Sony Pmw-Ex30 1st Ed

SOLID-STATE MEMORY RECORDER
PMW-EX30
SERVICE MANUAL
1st Edition
! 警告
このマニュアルは，サービス専用です。
お客様が，このマニュアルに記載された設置や保守，点検，修理などを行うと感電や火災，
人身事故につながることがあります。
危険をさけるため，サービストレーニングを受けた技術者のみご使用ください。
! WARNING
This manual is intended for qualified service personnel only.
To reduce the risk of electric shock, fire or injury, do not perform any servicing other than that
contained in the operating instructions unless you are qualified to do so. Refer all servicing to
qualified service personnel.
! WARNUNG
Die Anleitung ist nur für qualifiziertes Fachpersonal bestimmt.
Alle Wartungsarbeiten dürfen nur von qualifiziertem Fachpersonal ausgeführt werden. Um die
Gefahr eines elektrischen Schlages, Feuergefahr und Verletzungen zu vermeiden, sind bei
Wartungsarbeiten strikt die Angaben in der Anleitung zu befolgen. Andere als die angegeben
Wartungsarbeiten dürfen nur von Personen ausgeführt werden, die eine spezielle Befähigung
dazu besitzen.
! AVERTISSEMENT
Ce manual est destiné uniquement aux personnes compétentes en charge de l’entretien. Afin
de réduire les risques de décharge électrique, d’incendie ou de blessure n’effectuer que les
réparations indiquées dans le mode d’emploi à moins d’être qualifié pour en effectuer d’autres.
Pour toute réparation faire appel à une personne compétente uniquement.
警告
本機は電源スイッチを備えていません。
万一，異常が起きた際に，お客様が電源を切ることが
できるように，設置の際には，機器近くの固定配線内
に専用遮断装置を設けるか，機器使用中に，容易に抜
き差しできるコンセントに電源プラグを接続してださ
い。
WARNING
This unit has no power switch.
When installing the unit, incorporate a readily accessible
disconnect device in the fixed wiring, or connect the
power cord to a socket-outlet which must be provided
near the unit and easily accessible, so that the user can
turn off the power in case a fault should occur.
WARNUNG
Dieses Gerät hat keinen Netzschalter.
Beim Einbau des Geräts ist daher im Festkabel
ein leicht zugänglicher Unterbrecher einzufügen,
oder das Netzkabel muß mit einer in der Nähe
des Geräts befindlichen, leicht zugänglichen
Wandsteckdose verbunden werden, damit sich bei
einer Funktionsstörung die Stromversorgung zum Gerät
jederzeit unterbrechen läßt.
PMW-EX30
注意 ADVARSEL!
指定以外の電池に交換すると，破裂する危険があり Lithiumbatteri-Eksplosionsfare ved fejlagtig

ます。 håndtering.
使用済の電池は，説明書に従って処理してください。 Udskiftning må kun ske med batteri
af samme fabrikat og type.
Levér det brugte batteri tilbage til leverandøren.
CAUTION
Danger of explosion if battery is incorrectly replaced. ADVARSEL
Replace only with the same or equivalent type Lithiumbatteri - Eksplosjonsfare.

recommended by the manufacturer. Ved utskifting benyttes kun batteri som
Dispose of used batteries according to the anbefalt av apparatfabrikanten.
manufacturer’s instructions. Brukt batteri returneres
apparatleverandøren.
Vorsicht! VARNING
Explosionsgefahr bei unsachgemäßem Austausch Explosionsfara vid felaktigt batteribyte.
der Batterie. Använd samma batterityp eller en likvärdig typ
som rekommenderas av apparattillverkaren.
Ersatz nur durch denselben oder einen vom Kassera använt batteri enligt gällande
Hersteller empfohlenen ähnlichen Typ. Entsorgung föreskrifter.
gebrauchter Batterien nach Angaben des
Herstellers.
VAROITUS
ATTENTION
Paristo voi räjähtää jos se on virheellisesti
asennettu.
Il y a danger d’explosion s’il y a remplacement
Vaihda paristo ainoastaan laitevalmistajan
incorrect de la batterie.
suosittelemaan tyyppiin.
Hävitä käytetty paristo valmistajan ohjeiden
Remplacer uniquement avec une batterie du même
mukaisesti.
type ou d’un type équivalent recommandé par le
constructeur.
Mettre au rebut les batteries usagées conformément
aux instructions du fabricant.
PMW-EX30 1 (P)
Table of Contents
Manual Structure 2. Replacement of Main Parts
Purpose of this manual .................................................................. 3 2-1. U Case ............................................................................. 2-1

Related manuals ............................................................................ 3 2-2. Front Panel Assembly...................................................... 2-1
2-3. Rear Panel Assembly....................................................... 2-2
2-4. LCD Assembly ................................................................ 2-2
1. Service Overview 2-5. Lithium Battery ............................................................... 2-3
2-6. KY-633 Board ................................................................. 2-3
1-1. Operating Conditions ...................................................... 1-1
2-7. HP-143 Board.................................................................. 2-4
1-2. Power Supply .................................................................. 1-1
2-8. EC-64 Board.................................................................... 2-4
1-3. Installation Space ............................................................ 1-2
2-9. DPR-297 Board ............................................................... 2-5
1-3-1. Outside Dimensions ............................................... 1-2
2-10. AVP-11 Board ................................................................. 2-5
1-3-2. Notes on Installation .............................................. 1-3
2-11. CP-400 Board .................................................................. 2-6
1-3-3. Rack Mounting ...................................................... 1-3
1-4. External Connectors ........................................................ 1-4
1-4-1. Signal Inputs and Outputs ...................................... 1-4
3. SERVICE Menu
1-5. Board Location ................................................................ 1-5
1-6. Function of Switches on Boards...................................... 1-6
3-1. SERVICE Menu List ....................................................... 3-1
1-7. Circuit Description .......................................................... 1-7
3-2. SERVICE Menu Outline ................................................. 3-1
1-8. Service Tools/Measuring Equipment List ..................... 1-13 3-2-1. Basic Menu Operations.......................................... 3-1
1-8-1. Service Tools........................................................ 1-13 3-2-2. SERVICE Menu Structure ..................................... 3-2
1-8-2. Measuring Equipment .......................................... 1-13 3-2-3. Displaying the SERVICE Menu ............................ 3-2
1-9. Firmware Upgrade......................................................... 1-14 3-3. SERVICE Menu Description ......................................... 3-2
1-10. Recommended Periodic Replacement Parts.................. 1-15 3-3-1. INFORMATION Menu ......................................... 3-2
1-11. Servicing Software “ServiceNavi-EX” ......................... 1-15
1-12. Note on Service ............................................................. 1-15
1-12-1. Requirements on Replacement of Boards 4. Spare Parts
or Parts ................................................................. 1-15
1-12-2. Note on Replacement of Parts on the Board ........ 1-15 4-1. Notes on Repair Parts ...................................................... 4-1
1-12-3. Lead-free Solder .................................................. 1-16 4-2. Exploded Views............................................................... 4-2
1-12-4. Fuse and IC Link Replacement............................ 1-16 4-3. Electrical Parts List ......................................................... 4-6
1-12-5. Circuit Protection Element................................... 1-17
4-4. Packing Materials & Supplied Accessories................... 4-33
1-13. Replacing the Flexible Card Wires................................ 1-17
1-14. Replacing the Coaxial Cable with Connector
(Fine Pitch Coaxial Cable) ............................................ 1-18 5. Block Diagrams
1-15. List of Error Numbers on the LCD Display .................. 1-19
Overall ............................................................................. 5-1
PMW-EX30 1
6. Schematic Diagrams
AVP-11 ............................................................................ 6-2

CP-400........................................................................... 6-26
DPR-297 ........................................................................ 6-28
EC-64 ............................................................................ 6-50
HP-143 .......................................................................... 6-51
KY-633 .......................................................................... 6-52
Frame Wiring................................................................. 6-56
7. Board Layouts
EC-64 .............................................................................. 7-1

HP-143 ............................................................................ 7-1
AVP-11 ............................................................................ 7-2
CP-400............................................................................. 7-5
DPR-297 .......................................................................... 7-6
KY-633 ............................................................................ 7-8
2 PMW-EX30
Manual Structure
Purpose of this manual

This is the Service Manual of solid-state memory recorder PMW-EX30.
This manual is intended for use by trained system and service engineers, and pro-
vides the information of maintenance and detailed service (parts replacement, guide-
line for adjustment, schematic diagrams, board layouts, detailed parts list).
Related manuals
In addition to this Manual, the following manuals are provided for this unit.
. Operating Instructions (Supplied with the unit)

This manual is required for the proper operation and application of this unit.
. “Semiconductor Pin Assignments” CD-ROM (Available on request)

This “Semiconductor Pin Assignments” CD-ROM allows you to search for
semiconductors used in Broadcast and Professional equipment.
Part number: 9-968-546-06
PMW-EX30 3
Section 1
Service Overview
1-1. Operating Conditions
Operating temperature: 5 dC to 40 dC
Storage temperature: _20 dC to 60 dC
Locations to avoid:
. Areas where the unit will be exposed to direct sunlight of any other strong lights.
. Areas near heat sources.
. Dusty areas or areas subject to vibration.
. Areas with strong magnetic field.
. Areas with much electrical noise.
. Areas with much static electricity.
. Areas that is impossible to find a specified room for installation.
(Refer to Section 1-3. Installation Space.)
. Areas windtight.
1-2. Power Supply
The unit works DC. When repairing or checking the unit, using AC adapter (MPA-AC1) supplied with the
unit is recommended.
Power voltage: 100 to 240 V AC (MPA-AC1)

12 V DC (PMW-EX30)
Power consumption: DC: approx. 12 W
PMW-EX30 1-1
1-3. Installation Space
1-3-1. Outside Dimensions

(219.1)
(142)
d=200
(36)
h=88
(98)
(160)
w=210 Unit: mm
1-2 PMW-EX30
1-3-2. Notes on Installation
w
To avoid an injury, do not install the unit on rickety table.
Ventilation and Installation Space for Servicing

. Do not install the unit with the feet (four parts on the bottom) removed.
. In order to make a unit with good ventilation, ensure sufficient clearance around the unit.
. Be sure to provide 2 cm or more space to both the right and left sides and the top of the unit, and 25 cm
or more space behind the unit.
. Do not install equipment on this unit.
n
Provide 2 cm or more space to both right and left sides of the unit. Providing 20 cm or more space above
the unit is recommended considering service operations.
1-3-3. Rack Mounting
Notes on Rack Mounting

. A rise in temperature inside the rack due to a residual heat by neighboring units will bad effects on the
unit. Check that the temperature inside the rack is within the range of specified operating temperature of
the unit.
. When installing units side by side, leave 1 cm or more of space to the both side of each PMW-EX30.
. Leave 25 cm or more of space to the rear of the unit.
. Use a commercially available rack mount kit.
Select an appropriate shelf taking size and weight of the unit into consideration.
. Never remove the top and bottom panels, handle, or legs of the unit when installing.
. Use adequately long cables for connection of the connector panel, considering that the unit is pulled out
from the rack.
n
After rack mounting, check that the temperature inside the rack is within the range of 5 dC through 35 dC.
PMW-EX30 1-3
1-4. External Connectors
1-4-1. Signal Inputs and Outputs
 HD/SD SDI OUTPUT: BNC Type  VIDEO OUTPUT S_VIDEO: Mini DIN 4-pin (Female)
SDI output signal
4 3
 HD SDI INPUT: BNC Type
SDI input signal 2 1
 VIDEO OUTPUT COMPOSITE: BNC Type

Composite video output signal _ EXT VIEW _
 PHONES: Stereo mini jack No. Signal I/O Specifications

_20.5 dBu (Reference level 16 Z loaded) 1 A GND _ GND
Sound monitor, monaural/Stereo Selectable 2 A GND _ GND
3 Y O COMPONENT (Y)
 AUDIO INPUT CH-1, CH-2: RCA-PIN (Female) 4 C O COMPONENT (C)
2 1
 VIDEO OUTPUT COMPONENT Y, Pb/B_Y, Pr/R_Y:
BNC x3
_ EXT VIEW _
(0 dBu = 0.775 V rms) 2 1 2 1 2 1
No. Signal I/O Specifications

