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PANEL REPAIR FACTORY INDIA PVT. LTD.
(Registered with Startup India Program of Govt. of India)
INDIA’S NO. 1
Manufacturer & Exporters of ACF Bonding Machines (LCD TV Panels & Mobile Screens)

PRF-960 LCD/LED Panel Bonding Machine

Panel Repair Factory India Pvt. Ltd.

Address : A-42, Gate No- 4, 1st Floor, Mayapuri Phase-II,
New Delhi-110064
Tel No. : 011- 49123872
Mobile : +91 9810110049, +91 9999727372, +91 9990783338
Email : support@panelrepairfactory.com
Website : www.panelrepairfactory.com
 PANEL REPAIR
FACTORY INDIA PVT. LTD.
An Introduction to PRF Group
Panel Repair factory India Pvt. Ltd. with extensive
experienced team developed First Time in India ACF
Pulse Heating Bonding Machines For LCD TV Panels
and Mobile Phone Panels.
We have been into the development & production of
advanced Bonding Technology since last many years.
We are the Manufacturer & Exporters of ACF
Bonding Machine in New Delhi (India).
Our Mission
To achieve our vision through fairness, business ethics,
global reach, technological expertise, building long
term relationships with all our associates, customers,
partners, and employees
Our Vission
"To be a globally recognized corporation that provides
best technologies solutions, delivered by best-in-class
people."
Our Services
F Manufacturers of ACF Bonding Machines & Digital
Microscope & Special Bonding Work shop Table.
F PRF Institute of Technology.
F LED/LCD TV Panel & Mobile Repairs.
Our Values
Customer Delight:
A commitment to surpassing our customer
expectations.
Leadership by example:
A commitment to set standards in our business and
transactions based on mutual trust.
Integrity and Transparency:
A commitment to be ethical, sincere and open in our
dealing.
Pursuit of Excellence:
A commitment to strive relentlessly, to constantly
improve ourselves, our teams, our services and
products so as to become the best in class.
MACHINE INTRODUCTION
PRF-960 LCD/LED Panel Bonding Machine
 ACF Bonding Technology

F An electro-mechanical connection is created between two components

using anisotropic conductive lm (ACF).

F The conductive particles in the lm make contact in the Z- direction only
when heat and pressure are applied.

F A minimum contact time is required to ensure the adhesive cures properly.

F ACF-bonding is mostly used to create exible connections between

components such as excable to LCD and excable to PCB.

Working Concept of ACF Bonding

Chip on Film (COF)

Substrate (Glass or PCB)

Chip on Film (COF)

Substrate (Glass or PCB)

 ACF (Anisotropic Conductive Film) Bonding process flow

F Parts positioning F Parts alignment (xed, manual, automatic)

F Pulsed heat process F Pre bonding F Final bonding

 A view of Bonding Process Step by Step

Step 1: COF Removing from Panel

Step 2: COF Cleaning with ACF 450G

Step 3: Digital Microscope with Testing

Table

Step 4: COF Track checking on

Digital Microscope.

Step 5: Before bonding apply ACF

Tape on COF

Step 6: Finally the Bonding COF on

Glass side & PCB side.
 MACHINE DETAILS

Pressure Gauge

2 2
1. The working pressure at 2.8 kg/cm ~3.0 kg/cm is better.
2. Provide compressed air to the cylinder.
3. Display the input pressure and output or working
pressure.

COF alignment display screen, HMI, PID, Digital pressure

gauge Gauge controller and Digital gauge controller

1. Display screen: Display the situation of ITO of COF and

panels.
2. HMI: Parameter setting and functional operation.
3. PID: Temperature sensor and pulse generator.
4. Digital gauge: Show input pressure.
5. Gauge controller: Control input and output or working
pressure.
6. Digital gauge controller: Control digital gauge.

Power Switch

The power of the whole machine and upper light are on

and off.

Air Filter

In which lter is provided because Pneumatic equipment

part of the need to work as much as possible to provide
dry clean compressed air. And lubricator is provide for
maintain lubricants on pneumatic components
 1. Cylinder: the pressure required to provide ACF
pressure to contribute .
2. Thermocouple socket: temperature test line bridge
socket.
3. Silicone: silicone rubber device equipped with
retractable wheels.
4. Pulse heating components: accurately provide the
necessary heat energy for ACF particle blasting.
5. Quartz strip: to provide a high delity COF image of the
optical path.
6. Quartz table: the carrying and position adjustment of
quartz.

LCD glass platform

1. Provide a high degree of balance

2. Adjustable placement platform.
3. Glass table size is 1535*735*30(mm).
4. Non tempered glass is used.
5. It is easy deformation for toughened glass after
heating. Plane accuracy will decline.

Optical lens position adjustment

Lens X-Y-Z three position of the ne-tuning device

calibration and clear the Mark to read the ITO reference
point.

