Process / input Data source

Sample Size Who When How

(X) and location

Sanjay /
Spin cup pin shape IPQC Report , Line 72 samples/ day Feb~Apr'10 Observation
Naveen
Sanjay /
Capillary vacuum pin IPQC Report , Line 72 samples/ day Feb~Apr'10 Observation
Naveen
Scanner (intensity of
Calibration
light, inspection Sanjay /
Scanner Setting Once in a week Feb~Apr'10 of scanner
region, handler Naveen
and recheck
position)
Sanjay /
Handler height Scanner Setting Once in a day Feb~Apr'10 Observation
Naveen
Splash from dye- Sanjay /
IPQC Report , Line Monitoring Feb~Apr'10 Observation
coating Naveen
Splash from edge- Sanjay /
IPQC Report , Line Monitoring Feb~Apr'10 Observation
washing Naveen

Air entrapment in Sanjay /

Dye circuit in line Once in a day Feb~Apr'10 Observation
dye-circuit Naveen

Dye drop detection Sanjay / Scanner

DVD-MIS Once in a day Feb~Apr'10
parameter Naveen Yield
Digital
Digital meter on Monitoring 24 Sanjay /
Barrel temperature Feb~Apr'10 screen on
Line hours Naveen
M/C
Production
Sputtering unit & Monitoring over a Sanjay / Log Book &
Mask condition Feb~Apr'10
MPC week / month Naveen vernier
calipers
Other data that
should be
collected at the
same time
Bonding unit
temperature
Capillary time &
resin temperature

LED life

Maint. Record for

dye ckt related work

Inspection
parameter

Back pressure,
mold temperature
 Department
PRODUCTION/
IMM QUALITY
PROCESS
Sub Process

PC treatment 124 degC / 4hrs. Start

Stamper Loading. A1

Injecting homogenous mixture into the mold. A2

A1

The stamped blank substrate from mold is placed in

A3
Pre-cooler.

From pre-cooler blank substrate is placed at input

A4
conveyor.

Blank substrate is inspected for visual & mechanical NO

characteristics. D1

YES
Blank substrate passes through cooler at 27degC. A5

Blank substrate is coated with dye in dye cup. A6

On dye coated substrate image printing is done in

A7
hub area using printer unit.
NO

After image printing,dye coated substrate is passed D2

through QC1 scanner for identifying A,B&D
category product.
YES
After scanning,dyecoated & dummy substrates are A8
passed through drier at 100 degC.

On dye coated side silver is sputtered to make

A9
reflective layer in sputter unit.

Uncovered portion of sputtered substrate is cleaned A10

in edge-washing cup using chemical solvent.

Sputtered (edgewashed) & dummy substrates are

A11
passed through de-ionization bar on bonding
conveyor.

At bonding station (L/R) glue is dispensed on A12

sputtered substrate & dummy is placed over it.

1
 1

Unbonded pair from bonding station is placed at

A13
capillary table (L/R) for capillary action.

Unbonded pair is placed in spinning cups for

dispersion of glue (L/R). A14

Pair with dispersed glue is placed cured in UV-

curing unit. A15

Bonded disc is then cooled at cooling station. A16

Cooled disc passes through de-ionization stage. A17

De-ionized disc is passed through QC-2 scanner for NO

D3
identifying A, B & D grade category product.

YES

A, B & D Grade discs are received at final receiver. A18

NO
Visual inspection A & B Grade product is done by L D4
I/C.
YES

NO
Electrical, mechanical & visual inspection of A & B D4
Grade is done by IPQC.

