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1/25 SDH MSPP

Thomas Jost

Coriant hiT 7035


7

Technical Description
2/25 Technical Description hiT 7035
July 16, 2013 / Issue 10

The information in this document is subject to change without notice and describes only the product defined in the
introduction of this documentation. This documentation is intended for the use of Coriant customers only for the
purposes of the agreement underder which the document is submitted, and no part of it may be used, reproduced,
modified or transmitted in any form or means without the prior written permission of Coriant. The documentation
has been prepared to be used by professional and properly traine
trained
d personnel, and the customer assumes full
responsibility when using it. Coriant welcomes customer comments as part of the process of continuous
development and improvement of the documentation.

The information or statements given in this documentation cconcerning


oncerning the suitability, capacity, or performance of
the mentioned hardware or software products are given “as is” and all liability arising in connection with such
hardware or software products shall be defined conclusively and finally in a separate agreement
agreement between Coriant
and the customer. However, Coriant has made all reasonable efforts to ensure that the instructions contained in
the document are adequate and free of material errors and omissions. Coriant will, if deemed necessary by Coriant,
explain
n issues which may not be covered by the document.

Coriant will correct errors in this documentation as soon as possible. IN NO EVENT WILL CORIANT BE LIABLE
FOR ERRORS IN THIS DOCUMENTATION OR FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO
SPECIAL, DIRECT,, INDIRECT, INCIDENTAL OR CONSEQUENTIAL OR ANY LOSSES, SUCH AS BUT NOT
LIMITED TO LOSS OF PROFIT, REVENUE, BUSINESS INTERRUPTION, BUSINESS OPPORTUNITY OR
DATA,THAT MAY ARISE FROM THE USE OF THIS DOCUMENT OR THE INFORMATION IN IT.

This documentation and the e product it describes are considered protected by copyrights and other intellectual
property rights according to the applicable laws.
Other product names mentioned in this document may be trademarks of their respective owners, and they are
mentioned for identification
dentification purposes only.

Copyright © Coriant 2013. All rights reserved.


3/25 Technical Description hiT 7035
July 16, 2013 / Issue 10

Contents
1. Introduction ................................................................
........................................................................... 6
1.1 Editorials ................................
................................................................................................
......................................... 6
1.2 Next Generation SDH ......................................................................................
...................... 6
1.3 hiT 70 series ................................................................................................
................................ .................................... 7

2. hiT 7035 Overview ................................................................


................................ 8
2.1 Overview ................................
................................................................................................
......................................... 8
2.2 Data Capabilities ...........................................................................................
................................ ........................... 10

3. System Application .............................................................


............................. 10
3.1 Networking Capability ....................................................................................
.................... 10
3.1.1 Termination and Multiplexing (TM) ................................................................
................................ 10
3.1.2 Hubbing and Local Cross Connect ................................................................
................................ 11
3.1.3 Linear ................................
................................................................................................
............................................ 13
3.1.4 Ring ................................................................................................
................................ ............................................... 13
3.1.5 Multiple Ring Closure ....................................................................................
.................... 14
3.2 Ethernet Service Applications ................................................................
........................................ 14

4. System Description .............................................................


............................. 15
4.1 Physical Structure and Module Construction .................................................
................................ 15

5. Protection and Redundancy ................................................


................ 15
5.1 Network Protection ........................................................................................
........................ 15

6. Technical
al Specification .......................................................
....................... 17
6.1 Interface Types................................
..............................................................................................
.............................. 17
6.1.1 Electrical Interfaces .......................................................................................
....................... 17
6.1.2 Optical Interfaces ..........................................................................................
.......................... 18
6.2 Timing ................................................................................................
................................ ........................................... 18
6.3 Power Source ................................
................................................................................................
................................ 19
6.3.1 Power Supply ................................
................................................................................................
................................ 19
6.3.2 Cooling ................................
................................................................................................
.......................................... 19
6.3.3 Mechanical Structure .....................................................................................
..................... 19
6.4 Environment Requirements ................................................................
........................................... 19
6.4.1 Enhanced Temperature Variant ................................................................
..................................... 20
6.5 Vibration Tests ................................
..............................................................................................
.............................. 20
6.5.1 Shipping Test ................................
................................................................................................
................................ 20
6.5.2 Office Test ................................
................................................................................................
..................................... 21
6.5.3 Alarm Reports ...............................................................................................
................................ ............................... 21

