HUAWEI G526 Maintenance Manual (G526, V1.0, English, Normal) PDF

G526 Maintenance Manual V1.
Prepared by Date
Reviewed by Date
Approved by Date
Huawei Technologies Co., Ltd.

All rights reserved.
G526 Maintenance Manual V1.0 INTERNAL
Change History
Date Revision Revision Section Change Author

Version Cause Number Description
2013-07-18 Huawei Confidential Page 2 of 103

Contents
1 Product Introduction .................................................................................................................... 5
1.1 Appearance ....................................................................................................................................................... 5
1.2 Specifications ................................................................................................................................................... 5
2 Applicable Scope and Precautions ............................................................................................ 7

2.1 Applicable Scope .............................................................................................................................................. 7
2.2 Precautions ....................................................................................................................................................... 7
2.3 Obtaining Product and Repair Information ...................................................................................................... 7
3 Exploded View and PCBA Components .................................................................................. 8

3.1 Exploded View ................................................................................................................................................. 8
3.2 Components on the PCBA ............................................................................................................................. 10
4 Software Upgrade ....................................................................................................................... 13

4.1 Upgrade Preparations ..................................................................................................................................... 13
4.2 Upgrade Procedure ......................................................................................................................................... 14
5 Maintenance Tools ...................................................................................................................... 16

6 Disassembly Procedure .............................................................................................................. 18
7 Assembly Procedure ................................................................................................................... 21
8 Working Principles ..................................................................................................................... 23
8.1 Structure ......................................................................................................................................................... 23
8.2 Circuit Schematic ........................................................................................................................................... 23
8.3 PCBA Functions ............................................................................................................................................. 23
8.4 Baseband ........................................................................................................................................................ 28
8.4.1 Power-on and Power-off Sequence ....................................................................................................... 28
8.4.2 Memory Interface Analysis ................................................................................................................... 29
8.4.3 LCD and TP Assembly .......................................................................................................................... 30
8.4.4 Camera Interfaces ................................................................................................................................. 32
8.4.5 Wi-Fi or Bluetooth Interface ................................................................................................................. 35
8.4.6 USIM Card and microSD Card Interfaces ............................................................................................ 36
8.4.7 Headset Jack.......................................................................................................................................... 38
8.4.8 Audio Interfaces .................................................................................................................................... 39
8.4.9 Keypad Interfaces ................................................................................................................................. 43
8.4.10 Battery and Charging Interfaces .......................................................................................................... 44
8.4.11 Sensor Interfaces ................................................................................................................................. 54
8.4.12 Vibration Motor Interfaces .................................................................................................................. 58
8.4.13 Environment Monitoring and Protective Measures ............................................................................. 59
8.4.14 Charging Status Indicator Interfaces ................................................................................................... 60

8.4.15 PCBA Power Management ................................................................................................................. 61

8.4.16 MSM8930 Memory Allocation ........................................................................................................... 65
8.4.17 Board Power-on and Power-off Processes .......................................................................................... 66
8.4.18 Clock Solution .................................................................................................................................... 70
8.4.19 RTC ..................................................................................................................................................... 70
8.4.20 UVLO and SMPL Recovery Functions ............................................................................................... 71
8.5 RF Subsystem................................................................................................................................................. 72
8.5.1 LTE/WCDMA/GSM Transmission ....................................................................................................... 72
8.5.2 LTE/WCDMA/GSM Reception ............................................................................................................ 75
8.5.3 Frequency Source .................................................................................................................................. 79
8.5.4 GPS and B1 Diversity ........................................................................................................................... 80
8.5.5 Wi-Fi and Bluetooth .............................................................................................................................. 80
9 Troubleshooting for Common Faults ...................................................................................... 81

9.1 Phone Cannot Be Powered On ....................................................................................................................... 81
9.1.1 No Current ............................................................................................................................................ 82
9.1.2 Small Current ........................................................................................................................................ 83
9.1.3 Large Current ........................................................................................................................................ 84
9.2 No Signal Received ........................................................................................................................................ 85
9.3 No Transmission Detected ............................................................................................................................. 86
9.4 Charging Failure ............................................................................................................................................. 88
9.5 Photo Taking Failure ...................................................................................................................................... 89
9.6 Data Transmission Failure .............................................................................................................................. 90
9.7 Sound Reception Failure ................................................................................................................................ 91
9.8 Sound Transmission Failure ........................................................................................................................... 92
9.9 Vibration Failure ............................................................................................................................................ 93
9.10 Ringtone Failure ........................................................................................................................................... 94
9.11 LCD Display Failure .................................................................................................................................... 95
9.12 Keypad Failure ............................................................................................................................................. 96
9.13 No Sound Is Heard from the Headset ........................................................................................................... 97
9.14 microSD Card Detection Failure .................................................................................................................. 98
9.15 GPS Signal Reception Failure ...................................................................................................................... 99
10 Functions ................................................................................................................................... 100

10.1 Buttons and Keys ....................................................................................................................................... 100
10.2 MMI Test .................................................................................................................................................... 100
10.2.2 Voice Call Test .................................................................................................................................. 102

1 Product Introduction
1.1 Appearance
Figure 1-1 G526
1.2 Specifications
Item Description
Dimensions (H x W x D) 9.9 mm x 134.5 mm x 67.5 mm (0.39 in. x 5.30 in. x 2.66 in.)
Frequency band G526-L11:
● WCDMA 2100 MHz: 1920–1980 MHz (UL), 2110–2170 MHz (DL)
● GSM 850 MHz: 824–849 MHz (UL), 869–894 MHz (DL)
● LTE B3: 1710–1785 MHz (UL), 1805–1880 MHz(DL)
● LTE B7: 2500–2570 MHz (UL), 2620–2690 MHz(DL)
● LTE B20: 832–862 MHz (UL), 791–821 MHz(DL)
G526-L22:

Item Description
● LTE B3: 1710–1785 MHz (UL), 1805–1880 MHz(DL)
● LTE B7: 2500–2570 MHz (UL), 2620–2690 MHz(DL)
G526-L33:
● WCDMA AWS: 1710–1755 MHz(UL), 2110–2155 MHz(DL)
● LTE B4: 1710–1755 MHz (UL), 2110–2155 MHz(DL)
● LTE B7: 2500–2570 MHz (UL), 2620–2690MHz(DL)
Weight About 150 g with a battery

Form factor Bar-type
Antenna Built-in
UIM card SIM or USIM
Charger Output: 5 V, 1,000 mA
Battery 1950 mAh Standby time: 220-250 hours
Li-ion Talk time: 600 minutes (depends on the network)
Display Resolution 960 x 540 pixels
Type TFT LCD
Color 16 M
Size 4.5 inches
Port Charger micro-USB connector
port
USB port micro-USB connector
Storage card microSD card slot
slot
Headset 3. 5 mm headset jack (LRGM)
jack
Maximum 23-33 dBm
transmit

Item Description
power
Static –104 dBm minimum

sensitivity
Temperature Operating temperature: 0°C to +30°C
Storage temperature: –20°C to +70°C
Humidity Operating humidity: 5% to 95% RH
2 Applicable Scope and Precautions

2.1 Applicable Scope
This document provides repair instructions for technicians at service centers authorized by Huawei. This
maintenance manual is confidential and accessible to authorized service centers (ASCs) and authorized
service providers (ASPs) only. While every effort has been made to ensure the accuracy of this document,
errors may still exist. If you find any errors or have any suggestions, contact Huawei customer service.
2.2 Precautions
 Only qualified technicians are allowed to perform repair and calibration.
 Perform all operations in electrostatic discharge (ESD) rooms and wear ESD wrist straps throughout
the operations.
 Ensure that all components, screws and insulators are properly installed after repair and calibration,
and that all cables and wires are installed and connected correctly.
 Ensure that the soldering is lead-free and compliant with eco-friendly requirements.
Electrostatic discharge (ESD) is a major cause for damage to sensitive electronic components.
Every service center must attach great importance to ESD protection and meet ESD protection
requirements specified in this document.
2.3 Obtaining Product and Repair Information

To obtain product and repair information, please visit http://www.huaweidevice.com/cn/technicaIndex.do

3 Exploded View and PCBA Components

3.1 Exploded View
Figure 3-1 G526 exploded view
Table 3-1 G526 Components
No. Item Quantity

1 TP 1
2 Receiver decoration part 1
3 LCD 1
4 Front housing 1
5 Receiver 1
6 Front camera 1
7 Front camera stand 1
8 Receiver FPC 1
9 Receiver FPC stand 1
10 PCBA 1

No. Item Quantity

11 eMMC shielding cover 1
12 Rear camera stand 1
13 RF shielding cover 1
14 Rear camera 1
15 Rear housing 1
16 Wi-Fi antenna 1
17 GPS antenna 1
18 Screw 11
19 Battery cover 1
20 Side key FPC 1
21 PM shielding cover 1
22 PA shielding cover 1
23 Main FPC 1
24 Antenna board 1
25 Speaker 1
26 Coaxial cable 1
27 Diversity antenna (or shielding film) 1
28 Main antenna stand 1
29 Rear label 1
30 NFC antenna or polyester (PET) part of the battery cover 1
31 Battery 1

3.2 Components on the PCBA

J2601 R FPC J2101 rear camera
MIC1801 second microphone
U2401 TP IC May cause failure of the connector
May cause TP failure May cause sound transmission May cause rear camera
receiver, tri-color light,
failure in handsfree calls failure
and ambient light sensor
U2202 compass IC
J2402 TP connector May cause compass
May cause TP failure failure
U1403 eMMC and LCD

U2201 gravity IC
power supply
May cause gravity
May cause failure of startup
sensing failure
or the LCD
U1401 eMMC
U6502 RF switch
May cause failure of loading
May cause RF failure
or startup
U5601 RF signal
U1701 audio processing processing IC
chip May cause RF failure
May cause audio failure
J2001 LCD connector U3301 RF switch

May cause LCD failure May cause RF failure
J2302 microSD card

J1501 battery holder
connector
Failure of startup or
May cause microSD card
charging
detection failure
J2301 SIM card connector

May cause microSD card
detection failure

J2102 front camera

U6001 WIFI/BT/FM IC connector
W-Fi/BT/FM failure May cause front camera
failure
U201 power management

IC
U5801 WCDMA PA power May cause failure of
supply IC startup, charging, or power
May cause RF failure supply
U2101 flash light IC

U3601 RF PA chip May cause flash light
May cause RF failure failure
U2801 NFC chip

May cause NFC function
J1502 USB connector failure
May cause failure of USB
connection or charging
U301 CPU
May cause system failure
U4301 LTE power module
Q301 main power supply
MOSFET
May cause failure of
U4101 LTE power module startup or charging
J2602 BTB connector

May cause failure of the
speakers, microphone, or
motor
Table 3-2 Component descriptions
Reference Designator Huawei Code Description

U2401 43140166 Interface Controller,TP IC,2.85V,CSP49, Terminal
Dedicated
MIC1801 22050091 Microphone,-44dB.,D4*1.5mm,wideband,terminal
J2601 14240496 BTB Connector,Female,24Pin,0.4mm,SMT,Mating
Height 0.8mm,Terminal Dedicated
J2101 14240181 BTB Connector,Fmale,24Pin,0.4mm,SMT,Mating