COF trimming fixture

COF placed on the mechanical arm, to achieve the

precise positioning of COF through the operation of the
respective ne tuning knob.
 Machine Button
1. Spot light
2. Crystal light
3. Press head controller
4. Head cool
5. PCB bonding
6. Glass bonding
7. Manual alignment
8. Manual bonding
9. Emergency stop
10. Vacuum

Equipment power supply and air pressure

supply

1. Machine power supply

2. Machine air pressure supply
3. Compressor power supply
4. Compressor pressure supply

Optical lens

The micron level ITO electrodes and COF electrodes are

amplied to provide a high degree of identication of the
image, the use of COF to ne tune the operation of the
device to achieve the Mark point precision alignment.

1. LCD Vacuum adsorption:

Suck the COF and LCD screen to maintain its stability.
2. Light down:
Help to see the electrodes more clear.
1.2 FEATURES

a. High denition interface and PLC control.

b. Multifunction and humanized operation use interface human-machine.
c. Vacuum absorption for stability of LCD screen.
d. Slowly movement of microscope for more accuracy in alignment.
e. HMI is used for better interface human and machine
f. PID is used as a temperature sensor and pulse generator.
g. Pressure gauge used for show input pressure also.

1.3. Safety Protection Function

a. Safety with emergency stop-switch, when temperature, thermocouple is abnormal, indicator will
prompt.
b. Has double bond restart protection, avoid careless boot device.

1.4. Alignment System

a. CENTRE XY control the optical system, control the movement of the COF xture. The x, y axis and θ angle with
the micrometer adjustment, precision positioning, alignment accuracy is ±0.01mm. c.v-groove positioning the COF
and PCB board.
b. Flexible and removable universal xture has protective effects and no damage to the COF, suitable for all kinds of
LCD repair.
c. Has alignment systems with 16”/18”/19” high denition industrial display.

1.5. Temperature System

a. Temperature control parameter is wrote into the program.

b. Save multiple-groups proles according to the need set and modify the temperature parameter on the touch screen
(HMI) at any time.
c. On the HMI screen, temperature curve can always be adjusted. The peak temperature has small error, +/-2
degrees Celsius. Response time is 3-4 seconds from room temperature to 180 degrees.

PRODUCT SPECIFICATIONS AND TECHNICAL PARAMETERS

Model PRF-960
Heating Mode Pulse
Available size 14-85 inch, all different brands of LCD
Suitable 2K, 4K,8K
SELEC temperature control module
Temperature curve Factory Reset
PID temperature
Peak temperature +/-2 degrees Celsius
control system
From room temperature to 180 degrees response time for 2 seconds
Thermonuclear type: K type
Materials: titanium alloy. Place of origin: India
 Plane precision (hot-pressing side) : 0.005 mm
Heat press head Size:(1.3*65)mm
Temperature:50-300 0C, adjustable
Quartz strip Plane precision (pressure surface): 0.005mm
Cylinder SMC
Industrial control unit PLCS
HDMI
COF alignment:under alignment (optical path: lens>quartz>ITO
electrode COF package)
PCB alignment: No
Microscope magnication: 20 ~ 100 consecutive times
Imaging unit
Number of lens: 2
COF alignment display: 16”/19”
PCB alignment display: 16”/19”
Light above : Yes Light down : Yes
Temperature:50-300 0C, adjustable
Place of origin: India
Type of guide rail : V guide rail
Accuracy: 0.01
COF trimming Unit
Adjustable direction: X/Y/θ
X-Y range: + / - 6.5mm
θ range: coarse adjustment 360 degrees, ne adjustment + / - 5 degrees
Mechanical clamping xture way, Z to tilt radius can be adjusted/
COF fixture
Adjustable horizontal angel/COF can be extended

Type of guide rail: precise cross rail .Control mode: X - Y - Z micrometer

Lens fine-tuning unit
Control
Silicone India, change position manually
LCD Vacuum adsorption Yes
LCD drive (platform) Sliding or xed optional manually Size: ( 6ft x 3ft ) / ( 5ft x 3ft )
Indicator Abnormal : temperature/thermocouple anomaly/actions
Heat press head alignment Independent pneumatic, Pressure reducing valve be adjusted manually
Control way Touch screen + button operation
According to the need to set to storage 26 groups of hot-pressing
Parameter setting
Parameters
Voltage 220V
Peak power 500W，working power 400W
Weight 350kg (Approx.)
Size of machine (mm) 1144*930*1500
 MACHINE FUNCTIONS AND USAGE
For the combination of hot state all kinds of FPC, and LCD, COF, TAB Panel and PCB, it is a
kind of high precision repair equipment for repair various size LCD screen
Application: used in large LCD production factory, TV maintenance market and appliance
repair market.
There are some problems that our machine can repair

