Project-I Progress Report

On

“Development of Thermoelectric Refrigerator for Bottle

Cooling”

Submitted in partial fulfillment of the requirements for the degree of

Bachelor of Engineering in MECHANICAL ENGINEERING

By

MAYURESH MILIND MANDHARE

VIRAJ RAJU MHATRE

ALANKAR ANANTA KHARKAR

SHUBHAM SUHAS MHATRE

Under the guidance of

Mr. Sagar Patil

DEPARTMENT OF MECHANICAL ENGINEERING

PILLAI HOC COLLEGE OF ENGINEERING AND

TECHNOLOGY

RASAYANI– 410207

2019-2020
 University of Mumbai

Mahatma Education Society’s

Pillai HOC College of Engineering and Technology,
Rasayani – 410207
Academic Year- 2019-20

DEPARTMENT OF MECHANICAL ENGINEERING

Certificate

This is to certify that the project synopsis entitled “Development of Thermoelectric

Refrigerator for Bottle Cooling” is successfully submitted by following students:

GROUP NO: M09

MAYURESH MILIND MANDHARE B 47

VIRAJ RAJU MHATRE A 60

ALANKAR ANANTA KHARKAR A 43

SHUBHAM SUHAS MHATRE A 58

As per the syllabus and in partial fulfillment for the completion Bachelor’s degree in
Mechanical Engineering from University of Mumbai, it is also to certify that this is
the original work of the students done during the academic year 2019-2020.
_________________ _________________
Project Guide Head of Department
_________________
Principal
 ACKNOWLEDGEMENT

We would like to express our special thanks of gratitude to our guide Mr. Sagar Patil
for his expert guidance, encouragement and suggestion throughout the preparation of
this work. He helped us whenever we needed help or were stuck on a problem. He has
been a pillar of support and inspired us throughout this study, without him this would
not have been possible. We also express our heartiest thank to Dr. G. V. Patil, Head
of Mechanical Engineering Department for ensuring support throughout our project
studies.

We are grateful and offer our sincere thanks to Dr. Madhumita Chatterjee and to the
teaching faculty members of Mechanical Engineering Department for their valuable
suggestions and instruction regarding project work.

Group Members

MAYURESH MILIND MANDHARE

VIRAJ RAJU MHATRE
ALANKAR ANANTA KHARKAR
SHUBHAM SUHAS MHATRE
 ABSTRACT
The refrigeration system that we use in our houses uses mainly VCR (vapor
compression refrigeration) system which uses harmful gases as coolants. They use
CFC’s; HFC’s which are really harmful gases that are harming our environment. As
well as this refrigeration system uses a lot of electricity also. This gives us higher
electricity bills. This report shows how we can use a completely new system of
cooling which is Thermoelectric Cooling System to cool down temperature without
using harmful gases. Thermoelectric Refrigeration will use a Peltier module to
produce the cooling effect. This cooling effect will be used for cooling water or any
small application. as there is no compressor the system create very low vibration. The
system is very easy to handle and very simple to understand. The primary advantages
of a Peltier cooler compared to a vapor-compression refrigerator are its lack of
moving parts or circulating liquid, very long life, invulnerability to leaks, small size,
and flexible shape. Its main disadvantages are high cost for a given cooling capacity
and poor power efficiency. We are going to perform the tests and try to improve the
efficiency of the module by eliminating the heating effect .

Keywords: Thermoelectric, thermoelectric energy, application of thermoelectric,

thermoelectric cooling, thermoelectric refrigerator, thermoelectric generator
 Index
Title
Page no.