1 LINE (X) I High impedance, Unbalanced, _ EXT VIEW _
_10 dBu/_2 dBu/+4 dBu, selectable
2 LINE (G) _ GND
1 Y O COMPONENT (Y)
 AUDIO OUTPUT CH-1/3, CH-2/4: RCA-PIN (Female)
2 Y_GND _ Y GND
1 PB O COMPONENT (Pb)
2 1 2 PB_GND _ PB GND
1 PR O COMPONENT (Pr)
2 PR_GND _ PR GND
_ EXT VIEW _
(0 dBu = 0.775 V rms)

1 LINE (X) O Unbalanced, _10 dBu
2 LINE (G) _ GND
1-4 PMW-EX30
 HDV/DV: i.LINK connector (IEEE1394, S400) (6P)  DC IN: 2P (DC JACK TYPE 4)
2 4 6
EXT DC GND
_ EXT VIEW _
1 3 5
_ EXT VIEW _

1 VP I BUS POWER
2 VG _ GND
3 NTPB I/O STROBE B (_)
4 TPB I/O STROBE B (+)
5 NTPA I/O DATA A (_)
6 TPA I/O DATA A (+)
 : USB mini B connector (5P)

1 5
_ EXT VIEW _

1 VCC _ USB Vcc
2 D_ I/O USB_
3 D+ I/O USB+
4 ID _ NC
5 GND _ Ground
1-5. Board Location
AVP-11 board CP-400 board
HP-143 board
DPR-297 board
IF-1072 board
EC-64 boards
KY-633 board
PMW-EX30 1-5
1-6. Function of Switches on Boards
AVP-11 board
S2001
S1
AVP-11 board (A side)
Ref. No. (address) Description Factory setting

S1 (A-4) Factory use OFF
S2001 (B-1) RESET _
1-6 PMW-EX30
1-7. Circuit Description
1. Video signal system
DPR-297 board
The digital video (Y/C) signal output from the Copro Sub IC (IC900) on the AVP-11 board enters the
baseband processing IC (IC100).
The baseband processing IC (IC100) performs the overall baseband processing of video and audio signals
with a single chip IC containing the various scaler functions (supporting the multiple format outputs),
various OSD functions, PLL function (54 MHz → 74 MHz) and CPU.
The baseband processing IC (IC100) provides the following outputs:
. HD/SD-SDI (digital): To AVP-11 board
. HDMI (digital): To AVP-11 board
. HD/SD Component (analog): To AVP-11 and CP-400 boards
. Composite (analog): To AVP-11 and CP-400 boards
. S-Video (analog): To AVP-11 and CP-400 boards
. LCD signal (digital): To LCD module
The input/output signals of the baseband processing IC (IC100) are the following signals:
. MPEG encoder/decoder I/F signal (digital): To IC401
. Audio I/F signal (digital): To IC800 on the AVP-11 board
Peripheral circuits of the baseband processing IC (IC100) are the master clock 54 MHz VCXO (X100)
control circuit (IC102 to IC106 and IC108) and the Mobile DDR SDRAM memory (IC300, IC301).
Peripheral circuits of the built-in CPU are FLASH ROM (IC202) and SDRAM (IC205).
The baseband processing IC (IC100) is controlled by the system controller (IC1600) on the AVP-11 board.
The LCD driver IC, the EVF driver IC, SDI Copro, the audio system and the power save control of the
output systems are controlled by the built-in CPU inside IC100.
2. Media recording and playback
DPR-297 board
Output from the baseband processing IC (IC100) is input into the MPEG encoder/decoder (IC401).
The MPEG encoder/decoder (IC401) is the single-chip MPEG Codec IC that encodes and decodes both
the high-quality HD video signal and audio signal in real-time. It has various interfaces with signals such
as MPEG video, video input/output, MPEG audio, audio input/output, bit stream input/output, and inter-
face with the host.
IC401 output is then input into LSI (IC400) for AVIT signal processing.
LSI (IC400) for AVIT signal processing contains the built-in CPU and has interfaces for 2 GBit DDR2
SDRAM memory (IC500, IC501), PCI bus, PCI-Express bus, I/O for IC401, and serial communication
with system controller (IC1600) on the AVP-11 board.
IC400 is also connected to the NOR-type Flash ROM (IC601) to read the CPU program in the IC400
during initial startup.
LSI (IC400) for AVIT signal processing is controlled by the system controller (IC1600) on the AVP-11
board, in the same way as other main devices, and provides the following types of functions: video/audio
stream control, access to the SxS memory card, mass storage operations when connected to USB and
HDV device controls when connected to i.LINK.
PMW-EX30 1-7
Explanation of peripheral devices
<SxS memory card slot>
Two memory card slot boards (EC-64) are connected to the dual channel PCI-Express signals coming
from IC400 through a 0.5 mm pitch, 30-pin fine coaxial cables connected to CN800 and CN801.
Furthermore, dual channel USB host signals output from USB host controller (IC802) are connect to the
EC-64 boards through fine coaxial cables just as with the PCI-Express signals.
IC802 is controlled by PCI bus from IC400.
<USB device controller>

USB device signal output from USB device controller (IC602) is connected to USB Mini-B connector
(CN600).
IC602 is controlled by the dedicated bus from IC400.
If there is no USB connection, the power supply for IC602 drops off.
<i.Link controller >

The i.Link signal output from the i.Link controller (IC700) is connected to the 6-pin i.Link connector
(CN700).
IC700 is controlled by the PCI bus from IC400.
3. Audio system
This overview explains the audio system according to the audio block diagram shown in Fig. 1.
CP-400 board
This board is a connector board on which RCA-pin (2-pin) connector for external LINE input and the
[_10 dBu/_2 dBu/+4 dBu] input selection switch for two channels are mounted on this connector board.
AVP-11 board (Audio block)

This board controls the analog audio input signal processing, as well as serial signal.
. This audio input signal is received by the input amplifier (IC1024, IC1025) that performs amplification
of 0/+12 dB and switching (Q1006 to Q1009) in accordance with the level that is set by INPUT TRIM.
After that, the audio signal is connected to the SEL/AMP (1, 2).
. SEL/AMP (1, 2) is a signal selector and buffer amplifier.
. Serial control
The I2C control signal from Display Block (T-one) is converted into GPI, and performs the switching
between MONITOR [CH1/CH2] / [CH1+CH2] / [CH1] / [CH2] for CH1 and CH2 respectively.
The I2C control from Display Block (T-one) selects either IC1160 or IC1161 for the target with I2C
MPX and sets the register of IC1160 or IC1161.
1-8 PMW-EX30
This board is comprised of two pieces of the Audio Codec IC and the GLUE.
. Audio Codec (IC1160, IC1161)
The analog audio signal is connected to IC1160 and IC1161 that are the Audio Codec (PGA, ADC, DSP,
Digital IF, headphones amplifier are built on one chip and the parameters are set with I2C).
The Input TRIM (PGA) functions in the [MANUAL] mode, and fixed GAIN functions in the [PRESET]
mode to control the audio signal level. The analog signal after level adjustment is converted to the
digital signal with the ADC.
After the digital signal receives the audio level control processing from the DSP, the digital signal is
output for audio recording.
Playback output (including EE) is the digital signal that is connected to Audio Codec where it is con-
verted to the analog signal with DAC and output to the CP-400 board.
Furthermore, the audio signal that is processed for audio monitoring in Audio Codec is connected to the
headphones amplifier through the monitor level control from the AUX input of IC1160.
. GLUE (IC800)
After the digital signal output signal from the Audio Codec is amplified by +12 dB, it is supplied to the
Display Block (T-one). GLUE (IC800) also receives the playback output signal from the Display Block.
The playback system selects CH1/CH2 or CH3/CH4, connects EE, and connects TEST TONE from the
Display Block depending on the data.
Furthermore, GLUE divides the clock signal that is supplied from the Display Block to Audio Codec.
. Analog output from DAC re-enters into the AUX input of Audio Codec after passing through the moni-
tor selector/mixer (IC1019 to IC1021), and becomes the monitor signal.
CP-400 board (Audio block)

Analog output from Audio Codec on the AVP-11 board is buffered by IC101 and is output to the RCA-pin
connector after passing through the audio MUTE control. The audio output from the AVP-11 board is con-
nected to PCA-pin connector.
HP-143 board (Audio block)

The headphones output signal is connected to the headphones jack.
The headphones output is muted by the MUTE (Q1160, Q1161) on the AVP-11 board.
Switch/volume control/menu panel (Audio controller block)

Operation panel functions relating to audio signal are built into the following blocks.
KY-633 board (Audio block)

Each CH1 and CH2 are connected to PIO of CPU (IC400), and the volume control [AUDIO LEVEL] is
connected to ADC of CPU (IC400).
The switch [MONITOR (AUDIO) +/_] that is common to CH1 and CH2 is connected to PIO of CPU
(IC300).
MENU processing
(1) Audio Input
. CH1, CH2 [REC Level]: Preset 0 dB/Manual +12 dB to _%
. [1 kHz Tone]: ON/OFF
(2) Audio Output
. [MONITOR CH]: [CH1/CH2] / [CH1+CH2] / [CH1] / [CH2] selection
. Output CH: [CH1/CH2] / [CH3/CH4] selection
PMW-EX30 1-9
AVP-11 INT/EXT1,INT/EXT2
MIC/LINE/+48V-1, I2C to I2C Display
MIC/LINE/+48V-2, GPIO Block(T-on)
COPY1to2, LINK2to1, LINK1to2
IC1009-IC1012 DPR-297
IC800
IC1014, IC1018 IC1160(1/2)
GLUE
Digital Audio
EXT 1 OUT 1
IC1016, PGA
IC1017 CPLD_O_
GAIN A/D FIL AGC LVL I2S
DP_O_CAM_ AU_DT12
IC102 O_AU_ IC900 DP_I_AU_ TO
AUDIO IF DT12 DT12
SEL/
AU_DT12O
CPLD_O_
DPR-297
DC-COPRO O_AU_ DP_I_AU_
COPRO
AMP1 (DP_O_CAM AU_DT34 DT34 SUB DT34
PGA _AU_DT34O)
Recording
GAIN
signal
Digital Audio
LINE 1 LINE -1 Linked/ D/A IN 1 or 3 AU_DT12_FOR_AEE
AMP Separated
RCA-PIN CLOCK DIV AU_DT34_FOR_AEE
IC1025 IC1013, (1fs,64fs,256fs)
Q1009, IC1015
Q1008 CLOCK DIV
(GAIN SEL CH1) (1fs,64fs,256fs)
SEL/ FROM
AMP2 GAIN MAKE
LINE 2 LINE -2 PGA OUT 2
DPR-297
AMP GAIN I2S
RCA-PIN A/D FIL AGC LVL
AUDIO IF
IC024 INT/EXT 2
DP_I_CAM_A Playback
U_DT12O
Q1006, signal
Q1007 CH1 CH1/CH2 DP_I_CAM_A
Linked/ PGA U_DT34O
(GAIN SEL CH2) GAIN
Separated
Digital Audio
D/A IN 2 or 4
Out1 CLOCK DIV

MUTE AMP (1fs,64fs,256fs)
(Line Out1)
Q1160
Out2 IC1161
MUTE AMP LINE 3/4
(Line Out2)
Q1161 IC1020,
IC1019 (1/2)
CP-400
SEL/
MIX1
MONI CH-1
MONI CH2-1
SEL/
IC1021, MIX2
IC1019 (2/2)
IC1160(2/2)
HP-143 Q1160
MONI CH2-2
MONI CH2-2 BEEP
MUTE AMP
HP Out AUX IN (L)
(PHONE
MINI) Q1161
CN1 MUTE AMP MIX
AMP AUX IN (R)
AMP
Q1000-Q1005 MONITOR LEVEL
PWR or
MUTE
DET
IC1163
I2C
DPR-297
IC1022-IC1026 I2C MPX Display
(DEVICE CONTROL) Block
MONI1-1,2-1,
MONI2-2,2-1, I2C (T-one)
GPIO
BEEP,
MUTE
Fig.1 Audio block diagram
1-10 PMW-EX30
4. System control
AVP-11 board
The 32-bit RISC CPU (ARM) with ARM core is built-in as the system controller (IC1600).
It has the peripheral interface functions of SDRAM, USB, SCI, and I2C. It operates on a 27 MHz clock
(X1200). FLASH ROM (IC1202), SDRAM (IC1203), and EEPROM (IC1313) are mounted as the periph-
eral ICs.
It performs the system control through serial communication with IC100 of the video signal system, and
IC400 of the media recording/playback system on the DPR-297 board.
Main functions of the system controller and peripherals

