DLP Pico Series 210 DMD & System Reference Design

Mechanical and Thermal Application Note

TI Drawing # 2510323 Rev A
2 Mar 2009

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1.0 Scope
As an aid to the successful first time utilization and implementation of the Series 210 DMD, this
Application Note will address the following topics:

• Terminology
• Specification and Design Details of a Series-210 DMD
• Series 210 System Reference Design concept, including key attributes and important design
considerations
• System connector

2.0 Terminology
The primary features of the Series 210 DMD are illustrated in the Figure 1

Figure 1 – Series 210 Features

• WLP Chip – Wafer level package DMD chip which contains the DMD active array
• DMD Active Array – The array of active DMD mirrors
• Window glass – Clear glass cover that protects the DMD active area
• Frame – part used to cover and protect the wire bond wires
• Ceramic – the main support structure of the DMD for the mechanical datums and electrical
interface
• System Connector – the electrical interface connector in the system
• DMD Test Pads – electrical interface pads used for testing at Texas Instruments

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3.0 DMD Specifications
The key mechanical and thermal DMD specifications are summarized in this application note. In
case of conflict between this document and either the DMD data sheet or mechanical ICD, the
DMD data sheet and mechanical ICD should be followed.

3.1 Documentation Structure

The technical information for the DMD is contained in two documents, the DMD Data Sheet
(2510298) and the DMD Mechanical ICD (2509058). The overall size, datum locations,
tolerances, and other geometry information is in the DMD Mechanical ICD. The functional
characteristics are in the DMD data sheet. A 3D-CAD file of the DMD nominal geometry is
also available in STEP format.

Table 1 summarizes which document technical information is located in.

Table 1 - Document Information

DMD Mech ICD
DMD Technical Information DMD Data Sheet (Mech Data sheet)
2510298 2509058
Package Geometry (Dimensions, Mounting X
Datums, etc..)
Thermal Characteristics X
Mechanical Mounting Loads X
Optical Properties X
Electrical Characteristics (signal names) X
Part Identification X

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 3.2 Optical Interface Features
The Series 210 DMD incorporates three principle datum features (Datum ‘A’, Datum ‘B’, and
Datum ‘C’). These datum features facilitate physical orientation of the DMD Active Array
relative to the optical system. The dimensions and sizes of the datum areas are in the
mechanical ICD drawing 2509058. The three datum features are described below and
illustrated in the Figure 2.

Datum ‘A’ – Primary datum

Datum ‘A’ is a plane specified by 3 areas on the surface of the ceramic. The plane of
the DMD Active Array is parallel to the plane formed by the three Datum ‘A’ areas. The
DMD Active Array has a controlled distance and parallelism from Datum ‘A’ (refer to the
DMD Mechanical ICD for specific values and tolerances). Datum ‘A’ allows the plane of
the Active Array to be precisely (and repeatable) oriented along the optical axis of the
optical system.

Datum ‘B’ – Secondary datum

Datum ‘B’ is the center of a theoretically perfect 1.5 mm diameter pin that contacts the
edge of the ceramic in the areas shown. While Datum ‘A’ positions the Active Array
plane along the optical axis of the optical system, Datum ‘B’ establishes the X and Y
position of the Active Array within the required plane (refer to the DMD Mechanical ICD
for specific values and tolerances). Datum ‘B’ is not the entire edge thickness of the
ceramic but rather the 0.35 mm thickness closest to the Datum ‘A’ areas as shown in
Figure 2.

Datum ‘C’ – Tertiary datum

Datum ‘C’ is the center of the 3.0 mm slot on the edge of the ceramic. Datum ‘C’
establishes the rotation of the Active Array within the required plane and X-Y position
established by Datum ‘B’ (refer to the DMD Mechanical ICD for specific values and
tolerances). Datum ‘C’ is not the entire edge thickness of the ceramic but rather the 0.4
mm thickness closest to the Datum ‘A’ areas.

Figure 2 - DMD Datum Features

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 3.3 Electrical Interface Features
The Series 210 DMD incorporates a 46 contact, 0.5 mm pitch Board-To-Board (BTB)
type connector for the electrical interface to the system. The system interface connector
on the DMD is the Panasonic AXK6L46347G or equivalent. Information about this
connector is available on the Panasonic web site by searching on the part number. The
DMD also has a set of land-grid-array (LGA) pads. These LGA pads are test
connections and should not be connected in the system.