List of Figures i

List of Tables ii

List of Abbreviations iii

Chapter 1 Introduction 1
1.
Thermoelectric Principle 1
1
1.
Problem Defination 2
2
1.
Need and Scope 2
3
Chapter 2 Literature Review 3
2.
Thermoelectric Materials 3
1

2. Bismuth- Telluride based material

3
2

2. Heat sink
4
3

Comparison of Peltier, Sterling and vapour compression

2. portable cooler
6
4

2.
Objectives 7
5
Chapter 3 Thermoelectric cooling 10
3.
Thermoelectric System 10
1
3. Seebeck effect 10
 2
3.
The Peltier Effect 15
3
3.
The Thomsan Effect 16
4
Chapter 4 Working and Fabrication 19
4.
Layout design 19
1
4.1.1 Peltier Cooling in N type Semiconductor 21
4.1.2 Peltier cooling in P type Semiconductor 21
4.1.3 Peltier Cooling with P and Nmype semiconductore

Chapter 5 Thermoelectric refrigeration design 22

5.1 Designing
5.2 Component
5.3 CAD model
Chapter 6 Expected Result and Conclusion 26
Chapter 7 References 28
 List of Figures
Figure No. Title Page no.
1.1 Thermoelectric Principle 2
2.1 Coefficient of performance of ambient air at 21 degree and 11
32 degree
2.2 Second law efficiency ambient air at 21 degree and at 32 degree 14
3.1 Seebeck effect 16
3.2 Peltier effect 17
3.3 Thomson effect 20
4.1 N type semiconductor energy band diagram 26
4.2 Peltier cooling with N type semiconductor 26
4.3 P type semiconductor energy band diagram 27
4.4 Peltier cooling with P type semiconductor 27
4.5 Peltier cooling by couple on P and N
4.6 Peltier cooling by multiple Pallets
4.7 Electrical connection of Peltier module
4.8 Nomenclature of peltier module
4.9 Configuration of air to air thermoelectric cooler
5.1 Dimensions of Refrigerator
5.2 Front view of refrigerator
5.3 Back view of Refrigerator
 List of Tables
Table No. Title Page no.
2.1 Cooling system 14
 List of Abbreviations
Vapour Compression Refrigeration VCR
Thermo-Electric Refrigeration TER
Chlorofluorocarbon CFC
 Chapter 1

Introduction

World’s energy demand is continuously increasing day by day and convention source
of energy have limited stock. Also, conventional sources of energy have many issues
of carbon emission; it is main cause of global warming. The thermoelectric (TE)
system is quite suitable due to its renewable energy feature (means no carbon
emission) and eco-friendly behaviour. Only green technologies such as wind power,
solar power and other renewable energy sources can control the emission of
greenhouse gases and play important role for sustainable development. Many
countries are trying to control emission of carbon by forming new rules for industries.
In recent few years, thermoelectric equipments have come out with potential as
alternative eco-friendly applications. Applications of thermoelectric energy extended
in various areas such cooling or heating, refrigeration, electricity generation,
ventilation, air conditioning etc. due to its eco-friendly features and distinct
advantages. Thermoelectric energy has potential to convert thermal energy into
electrical energy and vice-versa. Due to solid state (no fluid/rotating part) mechanism
of thermoelectric devices, it has variety of small applications for cooling of central
processing units (CPU) and produce electricity in automobiles from waste heat.

1.1 THERMOELECTRIC PRINCIPLE

The transformation of temperature difference into electric current and vice-versa is

called as the thermoelectric effect. The principle of thermoelectricity was discovered
in 1823 by German scientist, Thomas Seebeck, he found that electric current
continuously flow if close circuit of two dissimilar conductors formed and their joints
kept at hot and cold junctions. The Peltier effect was discovered by French
watchmaker, Jean Charles Athanase Peltier, Peltier use current as an interface among
dissimilar conductor metals in circuit results, absorption of heat at one joint and
release of heat at another joint; exactly reverse phenomenon of Seebeck effect. When
current (I) flow from n to p type and electrons (e - ) pass from p to n type
semiconductor materials; electrons jump from low energy level (p type) to higher
energy level (n type) absorbs heat from the surrounding and vice-versa

Fig.1.1Thermoelectric Principle.
(wikipedia)

1.2 Problem definition

The need of development of new type of refrigeration system which is portable and is
environment friendly. It should not impact the environment by using alternate
techniques which use harmful CFC refrigerants. According to Kyoto Protocol CFC
based refrigerants which have high Ozone Depletion Potential are banned from usage.

