KX-TG4111MEB KX-TG4112MEB KX-TGA410MEB: Telephone Equipment

ORDER NO.
KM41106439CE
Telephone Equipment
Model No. KX-TG4111MEB
Caller ID Compatible
KX-TG4112MEB
KX-TGA410MEB
Digital Cordless Phone
B: Black Version
(for Mexico)
KX-TGA410MEB KX-TG4111MEB
(Handset) (Base Unit)
(Charger Unit)
Configuration for each model
Model No Base Unit Handset Charger Unit Expandable

KX-TG4111 1 (TG4111) 1 (TGA410) Up to 6
KX-TG4112 1 (TG4111) 2 (TGA410) 1 Up to 6
Information for optional accessories

You can expand your phone system by registering optional
handsets (KX-TGA660ME) to a single base unit.
Optional handsets and the supplied handset are different model
so that some functions may not be available.
Refer to each Operating Instruction for details.
© Panasonic System Networks Co., Ltd. 2011

Unauthorized copying and distribution is a violation
of law.
KX-TG4111MEB/KX-TG4112MEB/KX-TGA410MEB
WARNING
This service information is designed for experienced repair technicians only and is not designed for use by the general
public. It does not contain warnings or cautions to advise non-technical individuals of potential dangers in attempting
to service a product. Products powered by electricity should be serviced or repaired only by experienced professional
technicians. Any attempt to service or repair the product or products dealt with in this service information by anyone
else could result in serious injury or death.
IMPORTANT SAFETY NOTICE

There are special components used in this equipment which are important for safety. These parts are marked by
in the Schematic Diagrams, Circuit Board Diagrams, Exploded Views and Replacement Parts List. It is essential that
these critical parts should be replaced with manufacturer’s specified parts to prevent shock, fire or other hazards.
Do not modify the original design without permission of manufacturer.
IMPORTANT INFORMATION ABOUT LEAD FREE, (PbF), SOLDERING

If lead free solder was used in the manufacture of this product, the printed circuit boards will be marked PbF.
Standard leaded, (Pb), solder can be used as usual on boards without the PbF mark.
When this mark does appear, please read and follow the special instructions described in this manual on the
use of PbF and how it might be permissible to use Pb solder during service and repair work.
L When you note the serial number, write down all 11 digits. The serial number may be found on the bottom of the unit.
L The illustrations in this Service Manual may vary slightly from the actual product.
2
TABLE OF CONTENTS
PAGE
1 Safety Precautions----------------------------------------------- 4
1.1. For Service Technicians --------------------------------- 4
2 Warning -------------------------------------------------------------- 4
2.1. Battery Caution--------------------------------------------- 4
2.2. About Lead Free Solder (PbF: Pb free)-------------- 4
2.3. Discarding of P. C. Board-------------------------------- 5
3 Specifications ----------------------------------------------------- 6
4 Technical Descriptions ----------------------------------------- 7
4.1. US-DECT Description ------------------------------------ 7
4.2. Block Diagram (Base Unit_Main)---------------------- 9
4.3. Block Diagram (Base Unit_RF Part) -----------------10
4.4. Circuit Operation (Base Unit) -------------------------- 11
4.5. Block Diagram (Handset)-------------------------------18
4.6. Block Diagram (Handset_RF Part)-------------------19
4.7. Circuit Operation (Handset)----------------------------20
4.8. Circuit Operation (Charger Unit) ----------------------22
4.9. Signal Route -----------------------------------------------23
5 Location of Controls and Components ------------------24
6 Installation Instructions ---------------------------------------24
7 Operating Instructions-----------------------------------------24
8 Test Mode ----------------------------------------------------------25
8.1. Engineering Mode ----------------------------------------25
9 Service Mode -----------------------------------------------------29
9.1. How to Clear User Setting (Handset Only)---------29
10 Troubleshooting Guide ----------------------------------------30
10.1. Troubleshooting Flowchart -----------------------------30
11 Disassembly and Assembly Instructions ---------------41
11.1. Disassembly Instructions -------------------------------41
11.2. How to Replace the Handset LCD -------------------45
12 Measurements and Adjustments---------------------------46
12.1. Equipment Required -------------------------------------46
12.2. The Setting Method of JIG -----------------------------46
12.3. Adjustment Standard (Base Unit)---------------------50
12.4. Adjustment Standard (Charger Unit)-----------------51
12.5. Adjustment Standard (Handset) ----------------------52
12.6. Things to Do after Replacing IC or X'tal ------------53
12.7. Frequency Table ------------------------------------------55
13 Miscellaneous ----------------------------------------------------56
13.1. How to Replace the LLP (Leadless Leadframe
Package) IC------------------------------------------------56
13.2. How to Replace the Flat Package IC ----------------58
13.3. Terminal Guide of the ICs, Transistors and
Diodes -------------------------------------------------------60
14 Schematic Diagram ---------------------------------------------61
14.1. For Schematic Diagram---------------------------------61
14.2. Schematic Diagram (Base Unit_Main) --------------62
14.3. Schematic Diagram (Handset_Main) ----------------64
14.4. Schematic Diagram (Charger Unit) -----------------66
15 Printed Circuit Board-------------------------------------------67
15.1. Circuit Board (Base Unit_Main) -----------------------67
15.2. Circuit Board (Handset_Main)-------------------------69
15.3. Circuit Board (Charger Unit) ---------------------------71
16 Exploded View and Replacement Parts List -----------72
16.1. Cabinet and Electrical Parts (Base Unit) -----------72
16.2. Cabinet and Electrical Parts (Handset) -------------73
16.3. Cabinet and Electrical Parts (Charger Unit) -------74
16.4. Accessories ------------------------------------------------75
16.5. Replacement Parts List ---------------------------------76
3
1 Safety Precautions
1.1. For Service Technicians
• Repair service shall be provided in accordance with repair technology information such as service manual so as to
prevent fires, injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
• ICs and LSIs are vulnerable to static electricity.

When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on worktable.
4. Do not grasp IC or LSI pins with bare fingers.
2 Warning
2.1. Battery Caution
Risk of explosion if battery is replaced by an incorrect type. Dispose of used batteries according to the instructions.
2.2. About Lead Free Solder (PbF: Pb free)

Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50 °F ~ 70 °F (30 °C ~ 40 °C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700 °F ± 20 °F (370 °C ± 10 °C).
• Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 °F (600 °C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
Component Component
pin
Remove all of the
excess solder
Solder
(Slice View)
4
2.2.1. Suggested PbF Solder

There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper
(Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc, and Bismuth (Sn+Zn+Bi). Please check the
manufacturer's specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3 mm, 0.6 mm and 1.0 mm.
0.3 mm X 100 g 0.6 mm X 100 g 1.0 mm X 100 g
2.3. Discarding of P. C. Board

When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.
5
3 Specifications
■ Standard: ■ Bit rate:
DECT 6.0 (Digital Enhanced Cordless 1.152 kbit/s
Telecommunications 6.0) ■ Modulation:
■ Number of channels: GFSK (Gaussian Frequency Shift Keying)
60 Duplex Channels ■ RF transmission power:
■ Frequency range: 115 mW (max)
1.92 GHz to 1.93 GHz
■ Voice coding:
■ Duplex procedure: ADPCM 32 kbit/s
TDMA (Time Division Multiple Access)
■ Channel spacing:
1.728kHz
Base Unit Handset Charger

Power source AC Adaptor Rechargeable Ni-MH battery AC Adaptor
(PNLV226Z, 120 V AC, 60 Hz) AAA (R03) size (1.2 V 550 mAh) (PNLV226Z, 120 V AC, 60 Hz)
Receiving Method Super Heterodyne Super Heterodyne
Oscillation Method PLL synthesizer PLL synthesizer
Detecting Method Quadrature Discriminator Quadrature Discriminator
Tolerance of OSC Frequency 13.824 MHz ± 100 Hz 13.824 MHz ±100 Hz
Modulation Method Frequency Modulation Frequency Modulation
ID Code 40 bit 40 bit
Ringer Equivalence No. (REN) 0.1B
Dialing Mode Tone (DTMF)/Pulse Tone (DTMF)/Pulse
Redial Up to 48 digits Up to 48 digits
Speed Dialer Up to 24 digits (Phonebook)
Power Consumption Standby: Approx. 0.7 W 11 days at Standby, Standby: Approx 0.1 W
Maximum: Approx. 3.5 W 13 hours at Talk Maximum: Approx 2.0 W
Operating Conditions 0 °C - 40 °C 20 % – 80 % relative 0 °C - 40 °C 20 % – 80 % relative 0 °C - 40 °C 20 % – 80 % relative
air humidity (dry) air humidity (dry) air humidity (dry)
Dimensions (H x W x D) Approx. 77 mm x 126 mm x 90 mm Approx. 159 mm x 49 mm x 29 mm Approx. 43 mm x 73 mm x 76 mm
Mass (Weight) Approx. 140 g Approx. 130 g Approx. 50 g
Note:
• Design and specifications are subject to change without notice.
Note for Service:
• Operation range: Up to 300 m outdoors, Up to 50 m indoors, depending on the condition.
• Analog telephone connection: Telephone Line
6
4 Technical Descriptions
4.1. US-DECT Description
The frequency range of 1.92 GHz-1.93 GHz is used. Transmitting and receiving carrier between base unit and handset is same
frequency. Refer to Frequency Table (P.55).
4.1.1. TDD Frame Format

5 ms 5 ms
Up Link ( Handset -> Base Unit ) Down Link ( Base Unit -> Handset )
RX1 RX2 RX3 RX4 RX5 RX6 TX1 TX2 TX3 TX4 TX5 TX6
DATA rate : 1.152 Mbps

417 µs (available) 417 µs (blind)
4.1.2. TDMA system

This system is the cycles of 10 ms, and has 6 duplex paths, but maximum duplex communication path is 5 because of dummy
bearer use.
In 1 slot 417 µs, the 10 ms of voice data is transmitted.
• 2 - Handsets Link
Traffic Bearer Dummy bearer
Base unit RX1 RX2 RX3 RX4 RX5 RX6 TX1 TX2 TX3 TX4 TX5 TX6
Handset 1
(Stand by)
Handset 2 TX RX
(Link)
Handset 3 TX RX
(Link)
Traffic Bearer
A link is established between base unit and handset.
The state where duplex communication is performed.
Handset doesn't make up duplex in no free RF channels because of interference. (*1)
Dummy Bearer
Base unit sends Dummy-data to the all stand-by state handsets.
Handsets receive that data for synchronization and monitoring request from the base unit.
Base unit doesn't send Dummy bearer in no free RF channels because of interference. (*1)
Note:
(*1) It is a feature under FCC 15 regulation and for interference avoidance.
In the case of checking RF parts, it is better in least interference condition.
7
4.1.3. Signal Flowchart in the Radio Parts

Reception
Base unit:
A voice signal from TEL line is encoded to digital data and converted into a 1.9GHz modulated radio signal by BBIC(IC501).
The RF signal, after which is amplified in BBIC, is fed to selected antenna.
Handset:
As for a handset RF, RF signal is received in one antenna.
BBIC down-converts to 864 kHz IF signal from RX signal and demodulates it to digital data "RXDATA".
BBIC (IC1) converts RXDATA into a voice signal and outputs it to speaker.
Transmission
Handset:
A voice signal from microphone is encoded to digital data and converted into a 1.9GHz modulated radio signal by BBIC(IC1).
The RF signal, after which is amplified in BBIC, is fed to an antenna.
Base unit:
As for a base unit RF, RF signal is received in two antennas.
BBIC (IC501) compares RF signal levels and selects the antenna to be used. Then BBIC down-converts to 864 kHz IF signal
from RX signal in the selected antenna, and demodulates it to digital data "RXDATA".
BBIC (IC501) converts RXDATA into a voice signal and outputs it to TEL line.
8
4.2.
Q141
RLY
Q161 R151,R152 R131, R133 D101

L1T
SIDE TONE INUSE INUSE
CIRCUIT DETECT 2 DETECT 1 L1R
ANT1 ANT2 TEL JACK

X501
13.824 MHz
SW1 Q171
SP
RECEIVE DCP
AMP
DCM
Q111
LOUT BELL DC JACK
LIN DETECT
KEY 1
HOOK
KEY C
RF_PART DCIN 2
ANT1 DCIN 1
ANT2 BELL
HSMIP
RXp HSMIN
RXn IC302
RXON IC501 VBAT 3.0 V
VCCPA
TXp BBIC VBAT_APU REGULATOR
TXn VCC_IF
Block Diagram (Base Unit_Main)
VCC_FE
TXON
9
VCC_VCO
RSTN RESET
PDN DET
DOUBOUT 3.0V
SCL, SDA
WP
STM/CKM
VCCA
IC611 R371
VCC R372
VBAT EEPROM
MEMORY
CHARGE_CONTACT
+
KX-TG4111/4112 BLOCK DIAGRAM (Base Unit_Main)

4.3. Block Diagram (Base Unit_RF Part)

ANT2
ANT2 TXp
TXn
ANT1
DA801 TXON
RXON
RXp
RXn
ANT1
KX-TG4111/4112 BLOCK DIAGRAM (Base Unit_RF Part)
10
4.4. Circuit Operation (Base Unit)

General Description:
(BBIC, EERROM) is a digital speech/signal processing system that implements all the functions of speech compression, and
memory management required in a digital telephone answering machine.
The BBIC system is fully controlled by a host processor. The host processor provides activation and control of all that functions
as follows.
DECT RF system ADPCM

TDMA/TDD Digital TEL
Mod/Demod Speech Analog Line
PA/LNA ADPCM Processor Front Interface
RF part End
&
Host CPU
Caller ID
Modem Multi-
plexer
BBIC (IC501)
EEPROM IC611 Keys/ Charge
4.4.1. BBIC (Base Band IC: IC501)

• DTMF Generator
When the DTMF data from the handset is received, the DTMF signal is output.
• Caller ID demodulation
The BBIC implements monitor and demodulate the FSK/DTMF signals that provide CID information from the Central Office.
• Digital Switching
The voice signal from telephone line is transmitted to the handset or the voice signal from the handset is transmitted to the
Telephone line, etc. They are determined by the signal path route operation of voice signal.
• Block Interface Circuit
RF part, Key scan, Telephone line.
4.4.2. EEPROM (IC611)

Following information data is stored.
• Settings
ex: message numbers, ID code, Flash Time, Tone/Pulse
11
4.4.3. Power Supply Circuit/Reset Circuit

