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1. General description
The 74HC02; 74HCT02 is a quad 2-input NOR gate. Inputs include clamp diodes. This enables the
use of current limiting resistors to interface inputs to voltages in excess of VCC.
3. Ordering information
Table 1. Ordering information
Type number Package
Temperature range Name Description Version
74HC02D -40 °C to +125 °C SO14 plastic small outline package; 14 leads; SOT108-1
74HCT02D body width 3.9 mm
74HC02DB -40 °C to +125 °C SSOP14 plastic shrink small outline package; 14 leads; SOT337-1
74HCT02DB body width 5.3 mm
74HC02PW -40 °C to +125 °C TSSOP14 plastic thin shrink small outline package; SOT402-1
74HCT02PW 14 leads; body width 4.4 mm
74HC02BQ -40 °C to +125 °C DHVQFN14 plastic dual in-line compatible thermal SOT762-1
74HCT02BQ enhanced very thin quad flat package; no leads;
14 terminals; body 2.5 × 3 × 0.85 mm
Nexperia 74HC02; 74HCT02
Quad 2-input NOR gate
4. Functional diagram
2
2 1A ≥1 1
1Y 1 3
3 1B
5 2A 5
2Y 4 ≥1 4
6 2B 6
8 3A 8
3Y 10 ≥1 10
9 3B 9 A
11 4A
4Y 13 11 Y
12 4B ≥1 13
12
B
mna216 001aah084 mna215
Fig. 1. Logic symbol Fig. 2. IEC logic symbol Fig. 3. Logic diagram (one gate)
5. Pinning information
5.1. Pinning
14 VCC
terminal 1
1Y
index area
1
1A 2 13 4Y
1B 3 12 4B
2Y 4 02 11 4A
2A 5 GND(1) 10 3Y
1Y 1 14 VCC
2B 6 9 3B
1A 2 13 4Y
7
1B 3 12 4B
GND
3A
2Y 4 02 11 4A 001aac920
2A 5 10 3Y
Transparent top view
2B 6 9 3B
(1) This is not a ground pin. There is no electrical or
GND 7 8 3A
mechanical requirement to solder the pad. In case
001aac919 soldered, the solder land should remain floating or
connected to GND.
Fig. 4. Pin configuration SOT108-1 (SO14), SOT337-1
(SSOP14) and SOT402-1 (TSSOP14) Fig. 5. Pin configuration SOT762-1 (DHVQFN14)
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6. Functional description
Table 3. Function table
H = HIGH voltage level; L = LOW voltage level; X = don’t care.
Input Output
nA nB nY
L L H
X H L
H X L
7. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions Min Max Unit
VCC supply voltage -0.5 +7 V
IIK input clamping current VI < -0.5 V or VI > VCC + 0.5 V [1] - ±20 mA
IOK output clamping current VO < -0.5 V or VO > VCC + 0.5 V [1] - ±20 mA
IO output current -0.5 V < VO < VCC + 0.5 V - ±25 mA
ICC supply current - 50 mA
IGND ground current -50 - mA
Tstg storage temperature -65 +150 °C
Ptot total power dissipation [2] - 500 mW
[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2] For SOT108-1 (SO14) package: Ptot derates linearly with 10.1 mW/K above 100 °C.
For SOT337-1 (SSOP14) package: Ptot derates linearly with 7.3 mW/K above 81 °C.
For SOT402-1 (TSSOP14) package: Ptot derates linearly with 7.3 mW/K above 81 °C.
For SOT762-1 (DHVQFN14) package: Ptot derates linearly with 9.6 mW/K above 98 °C.
