Current Sensor Assembly deliver a R191 CAV_Err
Offset Value
compensation current proportional to the current driven through Amplifier
Adj X705

D1 DAC
the gradient coil. This compensation current is converted into a DAC_X(Y,Z)
Iact.
corresponding voltage level by the Actual Value Amplifier. The 40 A/V
X3
CAV

D4 Modulator
output is scaled for 40A/V Reg_Off
The offset of the amplifier is adjusted by potentiometer R191. See S1
TSG for the procedure. Reg D

D6 Service
Data A P
N_SeMo

Monitor
Soft-start I V27
D
In order to prevent pre-magnetization of the current sensors the
A PI Regulator
actual value amplifier is soft-started via photo-resistors to the
S2
sensors.

&
Monitoring

D6 Service
Loop_Err
The AVA contains a soft-start circuit to run up the current sensors
slowly. It also checks if the amplifier is connected to the sensors Reg_Err
Reset Reg_Out
and the cable connection to the sensors is checked by an interlock

D3 Sync
X701
signal (P15_RET). Also, the difference between the compensation TRIA X703
currents of the two sensors is checked that it is not greater than PW Modulator CAV_Err N_INT_INT
30A. If any of the above conditions are not met, a CAV_ERR is Reg_Err ≥1
generated and LED V24 is lit. 4 4
X401-X404 X405-X408
Loop Testing

X(Y,Z)2_S1-4
X(Y,Z)1_S1-4
The analog signal CAV is connected to the loop multiplexer on the
Service/CAN board for automatic testing.

D4 Modulator
P-I Regulator 8.2 .43
Figure 129 D2 Regulator Block Diagram
The closed loop regulation is based on a digitally controlled PI- CSA Parts Main
regulator with 7 bit resolution for both the Proportional (P) and the Location Diagram

+15V_Ret
C-Con1/2
Integral (I) part. The initial setting of the regulator after power on
is determined by DIP-switches (S1: P-part; S2: I-part. The
nominal setting, a result of the regulator adjustment procedure, is
activated by software. X707 (LEM 1)
D2 X709 (LEM 2)
The regulator compares the actual current value to the nominal Regulator
2
current value from the DAC and the resulting regulator difference is
V24
amplified by the regulator according to its PI-characteristic.

Monitor
R191 Actual
Value CAV_Err
Monitoring Offset
Adj Amplifier
X705

D1 DAC
The difference between the nominal value from the DAC and the DAC_X(Y,Z)
Iact.
actual value and the output signal of the regulator (Reg_Out) are 40 A/V
X3
CAV
monitored by an error logic. If any of these signals are out of range

D4 Modulator
Reg_Off
a yellow LED (V27) on the front panel is on. This state (Loop_Err)
S1
is detected by the Service/CAN board (D6).
Reg D

D6 Service
The analog outputs of the Regulator are connected to the loop Data A P
N_SeMo

Monitor
multiplexer on the D6 Service/CAN board for testing, although this I V27
D
signal can not be selected in the SeSo test tools. A PI Regulator
The Reg_Off signal generated by the supervision logic on the D4 S2

&
Modulator disables the regulator by forcing its output to zero.

D6 Service
Loop_Err

Reg_Err
Pulse Width Modulator 8.2 .4
Reset Reg_Out

D3 Sync
The pulse width Modulator compares the output signal of the TRIA
X701
X703
regulator to the TRIAngle voltage coming from the D3
Synchronization and generates two pairs of four switch control PW Modulator CAV_Err N_INT_INT
Reg_Err ≥1
signals 1S1-4 and 2S1-4 for up to two Power Stages. 4 4
X401-X404 X405-X408

X(Y,Z)2_S1-4
X(Y,Z)1_S1-4
D4 Modulator

199
Gradient - Gradient System K2209
 8
200

Switches 8.2 .45

Figure 130 D2 Front View
Switches S1 and S2 are used to set the default P and I regulator
Block
values and are always set to S1.1 ON, S1.2-8 OFF . X401 Bridge 1 - Switch 1
Diagram
X402 Bridge 1 - Switch 2
LEDs 8.2 .46
X403 Bridge 1 - Switch 3
X401 X404 Bridge 1 - Switch 4
X405 Bridge 2 - Switch 1
LED Description X406 Bridge 2 - Switch 2
On when a current diference of more than 32A between the X407 Bridge 2 - Switch 3
CAV Err
current measured by the two current sensors. X408 Bridge 2 - Switch 4
On when the difference between the Actual and Nominal inputs X412 X409 not used
Loop Err to the regulator or the regulator output level is too high. We X410 not used
have an OPEN loop! X411 not used
Digital X412 not used
Gnd
Testpoints 8.2 .47

A list of the signals that can be measured over Testpoints X401-

X412 and X701-X712 are given in the diagram at right and are
intended for internal (factory) use and not intended for field service
procedures. CAV Err

Loop Err
TP Description
PWM signals to the switches 1 through 4 in bridge (Power
X401-404
Stage Module) 1 - the three modules on the left side
PWM signals to the switches 1 through 4 in bridge (Power
X405-408
Stage Module) 2 - the three modules on the right side
X701 see list in diagram at right
R191 LEM Offset

X3 CAV X701 Regulator error signal

X702 no connection
X701
X703 Regulator output
X704 no connection
X705 CAV (40V/A)
X706 no connection
X707 Current sensor 1
X712 X708 no connection
X709 Current sensor 2
Analog X710 no connection
Gnd X711 no connection
X712 Input : control test
D3 Synchronization 8.2.25 Figure 131 D3 Synchronization Block Diagram
Parts Main
General 8.2 .51 Location Diagram

The D3 consists of two functional blocks:

• Triangle Generation and Synchronization

D10 Driver PS
D3 Sync
• Supervision. 50kHz 50kHz
X14 Triangle Generator X12
The D3 generates a triangular signal required for the pulse width

D1 DAC
modulators on the three regulator boards. It also generates a FSYNC Phase Freq1
rectangular synchronization signal for the driver supply circuit in Comparator
±9V
the GSSU power supply. The above mentioned signals are phase PLL X10
locked to the system frequency. R66

D2 Reg
Freq Window TRIA
In addition to the signal generation a multipurpose supervision is Adj
VCO
Integrator
implemented on the board.

Triangle Generation and Synchronization 8.2 .52

Triangular Signal
The triangular signal TRIA is generated by a free running Voltage
Supervision
Controlled Oscillator (VCO). The frequency of the signal is 50 kHz
V38 Tria_Err
(phase locked to the system frequency) the amplitude is ± 9 V. Triangle
Monitor
This signal is available for monitoring on the front panel test pin
X10. The free running frequency of the VCO is adjustable by the Sync
V37 Sync_Err
potentiometer R66. Monitor

D6 Service
The synchronization signal (FSYNC) can be monitored on the front

D4 Mod

Latch
N_SeMo
panel test pin X14.
Driver Supply Clock
A rectangular 50 kHz synchronization signal (FREQ1) is generated P15 V32 P15_Err

D7 Light Bd
for the Driver Supply Board (D10 in the GSSU power supply). N15 Voltage V31 N15_Err
Vcc Monitor V30 Vcc_OK

X16
N_INT_INT
X18
X20
X22 S1
X23 Reset
&
GSSU PS
CAN_Reset

201
Gradient - Gradient System K2209
 8
202

Supervision 8.2 .53

Figure 132 D3 Synchronization Block Diagram
Triangular Signal Parts Main
The frequency, amplitude and offset of the triangle signal is Location Diagram

monitored. If any of the monitored parameters are out of tolerance

LED V38 will be turned on and the TRIA_ERR signal sent to the

D10 Driver PS
D3 Sync
D6 Service/CAN board.
50kHz 50kHz
X14 Triangle Generator X12

D1 DAC
Synchronization FSYNC Phase Freq1
Comparator
If the PLL is not locked it is detected by an error logic. In this case ±9V
LED V37 will come on and the SYNC_ERR sent to the D6 Service/ PLL X10
R66
CAN board. This error will be over-ridden if the Service Mode switch

D2 Reg
Freq Window TRIA
VCO
(N_SeMo signal from D4) is activated. Adj Integrator

Supply Voltage Supervision

The supply voltages of the GSSU (+5 V and ±15 V) are monitored
on this board. The state of the supervision logic is indicated by
LEDs on the front panel. Two red LEDs (V31,V32) are indicating if Supervision
the ±15 V is out of tolerance and one green LED (V30 normally on) Triangle V38 Tria_Err
indicates if the +5 V supply is O.K. The state of the supervision Monitor

logic is detected by the Service/CAN board. These voltages can be Sync

V37 Sync_Err
measured over test pins X16, X18 and X20. Monitor

D6 Service
D4 Mod

Latch
N_SeMo
General Functions 8.2 .54

Reset
P15 V32 P15_Err
All error signals are latched. Push button S1 on the front panel can

D7 Light Bd
N15 Voltage V31 N15_Err
be used to reset the error latches on the board. This reset function Monitor V30 Vcc_OK
Vcc
can also be activated by the Service/CAN board.
X16
N_INT_INT
X18
X20
Internal Interrupt
X22 S1
A l l e r r o r s t a t e s w i l l a c t i va t e t h e i n t e r n a l i n t e r r u p t l i n e
X23 Reset
&
GSSU PS
(N_INT_INT) except Sync-Error in Service-Mode (see D4
CAN_Reset
Modulator description).
LEDs 8.2 .5
Figure 133 D3 Front View

LED Description Block

Diagram
Tria Err On when Triangle signal not ok: amplitude and/or offset
On when the Sync signal is either missing (clock from MC4C40)
Sync Err
or if the PLL cannot lock on (internal eror) Tria
50kHz
P15 Err P15 power not ok when ON 50kHz
N15 Err N15 power not ok when ON P15
N15
P5 Err P5 power not ok when OFF
Vcc

Potentiometer 8.2 .56

Analog
R66 can be used to adjust the frequency / amplitude of the Triangle Gnd
signal. Se Replacement of Parts for details.

R66 Freq Adj

S1 Supervision reset

V38 Tria Err

V37 Sync Err
V36
V35
V34
V33
V32 P15 Err
V31 N15 Err
V30 Vcc Ok

203
Gradient - Gradient System K2209
 8
204

D4 Modulator 8.2.26 Figure 134 D4 Modulator Block Diagram

Parts Main
General 8.2 .61
Location Diagram
Two main functions are implemented on the Modulator Board D4:
• Dead-time delay generation
• Supervision of Power Stages (the first set) D4 Modulator
X1_S1-4
The Modulator board is based on a programmable logic that X2_S1-4
Programed
Delay
contains the digital part of the pulse width modulator and the

Power Stage
DTD Monitor

Digital Switch

Drive Signal
Fail Detect
Y1_S1-4
monitoring circuit of time critical power stage related signals.

D2 Regulator
The switch control signals from the three regulators passing Y2_S1-4
through the board with an added dead-time delay and a double Z1_S1-4
security disable function.
Z2_S1-4
The supervision monitors the supply voltage and temperature of
the power stages and limits the current generated by them to
prevent damage of the hardware.
Mode Select
S3
S1

Drive Err
Modulator Function 8.2 .62
S4
S2
Dead-time Delay Reg_Off
SeMo
In order to prevent cross-current in the power stage bridge a delay N_SeMo V1 ModOff
is added to the switch-on signals. This delay (dead-time delay), ModOff
generated by the programmable logic is selectable by a DIP-switch Duty Cycle
(sw1 and sw2 of S3). X(Y,Z)_CAV

D6 Service
The logic is also responsible to prevent firing the two switches in Overcurrent

Latch
the same half of the bridge at the same time (cross-current). A Imax. +5%
second safety level based on a separate circuit is responsible to X V8
ModOff
detect the cross-current state in case the prevention logic fails Y V9

D3 Sync
Reset V10
(DRIVE_ERR). Z
Current
Direction 3 3

Current Indicator
D7 Light Bd
The actual current signal (SU_CAV) from the regulator board
reaches the current indicator detecting the current direction and

Temp_Err

RC_OVV
>425V
>55°C
correspondingly driving the yellow twin-LEDs V8, V9 and V10. The
current indicator also generates signals for the supervision logic
used to disable driver signals of the respective counter direction.
Power Stage ResCon
Supervision and Control 8.2 .63
Figure 135 D4 Modulator Block Diagram
The supervision and control based on the programmable logic
allows a very high flexibility. The internal 32 MHz clock (MOD_CLK)
of the supervision is generated on board and it is phase locked to
the 4 MHz system clock.
The control section is responsible for generating the switch control D4 Modulator
X1_S1-4
signals if it is enabled by the supervision section. It is also
Programed
generating signals supporting the Turbo Modulator (D5). X2_S1-4
Delay

Power Stage
DTD Monitor

Digital Switch
In the supervision section the power dissipation of the power

Drive Signal
Fail Detect
Y1_S1-4
stages is simulated by an electrical circuit. Additionally the supply

D2 Regulator
Y2_S1-4
voltage, the temperature of the power stages and the current
Z1_S1-4
generated by the those is monitored.
Z2_S1-4

Status Signals
The following error states are detected and partially displayed by
the supervision logic: Mode Select
• Over-current (OVERCUR_ERR) S3
S1

Drive Err
• Duty cycle error (DC_ERR) S4
S2
• Temperature error (TEMP_ERR) Reg_Off
SeMo
• Over-voltage (OVV_ERR) N_SeMo V1 ModOff
• Driver error (DRIVE_ERR) ModOff

Beside the error states also the internal interrupt line Duty Cycle
X(Y,Z)_CAV
(INT_INTERN) and front panel switches (S1_left, S2_right, S2_left)

D6 Service
can disable the generation of switch control signals. These states Overcurrent

Latch
Imax. +5%
are detected by the supervision logic, too.
ModOff
X V8
Y V9

D3 Sync
)
Reset Z V10
Error Memory Current
The above mentioned seven states are stored locally on the Direction 3 3
modulator board for all three axis. The Service/CAN board is able
to read these states sequentially using the ERR_X, ERR_Y, ERR_Z D7 Light Bd
data and ERR_SEL1, ERR_SEL2, ERR_SEL3 control lines.

Temp_Err

RC_OVV
>425V
>55°C
Power Stage ResCon

205
Gradient - Gradient System K2209
 8
206

Service Mode Figure 136 D4 Front View

The supervision logic can be switched into service mode (SEMO) by
Block
a front panel switch (S1_right) and remotely from the Service/CAN Diagram
board. The service mode is indicated by a yellow LED (V1 left) on
the front panel and it is also detected by the Service/CAN board.
V1 Service mode / Modulator disabled
Internal Switches
The setting of the two DIP-switches (S3 and S4) on the board V2 Over temp / Drive error (X1 or Y1 or Z1)
determines the function of the supervision and control. The V3 Spare / Over voltage X1
following two tables are a brief explanation of these functions. V4 Over voltage Y1 / Over voltage Z1
V5 Over current X1 / Duty cycle error X1
V6 Over current Y1 / Duty cycle error Y1
V7 Over current Z1 / Duty cycle error Z1
Switches 8.2 .64

V8 Current X+ / Current X-
Switch Function Explanation V9 Current Y+ / Current Y-
V10 Current Z+ / Current Z
S3

MOD OFF
sw1 dead time 1
Dead time range select switches

SeMo
sw2 dead time 2
X
sw3 mode 1 not used on
off
sw4 mode 3 Power Stage swapping enable
sw5 fqa Frequency monitoring select switch (with fqb) on
off
sw6 mode 2 not used Z Y sw1 deadtime range select 1
MOD
sw7 fqb see sw5 OFF
sw2 deadtime range select 2
sw3 not used
sw8 mode 4 not used sw4 Power Stage swapping enable
sw5 Frequency monitoring select 1
S4 sw6 not used
S3
sw1 modsemo x sw7 Frequey monitoring select 1
sw8 not used
sw2 modsemo y Local service mode select switches (not used)
sw3 modsemo z sw1 not used
sw2 not used
sw4 sunuse x S4 sw3 not used
Power Stage switch device type select switches sw4 Power Stage X type select
sw5 sunuse y
sw5 Power Stage Y type select
sw6 sunuse z sw6 Power Stage Z type select
sw7 Power Stage heat dissipation adapt 1
sw7 swloss 1 Power Stage switch heat dissipation adapt sw8 Power Stage heat dissipation adapt 1
sw8 swloss 2 switches
D5 Turbo Modulator 8.2.27 Figure 137 D5 Turbo-Modulator
)

Function 8.2 .71

Main
D5 TURBO Diagram
The D5 Turbo Modulator is a slave of the D4 Modulator and is
responsible for performing the same functionality for the Power
Stages of the ULTRA option.

NOTE The Turbo-Modulator D5 is only necessary for gradient

systems with the Ultra-option. It is not installed for the
Turbo option! V2 Over temp / Drive error (X2 or Y2 or Z2)
V3 Spare / Over voltage X2
V4 Over voltage Y2 / Over voltage Z2
V5 Over current X2 / Duty cycle error X2
V6 Over current Y2 / Duty cycle error Y2
V7 Over current Z2 / Duty cycle error Z2

sw1 deadtime range select 1

sw2 deadtime range select 2
sw3 not used
sw4 Power Stage swapping enable
sw5 Frequency monitoring select 1
S3 sw6 not used
sw7 Frequey monitoring select 1
sw8 not used

sw1 not used

S4 sw2 not used
sw3 not used
sw4 Power Stage X type select
sw5 Power Stage Y type select
sw6 Power Stage Z type select
sw7 Power Stage heat dissipation adapt 1
sw8 Power Stage heat dissipation adapt 1

207
Gradient - Gradient System K2209
 8
208

D6 Service/CAN 8.2.28 Figure 138 D6 Service/CAN

Main
Diagram
General 8.2 .81
D6
The Service/CAN Board consists of two functional blocks: Service / CAN Parts
• the communication and supervision (CAN-Module) and Location

EXT_IN
• the analog signal multiplexer.
X301
Loop Ext. Ch.

D1 DAC
Function 8.2 .82
AUX X501

Receiver 1
DC+
DAC
The CAN-Module is responsible for the data transfer between the

MUX
CAV X500
DC-
MMC and the GPA. Control data for the GPA is transferred from the RegOut

D2 Reg
1X,2X 25kHz
MMC and GPA-status information to the MMC. RegErr
V5X,10X
The analog signal multiplexer is used to connect signals generated
in the GPA to the ADC in the data acquisition system. This link X502 Scope
allows the software evaluation of the selected signals. Out

X401

MPCU
Proc
CAN-Module 8.2 .83 Reset
LW active
Communication FW active
X402
The firmware (FW) stored in a PROM allows the processor to run a

MSU
CAN
self-test to communicate on the CAN-Bus and to load the Module ResCon
application software. The application software (LW) for the ON

processor is stored in an EEPROM. According to this program the Communication ResCon

& ON
processor is able to receive control data from the MMC and transfer Supervision ResCon
status information from the GPA to the MMC. Status & OFF
Control
Signals

Reset
The front panel push button S404 is used to reset and re-start
(warm-start) the Processor. D7 Light Bd

RC_CurTrip

RC_Enable
RC_Ready
RC_Temp
D1, D2, D3, D4, D5 Res Con D9 Coil Mon
ResCon Control 8.2 .84
Figure 139 D6 Service/CAN
ResCon on/off Main
Diagram
The front panel push button S402 is used to switch on the D6
Resonant Converter; button S403 is used to switch it to standby. Parts
The switched on state is indicated with the green twin-LED V407.
Service / CAN Location

EXT_IN
Power -Fail message 8.2 .85

X301
The + 5 V supply of the CAN-Module is buffered at + 15 V level. If Loop Ext. Ch.

D1 DAC
the + 15 V fails it is detected by an error logic and the buffered
+ 5 V is still available long enough to send a Power-Fail message to AUX X501

Receiver 1
DC+
DAC
the CAN-System. This message is processed with the highest

MUX
CAV X500
DC-
priority. The Power-Fail state is indicated by the red LED V607. RegOut

D2 Reg
RegErr 1X,2X 25kHz
V5X,10X

Analog Signal Multiplexer 8.2 .86

X502 Scope
Loop multiplexer Out
The DAC-output signal (S_DAC), the actual value signal (S_CAV),
X401
the regulator difference (S_REGERR) and regulator output signal

MPCU
Proc
(S_REGOUT) from all three channels are fed via the backplane to Reset

the signal multiplexer. The selected signal is amplified by the LW active

FW active
selected gain (1, 2, 5 or 10) and additionally a low-pass filter X402

MSU
(25 kHz) can be activated. The differential output signal DC+ CAN
Module ResCon
(X500) and DC-(X501) are input to the RX_Module of the RF- ON
system where it is digitized. ResCon
Communication
The settings described above can also be used for an external & ON

signal connected to the multiplexer via the front panel connector Supervision ResCon
Status & OFF
X301. In this case the setting is done by the front panel push Control
Signals
button S401.
(For detailed explanation of this function see Troubleshooting
Guide.)
D7 Light Bd

RC_CurTrip

RC_Enable
RC_Ready
RC_Temp
D1, D2, D3, D4, D5 Res Con D9 Coil Mon

209
Gradient - Gradient System K2209
 8
210

LEDs Figure 140 D6 Service/CAN

Two LEDs indicate the software state of the CAN module.
Main
Diagram
LED Description
Tria Err On when Triangle signal not ok: amplitude and/or offset
V408
On when the Sync signal is either missing (clock from MC4C40)
Sync Err V412
or if the PLL cannot lock on (internal eror) not used

P15 Err P15 power not ok when ON S401

N15 Err N15 power not ok when ON

External
P5 Err P5 power not ok when OFF X301 IN

Loop Out
X500 (DC-)
Loop Out
X501 (DC+)

O’scope
X502
Out

ResCon
S402 ON
ResCon
V407 ON
ResCon
V403 OFF

Upgrd Fail
V413 Coil Err
V607 Pwr Fail

S404 Proc
Reset

V403 LW active
FW active

X401 CAN

X402 CAN
D7 Light Board 8.2.29 Figure 141 D7 Layout

General 8.2 .91

The optical transmitters and receivers between the GSSU and the
rest of the Gradient System are implemented on the Light Board
U11 U13
D7. Additionally the Power Supply connection and the Current
Sensor Assembly connection is done via this board. U12 U14

U21 U22
50kHz CSA_Y
Function 8.2 .92 U24 U25 X4
Power
• Electrical to optical and optical to electrical signal conversion CSA_X CSA_Z
1 3
U31 U33
for the Power Stages.
• Control signal decoupling for the ResCon. U32 U34

• Clock signal (50 kHz) decoupling for the Driver Supply board CSA
U101 U121 U111
D10. X1_S1 X2_S1
• Gradient coil temperature monitoring signal decoupling. U102
X1_S2
U122 U112
X2_S2
U151 U171 U161

• Synchronization clock for Current Sensor Assy. (not used). U152 U172 U162
U103 U123 U113
• Upgrade status link connector. X1_S3 X2_S3 X1_Temp_Err X2_Temp_Err
U104 U124 U114 U153 U173 U163
X1_S4 X2_S4 X1_OVV_Err X2_OVV_Err

U201 U221 U211

Y1_S1 Y2_S1
U202 U222 U212 U251 U271 U261
Y1_S2 Y2_S2

U203 U223 U213 U252 U272 U262

Y1_S3 Y2_S3 Y1_Temp_Err Y2_Temp_Err
U204 U224 U214 U253 U273 U263
Y1_S4 Y2_S4 Y1_OVV_Err Y2_OVV_Err
U301 U321 U311
Z1_S1 Z2_S1
U302 U322 U312 U351 U371 U361
Z1_S2 Z2_S2

U203 U323 U313 U352 U372 U362

Y1_S3 Z2_S3 Z1_Temp_Err Z2_Temp_Err
U204 U324 U314 U353 U373 U363
Y1_S4 Z2_S4 Z1_OVV_Err Z2_OVV_Err

U41 U51 U53 U55

Coil_err RC_Enable RC_Ready
U52 U52 U56
RC_Temp RC_CurrTrip

211
Gradient - Gradient System K2209
 8
212

GSSU Power Supply 8.23 Figure 142 GSSU Power Supply

Main
DC Supplies 8.2.31
Diagram
50kHz Power
Stabilized DC-voltages for the GSSU. Voltages and tolerances with clock LED
disabled modulator:

Voltage Tolerance Measure Point Current

5.075 V ±25 mV D17 X63 3A
15.050 V ±25 mV D17 X61 2A
–15.050 V ±25 mV D17 X65 2A

Driver
Power Supply
D10 Driver Power Supply
Driver Supply with external clock (jumper X4 1-2).
The external clock (50 kHz via a fiber optic cable from D7) divided Driver
to 25 kHz on board. Supply
Output voltage is 16V AC @25 kHz, Imax = 10 A. Outputs
An LED indicates if the output voltage is available
A separate cable connection is available for each driver circuit.

NOTE The stabilized DC-voltages are adjustable by

potentiometers on the respective power supply.

GSSU
Power Supply
Power Stage 8.24 Figure 143 Power Stage

Each of the water-cooled Power Stages contains a 4-switch bridge Main

supplying maximum 400V and capable of a maximum output Diagram
current of 300 A pulsed, 160 A constant current.
The number of Power Stages is as follows:

• Standard Power Stage = Turbo option 3 power stage modules

• Upgrade Power Stage = Ultra option 6 power stage modules

Function 8.2.41
X Y Z X Y Z
The 400V DC supply voltage from the Resonant Converter is
delivered to the Power Stages over tongue connectors at the rear.
The PWM drive signals from the Modulator are delivered over Standard Upgrade
Power Power
fiber optic cables and connected at the top-side of the Power Stage
Stages Stages
modules.
(Turbo option) (Ultra option)

WARNING Swapping the fiber optic drive signals will result in

blowing up the Power Stage. This is very loud and
can cause heart failure and/or hearing impairment!
Therefore, don’t do it.

The 16V AC, 25 kHz power supply for the internal Drivers are
delivered over yellow and brown twisted pair cables and connected
also at the top of the Power Stage modules.
T h e p o w e r s t a g e s h ave i n t e r n a l h e a t- s i n k t e m p e r a t u r e
monitoring circuits. Their output is one fiber optic cable at the top
of the Power Stage module

NOTE The Power Stage is an FRU!

213
Gradient - Gradient System K2209
 8
214

Resonant Converter 8.25 Figure 144 Resonant Converter

Main
General 8.2.51
Diagram

The Resonant Converter (ResCon) supplies the Power Stages with Resonant Converter Mk I
stabilized DC-voltage. Each Power Stage has its own supply to
minimize the coupling between the axis.

Specifications 8.2.52

The adjustable output voltage is set to DC400 V and the ResCon is

capable to handle at least 25 kW output power for an unlimited
time.
The picture on the left shows you the ResCon MK I for older
systems. For newer systems you will find a half-height component
called ResCon MK II.

Supervision 8.2.53

The monitoring of the ResCon controls the power-on sequence and

it detects the over temperature and overload state (total power) of
the unit and provides a voltage and current supervision for every
output channel (6x).
Resonant Converter Mk II
LEDs 8.2.54

LED Description
Tria Err On when Triangle signal not ok: amplitude and/or offset
On when the Sync signal is either missing (clock from MC4C40)
Sync Err
or if the PLL cannot lock on (internal eror)
P15 Err P15 power not ok when ON
N15 Err N15 power not ok when ON
P5 Err P5 power not ok when OFF

See TSG for a detailed description of status LED’s and FOC-links.

Current Sensor Assembly 8.26 Figure 145 Current Sensor Assembly

Main
Overview 8.2.61
Diagram

The Current Sensor Assembly (E7) consists of three pairs of

current sensors each for one gradient axes. In addition, filter
capacitors are installed in this unit.

