Beruflich Dokumente
Kultur Dokumente
R1 VOUT
VIN
C1
1
f-3 dB =
2pR1C1
VOUT
VIN (
= 1+
RF
RG (( 1
1 + sR1C1 (
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION
DATA.
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V
SLOS068W – JUNE 1976 – REVISED OCTOBER 2019 www.ti.com
Table of Contents
1 Features .................................................................. 1 9.1 Overview ................................................................. 24
2 Applications ........................................................... 1 9.2 Functional Block Diagram - LM358B, LM358BA,
LM2904B, LM2904BA .............................................. 24
3 Description ............................................................. 1
9.3 Feature Description................................................. 25
4 Revision History..................................................... 2
9.4 Device Functional Modes........................................ 25
5 Device Comparison Table..................................... 4
10 Application and Implementation........................ 26
6 Pin Configuration and Functions ......................... 5 10.1 Application Information.......................................... 26
7 Specifications......................................................... 6 10.2 Typical Application ............................................... 26
7.1 Absolute Maximum Ratings ...................................... 6 11 Power Supply Recommendations ..................... 27
7.2 ESD Ratings.............................................................. 6
12 Layout................................................................... 27
7.3 Recommended Operating Conditions....................... 7
12.1 Layout Guidelines ................................................. 27
7.4 Thermal Information .................................................. 7
12.2 Layout Examples................................................... 28
7.5 Electrical Characteristics: LM358B and LM358BA ... 8
13 Device and Documentation Support ................. 29
7.6 Electrical Characteristics: LM2904B and LM2904B.. 9
13.1 Documentation Support ........................................ 29
7.7 Electrical Characteristics: LM358, LM358A ............ 10
13.2 Related Links ........................................................ 29
7.8 Electrical Characteristics: LM2904, LM2904V ........ 11
13.3 Receiving Notification of Documentation Updates 29
7.9 Electrical Characteristics: LM158, LM158A ............ 12
13.4 Community Resources.......................................... 29
7.10 Electrical Characteristics: LM258, LM258A .......... 13
13.5 Trademarks ........................................................... 29
7.11 Typical Characteristics .......................................... 14
13.6 Electrostatic Discharge Caution ............................ 29
7.12 Typical Characteristics .......................................... 21
13.7 Glossary ................................................................ 29
8 Parameter Measurement Information ................ 23
14 Mechanical, Packaging, and Orderable
9 Detailed Description ............................................ 24 Information ........................................................... 30
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
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• Changed all entries in the Absolute Maximum Ratings table except TJ and Tstg .................................................................. 6
• Deleted lead temperature and case temperature from Absolute Maximum Ratings.............................................................. 6
• Changed device listings and their voltage values in the ESD Ratings table ......................................................................... 6
• Changed "free-air temperature" to "ambient temperature" in the Recommended Operating Conditions condition
statement ............................................................................................................................................................................... 7
• Changed table entries for all parameters in the Recommended Operating Conditions table ................................................ 7
• Added rows to the Thermal Information table, and a table note regarding device-package combinations .......................... 7
• Deleted the Operating Conditions table................................................................................................................................ 13
• Added a condition statement to the Typical Characteristics section .................................................................................... 21
• Changed specific voltages to a Recommended Operating Conditions reference................................................................ 24
• Changed unity-gain bandwidth from 0.7 MHz for all devices to 1.2 MHz for B-version devices.......................................... 25
• Changed slew rate from.3 V/µs for all devices to o.5 V/µs for B-version devices................................................................ 25
• Changed the Input Common Mode Range section in multiple places throughout ............................................................... 25
• Changed VCC to VS in the Application Information section .................................................................................................. 26
• Subscripted the suffixes fro RI and RF .................................................................................................................................. 26
• Changed Operational Amplifier Board Layout for Noninverting Configuration with an image that includes a dual op amp 28
• Added Preview designation to the LM358B and LM2904B devices in Table 1 ................................................................... 29
• Added Applications section, ESD Ratings table, Feature Description section, Device Functional Modes, Application
and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section ............................................................... 1
• Converted this data sheet from the QS format to DocZone using the PDF on the web ........................................................ 1
• Deleted Ordering Information table ........................................................................................................................................ 1
• Updated Features to include Military Disclaimer .................................................................................................................... 1
• Added Typical Characteristics section.................................................................................................................................. 21
• Added ESD warning ............................................................................................................................................................. 29
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
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OUT1
NC
NC
NC
V+
OUT1 1 8 V+
IN1± 2 7 OUT2
20
19
IN1+ 3 6 IN2±
NC 4 18 NC
V± 4 5 IN2+
IN1± 5 17 OUT2
NC 6 16 NC
Not to scale
IN1+ 7 15 IN2±
NC 8 14 NC
10
11
12
13
9
Not to scale
NC
V±
NC
IN2+
NC
NC - No internal connection
Pin Functions
PIN I/O DESCRIPTION
SOIC, SSOP, CDIP, PDIP, SO,
NAME LCCC (1)
TSSOP, CFP (1)
IN1– 5 2 I Negative input
IN1+ 7 3 I Positive input
IN2– 15 6 I Negative input
IN2+ 12 5 I Positive input
OUT1 2 1 O Output
OUT2 17 7 O Output
Negative (lowest) supply or ground (for single-
V– 10 4 —
supply operation)
1, 3, 4, 6, 8, 9, 11,
NC — — No internal connection
13, 14, 16, 18, 19
V+ 20 8 — Positive (highest) supply
(1) For a listing of which devices are available in what packages, see Device Comparison Table.