(1) Reading operation switch information
Reading the switch information and the LED control are performed by I2C bus communication with each
sub-microprocessor.
. Front switch: IC200, IC300, IC400 on the KY-633 board
. Power supply switch: IC2002
(2) Watch IC (RTC) control

The watch IC (IC102) is built onto the KY-633 board.
The watch IC (IC102) is backed up by a lithium coin battery, and the current time is read or set via
IC1600 on the AVP-11 board.
(3) Infrared remote control demodulation

The KY-633 board has an IC (IC101) for infrared remote control signal demodulation, and it receives the
command codes via IC300 on the KY-633 board.
(4) Power supply voltage detection

The power supply voltage at the DC IN connector is measured by the A/D port on IC2002 on the AVP-11
board, and it is posted to the system controller as the input voltage value.
(5) Power system control

IC2002 on the AVP-11 board checks that the power switch on the unit is turned ON, and turns on the
system controller of IC1600. After that, it controls the power for each circuit block according to the
system controller.
The system controller controls the respective power supply systems in the AVP-11 and DPR-297 boards
according to the operation mode of the device, via the POWER SUPPLY MICON (IC2002).
By turning off the power systems to unnecessary circuits blocks, power can be saved.
5. SDI system
SDI block (Input)

AVP-11 board
An SDI signal is input through cable EQ (IC453) from CN401 to DC_Copro (IC102).
In the DC_Copro (IC102), the input signal is decoded from a serial signal and separated to a parallel video
signal, embedded audio signal, and time code. After this, the resultant signal is video-filtered, audio-
deemphasized, and audio level-controlled in the Copro SUB (IC900) and input to IC100 on the DPR-297
board.
PMW-EX30 1-11
SDI block (Output)
AVP-11 board
The DC Copro (IC102) receives the parallel video signal from IC100 on the DPR-297 board and per-
formes signal-parallel conversion, and outputs the SDI signal.
Output SDI signals are supplied to CN401 through the cable driver (IC451).
The PLL circuit is used to reduce jitter of the HD-SDI clock signal.
The DC_Copro (IC102) is controlled by IC100 on the DPR-297 board through 4-line serial communica-
tion.
The FPGA program is stored in the IC901 ROM, and SPI can be used to overwrite the data from IC1600.
HDMI block (Output)

AVP-11 board
The parallel video signal and serial audio signal output from DC_Copro (IC102) are output from an
HDMI connector (CN404) through an HDMI transmitter (IC452).
DVCAM OUT block (Output)

AVP-11 board
The parallel video output signal that was down-converted using IC100 on the DPR-297 board is filtered
from 4:2:0 to 4:1:1 (4:1:0) in GLUE (IC800). After that, the signal is converted into a 4-bit signal and
sent to IC400 on the DPR-297 board. In IC400, the resultant signal is encoded to a DVCAM signal and
output from the i.LINK connector (CN700) on the DPR-297 board.
6. Power supply system
AVP-11 board
This board is comprised of the power supply circuit and the POWER SUPPLY MICON (IC2002).
However, part of the low-voltage power supply is mounted on the DPR-297 board.
(1) Input power supply (UNREG) system operations

When the UNREG power is input, the EVER power state is established.
In this state, the ON/OFF state of the Power switch can be recognized.
If the POWER SUPPLY MICON (IC2002) recognizes that Power switch is ON, the power is turned on
for the system control system and the POWER SUPPLY MICON controls the power supply for each
block according to the system controller (IC1600).
The normal value for the input power supply (UNREG) is in the range of about +10.5 V to +18 V.
. Input overvoltage protection

If the voltage is too high in the UNREG power supply, the overvoltage protection circuit starts operat-
ing around the set value of +17.9 V, and the unit shuts down. When the input power supply voltage to
this circuit becomes less than +17.9 V, the power supply immediately switches on with automatic
recovery.
. Input low-voltage protection

If the voltage is too low in the UNREG power supply, the low-voltage protection circuit starts operating
around the set value of +10.5 V according to the control by the POWER SUPPLY MICON (IC2002),
and the unit shuts down. When the input power supply voltage becomes higher than +10.5 V, the power
supply immediately switches on with automatic recovery according to the control by the POWER
SUPPLY MICON.
1-12 PMW-EX30
. Overcurrent detection
The overcurrent detection circuit is comprised of IC1504. The setting value is approximately 4.3 (A).
Even after clearing IC1504 after overcurrent detection, automatic recovery is not performed and the
power must be turned on again.
. Power supply reverse connection protection

If the input power has reverse voltage, Q1501 on the AVP-11 board is immediately turned off and
UNREG power is stopped on the GND side, and the protection function works.
(2) DC/DC converter function

The power supply output is divided into 18 systems, which are separated into three blocks as seen below.
. Audio/video signal system, 7 systems: (+13.5 V, _4.6 V, +4.6 V, etc.)
. System controller system, 5 systems: (+4.6 V, +3.1 V, +2.5 V, etc.)
. Media recording/playback system, 6 systems: (+3.1 V, +2.5 V, +1.8 V, etc.)
The sequence control (powering up and powering down) for the power supply system is controlled by the
POWER SUPPLY MICON (IC2002) for the respective power supply blocks of each block.
. Short-circuit protection for each power supply system

The circuit settings monitor each output voltage or current for each power supply system and operate
the protection circuits per block.
Even after short-circuit is cleared, the protection circuit does not recover automatically and the power
must be turned on again.
1-8. Service Tools/Measuring Equipment List
1-8-1. Service Tools
Part No. Name Usage/Note

* Mini USB cable For firmware version-upgrade
* : This cable is supplied with this unit.
1-8-2. Measuring Equipment
Use the calibrated equipment or equivalent as listed below for the adjustments.
Equipment Model name

Oscilloscope Tektronix TDS3054 or equivalent (150 MHz or more)
HD waveform monitor LEADER ELECTRONICS LV5152DA or equivalent
Frequency counter Advantest TR5821AK or equivalent
Color monitor Sony HDM-20E1U/14E1U/14E5U or equivalent
HD signal generator Tektronix TSG700 or equivalent
PMW-EX30 1-13
1-9. Firmware Upgrade
Upgrade the firmware for the this unit through a USB

connection to a computer.
For detailed information about the upgrade procedure,
check the readme file that comes with the upgrade soft-
ware.
For inquiry or comments about the firmware upgrade,
please contact your local Sony Sales Office/Service Center.
Firmware upgrade procedure

Download the software for the new firmware upgrade onto
the computer before starting these operations.
1. Check that the power switch on the unit is turned OFF.

2. Remove the U case. (Refer to Section 2-1.)
3. Use the USB cable that comes with the unit to connect
USB maintenance connector
the computer and the USB maintenance connector. （CN1200）
4. Turn on the power of this unit.
5. Run the software for the firmware upgrade on the
computer.
AVP-11 board
6. When the upgrade is complete, turn OFF the power
and remove the USB cable.
7. Attach the U case. (Refer to Section 2-1.)
When this unit is connected to the computer for the first

time, the driver software will need to be installed into the
computer. For more details, check the readme file that
comes with the upgrade software.
1-14 PMW-EX30
1-10. Recommended Periodic Replacement Parts
This section describes the recommended replacement parts and recommended replacement time.
Part name Ref. No. Board Sony part No. Replacement timing
Lithium battery (CR2032 type) BT100 KY-633 !1-528-174-11 approx. 3 years
1-11. Servicing Software “ServiceNavi-EX”
Servicing software “ServiceNavi-EX” is required for electrical adjustment and self diagnosis.
For how to obtain the “ServiceNavi-EX”, contact your local Sony Sales Office/Service Center.
1-12. Note on Service
1-12-1. Requirements on Replacement of Boards or Parts
This section explains the necessary setups required when replacing boards or parts.
1. When any of the following boards is replaced, upgrade the firmware version.
All data are written at once when upgrading the firmware version. (Refer to Section 1-9.)
Board name Ref. No.

DPR-297 IC202, IC601
KY-633 IC200, IC300, IC400
AVP-11 IC901, IC1202, IC2002
2. Adjusted values are stored in the following boards and parts. The values need to be readjusted when
they are replaced.
Board/part name Ref. No.

DPR-297 *1
LCD module*2 IC601/DPR-297 board

*1: The adjusted values for the LCD module are stored in the DPR-297 board.
*2: The adjusted values for the LCD module are stored in the LCD module, but the adjusted values need to be copied to the DPR-297
board.
3. The user setting values are stored in IC1313 on the AVP-11 board. The user data must be stored
(Restore) in SxS before replacing the board and it must be read (Recall) after replacing the board.
1-12-2. Note on Replacement of Parts on the Board
Parts labels also cannot be replaced in the DPR-297 board.

If parts become defective, replace the entire mounted board.
PMW-EX30 1-15
1-12-3. Lead-free Solder
Boards requiring use of lead-free solder are printed with a lead free mark (LF) indicating the solder
contains no lead.
(Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular
size.)
: LEAD FREE MARK
m
. Be sure to use the lead-free solder for the printed circuit board printed with the lead free mark.
. The lead-free solder melts at a temperature about 40 dC higher than the ordinary solder, therefore, it is
recommended to use the soldering iron having a temperature regulator.
. The ordinary soldering iron can be used but the iron tip has to be applied to the solder joint for a slightly
longer time. The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so
be careful.
1-12-4. Fuse and IC Link Replacement
w
The fuse and IC link are critical parts to safe operation.
Replace the components with Sony parts whose part number appear in the manual published by Sony. If
the components are replaced by any parts other than the specified ones, this may cause a fire or electric
shock.
c
If a fuse or IC link is replaced while the main power is kept on, this may cause electric shock.
Before replacing fuse or IC link, not only turn off the POWER switch but also remove the power cable
that is connected to the DC IN connector.
The AVP-11 board is equipped with fuse. The KY-633 board is equipped with IC link.
Any an excessive current flow due to abnormality inside the equipment, the fuse and IC link blow. If a
fuse or IC link blows, turn off the main power of the equipment once and inspect inside of the equipment
and remove the cause of excessive current. After that, replace the fuse and/or IC link.
Board Ref. No. Description Part No.

AVP-11 F1500 Fuse (5 A/125 V) !1-533-627-21
KY-633 PS100 to PS103 IC link (0.4 A/72 V) !1-576-122-21
1-16 PMW-EX30
1-12-5. Circuit Protection Element
The DPR-297 board of this unit is equipped with the positive characteristics thermistor (power thermistor)
as the circuit protection element. The positive characteristics thermistor limits the electric current flowing
through the circuit as the internal resistance increases when an excessive current flows or when the ambi-
ent temperature increases. If the positive characteristics thermistor works, turn off the main power of the
unit and inspect the internal circuit of this unit. After the cause of the trouble is removed, turn on the main
power back again. The unit works normally. It takes about one minute to cool down the positive charac-
teristics thermistor after the main power is turned off.
Board Ref. No. Address Protection circuit/equipment

DPR-297 THP700 to THP703 A-4 Internal circuit of the board
1-13. Replacing the Flexible Card Wires
n
The flat cables, flexible card wires and boards are used to connect between the following boards. Life of
flexible card wire will be significantly shortened if it is folded. Be very careful not to fold the flat cables,
flexible card wires and boards.
Because the direction of the flat cables, flexible card wires and boards are different depending on the
shape of the connector, be careful when connecting the flat cables, flexible card wires and boards.
Disconnecting
1. Turn off the power.