To make such refrigeration we are going to use a thermoelectric technique of cooling

and we are going to cool water bottles.

1.3 Need and Scope

As we can observe from the drastic environmental change that environment is getting
harmed from all our human deeds. So we need to change the harmful deeds like we
can change the use of refrigerants that harm the environment and we can use
Thermoelectric Refrigeration system. And there will be need for this refrigeration in
the future.
 Chapter 2

Literature Review

This section contains all the research papers published and all the related things which
would aid us in the development of the Thermoelectric Refrigerator. In view of the
above-mentioned facts, different journals and internet have been explored to find
research papers and activities regarding Thermoelectric modules, Thermoelectric
Application.

2.1 Thermoelectrics material

Material used in thermoelectrics is largely dependent on Figure of merit. It is

advisable to use the material which has higher value of figure of merit because it leads
to higher cooling power of a module. As we have seen figure of merit in previous
section, it depends on seebeck coefficient, thermal conductivity and electrical
conductivity. So, the properties which are considered for selection of thermoelectric
material are:

Electrical conductivity

For figure of merit to be high, electrical conductivity must be high. Metals are
typically good electrical conductors, but the higher the temperature, the lower the
conductivity. This tendency can be explained in terms of the Drude conductivity
formula

Where,

 n is charge carrier density

 e is charge per carrier (elementary charge)

 τ is carrier mean free time between scattering events

 m is carrier mass

Thermal conductivity

For figure of merit to be high, thermal conductivity must be low. Thermal

conductivity of any material is the sum of conductivities of electron and phonon.

According to the Wiedemann–Franz law, the higher the electrical conductivity, the
higher becomes. Therefore, it is necessary to minimize . In semiconductors, so it is
easier to decouple K and σ in a semiconductor and K can be improved by working on
Kphonon.

Power factor

In order to determine the usefulness of a material in a thermoelectric generator or a

thermoelectric cooler the power factor is calculated by its Seebeck coefficient and its
electrical conductivity under a given temperature difference

Where alpha is the Seebeck coefficient and σ is the electrical conductivity

2.2 Bismuth- Telluride based material

The best thermoelectric materials currently available, compounds of doped Bi2Te3,

have ZT =1 at room temperature and attain maximum temperature differential of
=82K. Some of the commonly used conventional thermoelectric materials are as
follows:

 Bi2Te3, Bi2Se3 and Sb2Te3 ; ZnSb, PbTe and PbSe

Bi2Te3, this compound has been extensively used in the construction of

thermoelectric modules. The performance of these modules has steadily improved,
since the original observations, due to a number of factors. The thermoelectric figure
of merit has increased from the order of 0.5 to values significantly greater than one.

To increase the ZT value for this material, research is going to decrease thermal
conductivity without affecting electrical conductivity.
As we have seen, The thermal conductivity of the material can be decomposed into
two principle components. The first is the lattice contribution, related to thermal
conduction by phonons (lattice vibrations). The second is the radiative contribution
related to thermal conduction by photons (electromagnetic radiation). Now, decrease
in thermal conductivity can be achieved about through a reduction in the lattice
component of the thermal conductivity. Researchers have developed some techniques
for doing so, includes :

1. Superlattices

2. Phonon-glass electron crystal materials

3. phonon-liquid electron-crystal

2.3 Heat sink

Performance of thermoelectric cooler can be improved by working on thermal side.