The power supply voltage from AC adaptor is converted to VBAT (3.0V) in IC302. And +3.0V for peripherals and analog part is
insulated from VBAT by Doubler of BBIC.
Circuit Operation:
VBAT +3.0V
IC302 VBAT IC501 IC611

pin 15
5.5V pin 10
3.0V EEPROM
AC Adaptor RSTN(Reset) DOUBLER OUT
REGULATOR For peripherals
pin 54 BBIC
STM/CKM
VDDC (1.2V)
pin 57
Receive
pin 9
Amp.
RF Part
VBAT
VDDC (1.2 V)
Reset (RSTN)
(IC501_54 pin)
Startmonitor
(IC501 57pin)
(CKM/STM)
BBIC chip initialize
12
4.4.3.1. Charge Circuit

The voltage from the AC adaptor is supplied to the charge circuits.
R371
+5.5V
F301 DCP
R372
DCM
D362
CHARGE+ +
C306
D361
( )
CHARGE-
13
4.4.4. Telephone Line Interface

Telephone Line Interface Circuit:
Function
• Bell signal detection
• ON/OFF hook and pulse dial circuit
• Side tone circuit
Bell signal detection and OFF HOOK circuit:
In the idle mode, Q141 is open to cut the DC loop current and decrease the ring load. When ring voltage appears at the Tip (T)
and Ring (R) leads (When the telephone rings), the AC ring voltage is transferred as follows:
T → L101 → R111 → C111 → Q111 → BBIC pin 59
When the CPU (BBIC) detects a ring signal, Q141 turns on, thus providing an off-hook condition (active DC current flow through
the circuit). Following signal flow is the DC current flow.
T → L101 → D101 → Q141 → Q161 → R163 → R167 → D101 → L102 → P101 → R
ON HOOK Circuit:
Q141 is open, Q141 is connected as to cut the DC loop current and to cut the voice signal. The unit is consequently in an on-
hook condition.
Pulse Dial Circuit:
Pin 6 of BBIC turns Q141 ON/OFF to make the pulse dialing.
Side Tone Circuit:
Basically this circuit prevents the TX signal from feeding back to RX signal. As for this unit, TX signal feed back from Q161 is
canceled by the canceller circuit of BBIC.
3.0V
Q141
R176
R141
R162
R160
C167
R165
R175 R172
Q161
RX R178 C178 C175 C165
C142
D143
( ) C163 C101
( ) R142
Pin 16 of IC501 Q171
C173 R164 R161
Q142 D101
L101
R167 R163
3 2
C164
C161
SA101
C176
R171
4 1
+
R145
)
C168
L1T
(
C102 L102 P101 L1R

TEL JACK
Hook
Pin 6 of IC501 R181 C184
3.0V
C111 R111
C112 R112
TX
)
C181
R114
Pin 28 of IC501
(
BELL
Q111
Pin 59 of IC501
R113
D113
C113
14
4.4.5. Parallel Connection Detect Circuit/Auto Disconnect Circuit

Function:
In order to disable call waiting and stutter tone functions when using telephones connected in parallel, it is necessary to have a
circuit that judges whether a telephone connected in parallel is in use or not. This circuit determines whether the telephone
connected in parallel is on hook or off hook by detecting changes in the T/R voltage.
Circuit Operation:
Parallel connection detection when on hook:
When on hook, the voltage is monitored at pin 17 of IC501. There is no parallel connection if the voltage is
0.54 V or higher, while a parallel connection is deemed to exist if the voltage is lower.
Parallel connection detection when off hook:

When off hook, the voltage is monitored at pin 18 of IC501; the presence/absence of a parallel connection is determined by
detecting the voltage changes.
If the Auto disconnect function is ON and statuses are Hold, receiving ICM, OGM transmitting, BBIC disconnects the line after
detecting parallel connection is off hook.
Q141
Q161
R141
R163
R142
R131
Pin 18 of IC501 C101
DCIN2
D101 L101
RA151 R151 3 2
R167
C132
Q142
R152 4 1
C152
SA101
L1T
R133
R145
L1R
C102 L102 TEL JACK
Pin 17 of IC501
DCIN1
P101
HOOK RA151
Pin 6 of IC501
15
4.4.6. Calling Line Identification (Caller ID)/Call Waiting Caller ID

Function:
Caller ID
The caller ID is a chargeable ID which the user of a telephone circuit obtains by entering a contract with the telephone company
to utilize a caller ID service. For this reason, the operation of this circuit assumes that a caller ID service contract has been
entered for the circuit being used. The data for the caller ID from the telephone exchange is sent during the interval between the
first and second rings of the bell signal. The data from the telephone exchange is a modem signal which is modulated in an FSK
(Frequency Shift Keying) * format. Data "1" is a 1200 Hz sine wave, and data "0" is a 2200 Hz sine wave. There are two types of
the message format which can be received: i.e. the single message format and plural message format. The plural message
format allows to transmit the name and data code information in addition to the time and telephone number data.
*: Also the telephone exchange service provides other formats.
Single message format
1st Ring 2nd Ring
2 sec Silent interval 4 sec 2 sec
0.5 s 575 ms min 0.5 s
DATA
STD Ring / 20 Hz
Tip-Ring 0.1 Vrms
70 Vrms
A DATA in
1200 Hz 2200 Hz
=DATA "1" =DATA "0 "
B DATA out
1 bit=833 µs
month day hour minute number

04 15 16 35 2013487000
Plural message format

1st Ring 718 ms
0.5 s 2nd Ring
2 sec
DATA
DATA CODE NAME month day hour minute number

201 John Smith 04 16 16 35 2013487000
16
Call Waiting Caller ID

Calling Identity Delivery on Call Waiting (CIDCW) is a CLASS service that allows a customer, while off-hook on an existing call,
to receive information about a calling party on a waited call. The transmission of the calling information takes place almost
immediately after the customer is alerted to the new call so he/she can use this information to decide whether to take the new
call.
Function:
The telephone exchange transmits or receives CAS and ACK signals through each voice RX/TX route. Then FSK data and
MARK data pass the following route.
Telephone Line → P101 → L101, L102 → C121, C122 → R121, R122 → IC501 (25, 24).
If the unit deems that a telephone connected in parallel is in use, ACK is not returned even if CAS is received, and the
information for the second and subsequent callers is not displayed on the portable handset display.
Call Waiting Format
CAS: CPE Alerting Signal

Dual Tone of 2130 Hz, 2750 Hz Continuance Signal
-15 dBm (900 ohm load) of 1200 Hz (Data "1") "FSK"
Signal Flow
Telephone Exchange CAS MARK DATA
Cordlessphone
80 5 ms 0~500 ms 58~75 ms about 300 ms
(be changed by
Information Volume)
ACK: Acknowledged Signal

DTMF
Signal Flow "D"
ACK
Cordlessphone Telephone Exchange
0~100 ms 60 5 ms
R121 C121 L101
BBIC L1T Telephone "FSK"

25 SA101 Line
IC501 C120 R122 C122 L102 L1R data
24
P101
17
4.5. Block Diagram (Handset)

VBAT
IC3
ANT1
X1
EEPROM
13.824 MHz
VBAT
WP, CLK, DATA

CHG_DET
RF part
CHG_CTL RXp
RXn
RXON
TXp
RSTN RESET TXn
Q4 D7 TXON
CHARGE
VBAT
BATTERY
MIC IC1
MIP BBIC
MIN
Receiver
HSSPOUTP
VBAT 4.0V LOUT
IC4
4.0V 3V
LED
(KEY/LCD) LED
Q6 (BELL)
KEYSTOROBE_A~E
KEY_LED
Q5
BELL_LED
KEYIN_1~5
Monitor SP
SPOUTP
SPOUTN
CKM/STM CKM//STM
LCD KEYS
KX-TGA410 BLOCK DIAGRAM (Handset)
18
4.6. Block Diagram (Handset_RF Part)

TXp
TXn
ANT TXON
DA801
RXON
RXp
RXn
KX-TGA410 BLOCK DIAGRAM (Handset_RF Part)
19
4.7. Circuit Operation (Handset)

4.7.1. Outline
Handset consists of the following ICs as shown in Block Diagram (Handset) (P.18).
• DECT BBIC (Base Band IC): IC1
- All data signals (forming/analyzing ACK or CMD signal)
- All interfaces (ex: Key, Detector Circuit, Charge, EEPROM, LCD)
• EEPROM: IC3
- Setting data is stored. (e.g. ID, user setting)
4.7.2. Power Supply Circuit/Reset Circuit

Circuit Operation:
When power on the Handset, the voltage is as follows;
BATTERY(2.2 V ~ 2.6 V: BATT+) → F1 → BBC1 (IC1) 10 pin
The Reset signal generates IC1 (54 pin) and 1.8 V.
VBAT
VDDC (1.2 V)
Reset (RSTN)
(IC1_54 pin)
Startmonitor
(IC1 57pin)
(CKM/STM)
BBIC chip initialize
4.0V
IC4
VBAT
3.0V
3.0V
BATTERY
EEPROM
2CELL
GND
VDDC (1.2V)
DOUBLER OUT (Charge Pump)
For all peripherals
3.0V
BBIC LCD
4.0V 3.0V
KEY LED
BELL LED
LCD BL
GHD GND
20
4.7.3. Charge Circuit

Circuit Operation:
When charging the handset on the Base Unit, the charge current is as follows;
DC+(6.5 V) → F301 → R371 → R372 →CHARGE+(Base) → CHARGE+(Handset) → Q4 → D7→ F1 → BATTERY+... Battery...
BATTERY- → R45 → GND → CHARGE-(Handset)→ CHARGE-(Base) → GND → DC-(GND)
In this way, the BBIC on Handset detects the fact that the battery is charged.
The charge current is controlled by switching Q9 of Handset.
Refer to Fig.101 in Power Supply Circuit/Reset Circuit (P.12).
Q2
C19
R2
R9
R8 D7
CHG +
Q3
BATT +
R4 47K Q4 BATTERY
2CELL
R6
10K BATT +
CHG -
Q9
GND
GND
GND
CHG CTRL (32)
BBIC
R7 CHG DET (34) IC1
100K
4.7.4. Battery Low/Power Down Detector

Circuit Operation:
“Battery Low” and “Power Down” are detected by BBIC which check the voltage from battery.
The detected voltage is as follows;
• Battery Low
Battery voltage: V(Batt) 2.35 V ± 50 mV
The BBIC detects this level and " " starts flashing.
• Power Down
Battery voltage: V(Batt) 2.1 V ± 50 mV
The BBIC detects this level and power down.
4.7.5. Speakerphone
The hands-free loudspeaker at SP+ and SP- is used to generate the ring alarm.
21
4.8. Circuit Operation (Charger Unit)

Charge control is executed at handset side so that the operation when using charger is also controlled by handset.
Refer to Circuit Operation (Handset) (P.20)
F1
R1 TP1
J1
TP2
AC Adaptor
The route for this is as follows: DC+pin of J1(+) → F1 → R1 → CHARGE+pad → Handset → CHARGE-pad → DC-pin of J1(-).
22
4.9. Signal Route

SIGNAL ROUTE IN 㸢㩷 ROUTE 㸢㩷 OUT
HANDSET TX HANDSET MIC - R73/74 - C11/13 - RA4 - IC1(22/23)

- <HANDSET_RF_TX_ROUTE> - ANT. ---
---ANT. - <BASE_UNIT_RF_RX_ROUTE> - IC501(46/47 - 28) - R181 - C184 - Q161 - Q141
- D101 - L101/[L102 - P101] - T/R(TEL LINE)
HANDSET RX T/R(TEL LINE) - L101/[P101 - L102] - D101 - Q141 - R165 - C173 - Q171 - C178 - R178
- IC501(16 - 44/45) - <BASE_UNIT_RF_TX_ROUTE> - ANT. ---
--- ANT. - <HANDSET_RF_RX_ROUTE> - IC1(28/27) - C86 - R10 -
HEADSET_JACK(5 - 4) - HANDSET SPEAKER
HANDSET HANDSET MIC - R73/74 - C11/13 - RA4 - IC1(22/23)

SP-Phone TX - <HANDSET_RF_TX_ROUTE> - ANT. ---
---ANT. - <BASE_UNIT_RF_RX_ROUTE> - IC501(46/47 - 28) - R181 - C184 - Q161 - Q141
- D101 - L101/[L102 - P101] -T/R(TEL LINE)
HANDSET T/R(TEL LINE) - L101/[P101 - L102] - D101 - Q141 - R165 - C173 - Q171 - C178 -R178
SP-Phone RX - IC501(16-44/45) - <BASE_UNIT_RF_TX_ROUTE> - ANT. ---
--- ANT. -<HANDSET_RF_RX_ROUTE> - IC1(29/31) - L13/L14 - Backside SP
DTMF SIGNAL IC501(28) - R181 - C184 - Q161 - Q141 - D101 - L101/[L102 - P101] - T/R(TEL LINE)
TO TEL LINE
CALLER ID T/R(TEL LINE) - L101/[P101 - L102] - C121/C122 - R121/R122 - IC501(24/25)
BELL DETECTION T/R(TEL LINE) - L101/[P101 - L102] - R111/R112 - C111/C112 - Q111 - IC501(5)
Note:
: inside of Handset
RF part signal route
SIGNAL ROUTE IN 㸢㩷 ROUTE 㸢㩷 OUT
HANDSET RF IC1(44/45) - L809 - C812 - DA801 - C895 - ANT

[ TX_ROUTE ]
HANDSET RF ANT - C895 - DA801 - C826 - IC1(46/47)

[ RX_ROUTE ]
BASE UNIT RF IC501(44/45) - C812 - L809 - DA801 - C895 - DA802 - C894/C893 - ANT1/ANT2
[ TX_ROUTE ]
BASE UNIT RF ANT1/ANT2 - C894/C893 - DA802 - C895 - DA801 - C826 - IC501(46/47)

