A Series PLC Hardware Manual

앬 SAFETY PRECAUTIONS 앬
(Read these precautions before using.)
When using Mitsubishi equipment, thoroughly read this manual and the associated manuals introduced
in this manual.
Also pay careful attention to safety and handle the module properly. These precautions apply only to
Mitsubishi equipment. Refer to the CPU module user’s manual for a description of the PC system safety
precautions.
These 앬 SAFETY PRECAUTIONS 앬 classify the safety precautions into two categories: “DANGER” and
“CAUTION”.
Procedures which may lead to a dangerous condition and cause death

PDANGER
or serious injury if not carried out properly.
Procedures which may lead to a dangerous condition and cause
ECAUTION superficial to medium injury, or physical damage only, if not carried out
properly.
Depending on circumstances, procedures indicated by E CAUTION may also be linked to serious

results.
In any case, it is important to follow the directions for usage.
Store this manual in a safe place so that you can take it out and read it whenever necessary. Always
forward it to the end user.
[DESIGN PRECAUTIONS]
P DANGER
• Install a safety circuit external to the PC that keeps the entire system safe even when there are
problems with the external power supply or the PC module. Otherwise, trouble could result from
erroneous output or erroneous operation.
(1) Outside the PC, construct mechanical damage preventing interlock circuits such as
emergency stop, protective circuits, positioning upper and lower limits switches and
interlocking forward /reverse operations.
(2) When the PC detects the following problems, it will stop calculation and turn off all output.
• The power supply module has over current protection equipment and over voltage
protection equipment.
• The PC CPUs self diagnostic functions, such as the watchdog timer error, detect
problems. In addition, all output will be turned on when there are problems that the PC
CPU cannot detect, such as in the I/O controller. Build a fail safe circuit exterior to the
PC that will make sure the equipment operates safely at such times.
Refer to Section 5.1 of this user’s manual for example fail safe circuits.
(3) Output could be left on or off when there is trouble in the output module relay or transistor.
So build an external monitoring circuit that will monitor any single output that could cause
serious trouble.
• When overcurrent which exceeds the rating or caused by short-circuited load flows in the output
module for a long time, it may cause smoke or fire. To prevent this, configure an external safety
circuit, such as fuse.
• Build a circuit that turns on the external power supply when the PC main module power is turned
on. If the external power supply is turned on first, it could result in erroneous output or erroneous
operation.
• When there are communication problems with the data link, the communication problem station
will enter the following condition.
Build an interlock circuit into the PC program that will make sure the system operates safely by
using the communication state information. Not doing so could result in erroneous output or
erroneous operation.
(1) For the data link data, the data prior to the communication error will be held.
(2) The MELSECNET (II,/B,/10) remote I/O station will turn all output off.
(3) The MELSECNET/MINI-S3 remote I/O station will hold the output or turn all output off
depending on the E.C. remote setting.
Refer to the data link manuals regarding the method for setting the communication problem
station and the operation state when there are communication problem.
E CAUTION
• Do not bunch the control wires or communication cables with the main circuit or power wires, or
install them close to each other. They should be installed 100mm(3.94inch) or more from each
other. Not doing so could result in noise that would cause erroneous operation.
[INSTALLATION PRECAUTIONS]
P DANGER
• Use the PC in an environment that meets the general specifications contained in this manual.
Using this PC in an environment outside the range of the general specifications could result in
electric shock, fire, erroneous operation, and damage to or deterioration of the product.
• Install so that the pegs on the bottom of the module fit securely into the base unit peg holes, and
use the specified torque to tighten the module’s fixing screws. Not installing the module correctly
could result in erroneous operation, damage, or pieces of the product falling.
• Tightening the screws too far may cause damages to the screws and/or the module, resulting in
fallout, short circuits, or malfunction.
• When installing more cables, be sure that the base unit and the module connectors are installed
correctly. After installation, check them for looseness. Poor connections could result in
erroneous input and erroneous output.
• Correctly connect the memory cassette installation connector to the memory cassette. After
installation, make sure that the connection is not loose. A poor connection could result in
• Do not directly touch the module’s conductive parts or electronic components. Doing so could
cause erroneous operation or damage of the module.
[WIRING PRECAUTIONS]
P DANGER
• Completely turn off the external power supply when installing or placing wiring. Not completely
turning off all power could result in electric shock or damage to the product.
• When turning on the power supply or operating the module after installation or wiring work, be
sure that the unit’s terminal covers are correctly attached. Not attaching the terminal cover could
result in electric shock.
E CAUTION
• Be sure to ground the FG terminals and LG terminals to the protective ground conductor. Not
doing so could result in electric shock or erroneous operation.
• When wiring in the PC, be sure that it is done correctly by checking the product’s rated voltage
and the terminal layout. Connecting a power supply that is different from the rating or incorrectly
wiring the product could result in fire or damage.
• Do not connect multiple power supply modules in parallel. Doing so could cause overheating,
fire or damage to the power supply module. If the terminal screws are too tight, it may cause
falling, short circuit or erroneous operation due to damage of the screws or module.
• Tighten the terminal screws with the specified torque. If the terminal screws are loosen, it could
result in short circuits, fire, or erroneous operation.
• Tightening the terminal screws too far may cause damages to the screws and/or the module,
resulting in fallout, short circuits, or malfunction.
• Be sure there are no foreign substances such as sawdust or wiring debris inside the module.
Such debris could cause fires, damage, or erroneous operation.
[WIRING PRECAUTIONS]
E CAUTION
• External connections shall be crimped or pressure welded with the specified tools, or correctly
soldered. For information regarding the crimping and pressure welding tools, refer to the I/O
module’s user’s manual. Imperfect connections could result in short circuit, fires, or erroneous
operation.
[STARTUP AND MAINTENANCE PRECAUTIONS]
P DANGER
• Do not touch the terminals while power is on. Doing so could cause shock or erroneous
operation.
• Correctly connect the battery. Also, do not charge, disassemble, heat, place in fire, short circuit,
or solder the battery. Mishandling of battery can cause overheating or cracks which could result
in injury and fires.
• Switch all phases of the external power supply off when cleaning the module or tightening the
terminal screws. Not doing so could result in electric shock. If the screws are too tight, it may
cause falling, short circuit or erroneous operation due to damage of the screws or modules.
• Tightening the screws too far may cause damages to the screws and/or the module, resulting in
fallout, short circuits, or malfunction.
E CAUTION
• The online operations conducted for the CPU module being operated, connecting the peripheral
device (especially, when changing data or operation status), shall be conducted after the manual
has been carefully read and a sufficient check of safety has been conducted.
Operation mistakes could cause damage or trouble of the module.
• Do not disassemble or modify the modules. Doing so could cause trouble, erroneous operation,
injury, or fire.
• Switch all phases of the external power supply off before mounting or removing the module. If
you do not switch off the external power supply, it will cause failure or malfunction of the module.
[DISPOSAL PRECAUTIONS]
E CAUTION
• When disposing of this product, treat it as industrial waste.
REVISIONS
* The manual number is given on the bottom left of the back cover.
Print Date *Manual Number Revision

Apr.,1994 IB (NA) 66468-A First edition
Dec.,1994 IB (NA) 66468-B Correction
CONTENTS, Detailed manuals, Related manuals,
1.1, 1.2, 1.3, 1.4, 2.1, 2.2, 2.3, 3.1, 3.2
Addition
1.4, 1.5, 1.6
Jun.,1995 IB (NA) 66468-C Overall revision
Oct.,1995 IB (NA) 66468-D Correction
CONTENTS, 1, 2.2.1, 2.2.2, 2.2.3, 3.3, 3.5, 4.3.1,
4.3.2, 5.2, 7.2
Jan., 1996 IB (NA) 66468-E Correction
CONTENTS, 4.1, 4.2, 5.1, 5.2, 6.1, 6.2, 6.3, 6.4, 6.5,
7.1, 7.2
Addition
3.2, 4.3.3
Apr., 1997 IB(NA) 66468-F Addition of models
A1SHCPU, A2SHCPU(S1)
Addition
Grneral specifications, Low voltage instruction,
3.1, 5.3, 7.2, Appendix
Correction
Safety precautions, 4.2
Aug., 1997 IB(NA) 66468-G Correction
CONTENTS, 3.4, 7.1, 7.3, Appendix 2, Appendix 5
INTRODUCTION
Thank you for choosing the Mitsubishi MELSEC-A Series of General Purpose Programmable
Controllers. Please read this manual carefully so that the product is used to its optimum. A copy of
this manual should be forwarded to the end user.
This manual describes specifications and requirements related to safety, installations, wiring and
maintenance of the AnS series PC. For functional information, please refer to detail manuals of
each module.
Guidelines for the safety of the user and protection of the AnS series PC
This manual provides information for the installation and use of the AnS series PC. The manual
has been written to be used by trained and competent personnel. Please read the manual carefully
before installation and/or operations of the product. If the product is used in a manner not
specified by the manual, the protection provided by the product may be impaired.
Note: Definition of ‘trained and competent personnel’ is as follows:
a) Any engineer who is responsible for the planning, design and construction of
automatic equipment using the product associated with this manual should be of a
competent nature, (trained and qualified to the local and national standards required
to fulfill that role). These engineers should be fully aware of all aspects of safety with
regards to automated equipment.
b) Any commissioning or service engineer must be of a competent nature, trained and

qualified to the local and national standards required to fulfill that job. These
engineers should also be trained in the use and maintenance of the completed
product. This includes being completely familiar with all associated documentation
for the said product. All maintenance should be carried out in accordance with
established safety practices.
c) All operators of the completed product should be trained to use that product in a safe
and co-ordinated manner in compliance to established safety practices. The
operators should also be familiar with all documentation which is connected with the
actual operation of the completed equipment.
Note: the term ‘completed equipment’ refers to a third party constructed device which
contains or uses the product associated with this manual.
Note’s on the symbols used in this manual

At various times through out this manual, certain symbols are used to highlight points of
information which are intended to ensure the users personal safety and protect the integrity of the
equipment. Whenever any of the following symbols are encountered, its associated note must be
read and understood. Each of the symbols used are listed with a brief description of its meaning.
P DANGER
Indicates that the identified danger could possibly cause serious physical
injury and/or death.
ECAUTION Indicates that the identified danger could possibly cause physical injury or
property damage.
Notification of CE marking
The following products have shown compliance through direct testing (to the
identified standards) and design analysis (forming a technical construction file)
to the European Directive for Electromagnetic Compatibility (89/336/EEC)
Products: Type: Programmable Logic Controller
(Open Type equipment, Installation category II)
Model: AnS-Series
(Applicable units listed below)
Harmonised European Standards IEC Standards

Reference No. Date of lssue Reference No. Date of lssue
EN50081-2 1992 IEC801-2 1984
prEN50082-2 1992 IEC801-3 1984
EN50082-2 1995 IEC801-4 1988
AnS-Series Programmable Logic Controllers

Range of products:
Models
A1S32B A1S63P A1SG62 A1SJHCPU A1SY18A A2SHCPU
A1S33B A1S64AD A1SH42 A1SP60 A1SY18AEU A2SHCPU-S1
A1S35B A1S65B A1SH42 A1ST60 A1SY22 A64DAIC
A1S38B A1S65B-S1 A1SI61 A1SX10EU A1SY28A A64DAVC
A1S52B A1S68AD A1SJ51T64 A1SX20EU A1SY28EU A68ADC
A1S52B-S1 A1S68B A1SJ71AP21 A1SX30 A1SY40 AD61C
A1S55B A1S68B-S1 A1SJ71AP21-S3 A1SX40 A1SY41 AJ55TB2-4R
A1S55B-S1 A1S68DAI A1SJ71AR21 A1SX40-S1 A1SY42 AJ55TB2-8R
A1S58B A1S68DAV A1SJ71AT21B A1SX40-S2 A1SY50 AJ55TB3-4D
A1S58B-S1 A1S68TD A1SJ71E71-B2 A1SX41 A1SY60E AJ55TB3-8D
A1S61P A1SCPU A1SJ71E71-B5 A1SX41-S2 A1SY68A AJ55TB32-4DR
A1S61PEU A1SCPU-S1 A1SJ71LP21 A1SX42 A1SY71 AJ55TB32-8DR
A1S61PN A1SHCPU A1SJ71PT32-S3 A1SX42-S2 A1SY80 AX40Y50C
A1S62DA A1SD51S A1SJ71C24-PRF A1SX80 A1SY81 AX80Y14CEU
A1S62DA A1SD61 A1SJ71C24-R2 A1SX80-S1 A1SY81EP AX80Y80C
A1S62P A1SD70 A1SJ71C24-R4 A1SX80-S2 A2ASCPU AX41C
A1S62PEU A1SD71-S2 A1SJ71UC24-PRF A1SX81 A2ASCPU-S1 AX81C
A1S62PN A1SD71-S7 A1SJ71UC24-R2 A1SX81-S2 A2ASCPU-S30 AY15CEU
A1S62RD3 A1SD75-P1 A1SJ71UC24-R4 A1SY10 A2ASCPU-S60 AY51C
A1S62RD4 A1SD75-P2 A1SJ72T25B A1SY10EU A2SCPU AY81C
A1S63ADA A1SD75-P3 A1SJCPU-S3 A1SY14EU A2SCPU-S1
The products listed above must be used as directed by the associated documentation in order to
provide full compliance. Please contact your local Mitsubishi Sales office or distributor for further
details.
CONTENTS
1. ENVIRONMENTAL SPECIFICATIONS ...........................................................................................1 - 1
2. MODULE SPECIFICATIONS ............................................................................................. 2 - 1 to 2 - 8

2.1 Power Supply Modules ............................................................................................................2 - 1
2.2 Digital I/O Modules ...................................................................................................................2 - 3
2.2.1 Input modules .............................................................................................................2 - 3
2.2.2 Output modules ..........................................................................................................2 - 5
2.2.3 Input/output combined modules ...............................................................................2 - 7
3. INSTALLATION ................................................................................................................. 3 - 1 to 3 - 23
3.1 General Safety Requirements ................................................................................................3 - 1
3.2 Requirements for Compliance to EMC Directive (89/336/EEC) ........................................3 - 2
3.2.1 EMC standards ............................................................................................................3 - 2
3.2.2 Installation instructions for EMC ...............................................................................3 - 4
3.2.2.1 Controll cabinet ..........................................................................................3 - 4
3.2.2.2 Connection of power and earth wires3 - 4
3.2.2.3 Cables .........................................................................................................3 - 5
3.2.2.4 Shield earthing ...........................................................................................3 - 6
3.2.2.5 MELSECNET/II module.............................................................................3 - 6
3.2.2.6 Ethernet module .........................................................................................3 - 7
3.2.2.7 I/O and other communication cables .....................................................3 - 7
3.2.2.8 Power supply module ................................................................................3 - 7
3.2.2.9 Ferrite core .................................................................................................3 - 8
3.2.2.10 Noise filter (power supply line filter) .......................................................3 - 8
3.3 Requirment to Conform to the low Voltage Instruction .......................................................3 - 9
3.3.1 Standard applied for MELSEC-AnS..........................................................................3 - 9
3.3.2 Precautions When using the MELSEC-AnS series PC......................................... 3 -10
3.3.3 Power supply .............................................................................................................. 3 -10
3.3.4 Control box .................................................................................................................. 3 -11
3.3.5 Module installation ..................................................................................................... 3 -11
3.3.6 Grounding .................................................................................................................... 3 -12
3.3.7 External wiring ............................................................................................................ 3 -12
3.4 Module Handling ..................................................................................................................... 3 -13
3.5 Base Mounting ......................................................................................................................... 3 -14
3.6 Constructions to Reduce EMI Noise ..................................................................................... 3 -16
3.7 Precautions When Unfailure Power System (CPS) is Connected.................................... 3 -17
3.8 Part Indentification of the CPU .............................................................................................. 3 -18
3.9 RS232C Interface (A1SCPUC24-R2 only) ........................................................................... 3 -21
3.10 Self-Loopback Test (A1SCPUC24-R2 only) ........................................................................3 -23
–i–
4. WIRING ............................................................................................................................... 4 - 1 to 4 - 17
4.2 Power Supply Modules ............................................................................................................4 - 2
4.3 Digital I/O Modules ...................................................................................................................4 - 5
4.3.1 Input module connections ..........................................................................................4 - 6
4.3.2 Output module connections ...................................................................................... 4 -10
4.3.3 Input/output composite module connections ...........................................................4 -16
5. FAIL-SAFE CONSTRUCTIONS ........................................................................................ 5 - 1 to 5 -3

5.2 Fail-Safe Circuitry Against to Failure of the PC...................................................................5 - 1
6. MAINTENANCE ................................................................................................................... 6 - 1 to 6 - 4
6.1 General Safety Requirement ..................................................................................................6 - 1
6.2 Daily Inspection ........................................................................................................................6 - 2
6.3 Periodic Inspection ...................................................................................................................6 - 3
6.4 Battery Replacement................................................................................................................6 - 4
7. ERROR CODES ................................................................................................................. 7 - 1 to 7 - 14

7.1 Error Code List for A1SCPU(S1), A1SCPUC24-R2 and A2SCPU(S1) ............................7 - 1
7.2 Error Code List for A2ASCPU(S1/S30/S60) .........................................................................7 - 5
7.3 Error Code List for A1SHCPU, A2SHCPU(S1) ................................................................... 7 -14
APPENDIX ................................................................................................................................. A - 1 to A - 2
Appendix 1 Dissimilarities between A1SHCPU and A1SCPU(S1)............................................. A - 1
Appendix 2 Dissimilarities between A2SHCPU(S1) and A2SCPU(S1) ..................................... A - 1
Appendix 3 Diffrernces between A2SCPU-S30/S60 and A2ASCPU(S1).................................. A - 2
Appendix 4 CE Marking Compatible Module for Compact PC ................................................... A - 2
Appendix 5 CC-Link Dedicated Instructions List .......................................................................... A - 2
– ii –
This manual describes cautions on handling, connection to I/O modules, and
error codes of A1SCPU(S1), A2SCPU(S1), A2ASCPU(S1/S30/S60), and
A1SHCPU, A1SHCPU(S1), A1SCPUC24-R2 (hereafter called “the CPU”).
Refer to the following manuals when necessary.
Detailed manuals • A1SCPU/A1SCPUC24-R2/A2SCPU User’s Manual (IB-66320)
This manual describes the specifications and functions of A1S, A1SC24-R2
and A2SCPU(S1), and specifications etc. of the memory cassettes, the
power supply module and extension base unit.
• A2ASCPU(S1) User’s Manual (IB-66455)
This manual describes the specifications and functions of A2ASCPU(S1)
and the specifications of the memory cassettes, the power supply modules
and extension base units that can be used with it.
• A1SJHCPU/A1SHCPU/A2SHCPU(S1) User’s Manual (IB-66779)
This manual describes the specifications and functions of A1SJHCPU,
A1SH, and A2SHCPU(S1) and the specifications of the memory cassettes,
the power supply modules and extension base units that can be used with
it.
Related manuals • ACPU Programming Manual (Fundamentals) (IB-66249)

