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BSP Hardware Description

BSP 8100

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DESCRIPTION

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Copyright

© Ericsson AB 2015, 2016. All rights reserved. No part of this document may be
reproduced in any form without the written permission of the copyright owner.

Disclaimer

The contents of this document are subject to revision without notice due to
continued progress in methodology, design and manufacturing. Ericsson shall
have no liability for any error or damage of any kind resulting from the use

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of this document.

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Trademark List

All trademarks mentioned herein are the property of their respective owners.

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These are shown in the document Trademark Information.

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Contents

Contents

1 Introduction 1
1.1 Scope 1
1.2 Target Groups 1

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1.3 Documents 2

2 Hardware Structure 3

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2.1 Product Identification 5
2.2 EGEM2 Shelf 5

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2.3 Address Plugs 6
2.4 PFM-LOD and PFM-HOD 7
2.5
2.6
2.7
SCXB3
CMXB3
Active Patch Panel
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2.8 GEP 16
2.9 Dummy Unit 22
2.10 Indicators on Front Panels of Plug-In Units 23
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3 Unit Positions and Connectors 25


3.1 Positions at Cabinet Level 26
3.2 Positions at Shelf and Plug-In Unit Level 27
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4 BSP 8100 Physical Connectivity 29


4.1 Cables 29
4.2 Physical Connectivity 29
4.3 SFP and SFP+ for Optical Connection 33
4.4 Expansions in BSP 8100 with APP 34

5 Technical Data and Characteristics 35


5.1 Cabinet Dimensions 35
5.2 Weight 35
5.3 Power Supply 36
5.4 Power Consumption 46

6 Environmental Conditions 49
6.1 Climatic Conditions 49

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6.2 Electromagnetic Compatibility 49


6.3 Product Safety 49
6.4 RoHS Compliance 50
6.5 Earthquake Resistibility 50
6.6 Dependability 50

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Introduction

1 Introduction

The Blade Server Platform (BSP) 8100 hardware has two variants, ‘‘BSP 8100
with APP’’ and ‘‘BSP 8100 High Bandwidth’’.

‘‘BSP 8100 High Bandwidth’’ provides the following:

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• Redundant Internal Data Connectivity of up to 80GE between shelves

• Redundant External Data Connectivity consisting of a set of 3 × 1GE

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Electrical, 8 ×10GE SFP+, and 2 × 40GE QSFP interfaces

In that variant, up to three shelves are supported.

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For a further description of ‘‘BSP 8100 High Bandwidth’’, refer to BSP High
Bandwidth Hardware Description.


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‘‘BSP 8100 with APP’’ provides the following:

Redundant Internal Data Connectivity of up to 40GE between shelves


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• Redundant External Data Connectivity consisting of 3 × 1GE or 2 × 10GE
interfaces

Maximum six shelves are allowed in this configuration. 1GE external


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connectivity can also be achieved without APP.

1.1 Scope
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The scope of this document is as follows:

• Describe all hardware components required for ‘‘BSP 8100 with APP’’

• Describe rules for BSP physical connectivity

• Provide basic technical data of the platform

1.2 Target Groups


The main target audience of this document is the following:

• Product Packaging

• Ericsson Marketing

• Product Management

• Technical Sales Support

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BSP Hardware Description

It is also used in discussions with Ericsson customers.

1.3 Documents
The following documents are referenced:

• BSP High Bandwidth Hardware Description

• External Cables for BSP Hardware

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• Identify BSP Hardware

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• Internal Cables for BSP Hardware

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Hardware Structure

2 Hardware Structure

‘‘BSP 8100 with APP’’ consists of one or two cabinets. Up to three shelves
can be installed in each cabinet. The door can be locked for the cabinet, and
mounting kits for high earthquake risk areas are available. The cabinet is
designed for installation in indoor locations in telecommunications centers.

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In summary, the following hardware components are included in ‘‘BSP 8100
with APP’’:

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• Cabinet BYB 501.

• Evolved Generic Ericsson Magazine, type 2 (EGEM2) shelf

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• Power and Fan Module (PFM) 2400.


Active Patch Panel (APP).
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System Control Switch Board (SCXB).
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• Component Main Switch Board (CMXB).

• Generic Ericsson Processor (GEP) blades.

An example of a fully equipped BSP cabinet is shown in Figure 1.


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BSP Hardware Description

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Figure 1 Example of Fully Equipped BSP Cabinet


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The BSP hardware Product Package contains product numbers and versions of
supported hardware.

Figure 2 shows how the shelves are located in a cabinet that has one shelf,
two shelves, or three shelves. If having two cabinets, cabinet 2 has one shelf,
two shelves, or three shelves, located as shown in Figure 2. Cabinet 1 must
then have three shelves.

