Datasheet

PIC16F87XA
PIC16F87XA Rev. B0 Silicon/Data Sheet Errata

The PIC16F87XA Rev. B0 parts you have received Work around
conform functionally to the Device Data Sheet This problem is specific to the Rev. B0, and has
(DS39582A), except for the anomalies described been resolved by Rev. B2 of the silicon (date
below. This Errata Sheet supersedes any previously codes later than 0242xxx).
published Errata for PIC16F87XA Rev. B0.
All the problems listed here will be addressed in future
revisions of the PIC16F87XA silicon.
1. Module: A/D (Electrical Specifications)
Note: This issue applies only to 28-pin parts

of this device family (PIC16F873A
and PIC16F876A). PIC16F874A and
PIC16F877A devices are not affected.
The linearity and error specifications of the A/D

module vary from the originally published specifi-
cations. The new values for 28-pin devices are
shown in Table 1 (below).
To meet these specifications while operating the
microcontroller at the maximum clock speed of
20 MHz, the A/D conversion clock must always
be configured for divide-by-64 operation
(ADCON0<7:6> = 10, ADCON1<6> = 1).
The 40-pin devices of the PIC16F87XA product
family continue to meet the previously published
specifications in the Device Data Sheet.
TABLE 1: A/D CONVERTER CHARACTERISTICS (PARTIAL): PIC16F873A/876A (INDUSTRIAL)

PIC16LF873A/876A (INDUSTRIAL)
Data Sheet
New Specification
Param Specification
Sym. Characteristic Units
No.
Min Typ Max Min Typ Max
A03 EIL Integral linearity error PIC16F873A/876A — — ±1.4 — — <±1 LSb

Differential linearity PIC16F873A/876A
A04 EDL — — ±1.4 — — <±1 LSb
error
A07 EGN Gain error PIC16F873A/876A — — ±2.0 — — <±1 LSb
 2003 Microchip Technology Inc. DS80128D-page 1

PIC16F87XA
2. Module: FLASH Program Memory Work around
A software workaround will enable FLASH pro-
To ensure proper reading of data from tables in
gram memory to function as published. One NOP
FLASH Program Memory, as described in
should precede, and six NOPs should follow the
Section 3.5 of the Device Data Sheet, the following
instruction that sets the read bit.
work around is necessary.
Replace the required 3-instruction sequence,
shown in Example 3-3 of the Data Sheet, with the
sequence shown in Example 1 (below). The
interrupts should be disabled during this process.
This problem is specific to Rev. B0, and has been
resolved by Rev. B2 of the silicon (date codes later
than 0242xxx).
EXAMPLE 1:
BCF INTCON, GIE ;Disable the interrupts
NOP ;This NOP is required for the workaround.
BSF EECON1, RD ;This initiates program memory read.
NOP ;Any instructions here are ignored while program memory is read in the
NOP ;second instruction cycle after BSF EECON1, RD.
NOP ;These four NOP's are required for the workaround.
NOP
NOP
NOP
BSF INTCON, GIE ;Enable the interrupts
DS80128D-page 2  2003 Microchip Technology Inc.

