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VACUUM PUMPS
In reality a hole leading to an ideal vacuum does not exist. Real vacuum pumps arrive to some ultimate
limit pressure where their pumping speed goes to zero. Let us consider in the place of an ideal vacuum
a hole connecting to a volume with the pressure p`. The number of gas particles colliding with the hole
per unit time (f'A):
2c1 1 1
f A′ = ( p-p' ) A (1)
c5 m0 T
The above formula contains a forward stream and a backward gas stream. Writing (1) in a different
way we get:
p' 2c1 1 p
f A′ =A 1- (2)
p c5 m0 T
p'
The factor A 1- characterizes the pump efficiency.
p
For an optimally designed pump one requires the maximum A and the minimum p`.
Vacuum pumps are characterized by the pumping speed S, [m3/h] or [l/s], (1 m3/h = 0.28 l/s) and by the
ultimate pressure p∞. Observe that S=S(p) – pump characteristics. S~A, p∞. depends on the total back-
stream and the materials used to build and lubricate the pump.
Vs
Qs=pVs=760 Vs p ∞ [Tr] =760
Vc
The pumping volume is lubricated with vacuum
oil, which means that in reality:
Vs
p ∞ =760 +p∞ (oil v.p.)
Vc
The most commonly used pumps for all basic vacuum applications from atmospheric pressure down to
10-3 Torr. They are used as backing pumps for other high-
vacuum gas transfer pumps such as turbo-molecular and
diffusion pumps.
Principle of operation:
Gas enters the inlet port and is trapped between the rotor vanes
and the pump body. The eccentrically mounted rotor
compresses the gas and sweeps it toward the discharge port.
When gas pressure exceeds atmospheric pressure, the exhaust
valve opens and gas is expelled. Oil is used as lubricant and
sealant.
The geometrical speed of pumping Sg=V N, where V is the volume between the rotor and the stator and
N is the speed of rotation. The geometrical speed is limited by the conductivity of the pump inlet and
inside channels.
1
S = Sg
S
1+ G
GP
The main contribution to 1 G P is the size of holes leading to the cylinder (limited by the slide
width). p∞ is determined by the design, quality of machining and oil vapour pressure.
Typically:
one stage 10-1 - 10-3 [Tr]
two stage down to 10-5 [Tr]
Membrane pumps
Roots pumps
The rotary lobe pump (Roots) is excellent for moving large quantities of gas at higher pressure than
possible with the rotary oil or piston pumps. Roots pumps are in use in molecular beam experiment and
IC fabrication lines that need high pumping speed at 0.1 to 10 Tr.
The lobes are similar to the figure eight in cross section (see Fig 2d). They mash with each other and
counter-rotate to continuously transfer gas from one side of the pump to the other. The compression
ratio of the pump is small and varies with the molecular weight of the gas. Light gases easily escape
back into the vacuum vessel around the edges of the rotors, creating a beck stream, so rotary or piston
pumps must back roots pumps. Typically pump speed: N≈ 1500-3000 rpm, gap between the rotors: 1-
0.15 mm.
I + =S0 p
The backward stream is constituted by gas flow through a clearance between the stator and rotor
surfaces. If Gs is the clearance conductivity then:
I − = Gs ( p1 − p )
The effective pumping:
I p =I + -I- =S0 p-G(p1 -p)
Ip G s p1
S= = S0 1- S ( p -1)
p 0
Problems:
Oil leaks - multiple gaskets Insert (Fig 2h)
Closed sealed pumps - Teflon seals
Vibration
Lab v
p − p1 = k p
h2
The drag pump has a smooth, high-speed rotor, shaped like an inverted bowl, that spins between two
closely spaced, cylindrical walls. The walls have helical grooves facing the rotor. The rotor reaches a
tangential velocity that approaches the average velocity of gas molecules. The pumping action is
induced by momentum transfer from the rotor to the gas molecules in the direction of the exhaust port.
The spiral grooves are designed to assist gas flow in the right direction
A molecular drag pump may reach a compression ratio of 10 9 for N2, 104 for He, and 103 for H2,
while discharging into a fore-line pressure of 10 to 40 Torr.
These pumps accept continues inlet pressure below 0.1 Torr and are used where low pumping speed
(less than 10 L/s) and modest ultimate pressure (no lower than 10-6 Torr) are demanded.
The hybrid pump combines several stages of turbo pumps with drag pumps. The result is a pump with a
higher pumping speed that backs into a high fore-line pressure.
p ∞ ≈ 10-4[Tr]
S ≈ up to15000 [l/s]
Oil volume 5[l]
Heating power ≈ 5kW
I+=kvpn(x)
I--=D dn(x)/dx
General characteristics:
p ∞ ≈ 10-6[Tr.]-10-8[Tr.] s ≈ 2 [l/s] -104 [l/s] Oil volume = 20cm3 - 500 cm3
Operation procedures must protect boiling oil against oxidation during pump-vent cycles.
Oil traps
**See Table: 4a
OPERATING A DIFFUSION PUMP VACUUM SYSTEM
DP – diffusion pump
BP – primary (backing) pump
V1 – backing valve
V2 – bypass valve
V3 - vent (air inlet) valve
V4 – high vacuum valve
G1 – fore-vacuum gauge
G2 – high vacuum gauge
Pumping down (initial pressure in the chamber 760 Tr, all in the pump start-up positions):
1. close V3
2. close V1
3. open V2
4. wait until G2 reading goes below ~ 10-2 Tr
5. close V2
6. open V1
7. slowly open V4
8. wait until G2 reads the desired pressure.