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Figure 2 BSP Cabinet with 1, 2, or 3 Shelves


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2.1 Product Identification


All products are marked with product identification labels. The labels have two
parts: one with information in plain text, the other with the same information
in two types of barcode; PDF 417 code and Code 128. For details, refer to
Identify BSP Hardware.

2.2 EGEM2 Shelf


The EGEM2 is a self-contained NEBS-compliant shelf providing power, cooling,
mechanical housing, and transmission infrastructure, see Figure 3. The
EGEM2, BFD 538 002/1, is used in the BSP hardware and its backplane has
the following characteristics:

• Dual transport switch architecture

• Dual control switch and shelf manager

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BSP Hardware Description

• Up to 24 device boards with 10GE connectivity through the backplane

• 048 V DC power connections through the exchangeable PFMs


Each EGEM2 shelf is equipped with two PFMs that provide cooling and power
for the plug-in units in the shelf.

An EGEM2 can house up to 12 plug-in units of 30 mm width, or 24 plug-in


units of 15 mm width, or mixed. Most processor blades take two slots, so a
maximum of 12 processor blades can be located in one shelf. The plug-in units

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have the form factor of 265 × 225 mm.

For Ethernet switching infrastructure there are two 15 mm width SCXB3 and

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two 15 mm width CMXB3 plug-in units.

From the EGEM2 backplane, all plug-in units are provided with dual 048 V DC

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power supplies, redundant 1GE or 10GE connections, for administration/control,
and Intelligent Platform Management Interface (IPMI) connections.

2.3 Address Plugs IN


The shelf address is defined by a combination of the three address plugs at the
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left side of the shelf. Address plug AP_0 is at the top. Address plug AP_1 is
the second one from the top. Address plug AP_3 is at the bottom. The third
address plug from the top, AP_2 , is not used. See Figure 3.
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In a BSP system, the only requirement is that the settings of AP_0, AP_1 and
AP_3 in each shelf together are unique within the BSP.

The address can be read from all plug-in unit slots. The address plugs are
inserted at the factory. All plug-in units support hot-swapping. All three address
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plugs are of type ROJ 119 2189/1.

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Figure 3
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EGEM2 Shelf with Address Plugs
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2.4 PFM-LOD and PFM-HOD
Each EGEM2 shelf houses two PFMs, either PFM-LOD 2400 (BFB 140 13/2),
or PFM-HOD 2400 (BFB 140 13/1). This gives a fully redundant system, as
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one PFM has capacity to supply power and cooling to the fully equipped
EGEM2. The PFMs have integrated soft start, short circuit protection, fan
control, supervision of all vital functions, and are externally controlled by the
SCX shelf manager.
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The two PFMs are covered by the front cover grid as shown in Figure 4. The
front plate for PFM-LOD 2400 is described in Figure 5. The front plate for
PFM-HOD 2400 is described in Figure 6.

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Figure 4
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Location of PFMs (LOD or HOD) in EGEM2 Shelf
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1 2 3 4 5 6 7
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LOD
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C0002110A

Figure 5 Front Plate of PFM-LOD 2400

The numbers for PFM-LOD 2400 in Figure 5 refer to the following:

1 Connector for Input Power 1 (right part) and Input Power


2 (left part)

2 Input Power 1

3 Input Power 2

4 Power

5 Maintenance

6 No optical indicator

7 No optical indicator

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1 2 3 4 5 6 7 8

HOD HOD

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C0002109A

Figure 6 Front Plate of PFM-HOD 2400

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The numbers for PFM-HOD 2400 in Figure 6 refer to the following:

1 Connector for Input Power 1 (right part) and Input Power

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2 (left part)

2 Input Power 1

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Input Power 2

Power
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5 Maintenance

6 Input Power 3
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7 Input Power 4

8 Connector for Input Power 3 (right part) and Input Power


4 (left part)
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Caution!

Rotating fan blades can cause injury to body parts that come into contact with
the blades. Blades in fan units continue to rotate for some time, even after
the fan has been switched off. Wait until fan blades have stopped rotating
completely before starting work on or near fans.

There is no finger protection for the fan propeller openings on the PFMs.
Protection is provided by the front cover grid. Keep the front cover on the shelf.

Be careful when replacing a power cable or a PFM to avoid accidents. Do not


put a hand in the air intake below the PFMs. Do not put a hand in the space
when a PFM is removed, as the fans in the other PFM still work. Always put

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BSP Hardware Description

back the front cover at the end of a replacement procedure. Access is allowed
for trained personnel only.

2.4.1 Power Distribution


In a BSP shelf, power is supplied to the backplane through two PFMs.

A PFM-LOD 2400 receives two 048 V DC inputs (2 × 1200 W) through a single


front connector, whereas a PFM-HOD 2400 receives three 048 V DC inputs (3

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× 800 W) through two front connectors. The inputs are combined and filtered,
and power is supplied to the backplane.

