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Technical Description
2/25 Technical Description hiT 7035
July 16, 2013 / Issue 10
The information in this document is subject to change without notice and describes only the product defined in the
introduction of this documentation. This documentation is intended for the use of Coriant customers only for the
purposes of the agreement underder which the document is submitted, and no part of it may be used, reproduced,
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trained
d personnel, and the customer assumes full
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Coriant will correct errors in this documentation as soon as possible. IN NO EVENT WILL CORIANT BE LIABLE
FOR ERRORS IN THIS DOCUMENTATION OR FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO
SPECIAL, DIRECT,, INDIRECT, INCIDENTAL OR CONSEQUENTIAL OR ANY LOSSES, SUCH AS BUT NOT
LIMITED TO LOSS OF PROFIT, REVENUE, BUSINESS INTERRUPTION, BUSINESS OPPORTUNITY OR
DATA,THAT MAY ARISE FROM THE USE OF THIS DOCUMENT OR THE INFORMATION IN IT.
This documentation and the e product it describes are considered protected by copyrights and other intellectual
property rights according to the applicable laws.
Other product names mentioned in this document may be trademarks of their respective owners, and they are
mentioned for identification
dentification purposes only.
Contents
1. Introduction ................................................................
........................................................................... 6
1.1 Editorials ................................
................................................................................................
......................................... 6
1.2 Next Generation SDH ......................................................................................
...................... 6
1.3 hiT 70 series ................................................................................................
................................ .................................... 7
6. Technical
al Specification .......................................................
....................... 17
6.1 Interface Types................................
..............................................................................................
.............................. 17
6.1.1 Electrical Interfaces .......................................................................................
....................... 17
6.1.2 Optical Interfaces ..........................................................................................
.......................... 18
6.2 Timing ................................................................................................
................................ ........................................... 18
6.3 Power Source ................................
................................................................................................
................................ 19
6.3.1 Power Supply ................................
................................................................................................
................................ 19
6.3.2 Cooling ................................
................................................................................................
.......................................... 19
6.3.3 Mechanical Structure .....................................................................................
..................... 19
6.4 Environment Requirements ................................................................
........................................... 19
6.4.1 Enhanced Temperature Variant ................................................................
..................................... 20
6.5 Vibration Tests ................................
..............................................................................................
.............................. 20
6.5.1 Shipping Test ................................
................................................................................................
................................ 20
6.5.2 Office Test ................................
................................................................................................
..................................... 21
6.5.3 Alarm Reports ...............................................................................................
................................ ............................... 21
List of Figures
Figure 1 - Future Traffic Growth ................................
................................................................................................
....................................... 7
Figure 2 - hiT 7035 chassis ................................
................................................................................................
.............................................. 9
Figure 3 - hiT 7035 termination and multiplexing capability ..................................................
.................. 11
Figure 4 - hiT 7035 termination and multiplexing capability ...........................................................
........................... 12
Figure 5 - hiT 7035 linear network configuration................................................................
............................................ 13
Figure 6 - hiT 7035 2-fiber MS-SPRing
SPRing application ................................................................
....................................... 13
Figure 7 - Multiple Ring closure
re at a single hiT 7025 node ......................................................
...................... 14
Figure 8 - hiT 7035 Chassis view ................................................................................................
................................... 15
Figure 8 – hiT 7035 Interface Types ..............................................................................................
.............................. 17
Figure 9 - hiT 7035 Environment Requirements ................................................................
............................................ 20
Figure 10 - Shipping Test Standards .............................................................................................
............................. 20
Figure 11 - Office test standards ................................................................................................
.................................... 21
6/25 Technical Description hiT 7035
July 16, 2013 / Issue 10
1. Introduction
1.1 Editorials
For almost two decades, Synchronous Digital Hierarchy (SDH) has been the preferred
transport technology over optical fibers. SDH is the dominant transport protocol in
virtually all long-haul
haul networks (voice and data) as well as in metro networks that
tha were
originally developed for voice traffic. As a resilient, well
well-understood
understood transport
mechanism, SDH has stood the test of time. Its reliability is uned. The ability of SDH to
support 50-msec
msec switching to backup paths, combined with extensive performance
performanc
monitoring features for carrier
carrier-class transport.
Legacy SDH was designed mainly to transport circuit oriented services like voice and as
such is an inherently rigid and inefficient method for transporting data. Traditionally a
single wire speed Gigabit Ethernet
thernet service (1.25G) will be allocated to one STM
STM-16
channel (2.5G). This means 48 % of the of this STM-16
STM 16 pipe remains as idle capacity.
7/25 Technical Description hiT 7035
July 16, 2013 / Issue 10
as well.
The solution is Next Generation SDHSDH—technology
technology that transforms rigid, circuit-oriented
circuit
SDH networks to a universal transport mechanism that is optimized for both voice and
data. The technology enables carriers to keep up with growing demands for bandwidth,
to efficiently carry both streaming and bursty traffic, and adapt to constantly changing
traffic patterns. Multiple protocols and thus services are supported: from basic TDM
voice, Ethernet, as well as SAN.