J2402 14240282 BTB
Connector,female,40Pin,0.4mm,1.0mm,SMT,Terminal
Dedicated
U1403 39110756 Switching Regulators,DC/DC
buck,2.5V~5.5V,Voadj,1.2A,DFN/QFN
U1401 40060446 NAND Flash,4GB
EMMC,52MHz,1024KB,3.3V/1.8V,FBGA153(Pb-free)
,Terminal Dedicated
U1701 39200522 AUDIO CODEC
DEVICE-WCD9304,1.2/1.8/2.2/3.8V,WLNSP
J2001 14240496 BTB Connector,Female,24Pin,0.4mm,SMT,Mating
J2302 14240551 Card Connecter,Micro SD
Header,10pin,1.1mm,Without Lock,Without Hold
Peg,1.0mm,height 2.45mm,Terminal Dedicated
J2301 14240245 Card Socket,SIM
Socket,6Pin,Horizontal,2.54mm,Without Hold
Peg,Without Clip,Pin Tail Length1.7mm,ball type
height 1.6mm,Terminal Dedicated
U2202 38140069 Semiconductor
Sensor,E-Compass,WLCSP(Pb-free),3axis,Terminal
Dedicated
U2201 38140098 Semiconductor
Sensor,Accelerometer,LGA,3axis,Terminal Dedicated
U6502 47140068 RF
Switch,400~3000MHz,DPDT,0.25~0.7dB,1.5:1,26dB,Q
FN,1000V
U5601 39200499 Terminal Baseband process
IC,LTE/WCDMA/CDMA/TDSCDMA/GSM
Transceiver(WTR1605L)-2.2V/1.8V/1.3V-WLNSP142
U3301 47140081 RF Switch,746~2690MHz,SP10T ASM-1.5dB max.,1.7
max,21dB.3.2*3.2*1.0mm,Terminal Dedicated
J1501 14240582 Card Socket,Battery connector,4PIN,Mid Mount,Side
Contact,2.50mm,With Plastic Peg,0.50mm,Terminal
Dedicated
U6001 39210028 Terminal Baseband process IC,2.4/5GHz
WLAN/Bluetooth 4.0/FM Single
chip-WCN3660,1.2~2.9V,79B
WLNSP(Pb-free),Terminal Dedicated
U5801 39110714 Power Driver,DC-DC for
PA2.5A,2.7V-5.5V,CSP-16,Terminal Dedicated


U3601 47150239 RF Multi-functional Component,Multiband Multimode
Power Amplifer Module for Quadband GSM/EDGE
and Penta-Band(Band
I,II,IV,V,VIII)WCDMA/HSDPA/HSUPA/HSPA+/LTE
,800~2100MHz,42-pad 7X5X0.9mm,Terminal
Dedicated
J1502 14240646 IO Connector,Micro_B-Female,5pin,1.77mm Height
from PCB Top Side,SMT,Terminal Dedicated
U4301 47100691 RF Power Amplifying
Module,832~862MHZ,28dB,31.5dBm,Terminal
Dedicated
U4101 47100353 RF Power Amplifying
Module,2500-2570MHz,28,31dBm,QFN,1000V
J2102 14240181 BTB Connector,Fmale,24Pin,0.4mm,SMT,Mating
U201 39200438 Power Management
IC(PM8038),2.5~4.5V,NSP(pb-free),Terminal
Dedicated
U2101 39110800 Switching Regulators,1.5A LED Flash Driver
IC,2.5V~5.5V,1.5A,4MHz,CSP-9,Terminal Dedicated
U2801 39210128 Connectivity IC,NFC
Controller ,2.3V-5.5V,QFN-34L,Terminal Dedicated
U301 39200558 Terminal Baseband process IC,LTE/WCDMA/GSM
Multimode BASEBAND PROCESSOR
MSM8930-3,1.2V/1.8V/2.85V/5V,12x12mm
PoP,Terminal Dedicated
Q301 15060318 MOSFET,P
Channel,12V,5A,0.020ohm,8V,UDFN6,Terminal
Dedicated
J2602 14240495 BTB Connector,Male,24Pin,0.4mm,SMT,Mating
4 Software Upgrade
4.1 Upgrade Preparations
Category Item Description
Upgrade environment Computer Used to copy the upgrade software.

Category Item Description
microSD card Available space: ≥ 2 G.
Battery Remaining battery life: ≥ 30%.

Upgrade file Main upgrade /1_SDCARD/dex/UPDATE.APP
package
Vendor upgrade /0_CUST/UPDATE.APP
package
Upgrade method Using the Normal upgrade
microSD card
Forcible upgrade
4.2 Upgrade Procedure

Step 1 Format the microSD card.
Step 2 Create a folder named dload in the root directory of the microSD card.
Step 3 Copy the upgrade file update.app to the dload folder.
Step 4 Insert the microSD card into the phone. Power on the phone and enter*#*#2846579#*#* from
the idle screen.
Step 5 Select Project Menu > Upgrade > microSD card upgrade and select confirm to start the
upgrade.
Before the upgrade, NV items backup is performed. Then the upgrade starts.
The upgrade progress is displayed on the LCD, as shown in Figure 4-1.
Figure 4-1 Upgrading
Step 6 Repeat Step 1 through Step 5 to install the vendor upgrade package.

If the phone cannot be powered on, use either of the following methods to forcibly upgrade the phone:
 Install the battery on the phone (if the phone screen flashes, remove the battery from the phone and
re-install it 5 minutes later). Press and hold the volume up and volume down keys and press the power
key. Then the phone automatically starts the forcible upgrade. The upgrade procedure is the similar to
that performed through the engineering menu.
 Remove the battery from the phone. Press and hold the volume up and volume down keys and connect
the charger to the phone. Then the phone automatically starts the forcible upgrade.
This method is recommended.
If the forcible upgrade fails, try another microSD card for the forcible upgrade.
----End

5 Maintenance Tools
Table 5-1 Maintenance tools
Name: constant-temperature heat gun
Usage: to heat components
Name: soldering iron

Usage: to solder components
Name: DC power supply

Usage: to supply DC power
Name: soldering table

Usage: to secure the PCBA
Name: lead-free solder wire

Usage: soldering
Name: digital multimeter

Usage: to measure during repair
Name: toolkit
Usage: to assemble and disassemble terminal products

Name: electric screwdriver

Usage: to fasten and remove screws

6 Disassembly Procedure
Table 6-1 Disassembly Procedure
1. Ensure that the ESD wrist strap is properly 2. Remove the battery cover.
grounded.
3. Remove the screws from the rear housing. 4. Separate the snap joints from the rear housing.
5. Remove the rear housing. 6. Disconnect the BTB connectors.

7. Loosen the PCBA fastener. 8. Remove the PCBA.
9. Remove the rear camera. 10. Remove the front camera.
11. Remove the ambient light FPC. 12. Remove the antenna board.

13. Remove the side key FPC. 14. The disassembly is complete.

7 Assembly Procedure
Table 7-1 Assembly Procedure
1. Ensure that the ESD wrist strap is properly 2. Prepare all components.
grounded.
3. Install the side key FPC. 4. Install the antenna board.
5. Install the ambient light FPC. 6. Install the front camera.

7. Install the rear camera and FPC that connects the 8. Fit the PCBA into the front housing.
PCBA and antenna board.
9. Tighten all BTB connectors. 10. Install the rear housing.
11. Tighten the screws. 12. The assembly is complete.

8 Working Principles
8.1 Structure
The G526 is a bar-type mobile phone that consists of the PCBs, battery, and structural parts.
The PCBs include the PCBA (M), proximity light or FPC (R), antenna board (S), side key FPC (P), and
connection FPC (F).
Structural parts include the LCD module, touch panel (TP), 5 MP rear camera module, 0.3 MP front camera
module, housings, and antennas.
8.2 Circuit Schematic

Figure 8-1 G526 circuit schematic
the MSM8930 is a baseband processor chip that processes input and output signals such as video, audio, or
radio frequency (RF) signals. Baseband interfaces include the interfaces for the keypad, LCD, microSD
card, Bluetooth, camera, and microphone. PM8038 provides the analog multi-way switch, real-time clock
(RTC) circuit, temperature compensated crystal oscillator (TCXO), motor drive circuit, and programmable
current source. WTR1605 is an RF signal processor that implements conversion of uplink and downlink RF
signals. The PCBA can be divided into four logical subsystems, that is, the base band, RF, power supply,
and user interface subsystems.
8.3 PCBA Functions

According to logic functions, the PCBA are categorized into four sub-systems: baseband, RF, power supply,
and user interfaces. The modules and units of each subsystem are described in Table 8-1.

Table 8-1 PCBA subsystems
Subsystem Module Unit Description

Baseband MSM8930 Modem Contains 2 x QDSP6 V4 for modem usage, each
subsystem subsystem running at 500 MHz.
Supports LTE, CDMA, WCDMA, GPS, and
GSM.
Includes the ARM9 processor, modem DSP,
modem AHB bus, interrupt controller, and
power and sleep controller (PSC).
Application Contains the dual-core 1.0 GHz Krait processor
subsystem and QDSP6 V4 processor.
Provides function modules such as microSD
card, EBI2, UART or USIM, I2C, GPIO, and
clock.
User interface Includes the camera interface, PCM interface,
processing unit broadband codec, vocoder, RF interface,
HKADC, LCD interface, microSD interface,
USB interface, UART interface, USIM card
interface, SBI interface, GPIO, JTAG or ETM
interface, and keypad interface.
Multimedia and Includes the MPEG or JPEG hardware engine,
game engine game engine, Java accelerator, and
MP3/MMS/MIDI function.
PM8038 Power supply Lists monitoring targets, such as external power
voltage input, Li-ion battery, coin battery, voltage drain
monitoring drain (VDD), and important low-dropout (LDO)
regulators.
Temperature Monitors the temperature of the battery and
monitoring power amplifier (PA).
Battery ID Differentiates batteries of different
manufacturers and discharge and discharge
algorithms.
eMMC NAND feature, Has a storage space of 4 GB (2 x 16 GBit) and
power stores programs and some NV items.
consumption,
and file system
support
LPDDR2 Package on Has a storage space of 8 GB (128 MB x 32 +
RAM package (PoP) 128 MB x 32) for running programs.
on the
MSM8930
RF subsystem GPS GPS receiver GpsOne Gen8 engine with GNSS
Receives and processes GPS signals
Includes RTRLTN and the peripheral circuits.


Bluetooth Bluetooth Implements Bluetooth baseband functions and
interface module transmits and receives RF signals.
Includes the Bluetooth module of WCN3660 and
peripheral circuits.
Wi-Fi Wi-Fi module Implements Wi-Fi baseband functions and
interface transmits and receives RF signals.
Includes the Wi-Fi module of WCN3660 and
peripheral circuits.
Oscillator and VCTCXO and The controller generates temperature
frequency MSM8930 compensated crystal controlled voltages
synthesizer controller (TCXVCOs) with as high a precision as 19.2
MHz.
Antenna Antenna, The built-in antenna is used for signal
internal transception and supports LTE, WCDMA, and
interface GSM. Antennas consist of the main antenna,
component, and Wi-Fi or Bluetooth antenna, NFC antenna, and
antenna GPS antenna.
protection
Coupler Power coupler Couples part of the output power to RTRLTN
for detection.
User interface UART The UART interface in the MSM8930
subsystem Interface subsystem is used for Bluetooth.
USB interface Driver, Peripheral circuit of the USB interface
protection Includes unit circuits such as USB protection
circuit and circuit, and interface connectors. Provides a
output interface channel for data transmission of engineering
component prototypes
Can be used for device debugging and testing
during development.
USIM card Power supply, USIM card slot and the related circuit
interface protection
circuit, USIM
card slot
Keypad and Keypad driver The volume keys adopt GPIO for interrupt
backlight circuit, external detection. Provides a side LED backlight that
keypad, LED turns on when a user touches the touchscreen.
backlight
driving circuit
Color LCD LCD driver, The main LCD is of 16 million colors, 960 x 540
and backlight interface mode, resolution.
backlight Adopts content adaptive backlight control
control (CABC) to control LCD backlight brightness.


microSD card Power supply, microSD card connector and the related interface
protection circuit
circuit,
connector
Speaker Driver mode, Up to 500 mW.
connection Plays polyphonic ringtones with incoming calls.
mode, speaker Provides a Class AB amplifier.
component
Provides frequency response that is good enough
for it to play 20 Hz to 20 kHz ringtones.
Can also play mono-audio MP3 files.
Receiver Driver mode, The power of the receiver for calls should be less
connection than 70 mW.
mode, receiver
component
Microphone Interface circuit, Includes two built-in microphones for noise
connection reduction.
mode,
microphone
component
Headset Headset Includes a headset jack for audio output.
interface circuit, Supports a headset cable that provides a
microphone microphone for audio input
interface circuit
Vibration Driver mode, Alerts users to incoming calls.
motor connection
interface mode, motor
Accelerometer I2C interface Measures acceleration for gaming.
control
Compass I2C interface Implements electronic compass and other
control auxiliary functions.
Power supply Built-in Li-ion battery Provides a nominal voltage of 3.7 V, a nominal
subsystem standby and interface capacity of 1950 mAh, and over 500 charge
battery component cycles.
Meet GB18287 safety requirements.