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Each PFM supplies all slots of the backplane and the other PFM for fan
redundancy reasons. Maximum fan power is 165 W (3 × 55 W) for the three
fans at full fan speed. This means 330 W (2 × 165 W) maximum fan power per

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shelf. Maximum power available for the blades in an EGEM2 shelf is thus
2070 W (2400 W 0 330 W).

2.4.2 Cooling IN
The power dissipation from the processor boards requires forced cooling by
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fans.

Cooling is provided by two PFMs, which are mounted in the lower part of each
EGEM2 shelf. The PFM consists of a low-height shelf with three fans and a
control board. The PFM fans are speed-controlled with thermal sensors that
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measure the air inlet temperature.

The semi-parallel cooling principle is used with the airflow going from the
bottom to the top of each shelf in the cabinet.
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The airflow through the EGEM2 shelves in a BSP hardware cabinet is shown
in Figure 7.

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Figure 7 Airflow in Cabinet with Three EGEM2 Shelves

2.5 SCXB3
The SCXB3 plug-in units are 15 mm wide. Each EGEM2 shelf includes two
SCXB3 units for redundancy. The SCXB3 units have their dedicated positions
in the slots 0 and 25 in the EGEM2 shelves. The SCXB3 is fed with 048 V
DC from the backplane.

SCXB3 front panel is shown in Figure 8.

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BSP Hardware Description

SCXB3 provides the following functions on the front:

• 3 × 10/100/1000 BASE-T Ethernet ports

• 4 × 10GE BASE-CX4 Ethernet ports

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Figure 8 SCXB3 Front Panel

The connectors at the front of the SCXB3 are described in Table 1.

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Table 1 SCXB3 Front Interfaces


Designation Interface Comments
Sync2 Clock synchronization port Not used in BSP
Ethernet Debug 10/100/1000 BASE-T For debug only
RS-232/Alarm Console port, serial debug connector Alarm handling, PBIST
GPS Frequency synchronization reference Not used in BSP
Sync1 Clock synchronization port Not used in BSP

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SC Serial control port Patch panel connector
RPBus Regional Processor (RP) bus port Not used in BSP
GE3 10/100/1000 BASE-T

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GE2 10/100/1000 BASE-T
GE1 10/100/1000 BASE-T

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E4 10GBASE-CX4 10 Gb/s only, no auto-negotiation
E3 10GBASE-CX4 10 Gb/s only, no auto-negotiation
E2
E1
10GBASE-CX4
10GBASE-CX4 IN 10 Gb/s only, no auto-negotiation
10 Gb/s only, no auto-negotiation
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2.6 CMXB3
BSP 8100 uses the CMXB3 EGEM2 version. The CMXB3 plug-in units are
15 mm wide. Each EGEM2 shelf includes two CMXB3 plug-in units for
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redundancy. The EGEM2 has dedicated positions for CMXBs, that is, slots 26
and 28. The CMXB3 is fed with 048 V DC from the backplane.

CMXB3 provides the following functions on the front:


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• Ethernet switching:

0 4 × 10/100/1000 Base-T ports

0 4 × 10GE BASE-CX4 ports

0 4 × 40GE BASE-CX4/CR4 ports

• Maintenance port:

0 1 × 1000 Base-T Ethernet, for maintenance and debug only

CMXB3 is shown in Figure 9.

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BSP Hardware Description

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Figure 9 CMXB3 Front Panel

The connectors at the front of the CMXB3 are described in Table 2.

Table 2 CMXB3 Front Interfaces


Designation Interface Comments
DBG 10/100/1000 BASE-T Not used in BSP
GE4 10/100/1000BASE-T Auto-negotiation enabled
GE3 10/100/1000BASE-T Auto-negotiation enabled
GE2 10/100/1000BASE-T Auto-negotiation enabled
GE1 10/100/1000BASE-T Auto-negotiation enabled

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Designation Interface Comments


E8 10GBASE-CX4 10 Gb/s
E7 10GBASE-CX4 10 Gb/s
E6 10GBASE-CX4 10 Gb/s
E5 10GBASE-CX4 10 Gb/s
E4 10GBASE-CX4 or -KR or 40GE 40 Gb/s
BASE-CR4
E3 10GBASE-CX4 or -KR or 40GE 40 Gb/s
BASE-CR4

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E2 10GBASE-CX4 or -KR or 40GE 40 Gb/s
BASE-CR4

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E1 10GBASE-CX4 or -KR or 40GE 40 Gb/s
BASE-CR4

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2.7 Active Patch Panel

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The APP is an Optical/Electrical (O/E) converter used for optical Ethernet
connection, and is located at the bottom of cabinet 1. It can be equipped
with both 1GE and 10GE O/E converters in the form of different SFP/SFP+
modules depending on the connectivity needs. The APPs are always used
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in pairs to provide the needed redundancy. These APPs are mandatory if
10GE is used for external communication, but optional if 1GE is used for
external communication. The APPs must be installed physically if 10GE is
used for external communication, if the BSP can be expanded to require 10GE
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connectivity, or if more applications may be added to this BSP requiring either


more bandwidth or more physical ports for physical separation of Virtual Private
Networks (VPNs).