2. Slide or lift up the portion A in the direction of the arrow to unlock and pull out the flexible card wire.
Connecting
m
. Do not insert the coaxial cable with connector sideways.
. Check that there is no stain or dust on the contact surface of the coaxial cable with connector.
1. Slide or lift up the portion A in the direction of the arrow and securely insert the flexible card wire
into the deep end of the connector.
2. Return the portion A to its original position and lock the connector.
n
When connecting the flexible card wire, check the connec-
tor shape, and great care should be taken for the direction
of the contact surface or isolation surface (blue).
Isolation surface
(blue)
PMW-EX30 1-17
1-14. Replacing the Coaxial Cable with Connector
(Fine Pitch Coaxial Cable)
This unit uses coaxial cables with connector.

The following precautions must be observed when removing or connecting the coaxial cable with connec-
tor.
Note on disconnecting
The coaxial cable with connector uses fine pitch coaxial

cables. Be careful when arranging the cable. When discon-
necting the coaxial cable with connector, do not attempt to
[OK] Hold the connector to remove.
remove by pulling the cable. Be sure to hold the connector
to remove.
[NG] Do not attempt to remove by

pulling the cables.
1-18 PMW-EX30
Note on connecting
. Do not insert the coaxial cable with connector at an

angle.
. Check that the contact on the coaxial cable with connec-
tor is free from dirt or dust.
. Always insert the coaxial cable with connector with the
contact surface up.
. When connecting the coaxial cable with connector, hold Polarity marks
the connector, and align the polarity marks. Then connect
the coaxial cable wih connector to the connector straight.
Contact surface
[OK] Hold the connector

to connect.
[NG] Not to bend

the cable.
1-15. List of Error Numbers on the LCD Display
Error numbers are displayed as E-XXXXX (X indicates a number).

Error No. Description Service action
15030 System error Repair the DPR-297 and AVP-11 boards or replace it.
17001 Abnormality in the Media ID data in the Rewrite the media ID data in the EEPROM using
EEPROM “ServiceNavi-EX”.
17003 The display block does not start up Repair the DPR-297 and AVP-11 boards or replace it.
17004 The media block does not start up
17006 Abnormality in the start-up process of the
display block
17007 Abnormality in the start-up process of the
media block
17015 Abnormality in the media block Repair the DPR-297 and AVP-11 boards or replace it.
17017 Internal error in the media block Repair the DPR-297 and AVP-11 boards or replace it.
or
4XXXX
PMW-EX30 1-19
Section 2
Replacement of Main Parts
n
Before starting the procedure, pull out the power cable con-
nected to this unit.
2-1. U Case
1. Remove the five screws, then remove the U case in the

direction of the arrow. U case
B3 x 6
2. To install, reverse the removal procedure.
B3 x 6
B3 x 6
2-2. Front Panel Assembly
1. Remove the U case. (Refer to Section 2-1.) DPR-297 board

2. Disconnect the harness and flexible flat cable from the AVP-11 board CN200
connectors (CN1160 and CN1201) on the AVP-11 CN1201
board. CN1160
3. Disconnect the harness from the connector (CN200) on Flexible flat cable
the DPR-297 board.
4. Remove the five screws, then remove the front panel B3 x 6 Harness
assembly.
Harness B3 x 6
Front panel assembly
PMW-EX30 2-1
2-3. Rear Panel Assembly

B3 x 6
2. Disconnect the flexible flat cable from the connector
Rear panel assembly
(CN4) on the CP-400 board. Flexible flat cable CN4
3. Remove the seven screws, then remove the rear panel
CP-400 board
assembly.
2-4. LCD Assembly

Front frame assembly
2. Remove the front panel assembly.
(Refer to Section 2-2.)
3. Remove the two volume knobs and four screws (PTP3 LCD assembly
x 6), then remove the front frame assembly. LCD gasket
4. Remove the four screws (PTP2 x 5), then remove the PTP2 x 5
LCD gasket and LCD assembly. PTP2 x 5 PTP
3x6
5. Disconnect the harness from the LCD assembly.
6. To install, reverse the removal procedure. Harness
Volume knobs
Front panel subassembly
2-2 PMW-EX30
2-5. Lithium Battery

2. Remove the lithium battery from the KY-633 board. Lithium battery
n
When the backup battery is replaced, the date and time in KY-633 board
the internal clock need to be set. Refer to “Setting the
Clock” of the “Preparations” in the Operating Instructions.
2-6. KY-633 Board

2. Remove the front panel assembly. Flexible flat cable
(Refer to Section 2-2.) CN100

3. Remove the two volume knobs.
4. Remove the five screws, then remove the KY-633 PSW
board. 3x6
5. Disconnect the flexible flat cable from the connector

(CN100) on the KY-633 board.
KY-633 board
Volume knobs
Front panel
subassembly
PMW-EX30 2-3
2-7. HP-143 Board

2. Remove the front panel assembly.
(Refer to Section 2-2.) Front frame assembly
3. Remove the front frame assembly.
(Refer to step 3 in Section 2-4.)
4. Remove the screw, then remove the HP-143 board in
the direction of the arrow.
5. Disconnect the harness from the connector (CN1) on
the HP-143 baord.
HP-143 board
Harness
CN1
PSW M2 x 5
2-8. EC-64 Board

2. Disconnect the two harnesses from the two connectors Harness
EC-64 board CN1
(CN1) on the EC-64 board.
3. Remove the two screws (PSW3 x 6), then remove the
express card assembly. P2 x 3 Harness
4. Remove the eight screws (P2 x 3), then remove the EC-64 board
two EC-64 boards. CN1
5. To install, reverse the removal procedure. P2 x 3
Express card assembly
PSW3 x 6
2-4 PMW-EX30
2-9. DPR-297 Board

Harnesses
2. Remove the rear panel assembly.
(Refer to Section 2-3.) PSW3 x 6
3. Disconnect the three harnesses from the connectors PSW3 x 6
DPR-297 board
(CN200, CN800 and CN801) on the DPR-297 board.
4. Remove the four screws.
5. Remove the DPR-297 board from the connectors Harness
(CN500 and CN501) on the AVP-11 board.
CN800
6. To install, reverse the removal procedure. AVP-11 board CN200

CN801
CN500
CN501
2-10. AVP-11 Board

Plate nut
2. Remove the rear panel assembly. Supports PSW3 x 6
(Refer to Section 2-3.) AVP-11 board
3. Remove the DPR-297 board. (Refer to Section 2-9.)
PSW3 x 6
4. Remove the screw (PSW3 x 6), then remove the plate
Plate
spring. spring
5. Remove the screw (PTP3 x 6), two screws (P2 x 3)
and plate nut.
6. Remove the four screws (PSW3 x 6) and two supports,
then remove the AVP-11 board in the direction of the
arrow.
7. To install, reverse the removal procedure. P2 x 3
PTP3 x 6
PMW-EX30 2-5
2-11. CP-400 Board

Rear panel
2. Remove the rear panel assembly.
(Refer to Section 2-3.)
BVTP3 x 8
3. Remove the six screws, then remove the CP-400 board.
CP-400 board
2-6 PMW-EX30
Section 3
SERVICE Menu
3-1. SERVICE Menu List
INFORMATION menu
Menu Item Submenu Item Choice Function

Serial Number _ _ Displays the serial number.
Version _ _ Displays the software version.
Self Diag Diag Type Type1 Selects the self-diagnostic type.
Type2
Item1 _ _
Item2 Execute Executes self-diagnostic Item 2.
Cancel
Cancel
Cancel
Cancel
Cancel
Item7 _ _
Cancel
Cancel
Cancel
Cancel
Cancel
Cancel
Log Dump _ Execute Saving the system log onto the SxS
Cancel memory card.
3-2. SERVICE Menu Outline
3-2-1. Basic Menu Operations
Basic Menu Operation

Press the [MENU] button to enter the menu mode.
Press the [MENU] button or the [STATUS] button while the menu is displayed to close the menu dis-
play. The menu display is closed when the power is turned off.
1. Press the [MENU] button.

The system enters the menu mode.
n
For displaying the SERVICE menu, refer to section 3-2-3 of this manual.
2. Press the arrow key to move the cursor to the desired setting item and press the [SET] button.
PMW-EX30 3-1
Exiting the Menu Mode
Press the [MENU] button again.
The system exits the menu mode to return to the normal camera mode.
3-2-2. SERVICE Menu Structure
The SERVICE menu consists of a SERVICE dedicated menu and the five ordinary SETUP menus for a
total of six menus.
SERVICE menu type
Menu name Description

INFORMATION Information display on the particular PMW-EX30, self-diagnostics and saving of system log.
3-2-3. Displaying the SERVICE Menu
. To display the SERVICE menu, press the [CANCEL] button, the [MENU] button, and the [SET]
button at the same time.
Pressing the [MENU] button again closes the SERVICE menu display.
. Once the SERVICE menu has been displayed, simply pressing the [MENU] button displays the SER-
VICE menu instead of the normal SETUP menu unless the power is turned off.
3-3. SERVICE Menu Description
3-3-1. INFORMATION Menu
The INFORMATION menu enables operations such as displaying the information inherent to a specific
machine, executing Self Diag and saving of system log.
1. Displaying the serial number
. The serial number of the unit is displayed on the Serial Number.

. The cursor cannot be moved to the Serial Number.
2. Displaying the version number
. The software version of the unit is displayed on the Version.

. The cursor cannot be moved to the Version.
3. Executing self diag
Self Diag enables the user to execute self-diagnosis of the equipment. When Self Diag is run, the result of
self-diagnosis appears regardless of whether the result is good or bad.
The self-diagnosis can be executed only under the following conditions. When executing the self-diagno-
sis, change to the following conditions with the SETUP menu.
. Country: NTSC Area → OTHERS menu
. Video Format: HQ1080/60i → OTHERS menu
3-2 PMW-EX30
(1) Self-diagnostic items
The following two types of self-diagnosis are provided.
. Type1: Simple self-diagnosis
. Use to execute a simple version of the self-diagnosis. This finishes in a short time.
. Type2: Complete self-diagnosis
. This executes all items included in the Self Diag. Since complete self-diagnosis involves a memory test
and a complicated device test, this requires time to be completed. In addition, since the system cannot
be returned to normal operations after the self-diagnosis, the power must be turned off and on again.
n
The self-diagnostic items range from Item1 to Item13.
Self-diagnostic item list
Item No. Self-diagnostic item Description

Item1 _ _
Item2 Display block Diagnosis of video signal system (LCD and base band signal
processing)
Item3 Media block Diagnosis of media recording and playback (encoder, decoder,
memory card, i.LINK and USB interface)
Item4 Audio block Diagnosis of audio input and output
Item5 System controller block Diagnosis of system controller system
Item6 Power block Diagnosis of power supply system
Item7 _ _
Item8 Video I/F while recording between Diagnosis of the video signal line (recording direction) from
display and media block base band processing IC via encoder IC to AVIT signal
processing IC
Item9 Video I/F while playing back Diagnosis of the video signal line (playback direction) from
between display and media block AVIT signal processing IC via decoder IC to base band
processing IC
Item10 Audio I/F while recording between Diagnosis of the audio signal line (recording direction) from
display and media block base band processing IC to AVIT signal processing IC
Item11 Audio I/F while playing back Diagnosis of the audio signal line (playback direction) from
between display and media block AVIT signal processing IC to base band processing IC
Item12 4bit I/F while recording between Diagnosis of the 4bit Bus signal line (recording direction) from
display and media block base band processing IC to AVIT signal processing IC
Item13 4bit I/F while playing back between Diagnosis of the 4bit Bus signal line (playback direction) from
display and media block AVIT signal processing IC to base band processing IC
*The grayed-out items cannot be selected.
(2) Procedure for the self-diagnosis

1) Select the type of self-diagnosis (Type 1 or Type 2) in Diag Type.
n
When Type 1/2 for an Item in the table is “1 only”, the item executes only for type 1, and when it
is “2 only”, it executes only for type 2. For “1, 2”, the item executes for both type 1 and type 2.
2) Select the Item of self-diagnosis from Item1 to Item13.

