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Corrosion is an inevitable fact in is one factor which remains largely As a reaction to the troubling creep
our increasingly polluted environ- in their control, but new market corrosion failure mode, an inter-
ment. Corrosion can be mitigated dynamics are challenging the reli- national organisation concerned
in several ways. The materials used ability factor as well. Corrosion-in- with electronics specification, IPC,
in the manufacture of electronic duced service failures are increas- has commissioned a sub-commit-
devices need to be chosen wisely, ing at a troubling rate. Corrosion of tee IPC 3-11g Metal Finishes Data
based on available corrosion data. printed circuit boards can have the Acquisition to collect data on the
The materials should be protected effect of causing electrical opens interactions of circuit board sur-
from pollution by the use of pro- in very fine line circuitry, as well face finishes and various corrosive
tective coatings, device enclosures, as the creation of electrical shorts environments. The committee is
or relocation of equipment to more when the corrosion products creep expected to determine the rate of
protected environments. Humidity among conductors. This latter fail- corrosion of circuit materials, al-
is a chief contributor to corrosion, ure mode, creep corrosion, is seen lowing equipment makers to bet-
as water allows intimate access of more and more as sensitive elec- ter plan for reliability, service,
concentrated contaminating spe- tronic products are deployed in the and environmental requirements.
cies and transportation of corro- more polluted regions of the devel- Already, we have seen changes in
sion products. The choice of pro- oping world. Increasingly, telecom the way circuit boards are pro-
tective films needs to be weighed products are used in uncontrolled tected. A goal of the committee is
against other functional aspects of environments, e.g.: switches and to produce a statement increasing
the film choices. Materials used in routers in internet-savvy Banga- awareness of the issue, providing
electronics manufacture will in- lore. Lastly, we have seen the rise data for planning purposes, and
teract with different pollutants at in use of thin coatings to replace issuing recommendations for in-
differing rates based on pollutant thick hot air solder level, a victim creased circuit protection. As the
levels and other environmental ef- of Europe’s RoHS legislation. These IPC membership acts as a group
fects. In some cases, galvanic pairs coatings provide an easier access to of volunteers, chemical suppliers
can be created when using dissimi- copper, the material identified as contribute test vehicles and plated
lar materials, which can accelerate the creep corrosion product. coatings, circuit vendors provide
corrosion. To predict corrosion, time on their equipment, assembly
and useful service life of electronic
devices, historical data set can be Figure 1 – The intersection of key factors resulting in increased corrosion
consulted, but gaps exist in the of electronic circuitry
rate of corrosion on surface finish-
ing materials used in today’s elec-
tronics. To fill in data gaps, indus-
try groups can share resources in
studying corrosion. New findings
will allow for better predictability
on service life, selection of appro-
priate coatings to fit specific needs,
and development of more robust
materials to protect circuitry.
contractors solder components, Factors influencing corrosion rate dry and deposit crystallised corro-
and OEMs provide access to ana- are: sion salts. If more liquid comes in
lytical test equipment. • Exposure of surface materials contact with the circuitry, the cy-
with corrosive pollutants (porosity, cle repeats, with the formation of
Corrosion failure rates rise when weak protectant films) rings of crystalline deposits. When
three key factors intersect: in- • Thermodynamic spontaneity and analysed, the material found to
creased pollution, reduced circuit favourable energy of formation val- creep is copper with its corrosion
protection, and wider use of elec- ues product anion, usually sulfide.