APP KDU 137 557/5 is used for BSP 8100 and is shown in Figure 10 and
Figure 22.
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Figure 10 APP Front Panels

The APP is equipped with one 6-port 1GE daughter card and three 2-port 10GE
daughter cards.

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BSP Hardware Description

The 6-port 1GE card has DENSISHIELD™ connectors, each supporting two
1GE links, for the internal electrical interfaces and SFP cages for the external
1GE SFP modules.

The three 2-port 10GE cards have DENSISHIELD connectors for the CX4
interfaces and SFP+ cages for the 10GE SFP+ modules. The 10GE ports can
also, independent of each other, be configured to work in 1GE bypass mode; in
that case, a 1GE SFP module must be used.

The configuration is performed through the Command-Line Interface (CLI) by

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connecting to the SCX through RS-232.

An LM/DS75 temperature sensor is provided on the mother board. It is used for

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temperature alarm, thermal shutdown of daughter cards, and fan control.

This KDU variant is equipped with the Low Ohmic Distribution (LOD) energy

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backup card.

2.8 GEP
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GEP is the universal processing common component in EGEM2. It is the
processing element for basically all Ericsson applications designed for the
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X.86 processor architecture.

The GEPs are regularly upgraded with the latest technology. ‘‘BSP 8100 with
APP’’ supports GEP3, GEP5 and GEP7.
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2.8.1 GEP7
GEP7 is designed to work with different systems and applications requiring
high performance, energy efficiency, and cost effective solutions. It also gives
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superior capacity per volume. GEP7 is available in three different variants;


GEP7-64, GEP7-128-X, and GEP7-128-X16. GEP7 is fed with duplicated 048
V DC power from the backplane.

GEP7 is a 30 mm wide blade with the following:

• Processor: 64-bit, 14 cores, Intel™ Xeon™ E5-2658v4 (Broadwell)


processor running at 2.3 GHz, 35 MB cache

• Chipset: Coleto Creek PCH with accelerator

• System Memory: 64 GB or 128 GB, DDR4 VLP-DIMMs with ECC

• Storage: 400 GB or 1600 GB SSD (1 or 2x1.8” SSD, LSI SAS2308


controller)

• Front Panel Interface: DENSISHIELD combo connector with the following:

0 10/100/1000BASE-T and for maintenance

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0 RS-232 Console port

0 USB

• Backplane Interface: All GEP7 ‘‘-X’’ variants have 2 × 10GE, 2 × 1GE to


the back and an extra 2 × 10GE to the back on the adjacent slot.

All other GEP7 variants have 2 × 10GE and 2 × 1GE to the back.

The interfaces on the front panel are shown in Figure 11 and described in

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Table 3.

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Figure 11 GEP7 Front Panel

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BSP Hardware Description

Table 3 GEP7-64 Front Interfaces


Designation Interface Comments
X51 ITEST Debug port with BMC console
and external BIOS flash
X50 DBG Debug port with USB-0, BIOS
console and 1GE

2.8.2 GEP5

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GEP5 is available in eight different variants; GEP5-48GB, GEP5-E1/T1,
GEP5-400, GEP5-1200, GEP5-10GE, GEP5-64, GEP5-64-1200 and
GEP5-64-400. GEP5 is fed with duplicated 048 V DC power from the

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backplane.

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The GEP5 blade is a 30 mm wide blade with the following:

• Processor: one embedded x86, 64-bit, 10 cores, Intel Xeon E5-2658v2 (Ivy


Bridge) 95 W, 2.4 GHz, 25 MB cache
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Chipset: Cave Creek PCH (Southbridge, 1GbE, and accelerator)
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• System Memory: 48 GB or 64 GB, DDR3 Memory with ECC

• Storage: 400 GB or 1200 GB SSD (1 or 3 × 1.8” SSD, LSI SAS2308


controller)
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• Front Panel Interface: DENSISHIELD connectors > 2 ×


10/100/1000BASE-T; 1 × 10/100/1000BASE-T for maintenance; 1 ×
RS-232 Console port; USB port

• Backplane Interface: 2 × 10GBASE-KX4, 2 × 1000BASE-T.


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GEP5-64GB has an extra 2 × 10GBASE-KX4.

The indicators and connectors at the front of the GEP5-64 are shown in Figure
12 and described in Table 4.