7 Specifications
7.1 Absolute Maximum Ratings
over operating ambient temperature range (unless otherwise noted) (1)
MIN MAX UNIT
LM358B, LM358BA,
±20 or 40
LM2904B, LM2904BA
LM158, LM258, LM358,
Supply voltage, VS = ([V+] – [V–]) V
LM158A, LM258A, LM358A, ±16 or 32
LM2904V
LM2904 ±13 or 26
LM358B, LM358BA,
LM2904B, LM2904BA,LM158,
–32 32
Differential input voltage, VID (2) LM258, LM358, LM158A, V
LM258A, LM358A, LM2904V
LM2904 –26 26
LM358B, LM358BA,
–0.3 40
LM2904B, LM2904BA
LM158, LM258, LM358,
Input voltage, VI Either input V
LM158A, LM258A, LM358A, –0.3 32
LM2904V
LM2904 –0.3 26
Duration of output short circuit (one amplifier) to ground at (or below) TA = 25°C,
Unlimited s
VS ≤ 15 V (3)
LM158, LM158A –55 125
LM258, LM258A –25 85
LM358B, LM358BA –40 85
Operating ambient temperature, TA °C
LM358, LM358A 0 70
LM2904B, LM2904BA,
–40 125
LM2904, LM2904V
Operating virtual-junction temperature, TJ 150 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Differential voltages are at IN+, with respect to IN−.
(3) Short circuits from outputs to VS can cause excessive heating and eventual destruction.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
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(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
(2) For a listing of which devices are available in what packages, see Device Comparison Table.
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
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LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V
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(1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified.
Maximum VS for testing purposes is 30 V for LM358 and LM358A.
(2) All typical values are TA = 25°C.
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
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LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V
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OFFSET VOLTAGE
Non-A suffix 3 7
devices TA = –40°C to 125°C 10
VS = 5 V to maximum; VCM = 0 V; VO = 1.4
VOS Input offset voltage mV
V 1 2
A-suffix
devices TA = –40°C to 125°C 4
dVOS/dT Input offset voltage drift TA = –40°C to 125°C 7 µV/°C
Input offset voltage vs power
PSRR VS = 5 V to 30 V 65 100 dB
supply (ΔVIO/ΔVS)
VO1/ VO2 Channel separation f = 1 kHz to 20 kHz 120 dB
INPUT VOLTAGE RANGE
(V–) (V+) – 1.5
VCM Common-mode voltage range VS = 5 V to maximum V
TA = –40°C to 125°C (V–) (V+) – 2
CMRR Common-mode rejection ratio VS = 5 V to maximum; VCM = 0 V 65 80 dB
INPUT BIAS CURRENT
–20 –250
IB Input bias current VO = 1.4 V nA
TA = –40°C to 125°C –500
Non-V suffix 2 50
device TA = –40°C to 125°C 300
IOS Input offset current VO = 1.4 V nA
V-suffix 2 50
device TA = –40°C to 125°C 150
dIOS/dT Input offset current drift TA = –40°C to 125°C 10 pA/°C
NOISE
en Input voltage noise density f = 1 kHz 40 nV/√Hz
OPEN-LOOP GAIN
25 100
AOL Open-loop voltage gain VS = 15 V; VO = 1 V to 11 V; RL ≥ 2 kΩ V/mV
TA = –40°C to 125°C 15
FREQUENCY RESPONSE
GBW Gain bandwidth product 0.7 MHz
SR Slew rate G = +1 0.3 V/µs
OUTPUT
RL ≥ 10 kΩ VS – 1.5
VS = maximum; RL =
4
Non-V suffix 2 kΩ
device VS = maximum; RL ≥
2 3
Positive rail 10 kΩ V
VO Voltage output swing from rail TA = –40°C to 125°C
VS = maximum; RL =
6
2 kΩ
V-suffix device
VS = maximum; RL ≥
4 5
10 kΩ
Negative rail VS = 5 V; RL ≤ 10 kΩ TA = –40°C to 125°C 5 20 mV
–20 –30
VS = 15 V; VO = 0 V; VID = 1 V Source
TA = –40°C to 125°C –10
mA
10 20
IO Output current VS = 15 V; VO = 15 V; VID = –1 V Sink
TA = –40°C to 125°C 5
Non-V suffix device 30
VID = -1 V; VO = 200 mV µA
V-suffix device 12 40
ISC Short-circuit current VS = 10 V; VO = VS / 2 ±40 ±60 mA
POWER SUPPLY
VO = 2.5 V; IO = 0 A 350 600
IQ Quiescent current per amplifier TA = –40°C to 125°C µA
VS = maximum; VO = maximum / 2; IO = 0 A 500 1000
(1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified.