This manual describes programming methods required to create programs,
device names, parameters, types of program, configuration of the memory
area, etc.
• ACPU Programming Manual (Common Instructions) (IB-66250)
This manual describes how to use the sequence instructions, basic instruc-
tions, application instructions and micro-computer programs.
• AnACPU/AnUCPU Programming Manual (Dedicated Instructions)
(IB-66251)
This manual describes the extended instructions for the A2ASCPU(S1).
• AnACPU/AnUCPU Programming Manual (AD57 control instructions)
(IB-66257)
This manual describes the dedicated instructions used to control AD57(S1)/
AD58 CRT/LCD control modules with an A2ASCPU(S1).
• AnACPU/AnUCPU Programming Manual (PID control instructions)
(IB-66258)
This manual describes the dedicated instructions used to execute PID
control with an A2ASCPU(S1).
• AnS Module type I/O User’s Manual (IB-66541)
This manual gives the specifications for AnS module type I/O modules.
• Computer Link Module User’s Manual (Comms. link func./ Print func.)
(SH-3511)
This manual describes communication between the A1SCPUC24-R2 and
external devices using the dedicated protocol, no protocol, and bidirectional
modes, and the settings, wiring, programming, troubleshooting, etc., for this
module.
• Computer Link Module Guidebook (SH-3510)
This manual gives the basic information required to execute data communi-
cation with external devices (computers, for example), in each mode of the
computer link function.
• MELSECNET, MELSECNET/B Data Link System Reference Manual
(IB-66350)
This manual describes the performance, functions and programming meth-
ods for the MELSECNET and MELSECNET/B data link systems.
1. GENERAL SPECIFICATIONS
MELSEC-A
1. GENERAL SPECIFICATIONS
This product has been designed to be installed in the following environmental
conditions.
Please place the product in places where environmental conditions satisfies
the specifications.
Item Specifications
Ambient operating
0 to 55°C
temperature
Ambient storage
-20 to 75°C
temperature
Ambient operating
10 to 90% RH, Non-condensing
humidity
Ambient storage humidity 10 to 90% RH, Non-condensing
Frequency Acceleration Amplitude No. of sweeps
0.075mm
Under intermittent 10 to 57Hz —
Conforming to (0.003inch) 10 times each
Vibration resistance JIS B 3501, vibration
57 to 150Hz 9.8m/s 2 {1G} — in X, Y, Z
IEC 1131-2 directions
0.035mm
Under continuous 10 to 57Hz — (for 80 min.)
(0.001inch)
vibration
57 to 150Hz 4.9m/s2 {0.5G} —
Conforming to JIS B3501, IEC 1131-2
Shock resistance
(147m/s 2 {15G}, 3 times in each of 3 directions X Y Z)
Operating ambience No corrosive gases
Operating elevation 2000m (6562 feet) max.
Installation location Control panel
Over voltage category * 1 II max.
Pollution level * 2 2 max.
*1: This indicates the section of the power supply to which the equipment is assumed to be
connected between the public electrical power distribution network and the machinery within the
premises. Category II applies to equipment for which electrical power is supplied from fixed
facilities. The surge voltage withstand level for up to the rated voltage of 300V is 2500V.
*2: This index indicates the degree to which conductive material is generated in terms of the
environment in which the equipment is used. Pollution level 2 is when only non-conductive
pollution occurs. A temporary conductivity caused by condensation must be expected
occasionally.
1–1
2. MODULE SPECIFICATIONS
MELSEC-A
2.1 Power Supply Modules

Specifications of power supply modules are shown in the following table
Specifications
Item
A161P A1S62P A1S63P
Base loading slot Power supply module loading slot
100 to 120 VAC+10%/-15%(85 to 132 VAC) 24 VDC +30%/-35%

Rated input voltage
(15.6 to 31.2VDC)
200 to 240 VAC+10%/-15%(170 to 264 VAC)
Rated input frequency 50/60 Hz ±3% 
Max. input apparent power 105 VA 41 Ω
Inrush current 20 A 8 ms or lower 81 A 1 ms or lower
5 VDC 5A 3A 5A
Rated output current
24 VDC±10%  0.6 A 
5 VDC 5.5 A or higher 3.3 A or higher 5.5 A or higher

Overcurrent protection
24 VDC  0.66 A or higher 
5 VDC 5.5 to 6.5 V

Overvoltage protection
24 VDC 
Efficiency 65% or higher
Allowable momentary power failure time *3 20ms or lower 1ms or lower
Between primary
1500 VAC *1 1500 VAC *1 500 VAC
Dielectric withstand and 5 VDC
voltage
Between primary
 1500 VAC *1 
and 24 VDC
Insulation resistor 5M Ω or highter at insulation resistance tester
Noise voltage 500Vp-p,

Noise voltage 1500Vp-p, Noise width 1 µs, Noise frequency Noise width 1 µs, Noise
Noise durability
25 to 60Hz (noise simulator condition) frequency 25 to 60Hz (noise
simulator condition)
Power indication Power LED indication (light at the time of output of 5VDC)
Terminal screw size M3.5 × 7
Applicable wire size 0.75 to 2mm 2 (AWG18 to 14)
Applicable solderless terminal RAV1.25 to 3.5, RAV2 to 3.5
Applicable tightenig torque 59 to 88 N⋅cm (6 to 9kg⋅cm)
External dimension mm (inch) 130 × 55 × 93.6 (5.12 × 2.17 × 3.69)
Weight kg (lb) 0.53 (1.17) 0.55 (1.21) 0.5 (1.1)
*1: Overcurrent protection

The overcurrent protection device shuts off the 5V, 24 VDC circuit and stops the system if the current flowing
in the circuit exceeds the specified value. When this device is activated, the power supply module LED is
switched OFF or dimly lit. If this happens, eliminate the cause of the overcurrent and start up the system again.
*2: Overvoltage protection
The overvoltage protection device shuts off the 5 VDC circuit and stops the system if a voltage of 5.5 to 6.5 V is
applied to the circuit. When this device is activated, the power supply module LED is switched OFF. If this
happens, switch the input power OFF, then ON to restart the system. The power supply module must be changed
if the system is not booted and the LED remains OFF.
*3: Allowable momentary power interruption time
This value indicates the momentary power interruption time allowed for the PC CPU and varies according to the
power supply module used with the PC CPU module. The allowable momentary power interruption time for a
system in which an A1S63P is used is defined as starting when the primary power supply of the 24 VDC
stabilized power supply of the A1S63P is turned OFF and lasting until the 24 VDC becomes less than the
specified voltage (15.6 VDC).
2–1
MELSEC-A
A1S61PEU A1S62PEU A1S61PN A1S62PN
200 to 240 VAC (10%/-15%) 100 to 240 VAC(10%/-15%)

(170 to 264VAC) (85 to 264VAC)
50/60 Hz ±5%
105VA
40 A 8ms or lower 20A 8ms or lower
5A 3A 5A 3A
 0.6A  0.6A
5.5 A or higher 3.3 A or higher 5.5 A or higher 3.3 A or higher
 0.66A or higher  0.66 A or higher
20ms or higher
1780 VAC 1780 VAC

AC across input/LG and output/FG 2830VAC rms/3cycle (2000m)
 1780 VAC
AC across input/LG and output/FG5M Ω or highter, mesured with a

5M Ω or highter at insulation resistance tester
500VDC insulation resistance tester
(1) Noise voltage 1500Vp-p, Noise width 1 µs,

Noise frequency 25 to 60Hz (noise simulator condition)
(2) Noise voltage IEC801-4, 2kV
RAV1.25 to 3.5, RAV2 to 3.5 RAV1.25 to 4, RAV2 to 4
59 to 88 N⋅cm (6 to 9 kg⋅cm) 83 to 113 N⋅cm (8.5 to 11.5 kg⋅cm)
130 × 55 × 93.6 (5.12 × 2.17 × 3.69) 130 × 54.5 × 93.6 (5.12 × 2.15 × 3.69)
0.53 (1.17) 0.55 (1.21) 0.60(1.32)
*4: A1S61PEU and A1S62PEU comply with EN61010-1 and safety aspects of IEC1131-2 to meet the Low Voltage
Directive which will be mandatory from the 1st of January 1997.
*5: Do not apply over 400 Voltage between AC and LG as the Varistor is installed between the AC and LG.
2–2
MELSEC-A
2.2 Digital I/O Modules
2.2.1 Input modules
Specifications of input modules are shown in the following table.
Operating Voltage Maximum

Simultaneous
Dielectric
No. of Rated Input Input Input Points
Model Type Withstand
Points Voltage Current (Percentage
Voltage ON Voltage OFF Voltage Simultaneously
ON)
100% (110 VAC)

A1SX10 16 100 to 120 VAC, 6 mA 1500 VAC 80 VAC or 30 VAC or 60% (132 VAC)
50/60 Hz higher lower
A1SX10EU AC input 16 7 mA 1780 VAC 100%
A1SX20 16 200 to 240 VAC, 9 mA 1500 VAC 80 VAC or 30 VAC or

60% (220 VAC)
50/60 Hz higher lower
A1SX20EU 16 11 mA 2830 VAC
12/24 VAC,
7 VAC/VDC or 2.7 VAC/VDC
A1SX30 AC/DC input 16 50/60 Hz 4.2/8.6 mA 75% (26.4 VAC)
higher or lower
12/24 VDC
8 VDC or 100%
A1SX40 16 12/24 VDC 3/7 mA 4 VDC or lower
higher (26.4 VDC)
14 VDC or 6.5 VDC or 100%

A1SX40-S1 16 24 VDC 7 mA
higher lower (26.4 VDC)

A1SX40-S2 16 24 VDC 7 mA
DC input
(sink type) 8 VDC or
A1SX41 32 12/24 VDC 3/7 mA 4 VDC or lower 60% (26.4 VDC)
higher
14 VDC or 6.5 VDC or

A1SX41-S2 32 24 VDC 7 mA 60% (26.4 VDC)
higher lower
8 VDC or
A1SX42 64 12/24 VDC 2/5 mA 4 VDC or lower 50% (24 VDC)
500 VAC higher
17.5 VDC or
A1SX42-S2 64 24 VDC 5 mA 7 VDC or lower 50% (24 VDC)
higher
3.5 VDC or
A1SX71 32 5/12 VDC 1.2/3.3 mA 1 VDC or lower 100%
higher
8 VDC or 100%
A1SX80 16 12/24 VDC 3/7 mA 4 VDC or lower
higher (26.4 VDC)
17 VDC or 100%
A1SX80-S1 DC input 16 24 VDC 7 mA 5 VDC or lower
higher (26.4 VDC)
(sink/source)
13 VDC or 100%
A1DX80-S2 16 24 VDC 7 mA 6 VDC or lower
higher (26.4 VDC)
8 VDC or
A1SX81 32 12/24 VDC 3/7 mA 4 VDC or lower 60% (26.4 VDC)
higher
13 VDC or
A1SX81-S2 32 24 VDC 7 mA 6 VDC or lower 60% (26.4 VDC)
higher
DC input 16/32/ 8 VDC or 100%

A1S42X 12/24 VDC 4/9 mA 4 VDC or lower
(dynamic) 48/64 higher (26.4 VDC)
2–3
MELSEC-A
Specifications of input modules are shown in the following table.
Max. Response Time

Internal Power
No. of
Applicable Wire Points/ Noise Current Supply
Field Wiring Occupied
Size Common Immunity Consumption Requirement
OFF to ON ON to OFF Points
(5 VDC)
Terminal 16 1000 VAC 0.05 A 16

20 ms 35 ms

30 ms 55 ms
0.75 to 1.25 mm 2
25 ms 20 ms AWG 15 to 19
20 ms 20 ms
10 ms 10 ms Terminal 16 500 VAC 0.05 A 16
0.1 ms 0.2 ms Terminal 16 500 VAC 0.05 A 16
10 ms 10 ms 40-pin connector 32 500 VAC 0.08 A 32
0.3 mm 2 SELV
10 ms 10 ms 40-pin connector AWG22 32 500 VAC 0.09 A 64 power
supply is
required
1.5 ms 3 ms 40-pin connector 32 500 VAC 0.075 A 32
2
0.75 to 1.25 mm
0.4 ms 0.5 ms Terminal AWG15 to 19 16 1000 VAC 0.05 A 16
0.3 mm 2
10 ms 10 ms 37-pin connector AWG22 32 1000 VAC 0.08 A 32
0.4 ms 0.4 ms 24-pin connector  500 VAC 0.08 A 16/32/48/64
2–4
MELSEC-A
2.2.2 Output modules
Specifications of output modules are shown in the following table.
No. Max. Output Response

of Time
Model Type Rated Load Voltage Max. Load Current Dielectric Withstand Voltage
Points
OFF to
ON to OFF
ON
240 VAC, 50/60 Hz

A1SY10 Relay output 16 2 A/pt, 8 A/com 1500 VAC 10 ms 12 ms
24 VDC
AC terminal-Relay
Relay output 1780 VAC
A1SY10EU 16 120 VAC, 24 VDC 2 A/pt, 8 A/com coil, 5 VAC 10 ms 12 ms
(for 24 VDC)
Relay coil, 5 VAC 500 VAC
AC terminal-Relay
2830 VAC
A1SY14EU Relay output 12 240 VAC, 24 VDC 2 A/pt, 8 A/com coil, 5 VAC 10 ms 12 ms
240 VAC, 50/60 Hz

A1SY18A Relay output 8 2 A/pt, 8 A/module 1500 VAC 10 ms 12 ms
24 VDC
AC terminal-Relay
2830 VAC
A1SY18AEU Relay output 8 240 VAC, 24 VDC 2 A/pt coil, 5 VAC 10 ms 12 ms
A1SY22 Triac output 16 240 VAC, 50/60 Hz 0.6 A/pt, 2.4 A/com 1500 VAC 1 ms 0.5 cycle + 1 ms
A1SY28A Triac output 8 240 VAC, 50/60 Hz 1 A/pt, 4 A/module 1500 VAC 1 ms 0.5 cycle + 1 ms
A1SY28EU Triac output 8 100 - 240 VAC 0.6 A/pt, 1.9 A/com 2830 VAC 1 ms 0.5 cycle + 1 ms
A1SY40 16 12/24 VDC 0.1 A/pt, 0.8 A/com 2 ms 2 ms
A1SY41 32 12/24 VDC 0.1 A/pt, 2 A/com 2 ms 2 ms
A1SY60 16 24 VDC 2 A/pt, 4 A/com 2 ms 2 ms

Transistor
500 VAC
output
A1SY60E 16 5/12/24 VDC 2 A/pt, 4 A/com 3 ms 10 ms
A1SY68A 8 5/12/24 VDC 2 A/pt 3 ms 10 ms
A1SY71 32 5/12 VDC 16 mA/pt, 256 mA/com 1 ms 1 ms
0.1 A/pt, 2 A/com

A1SY81EP 32 12/24 VDC 0.5ms 1.5ms
0.05 A/pt, 1.6 A/com
A1S42Y 64 12/24 VDC 0.1 A/pt 2 ms 2 ms
2–5
MELSEC-A
External Power Internal

Supply No of
Applicable Points/ Surge Noise Current
Field Wiring Fuse Rating Occupied
Wire Size Common Suppression Durability Consumption
Points
Current Requirement (5 VDC)
Terminal 8 None None 1000 VAC 0.09 A 0.12 A 16
SELV power
supply
Terminal 4 None None 1000 VAC 0.1 A required 0.12 A 16
0.75 to
1.25 mm 2
AWG15 to 19
Terminal  None None 1000 VAC 0.75 A 0.24 A 16
Terminal 8 CR 5A 1500 VAC 0.02 A 0.27 A 16
Terminal 1 CR None 1500 VAC  0.13 A 16
Terminal 4 CR None 1000 VAC  0.27 A 16
Terminal 8 Zener diode 1.6 A 500 VAC 0.08 A 0.27 A 16
40-pin connector 0.3 mm 2 32 Zener diode 3.2 A 500 VAC 0.08 A 0.5 A 32
AWG22
40-pin connector 32 Zener diode 3.2 A 500 VAC 0.08 A 0.93 A 64
Terminal 8 Zener diode 3.2 A 500 VAC 0.06 A 0.12 A 16
Terminal 0.75 to 8 Zener diode 5A 500 VAC 0.015 A 0.12 A 16

1.25 mm 2
AWG15 to 19
Terminal 8 Zener diode 7A 500 VAC 0.01 A SELV power 0.2 A 16
supply
Terminal 1 Zener diode None 500 VAC  required 0.11 A 16
0.3mm 2
40-pin connector. 32 None 1.6 A 500 VAC 0.15 A 0.4 A 32
AWG22
0.75 to
Terminal 1.25 mm 2 8 Zener diode 5A 1000 VAC 0.02 A 0.12 A 16
AWG15 to 19
37-pin connector 32 Zener diode 3.2 A 1000 VAC 0.08 A 0.5 A 32

0.3 mm 2 Clamping
37-pin connector AWG22 32 None 1000VAC 0.08A 0.5A 32
diode
24-pin connector  None 1.6 A 500 VAC 0.08 A 0.1 A 16/32/48/64
2–6
MELSEC-A
2.2.3 Input/output combined modules
Specifications of input/output combined modules are shown in the following

table.
(1) Input specifications
Operating Voltagee Maximum

Simultaneous
Insulation
No. of Rated Input Input Input Points
Model Type Withstand
Points Voltage Current (Percentage
Voltage ON Voltage OFF Voltage Simultaneously
ON)
8 VDC or 4 VDC or 60%

A1SH42 32 12/24 VDC 2/5 mA
higher lower (24 VDC)
DC input 14 VDC or 6.5 VDC or 100%
A1SX48Y18 8 24 VDC 7 mA 500 VAC
(sink type) higher lower (26.4 VDC)

A1SX48Y58 8 24 VDC 7 mA
(2) Output specifications
Dielectric Max. Output Response Time

Rated Load Max. Load
Model Type No. of Points Withstand
Voltage Current
Voltage OFF to ON ON to OFF
Transistor 0.1 A/pt,

A1SH42 32 12/24 VDC 500 VAC 0.4 ms 0.4 ms
output 0.8 A/com
240 VAC, 2 A/pt,

A1SX48Y18 Relay output 8 1500 VAC 10 ms 12 ms
50/60 Hz 24 VDC 8 A/com
Transistor 0.5 A/pt,

