ITI LIMITED

DOORVANI NAGAR
BENGALURU

IN-PLANT TRAINING REPORT

Submitted by:
Hemanth Kumar HG
3rd Year B.Tech, CSE
NITK ,Surathkal

Under Guidance of
Mr.Ronny Estiberio[A.O H.R]
ITI Limited,Bengaluru
 CONTENTS
SL.NO DEPARTMENTS
1. RESEARCH AND DEVELOPMENT
1. IP ENCRYPTOR AND ACCESS LAB
2. WIRELESS LAB
3. SCADA LAB
4. POWER SUPPLY LAB
5. PCB AND CHEMICAL LAB
6. TERMINAL LAB
7. CAD LAB
8. RELIABILITY LAB
2. TDP
3. QUALITY ASSURANCE
4. INFORMATION TECHNOLOGY
5. SAS AND SAP
F2: SMT LINE (Surface mounting Technology)
F3:C-DOT card Repair centre
 ACKNOWLEDGEMENT

Apart from the technical knowledge that will be practiced in the college
and schools Practical Approach is much more important than the theory.
Even though we have the talent and knowledge ,opportunity and right
guidance are two very important backups.
In plant training is one of the main aspect of B.Tech or B.E Programme.
It is my great honor to go under Training in one of the prestigious
company called ITI Limited one of the leading public sector amongst the
electronics industries in India . I am thankful to the company for
allowing me to do training as per the request sent .
I wish my gratitude to Mr. Ronny Estiberio (AO HR ,ITI Bangalore) and
all the employees who has co-operated in sharing the knowledge and
allowing me to do training in systematic manner .I am thankful to them
for providing their valuable time and necessary information in order to
complete the project successfully. I’m thankful to the team members
who has helped me to understand the various concepts in the lab .And
Finally I want to thank my family for the support and love.

HEMANTH KUMAR HG(3831)

3RD YEAR B.TECH,CSE

NITK SURATHKAL ,MANGALORE

INTRODUCTION

ITI Limited was set up in 1948 in India’s technology capital

Bangalore.ITI is the first telecom equipment manufacturer. It has a
complete range of Telecom product, value added services and country
wide marketing and customer care centre. ITI Limited is one of the
premier public sector unit in India with the state of art manufacturing
facilities at six locations in India
The company offers a complete range of telecom product covering the
whole spectrum of switching premier equipment in line with the pre-
valing technology trend.
Indian Telephone Industry is consolidating its diversification into IT and
IT enabled services to gain a competitive edge in the convergence
market. As a part part of its diversification exercise ITI is in the process
of forming joint venture for the manufacturing world class telecom
equipment.
 1. R &D Department [Research and Development]:
It is the first department visited by our group and we have
visited the total of 8 lab’s and gathered lot of information.
The following are the Lab’s under the R&D Department:

1.IP ENCRYPTOR & ACCESS LAB

2.WIRELESS LAB
3.SCADA LAB
4. POWER SUPLLY LAB
5.CHEMICAL LAB
6.TERMINAL LAB
7.PCB AND CAD LAB
8.RELIABILITY LAB
1. IP ENCRYPTOR & ACCESS LAB:
This particular lab explains about the Data communication and Voice
communication.
Device shown: PRIMARY MUX
PROPERTIES: I/P -240v, 30 channel, RS 23I IC, Remote monitoring is
enabled, Microcontroller, APGI.
ADSL CPE TYPE 1AND TYPE 2 for wifi communication.
Data card and synchronous data cards functionality is explained like
these cards are used in ATM security purpose and by the PIC security
system we can protect the code even after the controller is lost. Call
switching facility like FXO and FXS is shown which consists of Auto
Junction, E&M junction circuit. Knowledge of Transmission mode is
explained like medium of transmission and their advantages.

2. WIRELESS LAB
This lab explains about the wireless communication and cable
connection.
Exchange acts as medium between the telephone in cable connection.
Device Shown: ISM band radio , control card
Properties:2.4 -2.485 Ghz
Data rate-250Kbps
Interface- RF
Uses Transducer
Supports: Indoor (1KM)
Outdoor (10km)
Points to keep in mind:
1.Programs are loaded into flash memory for fast access.
2.PORT switching concept.(Voltage regulator used convert 5 to 3.5 v)
3.Rod Antenna(extends upto 3.2 Km) used for PC to PC communication.
4.ARM controller (32 bit)
3. SCADA LAB (Supervisory control and data acquisition system)
This lab explains about the network tracking facility for Indian
Railways. Used in Railway line , Monitoring and control OS line .The
signals are sent through the serial communication from RTU to RTC.