7. Appendix 1: Definitions and Abbreviations .......................... 22


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July 16, 2013 / Issue 10
5/25 Technical Description hiT 7035
July 16, 2013 / Issue 10

List of Figures
Figure 1 - Future Traffic Growth ................................
................................................................................................
....................................... 7
Figure 2 - hiT 7035 chassis ................................
................................................................................................
.............................................. 9
Figure 3 - hiT 7035 termination and multiplexing capability ..................................................
.................. 11
Figure 4 - hiT 7035 termination and multiplexing capability ...........................................................
........................... 12
Figure 5 - hiT 7035 linear network configuration................................................................
............................................ 13
Figure 6 - hiT 7035 2-fiber MS-SPRing
SPRing application ................................................................
....................................... 13
Figure 7 - Multiple Ring closure
re at a single hiT 7025 node ......................................................
...................... 14
Figure 8 - hiT 7035 Chassis view ................................................................................................
................................... 15
Figure 8 – hiT 7035 Interface Types ..............................................................................................
.............................. 17
Figure 9 - hiT 7035 Environment Requirements ................................................................
............................................ 20
Figure 10 - Shipping Test Standards .............................................................................................
............................. 20
Figure 11 - Office test standards ................................................................................................
.................................... 21
6/25 Technical Description hiT 7035
July 16, 2013 / Issue 10

1. Introduction

1.1 Editorials

This document is a technical description for the product hiT


iT 7035. The technical
descriptions of other products of the hiT 70 series are also available. This document is
not a marketing document. The target of this document is to inform on detail about the
product, product features and the application in the network environment.
It is not a document for advertisement purposes but it is useful to inform our customer in
detail in the after sales period. For marketing and advertisement related product
information please contact the sales department.
If the reader is looking for information on the basis technologies please refer to 9
Appendix 2: Basis Technologies.

1.2 Next Generatio


Generation SDH

For almost two decades, Synchronous Digital Hierarchy (SDH) has been the preferred
transport technology over optical fibers. SDH is the dominant transport protocol in
virtually all long-haul
haul networks (voice and data) as well as in metro networks that
tha were
originally developed for voice traffic. As a resilient, well
well-understood
understood transport
mechanism, SDH has stood the test of time. Its reliability is uned. The ability of SDH to
support 50-msec
msec switching to backup paths, combined with extensive performance
performanc
monitoring features for carrier
carrier-class transport.
Legacy SDH was designed mainly to transport circuit oriented services like voice and as
such is an inherently rigid and inefficient method for transporting data. Traditionally a
single wire speed Gigabit Ethernet
thernet service (1.25G) will be allocated to one STM
STM-16
channel (2.5G). This means 48 % of the of this STM-16
STM 16 pipe remains as idle capacity.
7/25 Technical Description hiT 7035
July 16, 2013 / Issue 10

Figure 1 - Future Traffic Growth

The phenomenal growth in bandwidth, connectivity and content


content generated by the
Internet, Intranet and broadband applications, has made native data transfer a very
important criteria for telecommunication infrastructure (see Figure 1). Ethernet has
become the de facto standard for enterprise networks. In Storage
Storage Area Networks (SAN
ESCON TM , FICON TM and Fiber Channel are by far today‘s most dominating technology
P
P
P
P

as well.
The solution is Next Generation SDHSDH—technology
technology that transforms rigid, circuit-oriented
circuit
SDH networks to a universal transport mechanism that is optimized for both voice and
data. The technology enables carriers to keep up with growing demands for bandwidth,
to efficiently carry both streaming and bursty traffic, and adapt to constantly changing
traffic patterns. Multiple protocols and thus services are supported: from basic TDM
voice, Ethernet, as well as SAN.

1.3 hiT 70 series

Coriant has introduced a new ra range


nge of equipment that makes the promise of Next
Generation SDH a reality: the hiT 70 series
series.. This platform provides the flexibility of true
packet switching and Ethernet transport, while operating with the inherent reliability of
SDH. Multiple network elementsents are integrated and consolidated into a single compact
unit. The efficiency of this approach, together with extensive use of highly integrated
components allows the hiT 70 series to be offered at lower costs than current solutions.