3) When an Item is selected, Execute and Cancel appear. In addition, when Execute is selected, the
self-diagnosis of the selected Item starts.
4) When the self-diagnosis is completed, the result of self-diagnosis appears.
PMW-EX30 3-3
Example of the display for results of self-diagnosis
Press the [CANCEL] button, arrow key or [SET] button
while displaying the result of self-diagnosis to return to the
INFORMATION menu.
The results of self-diagnosis

The result of self-diagnosis is composed of the diagnostic item ID (DiagID) for the Item and Try, Success,
and Result for the item. The result of the self-diagnosis for each item is displayed after execution.
Meaning of Try, Success, and Result
Category Description
Try Shows the number of trials of the self-diagnosis.
Success Shows the number of internal successes of the self-diagnosis.
Result Shows the result of the self-diagnosis. “0” means no problems.
When a value other than “0” is displayed, check the details for each self-diagnostic item.
(3) Details of self-diagnosis

This section describes self-diagnostic items included in each Item. The values in the Error value column
show the value for errors. The value is “0” when there is no error.
Item2: Display block diagnosis
Display block diagnosis does not function.
3-4 PMW-EX30
Item3: Media block diagnosis
Media block diagnosis analyzes the following contents.

ID Diagnosis description Error value Type 1/2 Note
0x01 DDR2 SDRAM Read/Write check -1: Error 2 only Continuous operations cannot
be operated after this check.
This check requires a long time.
0x06 USB Device Register -1: Error 1 only _
0x08 Read/Write check
0x09 i.Link Register Read/Write check -1: Error 1 only _
0x0a
0x0b USB Host Register -1: Error 1 only _
0x0d Read/Write check
0x11
0x13 _ _ _ _
0x14 PIFC POWSW -1: Error 1 only _
0x15 SPA POWSW -1: Error 1 only _
0x12 MPEG encoder/decoder IC Data -1: Error 1 only _
Read/Write
0x20 NOR-FlashROM data -1: Error 1 only _
0x21 consistency check
0x22
0x25
0x26
0x23 Slot A LED blink -1: Error 1 only _
0x24 Slot B LED blink -1: Error 1 only _
Item4: Audio block diagnosis
Audio block diagnosis analyzes the following contents.

0x02 Memory area check for audio block -1: Memory read/write comparison NG 1, 2 _
When an error is detected in the item, it indicates a possible error in the hardware.
PMW-EX30 3-5
Item5: System controller block diagnosis
System controller block diagnosis analyzes the following contents.

0x01 IIC communication test (clock IC) -1: Error 1, 2 _
0x02 IIC communication test (EEPROM) -1: Error 1, 2 _
0x03 IIC communication test (power supply microcomputer) -1: Error 1, 2 _
0x04 IIC communication test (sub-microcomputer of the inside -1: Error 1, 2 _
panel)
0x05 IIC communication test (sub-microcomputer of the handle) -1: Error 1, 2 _
0x06 IIC communication test (sub-microcomputer of -1: Error 1, 2 _
0x07 the rear panel)
0x08
0x09 IIC communication test (I/O expander) -1: Error 1, 2 _
0x0a
0x0b
0x0c
0x0d
0x0e
0x0f
When an error is detected in the IIC communication test, it indicates a possible failure in the communication line or device.
*: When an error is detected in the version matching test, upgrade again to a compatible version.
Contact your local Sony Sales Office/Service Center for information on versions.
Item6: Power block diagnosis
Power block diagnosis analyzes the following contents.

0x01 Power switch readout -1: Cannot readout battery 1, 2 _
power switch
-4: Cannot diagnose since the
power switch is not set to
CAMERA
0x03 Power supply state -1: Power supply is not con- 1, 2 _
trolled correctly
-4: Cannot diagnose since the
power switch is not CAM-
ERA
3-6 PMW-EX30
Item8 to 13: Diagnosis between display and media blocks
Diagnosis between display and media blocks analyzes the following contents.
Item No. ID Diagnosis description Error value Type 1/2 Note
8 0x90 Video signal line communication -1: Test pattern checking failure 1, 2 _
test in recording direction (in the -2: Sequence error
direction from base band process-
ing IC to AVIT signal processing IC)
9 0x91 Video signal line communication -1: Test pattern checking failure 1, 2 _
test in playback direction (in the -2: Sequence error
direction from AVIT signal process-
ing IC to base band processing IC)
10 0x92 LPCM signal line communication -1: Test pattern checking failure 1, 2 _
11 0x93 LPCM signal line communication -1: Test pattern checking failure 1, 2 _
ing IC to base band processing IC)
12 0x94 4bit I/F signal line communication -1: Test pattern checking failure 1, 2 _
13 0x95 4bit I/F signal line communication -1: Test pattern checking failure 1, 2 _
ing IC to base band processing)
When an error is detected, it indicates a possible failure in the chip or the signal line between chips.
PMW-EX30 3-7
Section 4
Spare Parts
4-1. Notes on Repair Parts
1. Safety Related Components Warning

w
Components marked ! are critical to safe operation.
Therefore, specified parts should be used in the case of
replacement.
2. Standardization of Parts
Some repair parts supplied by Sony differ from those
used for the unit. These are because of parts common-
ality and improvement.
3. Stock of Parts
Parts marked with “o” at SP (Supply Code) column of
the spare parts list may not be stocked. Therefore, the
delivery date will be delayed.
4. Harness
Harnesses with no part number are not registered as
spare parts.
PMW-EX30 4-1
Front Panel Block
4-2. Exploded Views
B3 x 6
B3 x 6
B3 x 6
3
B
7
B
11
D
12
C B3 x 6
5 PSW
B3 x 6 3x6
E
A C
2 6
PTP2 x 5
10 PTP3 x 6
4
14
PTP2 x 5
13 1
4-2 PMW-EX30
Front Panel Block
No. Part No. SP Description

1 A-1363-183-B s 3.5 INCH LCD ASSY
2 A-1549-522-A s MOUNTED CIRCUIT BOARD, HP-143
3 A-1550-512-A s MOUNTED CIRCUIT BOARD, KY-633
4 X-2318-585-1 s SUB ASSY,FRONT PANEL
5 ! 1-528-174-11 s BATTERY, LITHIUM (CR2032 TYPE)
6 1-822-123-11 s JACK
7 1-832-097-11 s CABLE, FLEXIBLE FLAT (30 CORE)
8 3-278-644-01 s XDCAM EMBLEM
9 3-855-938-01 s SCREW +PSW M2X5
10 3-964-010-32 s SCREW (M2), 0 PART-NO. P2 MAIN
11 3-991-302-02 s BASE,POWER SWITCH
12 4-000-084-01 s BUTTON, POWER
13 4-000-117-02 s VOL KNOB
14 4-942-567-32 s EMBLEM (NO.4), SONY
7-682-547-04 s SCREW +B 3X6

7-682-947-01 s SCREW +PSW 3X6
7-685-103-11 s SCREW +PTP 2X5 TYPE2 NON-SLIT
PMW-EX30 4-3
Board Block
A
B
PSW3 x 6
104
PSW3 x 6
110
111 108
B3 x 6
109 114 PSW3 x 6 BVTP3 x 8
PSW3 x 6
106
105
107
112
103
C
115
P2 x 3
101
PTP
3x6
PSW3 x 6
118
B
P2 x 3 116
117 116
A
113
102 117
P2 x 3
113
102
4-4 PMW-EX30
Board Block
No. Part No. SP Description

101 A-1550-513-A s MOUNTED CIRCUIT BOARD, CP-400
102 A-1550-514-A s MOUNTED CIRCUIT BOARD, EC-64
103 A-1550-515-A s MOUNTED CIRCUIT BOARD, AVP-11
104 A-1550-516-A s MOUNTED CIRCUIT BOARD, DPR-297
105 1-573-584-11 s CONNECTOR, BNC (RECEPTACLE) 3P
106 1-573-590-22 s CONNECTOR, (S) TERMINAL 4P
107 1-770-080-12 s CONNECTOR, ASSY (BNC) 1P
108 1-785-444-11 s CONNECTOR, SQUARE TYPE
109 1-793-459-11 s JACK,DC(POLARITY UNIFIED TYPE)
110 1-818-513-21 s CONNECTOR (SQUARE TYPE)(USB)5P
111 1-819-696-21 s CONNECTOR, HDMI
112 1-819-853-11 s JACK, PIN 2P
113 1-821-531-11 s CONNECTOR, EX CARD(GUIDE UNIT)
114 1-821-694-11 s CONNECTOR, COAXIAL (BNC2P)
115 1-832-098-11 s CABLE, FLEXIBLE FLAT (30 CORE)
116 1-966-220-11 s HARNESS(DPR-EC1)
117 3-968-729-52 s SCREW (M2), LOCK ACE, P2
118 3-987-171-02 s FOOT (FF-004)
7-621-255-15 s SCREW +P 2X3