In order to address the varying needs and requirements of carrier‘s carrier, carrier
car and
enterprise, the hiT 70 series consists of a diverse range of products, namely:
2.1 Overview
3. System Application
E1
E3/DS3
10/100M STM-1/
1/-4/16
10/100/1000M hiT 7035
100M FX
GE
STM-1E
STM-1/4
ATM IMA
FC
STM-1/-4/16 STM-1/
1/-4/16
hiT 7035
E1
E3/DS3
100/100M
10/100/1000M
100M FX
GE
STM-1E
STM-1/4
ATM IMA
FC
3.1.3 Linear
3.1.4 Ring
Rings provide redundant bandwidth and/or equipment to ensure system integrity in the
event of any transmission or timing failure, including a fiber cut or node failure. A ring is a
collection of nodes that form a closed loop, in which each node is connected to adjacent
nodes.
hiT 7035 supports two-fiber
fiber MS
MS-SPRing.
SPRing. Figure below shows a hiT 7035 ring example.
hiT7035
hiT7035
A single network element as depicted in Figure 9 can interconnect two hiT 7035 rings
working at different or the same line speeds.
hiT7035 hiT7035
hiT7035 hiT7035
hiT 7035 provides data transport over SDH, and offers various data applications in
addition to traditional TDM applications. This offers service providers a cost
cost-effective,
effective,
simple, and reliable multi-service
service solution for their customers.
The use of GFP data mapping techniques within hiT 7035 greatly improves the
bandwidth efficiency of the connections.
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July 16, 2013 / Issue 10
4. System Description
hiT 7035 is designed to fit ETSI (21 inch) and EIA 300 (19 inch) requirements. A hiT
7035 chassis
sis view is shown below:
hiT 7035 supports multiple layer network protection functions and multiple layer
protection escalation. The network protection functions supported are:
• MS-SPRing,
SPRing, in compliance with ITU-T
ITU G.841
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July 16, 2013 / Issue 10
6. Technical
chnical Specification
Optical Interfaces:
STM-16
16 SFP interfaces S-16.1, L16.1 and L-16.2, V-16.2,
16.2, U-16.2
U
also FC 2G.
STM-4
4 SFP interfaces S-4.1, L4.1, L-4.2 and V-4.2
STM-1
1 SFP interfaces I-1 S-1.1, L1.1, L1.2 and V-1.2 also 100M FX
GE SFP interfaces SX, LX, LH, ZX also FC(1G)
STM-1
1 electrical SFP interfaces
Multi-rate
rate CWDM SFP interfaces G. 695 C8L1
C8L1-1D2 and C8L1-0D2
2.5G DWDM SFP interfaces 100G Hz channel grid
GE electrical
ical SFP interfaces
6.2 Timing
Additionally, hiT 7035 is able to provide retiming for E1 (2Mbit/s) traffic interfaces to
provide synchronized reference to another equipment.
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July 16, 2013 / Issue 10
6.3.2 Cooling
The equipment is assembled with one fan unit. It is field replaceable. Fan failure does
not affect service.
hiT 7035 system is designed to comply with the following ETSI requirements (ETS 300
019) on environmental conditions:
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July 16, 2013 / Issue 10
Depending on the used chassis variant of hiT 7035 also an operating temperature up to
55 degree is available.
This enhanced temperature variant has a more powerful fan assembly and is introduced
with system software R4.3.
Performance Guaranteed:
Operation for long term: -5°
5°C~55°C
Relative Humidity: 10%~100% (30°C)
The Element Management software logs the 10,000 latest failures in the alarm log and
independently reports the failure status change to the EMS. hiT 7035 allows users to
query alarm logs using a variety of criteria.
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July 16, 2013 / Issue 10
Abbreviation Definition
ADM Add
Add-Drop Multiplexer
AIS Alarm Indication Signal
APS Automatic Protection Switching
ASON Automatic Switched Optical Network
ASTN Automatic Switched Transport Network
ATM Asynchronous Transfer Mode
AU Administrative Unit
AU-n Administration Unit,level
Unit n
AUG Administration Unit Group
AU-PTR Administration Unit Pointer
BA Booster Amplifier
BBE Background Block Error
BBER Background Block Error Ratio
BER Bit Error Ratio
BITS Building Integrated Timing Supply
BML Business Management Layer
BoD Bandwidth on Demand
Broadband
Broadband-Remote Access Server
B-RAS
(or Broadband Access Management Switch)
CDV Cell Delay Variation
CLR Cell Loss Rate
CMI Coded Mark Inversion
C-n Container n
Container-
CORBA Common Object Request Broker ArchiTecture
CTD Cell Transfer Delay
CV Code Violation
DB Data Base
DBMS Data Base Management System
DCC Data Communications Channel
DCE Data Circuit
Circuit-terminating Equipment
DCF Data Communications Function
DCN Data Communications Network
DDN Digital Data Network
DNA Distributed Network ArchiTecture
DNI Dual Node Interconnection
DNU Do Not Use for Sync.
