Beruflich Dokumente
Kultur Dokumente
Description
The U4224B is a bipolar integrated straight-through receiver circuit in the frequency range of 40 to 80 kHz.
The device is designed for radio-controlled clock applications.
Features
D Very low power consumption D Only a few external components necessary
D Very high sensitivity D Digitalized serial output signal
D High selectivity by using two crystal filters
D AGC hold mode
D Power-down mode available
Block Diagram
15 16
GND 3 11 FLB
9 DEC
4 5 6 13 14 7 8
SB Q1A Q1B Q2A Q2B REC INT
Figure 1.
IN SB
A ferrite antenna is connected between IN and VCC. For A resistor RSB is connected between SB and GND. It con-
high sensitivity, the Q factor of the antenna circuit should trols the bandwidth of the crystal filters. It is
be as high as possible. Please note that a high Q factor recommended: RSB = 0 W for DCF 77.5 kHz, RSB =
requires temperature compensation of the resonant 10 kW for 60 kHz WWVB and RSB = open for JG2AS
frequency in most cases. Specifications are valid for 40 kHz.
Q > 30. An optimal signal-to-noise ratio will be achieved
by a resonant resistance of 50 to 200 kW.
94 8381
VCC
IN SB
GND
94 8379
Figure 3. Figure 4.
GND
94 8382
Figure 5.
INT
Integrator output: The voltage VINT is the control voltage
for the AGC. The capacitor C2 between INT and DEC
REC defines the time constant of the integrator. The current
Rectifier output and integrator input: The capacitor C1 through the capacitor is the input signal of the decoder.
between REC and INT is the lowpass filter of the rectifier
and at the same time a damping element of the gain 94 8375
control.
94 8374
INT
REC
GND
Figure 9.
GND
Figure 6.
FLA, FLB
DEC Lowpass filter: A capacitor C3 connected between FLA
Decoder input: Senses the current through the integration and FLB suppresses higher frequencies at the trigger
capacitor C2. The dynamic input resistance has a value of circuit of the decoder.
about 420 kW and is low compared to the impedance of
C2.
FLB FLB
DEC
94 8377
94 8376
GND Figure 10.
Figure 7.
Figure 14.
94 8383
GND
TCO Probe
w 10 MW
10 : 1
v
used, the additional parasitic capacitances of the coil the capacitor Cres as close as possible to the antenna coil
( 20 pF) must be considered. The Q value of the or to use a twisted wire for the antenna-coil connection.
capacitor should be no problem if a high Q type is used. This twisted line is also necessary to reduce feedback of
The Q value of the coil differs more or less from the DC noise from the microprocessor to the IC input. Long
resistance of the wire. Skin effects can be observed but do connection lines must be shielded.
not dominate.
A final adjustment of the time-code receiver can be
Therefore, it should not be a problem to achieve the carried out by pushing the coil along the bar antenna. The
recommended values of the resonant resistance. The use maximum of the integrator output voltage VINT at
of thicker wire increases the Q value and accordingly Pin INT indicates the resonant point. But attention: The
w
reduces bandwidth. This is advantageous in order to load current should not exceed 1 nA, that means an input
improve reception in noisy areas. On the other hand, resistance 1 GW of the measuring device is required.
temperature compensation of the resonant frequency Therefore, a special DVM or an isolation amplifier is
might become a problem if the bandwidth of the antenna necessary.
Thermal Resistance
Parameters Symbol Value Unit
Thermal resistance RthJA 70 K/W
Stco Spon 1M 1M
82p
Vtco Isl
U4224B SL
10M
Ivcc 100k Sdec
VCC STABILISATION FLB
DECODING
Iin
Idec
FLA
AGC- 100M
1M AMPLIFIER RECTIFIER
IN DEC Vdec
Vrec Vint
Isb
Irec Iint 94 8384 e
Figure 16.
Ferrite Antenna 1 16
fres = 77.5 kHz
15 TCO
2
PON 3) Microcomputer
3 14
77.5 kHz SL 1)
4 13 Keyboard
U4224B
5 12
77.5 kHz 2)
Display
6 11 C3
10 10 nF
C1 7
1) If SL is not used, SL is connected to VCC
2) 77.5-kHz crystal can be replaced by 10 pF
6.8 nF 8 9 C2 3) If IC is activated, PON is connected to GND
33 nF
94 8279 e
Figure 17.