External Adapter, Meets usage requirements of China, Europe,
power supply interface American, and Australia.
(travel component Requires input voltage that varies from 90 to 240
charger) V and its frequency varies from 45 Hz to 55 Hz,
depending on the market requirements.
Delivers a voltage of 5±0.25 V. The charger
must pass certifications required by the specific
country.
The output current of the charge must be
sufficient for the phone to operate properly while
the phone is being charged.
Power Power Includes filter networks and routing of the power
distribution distribution supply.
network and network
power
management Standby battery Manages battery charging and discharging,
function management, protects the battery from overcharging and
charge circuit, overdischarging, and charges the capacitor used
charge mode, for maintaining a constant current.
charge
protection
Board circuit Indicates LDO mainly, which manages power
power supply flexibly. Based on protocols and power
management saving analysis requirements, the board software
(power-on/off manages the power supply of unit circuits
analysis) according to the service status to decrease power
consumption of devices. 32.768 kHz dormant
clock is provided.
PM8038 RTC Uses a dormant clock of 32.768 kHz to provide
enhanced precise time.
functions
HKADC Supports 16 channels of analog signals multiplex
Outputs a channel of signals to the MSM8930 to
be processed by the analog-to-digital converter
(ADC).
TCXO driver Outputs sine waves to the TCXO, which outputs
and related square waves suitable for the MSM8930.
controls
UVLO Powers the phone off when input voltage is
lower than the threshold for a specific period.
Watchdog timer Supports WDT overflow reset.
(WDT) reset
Over-temperatu When the on-chip junction temperature is over
re protection 150°C, the phone powers off.
Internal driver Provides four LED drivers, one vibrator driver,
circuit and one speaker driver.


Interrupt Is built in to process related interrupt signals.
manager
OTG USB Supports USB 2.0 interfaces.
driver OTG is currently not supported by software.
8.4 Baseband
8.4.1 Power-on and Power-off Sequence
Figure 8-2 shows the power-on and power-off sequence of the PM8038.
Figure 8-2 Power-on and power-off sequence
The platform implements interrupt when the KYPD_PWR_N signal is pulled low. The PM8038 powers on
the device based on the sequence shown in Figure 8-2. During the power-off process, power off the
PS_HOLD signal first.

8.4.2 Memory Interface Analysis

The MSM8930 supports PoP LPDDR2 SDRAM and external eMMC NAND flash memory. The memory
interfaces of the MSM8930 are shown in Figure 8-3 and include:
PoP LPDDR2
External eMMC chipset that connects to the MSM8930 through SDC1
microSD card that connects to the MSM8930 through SDC3
Figure 8-3 MSM8930 memory interfaces
LPDDR2 connects to the MSM8930 though the EBI, a 32-bit data bus. The MSM8930 uses an EBI and
supports up to 400 MHz clock rate and up to 1 GB memory space.
Three types of PoP LPDDR2 are recommended by Qualcomm and controlled by the MSM8930 through
EBI1 chip selects, as shown in Figure 8-4. Three types of configurations are supported by EBI1:
 2 x 256 MB
 1 x 512 MB
 1 x 512 MB + 1 x 256 MB
Figure 8-4 Supported memory configurations

The MSM8930 supports eMMC, microSD cards, and a clock rate of up to 104 MHz (SDR) and 52 MHz
(DDR). eMMC flash memory connects to the MSM8930 through SDC1 interface. The microSD card
connects to the MSM8930 through SDC3. The G526 supports a microSD card of up to 32 GB.
Figure 8-5 eMMC interface
Figure 8-6 microSD card interface
8.4.3 LCD and TP Assembly

Figure 8-7 shows the LCD interface schematic diagram for the MSM8930.

Figure 8-7 LCD interface schematic diagram
Table 8-2 shows the definitions of LCD interfaces:
Table 8-2 LCD interfaces
Category Description Network MSM8930 GPIO/PM8038

MPP
Power supply Digital power input VREG_L11_1P8 VREG_L11_1P8 (PM8038)

Digital power input LCD_VCI VREG_L9_2P85 (PM8038)
Signal cable MIPI signal cable MIPI_DSI_LANE1_P_A MIPI_DSI_LANE1_P
MIPI signal cable MIPI_DSI_LANE1_N_A MIPI_DSI_LANE1_N
MIPI signal cable MIPI_DSI_LANE2_P_A MIPI_DSI_LANE2_P
MIPI signal cable MIPI_DSI_LANE2_N_A MIPI_DSI_LANE2_N
Synchronizatio Frame signals MDP_VSYNC_P GPIO0
n signal synchronize with
clock signals
Clock signal MIPI clock MIPI_DSI_CLK_P_A MIPI_DSI_CLK_P
MIPI clock MIPI_DSI_CLK_N_A MIPI_DSI_CLK_N
Control signal Reset signal MIPI_DSI0_RESET_N GPIO58
Identification Identification of the LCD_ID0 GPIO93
signal LCD model
Backlight Positive pole of the LED_A Positive pole of the backlight
signal backlight LED LED
Negative pole of the LED_K Negative pole of the backlight
backlight LED LED

Category Description Network MSM8930 GPIO/PM8038

MPP
LED brightness PWM_OUT
control signal
In G526, the backlight driving circuit is built in the PM8038 and powered by VPH_PWR. PWM_OUT is
the backlight control signal that is output from the LCD module using content adaptive backlight control
(CABC). Figure 8-8 shows the backlight driving circuit.
Figure 8-8 Backlight driving circuit
8.4.4 Camera Interfaces

The 5MP rear camera uses a 24-pin BTB connector, I2C bus, and MIPI.
Table 8-3 Rear camera interfaces
Category Network MSM8930 Voltage Connector Remarks

GPIO/PM8038MPP Number
Camera CAM_VIO VREG_LVS1_1P8(P 1.8 6, 8 0.750-3.050 V
power M8038)
supply
CAM_AVDD VREG_L8 (PM8038) 2.85 22 0.750-3.050 V
VREG_L8_2V8 VREG_L8(PM8038) 2.85 3 1.500-3.050 V
Clock CAMIF_MCLK GPIO5 1.8 16 Camera reference
clock
MIPI_CSI0_CL MIPI_CSI0_CLK_P 1.8 13
K_P
MIPI_CSI0_CL MIPI_CSI0_CLK_N 1.8 11
K_N
Data cable MIPI_CSI0_LA MIPI_CSI0_LANE0_ 1.8 17 Data cable
NE0_P P
MIPI_CSI0_LA MIPI_CSI0_LANE0_ 1.8 15
NE0_N N
NE1_P P

Category Network MSM8930 Voltage Connector Remarks

GPIO/PM8038MPP Number
NE1_N N
I2C I2C3_SCL GPIO21 1.8 7 I2C control signal
control
signal I2C3_SDA GPIO20 1.8 5
Control MCAMIF_SHD GPIO54 1.8 10 Shutdown signal

signal N
MCAMIF_ID GPIO55 1.8 2 Module supplier
identification
MCAMIF_RESE GPIO107 1.8 12 Reset signal
T
CAM_VCM_PD GPIO13 1.8 4 Camera motor
_N control
Ground GND 0 1, 9, 14, 18, Ground signal
24
Figure 8-9 Main camera circuit
The 0.3 MP front camera uses the same I2C bus as the rear camera. MIPI is also used for data transmission.
Table 8-4 describes the interfaces of the front camera.

Table 8-4 Front camera interfaces
Category Network MSM722A Voltage Connector Remarks

GPIO Number
Camera VREG_VIO VREG_S3(PM 1.8 6 0.750-3.050 V
power 8038)
supply
VREG_VIO VREG_S3(PM 1.8 8 0.750-3.050 V
8038)
VREG_AVDD VREG_L17(P 2.85 22 1.500-3.050 V
M8038)
Clock CAMIF_MCLK GPIO15 1.8 16 Camera reference
clock
MSM8930->Camera
MIPI_CSI1_CLK_ MIPI_CSI1_C 1.8 13
P LK_P
MIPI_CSI1_CLK_ MIPI_CSI1_C 1.8 11
N LK_N
Data cable MIPI_CSI1_LANE MIPI_CSI1_L 1.8 17
0_P ANE0_P
MIPI_CSI1_LANE MIPI_CSI1_L 1.8 15 Data cable
0_N ANE0_N
I2C I2C3_SCL GPIO21 1.8 7 I2C control signal
control
signal I2C3_SDA GPIO20 1.8 5
Control SCAMIF_SHDN GPIO14 1.8 10 Shutdown signal

signal
SCAMIF_ID GPIO75 1.8 2 Module supplier
identification
SCAMIF_RESET GPIO76 1.8 12 Reset signal
Ground GND 0 1, 9, 14, 24 Ground signal

Figure 8-10 Front camera circuit
The G526's camera LED flash driver, LM3462, delivers up to 1.5 A. The driver's output current is
controlled by the I2C bus, and its turn on is controlled by FLASH_EN GPIO2 (MSM8930). When it is
turned on, GPIO2 (MSM8930) is set to 1.
Figure 8-11 Camera LED flash circuit
8.4.5 Wi-Fi or Bluetooth Interface

The G526 uses the Qualcomm WCN3660, a Bluetooth, Wi-Fi (dual band: 2.4G and 5G), and FM radio
combo chip.
Power Supply
The VREG_L1_1P3 is the working power supply for the WCN3660 chip. Tables xx lists the network
names and work directions of power supplies.
Table 8-5 Power supply interfaces
Category Network Direction PM8038

Working power VREG_L1_1P3 From the PM8038 VREG_L1_1/2
supply to the WCN3660

Category Network Direction PM8038

PA power supply VREG_L10_3P0 From the PM8038 VREG_L10
to the WCN3660
XO power supply VDD_XO_1P8 From the PM8038 VREG_L4
to the WCN3660
IO power supply VDD_IO_1P8 From the PM8038 VREG_L11
to the WCN3660
Communication Module
The WCN3660 chip communicates with the main chip through three types of buses: SSBI, IQ, and SD. The
SSBI and IQ high-speed signal cables use Qualcomm bus protocols.
Figure 8-12 Communication module
8.4.6 USIM Card and microSD Card Interfaces
USIM Card Interface

The USIM card interface circuit is shown in Figure 8-13. The MSM8930 supports two UIM cards, but this
circuit uses only the UIM1 interface to which a 1.8 V or 3.0 V SIM card can be inserted. VREG_L15
supplies power to the SIM card as follows: VREG_L15 pulls the voltage to 1.8 V and detects whether the
SIM card supports 1.8 V:
 If yes, VREG_L15 continues to provide 1.8 V power supply.

 If no, VREG_L15 pulls the voltage to provide 3.0 V power supply.

UIM1_CLK, UIM1_REST, and UIM1_DATA are the clock signal, reset signal, and data signal respectively
and transmitted bidirectionally between the SIM card and the MSM8930. The data signals are connected to
VREG_L15 while connected to a pull-up resistor. Since users use SIM cards frequently, transient voltage
suppressors (TVSs) are added to provide ESD and surge protection.
To support NFC, the Pin 5 of the SIM card is connected to the SWIO pin of the NFC chip so that NFC data
can be transmitted and stored on EEPROM of the SIM card.
Figure 8-13 USIM card interface circuit
microSD Card Interface

The MSM8930 has five microSD card interfaces dedicated to microSD cards. In the G526, the SDC3
interface is connected to the microSD card slot, as shown in Figure 8-14.