Maximum VS for testing purposes is 26 V for LM2904 and 32 V for LM2904V.
(2) All typical values are TA = 25°C.
(1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified.
Maximum VS for testing purposes is 30 V for LM158 and LM158A.
(2) All typical values are TA = 25°C.
(3) On products compliant to MIL-PRF-38535, this parameter is not production tested.
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
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(1) All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified.
Maximum VS for testing purposes is 30 V for LM258 and LM258A.
(2) All typical values are TA = 25°C.
20 30
18 27
16 24
14 21
Amplifiers (%)
Amplifiers (%)
12 18
10 15
8 12
6 9
4 6
2 3
0 0
-1800 -1200 -600 0 600 1200 1800 0 0.25 0.5 0.75 1 1.25 1.5 1.75 2 2.25 2.5 2.75
Offset Voltage (µV) DC11 Offset Voltage Drift (µV/°C) DC12
Figure 1. Offset Voltage Production Distribution Figure 2. Offset Voltage Drift Distribution
750 500
450 300
Offset Voltage (µV)
150 100
-150 -100
-450 -300
-750 -500
-40 -20 0 20 40 60 80 100 120 -18 -12 -6 0 6 12 17
Temperature (°C) DC10
Common-Mode Voltage (V) DC10
G = 100
Open Loop Voltage Gain (dB)
70 80 50
G = 1000
60 70 G = –1
40
50 60
30
Phase ( )
40 50
20
30 40
10
20 30
0
10 20
0 10 -10
Gain (dB) -20
-10 0
Phase (°)
-20 -10 -30
1k 10k 100k 1M 1k 10k 100k 1M
Frequency (Hz) D012
Frequency (Hz) D017
Figure 5. Open-Loop Gain and Phase vs Frequency Figure 6. Closed-Loop Gain vs Frequency
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
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LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V
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60
-10 40
20
-12.5 0
-20
-15 -40
-20 -15 -10 -5 0 5 10 15 20 -20 -15 -10 -5 0 5 10 15 20
Common-Mode Voltage (V) DC3I Common-Mode Voltage (V) DC3I
Figure 7. Input Bias Current vs Common-Mode Voltage Figure 8. Input Offset Current vs Common-Mode Voltage
-6 0.06
-7 0.045
Input Offset Current (nA)
Input Bias Current (nA)
-8 0.03
-9 0.015
IB+
-10 IB– 0
-11 -0.015
-12 -0.03
-40 -10 20 50 80 110 130 -40 -10 20 50 80 110 130
Temperature (°C) DCIB
Temperature (°C) DCIO
Figure 9. Input Bias Current vs Temperature Figure 10. Input Offset Current vs Temperature
V+ (V–) + 18 V
–40 C
25 C
(V–) + 15 V 125 C
(V+) – 3 V
Output Voltage (V)
Output Voltage (V)
(V–) + 12 V
(V+) – 6 V (V–) + 9 V
(V–) + 6 V
(V+) – 9 V
–40 C (V–) + 3 V
25 C
125 C
(V+) – 12 V V–
0 10 20 30 40 50 0 5 10 15 20 25 30 35 40
Output Current (mA) Output Current (mA) DC1-
DC13
Figure 11. Output Voltage Swing vs Figure 12. Output Voltage Swing vs
Output Current (Sourcing) Output Current (Sinking)
70 110
60 105
50
100
40
30 95
20
90 VS = 36V
10
VS = 5V
0 85
1k 10k 100k 1M -40 -10 20 50 80 110 130
Frequency (Hz) Temperature (°C) DC2_
D001
Figure 13. CMRR and PSRR vs Frequency Figure 14. Common-Mode Rejection Ratio vs
Temperature (dB)
-118 1.6
1.2
Power Supply Rejection Ratio (dB)
-119 0.8
0.4
Voltage (µV)
-120
0
-0.4
-121
-0.8
-122 -1.2
-1.6
-123 -2
-40 -20 0 20 40 60 80 100 120 140 0 1 2 3 4 5 6 7 8 9 10
Temperature (°C) DC8_
Time (s) D011
VS = 5 V to 36 V
Figure 15. Power Supply Rejection Ratio vs Figure 16. 0.1-Hz to 10-Hz Noise
Temperature (dB)
100 -32
10 k
Voltage Noise Spectral Density (nV/—Hz)
90 -40 2k
80 -48
70 -56
THD+N (dB)
60 -64
50 -72
40 -80
30 -88
20 -96
10 -104
0 -112
10 100 1k 10k 100k 100 1k 10k
Frequency (Hz) Frequency (Hz) D013
D010
G = 1, f = 1 kHz, BW = 80 kHz,
VOUT = 10 VPP, RL connected to V–
Figure 17. Input Voltage Noise Spectral Density vs Figure 18. THD+N Ratio vs Frequency, G = 1