Ensure the LGA pads are not directly or inadvertently connected or shorted by a
mounting plate or something that would short the pads together or connect them to
ground. The DMD data sheet identifies the BTB connector pins and signal names.
Figure 3 illustrates the electrical interface features.

Figure 3 - Electrical Interface

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 3.4 Thermal Characteristics
The operating and storage temperatures for the DMD and specific measurement points
used to monitor the temperature are defined in the DMD data sheet and summarized
here. The recommended operating temperature of the active array and thermocouple
location TC3 shown in Figure 4 is 25o to 45oC.

Figure 4 – Thermal Measurement Point

The absolute minimum and maximum operating temperatures apply to both the
measurement point (TC3) and the active array. A summary of the minimum and
maximum temperatures is shown in Table 2.

Table 2 – Absolute Minimum and Maximum Temperatures

Parameters Min Max Units
Operating Temperature: o
-20 75 C
• Array and reference locations TC3 in Figure 4
Storage Temperature (non-operating): o
-40 80 C
• Reference locations TC3 in Figure 4
Operating Relative Humidity (non-condensing) 0 95 %
Storage Relative Humidity (non-condensing) 0 95 %

The array temperature can not be measured directly but must be computed analytically
from information in the DMD data sheet, the thermocouple measurement (see TC3 in
Figure 4), and the thermal load absorbed from the illumination energy. The relationship
to calculate the array temperature from the reference ceramic temperature (TC3) is
shown in the DMD data sheet and below. The thermal resistance (R Array-To-Ceramic) from
the array to the ceramic measurement point (TC3) is 5 oC/W (see data sheet).

The thermal load on the DMD results from the DMD electrical power, and the absorbed
energy from the optical illumination. The electrical load is defined in the DMD data
sheet as 0.075 watts. The absorbed energy from the optical load will need to be
determined for the specific application.

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 3.4.1 Calculation of Array temperature from TC3 Measurement

The array temperature can be calculation using the formulas below.

TArray = TCeramic + (Q Array • R Array-To-Ceramic)

Q Array = Q ELE + Q ILL

Where:
TArray = computed array temperature (°C)

TCeramic = measured ceramic temperature (°C) (TC3 location in DMD data sheet)

Q Array = Total DMD array power (electrical + absorbed) (watts)

R Array-To-Ceramic = DMD package thermal resistance from array to ceramic TC3

(°C/watt) which is 5 °C/watt (from DMD Data sheet)

Q ELE = Nominal electrical power = 0.075 watts (from DMD data sheet)

Q ILL = Absorbed illumination energy (watts) (application specific value)

Sample Calculation for:

Q ILL = 0.05 watts (determined for each specific application)
TCeramic = 45 °C (measured)

QArray = 0.075 + 0.05 = 0.125 watts

TArray = 45 °C + (0.125 watts • 5 °C/watt) = 45.6°C

The Series 210 DMD does not have a specifically defined thermal contact area to aid in
conducting the thermal load from the DMD. For this reason the typical application for
the Series 210 DMD would be for an absorbed illumination load less than 0.055 watts.
This load is expected to be distributed across the entire active array. For a display
application this would be less than 20 lumens measured on the screen, or about 40
lumens of illumination directly on the DMD.

The amount of energy can vary over time with many illumination sources so it is
important to verify the amount of illumination energy when verifying the thermal design
of an application each time a temperature measurement is taken.

The DMD is characterized for an illumination load which is distributed across the active
array. Applications with illumination that has high energy density (for example, highly
collimated laser beams) have not been characterized and need to be investigated for
the specific illumination source and application.
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 3.4.2 Sample Array Calculation for a 1-Chip Display Application

For a typical 1-Chip display application with a total projection efficiency from the DMD
to the screen of 87% the illumination heat load is 0.00274 times the measured screen
lumens. This assumes a spectral efficiency of 300 lumens/watt for the projected light
and illumination distribution of 83.7% on the active array and 16.3% on the array border
and window aperture. An example of the array temperature calculation for a display
application is shown below.