Figure 8-14 microSD card interface circuit
SDC3_CLK is the clock signal. SDC3_CMD is the command signal. SDC3_DATA0, SDC3_DATA1,
SDC3_DATA2, and SDC3_DATA3 are four data routes. SD_DETCT detects the insertion and removal of a
microSD card. A 1 M pull-up resistor is added outside SD_DETCT. When a microSD card is inserted,
SD_DETCT is pulled low, by which the MSM8930 detects the insertion of the microSD card.
8.4.7 Headset Jack

he G526 provides a 3.5 mm headset jack. Figure 8-15 shows the headset jack circuit.

Figure 8-15 Headset jack circuit
8.4.8 Audio Interfaces
Classification
Audio interfaces in the G526 are classified into four types:
 Speaker
The speaker that plays polyphonic ringtones when there is an incoming call and has an output power
of up to 500 mW. The speaker has good frequency response so that it can play 20 Hz to 20 kHz
ringtones and mono-audio MP3 files.
 Receiver
Receives voice during calls.
 Microphone
Built in the G526.
 Headset
The headset transmits sounds or MP3 audio, provides a microphone used for audio input, and supports
single-ended stereo.

Description
The functions of the MSM8930's audio interfaces are implemented by the WCD9304 codec chip.
Figure 8-16 WCD9304 codec chip
Audio data is transmitted between the WCD9304 and the MSM8930 through dedicated SLIMbus interfaces.
Inter-IC Sound (I2S) interfaces are not supported. The codec chip includes four analog input interfaces, five
analog output interfaces, four analog-to-digital converters (ADCs), five digital-to-analog converters
(DACs), and four digital microphone input interfaces (two pairs of signals, each pair containing a DATA
and a CLK). The WCD9304 supports MBHC, which can detect whether headsets are inserted or removed
and whether the headset provides a microphone, and detection of up to eight buttons is supported.

Figure 8-17 Function modules of the audio interfaces
 Speaker
The speaker uses the class D audio amplifier built in the PM8038. In the circuit shown in Figure 8-18,
differential mono audio inputs are used. The speaker outputs mono audio. The WCD9304 drives the
speaker using LINE_OUT1 to output signals to the PM8038.
Figure 8-18shows the speaker circuit of the WCD9304.
Figure 8-18 Speaker circuit
 Receiver
WCD9304 supports an external receiver (8 ohms to 32 ohms) and provides a built-in class G power
amplifier with an output power of up to 125mW. In the circuit shown in Figure 8-19, EAR_M and EAR_P
connect to the corresponding pins on the WCD9304.

Figure 8-19 Circuit connection between the receiver and WCD9304
 Microphone
In the G526, two surface-mounted electret condenser microphones (ECMs) are used for noise reduction.
The primary microphone on board K is at the bottom of the G526 and used for receiving the desired sounds.
The second microphone on board M is at the upper part of the G526 and used for receiving ambient noise
to reduce noise and echoes. Both microphones use the MIC_BIAS2 output from the codec as the bias
voltage.
Figure 8-20 shows the primary microphone circuit, where MIC1_P and MIC1_N respectively connect to
the MIC1_P and MIC1_N pins on the WCD9310.

Figure 8-20 Primary microphone circuit
8.4.9 Keypad Interfaces

The G526 has three physical buttons: the power key, volume up key, and volume down key. In addition,
three touch sensitive keys are available on the touchscreen: search, back, and menu.
The power key signal KYPD_PWR_ON is connected to the KYPD_PWR_N pin on the PM8038. The three
physical buttons connect to different detection pins on the PM8038, as described in Table 8-6.
Table 8-6 Buttons and their corresponding pins
Button Detection Pin
Power key KYPD_PWR_N

Volume up key GPIO_3
Volume down key GPIO_7

Figure 8-21 Keypad interfaces
8.4.10 Battery and Charging Interfaces

Figure 8-22 shows the battery connector interface circuit. VBAT is the battery voltage. BATT_TEMP is the
output pin for battery temperature detection. VREF_THERM is the pull-up reference voltage used for
temperature detection. BAT_ID, the battery ID detection pin, connects to the ID pin on the battery.
Figure 8-22 Battery connector interface circuit
Charging
The PM8038 supports charging using a USB charger or wall charger. Table 8-7 lists the pins related to
these two charging methods.

Table 8-7 Charging methods and pins
The wall charger also charges the G526 through a USB port, so whichever charging method is used, the
electric current flows to the PM8038 through USB_IN for the PM8038 to detect the current, and then flows
from USB_OUT to DC_IN for voltage detection.
 Power input circuit
RC network: Both the wall charger and USB charger circuits have RC networks that use 1.0 μF and 4.7 μF
capacitors respectively. RC networks are used for filtering frequencies, stabilizing the input voltage, and
ensuring electromagnetic compatibility. In the RC networks, resistors pull down voltage to ground when no
wall charger or USB charger is inserted, and the charger connection status is quickly detected.
Current detection: In the PM8038, current is detected only when the G526 is charged through a USB
charger.
Battery control MOS transistor: The MOS transistor is a p-channel p-channel MOSFET. It is controlled by
BAT_FET_N on the PM8038. When the MOSFET is turned on, VPH_CHG charges the primary battery
and supplies power for the G526's operating.

Figure 8-23 Charging circuit
Figure 8-24 USB interface circuit
 External voltage detection

The power management IC (PMIC) constantly monitors external power supply voltage at USB_IN. The
voltage indicates whether the power supply is plugged in and whether the connection is within a valid range.
Hysteresis prevents unwanted switching near the threshold and an interrupt report on the state is sent to the
state machine and the MSM8930 or QSC.
 Overvoltage protection (OVP)

The G526 provides a built-in overvoltage protection circuit that detects the input voltage. When the voltage
is lower than the threshold (from 5.5 V to 7.5 V with a step of 0.5 V and a default value of 6.5 V), the
MOSFET is turned on and USB_OUT obtains the charging voltage. When the obtained voltage is higher
than the threshold, overvoltage protection is implemented and the MOSFET is turned off to block the
charging voltage.
Figure 8-25 OVP circuit
 Four closed loops for charging current control

The PM8038 implements charging protection through four closed loops:
− USB charger input current
− Wall charger input voltage
− Buck circuit output voltage
− Battery charging current
The minimum duty cycles of the closed loops are used for controlling the charging current and voltage.
Figure 8-26 Four closed loops
 Primary battery charging

The PM8038 can charge the Li-ion battery in four modes: trickle charging, constant current charging,
constant voltage charging, and pulse charging. The MSM8930 detects the battery voltage, external voltage,
and current through the analog multiplexer of the PM8038.
The charging state machine starts when the G526 is powered on. When VDD is detected, the state machine
reacts to some circumstances. For example, the charger is inserted, or the battery requires trickle charging.
When the G526 is powered on, the state machine starts and reads the initial state. Then the hardware
determines whether automatic trickle charging is required. Trickle charging restricts the charging current to
avoid VDD drop. When the system is started, software determines whether trickle charging is required.
When trickle charging raises the battery voltage to a threshold, current charging is implemented to
accelerate charging. This charging mode is called fast charging. When the voltage of the Li-ion battery
reaches the predefined value through constant current charging, software continues the battery charging
using constant voltage charging or pulse charging. Figure 8-27 shows the charging process.
Figure 8-27 Charging process
The following describe the charging modes in details:

1. Trickle charging
When the battery enters into a deep discharge state, high current charging will cause malfunctioning of the
mobile phone or VDD drop. To solve this problem, the PM8038 provides trickle charging to charge the
battery at a stable and low rate. Trickle charging can be implemented using a USB charger or the on-chip
trickle charger.
Figure 8-28 shows the trickle charging method.

Figure 8-28 Trickle charging
When the system is started, trickle charging is under the software's control and stops when the voltage
reaches a specified threshold (3.0 V for a Li-ion battery). Software detects the battery voltage through
HKADC and determines when to stop trickle charging. Software can also control the trickle charging
current by setting the current to between 50 mA and 300 mA with a specified interval.
2. Constant current charging
To implement constant current charging, the MOSFET must work in the linear zone and the primary battery
must be connected to VDD. In the closed loop based on battery current detection, the MOSFET is used to
adjust the overall current. IMAXSEL.MSM controls the constant current charging until the battery voltage
reaches the specified value. Figure 8-29 shows the constant current charging method.
Figure 8-29 Constant current charging
During constant current charging, when VBAT is close to Vset, the charging current decreases and ends,
and then constant voltage charging starts. Figure 8-30 shows the battery voltage and current waveforms
during constant current charging.

Figure 8-30 Battery voltage and current waveforms during constant current charging
3. Constant voltage charging

The requirements of constant voltage charging are similar to that of those of constant current charging:
MOSFET works in the linear zone and performs current control in a closed loop. The difference is that in
this closed loop, VBAT is to reach a specified value (VMAXSEL), which ensures the battery voltage to
reach a precise value. Manufacturers of Li-ion batteries recommend that battery voltage precision should
reach 1% or higher when the charging ends. During constant voltage charging, the battery voltage
maintains (nearly) constant and the charging current decreases exponentially. Figure 8-31 shows the battery
voltage and current waveforms during constant voltage charging.
Figure 8-31 Battery voltage and current waveforms during constant voltage charging
Coin battery charging and standby power supply

The G526 does not provide coin batteries but has three external 22 μF capacitors connected in parallel.

When the G526 is powered off, some clock circuits and RTC circuits need to keep running. If the main
battery is in the G526, it supplies power to these circuits. If the main battery is not available, the coin
battery or standby capacitor is required. The standby capacitor cannot provide sufficient power for the RTC
and other circuits, but it can be used for sudden momentary power loss (SMPL). Capacitors of different
capacitance may sustain power supply for different lengths of time. For example, 22 μF can sustain power
supply for over 10 seconds.
When the G526 is being charged, the charging settings of the standby power supply are valid all the time
and are not reset when SMPL occurs. When the main battery is in the G526, the charging process goes on
even if the G526 is powered off.
Figure 8-32 Charging circuit of the main battery and standby battery
Figure 8-33 Battery monitoring system
Figure 8-33 Battery monitoring system
The battery monitoring system (BMS) consists of four blocks:

4. Battery temperature detection

VREF_BAT provides voltage reference for external temperature detection and the battery ID pin. The
temperature threshold can be configured by adjusting the external resistors, as listed in Table 8-8.
Figure 8-34 Battery temperature detection
Table 8-8 Battery temperature thresholds and resistors' resistance values
5. Battery voltage alarms

A programmable window detector constantly adjusts the battery voltage VBAT. Upper threshold and lower
threshold are programmable and include hysteresis to improve stability. To prevent excess interrupts caused
by voltage dips, the occurrence of an interrupt is delayed for a specified period of time. Such delay is also
programmable. If the battery voltage returns to normal before the specified time period ends, the delay
counter is reset and no interrupt occurs.
Figure 8-35 Battery voltage alarm circuit of the PM8038

6. UVLO and SMPL

The under voltage lockout (UVLO) circuit constantly monitors VDD and when the battery level is low,
powers off the G526. The programmable UVLO threshold is lower than the lower battery threshold.
If VDD drops out of the voltage range and returns to normal within the specified time period, SMPL
initializes the power-on sequence. If the SMPL function is enabled, the SMPL function automatically runs
and recovers the voltage when an SMPL occurs.
7. Integrated power ICC
ICC collects data about the original open-circuit voltage (OCV) and constant current from the Coulomb
meter and calculates the battery resistance based on the measured voltage and current.
8. Battery MOSFET

8.4.11 Sensor Interfaces
Accelerometer
There are three suppliers (ADI, ST, and Freescale) for the accelerometers. The measurement range of ADI's
ADXL346 is ±2 g/±4 g/±8 g/±16 g with the highest precision of 1/256 g. The measurement range of ST's
LIS3DH is ±2 g/±4 g/±8 g/±16 g with the highest precision of 1 mg. The measurement range of Freescale's
MMA8452Q is ±2 g/±4 g/±8 g with the highest precision of 1/1024 g. The three components are all tri-axis
accelerometers with ultra-low voltage, high precision, and high resolution. They have built-in ADCs and
directly output digital signals. ADXL346 and LIS3DH are compatible with I2C and SPI communication
interfaces. MMA8452Q supports only I2C interfaces.
To make the three components pin-to-pin compatible, the following circuit designs are adopted:
 Use I2C interfaces that are supported by the three components. Connect pin 8 to IO power supply and
enable LIS3DH's I2C function. Pin 4 is I2C4_CLK_SENS, and pin 6 is I2C4_DATA_SENS. Connect
Pin 7 SA0 to ground and set the lowest position of the components' I2C address to 0.
 Connect Pin 2 to a 0.1 μF capacitor in series to ground per MMA8452Q's requirements.
 Connect Pin 10 to ground per LIS3DH's requirements and connect Pin 5, Pin 12, and Pin 16 to ground.
 Connect Pin 15 to VDD per ADXL346's requirements.
Figure 8-36 shows the accelerometer circuit.
Figure 8-36 Accelerometer circuit
Table 8-9 Interface signals
Signal Direction Description

I2C4_CLK_SENS Input I2C clock signal, connected to GPIO_45 of the
MSM8930.
I2C4_DATA_SENS In/Out I2C data signal, connected to GPIO_44 of the
MSM8930.