Frequency
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
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LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V
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-48 -50
-56 -60
THD+N (dB)
THD+N (dB)
-64 -70
-72 -80
-80 -90
-88 -100
-96 -110 10 k
2k
-104 -120
100 1k 10k 0.001 0.01 0.1 1 10 20
Frequency (Hz) D014
Amplitude (VPP) D015
Figure 19. THD+N Ratio vs Frequency, G = –1 Figure 20. THD+N vs Output Amplitude, G = 1
-20 460
-35 430
Quiescent Current (µA)
-50 400
THD+N (dB)
-65 370
-80 340
-95 310
10 k
2k
-110 280
0.001 0.01 0.1 1 10 20 3 9 15 21 27 33 36
Amplitude (VPP) D016
Supply Voltage (V) DC_S
G = –1, f = 1 kHz, BW = 80 kHz,
RL connected to V–
Figure 21. THD+N vs Output Amplitude, G = –1 Figure 22. Quiescent Current vs Supply Voltage
600 500
VS = 36V
Quiescent Current per Amplifier (µA)
VS = 5V
Open Loop Output Impedance ( )
540
400
480
420 300
360
200
300
240 100
-40 -20 0 20 40 60 80 100 120 1k 10k 100k 1M
Temperature (°C) DC4_
Frequency (Hz) D006
Figure 23. Quiescent Current vs Temperature Figure 24. Open-Loop Output Impedance vs Frequency
32 12
Overshoot (%)
Overshoot (%)
28 10
24 8
20 6
16 4
12 2
8 0
0 40 80 120 160 200 240 280 320 360 40 80 120 160 200 240 280 320 360
Capacitance load (pF) D019
Capacitance load (pF) D020
G = 1, 100-mV output step, RL = open G = –1, 100-mV output step, RL = open
Figure 25. Small-Signal Overshoot vs Capacitive Load Figure 26. Small-Signal Overshoot vs Capacitive Load
60 20
Input
57 Output
54
10
51
Phase Margin (°)
Voltage (V)
48
45 0
42
39
-10
36
33
30 -20
0 40 80 120 160 200 240 280 320 360 0 200 400 600 800 1000
Capacitance Load (pF) Time ( s) D021
D018
G = –10
Figure 27. Phase Margin vs Capacitive Load Figure 28. Overload Recovery
10 10
7.5 7.5
5 5
Voltage (mV)
Voltage (mV)
2.5 2.5
0 0
-2.5 -2.5
-5 -5
Figure 29. Small-Signal Step Response, G = 1 Figure 30. Small-Signal Step Response, G = –1
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
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G = 1, RL = open G = 1, RL = open
Figure 31. Large-Signal Step Response (Rising) Figure 32. Large-Signal Step Response (Falling)
2.5 0.675
Output Positive
2 Input Negative
1.5 0.625
1
Slew Rate(V/ s)
Votlage (V)
0.5 0.575
0
-0.5 0.525
-1
-1.5 0.475
-2
-2.5 0.425
0 20 40 60 80 100 -40 -25 -10 5 20 35 50 65 80 95 110 125
Time (µs) AC_S
Temp( C) D009
G = 1, RL = open
Figure 33. Large-Signal Step Response Figure 34. Slew Rate vs Temperature
60 15
14
13
Maximum Output Voltage (V PP)
40
12
Short-Circuit Current (mA)
11
20 10
9
Sinking 8
0 Sourcing 7
6
-20 5
4
-40 3
2
1
-60 0
-40 -25 -10 5 20 35 50 65 80 95 110 125 1k 10k 100k 1M
Temperature (°C) DC7_ Frequency (Hz) D005
VS = 15 V
Figure 35. Short-Circuit Current vs Temperature Figure 36. Maximum Output Voltage vs Frequency
72
-95
66
EMIRR (dB)
60
-105
54
-115 48
42
-125 36
30
-135 24
1k 10k 100k 1M 1M 10M 100M 1G
Frequency (Hz) D008 Frequency (Hz) D007
Figure 37. Channel Separation vs Frequency Figure 38. EMIRR (Electromagnetic Interference Rejection
Ratio) vs Frequency
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
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20 0.36
18 0.34 –55C
16 0C
0.32
14 125C
12 0.3
10 0.28
8
0.26
6 5Vdc
15Vdc 0.24
4
30Vdc
2 0.22
0 0.2
–55 –35 –15 5 25 45 65 85 105 125 0 5 10 15 20 25 30
Temperature (°C) Supply Voltage (Vdc)
Figure 39. Input Current vs Temperature Figure 40. Supply Current vs Supply Voltage
160 100
70
100
CMRR (dB)
60