Data + Voice = hiT 70 series


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July 16, 2013 / Issue 10

In order to address the varying needs and requirements of carrier‘s carrier, carrier
car and
enterprise, the hiT 70 series consists of a diverse range of products, namely:

• hiT 7080 ADM / CC, multiple STM-64


• hiT 7065 ADM / CC, multiple STM-64
• hiT 7060 HC ADM 64, multiple STM-16
• hiT 7060 ADM, multiple STM-16
• hiT 7035 ADM, STM-16, STM- 4, STM-1
• hiT 7025 ADM, STM-16, STM-4, STM-1
• hiT 7030 ADM 4/1 modular
• hiT 7020 ADM 4/1 single board CPE

This Technical Description covers hiT 7035,


70 only.

2. hiT 7035 Overview

2.1 Overview

hiT 7035 is a compact carrier class full blown STM


STM-4/-1 add-drop-multiplexer
multiplexer which can
be upgraded to a compact STM
STM-16 ADM.
hiT 7035 supports core equipment protection with no single point of failure, and PDH
electrical protection.
It offers rich Ethernet features.
Applications:
• Optimized for SDH applications with data capabilities
• In transmission networks of mobile network
• Central office STM-16/
16/-4/-1 add drop multiplexer
• High-end enterprise services

hiT 7035 offers a High Order cross


c connection capacity up to 32.8G
G and a Low Order
cross connection capacity up to 5G.
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July 16, 2013 / Issue 10

Figure 2 - hiT 7035 chassis

hiT 7035 offers a powerful and cost-effective


cost effective product design for PDH, SDH and data
applications independent if these applications capabilities are requested for use in
central offices, fixed part of mobile networks or in combination with high-end enterprise
services.
hiT 7035 supports the complete range of PDH and SDH interfaces ranging from E1,
E3/DS3, STM-1 1 el./opt. to STM-4
STM and even STM-16. 16. It provides a full suite of SDH
functions including mapping, multiplexing, cross
cross-connection
connection and various protection
schemes.
hiT 7035 has a modular and scalable design, enabling a pay-as-you-grow
pay grow deployment
plan. The system can be initially deployed as a low cost, modest capacity system, and
then enlarged to a high capacity, multi-service
multi service system. A large variety of service
modules ensure a cost-effective
effective match with service demands of today while retaining
superior flexibility to meet future service requirements.
Its advance software architecture design results in a highly fault-tolerant
fault tolerant system.
Combined with built-in
in hardwa
hardware redundancies, hiT 7035 achieves carrier-classclass reliability
with 99.999% availability.
The system is fully compliant with ITU-T
ITU and/or IEEE standards, and is inter--operable
with other standards-based
based SDH, multi
multi-service
service transport, and data communication
products.
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July 16, 2013 / Issue 10

Utilizing hiT 7035 in combination with the multi


multi-service capabilities of Coriant TNMS
network management system, service providers can cost-effectively
cost effectively grow their
embedded base networks or launch new networks

2.2 Data Capabilities

hiT 7035 supports GFP (ITU-T


T G.7041 / Y.1303) encapsulation for Ethernet data.

3. System Application

hiT 7035 multi-service


service access platform is a highly flexible product capable of supporting
a variety of network applications like bandwidth access, service-on-demand
service demand and LAN
services.
hiT 7035 can be configured in such a way that it supports a large variety of network
applications with any mix of PDH, SDH and Ethernet services.

3.1 Networking Capability

hiT 7035 provides high flexibility and compactness supporting


supporting a large variety of
configurations for STM-16,
16, STM
STM-4 and STM-1 network applications:
• Termination and multiplexing
• Small local cross connect
• Linear
• Ring
• Multi Ring closure

3.1.1 Termination and Multiplexing (TM)

hiT 7035 system can be configured to function as a hub


hub-Terminal at STM-16,
16, STM
STM-4 or
STM-1 level
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July 16, 2013 / Issue 10