Signal Direction Description

VREG_LVS2_1P8 Power supply Power supply of the IO interface, powered by LVS2,
1.8 V.
ACCEL_INT1 Out Interrupt output signal 1, connected to GPIO_46 of the

MSM8930.
ACCEL_INT2 Out Interrupt output signal 2, connected to GPIO_67 of the
MSM8930.
VREG_L10_2P7 Power supply Power supply built in the accelerometer.
CS: used to select the SPI or I2C bus. In the sensor, CS is set high and I2C is selected.
SA0: used to select the I2C address. In the sensor, SA0 is 0, so the I2C addresses shown in Table 8-10 are
used.
Table 8-10 I2C address
Component Write Address Read Address
ADXL346 A6H A7H

LIS3DH 30H 31H
MMA8452Q 38H 39H
Table 8-11 Accelerometer's specifications
Parameter Microsoft's 38140023 ADXL346 Requirements Are

Requirements Met or Not
Dimension Tri-axis Tri-axis Yes

Sampling rate 100 Hz or less Output data rate: from Yes
0.1 Hz to 3200 Hz
Driver-selectable ±2, ±4, ±8 User selectable: ±2, ±4, Yes
g-ranges ±8, ±16
Resolution At least 8 bit. (10 bit 13-bit resolution Yes
recommended)
Accuracy ±5 degrees tilt at the ±2 Accuracy: ±0.25 Yes
g range recommended degrees tilt at the ±2
g-range recommended
Power modes recommends sleep and Power modes: sleep and Yes
active mode active mode
Signal-to-noise ratio ≤ 500 μg/√Hz
(SNR)

Compass
AK8963C is a highly-integrated mini tri-axis electronic compass that detects terrestrial magnetism in three
dimensions. It supports communication between I2C interfaces and SPI and has a measurement range of
±1200μT and sensitivity of 0.3 μT.
Figure 8-37 Electronic compass circuit
The following are the signals used in the compass circuit:

COMPASS_INT: data ready signal that connects directly to the MSM8930 and produces interrupt signals
when data is ready.
I2C4_DATA_SENS and I2C4_CLK_SENS: I2C interfaces used to configure the register and transmit data
from the accelerometer to the processor.
CS: Used to select the communication method between the SPI and I2C interface. In the compass, CS is set
high and I2C is selected.
CAD0 and CAD1: Used to select the I2C address. In the compass, CAD0 is 0 and CAD1 is 1, so the I2C
address is 0EH.
Table 8-12 Electronic compass specifications
Parameter Microsoft's 38140069 AK8963C Requirements Are

Sampling rate 60 Hz 8 Hz or 100 Hz Yes

Resolution At least 1 μT (0.3 μT 0.3 μT Yes
recommended)
Accuracy ±5 μT 0.3 μT Yes
Measurement range At least ±300 μT (±1200 ±4900 μT Yes
μT recommended)

Proximity and ambient light sensor

The proximity and ambient light sensor incorporates ambient light sensing (ALS), proximity detection, and
infrared LEDs and is supplied by two suppliers, AVAGO and TAOS. AVAGO's ADPS-990x is fully
compatible with TAOS's TMD2771x pins. Ambient light sensing is used for detecting the ambient light
brightness and adjusting the LED backlight brightness. Proximity detection is used for preventing mistaken
touch on the capacitive screen during calls.
The sensor emits infrared light using the built-in infrared emitting diodes and detects the returned infrared
light brightness using the built-in light detector, thereby implementing the function of a proximity sensor.
The sensor uses full image diodes in conjunction with infrared diodes to filter some invisible light from the
ambient light and realize the ambient light sensing capability similar to that of human eyes. The sensor
supports not only I2C interfaces, but also programmable interrupt thresholds.
Figure 8-38 shows the proximity and ambient light sensor circuit.
Figure 8-38 Proximity and ambient light sensor circuit
Interface signals
PROXIMITY_INT: Interrupt output that connects directly to the MSM8930 and provides interrupt signals
of proximity and ambient light. An interrupt occurs when the proximity or ambient light value input to the
ADC exceeds or is lower than the specified value.
I2C4_DATA_SENS and I2C4_CLK_SENS: I2C interfaces used to configure the register and send to the
processor the sensor's data, including the values of ambient light (when the sensor is exposed or shielded)
and the proximity sensor.
LDR is connected to LEDK and the LED driver built in the sensor is adopted.
The I2C address is 0x72/0x73.
Table 8-13 Ambient light sensor specifications
Parameter Microsoft's APDS-9900 Requirements Are

Standardized Similar to human eyes Similar to human eyes Yes

spectral response

Parameter Microsoft's APDS-9900 Requirements Are

Peak response Range: 0-100 lux This parameter is not listed in TBD
wavelength Resolution: 10 lux the manual.
resolution
Peak response Range: 100-1000 lux This parameter is not listed in
resolution
Accuracy: ±25%
Peak response Range: 1000-4000 lux This parameter is not listed in
resolution
Accuracy: ±25%
Sampling rate ≥ 4 Hz ALS ADC Integration Time: Yes
2.72-696 ms
Table 8-14 Proximity sensor specifications
Parameter Microsoft's Requirements APDS-9900 Requirements

Are Met or Not
Capable of detecting a 3 cm wide, 5 It is hard to detect a black
cm high card whether it is black, card and few projects can
grey, or white at a distance of 15 mm, do this because it sets high
4 mm, 2 mm, or 0 mm. requirements for the
structural design.
Sampling ≥ 10 Hz ADC Conversion Yes
rate Time:2.72 ms
8.4.12 Vibration Motor Interfaces

The vibration motor is on board S. Figure 8-39 shows the vibration motor circuit.
Figure 8-39 Vibration motor circuit

The VIB_DRV_N signal is connected to the corresponding pin on the PM8038 to drive the vibration motor.
8.4.13 Environment Monitoring and Protective Measures

HK/XO ADC in the PM8038 monitors the status of the G526's external environment, for example, the
power supply voltage, battery temperature, PA temperature, and crystal temperature. The housekeeping part
in Figure 8-40 shows the system overall structure.
Figure 8-40 High-level PM8038 IC functional block diagram

Power supply detection: The analog interfaces of the PM8038's power supply receives the detected signals
such as VBAT, VCOIN, VCHG, USB_IN, and DC_IN. The signals are then processed by the analog
multiplexer and sent to HKADC to be converted into digital signals.
Battery temperature detection: Connect the built-in negative temperature coefficient (NTC) thermistor to a
resistor in series and then to VREF_THERM. The voltage across the NTC thermistor is processed by the
analog multiplexer and sent to the HKADC to be converted into digital signals.
PA temperature detection: An NTC thermistor is placed beside the PA to measure the PA's temperature.
PA_THERM output from the thermistor is connected to the PM8038's analog multiplexer and sent to the
HKADC to be converted into digital signals. During the PCB design, place the thermistor as close to the PA
as possible.
Crystal oscillator temperature detection: A 19.2 MHz crystal oscillator with a built-in NTC thermistor is
used by connecting the TH-IN pin to the XO_THERM pin on the PM8038. The signals are processed by
the PM8038's built-in analog multiplexer and then sent to the HKADC to be converted into digital signals.
8.4.14 Charging Status Indicator Interfaces

The tri-color light driver is built in the PM8038. Figure 8-41 shows the driving circuit. The red light
LED_RED_DRV is connected to the RGB_RED pin on the PM8038. The green light LED_GREEN_DRV
is connected to the RGB_GRN pin on the PM8038. The blue light LED_BLUE_DRV is connected to the
RGB_BLU pin on the PM8038. The PM8038 adjusts the tri-color light's color and brightness by controlling
the rates and proportions of the driving currents.
Figure 8-41 Charging status indicator

Figure 8-42 Tri-color light circuit
8.4.15 PCBA Power Management

Power supply of the G526 is mainly implemented by the power management function of the PM8038.
PM8038's Power Management Chip

 Overall description of the PM8038's power distribution function:
The PM8038's power management chip provides two types of programmable voltage regulators: 6
switching power supplies and 27 LDOs. In addition, two outputs from two low voltage switches and one
negative voltage are provided.
Despite the dedicated functions, all regulators can be used for other functions except the following:
 S1: Can only be used to supply power to the modem and USB module of the MSM8930.
 S5: Can only be used to supply power to the krait #1 of the MSM8930.
 S6: Can only be used to supply power to the krait #2 of the MSM8930.
 L13: Can only be used to supply power to PMIC CLOCK.
 L15/L17: Can only be used to supply power to the UIM card.
Table 8-15 lists the specific parameters of each voltage regulator.
Table 8-15 Voltage regulators

 Reference source
All voltage regulators and other circuits in the PM8038 share a voltage reference. Special requirements for
the circuit are:
− The REF_GND pin is the ground of the voltage reference
− The REF_BYP pin is connected to a 0.1 μF bypass capacitor to ground and functions in
conjunction with internal resistors as a low-pass filter.
− The filtered voltage signals are provided to the MPP pin as analog output.
Figure 8-43 shows the voltage reference circuit.
Figure 8-43 Voltage reference circuit
 Switching power supplies

The PM8038's switching power supplies are implemented through pulse width modulation (PWM) and can
work in PWM mode or pulse frequency modulation (PFM) mode.
To increase the efficiency in low current mode, converters can work in low power mode: The converters are
turned off most of the time and are turned on for a short time to sustain the voltage output. In low power
mode, the buck converter reduces the pulse frequency and works in PFM mode, but when the load is too
light the pulse frequency may drop to the audio range, which affects the audio functions.