[ RX_ROUTE ]
Note:
: inside of Handset
23
5 Location of Controls and Components

Refer to the Operating Instructions.
Note:
You can download and refer to the Operating Instructions (Instruction book) on TSN Server.
6 Installation Instructions
Note:
7 Operating Instructions
Note:
24
8 Test Mode
8.1. Engineering Mode
8.1.1. Base Unit
Important:
Make sure the address on LCD is correct when entering new data. Otherwise, you may ruin the unit.
Soft keys
{OFF}
Navigator key/
? (Volume) key
{FLASH}
{CALL WAIT}
Dial keypad
H/S LCD
H/S key operation ^
V
Caller List
1). Press .
INT SELECT
^
V
Initial setting
2). Select "Initial Setting" using {^}or {V}
then press SELECT or {>}.
INT SELECT
^
V
Select "Set tel line" using {^}or{V}
Set tel line
BACK SELECT
^
See next page
3). Enter "7", "2", "6", "2", "7", "6", "6", "4". V
Note: 7262 7664 = PANA SONI Set dial mode
(see letters printed on dial keys)
BACK SELECT
4). Select "Write EEP" using {^} or{V}
Service Mode
then press SELECT or {>}. Read EEP
Write EEP
BACK SELECT
5). Enter "٨", "٨", "٨", "٨" (Address). (*1)
Set Addr.:
Default Data
6). Enter "㧖", "㧖" (New Data). (*1)

CLEAR M
25
Set Addr.:
7). Press M , a long confirmation beep
New Data
will be heard.
CLEAR M
8). Press {OFF} to return to standby mode. Set Addr.:
After that, turn the base unit power off and then power on. ____ __
BACK
Note: * To enter "Set dial mode", press SELECT or {>} at " Set tel line".
It is necessary to turn on the power of base unit.
Frequently Used Items (Base Unit)
ex.)
Items Address Default Data New Data Remarks

Frequency 00 07 / 00 08 00/01 - - Use these items in a READ-ONLY mode to
ID 00 02 ~ 00 06 Given value - - confirm the contents. Careless rewriting may
cause serious damage to the computer system.
Note:
(*1) When you enter the address or New Data, please refer to the table below.
Desired Number (hex) Input Keys Desired Number (hex) Input Keys
0 0 A [Flash] + 0
1 1 B [Flash] + 1
. . C [Flash] + 2
. . D [Flash] + 3
. . E [Flash] + 4
9 9 F [Flash] + 5
26
8.1.2. Handset
Important:
Make sure the address on LCD is correct when entering new data. Otherwise, you may ruin the unit.
Soft keys
{OFF}
Navigator key/
? (Volume) key
{FLASH}
{CALL WAIT}
Dial keypad
H/S key operation H/S LCD

^
V
1). Press .
Caller List
INT SELECT
2). Select "Initial Setting" using {^} or {V} ^

V
Initial setting
INT SELECT
3). Enter "7", "2", "6", "2", "7", "6", "6", "4". ^
V
Note: 7262 7664 = PANA SONI
(see letters printed on dial keys) Ringer setting
BACK SELECT
4). Select "Write EEP" using {^} or{V}
then press SELECT or {>}. Service Mode
Read EEP
Write EEP
BACK SELECT
5). Enter "٨", "٨", "٨", "٨" (Address). (*1) Set Addr.:
Default Data
CLEAR M
6). Enter "㧖", "㧖" (New Data). (*1)
Set Addr.:
New Data
CLEAR M
7). Press M , a long confirmation beep
will be heard. Set Addr.:
____ __
BACK
8). Press {OFF} to return to standby mode.
After that, remove and reinsert the batteries. Press the Power button for
about 1 second if the power is not turned on.
27
Frequently Used Items (Handset)

ex.)
Items Address Default Data New Data Possible Adjusted Possible Adjusted Remarks
Value MAX (hex) Value MIN (hex)
Battery Low 00 12/00 13 00 / 00 - - -
Frequency 00 07 / 00 08 00 / 01 - - - (*2)
ID 00 02 ~ 00 06 Given value - - -
Note:
(*1) When you enter the address or New Data, please refer to the table below.
Desired Number (hex.) Input Keys Desired Number (hex.) Input Keys
0 0 A [Flash] + 0
1 1 B [Flash] + 1
. . C [Flash] + 2
. . D [Flash] + 3
. . E [Flash] + 4
9 9 F [Flash] + 5
(*2) Use these items in a READ-ONLY mode to confirm the contents. Careless rewriting may cause serious damage to the
handset.
28
9 Service Mode
9.1. How to Clear User Setting (Handset Only)
Handset
Press , , , simultaneously until a beep sound is heard. Then single handset is initialized.
(The contents of user setting are reset to factory default)
*Usage time is not cleared.
29
10 Troubleshooting Guide
10.1. Troubleshooting Flowchart
FLOW CHART
Not working
Power ON Base Unit Check Power
OK
Link
No link
No charge
Battery Charge Check Battery Charge
OK
OK
Check Link
NG
Range Check the RF part
OK
No voice
Handset Voice Transmission Check Handset Transmission
OK
No voice
Handset Voice Reception Check Handset Reception
OK
Caller ID Error
Caller ID function Check Caller ID
Cross Reference:
Check Power (P.31)
Check Battery Charge (P.32)
Check Link (P.33)
Check the RF part (P.35)
Check Handset Transmission (P.40)
Check Handset Reception (P.40)
Check Caller ID (P.40)
30
10.1.1. Check Power

10.1.1.1. Base Unit
Is the AC Adaptor inserted into AC outlet? (*1)
NO
Is output voltage of AC adaptor 5.5 V? Check AC Adaptor.
YES
NO
Check VDDC (1.2 V): Test Point [VDDC] Check Power Supply Circuit.
OK
NO
RSTN: Reset = "High"? Check Reset Circuit.
YES
NO
Check Xtal CLK = 13.824 MHz? Check X501.
YES
Check BBIC.
Cross Reference: Note:

Power Supply Circuit/Reset Circuit (P.12) BBIC is IC501.
(*1) Refer to Specifications (P.6) for part number and
supply voltage of AC adaptor.
(*2) Refer to Circuit Board (Base Unit_Main) (P.67).
10.1.1.2. Handset
Is the battery inserted to BATT+ and BATT-?
YES
NO
Is the voltage of TP-VBAT 2.3 V more? Check the battery and around BATT+ and
BATT- are not shorted.
YES
NO
Is the voltage of TP 3.0 V about 3.0 V?
YES Check Power Supply Circuit/Reset Circuit.

NO
Is the voltage of TP VDDC about 1.8 V?
YES
NO
Check Xtal CLK = 13.824MHz? Check X1, C8, C9.
YES
Check BBIC (IC1).
Cross Reference:
Power Supply Circuit/Reset Circuit (P.20)
31
10.1.2. Check Battery Charge

10.1.2.1. Base Unit
Plug in the AC Power source.
Charge Handset on Base Unit.
NO
Is the voltage of two charge contacts about Check Charge Circuit of Base Unit.
3 V or more?
OK
YES
Check Handset.
Check Charge Contacts at
Base Unit from mechanical point of view.
Cross Reference:
Charge Circuit (P.13)
10.1.2.2. Handset
NO
Is Check Power OK? Check Power of Handset.
YES
NO
Is BBIC (IC1: 34) high at charge state? Check Charge Circuit.
Cross Reference:
Check Power (P.31)
10.1.2.3. Charger Unit

Plug in the AC Power source.
Charge Handset on Charger Unit.
NO
Is the voltage of two charge contacts about Check Charge Circuit of Charger Unit.
3 V or more?
OK
YES
Check Handset.
Check Charge Contacts at Charger Unit
from mechanical point of view.
Cross Reference:
32
10.1.3. Check Link

10.1.3.1. Base Unit
Does Base Unit make link with normal working YES

Base Unit is OK. Check Handset.
Handset?
NO
Is the voltage of VBAT about 3.0 V? NO

Check around Power Supply Circuit.
YES
Is the voltage of VDDC about 1.2 V? NO
YES
NO
Is the voltage of +3.0V about 3.0 V? Adjust +3.0V voltage to 3.0 V. *1
YES
OK
Does the RF clock (CLK) oscillate at 13.824 MHz in NO Check around X501 and RF module and adjust
Base Unit Test Mode? clock frequency.*2
YES
Check the RF part
Cross Reference:
Note:
*1 How to adjust +3.0V:
Execute the command "VDA"
Refer to Things to Do after Replacing IC or X'tal (P.53) for Base Unit.
*2 How to adjust the frequency of X501:
To see the frequency, execute the command “SFR“, then check the TP_CKM (IC501-57pin).
To adjust frequency, send command “SFR “until the frequency counter becomes13.824 MHZ±55HZ.
33
10.1.3.2. Handset
Does Handset make link with Base Unit? YES

Handset is OK. Check Base Unit.
(Correct working unit)
NO
Is the voltage of TP VBAT about 2.2~2.8 V? NO Check the batteries.
YES
NO
Is the voltage of TP VDDC about 1.8 V? Check around Power Supply Circuit/Reset Circuit.
YES
OR
Is the voltage of TP 3.0 V about 3.0 V? Adjust +3.0V Vottage to 3.0V *1
YES
Does the RF clock (CLK) oscillate: 13.824 MHz NO Check around X1 and RF module and adjust
in Handset Test Mode? clock frequency. *2
YES
Check the RF part
Cross Reference:
Note:
*1 How to adjust +3.0V:
Execute the command "VDA"
Refer to Things to Do after Replacing IC or X'tal (P.54) for Handset.
*2 How to adjust the frequency of X1:
To see the frequency, execute the command “SFR“, then check the TP_CKM (IC1-57pin).
To adjust frequency, send command “SFR “until the frequency counter becomes13.824 MHz±55HZ.
34
10.1.4. Check the RF part

10.1.4.1. Finding out the Defective part
1. Prepare Regular HS(*1) and Regular BU(*2).
2. a. Re-register regular HS (Normal mode) to base unit (to be checked).
If this operation fails in some ways, the base unit is defective.
b. Re-register handset (to be checked) to regular BU (Normal mode).
If this operation fails in some ways, the handset is defective.
After All the Checkings or Repairing
1. Re-register the checked handset to the checked base unit, and Regular HS to Regular BU.
START
No Registration of Registration of No
Base unit is defective Regular HS to handset to Handset is defective
base unit Regular BU
Yes Yes
(other checkings)
Registration of Regular HS to Regular BU
Registration of handset to base unit

(checked ones)
Note:
(*1) HS: Handset
(*2) BU: Base Unit
35
10.1.4.2. RF Check Flowchart

Each item (1 ~ 5) of RF Check Flowchart corresponds to Check Table for RF part (P.37).
Please refer to the each item.
Start
1 2
Link NG Control NG Check BBIC interface parts.
confirmation signal
Normal confirmation (RF Block <->BBIC on BU/HS P.C.B)
OK OK
3
X'tal
NG
Frequency Adjust X'tal Frequency. (*1)
confirmation
OK
4
NG
TX confirmation Check TX Block.
OK
5
Range NG
confirmation TEST RANGE Check.
Normal
OK
GOOD
Note:
(*1) Refer to Check Link (P.33).
36
10.1.4.3. Check Table for RF part
No. Item BU (Base Unit) Check HS (Handset) Check

1 Link Confirmation Normal 1. Register Regular HS to BU (to be 1. Register HS (to be checked) to Regular
checked). BU.
HS, BU Mode [Normal Mode] 2. Press [Talk] key of the Regular HS to 2. Press [Talk] key of the HS to establish link.
establish link.
2 X'tal Frequency confirmation Check X'tal Frequency. Check X'tal Frequency.
(10.368 MHz ±100Hz) (13.824 MHz ±100 Hz)
HS, BU Mode: [Adjustment]
3 TX confirmation 1. Remove wire antenna 2 and connect 1. Connect spectrum analyzer to TP.(*4)
spectrum analyzer to TP. (*3). 2. Confirm TX power whether satisfied spec.
HS Mode: 2. Confirm TX power whether spec. is Power >=16.0dBm
HS_Burst Mode] (*1) satisfied.
Power >=14.5dBm
BS Mode:
BS_Burst Mode] (*2)
4 Range Confirmation Normal 1. Register Regular HS to BU (to be 1. Register HS (to be checked) to Regular
checked). BU.
HS, BU Mode: [Normal Mode] 2. Press [Talk] key of the Regular HS to 2. Press [Talk] key of the HS to establish link.
establish link. 3. Compare the range of the HS (being
3. Compare the range of the BU (being checked) with that of the Regular HS.
checked) with that of the Regular BU.
Note:
(*1) Refer to Commands (Handset) (P.49)
(*2) Refer to Commands (Base Unit) (P.49)
(*3) Adjustment Standard (Base Unit) (P.50)
(*4) Adjustment Standard (Handset) (P.52)
37
10.1.4.4. TEST RANGE Check

Circuit block which range is defective can be found by the following check.
Item BU (Base Unit) Check HS (Handset) Check

Range Confirmation TX TEST 1. Register Regular HS to BU (to be checked). 1. Register HS (to be checked) to Regular BU.
(TX Power check)
2. Set TX Power of the BU and the Regular HS 2. Set TX Power of the HS and the Regular BU
HS, BU setting according to CHART1. according to CHART1.
Checked unit: Low TX power (*1)
Regular unit: High TX power (*1) 3. At distance of about 20m between HS and BU, 3. At distance of about 20m between HS and BU,
Link OK = TX Power of the BU is OK. Link OK = TX Power of the HS is OK.
No Link = TX Power of the BU is NG. No Link = TX Power of the HS is NG.
Range Confirmation RX TEST 1. Register Regular HS to BU (to be checked). 1. Register HS (to be checked) to Regular BU.
(RX sensitivity check)
2. Set TX Power of the BU and the Regular HS 2. Set TX Power of the Checking HS and the Reg-
HS, BU setting according to CHART1. ular BU according to CHART1.
Checked unit: High TX power (*1)
Regular unit: Low TX power (*1) 3. At distance of about 20m between HS and BU, 3. At distance of about 20m between HS and BU,
Link OK= RX Sensitivity of the BU is OK. Link OK= RX Sensitivity of the HS is OK.
No Link = RX Sensitivity of the BU is NG. No Link = RX Sensitivity of the HS is NG
CHART1: Setting of TX Power and RX Sensitivity in Range Confirmation TX TEST, RX TEST
BU (to be checked) Regular_HS

TX Power TX Power
BU (Base Unit) TX Power Check Low Hig h
BU (Base Unit) RX Sensitivity Check High Low
HS (to be checked) Regular_BU

TX Power TX Power
HS (Handset) TX Power Check Low High
HS (Handset) RX Sensitivity Check High Low
Note:
(*1) Refer to Commands (Base Unit) (P.49).
38
10.1.5. Registering a Handset to the Base Unit