 RTU(Remote terminal unit)

 RTC(Remote terminal centre)
 MMI(Main Machine Interface)

RTU server is used in remote areas and in order to communicate 1

modem is installed in RTU and RCC .RTU server rack consists of
various compartments and in each row the functionally differs. First one
is PSU rack which consists of AC and DC module. Second Rack
consists of I/P card ,I/O card, Duo card ,CPU card, IF card. And the last
rack is Relay circuits of different channel. Main Rack consist of
Transducer (analog to digital conversion) which is divided into two one
is voltage and other is current Transducer. SCADA RTU is slave device
and it is operates on 240v AC .
 4. POWER SUPPLY LAB
This lab explains about the different power supply and protection circuit/
1.Linear Power supply(LPS)
2.Switch mode power supply(SMPS)
LPS:

230V AC STEPDOWN RECTIFIER FILTER

TRANSFORMER
50 HZ

DC OUTPUT REGULATOR

Disadvantages:
1.High cost
2.Failure more
3.Size more.
Protection circuits :
1.UV/OV
2.BMI/EMC
3.SPIKE
4.LED /ALARM
SMPS:

AC RECTIFIER SWITCHING SDT

50 HZ CIRCUIT

DC OUTPUT REGULATOR FILTER RECTIFIER

EMI testing and Bread Board testing is also done in this lab.

5. PCB AND CHEMICAL LAB

In this lab we learnt about the PCB’s properties, manufacturing of Board
cleaning , pasting, drilling, filling and other processes involved in
making the PCB’s.In ITI four layer PCB’s are manufactured .The
manufacturing is done by PCB machineries.
The proper process involved in the double sided PCB:

1.Copper clad cut to size

2.CNC drilling
3.Debur and cleaning
4.Platted through hole 15.cut to final size
5.Lamination 16.Bare board Testing
6.Allign and expose circuit 17.Legend marking
7.Developing
8.Electro copper Plating
9.Tin Plating
10.Film stripping
11.Etching
12.Tin stripping
13.Solder masking
14.expose developing

The process involved for multilayer Boards :

1.Copper clad cub to size 9.Prepreg
2.Initial Drilling 10.Copper fail
3.Photo film lamination 11.Booking of layer
4.Align and expose 12.Pressing
5.Developing
6.Etching
7.Film stripping
8.Black Oxide
6. CAD (COMPUTER AIDED DESIGN)
PCB is designed using CAD .The software used in zuken cadstar for
designing 2,4,6,8.. layer PCB via interconnection between top and
bottom.
Top layer :Horizontal layer
Bottom layer: Vertical layer
Ground : Analog to digital ground
VCC : Analog to digital vcc
Filming is done using black plastic paper thereafter BBT testing is done
then lastly Assembling is done before going to the PCB machine.

7. TERMINAL LAB
This lab tells about the advanced technology used in the telephone
device in the filed of defence .Trainee showed all the types of telephone
from first telephone to the latest telephone.
Different phases of telephone technology are:
1. Rotatory dial phone
2. Cardless phone
3. ISDN
4. IP Phone
5. Caller ID
6. Executive telephone
The First electric telephone was designed in 1980 this phone consists of
1.Dailer IC
2.Ringer IC
3.Speech IC
The electronic telephone requires 48v supply and 25hz frequency.
Thunder, humidity and different climate are some of the problems that
we need to overcome .
Dialler IC: This IC is present in the keypad to detect the key pressing
Two modes used in this telephone are :
1.Pulse mode
2.Tone mode
8. RELIABILITY LAB
Reliability means how the equipment works under the stressed condition
and dependability of the machine and trust worthy.
ITI has many chambers to check the reliability at an instrument under
various condition like humidity, temperature , volume ,pressure etc.
These are some of the chambers used are:
Thermotron: Volume :30lt
Temperature :70 c to 150 c
WEISS Tecnik 1000SB Climate Chamber : ( Durability test)
Temp : -15c to 100c
Humidity: 20% to 95%
Volume : 10,000lt
Tenny 64 climate chamber: Volume : 1800lt
Temperatre: -40 c to 100c
Humidity : 50% to 95%
BEMED ALTITUDE CHAMBER:
Volume : 1800lt
Temp: -60c to 100c
TABAI: Volume :90lt
Temp: 200c
 2. TDP (TELEPHONE DEFENCE PRODUCTS) DEPT:

In this particular department there are 2 types of Telephones which are

manufactured and replaced .
1. E7S-04
2. D7S
1. EXECUTIVE TELEPHONE SYSTEM
2. DEFENCE TELEPHONE SYSTEM
Telephones which are manufactured are tested here and the main
concentration of this department is on field telephone testing which is 1
to 1 connection. Second one is Electromechanical which is used for 2
line communication purpose .
RANGE : 40KM
The dial parameter are measured using a device called as 1088[ pulse
switch telephone analyzer]
FIELD AUTO TELEPHONE 2A:
This particular type of telephone is used in RR vehicle (radio relay
vehicle). In RR vehicle the Antenna is mounted on top the vehicle which
enables it to extract the signal. This type of Telephone consists of
Number pad.
MAGNETO PHONE:
In this phone the conversion of magnetic pulses into electrical voltage
takes place. No frequency is used here ,used for 1 to 1 communication.
VOLTAGE RANGE : 80V to 110V
SOUND POWER TELEPHONE(BULK HEAD)
1. Used in Indian naval ship for good communication system.
2. It does not require any external power supply
3. One-to-one Communication
4. Consists of Generator, when we crank it 24v to 26v will be
generated.
5. RANGE: 55KM
D7S PHONE [2A]
The main feature of this phone is one to many communication facility.
Used in INS (space and sea level communication purpose) .It consists of
HF Generators (900hz). Output will be in range of 20-27v. Unlike other
defense telephone provides 1 to 1 communication.
Different modes are available in this phone :
1. Ratio mode
2. Auto CB mode
3. Magneto mode.
4. Sine mode.

In sine mode phone is connected to over exchange line via exchange.

Auto CB phone used for one to one communication. Ratio mode is used
for wireless communication.
Executive telephone service: used in office(I/P = +1.5v)
Auto test, simulation test , step by step testing is done in TDP division.
All the device here are 32 channel of Input =40V .

3. QUALITY ASSURANCE (METAL LAB)

Any devices that comes to this plant are qualitatively checked before its
going to deliver until or unless it is checked in both electrical and
mechanical testing manner .
1.Electrical checks
2.Mechanical checks
In this dept various testing are done through different machine
depending on the material and subjected to different electrical test which
can measure the electrical parameters.(LCR meter ,LCZ meter, Dual DC
power supply, AC/DC high Voltage Test, Micro Ohm meter. These are
test conducted under Electrical.
Mechanical checks the properties of device like Elongation, Tensile,
Hardness . For different types of devices different types of testing is
done.
Checking under Mechanical checks:
1.Load testing
2.Thermoplast Checking
3. Tensile Stress Checking.
4.Bending test.
5.Cross Breaking Test.
6.Shearing Test.
7.Cross Breaking Test.

UTM :
Universal Testing machine is used to check the device load capacity
50,000kg is the max load that can be tested in this machine. In tensile
stress machine min weight is 500gm to max of 50kg is tested. Similarly
in Bending testing the device is tested whether it consists of power or
scratches . Different machines will have different units example in some
tensile testing machine the units used are Newton and in some machine
weight is used .Mechanical Strength is applied on the particular in order
to check the durability of the device in case if it breaks. Similarly for the
wires elongation testing is done using the machines .
1.Izode Impact test machine.
2.Oven Machine
3.Hawkwell machine(Hardness testing machine)

“ONE TEST IS WORTH A THOUSAND EXPERT OPINION”.