tronics. Figure 1 graphically rep- • Galvanic difference between met-
resents this intersection. Approxi- al layers Causes of surface finish tarnish
mately 75 percent of all industrial • Transport and residence time are:
sites have some form of electronic of pollutant (humidity, condensa- • Improperly cleaned PCBs as
corrosion which leads to prema- tion) shipped from the PCB manufac-
ture equipment failure. Premature • Replenishment of reacting pol- turer
equipment failure occurs in less lutants (air flow) • Improperly applied PCB surface
than a year in about 5 to 10 per- • Time and temperature at corro- finish
cent of current industrial process sive conditions • Improperly stored or handled
control applications. • Solvent environment (air, water, PCBs as shipped from the PCB
oils, partial vacuum...) manufacturer or received at the
This study focuses on the corro- • Movement of metals with a sys- component assembler
sion of exposed metal in the field tem (diffusion, recrystallisation, • Exposure to the reactive com-
use of assembled printed circuit density change with growth of cor- pounds of sulfur, nitrogen, oxygen,
boards. An anecdotal increase in rosion. and chlorine
field failures was observed dur- • Contact with materials contain-
ing the time immediately follow- Creeping corrosion has been docu- ing high concentrations of elemen-
ing implementation of the RoHS mented by Battelle labs, Texas In- tal sulfur and/or pollutant particu-
initiative. An explanation for the struments, Rockwell Automation, lates
somewhat sudden increase in field Alcatel-Lucent, Hewlett Packard, • Exposure of PCBs to moderate
failures follows three converging Dell Computer, and the University levels of corrosive gas during high
and conspiring trends, increased of Maryland among others. In this temperature solder reflow
overall pollution, portability of extreme corrosion mechanism, the • Extended exposure to unprotect-
electronic devices, and the use of surface finish is corroded, exposing ed environments between reflow
less robust materials for protect- the underlying copper. Then the cycles. (OSP can oxidise in as lit-
ing corrosion. Similar to the FMEA corrosive ions form copper salts. tle as 2 hours; silver’s shelf-life can
methodology, the severity of corro- Liquid solvents, such as water, will reduce from 10 weeks to as low as
sion is due to less robust materials, carry the salts across the circuitry 2 days.)
the occurrence is due to more in- in an electrolyte solution. With suf-
teraction opportunities, and unless ficient liquid and surface tension, Corrosion can manifest itself in
the amount of pollution is drasti- the electrolyte can bridge the gap several ways. Simple surface corro-
cally reduced, an effective solution between circuitry and soldermask. sion can be as benign as the crea-
is not readily available. When heated, the electrolyte may tion of invisible oxides, sulfides and
chlorides in sub-micron layers on
Table 1 – Conditions for mixed flowing gas circuit metals. Usually invisible
and self-limiting as the availabil-
ity of surface metal is consumed,
these films are normally invisible
to the unaided eye. Copper, and
especially silver, tarnish is more
visible even at very thin angstrom-
level films. With more corrosion,
Figures 3 – Mixed flowing gas equipment (left) and an example of creep corrosion on immersion tin formed using
MFG (right)
replenishment of reactive materi- led texture and cleanliness. Cor- circuitry is most often exposed to
als, and movement of the materials rosion is measured by weight loss replenishing, heterogeneous, gase-
by (typically) water, a new class of and weight gain. The surface can ous environments. For this reason,
corrosion is manifested. Thick cor- be analysed to determine the cor- the mixed flowing gas technique
rosion can impact electrical sur- rosion products. This method is (MFG) is well suited for predicting
face contact functionality. Under limited by corrosion mechanism material compatibility in field use.
electrical bias, dissolved materials – loosely adherent corrosion mate- The range of conditioning envi-
can conduct current and form den- rials can peel and flake off the sam- ronments is documented in ASTM
drites. Even without dependency ple showing a weight loss, while B845-97 (2003) and summarised in
on electrical bias, corrosion can adherent corrosion products result Table 1. Mixed flowing gas meth-
move across insulating surfaces. in a weight gain. odology is very useful in creating
Creep corrosion relies on high hu- representative corrosion of elec-
midity to exhibit such movement. Analysis of corrosion products tronic circuit materials. The origi-
It is hypothesised that condensing is conducted by several methods nal literature published during the
moisture is required for the creep including acid digestion, desput- invention of the test method does
corrosion phenomenon. tering elemental analysis, energy indicate success in creating creep
dispersive spectroscopy, depth pro- corrosion on electroplated metals.