7-682-547-04 s SCREW +B 3X6
7-682-947-01 s SCREW +PSW 3X6
7-685-646-19 s SCREW +BVTP 3X8 TYPE2 N-S
PMW-EX30 4-5
4-3. Electrical Parts List
------------
AVP-11 BOARD (AVP-11 BOARD)
------------
Ref. No. Ref. No.
or Q'ty Part No. SP Description or Q'ty Part No. SP Description
1pc A-1550-515-A s MOUNTED CIRCUIT BOARD, AVP-11 C319 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C320 1-112-815-91 s CAP, CERAMIC 10MF C (1608)
C100 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005) C321 1-112-815-91 s CAP, CERAMIC 10MF C (1608)
C102 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005) C323 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C103 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C108 1-100-611-91 s CAP, CERAMIC 22MF C (2012) C328 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C109 1-112-746-91 s CAP, CERAMIC 4.7MF B (1608)
C111 1-112-815-91 s CAP, CERAMIC 10MF C (1608) C331 1-112-815-91 s CAP, CERAMIC 10MF C (1608)
C113 1-100-611-91 s CAP, CERAMIC 22MF C (2012) C401 1-125-891-91 s CAP, CHIP CERAMIC0.47MF B 1608
C115 1-164-227-91 s CAP,CERAMIC 22000PF B 1608 C402 1-100-503-91 s CAP, CERAMIC 4.7MF C (2012)
C116 1-164-227-91 s CAP,CERAMIC 22000PF B 1608 C404 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C119 1-164-227-91 s CAP,CERAMIC 22000PF B 1608
C123 1-164-227-91 s CAP,CERAMIC 22000PF B 1608 C411 1-127-715-91 s CAP,CHIP CERAMIC 0.22MF B 1608
C126 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005) C412 1-127-715-91 s CAP,CHIP CERAMIC 0.22MF B 1608
C413 1-127-715-91 s CAP,CHIP CERAMIC 0.22MF B 1608
C127 1-112-815-91 s CAP, CERAMIC 10MF C (1608) C414 1-127-715-91 s CAP,CHIP CERAMIC 0.22MF B 1608
C128 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005) C415 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
C130 1-164-227-91 s CAP,CERAMIC 22000PF B 1608
C134 1-164-227-91 s CAP,CERAMIC 22000PF B 1608 C424 1-125-891-91 s CAP, CHIP CERAMIC0.47MF B 1608
C200 1-127-692-91 s CAP, CHIP CERAMIC 10MF B 3225 C435 1-127-715-91 s CAP,CHIP CERAMIC 0.22MF B 1608
C300 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005 C452 1-100-611-91 s CAP, CERAMIC 22MF C (2012)
C301 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005 C453 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C303 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005
C304 1-112-815-91 s CAP, CERAMIC 10MF C (1608) C455 1-112-746-91 s CAP, CERAMIC 4.7MF B (1608)
C305 1-164-874-81 s CAP,CHIP CERAMIC 100PF CH 1005 C457 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
C311 1-112-692-81 s CAP,CHIP CERAMIC1000PF CH 1005 C461 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C312 1-112-692-81 s CAP,CHIP CERAMIC1000PF CH 1005 C601 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C314 1-165-884-91 s CAP, CERAMIC 2.2MF (1608) C603 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C315 1-165-884-91 s CAP, CERAMIC 2.2MF (1608)
4-6 PMW-EX30
(AVP-11 BOARD) (AVP-11 BOARD)
Ref. No. Ref. No.
C608 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005) C918 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C609 1-165-989-91 s CAP, CERAMIC 10MF (2012) C919 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C610 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005) C920 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C701 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005) C921 1-112-746-91 s CAP, CERAMIC 4.7MF B (1608)
C702 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005) C1000 1-162-910-91 s CAP, CERAMIC 5.0PF CH 1608
C714 1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216 C1001 1-162-910-91 s CAP, CERAMIC 5.0PF CH 1608
C722 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005) C1009 1-162-915-91 s CAP, CERAMIC 10PF CH 1608
C809 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005) C1024 1-162-964-91 s CAP,CHIP CERAMIC 1000PF B 1608
C815 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005) C1031 1-124-779-21 s CAP, ELECT 10MF (4.3X5.5)
C819 1-165-989-91 s CAP, CERAMIC 10MF (2012) C1035 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C820 1-165-989-91 s CAP, CERAMIC 10MF (2012) C1036 1-124-779-21 s CAP, ELECT 10MF (4.3X5.5)
C821 1-165-989-91 s CAP, CERAMIC 10MF (2012) C1037 1-124-779-21 s CAP, ELECT 10MF (4.3X5.5)
PMW-EX30 4-7
Ref. No. Ref. No.
C1056 1-128-991-21 s CAP, ELECT 10MF (5.3X5.5) C1202 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C1058 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225 C1204 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C1061 1-162-919-91 s CAP, CERAMIC 22PF CH 1608 C1207 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C1067 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005) C1215 1-162-970-91 s CAP, CERAMIC 0.01MF B 1608
C1068 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005) C1216 1-165-176-91 s CAP,CERAMIC 47000PF B 1608
C1069 1-100-672-91 s CAP, CERAMIC 10MF C (3216) C1217 1-165-176-91 s CAP,CERAMIC 47000PF B 1608
C1090 1-162-919-91 s CAP, CERAMIC 22PF CH 1608 C1238 1-112-815-91 s CAP, CERAMIC 10MF C (1608)
C1160 1-126-412-21 s CAP, CHIP ELECT 220MF (4X5.7) C1241 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C1161 1-126-412-21 s CAP, CHIP ELECT 220MF (4X5.7) C1242 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C1162 1-112-746-91 s CAP, CERAMIC 4.7MF B (1608) C1243 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005)
C1179 1-100-505-91 s CAP, CERAMIC 0.1MF C (1005) C1501 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C1201 1-162-970-91 s CAP, CERAMIC 0.01MF B 1608 C1503 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
4-8 PMW-EX30
Ref. No. Ref. No.
C1504 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608 C1645 1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225)
C1505 1-125-891-91 s CAP, CHIP CERAMIC0.47MF B 1608 C1646 1-112-300-91 s CAP, CERAMIC 4.7MF B (2012)
C1506 1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225) C1647 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
C1507 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608 C1648 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C1508 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608 C1649 1-100-159-91 s CAP, CERAMIC 22MF B (SMD) 3216
C1509 1-162-970-91 s CAP, CERAMIC 0.01MF B 1608 C1650 1-165-176-91 s CAP,CERAMIC 47000PF B 1608
C1510 1-165-989-91 s CAP, CERAMIC 10MF (2012) C1651 1-162-970-91 s CAP, CERAMIC 0.01MF B 1608
C1511 1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225) C1652 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C1513 1-162-970-91 s CAP, CERAMIC 0.01MF B 1608 C1654 1-162-970-91 s CAP, CERAMIC 0.01MF B 1608
C1514 1-162-927-91 s CAP, CERAMIC 100PF CH 1608 C1655 1-135-349-21 s CAP, ELECT 22MF (6.3X6)
C1515 1-112-180-21 s CAP, ALUMINIUM ELECT 150MF C1656 1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225)
C1516 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608 C1657 1-162-923-91 s CAP, CERAMIC 47PF CH 1608
C1517 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608 C1658 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C1518 1-127-715-91 s CAP,CHIP CERAMIC 0.22MF B 1608 C1659 1-162-923-91 s CAP, CERAMIC 47PF CH 1608
C1520 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608 C1660 1-164-230-91 s CAP,CERAMIC 220PF CH 1608
C1521 1-162-927-91 s CAP, CERAMIC 100PF CH 1608 C1661 1-165-176-91 s CAP,CERAMIC 47000PF B 1608
C1524 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608 C1662 1-164-227-91 s CAP,CERAMIC 22000PF B 1608
C1602 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608 C1663 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C1603 1-112-746-91 s CAP, CERAMIC 4.7MF B (1608) C1664 1-112-180-21 s CAP, ALUMINIUM ELECT 150MF
C1604 1-112-746-91 s CAP, CERAMIC 4.7MF B (1608) C1665 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C1605 1-112-746-91 s CAP, CERAMIC 4.7MF B (1608) C1666 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C1607 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608 C1667 1-112-785-11 s CAP, ELECT(SOLID)
C1608 1-137-980-91 s CAP,CHIP CERAMIC 0.47MF B 3216 C1668 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C1609 1-127-715-91 s CAP,CHIP CERAMIC 0.22MF B 1608 C1669 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C1610 1-127-715-91 s CAP,CHIP CERAMIC 0.22MF B 1608 C1670 1-107-823-91 s CAP, CERAMIC 470000PF B (2012)
C1611 1-127-715-91 s CAP,CHIP CERAMIC 0.22MF B 1608 C1671 1-164-227-91 s CAP,CERAMIC 22000PF B 1608