By properly designing the heat sink on hot side and cold side can improve this system.
To obtain the best performance, a Peltier cooler must be designed with heat sink
thermal resistance as small as possible. The conventional heat sink unit utilized at the
TEC hot side is composed of fins and a fan. The fins are employed to increase heat
transfer area. The fan conducts heat transfer through convection. Although the
thermal resistance of such a unit can be as low as 0.1 K/W , it is usually larger in size.
The conventional heat sink can only be employed in situations where space is not
restricted. Various researchers are working on designing proper heat sinks that can be
applied to TEC, which includes

1. Phase change materials

2. Thermo-syphonic heat exchanger

3. Micro-channels

2.4 Comparison of Peltier, Sterling and vapour compression portable

cooler

A paper by C. Hermes, J. Barbosa, “Thermodynamic comparison of Peltier, Stirling,

and vapor compression portable coolers”This paper compares the thermodynamic
performance of four small-capacity portable coolers that employ different cooling
technologies: thermoelectric, Stirling, and vapor compression using two different
compressors (reciprocating and linear). The refrigeration systems were experimentally
evaluated in a climatized chamber with controlled temperature and humidity. Tests
were carried out at two different ambient temperatures (21 and 32 oC) in order to
obtain key performance parameters of the systems (e.g., power consumption, cooling
capacity, internal air temperature, and the hot end and cold end temperatures).

In this work, author compared performance parameters using a thermodynamic

approach that splits the overall 2nd law efficiency into two terms, namely, the internal
and external efficiencies. In doing so, the internal irreversibilities (e.g., friction in the
working fluid in the Stirling and vapor compression machines, Joule heating and heat
conduction in the thermoelectric devices of the Peltier cooler) were separated from the
heat exchanger losses (external irreversibilities), allowing the comparison between
different refrigeration technologies with respect to the same thermodynamic baseline.

Cooling systems used for analysis are as given in Table

Table 2.1

Results of this experiment are shown below. Figure 23 shows the comparison of COP
for ambient temperature at 21 C and 32 C. As we can see, carnot COP of TEC is
highest, but due to electrical irreversibility its actual COP is much lower that other
system.
 Fig-2.1

Figure 2.1 shows the comparison of second law efficiency of all the refrigerators,
which indicates internal efficiency of thermoelectric cooler is very less, means that
the internal irreversibilities in the thermoelectric module can be quite high. Indeed,
this combined with the comparatively large value of its internally ideal coefficient of
performance confirms the need for improvement of the thermoelectric properties of
the thermoelectric cooler.
 Fig-2.2

2.5 Objectives

• To Design a complete functional model of Thermoelectric Refrigerator.

• Fabrication of Thermoelectric Refrigerator for Bottle Cooling Purpose.

• Make a alternative for conventional cooling system .
 Chapter 3

Thermoelectric Effect

3.1 Thermoelectric effect

The thermoelectric effect is the direct conversion of temperature differences to

electric voltage and vice versa. A thermoelectric device creates voltage when there is
a different temperature on each side. Conversely, when a voltage is applied to it, it
creates a temperature difference. At the atomic scale, an applied temperature gradient
causes charge carriers in the material to diffuse from the hot side to the cold side.
The term "thermoelectric effect" encompasses three separately identified effects:
the Seebeck effect, Peltier effect, and Thomson effect.
3.2 The Seebeck effect

The Seebeck effect is the conversion of heat directly into electricity at the
junction of dissimilar electrical conductors. It is named for the Baltic German
physicist Thomas Johann Seebeck.

Fig 3.1 seebeck effect

As shown in Figure 3.1, the conductors are two dissimilar metals denoted as
material A and material B. The junction temperature at A is used as a reference and is
maintained at a relatively cool temperature (TC). The junction temperature at B is
used as temperature higher 3 than temperature TC. With heat applied to junction B, a
voltage (Eout) will appear across terminals T1 and T2 and hence an electric current
would flow continuously in this closed circuit. This voltage is known as the Seebeck
EMF, can be expressed as
Where: α = dE / dT = α A – α B
 α is the differential Seebeck coefficient or (thermo electric power
coefficient) between
 the two materials, A and B, positive when the direction of electric
current is same as the direction of thermal current, unit is V/K. Eout is the
output voltage in volts.
  TH and TC are the hot and cold junction temperatures, respectively,
in Kelvin.