NOTE The Current Sensor Assembly is an FRU!

215
Gradient - Gradient System K2209
 8
216

Gradient System K2217 8.3

Figure 146 Gradient System K2217

Introduction 8.31
K2217
The Quantum gradient system K2217 is the standard gradient Current Sensor Assembly
system in the MAGNETOM Sonata. Additionally, it is available as an
option for the MAGN ETOM Sym phony and the MAGNETO M GSSU
Harmony.
(For more details refer to "The Different Gradient Systems" in this
description.) GSSU Power Supply

The Quantum gradient system in the MAGNETOM Sonata features

the following performance: Output Choke (behind Power Stages)

Sprint Quantum
Power Stages
Max. Gradient Field 30 mT/m 30mT/m
Max. Current 380 A 380 A
Max. Voltage 1500 V 2000 V
Min. Rise Time 400 µs 300 µs
100 (X,Y)
Slew Rate in T/m/s 75 (X,Y,Z)
125 (Z)

Power Stage Power Supply

(D30, D31)
Figure 147 K2217 Block Diagram

Parts System
Location Diagram
GSSU
MMC AVA

D A
X
MC4C40

PID Reg D

Control
GPA_CTRL A
Modulator

4MHz Control and

clock monitoring logic
Supervision

Cascade Light
and Synch.
D11 (D111) D12 (124) D14 (142)
MC1C40

DAC Regulator Modulator

STIMO
Y

Monitoring Logic
D17
CAN

CAN I/O
CAN

Blowers

Cascade Quantum
Communication
& Test- Z
Supervision signals
RX_Module

Loop MUX
Loop

X
Y
D16 CAN & Service Z

Power Stages Chokes CSA Filter Grad

D31 Panel Coil
LPD SSU
X100
F14
GSSU 5 x 400 VDC
PS
CCA
Terminal 5 x 400 VDC
Gradient System
Roof Power
Mains F3
Line
Stage
D32
Rectifier
5 x 400 VDC
K2217
Box Filter Supply

217
Gradient - Gradient System K2217
 8
218

Gradient Small Signal Unit (GSSU) 8.32 Figure 148 GSSU Front View

Main
General 8.3.21
K2217 E5 GSSU Diagram

The GSSU is generating the pulse width modulated control signals

D11 D12 D14(2) D16 D17
for the switches in the Power Stage based on the digital data
coming from the MMC. It’s additional task is the overall supervision

ext ch
of the GPA. V130 V57 V27

LP on
V131 V58 gain V38
V132 V59 1 V40
V408
V133 V60 2
V412 V41
V134 V61
The PCBs or FRUs (field replaceable units) of the GSSU connected V135 V62
5
10
S401 S1
to the one common backplane (D18) are listed below: X3 V136 V63

• DAC D11 (or D111 with Light)

V137 V64
External S2
V159
• Regulator D12 (or D124 with Light) X R155
X301 IN
S3
• Modulator D14 (or D142 with Light) Y R189 X500
Loop Out
(DC-)
• Service/CAN D16 S1
Z R223
X501
Loop Out
(DC+)
X61-65

• I/O-Board D17
reg. differ.
n. c. X3

X61-67
reg. output
n. c. O’scope
S2 act. value X502 Out
n. c.
ext. sig. in

DAC reg. differ.

X701-

X71-77
n. c.
Offset reg. output X713
n. c. PwrStg PS
D18 Backplane 8.3.2
X R153 act. value
n. c.
ext. sig. in
S402 ON
Y R177 PwrStg
reg. differ. V407

X81-87
n. c. ON
Function 8.32.21
Z R200 reg. output
n. c.
X8
act. value PwrStg PS
n. c. S403
The backplane is the interconnection between the components of ext. sig. in OFF

the GSSU. It is part of the GSSU-rack mounted to the cabinet X81-88

X14
X15
gnd X4
frame by four quick release screws. X
Z
Y DAC V413
Fast Off X5
X11 X Coil Err
X DAC V607 Pwr Fail
Y X12 Y
Z no filt
S403 Proc
X9 gnd X13 Z Reset
V403 LW active
X4 X FW active

X5 Y
X401
X6 Z X3
X10 X5 CAN
DAC
Output X402
D11 (D111) DAC 8.3.23 Figure 149 DAC-Board D11/D111
The DAC-Board exists in two versions: GCTX
Main
Diagram
Board System Differences
GPA_CTRL Board
D11 K2217 Quantum or Sonata selected DACs Layout
X3
D111 K2217 Light non-selected DACs

D11/D111
The DAC board can be divided into these functional blocks:
• Control Logic DAC Test
• DACs 4MHz clock Data Input Logic
• Frequency Divider SU_Grad Grad_Data G_SEL

Control Logic 8.32.31 S1

S3
The gradient amplitude data (including the eddy current pre- X Y
F0 D A
distortion and the gradient delay) coming from the MMC is C
3
4 MHz Z
connected to a 50 pin female front connector (X3). The Control 9
6
S2
Logic contains circuitry to galvanically isolate from the MMC, data F0
3
Unfiltered X85 (X)
change recognition and a data feedback for test looping. 20 kHz
C

9
6 Offset X86 (Y)
R153 (X)
The 18 bit amplitude data (Grad_Data) for the three gradient axes S4 X87 (Z)
R177 (Y)
Frequency
is transferred multiplexed and controlled by the select signals
R200 (Z)
Divider filtered X81 (X)
G_SEL. The G_SEL select signals are used to clock in new gradient X82 (Y)
data values. Unchanged values are not clocked in, thereby Umax ±10 V X83 (Z)

increasing the signal stability. X9

X4
Loopback Test
X5
An input data loop-back test between the MC4C40/GCTX and the X X6
D11 can be run from the Service Software. When the Test signal is Y

S_DAC_X(Y,Z)
Z
activates (SeSo), the 18 bit data of the X channel (SU_Grad) and

DAC_X(Y,Z)
the control lines can be looped back to the GCTX to verify the data

FSYNC
cables and connections.

D14 Mod D12 Regulator D16 Service

219
Gradient - Gradient System K2217
 8
220

DAC 8.32.32
Figure 150 DAC-Board D11/D111
The 18 bit amplitude data is transferred to the three DACs GCTX
Parts Main
controlled by the select signals. The DACs have an output voltage Location Diagram
of ± 10 V which corresponds to the maximum current allowed by
the gradient option. GPA_CTRL

The main DAC output is fed over the GSSU backplane to the D12 X3
Regulator board as the nominal gradient amplitude. A copy is also
sent to the D16 CAN & Service board where it is used as a feed D11/D111
back to the measurement control for loop testing and for the tune DAC Test
up procedures found in the Service Software.
4MHz clock Data Input Logic
SU_Grad Grad_Data G_SEL

Frequency Divider 8.32.3

A 4 M Hz cl oc k si gn al de l ive red f rom t he GCT X i s us e d to S1

synchronize the GPA to the rest of the MR system. This clock signal S3 X Y
is divided by the frequency divider according to the settings of the F0
3
D A
t w o r o t a r y sw i tc h e s S 3 a nd S 4 . T h ey a r e s et t o 3 a n d 6 C
6
4 MHz Z
9
respectively for an output frequency of 20kHz. F0
S2
3
C 20 kHz Unfiltered X85 (X)
9
6 Offset X86 (Y)
R153 (X) X87 (Z)
S4 R177 (Y)
Frequency R200 (Z)
Divider filtered X81 (X)
X82 (Y)
Umax ±10 V X83 (Z)

X9

X4
X5
X X6
Y

S_DAC_X(Y,Z)
Z

DAC_X(Y,Z)
FSYNC
D14 Mod D12 Regulator D16 Service
Switches 8.3.24 Figure 151 D11 Front View
Switches S1 and S2 are used to zero the DAC inputs and outputs
D11 Block
for the offset adjustment. When set to the upper position, the Block
Diagram
Diagram
Offset potentiometers R153(X), R177(Y) and R200(Z) are
adjusted for 0V ±50µV at connectors X4(X), X5(Y), X6(Z).

Switch Description Position

S1 left DAC_X enable/disable down/up 18 bit Gradient Data input
4MHz synchronization clock
S1 right DAC_Y enable/disable down/up X3 Test-Read signal
S2 left DAC_Z enable/disable down/up
S2 right not used not used
DAC enable
Potentiometers 8.3.25
off
on S1 The DAC inputs are set to ZERO
when in the off position.
The static DAC offset can be adjusted with potentiometers. During off
S2
on
the adjustment the corresponding DAC has to be disabled by using
DIP-switches S1 and S2. See above.
X R153 X-DAC offset adjustment
Potentiometer Description
Y R177 Y-DAC offset adjustment
R 153 DAC_X offset adjustment Z R200 Z-DAC offset adjustment
R 177 DAC_Y offset adjustment
R 200 DAC_Z offset adjustment
X81-88
X DAC_X, filtered
Y DAC DAC_Y, filtered
Z
DAC_Z, filtered
X DAC DAC_X, unfiltered
Y
Z no filt
Test Points
DAC_Y, unfiltered
8.3.26 DAC_Z, unfiltered
X9 gnd
The DAC output signals (DAC_X, Y, Z) are available for monitoring
X4 X DAC_X, filtered
via QLA-connectors (X4, X5 and X6) and test pins X81-X88 with (+/- 10 V corresponds to max. gradient
ground connection X9 at the front panel of the board. X5 Y DAC_Y, filtered current, configured by software license)
DAC_Z, filtered
X6 Z
DAC
Output

221
Gradient - Gradient System K2217
 8
222

D12 (D124) Regulator Board 8.3.27 Figure 152 Regulator Board D12/D124
D11 DAC
General 8.32.71
Main
Diagram
The Regulator-Board exists in three versions: CSA
DANF. LEM Board
Layout
Regulator Gradient System Differences
D12 K2217 Quantum or Sonata
C-CON1/2_X(Y,Z)
D124 K2217 Light regulator parameters
D123 K2217 Allegra
DAC_X(Y,Z)
6

D12/D124
The Regulator board includes the regulator function for all three
axes. It contains the following functional blocks:
Regulator
• Actual Value Amplifier (3x)

D14 Modulator
• PID Regulator (3x)
• Supervision Logic (3x) Actual
3 REG_OFF
• Monitoring and LEDs
Value
Amplifier

Monitoring
• Regulator Control
Monitor
Inom. Iact. and Errors
50 A/V LEDs
Function 8.32.72
N_RESET

D16 Service
The current sensors in the Current Sensor Assembly (CSA) deliver 3 S_CAV
a compensation current proportional to the current driven through
the gradient coil. This compensation current is converted into a Regulator
Param.
corresponding voltage level by the actual value amplifier. PID-Regulator
Control
Regulator-data
2 2 Low_Gain
In the PID-regulator the actual current value is compared to the X
Y
nominal current value DAC_X(Y, Z) from the DAC-board. The Z
resulting regulator difference is amplified by the regulator
REG_ REG_ SOFF_X(Y,Z)14
according to its characteristic. The output signals REG_X(Y, Z)12 X(Y,Z)12 X(Y,Z)34 SOFF_X(Y,Z)23
and REG_X(Y, Z)34 of the regulator are connected to the input of
the modulator board D14 (or D142).
3 3 6

D14/D142 Modulator
Actual Value Amplifier (AVA) 8.32.73
Figure 153 Actual Value Amplifier
Amplifier
The measurement current (C-CON1) from the DANFYSIK current X(Y, Z)-Gradient Coil Back
transformer is amplified so that 50 A coil current corresponds to CSA
1 V. The signal from the LEM current transformer (C-CON2) is used
P15_RET
for monitoring only. DANFYSIK LEM

The offset of the amplifiers can be adjusted with potis R155(X),

C-CON1 C-CON2
R189(Y) and R223(Z). To adjust, the modulators are first disabled _X,Y,Z _X,Y,Z

+15V

-15V
using switches S1 and S2 located on the D17. The potis are then

+15V
-15V
adjusted for 0V ±50µV as measured at X11(X), X12(Y) and
AVA
X13(Z).
Monitoring
The two signals from the current transformers are checked for Voltage

Monitoring
OK CAV_ERR
differences greater than 32 A. The power supply (±15 V and
ANA_GND) for the current transformers on the current sensor Offset Adj. &
R155(X) abs. current
assembly (CSA) is coming from the D12/124-board and the +15 V R189(Y) difference
is looped back as P15_RET-signal. This signal is combined with the R 223(Z) < 32 A
±15 V voltage monitoring. If one of the above monitoring signals is
faulty, the respective current error (CAV_ERR) is sent to the D16- Current Flow

D14 Modulator
|i|<30A V159
board. This error signal also lights a red LED on the front panel of SOFF_
D12/124 and initiates the interrupt internal signal (N_INT_INT) >1 X(Y,Z)14
<+30A
that blocks all three axes. X24
1 SOFF_
Loop Test > -30A
X(Y,Z)23
>1
The analog signal S_CAV is connected to the loop multiplexer on
the Service/CAN board for automatic testing.
S_CAV_X(Y,Z)

D16
Stimulation Monitoring gradient loops

The actual current value is an important signal for the software

stimulation monitor on the MC1C40 in the Modular Measurement SU_CAV_X(Y,Z) D17 I/O
Control (MMC). Therefore, the signals SU_CAV and SU_GND are for Stimulation Monitor
and gradient loops
sent to this board via the D17 I/O-board. Current
Actual Value X11(12,13)
50 A/V
X65(75,85)

to regulators D12/D124 MMC

Regulator
MC1C40

223
Gradient - Gradient System K2217
 8
224

PID-Regulator 8.32.74
Figure 154 PID-Regulator
Current Setting D11 DAC CSA
The nominal value sent from the DAC-board is inverted and via Back
jumper X16(18, 20) added to the actual value coming from the
AVA. The two jumpers X22 and X23 are used to set the maximum

DAC_X

DAC_Z
DAC_Y
current value for the gradient system in use:
D12/D124
Regulator
X23 X22 Imax. Gradient System Software
I max
software LOW
1-2 1-2 what ever NUMARIS/4 setting
controlled GAIN1 1
non non 300 A Light X22
AVA

D16 CAN & Service

Sym/Har with LOW
non 2-3 380 A GAIN2 X16
Quantum option NUMARIS/3.5 1 1 (18,20)
X23
2-3 non 435 A not used
Inom. Iact.
2-3 2-3 500 A Sonata
Adder

Regulator Unit D
The closed loop regulation is based on a digitally controlled PID- A
P
regulator with 7bit resolution for the proportional (P), the integral S1

(I) and the differential (D) part. D I

The initial setting of the regulator after power on is determined by A
D
PID
DIP-switches S1 to S9 (see table on the left). During the scanner S2 Regulator
boot process the regulator values from the tune-up will be loaded D X17 1
A
by software. (19,21)
S3
The regulator output signal passes jumper X17(19, 21) and is sent
to the D14-board (inverted and non-inverted). The inverted

D16 CAN & Service

regulator output signal can be measured on test point X63(73, 83). REGOUT_X(Y, Z)
Test point X67(77, 87) can be used to supply an external nominal X63
value (via X16) or an external regulator signal (via X17). (73,83)

REG_X12_P

REG_X34_P
REG_Z...

REG_Y...
D14/142 Modulator
Monitoring 8.32.75
Figure 155 Monitoring on Regulator Board
Errors and LEDs
The following table shows the monitoring on the D12/D124-board: Back

Error Monitored Signal LEDS INT_INT

current sensors;

D14 Reg
CAV-error 15 V return from CSA; 3 red YES Vcc
N_INT_INT
±15 V supply AVA
Over-current actual current value 3 red YES
12
Duty Cycle actual current value 3 red YES
Ohmloss actual current value 1 red NO
regulator difference YES, if not in CAV_ERR CAV_ERR_
3
Loop-error 3 yellow
regulator output signal service mode X(Y, Z)

D16 Service & CAN

3
IMAX_
The interrupt internal (N_INT_INT) always blocks all three axes Overcurrent
Imax. +5% X(Y, Z)
for safety reasons. Iact.
Inom. 3
An Ohmloss-error additionally results in a Duty Cycle error for

Latch
Duty Cycle DUCY_
identification of the faulty axis. adder X(Y, Z)

Ohm-
Reset Reg power-
OHMLOSS
All of the above mentioned errors are latched in error flip-flops and diff loss
sent to the D16-board. The error flip-flops are reset by software via Loop LOOP_ERR_
3

the D16-board or manually using button S3 on D17-board. Error X(Y,Z)

Service Mode Regulator N_SEMO

D17 I/O
The service mode can be activated either by software via the D16-
X17 V130 N_RESET
board or by switch S2 on the D17-board. The service mode is 1 V131
indicated by a yellow LED on the D17-board. If service mode is V132
V133
activated, the loop error does not result in an interrupt internal. V134 X V136
Nevertheless, the yellow LEDs will light and the error is forwarded V135 Y Z V137
to the D16-board.

D14 Reg
V136 3
REG_OFF
Regulator Enable _X(YZ)
Monitoring Section
The modulator board D14 or D142 sends the signal REG_OFF to
enable and disable the regulator board. The enable status is shown
by three green LEDs on the front panel of the regulator board.
D12/D124
Regulator

225
Gradient - Gradient System K2217
 8
226

Opposite Current Direction Disabled Figure 156 Monitoring on Regulator Board

The actual value is monitored for a threshold of approximate 30 A
absolute. A green LED indicates if a current of more than +30 A or
Back
less than –30 A is running. Furthermore, the other two outputs of
this comparator logic (< 30 A and > –30 A) are used to disable the
transistors of the opposite current direction.

D14 Reg
The signal SOFF_X(Y, Z)23 disables the positive current direction Vcc
N_INT_INT
and the signal SOFF_X(Y, Z)14 disables the negative current AVA
direction. Both signals are sent to the modulator board D14 or 12
D142, respectively.
Jumper X24 determines wether this disable logic for the opposite
current direction is used (1-2) or not (2-3). CAV_ERR CAV_ERR_
3

X(Y, Z)

D16 Service & CAN

3
Overcurrent IMAX_
Imax. +5% X(Y, Z)
Inom. Iact. 3

Latch
Duty Cycle DUCY_
adder X(Y, Z)

Ohm- OHMLOSS
Reg power-
diff loss
3
Loop LOOP_ERR_
Error X(Y,Z)

Regulator N_SEMO

D17 I/O
X17 V130 N_RESET
1 V131
V132
V133
V134 X V136
V135 Y Z V137

D14 Reg
V136 3
REG_OFF
_X(YZ)
Monitoring Section

D12/D124
Regulator
LEDs 8.3.28 Figure 157 D12 Front View

LED Description D12 Block

Block
V136 left current flow (one or more axes) > |87 A| Diagram
Diagram
V136 right regulator X enabled V130 X Imax. Y Imax.
V137 left regulator Y enabled V131 Z Imax. X CAV error
V132 Y CAV error Z CAV error
V137 right regulator Z enabled V133 X DUCY Y DUCY
V134 Z DUCY OHMLOSS
V135 X LOOP error Y LOOP error

Test Points
V136 Z LOOP error X Reg. on
8.3.29
V137 Y Reg. on Z Reg. on

These test points are generally intended for factory use. V159 Current flow
X R155 X-current sensor offset adjustment
Y R189 Y-current sensor offset adjustment
Potentiometers 8.3 2.10 Z R223 Z-current sensor offset adjustment
X Regulator input (difference between Nom and CAV)
Potentiometer Description
--
X Regulator output
X61-67 --
X Actual value
R155 X-current sensor offset adjustment --
X Ext. sig. in

R189 Y-current sensor offset adjustment Y Regulator input (difference between Nom and CAV)
--
Y Regulator output
R223 Z-current sensor offset adjustment X71-77 --
Y Actual value
--
Y Ext. sig. in
Z Regulator input (difference between Nom and CAV)

The adjust is made in much the same way as the DAC offset
--
Z Regulator output
--
X81-87
adjustment. For this adjustment, the Modulators must be disabled
Z Actual value
--
Z Ext. sig. in
with switches S1 and S2 on the D17 I/O board to assure there is no
X14
current being generated by the amplifier. The pots are adjusted for X15
gnd

0V ±50µV at connectors X11(X), X12(Y), X13(Z).

X11 X
X11: Current actual value X
X12 Y X12: Current actual value Y
X13: Current actual value Z
X13 Z

Connection to Current Sensors CSA

X10

227
Gradient - Gradient System K2217
 8
228

D14 (D142) Modulator Board 8.3 2.1 Figure 158 Modulator Board D14 or D142

General 8.32.1 .1
Board Main
Layout Diagram
The Modulator board exists in two versions dependent on the type
of Power Stage used: D14/D142
Gradient # of
Modulator

Stages
Power
System Cascades Modulator 3 Driver_V
Supervision
Quantum 5 D14 K2217 3 PS_Temp
& Display
Light 3 D142 K2217
N_RESET

D17 I/O
SWOFF_X(Y,Z)
The Modulator Board has two main functions: N_SEMO
OVV_X(Y,Z)
• generation of the pulse-width-modulated switching signals EMMI
• supervision of power stage related signals GPA
OFF
Pulse-Width-Modulator

D11 DAC
8.32.1 .2

Overview FSNYC
The D14(2)-board is based on a programmable logic that contains
the pulse-width-modulator and the monitoring circuit of time 3 N_Mod_On_X(Y,Z)
Modulator
critical power stage related signals. 3 Err_Sel_1(2,3)

D16 CAN
N_SR2(4)
Modulator
X9 1
The regulator output signals REG_12 (34) are analog-to-digital SR1
Vcc
converted and fed to the modulator chip where the pulse-width- SR2 X10 1
modulation takes place. The resulting switch signals (active low)
N_Int_Int
are sent over 3 cables to each Power Stage module. These cables 6 SOFF_14

D12 Regulator
are monitored by looping VCC through a bridge between pin 1 and SOFF_23
pin 50 inside the plug on each of the Power Stage modules. If this 3 REG_12 A 1
signal (GPA_On) is missing, the VCC-supply for the opto- 3 REG_34 D
transmitters on the driver boards in the power stages is switched
6ADCs
off by means of a relay. 3 REG_OFF
The signals SOFF_14(23) inform the modulator chip whether the Vcc
opposite current direction should be enabled or disabled. Vcc for
opto-couplers
The N_INT_INT signal from the Regulator informs the modulator
chip about a severe problem of the regulator. Consequently, the
modulator disables the regulator of the desired axis by means of
signal REG_OFF_X(Y, Z). Power Stage
Jumpers 8.32.1 .3
Figure 159 Modulator Board D14 or D142
The Quantum gradient system is available in different versions Main
dependent on the MAGNETOM system it is used for. The max. Diagram
power stage voltage is selectable by software or jumper X9 and
X10: D14/D142
Modulator
X9 X10 Max Voltage System Software

Stages
Power
3 Driver_V
1–2 1–2 software Supervision
all NUMARIS/4 3 PS_Temp
(SR2ADJ) (SR4ADJ) controlled & Display
S/H Quantum; N_RESET
2–3 2–3 2000 V
Sonata

D17 I/O
SWOFF_X(Y,Z)
NUMARIS/3.5 N_SEMO
none 2–3 1000 V S/H Ultra
OVV_X(Y,Z)
don’t care none 500 V S/H Turbo EMMI

GPA
OFF

D11 DAC
The actual setting of the Power Stage voltage is fed back to the
D16 Service/CAN. If the Power Stage voltage is set to >1000 V, the FSNYC
gradient system requires a stimulation monitor. Systems running
with NUMARIS/3.5 use a hardware stimulation monitor (D13 or 3 N_Mod_On_X(Y,Z)
Modulator
D131) and systems with NUMARIS/4 use a software stimulation 3 Err_Sel_1(2,3)

D16 CAN
monitor: N_SR2(4)

SR1 X9 1

Option NUMARIS/3.5 NUMARIS/4 Vcc

SR2 X10 1
Sprint not existing
software controlled N_Int_Int
Quantum D13 K2217
stimulation monitor 6 SOFF_14

D12 Regulator
Sonata D131 K2217 SOFF_23
3 REG_12 A 1
3 REG_34 D
6ADCs
3 REG_OFF

Vcc
Vcc for
opto-couplers

Power Stage

229
Gradient - Gradient System K2217
 8
230

Supervision, Display and Synchronization Logic 8.32.1 .4

Figure 160 Supervision on D14/D142
Monitoring
The supervision monitors the supply voltages (±15 V and +5 V), D14/D142
clock and synchronization. Furthermore, monitoring signals from Modulator
other boards can disable the modulator:
• Software Stimulation Monitor from MMC;

D11 DAC
FSYNC Supervision Clock_Err
• Power stage voltage monitoring from D17; &
• Manual modulator off by switches S1 and S2 on D17; Sync Logic
• Modulator enable/disable from the processor board D16. P15_Err

D16 CAN
N_Mod_On_X(Y,Z)

Error Latch
Voltage Monitor
If the modulator detects an error, the D16 is informed by signal Err_Sel_1(2,3)
ERR_X(Y, Z). N15_Err

Driver_V

Stages
Power
Switch Off Modes VCC_Err
PS_Temp
In case of an error, the modulator can disable a running gradient
current in two ways:
• The "hard" way; all switches of the power stage are blocked.

D16 Service / CAN

D17-I/O
• The "soft" way; the modulator enables switch 1 and 3 of the Mod_Err
power stage permanently (upper freewheeling). N_RESET

Sync_Err

S1
SWOFF_X(Y,Z)

N_SEMO
Err_X(Y,Z)

S2
OVV_X(Y,Z)

EMMI

This "soft off" is necessary to prevent stimulation during switch off. DB_WDG_ERR
Only the processor controlled modulator disable using signal
N_MOD_ON_X(Y, Z) and the manual off (SWOFF...) by the switches
on D17-board result in a hard switch off of the gradient current. N_DB_WDG

MMC
GPA_ON MC1C40
LED Display 8.32.1 .5
Figure 161 Error Display D14(2)
The different error possibilities are indicated by eight error LEDs D14(2) Block
and two control LEDs. The status of the two control LEDs (LED 7 Diagram
and 8) determine the error indicated by the lower eight LEDs.
V57 Clock Err MOD Err
Error Reset V58 P15 Err N15 Err
All errors can be reset by the processor D16 (N_CAN_RESET) or V59 Sync Err P5 Err
V60 Err LED 1 Err LED 2
manually by switch S3 on I/O-board D17. V61
V62
Service Mode V63 Err LED 1 Err LED 2
The supervision logic can be switched into service mode (N_SEMO) V64
by front panel switch S2_right on D17-board and remotely from N_INT_INT X-Modulator. man. OFF

the D16-board (N_CAN_RESET). The service mode is indicated by a EMMI Pull Protection
yellow LED on the front panel of the I/O-board D17. Fequency X Power Stage Temp. X
Power Stage Voltage X Driver X Volt low
X3

X-axis PMW Err LED 1 Err LED 2

outputs to
not used Y-Modulator. man. OFF
Power Stage
PWM outputs disabled Modulator defect
Fequency Y Power Stage Temp. Y
Power Stage Voltage Y Driver Y Volt low

X4
Err LED 1 Err LED 2
Y-axis PMW not used Z-Modulator. man. OFF
outputs to not used not used
Power Stage
Fequency Z Power Stage Temp. Z
Power Stage Voltage Z Driver Z Volt low

X5

Z-axis PMW
outputs to
Power Stage

231
Gradient - Gradient System K2217
 8
232

D16 Service/CAN Board 8.3 2.12 Figure 162 D16 Service/CAN Board

General 8.32.12.1 Main

Diagram
The Service/CAN Board consists of two functional blocks: D16
• Communication and Supervision (CAN-Module)

EXT_IN
Board
Service / CAN Layout
• Analog signal multiplexer.