C1616 1-112-727-21 s CAP, ELECT 47MF (8.0X6.9) C1803 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C1617 1-164-315-91 s CAP, CERAMIC 470PF CH (1608) C1804 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C1618 1-162-927-91 s CAP, CERAMIC 100PF CH 1608 C1805 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C1620 1-162-923-91 s CAP, CERAMIC 47PF CH 1608 C1807 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C1623 1-162-970-91 s CAP, CERAMIC 0.01MF B 1608 C1810 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C1624 1-162-970-91 s CAP, CERAMIC 0.01MF B 1608 C1811 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C1627 1-162-969-91 s CAP, CERAMIC 6800PF B 1608 C1814 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C1629 1-112-746-91 s CAP, CERAMIC 4.7MF B (1608) C1816 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C1630 1-127-715-91 s CAP,CHIP CERAMIC 0.22MF B 1608 C1817 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C1631 1-162-969-91 s CAP, CERAMIC 6800PF B 1608 C1818 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C1632 1-165-989-91 s CAP, CERAMIC 10MF (2012) C1819 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C1638 1-135-349-21 s CAP, ELECT 22MF (6.3X6) C1825 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C1641 1-112-180-21 s CAP, ALUMINIUM ELECT 150MF C1828 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C1642 1-112-180-21 s CAP, ALUMINIUM ELECT 150MF C1829 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
C1644 1-112-784-11 s CAP, ELECT(SOLID) C1831 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608
PMW-EX30 4-9
Ref. No. Ref. No.
C1832 1-165-989-91 s CAP, CERAMIC 10MF (2012) D1602 8-719-069-28 s DIODE 1SS400TE-61
C1836 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225 D1606 8-719-069-28 s DIODE 1SS400TE-61
C1837 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608 D1607 8-719-069-28 s DIODE 1SS400TE-61
C1838 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608 D1608 8-719-938-77 s DIODE SB05-05C-TB-E
C1840 1-112-298-91 o CAP, CERAMIC 1MF B (1608) D1610 8-719-069-28 s DIODE 1SS400TE-61
C1841 1-162-970-91 s CAP, CERAMIC 0.01MF B 1608 D1611 8-719-069-28 s DIODE 1SS400TE-61
C1842 1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225) D1612 8-719-069-28 s DIODE 1SS400TE-61
C1843 1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225) D1613 8-719-069-28 s DIODE 1SS400TE-61
C1845 1-162-970-91 s CAP, CERAMIC 0.01MF B 1608 D1615 8-719-051-04 s DIODE EC10QS04-TE12L5
C1846 1-162-927-91 s CAP, CERAMIC 100PF CH 1608 D1616 8-719-051-04 s DIODE EC10QS04-TE12L5
C1847 1-114-509-11 s CAP, ELECT 150MF (6.3X7.7) D1617 8-719-069-28 s DIODE 1SS400TE-61
C1850 1-127-715-91 s CAP,CHIP CERAMIC 0.22MF B 1608 D1800 8-719-069-28 s DIODE 1SS400TE-61
C1852 1-127-715-91 s CAP,CHIP CERAMIC 0.22MF B 1608 D1802 8-719-069-28 s DIODE 1SS400TE-61
C2001 1-162-927-91 s CAP, CERAMIC 100PF CH 1608 D1807 8-719-069-28 s DIODE 1SS400TE-61
C2003 1-112-298-91 o CAP, CERAMIC 1MF B (1608) D1809 8-719-069-28 s DIODE 1SS400TE-61
C2005 1-112-300-91 s CAP, CERAMIC 4.7MF B (2012) D1811 8-719-069-28 s DIODE 1SS400TE-61
C2006 1-100-276-21 s CAP, ELECT 22MF (5.0X6.5) D1812 8-719-069-28 s DIODE 1SS400TE-61
C2007 1-112-300-91 s CAP, CERAMIC 4.7MF B (2012) D1813 8-719-067-83 s DIODE RB161L-40TE25
C2009 1-164-315-91 s CAP, CERAMIC 470PF CH (1608)
EP1401 1-535-877-22 s CHIP, CHECKER
CN401 1-821-694-11 s CONNECTOR, COAXIAL (BNC2P) EP1402 1-535-877-22 s CHIP, CHECKER
CN404 1-819-696-21 s CONNECTOR, HDMI EP1403 1-535-877-22 s CHIP, CHECKER
CN801 1-573-290-21 s PIN, CONNECTOR (1.5MM) (SMD)4P EP1404 1-535-877-22 s CHIP, CHECKER
CN1000 1-778-650-31 s CONNECTOR, FFC/FPC(ZIF) ST 30P EP1405 1-535-877-22 s CHIP, CHECKER
CN1160 1-764-079-21 s PIN, CONNECTOR (PC BOARD) 4P
F1500 ! 1-533-627-21 s FUSE (SMD) (5A/125V)
CN1200 1-820-173-11 s CONNECTOR, USB
CN1201 1-778-650-31 s CONNECTOR, FFC/FPC(ZIF) ST 30P FB300 1-414-760-21 s FERRITE, EMI (SMD) (1608)
CN1300 1-817-871-21 s PIN, CONNECTOR 15P FB401 1-414-760-21 s FERRITE, EMI (SMD) (1608)
CN1400 1-817-869-21 s PIN, CONNECTOR 10P FB402 1-414-760-21 s FERRITE, EMI (SMD) (1608)
CN1401 1-573-290-21 s PIN, CONNECTOR (1.5MM) (SMD)4P FB403 1-414-760-21 s FERRITE, EMI (SMD) (1608)
FB404 1-414-760-21 s FERRITE, EMI (SMD) (1608)
CN1500 1-793-459-11 s JACK,DC(POLARITY UNIFIED TYPE)
CN2001 1-573-290-21 s PIN, CONNECTOR (1.5MM) (SMD)4P FB405 1-414-760-21 s FERRITE, EMI (SMD) (1608)
D1000 8-719-069-28 s DIODE 1SS400TE-61 FB407 1-414-760-21 s FERRITE, EMI (SMD) (1608)
D1200 8-719-056-48 s DIODE 1SS388(TPL3) FB409 1-414-760-21 s FERRITE, EMI (SMD) (1608)
D1500 8-719-421-72 s DIODE MA132WA-TX
D1501 8-719-421-68 s DIODE MA132WK-TX FB410 1-414-760-21 s FERRITE, EMI (SMD) (1608)
D1502 8-719-157-61 s DIODE RD15M-T1B FB412 1-414-760-21 s FERRITE, EMI (SMD) (1608)
D1503 8-719-072-43 s DIODE RB050L-40TE25 FB413 1-414-760-21 s FERRITE, EMI (SMD) (1608)
D1505 8-719-069-28 s DIODE 1SS400TE-61
D1506 8-719-421-68 s DIODE MA132WK-TX FB415 1-414-760-21 s FERRITE, EMI (SMD) (1608)
4-10 PMW-EX30
Ref. No. Ref. No.
FB1202 1-414-760-21 s FERRITE, EMI (SMD) (1608) IC1204 6-704-178-01 s IC TC7SZ08AFE
FB1500 1-400-580-21 s FERRITE, EMI (SMD) IC1205 6-704-178-01 s IC TC7SZ08AFE
FB1501 1-400-580-21 s FERRITE, EMI (SMD) IC1206 6-704-178-01 s IC TC7SZ08AFE
IC1207 6-704-178-01 s IC TC7SZ08AFE
FL401 1-239-897-31 s FILTER, EMI (SMD) IC1208 6-704-178-01 s IC TC7SZ08AFE
FL1500 1-469-819-22 s FILTER, EMI
IC1209 6-704-178-01 s IC TC7SZ08AFE
IC100 6-709-147-01 s IC SN74LVC2T45DCUR IC1300 8-759-592-49 s IC TC7SZ125FU(TE85R)
IC103 6-711-055-01 s IC LTC3526BEDC#TR IC1301 8-759-669-41 s IC SN74LVC125APWR-12
IC106 6-708-464-01 o IC R1114Q251D-TR-FA IC1302 6-704-178-01 s IC TC7SZ08AFE
IC300 6-707-872-01 s IC TC74VHC221AFT(EKJ) IC1303 6-704-178-01 s IC TC7SZ08AFE
IC301 8-759-592-48 s IC TC7SZ32FU(TE85R)
IC1304 6-704-178-01 s IC TC7SZ08AFE
IC302 6-703-879-01 s IC NJU7043RB1(TE2) IC1305 6-704-178-01 s IC TC7SZ08AFE
IC303 8-759-592-49 s IC TC7SZ125FU(TE85R) IC1306 6-704-178-01 s IC TC7SZ08AFE
IC304 8-759-592-49 s IC TC7SZ125FU(TE85R) IC1307 6-704-178-01 s IC TC7SZ08AFE
IC305 6-709-646-01 s IC TLC2933AIPWR IC1308 6-704-178-01 s IC TC7SZ08AFE
IC306 6-709-646-01 s IC TLC2933AIPWR
IC1309 6-704-178-01 s IC TC7SZ08AFE
IC307 6-707-863-01 s IC TC74VHC08FT(EKJ) IC1310 6-704-178-01 s IC TC7SZ08AFE
IC308 8-759-683-80 s IC SN65LVDS1DBVR IC1311 6-704-178-01 s IC TC7SZ08AFE
IC402 8-759-392-77 s IC SN74LVC245APWR IC1312 6-704-178-01 s IC TC7SZ08AFE
IC403 8-759-392-77 s IC SN74LVC245APWR IC1313 6-710-121-01 s IC M24256-BWMN6TP(A)
IC404 8-759-392-77 s IC SN74LVC245APWR
IC1314 6-704-178-01 s IC TC7SZ08AFE
IC405 8-759-392-77 s IC SN74LVC245APWR IC1315 6-704-178-01 s IC TC7SZ08AFE
IC407 6-706-478-01 s IC TC7SET08FU(T5RSOJF) IC1400 8-759-592-47 s IC TC7SZ08FU(TE85R)
IC451 6-709-619-01 s IC GS1578ACNE3 IC1401 8-759-592-47 s IC TC7SZ08FU(TE85R)
IC452 6-712-973-01 s IC AD9889BBCPZ-80 IC1500 8-759-338-95 s IC NJM2903V(TE2)
IC453 6-709-612-01 s IC GS1574ACNE3
IC1501 6-706-487-01 s IC TC7SH08FU(T5RSOYJF)
IC500 8-759-392-77 s IC SN74LVC245APWR IC1502 8-759-653-03 s IC NJM78M05DL1A-TE1
IC601 8-759-392-77 s IC SN74LVC245APWR IC1504 6-701-652-01 s IC MAX4374TEUB+TG069
IC701 6-702-481-01 s IC PCA9555DB-118 IC1600 8-753-235-21 s IC CXD3175BGG-T6
IC801 8-759-592-49 s IC TC7SZ125FU(TE85R) IC1601 6-707-828-01 s IC MM1431ANRE
IC802 8-759-592-49 s IC TC7SZ125FU(TE85R)
IC1602 6-707-828-01 s IC MM1431ANRE
IC903 8-759-669-41 s IC SN74LVC125APWR-12 IC1603 6-701-549-01 s IC LTC1778EGN
IC1000 8-759-561-46 s IC AD8014ARTZ-REEL7 IC1604 6-702-510-01 s IC TPS5120DBTRG4
IC1001 8-759-561-46 s IC AD8014ARTZ-REEL7 IC1606 6-705-481-01 s IC LT1931ES5#TR
IC1002 8-759-561-46 s IC AD8014ARTZ-REEL7 IC1607 6-705-480-01 s IC LT3467ES6#TR
IC1003 8-759-561-46 s IC AD8014ARTZ-REEL7
IC1608 6-703-721-01 s IC TPS54310PWPR
IC1004 8-759-561-46 s IC AD8014ARTZ-REEL7 IC1609 8-759-338-95 s IC NJM2903V(TE2)
IC1005 8-759-561-46 s IC AD8014ARTZ-REEL7 IC1610 8-759-338-95 s IC NJM2903V(TE2)
IC1006 8-759-462-09 s IC TLV431AIDBVR IC1611 8-759-338-95 s IC NJM2903V(TE2)
IC1007 8-759-462-09 s IC TLV431AIDBVR IC1612 8-759-338-95 s IC NJM2903V(TE2)
IC1009 6-704-894-01 s IC PCA9554BS-118
IC1801 6-705-338-01 s IC TK11250CMCL-G
IC1010 6-704-894-01 s IC PCA9554BS-118 IC2000 6-703-879-01 s IC NJU7043RB1(TE2)
IC1011 6-707-862-01 s IC TC74VHC05FT(EKJ) IC2001 8-759-592-49 s IC TC7SZ125FU(TE85R)
IC1012 6-707-862-01 s IC TC74VHC05FT(EKJ) IC2002 6-807-890-01 s IC UPD78F0533AGB(S)-404-UEU-A
IC1013 8-759-144-75 s IC UPC4572G2-E2
IC1014 8-759-523-02 s IC TC74HC4053AFT(EL) L100 1-456-136-21 s CHOKE COIL (10UH) (5.0X5.0)
L101 1-414-392-41 s INDUCTOR (SMD) 1.0UH
IC1015 8-759-523-02 s IC TC74HC4053AFT(EL) L102 1-414-396-41 s INDUCTOR (SMD) 4.7UH
IC1017 8-759-144-75 s IC UPC4572G2-E2 L104 1-414-396-41 s INDUCTOR (SMD) 4.7UH
IC1018 8-759-523-02 s IC TC74HC4053AFT(EL)
IC1019 8-759-422-21 s IC NJM4580V(TE2) L105 1-414-396-41 s INDUCTOR (SMD) 4.7UH
IC1022 6-704-894-01 s IC PCA9554BS-118 L300 1-414-398-41 s INDUCTOR (SMD) 10.0UH
IC1023 6-707-862-01 s IC TC74VHC05FT(EKJ)
IC1201 8-759-592-49 s IC TC7SZ125FU(TE85R) L401 1-414-461-41 s INDUCTOR, CHIP (K) 6.8NH
IC1203 6-708-857-01 o IC K4M28163LH-BN75T L402 1-414-398-41 s INDUCTOR (SMD) 10.0UH
PMW-EX30 4-11
Ref. No. Ref. No.
L403 1-414-398-41 s INDUCTOR (SMD) 10.0UH L1817 1-456-622-21 s COIL, CHOKE 1UH
L451 1-414-398-41 s INDUCTOR (SMD) 10.0UH Q300 8-729-928-25 s TRANSISTOR 2SA1774TL-QR
L452 1-414-461-41 s INDUCTOR, CHIP (K) 6.8NH Q301 8-729-928-25 s TRANSISTOR 2SA1774TL-QR
L453 1-414-398-41 s INDUCTOR (SMD) 10.0UH Q401 6-550-119-01 s TRANSISTOR DTC144EMFS6T2L
Q1000 6-550-981-01 s TRANSISTOR RN1905(T5RSONY,D,F)
L454 1-414-398-41 s INDUCTOR (SMD) 10.0UH Q1001 6-550-239-01 s TRANSISTOR DTA144EMFS6T2L
L456 1-813-308-11 o COMMON MODE CHOKE Q1002 6-551-266-01 s TRANSISTOR SI2304BDS-T1