3.3 The Peltier effect

Peltier found there was an opposite phenomenon to the Seebeck Effect,
whereby thermal energy could be absorbed at one dissimilar metal junction and
discharged at the other junction when an electric current flowed within the closed
circuit

Fig- 3.2
In Figure 3.2 , the circuit is modified to obtain a different configuration that
illustrates the Peltier Effect, a phenomenon opposite that of the Seebeck Effect. If a
voltage (Ein) is applied to terminals T1 and T2, an electrical current (I) will flow in
the circuit. As a result of 4 the current flow, a slight cooling effect (QC) will occur at
thermocouple junction A (where heat is absorbed), and a heating effect (QH) will
occur at junction B (where heat is expelled). Note that this effect may be reversed
whereby a change in the direction of electric current flow will reverse the direction of
heat flow. Joule heating, having a magnitude of I2 x R (where R is the electrical
resistance), also occurs in the conductors as a result of current flow. This Joule
heating effect acts in opposition to the Peltier Effect and causes a net reduction of the
available cooling. The Peltier effect can be expressed mathematically as

Qc or QH

Where: β is the differential Peltier coefficient between the two materials A

and B in volts.
  I is the electric current flow in amperes.

 QC and QH are the rates of cooling and heating,

respectively, in watts.

3.4 The Thomson effect

As per the Thomson effect, when an electric current is passed through a

conductor having a temperature gradient over its length, heat will be either absorbed
by or expelled from the conductor. Whether heat is absorbed or expelled depends on
the direction of both the electric current and temperature gradient. This phenomenon
is known as the Thomson Effect.

Fig - 3.3
 Chapter 4

Working and fabrication

4.1 Working of Peltier cooler

The Peltier effect occurs whenever electrical current flows through two dissimilar
conductors; depending on the direction of current flow, the junction of the two
conductors will either absorb or release heat. In the world of thermoelectric
technology, semiconductors (usually Bismuth Telluride) are the material of choice for
producing the Peltier effect because they can be more easily optimized for pumping
heat. Using this type of material, a Peltier device (i.e., thermoelectric module) can be
constructed in its simplest form around a single semiconductor “pellet” which is
soldered to electrically-conductive material on each end (usually plated copper). In
this configuration, the second dissimilar material required for the Peltier effect, is
actually the copper connection paths to the power supply. [10] It is important to note
that the heat will be moved in the direction of charge carrier movement throughout the
circuit (actually, it is the charge carriers that transfer the heat).

4.1.1 Peltier cooling with N-type semiconductor

In Figure 5, “N-type” semiconductor material is used to fabricate the pellet so

that electrons (with a negative charge) will be the charge carrier employed to create
the bulk of the Peltier effect. As shown in Error! Reference source not found., N-type
semi-conductor has a extra electron in its Fermi level (higher energy level).

Fig-4.1
 With a DC voltage source connected as shown, electrons will be repelled by the
negative pole and attracted by the positive pole of the supply; due to this attraction,
electrons at Fermi level move towards positive terminal by releasing heat and creating
the holes in the Fermi level. Now, due to continuous supply of current, electrons
move from valance band (lower energy band) to Fermi level by absorbing energy
from the junction. With the electrons flowing through the N-type material from
bottom to top, heat is absorbed at the bottom junction and actively transferred to the
top junction. [10] So we can say that, in Peltier cooler using N-type of semiconductor,
heat is absorbed at the junction near negative terminal and heat is rejected at the
junction near positive terminal.

Fig-4.2

4.1.2 Peltier cooling with N-type semiconductor

In the thermoelectric industry, “P-type” semiconductor pellets are also employed.

Figure 6 shows the energy band diagram of P-type semiconductor. In this, holes are at
the Fermi level (higher energy level)
 Fig-4.3

Now, when DC current is applied through the circuit as shown in Figure 7; holes
get attracted towards negative terminal of source. By this attraction, holes move to
negative terminal by releasing heat. Due to continuous supply of current, holes from
conduction band moves to Fermi level by absorbing heat from the junction.

Fig-4.4

So we can say that, in Peltier cooler using P-type of semiconductor, heat is

absorbed at the junction near positive terminal and heat is rejected at the junction near
negative terminal.