A1SX48Y58 8 12/24 VDC 500 VAC 2 ms 2 ms
output 2 A/com
2–7
MELSEC-A
Max. Response Time

Internal
No. of Power
Applicable Points/ Noise Current
Field Wiring Occupied Supply
Wire Size Common Durability Consumption
OFF to ON ON to OFF Points Requirement
(5 VDC)
40-pin 0.3 mm 2
10 ms 10 ms 32 500 VAC 0.05 A 32
connector AWG22
SELV power
10 ms 10 ms Terminal 8 500 VAC 0.05 A 16 supply
0.75 to 1.25 required
mm 2
AWG15 to 19
External Power Supply

Applicable Points/ Surge Noise
Field Wiring Fuse Rating
Wire Size Common Suppression Durability
Current Requirement
40-pin connec- 0.3 mm 2

32 None None 500 VAC 0.08 A
tor AWG22
SELV power
Terminal 0.75 to 1.25 8 Zener diode 3.2 A 1000 VAC 0.045 A supply required
mm 2
AWG 15 to 19
Terminal 8 None None 500 VAC 0.06 A
2–8
MEMO
3. INSTALLATION
MELSEC-A
3. INSTALLATION
3.1 General Safety Requirements
E CAUTION
This product is an open type equipment and itself does not comply with IP2X
protection. The product must be installed in a suitable enclosure which
should be selected and installed in accordance to the local and national
standards.
An enclosure which contains the product can be opened only under any of
the following conditions (a) to (c) in order to protect operators from electrical
shock in normal operations. The following measures must be taken:
(a) The use of a key or tool is necessary. This method is only allowed
for access by skilled or instructed persons.
(b) Disconnection of supplied power before the enclosure is opened.
(c) Barriers should be provided for all live parts except those supplied
by Extra-Low Voltage.
This products must be installed and used in environment specified as the

environmental specifications. Otherwise, using in different environment
could cause electrical shock, fire, malfunction, damage of the products
and/or decrease of product capability.
When mounting a module onto a base unit, securely insert the fixing hook on
the bottom of the module into the hole provided on the base unit at first, then
plug the body of module on the base unit. If the modules are not mounted
correctly they may fall, malfunction or fail to operate correctly.
Extension base cables must be securely connected. Make sure that no

unsecured connection is made. Unsecured connection could cause PC to
read and/or write wrong status from/to input or output modules.
A memory cassette module or memory chips must be securely loaded on a

connector or socket. Make sure that no unsecured loading was made or
malfunction may occur.
3–1
3. INSTALLATION
MELSEC-A
3.2 Requirements for Compliance to EMC Directive (89/336/EEC)
The EMC Directive (89/336/EEC) will become mandatory within Europe from
January 1st 1996. The EMC directive in essence defines the amount of
electromagnetic output a product is allowed to produce and how susceptible
that product is to electromagnetic interference. Any manufacturer or importer
of electrical/electronic apparatus must before releasing or selling products
within Europe after that date have either a CE mark attached to their goods.
Testing to comply with the directive is done by use of agreed European
standards which define limits for radiated and mains conducted electro-ma-
gnetic emissions from equipment, levels of immunity to radiated emissions,
ability for equipment to cope with transient voltage surges and electro-static
discharges.
When installed in the specified manner this unit will be compliant with the
relevant standards EN50081-2 and prEN50082-2 as applicable in the EMC
directive. Failure to comply with these instructions could lead to impaired
EMC performance of the equipment and as such Mitsubishi Electric Corpo-
ration can accept no liability for such actions.
3.2.1 EMC standards
When the PC is installed following the directions given in this manual its EMC
performance is compliant to the following standards and levels as required
by the EMC directive.
Specifications Test Item Test Description Standard Values

EN55011 Measure the electric wave 30M-230MHz QP : 30dBµV/m (30m measurement) *1
Radiated noise released by the product.
230M-1000MHz QP : 37dBµV/m (30m measurement)
EN50081-2: 1995
Measure the noise released 150k-500kHz QP: 79dB, Mean : 66dB *1
EN55011
by the product to the power
Conduction noise
line. 500k-30MHz QP : 73dB, Mean: 60dB
Immunity test by applying 4kV contact discharge

IEC801-2
static electricity to the
Static electricity immunity *2
module enclosure. 8kV air discharge
Immunity test by radiating

prEN50082-2: 1991 IEC801-3
an electric field to the 10V/m, 27-500MHz
Radiated electromagnetic field *2
product.
Immunity test by applying

IEC801-4
burst noise to the power 2kV
First transient burst noise
line and signal cable.
Immunity test by applying 4kV contact discharge

EN61000-4-2
static electricity to the
Static electricity immunity *2
module enclosure. 8kV air discharge
Immunity test by applying

EN61000-4-4
burst noise to the power 2kV
First transient burst noise
line and signal cable.
EN50082-2: 1995 ENV50140 Immunity test by radiating

Radiated electromagnetic field an electric field to the 10V/m, 80-1000MHz, 80% AM modulation@1kHz
AM modulation*2 product.
ENV50204 Immunity test by radiating

10V/m, 900MHz, 200Hz pulse modulation, 50%
Radiated electromagnetic field an electric field to the
duty
Pulse modulation*2 product.
Immunity test by inducting

ENV50141
electromagnetic field to the 10Vrms, 0.15-80MHz, 80% modulation@1kHz
Conduction noise
power line signal cable.
3–2
3. INSTALLATION
MELSEC-A
(*1) QP: Quasi-peak value, Mean: Average value
(*2) The PC is an open type device(device installed to another device) and
must be installed in a conductive control box.
The tests for the corresponding items were perfomed while the PC was
installed to inside the control box.
3–3
3. INSTALLATION
MELSEC-A
3.2.2 Installation instructions for EMC
3.2.2.1 Control cabinet
When constructing a control cabinet where the PC system will be installed,

the following instructions must be followed.
(1) Use a conductive control cabinet.

(2) When attaching the control cabinet’s top plate or base plate, mask
painting and weld so that good surface contact can be made between
the cabinet and plate.
(3) To ensure good electrical contact with the control cabinet, mask the
paint on the installation bolts of the inner plate in the control cabinet so
that contact between surfaces can be ensured over the widest possible
area.
(4) Earth the control cabinet with a thick wire so that a low impedance
connection to ground can be ensured even at high frequencies. (22 mm 2
wire or thicker is recommended.)
(5) Holes made in the control cabinet must be 10 cm diameter or less. If the
holes are 10 cm or larger, radio frequency noise may be emitted.
(6) Connect the door of cabinet to the main body with flat braided wires at
as many points as possible so that a low impedance can be ensured
even at high frequencies.
3.2.2.2 Connection of power and earth wires
Earthing and power supply wires for the PC system must be connected as
described below.
(1) Provide an earthing point near the power supply module. Earth the
power supply’s LG and FG terminals (LG: Line Ground, FG: Frame
Ground) with the thickest and shortest wire possible. (The wire length
must be 30 cm or shorter.) The LG and FG terminals function is to pass
the noise generated in the PC system to the ground, so an impedance
that is as low as possible must be ensured. As the wires are used to
relieve the noise, the wire itself carries a large noise content and thus
short wiring means that the wire is prevented from acting as an antenna.
Note) A long conductor will become a highly efficient antenna at high fre-
quency.
(2) The earth wire lead from the earthing point must be twisted with the
power supply wires. By twisting with the earthing wire, noise flowing
from the power supply wires can be relieved to the earthing. However,
if a filter is installed on the power supply wires, the wires and the
earthing wire may not need to be twisted.
(3) Except for A1S61PEU and A1S62PEU, short between FG and LG
terminals by a short jumper wire.
3–4
3. INSTALLATION
MELSEC-A
3.2.2.3 Cables
The cables led from the control cabinet contain a high frequency noise
element and outside the control panel these cables act as antenna and
radiate noise. The cables connected to input/output modules or special
modules which leave the control panel must always be shielded cables.
Mounting of a ferrite core on the cables is not required (excluding some
models) but if a ferrite core is mounted, the noise radiated through the cable
can be suppressed further.
Use of a shielded cable is also effective for increasing the noise immunity
level. The PC system’s input/output and special function module provide a
noise immunity level of equivalent to that stated in IEC801-4: 2 kV when a
shielded cable is used. If a shielded cable is not used or if the shield earthing
treatment is not suitable even when used (refer to section 3.2.2.4), the noise
immunity level is less than 2 kV
Note) prEN50082-2 specifies the noise resistance level based on the signal
wire application
Signals involved in process control: 2 kV
Signals not involved in process control: 1 kV
The meaning of “involved in process control” is not defined in prEN50082-2.
However, when the purposes of the EMC Directive are considered, the
signals that could cause personal injury or risks in the facility if a malfunction
occurs should be defined as “signals involved in process control”. Thus, it is
assumed that a high noise immunity level is required.
3–5
3. INSTALLATION
MELSEC-A
3.2.2.4 Shield earthing
When a shield of shield cable is earthed to the cabinet body, please ensure
that the shield contact with the body is over a large surface area. If the
cabinet body is painted it will be necessary to remove paint from the contact
area. All fastenings must be metallic and the shield and earthing contact must
be made over the largest available surface area. If the contact surfaces are
too uneven for optimal contact to be made either use washers to correct for
surface inconsistencies or use an abrasive to level the surfaces. The follo-
wing diagrams show examples of how to provide good surface contact of
shield earthing by use of a cable clamp.
Screw
Clamp fitting
Shield section
Paint mask Shielded cable
(a) Peal the cable insulation off (b) Sandwich the exposed shield section with the clamp
and expose the shield section. and earth to the control cabinet over a wide area.
Note) The method of earthing by soldering a wire onto the shield section of
the shielded cable as shown below is not recommended. The high
frequency impedance will increase and the shield will be ineffective.
Shielded cable
Wire
Crimp terminal
3.2.2.5 MELSECNET/II module
The following requirements apply to A1SJ71AR21, A1SJ71BR11, AnN-

CPUR21, AnACPUR21.
(1) Always use a triaxial cable for the module. The radiated noise in the
band of 30 MHz or higher can be suppressed by using a triax cable.
Earth the outer shield by the method described in Section 3.2.2.4.
Earth this section
(2) Always mount a ferrite core onto the triaxial cable. Mount the ferrite core
near the control cabinet outlet of each cable. Use of the TDK ZCAT3035
ferrite core is recommended.
3–6
3. INSTALLATION
MELSEC-A
3.2.2.6 Ethernet module
(1) Always earth the AUI cable connected to the A1SJ71E71-B5. The AUI
is a shielded cable so remove the outer insulation and connect to earth
the exposed shield section using as wide a surface area as possible in
the manner shown below.
AUI cable
Shield
(2) Always use a triaxial cable for the coaxial cable connected to the
A1SJ71E71-B2. The earthing precautions are the same as Section
3.2.2.5.
(3) For A1SJ71E71-B2/B5, always mount a ferrite core in addition to items
(1) and (2) above. Use of the TDK ZCAT3035 ferrite core is recommen-
ded.
3.2.2.7 I/O and other communication cables
Always earth the shield section of the I/O signal cables and other communi-
cation cables (RS-232-C, RS-422, etc.) in the same manner as described in
Section 3.2.2.4 if the cables go outside of the control cabinet.
3.2.2.8 Power supply module
The precautions required for each power supply module are described below.
Always observe the items noted as precautions.
Model Precautions
A1S61P Always mount one of the filters listed in section 3.2.2.10 to the incoming
A1S62P power supply lines.
A1S63P (*1)
A1S61PEU None
A1S62PEU
A1S61PN
A1S62PN
(*1) If a sufficient filter circuitry is built into a 24 VDC external power supply
unit, the noise generated by A1S63P will be absorbed by that filter
circuit, so a line filter may not be required.
3–7
3. INSTALLATION
MELSEC-A
3.2.2.9 Ferrite core
A ferrite core is effective for reducing noise in the band of 30 MHz to 100
MHz. Mounting of a ferrite core is not necessary except for some particular
models described in Section 3.2.2.5 and 3.2.2.6. However if further attenua-
tion of noise is necessary, mounting of a ferrite core on cables which radiate
noise is recommended. When a ferrite core is mounted, mount the ferrite core
just before the point where the cable goes outside of the cabinet. The ferrite
will not be effective if the mounting position is not adequate.
Ferrite Ferrite
core core
Noise Noise
(a) When there is a distance from the (b) When mounted by the cable exit
cable exit hole, the noise will jump hole, the noise will not jump over
over the forrite, thus the effect will the ferrite.
be halved.
3.2.2.10 Noise filter (power supply line filter)
The noise filter (power supply line filter) is a device effective to reduce
conducted noise. Except some particular models described in Section
3.2.2.8, installation of a noise filter onto the power supply lines is not
necessary. However conducted noise can be reduced if it is installed. (The
noise filter is generally effective for reducing conducted noise in the band of
10 MHz or less.) Usage of the following filters is recommended.
Model name FN343-3/01 FN660-6/06 ZHC2203-11

Manufacturer SCHAFFNER SCHAFFNER TDK
Rated current 3A 6A 3A
Rated voltage 250 V
3–8
3. INSTALLATION
MELSEC-A
The precautions required when installing a noise filter are described below.
(1) Do not bundle the wires on the input side and output side of the noise
filter. When bundled, the output side noise will be induced into the input
side wires from which the noise was filtered.
Input side Input side
(power supply side) (power supply side)
Introduction
Filter Filter
Output side Output side

(device side) (device side)
(a) The noise will be included when the (b) Separate and lay the input
input and output wires are bundled. and output wires.
(2) Earth the noise filter earthing terminal to the control cabinet with the
shortest wire possible (approx. 10 cm).
3.3 Requirement to Conform to the Low-Voltage Instruction
The low-voltage instruction, one of the European Instructions, is now regu-

lated.
The low-voltage instruction require each device which operates with power
supply ranging from 50VAC to 1000V and 75VDC to 1500V to satisfy neces-
sary safety items.
In the sections from 3.3.1 to 3.3.7, cautions on installation and wiring of the
MELSEC-AnS series PC to conform to the low-voltage instruction regulation
are described.
We have put the maximum effort to develop this material based on the
requirements and standards of the regulation that we have collected. How-
ever, compatibility of the devices which are fabricated according to the
contents of this manual to the above regulation is not guaranteed. Each
manufacturer who fabricates such device should make the final judgment
about the application method of the low-voltage instruction and the product
compatibility.
3.3.1 Standard applied for MELSEC-AnS

The standard applied for MELSEC-AnS is EN61010-1 safety of devices used
in measurement rooms, control rooms, or laboratories.
For the modules which operate with the rated voltage of 50VAC/75VDC or
above, we have developed new models that conform to the above standard.
(See Appendix 4.)
For the modules which operate with the rated voltage under 50VAC/75VDC,
the conventional models can be used, because they are out of the low-voltage
instruction application range.
3–9
3. INSTALLATION
MELSEC-A
3.3.2 Precautions when using the MELSEC-AnS series PC
Module selection
(1) Power module

For a power module with rated input voltage of 100/200VAC, select a
model in which the internal part between the first order and second or-
der is intensively insulated, because it generates hazardous voltage
(voltage of 42.4V or more at the peak) area. (See Appendix 4.)
For a power module with 24VDC rated input, a conventional model

can be used.
(2) I/O module

For I/O module with rated input voltage of 100/200VAC, select a mo-
del in which the internal area between the first order and second or-
der is intensively insulated, because it has hazardous voltage area.
(See Appendix 4.)
For I/O module with 24VDC rated input, a conventional model can be
used.
(3) CPU module, memory cassette, base module

Conventional models can be used for these modules, because they
only have a 5VDC circuit inside.
(4) Special module

Conventional models can be used for the special modules including
analog module, network module, and positioning module, because
the rated voltage is 24VDC or smaller.
(5) Display device
Use an A870GOT CE compatible model.
3.3.3 Power supply

The insulation specification of the power module was designed assuming
installation category II. Be sure to use the installation category II power
supply to the PC.
The installation category indicates the durability level against surge voltage
generated by a thunderbolt. Category I has the lowest durability; category
IV has the highest durability.
Category IV Category III Category II Category I
Figure 1. : Installation Category
Category II indicates a power supply whose voltage has been reduced by two
or more levels of isolating transformers from the public power distribution.
3 – 10
3. INSTALLATION
MELSEC-A
3.3.4 Control box
Because the PC is an open device (a device designed to be stored within
another unit), be sure to use it after storing in the control box.
(1) Electrical shock prevention

In order to prevent persons who are not familiar with the electric facili-
ty such as the operators from electrical shocks, the control box must
have the following functions:
(a) The control box must be equipped with a lock so that only the
personnel who has studied about the electric facility and have
enough knowledge can open it.
(b) The control box must have a structure which automatically stops the
power supply when the box is opened.
(2) Dustproof and waterproof features

The control box also has the dustproof and waterproof functions. In-
sufficient dustproof and waterproof features lower the insulation
withstand voltage, resulting in insulation destruction. The insulation
in our PC is designed to cope with the pollution level 2, so use in an
environment with pollustion level 2 or below.
Pollution level 1: An environment where the air is dry and

conductive dust does not exist.
Pollution level 2: An environment where conductive dust
does not usually exist, but occasional
temporary conductivity occurs due to the
accumulated dust. Generally, this is the
level for inside the control box equivalent
to IP54 in a control room or on the floor of
a typical factory.
Pollution level 3: An environment where conductive dust
exits and conductivity may be generated
due to the accumulated dust.
An environment for a typical factory floor.
Pollution level 4: Continuous conductivity may occur due to
rain, snow, etc. An outdoor environment.
As shown above, the PC can realize the pollution level 2 when stored
in a control box equivalent to IP54.
3.3.5 Module installation

(1) Installing modules contiguously
In AnS series PCs, the left side of each I/O module is left open.
When installing an I/O module to the base, do not make any open
slots between any two modules. If there is an open slot on the left
side of a module with 100/200VAC rating, the printed board which
contains the hazardous voltage circuit becomes bare. When it is una-
voidable to make an open slot, be sure to install the blank module
(A1SG60).
When using the A1S5aB expansion base with no power supply, attach
the cover packaged with the expansion base to the side of the left-
most module.
3 – 11
3. INSTALLATION
MELSEC-A
3.3.6 Grounding
There are two kinds of grounding terminals as shown below. Either groun-
ding terminal must be used grounded.
Be sure to ground the protective grounding for the safety reasons.