From the time of their commercialisation in the late 1950s (by Varian), ion pumps have been a primary
choice for UHV systems. They are clean, bakeable, vibration free, operate in the 10- 11 Torr range with
low power consumption and have long operating lives. All ion pumps have the same basic components:
a parallel array of short stainless steel tubes, two plates (Ti or Ta) spaced a short distance from the open
ends of the tubes and a strong magnetic field parallel to the tube axes.
Electrons released from the (cathodic) plates are constrained by the magnetic field into tight helical
trajectories in the (anodic) tubes. The potential energy of gas molecules ionised in the tubes is
converted to kinetic energy and the cathode sputters titanium when struck by an ion. The sputtered
material coats the tubes, the cathode plates and the pump’s walls. Several pumping mechanisms are
possible including chemical reaction, ion burial and neutral burial - the last two accounting for the
pump’s ability to handle inert gases.
There are three types of ion pumps. The plate material and form, and the voltage supply determine their
names and characteristics. In the diode pump, the Ti plates are grounded and the tubes have a high
positive voltage. It has high pumping speed for H2, O2, N2, CO2, CO and other getterable gases. The
noble diode pump has the same electrical arrangement as the diode but one plate is Ti and the other is
Ta. This reduces the pumps H2 pumping speed, but allows higher speed and greater stability for Ar and
He. In the triode pump, the plate’s electrodes are slotted and connected to high negative voltage. Both
the tubes and the pump casing (acting as a third electrode) are grounded. Sputtering from the slotted
plate’s deposits Ti not only on the tubes and other areas of the plates but also on the pump casing. Inert
gas burial and active gas reaction on the casing is less susceptible to interference by ion bombardment,
even at high system pressures when ion bombardment of the plates is high. The triode pump is the
therefore the optimum choice when the system’s pressure will vary throughout the ion pump’s range.
*
Dehydration creates channels with calibrated diameter size, 0.1 nm<D<10 nm, and the network of
chambers, of the volume of the order of 1000 A3, interconnected by narrow channels. The effective
surface ~ 1000 m2/g! 50% of the zeolite volume is constituted by chambers and channels.
These gas capture pumps fill a niche. They are never used as the only type of
pump in the UHV system. They are most often used to supplement ion pumps
(occasionally diffusion pumps) increasing the pumping speed for reactive gases
particularly when poling the system through the 10-5 to 10-8 Torr range to
UHV pressures.
Ti sublimation pump operate by depositing a film of titanium (from a filament
that is resistant heated) over a surface cooled to LN2 temp’. Active gases
(hydrogen, oxygen, and nitrogen) react to form non-volatile compound with the
film. Sublimation pumps are switched on intermittently, ether by time/pressure
controller or manually when the operator judge the previous film has all reacted.
2.3.5. Getter pumps
In their operational mode getter pumps are similar to Ti sublimation pumps and
share the distinction of being secondary rather than primary pumps. However,
the name ‘getter’ is often applied to devices attached to a system that will never
be opened to atmosphere after initial pump-down. Examples can be found in the
electric lamp, CRT and vacuum tube industries. When the system is at its ultimate pressure a very
reactive metal (often barium or titanium) is evaporated onto the inner surface of the chamber and reacts
with any gas that evolves from the walls throughout the lifetime of the device.
2.3.6. Cryopumps
This gas capture pump is particularly useful for systems containing gases other than helium or
hydrogen. Cryopumps have rapidly increased in popularity and variety of applications in recent years.
Their major use at present is in sputtering systems applied to semiconductors processing, where oil-free
operation and a huge capacity for pumping argon process gas are needed. They are particularly suited
to pumping high molecular weight gases in the 10-6 to 10-9 Torr range.
The pump has two low temperature zones, an inner surface held at approximately 20K and a
surrounding surface at approximately 80K (Helium refrigeration). The inner surface is coated with
activated carbon that assists in pumping hydrogen by adsorption. The low temp’ are achieved by
attaching the pump directly to a helium cryo-compressor.
The most important feature of the cryopump is the cleanliness of the vacuum. The pumping speed can
be vary high and the ultimate vacuum (in the absence of hydrogen and helium) excellent. In contrast
with ion pumps, which are also oil free the cryopumps, is mach less susceptible to failure or damage if
switched on at high pressure.
γ
SA = 2c1 c3 TA
m0
Recalling the value of c1 , c3 we get:
γ
SA = 3.7 TA
m0
H2O 0.9 18 13 7
CO2 0.8 44 8 4
A 0.7 40 7 4
Final pressure for the gas of the temperaqture T at the cryogenic surface of the temperature Ts. pp is a
saturated vapour pressure of the gas at 4.2 K
T
p∞ = p p
Ts
Complex pumping systems have to be designed in such a way that a constant gas flow through entire
system will be maintained. This requires:
I ≤ PS
1 1 ≤ P2S2 ≤ P3S3 ≤ ⋅⋅⋅
Pumping speed should increase towards forevacuum in order to avoid blocking of the cascaded pump.