TArray = TCeramic + (Q Array • R Array-To-Ceramic)

Q Array = Q ELE + Q ILL

Q ILL = 0.00274 • SL

Where:
TArray = computed array temperature (°C)

TCeramic = measured ceramic temperature (°C) (TC3 location in DMD data sheet)

Q Array = Total DMD array power (electrical + absorbed) (watts)

R Array-To-Ceramic = DMD package thermal resistance from array to ceramic TC3

(°C/watt) which is 5 °C/watt (from DMD Data sheet)

Q ELE = Nominal electrical power = 0.075 watts (from DMD data sheet)

Q ILL = Absorbed illumination energy (watts) (application specific value)

SL = measured screen lumens (lumens)

Sample Calculation for:

SL = 20 lumens (measured)
TCeramic = 55 °C (measured)

QArray = 0.075 + (0.00274 • 20) = 0.13 watts

TArray = 55 °C + (0.13 watts • 5 °C/watt) = 55.7°C

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 3.5 Mechanical loading
The maximum mechanical load limits which can be applied to the different areas of the
DMD are illustrated in Figure 5. This is the maximum load during the process of mounting
the DMD in a system, and the continuous load after the DMD has been installed in the
system.

Mechanical Load on the Datum ‘A’ areas

The Series 210 DMD will accommodate a mechanical load evenly distributed across the
three Datum ‘A’ areas. This load functions to counteract the combined loads from
mounting the DMD and the Electrical Interface.

Mechanical Load on the Connector area

The Series 210 DMD is designed to accommodate a mechanical load evenly distributed
across the Connector area. The load associated with the electrical connection is for the
load applied during the mating of the system connector, and what must be continuously
maintained to assure proper electrical connection.

Figure 5 - DMD Loads

Loads in excess of the specified limits can result in mechanical failure of the DMD package.

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4.0 System Reference Design
4.1 Critical considerations for mounting and utilizing the DMD
The mounting system for the DMD needs to meet the functional design objectives while also
controlling the mechanical loads being applied to the DMD. Controlling the loads on the
DMD can be done by design details, assembly processes, or a combination of both.

The functional design objectives of the mounting system include the following:
• Establish (and maintain) the physical placement of the DMD’s Active Array relative to
the optical system.
• Establish (and maintain) a low electrical impedance connection between the DMD’s
Electrical Interface and the system connector on the flex or printed circuit board.
• Establish (and maintain) a dust-proof seal between the DMD and the optical chassis.

The system reference design presented in this Application Note achieves the design
objectives listed above.

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 4.2 Opto-Mechanical alignment features
The DMD Opto-Mechanical Alignment Features are used to establish and maintain the
physical placement of the DMD’s Active Array relative to the optical system.
The earlier section reviewed the Optical Interface Features of the DMD.
This section will review the suggested mating features on the optical system for the DMD
Datums ‘A’, ‘B’, and ‘C’.. Figure 6 illustrates the following suggested mating features:
• Three Datum ‘A’ tabs (coplanar)
• One 1.5 mm diameter post (pin) feature to contact Datum ‘B’
• One Datum ‘C’ post
• Three threaded bosses to secure the DMD into the system

Figure 6 - Optical Alignment features – 3 Tab

The simplest form for the Datum ‘B’ interface is a precision 1.5 mm diameter pin. However,
other shapes could be used to create a more robust feature that would be easier to
manufacture. An example is shown in Figure 6 above.

To avoid bending and damaging the DMD ceramic package the mounting forces should be
applied perpendicular to the substrate and directly opposite the ceramic Datum ‘A’ areas.

The optical chassis features that contact the DMD Datum ‘B’ and Datum ‘C’ should be lower
in height than the ceramic thickness and associated tolerance. The lower height will prevent
interference with the mating connector or supporting parts associated with it. This clearance
is illustrated in Figure 7.

The three Datum ‘A’ tabs need to be coplanar to ensure uniform focus of the array and
repeatability between systems. The coplanar requirements are established by the depth of
focus of the specific optical design.

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 Figure 7 - Section of Optical Alignment Features

4.3 Basic System Reference Design

The active array is maintained parallel to the three Datum ‘A’ areas identified on the DMD
mechanical ICD drawing. Contacting only these three Datum ‘A’ areas assures the
parallelism of the active array to the Datum ‘A’ optical chassis features. The Datum ‘A’
areas are not symmetrical so it may be desirable to contact a fourth tab to ensure strength
for high shock loads, uniform clamping pressure, and reduce chances of damage during
assembly. Figure 8 illustrates the addition of the fourth tab and threaded boss to the
features described in Figure 6. The four Datum ‘A’ tabs need to be coplanar to ensure
uniform focus of the array and repeatability between systems. Use of the fourth tab may
have a slight impact to focus but for many applications the optical design can accommodate
this.