PIC16F87XA
3. Module: Core Clarifications/Corrections to the Data
Sheet:
Certain code sequence and placement may cause
the corruption of a few bits in the instruction fetch In the Device Data Sheet (DS39582A), the following
when the part is used above 4 MHz. A corrupted clarifications and corrections should be noted.
instruction fetch will cause the part to execute an
improper instruction and result in unpredictable 1. Module: Comparator
outputs.
In Figure 12-1, “Comparator Operating Modes”,
Microchip cannot predict which code sequences the POR default value is CMCON<2:0> = 111, not
and placement will cause this failure. If this failure CMCON<2:0> = 000 as shown.
mechanism exists in your system, it should be evi-
dent during statistically significant pre-production 2. Module: Packaging (Pinout and Product
testing (minimum suggested sample size 100 Identification)
units) of your particular code sequence and
placement. PIC16F874A and PIC16F877A devices are now
offered in 44-pin, micro lead frame packages
Any code change should be tested in the same
(commonly known as “QFN”). This provides near
manner prior to their implementation. If most parts
chip scale package size. This option is in addition
fail your tests, or if failures are seen at all voltages
to the 28-pin QFN packages already available for
or at all frequencies, this indicates that the problem
PIC16F873A and PIC16F876A devices. The
experienced does not relate to this failure
44-pin QFN package has been added to the prod-
mechanism.
uct line since the original publication of the Device
This problem has not been observed at operating Data Sheet.
frequencies below 4 MHz.
The addition of this option requires the following
Work around additions to the Device Data Sheet (DS39582A).
Use the part at or below 4 MHz. Referenced figures and tables follow this text.
This problem is specific to Rev. B0, and has been 1. The “Pin Diagrams” on pages 2-3 of the Data
resolved by Rev. B2 of the silicon (date codes later Sheet are amended with the addition of the
than 0242xxx). 44-pin QFN pinout shown in Figure 1.
2. Table 1.3 of Section 1.0 (“Device Overview”) is
4. Module: A/D (Operation) replaced with an updated version, which adds a
column for QFN pin assignments. All new
The ADC is disabled when ADCON1<3:0> = 011x
information is indicated in bold.
(all inputs digital) and CMCON<2:0> = 111
(comparators are off). 3. Section 19.1 (“Package Marking Information”) is
amended to include a marking template and
This is a special case that conflicts with the second example for 44-pin QFN devices. These are
sentence of Note 1 on page 129 of the device data shown in Figure 2.
sheet: “Pins configured as digital inputs will
4. Section 19.1 is also amended to include the
convert an analog input.”
mechanical drawings of the 44-pin QFN pack-
Work around age and its solder mask diagram, following the
For the ADC module to be enabled, it is necessary existing drawings. These are shown in Figure 3
to either: and Figure 4, respectively.
5. In the “PIC16F87XA Product Information Sys-
1.) enable the comparators
tem” (page 219), the “ML” line item in the “Pack-
(CMCON<2:0> ≠ 111).
age” options section should now read (change in
2.) configure at least one ADC channel as an bold):
analog input (ADCON1<3:0> ≠ 011x).
ML = QFN
For the sake of completeness, it is also noted that
the package designation “MLF” is now replaced by
“QFN” in all occurrences throughout the Device
Data Sheet. “MLF” should be considered an
obsoleted term.

PIC16F87XA
FIGURE 1: PINOUT DIAGRAM FOR PIC16F87XA, 44-PIN QFN PACKAGE
44-Pin QFN
RC1/T1OSI/CCP2
RC3/SCK/SCL
RC4/SDI/SDA
RC6/TX/CK
RC0/T1CKI
RC2/CCP1
RD3/PSP3
RD2/PSP2
RD1/PSP1
RD0/PSP0
RC5/SDO
44
43
42
41
40
39
38
37
36
35
34
RC7/RX/DT 1 33 OSC2/CLKO
RD4/PSP4 2 32 OSC1/CLKI
RD5/PSP5 3 31 VSS
RD6/PSP6 4 30 VSS
RD7/PSP7 5 PIC16F874A 29 VDD
VSS 6 28 VDD
VDD 7 PIC16F877A 27 RE2/AN7/CS
VDD 8 26 RE1/AN6/WR
RB0/INT0 9 25 RE0/AN5/RD
RB1 10 24 RA5/AN4/SS/C2OUT
RB2 11 23 RA4/T0CKI/C1OUT
22
12
13
14
15
16
17
18
19
20
21
RB3/PGM
NC
RB4
RB5
RB6/PGC
RB7/PGD
MCLR/VPP
RA0/AN0
RA1/AN1
RA2/AN2/VREF-/CVREF
RA3/AN3/VREF+
FIGURE 2: PACKAGE MARKING TEMPLATE FOR PIC16F87XA, 44-PIN QFN
44-Lead QFN Example
XXXXXXXXXX PIC16F877A
XXXXXXXXXX -I/ML
XXXXXXXXXX
YYWWNNN 0310017