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Figure 12 GEP5-64 Front Panel

Table 4 GEP5-48GB and GEP5-64GB Front Interfaces


Designation Interface Comments
USB-1 Mini USB connector Standard USB-2 interface with
the GEP as the host
ITEST Test interface with PCI express Allows for a graphics test board

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Designation Interface Comments


ETH-2/DEBUG Ethernet debug connection Debug and production test
CONS RS-232 port
ETH-1 Port is compatible with 1GE transmit/receive
10/100/1000 Mb/s Ethernet,
auto MDI-X
ETH-0 Port is compatible with 1GE transmit/receive
10/100/1000 Mb/s Ethernet,
auto MDI-X

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2.8.3 GEP3

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GEP3 is available in four different variants; GEP3-24GB, GEP3-E1/T1,
GEP3-HD300, and GEP3-HD600. GEP3 is fed with duplicated 048 V DC

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power from the backplane.

The GEP3 blade is a 30 mm wide blade with the following:


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6 cores, a 64-bit, Intel Xeon L5638 processor running at 2.00 GHz

12 MB on-die L2 cache; 24 GB DDR3 memory down


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• 2 × 10GE and 2 × 1GE to back, and 2 × 1GE to front

• Power, duplicated 048 V DC


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The indicators and connectors at the front of the GEP3-24GB are shown in
Figure 13 and described in Table 5.
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Hardware Structure

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Figure 13 GEP3-24GB Front Panel

Table 5 GEP3-24GB Front Interfaces


Designation Interface Comments
USB-1 Miniature USB connector USB2 interface
SATA-1 SATA connector External SATA interface
SATA-0/ USB SATA connector External SATA interface
ETH2/ DEBUG Ethernet connection Not intended for traffic; not enabled when
running vDicos operating system
CONS RS-232 port

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Designation Interface Comments


ETH-1 Port is compatible 1GE transmit/receive
with 10/100/1000 Mb/s
Ethernet, auto MDI-X
ETH-0 Port is compatible 1GE transmit/receive
with 10/100/1000 Mb/s
Ethernet, auto MDI-X

2.9 Dummy Unit

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Dummy boards are used to fill all empty slots in the shelves, to provide
adequate cooling and EMC shielding.

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A dummy unit with dimensions 265 × 225 × 15 mm is used in BSP 8100 and
is shown in Figure 14.

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Figure 14 Dummy Unit 15 mm

2.10 Indicators on Front Panels of Plug-In Units


The functions of the front panel indicators are described in Table 6.

Table 6 Indicators on Front Panels of Plug-In Units


Color Description

Red Fault indicator


Green Operational indicator
Blue Maintenance indicator
Yellow Status indicator

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Unit Positions and Connectors

3 Unit Positions and Connectors

The mechanical design of the BSP 8100 cabinets has a modular structure. One
benefit of the modularity is the possibility to define positions of shelves, plug-in
units, and connectors. This three-dimensional coordinate system enables an
unambiguous description of the position of all hardware items in the system.
The description is based on reference planes and lines of the different items.

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Generally, the reference planes and lines are found at the lower left of the
related items.

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The front view of a BSP 8100 cabinet with EGEM2 shelves is shown in Figure
15, which shows the positions of the shelves.

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Figure 15 Front View of BSP 8100

3.1 Positions at Cabinet Level


The module at cabinet level is 25 mm, see Figure 16 and Figure 17. The shelf
shown has the coordinates 0304.

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Figure 16 Vertical Coordinates of Cabinet

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Figure 17 Horizontal Coordinates of Cabinet

3.2 Positions at Shelf and Plug-In Unit Level


A plug-in unit in position 14 is shown in Figure 18. The connector is located in
horizontal position 15 and vertical position 14.

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Figure 18 Coordinates within Shelf
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In the Operation and Maintenance (O&M) system, plug-in units are installed
and addressed in slots.
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BSP 8100 Physical Connectivity

4 BSP 8100 Physical Connectivity

BSP 8100 does not have any defined configurations. For a brief description of
sample configurations and rules, see this section and Section 2 on page 3.

4.1 Cables

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Cables are sorted into two groups: internal and external.

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Internal cables are installed in the production factory, refer to Internal Cables
for BSP Hardware.

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External cables are installed at site when the system is installed, refer to
External Cables for BSP Hardware.

4.2 Physical Connectivity


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The cabling for ‘‘BSP 8100 with APP’’ on a six shelf node is shown in Figure 19
(for cabinet 1) and Figure 20 (for cabinet 2).

Figure 19 can also be used for cabling a BSP with one shelf or with two shelves.
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The cabling between the two cabinets is described in Figure 21, when the cable
entry is from above. The cable connection between the APPs in cabinet 1 and
SCXB/CMXB in shelf 0 is shown in Figure 22.

The Shelf IDs starts from 0.