D11 DAC
X301
Loop Ext. Ch.

Function AUX X501

Receiver 1
8.32.12.
DC+
DAC

MUX
The CAN-Module is responsible for the data transfer between the

D12 Reg
CAV X500
DC-
MMC and the GPA. Control data for the GPA is transferred from the RegOut
1X,2X 25kHz
RegErr
MMC and GPA-status information to the MMC. V5X,10X X502 Scope
Out
The analog signal multiplexer is used to connect signals generated
in the GPA to the ADC in the data acquisition system. This link

D9 Coil_Mon
allows the software evaluation of the selected signals.

PwrStg PS S402 Coil_Err

ON
V407
CAN-Module 8.32.12.3
PWR ON V413
PwrStg PS S403 (EPI)
Communication OFF Fast_Off

The firmware (FW) stored in a PROM allows the processor to run a

D31 / D32
D17
+15 V Communication
Mon
Pow_On
& &
self-test to communicate on the CAN-Bus and to load the V607
Pwr
Fail Supervision
application software. The application software (LW) for the Pwr Fail

I/O
Pow_Ready
processor is stored in an EEPROM. According to this program the RC_Temp
processor is able to receive control data from the MMC and transfer Reset
status information from the GPA to the MMC. Proc S404 N_DB_WDG
Reset
Front Panel Control LW active / V403
CAN
The state of the front panel switches is checked via input ports and FW active
Module Status
the front panel LEDs are driven by output ports of the CAN-Module.

D12
X401 &

MPCU
Control
Reset Signals
The front panel push button S404 is used to reset and re-start

D14
(warm start) the Processor. MSU
X402
Power Stage Power Supply ON / OFF Figure 163 D16 Service/CAN Boar Layoutd
Switches S402 is used to switch ON the Power Stage Power Supply
switch S403 to switch it OFF. LED V407 indicates ON/OFF state D16 Block
Diagram
and lights when ON.

ext ch
Power Fail Message

LP on
The + 5 V supply of the CAN-Module is produced from the + 15 V gain
1
V408
and buffered. If the + 15 V fails it is detected by an error logic and 2
V412
the buffered + 5 V will be available long enough to send a Power- 5
S401 Gain/LP select 10
Fail message to the CAN-System. This message is processed with
the highest priority. The Power-Fail state is indicated by the red
External
LED V607. X301 IN

Loop Out
X500
(DC-)
Loop Out
Analog signal multiplexer 8.32.12.4
X501 (DC+)

Loop Multiplexer X502

O’scope
Out
The DAC-output signal (S_DAC), the actual value signal (S_CAV),
the regulator difference (S_REGERR) and regulator output signal
(S_REGOUT) from all three channels are fed via the backplane to S402 PowerStage PS ON
the signal multiplexer. The selected signal is amplified by the
selected gain (1, 2, 5 or 10) and additionally a low-pass filter V407 PowerStage PS ON
(25 kHz) can be activated. The differential output signal DC+
(X500) and DC- (X501) are input to the RX_Module of the RF- S403 PowerStage PS OFF

system where it is digitized.

The settings described above can also be used for an external
V413 Fast Off / Coil Err
signal connected to the multiplexer via the front panel connector
V607 Pwr Fail
X301. In this case the setting is done by the front panel push
button S401. S403 Proc
Reset
(For a detailed explanation of this function see Troubleshooting
V403 LW active
Guide.) FW active

X401

CAN

X402

233
Gradient - Gradient System K2217
 8
234

D17 I/O Board 8.3 2.13 Figure 164 D17 I/O Boar Layoutd

General 8.32.13.1
D17 Block
Diagram
The D17 I/O board acts as an interface for the control and
monitoring signals to and from the D14 Modulator and D16 Service V27 Rectifier Temp not used
V38 Coil Temp not used
CAN boards and the components external to the GSSU (refer to V40 EMMI DB_WDG_ERR (stim.mon.)
Figure 165). V41 Service Mode
It also provides several service switches (see below) and the off
S1 Modulator disable X / Y
on
distribution of the GSSU power supply voltages to the GSSU boards
off
over the backplane. on S2 Modulator disable Z / Service Mode

S3
STIMO Interface 8.32.13.2
Error reset

For systems running syngo MR and having the Sprint, Quantum or X61-65
+15V
--

Sonata gradient options the MC1C40 stimulation monitor is used.

-15V
--
+5V
The MC1C40 outputs two signals, EMMI and DB_Wdg_Err, to the OVV X
--
D14 and D16 over the D17 where their states are indicated. They OVV Y
--
OVV Z
can also be bypassed with jumper X9. X701-
--
System clock 4 Mhz
X713 --
Modulator clock 20 kHz
Power Control 8.32.13.
--
FSYNC
--
FAUX (auxilary 50kHz clock - not used)
See the Power Stage power supply section for details.
X8

Service Switches 8.32.13.4

S1 and S2 provide a means o disable the modulators for service

purposes. They are used, for example, to set the current sensor X5 Connector to MC1C40
STIMO Monitor
offsets (see D12 AVA description)

Synchronization for DANFYSIK-Unit 8.32.13.5

The signal DCLOCK from the modulator is sent to the DANFYSIK-

current sensors in the Current Sensor Assembly (CSA) to
synchronize these units to the system clock.
Connector to D31
X3
Power Supply Distribution 8.32.13.6
Soft Start Unit

The GSSU power supply voltages are fed to the GSSU boards over
the backplane via the D17. These voltages can be measured at the
front over X61, X63 and X65 (see D17 board layout diagram).
Figure 165 I/O-Board D17
D16 Service & CAN D14/142-MOD Main
D18 Backplane Diagram

OFF_X(Y,Z)_SW
Board

DB_WDG_Err

N_SEMO_SW
Layout

CAN_Reset
to GSSU

COILERR

DCLOCK
boards

Reset
EMMI
D17-
I/O

Service Switches
V40
V41

Syncronisation
Power Control

Power Supply
&
& S1
V38 1 X9

Interface

& Status
17 X Y

STIMO
X9 X9
18 1
13
1
15 S1
1
14 16 Z
S2

+15V
S5 S2

-15V
GND
+5V
Reset

U7 U1 U2 U3 X4
V27
V38

X61
X65
X63
V40

X5 X3

RF-Cabin MC1C40 Power Stage GSSU

U1 P.S.
Power Supply DANFYSIK
Sensors
D9
Coil Temp CSA
6

J
NTC

Gradient
Coil

235
Gradient - Gradient System K2217
 8
236

GSSU Power Supply 8.3 Figure 166 GSSU Power Supply

Main
DC-Supply for GSSU 8.3.31
Diagram

Stabilized DC-voltages for the GSSU. Voltages and tolerances with

disabled modulator:

Measure
Voltage Tolerance Point Current
5.075 V ±25 mV D17 X63 3A
15.050 V ±25 mV D17 X61 2A
–15.050 V ±25 mV D17 X65 2A

DC-Supply for the Driver Supply

Stabilized DC-voltage for the driver supply in the power stage
modules.

Measure
Voltage Tolerance Point Current
direct on the
16.500 V ±100 mV 12 A
power supply
GSSU
Power Supply

NOTE The stabilized DC-voltages are adjustable by Slot 1 Line

potentiometers on the respective power supply. Filter
Slot 2
E1
Slot 3
Power Stage Power Supply
Mains Supply
The mains (L1, L2, L3) are supplied by the 80 A circuit breaker F3
located at the top of the CCA cabinet. Line filter E1 provides
decoupling from the customer mains. Three yellow LED-pairs on
the D31 Soft Start Unit indicate that circuit breaker F3 is closed
and there is lines voltage available.
WARNING Circuit breaker F3 MUST be switched on BEFORE
powering up the GSSU. Otherwise severe damage to
the Power Stage power supply and/or Power Stages
is possible!
Power Up/Down
The Power Stage power supply is enabled/disabled with the
N_Power_On signal and is performed either automatically via a
command from NUMARIS over the CAN bus or manually with
switches S402 and S403 on the Service/CAN D16.
When set the N_Power_On signal activates relay K1 which feeds
the mains voltage to transformer T1 over current-limiting resistors
to allow a slow charge of the buffer capacitors in the Power Stages.
After a 2 second delay contactor K2 will be activated to connect the
mains voltage directly to the transformer.
The current over the damping resistors is monitored and when too
high, the respective relay (K100 for L1, K200/L2 and K300/L3) is
activated resulting in a extreme power input (EPI) error message
to the D16 (this signal changes to Fast_Off which lights the left
side of LED V413 and informs the CPU.) At the same time the
N_Power_On signal to K1 is removed deactivating both K1 and K2.
Power-ON Acknowledge
When contactor K2 is activated a normally-open contact of K2 is
8.34
used to switch on relay K3 on the D31 via a cable interlock over
the D32 Rectifier board. A normally open contact of K3 informs the
processor (N_Power_Ready). Service jumper X9 on D17 allows
8.3.41 to bypass this acknowledge signal.
Transformer T1 8.3.4
The primary of Transformer T1 must be tapped for the proper
incoming mains voltage. Its secondary provides fifteen 285V AC
outputs each fused with 25A fuses. The secondary voltage is sent
to the D32 Rectifier board for rectification to 400V DC.
Rectifier Temperature Monitoring 8.3.45
The 15 rectifier units on the D32-board are mounted by a water-
cooled heat sink whose temperature is monitored via a PTC-
resistor. A monitoring circuit on the D31 checks the rectifier heat
8.3.42 sink temperature, if it exceeds 55°C relay K4 is activated. In case
of an error, relay K4 is deactivated and D17 sends an error signal
to the D16-board. The left side of LED V27 on the D17 indicates
this error.
Power Stage Voltage Monitoring 8.3.46
Each power stage module needs 5 times 400V DC for the five
cascades. The D32 Rectifier board has 15 rectifiers for the three
axes with over-voltage monitors. The three error signals pass the
soft start unit D31 and block the modulator via the I/O-Board.
8.3.43
237
Gradient - Gradient System K2217
 8
238

Figure 167 Power Stage Power Supply

Mains F3
Power Stage Parts Main
Box 80A
D31 Soft Start L1 L2 L3 L3
Power Supply Location Diagram
ON ON ON
Power
L1 L2

E1 Line
Stage Filter
PS
D16 D17 X2
CAN I/O
Power On +15V
-15V
ON Logic
S402 K1 K2
2 sec.
X3 X1
N_Power_On
& 1 +15V
6x
-15V
V413
K100 K200 K300
S403 Over
OFF Current
EPI

500V
480V
460V
440V
420V
400V
380V
500V
480V
460V
440V
420V
400V
380V

500V
480V
460V
440V
420V
400V
380V
Fast_Off Extreme_Power

Fast Off /
Coil Error
K3 T1 15 x 25A
N_Power_Rdy Rect_OK
10 10 10
X9
8 7 X8
V27 15 x 285V AC
PTC
K4 Temp
RC_TEMP J
1 1 Monitor
>55°C +15 V 15 x 400V DC
X9
GND
X703

9 10
OVV_X N_OVV_X
D14/142-MOD

1
Voltage
X703

X9 Monitor
OVV_Y 1 2 N_OVV_Y >450V
1
D32
X703

X9
OVV_Z 3 4 N_OVV_Z Rectifier
1
10 10 10
X9
5 6

X Power

Y Power

Z Power
Stage

Stage

Stage
+15 V
GND
-15 V
Figure 168 Power Stage Module

Block
Diagram

Rectifiers

D32

Views from front side

View from left side

D31

239
Gradient - Gradient System K2217
 8
240

Power Stage 8.35 Figure 169 Power Stage Modules

Block
Overview 8.3.51
Diagram
The difference between a Cascade Light and
Cascade Quantum can be seen by the DC PS
LEDs. If all 6 are on, ist a Cascade Quantum, if
Each of the three power stage modules consists of the following:
only 4 LEDs then it is a Cascade Light.
• 5 water cooled bridges (cascades) with 4 IGBT-switches each
(3 water cooled bridges in case of Light).
• 5 times DC400 V power stage supply.
• Integrated driver supply, capacity block and filter units.
• Integrated opto-transmitter and opto-receiver for drive- and X Y Z
monitoring-signals.
• Maximum output 500 A and 2000 V

PWM
CAUTION The Power Stage capacitors require approximately Input
20 minutes to fully discharge after switch-off.

NOTE This time can be shortened to under 1 minute by

enabling the Service Switch S4 right on the D17 before
turning power Stage power supply off using S403 on the
D16 board.

Driver
Supply
LEDs 8.3.52 Figure 170 Power Stage Module
Each of the Power Stage modules consists of 5 cascades (bridges) D32 Rectifier D14 Modulator GSSU PS
(or 3 for the Cascade Light version) each with its own DC400 V X12
power supply. The presence of the supply voltage is indicated by (X22, X32)

17VDC
green double LED sets which are visible through holes on the front Parts D31
Location 50-pin SSU
side of the Power Stages. SCSI-cable
X1 X2

NOTE Power Stages for the Symphony, Sonata and Quantum

clock
5 x 400 VDC
systems having revision level 07 (as of August 2006)
these LEDs have been removed! But the holes are still cable Driver

Supply
Driver
interlock Supply
there :-) T > 50°C
20
< 14 V
DC AC

Cable Connections 8.3.53

J to Drivers to Drivers
• 5 times DC400 V from the rectifier board D32
• 16.5V DC supply from the GSSU-power supply unit routed via
the soft start unit D31.
• 50-pin SCSI-cable for the drive signals coming from the

Driver

Driver
1 5
modulator board D14(2).

Driver
Driver
2 4

all 5 stages
Cascade Quantum:

Cascade Light:
Stages 1,3,5 only
Driver
Driver
Power 3 3
Stage

241
Gradient - Gradient System K2217
 8
242

Output Filter Chokes 8.4

Figure 171 Output Filter-Chokes and Fan Box

Six Output Filter-Chokes are located in a box (Choke-Set). The Back

switching ripple on the gradient current is eliminated by the

inductance of two filter-chokes per axis.

Over Temperature Protection 8.41

Output Filter-
Chokes
Each choke is protected by a thermal-switch that opens in case of
over temperature. A corresponding FI_TEMPX(Y, Z) signal is
generated and fed via D110 and D70 to the D40 Modulator-board.

Fan Box 8.5

For cooling the Power Stages and Output Filter-chokes, five 24 VDC
fans are located in a box underneath.

Fan Monitoring 8.51

Each fan is equipped with a built in monitoring circuitry. If one fails,

a sum-error (FAN_ERR) is reported via D110 and D70 to the D40.

NOTE The complete Fan Box is a Field Replaceable Unit

(FRU)! Fan Box
Current Sensor Assembly 8.52 Figure 172 Current Sensor Assembly
D12 Reg
Main
Overview

DCLOCK
8.5.21
Diagram

The Current Sensor Assembly consists of three LEM-current

sensors for monitoring purpose and three DANFYSIK-current D17
sensors that supply the precise current value (actual value) for the I/O + + +
regulation.

Function 8.5.2

LEM 8.52.21

The current sensors from the company LEM use the Hall device DANFYSIK
principle and are used only for monitoring purposes. It is necessary Sensors
to measure the current on both sides of the gradient coil because CSA
of the fact that the final stages and coils are floating (galvanically
isolated). Shorts to ground or to another coil can only be detected
by comparing the current leaving and the current coming back
from the coil.
Current Sensor Assembly
In addition, filter capacitors are installed in this unit.
LEM Danfysik

243
Gradient - Fan Box
 8
244

Gradient Coil Assembly 8.6

Figure 173 Coil Supervision Board D9
Gradient Coil PTAB
K2209 K2217
The Gradient Coil is actively shielded and water cooled. The NTC Temp
electrical parameters of the coil allow a ramping time of 40 µs/mT/ Sensors D7.U41 D17.U7
m with the standard Power Stage (Turbo-Gradient) or 20 µs/mT/m
with the Upgrade (Ultra-Gradient). The coil is able to handle the
current that is required for a 20 mT/m gradient field.
Coil Supervision +18V,
-18V
The temperature of the Gradient Coil Assembly is monitored by the
Coil Supervision Board D9 located in the Patient Table Control V4
frame. The GPA-control (Service/CAN D6) detects the state of the D9 V12
V20
monitoring via a fibre optic link (Light Board D7). S1
V36
X pri 1
Comparators
2
D9 Coil Temp Monitoring
Y pri
U1

D7, D17
8.61
Z pri 3
X sec 4
The temperature of the gradient coil is measured with six thermal Y sec + 5 N_CoilErr
resistors (NTC) located in the coil. The monitoring circuit is on the Z sec 6
Coil Supervision Board D9 where a defective NTC can be by-passed
by a DIP-switch.

NOTE For safety reasons there must be at least four working

NTCs in the gradient coil.

V4 X pri / Y pri
In addition the Body resonator temperature (water cooled) is V12 Z pri / X sec
monitored by the board D9. If the temperature is within range the V20 Y sec / Z sec
green LEDs Grad. temp. ok (V36/A2) and Body Coil ok (V83/A2) V28 na / na
V36 na / Grad coil temp ok
are on. (For detailed description of the Coil Supervision Board D9 V55 18V supply ok
see TSG.) V63 Body Coil erors
Patient Table
V83 Control Unit
Service Jumper X9 8.61.01

U1
By means of this jumper each of the errors passing the D17-Board U2
can be jumpered out. In such a case the desired error is not
monitored anymore! Gradient Coil
Supervision
Board D9
 Section

9 Magnet System 9

Introduction 9.1
Figure 174 OR24, OR70 Magnets

The Magnet Systems of the 1 Tesla Harmony and the 1.5 Tesla
Symphony/Sonata systems consist of the following components:
• OR24 Magnet - a 1 Tesla superconductive magnet for the
Harmony systems.
• OR70 Magnet - a 1.5 Tesla superconductive magnet for the
Symphony and Sonata systems.
• Magnet Supervision - MSUP
Monitoring system for magnet and refrigerator functions.
• Alarm Box
Indicator for warning and alarm messages of the MSUP
including the system power up-, stand by-, power down- and
magnet stop buttons.
• Magnet Refrigerator System - MREF
Compressor and cold head unit for cooling the cryo shields of
the magnets.
• Advanced Shim
An optional electrical shim unit for localized shimming of
imaging volumes.
• Magnet Power Supply - MPS
A mobile power supply for energizing (ramping up) and de-
energizing (ramping down) the magnet. The MPS, including
the ramp cables and accessories, is a service tool and not
part of the system delivery.

245
Magnet System - Introduction
 9
246

Figure 175 Magnet System Overview

System
RF-Room
Magnet System Diagram

RCA Alarm Box

Compressor
W201 X12 W200 X3
Shim Power
Supply

Magnet OR24,
OR70
X1

CCA
X10 X8
MSUP CAN
X2 X2
X1 X1
W206

D15-1
Mag ID
X4
* W205 W204 Remote
Alarm

CAN
CAN

X1 X3 X4

MSUP +15V,
~ Power Switch
Magnet ~ PS

Power X5 X6
Mag ID
Supply LPD
F24 F2
X1 X102
PWR
3
F5 F4 Mains
X6 RS 232

Host Port 6
OR24/OR70 Magnets 9.2
Specifications 9.2.1

OR41
OR 24 OR70 OR42 OR35 OR64
Overview 9.21

Harmony Symphony Impact Vision Trio

The OR24 and OR70 are high-field actively shielded super- Field strength 0.95 T 1.494 T 0.95 T 1.50 T 2.895 T
conductive magnets designed for the generation of a high 0.5mT fringe Z 3.9 m Z 4.0 m Z 3.9 m Z 4.7m Z 6.0m
homogeneous magnetic field, B0 . The mechanical outer design, field distance X,Y 2.3 m X,Y 2.5 m X,Y 2.3 m X,Y 2.6 m X,Y 3.9m
venting system and the electrical connections and interfaces are Max. field 37 kHz 55 kHz 37 kHz 55kHz 108kHz
identical for both magnets. These magnets have gone through decay /Year /Year /Year /Year /Year
several revisions and improvements. The documentation will focus Magnet weight
on the latest version. (100% He, no 3350 kg 3900 kg 5000 kg 8650 kg 9970 kg
coils or table)
The magnets employ active shield coils to reduce the fringe fields Magnet length 1.6 m 1.89 m 2.284 m 2.15 m
The magnet primary and active shield coils are sealed into a
Magnet height
welded stain-less steel vessel and filled with liquid helium. This 2.33 m 2.37 m 2.508 m 2.53 m
(with turret)
vessel, called a cryostat, magnet or helium vessel, is assembled Magnet outer
into an outer stainless steel shell which is placed under vacuum to 1.97 m 1.99 m 2.15 m 2.15 m
diameter
eliminate convected heat from entering the magnet vessel as a Magnet bore 0.9 m same 0.905 m 0.92 m
means to reduce helium boil-off. Between the outer shell and the Imaging 500mm
magnet vessel are two aluminium radiation shields whose purpose same same same same
Volume DSV
is to reduce the influx of radiated energies which would cause an Ramping time
increased helium boil-off. As additional measures to reduce helium to nominal 30 min 45 min 30 min 40 min 120 min
boil-off, the magnet is suspended within its shell by fiberglass field
suspension elements as a means to reduce the influx of convected Typical Current 380A 585A 355A 690A 487A
energies. max. Voltage
during 9.9 V same same same
Cryogenic and electrical access to the is provided by an integrated ramping
turret. <=5ppm/ <=5ppm/ <=5ppm/
Stabilization <=5ppm/hr after 10
The radiation shields are cooled by a two stage Gifford-McMahon hr after hr after hr after
after ramping min
10 min 20 min 15 min
refrigerator (see also Refrigerator System) to buffer the outer
100% Helium 1320 l /
t e m p e ra t u r e s o f ~ 3 0 0 K f ro m t h e i n t e r n a l m a g ne t ve s s e l 1806 l 1710 l 1630 l 1319 l
level 1233 l
temperature of 4K (liquid) to 6K (gas).
30% Helium
380 l /
The Magnet consists of two main components: level (min 454 l 436 l
317 l
300 l 715 l
level)
• Electrical Circuits - coil windings, temp sensors, LHe sensor
maximum He not not
• Venting System - bleed and bypass valves, and plumbing boil off
0.075 l /h
specified
0.10 l/h
specified
for the boil-off and quench gasses
typical He boil not
0.050 l /h 0.1 l /h 0.10 l/h
off specified

247
Magnet System - OR24/OR70 Magnets
 9
248

Figure 176 Magnet Supervision Block Diagram

Coolant MPS Main

Refrigerator
System Magnet OR24/70 Diagram

Helium Compressor
Overview Venting
System
Super Conductive
Switch
8 Bar 20 Bar
Cold
Head Fiberglass
Supports Quench Protecting System
Displacer
Unisock

External EIS Quench

EIS Quench Interference Switch
Quench Shield
Switch
Protecting
System

Primary windng
50cm
AS windng Imaging primary coils
Volume
Coil former
90 cm
2,3m
active shield coils
Vacuum vessel bore
b tube

OVC - outer vacuum

vacu vessel

80K cryoshield
20K cryoshield

Helium vessel Super Conductive

(Cryostat) Terminal
Board Switch
Quench
Heaters

160 cm
Venting System 9.2
Component Description
Service turret The service turret is the interface into the He vessel
for cryo and gas transfer as well as for all electrical
Hazards and Risks 9.2.21

connections
Given the extreme temperatures and the phenomenal liquid-to-gas Cold Head The cold head is a part of the refrigerator system,
expansion ratio of liquid helium, it should almost go without saying keeping the He boil off at a low level
that the hazards which exist with a vessel containing up to 1600 He syphon The vacuum pipe is a part of the He filling device
liters of liquid helium are not exactly small. The main dangers Ramp connectors The quench valve and overpressure valve is
confronting both man and machine are frostbite, asphyxiation and connected there to allow safe venting of boiled-off He
gas to quench pipe
explosion of the magnet due to an over-pressure situation (ice-
blocked magnet vessel). Quench pipe Piping system for directing boil-off and quench gasses
to the outside of the building
With these dangers vividly before our minds-eye we want to spend Quench valve Valve that opens in case of a quench to release the
some time here to discuss the components of the magnet venting large amount of boiled-off LHe safely into
system which provides features for both safety and serviceability. atmosphere. It contains a spring loaded valve that
opens at a pressure of 15 psi. In addition a graphite
bursting disc will break if a pressure of 20 psi is
WARNING This information is provided for general informational exceeded.
purposes only. Work on the magnet should not be Overpressure valve The overpressure non return valve keeps the magnet
performed by inexperienced personnel. He-pressure at 2/3 psi
Depressurization Opens a connection from the He vessel into the
(Bypass) valve quench pipe to depressurize the vessel in case of
service actions
Introduction 9.2.2
Pressure gauge Indicates the pressure inside the He vessel
The components of the venting system provide these functions: Current lead Used for cooling the current lead during ramping (will
• Allow an unimpeded exiting of the normal helium boil-off cooling pipe be installed only during ramping)
gasses or quench gasses developed in the magnet safely out
to atmosphere.
• Prevent air from entering the magnet - ingression of air will
cause an ice blockage which could lead to a total blockage of
the magnet and eventually bring the magnet to explode.
• Provide a service entry point into the magnet.
• Provide indication of pressure within the magnet.

249
Magnet System - OR24/OR70 Magnets
 9
250

Figure 177 Magnet Venting System OR24, OR70

OR70 Magnet Quench Burst

2 3

Lhe fill vent line

Back

Venting System
4
1

Valve disk O-ring 5

Lhe fill line

psi

po/ Ship kit

Vent
line

Electrical connections
HDCL tube
0.5psi
Lhe fill Lhe fill tube
vent line
Vacuum chamber
Neck tube
Depressurisation 80K shield
0.5 psi (bypass) valve 20K shield
valve cryostat
Lhe fill
Depressurisation
vent line light blue color signifies pressurized helium
(bypass) valve
back side view

Lhe fill HDCL port

vent line

Electrical
connections

Quench
Valve
B A
C

Lhe fill line

Lhe fill line Ceiling view

service side view
Magnet Supervision The MSUP includes the following features:
• Emergency run down unit (ERDU)
9.3

• Switch and quench heater supervision

The Magnet Supervision MSUP is responsible for supervising
• Helium level metering
various magnet vital statistics and providing an emergency run
down function. The MSUP is designed for use with both the OR24
• Shield temperature monitoring (Cold Head efficiency)
and OR70 magnets as well as with the older OR41/OR42 and OR35
• Cabinet temperature monitoring
magnets. • Screen coil reset
• Error / Status reporting
Figure 178 MSUP

Main Block
Diagram Diagram

D3 D2 D1 D4
Diagram Diagram Diagram Diagram

rear view 24V battery MSUP PS MSUP Backplane

251
Magnet System - Magnet Supervision
 9
252

Figure 179 Magnet Supervision Block Diagram

Exam
Parts Main
Magnet Room
EIS Fault EIS On Location Diagram
A Batt Bad Batt Ok
X2 X2
HE HE Level Batt Rly Batt Supp MSUP Block
Probe Batt Test Load On
D2 Batt, He,
Diagram
B EIS Control
Screen Reset +5V X3
EIS +15V MSUP
-15V PS
QH1 +40V
Heater Supply
QH2 SH MPS SH
SWH Heater Return QH1 QH2
X7
Butt short Butt Missing
Tell Tale
C 24 V
MAG ID
Resistor D3 ERDU
Carbon
Resistors

Shield Temp. CAN Bus

80 K GPA
Socket CAN Bus
X4 RCA
ERDU Remote Alarm
Button CAN X8
Module
DC Supplies Shim
X6 X1 +5V +15V
Alarm -15V +40V X10 PS
MPS SH_On
D4
Box ETL Sample Unit
ERDU Button X1 F Probe OC Test Processor Shim Signals
F Alarm F Warn
LEDs He Alarm He Warn
He ERDU
Acknowledge
EIS Fridge X5
CCA_Temp ϑ CCA
System Power On/Off/Stby Temp
Acknowledge
CCA Sensor
Man Sample
LPD Roof
X4 Display Temp X6
K4,5,9 GPA_Temp ϑ GPA
MsgSys_ON Temp
K1-1 D1 Monitor Sensor
CCS_ON
K13 MSUP Backplane
D1 Monitor 9.31
The HE_ALARM LED is turned on to indicate that the minimum level
(<30% LHe-level) is reached. The alarm box Helium alarm and
The D1 provides the following functions: buzzer are also activated.
• error / status logic - error and status message latching and
LED indicators, numeric display (for He level), signal level
conversion (analog to TTL) ERDU Test Load Connected 9.3.12

• magnet shield temperature monitoring Connecting the ERDU lest load (ETL) activates the buzzer and lights
• voltage monitoring the ERDU TEST LED. This serves as a reminder to the CSE not to
• cabinet temperature sensor interface forget to remove the test load, since the ETL disables the ERDU
buttons making an emergency quench impossible.