PIC16F87XA
TABLE 1-3: PIC16F874A/877A PINOUT DESCRIPTION
DIP PLCC QFN QFP I/O/P Buffer
Pin Name Description
Pin# Pin# Pin# Pin# Type Type
OSC1/CLKI 13 14 32 30 I ST/CMOS(4) Oscillator crystal or external clock input.
OSC1 Oscillator crystal input or external clock source
input. ST buffer when configured in RC mode.
Otherwise CMOS.
CLKI External clock source input. Always associated
with pin function OSC1 (see OSC1/CLKI,
OSC2/CLKO pins).
OSC2/CLKO 14 15 33 31 O — Oscillator crystal or clock output.
OSC2 Oscillator crystal output.
Connects to crystal or resonator in Crystal
Oscillator mode.
CLKO In RC mode, OSC2 pin outputs CLKO, which has
1/4 the frequency of OSC1 and denotes the
instruction cycle rate.
MCLR/VPP 1 2 18 18 I/P ST Master Clear (input) or programming voltage (output).
MCLR Master Clear (Reset) input. This pin is an active
low RESET to the device.
VPP Programming voltage input.
PORTA is a bi-directional I/O port.
RA0/AN0 2 3 19 19 TTL
RA0 I/O Digital I/O.
AN0 I Analog input 0.
RA1/AN1 3 4 20 20 TTL
RA2/AN2/VREF-/CVREF 4 5 21 21 TTL
VREF- I A/D reference voltage (Low) input.
CVREF O Comparator VREF output.
RA3/AN3/VREF+ 5 6 22 22 TTL
VREF+ I A/D reference voltage (High) input.
RA4/T0CKI/C1OUT 6 7 23 23 ST
RA4 I/O Digital I/O – Open drain when configured as output.
T0CKI I Timer0 external clock input.
C1OUT O Comparator 1 output.
RA5/SS/AN4/C2OUT 7 8 24 24 TTL
SS I SPI slave select input.
C2OUT O Comparator 2 output.
Legend: I = input O = output I/O = input/output P = power
— = Not used TTL = TTL input ST = Schmitt Trigger input
Note 1: This buffer is a Schmitt Trigger input when configured as an external interrupt.
2: This buffer is a Schmitt Trigger input when used in Serial Programming mode.
3: This buffer is a Schmitt Trigger input when configured as general purpose I/O and a TTL input when used in the Parallel
Slave Port mode (for interfacing to a microprocessor bus).
4: This buffer is a Schmitt Trigger input when configured in RC Oscillator mode and a CMOS input otherwise.

PIC16F87XA
TABLE 1-3: PIC16F874A/877A PINOUT DESCRIPTION (CONTINUED)
PORTB is a bi-directional I/O port. PORTB can be
software programmed for internal weak pull-up on all
inputs.
RB0/INT 33 36 9 8 TTL/ST(1)
RB0 I/O Digital I/O.
INT I External interrupt.
RB1 34 37 10 9 I/O TTL Digital I/O.
RB3/PGM 36 39 12 11 TTL
PGM I/O Low voltage ICSP programming enable pin.
RB6/PGC 39 43 16 16 TTL/ST(2)
PGC I/O In-Circuit Debugger and ICSP programming clock.
RB7/PGD 40 44 17 17 TTL/ST(2)
PGD I/O In-Circuit Debugger and ICSP programming data.

PIC16F87XA
PORTC is a bi-directional I/O port.
RC0/T1OSO/T1CKI 15 16 34 32 ST
RC0 I/O Digital I/O.
T1OSO O Timer1 oscillator output.
T1CKI I Timer1 external clock input.
RC1/T1OSI/CCP2 16 18 35 35 ST
T1OSI I Timer1 oscillator input.
CCP2 I/O Capture2 input, Compare2 output, PWM2 output.
RC2/CCP1 17 19 36 36 ST
CCP1 I/O Capture1 input/Compare1 output/PWM1 output.
RC3/SCK/SCL 18 20 37 37 ST
SCK I/O Synchronous serial clock input/output for SPI mode.
SCL I/O Synchronous serial clock input/output for I2C mode.
RC4/SDI/SDA 23 25 42 42 ST
SDI I SPI data in.
SDA I/O I2C data I/O.
RC5/SDO 24 26 43 43 ST
SDO O SPI data out.
RC6/TX/CK 25 27 44 44 ST
TX O USART asynchronous transmit.
CK I/O USART 1 synchronous clock.
RC7/RX/DT 26 29 1 1 ST
RX I USART asynchronous receive.
DT I/O USART synchronous data.