E1
E3/DS3
10/100M STM-1/
1/-4/16
10/100/1000M hiT 7035
100M FX
GE
STM-1E
STM-1/4
ATM IMA
FC

Figure 3 - hiT 7035 termination and multiplexing capability

3.1.2 Hubbing and Local Cross Connect

hiT 7035 system can be used to function as a small local cross


cross-connect
connect system (or can
be applied in hubbing
ubbing configurations). This allows various hybrid network architectures
with a variety of connection speeds and network topologies such as rings, multi-rings,
multi
subtending rings, or linear structures. This eliminates the need for back-to-back
back back
terminals and greatly increases network flexibility.
hiT 7035 can serve a cluster of other terminals, for example hiT 7030 or other vendor’s
products that have standard SDH interfaces, located at remote sites, through point-to-
point
point connections with optional 1+1 MSP protection. It also serves as an aggregation
Hub for Subtending Rings. This feature eliminates back
back-to-backk terminals that would be
required to serve multi-ring
ring connections using equipment with less ring
ring-closure
closure
capabilities.
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July 16, 2013 / Issue 10

STM-1/-4/16 STM-1/
1/-4/16
hiT 7035

E1
E3/DS3
100/100M
10/100/1000M
100M FX
GE
STM-1E
STM-1/4
ATM IMA
FC

Figure 4 - hiT 7035 termination and multiplexing capability


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July 16, 2013 / Issue 10

3.1.3 Linear

hiT 7035 supports STM-16/-4/


4/-1
1 linear network topology as depicted in figure below:

hiT7035 hiT7035 hiT7035


TM ADM TM

Figure 5 - hiT 7035 linear network configuration

3.1.4 Ring

Rings provide redundant bandwidth and/or equipment to ensure system integrity in the
event of any transmission or timing failure, including a fiber cut or node failure. A ring is a
collection of nodes that form a closed loop, in which each node is connected to adjacent
nodes.
hiT 7035 supports two-fiber
fiber MS
MS-SPRing.
SPRing. Figure below shows a hiT 7035 ring example.

hiT7035

hiT7035 2-Fiber STM-4/16 ring hiT7035

hiT7035

Figure 6 - hiT 7035 2-fiber MS-SPRing application

When using the MS-SPRing


SPRing protection mechanism, rings ranging from 3 to 16 nodes are
supported (the maximum of 16 nodes in a ring is specified in G.841). They
They perform
automatic protection switching (revertive) in less than 50 milliseconds.
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July 16, 2013 / Issue 10

3.1.5 Multiple Ring Closure

A single network element as depicted in Figure 9 can interconnect two hiT 7035 rings
working at different or the same line speeds.

hiT7035 hiT7035

Ring 1 hiT7035 Ring 2


hiT7035 hiT7035
1/4/16)
(STM-1/4/16) (STM-4/16)

hiT7035 hiT7035

Figure 7 - Multiple Ring closure at a single hiT 7025 node

3.2 Ethernet Service Applications

hiT 7035 provides data transport over SDH, and offers various data applications in
addition to traditional TDM applications. This offers service providers a cost
cost-effective,
effective,
simple, and reliable multi-service
service solution for their customers.
The use of GFP data mapping techniques within hiT 7035 greatly improves the
bandwidth efficiency of the connections.
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July 16, 2013 / Issue 10

4. System Description

4.1 Physical Structure and Module Construction

hiT 7035 is designed to fit ETSI (21 inch) and EIA 300 (19 inch) requirements. A hiT
7035 chassis
sis view is shown below:

Figure 8 - hiT 7035 Chassis view

hiT 7035 sub-rack


rack is structured using a vertical oriented, multi-card
multi chassis.

5. Protection and Redundancy

5.1 Network Protection

hiT 7035 supports multiple layer network protection functions and multiple layer
protection escalation. The network protection functions supported are:

• MS-SPRing,
SPRing, in compliance with ITU-T
ITU G.841
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July 16, 2013 / Issue 10

• MSP 1+1 protection, revertive or non


non-revertive modes, in compliance
nce with ITU
ITU-T
G.841
• SNCP at VC-12, VC-3,
3, VC-4,
VC VC-4-4c level in compliance with ITU-T
T G.841
• Rapid Spanning Tree Protocol (RSTP) to provide Layer 2 Ethernet data
protection by converging data to another path, in compliance with IEEE 802.1w
protocol
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July 16, 2013 / Issue 10