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Figure 19 Cabling with Three Shelves in Cabinet 1

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Figure 20 Cabling with Three Shelves in Cabinet 2


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Figure 21 Cabling between Two Cabinets


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Figure 22 Cabling between APPs and CMXB/SCXB

The optional Capturing Unit (CU) is used per BSP, irrespective of the number
of shelves and cabinets that the BSP contains. This blade is shared by all
EL

BSP applications in all cabinets belonging to the same BSP. It can be located
in any of the slots 1–24, but only in shelf 1. The CU is located in shelf 0 if the
BSP contains only one shelf.

The current maximum deployment supported by BSP 8100 consists of two


PR

cabinets, where each cabinet can have up to three shelves. These shelves can
be connected and configured according to the BSP 8100 platform applications
needs.

4.3 SFP and SFP+ for Optical Connection


To enable communication between the APPs and an external system, SFP+
for 10GE optical connection, or SFP for 1GE optical connection, must be
inserted in the APPs.

The solutions listed in Table 7 are recommended to use.

Table 7 Recommended SFP and SFP+ for APP


Transceiver Description
RDH 102 44/1 SFP, 1000Base-SX optical transceiver,
Short Range transceiver for 1GE (SX)

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BSP Hardware Description

Transceiver Description
RDH 102 44/2 SFP, 1000Base-LX optical transceiver,
Long Range transceiver for 1GE (LX)
RDH 102 50/1 SFP+, 10GBase-SR optical transceiver,
Short Range transceiver for 10GE (SR)
RDH 102 50/3 SFP+, 10GBase-LR optical transceiver,
Long Range transceiver for 10GE (LR)

Y
4.4 Expansions in BSP 8100 with APP

R
Expansions are done by adding extra shelves or a second cabinet.

A
The shelves are installed starting from the bottom of the cabinet, so that the
first shelf is the lowest, the second one is in the middle, and the third one is on
the top. For a description of how the new shelves are installed, see Section
2 on page 3.
IN
An extra cabinet 2 is connected to cabinet 1 by 10GE/40GE links, see Figure
19 and Figure 20.
IM
EL
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Technical Data and Characteristics

5 Technical Data and Characteristics

This section provides technical data and characteristics for the BSP 8100
hardware.

5.1 Cabinet Dimensions

Y
The height for BYB 501 is 1800 mm, the width is 600 mm, and the depth is

R
400 mm.

A
5.2 Weight
The weight of the BSP 8100 components is described in Table 8.

Table 8
Component
IN
Weight of BSP 8100 Hardware Components
Weight (kg)
IM
Cabinet – BYB 501 67.6

EGEM2 Subrack – BFD 538 002/1 12.8

PFM 2400 LOD – BFB 140 13/2 5.2


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PFM 2400 HOD – BFB 140 13/1 4.4

SCXB3 – ROJ 208 395/1 0.8

CMXB3 – ROJ 208 392/1 0.8

GEP3-24GB – ROJ 208 821/3 1.4


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GEP3-HD600 – ROJ 208 844/3 1.7

GEP3-E1/T1 – ROJ 208 830/3 1.6

GEP5-48GB – ROJ 208 820/5 1.4

GEP5-64GB – ROJ 208 866/5 1.4

GEP5-400 – ROJ 208 840/5 1.5

GEP5-64-400 – ROJ 208 868/5 1.5

GEP5-1200 – ROJ 208 842/5 1.7

GEP5-64-1200 – ROJ 208 867/5 1.7

GEP5-10GE – ROJ 208 860/5 1.5

GEP5-E1/T1 – ROJ 208 830/5 1.5

GEP7-64 – ROJ 208 820/7 1.450

GEP7-128-X – ROJ 208 841/7 1.610

GEP7-128-X16 – ROJ 208 844/7 1.690

The maximal weight of a cabinet with three shelves is about 230 kg.

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BSP Hardware Description

5.3 Power Supply


The equipment is to be powered by redundant 048 V DC (nominal) supply as
specified in ETSI EN 300 132-2 or ANSI T1.315-2001 (R2006). The voltage
range for normal operation is 040.0 V DC through 057.0 V DC.

The platform uses one of the following power distribution principles:

• PFM-LOD (BFB 140 13/2), see Section 5.3.1 on page 36, or Section 5.3.2
on page 43.

Y
• PFM-HOD (BFB 140 13/1), see Section 5.3.3 on page 45.

R
PFM-LOD with Power Termination Module (PTM) is the recommended
alternative.

048 V DC to logic

A
Each plug-in unit has its own onboard conversion from
voltages.

IN
Strengthening cables are normally required in all 2-wire power arrangements.
Ericsson uses single-core 50 mm2-cables as standard. These cables are routed
along the shortest positive return conductor (from the nearest cabinet) to the
positive bar in the power supply equipment (0 V).
IM
For new installations, PFM-LOD must be connected to the customer LOD power
plant, and PFM-HOD must be connected to the customer HOD power plant. No
other combination is allowed. PFM-LOD must be ordered if the customer cannot
provide sufficient information that a true HOD power plant is used on site.
EL

5.3.1 LOD Power Supply with PTM


PR

Attention!