A+B Grade discs are transferred to printing dept. END

using MTR sheet.
 Bonding Defects

S.No Process I/P Total

10

1 Spin cup pin 9 90

2 Capillary vaccum pin 9 90

3 Scanner setting 9 90

4 Handler height 9 90

5 Handler allignment 3 30

6 Bonding profile 3 30

7 Moat area of disc 3 30

8 Radial tilt 3 30

9 Dispense pressure 3 30

10 Glue dispense 3 30

11 Capillary time 3 30

12 Spinner suction pin condition 3 30

13 Stamper Holder 3 30

14 Bonding resin 3 30

15 Temprature of bonding section 3 30

16 Temprature of resin 3 30

17 Bow head functioning 3 30

18 Glue dispense needle status & position 1 10

19 Cocentricity of bonding glue ring 1 10

20 Arreate vacumm at disc release 1 10

21 Condition of Bonding Chuck 1 10

Rack and pinion assembly which hold stamper
22 1 10
holder
23 Needle teaching 1 10
 Customer Operational Non value
Activity
value added value added added

PC treatment 124 degC / 4hrs. a

Stamper loading. a
Injecting homogenous mixture into the
mold. a
The stamped blank substrate from mold
is placed in Pre-cooler. a
From pre-cooler blank substrate is placed
at input conveyor. a
Blank substrate is inspected for visual &
mechanical characteristics. a
Blank substrate passes through cooler at
27degC. a
Blank substrate is coated with dye in dye
cup. a
On dyecoated substrate image printing is
done in hub area using printer unit. a
After image printing,dyecoated substrate
is passed through QC1 scanner for
identifying A, B & D category product.
a
After scanning,dyecoated & dummy
substrate sarepass through drier at 100
degC.
a
On dyecoated side silver is sputtered to
make reflective layer in sputter unit. a
Uncovered portion of sputtered substrate
is cleaned in edge-washing cup using
chemical solvent.
a
Sputtered (edgewashed) & dummy
substrates are passed through de-
ionization bar on bonding conveyor.
a
At bonding station (L/R) glue is dispensed
on sputtered substrate & dummy is
placed over it.
a
Unbonded pair from bonding station is
placed at capillary table (L/R) for capillary
action.
a
Unbonded pair is placed in spinning cups
for dispersion of glue (L/R). a
Pair with dispersed glue is placed cured
in UV-curing unit. a
Bonded disc is then cooled at cooling
station. a
Cooled disc passes through de-ionization
stage. a
De-ionized disc is passed through QC-2
scanner for identifying A, B & D grade
category product.
a
A, B & D Grade discs are received at final
receiver. a
Visual inspection A & B Grade product is
done by L I/C. a
Electrical, mechanical & visual inspection
of A & B Grade is done by IPQC. a
A+B Grade discs are transferred to
printing dept. using MTR sheet. a
 Potential quick win opportunities

WITHIN THE TEAM CONTROL

CHEAP TO IMPLEMENT
EASY TO IMPLEMENT

FAST TO IMPLEMENT

EASY REVERSIBLE

IMPLEMENT (Y/N)
CONCERN ISSUE

(SOLUTIONS)
SOURCE

Retrofit pipe must

Dye drop at hub be fill up to the
YES YES YES YES YES YES
area mark at starting of
shift
Operational Issues

Calibration of
BCNUMA YES YES YES YES YES YES
Scanners

Scratches on the Use of Scanners to

YES YES YES YES YES YES
discs detect scratch
Quality Issue

Limit sample Standardization of

YES YES YES YES YES YES
updation limit sample
 TARGET ACTUAL STANADARDI STANADARDI
RESPONSIBLE START
QUICK WINS ACTIVITIES DATE OF DATE OF ZATION OF ZATION OF
PERSON DATE
COMPLETION COMPLETION COMPLETION COMPLETION

Retrofit pipe must Develop check sheet

be fill up to the and ensure retrofit pipe M.Kumar/
18/1/2010 28/1/2010 25/1/2010 Check Sheet Check Sheet
mark at starting of must be filled, up to the Sanjeev
shift mark at starting of shift

Calibrate scanner w.r.t

Calibration of anjay / M.Sahoo /
to defect size as per 20/1/2010 25/1/2010 25/1/2010 Check Sheet Check Sheet
Scanners Naveen2
QMP

Enabled option for

Use of Scanners M.Sahoo / Sanjay
needle scratch in final 20/1/2010 25/1/2010 25/1/2010 Audit Audit
to detect scratch / Sanjeev
scanner

Limit samples made by

Standardization of Harsh /
benchmarking with 25/1/2010 25/2/2010 31/3/2010 QMP Updated QMP Updated
limit sample M.Kumar / Amit
Japan Marke media