Protective grounding : Maintains the safety of the PC and
improves the noise resistance.
Functional grounding : Improves the noise resistance.
3.3.7 External wiring

(1) 24VDC external power supply
For special modules that require a 24VDC I/O module or external po-
wer supply, user a model whose 24VDC circuit is intensively insula-
ted from the hazardous voltage circuit.
(2) External devices

When a device with a hazardous voltage circuit is externally connec-
ted to the PC, use a model whose circuit section of the interface to
the PC is intensively insulated from the hazardous voltage circuit.
(3) Intensive insulation

Intensive insulation refers to the insulation with the dielectric
withstand voltage shown in table 2.
Table 2: Intensive Insulation Withstand Voltage (Installation

Category II, source: IEC664)
Rated voltage of hazardous voltage area Surge withstand voltage (1.2/50µs)

150VAC or below 2500V
300VAC or below 4000V
3 – 12
3. INSTALLATION
MELSEC-A
3.4 Module Handling
E CAUTION
Do not disassemble or modify the modules. Doing so could cause trouble,
erroneous operation, injury, or fire.
When wiring, be sure there are no foreign substances such as sawdust or
wiring debris inside the module. Such debris could cause fires, damages, or
Tighten the terminal screws with the specified torque. If the terminal screws
are loose, it could result in short circuits, fire, or erroneous operation. If the
terminal screws are too tight, it may cause falling, short circuit or erroneous
operation due to damage of the screws or module.
Install so that the pegs on the bottom of the module fit securely into the base
unit peg holes, and use the specified torque to tighten the module’s fixing
screws. Not installing the module correctry could result in erroneous opera-
tion, damage, or pieces of the product falling. If the terminal screws are too
tight, it may cause falling, short circuit or erroneous operation due to damage
of the screws or module.
Do not directry touch the module’s conductive parts or electronic componets.

Doing so could cause erroneous operation or damage of the module.
(1) Module enclosure, terminal block connectors and pin connectors are
made of resin; do not drop them or subject them to strong impact.
(2) Do not remove modules’ printed circuit boards from the enclosure in
order to avoid changes in operation.
(3) During wiring, take care to ensure that wiring off-cuts, etc. do not get
inside the case. If anything does get inside the case, remove it.
(4) Tighten the module mounting and fixing screws as specified below.
Screw Tightenig Torque N⋅cm (kg⋅cm) [lb⋅inch]

Module mounting screws (M4) 78 to 118 (8 to 12) [6.9 to 10.4]
I/O module terminal screw (M3.5) 59 to 88 (6 to 9) [5.2 to 7.8]
Power spply module terminal screws (M3.5) 59 to 88 (6 to 9) [5.2 to 7.8]
3 – 13
3. INSTALLATION
MELSEC-A
3.5 Base Mounting

(1) Mounting dimension
Mounting dimensions of each base unit are as follows:
out OUT
HS
H
CPU I/O 0 I/O 1 I/O 2 I/O 3 I/O 4 I/O 5 I/O 6 I/O 7
POWER MITSUBISHI ELECTRIC CORPORATION 80626E80G52
MADE IN JAPAN E.S.D A1S38B
WS
W
Dimensions mm (inch)
A1S52B A1S55B A1S58B A1S65B A1S68B

A1S32B A1S33B A1S35B A1S38B
(S1) (S1) (S1) (S1) (S1)
W 220 255 325 430 155 260 365 315 420
(8.66) (10.04) (12.80) (16.93) (6.10) (10.24) (14.37) (12.40) (16.54)
Ws 200 235 305 410 135 240 345 295 400
(7.87) (9.25) (12.01) (16.14) (5.31) (9.45) (13.58) (11.61) (15.75)
H 130 (5.12)
Hs 110 (4.33)
(2) Base unit mounting position

Provide a clearance between the top and bottom of modules and wall
of structure or components as given below. This is required for venti-
lation and allows easy replacement of modules.
Main base, Extension base 30 mm (1.18 inch) or over
(A1S5[ ]B(S1),A1S6[ ]B(S1))
Extension base (A5[ ]B, A6[ ]B) 80 mm (3.15 inch) or over
Main base 30mm (1.18 inch) or over Main base 30mm (1.18 inch) or over
30mm (1.18 inch) or over 30 mm (1.18 inch) or over
Extension base (A1S5[ ]B(S1),A1S6[ ]B(S1)) 30mm (1.18 inch) or Extension base (A5[ ]B,A6[ ]B) 80 mm (3.15 inch)
over or over
Conduit
Conduit (50mm (1.97 inch)
(50mm (1.97 inch) or less in height)
or less in height)
30mm (1.18 inch) or over
80 mm (3.15 inch)
or over
3 – 14
3. INSTALLATION
MELSEC-A
(3) Unit mounting orientation
(a) Since the PC generates heat, it should be mounted on a well

ventilated location in the orientation shown below.
(b) Do not mount it in either of the orientations shown below.
Flat
Vertical
(4) Mount base unit on a flat surface. If the mounting surface is not even,
this may strain the printed circuit boards and cause malfunctions.
(5) Avoid mounting base unit in proximity to vibration sources such as large
magnetic contractors and no-fuse circuit breakers; mount these on a
separate panel or at a distance.
(6) In order to avoid the effects of radiated noise and heat, provide the
clearances indicated below between the PC and devices that generate
noise or heat (contactors and relays).
Required clearance in front of: at least 100 mm (3.94 inches)
Required clearance on the right and left of <R>: at least 50 mm (1.97

inches)
At least 100 mm
(3.94 inches) At least 50mm(1.97 inches)
Contactor,
relay, etc.
3 – 15
3. INSTALLATION
MELSEC-A
(7) If you want to mount base units on a DIN rail, please note the following
points.
(a) Suitable DIN rail types are listed as follows:
TH35-7.5Fe
TH35-7.5Al
TH35-15Fe
*JIS: Japanese Industrial Standard
(b) Spacing intervals for DIN rail mounting screws
When using a TH35-7.5Fe or TH35-7.5Al DIN rail, rail mounting

screws should be placed at a pitch of 200 mm (7.87 inch) or less
in order to ensure that the rail has sufficient strength.
DIN rail DIN rail mounting screws
35 mm
(1.38 inches)
P P P
P=200 mm (7.87 inches) or less
3.6 Constructions to Reduce EMI Noise
The following measures are effective to reduce EMI noise generated

by equipment which contains the AnS products.
(1) Grouding of a control cabinet

Material of the control cabinet should be steel or equivarent conduc-
tor so that radiation of noise is protected. However, if grounding of
the cabinet is not good enough, the cabinet body to which noise is in-
ducted becomes an antenna to radiate noise. Therefore, impedance
of grouding cable of the cabinet should be as low as possible. Use of
a flat braided wire at shortest distance to the earth is recommended
to minimize high frequency impedance.
Door of the cabinet should be also connected to the body low impe-
dance wires.
(2) Grouding of AnS

Please be aware of the following points for grouding of AnS.
(a) Connect both LG and FG terminal on power supply modules to the

control cabinet at shortest distance. Approx. 20cm.
2
(b) Use thick wire for the earth connections. 2mm or thicker.
3 – 16
3. INSTALLATION
MELSEC-A
(3) Process signal cables
Please be aware of the following points for process signal cable in-
stallations.
(a) Do not install process signal cables with primary voltage lines.
(b) If process cables are installed outside of the cabinet, use of screen
cables is effective for EMI noise reduction.
3.7 Precautions When Unfailure Power System (UPS) is Connected
When Unfailure Power System (abbreviated as UPS hereafter) is connected

to the CPU system, care must be taken on the following matter:
Use a UPS of inverter power supply type at all time with 5% or less voltage
distortion. Do not use a UPS of commercial power supply type.
3 – 17
3. INSTALLATION
MELSEC-A
3.8 Part Identification of the CPU
This section gives the names of each part of the CPU.
(2) (6)
(1)
(8) (11) (11)

(3)
(9) (7)
(5)
(10)
(4)
A1SCPU(S1) A2SCPU(S1) A2ASCPU(S1/S30/S60)
(1) RUN/STOP key switch (6) Module fixing screws

RUN/STOP: (7) Battery
Used to start/stop sequence program execution. (8) Dip switch
L.CLR:
Memory write protect switch ...A1SCPU(S1),
Used to clear the data set in the latch range set in the
A1SCPUC24-R2
parameters.
ON
(OFF: Memory not protected,
(2) “RUN” LED (ON : Memory write protected)
ON: I/O control switch
Indicates that the RUN key switch is set to the RUN (OFF: Refresh mode, ON: Direct mode)
position and the sequence program is being executed. (9) Battery connector
OFF: (10) Memory cassette installing connector
The RUN LED is OFF in the following cases:
(11) Memory write protect Dip switch
• When the 100/200 VAC power supply is not being
supplied to the CPU. Memory Write
Setting Switch
A2SCPU-S1
• When the RUN/STOP key switch is set to the STOP Protect Range A2SCPU
A2ASCPU-
(kbytes) A2ASCPU
position. S1/S30/S60
• When a remote STOP/PAUSE is currently effective. 0 to 16 1: ON 1: ON
Flashing: 16 to 32 2: ON 2: ON
The RUN LED flashes in the following cases: 32 to 48 3: ON 3: ON
• When an error that stops sequence program opera- 48 to 64 4: ON 4: ON
tion has been detected in self-diagnosis. 64 to 80 Unused 5: ON
• When a latch clear operation is being executed. 80 to 96 Unused 6: ON
96 to 112 Unused 7: ON
(3) “ERROR” LED
112 to 144 Unused 8: ON
ON: 144 to 256 Unused 9: ON
Indicates that an error has been detected in self-dia-
gnosis. (Note that this LED remains OFF if the setting
for the detected error in the ERROR LED indication Latch clear method
priority settings is “OFF”.) 1) Turn the RUN/STOP key switch from the “STOP” posi-
OFF: tion to the “L.CLR” position several times to make the
Indicates that no error has occurred, or a fault has “RUN” LED start flashing.
been detected by the CHK instruction. 2) Turn the RUN/STOP switch from the “STOP” position
Flashing: to the “L.CLR” position once more.
Indicates that the annunciator (F) has been switched
3) The latch clear operation is completed when the “RUN”
ON by the sequence program.
LED goes OFF.
(4) RS-422 connector
(5) Cover
3 – 18
3. INSTALLATION
MELSEC-A
MELSEC A1SCPUC24-R2
STOP
RUN L.CLR RUN
RESET
ERROR RESET
(12)
MITSUBISHI
ON
(13)
1
2
3
BC D
4
A
E
8 9
F0 1
5
67
6
2
34 5
7
8
9
(14)
(15)
A1SCPUC24-R2
(12) Transmission specification setting switch (14) Computer link LED
Transmission specification settings LED No. Description

(factory setting: all OFF)
Normal run
Pisition of Setting Switch 0 RUN Normal: ON
SW Setting Items 0 Error: OFF
ON ON OFF
1 Transmitting
1 2 3 4 5 6 7 8 9
Write during RUN 1 SD

1 Enabled Disabled Flashes during data transmission
enabled/disabled setting
2 2 RD
Receiving
2 Flashes during data receive
Transmission speed 3
3 See *1 Communications with PC CPU
setting
4 3 CPU Flashes during communications with
4 PC CPU
5 Data bit setting 8 bit 7 bit 5 Neutral
Transmission sequence initial state
6 Parity bit setting Set Not set 4 NEU
6 (waiting for ENQ): ON
ENQ received: OFF
7 Even/odd parity setting Even Odd
7 ACK
8 Stop bit setting 2 bit 1 bit
5 ACK After sending ACK: ON
9 Sum check setting Set Not set 8 After sending NAK: OFF
NAK
9 6 NAK After sending NAK: ON
*1 Transmission speed setting After sending ACK: OFF
10
Baud rate Result of PC CPU communications
300 600 1200 2400 4800 9600 19200
(BPS) 7 C/N Error: ON
Normal: OFF
SW05 OFF ON OFF ON OFF ON OFF
Parity/Sum check error
SW06 OFF OFF ON ON OFF OFF ON 8 P/S Error: ON
Normal: OFF
SW07 OFF OFF OFF OFF ON ON ON
Protocol error
9 PRO Communications protocol error: ON
Normal: OFF
(13) Mode setting switch
SIO error
10 SIO
Mode settings (factory setting: 0) Normal: OFF
Mode Setting
Setting
Switch Number (15) RS-232C connector
BC D 0 Unusable
A
E
8 9
F0 1
1 Protocol 1
67
2
34 5 2 Protocol 2
3 Protocol 3
MODE 4 Protocol 4
5 No-protocol or printer function
6 to E Unusable
Used for testing the independent

F
module
3 – 19
3. INSTALLATION
MELSEC-A
MELSEC A1SHCPU
STOP
RUN LCLR RUN
ERROR RESET RESET (16)
MITSUBISHI
(10)
A1SHCPU/A2SHCPU(S1)
(16) Dip switch
A1SHCPU Switch No. Application

Memory write protect setting (RAM and E 2 PROM)
2 ON: With memory write protection *1
OFF: Without memory write protection
I/O select switch setting
1 ON: Direct method
OFF: Refresh method
A2SHCPU Switch No. Application

I/O switch setting
5 ON: Direct method
OFF: Refresh method
ON: With memory write protection *1
OFF: Without memory write protection
Memory write protection range
4 48 to 64k bytes
3 32 to 48k bytes
2 16 to 32k bytes
1 0 to 16k bytes
A2SHCPU-S1 Switch No. Application

10 ON: Direct method
1 2 3 4 5 6 7 8 9 10
OFF:Refresh method
Memory write protect setting (RAM and E 2 PROM)
ON: With memory write protection *1
OFF:Without memory write protection
Memory write protection range
9 144 to 192k bytes
8 112 to 144k bytes
7 96 to 112k bytes
6 80 to 96k bytes
5 64 to 80k bytes
4 48 to 64k bytes
3 32 to 48k bytes
2 16 to 32k bytes
ON OFF
1 0 to 16k bytes
*1 When installing the memory cassette, the setting becomes invalid to

RAM only.
3 – 20
3. INSTALLATION
MELSEC-A
3.9 RS232C Interface (A1SCPUC24-R2 only)
(1) RS-232C connector specificatins
Pin Signal Signal Direction
Signal Name
Number Abbreviation A1SCPUC24-R2 ↔ External Device
1 CD Receive carrier detection
2 RD(RXD) Receive data

1
6 Send data
2 7
3 SD(TXD)
3 8 4 DTR(ER) Data terminal ready
4 9 5 SG Signal ground
5 Data set ready
6 DSR(DR)
7 RS(RTS) Request to send
8 CS(CTS) Clear to send
A 9-pin D subconnector is supplied in the same package as the A1SCPUC24-

R2 body.
Product name
9-pin Dsub (male), screw mounted
17JE-23090-02-D8A, made by DDK
(2) RS-232C cable
For the RS-232C cable, use a cable that conforms to the RS-232C
standard and is no longer than 15 m.
(Recommended cable)
7/0. 127[ ]P HRV-SV............(RS-232C cable made by Oki Densen)
Specify the number of wire pairs.
For example, if the number of pairs is thirteen:
7/0. 127 13P HRV-SV
(3) Connecting the RS-232C connectors
The standard method for connecting the RS-232C connectors is shown
below.
For details on the connection method, refer to the Computer Link Module
User’s Manual (Com. link func./Print func.).
(a) Example connection to an external device in which the CD signal

(pin No.8) can be switched ON and OFF.
A1SCPUC24-R2 Cable External Device

Connections and
Signal Names Pin Number Signal Directions Signal Names
CD 1 CD
RD(RXD) 2 RD(RXD)
SD(TXD) 3 SD(TXD)
DTR(ER) 4 DTR(ER)
SG 5 SG
DSR(DR) 6 DSR(DR)
RS(RTS) 7 RS(RTS)
CS(CTS) 8 CS(CTS)
3 – 21
3. INSTALLATION
MELSEC-A
(b) Example connection to an external device in which the CD signal
(pin No.8) cannot be switched ON and OFF.
In the case of a connection to a device in which the device’s CD
signal cannot be switched ON and OFF, set non-execution of the
buffer memory address 10BH RS232C CD terminal check.
1) Example connection to an external device in which DC code
control or DTR/DSR code control is executed.

Connections and
CD 1 CD
RD(RXD) 2 RD(RXD)
SD(TXD) 3 SD(TXD)
DTR(ER) 4 DTR(ER)
SG 5 SG
DSR(DR) 6 DSR(DR)
RS(RTS) 7 RS(RTS)
CS(CTS) 8 CS(CTS)
2) Example connection to an external device in which DC code

control is executed.

Connections and
CD 1 CD
RD(RXD) 2 RD(RXD)
SD(TXD) 3 SD(TXD)
DTR(ER) 4 DTR(ER)
SG 5 SG
DSR(DR) 6 DSR(DR)
RS(RTS) 7 RS(RTS)
CS(CTS) 8 CS(CTS)
3 – 22
3. INSTALLATION
MELSEC-A
3.10 Self-Loopback Test (A1SCPUC24-R2 only)
The self-loopback test checks whether or not the isolated A1SCPUC24-R2
(not connected to any external devices) will operate correctly.
For details on the self-loopback test, refer to the Computer Link Module
User’s Manual (Com. link func./Printer func.).
Connect the cables

• Connect cables to the RS-232C connectors.
Pin Signal
Signal Name Cable Connections
Number Abbreviation
1 CD Receive carrier detection
2 RD(RXD) Receive data

1
6
2 7 3 SD(TXD) Send data
3 8
4
5
9 4 DTR(ER) Data terminal ready
5 SG Signal ground
6 DSR(DR) Data set ready
7 RS(RTS) Request to send
8 CS(CTS) Clear to send
Set the mode setting switch
• Set the mode setting switch to “F”.
Execute the self-loopback test
• Turn the PC CPU power supply ON or reset the PC CPU.
Check the LED display status
Check Item Display When Normal Display in Error Status

PC CPU communications C/N OFF C/N
ON
check CPU Flicker (LED No.7)
SIO OFF
RS-232C communications SIO
SD ON
check Flicker (LED No.10)
RD
Completed
• Turn the power supply OFF.
3 – 23
4. WIRING
MELSEC-A
4. WIRING
P DANGER
All external power supply must be turned off during installation and wiring.
Unless all phases are cut off from the products, it could cause electrical
shock or damage on the products.
Before connecting the power to the products, put terminal covers back
onto the terminals.
Otherwise, it could cause electrical shock.
A protective earth terminal which is marked with “ (LG)” must be connec-

ted to the earth.
Otherwise, it could cause electrical shock.
All electrical connections should be carried out by trained and competent

personnel, and must comply with the requirements of all relevant local and
national wiring regulations for installation wiring.
Particular attention is required when preparing the installation wiring for

connection to terminal to ensure that hazardous live wiring are adequately
separated from the Safety Extra Low Voltage wiring.
All external power supplies and signals connected to other devices or

equipment, of which rated voltage is 24 V or lower, should not compromise
the Safety Extra Low Voltage requirements.
A readily accessible switch or circuit breaker should be included in the

equipment which contains the product so that the power supply for the pro-
duct can be disconnected if necessary.
E CAUTION
Rated voltage and terminal assignment of each module should be confir-

med before wiring is carried out. Connection of different voltage or wrong
connection could cause fire and/or malfunction of the products.
Do not supply 24 VDC power

supply from more than one power 24 VDC
supply modules in parallel to one
I/O module. If they are connected
so, the power supply modules will 24 VDC
become not and could be caused External power supply
fire and/or malfunction.
Terminal screws should be tighten by the specified torque. Loose connecti-

on could cause short-circuit, fire and/or malfunction of the products.
During wiring, be sure that no off-cut of wires or other conductive dusts go

into modules. It could cause fire, malfunction and/or failure of the products.
Wiring for modules which provide connector for external wiring should be
securely carried out with the specified tools or by soldering. Unsecured
connection could cause short-circuit, fire, and/or malfunction of the prod-
ucts.
4–1
4. WIRING
MELSEC-A
Do not place process control signal cables and/or communication cables
nearby main power cables or actuation power cables so that risk of noise
trouble can be minimized. It is recommended to keep a distance of 100
mm or more between those cables.
4.2 Power Supply Modules
(1) Terminal assignment
(a) A1S61P
Terminal
A1S61P Wiring Instructions
Name
Connect 100 to 120/200 to 240 VAC

INPUT power supply wires to these terminals.
AC100/200V Either terminal can be connected to
either live or neutral line.
These are voltage selection terminals.