6. Technical
chnical Specification

6.1 Interface Types

hiT 7035 supports the following interfaces listed in Table below:

Interface Types Interface Name and Rates


10/100M Base-T
10/100/1000 Base-T
Electrical Interface E1 (2048kbit/s)
E3/DS3
1 el. (155.520Mbit/s)
STM-1
STM-1
1 (155.520Mbit/s)
STM-4
4 (622.080Mbit/s)
STM-16 (2.5 Gbit/s)
Optical Interface
GE
FC
100M FX
2048kbit/s
Timing Interface
2048kHz
Auxiliary Management and Maintenance Interface)
Interface RS-232, RJ-45
45 (802.3 LAN)
TIF (MDO or MDI) RJ-45
Data Channels 64Kbps/s, G703, RJ45

Figure 9 – hiT 7035 Interface Types

6.1.1 Electrical Interfaces

hiT 7035 Ethernet 10/100M Base


Base-T rate-adaptive
adaptive electrical interface complies with IEEE
Standard 802.3. The transmission media is 100 Ohms
Ohms–twotwo pairs shielded twisted pair
cable (STP) and two pairs of unshielded twisted pair cable (Category 5 UTP); the
interface
e connector is using standard RJ
RJ-45 (1000ohm) connector.
hiT 7035 STM-1E
1E interface complies with ITU-T
ITU T G.703 Recommendation and uses CC4
connector (75 ohm) unbalanced.
hiT 7035 E3/DS3 interface complies with ITU
ITU-T
T G.703 Recommendation and uses CC4
connectorr (75ohm) unbalanced.
hiT 7035 E1 interface complies with ITU
ITU-T
T G.703 Recommendation, and uses 2mm High
Density (75ohm or 120ohm) connector.
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6.1.2 Optical Interfaces

hiT 7035 optical interfaces comply with ITU-T


ITU T Recommendations G.957 and G.691. The
SFP opticall modules are field replaceable.

Optical Interfaces:
STM-16
16 SFP interfaces S-16.1, L16.1 and L-16.2, V-16.2,
16.2, U-16.2
U
also FC 2G.
STM-4
4 SFP interfaces S-4.1, L4.1, L-4.2 and V-4.2
STM-1
1 SFP interfaces I-1 S-1.1, L1.1, L1.2 and V-1.2 also 100M FX
GE SFP interfaces SX, LX, LH, ZX also FC(1G)
STM-1
1 electrical SFP interfaces
Multi-rate
rate CWDM SFP interfaces G. 695 C8L1
C8L1-1D2 and C8L1-0D2
2.5G DWDM SFP interfaces 100G Hz channel grid
GE electrical
ical SFP interfaces

Laser safety for the STM-16,


16, STM-4
STM and STM-1
1 optical interface: complies with IEC
IEC-
60825 recommendations

6.2 Timing

hiT 7035 provides the following timing clock interfaces:


External clock source (T3): 2 input port, 2048kbit/s (G.703
(G.703-6) orr 2048 kHz (G.703-
(G.703
10)75Ω
Synchronize output (T4): 2 output port, 2048kbit/s (G.703)75Ω
(G.703)75
hiT 7035supports the selection of the following 4 timing references:
• Line/tributary timing (STM--1/-4/-16 lines, or E1 tributary)
• External station clock timing
• Internal clock (ITU-T
T G.813 option 1)
• E1 tributary timing (any E1 port can be selected as the timing source)

Additionally, hiT 7035 is able to provide retiming for E1 (2Mbit/s) traffic interfaces to
provide synchronized reference to another equipment.
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July 16, 2013 / Issue 10

6.3 Power Source

6.3.1 Power Supply

hiT 7035 supports -48V/60V


48V/60V (-40.5~-72.0
( 72.0 V) DC power supply, support load balanced
1+1 power supply modular protection.

6.3.2 Cooling

The equipment is assembled with one fan unit. It is field replaceable. Fan failure does
not affect service.