The supplied handset and base unit are pre-registered. If for some reason the
handset is not registered to the base unit, re-register the handset.
1 Handset:
{MENU} i # 1 3 0
2 Base unit:
Press and hold {LOCATOR} for about 5 seconds until the registration tone
sounds.
L If all registered handsets start ringing, press {LOCATOR} again to stop, then
repeat this step.
L The next step must be completed within 90 seconds.
3 Handset:
Press {OK}, then wait until a long beep sounds.
Note:
L While registering, “En La Base Modo Registro” is displayed on all registered
handsets.
L When you purchase an additional handset, refer to the additional handset’s
installation manual for registration.
10.1.6. Deregistering a Handset

A handset can cancel its own registration to the base unit, or other handsets
registered to the same base unit. This allows the handset to end its wireless
connection with the system.
1 {MENU} i # 1 3 1
L All handsets registered to the base unit are displayed.
2 { } : Select the handset you want to cancel. i {SELEC.}
3 { }: “Sí” i {SELEC.}
4 {OFF}
39
10.1.7. Check Handset Transmission

Check MIC of handset.
Check handset Tx in Signal Route.
Cross Reference:
Signal Route (P.23)
10.1.8. Check Handset Reception

Check speaker of handset.
Check handset Rx in Signal Route.
Cross Reference:
Signal Route (P.23)
Note:
When checking the RF part, Refer to Check the RF part
(P.35).
10.1.9. Check Caller ID

BASE UNIT
Did bell ring? NO Check bell signal detection in
(Message indicator Telephone Line Interface.
blinks)
YES
Check Calling Line Identification (Caller ID)/

Call Waiting Caller ID.
Cross Reference:
Telephone Line Interface (P.14)
Calling Line Identification (Caller ID)/Call Waiting Caller
ID (P.16)
Note:
• Make sure the format of the Caller ID service of the
Telephone company that the customer subscribes to.
• It is also recommended to confirm that the customer is really
a subscriber of the service.
40
11 Disassembly and Assembly Instructions

11.1. Disassembly Instructions
11.1.1. Base Unit
Ԙ 4 screws
Ԙ Remove the 4 screws to remove

the cabinet cover.
ԙ Remove the tape and solders.
Cabinet cover
ԙ Tape and Solders
Ԛ screw
Ԛ Remove the screw to remove the jack holder.
Jack holder
41
ԛ Remove the screw to remove

the main P.C. board.
ԛ screw
Main P.C. board
42
11.1.2. Handset
Ԙ Remove the 2 screws. Ԙ 2 screws
ԙ Insert a plastic card.

(Ex. Used SIM card etc.) Cabinet body
between the cabinet body
and the cabinet cover, then
pull it along the gap to open
the cabinet.
Cabinet cover
Ԛ Likewise, open the other

side of the cabinet.
Cabinet cover
ԛ Remove the cabinet cover
by pushing it upward.
ԝ Screw
Ԝ Remove the solders.
Ԝ Solders
ԝ Remove the screw to remove
the main P. C. board.
Main P.C. board
43
11.1.3. Charger Unit

Ԙ Screw
Ԙ Remove the screw to remove

the cabinet cover.
Main P.C. board

ԙ Solders
ԙ Remove the solders to remove
the 2 charge terminals.
2 charge terminals
44
11.2. How to Replace the Handset LCD

Note:
The illustrations are simplified in this page.
They may differ from the actual product.
P. C. board
Vertical Interval
Tolerance
Peel off the FFC (Flexible Flat Cable) from

the LCD, in the direction of the arrow. Take 0.2 mm
care to ensure that the foil on the P.C. board
is not damaged.
Horizontal Interval
0.2 mm Tolerance
If interval tolerance between center lines
is less than 0.2 mm, it is o.k.
New LCD
OK
Fit the heatseal of a new LCD.
NG
(Inclined)
Tip of Soldering Iron

(Part No. PQZZ430PIR)
Rubber of Soldering Iron
(Part No. PQZZ430PRB)
Heatweld with the tip of the soldering
iron about 5 to 8 seconds NG
(in case of 60W soldering iron).
(Vertical interval tolerance is
more than 0.2 mm.)
NG
(Horizontal interval tolerance is
more than 0.2 mm.)
45
12 Measurements and Adjustments

This chapter explains the measuring equipment, the JIG connection, and the PC setting method necessary for the measurement in
Troubleshooting Guide (P.30)
12.1. Equipment Required

• Digital multi-meter (DMM): it must be able to measure voltage and current.
• Oscilloscope.
• Frequency counter: It must be precise enough to measure intervals of 1 Hz (precision; ±4 ppm)
Hewlett Packard, 53131A is recommended.
• DECT tester: Rohde & Schwarz, CMD 60 is recommended.
This equipment may be useful in order to precisely adjust like a mass production.
12.2. The Setting Method of JIG

<Preparation> Note:
• Serial JIG cable: PQZZ1CD300E* *: If you have the JIG Cable for TCD500 series
• PC which runs in DOS mode (PQZZ1CD505E), change the following values of
• Batch file CD-ROM for setting: PNZZTG4131ME resistance. Then you can use it as a JIG Cable for both
TCD300 and TCD500 series. (It is an upper compatible JIG
Cable.)
Resistor Old value (kΩ) New value (kΩ)

R2 22 3.3
R3 22 3.3
R4 22 4.7
R7 4.7 10
12.2.1. Connections (Base Unit)

Connect the AC adaptor.
Connect the JIG Cable GND (black).
Connect the JIG Cable RX (red) and TX (yellow).
DC JACK
JIG Cable
1
3 UTX (yellow)
To Serial Port
3 URX (red)
AC adaptor (COM port 1*)
2 GND (black)
UTX URX GND PC
Base unit P. C. board

Note:
*: COM port names may vary depending on what your PC calls it.
46
12.2.2. Connections (Handset)

Connect the DC Power or Battery to BATT+ and BATT-.
Connect the JIG cable GND (black) to GND.
Connect the JIG cable UTX (yellow) to UTX and URX (red) to URX.
3 URX (red)
To Serial Port
URX UTX
3 UTX (yellow)
(com port 1*)
2 GND (black)
GND
DC Power
1 BATT+ BATT-
or Battery
JIG Cable
PC
Handset P. C. board
Note:
*: COM port names may vary depending on what your PC calls it.
47
12.2.3. How to install Batch file into P.C.
1. Insert the Batch file CD-ROM into CD-ROM drive and

copy PNZZTG**** folder to your PC (example: D drive).
<Example for Windows>
2. Open an MS-DOS mode window. On your computer, click [Start], select Programs
(All Programs for Windows XP/Windows Server 2003),
then click
MS-DOS Prompt. (for Windows 95/Windows 98)
Or
Accessories-MS-DOS Prompt. (for Windows Me)
Or
Command Prompt. (for Windows NT 4.0)
Or
Accessories-Command Prompt.
(for Windows 2000/Windows XP/Windows Server 2003)
3. At the DOS prompt, type "D:" (for example) to select the
drive, then press the Enter key.
<Example>
4. Type "CD 㪳PNZZTG****", then press the Enter key.
5. Type "SET_COM=X", then press the Enter key C: >Documents and Settings>D:
(X: COM port number used for the serial connection on your PC). D: >>CD >PNZZTG****
D: >PNZZTG**** >SET_COM=X
D: >PNZZTG****>READID
6. Type "READID", then press the Enter key. 00 52 4F A8 A8
䊶If any error messages appear, change the port number or D: >PNZZTG****>DOSKEY
䇭check the cable connection. D: >PNZZTG****>
䊶If any value appear, go to next step.
7. Type "DOSKEY", then press the Enter key. <Example: error happens>
C: >Documents and Settings>D:

D: >>CD >PNZZTG****
D: >PNZZTG**** >SET_COM=X
D: >PNZZTG****>READID
‫ޓ‬CreateFile error
ERROR 10: Can't open serial port
D: >PNZZTG ****>
Note:
• “*****” varies depending on the country or models.
48
12.2.4. Commands (Base Unit)

See the table below for frequently used commands.
Command name Function Example

rdeeprom Read the data of EEPROM Type “rdeeprom 00 00 FF”, and the data from address
“00 00” to “FF” is read out.
readid Read ID (RFPI) Type “readid”, and the registered ID is read out.
writeid Write ID (RFPI) Type “writeid 00 18 E0 0E 98”, and the ID “0018 E0 0E
98” is written.
hookoff Off-hook mode on Base Type “hookoff”.
hookon On-hook mode on Base Type “hookon”.
getchk Read checksum Type “getchk”.
How to use of 1.rdeeprom Read EEPROM Type “RdEeprom 03 F2 04”, and the data from address
"getchk" “03 F2” to “03 F5” is read out
*This command gets 4 byte "WW", "XX", "YY", "ZZ".
*Please NEVER forget these 4 byte data!
2.sendchar epw Write EEPROM Type “sendchar epw 03 F2 04 FF FF FF FF”
3.sendchar RST Reset baseset Type “sendchar RST”
4.getchk Read checksum Type “getchk”.
5.sendchar epw Write EEPROM Type “sendchar epw 03 F2 04 WW XX YY ZZ”
*"WW", "XX", "YY", "ZZ" is 4 byte data that already read
from same address.
wreeprom Write the data of EEPROM Type “wreeprom 01 23 45”. “01 23” is address and “45”
is data to be written.
bs_burst Base unit outputs RF power in burst Type"bs_burst"
test mode on antenna 2
tx_high Keep TX power high Type"tx_high"
tx_low Keep TX power low Type"tx_low"
12.2.5. Commands (Handset)

See the table below for frequently used commands.
Command name Function Example

rdeeprom Read the data of EEPROM Type “rdeeprom 00 00 FF”, and the data from address
“00 00” to “FF” is read out.
readid Read ID (RFPI) Type “readid”, and the registered ID is read out.
writeid Write ID (RFPI) Type “writeid 00 18 E0 0E 98”, and the ID “0018 E0 0E
98” is written.
getchk Read checksum Type "getchk"
How to use of 1.rdeeprom Read EEPROM Type “RdEeprom 03 7D 04”, and the data from address
"getchk" “03 7D” to “03 80” is read out
*NEVER forget the read 4 byte data!
2.sendchar epw Write EEPROM Type “sendchar epw 03 7D 04 FF FF FF FF”
3.sendchar RST Reset baseset Type “sendchar RST”
4.getchk Read checksum Type “getchk”.
5.sendchar epw Write EEPROM Type “sendchar epw 03 7D 04 WW XX YY ZZ”
*"WW", "XX", "YY", "ZZ" is 4 byte data that already read
from same address.
weeprom Write the data of EEPROM Type”wreeprom 01 23 45”. “01 23” is address and “45”
is data to be written.
hs_burst Handset outputs RF power in burst test Type"hs_burst"
mode
tx_high Keep TX power high Type"tx_high"
tx_low Keep TX power low Type"tx_low"
49
12.3. Adjustment Standard (Base Unit)

When connecting the simulator equipment for checking, please refer to below.
12.3.1. Bottom View

DC
Oscilloscope
5.5V
Volt
Meter
A
CL2 CL1
Spectrum Analyzer ANT2 ANT1
PNLB1884Z -PA PbF

GRY DCM
C301 VBAT
L1R
DC
3.0A R331 R332
PUR DCP F301 R115 C115
C331 BRN
ORG SPP
C476 C479
D473
R112
C477 C478
C122 C121
D472
L1T TEL
R121
R122 R111
SP L474 L476
C112
C511
C126
C125
C110
R113 C111
SPN VCCA C514 C114 YLW
D113
BLU
C472 C473
C512
C113
C475
C525
R136
VREF C510 Q111

C185
C151 C186
C513
R503
C184 R114
R166
C171
VBG C530 R131
+3.0V Q161
C523
R178
C132
R181 C181
Q652
C120
C173 R133
D153
C124 C123 C163 R172

RSTN
C174 R171
C133
L661
D133
RA151
C521
C666 R176 C175

STM/CKM/P15
C664 R511 R175
C663 C665
L665 VDDC C176

R510
C178
Q171
C152
R152
C611
R612
R606
R605
C661
RA504
L663 R506
C662 C670 R505
UTX URX UGND +5.5V D361
IC601
R601
TMS TCK
IC611
C351
TDI TDO
R604
RTCK CHARGE+ CHARGE-
C601
CHG
A
STM/CKM/P15 Frequency Counter (*1)
* Send command "SFR", then

the frequency output on this TP.
Oscilloscope (*2)
* Start Monitor
Note:
(*1) is referred to No.2 of Check Check Table for RF part (P.37)
(*2) is referred to Power Supply Circuit/Reset Circuit (P.12)
50
12.4. Adjustment Standard (Charger Unit)

12.4.1. Bottom View

Digital
Volt Meter
Charge+
Charge-
12 /2 W
PNLB1922Z
PbF
F1
3.0A
-IG
A
(GND)
DC POWER
DC 5.5 V
51
12.5. Adjustment Standard (Handset)

12.5.1. Component View

PNLB1886Z -PA
KX-TGA410
ANT
AN
T_
TP
Oscilloscope
PbF
Spectrum Analyzer
RECEIVER
VOLT METER
R504
orange
green
C505
R501
C504
40
CD SCL SID D21 D22
C896
CS RESET
C71
C897
C70
C895
C152
C859
C138
C825
D
R806
C814
A8
R561
01 C826
C812
Q5
C81
C22
C
L8
81
09
1
C23
C25
C813
C822 C820
ATSTN C810 C24
C863
C8
R807 C805
ATSTP
R1
C806 C26
C43
RSTN
C
C99
44
TEST C188 X1
C9
C45
C46
C98
CKM/STM
CKM/STM
C7 R23
C17
IC1
C1
R66
R67
8
the frequency output on this TP.
C C2
* Send command "SFR", then
31 0
TDI C40 C C 21
R35
30 C VREF
Frequency Counter (*1)
CHG_CUR R7
29
TMS
L13
CH
G_
R68
CH L14
C34
C
TCK
Oscilloscope (*2)
DE C86
32
G
C
L29
_
41
* Start Monitor
R69 C72
CT
C R33
51
GND_J
RL
TDO D13
R31
R21
C33
R10
C73
C65 VDDC C97
C36 RA4 C13
C127
R64 C64 L9 D14