Error & Status Logic

Voltage Monitoring
9.3.1

9.3.13

The error/status signal outputs of the monitoring circuits on the D2

and D3 boards have analog voltage levels and need to be
converted to TTL levels before being sent to the D4 Processor. Error
signals are latched, warning and status signals are indicating only
with LEDs and messages to the customer. Latched errors set off an
audible alarm on the Alarm Box via the Buzz signal. The audible
The +5 V, +15 V, –15 V and +40V voltages are continuously
monitored. If any of these voltages drop too low the PWR_FAIL or
40V_FAIL signal will inform the D4 Processor.
LEDs 9.3.14

alarm can be silenced with the Acknowledge button on the Alarm

Box and with S1 on the D1 board. S1 additionally resets the error LED Description
latch. Helium level alarm - helium level has dropped below 30%
He
Remote Alarm 9.31.1 ERDU an error with either the 24V battery, ERDU buttons or heaters

An error also activates relay K1 connected to Plug X4 on CCA Roof EIS EIS circuit or probe fault
is driven together with the buzzer activating an external alarm. magnet shield temperature above 80 K. Either Cold Head is not
FRIDGE running or has become too old
Since relay contacts are used galvanic separation is provided from
any external connection.

Switch Heater Error Masking 9.31.12

Buttons 9.3.15

When ramping the magnet the HTR_OK error must be disabled. It Button Function
is masked out with the SH_I_On signal. to acknowledge He, EIS and ERDU errors. Turns off the
Acknowledge corresponding LEDs
Helium Level Display 9.31.13
initiates a helium level and shield temperature
Manual Sample measurement and an EIS reset
The two digit display on the D1 is for display of the helium level.
The value is driven by the D4 Processor. LEDs: there are two LEDs. Display Temp for displaying the cabinet temperature
The HE-WARN LED is turned on when the He-level is below the
warning level. The level is set under SESO, Magnet and Cooling.

253
Magnet System - Magnet Supervision
 9
254

Figure 180 D1 Monitor Block Diagram

D2
D1 Monitor Parts
Location
Main
Diagram

SH_I_On Msg_HTR_OK
HTR_OK &
Batt_Status MagStopOK
³1
D3

D4 Processor
SWIT_OK 1 Msg_SWIT_OK
EIS_Error Msg_EIS_OK
2
MSG_ALR_OK
Batt_Tst_On ³1
He_Alarm He_Alarm He_Alarm_Out

Fridge_Alarm F Alarm 3
D4 Processor

4 X4
N/C
He_Warn Com
He Warn
Fridge_Warn N/O
F Warn
Sample_On
³1

CCA Roof
Sample
He_Disp_En S1 +15V
R

Alarm Box
Mod_Data0-7
Acknowledge ERDU Remote Alarm
1 S
EIS

Latch
Acknowledge 2 1D Buzz
He ³1
3 R
Fridge
Error / Status Logic 4
MsgSys_On
LPD

Msg_SysOn
Air_Con_On CCS_On

LPD
Alarm
Box

ERDU Test
X2
ERDU_Test
ERDU Test Load Reminder OSC +15V
BUZZER
ETL

Roof
CCA

Man_Sample
Shield Temp Monitor Manual Sample
Tmp_Disp
Display Temp

D4 Processor
CCA Temp
Sensor
MSUP_Sel1,2
Cabinet Temp
GPA Temp 80K shield
Sensor Interface MSUP_Mon

MUX
Sensor CCA Temp
GPA Temp
+5V
Pwr Sup

V Mon

+15V
-15V Pwr_Fail
+40V 40V_Fail
Shield Temperature Measurement. 9.3.16 Figure 181 Shield Temp Monitor
The function of the refrigerator system is indirectly monitored via
the shield temperature of the magnet. If the refrigerator fails or Back
becomes inefficient (Cold Head wears out) the shield will heat up. D1 Monitor
This condition needs to be recognized for two reasons: firstly,
warm cryo-shields will increase the helium boil-off and, secondly, Shield Temp Monitor
will lead to higher Eddy currents causing poor fat saturation +15V +5V
adversely effecting image quality. and a warning or alarm will be
issued after the next shield test.

D4 Processor
F Probe OC
ref
Fridge_On
Msg_Probe_OC
NOTE In case of a complete refrigerator failure the helium boil-
off rises to 3% or more per day after just 24 hours after
the failure!
MSUP_Sel1,2

D4 Processor
The shield temp measurement is initiated by the D4 Processor with MSUP_Mon

MUX
the Fridge_On signal. When active, +5V is applied to a constant Magnet
current source which runs a current through the temperature Fridge_+,- RV2
sensor diode located on the 80 K Unisock. The diode resistance is
proportional to the temperature. The voltage drop across the diode +5V
80 K Shield Test
is read into the D4 Processor’s ADC and evaluated by software. The Temp
S4 Msg_Frig_Nrm
RV3
measurement takes approximately 10 seconds. Sensor
Test

If the temperature exceeds 75 K the Fridge_Warn signal is

activated turning on an LED on the D1 and the customer will be
informed with a warning message in a pop-up window under
NUMARIS customer.
If the shield temperature is above 80 Kelvin the Fridge_Alarm
signal is activated setting the F. ALARM LED on and causing an
annoying audible alarm.
If the diode is defective or the connection to the diode interrupted,
a probe fault will be generated which turns on the F. PROBE O/C
LED during the sampling period, and also causes a fridge alarm.
There are three additional shield temperature sensor diodes (two of
them mounted on the 20K shield) which can be measured
manually. See the TSG.

255
Magnet System - Magnet Supervision
 9
D2 Battery, He and EIS Control
ERDU Battery Control
A sealed rechargeable 24V battery in the MSUP keeps the magnet
stop (ERDU) in operation in case of line failures. The battery
voltage is checked every 24 hours by the D4 processor via signal
BAT_TST_ON. The voltage is compared to a reference value and
sent back to the processor D4 as BATOK. From this the D4 drives
an OK or fail LED on the D2 and transmits the signal MAGSTOP OK
to the alarm box. If during test the voltage of the battery falls
below 20V the BAT. BAD LED at the D2 board gets activated.
Battery Charging
The battery is trickle charged. The voltage for charging is fixed.
The battery has to be replaced every 3 years during preventive
maintenance.
USTOP and UBATT
In case of Magnet Stop (see D3 ERDU) the regulated 24V voltage
USTOP is used for driving current to the quench heaters. In case of
power failure, the battery will provide the 24V for USTOP.
Screen Reset
This module periodically quenches out any circulating current in the
screen coil of the magnet (by opening it) and it prevents any
current from being induced into the screen coil during ramping the
magnet. The function is activated by:
- EIS_ON. This signal comes from processor D4 once every
24 hours, at a time when the system is not used. The time
point is set under SESO, Magnet and Cooling. The output
is turned on for 15 seconds.
- SH_I_ON from D3 ERDU. The interface to this signal
causes an output to be delivered for as long as the magnet
switch heaters are on, plus approximately 10 minutes
extra for settling.
256
9.32
Connector EIS O/R: You can also permanently open (heat) the
screen coil (for example in order to increase the pressure in the
magnet) by shortening the connector "EIS O/R".
9.3.21
Screen Reset Monitoring
9.3 2. 1
If a false output or no supply when requested is detected, the
message EIS_Error is transmitted to board D1 Monitor.
Helium Level Measurement. 9.3.23
The He level is measured by a superconductive wire located in the
He-tank. During the measurement a constant current is driven
through the wire (He measuring probe), which heats it up. This
9.32.1 makes the wire normally conductive where it is not covered by
liquid helium. The measured resistance of the normally conductive
part of the probe is thus a measure for the He level. The constant
current for the He measuring probe is 250 mA, that can be
adjusted with the Poti RV1. The processor in D4 starts the
9.32.12
measurement in 24 hour intervals with the signal MEASURE_ON.
The voltage drop generated by the constant current in the probe is
measured via a differential amplifier and is transmitted to the
processor D4.
Manual measurement: in addition it is possible to measure with
a DVM connected to X3 (He V, see TSG) and X2 (He I, see TSG)
9.3.2
directly the He level. The measurement has to be started by
pressing the button "Manual Sample" on the D1 Monitor.
Switch Booster Pulse: For some magnets, especially when not
under field, a bigger current for the He measurement is required. If
you activate the switch "Booster Pulse", a current of 500mA will
be driven to the He-probe during the He measurement.
Figure 182 MSUP D2 Block Diagram

Parts Main
D2 Location Diagram
ERDU
Control Battery
K2
Manual
Batt_Tst_Quit
+ Batt Test S
+24V

D4 Processor
Man_Batt_Tst
D3 ERDU

+40V 1D
USTOP +
Regulator R
UBATT
Msg_Tst_ERDU
SH_I_ON F1* Load
X7 On
BATT+
BATOK
Batt
24V Supp Test
Backplane

Batt
Battery Load ref
MSUP

K2 Rly

D1 Monitor
BATT
Out +40V Test
Batt_Tst_On
Batt_Sense Battery In
Charger Batt Batt
Batt_Test_On Bad Ok
Batt_Status
ERDU_Batt_Ok

CCA Roof
Backplane
MSUP
Sample_On
≥1 Magnet
EIS
Fault EIS_Error
=1
EIS_ON X2 X2
EISRET
≥1
K1
D4 Processor

10 min F3
Delay EIS 600mA EISOUT
Override
+15V EIS ON
EIS Control

Measure_On
HE_I-

Set Probe
Booster Pulse Current
X2
Switch
F2* HE_I+
1: 500mA +40V
0: 250mA
X3
HE_U+
HE_ANLG_SIG
HE_U-
Helium Level * = thermal fuse

257
Magnet System - Magnet Supervision
 9
D3 ERDU
ERDU (Magnet Stop)
The ERDU has the capability to quickly run down the main
magnetic field in an emergency. This is done by heating the
superconductor by means of the quench heaters and switch
heaters. The current for these heaters is supplied by the ERDU
when a quench button is activated. When pressed, relay K1
activates and applies voltage to the Quench Heaters (QH1, QH2)
and the Switch Heater (SH). The voltage is supplied by the He, EIS
& Battery D2.
When one of the magnet stop switches is depressed relay K1 is
activated applying 24 VDC from either USTOP or UBatt (supplied by
D2 Control board) to quench heaters 1 and 2 and switch heater 1
via the D81 ERDU Power board. The voltage is normally supplied by
the TEDI board D80 (USTOP_Net). In case of voltage failure the 24
Volt battery supplies the voltage via a de-coupling diode (USTOP).
The heating current flows to ground via diodes/resistors which are
part of the heater monitoring circuit.
Tell Tale Indicator
When K1 energizes (a quench button has been pressed) fuse F4
(63mA) will blow and the Tell Tale LED will light.
Heater Monitoring
Via a protective resistor the voltage UHTR permanently drives a
small current (about 10 mA) through QH1, QH2 and the Switch
heater. The voltage drop is compared to reference values in two
comparators. It is thus possible to detect breaks in the lines to the
heaters or short-circuits. Each heater can activate a LED on board
to indicate a heater fault. The actual alarm signal is summarized
from all messages and transmitted to the D1 Monitor.
258
9.3
Switch Monitoring 9.3. 3
The two ERDU remote buttons driving relay K1 on D3 each have
9.3.31
one resistor. Via this resistor, the relay and a resistor against
ground a permanent current is driven. A voltage drop compared to
reference values in comparators indicates whether both switches
are connected. In case of a fault, a LED will light and a message
SWITOK is transmitted to the monitor board D1.
DIP-Switch SW2 9.3. 4
Allows to connect a third (optional) ERDU button to the MSUP.
• 2 ERDU buttons (standard): SW2A closed, SW2B open
• 3 ERDU buttons (optional): SW2A open, SW2B open
Switch Heater 9.3. 5
The Switch Heater is switched on when the signal +5V_MPS is
energized from the MPS.
ERDU Test Load (ETL) 9.3. 6
The ERDU Test Load is a service tool used to test the monitoring
functions of the MSUP. Push buttons on the test load simulate faults
such as heater load resistance too low or too high. These simulated
faults have to be recognized by the D3 ERDU switch monitoring.
When the ERDU buttons are activated, LEDs on the test load light
9.3.32
up to indicate correct operation.
For a detailed description how to use the ERDU TEST LOAD
see the Safety Related Tests documentation.
Figure 183 D3 ERDU Block Diagram
MSUP PS D2 Control
Parts Main
Alarm Location Diagram

Ustop
UBatt
+15V

+24V
Box X1 X1
SH1

Heater Monitoring
QH1
≥1
QH2

F5*

Comp
>R

<R
Lo

Lo
Hi

Hi
S2.B
S2.A
UBatt

MSUP Backplane
R

R
R

R
MPS SH
100µ

CCA Roof
Remote X2 X2 K2B
SH_Ret
ERDU
buttons
Rp Magnet
+15 UBatt xH_Ret 3
K2 K2A
X6 X1 X2 X2
F1 0.8A SH
MPS

SH_Out
F2 2A QH1_Out QH 1
UQuench
MSUP Backplane
CCA Roof

K1
UBatt F3 2A QH 2
QH1_Out

B
+15V

63mA
Tell

F4
Button Button Tale
Switch Monitoring

missing shorted
Ref
max
HTROK

D1 Control
SWITOK
Comparators ≥1
SH_I_On

Ref
min

* = thermal fuse
D3 ERDU

259
Magnet System - Magnet Supervision
 9
260

D4 Processor 9.34 Figure 184 D4 Processor Block Diagram

Function: Main
The D4 is the communication interface between the magnet D4 Processor Diagram
VERY!
monitoring system and the MMC. The Monitoring functions are:
Parts
• ERDU: battery, heater and buttons Location
• Helium level, Screen reset, cryo-shield temperature, CCA/
GPA air temperature Status

D1 Monitor
In addition, the processor board controls the Advanced Shim.

Status

D2 Control
Control

D1 Monitor
Mod Data
He_Ana_Sig

Digital In
MSUP_Mon

Analog
MUX

Digital Out
+48V
Mod_Mon 2

D2 Control
Control

Shim PS Unit
A

Addr, Data
D

Shim PS Unit
Mains_Fail Mod Data
DC_+5V
Mod_Fail
DC_Inhibit
DC_Sply_Gnd

FW RS232
LW CAN Bus

RCA
Proc
Reset
CAN
CAN Bus
Module

GPA
Cabinet Temp Sensors 9.4

Figure 185 CCA Cabinet Temperature Sensors

Main
Back Diagram

CCA Cabinet

GPA K2209 GPA K2217

261
Magnet System - Cabinet Temp Sensors
 9
262

Figure 186 Alarm Box

Alarm Box 9.5

Block
Diagram
Overview 9.51

The Alarm Box is a user interface for:

• Power switching of the MR-system
• Magnet Supervision Indicators
• ERDU

System Power Switching 9.52

The System On, System Off and System Standby buttons are hard-
wired to relays K4, K5 and K9 in the Power Distributor respectively.
In addition, the Host can also activate the system Standby or On
relays via software under the System / Control / MR Scanner
menu.
Figure 187 Alarm Box Block Diagram

Parts Main
Location Diagram
CCA

Alarm Box

Distributor
X5
LPD

Port 7

Serial
RS232
W026a
+15V
X1
Pwr Sup

+15V +
MSUP

+5V µP
+
Regulator

Host
X3
X1 X1
LEDs
LINE
MsgSys_On CCA
System On
MagStopOk
Magnet Stop
D1 Monitor

MSUP
He_Alarm_Out +15V
Helium Level
Alarm
Acknowledge

D1 Monitor
Buzzer SYSTEM SYSTEM SYSTEM
ON OFF STANDBY ACKNOWLEDGE
X1 X1 X1
+15V
Buzz OSC

Standy
ERDU Button
ERDU_Button System_Off
System_On
D3 ERDU

W206
39k
X4
System Power
Switching

LPD
MSUP W206

263
Magnet System - Alarm Box
 9
264

Refrigerator System 9.6

Figure 188 Compressor Unit Layout

Block
Overview 9.61 Diagram

The cryogenic refrigeration system consists of these components:

Leybold Coolpak 6000
On / OFF /Reset
• Compressor Unit, Display
• Cold Head, Cold Head power
• the flex lines between compressor unit and cold head. Power Switch
The first refrigeration system used in the Harmony/Symphony Status Output
systems was the Coolpak 6000 from LEYBOLD. In 2001 it was Power In
replaced by the APD HC-10. Both are seen in the diagram at the
Gas recharge port
right.
Pressure Guage
As of Jan. 2007 a new pin-plug-in compatible compressor, the F-70
from Sumitomo, has been introduced which can replace both
previous compressor types. The F-70 will eventually replace the Gas In and Outputs
other compressor spares stock within the following years.
The function and operation of all these compressors is practically Cooling Water
the same.

Concept 9.6.1
APD HC-10
Heat is being developed in the cryo shields, mainly caused by Pressure Guage
induced radiation. This heat, if not removed, would lead to an On / OFF /Reset
increased liquid helium boil-off rate. Helium costs, at today’s rate,
around €10 a liter.
Status Output
The Refrigerator System, consisting of the compressor and cold
head, works on exactly the same principle as refrigerator
appliances you find in any home. The compressor provides the high
pressure gas. The cold head provides the expansion chambers to
produce the heat extraction from the cryo-shields to which it is Power In
connected. The cold head has two stages. Both the design and the
materials used within the cold head allow it to reach temperature
of 20K and 80K
Compressor Unit 9.62
• Thermal Switch TSH1: shuts down the compressor, if the
temperature of the helium behind (downstream of) the heat
exchanger exceeds 38° C.
Function 9.6.21
• Thermal Switch TSH2: shuts down the compressor if the
The oil-lubricated compressor compresses the helium gas from compressor-exit helium temperature exceeds 100° C.
approx. 7 bar (Pl) to approx. 21 bar (Ph). This causes the helium to • Thermal switch in compressor capsule.
become very hot. For this reason it is passed through a helium/ • Motor protection switch. It protects the compressor unit
water heat exchanger located immediately downstream from the against excessive main currents.
compressor. The gas temperature is lowered to about the • Fuses for cold head
temperature of the coolant. The major portion of the oil vapor • Fuses for control voltage (internal)
mixed with the helium in the compressor is condensed to droplets • Bypass valve. This will open a shunt between the high- and
within the oil separators and returned to the compressor by means low-pressure helium circuits if the pressure difference
of capillary pipes. exceeds 17 bar.
The helium gas exiting the second oil separator, however, still • Safety valve. This will open the helium circuit to the
contains small quantities of oil vapor. A charcoal-based adsorber atmosphere if the high-pressure segment exceeds 29 bar.
removes the rest of the oil. The adsorber must be replaced every • Microprocessor for checking the phase rotation.
18000 hours (two years) since it will become saturated with oil If the compressor is shutdown due to a failure, the compressor
over time.
must be MANUALLY re-started. Please refer to the delivered OEM
documentation for detailed information on error status and
CAUTION If any oil were to escape the compressor, it would handling.
contaminate the flex lines and also enter the cold Figure 189 Compressor Status Feedback
head. There it would freeze and damage the cold
head. Therefore: REPLACE THE ADSORBER Block
REGULARLY! Diagram
Compressor
Cooler 1
To cool the compressor, its oil is pumped through a heat exchanger. Remote
25 +24V_Compressor 4
Oil circulation is maintained by the pressure difference between low +24V
and high-pressure helium. The temperature of the cooling water
should be 5...25°C at a flow rate of 5...10 l/min. PSL 16 Low Pressure 36

CAN
(24V=error)

Safety Devices 9.6.2

HE1 18 Overtemp Helium 37

The compressor unit has the following safety equipment: (24V=error)

• Pressure switch PSL: shuts down the compressor unit if the

pressure difference between low-pressure helium and
atmospheric pressure drops below 2.0 bar.

265
Magnet System - Refrigerator System
 9
266

Figure 190 COOLPAK 6000 Compressor Unit

RCA
Parts Main
F Location Diagram

CCA
Quik disconnect

PWR
X101
He-Compressor
LPD

W063 Power
TSH1
Module Leybold Coolpack 6000
TSH2
Remote APD HC-10
PSL > 60 C
0

Cold Head Pressure

WTR WTR
Gauge

Heat Relief p > 29 bar

Exchanger Valve

Oil
> 100 0C > 38 0C
Cooler 1

Separators
TSH2 TSH1
Oil
Compr. Adsorber
Ph ~ 21 bar
Heat
Exchanger Bypass Valve

Cold Head
Pl ~ 7 bar ∆p = 17 bar

He Filling
p < 2 bar
PSL

W210

= aeroquip fittings
Advanced Shim 9.7
Figure 191 Shim Power Supply Layout

Block
Introduction 9.71
Diagram

Passive shimming with iron plates reduces low and high order
inhomogeneities caused by magnet tolerances and ferromagnetic
objects in the environment. Objects to be measured (patients as
well as phantoms) may generate local field inhomogeneities that
have to be compensated for applications sensitive to inferior shim
e.g. Spectroscopy, Fatsat, EPI (Echo Planar Imaging), TGSE (Turbo
Gradient Spin Echo).
Correction of the first-order (linear) inhomogeneities is achieved by
applying DC offset currents to the gradient coils. The higher
second-order terms are corrected with a 5-channel shim coil
embedded within the Gradient coil. The currents for these coils is
produced by the Shim Power Supply Unit, which is described here.
The Advanced Shim option is optional for the Harmony and
Symphony systems, standard for the Allegra and Sonata systems.
Inputs 9.7.21

Layout and Function 9.72

The Shim Power Supply Unit (Shim PSU) consists of 5 identical
shim amplifier modules housed in a rack having a common
backplane and a +48V DC power supply both of which are mounted
onto a metal frame which conveniently attaches to the back of the
CCA cabinet. A shim filter box is also part of the option and is
mounted on the RF Filter Panel for feed of the shim currents to the
shim coils.
Power
The +48V DC power supply requires 220V AC provided by the LPD
over circuit breaker F12.
The shim amplifier modules get their +5, +15 and -15 V supplies
from the MSUP over K12 which will be activated as soon as the
230V from the LPD is available.
Shim Control
The communication is passed through the Magnet Supervision via
the CAN bus connection and a hardware inter-face. The 5 demand
currents are loaded via Host - MPCU - Can Bus - D4 Processor in
MSUP - Data Bus into the 5 power modules. The second order field
inhomogeneities have been measured via the tune-up step
Phantom Shim. The compensation currents for the shim coils are
calculated by the host.
The amplifier bus (cable from X9 MSUP to X80 Shim Motherboard,
Shim Signals) comprises:

267
Magnet System - Advanced Shim
 9
268

• 8 bit data bus MOD_DATA0 - MOD_DATA7. The data bus is Protection and Monitoring 9.7.23

used to load the 12 bit channel demand currents to the

amplifiers current DAC and to determine the amplifier control
• ADDSEL line to select the channel writing of demand data and
amplifier operation
• 4 bit control bus with a. MOD_COM used for controlling
amplifier inhibit, fault, polarity conditions, b. DAC_DATA used
for loading DAC current demand, c. MOD_FAIL used to
indicate an amplifier fault, d. H/L BYTE is used for loading
demand current in two halves.
Amplifiers output currents and voltage monitoring is selected onto
the MOD_MON-lines. Typically, for output current an input reading
of 0 - 4.02V corresponds to 0 - 5A. For troubleshooting you can
measure the current by measuring the voltage at QLA outputs on
the shim channel amplifiers.
The power modules require 48V DC for current generation
(generated by a 48V DC Supply, which belongs to the Advanced
Shim) and +5V, +-15V for logics and ADCs. The +5V, +-15V
voltages are generated by the auxiliary power supply in the magnet
monitoring section. The Output currents from the power modules
• The DC supply current is fused at 5A/48V on each of the shim
amplifier boards,
• the amplifier output current is limited by a hardware current
trip adjusted to 5.5A,
• the 48V DC is monitored,
• Main line voltage failures are monitored by signal
MAINS_FAIL,
• The max power is 100W/channel and hence 500W in total for
all channels. If that is exceeded, the 48V DC Supply will be
shut down via signal DC_Inhibit. With 5A demand, the coil +
filter + cable resistance must stay below 4 ohms in total (i.e.
I**2*R must be <100W),
• Via the MOD_MON-lines currents and voltages are monitored.
Output load disconnection or incorrect voltage reading by
MSUP D4 processor board will cause faults such as: Advanced
Shim error: Amplifier fault of shim channel X (over voltage),
LEDs 9.7.24

run via (connector X3 at CCA Roof)-(connector X12 at SHIM Filter)-

(connector X1 at magnet rear side) to the shim coils. LED Description
AMP ON The green LED shows a digital signal sent from the
The functionality of the Advanced shim is tested during tune-up processor to the module. This signal switches on the
procedure "Phantom Shim". power electronics that regulates the output current. To
turn on the outputs, first the 48V PSU is enabled, then the
processor waits a short time for 48V to rise, then modules
Technical Specification 9.7.2
are turned ON.
FAULT amplifier fault
Specification Value
Main Input Voltage 230VAC+-10%
Frequency 50/60 Hz +-1Hz
Power Consumption <800W
Max current 5A per channel
Load resistance 1 to 6 Ohms
Inductance 0 to 30mH
Capacitance 100nF
Figure 192 Advanced SHIM

CCA Roof
Parts Main
Location Diagram
X9
Mod Data

Mod_Fail
D4 Processor

Shim Power Supply

X80 Exam Room
X8
+48VSDC X90
+48V Shim
Mains_Fail X70 X3 X12
Output Shim
DC Inhibit
W200 Filter

A(2,0) A(2,1) B(2,1) A(2,2) B(2,2) W201

+5V
0V
+15V
MSUP PS

+5V
-15V Shim
+15V Coils
-15V
FAULT FAULT FAULT FAULT FAULT
K12 AMP ON AMP ON AMP ON AMP ON AMP ON
MSUP
Backplane X1

+48V
SPS Backplane
X50 X60

F12 48V DC
LPD

10A X700
SUPPLY
N

269
Magnet System - Advanced Shim
 9
270

Magnet Power Supply 3600 9.8

Figure 193 MPS 3600)

Overview
Block
9.81 Diagram

The Magnet Power Supply Unit (MPS 3600) is an air-cooled,

moveable service tool to energize the superconductive magnet coil
to the required nominal field strength of 1.495T. 6
The MPS functions are controlled by a serial connection to the host
computer or to a Service-PC. Additional cable connections have to
be established for connecting the MPS control section to the
Magnet Supervision for switch heater control, to the Mains Box for
line power and the connections to the magnet.