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9. Static characteristics
Table 6. Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions 25 °C -40 °C to +85 °C -40 °C to +125 °C Unit
Min Typ Max Min Max Min Max
74HC02
VIH HIGH-level VCC = 2.0 V 1.5 1.2 - 1.5 - 1.5 - V
input voltage VCC = 4.5 V 3.15 2.4 - 3.15 - 3.15 - V
VCC = 6.0 V 4.2 3.2 - 4.2 - 4.2 - V
VIL LOW-level VCC = 2.0 V - 0.8 0.5 - 0.5 - 0.5 V
input voltage VCC = 4.5 V - 2.1 1.35 - 1.35 - 1.35 V
VCC = 6.0 V - 2.8 1.8 - 1.8 - 1.8 V
VOH HIGH-level VI = VIH or VIL
output voltage IO = -20 μA; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V
IO = -20 μA; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V
IO = -20 μA; VCC = 6.0 V 5.9 6.0 - 5.9 - 5.9 - V
IO = -4.0 mA; VCC = 4.5 V 3.98 4.32 - 3.84 - 3.7 - V
IO = -5.2 mA; VCC = 6.0 V 5.48 5.81 - 5.34 - 5.2 - V
VOL LOW-level VI = VIH or VIL
output voltage IO = 20 μA; VCC = 2.0 V - 0 0.1 - 0.1 - 0.1 V
IO = 20 μA; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V
IO = 20 μA; VCC = 6.0 V - 0 0.1 - 0.1 - 0.1 V
IO = 4.0 mA; VCC = 4.5 V - 0.15 0.26 - 0.33 - 0.4 V
IO = 5.2 mA; VCC = 6.0 V - 0.16 0.26 - 0.33 - 0.4 V
II input leakage VI = VCC or GND; VCC = 6.0 V - - ±0.1 - ±1 - ±1 μA
current
ICC supply current VI = VCC or GND; IO = 0 A; - - 2.0 - 20 - 40 μA
VCC = 6.0 V
CI input - 3.5 - - - - - pF
capacitance
74HCT02
VIH HIGH-level VCC = 4.5 V to 5.5 V 2.0 1.6 - 2.0 - 2.0 - V
input voltage
VIL LOW-level VCC = 4.5 V to 5.5 V - 1.2 0.8 - 0.8 - 0.8 V
input voltage
VOH HIGH-level VI = VIH or VIL; VCC = 4.5 V
output voltage IO = -20 μA 4.4 4.5 - 4.4 - 4.4 - V
IO = -4.0 mA 3.98 4.32 - 3.84 - 3.7 - V
VOL LOW-level VI = VIH or VIL; VCC = 4.5 V
output voltage IO = 20 μA - 0 0.1 - 0.1 - 0.1 V
IO = 5.2 mA - 0.15 0.26 - 0.33 - 0.4 V
II input leakage VI = VCC or GND; VCC = 5.5 V - - ±0.1 - ±1 - ±1 μA
current
ICC supply current VI = VCC or GND; IO = 0 A; - - 2.0 - 20 - 40 μA
VCC = 5.5 V
74HC_HCT02 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2020. All rights reserved
74HC_HCT02 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2020. All rights reserved
10.1. Waveforms
VI
nA, nB input VM
GND
tPHL tPLH
VOH
VY
nY output VM
VX
VOL
tTHL tTLH
001aai814
tW
VI
90 %
negative
VM VM
pulse
10 %
GND
tf tr
tr tf
VI
90 %
positive
VM VM
pulse
10 %
GND tW
VCC
VI VO
G DUT
RT CL
001aah768
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SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1
D E A
X
y HE v M A
14 8
Q
A2
(A 3) A
A1
pin 1 index
θ
Lp
1 7 L
e w M detail X
bp
0 2.5 5 mm
scale
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
99-12-27
SOT108-1 076E06 MS-012
03-02-19
74HC_HCT02 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2020. All rights reserved
SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm SOT337-1
D E A
X
c
y HE v M A
14 8
Q
A2 A
A1 (A 3)
pin 1 index
θ
Lp
L
1 7 detail X
w M
e bp
0 2.5 5 mm
scale
mm
0.21 1.80 0.38 0.20 6.4 5.4 7.9 1.03 0.9 1.4 8o
2 0.25 0.65 1.25 0.2 0.13 0.1
0.05 1.65 0.25 0.09 6.0 5.2 7.6 0.63 0.7 0.9 0o
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
99-12-27
SOT337-1 MO-150
03-02-19
74HC_HCT02 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2020. All rights reserved
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1
D E A
X
y HE v M A
14 8
Q
A2 (A 3 )
A
A1
pin 1 index
θ
Lp
L
1 7
detail X
w M
e bp
0 2.5 5 mm
scale
mm
0.15 0.95 0.30 0.2 5.1 4.5 6.6 0.75 0.4 0.72 8o
1.1 0.25 0.65 1 0.2 0.13 0.1
0.05 0.80 0.19 0.1 4.9 4.3 6.2 0.50 0.3 0.38 0o
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
99-12-27
SOT402-1 MO-153
03-02-18
74HC_HCT02 All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2020. All rights reserved
DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
14 terminals; body 2.5 x 3 x 0.85 mm SOT762-1
D B A
A
A1
E c
terminal 1 detail X
index area
terminal 1 C
e1
index area v C A B
e b y1 C y
w C
2 6
L
1 7
Eh e
14 8
k
13 9
Dh
X
k
0 2 4 mm
scale
Dimensions (mm are the original dimensions)
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12. Abbreviations
Table 10. Abbreviations
Acronym Description
CMOS Complementary Metal-Oxide Semiconductor
DUT Device Under Test
ESD ElectroStatic Discharge
HBM Human Body Model
MM Machine Model
TTL Transistor-Transistor Logic
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Contents
1. General description...................................................... 1
2. Features and benefits.................................................. 1
3. Ordering information....................................................1
4. Functional diagram.......................................................2
5. Pinning information......................................................2
5.1. Pinning.........................................................................2
5.2. Pin description............................................................. 2
6. Functional description................................................. 3
7. Limiting values............................................................. 3
8. Recommended operating conditions..........................3
9. Static characteristics....................................................4
10. Dynamic characteristics............................................ 5
10.1. Waveforms.................................................................6
11. Package outline.......................................................... 7
12. Abbreviations............................................................ 11
13. Revision history........................................................11
14. Legal information......................................................12
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