C10
VBAT_MON C11 C96

C6
E
E_WP
R24
VBG
N
VOLT METER
3.0V
O
C37
H
-P
IC3 R27
RA5
C78 C57
SP
L6
C84
R28
150
R563
orange
E_SDA C172 R34 C12

C58
E_SCL
blue
IC4 3V
C56
R562
C2
Oscilloscope
RA1 Q6
E
C79
C1
RA3 RA2
C121 R4
Q9
C15
C80
R6
Q4
MIC+ +47
MIC Load
C19 R45
1.1 kHz
R8
R2
OSC
SPM MIC+
Q2
Q3 SPP MIC-
+
R9 C150 C4
MIC- 47
URX UTX
GND
DC POWER SUPPLY
VBAT GND
F1
C3
2.6 V 2.34 V
VBAT
BATT+ BATT-
R3 D3
C5
C75 R73
C147
D4
DC VOLT METER
C74 CHG(-)
CHG(+)
R74
C113
Note:
(*1) is referred to No.2 of Check Check Table for RF part (P.37)
(*2) is referred to Power Supply Circuit/Reset Circuit (P.20)
52
12.6. Things to Do after Replacing IC or X'tal

If repairing or replacing EEPROM and X'tal, it is necessary to download the required data such as Programming data or adjustment
data, etc. in memory.
The set doesn't operate if it is not executed.
12.6.1. How to download the data

12.6.1.1. Base Unit
First, operate the PC setting according to The Setting Method of JIG (P.46).
Then download the appropriate data according to the following procedures.
Items How to download/Required adjustment

EEPROM (IC611) Adjusted parameter data is stored in memory. 1) Change the address “0001” of EEPROM to “55” to download
(country version batch file, default batch file, the data.
etc.) 2) Default batch file: Execute the command “default.bat”.
3) Country version batch file: Execute the command
“TG4111US_WW_RevXXX_YYY.bat”. (*1)
4) Clock adjustment
X'tal (X1) System clock Clock adjustment data is in EEPROM, adjust the data again
after replacing it.
1) Apply 5.5V between DCP ad DCM with DC power.
2) Input Command "sendchar sfr", then you can confirm the
current value.
3) Check X'tal Frequency.(13.824 MHz ± 100 Hz).
4) If the frequency is not 13.824 MHz ± 100 Hz, adjust the
frequency of CLK executing the command "sendchar sfr xx xx
(where xx is the value)" so that the reading of the frequency
counter is 13.824000 MHz ± 15 Hz.
Note:
(*1) WW: country code, XXX_YYY: revision number
"WW" and "XXX_YYY" vary depending on the country version. You can find them in the batch file, PNZZ- mentioned in The
Setting Method of JIG (P.46).
53
12.6.1.2. Handset
First, operate the PC setting according to The Setting Method of JIG (P.46).
Then download the appropriate data according to the following procedures.
Items How to download/Required adjustment

EEPROM (IC3) Adjusted parameter data is stored in memory. 1) Default batch file: Execute the command “default.bat”.
(country version batch file, default batch file, 2) Default batch file (remaining): Execute the command
etc.) “TGA410US_DEF_RevXXX_YYY.bat”. (*2)
3) Country version batch file: Execute the command
“TGA410US_WW_RevXXX_YYY.bat”. (*2)
4) Clock adjustment
5) 2.35 V setting and battery low detection
X'tal (X1) System clock 1) Apply 2.6V between BATT+ and BATT- with DC power.
2) Input Command " sendchar sfr", then you can confirm the
current value.
3) Check X'tal Frequency.(13.824 MHz ± 100 Hz).
4) If the frequency is not 13.824 MHz ± 100 Hz, adjust the fre-
quency of CLK executing the command "sendchar sfr xx xx
(where xx is the value)" so that the reading of the frequency
counter is 13.824000 MHz ± 5 Hz.
Note:
(*2) WW: country code, XXX_YYY: revision number
"WW" and "XXX_YYY" vary depending on the country version. You can find them in the batch file, PNZZ- mentioned in The
Setting Method of JIG (P.46).
54
12.7. Frequency Table
Ch. (hex) TX/RX Frequency (MHz)

Channel 0 00 1928.448
Channel 1 01 1926.720
Channel 2 02 1924.992
Channel 3 03 1923.264
Channel 4 04 1921.536
55
13 Miscellaneous
13.1. How to Replace the LLP (Leadless Leadframe Package) IC
Note:
This description is only applied on the model with Shield case.
13.1.1. Preparation
• PbF (: Pb free) Solder
• Soldering Iron
Tip Temperature of 700 °F ± 20 °F (370 °C ± 10 °C)
Note:
We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with less
experience could overheat and damage the PCB foil.
• Hot Air Desoldering Tool
Temperature: 608 °F ± 68 °F (320 °C ± 20 °C)
13.1.2. Caution
• To replace the IC efficiently, choose the right sized nozzle of the hot air desoldering tool that matches the IC package.
• Be careful about the temperature of the hot air desoldering tool not to damage the PCB and/or IC.
13.1.3. How to Remove the IC

1. Heat the IC with a hot air desoldering tool through the P.C.Board.
IC
P.C.Board
Hot Air Desoldering Tool
2. Pick up the IC with tweezers, etc. when the solder is melted completely.
Note:
• Be careful not to touch the peripheral parts with tweezers, etc. They are unstable.
Tweezers, etc.
IC
P.C.Board
When it is hard to melt the solder completely, heat it with a hot air desoldering tool through the IC besides through the
P.C.Board.
Hot Air Desoldering Tools

P.C.Board
3. After removing the IC, clean the P.C.Board of residual solder.
56
13.1.4. How to Install the IC

1. Place the solder a little on the land where the radiation GND pad on IC bottom is to be attached.
Soldering Iron
Land
Solder
P.C.Board
2. Place the solder a little on the land where IC pins are to be attached, then place the IC.
Note:
• When placing the IC, the positioning should be done very carefully.
IC
Soldering Iron
Land
Solder
P.C.Board
3. Heat the IC with a hot air desoldering tool through the P.C.Board until the solder on IC bottom is melted.
Note:
• Be sure to place it precisely, controlling the air volume of the hot air desoldering tool.
IC
P.C.Board
Hot Air Desoldering Tool
4. After soldering, confirm there are no short and open circuits with visual inspection.
57
13.2. How to Replace the Flat Package IC

Even if you do not have the special tools (for example, a spot heater) to remove the Flat IC, with some solder (large amount), a
soldering iron and a cutter knife, you can easily remove the ICs that have more than 100 pins.
13.2.1. Preparation
• PbF (: Pb free) Solder
• Soldering Iron
Tip Temperature of 700 °F ± 20 °F (370 °C ± 10 °C)
Note: We recommend a 30 to 40 Watt soldering iron. An expert may be able to use a 60 to 80 Watt iron where someone with
less experience could overheat and damage the PCB foil.
• Flux
Recommended Flux: Specific Gravity → 0.82.
Type → RMA (lower residue, non-cleaning type)
Note: See About Lead Free Solder (PbF: Pb free) (P.4)
13.2.2. How to Remove the IC

1. Put plenty of solder on the IC pins so that the pins can be completely covered.
Note:
If the IC pins are not soldered enough, you may give pressure to the P.C. board when cutting the pins with a cutter.
2. Make a few cuts into the joint (between the IC and its pins) first and then cut off the pins thoroughly.
3. While the solder melts, remove it together with the IC pins.
When you attach a new IC to the board, remove all solder left on the board with some tools like a soldering wire. If some solder is
left at the joint on the board, the new IC will not be attached properly.
58
13.2.3. How to Install the IC

1. Temporarily fix the FLAT PACKAGE IC, soldering the two marked pins.
*Check the accuracy of the IC setting with the corresponding soldering foil.
2. Apply flux to all pins of the FLAT PACKAGE IC.
3. Solder the pins, sliding the soldering iron in the direction of the arrow.
13.2.4. How to Remove a Solder Bridge

1. Lightly resolder the bridged portion.
2. Remove the remaining solder along the pins using a soldering iron as shown in the figure below.
59
13.3. Terminal Guide of the ICs, Transistors and Diodes

13.3.1. Base Unit
4 5 C
8
(Reverse View)
1 88 67 B
66 4
2 1 1
E
3
22 45
23 44 B1ABDF000017
C0DBEYY00102 C2HBCY000077 PNWI14111MEH B1ABDM000001 B1ACGP000008
Cathode
E Cathode
C Anode
B Anode
DSC7003S0L PQVDMD5S 1SS355 PQVDPTZT2530 B0ECKM000008
Cathode
ψ
ψ
Anode
B0DDCD000001
13.3.2. Handset
5 C
(Reverse View) 8 654
88 67 B
66 3
4
1 1 1 2 E
22 45 B1ADCF000040
23 44 B1GBCFYY0010
C2HBCY000081 PNWIGA410MER C0DBZYY00357 B1ABDF000017 B1ABGE000011
Cathode Cathode
(Reverse View) (Reverse View)

Anode Cathode Cathode
Anode Anode Anode
MA8043 B0DDCD000001 B3AEB0000146 B3ACB0000216
60
14 Schematic Diagram
14.1. For Schematic Diagram
14.1.1. Base Unit (Schematic Diagram (Base Unit_Main))
Notes:
1. DC voltage measurements are taken with voltmeter from the negative voltage line.
Important Safety Notice:

Components identified by mark have special characteristics important for
safety. When replacing any of these components, use only the manufacture's
specified parts.
2. The schematic diagrams may be modified at any time with the development of new technology.
14.1.2. Handset (Schematic Diagram (Handset_Main))

Notes:
1. DC voltage measurements are taken with an oscilloscope or a tester with a ground.
14.1.3. Charger Unit (Schematic Diagram (Charger Unit))

Notes:
1. DC voltage measurements are taken with voltmeter from the negative voltage line.
Important Safety Notice:

Components identified by mark have special characteristics important for
safety. When replacing any of these components, use only the manufacture's
specified parts.
61
14.2. Schematic Diagram (Base Unit_Main)

ANT1
R892
470
C892
R807 (1)
RXON SPN
5p 470
ANT1 C822 C827 (2)
W 0.2mm GND 10p 10p
SPP
2
10p
10p
L mm
D473 NC
D472 NC
A K
A K
1st layer
1
GND GND GND RXn
C478
C477
CL1 C894
C826
10p
10p
W 0.2mm
L 10mm
C863
C820
1.5p
1st layer 1.5p RXp
GND
GND GND
TXp
ANT2 DA801
1 2 C805
C895 L809 C812
2
3 3 2.7p
2 1
1
GND 1.2p 7.5n 0.9p GND

DA802
CL2 C893 C896 C859
2.2p 2.2p C810 TXn ANT2
C813
10p 2.4p
2p
TXON
W 0.2mm W 0.2mm GND TXn
L 10mm GND
L mm W 0.15mm TXp
1st layer 1st layer GND GND L 20mm RXp
C806
3rd layer GND 2.7p RXn
GND
R806 RXON
W 0.15mm W 0.15mm GND VBAT ANT1
C825 470
R891
470
GND C891 L 5.0mm L 5.0mm 10p

5p 1st layer 1st layer W 0.2mm
L 10.0mm TO RF BLOCK
GND 1st layer C811
VBAT
GND
10p
(3)
GND (4)
TXON (5)
(6)
ANT2
*WBX02 10pin +3.0V
PARALLEL WIRE
*Q652 NC * BBIC initialization ψ stand-by status 45
* W hen "SFR" command 46 TXp
AP1 LCD_BLTL
4 47 RXp
*C666 NC 3 is executed, 13.824MHz 48 RXn
10
2 49 GND_RF
NC2
LCD_BLT1
LCD_BLTR frequency will be output. GND 50 TRSW_p
L661 NC 1 51 ANT_n
LCD_GND 5 LCD_RST
52 ATST_n
LCD_RST +3.0V
L665 NC LCD_CS 53 ATST_p
LCD_CS
L664 NC LCD_CD 54 TEST
LCD_CD RSTN 55 RSTN
C515
L662 NC SPI2_DO
K1u
LCD_SIO
L663 NC SPI2_CLK 56 NC
*R507
R512
LCD_SCL
NC
NC
C516 0.1u 57 VCC_VCO
LCD_VDD
58 GPIO[27]
LCD_BLT2 STM/CKM/P15
C517 0.1u 59 VDDUSB
NC
NC
NC
NC
NC
1 60 DM_USB/GPI28
C518 0.1u 61 DP_USB/GPI29
C662
C661
C663
C665
C664
RA501 33
JTAG_TDO 62 VDDC1
MSG_LED JTAG_TDI 5 4 63 JTAG_TDO
4 JTAG_TCK 6 3 64 JTAG_TDI
3
JTAG_TMS 7 2 65 JTAG_TCK
2 ANS_LED JTAG_RTCK 8 1 66 JTAG_TMS
VBAT JTAG_RTCK
1
8
7
6
5
5 RA502 VDDC
10 NC 10k
*Q651 KEYS_E +3.0V
1
2
3
4
KEYS_E
KEYS_C
KEYS_C
KEYIN2
KEYIN2
KEYS_D
KEYS_D
KEYIN3 (7)
KEYIN3
KEYIN1
KEYIN1
LED_VDD
NC
MSG_LED *R652 NC
ANS_LED *R651 NC
NC
NC
NC
NC
NC
NC
NC
1
C652
C654
C651
C656
C653
C655
C660
*SW1
2 1 C670
(8)
NC
UTX
URX
JTAG_TDO
RTCK R502 JTAG_RTCK
JTAG_TCK
JTAG_TMS
JTAG_TDI
LOCATOR
*WBX01 10pin
PARALLEL WIRE
AP1
33
UGND
URX
TDO
TMS
UTX
TCK
TDI
NC: No Components
62
*R604
(8)
(7)
(6)
(5)
(4)
(3)
(2)
(1)
NC
EEP_SCL 67 44
GPIO[0]/SCL_IIC TXn
EEP_SDA 68 43 C508 10p C479 10p
2
GPIO[1]/SDA_IIC TRSW_n
EEP_WP 69 42
GPIO[2] ANT
LCD_BLTR 70 41 C514 0.1u C476 10p
NC
GPIO[3] VCC_FE
1 *CS
MSG_LED 71 40 C513 K2.2u
GPIO[4] VDD_IF NC
*C601
ANS_LED 72 C512 0.1u
X501
DO/IO1
GPIO[5] VCC_IF 39 C331
13.824M
R509 NC
SPI_DI 73 38 C511 10u
GPIO[6] VDD_APU
*IC601
SPI_DO C519 74
NC
GPIO[7] VBAT_APU 37 C510 K1u
4 GND DI/IO0
3 *WP/IO2 CLK
*HOLD/IO3
VCC
SPI_CLK 0.1u 75 36 C530 10p R332 R331
5
6
7
8
GPIO[8] XIN C509 12p
76
+5.5V
VDDIO1 XOUT 35 33k 68k
SPI_CS 77 34
GPIO[9] DCINS
78 33 C473 NC
+3.0V
LCD_RST GPIO[10] PWM0
GND
KEYIN1 R655 100 79 32 C522 10p C475 NC
R601 GPIO[11] PWM1
KEYIN2 *R656 NC 80 31 L476 NC
*IC501
GPIO[12] SPOUTP
NC KEYIN3 *R657 NC 81 30 C507 K2.2u
GPIO[13] VCCPA
SPI_CLK LCD_BLTL 82 29 C472 NC L474 NC
GPIO[14] SPOUTN
SPI_DO LCD_CD 83 28
GPIO[15] LOUT
SPI_DI SPI2_DO 84 27 C185
GPIO[16] HSSPOUTP
SPI_CS SPI2_CLK 85 26
GPIO[17] MPWR NC
C520 86 25
VDDIO2 HSMIP
LCD_CS 0.1u 87 24
GPIO[18] HSMIN
88 GPIO[19] MIP 23
C120
1000p
C178 0.022u C176 10u
89
E
C
C124 10p R171 R175 R176
3 A2
2 A1
1 A0
GPIO[20]
GPIO[21]
GPIO[22]
GPIO[23]
GPIO[24]
GPIO[25]
GPIO[26]
VDDC2
COREOUT
VBAT
DOUBCAPN1
DOUBCAPN
DOUBCAPP
DOUBCAPP1
DOUBOUT
DCIN0/LIN0
DCIN1
DCIN2
DCIN3/LIN1
VREF
VCCA
MIN
+3.0V
22 100
4 VSS
560
C123 10p
1
2
3
4
5
6
8
9
10
13
14
15
16
17
18
19
20
21
22
B
C174
R172
C164 NC
VREF
IC611
Q171
C611 0.1u
VCCA
NC
64K EEPROM
SDA 5
SCL 6
WP 7
VCC 8
VCCA
100k
C175 1000p
C161 10u
VDDC
12 C504 1u
11 C521 1u
VDDC
7 C524 NC
R501
10u
1u
+3.0V
10u
C126
C506
C505
910
R612 R505 2.2k 10