The MPS consists of:

• MPS 3600
• Line power connection cable (X1 MPS to X102 CCA roof)
• Ramp cables (contained in separate crate)
• RS 232 connection cable (X6 MPS to host serial port #6)
• CCA control cable (X5 to X6 CCA roof)
• Operation Manual (under lid)
5

2
1
Pos. 1 CB1, Mains circuit breaker
Pos. 2 X1, MPS power connection
Pos. 3 Fuses (F1 - F4) 4 3
Pos. 4 X6, RS 232 connection to Host or Service PC
Pos. 5 X5 Control cable to MSUP
Pos. 6 Ramp cables
Figure 194 MPS 3600 Block Diagram

Parts Main
Location Diagram

Voltage
Mains Box

X102 Sense X3
400 VAC X1

Rectifier Run Down

CB1 Line Filter Load
and Inverter
F3

Magnet
F4 Short
Contactor
Mosfet
Switch
Transformer X4

F1
F2
110 VAC
Voltage
Monitor

Current actual
FAN

DC
X2 Power Supply

to MSUP for

CCA Roof
CAN X5 SH control X6

X6
Host or RS 232
Control Circuit
Laptop Current
Monitor

MPS 3600

271
Magnet System - Magnet Power Supply 3600
 9
Function
Power Supplies
The 400 VAC 50/60 Hz 3-phase line voltage is fed via circuit
breaker CB1, which routes the input supply to a line filter. Two
outputs are taken from there, one via fuses F3 and F4 to a
transformer that reduces the voltage to 110 VAC, the second one
to the rectifier and inverter.
The power for the four cooling fans as well as for MPS control
circuits is protected by fuse F1 and F2. That 110 VAC voltage is
used as energizing voltage for the main output shorting-contactor
and is also routed to connector X2 at the MPS front. It can be used
to connect a low power-consumption device like a Service-PC.
Ramping Power Supply
The 3-phase input is rectified and fed to a full bridge inverter
running at about 20 kHz. The modulated square wave is fed to a 20
to 1 step down transformer that supplies a schottky rectifier and a
LC filter. The MPS output current (max. 725 A @ 12 V) is fed via a
Run Down Load (RDL) to the MPS output connector X3 and X4. The
RDL can be shorted by a MOSFET switch.
Actual output current is measured by a current transducer that is
connected to the Control Circuit. For service, it can be directly
measured at connectors X11 and X12.
Run Down Load, MOSFET switch
To run down the magnet, the MPS is equipped with a Run Down
Load (RDL) which consists of heavy-duty diodes embedded in heat
sinks and cooled by fans.
To activate the RDL, the MPS opens a MOSFET switch that is
connected in parallel. The energy that is stored in the magnet coil
is converted into heat inside the RDL and the magnet current is
ramped down. During ramping up, the MOSFET switch is closed to
272
9.82
directly feed the MPS current to the magnet coil.
9.8.21
Shorting Contactor 9.8.24
The MPS is equipped with a shorting contactor that is normally
closed. During different ramp phases, the control circuit will open
the contactor if required.
The shorting contactor is opened if:
• The MPS ramps up the magnet
• The MPS ramps down the magnet
The shorting contactor is closed if:
• The MPS is switched off
• During ramping, a line power failure occurs
(Magnet current will safely run down via the ramp cables and
9.8.2
closed shorting contactor)
• MPS performs internal 700 A self-test prior to ramping
• Magnet is captured at beginning of the ramping-down cycle
Control Circuit 9.8.25
The control circuit monitors and controls the operation of the MPS.
Ramping commands are initiated by the operator using the host or
a Service-PC, to be connected to the MPS. The algorithm for
ramping is stored in a table at the control circuit. Required magnet
specific data are loaded from the Magnet Supervision (MSUP) via
CAN-bus connection (X7). During ramping, the MPS activates the
9.8.23 switch heater by sending CAN commands to the MSUP.
If the CAN-bus is disconnected, the MPS is inhibited and the fault
displayed at the host or Service-PC.
Current and Voltage Monitoring 9.8.26
The MPS output current and voltage is monitored by the Control
Circuit. It is reported via RS 232 to the host or Service-PC.
Additionally, a DVM can be connected to the voltage monitor
terminals (X9, X10) or current monitor terminals (X11, X12) on the Welcome Screen 9.8 2.73

MPS connector panel.

Figure 195 MPS 3600 Connector / Indicator Panel)z
A welcome screen is displayed, 3 digits representing the operator
(i.e. your initials) have to be entered and accepted with <ENTER>.
In a next step, the magnet serial number has to be entered.
The MPS will now retrieve the magnet type, last set current, He-
level, date and time from the MSUP. Once the data has been
obtained, the MPSU will initiate a self test to ensure its correct
functioning.
Figure 196 MPS 3600 Logon)

Next

Connector / Indicator Panel

Service Routines 9.8.27

Connecting Host or Service-PC 9.82.71

To start ramping, the host or Service-PC has to be connected to X6

of the MPS (RS 232 interface). To establish communication, Hyper
Terminal software is required and must be set-up.

Hyper Terminal Setup 9.82.72

Hyper Terminal has to be configured and started before the MPS is

switched on.
• Select appropriate Com Port (port 8 if cable is connected to Self Test 9.8 2.74

Serial Distributor port 6) The MPS is run up to 700 A with shorting contactor closed, the
• Baud rate = 9600 voltage drop across the MOSFET switch is monitored. When the
• Data bits = 8 current reaches its peak, the voltage is recorded (V1). Next, the
• Parity = none MOSFET switch is opened and the current runs through the Run
• Stop bits = 1 Down Load. Before the current starts to decay, the voltage drop
• Flow Control = None. across the RDL is recorded at Peak Current (V2).
• File, properties, settings tab, Emulation = VT100

273
Magnet System - Magnet Power Supply 3600
 9
274

Operational Screen 9.82.75 If a fault occurs, an error screen is displayed automatically. To

On completion of the self test the Operational Screen is displayed: access it manually, a command can be entered (see table above).
The Magnet Peak Current is recorded on this screen, so if the
magnet should quench, the current level at that time is stored.
Figure 197 Operational Screen)

Run to Field 9.8.28

Prerequisites for Ramp to Field: 9.8 2.81

• The MPS must be connected properly.

Next
• Wait at least 1 hour after completing any previous ramp, or
aborted ramp (including cable tests).
• Following a helium fill, wait at least 2 hours before ramping.
• Helium level to be >40%.
MPS system Test: 9.8 2.82

• Perform Helium sample

• Check if magnet has not been filled with LHe the last 2 hours
• Check if current leads are not opened or shorted
• Check if FCL temperature > 28 K
• Determine actual FCL temperature
• Switch on pressure heater, wait one minute
• Check if magnet pressure < 17 psiA
• Check if magnet pressure increases
• Check if FCL temperature has dropped by 10 K
Ramping Commands 9.82.76
(time-out 30 min.)
• Vent Delay, wait 5 min.
Command Key combination • Turn off pressure heater
To set magnet current: S <space> 513.04 <Return> (Example) • Turn on EIS heater
To Run To Field: F <Return>
Cable Test: 9.8 2.83

To Run To Zero: Z <Return>

• Inverter and MOSFET switch is turned on, shorting contactor
To abort current action: A <Return>
open
To refresh the screen: O <Return>
• The current in the cables is ramped to 100 A
To go to the Error G <Return> Ramping parameters
Screen:
• MPS checks if actual current is 100 A +/- 1 A and measures
voltage drop across the FCL
Errors 9.82.7
• Current in the cables is ramped down to 0 A
 • Calculation of Turret Lead and Cable lead resistance • Switch heater is turned on
• Magnet capture is performed
Ramp to Field: 9.82.84

• Shorting contactor is opened

• Switch heater is turned on • MPS demand current is set to 0 A, wait 10 seconds
• Check if magnet is running down already. If so, the magnet is • Switch heater is turned off
captured and ramped down safely
• When magnet voltage has fallen to < 1 V switch heater is
• Shorting contactor is opened turned on again
• MPS demand current is set to entered current value + 3 A • Check if actual current is 0 A, turn off switch heater, wait 2
• As soon as 10 A are reached, the switch heater is switched off minutes
• 10 A before reaching nominal current, switch heater is • Turn EIS heater off
switched on again
• Check if entered current value + 3A is reached (over fielding) Ready!
• Wait 15 seconds
• Ramp to entered current value Bumping the Magnet 9.8.210

• Turn off switch heater, wait 2 minutes Bumping the magnet involves making a small change to the
• Ramp down cables to 0 A, wait 2 minutes magnetic field strength either up or down. The procedure is
• Turn EIS off essentially the same as ramping the Magnet.
Ready!
Prerequisites for bumping: 9.8 2.10.1

• The MPS and cables must be connected properly

Run to Zero 9.8.29
• Wait at least 1 hour after completing any previous ramp, or
aborted ramp (including cable tests).
Prerequisites for ramp to zero: 9.82.91
• Following a helium fill, wait at least 2 hours before ramping.
• The MPS and cables must be connected properly • Helium level to be >40%.
• Wait at least 30 minutes after completing any previous ramp
or aborted ramp (including cable tests).
• After helium fill at field, wait at least 2 hours before ramping.
• Helium level to be >40%. Saving MPS logfile 9.8.21

MPS checks prior to ramping down: 9.82.92

A logfile of the last ramp is recorded by the MPS and has to be
downloaded and sent to the factory at the following e-Mail address:
Same as checks prior to ramping up! magnet.hsc.med@siemens.com
Cable test: 9.82.93 The following commands have to be entered:
Same as for ramping up!
• G <Return>, to enter the Error screen
From Hyperterminal menu select:
Ramp to zero: 9.82.94
• Transfer

275
Magnet System - Magnet Power Supply 3600
 9
276

• Capture Text
• Browse
• Select the target directory and filename: e.g. 3600 Ramp
Data\OR105_SerNr_RampUp_Date_Time
• Start
• L <Return> (a data screen will appear)
From Hyperterminal menu select:
• Transfer
• Capture Text
• Stop
To return to the Operational Screen press <Return>.
Figure 198 MPS Ramp Data Dump)

Main
Diagram
 Section

10 Cooling System 10

Introduction 10.1

The Harmony and Symphony/Sonata MR systems employ a number of high-power components that require cooling to maintain a constant
operating temperature and stable performance. The Cooling System is responsible for providing temperature-stabilized cool water to these
components and to provide monitoring of the cooling water flows and temperature.

The Cooling System consists of two separate water circuits, a Secondary 10.1 0. 2

primary and a secondary.

The secondary water circuit of the Water Cooler is used for the
Primary Cool Water following components:
• Electronics Suite :
10.10.01

An external water chiller or customer in-house chilled water RFPA

provides primary cooling water of 9°C used to cool the following RFCI power supply
components: GPA (resonant converter and power stages)
• RCA Water Cooler (secondary cooling for system • Gradient Coil (alternatively MPS)
components)
• RF Body Coil
• RCA Coolpak (Cold head compressor) • RF Dummy load (TAS)
• Water-CCS Option
The RCA Water Cooler contains a heat exchanger which uses the
primary chilled water to maintain a secondary cooling water circuit Double Cooler 10.1 0. 3

at 20°C.
The RCA Coolpak (cold head compressor) uses the primary water
for cooling the compressor.
The water-CCS option uses primary water for internal climatic
cooling of the CCA and GPA cabinet components. This option
The RCA cabinet is designed to accept a second chiller unit
necessary for Sonata, Trio and Allegra. The distribution of the
secondary water can be seen in the next 3 block diagrams.
Flow Regulation
10.1 0. 4

eliminates the need for expensive and space-requirement-intensive The flow reducers in the CCA and GPA cabinets assure that the
external air conditioners and thus benefitting the customers proper amount of water flow requirements for the components in
pocketbook. each cabinet are maintained.

277
Magnet System - Introduction
 10
278

Figure 199 Cooling System Overview - Single Chiller

Parts System
Location Diagram
Cooling System
Gradient
Block Diagram Coil
Harmony / Symphony Chiller
TAS
Flow
Filter
BC-47 Temp Panel Transfer
(Option)
Station

1 1/2“
D9 PTAB
(Option)

CAN bus
1f AC
Sight Strainer 3f AC
Glass
R* Mains R* X100 X101
Box
R = flow reducer
R* = 1rst production
R GPA CCA R
run cabinets
Power Stages
R = Schroff cabinets
Water CCS

RFCI P.S. Water

Cooler 1

RFPA

MREF
Power Stage (Compr.)
Power Supply RCA
Figure 200 Cooling System Overview - Double Chiller

Parts System
Location Diagram
Cooling System
Gradient
Block Diagram Coil
Sonata/Trio/Allegra Chiller
TAS
Flow
Filter
BC-47 Temp Panel Transfer
(Option)
Station

1 1/2“
D9 PTAB
(Option)

CAN bus

1f AC
Sight Strainer 3f AC

X101
Glass
R* Mains R* X100
Box
R = flow reducer
R* = 1rst production
R GPA CCA R
run cabinets
Power Stages
R = Schroff cabinets
Water CCS

RFCI P.S. Water Water

Cooler 1 Cooler 2

RFPA

MREF
Power Stage (Compr.)
Power Supply RCA

279
Magnet System - Introduction
 10
280

Water Cooler 10.2

Figure 201 Water Cooler Connections

Block
Overview 10.21
Diagram
Pressure
The RCA water cooler contains a water/water heat exchanger which switches
uses the primary chilled water to maintain the secondary cooling Cold Head
water circuit at 20°C. Secondary lines
Return CH Power
The water/water plate heat exchanger in the RCA is responsible for
the pressure difference of max. 2.5 bar of forward and backward Power In
running primary water. Secondary
Supply
Primary tap
The secondary water circuit of the Water Cooler is used on the for CCS
following components organized in two circuits:
• Electronics Suite: Primary
- RFPA,
Single Cooler
- RFCI power supply,
- GPA.
• Coil:
- Gradient Coil, Block
Diagram
- RF Body Coil,
- RF Dummy load (TAS).
GC Supply

Double Cooler
Control Electronics
Monitoring is done by the Cooler Control Electronics. The controller
is an IAC (intelligent controller) manufactured by Satchwell and is
linked to a CAN-Module. According to its function the processor in
the CAN-Module receives status and error information from the
Satchwell controller and will transfer this information from the RCA
to the MMC. It also receives control data from the MMC, for
example for switching ON the secondary water circuit via the IAC
or switching it OFF during standby mode.
The IAC has the following INPUTS and OUTPUTS:
Analog INPUTS:
- Electronic Suite Waterflow,
- Gradient Coil Waterflow,
- Primary Waterflow,
- Water Overpressure Electronic Suite,
- Water Overpressure Gradient Coil.
The waterflow is monitored electrically by measuring the magnetic
variation in a coil caused by the rotation of a piece made of
ferromagnetic material placed in the water flow. This means, the
flow measurement will also work in polluted water.
Resistive INPUTS:
- Primary water temperature,
- Secondary water temperature.
Digital INPUTS:
- Pump Fault (for detection of overcurrent),
- 3 INPUTS indicating the waterlevel (FULL, LOW, VERY
LOW) of the seconday water reservoir (refilling of the
secondary water is necessary, when the yellow light glows
constantly)
- Low pressure and Over temperature signals from the
coldhead (these are status lines only),
10.2
- Local control. This is a manual switch labeled AUTO/MAN.
Its normal position for remote control of the pump is
AUTO. It is set to MAN during startup, when filling the
secondary water reservoir the first time.
Analog OUTPUTS:
- Actuator. The temperature of the secondary water is
controlled and adjusted to the "temperature set point"
(normally 20 degree, set under SESO, Magnet and
Cooling, Initialization) by changing the primary waterflow.
The primary waterflow rate through the Heat exchanger is
controlled by the IAC via motor setting of the primary
bypass valve. This is necessary in order to protect the
pump of the primary water chiller, when the system is
switched off. The flowrate of the primary water will be
dependent on the primary water temperature.
The IAC will switch off the pump for the secondary water circuit, if:
• system switched to "standby",
• water level in secondary water tank too low,
• water pressure too high,
• pump overload.
In the case the pump was switched off, due to overpressure for
example, you can switch it on again (after check of water
connections and hoses) by setting the system to "standby" and
then "ON" again.
Setting the flow rates of the secondary water through Electronic
Suite and Gradient coil is done by manually adjusting the valves
and monitoring the flow rates in the SESO under "MAGNET &
COOLING", "STATUS". This procedure as well as the setting of the
temperature measurement points is described in the "Technical
Documents", Register Start-up.
281
Magnet System - Water Cooler
 10
282

Figure 202 RCA Water Cooler Overview

Compressor RCA Wiring Main

Secondary Water Cooler Block Diagram Diagram

Show
CCA/GPA Grad. coil Primary Primary in Grad coil CCA/GPA Status
X100 X101
supply supply out return return
RCA roof
Pressure Pressure
Switch Switch CAN

SK2 SK1 SK3

0.4 mm
Strainer 400/480V 230V
F F F 3~
L Breather/
Filler K1
Temp
T1
Sensor
Temp

CAN Bus
T2
Low press. Sensor Water p
to CAN M Primary
Over temp Bypass Tank Pump
fault
Level
indicator
1/4“ Drain
Valves Heat Exchanger 0.25mm
Strainer

P.S.

CAN
Primary Coil Suite System Primary Secondary Full Low Oh, oh Level Primary Pump Pump Module

24 VAC
flow flow flow Overpressuretemp temp level level level Full bypass fault enable
F F F P T1 T2 L L L M p K1

Satchwell Controller LAN from Cooler 2

Figure 203 RCA Power Wiring

RCA Cabinet Wiring Diagram Back

X100 F1
X6 10A Water K1
Cooler 1
W063 K2
SK2

SK1
LPD

X101
SK3
W062

F2
10A
Water
Cooler 2
SK3
SK1

F1

Option for Sonata,Trio

K1 and Allegra Systems

K2 F3
20A
Compressor
X6 F2
X7
K1 K2

K1 = low pressure
K2 = He gas over-temperature

F3

T1

283
Magnet System - Water Cooler
 10
284

Cooler Status 10.2.21

The Cooling System status masks (viewed under SeSo > Magnet &
Cooling) are shown below:

Figure 204 Cooler Status Masks

Cabinet Cooling - CCS 10.3
sensors located at the top of the GPA abinet and at the backside of
the MSUP electronics rack in the CCA cabinet. The MSUP is also
responsible for the monitoring.
Overview 10.31 Figure 205 CCS Versions
The CCS incorporates two functional blocks:
• CCA/GPA cabinet climatisation CCS Water CCS Air Block
Diagram
• Monitoring

Cabinet Climatisation 10.32

CCS Water version 10.32.01

The blowers located in the Control-Blower Module draws in warmed

air from the GPA and CCA cabinets and forces it over a heat
exchanger which is supplied by the 6-12°C primary cooling water.
The cooled air enters the CCA and GPA cabinets through cut-outs
located cut out at the bottom of these cabinets. The CCA has an
additional cut-out at its mid-section. Air circulates over the CCA
and GPA electronics and drawn into the blowers again through cut-
outs at the top of the CCS completing the air circulation path.

CCS Air version 10.32.02

If the technical room is air conditioned, the CCS Air version can be
used. Cooled air is taken in from ventilation holes in the CCA
cabinet door and circulated through the CCA and GPA cabinets in
the same way as mentioned above.

Regulation 10.3.21

Regulation of the air temperature is achieved with a 3-way valve

(actuator) controlled by a PI regulator located on Control Unit N1.
Temperature sensor R1, a PT100 sensor located at the air outlet, is
used as actual value.

Monitoring 10.3

The Cabinet temperature monitoring is performed by temperature

285
Magnet System - Cabinet Cooling - CCS
 10
286

Figure 206 Cabinet Cooling Overview

Primary water CCS Water Version Main

Diagram

Strainer
GPA CCA CCS Blower Unit

Temp Temp
GSSU Monitor

Blower Unit
Monitor
M1
M1
MSUP
N1

M2 RFSU
M3

RFCI
M2 M3
MMC

Blower
Exchanger
Heat

RFPA N1 Switch Settings

Ni1000
w1 int ext
10V
A B
x1 a p Y1
u m
1
10V Ni1000

LPD w1 a p

CCS
 Section

11 Power Distribution (LPD) 1

Wow!! Hallo, it’s been a l o n g time since someone’s been here... probably made a wrong turn on the way to the RF section., eh? That usually
what happens... hey, hey... wait! PLEASE DONT LEAVE!!! If you stay and keep me company for a while, i’ll give tomorrows lottery number!
Really.

Introduction 1 .1 Mains Box 1 .2

The LPD has the monumental task of distributing the lines power to There are two versions of the LPD and Mains box, both are shown
the various components withing the system. Overview schematics below. The electrical connections for both versions are displayed in
of the LPD are found below. Please also refer to the Diagrams the schematics on the following pages.
document for details.

287
Power Distribution - Introduction
 11
288

Figure 207 Line Power Distributor Mains Box

Back
OLD Version

F3
GPA
F1
Mains

Newest Version

F5 F4
MPS RCA
F4
RCA
F23
Mains
Newer Version F5
MPS

F25
Astex

F3
GPA
Figure 208 LPD Schematic Page 1 (OLD version with K2209 GPA)

UPS MRC MRSC System On NEW System

X109 X110 X128 Version Diagram
E 1 2 2 1 E 1 2 3 E 1 2 3 E 1 2
X103 CCA Roof

F5 Mains Box
20A K7-1 K1 K1-2 CCS MMC Blower RFPA
1 X800 X801 X300
F7 F6

K9-1

K4-1
X102 3

K3-1
K10
MPS 5 10A 10A
9 K11
E
K5-1 ON
F3 RC-2
50A
1 RC-1 K3 K13-1 K7-2
X111 2
not 3
used
E
F9
F4 F2
K11 50A
32A F24 Line 25A F10
1 4A 6A
Filter Res
X101 2
RCA 3
Con F8
16A
4 K10
F1 F23 3U2 L1
E
100A 32A 3V2 L2
Line 3W2 L3
L1 1U1
Filter 1V1
N
X100 L2
Mains L3 1W1 K1
2U2 L1

Page 2
E 2V2 L2
T1

to
2W2 L3
N
X4 K4-2

MSUP +15V 6 K2-1

Alarm Box PS K13

CCA
K5-2

GPA
X1 X1 CCS_On
9

IOP
17 MsgSys_On ON OFF

T
17 17 4
N3.5 Trafo
24 System_On MSUP systems
22 22 3 K2-2
23 System_Off Backplane only
K6-2
23 23 2
22 Host_Stby
24 10 7
K1-1 K4 K5 K9 K6 K2 K7
8
3 3 +15V 0V 5
Stdby

289
Power Distribution - Mains Box
 11
290

Figure 209 LPD Schematic Page 1 (NEW version with K2217 GPA

UPS MRC MRIR System On OLD System

X109 X110 X128 Version Diagram
E 1 2 2 1 E 1 2 3 E 1 2 3 E 1 2
X103 CCA Roof

F5 Mains Box
20A K7-1 K1 K1-2 CCS MMC Blower RFPA
1 X800 X801 X300

K9-1

K4-1
X102 3

K3-1
F7 F6 K10
MPS 5 10A 10A
9 RC-2
E

F3 K5-1
ON
80A
K13-1 K7-2
RC-1 K3
X111
GPA

F4
32A F24 F2 F10
1 4A 25A 6A
X101 2
F8
RCA 3
16A
4 K10
F23 3U2 L1
E
32A 3V2 L2
Line 3W2 L3
L1 1U1
Filter 1V1
N
X100 L2
Mains L3 1W1 K1
2U2 L1

Page 2
E 2V2 L2
T1

to
2W2 L3
N
X4 K4-2

MSUP +15V 6 K2-1

Alarm Box PS K13

not used

CCA
K5-2

GPA
X1 X1 CCS_On
9
6 MsgSys_On ON OFF

T
17 17 4
Trafo
4 System_On MSUP
22 22 3 K2-2
5 System_Off Backplane K6-2
23 23 2
3 Host_Stby
24 10 7
K1-1 K4 K5 K9 K6 K2 K7
14
3 3 +15V 0V 5
Stdby
Relay Control
Relay Assembly
Figure 210 Inner view to PDS
System On
Manually
Pressing either the "System on" button on the Alarm Box or the
GREEN button S1 in the LPD K4 is activated temporarily closing
contact K4-1 and K4-2. Contact K4-1 activates K3 which pulls in
self-holding contact K3-1 and supplies the MRC and Imager with
power. Contact K4-2 activates K2. When K2 activates the self-
holding contact K2-1 keeps itself on and contact K2-2 activates K7.
Contact K7-1 activates relays K1, K10 (and K11 on oler systems)
which supplies power to the rest of the scanner components.
Via Software
"System On" can also be activated the software under the Options
> System Control menu on the Scanner task card : System
Standby. When activated, the Host sends a command to a µP in the
1 .3
Alarm Box over a serial link and the µP activates the System On
signal to the LPD.
1 .31
System Off 1 .3.12
Pressing either the "System off" button on the Alarm Box or the
BLUE button S2 in the LPD activates K5 which opens contacts K5-1
and K5-2 deactivating relays K3 (MRC, MRIR power) and K2 (K7,
K1, K10 and K11 removing power from the scanner components).
Host Standby 1 .3.13
Manually
Pressing the "Host Standby" button on the Alarm Box activates K9
and K6. K9 will enable K3 (self-locking) which powers MRC and
MRIR (MRSC). If the scanner was ON, K6 will disable K2 and so K7,
K10, K11 and K1 removing power from the rest of the scanner
components. If the scanner was OFF then K6 has no function.
Via Software
This feature works the same as for System On described at the left,
however, the Standby signal is activated.
1 .3.1
Overtemperature Protection 1 .3.14
In case the temperature in either the CCA or GPA cabinets exceeds
50°C K6 will be activated and the system is switched to Standby. If
the system is already switched off, but for any reason the
overtemperature switches get activated, a diode between K6 and
K9 will prevent the system from switching to Standby.
CCA and GPA 50°C Overtemp Switches 1 .3.15
291
Power Distribution - Relay Control
 11
292

Figure 211 Cabinet Overtemperature Switches

OLD NEW
Version Version

CCA Cabinet

GPA K2209 GPA K2217

Figure 212 LPD Schematic Page 2

RCA RF Room
Controller Reserve PatTab Printer Digicam
X104 X108 X105 X107 X106
1 2 3 E 1 2 3 E 1 2 3 E 1 2 3 E 1 2 3 E
CCA Roof

RFPA/BB GSSU MMC RFCI Shim PS

X350 X100 X200 X900 X700
1 2 3 1 2 3 1 2 3 1 2 3 1 2 3

F22 F11 F14 F16 F13 F20 F15 F18 F12 F17
2A 10A 4A 4A 4A 10A 16A 6A 10A 16A
Page 1
from

OLD

L1
L2
L3
N
Page 1
NEW
from

Old version New version

293
Power Distribution - Relay Control
 11
294

Circuit Breakers 1 .3.16

LPD Circuit Breakers
Circuit Breakers in Mains Box (on CCA roof)
NOTE The diagrams above show the relay contacts in the Mains fuses for the system,
F1
"System Off" state. in newer systems: replaced with F23
F3 K2217 GPA Final Stage supply (Light, Quantum, Sonata)
F4 RCA
F5 MPS (service tool)
LPD Circuit Breakers
RCA control electronics
Table 1 Circuit Breaker Listing
F22
F11 RFPA / BB (CORA amplifier for Spectroscopy)
GSSU, driver and multiple DC supply,
F14 K2209 Gradient only: resonant converter control
F16 spare
D14 motherboard,TX-modul D1, RX-modul D12 (TALES, LCCS,
F20 BCCS, BTB), in newer systems: additionally MMC power supply,
MPCU-box, backplane with MC4C40, RX4, IOP
PTAB, patient camera, patient light, fan, localizer-light, vacuum
F15 pump
F18 Printer option

F12 Shim control crate, DC supply, fans

MMC power supply, MPCU-box, backplane with MC4C40, RX4,
F13 IOP, in newer systems: spare
F17 Digital camera (optional)

F24 MSUP, also supply for relay control!