Note: A LOD cabinet always includes internal power cables to connect three
shelves, irrespective of how many shelves that are mounted in the
cabinet. External power cables between the power plant and PTM
must also be installed for three shelves, irrespective on how many
shelves that are mounted in the cabinet. The reason to this is that it
is not possible to expand existing PTM with more internal or external
power cables without shutting down the whole cabinet.

PFM-LOD is connected to a PTM in the cabinet. If the power cable entry is from
a cable ladder above, a PTM is located on top of the cabinet, that is PTM Over
Head (OH) is used. If the power cable entry is from below when using a raised
floor, a PTM is located on bottom of the cabinet, that is PTM Under Floor (UF) is
used. PFM-LOD with PTM OH is shown in Figure 23 and Figure 24. PFM-LOD

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Technical Data and Characteristics

with PTM UF is shown in Figure 25 and Figure 26. Termination positions for
internal node power cables for PTM OH are shown in Table 9. Termination
positions for internal node power cables for PTM UF are shown in Table 10.

A fully equipped cabinet requires 2 × 3 power connections, each to be fused


with an 80 A circuit breaker.

The power connections between PTM and PFM 2400 are routed in the rear
vertical cable duct on the left side. Feeding cables to APP are routed in the
front cable duct and do not connect to PTM.

Y
Related distribution cables in cable set NTB 101 634/1 are listed for each
position in Figure 23 and Figure 24. Related distribution cables in cable set

R
NTB 101 636/1 are listed for each position in Figure 25 and Figure 26.

The dimensioning of the power cable between PTM and the Power Plant is to

A
be described in a generic Customer Product Information (CPI) store for power
installation of an Ericsson Blade System (EBS) based node.

IN
IM
EL
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BSP Hardware Description

Y
R
A
IN
IM
EL
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Figure 23 Routing of Power Cables between PTM OH and PFM 2400

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Technical Data and Characteristics

Y
R
A
IN
IM
EL
PR

Figure 24 Side View of Cable Routing between PTM OH and PFM 2400

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BSP Hardware Description

Table 9 Power Termination Positions to PTM OH


Cable Set NTB 101 634/1
Cable Number Product Number PTM OH Position PFM Position
1 RPM 901 708/1 06 / black (minus polarity) 49

07 / grey (positive polarity)


2 RPM 901 708/2 02 / grey 47

03 / black

Y
3 RPM 901 708/3 14 / black 29

15 / grey
4 RPM 901 708/4 10 / grey 27

R
11 / black
5 RPM 901 708/5 22 / black 9

A
23 / grey
6 RPM 901 708/6 18 / grey 7

8
TSR 493 45/=
TSR 493 45/=
IN 19 / black
---
---
0
0
IM
9 3/TSR 490 090/= --- 4
10 3/TSR 490 090/= --- 3

Each termination position in PTM has a defined address-number according


EL

to Figure 27.
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Technical Data and Characteristics

Y
R
A
IN
IM
EL
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Figure 25 Routing of Power Cables between PTM UF and PFM 2400

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BSP Hardware Description

Y
R
A
IN
IM
EL
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Figure 26 Side View of Cable Routing between PTM UF and PFM 2400

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Technical Data and Characteristics

Table 10 Power Termination Positions to PTM UF


Cable Set NTB 101 636/1

Cable Number Product Number PTM UF Position PFM Position


1 RPM 901 709/1 02 / grey (positive polarity) 7

03 / black (minus polarity)


2 RPM 901 709/2 06 / black 9

07 / grey

Y
3 RPM 901 709/3 10 / grey 27

11 / black
4 RPM 901 709/4 14 / black 29

R
15 / grey
5 RPM 901 709/5 18 / grey 47

A
19 / black
6 RPM 901 709/6 22 / black 49

8
TSR 493 45/=
TSR 493 45/=
IN 23 / grey
---
---
0
0
IM
9 3/TSR 490 090/= --- 4
10 3/TSR 490 090/= --- 3

Each termination position in PTM has a defined address-number according


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to Figure 27.
PR

Figure 27 PTM Termination Positions

5.3.2 LOD Power Supply without PTM


A fully equipped cabinet requires either 2 × 6 power connections, each to be
fused with a 40 A circuit breaker (recommended), or 2 × 3 power connections,
each to be fused with an 80 A circuit breaker (not recommended).

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BSP Hardware Description

The two possible power supply cabling schemes for a BSP 8100 shelf with
PFM-LOD are shown in Figure 28 and Figure 29.

