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DOI:
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culations. Next, the theri.nal stress problem (TSPI will t = to: Full mold; the temperature is homogeneous
be derived using a linear thermo-viscoelastic consti- and equals Th; the pressure is zero: and the
tutive law; a strategy for the numerical solution is material is free of stresses.
given. t = t,: Contraction of the outer layers is hindered by
For the determination of the thermal stresses, the the no-slip condition at the mold walls. A
layer removal method (:12) is used. The expressions small tensile stress UJZ) is introduced in the
that relate the measured curvature to the stresses as solidified outer shells.
used in the layer removal method will be extended to t = t2:A holding pressure p acts on the melt result-
take warpage into account, due to uneven cooling of ing in a compressive stress cr = -phrcom-
the mold walls. pressing the rigid shell. As a result, the stress
Finally, the solution of the TSP is applied on two in these layers is decreased by Acr = vp,,/( 1 -
problems with different holding situations, and pre- u) (assuming that all displacements in the
dictions are compared with experimental results. The x-direction in the shell are suppressed), with
possible influence of flow-induced anisotropy due to v Poisson's ratio.
orientation on the thermal stresses is not considered. t = 5: During the holding stage the pressure re-
mains constant, while a small layer of the
AN ILLUSTRATION OF STRESS material solidifies during the time interval [t,,
DEVELOPMENT t3].Contraction of the newly cooled material
The principles of the development of residual ther- decreases the compressive stress in the sur-
mal stresses will be illustrated by means of a sche- face layers.
matic representation of an injection molding experi- t = t,: The pressure is set to zero and the stress in
ment, analogous to the example of Struik ( 9 , 10) for the melt disappears. The stresses in the rigid
the free quench experiment. Cooling is idealized in five shell increase with Au.
steps in which also the pressure varies as a function of t = t,: Finally, the product is released from the
time (see Ffg. 1 ) . As the cooling front moves inwards, mold. Further cooling is now similar to a free
the temperature drops from Th > Tgto Tl < Tg,where Tg quench. This results in tensile stresses in the
is the glass transition temperature. It is assumed that core that are in equilibrium with the stresses
the material behaves as an ideal fluid when T > Tg, in the outer layers.
thus u = -PI, and linear elastic when T < Tg.
When at t = to the mold is completely filled, the Instead of compressive surface stresses in the case
residual thermal stresses develop as follows: of a free quench experiment, tensile stresses occur at
la87
W. F. Zoetelief, L. F. A. Douven, and A. J . Ingen Housz
the surface of the sheet. These tensile stresses are 7. Mold elasticity is taken into account by taking
- 10 MPa and depend mainly on the magnitude and ahlat = C,ap/at, with C , the mold compliance (1,
duration of the holding pressure. The residual thermal 31, h the gapwidth, and p the cavity pressure.
stresses are induced by a hydrostatic pressure in
combination with rapid cooling, so the stresses in the Formulation of the Thermal Stress Problem
x-direction must equal those in the y-direction (see Summarized, the thermal stress problem (TSP) is
Fig. 2 for definitions). defined as
Given:
CALCULATIONS a temperature field T (2,t),
As argued above, the calculation of the residual a pressure field p(P, t),
thermal stresses requires the simulation of the com- a boundary displacement field iio(k, t),
plete injection molding cycle. The governing equations and a boundary loadfO(k,t),
that describe the process consist of a set of balance find:
equations and constitutive relations. The set of equa- the displacement field $2, t )
tions can be simplified considerably using the thin- such that:
film approximation. In this way the geometrical char- the balance equations
acteristics found in many injection molded products, G.d=6, u = d (1)
i.e., thin and flat or weakly curved shapes, are brought
into account. Detailed information with relation to the constitutive behavior (linear thermo-viscoelasticity)
solution of this set of equations can be found in the
literature (1, 2, 4, 13, 14). u=phI+ ad (2)
Basic Assumptions
1. All the assumptions employed using the thin-film
approximation are valid. The temperature and (31
pressure fields that are the output of the simula-
tion of mold filling, holding, and packing are used 1
ph=- - t r ( u )=
as input for the calculation of the thermal stresses. 3
The stress component in the thickness direction of
the product a,, equals minus the melt pressure (i.e. and boundary conditions
injection, holding, and packing pressure) for as
long as the temperature in the midplane of the (5)
cavity T* is above Tg.
+ +
2. As long as the melt pressure is non-zero in a point fi. @=fO=O (6)
of the midplane To. the material sticks to the mold
walls in this point. So global displacements are are satisfied, applying all assumptions mentioned
zero. The only non-zero strain component is czz. above.