Source driver X1 Fault

COF driver LCD panel Repair machine: FOG/COF Bonding Machine

Source driver X3 Fault Source driver X2 Fault

Repair machine: FOG/COF Bonding Machine Repair machine: FOG/COF Bonding Machine

Source driver X1 and X3 Fault Source and Gate driver X3 and Y2 Fault
Repair machine: FOG/COF Bonding Machine Repair machine: FOG/COF Bonding Machine
 ACCESSARIES WHICH REQUIRED FOR BONDING PROCESS

2. Magnier
1. Digital Microscope

4. 30W T Type Welding

3. 30W Soldering Iron
Head

6. Scissor
5. Small Plastic Bottle

8. ACF Remover Liquid

7. Empty Bottle 450G / 750G

9. ACF Tape for Glass:

Total 1.5mm
ACF Tape for PCB:
Total 2.0mm 10. Twizzer
Precaution: maintain
(50C to -80C)
Keep in Refrigerator

11. Teon Tape

 During the Bonding Process

Do... Don’t...
Dust free Envirnment
Do not eat, drink or
should have for Bonding
smoke in a room.
Process.

Wear Antistatic gloves,

Don’t wear shoes in machine
cap, jacket & shoes.
room.

Don’t work without

Flooring must be with
Antistatic gloves &
Antistatic mat.
jacket.

Keep away water,

Floor working table & all
chemical & ammable
electrical socket must be
liquids from Bonding
ground Earthing.
Machine.

Surface should be
Don’t wear loose clothes
Vibration free for better
when work on machine.
visibility of COF tracks.

Surface should be BALANCED

Don’t turn off the Power
SURFACE
balanced where machine while the machine is in
is installed. operation.

COF is cleaning only be Don’t move on tilt the

suggested chemicals (450G) machine when the power
is on.

ACF tape keep in cool Don’t allow untrained

place. (temp.- 50C-80C) workers to work on
machine.
 PRECAUTIONS FOR LCD/LED PANEL BONDING PROCESS
1. Bonding Process can happen only in dust free environment.
2. In COF bonding machine room you have to wear anti static gloves, cap, jacket and shoes.
3. COF bonding machine room should be neat and clean every day.
4. COF bonding machine working environment temperature should be as room temperature.
5. COF bonding machine room size should be at least 10X20 Ft.
6. Panel Cleaning Table and COF removing table should be separated.
7. Flooring must be with antistatic mat.
8. Floor, working table & all electrical socket must have ground Earthing.
9. Remove all loose conductive jewelry and trinkets, including rings, which may come in contact
with exposed circuits. (Do not wear long loose ties, scarves, or other loose clothing around
machines.)
10. When testing the panel no part of a live circuit should be touched by the bare hand.
11. Keep the body, or any part of it, out of the circuit. Where interconnecting wires and cable are
involved, they should be arranged so people will not trip over them.
12. Be as neat a possible. Keep the work area and workbench clear of items not used in the
experiment.
13. When unplugging a power cord, pull on the plug, not on the cable.
14. When disassembling a panel, rst remove the source of power.
15. No ungrounded electrical or electronic apparatus is to be used in the machine room unless it
is double insulated or battery operated.
16. Keep uids, chemicals, and beat away from COF bonding machine.
17. Surface should be balanced where the machine is installed.
18. Surface should be vibration free for better visibility of COF tracks on both displays.
19. At the time of COF cleaning only used suggested chemicals. (i.e. Acetone, Alchohal, ACF
Remover 450 G (Prefered))
20. At the time of bonding Head Teeth should be clean with IP and Sponge for proper bonding of
COF tracks.
0 0
21. ACF Tape keep in Refrigerator and after used place in Refrigerator. ( 5 C to 8 C )
22. COF removing and pasting table is needed for removing and pasting COF from LCD panels.
23. Cleaning of COF with ACF remover must be done by skilled engineer with Surgical rubber
gloves on hand.
24. For COF bonding process we have following accessories to be use
F Microscope 1 pc F Magnier 1 pc F 30 W Soldering Iron 1 pc
F T type welding head 1 pc F Hot strip 1 pc F Blade 1 Boxes
F Empty bottle 2 pc F ACF Remover liquid 250ml F Blue glue 50ml (Optional)
F ACF Tape for PCB (2.0mm) F ACF Tape for glass (1.5mm) F Small plastic bottle 2 pc
F TEFLON Tape 50m F Scissor 2 pc F Twizzer
PANEL REPAIR FACTORY INDIA PVT. LTD.
(Registered with Startup India Program of Govt. of India)
INDIA’S NO. 1
Manufacturer & Exporters of ACF Bonding Machines (LCD TV Panels & Mobile Screens)
Address: A-42, Gate No- 4, 1st Floor, Mayapuri Phase-II, New Delhi-110064
Tel No. : 011- 49123872 Mobile : +91 9810110049, +91 9999727372, +91 999078333
Email: support@panelrepairfactory.com Website: www.panelrepairfactory.com

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