The PM8038 has six step-down switching power supplies. Two of them are fast switching power supplies
with the output current up to 2000 mA, and the other four are high frequency switching power supplies
with output current up to 1500 mA. The following methods are recommended:
 S1: supplies power (1500 mA) to the core of the MSM8930.
 S5: supplies power (2000 mA) to the krait#1 of the MSM8930.
 S6: supplies power (2000 mA) to the krait#2 of the MSM8930.
 L16/L19: supplies power (1200 mA) to the QDSP.
Figure 8-44 S1 switching power supply circuit
Figure 8-45 S51 switching power supply circuit
The buck converter provides two control modes: low power but time consuming PFM mode, and normal
PWM mode. To achieve the highest efficiency, the buck converter automatically switches between PFM
mode and PWM mode. You can also manually select a mode.
Both fast switching and high frequency power supplies use constant-frequency current-mode control
architecture with the switch built in the power supplies.
 LDO
An LDO regulator consists of four function modules: the reference voltage, controlled element, feedback
path, and difference amplifier. The four modules form a closed-loop control system to regulate the output
voltage to be close to the reference voltage instead of regulating the output current. The inputs of the
difference amplifier are the reference voltage and the voltage output from the feedback path proportionally.
Any difference of the inputs will cause the difference voltage generated by the amplifier. The closed loop

system changes the controlled element and thus changes the output voltage to decrease the difference to
zero. The accuracy of the output voltage does not vary with the current. Figure 8-46 shows the LDO's
function modules.
Figure 8-46 LDO's function modules
Reference voltage: The PM8038 uses the bandgap reference circuit to generate the reference voltage,
whose accuracy and stability directly affects the output voltage. The circuit can use any reference voltage
because the closed loop system includes the feedback of proportional signals.
Controlled element: The PM8038 uses a p-channel MOSFET as the controlled element to implement two
functions:
The gate-source voltage drop varies with the amplifier.
Large currents flow between the drain and source but the drain-source voltage drop is hardly affected.
When the circuit is switched on or off, the current that flows through the controlled element changes
significantly, which enables the phone to work in different modes (such as sleep, Rx, and Rx/Tx).
The PM8038's LDO regulators are classified into five types:
− Regulators for 1200 mA output: L1, L16, L19, L20, L24, and L27
− Regulators for 600 mA output: L5, L6, L7, L10, and L11
− Regulators for 300 mA output: L8, L9, and L12
 NCP
The PM8038 contains an NCP switching power supply to generate a negative 1.8 V voltage for the stereo
headset.
 Voltage switch
The PM8038 contains two 100 mA low voltage switches (LVSs): LVS1 and LVS2.
Some internal modules of the PM8038 use the outputs from special voltage regulators, which is performed
within the PM8038. These modules can work properly only when the regulators work properly and output
default voltages. Table 8-16 shows the connection relationship between internal modules and voltage
regulators.

Table 8-16 Connection relationship between internal modules and voltage regulators
8.4.16 MSM8930 Memory Allocation

Figure 8-47 illustrates MSM8930 memory allocation.

Figure 8-47 MSM8930 memory allocation
8.4.17 Board Power-on and Power-off Processes

Figure 8-48 shows the power-on and power-off processes triggered when the power key is pressed.

Figure 8-48 PM8038 power-on and power-off processes
Figure 8-49 shows PM8038 power groups.
Figure 8-49 PM8038 power groups
The power-on sequence starts when the power key is pressed and the KPDPWR_N signal of the PM8038 is
pulled down. To ensure a successful power-on process, this signal must be kept at low level before the
PS_HOLD signal is pulled up.
After the KPDPWR_N signal has been pulled down for a short time span (treg1), voltage regulators are
enabled in the sequence from Group 7 to Group 0 (the interval for enabling the power supplies in the same
power group is four sleep clock cycles). When each voltage regulator is enabled, the detection circuit
checks whether the voltage regulator is correctly powered on. Therefore, after a voltage regulator is enabled,
each power group enables the next voltage regulator with a short delay (treg). This rule applies until all
power supplies that are supposed to be on by default are powered on.
The PON_RESET_N signal is pulled up after a short delay (treset1). This delay aims to ensure that the
MSM8930 has enough time to complete the power-on process.

In the initial stage of the power-on sequence, the PS_HOLD signal can be in any status but it must be
pulled up before the tpshold timer is overflowed. When this condition is met, a successful power-on process
is complete.
If the PS_HOLD signal remains at low level after the tpshold timer is overflowed, the power-on process
fails, and the power-off process starts immediately. The PS_HOLD signal is always at high level while a
mobile phone is being powered on.
The power-off process starts when the power key is pressed and the KPDPWR_N signal of the PM8038 has
been pulled down for a specified period. This period must be long enough so the MSM8930 can determine
that the power key is not pressed accidentally. After this period, the MSM8930 pulls down the PS_HOLD
signal and requests the PM8038 to initiate the power-off process.
After a short time span (treset0), voltage regulators are enabled in the sequence from Group 0 to Group 7,
which is the reverse order for enabling voltage regulators during the power-on process.
Power-on Process
When the PS_HOLD signal remains at low level, the PM8038 is off, and the power-on circuit is detecting
the following events that can trigger the power-on sequence:
 The power key is pressed, and the KPDPWR_N signal is pulled down.
 Cable Poweron pins are pulled down.
 External power supplies are plugged in (the VCHG pin voltage exceeds the related threshold).
 A real-time clock alarm is generated.
 SMPL occurs.
Any of the preceding events can generate power-on signals, and a related interrupt signal is sent to the
triggering source of the MSM8930 power-on process. No matter what the triggering source is, the PM8038
performs the following power-on process:
Step 1 Any of the five triggering events occurs or they occur in sequence. The PM8038 determines
power supplies. If the VCHG pin voltage exceeds the related threshold, the charger is used as
power supplies. If the VCHG pin voltage does not exceed the related threshold, the PM8038
pulls up the BAT_FET_N signal, uses the main battery as power supplies, and prohibits
charging.
Step 2 The PM8038 enables the internal time slot reference.
Step 3 The PM8038 monitors the VDD voltage. If the VDD voltage exceeds the low voltage lock
threshold, the power-on initialization process continues.
Step 4 The PM8038 pulls down the PON_RESET_N signal even though this signal is not generated
because the MSMP has not been enabled. This mechanism ensures that the PON_RESET_N
signal can be in correct state during the MSM8930 power-on process.
Step 5 The PM8038 restores the SBI register settings to default values. If the VCOIN voltage is
lower than the related threshold, the PM8038 also restores the SBI bit powered by the standby
battery and the RTCRST interrupt.
Step 6 (Optional) The PM8038 sets the SMPL interrupt status bit and restores the SMPL timer if the
SMPL function is enabled and the SMPL restart signal is valid. This aims to prepare for the
next SMPL event.
Step 7 After the treg1 delay, the PM8038 enables voltage regulators in the following sequence: S2 >
L24 > S1 > S4 > L11 > L20 > L26 > L4 > L22 > L6 > L3 > L5.

Step 8 The PM8038 pulls up the PON_RESET_N signal a short delay (treset1) after all voltage
regulators that are supposed to be on by default have been powered on.
Step 9 The PS_HOLD timer starts counting and monitors the PS_HOLD signal from the MSM8930
in real time.
----End
A successful power-on process requires that the PS_HOLD signal changes from low to high before the
PS_HOLD timer completes counting. If the PS_HOLD signal has not been pulled up when the PS_HOLD
timer is overflowed, the PM8038 enters the off state again, and the power-on process returns to step 1. If
any of the five triggering events still occurs, for example, the KPD_PWR_N signal remains at low level,
the power-on process starts again. If the PS_HOLD signal becomes high before the PS_HOLD timer is
overflowed, the PM8038 enters the power-on state (sleeping or working) and sends the related interrupt
signal to the MSM8930 to determine the triggering source.
The power-on process fails if either of the following events occurs:
 The triggering signal disappears. In this case, the power-on process stops and returns to step 1.
 The VDD voltage decreases to the UVLO threshold before the PS_HOLD signal is pulled up. In this
case, the PM8038 terminates the power-on process and retries it twice. If all these three power-on
attempts fail, the PM8038 is reset and waits for the next triggering event.
If the PS_HOLD signal is pulled up before the VDD voltage decreases to the UVLO threshold, the restart circuit does
not work, and this event is processed in the same way as an SMPL event.
When the MSM8930 is powered on, the PM8038 remains on until the PS_HOLD signal is pulled down, a
UVLO event occurs, or an overheating shutdown event occurs. In any of these three cases, the PM8038
performs the power-off process.
Power-off Process
When the PS_HOLD signal of the MSM8930 remains at high level, the PM8038 is on and detecting any of
the following events that may trigger the power-off process:
 The power key is pressed, and the MSM8930 pulls down the PS_HOLD signal.
 The VDD voltage detected at the ISNS_M pin is lower than the UVLO threshold.
 The temperature of the PM8038 exceeds the overheating threshold.
The PM8038's KPDPWR_N pin (can be pulled up inside the PM8038) connects to the power key on the
mobile phone. In general, the power-off sequence is triggered if the power key is pressed when the
MSM8930 is on. The MSM8930 monitors the power key using the interrupt logic. When the KPD_PWR_N
interrupt signal is generated, the MSM8930 starts the power-off process:
Step 1 A user presses and holds the power key for a period of time. The power-off menu is then
displayed.
Step 2 The MSM8930 writes the information that must be saved into the FLASH when the user
chooses the power-off option.
Step 3 The MSM8930 disables the SMPL function to prevent itself from being powered on again.
Step 4 The MSM8930 pulls down the PS_HOLD signal.
Step 5 The PM8038 pulls down the PON_RESET_N signal, resets the MSM8930 and peripherals,
and shuts down the TXCO manager.

Step 6 After the treset0 interval, the MSM8930 determines the next action depending on the
following:
 If the temperature of the PM8038 exceeds the overheating threshold, the MSM8930 pulls down the
PON_RESET_N signal immediately and shuts down all PM8038 circuits to prevent the PM8038 from
being damaged.
 If the VDD voltage is lower than the UVLO threshold, the MSM8930 pulls down the PON_RESET_N
signal immediately and shuts down all PM8038 circuits to prevent the main battery from being
damaged.
 If neither of the preceding events occurs and the watchdog restart bit is set, the MSM8930 sets the
interrupt status bit of the watchdog. Then, the MSM8930 restarts, its watchdog timer resets, and the
PM8038 restarts without being completely powered off.
 If none of the preceding events occurs and the SMPL function is enabled, an SMPL process is
triggered.
 If none of the preceding events occurs, the normal power-off process continues.
Step 7 The MSM8930 shuts down the remaining power managers in turn. Only the main battery or
the VPH_PWR provided by external power supplies is used to supply power.
----End
8.4.18 Clock Solution

The MSM8930's clock source consists of two parts, the 27 MHz PXO clock and the 19.2 MHz CXO clock.
The 32. 768 kHz sleep clock signals are generated by the internal RC oscillation circuit and calibrated by
the 19.2 MHz CXO clock.
Source Output To Divided As Output To

Signal
19.2 PM8038: XO_OUT_A0 WTR1605: XO_IN

MHz XTAL_19M
clock XO_OUT_D0 MSM8930: CXO and USB_HS_SYSCLK
signals
SLEEP_CLK (32.768
kHz)
27 MHz MSM8930: PXO SB_CLK WCD9304: SB_CLK
clock (27 MHz)
signals SB_MCLK WCD9304: MCLK
8.4.19 RTC
The RTC function is implemented by a 32-bit real-time counter and one 32-bit alarm, both configurable in
one-second increments. The primary input to the RTC circuit is the selected sleep clock source (32.768 kHz
crystal, calibrated low-frequency oscillator, or divided-down 19.2 MHz XO). Even when the phone is off,
the selected oscillator and RTC continue to run off the main battery.

NOTE
The RTC function can be disabled using a one-time programmable (OTP) bit to save current while the PM8038 is in its
off state. If the main battery is present and an SMPL event occurs, RTC contents are corrupted. As power is restored, the
RTC pauses and skips a few seconds. The phone must reacquire system time from the network to resume the usual RTC
accuracy. Similarly, if the main battery is not present and the voltage at VCOIN drops too low, RTC contents are again
corrupted. In either case, the RTC reset interrupt is generated. A different interrupt is generated if the oscillator stops,
also causing RTC errors.
Table 8-17 lists the RTC performance specifications.
Table 8-17 RTC performance specifications
8.4.20 UVLO and SMPL Recovery Functions

The PM8038 supports the UVLO and SMPL functions.
The UVLO circuit monitors the VDD voltage and turns off the PM8038 when the voltage is too low. The
threshold (2.70 V by default) for voltages that can trigger a UVLO event can be programmed, from 1.50 V
to 3.05 V by 50 mV. This threshold must be lower than the low voltage alarm threshold of the phone.
The UVLO is realized by hardware. Signals output by the UVLO circuit can be used for additional features,
such as SMPL recovery, power-on sequence termination, and timeout soft reset of the watchdog.
The low VDD voltage for a certain period will trigger a UVLO event. Setting a timeout duration prevents
noise signals from being detected as UVLO events. Once a UVLO event is detected, the PON_RST_N
voltage will be pulled down, and the phone will be powered off. The UVLO event detection does not
involve software. The timeout duration length cannot be modified. The UVLO events do not generates
interrupt signals.
Figure 8-50 UVLO event detection mechanism
The SMPL recovery function enables the PM8038 to restart after a momentary power-off.