4.1.3 Peltier cooling with P & N type of semiconductors

 By arranging N and P-type pellets in a “couple” (see Figure 8) and forming a
junction between them with a plated copper tab, it is possible to configure a series
circuit which can keep all of the heat moving in the same direction. As shown in the
illustration, with the free 9 (bottom) end of the P-type pellet connected to the positive
voltage potential and the free (bottom) end of the N-type pellet similarly connected to
the negative side of the voltage. As we have seen in previous section, for N-type of
semiconductor, heat is absorbed from the junction near to the negative terminal and
heat is releases at the junction near to the positive terminal. For P-type of
semiconductor, heat is absorbed from the junction near to positive terminal and
released at the junction near to negative terminal.

Fig-4.5

By arranging the circuit as like in Figure 8, it is possible to release heat to the one
side and absorb from another side. Using these special properties of the TE “couple”,
it is possible to team many pellets together in rectangular arrays to create practical
thermoelectric modules as in

Fig-4.6

4.2.1 Design of Peltier Module

 One n-type and one p-type, are used because they need to have different electron
densities. The alternating p & n-type semiconductor pillars are placed thermally in
parallel to each other and electrically in series and then joined with a thermally
conducting plate on each side, usually ceramic removing the need for a separate
insulator. When a voltage is applied to the free ends of the two semiconductors there
is a flow of DC current across the junction of the semiconductors causing a
temperature difference. The side with the cooling plate absorbs heat which is then
transported by the semiconductor to the other side of the device. The cooling ability
of the total unit is then proportional to the total cross section of all the pillars, many
are connected electrically in series to reduce the current needed to practical levels.
The length of the pillars is a balance between longer pillars which will have a greater
thermal resistance between the sides and allow a lower temperature to be reached but
produce more resistive heating, and shorter pillars which will have a greater electrical
efficiency but let more heat leak from the hot to cold side by thermal conduction. For
large temperature differences longer pillars are far less efficient than stacking
separate, progressively larger modules, the modules get larger as each layer must
remove both the heat moved by the above layer and the waste heat of the layer.

Fig-4.7
 Fig-4.8

4.2.2 Materials

A typical TEC module comprises of two highly thermally conductive substrates

(A12O3, AlN, BeO) that serve as Hot/Cold plates. An array of p-type and n-type
semiconductor (Bi2Te3, Sb2Te3, Bi2Se3, PbTe, Si-Ge) pellets are connected electrically
in series sandwiched between the substrates. The device is normally attached to the
cold side of the TEC module, and a heat sink which is required for enhanced heat
dissipation is attached to the hot side. Solder is normally used to connect the TEC
elements onto the conducting pads of the substrates. The construction of a single stage
thermoelectric module .

Considering a typical thermoelectric system designed to cool air in an enclosure (e.g.,

picnic box, equipment enclosure, etc.) as in Figure 11; this is probably the most
common type of TE application. Here the challenge is to “gather” heat from the inside
of the box, pump it to a heat exchanger on the outside of the box, and release the
collected heat into the ambient air. Usually, this is done by employing two heat
sink/fan combinations in conjunction with one or more Peltier devices. One of the
heat sinks is used on the inside of the enclosure; cooled to a temperature below that of
the air in the box, the sink picks up heat as the air circulates between the fins. In the
simplest case, the Peltier device is mounted between this “cold side” sink and a “hot
side” sink. As direct current passes through the thermoelectric device, it actively
pumps heat from the cold side sink to the one on the hot side. The fan on the hot side
then circulates ambient air between the sink’s fins to absorb some of the collected
heat. Note that the heat dissipated on the hot side not only includes what is pumped
from the box, but also the heat produced within the Peltier device itself (V x I).
 Fig-4.9