 4. INFORMATION TECHNOLOGY DEPARTMENT

 Several Industries are associated with information technology,

such as computer hardware, software, electronics, semiconductors,
internet, telecom equipment, e-commerce and computer related
services.
 IT department takes care of information transmissions and
communication between different systems in the industry and with
other industries. It basically deals with application of
telecommunication equipment and computers to storing,
transmitting, receiving and manipulating data often in context of
business or other enterprises.
 In order to communicate within the company, with different
departments and divisions, EPR application is being used. This
application helps employees to pass the messages related to orders
and other information to each other. It also allows administrator to
monitor activity of each employees and it reduces the human
labour to transfer paper written order details and it also helps to
faster the putting order and delivering the products.
 Now a days, every company needs its own website, where it can
put details about the company and related news. Designing website
is also work of IT department and maintaining it also requires a lot
of works, because of dynamic nature of websites. For designing
website we need to design the layout of webpages and it involves
knowledge of web designing aspects.
Various aspects used in designing a website for the company:
• Content Modelling
• Presentation Modelling
• Behaviour Modelling
• Designing Architecture
• Designing Content
In order to control every activity related to internet, we need
computer which will be performing the task of controlling and
monitoring the system. There are two kinds of OS, server side OS and
client side OS.
Windows NT is a server side OS and it is equipped with much faster
processor and has much higher value of RAM and storage. For server we
need a system with much higher value of cache memory and Windows
NT if a better option for that. Windows is one of the popular OS and it
is available with INTEL core processor, again which is very famous and
costly compared to other processors. AMD is the best and more reliable
processor available in the market. Unlike AMD, INTEL processors
support only Windows OS. But AMD supports all the OS available in
the market. Even though, Windows is the most popular OS and it is
available with INTEL processor, But 45% of market is owned by AMD.
MAC was the first OS with GUI and it was developed by Bill Gates.
After MAC, Windows became most popular OS and it was also
developed by Bill Gates. There are many other OS available in the
market like DOS, UNIX, UBUNTU, LINUX, FEDORA etc.
MAC is most costly OS available in the market and LINUX is free.
There are many versions available for LINUX in market and is most
secure and reliable operating system. It is also multitasking and
compared to other operating systems it is more user friendly and easy to
use because its user interface is very simple.
VIRUS stands for Virtual Information Resource Under Seize. These are
small macros or programs which can affect the system by so many ways
like filling up the memory with junk files, creating shortcut foe every
files and folders in the system, deleting the OS programs or crashing the
system.
Like VIRUS, there are many more programs which can harm the system
like TROJAN, ADWARE or MALWARE. All these threats works only
when their .exe files are run on the system. So all anti-virus or other
software mainly try to stop them from running in the system. They
identify the files and delete them.
Employees working in IT Department, also have to take care that
nobody hack the systems and steal the data. So they need to make sure
that no VIRUS can attack the system and if attacked, they should be able
to remove it from the system.

5. SAP & SAS (Switching and access products):

OCB-CSN TESTING:
OCB(organ de command) is the main part of the exchange and this
module is tested in this particular department.
The function handled by OCB are:-
1.Alarm management.
2.Billling.
3.Call Handling.
One single OCB line can handle upto 5 million Telephone lines.
83 processors are used in this OCB. OCB 283 is the technology used in
this department. Normally one OCB is sufficient for an exchange for a
typical sized area.
Types of cards in an OCB Module:-
1.Line card.
2.Power card.
3.CSN.
1.Line card divided into 16 portion each of which each of which
corresponds to a 1 subscriber.
2.This type of card provides power to the module ,it has various power
supply voltages. The voltage on the line from the exchange is -48v
which is standard voltage.

CSN: Numerical satellite concentrator

This type of machine is connected to the OCB for distribution of lines to
the subscribers. A typical CSN can be accessed by 2000 subscribers. If
CSN is directly connected to the OCB then it is called local connection.
If CSN is connected to the another separate exchange then it is called
distinct connection.
F3:C-DOT card Repair centre :
Centre for development of Telematics .It gives design and prototype to
the manufacturers.
SBM-XL:
It is a single base module which is used for telephone exchange. XL
signifies extra large. It contains various cards:
1.Line cards.
2.Power cards.
2024 subscribers are possible by single SBM 2 line module.
The SBM is connected to the TDP which is a terminal used to see the
status of the system.SBM deals with both analog and digital.
Any fault in the cards are tested using Jiggs. RAX (Rural area
exchange)-256 is the type of SBM used for village subscribers and the
capacity is 240 subscribers. Similarly, RAX-128 is used for 120 to 140
subscribers. 16 lines per card is used in the CSN at this department.

F2: SMT LINE (Surface mounting Technology)

This type of technique is used to measure the quality of soldering ,
accuracy, speed. Multi-layer Boards are manufactured using Surface
Mounting. It is the conventional way of approach.
Process stages in SMT Line are:
1.STENCIL PRINTER
2.GLUTE DISPENSER
3.CHIP SHOOTER
4.FINE FLACER
5.SHINDENSHI AO 1
6.RESEARCH MICRLO REFLOW OVEN
7.FUJI PCB UNLOADER.
These are machine used in this particular department for mounting the
PCB’s.
Points to be noted during this process:

 Stainless steel is used.

 Paste applied on the PCB in Glute dispenser consists of
lead,tin,silver. Flux is used for cleaning , Sliver is used for contact.
 Chip Shooter consists of 20 Turrets and each has 6 nossils and
each nossils functionality is assigned by the particular machine
software. Apprx 11components/sec is placed on the PCB.
 IC placer FIP 3
 0.03mm for tape comp@6,545cph .
 0.025mm for IC’s @1,440cph
 In reflow oven temp maintained in the range of 150 to 300
degree.It Includes 7 chamber.
 Visual Inspection is the main part because sometimes due the
machine Inaccuracy components are placed wrongly on the PCB’S
so this method is final stage of the SMT process.