3. If the pressure drops to zero in a point of ro,the In equations above, u is the Cauchy stress tensor, e
material is permitted to lose contact from the mold the linear strain tensor, G, and 0, the shear modulus
walls. and relaxation time of the i-th mode of the multi-mode
4. The gap between product surface and mold wall Maxwell model, uTthe shift factor of the time-temper-
that may develop if the pressure is zero is assumed ature superposition principle, a is the temperature
not to influence heat transport. dependent thermal volume expansion coefficient, K
5. There is no interaction between the flow-induced the compressibility coefficient, T the temperature, p h
stresses and the thermally induced stresses. the hydrostatic pressure and I the unit tensor. The
6. Bending is taken into account only after the prod- superscripts c, d refer to the conjugation and the de-
uct is ejected from the mold. viatoric part of a second order tensor resp. Consider-
zLL z=o
ing their definitions, a: and K can be evaluated from the where a * , a, b are a result of the incremental formu-
pvT-data. lation given in Appendix A.
For comparison, linear thermo-elastic constitutive
behavior is also modeled, expressed by 2. Constrained Quench With Solid Core
Same as case one. Since a,,is not explicitly given, it
ad = 2Gelid, (7)
has to be evaluated from the condition $!!&E,, dz = 0.
with G,, the elastic shear modulus. With the aid of Eq A. 11 , this results in
Note that in the balance of momentum equation (Eq
h/ 2
1). the volume and inertlal forces are neglected. In the
(0'/ a ) d z
formulation it is assumed that the material behaves
f-h/ 2
thermorheologically simj'ly (15).The normal vector fi is a,, = (14)
perpendicular to the midplane, thus fi = Zz. The bound-
ary of the product is split into two parts. On one part,
T,(t), the kinematic boundary condition (5)applies (free
quench), whereas on the other part, Td( t ) ,the dynamic
I-,,
h/2
2
(1/ a ) d z
RESULTS
In this section, results of the calculations are com-
pared with experimental results for two different test
where z 1 is the remaining thickness, E is the Young's specimens. Specimen A, shown in Fig. 3, is molded of
modulus, v the Poisson's ratio, and K,, K,, K , ~ , K , ~the polystyrene (PS, Styron 6783 of Dow Chemical) at the
(initial)curvatures in the x, y directions. The relation Philips Plastics and Metalware Factories (2, 3, 19),
for u,(zl) can be derived by exchanging the x and y indicated there as PS55. Specimen B is a rectangular
subscripts. strip (300 X 75 X 2.5 mm) molded of acrylonitrile-
The general biaxial formulation can be simplified by butadiene-styrene (ABS, Novodur P2X of Bayer) (see
assuming the stresses to be isotropic, i.e. u&) = CT,(Z), Fig. 4 ) . Both molds were equipped with pressure
leading to: transducers to monitor the place-dependent pressure
in time. The positions of the transducers are shown in
E Figs. 3 and 4 for specimen A and B, respectively. The
u x ( z 1=) - _ _ _ main processing parameters are summarized in Table
6(1 - V )
I.
1890 POLYMER ENGINEERING AND SCIENCE, JULY 1996, Vol. 36, No. 14
Fig. 5 . Determination of curvature
of a deformed bar.
i’
0.12
- - - . . l 0.08
0.06 0.04 0.02 0 1 0.5 d h [-I
0 x [ml
0 5 10 15 20 25 30 35
time [s] Fig. 7 . Stress distribution specimenA IPS) at the end offillfng
Fig. 6. Pressure history for specimen A IPS) at dflerent loca- Itl = 1.19s).
tions alongjowpath (tl: en.d offilling, ts end of packing, t5
end of holding, and t6 afte,-ejection).
The numerical simulations are carried out with a
visco-elastic (see Eq 3) and a viscous-elastic [accord-
The procedure for measuring the residual stresses ing to (7)lmodeling of the shear modulus. In the latter
differ for the two spechens. For the specimens of model the modulus in the melt is neglected (equals
mold B, bars of 100 X 5 mm were cut out in the flow zero), while the modulus in the solid is equal to the
direction (x-direction) and bars of 50 X 5 mm in the elastic shear modulus G,,, whereas in the visco-elastic
y-direction of the strip. By doing so, residual stresses representation the multi-mode Maxwell model is used.
in both directions can be determined. Because the The material parameters used in the calculations are
mold cooling was asymmetrical, the procedure of layer listed in T a b l e 4 for both materials. In the calculations
removal is carried out for both surfaces. For the layer the runner section is not taken into account. The
removal, a conventional milling machine with a 20 measured pressure history at position P , (see Figs. 3
mm end-mill operating at 1400 rpm was used. These and 4 ) , representing the gate, is prescribed during
milling conditions gave reproducible results, although packing, holding, and cooling, and thus can be con-
it is not known if extra stresses were introduced. For sidered as the holding parameter.