R160
C173
K0.22u
R606
R605
+3.0V
C503 C171 C167 1000p
10k NC
10u
0.1u
+3.0V
R506 NC C125 C186 0.022u
C502 C501
R165 27k
3
4
C523 NC
3.3k
3.3k
EEP_SCL R503 NC R166 NC
1.2V
NC 10p
EEP_SDA C172 NC R178 1k
R122
R121
C168 NC
NC
EEP_WP
+3.0V
C151 10p
R181
2.7k
R164
C133 NC C181
VBG
C165 NC
E
R167 27 R163
2 68
C
2
1
10k
C525 NC D153NC NC
R510
1 RA504
A K
1k
(4532) 12
100n
L501
VDDC
B
D133
Q161
RA151
3
4
NC
R136
R511
100k
100k
R161
A K
C184
K1.0u
C163 NC
R162
GND
URX
UTX
KEYS_C
KEYS_D
KEYS_E
BELL
HOOK
390k C122 680p
390k C121 680p
63
27k
100k
R151
BELL
R152 470k
HOOK
Tx
C342 0.1u R114 C152 0.01u

+3.0V
6.3 47k
C341 330u
C142 K0.01u
C Q111
B
D113
3.0V
C343 10p A K
C110 D143 NC
R321 R322 C113 NC
R145 2.2k D142 30V
F140 F100 K0.68u
C111
GND
R113 0.047u R111 100k AK
12
11
VBAT VBAT
R144 NC
10k
B
C112 R112 100k C

Q142
R142
0.047u
1 2 3 4 5
1
4 OUT2
10 9 8 7
E
C
B
ADJ
Q141
ZA1 NC
2.7k (3216) E
Caller ID
IC302
Bell
C114
6
2 OUT1 IN 3
NC
100k
R141
C322 10p
R133 330k R131 10M
C321 1u
C132 K0.01u
4
3
D361 D362
27k
K A R372 R371
R115
C115
AK
0.22u
D101
NC 1SR154 1 1
+5.5V
1
2
C102 680p
C101 680p
C306
+5.5V
100u
C301
Rx
33u
33u
L102
L101
SA103
HAK_CL1
NC
8XX : RF
1 2
5XX : BBIC
REFERENCE
NC
4XX : MIC, SP
7XX : FOR DK
SA101
1XX : TEL LINE
1 2
C351
!
22
3.0A
270V
F301
1u
GAP
P101
3XX : POWER, CHARGE
DCP
DCM
NC: No Components
L1T
(GREEN)
L1R
CHARGE-
(YELLOW)
KX-TG4111/4112ME SCHEMATIC DIAGRAM (Base Unit_Main)

CHARGE+
6XX : FLASH, EEPROM, KEY, LCD
14.3. Schematic Diagram (Handset_Main)

Charge Current
VBAT VBAT
!
F1
BATT+
C80
39p
2.5A
6.3 220u
6.3 220u
6.3 220u
C10
C78
C84
39p
39p
NC
NC
C1
C2
C3
C4
C150
0.1u
GND
GND GND GND GND GND GND GND CHG_CUR
BATT-
To Battery
R45
C15
39p
0.1
3.0V
C172
GND When on Charge 0.1u
8
7
6
5
RA5 8 1
3.3k VCC A0
EEP_WP E_WP 7
1
2
3
4
WP A1 2
EEP_SCL E_SCL 6
SCL 32K A2 3
EEP_SDA E_SDA 5
1s SDA VSS 4
IC3 GND
Q2
* BBIC initialization ψ stand-by status
C19
* W hen "SFR" command
is executed, 13.824MHz TXON
1000p
R2 frequency will be output. TXn
TXp
30k 3.0V TO RF BLOCK RXp
30k
R9
RXn
CHG(+) R8 Q3 RXON
R66 10k
R67 10k
R68 10k
R69 10k
3.3
VDDC VBAT
K0.1u
GND
C147
100k
To Charge
1.5k
47k
Q4
NC
C5
R3
R7
R4
Terminal TDI
TMS C45 K0.1u C46 10p
TCK K0.1u C43
TDO RSTN
CHG(-)
GND GND GND GND GND_J
C44
3.0V
CKM/STM
10k
R6
ATSTN
ATSTP
TEST
GND
K1u
Q9
GND
C121
NC
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
VBAT
JTAG_RTCK
JTAG_TMS
JTAG_TCK
JTAG_TDI
JTAG_TDO
VDDC1
DP_USB/GPI29
DM_USB/GPI28
VDDUSB
GPIO[27]
VCC_VCO
NC
RSTN
TEST
ATST_p
ATST_n
ANT_n
TRSW_p
GND_RF
RXn
RXp
TXp
GND GND
CHG_CTRL
RESET Hi-Z CHG_CTRL EEP_SCL 67 44
GPIO[0]/SCL_IIC TXn
CHG_DET EEP_SDA 68
GPIO[1]/SDA_IIC TRSW_n 43
CHG_DET EEP_WP 69 42 C22 k0.1u
GPIO[2] ANT
HEADSET_DET 70
GPIO[3] VCC_FE 41
STB_D 71 40
C25 K2.2u
GPIO[4] VDD_IF
LCD_RESET 72 39 C23 0.1u
GPIO[5] VCC_IF
73 38 C26 10u
GPIO[6] VDD_APU
LCD_SID 74 37 C24
GPIO[7] VBAT_APU
LCD_SCL C40 k0.1u 75
GPIO[8] XIN 36 1u (1)
3.0V 76
VDDIO1 XOUT 35
(2)
LCD_CS
LCD_CD GND
77
78
GPIO[9]
GPIO[10]
IC1 DCINS
PWM0
34
33 VBAT (3)
2.2k
R64
KIN_1
UTX KIN_2
79
80
GPIO[11] PWM1 32
31
(4)
UTX
URX KIN_3 81
GPIO[12] SPOUTP
30
(5)
URX GPIO[13] VCCPA C188
KIN_4 82 29
GND GPIO[14] SPOUTN (6)
C64
C65
NC
NC
KIN_5 83 28 1u
C41 84
GPIO[15] LOUT
27
(7)
GND k0.1u GPIO[16] GND HSSPOUTP (8)
STB_A 85 26
GPIO[17] MPWR
86 25 GND
GND VDDIO2 HSMIP
STB_B 87 24
GPIO[18] HSMIN
DOUBCAPN1
DOUBCAPP1
GND
DOUBCAPN
DOUBCAPP
URX
DCIN0/LIN0
DCIN3/LIN1
88 23
GPIO[19] MIP
COREOUT
DOUBOUT
GPIO[20]
GPIO[21]
GPIO[22]
GPIO[23]
GPIO[24]
GPIO[25]
GPIO[26]
C17 10p
VDDC2
DCIN1
DCIN2
89
VCCA
VREF
VBAT
MIN
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
10p
UTX
1u C21 1u
C18
STB_C VREF
R23
10
(9)
C20 10u
STB_E
C31 1u
C51
CP_OFF
10u
C29
GNDA
BELL_LED
VBAT_MON
SOFT1 TALK OFF VBAT KEY_LED C7
UP
GND
FLASH:1.8V / ROM:1.2V VDDC 3.0V 3.0V NC

KIN_5 GNDA
VDDC
DOWN * 7 4 1
VBAT
C30 10u
GNDA GND
C13 K0.1u RA4
C11 K0.1u 3.3k

C32 1u
4.0V
L6
100k 100k
R31 R33
KIN_4
MENU 0 8 5 2 IC4 3.0V C36 0.1u
VBG
1 6
VOUT CP
1.0uF
KIN_3
C56
1.0uF
C57
LEFT SHARP 9 6 3 2 5
GND VCC
1.2V
100k
0.1u
R21
C33
CHG_CUR
KIN_2 3 4
SHD CN
RIGHT SOFT2 SP FLASH
1.0uF
C58
(10)
C34
L29
39p
KIN_1
3.0V (11)
CHG_CUR
CP_OFF
STB_C
STB_D
STB_A
STB_B
STB_E
(12)
KEY_LED
BELL_LED
LCD_CS
LCD_RESET
LCD_CD
LCD_SCL
LCD_SID
4.0V 3.0V
3.0V
R562
R563
NC
0
LCD_BACKLIGHT KEY BACKLIGHT

Amber Amber 3.0V
LED5
LED2
LED3
LED4
LED6
LED1
LED7
LED8
LED9
RESET
R504
LED12
SCL
CD
CS
SID
NC
C138
R501 C504
NC
C505
BELL LED
K1u
3
(Amber)
4
NC 1u
5
8
7
6
4
3
2
1
RA1 RA2 RA3

560
R561
GND 180 560

220
5
6
7
8
1
2
3
4
1
2
CN3_C
CN3_C
CN3_C
CN3_C
CN3_C
CN3_C
CN3_C
CN3_C
CN3_C
CN3_C
CN3_C
CN3_C
GND
Q5
1
10
11
12
Q6
100p
C81
100p
C79
GND
OTP_PWR
CS1
RES
A0
SCL
SI
VDD
VDDA
VSS
V0
GND
GND GND
GND GND To B/W LCD Unit
NC: No Components
64
R807
RXON
RF BLOCK
C822
470
10p
W 0.15mm
L 20mm W 0.15mm/L 7mm
3rd layer GND W 0.5mm /L 5mm
C826 1st layer
ANT-Short-GND RXn
C863
C820
1.8p
1.8p
ANT-Short 10p
RX_RF
RXp
GND
ANT_TP
C895 2
GND 1.3p C812 L809 GND
3 TXp
1 8.2n
C805
C813
2.4p
1p
1.6p
DA801
C896
C859
1.8p
C810
2p
2.5p
W 0.15mm
L 20mm TX_RF
3rd layer GND GND
C897
GND
24p
GND R806 W 0.2mm TXn
C806
2.4p
L 10.0mm
W 0.2mm 470 1st layer GND
L 3.8mm
C825
GND GND
10p
1st layer GND
W 0.15mm VBAT
L 6.2mm
1st layer GND
C811
C814
100p
NC
GND GND
TXON
D10P
R1
C8
X1
13.824M L13 180n
(1) GND NC +
(2) CHG_DET L14 NC SP-PHONE_SPEAKER
12p
C9
(3) -
CHG_CTRL SP-phone RX
4.3V
4.3V
C73
C72
D14
D13
10p
10p
(4) GND
Speakerphone_SP+
(5)
Speakerphone_SP-
(6) RECEIVER- C86 22u R10 10 SPP GND GND GND GND
C152
(7) RECEIVER+ K1000p
(8) +
K1000p
C127
L9 RECEIVER
0 -
D10p
D10p
C96
C97
C98
C99
NC
NC
4.3V
4.3V
C71
C70
D22
D21
Handset RX
NC
NC
GNDA SPM
GND GND GND GND
GNDA GND
R24 MIC POWER
(9)
390
NC
C6
C37
10u
GNDA GNDA
3.0V
100k
R35
HEADSET_DET
2.2k
R27
MIC+ C113
MIC+ R73 33 NC
(10) 1 AP1
R74 33 MIC
(11) 2
C75 NC
C74 NC
MIC-
D4 NC
D3 NC
MIC-
2.2k
C12
R28
10u
(12) Handset TX GNDA GNDA GNDGND

SP-phone TX
R34
390
ZA1
GNDA
NC Test Pattarn for Carbon

CARBON_CL1
GND
NC: No Components
KX-TGA410 SCHEMATIC DIAGRAM (Handset_Main)
65
14.4. Schematic Diagram (Charger Unit)

!
1 F1 R1 TP1
2 6.8 (2W)
J1
TP2
SCHEMATIC DIAGRAM (Charger Unit)
66
15 Printed Circuit Board

15.1. Circuit Board (Base Unit_Main)
ANT1 ANT2
C894
C322 C893
C321
IC302
C341
C306
C343
L101
L102
R321
R322
P101 GRY
NC2 KEYS_E
C342
C102
LCD_BLT1 KEYS_C DC
LCD_GND KEYIN2
PUR
C101
SA103
D101 LCD_RST KEYS_D

SA101
BRN LCD_CS KEYIN3
DA802
LCD_CD KEYIN1
C891
X501 LCD_SIO LED_VDD
ORG
R141
TEL R891 LCD_SCL NC

MSG_LED SP
C142
LCD_VDD
C825
D142
Q141
C508 C509 LCD_BLT2 ANS_LED

R806 R509 BLU
R142
YLW
D143
C811
R371
C806
R501
DA801
R160 C896
C507
C167
C164
R165
R162
C522
L809 C812 C810 C505
C895
Q142
C805 C506
C813
R144 C165 R161
C161
C820
C827
C859 C826 C172