6.3.3 Mechanical Structure

hiT 7035 chassis mechanical parameters:


Height: 486mm (11U)
Width: 403mm
Depth: 240mm (300 mm back
back-to-door)

hiT 7035 can be installed in the following types of racks:


EIA 310 19”
2200mm(Height) × 600mm (Width) × 300mm (Depth)
2600mm(Height)×600mm(Width)×300mm(Depth)
600mm(Height)×600mm(Width)×300mm(Depth)

Depending on the electrical cable


cab load you can install up to three hiT 7035 chassis into a
2200mm high ETSI rack or an EIA 310 19” rack ( typically two systems per rack ).

6.4 Environment Requirements

hiT 7035 system is designed to comply with the following ETSI requirements (ETS 300
019) on environmental conditions:
20/25 Technical Description hiT 7035
July 16, 2013 / Issue 10

ETSI Class 3.2 on Environment


ETSI Class 1.2 on Storage
ETSI Class 2.3 on Transportation
The environmental conditions required by hiT 7035 are
ar as follows:

Environmental Condition Temperature Relative Humidity


Transport and storage -20º ~ 60ºC 2% ~ 98%
Operation for long term -5º ~ 45ºC 5% ~ 90% (30ºC)
Operation for short term -10º ~ 50ºC 5% ~ 90% (30ºC)

Figure 10 - hiT 7035 Environment Requirements

6.4.1 Enhanced Temperature Variant

Depending on the used chassis variant of hiT 7035 also an operating temperature up to
55 degree is available.
This enhanced temperature variant has a more powerful fan assembly and is introduced
with system software R4.3.
Performance Guaranteed:
Operation for long term: -5°
5°C~55°C
Relative Humidity: 10%~100% (30°C)

6.5 Vibration Tests

6.5.1 Shipping Test

hiT 7035 meets the following shipping test standards.

Test Test Standard


Amplitude (>= 0.6 mm) ETSI
Acceleration (>= 15 m/s
m/s—X, Y, Z three directions) ETSI
Test time (>=3 hours) ETSI

Figure 11 - Shipping Test Standards


21/25 Technical Description hiT 7035
July 16, 2013 / Issue 10

6.5.2 Office Test

hiT 7035 meets the following office test standards.

Test Test Standard


Amplitude (>= 0.6 mm) ETSI
Acceleration (>= 15 m/s—
—X, Y, Z three directions) ETSI
Test time (>= 3 hours) ETSI

Figure 12 - Office test standards

6.5.3 Alarm Reports

The Element Management software logs the 10,000 latest failures in the alarm log and
independently reports the failure status change to the EMS. hiT 7035 allows users to
query alarm logs using a variety of criteria.
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July 16, 2013 / Issue 10