SHORT 100VAC Short the terminals for 100 to 120
FG
OPEN 200VAC VAC input, and open them for 200 to
SHORT 100VAC
240 VAC input.
OPEN 200VAC
LG This is a functional earth terminal to
INPUT be connected to the noise free earth.
100/200VAC LG WARNING: If this terminal is not
connected to the earth, the terminal
holds half of the supplied voltage.
This is a functional earth terminal to

FG
be connected to the noise free earth.
(b) A1S61PEU
Terminal
A1S61PEU Wiring Instructions
Name
Connect 200 to 240 VAC power supply

INPUT 200 wires to these terminals.
to 240 VAC Either terminal can be connected to
This is a protective earth terminal to

be connected to the earth.
(FG)
(LG) WARNING: This terminal must be
connected to the earth, otherwise,
(LG)
the secondary circuit cannot be
ensured as safe.
INPUT
200 to 240VAC (FG) This is a functional earth terminal to
4–2
4. WIRING
MELSEC-A
(c) A1S61PN
Terminal
A1S61PN
Wiring Instructions
Name

NC
This is a protective earth terminal to
NC be connected to the earth.
(FG)
(LG)
ensured as safe.
INPUT
100 to 240VAC (FG) This is a functional earth terminal to
NC No Connectable
(d) A1S62P
A1S62P Terminal
Wiring Instructions
Name
Connect 100 to 120/200 to 240 VAC

INPUT power supply wires to these terminals.
100/200VAC Either terminal can be connected to
+24V
24G These are voltage selection terminals.
FG SHORT 100VAC Short the terminals for 100 to 120
SHORT 100VAC
OPEN 200VAC VAC input, and open them for 200 to
OPEN 200VAC 240 VAC input.
LG
INPUT This is a functional earth terminal to
100/200VAC be connected to the noise free earth.
LG WARNING: If this terminal is not
connected to the earth, the terminal
holds half of the supplied voltage.
This is a functional earth terminal to

FG
These are output terminals of 24 VDC

+24V
service power which can be used as
24G
I/O load power and/or other purposes.
4–3
4. WIRING
MELSEC-A
(e) A1S62PEU
Terminal
Wiring Instructions
A1S62PEU Name

+24V This is a protective earth terminal to
24G be connected to the earth.
(FG)
(LG)
ensured as safe.
INPUT
200 to 240 VAC (FG) This is a functional earth terminal to

+24V
24G
(f) A1S62PN
A1S62PN Terminal
Wiring Instructions
Name

+24V
24G This is a protective earth terminal to
be connected to the earth.
(FG)
(LG)
INPUT ensured as safe.
100 to 240VAC
(FG) This is a functional earth terminal to

+24V
24G
(g) A1S63P
Terminal
Wiring Instructions
A1S63P Name
Connect 24 VDC power supply wires

INPUT
to these terminals.
+24V
A 24 VDC SELV power supply is
24G
required.
NC This is a functional earth terminal to
LG
NC be connected to the noise free earth.
FG
NC This is a functional earth terminal to
FG
SELV power supply NC be connected to the noise free earth.
LG
+24V NC No Connectable
INPUT
24G
Functional earth
4–4
4. WIRING
MELSEC-A
(2) Take following measures so that electrical noise is minimized.
(a) Provide separate wiring for the PC power, I/O devices, and other
operating devices as shown below. Further more, insert an isolated
transformer if intensive noise is expected.
Main power PC power Isolation transformer

supply supply
200 to 240 VAC PC
I/O power
supply
Control devices
Main power
supply
Main power devices
(b) Power supply wires should be twisted as tightly as possible, and

connect to power supply modules at the shortest distance. To
minimize voltage drop, use wires as thick as possible.
(c) As a measure against lightning surges, insert surge absorbers as

shown below.
PC I/O
AC power source
devices
E2
E1
E1 Lightning surge absorber
POINTS
(1) Provide separator grounding for the lightning surge absorber (E1) and
for the PC (E2).
(2) Select a lightning surge absorber of which maximum allowable line

voltage is higher than input voltage of the power supply module.
4.3 Digital I/O Modules
The following instructions should be observed for I/O module wiring.
(1) I/O signal wires must be installed at least 100 mm (3.94 inch) away from
high-voltage and large-current main power wires so that noise induction
from such high power circuit is minimized.
(2) If the I/O signal wires cannot be separately installed from the high power
wires, use shielded cables for I/O signal and connect their shield to the
earth.
4–5
4. WIRING
MELSEC-A
4.3.1 Input module connections
Rated Input Model Rated Input Voltage

Model (2)
Voltage
A1SX30 12/24 VAC/DC
A1SX10
(1) 100 to 120 VAC
A1SX10EU
X00
A1SX20 X01 1
200 to 240 VAC 2 X02
X03 3
A1SX20EU 4 X04
X05 5
6 X06
X00 X07 8 7
X01 1 COM
2 X02 X08 9
X03 3 10 X09
4 X04 X0A 12 11
X05 5 X0B
6 X06 X0C 13
X07 7 14 X0D
8 COM X0E 16 15
X08 9 X0F
10 X09 COM 17
X0A 11 18
12 X0B 19
X0C 13 + - 20
14 X0D
X0E 15 - +
16 X0F 9 and 18 are connected internally.
COM 17
18
19
20
9 and 18 are connected internally.
P DANGER
Do not touch terminals while the power is
supplied.
Model Rated Input Voltage Model Rated Input Voltage
A1SX40 12/24 VDC A1SX80 12/24 VDC

(3) (4)
A1SX40-S1 A1SX80-S1
24 VDC 24 VDC
A1SX40-S2 A1SX80-S2
X00 X00
X01 1 X01 1
2 X02 2 X02
X03 3 X03 3
4 X04 4 X04
X05 5 X05 5
6 X06 6 X06
X07 7 X07 8 7
8 COM COM
X08 9 X08 9
10 X09 10 X09
X0A 11 X0A 12 11
12 X0B X0B
X0C 13 X0C 14 13
14 X0D X0D
X0E 15 X0E 16 15
16 X0F X0F
- + 17 + - COM 17
COM 18
18 19
19 - + 20
20
9 and 18 are connected internally. 9 and 18 are connected internally.
4–6
4. WIRING
MELSEC-A
Model Rated Input Voltage Model Rated Input Voltage

(6)
A1SX41 12/24 VDC A1SX71 5/24 VDC
(5)
A1SX41-S2 24 VDC
A1SX42 12/24 VDC X00 X10

B20 A20
X01 X11
A1SX42-S2 24 VDC B19 A19
X02 X12
B18 A18
X03 X13
B17 A17
X00 X10
B20 A20
X04 X14
B16 A16
X01 X11
B19 A19
X05 X15
B15 A15
X02 X12
B18 A18
X06 X16
B14 A14
X03 X13
B17 A17
X07 X17
B13 A13
X04 X14
B16 A16
X08 X18
B12 A12
X05 X15
B15 A15
X09 X19
B11 A11
X06 X16
B14 A14
X0A X1A
B10 A10
X07 X17
B13 A13
X0B X1B
B9 A9
X08 X18
B12 A12
X0C X1C
B8 A8
X09 X19
B11 A11
X0D X1D
B7 A7
X0A X1A
B10 A10
X0E X1E
B6 A6
X0B X1B
B9 A9
X0F X1F
B5 A5
X0C X1C
B8 A8
Vacant B4 A4 Vacant
X0D X1D
B7 A7
Vacant B3 A3 Vacant
X0E X1E
B6 A6 - + COM
B2 A2 Vacant
X0F X1F
B5 A5 COM Vacant
B1 A1
Vacant B4 A4 Vacant
Vacant B3 A3 Vacant
- + COM Vacant
B2 A2
COM Vacant
*1 The figure above shows the connections
B1 A1
for the open collector (sink) type.
B1 and B2 are connected internally.
• TTL, LS-TTL, CMOS buffer (sink)

*1 The figure above indicates F (the first half connection
32 points). B20
The connections for L (the latter half 32

points) are the same as for F (regard X00 + -
to X1F as X20 to X3F.)

B2
B1 and B2 are connected internally.
• Sensor (source) connection
*2 The A and B pin number rows shown
above are transposed with respect to the
diagram of the A and B rows which is B20
printed on the module. Remember that the

A row pin numbers correspond to the B
+ -
row of the module. B2

diagram of the A and B rows which is
row of the module.
4–7
4. WIRING
MELSEC-A
Model Rated Input Voltage

(7) A1SX81 12/24 VDC
A1SX81-S2 24 VDC
X00
X01 1
20
X02
X03 2
21
X04
X05 3
22
X06
X07 4
23
X08
X09 5
24
X0A
X0B 6
25
X0C
X0D 7
26
X0E
X0F 8
27
X10
X11 9
28
X12
X13 10
29
X14
X15 11
30
X16
X17 12
31
X18
X19 13
32
X1A
X1B 14
33
X1C
15
X1D 34
X1E
16
X1F 35
COM - +
17
COM 36
COM + -
18
Vacant 37
19 Vacant
• 17 , 18 and 36 are connected internally.
4–8
4. WIRING
MELSEC-A
Model Rated Input Voltage Pin Arrangement

(8)
A1S42X 12/24 VDC
B12 A12
B11 A11
Pin No. B10 A10
Input terminals
B9 A9
X38 X30 X28 X20 X18 X10 X08 X00 R Internal
control
B8 A8
B12 XD0 R
circuit B7 A7
X39 X31 X29 X21 X19 X11 X09 X01
A12 XD1 B6 A6
X3A X32 X2A X22 X1A X12 X0A X02
B11 XD2 B5 A5
X3B X33 X2B X23 X1B X13 X0B X03 B4 A4
A11 XD3
X3C X34 X2C X24 X1C X14 X0C X04 B3 A3
B10 XD4
B2 A2
X3D X35 X2D X25 X1D X15 X0D X05
A10 XD5 B1 A1
X3E X36 X2E X26 X1E X16 X0E X06
B9 XD6
X3F X37 X2F X27 X1F X17 X0F X07
A9 XD7
Seen from front
face of the module
B8 XSCN0 Internal
R control Pin Signal Pin Signal
circuit No. Name No. Name
A8 XSCN1
B7 XSCN2 B12 XD0 A12 XD1
A7 XSCN3 Internal B11 XD2 A11 XD3

scan at
B6 XSCN4 1/8th duty B10 XD4 A10 XD5
A6 XSCN5 B9 XD6 A9 XD7
B5 XSCN6 B8 XSCN0 A8 XSCN1
A5 XSCN7 B7 SXCN2 A7 XSCN3
B6 XSCN4 A6 XSCN5
B3, A3
B5 XSCN6 A5 XSCN7
12/24 VDC
B2, A2 B4 Vacant A4 Vacant
12/24 12/24
B3 A3
VDC VDC
B2 0V A2 0V
*1 If there will be cases where two or more switches
B1 FG A1 FG
are pressed simultaneously, install a diode at each
switch (see right).
4–9
4. WIRING
MELSEC-A
4.3.2 Output module connections
Model Rated Load Voltage Model Rated Load Voltage

(1) (2)
A1SY10 240 VAC, 24 VDC A1SY10EU 120 VAC, 24 VDC
Y00 Y00
Y01 1 L
L 2 Y01 1 L
Y02 L 2
Y03 3 L Y02
L 4 Y03 3 L
Y04 4
Y05 5 L L Y04
L 6 Y06 Y05 5 L
Y07 7 L L 6 Y06
L 8 COM1 7 L
Y07
Y08 9 L 8 COM1
L 10 Y09 9
11 L Y08
Y0A L 10 Y09
L 12 Y0B 11 L
Y0C 13 L Y0A
L L 12 Y0B
14 Y0D 13 L
Y0E 15 L Y0C
L 16 Y0F L 14 Y0D
COM2 17 L 15 L
18 L Y0E 16
+ - Y0F
19 COM2 17 L
20 24 VDC 18 + -
(For relay drive) 19
20
24 VDC
(For relay drive)
P DANGER
supplied.
P DANGER
supplied.
(3)
A1SY14EU 240 VAC, 24 VDC (4) A1SY18A
240 VAC,24 VDC
A1SY18AEU
Y00
Y01 1 L
L 2 Y02 Y00
Y03 3 L Y00 1 L
L 4 COM1 2 Y01
Y04 5 Y01 3 L
L 6 4 Y02
Y05 5 L
Y06 7 L Y02
L 8 6 Y03
Y07 Y03 7 L
COM2 9 L
10 8 Y04
Y08 Y04 9 L
Y09 11 L 10
L 12 Y05
Y0A L Y05 11 L
Y0B 13 12
L 14 COM3 Y06
Y06 13 L
15 14 Y07
16 Y07 15 L
17 16
18 + - 17
19 18 + -
20 24 VDC 19
20 24 VDC
(For relay drive)
(For relay drive)
P DANGER P DANGER
Do not touch terminals while the power is Do not touch terminals while the power is
supplied. supplied.
4 – 10
4. WIRING
MELSEC-A

(5) (6)
A1SY22 100/200 VAC A1SY28A 100/200 VAC
Y00
Y01 1 L
L 2 Y00
3 Y02 Y00 1 L
Y03 L 2
L 4 Y01
Y04 Y01 3 L
Y05 5 L
L 6 4 Y02
Y06 Y02 5 L
Y07 7 L
L 8 6 Y03
COM1 7 L
100/200 VAC 9 Y03
10 8 Y04
Y09 9 L
Y08 11 L Y04
L 12 10 Y05
Y0B 11 L
Y0A 13 L Y05
L 14 12 Y06
Y0D 13 L
Y0C 15 L Y06
L 16 14 Y07
Y0F 15 L
Y0E 17 L Y07
L 18 16
COM2 17
100/200 VAC 19
20 18
19
20
P DANGER
P DANGER
supplied. Do not touch terminals while the power is
supplied.
(7) (8)
A1SY28EU 100-240 VAC A1SY40 12/24 VDC
Y00 Y00
1 L Y01 1 L
2 L 2 Y02
Y01 3 L
3 L Y03
4 L 4 Y04
Y02 5 L
5 L Y05
6 L 6 Y06
Y03 Y07 7 L
7 L
8 L 8 12/24 VDC
Y04 9
9 L COM
10 10 Y09
Y05 Y08 11 L
11 L L 12
12 Y0B
Y06 L Y0A 13 L
13 L 14
14 Y0D
Y07 Y0C 15 L
15 L 16
16 L Y0F
17 Y0E 17 L
L 18 12/24 VDC
18 19
19 COM
20
20
P DANGER
supplied.
4 – 11
4. WIRING
MELSEC-A

(10)
(9) A1SY50 12/24 VDC A1SY60E 5/12/24 VDC
A1SY60 24 VDC
For a load
Y00
Y01 1 L voltage of
L 2
3 Y02
L
12/24 VDC.
Y03
Y00 L 4 Y04
Y01 1 L Y05 5 L
L 2 Y02 L 6 Y06
3 L Y07 7 L
Y03 L 8 + -
L 4 Y04 COM1
5 0V 9
Y05 L 10 12/24 VDC
L 6 Y08
Y06 Y09 11 L
Y07 7 L L 12 Y0A For a load
L 8 12/24 VDC Y0B 13 L
COM 9 L 14 Y0C voltage of
10 Y0D 15 L
Y09 L 16 5 VDC.
Y08 11 L Y0E
L 12 Y0F 17 L
Y0B L 18 COM1 + -
Y0A 13 L + - 19
L 14 0V
Y0D 20
Y0C 15 L 12/24 VDC
L 16 Y0F 5 VDC
Y0E 17 L
L 18 12/24 VDC
COM 19 * When using a working load voltage of 5 VDC,
20 a separate 12/24 VDC source is required for the
external power supply.