80 50
60 40
30
40
20
20 10
0 0
0 5 10 15 20 25 30 35 40 0.1 1 10 100 1000
V+ Supply Voltage (Vdc) Frequency (kHz) C001
Figure 41. Voltage Gain vs Supply Voltage Figure 42. Common-Mode Rejection Ratio vs Frequency
3.5 0.50
VOUT
3.0 0.45
2.5
0.40
Voltage (V)
Voltage (V)
2.0
0.35
1.5
0.30
1.0
0.25
0.5
VOUT
0.0 0.20
0 4 8 12 16 20 24 28 32 36 40 0 2 4 6 8 10
Time ( s) C001
Time ( s) C001
Figure 43. Voltage Follower Large Signal Response (50 pF) Figure 44. Voltage Follower Small Signal Response (50 pF)
6
12.5
5
10
4
7.5
3
5
2.5 2
0 1
1 10 100 1k 0.001 0.01 0.1 1 10 100
Frequency (kHz) Output Sink Current (mAdc)
Figure 45. Maximum Output Swing vs Frequency Figure 46. Output Sourcing Characteristics
(VCC = 15 V)
10 90
5Vdc
80
15Vdc
Output Current (mAdc)
30Vdc 70
Output Voltage (Vdc)
1 60
50
40
0.1 30
20
10
0.01 0
0.001 0.01 0.1 1 10 100 –55 –35 –15 5 25 45 65 85 105 125
Output Sink Current (mAdc) Temperature (°C)
Figure 47. Output Sinking Characteristics Figure 48. Source Current Limiting
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V
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+18V
–
VIN
+
-18V
RL
GND GND
Figure 51. Test Circuit, G = –1, for THD+N and Small-Signal Step Response
9 Detailed Description
9.1 Overview
These devices consist of two independent, high-gain frequency-compensated operational amplifiers designed to
operate from a single supply over a wide range of voltages. Operation from split supplies also is possible if the
difference between the two supplies is within the supply voltage range specified in the Recommended Operating
Conditions section, and VS is at least 1.5 V more positive than the input common-mode voltage. The low supply-
current drain is independent of the magnitude of the supply voltage.
Applications include transducer amplifiers, dc amplification blocks, and all the conventional operational amplifier
circuits that now can be implemented more easily in single-supply-voltage systems. For example, these devices
can be operated directly from the standard 5-V supply used in digital systems and easily can provide the required
interface electronics without additional ±5-V supplies.
VCC+
~6 µA ~6 µA ~100 µA
Curren t Curren t Curren t
Regula tor Regula tor Regula tor
IN- OUT
IN+
~120 µA
Curren t
Regula tor
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V
www.ti.com SLOS068W – JUNE 1976 – REVISED OCTOBER 2019
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
RI Vsup+
VOUT
+
VIN
Vsup-
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V
www.ti.com SLOS068W – JUNE 1976 – REVISED OCTOBER 2019
0.5
Volts
0
-0.5
-1
-1.5
-2
0 0.5 1 1.5 2
Time (ms)
CAUTION
Supply voltages larger than specified in the recommended operating region can
permanently damage the device (see the Absolute Maximum Ratings).
Place 0.1-µF bypass capacitors close to the power-supply pins to reduce errors coupling in from noisy or high-
impedance power supplies. For more detailed information on bypass capacitor placement, see the Layout
section.
12 Layout
OUT1 V+
RG
GND
VIN IN1+ IN2í
R IN
Ví IN2+
Only needed for Use low-ESR, ceramic
dual-supply bypass capacitor
operation
VSí
GND
(or GND for single supply) Ground (GND) plane on another layer
RIN
VIN +
VOUT
RG
RF
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V
www.ti.com SLOS068W – JUNE 1976 – REVISED OCTOBER 2019
13.5 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
13.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
13.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms and definitions.