F6 MRSC / BR (image processor)

F7 MRC with LCD monitor, intercom

F8 RFPA (160 volts, 3-phase)

K2209 Gradient only: resonant converter,
F9 in newer systems: removed
F23 Main fuse for transformer T1
Main fuse for relay control and MSUP,in case no UPS is installed.
F2 With UPS, this will take over relay control and MSUP supply.
F10 X800 to CCS, X801 to air distributor (fan) below MMC frame

Table 1 Circuit Breaker Listing

 Section

12 Tune-Up / QA
Main System
12

Diagram Diagram

Introduction 12.1
The Procedures 12.1

The procedures fall into three major parts:

The Tune-Up is a collection of procedures designed to calibrate, • RF-related Tune-Up Procedures
compensate or to determine hardware variables which need post- - Tuning Calibration
correction. They are performed initially to tune the MR system after - Body Coil Tuning
a new installation, but also at regular intervals (according to the - RF Characteristic
Preventative Maintenance schedule) as it is normal that system
• Gradient-related Tune-Up Procedures
components drift with time and may need re-calibration. Some
- Regulator Adjust
TUne-Up procedures will need to be performed after the repair
and/or replacement of certain components as described in the - Table Adjustment
Replacement of Parts procedures. - Phantom Shim
- Cross Term Compensation (CTC)
- Eddy Current Compensation (ECC)
NOTE Keep in mind when servicing a system which had not
been tuned up regularly (e.g., the site was without a - Coil Power Losses (CPL)
service contract) that its performance may not be - Gradient Delay
optimal and may have some influence on the "problem". - Gradient Sensitivity
• Receive Path-related Tune-Up Procedures
This description explanation of the physical background of the - Receive Path Calibration (to be done with the Body Coil)
individual Tune-Up procedures performed during the Tune-Up. The
more simplified and automatized the service-software has become, Dependencies 12.1. 1

the more important it is to have a good understanding of these

procedures and what they are doing. All selected procedures are performed from top to bottom. The
individual steps follow a specific order and should not be changed
due to the dependencies between those prior and those that follow.
I f a Tu n e - U p p r o c e d u r e h a s c h a n g e d i t s s t a t u s t h e n t h e
procedure(s) in the Quality Assurance menu for the corresponding
coil are changed to To Do.

295
Tune-Up / QA - Introduction
 12
Modes
Each of the Tune-Up steps can be performed in one of two modes:
• Normal mode: this is the mode that has to be used to
achieve a status of "Done".
• Expert Mode: This mode is intended for troubleshooting
only. Procedures which can be run in this mode offer the
possibility to change or make individual selections of sub-
steps of a procedure. For example, a single gradient axis
could be measured alone or certain parameters can be
selected, such as the terminations for the tuning calibration.
The determined or measured values will also be saved in this
mode!
NOTE The Tune-Up procedures measure and SAVE system
parameters. Therefore the Tune-Up procedures should
NOT be used for trouble shooting of if the system in not
in proper working order. The Quality Assurance
procedures only measure and VERIFY system
specifications without saving any system parameter.
Procedure Status
If a procedure is successful, it will be set to Done. If it is a fresh
installation all will be set to To Do. Also, if a procedure having
interdependencies was performed retrospectively, then the
subsequent procedures being interdependent on the one just
performed, will be set to To Do. For example, if a regulator
adjustment is performed, all gradient-related procedures will be set
to To Do, even if they were set to Done previously. If a procedure
has stopped or aborted due to an error or time-out, it will be set to
error. Is this all making any sense?
296
12.12 Reports 12.14
For every procedure the results are stored as an HTML file and can
be called up for display under "Reports", "Session History". The
saving of the measured data in the system parameter files, log files
and database files will be done automatically by if the procedure
was performed successfully.
Quality Assurance Procedures 12.15
The QA procedures are a set of procedures which are used to verify
system performance and include all the procedures found in the
Tune-Up as well as additional procedures for testing overall system
performance. Only these will be described since those
procedures found in Tune-Up are identical, with the
exception that not values are saved:
• If you are out of specification after a Quality Assurance step,
you must perform the corresponding Tune-Up step.
• Every Tune-Up and Quality Assurance procedure can be run
in either Normal or Expert mode with one exception: the
"field stability" procedure under Quality Assurance (very
useful during shim procedure or trouble shooting stability
problems) can only be run under Expert mode.
12.13
Go back to MAIN MENU
Active Coil menu 12.1.51
The Active Coil menu shows the name of the currently selected coil
that will be used by the Tune-up procedures. Since the body coil is
always connected, it will always be the default selection when the
Tune-up platform is opened.
In addition to the Body Coil, up to 4 coils may be connected to the
system at any one time. These coils are displayed in the Active coil
pull-down menu. The first coil displayed in the list is always the
Body Coil. The 2nd is the coil connected to the 1st coil plug, the 3rd
the coil connected to the 2nd coil plug and so on. If no coil is
connected to a plug the message "No Coil" replaces the coil name.
Figure 213 Tune Up and QA Procedural Steps

HOME HOME Not OK error

OK
Done To Do error

Workflow Workflow RF Verify BC

TuneUp Tuning Calibration
Quality Assurance
TuneUp Expert General QA
Coil QA RF Verify LC

RF related Quality Assurance Expert

BC Tuning Regulator Check
procedures
Phantom Shim Check
RF Characteristic
Cross Term Compensation Check
Tune-Up
checks Eddy Current Compensation Check
Regulator Adjust

Coil Power Losses Check

Table Adjustment
Gradient Delay Check
System
Diagram
Phantom Shim Gradient Sensitivity Check

Receive Path Calibration

Cross Term Compensation
Gradient Coil Check
related
procedures Image Orientation
Eddy Current Compensation

Calculation Artefacts
Coil Power Losses
Spike Check

System Stability Check

Gradient Delay
QA checks
Fat Saturation
Gradient Sensitivity
Synthesizer Check

Receive Path Calibration Stability_LongTerm Check

Field Stability Check

297
Tune-Up / QA - Introduction
 12
298

RF Related Tune-Up 12. Figure 214 Simplified BC Tuning Circuit

Main
Tuning Calibration 12.21
Reflection X Menu
j1
The Body Coil’s center frequency (electrical length) and loading Chart
Cs
conditions are constantly changing with every new patient or
patient position thus shifting its impedance away from the nominal
Range of
RF System impedance of 50 ohms resulting in an increasing power variance Cp
reflection. The Harmony and Symphony have been designed with of BTB
an impedance (Z) matching network called the Body Tune Box
(BTB). The BTB consists of a serial and a parallel capacitor array 0.1
that can be set to compensate the effects of the patient and bring 0W 50W ¥W R
the impedance of the Body Coil back to the nominal 50 ohm -1 short 0 open 1
impedance, or close enough so that the reflected power is 10% or
less (green circle in center of reflection chart). The task of Range of
measuring and analyzing the BC impedance (reflection factors) and variance
of Patient &
finding the appropriate BTB capacitor setting to compensate is Body coil
performed by the tuning algorithm in the Adjust/Tune procedure.
But before the Adjust/Tune procedure can perform the task of
m a t c h i n g t h e i m p e d a n c e i t m u s t f i r s t c a l i b ra t e t h e Tu n e
-j1
Measurement Circuit which is used to measure the reflections and
also the actual effective range of the BTB. This calibration is
accomplished in two separate steps:
BTB Body Coil
• Tune Measurement Circuit Calibration - normalizing the TX
impedance characteristics of the components in the Tune Module
Measurement Circuit including the TX_Module, RX_Module,
Cs Cp
all connecting cables and the internal components of the - Cables
0°
BCCS, LCCS and TALES. - BCCS
• BTB Calibration - mapping out the range of variance of the -
-
LCCS
TALES
series (Cs) and parallel (Cp) capacitances in the BTB.
Cs Cp 90°
RX
Module

Tune Measurement Circuit Z-Matching

Network
Tune Measurement Circuit Calibration
T

12. .1
Figure 215 Normalization of Tune Circuit

Measurement 12. 1.1

Results
For this measurement, the TALES output will be terminated with an TALES
open, a short and a 50 ohm terminations which covers the
BCCS
complete impedance resitive range. Under these different 0° X3
impedance conditions the forward and reflected values are
measured by applying a rectangular RF pulse (tuncal sequence) to

POI
the Ur and Uf side of the directional couplers in the BCCS. For each
termination condition, the frequency is varied through the
complete operating range. For Harmony the frequency range is 90°
4 0.35 to 40. 55 MHz wi th a frequency step of 10 kHz (21 X4
measurements). For Symphony/Sonata the frequency range is Ur
6 3.45 to 63. 75 MHz wi th a frequency step of 10 kHz (31
Uf
measurements).
The Symphony/Sonata system has a CP Body Coil consisting of two
coil systems so an additional measurement is necessary since there
is also a coupling of the two Body Coil systems over the Rx Hybrid.
This coupling has the result that impedances of the 0° system Rx
couple through to the 90° system effecting its impedance and vice Hybrid
TTX
versa, so it must be measured and compensated as well. This is TX
done by measuring the 90° path when sending with the 0° and vice Module
versa. The coupling factors are expressed as H-parameters.

POM
After this measurement the Tune Measurement Circuit will be
normalized and the point of measurement (POM) (i.e., the point
where the system knows the exact amplitude, frequency and phase
RX
of the signal being sent or received) will have been transferred to SGA1
Module
the Point of Interest (POI) and the system is now able to "see" the
impedance conditions at the POI.

Expert Mode 12. 1.12

LCCS

Individual terminations can be selected in the Expert mode. When

would you want to do this? It depends.
Tuning Calibration Step 1 - NORMALIZATION:
measuring the effects of the components between the POM and the POI (items in
RED)

299
Tune-Up / QA - RF Related Tune-Up
 12
300

Results
T

12. 1.13
Figure 216 Results of Normalizations
The graphic displays the results of the H parameter (Rx hybrid
coupling). Each colored line represents one of the four measured H 1 Back
parameters with each line displaying the 21 (harmony) or 31 H11
H12
(Symphony/Sonata) measured frequencies (tick marks). H21
H22
It is difficult to interpret this graphic since the lines will always be
round. You may notice, however, that the blue line begins, for 0.5
example, at real part 0 and imaginary part of approximately 0.75

imaginary part
and runs to r=0.6/i=0.2. All other lines begin and end at different
points. The graphic may be of help if compared with curves
measured at a time when the system was functioning properly. 0

Otherwise: forget about it.

Before the BTB Calibration is performed (the next measurement,
see below), the tuning calibration is first verified. This is -0.5
accomplished with two measurements. The first measures the
forward and reflected values on the 0° system with a 50 ohm
termination. After applying the compensation derived from the
tuning calibration measurement both real and imaginary parts -1
should be zero (= 0% reflection). The second verification -1 -0.5 0 0.5 1

measurement measures the 90° system with a short which should real part
give a result of real = -1, imaginary = 0 (i.e., 100% reflection).
The results are displayed in the two tables.
If the results are good, it will continue with the BTB Calibration.
TALES Reflection Verification 0-system (50 ohm)
Testing the Tuning Calibration 12. 1.14 Value Low Spec High Spec

There is a service test in the TestTools under RF system / BTB TALES_0_Reflect_Real 0.00 0.00 0.02

Interactive that also checks the tuning calibration. This test uses, TALES_0_Reflect_Imag 0.00 0.00 0.02

however, an open termination instead of a short (as used in the

measurement described above) which should result with a value of
real=1, imag=0 if the last saved tuning calibration is still valid (i.e., TALES Reflection Verification 90-system (short)
nothing in the tuning circuit has changed). Value Low Spec High Spec

TALES_90_Reflect_Real -1.00 -1.02 -0.98

TALES_90_Reflect_Imag 0.00 0.00 0.02

BTB Calibration
T

12. .12
Figure 217 Mapping out the BTB capacitances
After successfully normalizing the tuning circuit, the capacitor array
of the BTB will be "mapped out", i.e., its range of variance Back
BTB
determined. The tuning calibration must have been successful TX
since the impedance and coupling data are used. Module 0°
In the circle in the diagram at right represents the reflection factor Cs Cp
for any given load (R) and frequency (X) value. The outer - Cables
- BCCS
perimeter signifies 100% reflection (r=|1|), the center point 0% - LCCS
reflection (r=0 i.e., 50 ohms). This chart has been overly simplified - TALES
90°
for explanatory purposes. It can be seen, that the Cp capacitance
varies along the X axis, whereby the Cs capacitances vary along RX
Cs Cp
the R axis. The amount of variance along either axis depends on Module
the number of and the values of the individual capacitors. For
example, if the BTB has 4 switchable Cs capacitors, call them C1
Tune Measurement Circuit Z-Matching
through C4, and C1=1pF, C2=2pF, C3=4pF, C4=8pF, then there are Network
16 different capacitance values ranging from 1-15pF. There are
three different versions of BTB:
• Äst < 5 : 4 Cs capacitors, only three selectable (= 8 values)
• Äst > 5 : 4 Cs capacitors, all selectable (=16 values) X BTB_0° BTB_90°
j1
• BTB-2 : 5 Cs capacitors, all selectable (= 32 values)
X
j1
Cs

Cs Cp

All BTB versions have 4 selectable Cp capacitors yielding 16 values. -1

0W
short
50W ¥W
open
R
1

Range of
Results 12. 1.21
variance Cp -j1

of BTB
The results are not displayed but are stored in the tuncal.dat file
under C:\MedCom_047\MriSiteData\Measurement if the program
finished successfully.
0W 50W ¥W R
The output in the report is as follows: -1 short open 1

Performing BTB Calibration measurement for Open/50 ohm setup

Performing BTB Calibration measurement for Short/Open setup
Performing BTB Calibration measurement for 50 ohm/Short setup

Results are in specification. Have a nice day.

-j1

301
Tune-Up / QA - RF Related Tune-Up
 12
Body Coil Tuning
This procedure is used to measure and, if necessary, adjust the
central resonant frequency of each of the two Body Coil systems as
well as minimize the coupling between them.
This procedure is only possible for systems with the bird-cage Body
Coil (BC47-2).
Measurement
The measurements are performed with fixed Cs/Cp values and over
an 800 kHz frequency range. The resonant frequency is found at
that point where the reflection of the BC has a minimum. The
decoupling is given by the frequency where the transmission has
its maximum value. The transmission is determined at that
frequency where the transmission (coupling) has its maximum
value.This should be lower than -16 dB. A -16dB coupling
translates into a 2.5% power loss! Therefore, the lower the
coupling, the less losses.
Evaluation
Resonant Frequency 12. 2.21
The procedure measures the frequency response of the Body Coil
over an 800 kHz frequency range. The evaluation determines:
• if the center frequency of each Body Coil system is between
63.45-63.75 MHz
• that the center frequencies of both coil systems are tuned to
within 100 kHz of each other
• that the reflection factor is not more than 30% (r ≤ 0.3)
Transmission (coupling) 12. 2.2
The transmission through the Body Coil, that is, the amount of
coupling between the two Body Coil systems, describes a mutual
inductance between the Body Coil systems due to coil construction.
The transmission is measured by sending a signal into the 0°-
302
12.2
system and measuring what comes out of the 90°-system. A
Adjust Procedure 12.2. 3
This is a manual adjustment requiring the rear tunnel cover to be
removed. On the Body Coil are three 50-turn trim capacitors (refer
to Figure 218 below), two for adjusting the frequency of each Body
Coil system and one for minimizing the coupling between the two.
12. .21 Tuning 12. 2.31
The trim capacitors T1 and T2 vary the resonance frequency of the
system 1 and 2 respectively. These 50-turn capacitors vary the
frequency by approximately 5 kHz per turn. Turning the cap CW
LOWERS the frequency, CCW INCREASES the frequency.
Decoupling 12. 2.32
TD is also a 50-turn capacitor and effects the de-coupling between
the two BC systems. It is not possible to know which direction to
take at first, but there is only one minima.
12. .2 NOTE There is a interdependency between all three
adjustments! Refer to the TSG for a detailed description
of this procedure.
Expert Mode 12.2. 4
There is no Expert Mode for this procedure.
Figure 218 Body Coil Resonant Frequency and De-coupling Adjustments

Reflection Result Plot

Main
Menu
BTB Body Coil 0.9
Reflection 0 Degrees
Reflection 90 Degrees
0,8
BCCS 0°

Reflection Factor |r|

0° 0.7

0.6

Cs
T1 0.5
Cp
0.4

90° 0.3

0.2
0.1
TD

63.3
63.2

63.4

63.5

63.6

63.7

63.8

63.9

64.0
Frequency in MHz

90° -30
Transmission Result Plot

Rx

Transmission |t| in dB
-35

TX TTX Hybrid T2
Cs Cp -40
Module
-45

-50

-55

RX SGA1 -60

63.3
63.2

63.4

63.5

63.6

63.7

63.8

63.9

64.0
Module TD
Frequency in MHz

LCCS T1 T2 Reflection (minimum) Step 1

Frequency Reflection Factor r

Value Low Spec High Spec Unit Value Low Spec High Spec Unit

0 deg 63.64 63.45 63.75 MHz 0.2 0.0 0.3

90 deg 63.64 63.45 63.75 MHz 0.2 0.0 0.3

Delta 0.0 100 kHz

rear (service) side

Transmission (maximum) Step 1
Value Low Spec High Spec Unit

Frequency 63.55 63.30 63.90 MHz

Decoupling -33.66 -80.00 -16.00 dB

303
Tune-Up / QA - RF Related Tune-Up
 12
304

RF Characteristic 12.23 Figure 219 Pre-distortion of RF-pulses

The calibration of the RF transmitting system is important for
obtaining optimum image quality. The RF pulse amplitude defines Next
not only the flip angle, but the pulse lobe amplitude relationship Problematic of a
also defines RF pulse profile and hence the slice profile in slice- non-linear RFPA
selection imaging.
characteristic
Effects of amplitude distortions 12. 3.01 curve of RFPA
Pout
Amplitude distortions of the RF envelopes caused by the non- distorted pulse:
linearity of the amplifier may produce distortions of the slice profile main lobe too small
nominal
and slice thickness with the following consequences: RF pulse
• reduced signal to noise caused by crosstalk (in multi-slice Pin side lobes too large
sequences)
• reduced contrast due to the resulting partial volume effect t
The principle of amplitude corrections is shown in the next graphics
Non-linear RFPA Slice Profile
Effects of phase distortions 12. 3.02

A phase distortion would lead to a shift or drift in the frequency, desired pulse
which would result in false slice positions hence the phase f
distortion must also be corrected.
correction
The correction curve
Method of correction 12. 3.03
curve
is the inverse of the
RFPA’s characteristic
The distortion caused by the non-linearity of the RF amplifier is curve.
corrected by measuring the output of the RF transmission in terms f
cross-talk
of the amplitude and phase based on a known input to the RF
amplifier for the entire operating range of the RF amplifier, thereby
defining the input/output characteristic of the amplifier. The
corresponding inverse function of the amplitude and phase desired pulse
characteristics are used for pre-distortion of the input signal in
order to achieve a linear output characteristic and to optimize the
RF excitation. t

pre-distorted Non-linear RFPA

RF pulse
Measurement 12. .31
Figure 220 RF Characteristic Measurement
The RF-characteristic-measurement is performed with the following
steps: Results
RF Characteristic
1. Calibration Voltage Search: Starting with a nominal value
of 100 Volts, the output is increased until a value of 566
Measurement
Volts (400V for Harmony) is measured at the TALES.
2. RF Calibration: The characteristic measurement will be Calibration Measurement
made using the DICO, so it must first be calibrated. Using
100V 60.5V
the results of the first step, the DICO value will also be
measured giving a relation between the TALES and DICO.
This value is used as a correction factor for the DICO values.
RFPA TAS BCCS TALES BTB BC
3. RF Max Power Search: The system now determines the
DICO
input voltage to the RFPA required to achieve an output TX
Module
power at the coil of 12.2kW (8.5kW for Harmony), the
power range over which the RFPA will be calibrated. It Loader
& Ball
begins with a nominal value and increments the input until PF phantom
the 12.2 kW has been reached. RX
Module CV
4. RF Characteristic measurement: For the following
measurement the RF is sent to the 50Ω dummy in the TAS.
256 pulses with different amplitudes are applied. The first
pulse starts with the maximum voltage, then the voltage
drops by 0.25 dB for each pulse. In this way the complete RF Characteristic Measurement
characteristic is measured.
780V 512 pulses
5. Save the RF Characteristic result in the rfchara.dat file.
0V
6. Verify: The final step is to perform a verification measurement.
The inverse of the measured characteristic curve is now
used to pre-distort the RF pulses. The result should be a RFPA TAS BCCS TALES BTB BC
linear output transfer characteristic of the RFPA.
TX DICO
Module

50 W
dummy
PF load
RX
Module

305
Tune-Up / QA - RF Related Tune-Up
 12
306

Results 12. .32

Figure 221 RF Chara Results

Plot of Measure Characteristic 12. 3.21

Main
Menu
The first set of graphics show the measured amplitude and phase
Plot of Measured Amplitude and Phase Characteristic
characteristic curves each measured with 512 measure points. with
Amplitude Characteristic Phase Characteristic
a normalized RF input. 800 195
700
190
Plot of Calculated Characteristics

RF Output [volts]

Phase [degrees]
12. 3.2 600
500 185
The second set of graphics displays a calculated version of the 400 180
measured data mentioned above. The measured data is used to 300
175
generate an equidistant RF Characteristic correction data base on 200
170
input amplitude, slope and phase necessary for the RF 100

Characteristic data file. The output data is first made by dividing

0 165
0 0.1 0.2 0.3 0.4 0.5 0.6 0 100 200 300 400 500 600 700 800
t h e m a x i m u m vo l t a g e i n t o 1 0 2 4 e q u i d i s t a n t p o i n t s . T h e RF Input [normalized] RF Output [volts]

corresponding input and phase data is then calculated by

interpolating with the actual measured data. Non-unique amplitude Plot of Calculated Amplitude and Phase Characteristic
data is avoided by simply ignoring this data when generating the Amplitude Characteristic Phase Characteristic

input data. Finally, the output data and phase data is converted to 800 195
700
slope and phase values. 190

RF Output [volts]

Phase [degrees]
600
500 185
Plot of Verification Measurement 12. 3.23
400 180

The last set of graphics display the evaluation results of the 300
175
200
verification measurement. The verification measurement is made 100
170

by using the inverted characteristic curve to pre-distort the RF 0 165

0 0.1 0.2 0.3 0.4 0.5 0.6 0 100 200 300 400 500 600 700 800
pulses. For a correct compensation, the result should be a linear RF Input [normalized] RF Output [volts]
input to output transfer characteristic. The evaluation is made by
calculating the deviation of the measured data to an ideal linear Plot of Measured Amplitude and Phase Characteristic (Verify)
function which is derived by simply creating a straight line between
Amplitude Characteristic Phase Characteristic
the first data point (0V) and the last data point (maximum 800 181
voltage). A check for monotony is also made, assuring that the 700 180.8

RF Output [volts]
180.6
amplifier at no time went into saturation.

Phase [degrees]
600
180.4
500 180.2
400 180
Expert Mode 12. .3
300 179.8
179.6
200
179.4
The expert mode allows the user to specify the maximum voltage. 100 179.2
The voltage input must be between the range 50% to 100% of 0
0 100 200 300 400 500 600 700 800
179
0 100 200 300 400 500 600 700 800
MaxPowerAllowed. RF Input [normalized] RF Output [volts]
RF Characteristic for Local Coils
• Non-spectroscopy systems:
The Local coil characteristic can be measured in Expert Mode
interactively by connecting the dummy load to the LC output of the
TALES. This measurement is not mandatory because the RF
Characteristic BC is applied also for local TX-coils.
• Spectroscopy systems:
The RF-Characteristic must be measured using all RF-amplifiers
and all available nuclei (H and all X-nuclei) in the Local coil (LC)
path. An interaction of the service technician is necessary:
Measurement
The dummy load in the TAS_C must be connected to the LC-output
of the TALES (i.e. disconnect output cable from TALES X6,
disconnect input cable at BCCS X7 and connect it with TALES
output X6) and the service plug must be connected to patient table
coil plug 1.
The RF characteristic is measured as follows:
1. Calibration Voltage Search: Starting with 100 Volts
output (this is just a nominal value). The TALES readings
are used to increase the output until 250 Volts output are
measured.
2. RF Calibration: The DICO has to be calibrated since it is
used for the final measurement of the characteristic. The
DICO value is measured based on the resulting input
voltage from step 1. The DICO is calibrated using the known
relationship between TALES and DICO.
3. RF Max Power Search: By carefully increasing the output
voltage, the max. power of 1900 W, respectively 2440 W
(depending on nucleus) is searched.
4. RF Characteristic measurement: For the following
measurement, the RF is sent to the 50Ω dummy in the TAS.
256 pulses with different amplitudes are applied. The first
12.24
pulse starts with the maximum voltage, decreasing by 0.25
dB for each subsequent pulse. This ensures that the
complete characteristic is measured.
5. The RF Characteristic is saved in the rfchara.dat file.
6. The final step is the verify measurement. This includes
the calculation of amplitude and phase deviation and
checking if the results are within specification. The results
and graphics can be viewed in the service software under
Tune-Up, Report, Tune-Up Results.
Results 12.2.42
12. .41
Same as for RF Characteristic procedure for Body Coil.
Expert Mode 12.2.43
In Expert Mode, the function operates similar to standard mode
except that the following options are available:
1. You can click Save to save the RF Characteristic after
measurement.
2. You have an option to modify the "Maximum allowed RF
power".
3. Selection of RF-amplifier, coil path and nucleus.
4. Option to switch off the frequency adjustment
5. Option to disable switching of TAS to dummy load.
Also, Expert Mode does not include RF-verification at the end of the
measurement.
Main
Menu
307
Tune-Up / QA - RF Related Tune-Up
 12
308

Gradient Related Tune-Up 12.3 Figure 222 Regulator Adjustment

Regulator Adjust 12.31

Next

GPA Regulator
The regulators in the newest very-high-power Gradient Amplifiers
(500A and above at 2000V) have a proportional, P, (= gain),
AVA
inte gral, I, (= tim e) and differential, D, regulation
DAC Modulator Power
characteristics, thus each regulator consists of a P, I and D
Stage
regulator circuit in series. The purpose of this procedure is to find
the optimal P, I and D regulator adjustment values for an optimized D
regulation characteristic. A P I D
A A A
D D D

Actual Regulator Adjust DAC values:

7-bit
Measurement 12.3.1
P - 127 (min) to 0 (max)
I - 127 (min) to 0 (max)
The regulators are tuned one after the other in the order PID. Each D - 0 (min) to 127 (max)
regulator begins with a configured start value or in Expert Mode
with the user given start value. The regulator value then is Loop CAN
incriminated by one single bit and a measurement is done. The
measurement results are evaluated and a new regulator value is Service & CAN
calculated. This step is repeated until the regulator is optimized.
Finally, a configured safety factor is added to the regulator. RX_Module Software
The actual value gradient waveform is sent over the gradient loop
A
path from the D16 Service Can board in the GPA to the RX_Module DC+
D
in the RFSU and acquired by the ADC, with 256 sample points. The
GradReg program then performs the following:
• checks whether the data is in the real or imaginary part Evaluation
• displays the measured pulse: the first graphic shows the 1.03
complete gradient pulse, the second graphic displays the

Amplitude [normalized]
1
overshoot of the gradient pulse 1.02
• performs an evaluation (described below)
1.01

0 1

0 1 2 0.5 1
Time [ms]
Evaluation 12.3.12
Figure 223 Regulator Signal Evaluation
The pulse is evaluated for three criteria:
• Overshoot amplitude to the nominal pulse amplitude (in %) Pulse Check
Results

• Decay time for overshoot to decay to 15% of its amplitude

• Smoothness is the maximum positive deviation of the 1.12
initial (default) characteristic
gradient pulse top portion. 1.1
signal undershoot
signal oscillating
The smoothness of the overshoot is determined in this way: final adjustment
1.08
Starting from the maximum data point of the overshoot, the

Amplitude
difference to the next successive data point is determined. This is 1.06
repeated for all data points of the overshoot. The smoothness
factor is the maximum difference determined by the above process 1.04

divided by the nominal pulse amplitude an expressed in %. 1.02

Pulse Check 12.31.21

1

A check if the regulator is being over-driven or the pulse signal 0.98

oscillates is also made, indicated by 2 or more sign changes in the 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3
data points of the overshoot. Time [ms]

If there are points with an amplitude below the nominal amplitude Pulse Evaluation
an undershoot after an existing overshoot is detected. That means
over-driven regulator or oscillating signal. Overshoot (in %)
1.1 Decay time (from max to 15%)
Smoothness (in %)

A 1.08
D

Amplitude
1.06

1.04
sign
changes

1.02
15% of
overshoot
1

0.4 0.5 0.6 0.7 0.8

Time [ms]

309
Tune-Up / QA - Gradient Related Tune-Up
 12
310

Results 12.3.13

The final regulator adjustment values and achieved values are

displayed in tabular form.
Figure 224 Evaluation Results (final results)
Value Low Spec High Spec Unit Main
34
Menu
P

I 50

D 42

Overshoot 2.572 1.500 3.500 %

Decay Time 0.103 0.000 0.150 msec

Smoothness 0.097 0.000 0.300 %

After all regulators (PID) are tuned it is checked if the signal is in

specification. If so then the regulator values are set permanently. If
an error occurs or the program is aborted the old regulator values
(saved before Tune-Up starts) are restored for the GPA.