R164
C863
WBX02
WBX01
C503
C892 C822
C655
IC501
R145 R807
L501
C504
C516
C653
R163
R892 C515 C501

C168
C517
R151
R167
C518 C524 C656

C651
R512
C502
C520
C654
PbF R507
L664
RA501 C519 1
PNLB1884Z -PA
L662
ZA1 C660
RA502 R652
KX-TG41xxH
Q651
R657
R656 R651
R502
D362 C652
R655
HAK_CL1
R372 SW1
KX-TG4111/4112 CIRCUIT BOARD (Base Unit_Main (Component View))
67
15.1.2. Bottom View

VBAT
CL2 CL1
ANT2
ANT1
PNLB1884Z -PA PbF

GRY DCM
C301 VBAT
L1R
DC
3.0A R331 R332
PUR DCP F301 R115 C115
C331 BRN
ORG SPP
C476 C479
D473
R112
C477 C478
C122 C121
D472
L1T TEL
R121
R122 R111
SP L474 L476
C112
C511 C126
C125
C110
R113 C111
SPN VCCA C514 C114 YLW
D113
BLU
C472 C473
C113
C475 C512
C525
R136
VREF C510 Q111

C185
C151 C186
C513
C184 R114
R503
R166
C171
VBG C530 R131
+3.0V Q161
C523
R178
+3.0V C132
R181 C181
Q652
C120
C173 R133
D153
C124 C123 C163 R172

RSTN
C174 R171
C133
L661
D133
RA151
C521
C666 R176 C175

STM/CKM/P15
C664 R511 R175
STM/CKM/P15
C663 C665
VDDC L665 VDDC C176

R510
C178
Q171
(13.824MHz)
C152
R152
C611
R612
R606
R605
C661
RA504
L663 R506
C662 C670 R505
UTX URX UGND +5.5V D361
IC601
R601
TMS TCK
IC611
C351
TDI TDO
R604
RTCK CHARGE+ CHARGE-
C601
CHG
A
UTX URX GND
For JIG
KX-TG4111/4112 CIRCUIT BOARD (Base Unit_Main (Bottom View))
68
15.2. Circuit Board (Handset_Main)

PNLB1886Z -PA
KX-TGA410
ANT-TP
AN
T_ ANT-GND
TP
PbF
RECEIVER
R504
orange
green
C505
R501
C504
CD SCL SID D21 D22
C896
CS RESET
C71
C897
C70
C895
C152
C859
C138
C825
D
R806
A8 C814
R561
01 C826
C812
Q5
C81
C22
C
L8
81
09
1
C23
C25
C813
C822 C820
ATSTN C810 C24
C863
C8
R807 C805
ATSTP
R1
C806 C26
C43
RSTN
C
C99
44
TEST C188 X1
C9
C45
C46
CKM/STM CKM/STM
C98
C7 R23 C17
(13.824 MHz)
IC1
C1
R66
R67
8
C C2
31 0
C C 21
TDI C40
R35
VREF
30 C
CHG_CUR R7
29
TMS
L13
CH
G_
R68
CH L14
C34
C
TCK
DE C86
32
G
C
L29
_
41
R69 C72
CT
C
51 R33
GND_J
RL
TDO D13
R31
R21
C33
R10
C73
C65 VDDC C97

C36 RA4 C13
C127
R64 C64 L9 D14

C10
3.0V VBAT_MON C11 C96

C6
E
E_WP
R24
VBG
N
(output) 3.0V
O
C37
H
-P
IC3 R27
RA5
C78 C57
SP
L6
C84
R28
R563
orange
C58 E_SDA C172 R34 C12

E_SCL
blue
IC4 3V
C56
R562
C2
RA1 Q6
E
C79
C1
RA3 RA2
C121 R4
Q9
C15
C80
R6
Q4 SP+
C19 R45
SP-
R8
R2
SPM MIC+ MIC+
Q2
Q3 SPP MIC- MIC-
R9 C150 C4
URX for signal communication ji

URX UTX UTX
VBAT GND GND
F1
C3
VBAT
BATT+ BATT-
R3 D3
C5
C75 R73
C147
D4
C74 CHG(-)
CHG(+)
R74
CHG (+) C113 CHG (-)
KX-TGA410 CIRCUIT BOARD (Handset_Main (Component View))
69
15.2.2. Bottom View
LED12
CN3_C
LED9
LED8
LED7
SOFT1 MENU SOFT2
UP
TALK OFF
LED2 LEFT RIGHT LED5
SP DOWN FLASH
1 2 3
LED1
LED6
4 5 6
7 8 9
LED3
LED4
0 #
MIC
A
KX-TGA410 CIRCUIT BOARD (Handset_Main (Bottom View))
70
15.3. Circuit Board (Charger Unit)

R1
J1
A
CIRCUIT BOARD (Charger Unit (Component View))
15.3.2. Bottom View
PNLB1922Z
PbF
F1
3.0A
-IG
CIRCUIT BOARD (Charger Unit (Bottom View))
71
16 Exploded View and Replacement Parts List

16.1. Cabinet and Electrical Parts (Base Unit)
1
A PCB1
6
A
8
7
9
Ref.No. Figure
10
A A
2.6 x 8 mm
72
16.2. Cabinet and Electrical Parts (Handset)
CUSHION RUBBER
*STICK IT WITHIN THE FRAMEWORK ON P.C.B.
E105
E107
E103
104
E101(*1) E102
E106
103 105
102
E104
106 PCB100
MIC100
E108
E109
107
101
108
114
113 116
115 (*3)
111 (*2)
110
109
B
112
Battery cover
Ref.No. Figure
Spacer (No.115)
B Stick it between
Ǿ28 mm ribs.
Put it in the center.
Note:
(*1) This cable is fixed by welding. Refer to How to Replace the Handset LCD (P.45).
(*2) The rechargeable Ni-MH battery HHR-4MRT is available through sales route of Panasonic.
(*3) Attach the SPACER (No. 115) to the exact location described above.
73
16.3. Cabinet and Electrical Parts (Charger Unit)
200
200-1
PCB200
200-2
200-3
200-4
74
16.4. Accessories
A1 A2 P1, P2 (*1)
Note:
(*1) The illustrations differ from the actual gift box and cushion.
75
16.5. Replacement Parts List 16.5.1.2. Main P.C. Board Parts

