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com

Structured scintillators for digital X-Ray imaging


Anna Sahlholm
Scint-X Team

Per Wiklund, CEO. M.Sc., DIHM.


R&D in VLSI process and device technology. International M&S at Ericsson.
Anna Sahlholm, Process Engineer. M.Sc.
Research experience in materials chemistry.
Olof Svenonius, CTO. M.Sc.
Specialist in Optronics and sensors.
Carina Näsgårde, process technician
Long experience from semiconductor process development
Jan Linnros. Professor, KTH Stockholm
20 years research in solid state physics. Patent holder. Headed research activities

Advisory Board:
Professors Ulf Welander, Sture Petersson, Christer Fröjd
Scintillator technology for imaging x-ray detectors

Digital vs. Analog x-ray imaging:


+No chemicals involved. Image processing. Easy distribution
+Lower dose
−But lower resolution and contrast
Scint-X solves this problem !

”state of the art” scintillator Scint-X scintillator


Scint-X technology

Etched channels (Si wafer)

Scintillator
(CsI:Tl)

Pixellated sensor (CCD,


CMOS)

Conventional detector: Scint-X patented solution –


Trade-off between resolution and Structured scintillator:
sensitivity High resolution and high sensitivity
Scintillating waveguide

X-Ray photons
(~0-70 keV)

ƒ Incident X-Rays generate light at 550 nm


Silicon wavelength
ƒ 55 photons/X-ray photon/keV
ƒ Critical angle 35° (NA=0,57)
ƒ Rays at larger angles absorbed in Si
6 °
SiO2
(n=1,46) 6CsI(Tl) θc=35
(n=1,79) ƒ Advantages:
Light High absorption Î signal +
(λ=550 nm)
Light confinement Î resolution +
ƒ Challenge:
Waveguide loss Î signal -
CCD pixel CCD pixel
Characteristics

ƒModulation Transfer Function (MTF)


Ability to reproduce contrast vs. Spatial Frequency
Slant edge analysis according to ISO12233
- Low frequencies: coarse objects/large fluctuations
- High frequencies: fine objects/pixel pitch

Ideal: MTF = sin(x) / x Slant edge applied at small angle


Characteristics

MTF Comparison:

0.9

0.8

0.7

0.6
MTF

0.5 40 µm
0.4
30 µm
0.3
20 µm
0.2 CsI needle
0.1

0
0 5 10 15 20 25
Frequency [lp/mm]
Market for imaging x-ray detectors

Medical X-ray
Intra-oral sensors
Thinner detector
Improved image resolution and contrast
Modular scintillator – lower cost

Industrial Radiography
AXI, X-ray microscopy of materials
High resolution
Modular scintillator – lower cost
Process

Etched wafers

Deposition of CsI(Tl)

Melting and filling of CsI(Tl), annealing

Polishing

Polymer spinning

Dicing
Measurement setup

ƒX-Ray source:
Planmeca Intra, commercial dental source
E = 60..70 kVp
t = 20..800 ms

ƒSensor:
Hamamatsu S8981, commercial oral sensor
Scintillator removed – bare FOP
1000x1500 pixels, 20x20 µm
20x30 mm active area
Results - Comparison with ”state of the art” competing technology

Example: Integrated Circuit X-ray inspection

State of the art scintillator Scint-X scintillator (40 um pitch)


Results - Comparison with ”state of the art” competing technology
Where are we now?

9 Research at KTH: publications, PhD thesis, patent

9 Scint-X AB founded in 2007

9 Four full time employees

9 Funding: 10 MSEK (3 MSEK venture capital)

9 Prototypes tested – anticipated function verified

9 Two ”Letter of Intent” signed (dental x-ray)

9 Two orders from Swedish Space Corporation (Material analysis)

9 Project for industrialization started 2009


Thank you!

Questions?
Results - Comparison with ”state of the art” competing technology
Characteristics

ƒConversion Function (CF)


Light output vs. Exposure time (dose)
- X-Ray to photon conversion
- Waveguide efficiency

Sample S14: 365x365 pixels


Characteristics

ƒVariance
Variance vs. Exposure time (dose)
- Total noise: X-Ray induced & other

Ideal: Variance = k x Dose Sample S14: Gain-compensated


Characteristics

ƒSignal to Noise Ratio (SNR)


Signal (CF) / Noise (√variance) vs. Exposure time (dose)
- Total noise: X-Ray induced & other

Ideal: SNR = k x √Dose

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