Expert Mode 12.3.14

If the factory default values are too tight and cause the regulator to
oscillate and result in an aborted measurement, the default values
can be changed in the Expert Mode menu.
Figure 225 Evaluation Results (final results)
RegAdj Expert Mode

Orientation X gradient
Y gradient
Z gradient
127 (min)
Proportional 25
to 0 (max)

127 (min)
Integral 38
to 0 (max)

0 (min) to
Differential 58
127 (max)
Table Adjustment 12.32 Figure 226 Table Adjustment Results
The goal of the Table Adjustment is to determine:
Main
• center positioning of the phantom in the magnet iso-center A 50 cm
magnetic
B Menu
iso-center
• sufficient field homogeneity scan volume
• distance between light marker and magnet iso-center
24 cm
The Phantom shim, CTC and ECC procedures require a centered phantom

phantom for accurate results. The Table Adjustment determines

the phantom position with respect to the center of the gradient
Gz in
coils (iso-center). From this, the distance from the light marker to mT/m
the magnetic iso-center is determined.

Measurement 12.3.21

The measurement uses a double echo sequence. The first echo is Signal spectrum
acquired without applying a readout gradient resulting in an FID of phantom

the length of which is a rough check of the fundamental imaging

volume homogeneity.
During the second echo a readout gradient is applied resulting in a
signal spectrum of the phantom. The center of the phantom’s
signal spectrum is compared to the center of the scan volume
frequency window to calculate the phantom position in readout
direction. The sequence measures the three axis in this way. Figure
226 shows as example only the X axis.
Results 12.3.2
+z +z
frequency window
With a gradient applied, a linear frequency deviation over distance results providing
a Hz/mm relationship.
A If the phantom is centered within the scan volume, the center of its signal
spectrum will correlate with the center of the frequency window defined by the
applied gradient. The magnetic center of the gradient coil defines the iso-center of
the scan volume.
B If the phantom is off-center, its signal spectrum will not be centered to the
frequency window. The deviation from center in mm can be derived from the
correlation of frequency per mm value known from the gradient amplitude in mT/m.

The results of the Z axis measurement is used to determine the Phantom Position
table position and will be corrected automatically and stored as the Value Low Spec High Spec

new light marker distance. All three phantom position values are X Position -3 -5 5
displayed in a table, shown in the table in the graphic. Corrections Y Position 4 -10 10
necessary in the X direction are made by re-positioning the Z Position 3 -2 2
phantom. Corrections in the Y axis may be made by adjusting the
table height with SY0 (described in the TSG). Phantom is not centered in z-direction!
Moving patient table by -2 mm.
Correcting patient table distance by 2 mm to 899 mm.

311
Tune-Up / QA - Gradient Related Tune-Up
 12
312

Phantom Shim 12.3

Figure 227 The 3D - Shim Sequence
Phantom Shim measures magnet field inhomogeneities and
calculates the gradient offset and shim coil currents (option) Next
necessary for optimization. It is performed at this point in the Tune
Up set as preparation for the following procedures using the ball
phantom for measurement. The correction currents determined
here also serve as default values for the pre-sequence adjust shim

32 voxels
procedure used for patient imaging.

els
Background

vox
12.3.31

The phase of an MR signal is directly proportional to the magnetic

32
field. Phantom Shim makes a 3D-measurement, a so-called "Field 32 voxels
Map" of the measurement volume using a 32 x 32 x 32 voxel
matrix covering a 35 x 35 x 35 cm volume. The resulting voxel 3D DESS Sequence
volume is about 0.5ml and the voxels are cubes, so the resolution TE1
TR
is isotropic. An advantage with this method is in having actual field TE2
values for each of the voxels and allows the user to define a
TX/RX
specific volume within the measurement volume that is to be PSIF FISP
optimized. This is called local volume shimming. Also, the
evaluation algorithm detects voxels with little or no signal and will
32
not use the data for correction improving the optimization. GS

To avoid hardware anomalies (e.g., gradient delays or array coil

phase errors) it is better to do the measurement with two echo 32
GP
times and examine the phase difference of both measurements. To
save time the two echo times can be measured in one sequence 32 ADC samples
using a 3D-DESS-sequence (Double Echo Steady State). The GR
measurement is done twice, for the second measurement all
gradients are reversed to eliminate eddy current effects.
PhaseGR

Phasestatic

inphase condition Fat - water

Fat - water
Measurement
Shim System Check
First, an operational check of the shim hardware is made. A
nominal shim current is applied to each shim channel followed by a
shim measurement and the actual field change effect is compared
to the expected, predicted field change effects. In this way wrong
cabling, wrong polarity, open or short coils can be detected.
Field Map
The sequence is a 3D-DESS-sequence, i.e. two echoes, a FISP and
a PSIF echo are generated. The echo times - 4.7ms - are so
chosen, that fat and water are in phase, hence, the sequence is
prepared for patient use as well.
As seen in Figure 227 the Phase GR line represents the phase
rotation due to the readout gradient and the Phasestatic is the
phase rotation due to the static field inhomogeneities which is the
factor we are looking to determine.
Chemical shift (Fat - Water) = 3.35ppm. We operate with 1.5T:
3.35 * 63.6 MHz / 10**6 = 213Hz.
1/213Hz = 4.7ms.
Evaluation
For 1.5T systems the echo time difference of FISP and PSIF signals
is 9.4ms. This has the shortcoming, that the true absolute off
resonance-frequencies cannot be analyzed: Due to the Nyquist-
theorem the highest frequency, which can be analyzed correctly is
only
1/9.4ms = ± 53Hz
However, for the check and optimization of the B o -field it is
sufficient to compare the field differences between neighboring
voxels. The field difference is obtained by comparison of the phases
of the magnetization vectors. With an echo time difference of
9.4ms a shift of 10 degrees from voxel to voxel in one direction
12.3.32
results in a linear homogeneity of about 9µT/m in that direction.
The complete data set is evaluated by a differential shim equation.
The equation minimizes the difference between:
12.3 .21
• the field generated by the three gradient coils and the 5 shim
coils
• the measured magnetic field inhomogeneities.
Figure 228 Phase rotation of magnetization vectors in the voxels
12.3 .2
Example:
Results
change of 5° per voxel
5° / voxel:
linear inhomogeneity of 4.4µT/m
10° / voxel:
linear inhomogeneity of 8.8µT/m
change of 10° per voxel
12.3.3
Numerically, the problem is a least square fit leading to a system of
many linear equations with 8 unknowns: the 3 gradient offset
currents and the 5 shim currents. In short: the comparison of the
B o -fields in two voxels - performed by analyzing the phases -
results in one equation. For all voxels 98304 calculations are
required. However, a threshold is set for the signal to noise: voxels
with no or little signal-noise ratio will be rejected, so the number of
equations is typically reduced to about 20000.
313
Tune-Up / QA - Gradient Related Tune-Up
 12
314

Results 12.3.34
Figure 229 Phantom Shim Results
The first table displays the measured field terms for each of the 8
terms that can be corrected. The 3 first order field terms and the 5 Field Terms Main
Menu
second order field terms that can be optimized are: Value Low Spec High Spec Unit

Bpp 2.02 ppm

Spherical Correction
Harmonic Field Device Brms 0.23 ppm

A10 0.67 -0.70 0.70 ppm

First Order Terms
A11 0.89 -0.70 0.70 ppm
A(1,0) Gz Z gradient coil
A(1,1) Gx X gradient coil B11 0.06 -0.70 0.70 ppm

B(1,1) Gy Y gradient coil A20 -0.05 -0.70 0.70 ppm

A21 0.04 -0.70 0.70 ppm
Second Order Terms
2 2 2 B21 0.03 -0.70 0.70 ppm
A(2,0) z - (x +y )/2 Shim Coil
A22 -0.00 -0.70 0.70 ppm
A(2,1) xz Shim Coil
B22 -0.01 -0.70 0.70 ppm
B(2,1) yz Shim Coil
2 2
A(2,2) (x -y )/2 Shim Coil
B(2,2) xy Shim Coil TU Gradient Offsets Table
Old New Change

Pos. 1 The following two tables give the correction currents for Value Unit Value Unit Value Unit

the gradient and shim coils. The gradient offset current are Gx 0.0011 mT/m -0.0035 mT/m -0.0045 mT/m
expressed in mT/M and the shim coil currents in mA. Gy -0.0041 mT/m -0.0044 mT/m -0.0003 mT/m
Gz 0.0030 mT/m -0.0011 mT/m -0.0041 mT/m

Expert Mode 12.3.35

QA Shim Currents Table

No extra functionality is provided by the Expert Mode for either
Tune-Up or QA Old New Change

Value Unit Value Unit Value Unit

A20 -10 mA -2 mA 8 mA

A21 43 mA 29 mA -14 mA

B21 -29 mA -140 mA -11 mA

A22 -455 mA -454 mA 1 mA

B22 -13 mA -9 mA 4 mA
Cross Term Compensation (CTC) 12.34 Figure 230 Cross term Currents
An applied gradient field in any axis produces not only eddy
currents along that axis, but also small amounts of eddy currents Crossterms Main
Menu
are coupled over the conductive magnet components onto the
other two axis’, the so-called cross terms. The CTC (cross term Crossterm
sterm
erm currents
compensation) procedure measures the eddy currents created by
the cross terms. Compensated is made by pre-distortion of the
gradient waveform. Cross term amplitudes can be up to 0.2% of Y
the main applied gradient amplitude. Unlike the main eddy
currents which are complicated and need to be modeled with 5
time constants, the Cross Term current decay exponentially in time
in general with only one time constant. X
Main
nZ
gradient
radient
ient

Measurement 12.3.41

conductable
conductab
d bl magnet
b magne
The procedure measures the decay of the eddy currents caused by Gradient Coil parts (bore
(bore, shields)
the cross terms. Amplitudes and time constants of the eddy current
contributions are then calculated. The compensation is
straightforward: gradient fields of equal and opposite amplitude
and time constants to the measured cross terms are applied Cross Term Fit Results: Cross Term Fit Results:
perpendicular to the main applied gradient field. The result is a Z-Gradient X-Compensation Z-Gradient Y-Compensation
much cleaner main gradient with very small residual cross terms 0.005 0.03

improving the final image quality.

Compensation [%]

Compensation [%]
0 0.025

-0.005 0.02

Result 12.3.42
-0.01 0.015

-0.015 0.01
The amplitude and time constants if the compensations are -0.02 0.005
displayed graphically and in tabular form. Only the Z axis is shown. -0.025 0
0 0.5 1 1.5 2 2.5 3 0 0.5 1 1.5 2 2.5 3
Delay [s] Delay [s]

Expert Mode 12.3.43

The CTC can be made individually for each axis. Cross Term Fit Results for Z-Gradient

Amplitude Time Constant

Orientation X gradient
Value Unit Value Unit
Y gradient
Z gradient X Compensation -0.0246 % 0.388 s

Y Compensation 0.0293 % 0.505 s

315
Tune-Up / QA - Gradient Related Tune-Up
 12
316

Eddy Current Compensation (ECC) 12.35 Figure 231 Eddy Current Measurement
The dynamic gradient fields produce currents (called eddy magnet
currents) in all the surrounding conductive structures, mainly the Eddy currents Next
Body Coil, magnet bore and the cryo-shields. The eddy currents
produce in turn magnetic fields which oppose and distort the cryo-shield

applied gradient fields. Eddy currents in the warm components

(Body Coil and Magnet bore) have relatively short decay times,
whereby eddy currents developed in the cold cryo-shields can have I
+50 -50
relatively long time constants.
gradient field
T h e e d d y c u r r e n t s h a ve t o b e a c c u ra t e l y q u a n t i f i e d a n d
characterized by their time constants and amplitudes to achieve a
good compensation. The compensation is made by adding the Gradient Coil
reciprocal of the measured eddy currents to the gradient pulse thus
neutralizing their effects. For accurate compensation 5 time
constants are used.

Spatial Dependency of Eddy Currents 12.35.01

Experience has shown, that for smaller slice shifts it is sufficient to conductable magnet

express the eddy fields into a 0th and a 1st order term.
parts (bore, shields)

Term Description
Applied signal Resultant signal
0th This term arises from an asymmetry of the gradient coil with
respect to the magnet bore and cryo shields. This term is space
independent and present in the complete imaging volume and
adds to the nominal Bo-Field. The amplitude (x) is given in the no ECC
unit µTm/mT. The time constant of the most significant 0th term
component is about 500ms, although there are shorter time
constant components as well.
1st This is the most important term as it has the same symmetry as
the gradient field itself. The amplitude is given in % of the Eddy current
applied gradient pulse. energies

2nd or There are also high ordered eddy currents present, they are
above usually small and negligible as long as the slice shifts and off
center zooms are not too large. No compensation for the high
order eddy currents can be made.
with ECC
Measurement 12.3.51
Figure 232 Eddy Current Measurement
F irst , th e phant om ce nte r posi ti on is ch ecked. Th e sam e
preparation measurement is used as for Phantom shim, however, Next
the small spherical phantom is used. If the phantom is not
correctly positioned the measurement stops with an error.
The sequence for the measurements generates 23 spin echoes with Amplitude

delay times between 0.4 ms to 9000 ms of the applied gradient.

The measurement is made at the moderate slice shifts of ±5 cm to Eddy currents
prevent contributions from higher order terms. 8mT/m

V1: Training Center File: ecct_prep.dat

-------------------------------------------------- 2-5s
t
2006-12-14 10:22:17 Sequence: eddyprep
Gradient: Echoes: 12 Points: 256 * 30us Sample time

Slice Grad Shift Frequ Ampl1 SN Points Pos Ampl2 SN 180°

[mm] [Hz] [mm] 90°
-------------------------------------------------------------
1 X -50 4 12199 354 254 2 25943 402 t
2 X 50 -2 11018 393 254 0 24383 486
3 Y -50 -7 11084 315 254 -3 26051 550
4 Y 50 8 11999 291 254 -2 27071 546
5 Z -50 -4 10365 347 254 3 23582 516 Measurement of Short Eddy Currents
6 Z 50 5 11917 298 254 2 25538 460
-------------------------------------------------------------
Phantom Position: X:-2.7mm Y:-0.8mm Z:-2.7mm
Tolerances: 5.0mm 5.0mm 3.0mm Amplitude 4.4ms

8mT/m

2-5s Delay 8ms - 9s t

Sample time

180°
90°

Measurement of Long Eddy Currents

317
Tune-Up / QA - Gradient Related Tune-Up
 12
318

Evaluation 12.3.52

After a measurement - usually two or three iterations are required V1: Training Center File: ecct_x1.res Next
before the final optimization - the measured data is displayed in a --------------------------------------------------
table found in the log file. The first table (not shown) lists the 2006-12-14 10:23:23 Sequence: eddy
Gradient: X 8.0mT/m 400us Hardware: 1
a c t ua l m e a su r e d d a t a a t p o s it i o n + 5 0 m m f r o m th e f i r s t Echoes: 23 Points: 1024 * 10us
measurement. The second table lists the measured data for the -50 Gradel: 14us Ref.Freq: 34061.0Hz
mm position. The third table, shown at right, gives the combined Position 1: 50.0mm Position 2: -50.0mm
results of both.
Nr. Delay Gradient B0
[ms] [Hz] [%] [Hz] [uTm/mT]
Header 12.35.21
----------------------------------------------
( 1 0.38 2182.7 6.408 35.8 0.105)
There is some basic information given in the header (top section). ( 2 0.55 2147.3 6.304 34.2 0.100)
For example, the sequence generated 23 spin echoes. The delay 3 0.81 2119.2 6.222 33.2 0.097
times can be seen in the list and are between 0.4 ms to 9000 ms of 4 1.18 2113.4 6.205 33.0 0.097
the applied gradient. The gradient amplitude is 8 mT/m, the spin 5 1.71 2105.9 6.183 35.2 0.103
6 2.47 2101.8 6.171 37.5 0.110
echoes are generated in 3 mm slices with slice shifts of +50 mm 7 3.58 2089.5 6.135 36.3 0.107
and -50 mm. Hence the gradient amplitude in the slices is: 8 5.17 2073.2 6.087 32.7 0.096
±8 mT/m · 0.05m = ± 0.4 mT 9 8.57 2038.5 5.985 32.3 0.095
10 12.97 2007.6 5.894 29.7 0.087
corresponding to a frequency of 11 18.47 1974.3 5.796 28.8 0.084
12 26.62 1932.4 5.673 26.9 0.079
±0.4 · 10-3 · 42.577 · 106 Hz = ±17031 Hz 13 37.68 1883.8 5.531 25.4 0.075
14 53.76 1822.7 5.351 24.4 0.071
at the slice position +50 mm or - 50 mm resulting in an overall 15 76.87 1744.6 5.122 23.4 0.069
frequency of 34062 Hz. This frequency will be displayed as Ref. 16 111.05 1637.6 4.808 21.8 0.064
Frequency. 17 159.27 1497.5 4.397 20.1 0.059
18 230.29 1310.3 3.847 18.0 0.053
Signal Nr. 1 is measured for frequency offset. Signal 2 is measured 19 331.29 1079.2 3.168 15.4 0.045
to correct for the eddy currents generated by the slice-select 20 477.29 810.3 2.379 12.4 0.036
21 688.29 532.7 1.564 8.9 0.026
gradient (measurement of long delays). 22 993.29 292.7 0.859 5.6 0.016
The data for a given delay time will be rejected if the amplitude 23 1433.29 139.7 0.410 2.5 0.007
24 2069.29 57.3 0.168 0.4 0.001
"Ampl" is less than a given threshold-value. "Points" in the last 25 2988.29 21.5 0.063 -0.2 -0.000
column means the number of ADC-sampling points for the given 26 4315.29 7.1 0.021 -0.1 -0.000
signal. The shorter the delay time after the gradient, the shorter 27 6232.29 1.9 0.006 0.2 0.000
must be the total sampling time and hence the number of sampling 28 9002.29 0.3 0.001 0.3 0.001
--------------------------------------------
points.
After the sequence was run for the two slice positions + 50 mm
and - 50 mm the data first will be added up and then subtracted in
order to separate the 0th order term and 1st order term.
Results 12.3.53
Figure 233 ECC Measurement Results and Specifications
The program will then calculate:
Main
Gradient Compensation (1st order term) Results of First Measurement Menu
12.35.31

7 0.12
=========== Gradient Compensation for X ========== Gradient B0
6 Fit 0.1 Fit
Current Param. Change Suggested Param.

Gradient [%]

Gradient [%]
5 0.08
Time[s] Amp[%] Time[s] Amp[%] Time[s] Amp[%]
-------------------------------------------------- 4 0.06

1.982741 0.25|-0.068626 0.03| 1.914115 0.28 3 0.04

0.409179 7.49|-0.000460 -0.01| 0.408719 7.48 2 0.02
0.263029 -1.45| 0.005060 -0.01| 0.268090 -1.46 1 0
0.012902 0.41| 0.000000 -0.00| 0.012902 0.41 0 -0.02
0.002000 -0.05| 0.000000 0.01| 0.002000 -0.05 0.001 0.01 0.1 1 10 0.001 0.01 0.1 1 10
-------------------------------------------------- Delay [s] Delay [s]
Overshoot = 6.64 % Fit Quality = 0.103916
X Gradient B0

In this example the overshoot tells us that the initial gradient

Range Value Spec Unit Value Spec Unit

amplitude has to be 1.13% higher than the normal value without

<10ms 6.222 0.0 - 0.1 % 0.110 0.0 - 0.1 uTm/mT

eddy current compensation. For the Fit Quality the RMS-value is >10ms 5.894 0.0 - 0.1 % 0.087 0.0 - 0.1 uTm/mT

given. 2-100ms 1.049 0.0 - 0.04 % 0.041 0.0 - 0.03 uTm/mT

B0 Compensation (asymmetry) 12.35.32

Results of Final Measurement

============== B0 Compensation for X ============= 0.015 0.008

Gradient B0
Current Param. Change Suggested Param. 0.01 Fit 0.006 Fit
Time[s] Amp[%] Time[s] Amp[%] Time[s] Amp[%]
0.005 0.004
--------------------------------------------------
0.002
0.509204 0.09|-0.014494 -0.00| 0.494710 0.09 0
0
0.007394 0.05| 0.000255 -0.00| 0.007650 0.05
-0.005
0.000499 -0.14| 0.000017 0.03| 0.000516 -0.11 -0.002
-------------------------------------------------- -0.01 -0.004
Overshoot = 0.09 % Fit Quality = 0.069140 -0.015 -0.006
0.001 0.01 0.1 1 10 0.001 0.1 1 10
Delay [s] Delay [s]

The first plot of the uncompensated eddy fields shows a smooth

X Gradient B0
curve. The next measurement will establish already a large
improvement. Range Value Spec Unit Value Spec Unit

<10ms 0.009 0.0 - 0.1 % 0.006 0.0 - 0.1 uTm/mT

The final iteration, usually after 2 or 3 measurements, shows an >10ms 0.0 - 0.1 % 0.0 - 0.1 uTm/mT
0.013 0.004
oscillating pattern indicating the eddy-fields have become smaller
2-100ms 0.011 0.0 - 0.04 % 0.006 0.0 - 0.03 uTm/mT
than the measurement system is able to resolve.

319
Tune-Up / QA - Gradient Related Tune-Up
 12
320

Coil Power Losses (CPL) 12.36 Figure 234 Coil Power Loss Measurement
The purpose of this procedure is to measure the amount of power
loss of the Body Coil. This value is used by the RF-Safety Watchdog Coil Power Loss Measurement
Main
Menu
(RFSWD) monitor to achieve a more accurate SAR measurement.
Adjust Transmitter
Measurement 12.3.61
180° flip angle
A complete inline adjustment with a non-volume-selective
RFPA TAS BCCS TALES BTB BC
frequency adjustment is performed, followed by a transmitter
adjustment. The voltage from the Adjust/Transmitter result is used TX Small Ball
phantom
to calculate the reference power: Module

Reference Power from TALES = (Voltage from Adj/Tra)2 / 50 Ω.

The small spherical phantom is necessary because of the reduced CV Ref Power
RX
losses in the phantom and the dielectric resonances. Module MR_Signal Phantom check
A subsequent measurement is made only to verify that the small LCCS
(17cm diameter) spherical phantom is used and that is it centered.

Evaluation 12.3.62

Phantom Center
The measured reference power from the TALES is checked. Low
Value Low Spec High Spec Unit
Spec = 250 W, High Spec = 630 W. If an oil-filled 170 mm phantom
Phantom Center X -2.67 -20.00 20.00 mm
were to be used the low specification might not be reached or if the
body loader phantom is in the magnet the high specification might Phantom Center Y 2.81 -20.00 20.00 mm

be exceeded.
Phantom Diameter
Value Low Spec High Spec Unit
Results 12.3.63

Phantom Diameter X 169.97 150.00 190.00 mm

The value for the Coil Power Losses is calculated: CPL = Reference Phantom Diameter Y 170.01 150.00 190.00 mm
Power from TALES * (1 + σ), where σ is a correction factor taking
into account electrical conductivity of the phantom fluid and Ref Power from TALES
dielectric resonance effects. The factor σ is greater than 1 so the
Name Value Low Spec High Spec Unit
Coil power loss value is larger than the measured reference power.
Ref Power from TALES 422.98 250.00 630.00 W

Coil Power Losses result 507.57 W saved

Gradient Delay 12.37
times with different gradient strengths, i.e. high gradient pulses
may be different from low amplitude pulses. If the tolerance is
The gradient amplifiers have a delayed response time (tnom to tact), exceeded, this indicates some kind of nonlinearity in the gradient
due mainly to the coil inductance and is slightly different for each system.
of the three gradient axis. The Gradient Delay measurement
determines the delay time for each gradient axis. A precise timing
of gradient pulses and RF is very important for good image quality. Results 12.3.72

The new delays and maximum deviation values are displayed in

Measurement 12.3.71
two separate tables. If the procedure was successful, the values
will be saved.
The measurement uses a Spin-Echo-sequence without phase
encoding, hence only one line is measured. The gradient to be
tested acts as the readout gradient and is switched on once Expert Mode 12.3.73

between the 90°- and the 180°-pulse and then again during the No extra functionality is offered in the expert mode.
readout time of the spin echo.
The first gradient pulse causes a dephase of the magnetization
vector in the direction of the gradient axis. The amount of dephase
is proportional to the time-amplitude integral of the gradient pulse.
Subsequently, a 180° refocusing pulse is applied normally resulting
in a spin echo at TE/2 time later. However, due to the dephasing of
the vector by the first gradient pulse, the echo will only land in the
center of the ADC window (which is also centered exactly around
the TE time point) when an equal rephasing gradient has been
applied at the proper time so that the rephasing is finished at the
center of the ADC cycle.
For a non-corrected gradient delay the two gradient pulses are
time-delayed. This does not influence the dephasing effect of the
first gradient pulse, however the delayed second gradient pulse
causes a rephasing delay and thus a time-delayed echo signal.
From the echo signal delay and the gradient amplitude the system
can calculate the required correction time.