DTE Data Terminal Equipment
23/25 Technical Description hiT 7035
July 16, 2013 / Issue 10
Abbreviation Definition
DWDM Dense Wavelength-division
Wavelength Multiplexing
DXC Digital Cross Connect
ECC Embedded Control Channel
EM Element Management
EMC Electromagnetic Compatibility
EMI Electromagnetic Interference
EML Element Management Layer
EMS Element Management System
EOS Ethernet Over SDH
ES Error Second
ESD Electronic Static Discharge
ESR Error Second Ratio
ETSI European Telecommunication Standards Institute
FDM Frequency Division Multiplexing
FDDI Fiber Distributed Data Interface
FEBBE Far End Background Block Error
FEES Far End Errored Second
FESES Far End Severely Errored Second
GMPLS Generalized Multi-Protocol Label Switching
GUI Graphical User Interface
HDLC High Digital Link Control
HPC Higher order Path Connection
IP Internet Protocol
International Telecommunication Union-Telecommunication
Union Telecommunication
ITU-T
Standardization Sector
L2 Layer 2
LAN Local Area Network
LAPD Link Access Procedure On D
D-channel
LCT Local Craft Terminal
LMS Local NE Management System
LOF Loss Of Frame
LOM Loss of Multi-Frame
Multi
LOP Loss Of Pointer
LOS Loss Of Signal
LPC Lower order Path Connection
MAC Medium Access Control
MAN Metropolitan Area Network
MCU Micro Control Unit
MDI Miscellaneous Discrete Input
MDO Miscellaneous Discrete Output
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Abbreviation Definition
MM Multi Mode
MS Multiplex Section
MS-AIS Multiplex Sections - Alarm Indication Signal
MS-PSC Multiplex Sections - Protection Switching Count
MS-PSD Multiplex Sections - Protection Switching Duration
MS-SPRing Multiplexer Section Shared Protection Ring
MSAP Multiple Service Access Platform
MSOH Multiplex Section Overhead
MSP Multiplex Section Protection
MSTP Multiple Service Transport Platform
MSSP Multiple Service Switching Platform
MTBF Mean Time Between Failures
MTIE Maximum Time Interval Error
NE Network Element
NEF Network Element Function
NEL Network Element Layer
NML Network Manager Layer
NMS Network Management System
NUT Non
Non-preemptible and Unprotected Traffic
OAM Operation, Administration and Maintenance
OFS Out of Frame Second
OOF Out of Frame
OS Operation System
OSF Operation System Function
OSI Open System Interconnect
PCB Printed Circuit Board
PCM Pulse Code Modulation
PDH Plesiochronous Digital Hierarchy
PGND Protection GND
PJE+ Pointer Justification Event +
PJE- Pointer Justification Event -
POH Path Overhead
PPP Point to Point Protocol
PRC Primary Reference Clock
QA Q Adaptor
QoS Quality of Service
RAM Random Access Memory
RDI Remote Defect Indication
REI Remote Error Indication
REG Regenerator
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July 16, 2013 / Issue 10
Abbreviation Definition
RFI Remote Failure Indication
RIP Router Information Protocol
RMII Reduced Medium Independent Interface
RS Regenerator Section
RSOH Regenerator Section Overhead
SD Signal Degrade
SDH Synchronous Digital Hierarchy
SEC Station Equipment Clock
SES Severely Errored Second
SESR Severely Errored Second Ratio
SETS Synchronous Equipment Timing Source
SF Signal Failure
SFF Small Form Factor
SFP Small Form Factor Pluggable
SM Single Mode
SMCC Sub
Sub-network management control center
SML Service Management Layer
SMN SDH Management Network
1000
MBEint.Sli
Intranet
Phone
Internet
2000
10000
hiT7025
Source:
2002
2004
2006
2008
2010
Tbit/ss
WAN
de.8ADM
TM
Siemens SMS SDH Management Sub
Sub-Network
AG SMT Surface Mount Technology
2×
SNCP Sub
Sub-network Connection Protection
SOH Section Overhead
SPRING Shared Protection Ring
SSM Synchronous State Message
STM-N Synchronous Transport Module Level-N
Level
TCP Transport Control Protocol
TDEV Time Deviation
TDM Time Division Multiplex
TIF Telemetry Interface
TM Terminal Multiplexer
TMN Telecommunications Management Network
TU Tributary Unit
UAS Unavailable Second
VC Virtual Container
VC-n Virtual Container level n
VDN Virtual Data Network
VLAN Virtual Local Area Network
WAN Wide Area Network
WDM Wavelength Division Multiplexing