Rexolite 2200 Product Specifications

Rexolite® Cross-LinkedPolystyrene - Translucent -

DESCRIPTION
Rexolite 2200 is a thermoset cross linked styrene copolymer. This material is glassed filled which provides it with greater
temperature stablility and strength. Rexolite 2200 is highly suited for missile and other applications where extreme cold, thermal
shock and mechanical stress are encountered. This material is available in copper clad, commonly used for printed circuit
boards.

FEATURES FORMS
• Plate
• Rod

TYPICAL PROPERTIES

Type Property UOM Value Testing Method

Mechanical Flexural Strength psi 10500 D790

Mechanical IZOD Impact Strength Notched ft-lb/in 0.75 D256

Thermal Volume Resistivity, 50% RH ohm-cm 5X10^13

Thermal Thermal Conductivity BTU-in/ft 1.45 C177

Thermal Coefficient of Linear Thermal Expansion (x 10^-5 in./in./ 5.7?10^4

Electrical Dissipation Factor@1 MHz 0.0004 D150

Electrical Dielectric Strength. 1/8? th. V/mil 500 D149

Electrical Surface Resistivity @60 Hz ohms/sq 5X10^12 D257

NOTE: The information contained herein are typical values intended for reference and comparison purposes only. They should NOT be used
as a basis for design specifications or quality control. Contact us for manufacturers' complete material property datasheets

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