Ferrite Antenna 1 16
fres = 60 kHz
15 TCO
2
PON 3) Microcomputer
3 14
60 kHz SL 1)
RSB
4 13 Keyboard
10 kW U4224B
5 12
60 kHz 2)
Display
6 11 C3
10 10 nF
C1 7
1) If SL is not used, SL is connected to VCC
2) 60-kHz crystal can be replaced by 10 pF
15 nF 8 9 C2 3) If IC is activated, PON is connected to GND
47 nF
94 8278 e
Figure 18.
Ferrite Antenna 1 16
fres = 40 kHz
15 TCO
2
PON 3) Microcomputer
3 14
40 kHz SL 1)
4 13 Keyboard
U4224B
5 12
40 kHz 2)
Display
6 11 C3
C1 10 10 nF
7
1) If SL is not used, SL is connected to VCC
1 MW
680 pF C2
2) 40-kHz crystal can be replaced by 22 pF
8 9 3) If IC is activated, PON is connected to GND
R
220 nF
94 7724 e
Figure 19.
A2
Z1
Z2
10
P1
20
10
20
40
80
P3
20
40
10
10
20
8
10
4
8
1
2
4
8
P2
1
2
4
8
1
2
4
1
2
4
8
1
2
4
1
2
R
Example:19.35 h
s 1 2 4 8 10 20 40 P1 1 2 4 8 10 20 P2
seconds 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35
minutes hours
Start Bit Parity Bit P1 Parity Bit P2
Figure 20.
1
4
2
20
2
80
20
10
8
2
10
8
4
2
1
20
10
8
4
2
1
10
8
4
2
40
20
10
8
4
1
0
0
1
1
year month day of hour minute minute
month day identifier
Switch over to of
the next time frame week Parity BST
check hour + minute
bits day of week
day + month
year
0 1 BST 7 GMT change
impending
500 ms 500 ms
93 7528
Example: 80 40 20 10 8 4 2 1 10 8 4 2 1
March 1993
seconds 17 18 19 20 21 22 23 24 25 26 27 28 29 30
year month
Figure 21.
ADD
ADD
SUB
800
400
200
100
80
40
20
10
200
40
8
4
2
1
100
80
20
10
1
P3
8
4
2
20
P2
40
20
10
2
1
P1
10
8
2
1
4
P0
P0
P4
P5
daylight savings time bits
days leap second warning bit
minutes hours UTI UTI year leap year indicator bit
sign correction
“0” = non leap year
“1” = leap year
93 7529 e
P0 40 20 10 8 4 2 1 P1 20 10 8 4 2 1 P2
seconds 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
minutes hours
Frame-reference marker
Figure 22.
ADD
FRM
ADD
SUB
200
10 0
P4
PO
P5
P2
40
20
P1
80
20
P3
20
40
10
10
4
1
2
1
2
8
4
8
10
4
2
1
P0
8
2
1
8
minutes hours da ys
code dut1
Example: 18.42 h
Time frame
P0 40 20 10 8 4 2 1 P1 20 10 8 4 2 1 P2
seconds 59 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
minutes hours
Frame-reference marker (FRM)
Position-identifier marker P0 Position identifier marker P1
Figure 23.
2.45 2.70
2.25 0.3
2.45 0.2
0.25
0.49 0.10 7.5
7.3
0.35 1.27
10.56
8.89 10.15
technical drawings
according to DIN
specifications
1 95 11493
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems
with respect to their impact on the health and safety of our employees and the public, as well as their impact on
the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as
ozone depleting substances ( ODSs).
The Montreal Protocol ( 1987) and its London Amendments ( 1990) intend to severely restrict the use of ODSs and
forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban
on these substances.
TEMIC Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of
ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2 . Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency ( EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C ( transitional substances ) respectively.
TEMIC Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer
application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized
application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of,
directly or indirectly, any claim of personal damage, injury or death associated with such unintended or
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