Product Folder Links: LM158 LM158A LM258 LM258A LM358 LM358A LM358B LM358BA LM2904 LM2904B
LM2904BA LM2904V
PACKAGE OPTION ADDENDUM
www.ti.com 21-Nov-2019
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
5962-87710012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
87710012A
LM158FKB
5962-8771001PA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 8771001PA
LM158
5962-87710022A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
87710022A
LM158AFKB
5962-8771002PA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 8771002PA
LM158A
LM158 MW8 ACTIVE WAFERSALE YS 0 1 Green (RoHS Call TI Level-1-NA-UNLIM -55 to 125
& no Sb/Br)
LM158AFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
87710022A
LM158AFKB
LM158AJG ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 LM158AJG
LM158AJGB ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 8771002PA
LM158A
LM158FKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
87710012A
LM158FKB
LM158JG ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 LM158JG
LM158JGB ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 8771001PA
LM158
LM258AD ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM258A
& no Sb/Br)
LM258ADGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS CU NIPDAU | Level-1-260C-UNLIM -25 to 85 (M3L, M3P, M3S, M3
& no Sb/Br) CU NIPDAUAG U)
LM258ADR ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU | CU SN Level-1-260C-UNLIM -25 to 85 LM258A
& no Sb/Br)
LM258ADRE4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM258A
& no Sb/Br)
LM258ADRG4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM258A
& no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 21-Nov-2019
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
LM258AP ACTIVE PDIP P 8 50 Green (RoHS CU NIPDAU | CU SN N / A for Pkg Type -25 to 85 LM258AP
& no Sb/Br)
LM258APE4 ACTIVE PDIP P 8 50 Pb-Free CU NIPDAU N / A for Pkg Type -25 to 85 LM258AP
(RoHS)
LM258D ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM258
& no Sb/Br)
LM258DG4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM258
& no Sb/Br)
LM258DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS CU NIPDAU | Level-1-260C-UNLIM -25 to 85 (M2L, M2P, M2S, M2
& no Sb/Br) CU NIPDAUAG U)
LM258DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS CU NIPDAUAG Level-1-260C-UNLIM -25 to 85 (M2L, M2P, M2S, M2
& no Sb/Br) U)
LM258DR ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU | CU SN Level-1-260C-UNLIM -25 to 85 LM258
& no Sb/Br)
LM258DRG3 ACTIVE SOIC D 8 2500 Green (RoHS CU SN Level-1-260C-UNLIM -25 to 85 LM258
& no Sb/Br)
LM258DRG4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM258
& no Sb/Br)
LM258P ACTIVE PDIP P 8 50 Green (RoHS CU NIPDAU | CU SN N / A for Pkg Type -25 to 85 LM258P
& no Sb/Br)
LM258PE4 ACTIVE PDIP P 8 50 Pb-Free CU NIPDAU N / A for Pkg Type -25 to 85 LM258P
(RoHS)
LM2904AVQDR ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV
& no Sb/Br)
LM2904AVQDRG4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV
& no Sb/Br)
LM2904AVQPWR ACTIVE TSSOP PW 8 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV
& no Sb/Br)
LM2904AVQPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV
& no Sb/Br)
LM2904BAIDR ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 2904BA
& no Sb/Br)
LM2904BIDR ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 L2904B
& no Sb/Br)
LM2904D ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904
& no Sb/Br)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com 21-Nov-2019
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
LM2904DE4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904
& no Sb/Br)
LM2904DG4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904
& no Sb/Br)
LM2904DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS CU NIPDAU | Level-1-260C-UNLIM -40 to 125 (MBL, MBP, MBS, MB
& no Sb/Br) CU NIPDAUAG U)
LM2904DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS CU NIPDAUAG Level-1-260C-UNLIM -40 to 125 (MBL, MBP, MBS, MB
& no Sb/Br) U)
LM2904DR ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 LM2904
& no Sb/Br)
LM2904DRE4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904
& no Sb/Br)