7. Appendix 1: Definitions and Abbreviat


Abbreviations
ions

Abbreviation Definition
ADM Add
Add-Drop Multiplexer
AIS Alarm Indication Signal
APS Automatic Protection Switching
ASON Automatic Switched Optical Network
ASTN Automatic Switched Transport Network
ATM Asynchronous Transfer Mode
AU Administrative Unit
AU-n Administration Unit,level
Unit n
AUG Administration Unit Group
AU-PTR Administration Unit Pointer
BA Booster Amplifier
BBE Background Block Error
BBER Background Block Error Ratio
BER Bit Error Ratio
BITS Building Integrated Timing Supply
BML Business Management Layer
BoD Bandwidth on Demand
Broadband
Broadband-Remote Access Server
B-RAS
(or Broadband Access Management Switch)
CDV Cell Delay Variation
CLR Cell Loss Rate
CMI Coded Mark Inversion
C-n Container n
Container-
CORBA Common Object Request Broker ArchiTecture
CTD Cell Transfer Delay
CV Code Violation
DB Data Base
DBMS Data Base Management System
DCC Data Communications Channel
DCE Data Circuit
Circuit-terminating Equipment
DCF Data Communications Function
DCN Data Communications Network
DDN Digital Data Network
DNA Distributed Network ArchiTecture
DNI Dual Node Interconnection
DNU Do Not Use for Sync.
DTE Data Terminal Equipment
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Abbreviation Definition
DWDM Dense Wavelength-division
Wavelength Multiplexing
DXC Digital Cross Connect
ECC Embedded Control Channel
EM Element Management
EMC Electromagnetic Compatibility
EMI Electromagnetic Interference
EML Element Management Layer
EMS Element Management System
EOS Ethernet Over SDH
ES Error Second
ESD Electronic Static Discharge
ESR Error Second Ratio
ETSI European Telecommunication Standards Institute
FDM Frequency Division Multiplexing
FDDI Fiber Distributed Data Interface
FEBBE Far End Background Block Error
FEES Far End Errored Second
FESES Far End Severely Errored Second
GMPLS Generalized Multi-Protocol Label Switching
GUI Graphical User Interface
HDLC High Digital Link Control
HPC Higher order Path Connection
IP Internet Protocol
International Telecommunication Union-Telecommunication
Union Telecommunication
ITU-T
Standardization Sector
L2 Layer 2
LAN Local Area Network
LAPD Link Access Procedure On D
D-channel
LCT Local Craft Terminal
LMS Local NE Management System
LOF Loss Of Frame
LOM Loss of Multi-Frame
Multi
LOP Loss Of Pointer
LOS Loss Of Signal
LPC Lower order Path Connection
MAC Medium Access Control
MAN Metropolitan Area Network
MCU Micro Control Unit
MDI Miscellaneous Discrete Input
MDO Miscellaneous Discrete Output
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Abbreviation Definition
MM Multi Mode
MS Multiplex Section
MS-AIS Multiplex Sections - Alarm Indication Signal
MS-PSC Multiplex Sections - Protection Switching Count
MS-PSD Multiplex Sections - Protection Switching Duration
MS-SPRing Multiplexer Section Shared Protection Ring
MSAP Multiple Service Access Platform
MSOH Multiplex Section Overhead
MSP Multiplex Section Protection
MSTP Multiple Service Transport Platform
MSSP Multiple Service Switching Platform
MTBF Mean Time Between Failures
MTIE Maximum Time Interval Error
NE Network Element
NEF Network Element Function
NEL Network Element Layer
NML Network Manager Layer
NMS Network Management System
NUT Non
Non-preemptible and Unprotected Traffic
OAM Operation, Administration and Maintenance
OFS Out of Frame Second
OOF Out of Frame
OS Operation System
OSF Operation System Function
OSI Open System Interconnect
PCB Printed Circuit Board
PCM Pulse Code Modulation
PDH Plesiochronous Digital Hierarchy
PGND Protection GND
PJE+ Pointer Justification Event +
PJE- Pointer Justification Event -
POH Path Overhead
PPP Point to Point Protocol
PRC Primary Reference Clock
QA Q Adaptor
QoS Quality of Service
RAM Random Access Memory
RDI Remote Defect Indication
REI Remote Error Indication
REG Regenerator
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July 16, 2013 / Issue 10

Abbreviation Definition
RFI Remote Failure Indication
RIP Router Information Protocol
RMII Reduced Medium Independent Interface
RS Regenerator Section
RSOH Regenerator Section Overhead
SD Signal Degrade
SDH Synchronous Digital Hierarchy
SEC Station Equipment Clock
SES Severely Errored Second
SESR Severely Errored Second Ratio
SETS Synchronous Equipment Timing Source
SF Signal Failure
SFF Small Form Factor
SFP Small Form Factor Pluggable
SM Single Mode
SMCC Sub
Sub-network management control center
SML Service Management Layer
SMN SDH Management Network
1000
MBEint.Sli
Intranet
Phone
Internet
2000
10000
hiT7025
Source:
2002
2004
2006
2008
2010
Tbit/ss
WAN
de.8ADM
TM
Siemens SMS SDH Management Sub
Sub-Network
AG SMT Surface Mount Technology

SNCP Sub
Sub-network Connection Protection
SOH Section Overhead
SPRING Shared Protection Ring
SSM Synchronous State Message
STM-N Synchronous Transport Module Level-N
Level
TCP Transport Control Protocol
TDEV Time Deviation
TDM Time Division Multiplex
TIF Telemetry Interface
TM Terminal Multiplexer
TMN Telecommunications Management Network
TU Tributary Unit
UAS Unavailable Second
VC Virtual Container
VC-n Virtual Container level n
VDN Virtual Data Network
VLAN Virtual Local Area Network
WAN Wide Area Network
WDM Wavelength Division Multiplexing

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