Deviation Check 12.37.1

Each gradient is measured at three different gradient strengths -

1.5, 4 and 8 mT/m - giving three gradient delays for each gradient.
For an ideal gradient system, all delays should be the same.
The Max. Diff. Deviation is the maximum difference of the delay

321
Tune-Up / QA - Gradient Related Tune-Up
 12
322

Figure 235 Gradient Delay Measurement and Results

Gradient Delay Measurement Main

Menu
The RF and ADC events have been New Gradient Delay Values
advanced in the sequence by 300µs
Value Low Spec High Spec Unit
giving the gradients a 300µs window
TE X Gradient Delay 16.000 0.000 300.000 µs

Y Gradient Delay 14.000 0.000 300.000 µs

RF Z Gradient Delay 12.000 0.000 300.000 µs
t
TE/2 Max Diff Deviation
7680µs
ADC Value Low Spec High Spec Unit

Max diff deviation X 2.000 0.000 5.000 µs

300µs
Max diff deviation Y 0.000 0.000 5.000 µs
window
Max diff deviation Z 1.000 0.000 5.000 µs
90°_On 180°_On ADC_On
Sequence
GR_On GR_On t
New Gradient Delay values saved

Dephase Rephase
GR
Uncompensated t
missing
delay

Dephase Rephase
GR
Compensated t
echo
7680µs maxima

300µs
Gradient Sensitivity 12.38
sequence with a TR = 50 msec, TE = 10 msec. The sequence is run
three times, one for each orientation. For the sagittal orientation
The purpose of this measurement is to establish the actual LSB the usual orientation of the readout and phase encoding gradients
weighting (sensitivity) of the gradient amplifier so that accurate are swapped.
gradient field strengths can be calculated assuring accurate FoV
(image size).
Evaluation 12.3.82

Nominal Sensitivity 12.38.01

The 24cm phantom is measured and checked initially for size and
The nominal sensitivity is simply the maximum gradient strength of center.
the Gradient System (amplifier and coil) divided by the digital Results
resolution of the DAC. In the example below, the gradient system
has a maximum 30 mT/m field strength and an 18-bit DAC, Afterwards the three values for the gradient sensitivity will be
whereby 17 bits is the dynamic range since 1 bit is used for polarity stored in the status file.
(it is a ±10V DAC). This gives a nominal sensitivity of 0.229 µT/m. In addition, the Grad Sens program is used to determine the
The first Gradient Sensitivity measurement will use this value. As distance from the light marker to the gradient coil center.
can be seen in the first image results, the phantom has the shape
of an oval.
Expert Mode 12.3.83

Actual Sensitivity
In Expert Mode, the Grad Sens procedure operates similar except
12.38.02

The actual sensitivity, however, will depend on the characteristics that the results are not written into the database.
of the DAC, the amplifier and the coil. In order to determine the
actual gradient sensitivity an object of known diameter (the
large 24 cm spherical phantom) is measured using a 500 FoV. and
the resultant image evaluated and the actual phantom diameter
determined. The actual sensitivity is the old value time the
correction factor which is determined by dividing the nominal
phantom diameter with the actual measured image diameter.

Table Distance 12.38.03

During this procedure the patient table distance - the distance from
the light localizer to the iso-center - is also measured (again, it was
first measured some steps ago) and, if necessary, automatically
corrected. If a correction is necessary the measurement is
repeated.

Measurement 12.3.81

The gradsens sequence is a standard Gradient Echo (FLASH)

323
Tune-Up / QA - Gradient Related Tune-Up
 12
324

Figure 236 Gradient Sensitivity Measurement and Results

Main
Gradient Sensitivity Menu

30mT/m Gradient Coil

GPA
FoV = 350 mm
DAC 0.78V Amplifier
18 Bit*
24 cm Phantom Position
27EF D
Phantom f = 22.8 kHz PhaseEnc ReadOut Average
A m
T/ Value Unit Value Unit Value Unit
±10V 3m
2.2 X Position -0.5 mm -0.5 mm -0.5 mm

* 17 bits & one polarity bit Y Position +3.5 mm +3.6 mm +3.6 mm

Z Position +3.3 mm +3.5 mm +3.4 mm

Sequence:
PBW = 130 Hz Phantom Diameter
Default MA = 256
30mT/m FoV = 350 mm PhaseEnc ReadOut Average
Sensitivity =
217 PBW * MA * 1/FoV Value Spec Unit Value Spec Unit Value Spec Unit
GR =
= 0.229µT/m (LSB) 42.577 Diameter X 240.4 238 - 242 mm 239.9 238 - 242 mm 240.1 238 - 242 mm

GR = 2.23 mT/m Diameter Y 240.0 238 - 242 mm 240.3 238 - 242 mm 240.1 238 - 242 mm
Diameter Z 241.3 238 - 242 mm 239.5 238 - 242 mm 240.4 238 - 242 mm

Image
Gradient Sensitivities
Actual Sensitivity =
Current New
f Actual
?
New Value = Old value Value Unit Value Unit
f Nominal
Sensitivity X 0.000229 mT/m 0.000265 mT/m
By a fresh installation the “Old value” is Sensitivity Y 0.000229 mT/m 0.000276 mT/m
the default value of 0.229µT/m) ?
Sensitivity Z 0.000229 mT/m 0.000272 mT/m

Saving new gradient sensitivities to GPA.

Moving patient table by -3 mm.
(2.23mT/m * 0.24m ) * 42.577MHz = Df nominal in kHz
Correcting patient table distance by 3 mm to 899 mm.
Receive Path Calibration
The receiver system was designed to support the Integrated
Panoramic Array technology which allows the combined use of
multiple coils simultaneously. There are 16 receive lines from the 4
table connectors to the switch matrix on the LCCS. The switch
matrix can switch any of the 16 inputs to any one of the 8 outputs.
Each output goes through a switched-gain amplifier and over
receive cables of varied lengths (between 7 and 20 meters) to
the receive modules containing the ADCs. Since any coil element
can be switched through the LCCS matrix to any ADC in any of the
receive modules it is necessary to calibrate every receive path so
12.4
independent of the ADC you are using (with preamplifier switched
to high gain).
T h e R e c e i v e r G a i n C a l i b r a t i o n f a c t o r c h a ra c t e r i ze s t h e
preamplifier belonging to an ADC. The preamplifier can be switched
to high and low gain. The absolute value of the
ReceiverGainCalibra ti on factor describes the ratio of th e
magnitudes of the high and low gain signal.
The phase factor describes the phase difference of the high and
low gain signal.
Expert Mode
12.4.02

that the same image brightness for a given coil element will be In Expert Mode, the Receive Path Calibration (only for the head
achieved independent of the receive path used. The factors that coil) operates similar except that the results are not written into
will influence the MR signal from a coil, in amplitude or phase, are the database. For all other coils the standard procedure Image
highlighted above in bold letters. brightness is available.
This procedure replaces the former Coil Tune-Up procedure (aka,
image brightness adjustment) that had to be performed for EVERY
installed Local Coil (AdR: which was very time consuming).

Measurement 12.4.01

The Receive path calibration is performed with the CP Head Array

coil large bottle phantom.
The image brightness and the signal to noise ratio (S/N) is
determined first. The receiver scale factor of the first receiver
channel is determined by evaluating the image brightness. The
scale factors of all other receiver channels are adjusted by
evaluating the raw data amplitudes. The scale factors are
necessary to correct the differences of the amplification of each
receiver. In addition a complex factor is calculated for each receive
path, by measuring the relation of the raw data signals for receiver
high gain and low gain.
The ReceiverChannelCorrection factor compensates the
different sensibilities of the individual ADC’s. This means that you
will get the same brightness for a given phantom and coil element,

325
Tune-Up / QA - Receive Path Calibration
 12
326

Figure 237 Receive Path Calibration Measurement and Results

Main
Menu

LCCS SGA
A RxChanCorr
1
Factor
Switch D 1. Rx
A Mod RxChanCorr
Matrix 2
D Factor
1
2 A RxChanCorr

Image Reconstruction
3
D 2. Rx Factor
A Mod RxChanCorr
4
D Factor

A RxChanCorr
3 5
D 3. Rx Factor
4
A Mod RxChanCorr
6
D Factor

A RxChanCorr
7
D 4. Rx Factor
A Mod RxChanCorr
8
D Factor
Cable attenuation
(8.5 - 20 m)

SGA Gain and Phase Values

Im High gain

Low gain

Re
Quality Assurance 12.5
Main
Menu

Coil Check 12.51

This procedure replaces the former SN DIP used for the coil-QA and
determines:
• Signal to noise ratio S/N
• Image brightness
• Image uniformity (inhomogeneity)
for the Body coil and all LC-coils except the Head-coil.

One or more protocols have been defined for each coil. After each
protocol is measured, the routine will analyze the resulting image
or images for S/N and in some cases the image intensity profile
and image size. For transmit-capable coils the specific absorption
ratio (SAR) is checked as well.
In standard mode and for coils where only one phantom position is
necessary, the SN_DIP procedure performs all required SN_DIP
protocols without user intervention. If more than one protocol is
required, the procedure measures and evaluates each image from
the protocol before continuing with the next protocol. For coils that
require more than one phantom position to perform all the required
SN_DIP protocols, the user will be guided on screen through the
various phantom positions.

Expert Mode 12.5.1

Expert Mode lets the user select the protocols to be performed. A

list of available protocols is displayed. Any combination of protocols
can be selected. When selecting Start from the QA platform, the
selected protocols will be performed.

327
Tune-Up / QA - Quality Assurance
 12
Image Orientation
The 6 electrical connections of the Gradient Coil are checked here.
If any of the amplifier or coil connections are swapped between two
(or more) axis or any of the polarities of any axis is swapped, the
orientation of the image will not be correct. This procedure will
determine if the connections are correct and if not, which ones are
or could be wrong.
The check for correct gradient coil connections is performed in two
steps:
• First, for swaps between the three axis (x to y, y to z, etc.).
• Second, for correct polarity of each axis.
The Image Orientation procedure measures the position of the
loaded phantom and the spherical phantom in order to determine
the correct gradient orientation and polarity.
Measurement
With the first image the correct connection of the gradient cables
(x/y/z axis) are tested; with the second image the correct polarity
of the gradient currents is checked.
Because the image of the loader is not symmetrical with respect to
interchanging of gradient axes, an exchange of gradient axes (i.e.
wrong cable connections) can be detected.
Incorrect gradient polarity can be detected by identifying the
unsymmetrical cap of the spherical phantom.
In case of incorrect gradient axis orientation, polarity or positioning
of the phantom, the procedure is finished with "error".
Evaluation
The two measured images are automatically evaluated following
the measurement.
Axis swap
The program searches for the outer edges of the loader phantom
328
12.52
from all sides and compares it to the expected geometry.
In dem gemessenen Bild wird von allen Seiten von außen die Kante
des Loaders gesucht. Hierbei wird in der Richtung senkrecht zur
Suchrichtung über mehrere Pixel gemittelt. Eine gefundene Kante
wird nur als Loader akzeptiert wenn sie mehrere Pixel breit ist.
Dadurch wird eine sehr sichere Erkennung des Loaders
gewährleistet.
Bei korrekter Erkennung des Loaders, wenn alle Kanten gefunden
wurden und mit der erwarteten Geometrie übereinstimmen (Fall A)
geht das Programm zur Messung der Verpolung.
Bei fehlerhafter Erkennung des Loaders (nicht Fall A) wird das Bild
weiter ausgewertet um die vertauschten Gradientenachsen zu
identifizieren (Fall B - F). Danach bricht das Programm ab, da eine
Verpolungserkennung nur sinnvoll ist, wenn keine Vertauschung
vorliegt. Nach der Korrektur der Vertauschung muss das Programm
dann erneut gestartet werden.
12.5.21
The images and error messages can be displayed by clicking
Reports and selecting the corresponding procedure in the Session
History Log or by selecting the corresponding log file under QA.
Expert Mode 12.5.23
The only difference in Expert Mode is that no data are written into
the database.
QA Results
The two images measured can be loaded and displayed in the
HTML/XML output page.
Image windowing is done by clicking and dragging the mouse or by
direct input of image window and center values.
12.5.2
12.52.21
Figure 238 Image Orientation

Main
Axis Swap Examples: Menu
GPA Coil ART COR ROC SAG GAS

X
X Filter X

Y x>y x>y x>z x>y x>z

Y Filter Y y>x y>x y>x y>z y>y
z>z z>z z>y z>x z>x
Z
amplifier > coil ART = TRA swapped
Z Filter Z

Image Orientation Sequence Polarity Swap Examples:

Axis Swap Polarity Swap

T > S -45 deg T > S -45 deg T > S -45 deg
Ori: Transversal Ori: Oblique Tra > Sag -45°
FoV: 500 FoV: 300
A
R

F H F H T > S +45 deg T > S +45 deg

x&y x&z y&z x&y&z

L
P
x swap y swap z swap
Correct image results:
Image Orientation check failed!

The location of the phantom filling opening was identified in the wrong direction.

The _ and _ axis might be ok.

The _ axis may have wrong polarity.

Loader phantom and large ball phantom are used.

329
Tune-Up / QA - Quality Assurance
 12
330

Calculation Artefacts 12.53

Calculation Artefacts is a program that generates actual images Main

Menu
and analyzes the quantity of ghosts/artifacts outside the phantom.

Physical Background 12.5.31

Artifacts in MR images are produced by a variety of mechanisms.

For example, gradient deficiencies (instability, non-linearity, 50/
60Hz ripple, or RF instabilities) produce periodic blurring or
ghosting in the direction of the phase encoding gradient.

Measurement 12.5.32

A double-echo sequence with preceding in-line adjustments

followed by image reconstruction for the three slice orientations
with slice shift 0 is used. One measurement is performed for each
selected orientation.
The transverse orientation is performed first, followed by the
sagittal measurement and the coronal measurement. (Note: for
the SAG slice orientation, the z-gradient is used as phase encoding
gradient.)

Results 12.5.3

The measured images will be loaded and displayed. Image

windowing is done by clicking and dragging the mouse or by direct
input of image window and center values.

Expert Mode 12.5.34

Expert Mode lets the user select the slice shift 0, 50 mm, and the
three slice orientations separately.
The Evaluate option allows to evaluate any image in the actual
segment for artifacts.
Spike Check
The Spike Check is a quick test to check the MR imaging system for
the occurrence of "spikes" and RF interference. The raw data is
evaluated by a program that detects and identifies spikes. The
image data is evaluated for RF interference.
Physical Background
Electrostatic sparks during measurement can generate some
"spikes" within the raw data. "Spike" means individual raw data
points or small groups of raw data points with amplitudes above
the typical noise level of the MR imaging system. Spikes can
degrade the MR imaging quality. In this case, the signal-to-noise
ratio can be reduced or the image can show a periodic intensity
modulation or structure.
One typical source of spikes is the mechanical and electrostatic
stress of the MR system caused by the operation of the gradient
system.
A simple way to check the MR system for spikes is to run a noise
measurement. This is a measurement that will not generate an MR
signal, but instead pure statistical noise.
The spike sequence generates mechanical and electrostatic stress
by switching the gradient system rapidly within the raw data
acquisition period with maximum gradient strength as well as
running through tables covering a wide range of different gradient
amplitudes. This sequence applies no RF-pulses and therefore
generates no MR signal.
Expert Mode
The Spike Check in Expert Mode is similar except that no results
are written into the database.
An additional Sequence Advanced Spike is offered:
TRUFI and HASTE-sequences and special sequences used e.g. for
12.54
EPI or BOLD-Imaging generate spikes, which cannot be verified by
the normal "Spike Check". In these cases use the procedure
"Advanced Spike" for spike trouble shooting. The "Advanced Spike"
should be repeated at least three times - than the system has to be
free of spikes.
Results
12.5.43
12.5.41
The measured raw data and RF-interference images will be loaded
and displayed. Image windowing is done by clicking and dragging
the mouse or by direct input of image window and center values.
The same algorithm for spike searching is applied to both image
data and raw data. In case of image data (RF-interference in the
image), the spikes are RF-interference patterns that have been
picked up during the noise measurement and then fourier
transformed resulting in a spike in the image data, i.e. the RF-
interferences will result in pixels of increased intensity in the image
data.
Clicking Log-File in the HTML output page lets you open additional
windows displaying the Spike Check results:
• Total number of spike positions
• Number of spikes found in real and imaginary part
• Number of spikes correlated in real and imaginary part
• Position (column, row) of spikes
• Amplitudes of spikes in real and imaginary part
• Magnitude of the highest spike
• Threshold for spike discrimination
12.5.42 Main
Menu
331
Tune-Up / QA - Quality Assurance
 12
Stability Check
The Stability Check evaluates the stability of the MR signal under
various sequence conditions. A spin echo and a gradient echo are
m e a s u r e d w i t h o u t p h a s e e n c o d i n g u s i n g f i xe d s e q u e n c e
parameters. Therefore, all raw data lines should look alike. The
stability of the echo signal over the measured lines is evaluated. In
standard mode, all three orientations are measured so that each
gradient is performed as a read-out gradient. In addition, both 0
and +50 mm slice shift positions are measured.
Expert Mode
Expert Mode lets the user modify the default parameters. The
following selections are possible:
• Spin echo or Flash sequence measurement. The Spin echo
sequence is selected by default. This setting is exclusive, i.e.
for each Start performed in Expert mode, only one sequence
can be selected.
• Slice shift of 0 and +50 mm. Both are selected as defaults. If
no selection is made, a Start is not possible.
• Sagittal, coronal and transverse slice selection. All
orientations are selected as defaults, but any one, two or all
three can be selected. If none is selected, Start is not
possible.
In addition, the user can modify the TR and TE values from their
default settings. If the user selects a TR or TE value that is not
valid for the selected sequence, an error message is generated.
When selecting Start, the valid input ranges will be displayed.
The Evaluate option allows the user to evaluate the stability of the
last measurement.
The Evaluate File option allows the user to evaluate the stability of
a existing raw data file.
Results
The spin echo sequence is sensitive to instabilities in the range of a
332
12.5
few Hz up to 100 Hz which may be caused by 50/60 Hz line hum.
The gradient echo/flash sequence is sensitive from DC up to a few
Hz which may be caused by slow external field interferences, field
instabilities or mechanical vibrations.
The measurement result of the center slice is sensitive to
instabilities in the B0 Field, whereas the 50 mm offset slice is more
sensitive to gradient instabilities.
Amplitude Stability 12.5 5.21
The amplitude value in the column of maximum signal is displayed
12.5.51
in the graphical output.:
The phase shift of a spin echo is determined by the integral over
the magnetic field from 90° to 180° pulse minus the integral from
180° pulse to echo:
For a constant field or a slowly varying field, both integrals cancel
each other. However, for an oscillating field with a period of TE (20
ms = 1/50 Hz) this expression becomes maximum.
For the gradient echo sequence, the phase stability is evaluated by
fitting a straight line to the phase data. Subtracting the value of the
linear fit from the phase data results in the phase stability changes.
The slope of the straight line indicates the linear phase drift.
Main
Menu
12.5.52
Fat Saturation 12.56
Expert Mode 12.5.63

Fat saturation is used during MR imaging to suppress the fat signal The user can select the three orientations (TRA, SAG and COR)
while leaving the water signal unchanged. Since fat has an MR using this mode.
frequency 3.5ppm lower than water, this is achieved by applying a
low bandwidth RF-pulse to the fat frequency followed by spoiling Results 12.5.64

gradients. This requires good homogeneity in the imaging volume

in the order of 1-2ppm peak-peak to prevent that water is The images measured are loaded and displayed. Image windowing
saturated as well. In addition, the RF-flip angle of the Fat Sat pulse is done by clicking and dragging the mouse or by direct input of
should be about 90 degrees to get optimal results. image window and center values.
The degree of Fat Sat mainly depends on the shim condition. As a
Principle of Fat Saturation 12.5.61
r ul e , f o r a m e a n s a t u rat i o n rat i o o f 1 5 % , t h e p e a k- p e a k
homogeneity of the field has to better than 4ppm.
One requirement is to run the test with the standard water filled
body phantom. Since no fat signal is present, no real fat saturation
can be tested. However, physically it makes no difference to Main
saturate water instead of fat, only the frequency of the RF-pulse Menu
must be that of water.
First, a reference image is measured without any saturation. This
allows to determine the 100% signal level. This is followed by a
second measurement with water saturation. The quality of fat
saturation is now determined by the signal of the saturation
measurement divided by the signal of the normal measurement,
which should be as low as possible.

Evaluation of Measured Images 12.5.62

First, the normal image which shows the contours of the phantom
is analyzed. Position and diameters are calculated. Then, a region
of interest which is a circle of for example 80% (defined by status
file variable) of the phantom diameter is taken.
This region is now scanned into the normal image and into the
water saturated image, and the ratio of both signals is calculated
point by point. To reduce noise at every point, a 3x3 average over
neighbor points is done. Point by point saturation ratios are
calculated, resulting in a mean and a maximum value. These two
values are compared to specification.

333
Tune-Up / QA - Quality Assurance
 12
334

Synthesizer Check 12.57

The Synthesizer Check procedure is an important test to verify the
proper operation of the synthesizer. It is used to validate the
frequency and phase quality of the synthesizer with respect to the
accuracy of the slice position.
doing so, we approve the correct function of the TX-NCO's.
In the further steps all other RX-NCO's are tested against the
approved TX-NCO's by testing separately the group 1 RX-NCO's
and group 2 RX-NCO's.
Expert Mode 12.5.72

Principle of Synthesizer Test 12.5.71 The only difference of Expert Mode is that no data is written into
the database.
The Avanto system contains a maximum of 32 receiver channels.
Four receiver channels are connected to 1 double (Numeric
Controlled Oscillator) NCO so that we have in sum 16 RX-NCO's.
Double NCO means that we have two groups of NCO's, so that it is
possible to switch the group of 4 receiver channels either to NCO- Main
Menu
group 1 or to NCO-group 2.
For transmit we have one double NCO. As well the transmit path
can be switched to NCO-group 1 or NCO-group 2.
During simultaneous sending and receiving, the phase and
frequency of the TX-NCO and RX-NCO within one group is the
same. In the following QA-procedure asynchronous behavior of the
TX- and RX-NCO is needed, that means one NCO is stepping phase
and frequency while the other is fix. For that reason we always are
using different groups of NCO's when sending and receiving
simultaneously, i.e. TX NCO is fix and RX-NCO is stepping.
In a first step the verification of the frequency and phase operation
of the RF reference signal is performed by using the MR signal itself
(NCO-sequence). After the demodulation the received MR signal,
the reference signal is compared to the MR signal in terms of
frequency and phase. In one test, the reference signal is varied in
frequency over the whole range of the MR system. A second test
modifies the phase in fixed intervals. In this way the whole
operating range of the oscillator can be tested. The test is
performed for one RX-NCO from group 1 and one RX-NCO from
group 2. So the two RX-NCO's are validated and can be used for
further tests of the other NCO's.
In a second step we perform loop-measurements (nco_loop-
sequence) between the just tested RX-NCO's and the TX-NCO's. By
 Main
Menu

Stability_LongTerm Check 12.58

will be performed and repeated once again.
The first measurements is done with a flip angle of 30 degree
A new application of MR-Imaging is to make activities in the brain
visible. For that purpose the patient will be exposed to a periodical (evaluation of stability of B1 field, i.e. instabilities in the Tx- chain),
the second with a flip angle of 90 degree on 1 and 1.5T systems
optical, acoustical or other stimulation. During the exposition, a
and
series of MR-images will be measured. Afterwards the images will
be evaluated for changes of the signal intensity. The regions of the 70 degree flip angle on 3T systems (minimization of unstable RF,
brain activated by the stimulation can be localized by a very small detection of B0 and gradient like interferences).
variation of signal intensity. These variations can easily be hidden
by various instabilities of the system and/or the environment.
Therefore the instability of the MR-system and interferences from
Evaluation of Measured Images 12.5.82

environment must be below a specified level. The following graphical and numerical evaluations will be
performed:
The Stabil ity_LongTerm Ch eck det ermi nes the su m of al l
instabilities while doing a phantom measurement. Typical causes of • Mean values of a 15x15 ROI related to the mean value of all
instabilities are: measurements as function of image number
• Local B0 field variation caused by temperature variation in • Standard Deviation of a 15x15 ROI mean values (linear and
the shim-unit generate frequency instabilities. The result is a logarithmic plot)
virtual movement of the measured object during the scans. • Center position in x and y direction of phantom, dependent of
• B1 field variations by instable RF produce image intensity image number (Expert mode only)
variations. • Measurement protocol values
• Gradient fields generate frequency and phase variations, • Statistics of Mean values (for ROI size 15x15 and 25x25):
causing also virtual movement of the object. - Mean Image Intensity
• Mechanical vibrations, e.g. by cold head, produce signal - Variation peak-peak
intensity variation by the movement of the measured object - relative Variation peak-peak
relatively to the magnetic iso-center. - Standard Deviation
• Movement of phantom fluid cause phase errors. - total relative linear Drift
- Standard Deviation from linear Fit
Measurement 12.5.81
• Image quality parameters such as SNR and Ghosting
• Statistics of Phantom Movement (Expert mode only)
NOTE Between phantom positioning and measurement start Normally these evaluations will not be displayed.
wait at least 15 min, since even small movements of
phantom liquid will affect measurement results. Results 12.5.83

The numerical results and graphics can be viewed in the service

The measurement is done with the 8 Channel Head Matrix coil and
software under Reports.
the large bottle phantom (7.3 l).
A series of 512 measurements (EPI_FID sequence) with 11 slices

335
Tune-Up / QA - Quality Assurance
 12
336

Field Stability 12.59

10min by multiplying with the ratio (10min / actual measurement
time).
The drift over 10min should not exceed the pixel bandwidth of low
Principle and evaluation of MR-measurement 12.5.91

bandwidth sequence (e.g. 20Hz). The second one is important for

The phase of an MR-FID (Free Induction Decay) is given by: gradient echo sequences to avoid smearing. To be able to use long
echo times it should be typically less than 2Hz.
t

κ ( t ) = γ ∫ B ( t ) dt ≈ γBt
Main
0 Menu

γ is the gyromagnetic ratio of the proton, B(t) is the time

dependent magnetic field. To replace the integral, it is assumed
that the field B(t) does not change much during sampling of the
FID. Time 0 is given by the RF-pulse. So the field can be calculated
directly from the phase at time t. However, because of hardware
imperfections it is better to take the slope of the phase over time
which also gives the field.
To measure the field stability over a certain time a series of FID-
measurements is done. From every FID the phase over time is
calculated and a linear fit is done, the slope giving the frequency.
The time range of the fit should be long to get a high accuracy but
is usually limited by the length of the FID. A good compromise is
20ms, which averages over 50Hz line hum which is usually of no
interest in this measurement.
The total measurement time is given by the repetition time and
number of FIDs.

Evaluation of Field Stability 12.5.92

The result of the field measurement is the field (=frequency) over

the measurement time. As a measure of quality the linear drift over
10 min (=typical measurement time of an imaging sequence) and
the maximum deviation from this linear drift are taken. When the
measurement time is different from 10min, the drift is corrected for
 Section

13 Changes 13

This chapter provides a listing of the changes to the previous version

All sections underwent a major revision. The major changes include

the improvement in the readablity of the graphics, better coverage
of the Patient Handling, Gradient, Line Power Distribution and
Magnet systems.
THe RF System has also been improved with a better explaination
of the RFCI.
A navigation system has also been introduced.

337
Changes -
13
338

This page intentionally left blank.

1 Introduction

2 System

3 Software

4 Host / Imager

5 Control

6 RF System

7 Patient Handling

8 Gradient

9 Magnet

10 Cooling

11 Power Distribution

12 Tune-Up

13 Changes