Let’s look at this in terms of real numbers. Imagine that we have to pump 25 watts
from a box to bring its temperature to 3 oC from 20 oC (ambient). To accomplish this,
we might well have to take the temperature of the cold side sink down to 0° C. Using
a Peltier device which draws 4.1 amps at 10.4 V, the hot side of the system will have
to dissipate the 25 watts from the thermal load plus the 42.6 watts it takes to power
the TE module (for a total of 67.6 watts). Employing a hot side sink and fan with an
effective thermal resistance of 0.148 C°/W. The temperature of the hot side sink will
rise approximately 10°C above ambient. It should be noted that, to achieve the 17° C
drop between the box temperature and ambient, we had to create a 30° C (54°F)
temperature difference across the Peltier device.
 Chapter 5

Thermoelectric Refrigerator Designing

5.1 Designing
The idea for making a Thermoelectric Refrigerator came after looking at the
advantages of thermoelectric module. The module is so small and easy to use that it
can fit in easily and can be used anywhere. In order to design the complete
refrigerator first of all we required to find the volume of the refrigerator. Our purpose
is To cool 6 bottles of 6 liters each. According to our observation most of the people
use a bottle ranging from diameter of 7-8 cm . the height of the bottle range between
30-40 cm so accordingly we designed the refrigerator.

We tried two arrangements

1. Bottles placed vertical.

2. Bottle placed horizontal.

It was observed that when bottles where placed horizontally it was occupying a
lot of width and due to this there was less place for the thermoelectric module on the
back. So we decided to place the bottles in vertical position . this save alot of space
and gave a lot of space at the back to mount the complete setup of thermoelectric
modules , sink , fans.

For designing purpose we also have to consider various aspects as how much
outer temperature will be . we completed our design of the model in Solidworks then
we made a prototype of the model to see how large it will actually be.

5.2 Components
 The cooling effect completely depends on the peltier module that we are using
there are various peltier module available in the market . We are going to use TEC1-
12707 which is a 7 amp peltier module .

Components used

1. Thermoelectric Modules.

2. Heat sink

3. Cooling Fans

4. Metal sheet(aluminium or steel sheet)

5. SMPS (Switched-Mode Power Supply)

6. Wood

7. Screws

8. Glass

9. Bottles

10. Hinge

11. Insulating tapes

12. Electric wires

5.3 CAD Model

Fig-5.1

Fig-5.2
Fig-5.3
 Chapter 6

Expected Results and Conclusion

Expected Result
The expected result from using 3 peltier module is that we will obtain a cooling
down to 10 degree celsius . And the 6 bottles will get a complete cooling in nearly 3
hours. If we get this results we will try to improve the efficiency of the module by
modifying in the module. This will be a portable refrigerator so we can be able to
move it anywhere .

This will be a good alternative for the conventional VCR system . advancement
is needed in this field .

We expect a result of steady drop down of temperature without creating much

sound . once the temperature is stable the bottles should cool and we should be able to
get cool water anywhere anytime.

Conclusion
The coefficient of performance of this refrigerator is much smaller than that of a
conventional compressor-type refrigerator when the required cooling capacity is high,
whereas the coefficient of performance of the conventional unit falls off rapidly as the
cooling capacity is decreased and that of thermo electric unit remains constant. Thus a
conventional refrigerator is preferred when the required cooling capacity is high and a
thermoelectric refrigerator should be chosen when a low cooling capacity is needed.
The cold side of the thermoelectric module was utilized for refrigeration purposes
whereas the rejected heat from the hot side of the module was eliminated using heat
sinks and fans

As the cooling units are of small size, silent, contains no liquids or gases, have no
moving parts and have a long life. It is very simple to control the rate of cooling by
adjustment of the current, the response to changes in the supply is very rapid, while
reversal of the direction of the current transforms a cooling unit into a heater with a
coefficient of performance in excess of unity i.e. a heat pump for oven. In this work, a
portable compressor less refrigerator unit was fabricated and tested for the cooling
purpose

This is completely eco-friendly project Multipurpose and Portable.

 Chapter 7

References

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Thermoelectric Generation, Materials 2014, 7, 2577-2592.

2. S. Stackhouse, L. Stixrude, Theoretical Methods for Calculating the Lattice

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