Corrosion is not limited to these filing and analysis by binding en- However, the use of Class IV MFG
examples. Conductive anodic fila- ergy, and sequential electrochemi- methods in well controlled applica-
ment growth, whiskers, and fret- cal reduction (e.g. SERA). For the tion did not result in creep corro-
ting are other examples of metal specific measurement of creeping sion of contemporary PCB surface
movement linked to corrosive corrosion, the distance of creep finish coatings in repeated work
mechanisms. See Figure 2 for ex- can be measured linearly. The cor- conducted in 2003-2005.
amples of corrosion types. rosion products will creep on sol-
dermask more quickly than across Toscano details the work con-
epoxy substrate. This may be due to ducted to reproduce the creeping
Techniques for measurement smoothness, extent of water repul- corrosion mechanism on bare cop-
sion, and other material factors. per, immersion silver organic sol-
Environmental measurement can derability preservative (OSP), and
be conducted by “sniffers” for in- immersion silver coated with thin,
dividual chemicals such as H2S, Methods for reproducing corrosion protective films. By trapping cor-
SO2, Cl2 and solid particulates. & acceleration factors rosive gasses in static, non-flow-
These levels can be compared with ing environments with condensing
the levels recorded at field obser- For general use, industry, univer- moisture, creep corrosion was pro-
vation stations set up worldwide. sity and government groups have duced within 24 hours. The chemi-
In many cases, H2S is not actively developed controlled environ- cals used were those found in the
measured, but SO2 is the more ments to simulate corrosion by specialised environment of several
common sulfur species tracked common pollutants. The pollutants industries: tyre factory, fertiliser
by government agencies. Another are delivered in concentrations in- manufacturing, paper mill, and
measurement method uses sacri- tended to accelerate the corrosion clay modelling studio. Methods
ficial metal strips to record corro- reactions. The contamination can were developed based on the use of
sion. Metal strips are placed in an be liquid, gaseous, static, flow- actual, known contaminants, such
industrial environment. The strips ing (replenished), homogenous, as high-sulfur modelling clay and
are carefully prepared to a control- and heterogeneous. Electronic rubber vulcanisation chemicals.
When analysed, the environments gies, thin metal immersion coat- as OSP. Organics do not set up the
simulate the industrial settings, ings (Ag and Sn), thick physical electron transfer needed for gal-
but are intended to allow for accel- deposits (HASL), metal layers vanic corrosion. Corrosion of OSP
erated conditioning through con- (ENIG, NiPdAu), and organic cop- coated PCBs occurs only when the
centration, air flow, and humidity per protectants (OSP). All of the coating is compromised, exposing
adjustments. metal finishes have susceptibil- copper. In general, organic coat-
ity to sulfide-induced corrosion. ings are hydrophobic, shedding
Humidity was essential in this HASL offers good protection from water. This minimises the contact
testing. Condensing moisture and corrosion due to its high thick- time of pollutants, when soluble
100% humidity produced creep ness of sacrificial metal. About 50 contaminants are shed from OSP
corrosion. When reproduced, creep microns of relatively passive tin surfaces.
corrosion was demonstrated about separates copper circuitry from
equally on all surface finishes test- any polluted environment. HASL Given the ability for organic coat-
ed. Lower humidity, as achieved in becomes vulnerable when residues ings to resist corrosion (when
MFG testing, normally did not pro- prevent full HASL coatings and in- intact), should the industry con-
duce creep corrosion. At Class IV adequate thickness allows copper centrate on instituting OSP? In
conditions, with elevated humid- intermetallics to reach the surface. some cases, yes. In other cases,
ity, a few surface finish samples Intuitively, one expects the extra OSP cannot deliver the perform-
did show creep, as shown in Figure metal layer of ENIG to best resist ance of metal finishes needed for
3b. The laboratory technicians hy- corrosion, but observations report high volume assembly of compli-
pothesised the likelihood of local- otherwise. In part, porosity can ex- cation circuit designs. OSP suffers
ised condensation, as is a known plain ENIG’s poor performance in from challenges in surface con-
challenge with high humidity in mixed flowing gas. The rest of the tact functionality, and from insuf-
flowing gas testing. explanation is given by the galvan- ficient wetting of wavesolder in
ic potentials of the layered metal. PTHs. Other organic coatings have
A more noble metal on a less noble been deployed to offer the contact
Surface finish effects substrate can actually accelerate and soldering advantages of metal
corrosion. The galvanic corrosion finishes, while shedding moisture
Modern PCB surface finishes can mechanism works to the advan- like an OSP. A tarnish inhibitor
be categorised into four technolo- tage of thin organic coatings such on silver was deployed as early as
Figures 5 – Silver (left), STI (middle), and STI Plus (right) coatings exposed to MFG Class IV+ gas levels; 38°C, 90% RH