Y
R
A
IN
IM
EL
PR

Figure 28 Connecting EGEM2 Subracks to Central Power Distribution, LOD


with 40 A Circuit Breakers

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Technical Data and Characteristics

Y
R
A
IN
IM
EL

Figure 29 Connecting EGEM2 Subracks to Central Power Distribution, LOD


with 80 A Circuit Breakers
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5.3.3 HOD Power Supply


A cabinet with three shelves requires 2 × 9 power connections (2 × 6 power
cables), each to be fused with a 30 A circuit breaker in series with a 30 m

resistor.

The power supply cabling for a BSP 8100 shelf with PFM-HOD is shown in
Figure 30.

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BSP Hardware Description

Y
R
A
IN
IM
EL

Figure 30 Connecting EGEM2 Subracks to Central Power Distribution,


TS-HOD 800
PR

5.4 Power Consumption


The BSP 8100 hardware power consumption is provided in Table 11 and
Table 12.

Table 11 Power Consumption of BSP 8100 Components


Component Average Average Power Consumption Maximum Power
(W) Consumption (W)

PFM-LOD – BFB 140 13/2 30 110

PFM-HOD – BFB 140 13/1 30 110

SCXB3 – ROJ 208 395/1 51 63

CMXB3 – ROJ 208 392/1 88 110

GEP3-24GB – ROJ 208 821/3 95 120

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Technical Data and Characteristics

Component Average Average Power Consumption Maximum Power


(W) Consumption (W)

GEP3-E1/T1 – ROJ 208 830/3 110 137

GEP3-HD600 – ROJ 208 844/3 115 143

GEP5-48GB – ROJ 208 820/5 120 150

GEP5-64GB – ROJ 208 866/5 120 150

GEP5-10GE – ROJ 208 860/5 130 160

GEP5-400 – ROJ 208 840/5 140 175

Y
GEP5-64-400 – ROJ 208 868/5 140 175

GEP5-1200 – ROJ 208 842/5 140 175

R
GEP5-64-1200 – ROJ 208 867/5 140 175

GEP5-E1/T1 – ROJ 208 830/5 130 160

A
GEP7-64 – ROJ 208 820/7 115-130 182

GEP7-128-X – ROJ 208 841/7 127-137 192

GEP7-128-X16 – ROJ 208 844/7 130-140 195

Table 12
Sample Hardware
IN
Power Consumption of Sample Hardware Configuration
Average Power Consumption Maximum Power Consumption
IM
Configuration (W) (W)
BSP 8100 with one fully equipped 1790 2310
shelf
BSP 8100 with three fully 5370 6930
equipped shelves
EL

Note: The typical application power consumption with the fully equipped
shelves is shown in Table 12. For example, one fully equipped shelf
with one cluster can use two System Controllers (SCs) and 10 payload
blades within the EGEM2 BSP infrastructure.
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BSP Hardware Description

Y
R
A
IN
IM
EL
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Environmental Conditions

6 Environmental Conditions

Detailed information is received in applicable ‘‘Declaration of Conformity’’


(1/174 01-BFM 107 xxxx).

6.1 Climatic Conditions

Y
The cabinets are designed to operate in climatic conditions according to ETSI

R
EN 300 019-1-3, class 3.1 (indoor temperature controlled locations) and ANSI
T1.304-1997. The climatic conditions are specified in Table 13.

A
Table 13 Climatic Conditions
Normal in-use temperature +5C through +40C
Exceptional in-use temperature
IN
Recommended long-term average temperature (to
maximize the lifetime)
Transportation temperature
05C through +49C
+25C

According to ETSI EN 300 019-1-2, class 2.3:


IM
040C through +70C
Storage temperature According to ETSI EN 300 019-1-1, class 1.2:
025C through +55C
EL

6.2 Electromagnetic Compatibility


The equipment fulfills Electromagnetic Compatibility (EMC) requirements
according to the following:
PR

• ETSI EN 300 386 V1.5.1 (2010-10), Locations other than telecommunication


centers

• Telcordia GR-1089-CORE, Issue 5, August 2009 (Class B)

6.3 Product Safety


The equipment is certified to the following safety regulations:

• EN 60950-1 (LVD) for the European Union

• UL 60950-1 for USA

• IEC 60950-1 for international use

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BSP Hardware Description

6.4 RoHS Compliance


The equipment is designed to fulfill the European directive 2011/65/EU on
the restriction of the use of certain hazardous substances in electrical and
electronic equipment (RoHS).

6.5 Earthquake Resistibility


When equipped with earthquake resistant installation accessories, the cabinets

Y
fulfill the seismic requirements according to EN 300 019-2-3 and GR-63-CORE
zone 4 (NEBS SR-3580 level 3).

R
6.6 Dependability

A
The equipment is designed for High Availability. The internal LAN implements
1+1 redundancy, which applies to both hardware and software.

IN
IM
EL
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