(11) (12)
A1SY68A 5/12/24/48 VDC A1SY80 12/24 VDC
Y00
Y01 1 L
L 2 Y02
Y00
+ - 1 L Y03 3 L
Y00
2 For sink L 4
Y01 Y04
+ - Y01 3 L Y05 5 L
4 Y02 L 6 Y06
+ - Y02 5 L 7 L
Y07
6 Y03 L 8 COM1 + -
+ - Y03 7 L 9
8 + - 0V
Y04 10 Y08
Y04 9 11 L
L 10 Y05 + - Y09
11 L 12 Y0A
Y05 13 L
L 12 Y06 + - Y0B
13 L 14 Y0C
Y06 15 L
L 14 Y07 + - Y0D
Y07 15 L 16 Y0E
L 16 Y0F 17 L
17 Vacant L 18 COM1 + -
Vacant 18 For source 19
19 Vacant 0V
20
Vacant 20
4 – 12
4. WIRING
MELSEC-A

(13) (14)
A1SY41 12/24 VDC A1SY42 12/24 VDC
Y00 Y10 Y00 Y10

L B20 A20 L L B20 A20 L
Y01 Y11 Y01 Y11
L B19 A19 L L B19 A19 L
Y02 Y12 Y02 Y12
L B18 A18 L B18 A18
L L
Y03 Y13 Y03 Y13
L B17 A17 L B17 A17
L L
Y04 Y14
L B16 A16 L Y04 Y14
L B16 A16 L
Y05 Y15
L B15 A15 L Y05 Y15
L B15 A15 L
Y06 B14 A14 Y16
L L Y06 Y16
L B14 A14 L
Y07 Y17
L B13 A13 L Y07 Y17
L B13 A13 L
Y08 Y18
L B12 A12 L Y08 Y18
L B12 A12 L
Y09 Y19
L B11 A11 L Y09 Y19
L B11 A11 L
Y0A Y1A
L B10 A10 L
Y0A Y1A
L B10 A10 L
Y0B Y1B
L B9 A9 L
Y0B Y1B
L B9 A9 L
Y0C Y1C
L B8 A8 L
Y0C Y1C
L B8 A8 L
Y0D Y1D
L B7 A7 L
Y0D Y1D
Y0E Y1E L B7 A7 L
L B6 A6 L
Y0E Y1E
Y0F Y1F L B6 A6 L
L B5 A5 L
Y0F Y1F
L B5 A5 L
Vacant B4 A4 Vacant
Vacant B4 A4 Vacant
Vacant B3 A3 Vacant
12/24 VDC
12/24 VDC COM - + Vacant B3 A3 Vacant
B2 A2 12/24 VDC
12/24 VDC COM - +
12/24 VDC COM B2 A2
B1 A1
12/24 VDC COM
B1 A1
*1 B1 and B2 , and A1 and A2 are

connected internally. *1 The figure above indicates F (the first half
32 points).
*2 The A and B pin number rows shown The connections for L (the latter half 32
above are transposed with respect to the points) are the same as for F (regard Y00
diagram of the A and B rows which is to Y1F as Y20 to Y3F.)
printed on the module. Remember that the B1 and B2 , and A1 and A2 , are
A row pin numbers correspond to the B row connected internally.
of the module.
row of the module.
4 – 13
4. WIRING
MELSEC-A

(15)
(16)
A1SY71 5/12 VDC A1SY81
12/24 VDC
A1SY81EP
Y00
Y00 Y10 1 L
L B20 A20 L Y01
L 20
Y02
Y01 Y11 2 L
B19 A19 Y03
L L L 21
Y04
Y02 Y12 3 L
Y05
L B18 A18 L L 22
Y06
Y03 Y13 Y07 4 L
L B17 A17 L L 23
Y08
Y04 Y14 5 L
L B16 A16 L Y09
L 24
Y0A
Y05 Y15 6 L
L B15 A15 L Y0B
L 25
Y0C
Y06 Y16 7 L
Y0D
L B14 A14 L L 26
Y0E
Y07 Y17 8 L
Y0F
L B13 A13 L L 27
Y10
Y08 Y18 Y11 9 L
L B12 B12 L L 28
Y12
Y09 Y19 Y13 10 L
L B11 A11 L L 29
Y14
Y15 11 L
Y0A Y1A
L B10 A10 L L 30
Y16
Y17 12 L
Y0B Y1B L
L B9 A9 L 31
Y18
Y0C Y1C Y19 13 L
L B8 A8 L L 32
Y1A
Y0D Y1D Y1B 14 L
L B7 A7 L L 33
Y1C
Y0E Y1E Y1D 15 L
L B6 A6 L L 34
Y1E
Y0F Y1F Y1F 16 L
L B5 A5 L L 35
COM
COM 17
Vacant B4 A4 Vacant 36
COM
0V 18
Vacant B3 A3 Vacant 37
0V
- + 19
5/12 VDC COM
B2 A2
5/12 VDC COM

B1 A1
• 17 and 18 and 36 , and 19 and 37 are

connected internally.
*1 B1 and B2 , and A1 and A2 , are


A row pin numbers correspond to the B row
of the module.
4 – 14
4. WIRING
MELSEC-A
Model Rated Load Voltage Pin Arrangement

(17)
A1S42Y 12/24 VDC
B12 A12
Pin No. Output terminals B11 A11
A1S42Y *3 B10 A10
Resistors to limit B9 A9
LED current B8 A8
B7 A7
B6 A6
R B5 A5
B4 A4
B3 A3
B2 A2
B1 A1
Seen from front

face of the module
Pin Signal Pin Signal
No. Name (FH) No. Name (FH)
B12 YD0 A12 YD1
R
B11 YD2 A11 YD3
R
B10 YD4 A10 YD5
B9 YD6 A9 YD7
B8 YSCN0 A8 YSCN1
B7 YSCN2 A7 YSCN3
Internal B6 YSCN4 A6 YSCN5
scanning at B5 YSCN6 A5 YSCN7
1/8th duty B4 Vacant A4 Vacant
B3 12/24 VDC A3 12/24 VDC
B2 0V A2 0V
B1 Vacant A1 Vacant
12/24 VDC
*1 The fuse in the output module is provided to prevent the

external wiring from burning in the event of a short circuit in the
module’s output. Consequently, it may not be able to protect
output devices.
If an output device is damaged in a failure mode other than a *3 Mount the resistors to limit LED current
short circuit, the fuse might not be blown. externally to the A1S42Y.
*2 The “ERR.” LED will also come ON when the external power *4 The power supply voltage (12/24 VDC) is applied in the LED’s
supply is cut. reverse direction.
If the peak inverse voltage is insufficient, connect protective
diodes in series with each of the LEDs.
4 – 15
4. WIRING
MELSEC-A
4.3.3 Input/output composite module connections
Model Rated Input Voltage Rated Load Voltage

(1)
A1SH42 12/24 VDC 12/24 VDC
X00 X10 Y00 Y10

B20 A20 L B20 A20 L
X01 X11 Y01 Y11

B19 A19 L B19 A19 L
X02 X12 Y02 Y12

B18 A18 L B18 A18 L
X03 X13 Y03 Y13

B17 A17 L B17 A17 L
X04 X14 Y04 Y14

B16 A16 L B16 A16 L
X05 X15 Y05 Y15

B15 A15 L B15 A15 L
X06 X16 Y06 Y16

B14 A14 L B14 A14 L
X07 X17 Y07 Y17

B13 A13 L B13 A13 L
X08 X18 Y08 Y18

B12 A12 L B12 A12 L
X09 X19 Y09 Y19

B11 A11 L B11 A11 L
X0A X1A Y0A Y1A

B10 A10 L B10 A10 L
X0B X1B Y0B Y1B

B9 A9 L B9 A9 L
X0C X1C Y0C Y1C

B8 A8 L B8 A8 L
X0D X1D Y0D Y1D
B7 A7 L B7 A7 L
X0E X1E Y0E Y1E
B6 A6 L B6 A6 L
X0F X1F Y0F Y1F
B5 A5 L B5 A5 L
Vacant B4 A4 Vacant Vacant B4 A4 Vacant
Vacant B3 A3 Vacant Vacant B3 A3 Vacant

12/24 VDC
- + COM Vacant 12/24 VDC COM - +
B2 A2 B2 A2
COM Vacant 12/24 VDC COM
B1 A1 B1 A1
F (Input side) L (Output side)

*1 B1 and B2 are connected internally. *3 B1 and B2 , and A1 and A2 , are
*2 The A and B pin number rows shown above are transposed with respect to the diagram of
the A and B rows which is printed on the module. Remember that the A row pin numbers
correspond to the B row of the module.
4 – 16
4. WIRING
MELSEC-A

(2)
A1SX48Y18 24 VDC 24 VDC/240 VAC
P DANGER
Do not touch terminal while the power is supplied.

(3)
A1SX48Y58 24 VDC 12/24 VDC
4 – 17
5. FAIL-SAFE CONSTRUCTIONS
MELSEC-A
P DANGER
Safety circuitry must be so designed and constructed externally that an en-
tire system stays in safe in case of a external power supply failure and/or
PC failure. In particular, the following safety circuitry are required to con-
structed outside of the PC.
(1) Emergency stop circuit, protection circuit, interlocking circuit for contra-
ry operations such as forward and reverse movement, and hardware
stroke limit circuit for positioning controls must be constructed external-
ly.
(2) In case of hardware failure which PC CPU cannot detect occurs, all or
some output signals could be turned on without program instructions.
An external safety circuitry must be so constructed that safety of equip-
ment or machine can be protected from such case.
Please refer to Sub-clause 5.2 for details.
(3) In some cases, relays or transistors used in output modules stay always
ON or OFF as failure symptoms. If such failure could cause serious
damage on persons or properties, those safety critical output signals
must be externally monitored.
If the power to the PC is turned ON after turning ON the external power
supply used for the process control with the DC output module, the DC out-
put module may make an erroneous output for an instant. Take the follo-
wing procedures for power up of the equipment, in order to prevent such
erroneous input and output to/from the PC.
(1) Turn ON the power to the PC.
(2) Turn ON the external power supply used for the process control.
(3) Turn ON the START switch.

(4) Turn ON the power to the output devices by using a program.
(5) Confirm that all external power supplies are turned ON, and then, an I/O
control program should be executed.
5.2 Fail-Safe Circuitry Against to Failure of the PC

Though Mitsubishi PCs are manufactured under strict quality control, they
may cause failure or abnormal operations due to unspecific reasons. To
prevent the abnormal operation of the whole system, machine breakdown,
and accidents, fail-safe circuitry against to failure of the PC must be con-
structed outside the PC.
The following page gives an example of system designing that conforms to
the explanation mentioned above and an example of fail-safe measures
when the PC causes a failure.
5–1
MELSEC-A
(1) System design circuit example
ALL AC Mixed AC and DC
POWER POWER
TRANSFORMER
TRANSFORMER TRANSFORMER
FUSE FUSE
FUSE FUSE FUSE FUSE
CPU
M9006 CPU
Ym M9006
Ym DC
M9039 POWER
Yn *5 M9039 SUPPLY
Yn
(-) (+) *6
Y1 XM
XM TM
M9084 TM MC1
PROGRAM M9084
TM FUSE FUSE
No
START SW
RA1 *1 No M10 M10
PROGRAM *1
MC
START *1: RUN/STOP circuit interlok-
MC STOP SW RA1 ked with RA1 (run monitor
INPUT MODULE MC
RA2 XM MC STOP SW
relay)
*2: Low battery alarm
INPUT MODULE
(Lamp or buzzer)
OUTPUT MODULE RA2 XM *3: RA1 switched ON by
Ym *2 M9039 (run monitor relay)
L
*4: Power to output equipment
*3 OUTPUT MODULE switched OFF when the
Yn *2
RA1 Ym STOP signal is given.
L
*7 In the case of an emergen-
MC Yn cy stop or a stop caused
RA1
MC OUTPUT MODULE by a limit switch.
*4 *5: Input switched when power
supply established.
*4 OUTPUT MODULE MC MC
*6: Set time for DC power
supply to be established.
*4
MC2 RA2 *7: ON when run by M9039
MC1
*8: Interlock circuits as neces-
MC1 MC2 sary.
MC2
MC1
*8 Provide external interlock
Y1 MC1 circuits for conflicting ope-
RA2 MC2 rations, such as forward ro-
tation and reverse
rotation, and for parts that
*8
Voltage relay is
could damage the machi-
recommended ne or cause accidents if no
interlock were used.
The power-ON procedure is as follows: For AC/DC
For AC 1) Switch CPU to RUN.
1) Switch CPU to RUN. 2) Set the ON the power.
2) Set the ON the power. 3) Turn ON the start switch.
3) Turn ON the start switch. 4) When DC power is established, RA2 goes ON.
4) When the magnetic contactor (MC) comes in, the 5) Timer (TM) times out after the DC power reaches
output equipment is powered and may be driven by 100%.
the program. (The TM set value should be the period of time
from when RA2 goes ON to the establishment of
100% DC voltage. Set this value to approximately
0.5 seconds.)
6) When the magnetic contactor (MC) comes in, the
output equipment is powered and may be driven
by the program.
(If a voltage relay is used at RA2, no timer (TM) is
required in the program.)
5–2
MELSEC-A
Failure of a CPU or memory can be detected by the self diagnosis
function. However, Failure of I/O control area may not be detected by
the CPU. In such cases, all I/O points turn ON or OFF depending on a
condition of problem, and normal operating conditions and operating
safety cannot sometimes be maintained. Examples of fail-safe circuitry
are described as follows:
(a) Using on-delay and off-delay timers
ON delay timer
Internal program
Y00 T1
1 sec
OFF delay timer

M9032
Y00 T2
1 sec
External load MC
Y01 L
Y00 Y0F L
24 V
0.5 0.5
sec sec
0V
24 VDC
CPU module Output module *1

T2
T1
MC
*1: Y00 repeats turning ON and then OFF at 0.5 second intervals.
Use a no-contact output module (transistor in the example
shown above).
5–3
MEMO
6. MAINTENANCE
MELSEC-A
6. MAINTENANCE
6.1 General Safety Requirement
P DANGER
Maintenance activities for the product should be carried out by trained and
competent personnel.
Do not touch terminals while the power is supplied.
Cleaning or screw tightening must be carried out while the power is off.
E CAUTION
Do not change program, move switch of RUN, STOP of PAUSE, nor proceed
to force output during CPU RUN without confirmation of safety.
Do not disassemble nor modify the products.
Do not mount a module while the power is supplied.
Connect the battery properly. Do not recharge, disassemble, heat, burn,

short, nor solder the battery.
Only use A6BAT for battery replacement.
6–1
6. MAINTENANCE
MELSEC-A
6.2 Daily Inspection
It is recommended to inspect items listed in the following table to keep the

equipment running without trouble.
Corrective
No. Check Item Check Point Judgment
Action
1 Base unit Check for loose The base unit should be Retighten
mounting mounting securely mounted. screws.
conditions screws and
cover.
2 Mounting Check if the The hook should be Securely
conditions of I/O module is securely engaged and engage the
module, etc. disengaged or the module should be hook.
the hook is positively mounted.
securely
engaged.
3 Connecting Check for loose Screws should not be Retigten
condition terminal screws. loose. terminal screws.
Check distance Proper clearance should Correct.
between be provided between
solderless solderless terminals.
terminals.
Check Connections should not Retighten
connectors of be loose. connector
extension mounting
cable. screws.
4 “POWER” Check that the ON (OFF indicates an Refer to User’s
LED LED is ON. error.) Manual
“RUN” LED Check that the ON (OFF or flash Refer to User’s
LED is ON indicates an error.) Manual
CPU module indicator lamps
during RUN.
“ERROR” Check that the OFF (ON when an error Refer to User’s
LED LED is ON occurred.) Manual
when an error
occurred.
Input LED Check that the ON when input is ON. Refer to User’s
LED turns ON OFF when input is OFF. Manual
and OFF. (Display, which is not as
mentioned above,
indicates an error.)
Output LED Check that the ON when output is ON. Refer to User’s
LED turns ON OFF when output is OFF. Manual
and OFF. (Display, which is not as
mentioned above,
indicates an error)
6–2
6. MAINTENANCE
MELSEC-A
6.3 Periodic Inspection
This section explains the inspection items which are to be checked every six
months to one year. This inspection should also be performed when the
equipment is moved or modified or the wiring is changed.
No. Check Item Checking Method Judgment Corrective Action

1 Ambient Measure with 0 to 55 °C When PC is used
Ambient environment
temperature thermometer and inside a panel, the
hygrometer. temperature in the
Ambient Measure corrosive 10 to 90 %RH panel is ambient
humidity gas. temperature.
Ambience There should be
no corrosive
gases.
2 Line voltage Measure voltage 85 to 132 VAC Change supply

check. across 100/200 power . Change
VAC terminal. 170 to 264 VAC transformer tap.
Mounting conditions
3 Looseness, Move the unit. The module Retighten screws.

play should be
mounted securely
and positively.
Ingress of Visual check. There should be Remove and clean.
dust or no dust or foreign
foreign material, in the
material vicinity of the PC.
4 Loose Retighten. Connectors Retighten.
terminal should not be
Connecting conditions
screws loose.
Distances Visual check. Proper clearance Correct.
between should be
solderless provided between
terminals. solderless
terminals.
Loose Visual check. Connectors Retighten
connector should not be connector
loose. mounting screws.
5 Battery Check battery Preventive If battery capacity
status by maintenance reduction is not
monitoring special indicated, change
auxiliary relays the battery when
M9006 and M9007. specified service
Retighten battery life is exceeded.
if necessary.
6–3
6. MAINTENANCE
MELSEC-A
6.4 Battery Replacement
A lithium battery is used in a CPU module to keep program and data during
power failure time. When the voltage of battery comes low, M9006 and/or
M9007 internal diagnostic signal come on. Please replace the battery as
soon as possible once the signal is activated.
6–4
7. ERROR CODES
MELSEC-A
7. ERROR CODES
When an error occurs while in the PC RUN or RUN state, the self-diagnostic
function stores an error indication or error code (including step number) in
the special register. This section describes how to read the error code, as
well as causes of errors and corrective actions. Table 7.1 shows the error
codes for A1SCPU and A2SCPU, Table 7.2 the error codes and detailed error
codes for A2ASCPU(S1/S30/S60), and Table 7.3 the error codes and detai-
led error codes that are detected only in the A1SHCPU and A2SHCPU,
respectively.
Take proper action to eliminate the cause of error.
7.1 Error Code List for A1SCPU(S1), A1SCPUC24-R2 and A2SCPU(S1)
Table 7.1 Error Codes