LM2904DRG3 ACTIVE SOIC D 8 2500 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 LM2904
& no Sb/Br)
LM2904DRG4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904
& no Sb/Br)
LM2904P ACTIVE PDIP P 8 50 Green (RoHS CU NIPDAU | CU SN N / A for Pkg Type -40 to 125 LM2904P
& no Sb/Br)
LM2904PE4 ACTIVE PDIP P 8 50 Pb-Free CU NIPDAU N / A for Pkg Type -40 to 125 LM2904P
(RoHS)
LM2904PSR ACTIVE SO PS 8 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904
& no Sb/Br)
LM2904PW ACTIVE TSSOP PW 8 150 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904
& no Sb/Br)
LM2904PWR ACTIVE TSSOP PW 8 2000 Green (RoHS CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 L2904
& no Sb/Br)
LM2904PWRG3 ACTIVE TSSOP PW 8 2000 Green (RoHS CU SN Level-1-260C-UNLIM -40 to 125 L2904
& no Sb/Br)
LM2904PWRG4-JF ACTIVE TSSOP PW 8 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904
& no Sb/Br)
LM2904QDR ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 2904Q1
& no Sb/Br)
LM2904QDRG4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 2904Q1
& no Sb/Br)
LM2904VQDR ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V
& no Sb/Br)
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com 21-Nov-2019
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
LM2904VQDRG4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V
& no Sb/Br)
LM2904VQPWR ACTIVE TSSOP PW 8 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V
& no Sb/Br)
LM2904VQPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V
& no Sb/Br)
LM358AD ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A
& no Sb/Br)
LM358ADE4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A
& no Sb/Br)
LM358ADG4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A
& no Sb/Br)
LM358ADGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS CU NIPDAU | Level-1-260C-UNLIM 0 to 70 (M6L, M6P, M6S, M6
& no Sb/Br) CU NIPDAUAG U)
LM358ADGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS CU NIPDAUAG Level-1-260C-UNLIM 0 to 70 (M6L, M6P, M6S, M6
& no Sb/Br) U)
LM358ADR ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU | CU SN Level-1-260C-UNLIM 0 to 70 LM358A
& no Sb/Br)
LM358ADRE4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A
& no Sb/Br)
LM358ADRG4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A
& no Sb/Br)
LM358AP ACTIVE PDIP P 8 50 Green (RoHS CU NIPDAU | CU SN N / A for Pkg Type 0 to 70 LM358AP
& no Sb/Br)
LM358APE4 ACTIVE PDIP P 8 50 Pb-Free CU NIPDAU N / A for Pkg Type 0 to 70 LM358AP
(RoHS)
LM358APW ACTIVE TSSOP PW 8 150 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 L358A
& no Sb/Br)
LM358APWR ACTIVE TSSOP PW 8 2000 Green (RoHS CU NIPDAU | CU SN Level-1-260C-UNLIM 0 to 70 L358A
& no Sb/Br)
LM358APWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 L358A
& no Sb/Br)
LM358BAIDR ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 125 L358BA
& no Sb/Br)
LM358BIDR ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 LM358B
& no Sb/Br)
Addendum-Page 4
PACKAGE OPTION ADDENDUM
www.ti.com 21-Nov-2019
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
(1)
The marketing status values are defined as follows:
Addendum-Page 5
PACKAGE OPTION ADDENDUM
www.ti.com 21-Nov-2019
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Addendum-Page 6
PACKAGE OPTION ADDENDUM
www.ti.com 21-Nov-2019
Addendum-Page 7
PACKAGE MATERIALS INFORMATION
www.ti.com 28-Dec-2019
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 28-Dec-2019
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 28-Dec-2019
Pack Materials-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com 28-Dec-2019
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM258DR SOIC D 8 2500 364.0 364.0 27.0
LM258DRG3 SOIC D 8 2500 364.0 364.0 27.0
LM258DRG3 SOIC D 8 2500 333.2 345.9 28.6
LM258DRG4 SOIC D 8 2500 340.5 338.1 20.6
LM258DRG4 SOIC D 8 2500 367.0 367.0 35.0
LM2904AVQDR SOIC D 8 2500 340.5 338.1 20.6
LM2904AVQDRG4 SOIC D 8 2500 340.5 338.1 20.6
LM2904AVQPWR TSSOP PW 8 2000 367.0 367.0 35.0
LM2904AVQPWRG4 TSSOP PW 8 2000 367.0 367.0 35.0
LM2904BAIDR SOIC D 8 2500 340.5 338.1 20.6
LM2904BIDR SOIC D 8 2500 340.5 338.1 20.6
LM2904DGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM2904DGKR VSSOP DGK 8 2500 358.0 335.0 35.0
