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Abstract
Today's microprocessor technology develops very quickly. The speed of the
computing process has become a necessity for mankind. With the faster performance
computing will give rise to the heat concentration effect on the microprocessor
component. Each type of microprocessor components have tolerance limits of
operational heat, and when the heat exceeds the recommended threshold then the
microprocessor performance will be disrupted and result in computational capabilities
will decline, abnormal may even cause permanent damage. So to overcome this
problem, they invented refrigeration equipment to cool the microprocessor known as
the heatsink. Simulation heatsink performed using CFD software: Fluent with forced
flow of air by a fan at a speed of 7.5 m / s (90 CFM), heat input at the base / base of the
heatsink (the microprocessor) at 100 W and the heatsink is made of aluminum material.
From the simulation and analysis above it can be deduced: CFD Simulations with
FLUENT software is very useful help to explain the details of heat transfer phenomena
that occur in applications heatsink; With heating load of 100 watts at the base of
heatsinks, heatsinks highest temperature reached 47 K and the total enthalpy of the
process heat transfer at 48516.5 j / kg; each blade fin temperature distribution is not
uniform, where the nearest fin blade with a heat source (base) experienced higher
temperature fluctuations than in the bar fin furthest from the heat source; With the
forced convection air flow by fan, the heat transfer process in the more effective
heatsink.
(11)
330
yang menerobos melewati celah-celah 328
326
diantara fin, disini udara juga membawa 324
322
panas dari permukaan celah fin bagian 320
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