Contents
of Special
Register CPU
Error Message Error and Cause Corrective Action
D9008 State
(BIN
value)
An instruction code, which cannot be (1) Read the error step by use of pe-
decoded by CPU, is included in the ripheral device and correct the
program at that step.
program.
INSTRUCT (1) A memory cassette containing (2) In the case of the memory cas-
10 STOP invalid instruction code, has been sette, rewrite the contents of the
CODE ERR.
loaded. ROM, or replace with a memory
(2) The occurrence of an error cassette whose contents have
destroyed the memory contents, been correctly written.
adding an instruction code that
cannot be read to the memory.
(1) Check the loading of the PC CPU
The contents of the memory installed in memory cassette and load it cor-
the PC CPU have been destroyed rectly.
PARAMETER (2) Read the parameter data from the
11 STOP because of (a) the occurrence of noise,
ERROR PC CPU by use of a peripheral
or (b) the failure of the memory
device. Make any necessary cor-
cassette. rections and write it again to the
PC CPU.
MISSING END (1) There is no END(FEND) instruction (1) Write END at the end of the pro-
12 STOP in the program. gram.
INS.
(1) There is no jump destination for (1) Read the error step by use of a
plural destinations specified by the peripheral device and correct the
CJ, SCJ, CALL, CALLP or JMP program at that step.
instruction. (Make corrections such as the
(2) Although there is no CALL insertion of jump destination or
instruction, the RET instruction the changing of jump destinations
exists in the program and has to one.)
been executed.
(3) The CJ, SCJ, CALL, CALLP or
JMP instruction has been executed
with its jump destination located
below the END instruction.
CAN’T (4) The number of FOR instructions
13 STOP
EXECUTE (P) does not match the number of
NEXT instructions.
(5) The JMP instruction specified
between FOR to NEXT has caused
the execution to deviate from
between FOR to NEXT.
(6) The JMP instruction has caused
the execution to deviate from the
subroutine before the RET
instruction is executed.
(7) The JMP instruction has caused
execution to jump to a step or
subroutine between FOR to NEXT.
7–1
7. ERROR CODES
MELSEC-A
Table 7.1 Error Codes (Continued)
Contents
of Special
CPU
Error Message Register Error and Cause Corrective Action
State
D9008
(BIN value)
(1) There are instructions (including (1) Check the program of the CHK
NOP) other than LDX, LDIX, ANDX instruction circuit block (1) to (7)
and ANIX in the CHK instruction in the left column. Correct errors
circuit block. using a peripheral device and
restart the operation.
(2) There is more than one CHK (2) This error code is only valid when
instruction. the I/O control uses the direct
(3) The number of contact points in method.
the CHK instruction circuit block
exceeds 150.
(4) The X device number in the CHK
instruction circuit block exceeds
X7FE.
CHK (5) There is no circuit block in front of
14 STOP the CHK instruction circuit block.
FORMAT ERR.
CJ [ ]
(6) D1 device (number) of the
CHK/D1/D2 instruction is different
from the contact device (number)
above the CJ[ ] instruction.
(7) Pointer P254 is not attached to the
start of the CHK instruction circuit
block.
P254 CHK D1 D2
(1) Although the interrupt module is (1) Check for the presence of
used, there is no number for interrupt program which
interrupt pointer I, which corresponds to the interrupt
corresponds to that module, in the module and create and interrupt
program or several numbers of program or reduce the numbers of
pointer I exist in the program. I to one.
CAN’T
15 STOP (2) No IRET instruction has been (2) Check if there is IRET instruction
EXECUTE (I)
entered in the interrupt program. in the interrupt program and enter
the IRET instruction.
(3) There is an IRET instruction (3) Check if there is an IRET
somewhere besides the interrupt instruction somewhere besides
program. the interrupt program and delete
that IRET instruction.
(1) Parameters and/or sequence (1) Write parameters and/or
programs are not correctly written sequence programs correctly to
ROM ERR to the installed memory cassette. the memory cassette (EPROM or
(A1SCPU, 17 STOP E 2 PROM).
A1SHCPU) (2) Remove a memory cassette which
does not have any parameter
and/or sequence program.
(1) The PC CPU has checked if write Since this is a PC CPU hardware fault,
and read operations can be consult your nearest Mitsubishi
RAM ERROR 20 STOP performed properly to the data representative.
memory area of the PC CPU.
Normal writing and/or read/write
turned out to be impossible.
(1) The operation circuit, which
OPE. CIRCUIT performs the sequence processing
21 STOP
ERR. in the PC CPU, does not operate
properly.
Scan time exceeds watchdog monitoring (1) Calculate and check the scan
time. time of the user program and
reduce the scan time by the use
of CJ instructions, etc.
(1) Scan time of user program is (2) Monitor the content of special
WDT ERROR 22 STOP excessive. register D9005 by use of a
(2) Scan time has lengthened due to peripheral device. If the content
instantaneous power failure which is other than 0, line voltage is
occurred during the scan. insufficient. Therefore, check the
power and eliminate the voltage
fluctuation.
7–2
7. ERROR CODES
MELSEC-A
Contents
of Special
Register CPU
D9008 State
(BIN
value)
(1) When the END instruction is (1) Perform reset and RUN. If the
executed, another instruction code same error is displayed again, it
END NOT has been read due to noise, etc. is a PC CPU hardware fault.
24 STOP
EXECUTE Therefore, consult your nearest
(2) The END instruction has changed
to another instruction code. Mitsubishi representative.
The END instruction cannot be Check for an endless loop and correct
WDT ERROR 25 STOP
executed with the program looped. the program.
I/O module data is different from that at (1) Among special registers D9116 to
power ON. D9123, the bit corresponding to
the module verify error is “1".
Therefore, monitor the registers
by use of a peripheral device and
UNIT VERIFY STOP check for the module with ”1".
31
ERR. (RUN)
(1) The I/O module (including the (2) When the fault has been
special-function module) is (a) corrected, reset the PC CPU.
incorrectly disengaged or has been
removed, or (b) a different module
has been loaded.
(1) There is an output module with a (1) Check the blown fuse indicator
blown fuse. LED of the output module and
change the fuse in the module
whose LED is ON.
(2) The external power supply for the (2) Checking the module for a blown
output load is OFF or not fuse can also be done with a
FUSE BREAK STOP connected. peripheral device. Among special
32
OFF (RUN) registers D9100 to D9107, the bit
corresponding to the module of
verify error is “1". Therefore,
check by monitoring the registers.
(3) Check the ON/OFF state of the
external power supply for the
output load.
The FROM and TO instructions cannot (1) This is a special-function module,
be executed. CPU module or base unit
CONTROL-BUS hardware fault. Therefore,
40 STOP (1) Error of control bus with special- change the unit and check the
ERR.
function module. defective module. Consult your
nearest Mitsubishi representative
about the defective module.
When FROM and TO instructions This is a special-function module,
cannot be executed. CPU module or base unit hardware
fault. Therefore, change the unit and
SP. UNIT DOWN 41 STOP (1) Control bus error in the special- check the defective module. Consult
function module.
your nearest Mitsubishi representative
about the defective module.
Although the interrupt module is not (1) This is a certain module hardware
installed, an interruption has occurred. fault. Therefore, change the
I/O INT. ERROR 43 STOP module and check the defective
module. Consult your nearest
Mitsubishi representative about
the defective module.
(1) Three or more computer link (1) reduce the computer link modules
modules are installed into a single to two or less.
CPU module.
(2) Two or more data modules of (2) Use one MELSECNET(II),
MELSECNET(II), MELSECNET/B MELSECNET/B, or
or MELSECNET/10 are installed. MELSECNET/10.
SP. UNIT LAY. (3) Two or more interrupt modules are (3) Use one interrupt module.
44 STOP
ERR. installed.
(4) In the parameter setting of the (4) Reset the I/O assignment of
peripheral device, while an I/O parameter setting by use of
module is actually installed, a peripheral device according to the
special-function module has been actually loaded special-function
set in the I/O assignment, and vice module.
versa.
7–3
7. ERROR CODES
MELSEC-A
Contents
of Special
Register CPU
D9008 State
(BIN
value)
(1) Access (execution of FROM/TO (1) Read the error step by use of pe-
SP. UNIT ER- STOP instruction) has been made to a ripheral device, and check and
46 location where there is no special- correct the content of the FROM/
ROR (RUN)
function module. TO instruction at that step by
using a peripheral device.
(1) The contents, which have been (1) Write the parameters again and
written to the parameter area of check.
the link by setting the link range in
the parameter setting of peripheral
LINK PARA. ER- device, are different from the link
47 RUN parameter contents.
ROR
(2) The setting of the total number of (2) If this message is displayed
slave stations is 0. again, it is a hardware fault.
Therefore, consult your nearest
Mitsubishi representative.
(1) The result of BCD conversion has (1) Use a peripheral device to read
exceeded the specified range the error step and check and
(9999 or 99999999). correct the program at that step.
RUN (2) A setting has been done which ex- (Check device setting range, BCD
OPERATION ER- conversion value, etc.)
50 (STOP) ceeds the specified device range
ROR
and the operation cannot be done.
(3) File registers are used in the pro-
gram without performing the capac-
ity setting of file registers.
(1) An interrupt instruction (INT in- (1) INT instructions cannot be used in
struction) has been used in a microcomputer programs:
MAIN CPU microcomputer program. eliminate the INT instruction.
60 STOP
DOWN (2) The CPU has malfunctioned due to (2) Implement countermeasures
noise or some other problem. against noise.
(3) CPU hardware fault. (3) Replace the CPU.
(1) The battery voltage is low. (1) Change the battery.
BATTERY ER- (2) The battery lead is disconnected. (2) When RAM or power failure com-
70 RUN
ROR pensation is used, connect the
battery.
7–4
7. ERROR CODES
MELSEC-A
7.2 Error Code List for A2ASCPU(S1/S30/S60)
Error codes are generated as follows:
Table 7.2 Error Code List

Detailed
Error
Error
Error Message Code Error and Cause Corrective Action
Code
(D9008)
(D9091)
(1),(2) An unrecognized instruction (1) Read the error step by
code is being used. peripheral device and correct
(3) A CHG instruction was the program of that step.
executed when using an (2) Check to see if ROM has an
“INSTRCT CODE A2ASCPU. undecodable instruction code
ERR.” (4) When using an A2ASCPU(S1), and replace with ROM which
the LED or LEDC instruction has the correct content.
101 was used to operate the LED (3) The CHG instruction cannot be
indicators on the front of the used.
CPU. Delete the ladder block
containing the CHG instruction.
(4) The LED and LEDC
instructions cannot be used to
operate the LED indicators on
the front of the CPU.
Index is qualifying for a 32-bit Read the error step by peripheral
102
constant. device and correct the program of
that step.
The device specified by extension
103
application instruction is incorrect.
The program structure of the
104 extension application instruction
is incorrect.
10
The command name of the
105 extension application instruction
is incorrect.
There is a place where index
qualifying with Z or V is made in
106
the program in [LEDA/B|IX] to
[LEDA/B|IXEND].
(1) The device number and set
value in the OUT instruction
of the timer and counter are
qualified by an index.
(2) The label number of pointer (P)
assigned to a destination head
107 of [CJ], [SCJ], [CALL], [CALLP],
[JMP], [LEDA/B|FCALL],
[LADA/B|BREAK] instructions
or the label number of
interrupt pointer (I) assigned
to an interrupt program head
it is qualified by an index.
(Checked at STOP →
RUN or during 108 Error other than 101 to 107 above
instruction execution)
7–5
7. ERROR CODES
MELSEC-A
Table 7.2 Error Code List (Continued)
Detailed
Error
Error
Code
(D9008)
(D9091)
“PARAMETER ER-
The capacity settings of the main
ROR”
program, microcomputer Read the parameters in the CPU
programs, file register comments, memory and rewrite to the
status latch, sampling trace or memory after checking and
111 extension file registers are not correcting the content.
within the usable CPU range.
A subprogram was used when

Subprograms cannot be used.
using an A2ASCPU-S30.
The total of the set capacities of Read the parameters in the CPU
the main program, file register memory and rewrite to the
comments, status latch, sampling memory after checking and
112
trace and extension file registers correcting the content.
exceed the memory cassette
capacity.
11 The latch range in parameters or
113
the M, L, S setting is incorrect.
114 Sum check error
Parameter remote RUN/PAUSE

contacts, the run mode at error
occurrence, the annunciator
115
display mode or the STOP →
RUN display mode setting are
incorrect.
Parameter MNET-MINI automatic
116
refresh setting is incorrect.
Parameter timer settings are
117
incorrect.
(Checked at power-
Parameter counter settings are
on, STOP → RUN, 118
incorrect.
and PAUSE → RUN)
“MISSING END INS.”
There is no END (FEND)
(Checked at STOP 12 121 Write END in main program.
instruction in the main program.
→ RUN)
(1) The device number of pointer (1) Remove the duplicated number
(P) or interrupt pointer (I) used of pointer (P) with the
“CAN’T EXECUTE as the label added to the destination head and correct so
(P)” destination head is duplicated. that the number is not
131 duplicated.
(2) A CHG instruction was (2) The CHG instruction cannot be
executed when using an used.
13 A2ASCPU-S30. Delete the ladder block
containing the CHG instruction.
The label of pointer (P) specified Read the error step by peripheral
by [CJ], [SCJ], [CALL], [CALLP], device, check the content, and
[JMP], [LEDA/B|FCALL], insert destination pointer (P).
132
(Checked at the [LEDA/B|BREAK] instructions is
execution of not specified prior to the END
instruction) instruction.
7–6
7. ERROR CODES
MELSEC-A
Detailed
Error
Error
Code
(D9008)
(D9091)
(1) Even though the [CALL] (1) Read the error step by
instruction is missing, the [RET] peripheral device, check the
instruction has been executed content,and correct the
“CAN’T EXECUTE since it is in the program. program at that step.
(P)” (2) Even though the [FOR] (2) Nesting level for the [CALL],
instruction is missing, the [CALLP], and [FOR]
[NEXT] and [LEDA/B|BREAK] instructions must be 5 or less.
instructions have been
executed since they are in the
133
program.
(3) Since the nesting level for the
[CALL], [CALLP], or [FOR]
instruction is 6 or deeper, the
6th level nest has been
13 executed.
(4) The [RET] or [NEXT] instruc-
tion is missing at execution of
the [CALL] or [FOR] instruction.
Even though a subprogram was Read the error step with the
not set, the [CHG] instruction was peripheral device, and then
134
found in the program and elimiinate the [CHG] command
executed. circuit.
(Checked at the (1) [LEDA/B|IX] to [LEDA|IXEND] (1) Read the error step by
execution of instructi- instructions are not written as peripheral device, check the
on) a set. content, and correct the
135 (2) There are more than 32 sets program at that step.
of [LEDA/B|IX] to (2) [LEDA/B|IX] to [LEDA|IXEND]
[LEDA|IXEND] instructions. instructions must be less than
33 sets.
Instructions other than LDX, Refer to the content of the
“CHK FORMAT ERR.”
LDIX, ANDX and ANIX (including detailed error code, and check
141
NOP) are in the circuit block lf the and correct programs related to
[CHK] instruction. the [CHK] instruction.
There is more than 1 [CHK]
142
instruction.
The number of contact points in
143 the circuit block of the [CHK]
instruction exceeds 150.
The [LEDA|CHK] and
[LEDA|CHKEND] instructions are
144
not written as a set, or there are
14 2 or more sets.
The format of the block shown
below preceding the circuit block
lf the [CHK] instruction is
145 abnormal.
P254 CJ P[ ][ ]
The D1 device number of the

[CHK|D1|D2] instruction does not
146
match the contact device number
preceding the [CJP] instruction.
(Checked at There is a place where index
STOP/PAUSE → 147 qualification is made in the check
RUN) pattern circuit.
7–7
7. ERROR CODES
MELSEC-A
Detailed
Error
Error
Code
(D9008)
(D9091)
“CHK FORMAT ERR.” (1) There is more than 1 check Refer to the content of the
pattern circuit of [LEDA|CHK] detailed error code, and check
to [LEDA|CHKEND] instructions. and correct programs related to
(2) There are 7 or more check the [CHK] instruction.
condition circuits in
[LEDA|CHK] to
[LEDA|CHKEND] instructions.
(3) The check condition circuits
in [LEDA|CHK] to
14 148 [LEDA|CHKEND] instructions
have been created by
instructions other than X and Y
contact instructions and
comparison instructions.
(4) The check pattern circuit of
[LEDA|CHK] to
(Checked at [LEDA|CHKEND] instructions
STOP/PAUSE → has been created by 257 or
RUN) more steps.
“CAN’T EXECUTE The [IRET] instruction exists Read the error step by peripheral
(1)” 151 outside the interrupt program and device and erase the [IRET]
has been executed. instruction.
Check and correct use of [IRET]
No [IRET] instruction in the
152 instruction inside or outside
interrupt program.
interrupt program.
15 Monitor special register D9011 by
peripheral device, check whether
An interrupt module is being used
or not there is an interrupt
though there is no corresponding
program corresponding to the
153 interrupt pointer (I).
stored numeric values or whether
At error occurrence, pointer (I) is
(Checked at the or not the same number exists for
stored in D9011.
occurrence of the interrupt pointer (I), and
interruption) correct.
“RAM ERROR” Error of the CPU sequence Possible hardware fault, consult
201
program storage RAM Mitsubishi representative.
202 Error of the CPU work area RAM
20
203 CPU device memory error
(Checked at
204 CPU address RAM error
power-on)
“OPE CIRCUIT ERR” The operation circuit executing Possible hardware fault, consult
211 index qualification in the CPU is Mitsubishi representative.
not operating normally.
21 The CPU hardware (logic) is not