PIC16F87XA
PORTD is a bi-directional I/O port or parallel slave port
when interfacing to a microprocessor bus.
RD0/PSP0 19 21 38 38 ST/TTL(3)
RD0 I/O Digital I/O.
PSP0 I/O Parallel Slave Port data.
RD1/PSP1 20 22 39 39 ST/TTL(3)
RD2/PSP2 21 23 40 40 ST/TTL(3)
RD3/PSP3 22 24 41 41 ST/TTL(3)
RD4/PSP4 27 30 2 2 ST/TTL(3)
RD5/PSP5 28 31 3 3 ST/TTL(3)
RD6/PSP6 29 32 4 4 ST/TTL(3)
RD7/PSP7 30 33 5 5 ST/TTL(3)
PORTE is a bi-directional I/O port.
RE0/RD/AN5 8 9 25 25 ST/TTL(3)
RE0 I/O Digital I/O.
RD I Read control for parallel slave port.
RE1/WR/AN6 9 10 26 26 ST/TTL(3)
WR I Write control for parallel slave port.
RE2/CS/AN7 10 11 27 27 ST/TTL(3)
CS I Chip select control for parallel slave port .
VSS 12,31 13,34 6, 30, 6,29 P — Ground reference for logic and I/O pins.
31
VDD 11,32 12,35 7, 8, 7,28 P — Positive supply for logic and I/O pins.
28, 29
NC — 1,17, 13 12,13, — — These pins are not internally connected. These pins
28,40 33,34 should be left unconnected.

PIC16F87XA
FIGURE 3: 44-PIN QFN PACKAGE (DRAWING 1, PACKAGING)
44-Lead Plastic Quad Flat No Lead Package (ML) 8x8 mm Body (QFN)
E EXPOSED
METAL
PAD
D D2
2 B
1
n
OPTIONAL PIN 1 PIN 1
INDEX ON E2
INDEX ON
TOP MARKING EXPOSED PAD L
TOP VIEW BOTTOM VIEW
A
A1
A3
Units INCHES MILLIMETERS*

Dimension Limits MIN NOM MAX MIN NOM MAX
Number of Pins n 44 44
Pitch p .026 BSC 0.65 BSC
Overall Height A .031 .035 .039 0.80 0.90 1.00
Standoff A1 .000 .001 .002 0 0.02 0.05
Base Thickness A3 .010 REF 0.25 REF
Overall Width E .315 BSC 8.00 BSC
Exposed Pad Width E2 .262 .268 .274 6.65 6.80 6.95
Overall Length D .315 BSC 8.00 BSC
Exposed Pad Length D2 .262 .268 .274 6.65 6.80 6.95
Lead Width B .012 .013 .013 0.30 0.33 0.35
Lead Length L .014 .016 .018 0.35 0.40 0.45
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
JEDEC equivalent: M0-220
Drawing No. C04-103

PIC16F87XA
FIGURE 4: 44-PIN QFN PACKAGE (DRAWING 2, SOLDER MASK)
44-Lead Quad Flat No Lead Package (ML) 8x8 mm Body (QFN)

Land Pattern and Solder Mask
M B
PACKAGE
EDGE
SOLDER
MASK
Units INCHES MILLIMETERS*

Dimension Limits MIN NOM MAX MIN NOM MAX
Pitch p .026 BSC 0.65 BSC
Pad Width B __ __ __ __ __ __
Pad Length L __ __ __ __ __ __
Pad to Solder Mask M .005 .006 0.13 0.15
*Controlling Parameter
Drawing No. C04-2103

PIC16F87XA
APPENDIX A: REVISION HISTORY
Rev A Document (5/2002)
First revision of this document (silicon issues 1 (A/D)
and 2 (FLASH Program Memory)).
Rev B Document (8/2002)
Added silicon issues 3 and 4 (Oscillator and A/D
Operation).
Added data sheet clarification issue 1 (Comparator).
Rev C Document (12/2002)
Replaced silicon issue 3 (Oscillator) with Core.
Updated silicon issues 1 (A/D Electrical Specifications),
2 (FLASH Program Memory), and 4 (A/D Operation).
Rev D Document (3/2003)
Added data sheet clarification issue 2 (Packaging -
Pinout and Product Identification).

