Fin Heat Transfer

Varela J.A. - López D.G. - Largo J.C.

Escuela de ingeniería mecánica
Universidad del valle
 VAPOR CHAMBER HEAT
SINK WITH HOLLOW FINS

Authors: Vanessa Michels,

Fernando H. Milanez, Marcia B.
H. Mantelli
Journal: Journal of the Brazilian
Society of Mechanical Sciences and
Engineering
Publication date: February 2012

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 Introduction
The ever-increasing heat flux levels produced by
electronic devices have led to the search for more
efficient and smaller heat sinks. The performance
of traditional air-cooled heat sink approach, a solid
base plate with attached fins, requires thermal
gradients to appear. That is because they are
based on thermal conduction of solids. On the
other hand, the vapor chamber heat sink approach
is based on phase-change heat transfer, which
requires smaller thermal gradients. The smaller
the thermal gradients inside the heat sink, the Heat Sink
smaller the overall thermal resistance of the heat
sink.
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 Theoretical Framework
● The overall thermal resistance is:

(1)

(2)

(3)
● The sink thermal resistance is:

(4)

(5) 4
Materials and methods

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Prototype
Top Chamber Plate:
● Thin copper.
● 77 tubes soldered in a staggered
arrangement.
● Tube dimensions: 9.53 mm external
diameter, 0.39 mm wall thickness y
63 mm high.

Lowe Chamber Plate:

● Thin copper.
● Insulated
● Six 160-mesh size brass screens
were spot-welded as porous media.
● Chamber dimensions: 130 x 135 x 9
mm, excluding the flange.
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 Equipment and instrumentation
● Electronic Fan ● Thermocouple K type ● Copper block with
cartridge heaters
inserted

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Experimental setup

1. Electronic fan
2. Hollow fins
3. Vapor chamber
4. Thermocouples
5. Heat source

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Results

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 Results

By means of temperature
measurements, the thermal
resistances of the steam chamber
at different filling percentages of
the chamber volume of said
chamber were determined.

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 Results
Comparison with conventional Heat Sink

Convection heat transfer

coefficient:

Overall prototype resistance:

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Conclusions
● The results showed that the measured sink thermal resistance depends on the working
fluid filling ratio. For the prototype tested, 25% of the base chamber proved to be the
optimum level.
● The boiling heat transfer presents the largest thermal resistance of the heat sink, above
97% for the prototype tested. The proposed model predicts the data fairly well for the
optimum filling ratio provided there is no dry-out.
● Further work is needed to enhance the boiling heat transfer inside the heat sink in order
to make it competitive to the conventional heat sink.
● An optimization study similar to the ones encountered in the literature could be employed
to assess the advantages of the hollow fin vapor chamber heat sink under a specific
application.

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Referencias
I. MICHELS, Vanessa; MILANEZ, Fernando H. and MANTELLI, Marcia B. H.. Vapor chamber heat sink with
hollow fins. J. Braz. Soc. Mech. Sci. & Eng. [online]. 2012, vol.34, n.3 [cited 2020-05-16], pp.233-237.
Available from:
<http://www.scielo.br/scielo.php?script=sci_arttext&pid=S1678-58782012000300002&lng=en&nrm=iso>
. ISSN 1678-5878. https://doi.org/10.1590/S1678-58782012000300002.

II. Bergman, T. L., Incropera, F. P., Lavine, A. S., & DeWitt, D. P. (2011). Introduction to heat transfer.
John Wiley & Sons.

III. Cengel, Y. A., & Ghajar, A. (2007). Transferencia de calor y masa. McGraw-Hill Interamericana.

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