The SMPL recovery can be enabled using software. After you enable the SMPL recovery, if the VDD
voltage recovers to the normal value (higher than 2.7 V) within the preset timeout duration (0.5s to 2.0s),
the following recovery process will be initiated:
 Driven by the UVLO event, the PON_RST_N voltage is pulled down, and the PM8038 is powered off.
 The keep-alive capacitor or standby battery connected to the VCOIN pin starts to power the SMPL
circuit.
 If the VDD voltage resumes within the preset timeout duration, the PM8038 powers on again without
requiring software intervention. Meantime, the PM8038 sends interrupt signals to the MSM8930 to
inform that a sudden momentary power loss has happened, the RTC is affected due to the abnormal
voltage, and the current power-on process is abnormal.
 If the VDD voltage fails to resume within the preset timeout duration, the phone powers off. Only a
normal power-on process can bring the phone back on.
To use the SMPL recovery function, enable it using software and ensure that the phone has a keep-alive
capacitor or standby battery.
Figure 8-51 shows the VCOIN circuit of the G526. The 44 uF capacitor ensures that the RTC is maintained
when you replace the phone's main battery.
Figure 8-51 VCOIN circuit
8.5 RF Subsystem
The RF subsystem consists of the transceiver, frequency source, antennas, GPS module, and
Bluetooth+Wi-Fi module. This section provides the details of each module.
8.5.1 LTE/WCDMA/GSM Transmission

The RF subsystem uses the WTR1605L chip for RF transmission and reception and GPS functions. Figure
8-52 shows the block diagram of the WTR1605L.

Figure 8-52 WTR1605L block diagram
Reception
The WTR1605L provides seven reception channels, including three low-frequency channels, three
intermediate-frequency channels, and one high-frequency channels. In addition, the WTR1605L has four
WCDMA diversity reception channels, among which two channels are used to receive low-frequency
diversity signals and the other two channels are used to receive intermediate-frequency and high-frequency
diversity signals. The WTR1605L has one GPS (A-GPS also supported) signal reception channel used to
transmit I/Q signals to the baseband. GSM and WCDMA modules share two channels to output I/Q signals
to the baseband.
Transmission
The WTR1605L's transmission circuit supports WCDMA, GSM, CDMA, and LTE systems.
 The WCDMA system supports B1, B2, B3, B4, B5, B8, B9, and B19 frequency bands.
 The GSM system supports GSM, EGSM, PCS, and DCS frequency bands.
 The CDMA system supports the BC0, BC1, BC6, and BC15 frequency bands.
 The LTE system supports B1, B2, B3, B4, B5, B8, B9, B19, and B41 (not supported currently in the
product design) frequency bands.

Transmit Channels
The G526 uses the following three PAs:
 MMMBPA used for GSM850, GSM900, GSM1800, GSM1900, WCDMA B1, WCDMA B2,
WCDMA B4, WCDMA B5, WCDMA B8, LTE B3, and LTE B4
 PA used for LTE B7
 PA used for LTE B20
Figure 8-53 shows the block diagram of the MMMBPA.
Figure 8-53 MMMBPA block diagram
Figure 8-54 shows the transmit channel for the LTE B7.
Figure 8-54 LTE B7 transmit channel
Figure 8-55 shows the transmit channel for the LTE B20.

Figure 8-55 LTE B20 transmit channel
The preceding transmit channels, PA enabling signals and gain switching signals are provided by the
MSM8930.
8.5.2 LTE/WCDMA/GSM Reception

Reception circuits consist of LTE, WCDMA, and GSM reception channels. The main antenna receives
main reception signals, which go through the main antenna switch and finally arrive at the WTR1605L.
Figure 8-56 shows the main antenna and its switch.
Figure 8-56 Main antenna and its switch
The diversity frequency bands of the G526 are the W2100, LTE B3, LTE B4, LTE B7, and LTE B20. The
LTE B20 band uses an independent antenna, while the LTE B1, LTE B3, LTE B4, and LTE B7 share the
same reception antenna.

WCDMA Reception Channel

After going through the main antenna and main antenna RF switch, the WCDMA reception signals are sent
to the duplexer, and then mapped to the WTR1605L. Figure 8-57 shows the signal reception for the
WCDMA B1 band.
Figure 8-57 Signal reception for the WCDMA B1 band
Figure 8-58 shows the signal reception for the WCDMA B2 band.


GSM Reception Channel

After going through the main antenna and main antenna RF switch, GSM reception signals are mapped to
the RTR8615. G900 signals are sent through the PRX_LB2 channel (sharing the same reception channel
with the WCDMA B8 band); G850 signals are sent through the PRX_LB3 channel (sharing the same
reception channel with the WCDMA B5 band); G1800 signals are sent through the PRX_MB3 channel; and
G1900 signals are sent through the PRX_MB2 channel.
LTE Reception Channel

After going through the main antenna and main antenna RF switch, LTE reception signals are mapped to
the RTR8615.
Figure 8-62 shows the LTE B3 and B4 reception channel.
Figure 8-62 LTE B3 and B4 reception channel

The LTE B7 and LTE B4 bands share the same reception port. Figure 8-63 shows the LTE B7 reception
channel and the compatibility design.
Figure 8-63 LTE B7 reception channel and compatibility design
Figure 8-64 shows the LTE B20 reception channel.
Figure 8-64 LTE B20 reception channel
8.5.3 Frequency Source

The WTR1605L integrates all LO generation circuits required by WCDMA reception, GSM reception and
transmission, and GPS reception. Three internal LO circuits are available, and each circuit has independent
PLL, VCO, and distribution circuit. In addition, an external filter circuit is used. These circuits use
PM8930's XO input as the referent clock source, as shown in Figure 8-65.

Figure 8-65 Frequency source
The first local oscillator in the WTR1605L is used in all GSM and WCDMA transmit channels, the second
one is used in all GSM and WCDMA reception channels, and the third one is used in all GPS reception
channels.
8.5.4 GPS and B1 Diversity

The WTR1605L integrates the GPS circuit. After being filtered and amplified by the external low noise
amplifier (LNA), GPS signals are sent to the WTR1605L. Figure 8-66 shows the GPS reception circuit.
Figure 8-66 GPS reception circuit
8.5.5 Wi-Fi and Bluetooth

The G526 uses the Qualcomm WCN3660 chip as a Bluetooth & Wi-Fi-integrated module to implement
Bluetooth and Wi-Fi functions.

In this design, the Bluetooth and Wi-Fi functions share one antenna. The timeshare design in this solution
realizes the multiplexing of Wi-Fi and Bluetooth functions without any SP3T RF switches. Figure 8-67
shows the circuit.
Figure 8-67 Wi-Fi and Bluetooth circuit
The MSM8930 provides a PCM interface that interconnects to the Bluetooth module's PCM signals. Figure
8-68 shows signal definitions.
Figure 8-68 Signal definitions
The following signals are used to connect the WCN3660 chip and MSM8930:
 BT_WAKES_MSM: This is the Bluetooth module's wake-up output signal, which connects to the
Bluetooth module's HOST_WAKE pin to wake up the MSM8930 from sleep mode.
 MSM_WAKES_BT: This connects to the Bluetooth module's BT_WAKE pin to allow the MSM8930
to wake up the Bluetooth module from sleep mode.
 UART interface
9 Troubleshooting for Common Faults
Before troubleshooting, ensure that software on the phone has been restored to default settings and is working properly.
9.1 Phone Cannot Be Powered On

Such issues can be classified into three types (no current, small current, and large current). If you come
across such issues that are caused by power anomalies, conduct troubleshooting measures for the power
anomalies.
If the G526 cannot be powered on, conduct troubleshooting measures based on the fault type.

 No current when powered on: Connect the phone to a DC power supply. When you press the power
button, the current displayed on the DC power supply is between 0 mA and 5 mA.
 Small current when powered on: Connect the phone to a DC power supply. When you press the power
button, the current displayed on the DC power supply is between 5 mA and 10 mA.
 Large current when powered on: Connect the phone to a DC power supply. When you press the power
button, the current displayed on the DC power supply is above 300 mA.
9.1.1 No Current
Figure 9-1 Troubleshooting process when no current is detected
The G526 cannot be

powered on
Connect the G526 to a false battery and

maintenance power supply, observe the
current when you press the power
button
No current
Y
Is the keypad copper Clean the keypad
foil oxidized?
Measure the VPH_PWR voltage to see if N

it is between Check the U201
3.4 V and 4.2 V and equal to the
maintenance power supply voltage
Check the clock X202
Such issue is often due to a short circuit of the primary power supply. Especially check the VBUS and VSYS power
supplies to see whether a short circuit occurs.

9.1.2 Small Current
Figure 9-2 Troubleshooting process when a small current is detected
The G526 cannot be

powered on
Connect the G526 to a false

battery and maintenance power
supply, and observe the current
when you press the power button
The current is between 5

mA and 10 mA
Check whether the

Check the U201
U201 outputs DC
voltage
Y
Check the U501 to see if a short Locate the cause
circuit occurs in other outputs
Replace the U201
If the Vph-pwr voltage is normal but the U201 output is abnormal, it is probably because of a short circuit in other
outputs of the U201, which causes failure of the PMU power supply output. In such cases, check if a short circuit occurs
in any of U201's outputs.

9.1.3 Large Current

Large current often results from a short circuit in the power supply circuit, that is, VBAT is short to ground.
Figure 9-3 Troubleshooting process when a large current is detected
The G526 cannot be

powered on
Connect the G526 to a false

battery and maintenance power
supply, and observe the current
when you press the power button
The current is 500

mA or above
N
Check whether Pin 1
Check the U201
of the J1501 is short to
ground
Y
N Resolder or replace
Check to see if the voltage of the
the U201
U201 is normal
Y
Check the U201

9.2 No Signal Received

This section uses the troubleshooting procedure for the WCDMA2100's signal reception as an example.
Figure 9-4 Troubleshooting process for signal reception failure
The WCDMA2100
reception channel is faulty
Check the J3201 without

the RF cable pluged in
Check if Pin 1 of the N

J3302 and the middle Check the J3302
thimble work properly
Check if the U3301 switch

Check the U3301 and
control signal is normal. (Refer
U301
to the truth table.)
Y
Check to see if the U4501 signal

N Check the U4501
is normal
Check to see if the IQ signal of

the U5601 is normal and
N Check the U5601
whether the power supply
voltage is noraml
Check the U301
End

Use the multimeter or oscilloscope to test whether the switch control signals of the U3201 are normal. Table 9-1 shows
the truth table of the control signals.
Table 9-1 Truth table
The troubleshooting procedure for other frequency bands is similar. When issues occur in the LTE_B7 or
LTE_B4, check the compatible DP4T.
9.3 No Transmission Detected

If the transmission of the WCDMA2100/WCDMA900/GSM850/900/GSM1800/1900 is not detected,
check whether the contact of the SIM card or antenna is proper and then follow the following example,
which is the troubleshooting procedure for the WCDMA2100 frequency band.
The troubleshooting procedure for other frequency bands is similar.