PIC16F87XA
NOTES:

Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device Trademarks

applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to The Microchip name and logo, the Microchip logo, KEELOQ,
ensure that your application meets with your specifications. No MPLAB, PIC, PICmicro, PICSTART, PRO MATE and
representation or warranty is given and no liability is assumed by PowerSmart are registered trademarks of Microchip Technology
Microchip Technology Incorporated with respect to the accuracy Incorporated in the U.S.A. and other countries.
or use of such information, or infringement of patents or other
FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL
intellectual property rights arising from such use or otherwise.
and The Embedded Control Solutions Company are registered
Use of Microchip’s products as critical components in life
trademarks of Microchip Technology Incorporated in the U.S.A.
support systems is not authorized except with express written
approval by Microchip. No licenses are conveyed, implicitly or Accuron, Application Maestro, dsPIC, dsPICDEM,
otherwise, under any intellectual property rights. dsPICDEM.net, ECONOMONITOR, FanSense, FlexROM,
fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC,
microPort, Migratable Memory, MPASM, MPLIB, MPLINK,
MPSIM, PICC, PICkit, PICDEM, PICDEM.net, PowerCal,
PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC, Select Mode,
SmartSensor, SmartShunt, SmartTel and Total Endurance are
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
Serialized Quick Turn Programming (SQTP) is a service mark of

Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their

respective companies.
© 2003, Microchip Technology Incorporated, Printed in the

U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system

certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company’s quality system processes and
procedures are QS-9000 compliant for its
PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchip’s quality system for the
design and manufacture of development
systems is ISO 9001 certified.
 2003 Microchip Technology Inc. DS80128D - page 13

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03/25/03

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PIC16F87XA

PIC16F87XA Rev. B0 Silicon/Data Sheet Errata

1. Module: A/D (Electrical Specifications)

Note: This issue applies only to 28-pin parts

The linearity and error specifications of the A/D

TABLE 1: A/D CONVERTER CHARACTERISTICS (PARTIAL): PIC16F873A/876A (INDUSTRIAL)

A03 EIL Integral linearity error PIC16F873A/876A — — ±1.4 — — <±1 LSb

 2003 Microchip Technology Inc. DS80128D-page 1

DS80128D-page 2  2003 Microchip Technology Inc.

 2003 Microchip Technology Inc. DS80128D-page 3

FIGURE 2: PACKAGE MARKING TEMPLATE FOR PIC16F87XA, 44-PIN QFN

44-Lead QFN Example

DS80128D-page 4  2003 Microchip Technology Inc.

 2003 Microchip Technology Inc. DS80128D-page 5

DS80128D-page 6  2003 Microchip Technology Inc.

 2003 Microchip Technology Inc. DS80128D-page 7

DS80128D-page 8  2003 Microchip Technology Inc.

TOP VIEW BOTTOM VIEW

Units INCHES MILLIMETERS*

 2003 Microchip Technology Inc. DS80128D-page 9

44-Lead Quad Flat No Lead Package (ML) 8x8 mm Body (QFN)

Units INCHES MILLIMETERS*

Drawing No. C04-2103

DS80128D-page 10  2003 Microchip Technology Inc.

 2003 Microchip Technology Inc. DS80128D-page 11

DS80128D-page 12  2003 Microchip Technology Inc.

Information contained in this publication regarding device Trademarks

Serialized Quick Turn Programming (SQTP) is a service mark of

All other trademarks mentioned herein are property of their

© 2003, Microchip Technology Incorporated, Printed in the

Printed on recycled paper.

Microchip received QS-9000 quality system

 2003 Microchip Technology Inc. DS80128D - page 13

DS80128D-page 14  2003 Microchip Technology Inc.

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