1. RTL (Retention Time Limited) Note:
(*1) When replacing IC502, IC601, IC611 or X501, make
Note:
The “RTL” marking indicates that its Retention Time is the adjustment using PNZZTG4131ME. Refer to How to
Limited. download the data (P.53) of Things to Do after Replacing
When production is discontinued, this item will IC or X'tal.
continue to be available only for a specific period of
time. Safety Ref. Part No. Part Name & Description Remarks
No.
This period of time depends on the type of item, and
PCB1 PNWP14111MEH MAIN P.C.BOARD ASS'Y
the local laws governing parts and product retention. (RTL)
At the end of this period, the item will no longer be (ICs)
available. IC302 C0DBEYY00102 IC
IC501 C2HBCY000077 IC (*1)
2. Important safety notice
IC611 PNWI14111MEH IC(EEPROM)(*1)
Components identified by the mark indicates special (TRANSISTORS)
characteristics important for safety. When replacing any Q111 B1ABDF000017 TRANSISTOR(SI)
of these components, only use specified manufacture's Q141 B1ACGP000008 TRANSISTOR(SI)
Q142 B1ABDM000001 TRANSISTOR(SI)
parts.
Q161 DSC7003S0L TRANSISTOR(SI)
3. The S mark means the part is one of some identical parts. Q171 B1ABDF000017 TRANSISTOR(SI)
For that reason, it may be different from the installed part. (DIODES)
4. ISO code (Example: ABS-94HB) of the remarks column D101 PQVDMD5S DIODE(SI)
shows quality of the material and a flame resisting grade D113 1SS355 DIODE(SI) S
D133 1SS355 DIODE(SI) S
about plastics.
D142 PQVDPTZT2530 DIODE(SI) S
5. RESISTORS & CAPACITORS D362 B0ECKM000008 DIODE(SI)
Unless otherwise specified; DA801 B0DDCD000001 DIODE(SI)
All resistors are in ohms (Ω) k=1000Ω, M=1000kΩ DA802 B0DDCD000001 DIODE(SI)
(COILS)
All capacitors are in MICRO FARADS (µF) p=µµF
L101 PQLQXF330K COIL S
*Type & Wattage of Resistor L102 PQLQXF330K COIL S
Type L501 G1CR10J00010 COIL
L809 G1C7N5JA0044 COIL
ERC:Solid ERX:Metal Film PQ4R:Chip (RESISTOR ARRAYS)
ERDS:Carbon ERG:Metal Oxide ERS:Fusible Resistor
RA151 D1H410220001 RESISTOR ARRAY
ERJ:Chip ER0:Metal Film ERF:Cement Resistor
RA501 EXB28V330 RESISTOR ARRAY
Wattage RA502 EXB28V103 RESISTOR ARRAY
10,16:1/8W 14,25:1/4W 12:1/2W 1:1W 2:2W 3:3W RA504 D1H468020001 RESISTOR ARRAY
*Type & Voltage Of Capacitor (VARISTOR)
Type SA101 J0LF00000048 VARISTOR (SURGE
ABSORBER)
ECFD:Semi-Conductor ECCD,ECKD,ECBT,F1K,ECUV:Ceramic (RESISTORS)
ECQS:Styrol ECQE,ECQV,ECQG:Polyester R111 PQ4R10XJ104 100k S
ECUV,PQCUV, ECUE:Chip ECEA,ECST,EEE:Electlytic R112 PQ4R10XJ104 100k S
ECQMS:Mica ECQP:Polypropylene R113 ERJ3GEYJ103 10k S
Voltage R114 ERJ3GEYJ473 47k S
ECQ Type ECQG ECSZ Type Others R115 ERJ12YJ273U 27k
ECQV Type R121 ERJ3GEYJ394 390k S
R122 ERJ3GEYJ394 390k S
1H:50V 05:50V 0F:3.15V 0J :6.3V 1V :35V
2A:100V 1:100V 1A:10V 1A :10V 50,1H:50V R131 PQ4R18XJ106 10M S
2E:250V 2:200V 1V:35V 1C :16V 1J :16V R133 ERJ3GEYJ334 330k S
2H:500V 0J:6.3V 1E,25:25V 2A :100V R136 ERJ2GEJ104 100k S
R142 PQ4R18XJ272 2.7k S
16.5.1. Base Unit R145 ERJ2GEJ222 2.2k S
R151 ERJ2GEJ104 100k S
16.5.1.1. Cabinet and Electrical Parts R152 ERJ2GEJ474X 470k S
R160 ERJ3GEYJ911 910 S
Safety Ref. Part No. Part Name & Description Remarks
No. R162 ERJ3GEYJ273 27k S
1 PNKM1194V1 CABINET BODY PS-HB R163 ERJ12YJ120 12
R164 ERJ3GEYJ272 2.7k S
2 PNKE1090Z1 CASE, CHARGE TERMINAL PS-HB
3 PNJT1064Z CHARGE TERMINAL R165 ERJ3GEYJ273 27k S
4 PNBC1360Z1 BUTTON, LOCATOR ABS-HB R167 ERJ12YJ270 27
R171 ERJ2GEJ220 22 S
5 PNLA1048Z ANTENNA
6 PNHR1387Z GUIDE, JACK PS-HB R172 ERJ2GEJ104 100k S
7 PQJJ1T039L JACK, MODULAR R175 ERJ2GEJ561 560 S
R176 ERJ2GEJ101 100 S
8 K2ECYZ000001 JACK, DC
R178 ERJ2GEJ102 1k S
9 PNKF1145Z1 CABINET COVER PS-HB
10 PQHA10023Z RUBBER PARTS,FOOT R321 ERJ2RKF1400 140
CUSHION R322 ERJ2RKF1000 100
R331 ERJ3EKF6802 68k
R332 ERJ3EKF3302 33k
76
Safety Ref. Part No. Part Name & Description Remarks Safety Ref. Part No. Part Name & Description Remarks
No. No.
R371 ERJ12YJ1R0 1 C611 ECUE1A104KBQ 0.1
R372 ERJ12YJ1R0 1 C805 F1G1H2R7A480 2.7p
R501 ERJ3GEYJ100 10 S C806 F1G1H2R7A480 2.7p
R502 ERJ2GEJ330 33 S C810 F1G1H2R4A480 2.4p
R505 ERJ2GEJ222 2.2k S C811 ECUE1H100DCQ 10p S
R510 ERJ2GEJ103 10k S C812 F1G1HR90A480 0.9p
R605 ERJ2GEJ332 3.3k S C813 F1G1H2R0A480 2p
R606 ERJ2GEJ332 3.3k S C820 F1G1H1R5A480 1.5p
R612 ERJ2GEJ103 10k S C822 ECUE1H100DCQ 10p S
R655 ERJ2GEJ101 100 S C825 ECUE1H100DCQ 10p S
(CAPACITORS) C891 F1G1H5R0A480 5p
C101 F1K2H681A008 680p C892 F1G1H5R0A480 5p
C102 F1K2H681A008 680p C893 ECUE1H100DCQ 10p S
C111 F1J2A473A024 0.047 C894 ECUE1H100DCQ 10p S
C112 F1J2A473A024 0.047 C895 F1G1H1R2A480 1.2p
C113 PQCUV1A684KB 0.68 C896 F1G1H2R2A480 2.2p
C115 F1L2E2240004 0.22 (OTHERS)
C120 ECUE1H102KBQ 0.001 P101 D4DAY220A022 THERMISTOR (POSISTOR)
C121 F1K2H681A008 680p F301 K5H302Y00003 FUSE
C122 F1K2H681A008 680p X501 H0J138500011 CRYSTAL OSCILLATOR (*1)
C123 ECUE1H100DCQ 10p SW1 K0H1BA000259 SPECIAL SWITCH
C124 ECUE1H100DCQ 10p
C132 ECUV1H103KBV 0.01 16.5.2. Handset
C142 ECUV1H103KBV 0.01
C151 ECUE1H100DCQ 10p 16.5.2.1. Cabinet and Electrical Parts
C152 ECUE1C103KBQ 0.01
C161 EEE1HA100SP 10
C167 ECUV1H102KBV 0.001 Safety Ref. Part No. Part Name & Description Remarks
C171 ECUV1C223KBV 0.022 No.
C173 ECUV1A224KBV 0.22 101 PNGP1137Z1 PANEL, LCD PMMA-HB
C175 ECUE1H102KBQ 0.001 102 PNYE1041Z TAPE, DOUBLE SIDED
C176 PQCUV0J106KB 10 103 PNKM1191Z1 CABINET BODY ABS-HB
C178 ECUV1C223KBV 0.022 104 PNHR1391Z OPTIC CONDUCTIVE PARTS, PS-HB
LED LENS
C184 ECUV1A105KBV 1
105 L0AD01A00026 RECEIVER
106 PNYE1029Z SPACER, CUSHION LCD
C306 F2G1C1010034 100
107 PNBC1354Z1 BUTTON, NAVIGATOR KEY ABS-HB
C321 ECUV1A105KBV 1
108 PNJK1113W KEYBOARD SWITCH
109 PQHR11315Z GUIDE, SPEAKER ABS-HB
C341 F2G0J3310025 330
110 L0AA02A00095 SPEAKER
C342 ECUE1A104KBQ 0.1
111 PQHS10784Y SPACER, SPEAKER NET
112 PNJC1018Z BATTERY TERMINAL
C351 ECUV1C105KBV 1
113 PNKF1134Z1 CABINET COVER ABS-HB
114 PNKE1093Z1 COVER, RUBBER GRIP
115 PNHS1079Z SPACER, BATTERY
116 PNKK1053Z1 LID, BATTERY ABS-HB
C502 ECJ1VB0G106M 10 S
16.5.2.2. Main P.C. Board Parts
C503 ECJ1VB0G106M 10 S Note:
C504 ECUE0J105KBQ 1 (*1) Reconfirm the model No. written on the handset's name
C505 ECJ1VB0G106M 10 S plate when replacing PCB100. Because the model No. of
C506 ECUV1A105KBV 1
the optional handset may differ from the included handset.
C507 ECUV1A225KBV 2.2
(*2) When replacing IC3 or X1, make the adjustment
C509 ECUE1H120JCQ 12p using PNZZTG4131ME. Refer to Handset (P.54) of Things
C510 ECUV1A105KBV 1 to Do after Replacing IC or X'tal.
C511 ECJ1VB0G106M 10 S (*3) When replacing the handset LCD, See How to
C513 ECUV1A225KBV 2.2
Replace the Handset LCD (P.45).
C515 ECUV1A105KBV 1 Safety Ref. Part No. Part Name & Description Remarks
C516 ECUE1A104KBQ 0.1 No.
C517 ECUE1A104KBQ 0.1 PCB100 PNWPGA410MER MAIN P.C.BOARD ASS'Y
C518 ECUE1A104KBQ 0.1 (RTL) (*1)
C519 ECUE1A104KBQ 0.1 (ICs)
C520 ECUE1A104KBQ 0.1 IC1 C2HBCY000081 IC
C521 ECUE0J105KBQ 1 IC3 PNWIGA410MER IC(EEPROM)(*2)
C522 ECUE1H100DCQ 10p IC4 C0DBZYY00357 IC
C530 ECUE1H100DCQ 10p (TRANSISTORS)
77
No. No.
Q2 B1ADCF000040 TRANSISTOR(SI) C10 EEE0JA221WP 220
Q3 B1ABGE000011 TRANSISTOR(SI) C11 ECUE1A104KBQ 0.1
Q4 B1ADCF000040 TRANSISTOR(SI) C12 PQCUV0J106KB 10
Q5 B1GBCFYY0010 TRANSISTOR(SI) C13 ECUE1A104KBQ 0.1
Q6 B1GBCFYY0010 TRANSISTOR(SI) C15 ECUE1H390JCQ 39p
Q9 B1ABDF000017 TRANSISTOR(SI) C17 ECUE1H100DCQ 10p
(DIODES) C18 ECUE1H100DCQ 10p
D13 MA8043 DIODE(SI) S C19 ECUE1H102KBQ 0.001
D14 MA8043 DIODE(SI) S C20 ECJ1VB0G106M 10 S
D21 MA8043 DIODE(SI) S C21 ECUV1A105KBV 1
D22 MA8043 DIODE(SI) S C22 ECUE1A104KBQ 0.1
DA801 B0DDCD000001 DIODE(SI) C23 ECUE1A104KBQ 0.1
(LEDS) C24 ECUE0J105KBQ 1
LED1 B3AEB0000146 LED C25 ECUV1A225KBV 2.2
LED2 B3AEB0000146 LED C26 ECJ1VB0G106M 10 S
LED3 B3AEB0000146 LED C29 ECUV1A105KBV 1
LED4 B3AEB0000146 LED C30 ECJ1VB0G106M 10 S
LED5 B3AEB0000146 LED C31 ECUE0J105KBQ 1
LED6 B3AEB0000146 LED C32 ECUE0J105KBQ 1
LED7 B3AEB0000146 LED C33 ECUE1A104KBQ 0.1
LED8 B3AEB0000146 LED C34 ECUE1H390JCQ 39p
LED9 B3AEB0000146 LED C36 ECUE1A104KBQ 0.1
LED12 B3ACB0000216 LED C37 ECJ1VB0G106M 10 S
(COILS) C40 ECUE1A104KBQ 0.1
C812 PQLQR4C8N2J COIL S C41 ECUE1A104KBQ 0.1
L6 G1C1R0MA0072 COIL C43 ECUE1A104KBQ 0.1
L13 G1CR18J00004 COIL C44 ECUE0J105KBQ 1
(RESISTOR ARRAYS) C45 ECUE1A104KBQ 0.1
RA1 EXB28V181JX RESISTOR ARRAY C46 ECUE1H100DCQ 10p S
RA2 EXB28V561JX RESISTOR ARRAY C51 ECJ1VB0G106M 10 S
RA3 D1H456120001 RESISTOR ARRAY C56 ECUE0J105KBQ 1
RA4 D1H433220001 RESISTOR ARRAY C57 ECUE0J105KBQ 1
RA5 EXB28V332JX RESISTOR ARRAY C58 ECUE0J105KBQ 1
(IC FILTER) C72 ECUE1H100DCQ 10p
L29 J0JDC0000045 IC FILTER C73 ECUE1H100DCQ 10p
(RESISTORS) C78 ECUE1H390JCQ 39p
R2 ERJ2GEJ303 30k S C79 ECUE1H101JCQ 100p
R3 ERJ2GEJ152 1.5k S C80 ECUE1H390JCQ 39p
R4 ERJ2GEJ473 47k S C81 ECUE1H101JCQ 100p
R6 ERJ2GEJ103 10k S C86 F1J0J2260002 22
R7 ERJ2GEJ104 100k S C96 ECUE1H100DCQ 10p
R8 ERJ8GEYJ3R3 3.3 S C97 ECUE1H100DCQ 10p
R9 ERJ2GEJ303 30k S C127 ECUE1H102KBQ 0.001
R10 ERJ2GEJ100 10 S C150 ECUE1A104KBQ 0.1
R21 ERJ2GEJ104 100k S C152 ECUE1H102KBQ 0.001
R23 ERJ2GEJ100 10 S C172 ECUE1A104KBQ 0.1
R24 ERJ2GEJ391 390 S C188 ECUE0J105KBQ 1
R27 ERJ2GEJ222 2.2k S C504 ECUV1C105KBV 1
R28 ERJ2GEJ222 2.2k S C505 ECUE0J105KBQ 1
R31 ERJ2GEJ104 100k S C805 F1G1H2R4A480 2.4p
R33 ERJ2GEJ104 100k S C806 F1G1H2R4A480 2.4p
R35 ERJ2GEJ104 100k S C811 ECUE1H101JCQ 100p S
R45 ERJ6RSJR10V 0.1 C813 F1G1H1R6A480 1.6p
R64 ERJ2GEJ222 2.2k S C820 F1G1H1R8A480 1.8p
R69 ERJ2GEJ103 10k S C859 F1G1H2R0A480 2p
R562 ERJ2GE0R00 0 S C897 F1G1H240A557 24p
R806 ERJ2GEJ471 470 S L809 F1G1H1R0A480 1p
R807 ERJ2GEJ471 470 S (OTHERS)
L9 ERJ2GE0R00 0 S MIC100 L0CBAY000053 MICROPHONE
(CAPACITORS) E101 L5DYBYY00001 LIQUID CRYSTAL DISPLAY
C1 EEE0JA221WP 220 (*3)
C2 EEE0JA221WP 220 E102 PNHR1114Z TRANSPARENT PLATE, LCD PMMA-HB
C4 ECUE1H390JCQ 39p E103 PNHR1392Z GUIDE, LCD ABS-HB
C5 ECUE1A104KBQ 0.1 E104 PNHX1136Z COVER, LCD
C8 ECUE1H100DCQ 10p E105 PNLA1049Z ANTENNA
C9 ECUE1H120JCQ 12p E106 PNVE1011Z BATTERY TERMINAL ABS-HB
78
No. No.
E107 PQHG10729Z RUBBER PARTS, RECEIVER PQZZ430PRB RUBBER OF SOLDERING IRON
E108 PNJT1059Z CHARGE TERMINAL (L) (*2)
E109 PNJT1060Z CHARGE TERMINAL (R)
F1 K5H252Y00002 FUSE
X1 H0J138500003 CRYSTAL OSCILLATOR (*2) S
16.5.3. Charger Unit

16.5.3.1. Cabinet and Electrical Parts

No.
200 PNLC1018ZB CHARGER UNIT ASS'Y
without NAME PLATE
(RTL) (for KX-
TG4112MEB)
200-1 PNKM1204Z1 CABINET BODY PS-HB
200-2 PNJT1066Z CHARGE TERMINAL
200-3 PNKF1150Z1 CABINET COVER PS-HB
200-4 PQHA10023Z RUBBER PARTS, FOOT
CUSHION
16.5.3.2. Main P.C. Board Parts

No.
PCB200 PNWPTGA660CH MAIN P.C.BOARD ASS'Y
(RTL)
(JACK)
J1 K2ECYB000001 JACK S
(RESISTOR)
R1 ERX2SJ6R8 6.8
(FUSE)
F1 K5H302Y00003 FUSE
16.5.4. Accessories
Note:
You can download and refer to the　Operating Instructions
(Instruction book) on TSN Server.

No.
A1 PNLV226Z AC ADAPTOR
A2 PQJA10075Z CORD, TELEPHONE
P1 PNPK3296024Z GIFT BOX (for KX-
TG4111MEB)
P2 PNPK3290004Z GIFT BOX (for KX-
TG4112MEB)
16.5.5. Screws

No.
A XTB26+8GFJ TAPPING SCREW
B XTB2+8GFJ TAPPING SCREW
16.5.6. Fixtures and Tools

Note:
(*1) See Equipment Required (P.46), and The Setting
Method of JIG (P.46)
(*2) When replacing the Handset LCD, See How to
Replace the Handset LCD (P.45)

No. T.I
PQZZ1CD300E JIG CABLE (*1)
KXTG4111MEB
PNZZTG4131ME BATCH FILE CD-ROM (*1)
PQZZ430PIR TIP OF SOLDERING IRON KXTG4112MEB
(*2) KXTGA410MEB
79

KX-TG4111MEB KX-TG4112MEB KX-TGA410MEB: Telephone Equipment

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ORDER NO.

Configuration for each model

Model No Base Unit Handset Charger Unit Expandable

Information for optional accessories

© Panasonic System Networks Co., Ltd. 2011

IMPORTANT SAFETY NOTICE

IMPORTANT INFORMATION ABOUT LEAD FREE, (PbF), SOLDERING

• ICs and LSIs are vulnerable to static electricity.

2.2. About Lead Free Solder (PbF: Pb free)

2.2.1. Suggested PbF Solder

0.3 mm X 100 g 0.6 mm X 100 g 1.0 mm X 100 g

2.3. Discarding of P. C. Board

Base Unit Handset Charger

4.1.1. TDD Frame Format

DATA rate : 1.152 Mbps

4.1.2. TDMA system

4.1.3. Signal Flowchart in the Radio Parts

Q161 R151,R152 R131, R133 D101

ANT1 ANT2 TEL JACK

KX-TG4111/4112 BLOCK DIAGRAM (Base Unit_Main)

4.3. Block Diagram (Base Unit_RF Part)

KX-TG4111/4112 BLOCK DIAGRAM (Base Unit_RF Part)

4.4. Circuit Operation (Base Unit)

DECT RF system ADPCM

EEPROM IC611 Keys/ Charge

4.4.1. BBIC (Base Band IC: IC501)

4.4.2. EEPROM (IC611)

4.4.3. Power Supply Circuit/Reset Circuit

IC302 VBAT IC501 IC611

BBIC chip initialize

4.4.3.1. Charge Circuit

4.4.4. Telephone Line Interface

C102 L102 P101 L1R

4.4.5. Parallel Connection Detect Circuit/Auto Disconnect Circuit

Parallel connection detection when off hook:

4.4.6. Calling Line Identification (Caller ID)/Call Waiting Caller ID

month day hour minute number

Plural message format

DATA CODE NAME month day hour minute number

Call Waiting Caller ID

Call Waiting Format

CAS: CPE Alerting Signal

ACK: Acknowledged Signal

R121 C121 L101

BBIC L1T Telephone "FSK"

4.5. Block Diagram (Handset)

WP, CLK, DATA

KX-TGA410 BLOCK DIAGRAM (Handset)

4.6. Block Diagram (Handset_RF Part)

KX-TGA410 BLOCK DIAGRAM (Handset_RF Part)

4.7. Circuit Operation (Handset)

4.7.2. Power Supply Circuit/Reset Circuit

BBIC chip initialize

4.7.3. Charge Circuit

4.7.4. Battery Low/Power Down Detector

4.8. Circuit Operation (Charger Unit)

4.9. Signal Route

HANDSET TX HANDSET MIC - R73/74 - C11/13 - RA4 - IC1(22/23)

HANDSET HANDSET MIC - R73/74 - C11/13 - RA4 - IC1(22/23)

CALLER ID T/R(TEL LINE) - L101/[P101 - L102] - C121/C122 - R121/R122 - IC501(24/25)

HANDSET RF IC1(44/45) - L809 - C812 - DA801 - C895 - ANT

HANDSET RF ANT - C895 - DA801 - C826 - IC1(46/47)

BASE UNIT RF ANT1/ANT2 - C894/C893 - DA802 - C895 - DA801 - C826 - IC501(46/47)