practical reasons, for every layer removal, a new bar
Results for Specimen A (PS)
was taken. During milling, the bars were held flat by
double-sided adhesive tape. After removal of a layer The calculated and measured pressure histories are
the curvature K = 1/p w a s determined by measuring shown in Fig. 6. The labels P , , P,, and P , refer to the
the deflection 4 with an optical microscope (see FLg. 5). positions of the pressure transducers in Fig. 3. Figures
For further analysis, the curvature data are fitted by a 7 through 10 show, with the visco-elastic model cal-
high order polynomial function. For the measurement culated gapwise, residual stress profiles as a function
of the series A, Van Hastenberg et al. (19)modified our of the flow-path x for four different timesteps: at the
procedure to measure ihe stresses along the flowpath end of illling, at the end of packing, at the end of
of a (flat) product. holding, and after part ejection. The gapwise stress
1892 POLYMER ENGINEERING AND SCIENCE, JULY 1996, Vol. 36, No. 14
Residual Thermal Stresses in Injection Molded Products
2orT---T
10
--I
A
20
I--
LL--
-501 -0.8 -0.6 -0.4 -0.2 0 0.2 0.4 0.6 0.8 1
-50
-50'
-1 -0.8 -0.6 -0.4 -0.2 0 0.2 0.4 0.6 0.8
(-1 fi 1-1
(a) (b)
Fig. 1 1. Gapwise stress distribution halfway theflowpathfor specimen A (PSI, uisco-elastic (a]and uiscous-elastic calculation (b]It,:
end offilling. t s end of packing, ts end of holding, and t4: after ejection].
70,
- : visco-elastic -calculated
-- : viscous elastic 0 measured
time [s]
Fig. 12. Gapwise stress distribution specimen A IPS).
Fig. 13. Pressure history for specimen B (ABS)at duerent
locations alongflowpath.
mentally for specimens of two different amorphous
polymers. the residual stress development at considerable less
Calculations show that considerable tensile stress computing costs.
at the surface of injection molded products arises dur- In the analysis, the influence of the orientation on
ing the holding and packing stage. This tensile stress the material properties has not been taken into ac-
is caused by the high mold pressure that occurs dur- count, as well as the influence of the flow-induced
ing the process. Therefore, it is better to speak of the stresses. Until now, it is not known if the flow-induced
development of pressure-induced residual stresses stresses may simply be added to the pressure-induced
than of thermally induced stresses. Since the pres- and thermally induced stresses to form the final stress
sure is a main factor in the development of the resid- distribution. Of course, via the flow-induced stresses,
ual stress state, it is important to predict the pressure a measure of molecular orientation can be derived
decay during the holding and cooling stages as accu- that can be included in the calculation to take anisot-
rately as possible. Introducing mold elasticity ap- ropy of material properties into account. Assuming
peared necessary to get better agreement between cal- that the residual stress state is isotropic, is then no
culations and measurements in this part of the longer valid. However, from the measurements in both
process. the flow direction and the direction normal to the flow,
Calculations with the visco-elastic model agree no difference could be observed between the two so-
slightly better with the experimental results than obtained stress distributions. This confirms the ex-
those obtained from the viscous-elastic model. How- pectation that the tensile stresses are solely induced
ever, the model gives a good qualitative description of by the mold pressure.
x Lml x Iml
(4 (b)
Fig. 14. Stress distribution specimen B (ASS)after ejection [t = 45.0~1,uisco-elastic (a)and uiscous-elastic calculation (b).
2.5
0 x-direction
x y-direction
-visw-elastic
- - viscous elastic
0 measured (x-dir.)
I' I
I I x measured (y-dir.)
-0SI
-1 -0.8 -0.6 -0.4 -0.2 0 0.2 0.4 0.6 0.8
I1
z h [-I
(A.5)
-c,(T - T * )
c2 + T - T *
) (B.2)
P' =--'
At,.+,
\tr' dT. (A. 1 0 )
T* =
c2 = c2
To + SP
+ sp.
The parameters for this model are listed in Table 2 for
both materials.
(B.3)
(B.4)
with:
(A. 1 2 )
(A. 13)
=I (%, + a,JT - T,))
i
i
1 - 0.0894 In 1 + -
(T > T,)
Tg)
(B.8)
M = [ b:'
-
a' :% 0 l.
0 0
(A. 15)
Thermal Properties
The speciflc heat capacity cpis taken constant in the
melt and in the solid phase. For both materials the
0 0 0 O G ' values are: cp = 2289 J/(kgK)for T > T, and cp = 1785
J/(kgK) for T 5 T,.
The thermal conductivity is constant in both the
melt and in the solid phase. For the two materials A =
0 . 1 6 W/(mK).
(A. 16)
Table 2. Parameters in 7-Constant Cross Model.
PS ABS
n 0.2520 0.2030
3K' + 4 G ' 3K' - 2 G ' 7' Pa -
3.080 1 O4 1.175.105
a= , b= H Pas 4.76 * 10" 1.669. 1 O5
3 3 373 443
To K
(A. 1 7 ) =1 25.74 13.15
b2 b2 CP K 61.06 1 1 7.0
a' = a - - , b' = b - - s WPa 5.1.10-7 0
a a