Figure 8 - Optical Alignment features – 4 Tab

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 4.4 Detailed System Reference Design
A system reference design concept for mounting the Series 210 DMD is shown Figure 9.
The assembly drawing number for this concept is 2510317. The drawings and 3D-CAD
models in STEP format of the parts are available for study and use during product design.

This concept represents a “drop-in-place“ design where the DMD is not adjusted during or
after assembly for optical alignment. This simplifies the assembly of the DMD to the optics
but does require adequate tolerances between the optical chassis features for mounting the
DMD and other optical components to ensure proper optical performance. The tolerance
requirements will vary for each specific optical design but the capability of manufacturing the
parts needs to be considered when doing the optical design. The key areas for
consideration are the alignment of the illumination to the array, the amount of overfill, and
the focus across the array.

This concept utilizes the fourth tab and threaded boss described previously for strength and
better shock resistance. The optical interface includes typical features for mounting and
securing the DMD to the optics chassis. The clamp is used to secure the Datum ‘A’ and
Datum ‘B’ of the DMD to the corresponding features on the optics chassis. Control of loads
on the DMD are heavily dependant on the assembly process rather than the specifics of
design parts or features.

Figure 9 - Basic System Reference Design Concept

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 Figure 10 illustrates the Series 210 DMD in the proper location on the optical interface. The
optics Datum ‘A’ tabs are in contact with the DMD Datum ‘A’. The position
of the DMD Datum ‘B’ is in contact with the optical chassis Datum ‘B’ post. For proper
orientation of the array the DMD needs to be pushed into contact with the Datum ‘B’ post
and held in place. The design shown includes a simple clamp to achieve this. The clamp
contacts the side of the DMD opposite the Datum ‘B’, and must be manually pushed in the
direction shown prior to tightening the screws to assure the proper Datum ‘B’ contact. The
Figures 10 and 11 illustrate these concepts.

Figure 10 - Basic System Reference Design Concept

Figure 11 - Basic System Reference Design Concept – clamp contact

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 Other clamp designs are possible which could automatically push the DMD to make the
Datum ‘B’ contact.

The clamp design has raised areas which correspond to areas on the side of the DMD
ceramic opposite the Datum ‘A’ areas. The raised areas are shown in Figure 12. The use
of the raised areas helps to ensure the mounting load is applied to the Datum ‘A’ areas of
the DMD. The selection of the material and finish of the clamp should be such that the LGA
pads are not electrically connected or shorted together.

Figure 12 - Clamp Raised Areas

This mounting concept design is simple and has the fewest number of parts. This concept
does not include a flexible feature or compliant part like a coil spring to absorb the part
manufacturing variations or tolerances. When installing the DMD to the optical chassis
using the 4 screws into the optics threaded bosses, ensure the loads applied to the DMD by
tightening the screws do not exceed the DMD specification. The control of the loads applied
to the DMD must be done by a combination of part tolerances and assembly processes. A
summary of these is below:
• Partial tighten all 4 screws prior to final tightening
• Controlling the maximum torque on the screws in the threaded bosses
• Use alternating order when tightening the screws for both partial and final torque
• Tolerance the critical dimension on the optical interface and clamp to minimize the gap
between the threaded boss and the clamp. This gap is illustrated in the Figure 12.

Figure 12 - Basic System Reference Design Concept – Critical gap

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 The use of torque on the screws to control the forces applied to the DMD is highly
dependant on the material variations and friction factors of the screws and optical interface
material. Generally the force on the DMD will vary widely because of these. The clamp will
usually bow until the clamp contacts the threaded boss. Minimizing the gap between the
threaded boss and clamp helps to reduce the chances of applying excess forces to the DMD
but does not guarantee it.

This concept is an example of mounting the DMD. Specific requirements like size or other
geometry configuration associated with a specific implementation may require alternate
designs for a final product. Space available and the control of the loads on the DMD are
critical considerations.

5.0 System Connector

A mating system connector for the connector on the DMD is the Panasonic AXK5L46347G or
equivalent. Information about this connector is available on the Panasonic web site by
searching on the part number.

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