Figure 9-5 Troubleshooting process for signal transmission failure
The W2100 transmission

channel is faulty.
Check the J3201 without

the RF cable pluged in
N
Check whether Pin 1 and Pin 2 Check the J3201
of the J3201 works properly
Check whether the U3301

N
switch control signal is normal. Check the U3201 and
(refer to the truth table.) U301
N
Check whether Pin 7 and Pin 12
Check the U3301
of the U3301 have an insertion
loss of 2.5db or less
Y
N
Check whether the PA output of Check the U5601

the U5601 is normal
Y
N
Check whether
Y the IQ input of
Check the U5601
the U5601 and power supply
voltage are normal
Check the U301
End

9.4 Charging Failure

Figure 9-6 Troubleshooting process for charging failure
Charging does not start when
the charger is plugged in
N
Does the charger work Replace the
properly? charger
Y
Y
Check to see if the Repair the soldering
J1501 has pseudo of the J1501
soldering
N
Check to see if there is a voltage
Replace the Q301
across the VPH_PWR
N
Check to see if the battery Repair the J1501
connector contacts properly with
the battery
Is the battery damaged?

Y Replace the
battery
N
Check the U201

9.5 Photo Taking Failure

Figure 9-7 Troubleshooting process for photo taking failure
Photo taking does not work
Y
If the problem solved after End
the software is reloaded?
N
Y
Check to see if the J2101 is Repair the soldering
poorly soldered of the J2101 or
replace the J2101
N
Y
If the problem solved End
after the camera is
replaced
Replace the U2101 Y End
Replace the U301

9.6 Data Transmission Failure

Figure 9-8 Troubleshooting process for data transmission failure
Data transimission fails.
Y
Is the problem solved
after you use a normal End
USB cable
Y
Check to see if the 5-pin mini
USB port is poorly soldered Repair the soldering
Is the problem solved Y

after you reload the End
board software
Is there a voltage Replace the U201

acorss the Vchg?

9.7 Sound Reception Failure

Figure 9-9 Troubleshooting process for sound reception failure
No sound is received after

a call is setup
N
Check to see if the
End
receiver volume settings
are normal
Y
Y
Does the phone mistakenly
Replace the headset
judge that a headset is plugged
connector
in?
N
Y
after the receiver is End
replaced?
Replace the
U1701

9.8 Sound Transmission Failure

Figure 9-10 Troubleshooting process for sound transmission failure
No sound is transmitted
after a call is set up
Y
Is the problem solved End
after you reload the
software
N
N
Check to see if the MICBIAS Check the U201
voltage is 1.8 V
Y
Y
after you replace the End
microphone
Replace the
U1701

9.9 Vibration Failure

Figure 9-11 Troubleshooting process for vibration failure
Vibration fails
Y
End
after you reload the
software
N
Y
Is the problem solved after you End
replace the motor
Check to see if the voltage Y

across the VIB_DRV_N is Replace the FPC
equal to the battery voltage
N
Replace the main FPC

9.10 Ringtone Failure

Figure 9-12 Troubleshooting process for ringtone failure
The phone does not ring

with incoming calls
N
Are the ringtone volume End
settings correct?
Y
Y
Is the problem solved after End
you reload the software?
N
Y
replace the speaker?
Is the FPC is properly installed? N Reinstall or

replace the FPC
Is the problem solved after you Y End

replace the volume board?
Replace the
U1701

9.11 LCD Display Failure

Figure 9-13 Troubleshooting process for LCD display failure
The LCD does not

work
Y
Is the problem solved after End
you reload the software?
Is the problem solved after Y

you reinstall the LCD ZIF End
connector?
Is the problem solved Y End

after you repalce the
LCD?
N
N
Check the T2001, T2003, Replace the
and T2004 to see if their U201
impedences to ground are 0
ohms
Y
Replace the U301

9.12 Keypad Failure

Figure 9-14 Troubleshooting process for keypad failure
The keypad does not work
N
Is the dome keypad in good Clean the keypad
contact with the FPC?
Y
Y
End
after you replace the
FPC?
Reload the
software

9.13 No Sound Is Heard from the Headset

Figure 9-15 Troubleshooting process when no sound is head from the headset
No sound is heard after a call is set

up
N
Are the volume settings End
correct?
Y
Y
replace the headset?
N
N
Is the headset icon Replace the
displayed? headset connector
Replace the
U1701

9.14 microSD Card Detection Failure

Figure 9-16 Troubleshooting process for microSD card detection failure
The microSD card is not detected
Y
Is the problem solved after 结束
you replace the microSD?
N
Y
Is the microSD card holder
Replace the microSD
lifted?
card holder
N
Y
Does pseudo soldering Repair the soldering
occurs on the Z2302?
Replace the U301

9.15 GPS Signal Reception Failure

Figure 9-17 Troubleshooting process for GPS signal reception failure
No GPS signal is received
N
Check to see if the GPS
antenna is in good contact Replace the antenna or
with the corresponding contact spings
contact springs
Y Y
Check to see if pseudo

soldering occurs in the GPS Repair the soldering or
circuit replace components
Reload the software

10 Functions
10.1 Buttons and Keys
Power button
Volume up button
Volume down button
Back
Home
Menu
10.2 MMI Test

On the standby screen, press *#*#2846579#*#* to access the MMI test mode. Press the volume down
button to proceed to the next step, the menu key to skip the current test, and the back key to return to the
previous test.
Table 10-1 MMI test

No. Item Content Test Method
1 microSD microSD card If the microSD card is detected by the G526 and functions
card test test properly, the test succeeds. Press the volume down key to
proceed to the next test.
2 Key test Key test Press the keys and buttons one by one. The test succeeds if the
buttons on the screen changes their colors correspondingly.
Press the volume down button to proceed to the next test.
3 LCD test ● White The test succeeds if the following conditions are met:
screen ● The LCD displays a white screen when you press the volume
● Blank down button.
screen ● The LCD displays a black screen when you press the volume
● Color screen down button again.
● The LCD displays a red, green, and blue screen when you
press the volume down button for a third time.

4 LCD LCD The test succeeds if the LCD backlight constantly goes on and
backlight backlight test off. Press the volume down button to proceed to the next test.
test
5 Keypad LED Keypad LED The test succeeds if the keypad LED constantly goes on and off.
test test Press the volume down to proceed to the next test.
6 Touchscreen Touchscreen Touch the touchscreen along its four edges. The test succeeds if
test all the four edges become red.
7 Proximity Proximity Place the shielding card 4 mm away from the proximity sensor
test sensor test hole on top of the touch panel. The test succeeds if the icon
turns from a head image to a phone image.
8 Ambient Ambient light Check whether data is displayed for the ambient light. Access
light test sensor test the ambient light test screen, orient the phone toward the light,
and place your hand in front of the ambient light sensor. The
phone software automatically detects the light changes and
determines whether the test succeeds. If the test succeeds, the
screen for the next test is displayed without any success
indication. If the test fails several times, press the menu key to
confirm the failure.
9 Motor test Motor test The test succeeds if the motor keeps vibrating.
10 Speaker test Speaker test The test succeeds if the left and right speakers produce music in
turn.
11 Receiver test Receiver test The receiver plays an audio in loop mode. Press the volume
down button to proceed to the next test.
12 Microphone Microphone Press Record, say a word, and press Play. The microphone is
loopback test test working properly if you can hear what you said from the
receiver. Plug in the headset, press Record, say a word, and
press Play. The headset microphone works properly if you can
hear the word you said from the earphone.
If both microphones work properly, the test succeeds.
13 FM test FM Search for an FM station. The test succeeds if the FM station is
heard from the earphone.

14 Headset Headset cable The test succeeds if the In icon is green when the headset is
cable test plugged in, and the Out icon turns green when the headset is
removed.
15 CMMB test CMMB The test succeeds if signals are detected. Press the volume down
button to proceed to the next test.
16 5 MP 5MP camera The test succeeds if all the following conditions are met:
camera test The preview is displayed.
When you press the volume up button, a photo is taken and the
flash light flashes once. When you press the power button, the
auto focus function works properly.
17 0.3 MP 0.3 MP The test succeeds if the preview is displayed. Press the volume
camera test camera down button to proceed to the next test.
18 Bluetooth Bluetooth The test succeeds if a Bluetooth device is found.

test Press the volume down button to proceed to the next test.
Note:
Use a Bluetooth-enabled device to assist this test.
19 Gravity Acceleration Move the phone in three-dimensional space. The test succeeds
sensing test of gravity if the angles between the phone and the three coordinate planes
are all 45 degrees.
20 Wi-Fi test Wi-Fi The test succeeds if Wi-Fi signal reception is normal.
Note:
Use a device as the Wi-Fi hotspot to assist this test.
21 SIM card SIM card The test succeeds if the SIM card is detected and functions
test properly. Press the volume down button to proceed to the next
step.
10.2.2 Voice Call Test

Step 1 Install a normal SIM or USIM card and the battery.
Step 2 Press the power button to power on the phone.
Step 3 Check whether the signal strength changes correctly in a normal network.
Step 4 Dial the number of a fixed-line phone to test the voice quality during a call.
Step 5 If all the preceding tests succeed, end the voice call test. Otherwise, perform the test again or
send the phone to an advanced maintenance center for repair.
----End
Attachment:

G526 PCBA circuit diagrams
G526 PCBA circuit

diagrams.pdf
G526 PCBA reference designators
G526 PCBA
reference designators.pdf
G526 empty and soldered spots
G526 empty and

soldered spots.pdf

HUAWEI G526 Maintenance Manual (G526, V1.0, English, Normal) PDF

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G526 Maintenance Manual V1.

Huawei Technologies Co., Ltd.

Date Revision Revision Section Change Author

2013-07-18 Huawei Confidential Page 2 of 103

2 Applicable Scope and Precautions ............................................................................................ 7

3 Exploded View and PCBA Components .................................................................................. 8

4 Software Upgrade ....................................................................................................................... 13

5 Maintenance Tools ...................................................................................................................... 16

2013-07-18 Huawei Confidential Page 3 of 103

8.4.15 PCBA Power Management ................................................................................................................. 61

9 Troubleshooting for Common Faults ...................................................................................... 81

10 Functions ................................................................................................................................... 100

2013-07-18 Huawei Confidential Page 4 of 103

2013-07-18 Huawei Confidential Page 5 of 103

Weight About 150 g with a battery

2013-07-18 Huawei Confidential Page 6 of 103

Static –104 dBm minimum

2 Applicable Scope and Precautions

2.3 Obtaining Product and Repair Information

2013-07-18 Huawei Confidential Page 7 of 103

3 Exploded View and PCBA Components

Table 3-1 G526 Components

No. Item Quantity

2013-07-18 Huawei Confidential Page 8 of 103

No. Item Quantity

2013-07-18 Huawei Confidential Page 9 of 103

3.2 Components on the PCBA

U1403 eMMC and LCD

J2001 LCD connector U3301 RF switch

J2302 microSD card

J2301 SIM card connector

2013-07-18 Huawei Confidential Page 10 of 103

J2102 front camera

U201 power management

U2101 flash light IC

U2801 NFC chip

J2602 BTB connector

Table 3-2 Component descriptions

Reference Designator Huawei Code Description

2013-07-18 Huawei Confidential Page 11 of 103

Reference Designator Huawei Code Description

2013-07-18 Huawei Confidential Page 12 of 103

Reference Designator Huawei Code Description

Upgrade environment Computer Used to copy the upgrade software.

2013-07-18 Huawei Confidential Page 13 of 103

Category Item Description

microSD card Available space: ≥ 2 G.

Battery Remaining battery life: ≥ 30%.

4.2 Upgrade Procedure

Figure 4-1 Upgrading

2013-07-18 Huawei Confidential Page 14 of 103

2013-07-18 Huawei Confidential Page 15 of 103

Name: soldering iron

Name: DC power supply

Name: soldering table

Name: lead-free solder wire

Name: digital multimeter

2013-07-18 Huawei Confidential Page 16 of 103

Name: electric screwdriver

2013-07-18 Huawei Confidential Page 17 of 103

5. Remove the rear housing. 6. Disconnect the BTB connectors.

2013-07-18 Huawei Confidential Page 18 of 103

7. Loosen the PCBA fastener. 8. Remove the PCBA.