LM2904DR SOIC D 8 2500 340.5 338.1 20.6
LM2904DR SOIC D 8 2500 333.2 345.9 28.6
LM2904DR SOIC D 8 2500 364.0 364.0 27.0
LM2904DR SOIC D 8 2500 367.0 367.0 35.0
LM2904DRG3 SOIC D 8 2500 333.2 345.9 28.6
LM2904DRG3 SOIC D 8 2500 364.0 364.0 27.0
LM2904DRG4 SOIC D 8 2500 367.0 367.0 35.0
LM2904DRG4 SOIC D 8 2500 340.5 338.1 20.6
LM2904PWR TSSOP PW 8 2000 364.0 364.0 27.0
LM2904PWR TSSOP PW 8 2000 367.0 367.0 35.0
LM2904PWRG3 TSSOP PW 8 2000 364.0 364.0 27.0
LM2904PWRG4-JF TSSOP PW 8 2000 367.0 367.0 35.0
LM2904QDR SOIC D 8 2500 350.0 350.0 43.0
LM2904VQDR SOIC D 8 2500 340.5 338.1 20.6
LM2904VQPWR TSSOP PW 8 2000 367.0 367.0 35.0
LM2904VQPWRG4 TSSOP PW 8 2000 367.0 367.0 35.0
LM358ADGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM358ADR SOIC D 8 2500 367.0 367.0 35.0
LM358ADR SOIC D 8 2500 333.2 345.9 28.6
LM358ADR SOIC D 8 2500 340.5 338.1 20.6
LM358ADR SOIC D 8 2500 364.0 364.0 27.0
LM358ADRG4 SOIC D 8 2500 367.0 367.0 35.0
LM358ADRG4 SOIC D 8 2500 340.5 338.1 20.6
LM358APWR TSSOP PW 8 2000 367.0 367.0 35.0
LM358APWR TSSOP PW 8 2000 364.0 364.0 27.0
LM358APWRG4 TSSOP PW 8 2000 367.0 367.0 35.0
LM358BAIDR SOIC D 8 2500 340.5 338.1 20.6
LM358BIDR SOIC D 8 2500 340.5 338.1 20.6
LM358DGKR VSSOP DGK 8 2500 358.0 335.0 35.0
LM358DGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM358DR SOIC D 8 2500 364.0 364.0 27.0
Pack Materials-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com 28-Dec-2019
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM358DR SOIC D 8 2500 367.0 367.0 35.0
LM358DR SOIC D 8 2500 333.2 345.9 28.6
LM358DR SOIC D 8 2500 340.5 338.1 20.6
LM358DRG3 SOIC D 8 2500 333.2 345.9 28.6
LM358DRG3 SOIC D 8 2500 364.0 364.0 27.0
LM358DRG4 SOIC D 8 2500 340.5 338.1 20.6
LM358DRG4 SOIC D 8 2500 367.0 367.0 35.0
LM358PWR TSSOP PW 8 2000 364.0 364.0 27.0
LM358PWR TSSOP PW 8 2000 367.0 367.0 35.0
LM358PWRG3 TSSOP PW 8 2000 364.0 364.0 27.0
LM358PWRG4 TSSOP PW 8 2000 367.0 367.0 35.0
LM358PWRG4-JF TSSOP PW 8 2000 367.0 367.0 35.0
Pack Materials-Page 5
PACKAGE OUTLINE
D0008A SCALE 2.800
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
SEATING PLANE
.228-.244 TYP
[5.80-6.19]
.004 [0.1] C
A PIN 1 ID AREA
6X .050
[1.27]
8
1
.189-.197 2X
[4.81-5.00] .150
NOTE 3 [3.81]
4X (0 -15 )
4
5
8X .012-.020
B .150-.157 [0.31-0.51]
.069 MAX
[3.81-3.98] .010 [0.25] C A B [1.75]
NOTE 4
.005-.010 TYP
[0.13-0.25]
4X (0 -15 )
SEE DETAIL A
.010
[0.25]
.004-.010
0 -8 [0.11-0.25]
.016-.050
[0.41-1.27] DETAIL A
(.041) TYPICAL
[1.04]
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
www.ti.com
EXAMPLE BOARD LAYOUT
D0008A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55]
SYMM SEE
DETAILS
1
8
8X (.024)
[0.6] SYMM
(R.002 ) TYP
[0.05]
5
4
6X (.050 )
[1.27]
(.213)
[5.4]
EXPOSED
METAL EXPOSED
METAL
.0028 MAX .0028 MIN
[0.07] [0.07]
ALL AROUND ALL AROUND
4214825/C 02/2019
NOTES: (continued)
www.ti.com
EXAMPLE STENCIL DESIGN
D0008A SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55] SYMM
1
8
8X (.024)
[0.6] SYMM
(R.002 ) TYP
5 [0.05]
4
6X (.050 )
[1.27]
(.213)
[5.4]
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
MECHANICAL DATA
0.400 (10,16)
0.355 (9,00)
8 5
0.280 (7,11)
0.245 (6,22)
1 4
0.065 (1,65)
0.045 (1,14)
0.023 (0,58)
0°–15°
0.015 (0,38)
0.100 (2,54) 0.014 (0,36)
0.008 (0,20)
4040107/C 08/96
C
6.6 SEATING PLANE
TYP
6.2
A PIN 1 ID 0.1 C
AREA
6X 0.65
8
1
3.1 2X
2.9
NOTE 3 1.95
4
5
0.30
8X
0.19
4.5 1.2 MAX
B 0.1 C A B
4.3
NOTE 4
(0.15) TYP
SEE DETAIL A
0.25
GAGE PLANE
0.75 0.15
0 -8 0.05
0.50
DETAIL A
TYPICAL
4221848/A 02/2015
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153, variation AA.
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EXAMPLE BOARD LAYOUT
PW0008A TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
8X (1.5)
8X (0.45) SYMM
(R0.05)
1 TYP
8
SYMM
6X (0.65)
5
4
(5.8)
4221848/A 02/2015
NOTES: (continued)
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EXAMPLE STENCIL DESIGN
PW0008A TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
8X (1.5)
SYMM (R0.05) TYP
8X (0.45)
1
8
SYMM
6X (0.65)
5
4
(5.8)
4221848/A 02/2015
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
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