212
operating normally.
The operation circuit executing
(Cheked at
213 PC sequence program in the CPU
power-on)
is not operating normally.
“WDT ERROR” Scan time exceeds watchdog (1) Check PC program scan time
error monitor time. and reduce using the [CJ]
(1) User program scan time has instruction.
increased. (2) Check for momentary power
22 ——
(2) Momentary power failure failures by monitoring special
(Checked at the during program scan has register D9005.
execution of END caused apparent scan time to
instruction) increase.
7–8
7. ERROR CODES
MELSEC-A
Detailed
Error
Error
Code
(D9008)
(D9091)
“END NOT The entire stored program has (1) Reset CPU
EXECUTE” been executed without executing If error persists, possible
the END instruction. hardware fault, consult
(1) The END instruction has been Mitsubishi representative.
24 241 missed (e.g. memory cassette
removed during program
execution).
(Checked at end of (2) The END instruction has been
program) corrupted.
“MAIN CPU DOWN” The main CPU is malfunctioning Possible hardware fault, consult
26 ——
or broken. Mitsubishi representative.
“UNIT VERIFY ERR.” Verified data is different from the Read the detailed error code by
I/O data at power on. peripheral device, check and
(1) An I/O module (including replace the module corresponding
special function module) has to that numeric value (I/O head
31 —— been removed or the base number) or monitor special
unit while the PC power is registers D9116 to D9123 by
switched ON, or wrong module peripheral device, check and
(Checked is loaded. replace the module where that
continuously) data bit is “1".
“FUSE BREAK OFF” Output module fuse blown. (1) Check the fuse blown LED
indicator of the output module
and replace the fuse of the lit
module.
(2) Read the detailed error code
by peripheral device and
replace the fuse of the output
32 ——
module corresponding to that
numeric value (I/O head
number), or monitor special
registers D9100 to D9107 by
peripheral device and replace
(Checked the fuse of the output module
continuously) where that data bit is “1".
“CONTROL-BUS Incorrect FROM/TO instruction Hardware fault (CPU, special
401
ERR.” execution. function module and/or base
unit). Consult Mitsubishi
Parameter I/O assignment, representative.
special function modules cannot
be accessed at initial
40 communication.
402 At error occurrence, the head I/O
number (the upper 2 digits of a 3
digit expression) of the special
function module causing the error
is stored in D9011.
“SP. UNIT DOWN” No response from special Hardware error of the accessed
411 function unit after execution of special function module. Consult
FROM/TO instruction. Mitsubishi representative.
During parameter I/O assignment,
at initial communication,
41 responses from special function
modules have not been returned.
412 At error occurrence, the head I/O
number (the upper 2 digits of a 3-
digit expression) of the special
function module causing the error
is stored in D9011.
“LINK UNIT ERROR” A1SJ71AP21/R21, When using A1SJ71AP21/R21,
A1SJ71AT21B, AJ71AP21/R21 or A1SJ71AT21B, AJ71AP21/R21,
42 —— AJ71AT21B located in master or AJ71AT21B modules, set one
station. as the master station and the
other as a local station..
7–9
7. ERROR CODES
MELSEC-A
Detailed
Error
Error
Code
(D9008)
(D9091)
“I/O INT. ERROR” Interrupt signal received with no Since a hardware error has
interrupt module present. occurred in one of the modules,
replace the modules one by one
43 ——
to find the faulty module.
Consult Mitsubishi
representative.
“SP. UNIT LAY. ERR.” I/O modules allocated in parame- Reset I/O assignments in
ter settings by peripheral device parameters by peripheral device
441 have been allocated by special according to the loading status
function modules. Or, the oppo- of the special function modules.
site settings have been executed.
More than 11 special function mod- Load less than 10 special
ules [except for the AI61 (S1)] function modules [except for the
442
which can start interrupts to the AI61 (S1)] which can start
CPU have been loaded. interrupts to the CPU.
More than 1 AJ71AP21/R21s Load only AJ71AP21/R21s,
443 A1SJ71AT21Bs, AJ71AP21/R21s A1SJ71AT21Bs, AJ71AP21/R21s
or AJ71AT21Bs has been loaded. or AJ71AT21Bs.
More than 6 computer link mod- Load no more than 6 computer
444 ules, etc., have been loaded to 1 link modules.
CPU module.
More than 1 AI61 (S1)/A1SI61 has Load only 1 AI61/A1SI61.
445
been loaded.
The modules MNET/MINI automat- Reset the module assignments
ic refresh allocated in parameter of the MNET/MINI automatic
settings by peripheral device and refresh in parameter settings by
446
the names of the modules of actu- peripheral device according to
ally linked station numbers are in- the modules of station numbers
44 correct. actually linked.
The number special function mod- Decrease the number of loaded
ules which can use dedicated in- special function modules.
structions, registered by I/O
assignment per one CPU module
(number of modules to be loaded)
is larger than the specified limit.
(The total of computers shown
below is 1344 or more.)
(Number of loaded AD59 x 5)
447
(Number of loaded AD57(S1)/AD58 x 8)
(Number of loaded A1SJ71C24-R2(PRF/R4)
x 10)
(Number of loaded AJ71C24(S3/S6/S8) x 10)
(Number of loaded AJ71UC24 x 10)
(Number of loaded AJ71C21(S1) x 29)
(Number of loaded A1SJ71PT32-S3 x 125)
+ (Number of loaded AJ71PT32(S3) x 125)
Total > 1344
(1) More than 4 AJ71LP21/ (1) Load no more than 4 modules.

AJ71BR11 modules are installed. (2) Load a total of 4 or less of the
(2) A total of five or more of the modules.
following modules is installed:
448
A1SJ71AP21/R21,
A1SJ71AT21B, AJ71AP21/R21,
AJ71AT21B, AJ71LP21,
AJ71BR11.
7 – 10
7. ERROR CODES
MELSEC-A
Detailed
Error
Error
Error Massage Code Error and Cause Corrective Action
Code
(D9008)
(D9091)
“SP. UNIT ERROR” There is no special function Read the error step by peripheral
module in the area specified by device, check and correct the
461
the FROM/TO instruction. content of the FROM/TO
(Checked when instruction of that step.
FROM/TO instructi-
on, or special functi- (1) The model name of the module (1) Match the model name
on module dedicated specified in the CC-Link specified by I/O allocation
instruction is speci- dedicated instruction is different parameter with that specified in
46 from that specified by I/O the CC-Link dedicated
fied.)
allocation parameter. instruction.
462 (2) There is no special function (2) Read the error step by
module in the area specified by peripheral device, check and
the FROM/TO instruction or correct the content of the
there is no corresponding special function module
special function module. dedicated instruction of that
step.
“LINK PARA. ERROR” (1) The link range is set in (1) Re-write link parameters from
parameter settings by peripheral programming module
peripheral device, and for some to PC.
reason, the content written to (2) Check station number setting.
 the link parameter area differs (3) Persistent error occurrence
from the link parameter content may be an indication of
read by the CPU or link hardware fault. Consult
parameter is not written. Mitsubishi representative.
(2) 0 slave stations set.
NET/10 network refresh
470
parameter error.
47 NET/10 transfer parameter for
471
data link error
472 NET/10 routing parameter error
NET/10 network parameter error

473
(first module)
474
(second module)
475
(third module)
476
(fourth module)
7 – 11
7. ERROR CODES
MELSEC-A
Detailed
Error
Error
Code
(D9008)
(D9091)
“OPERATION ER- (1) When using file register (R), Read the error step by
ROR” operations have been executed peripheral device, check and
exceeding the specified range correct the program of that step.
for the device number and
501
block number of file register (R).
(2) The file register is used in the
program without executing file
register capacity settings.
The combination of devices
502
specified by instruction is incorrect.
The storage data of specified
503 devices or the constants are not
50 within the usable range.
The quality of settings used for
504 handled data has exceeded the
usable range.
(1) The station number specified
by instruction [LEDA/B|LRDP],
[LEDA/B|LWTP], [LRDP] or
[LWTP] is not a local station.
(2) The head I/O number
505 specified by instruction
[LEDA/B|RFRP],
(Checked during
[LEDA/B|RTOP], [RFRP] or
execution of instructi-
[RTOP] is not a remote station.
on)
7 – 12
7. ERROR CODES
MELSEC-A
Detailed
Error
Error
Code
(D9008)
(D9091)
“OPERATION The head I/O number specified by Read the error step by peripheral
ERROR” instruction [LEDA/B|RFRP], device, check and correct the
506 [LEDA/B|RTOP], [RFRP] or program of that step.
[RTOP] is not a special function
module.
(1) While the AD57 (S1) or the Read the error step by peripheral
AD58 is executing instructions device and provide interlock by
by partial processing, other special relay M9066 or change
instruction have been output to the program structure and
the same module. correct. This prevents the
(2) While the AD57 (S1) or the execution of other instructions to
507
AD58 is executing instructions the same module while executing
by partial processing, instructions to the AD57 (S1) or
instructions have been output AD58 by partial processing and
to other AD57 (S1) or AD58 by prevents the execution of
partial processing. instructions to other AD57(S1) or
AD58 by partial processing.
(1) An instruction which cannot (1) Read the error step by
be executed by remote peripheral device and correct
terminal module connected to the program, meeting loaded
50 the MNET/MINI-S3 was conditions of remote terminal
executed to the modules. module.
(2) Another [PRC] instruction has (2) Correct by using special
been executed although the register D9081 (number of
number registered in the mailbox vacancies) or special
memory and waiting to be register M9081 (mailbox BUSY
processed has reached 32, signal) to ensure that no
and this has caused the registrations can be made in
mailbox (memory area for the mailbox (memory area for
509 instructions waiting for instructions waiting for exe-
execution) to overflow. cution), and therefore [PRC]
(3) A [PIDCONT] instruction has instructions cannot be exe-
been executed without executed, when the mailbox is full.
cuting a [PIDINIT] instruction. (3) Execute each instruciton, and
Or, a [PID57] instruction has then, execute the next
been executed without exe- instruction.
cuting a [PIDINIT] instruction
or [PIDCONT] instruction.
(Checked during
execution of
instruction)
“MAIN CPU DOWN” (1) CPU malfunction due to noise. (1) Eliminate noise.
60 ——
(2) Hardware fault. (2) Hardware fault.
“BATTERY ERROR” (1) Battery voltage low. (1) Replace the battery.
(2) Battery not connected. (2) When using RAM memory or
70 —— the power failure compensation
(Checked at power- function, load the lead
on) connectors.
7 – 13
7. ERROR CODES
MELSEC-A
7.3 Error Code List Detected only with A1SHCPU and A2SHCPU(S1)
The error codes, error messages, detailed error codes and corrective actions
detected only with A1SHCPU and A2SHCPU(S1) are described.
For errors other than above, refer to section 7.1.
CC-Link is the abbreviation for Control & Communication Link.
It will be referred to as CC-Link in this section.
Table 7.3 Error Code List

Detailed
Error
Code
(D9092)
“INSTRUCT CODE ERR. An error code which the CPU cannot (1) Read out the steps where the
interpret exists in the program. error occurred using a peripheral
device, and correct the program.
101 (2) Check if the used ROM contains
instruction codes that cannot
be interpreted, and insert the
correct ROM.
Wrong device was specified in the Read out the steps where the error
103 extension application occurred using a peripheral device,
instruction. and correct the program.
The program structure of the
104 extension application instruction was
wrong.
Wrong command name was specified
105 in the extension application
instruction.
“SP. UNIT ERROR” (1) The model name of the module (1) Match the model name specified
specified in the CC-Link dedicated by I/O allocation parameter with
instruction is different from that that specified in the CC-Link
specified by I/O allocation dedicated instruction.
462 parameter. (2) Read the error step with a peripheral
(2) The module specified by a CC-Link device. Check and correct the CC-Link
dedicated instruction is not a master dedicated instruction in the step.
module.
“OPERATION ERROR” The stored data or constant in the Read out the steps where the error
503 specified device is not in the usable occurred using a peripheral device,
range. and correct the program.
The specified number of data to use
504 exceeded the allowed number.
The number of CC-Link dedicated Reduce the number of CC-Link
instructions executed during a scan dedicated instructions executed
executed 64. during a scan to 64 or less.
509
A CC-Link dedicated instruction was Set parameters.
issued to a master module for which
parameters are not set.
Point
MITSUBISHI
When using the CC-Link dedicated
MODEL
instructions, use a master module
with the rating plate indicating DATE 9707 B
“9707B” or later in its DATE
column.
MITUBISHI ELECTRIC BD992D008H38
Function version
Manufacture of year and month
7 – 14
APPENDIX
APPENDIX
Appendix 1 Dissimilarities Between A1SHCPU and A1SCPU(S1)

Item A1SHCPU A1SCPU A1SCPU-S1
1 Processing speed *1 0.33µs 1µs
2 I/O points 2048 points *2 256 points 512 points
Max. 8192 points

3 File register capacity (R) Max. 4096 points (R0 to 4095)
(R0 to 8191)
4 Memory capacity 64k bytes 32k bytes
5 Comment points Max. 3685 points Max. 1600 points *3
CC-Link Dedicated
6 11 instructions None
Instruction
Conventional memory
cassette × b b
7 A1SMCA-2KE/8KE/8KP
New memory cassette

b b b
A1SNMCA-2KE/8KE/8KP
*1 I/O processing: during refreshing or performing the LD instruction.

*2 Each CPU has 2048 points (X/Y0 to 7FF) of I/O devices, while the actual I/O points are
same as in the AnS series. The additional I/O devices can be used for MELSECNET
(/B), MELSECNET/MINI, or CC-Link.
*3 The CPU can store 1600 comment points, while the GPP function can create up to 3685
comment points.
Appendix 2 Dissimilarities Between A2SHCPU(S1) and A2SCPU(S1)

Item A2SHCPU A2SHCPU-S1 A2SCPU(S1)
1 Processing speed *4 0.25µs 1µs
512 points
2 I/O points 2048 points *5
(1024 points *6)
Max. 8192 points Max. 4096 points

3 File register capacity (R)
(R0 to 8191) (R0 to 4095 *6)
4 Memory capacity 64k bytes 192k bytes 32k bytes (192k bytes *6)
CC-Link Dedicated
5 11 instructions None
Instruction
Conventional memory
cassette × b b
6 A2SMCA-14KE/14KP
New memory cassette

b b b
A2SNMCA-30KE
*4 I/O processing: during refreshing or performing the LD instruction.

*5 Each CPU has 2048 points (X/Y0 to 7FF) of I/O devices, while the actual I/O points are
same as in the AnS series. The additional I/O devices can be used for MELSECNET
(/B), MELSECNET/MINI, or CC-Link.
*6 When using A2SCPU-S1
A–1
APPENDIX
Appendix 3 Dissimilarities Between A2SCPU-S30/S60 and A2ASCPU(S1)

Item A2ASCPU-S30 A2ASCPU-S60 A2ASCPU(S1)
Memory capacity 64k bytes

1 256k bytes 256k bytes
(built-in RAM) (256k bytes *7)
Program Main Max. 30k steps Max. 30k steps Max. 14k steps
2
capacity None Max. 30k steps None
Sub
512 points
3 No. of input/output points 1024 points 1024 points
(1024 points *7)
Max. block No. of Block No. 3

4 Block No. 3 Block No. 16
expanded file register (No. 16 *7)
Command
5 processing Sequence 0.20 ms/step 0.15 ms/step 0.20 ms/step
speed command
6 Consumed current 0.32A 0.35A 0.32A
*7 When using A2ASCPU-S1

Appendix 4 CE Marking Compatible Modules for Compact PC
Mode l Specification s
A1SHCPU 256 actual I/O points, 64k byte memory
CPU module
A2SHCPU(S1) 512 actual I/O points, 64k byte memory
A1S61PEU 200-240 VAC input, 5 VDC 5A output
Power supply A1S62PEU 200-240 VAC input, 5 VDC 2A 24VDC 0.6A output
module A1S61PN 100-240 VAC input, 5 VDC 5A output
A1S62PN 100-240 VAC input, 5 VDC 3A 24VDC 0.6A output
A1SX10EU 16 points, 100-120 VAC input
Input module
A1SX20EU 16 points, 200-240VAC input
A1SY10EU 16 points, 120VAC output (relay)
Output A1SY14EU 12 points, 240VAC output (relay)

module A1SY18AEU 8 points, 240VAC output, independent common (relay)
A1SY28EU 8 points, 100-240VAC output (Triac)
Appendix 5 CC-Link Dedicated Instructions List

RLPA Link parameter setting
RRPA Refresh parameter setting
RIFR Read from master station buffer memory
RITO Write to master station buffer memory
RIRD Read from buffer memory of intelligent remote station
RIWT Write to buffer memory of intelligent remote station
RIRCV Read from buffer memory of intelligent remote station (with handshaking)
RISEND Write to buffer memory of intelligent remote station (with handshaking)
RDGET Read from the word station link register
RDPUT Write to the word station link register
RDMON Monitor the word station link register
* For detailed information and description of CC- Link dedicated instructions, refer to Appendix
1.1 “CC-Link Dedicated Instructions” in the A1SJHCPU/A1SHCPU/A2SHCPU(S1) User’s
Manual(IB-66779).
A–2

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앬 SAFETY PRECAUTIONS 앬

(Read these precautions before using.)

Procedures which may lead to a dangerous condition and cause death

Depending on circumstances, procedures indicated by E CAUTION may also be linked to serious

[STARTUP AND MAINTENANCE PRECAUTIONS]

Print Date *Manual Number Revision

Note: Definition of ‘trained and competent personnel’ is as follows:

b) Any commissioning or service engineer must be of a competent nature, trained and

Note’s on the symbols used in this manual

Harmonised European Standards IEC Standards

AnS-Series Programmable Logic Controllers

1. ENVIRONMENTAL SPECIFICATIONS ...........................................................................................1 - 1

2. MODULE SPECIFICATIONS ............................................................................................. 2 - 1 to 2 - 8

5. FAIL-SAFE CONSTRUCTIONS ........................................................................................ 5 - 1 to 5 -3

7. ERROR CODES ................................................................................................................. 7 - 1 to 7 - 14

Related manuals • ACPU Programming Manual (Fundamentals) (IB-66249)

2.1 Power Supply Modules

Base loading slot Power supply module loading slot

100 to 120 VAC+10%/-15%(85 to 132 VAC) 24 VDC +30%/-35%

Rated input frequency 50/60 Hz ±3% 

Max. input apparent power 105 VA 41 Ω

Inrush current 20 A 8 ms or lower 81 A 1 ms or lower

5 VDC 5.5 A or higher 3.3 A or higher 5.5 A or higher

5 VDC 5.5 to 6.5 V

Efficiency 65% or higher

Allowable momentary power failure time *3 20ms or lower 1ms or lower

Insulation resistor 5M Ω or highter at insulation resistance tester

Noise voltage 500Vp-p,

Terminal screw size M3.5 × 7

Applicable wire size 0.75 to 2mm 2 (AWG18 to 14)

Applicable solderless terminal RAV1.25 to 3.5, RAV2 to 3.5

Applicable tightenig torque 59 to 88 N⋅cm (6 to 9kg⋅cm)

External dimension mm (inch) 130 × 55 × 93.6 (5.12 × 2.17 × 3.69)

Weight kg (lb) 0.53 (1.17) 0.55 (1.21) 0.5 (1.1)

*1: Overcurrent protection

A1S61PEU A1S62PEU A1S61PN A1S62PN

200 to 240 VAC (10%/-15%) 100 to 240 VAC(10%/-15%)

40 A 8ms or lower 20A 8ms or lower

5.5 A or higher 3.3 A or higher 5.5 A or higher 3.3 A or higher

 0.66A or higher  0.66 A or higher

1780 VAC 1780 VAC

AC across input/LG and output/FG5M Ω or highter, mesured with a

(1) Noise voltage 1500Vp-p, Noise width 1 µs,

RAV1.25 to 3.5, RAV2 to 3.5 RAV1.25 to 4, RAV2 to 4

59 to 88 N⋅cm (6 to 9 kg⋅cm) 83 to 113 N⋅cm (8.5 to 11.5 kg⋅cm)

0.53 (1.17) 0.55 (1.21) 0.60(1.32)

2.2.1 Input modules

Specifications of input modules are shown in the following table.

Operating Voltage Maximum

100% (110 VAC)

A1SX20 16 200 to 240 VAC, 9 mA 1500 VAC 80 VAC or 30 VAC or

14 VDC or 6.5 VDC or 100%

14 VDC or 6.5 VDC or 100%

14 VDC or 6.5 VDC or

DC input 16/32/ 8 VDC or 100%

Specifications of input modules are shown in the following table.

Max. Response Time

Terminal 16 1000 VAC 0.05 A 16

Terminal 16 1500 VAC 0.05 A 16

10 ms 10 ms Terminal 16 500 VAC 0.05 A 16

0.1 ms 0.2 ms Terminal 16 500 VAC 0.05 A 16

10 ms 10 ms Terminal 16 500 VAC 0.05 A 16

10 ms 10 ms 40-pin connector 32 500 VAC 0.08 A 32