L457 1-813-308-11 o COMMON MODE CHOKE Q1003 8-729-929-09 s TRANSISTOR DTC123JE-TL
L458 1-813-308-11 o COMMON MODE CHOKE Q1004 6-550-232-01 s TRANSISTOR 2SA2029FS6T2LQ/R
Q1005 6-550-232-01 s TRANSISTOR 2SA2029FS6T2LQ/R
L459 1-813-308-11 o COMMON MODE CHOKE Q1006 6-551-294-01 s TRANSISTOR MCH6606-TL-E
L1000 1-412-947-21 s INDUCTOR 4.7UH (2520) Q1007 6-551-041-01 s TRANSISTOR RN4904(T5RSONY,D,F)
L1002 1-412-947-21 s INDUCTOR 4.7UH (2520) Q1009 6-551-294-01 s TRANSISTOR MCH6606-TL-E
Q1160 8-729-231-72 s TRANSISTOR 2SC3326N-TE85L-AB
L1003 1-412-943-21 s INDUCTOR 2.2UH (2520) Q1161 8-729-231-72 s TRANSISTOR 2SC3326N-TE85L-AB
L1004 1-412-943-21 s INDUCTOR 2.2UH (2520)
L1006 1-469-549-21 s INDUCTOR, CHIP 1.0UH (LB2016) Q1500 8-729-928-82 s TRANSISTOR DTC144EE-TL
L1007 1-469-549-21 s INDUCTOR, CHIP 1.0UH (LB2016) Q1501 8-729-024-44 s TRANSISTOR 2SK2315TYTR
Q1502 8-729-928-82 s TRANSISTOR DTC144EE-TL
L1160 1-469-549-21 s INDUCTOR, CHIP 1.0UH (LB2016)
Q1507 6-551-380-01 s TRANSISTOR SI4425BDY-T1
L1200 1-456-799-11 s COIL, COMMON MODE CHOKE Q1508 8-729-928-25 s TRANSISTOR 2SA1774TL-QR
L1501 1-456-136-21 s CHOKE COIL (10UH) (5.0X5.0) Q1509 8-729-928-82 s TRANSISTOR DTC144EE-TL
L1502 1-412-979-41 s INDUCTOR, SMALL TYPE 1.0UH Q1510 8-729-928-82 s TRANSISTOR DTC144EE-TL
L1601 1-456-622-21 s COIL, CHOKE 1UH Q1511 8-729-928-82 s TRANSISTOR DTC144EE-TL
Q1512 6-551-380-01 s TRANSISTOR SI4425BDY-T1
L1602 1-456-622-21 s COIL, CHOKE 1UH Q1601 8-729-929-27 s TRANSISTOR DTC114TE-TL
L1603 1-456-046-21 s COIL, CHOKE (SMD) 10UH(10X10)
L1605 1-456-046-21 s COIL, CHOKE (SMD) 10UH(10X10) Q1603 8-729-929-27 s TRANSISTOR DTC114TE-TL
L1606 1-414-392-41 s INDUCTOR (SMD) 1.0UH Q1604 8-729-929-27 s TRANSISTOR DTC114TE-TL
Q1605 8-729-929-27 s TRANSISTOR DTC114TE-TL
Q1610 6-551-736-01 s TRANSISTOR FDS6690AS
L1612 1-456-046-21 s COIL, CHOKE (SMD) 10UH(10X10) Q1611 6-551-736-01 s TRANSISTOR FDS6690AS
L1613 1-456-046-21 s COIL, CHOKE (SMD) 10UH(10X10)
L1800 1-456-622-21 s COIL, CHOKE 1UH Q1612 6-551-736-01 s TRANSISTOR FDS6690AS
L1801 1-414-392-41 s INDUCTOR (SMD) 1.0UH Q1613 8-729-928-05 s TRANSISTOR 2SC4617TL-QR
L1802 1-414-392-41 s INDUCTOR (SMD) 1.0UH Q1614 8-729-928-05 s TRANSISTOR 2SC4617TL-QR
Q1615 8-729-928-05 s TRANSISTOR 2SC4617TL-QR
L1803 1-456-622-21 s COIL, CHOKE 1UH Q1616 8-729-928-05 s TRANSISTOR 2SC4617TL-QR
L1804 1-456-622-21 s COIL, CHOKE 1UH
L1805 1-456-622-21 s COIL, CHOKE 1UH Q1617 8-729-928-28 s TRANSISTOR DTA144EE-TL
L1806 1-456-622-21 s COIL, CHOKE 1UH Q1618 8-729-928-28 s TRANSISTOR DTA144EE-TL
L1807 1-414-392-41 s INDUCTOR (SMD) 1.0UH Q1619 8-729-928-28 s TRANSISTOR DTA144EE-TL
Q1620 8-729-928-28 s TRANSISTOR DTA144EE-TL
L1808 1-414-392-41 s INDUCTOR (SMD) 1.0UH Q1621 8-729-928-82 s TRANSISTOR DTC144EE-TL
L1812 1-456-622-21 s COIL, CHOKE 1UH Q1624 6-551-736-01 s TRANSISTOR FDS6690AS
Q1625 8-729-928-82 s TRANSISTOR DTC144EE-TL
4-12 PMW-EX30
Ref. No. Ref. No.
Q1629 8-729-929-27 s TRANSISTOR DTC114TE-TL R110 1-216-864-91 s CONDUCTOR, CHIP (1608)
Q1630 8-729-928-82 s TRANSISTOR DTC144EE-TL R111 1-218-911-91 s RES, CHIP 470K (1608)
Q1631 8-729-046-04 s TRANSISTOR FDS6690A R112 1-218-899-91 s RES, CHIP 150K (1608)
Q1632 8-729-046-04 s TRANSISTOR FDS6690A R113 1-218-915-91 s RES, CHIP 680K (1608)
Q1633 8-729-046-04 s TRANSISTOR FDS6690A R114 1-216-864-91 s CONDUCTOR, CHIP (1608)
Q1634 8-729-928-05 s TRANSISTOR 2SC4617TL-QR R115 1-218-915-91 s RES, CHIP 680K (1608)
Q1635 8-729-046-04 s TRANSISTOR FDS6690A R116 1-216-864-91 s CONDUCTOR, CHIP (1608)
Q1800 6-551-523-01 s TRANSISTOR SI7114DN-T1-E3 R117 1-218-911-91 s RES, CHIP 470K (1608)
Q1801 6-551-523-01 s TRANSISTOR SI7114DN-T1-E3 R200 1-211-977-91 s RES, CHIP 22 (1608)
Q1805 6-551-523-01 s TRANSISTOR SI7114DN-T1-E3 R300 1-218-990-81 s CONDUCTOR, CHIP (1005)
Q1808 6-551-523-01 s TRANSISTOR SI7114DN-T1-E3 R304 1-208-919-81 s RES, CHIP 22K (1005)
Q1809 8-729-928-28 s TRANSISTOR DTA144EE-TL R308 1-208-863-81 s RES, CHIP 100 (1005)
Q1811 8-729-928-28 s TRANSISTOR DTA144EE-TL R310 1-208-887-81 s RES, CHIP 1.0K (1005)
Q1813 8-729-928-28 s TRANSISTOR DTA144EE-TL R312 1-218-990-81 s CONDUCTOR, CHIP (1005)
Q1816 8-729-928-28 s TRANSISTOR DTA144EE-TL R317 1-208-911-81 s RES, CHIP 10K (1005)
Q1818 8-729-929-27 s TRANSISTOR DTC114TE-TL R319 1-208-919-81 s RES, CHIP 22K (1005)
Q1822 8-729-929-27 s TRANSISTOR DTC114TE-TL R323 1-208-959-81 s RES, CHIP 1M (1005)
Q1824 8-729-929-27 s TRANSISTOR DTC114TE-TL R325 1-208-959-81 s RES, CHIP 1M (1005)
Q1826 8-729-929-27 s TRANSISTOR DTC114TE-TL R327 1-208-887-81 s RES, CHIP 1.0K (1005)
Q1827 8-729-928-05 s TRANSISTOR 2SC4617TL-QR R330 1-208-911-81 s RES, CHIP 10K (1005)
Q1828 8-729-928-82 s TRANSISTOR DTC144EE-TL R331 1-208-911-81 s RES, CHIP 10K (1005)
Q1829 6-551-523-01 s TRANSISTOR SI7114DN-T1-E3 R332 1-208-903-81 s RES, CHIP 4.7K (1005)
Q1830 6-551-523-01 s TRANSISTOR SI7114DN-T1-E3 R333 1-208-903-81 s RES, CHIP 4.7K (1005)
Q1832 6-551-265-01 s TRANSISTOR SI2307BDS-T1 R335 1-220-878-81 s RES, CHIP 22 (1005)
Q1835 8-729-928-28 s TRANSISTOR DTA144EE-TL R338 1-208-935-81 s RES, CHIP 100K (1005)
Q1836 8-729-929-27 s TRANSISTOR DTC114TE-TL R339 1-220-870-81 s RES, CHIP 10 (1005)
Q1843 8-729-928-05 s TRANSISTOR 2SC4617TL-QR R412 1-211-990-91 s RES, CHIP 75 (1608)
Q1844 8-729-928-82 s TRANSISTOR DTC144EE-TL R413 1-218-835-91 s RES, CHIP 330 (1608)
Q2000 8-729-928-82 s TRANSISTOR DTC144EE-TL R414 1-218-847-91 s RES, CHIP 1.0K (1608)
Q2001 8-729-928-82 s TRANSISTOR DTC144EE-TL R415 1-211-986-91 s RES, CHIP 51 (1608)
R100 1-211-977-91 s RES, CHIP 22 (1608) R417 1-211-969-91 s RES, CHIP 10 (1608)
R108 1-216-864-91 s CONDUCTOR, CHIP (1608) R420 1-211-969-91 s RES, CHIP 10 (1608)
PMW-EX30 4-13
Ref. No. Ref. No.
R421 1-211-969-91 s RES, CHIP 10 (1608) R725 1-216-864-91 s CONDUCTOR, CHIP (1608)
R424 1-218-887-91 s RES, CHIP 47K (1608) R729 1-218-823-91 s RES, CHIP 100 (1608)
R425 1-218-853-91 s RES, CHIP 1.8K (1608) R733 1-216-864-91 s CONDUCTOR, CHIP (1608)
R427 1-218-871-91 s RES, CHIP 10K (1608) R735 1-216-864-91 s CONDUCTOR, CHIP (1608)
R448 1-216-864-91 s CONDUCTOR, CHIP (1608) R751 1-216-864-91 s CONDUCTOR, CHIP (1608)
R450 1-216-864-91 s CONDUCTOR, CHIP (1608) R753 1-218-871-91 s RES, CHIP 10K (1608)
R456 1-211-990-91 s RES, CHIP 75 (1608) R756 1-218-871-91 s RES, CHIP 10K (1608)
R470 1-218-871-91 s RES, CHIP 10K (1608) R800 1-218-859-91 s RES, CHIP 3.3K (1608)
R471 1-211-990-91 s RES, CHIP 75 (1608) R801 1-218-859-91 s RES, CHIP 3.3K (1608)
R474 1-216-864-91 s CONDUCTOR, CHIP (1608) R802 1-218-859-91 s RES, CHIP 3.3K (1608)
4-14 PMW-EX30
Ref. No. Ref. No.
R841 1-218-859-91 s RES, CHIP 3.3K (1608) R1027 1-218-852-91 s RES, CHIP 1.6K (1608)
R918 1-218-863-91 s RES, CHIP 4.7K (1608) R1036 1-218-827-91 s RES, CHIP 150 (1608)
R1020 1-218-847-91 s RES, CHIP 1.0K (1608) R1083 1-218-895-91 s RES, CHIP 100K (1608)
PMW-EX30 4-15
Ref. No. Ref. No.
R1102 1-218-895-91 s RES, CHIP 100K (1608) R1168 1-218-887-91 s RES, CHIP 47K (1608)
4-16 PMW-EX30
Ref. No. Ref. No.
R1306 1-218-887-91 s RES, CHIP 47K (1608) R1511 1-218-919-91 s RES, CHIP 1M (1608)
R1320 1-211-977-91 s RES, CHIP 22 (1608) R1527 1-219-611-21 s RES, CHIP (SQUARE TYPE) 0.047
PMW-EX30 4-17
Ref. No. Ref. No.
R1675 1-218-919-91 s RES, CHIP 1M (1608) R1801 1-218-919-91 s RES, CHIP 1M (1608)
R1676 1-218-919-91 s RES, CHIP 1M (1608) R1802 1-218-919-91 s RES, CHIP 1M (1608)
R1678 1-218-867-91 s RES, CHIP 6.8K (1608) R1804 1-218-919-91 s RES, CHIP 1M (1608)
R1679 1-216-864-91 s CONDUCTOR, CHIP (1608) R1805 1-218-919-91 s RES, CHIP 1M (1608)
R1680 1-218-863-91 s RES, CHIP 4.7K (1608) R1806 1-218-919-91 s RES, CHIP 1M (1608)
R1682 1-216-864-91 s CONDUCTOR, CHIP (1608) R1807 1-218-919-91 s RES, CHIP 1M (1608)
R1684 1-211-969-91 s RES, CHIP 10 (1608) R1808 1-218-919-91 s RES, CHIP 1M (1608)
4-18 PMW-EX30
Ref. No. Ref. No.
R1835 1-218-887-91 s RES, CHIP 47K (1608) RB202 1-234-381-21 s RES, NETWORK 100K (1005X4)
R1836 1-218-919-91 s RES, CHIP 1M (1608) RB203 1-234-381-21 s RES, NETWORK 100K (1005X4)
R1837 1-218-919-91 s RES, CHIP 1M (1608) RB500 1-234-369-21 s RES, NETWORK 10 (1005X4)
R1838 1-218-919-91 s RES, CHIP 1M (1608) RB501 1-234-369-21 s RES, NETWORK 10 (1005X4)
R1839 1-218-911-91 s RES, CHIP 470K (1608) RB502 1-234-369-21 s RES, NETWORK 10 (1005X4)
R1843 1-218-903-91 s RES, CHIP 220K (1608) RB701 1-234-375-21 s RES, NETWORK 1K (1005X4)
R1844 1-218-887-91 s RES, CHIP 47K (1608) RB1000 1-233-578-21 s RES, CHIP NETWORK 47K (3216)
R1847 1-218-887-91 s RES, CHIP 47K (1608) RB1160 1-234-380-21 o RES, NETWORK 47K (1005X4)
R1852 1-216-864-91 s CONDUCTOR, CHIP (1608) RB2003 1-234-380-21 o RES, NETWORK 47K (1005X4)
R1855 1-218-887-91 s RES, CHIP 47K (1608)
S1 1-771-709-41 s SWITCH, SLIDE
R1856 1-218-871-91 s RES, CHIP 10K (1608) S2001 1-771-721-21 s SWITCH, TACTILE
R1857 1-216-864-91 s CONDUCTOR, CHIP (1608)
R1858 1-216-864-91 s CONDUCTOR, CHIP (1608) TP100 1-535-877-22 s CHIP, CHECKER
R1859 1-218-919-91 s RES, CHIP 1M (1608) TP101 1-535-877-22 s CHIP, CHECKER
R1860 1-218-903-91 s RES, CHIP 220K (1608) TP102 1-535-877-22 s CHIP, CHECKER
TP103 1-535-877-22 s CHIP, CHECKER
R1862 1-218-871-91 s RES, CHIP 10K (1608)
R2001 1-218-863-91 s RES, CHIP 4.7K (1608) TP201 1-535-877-22 s CHIP, CHECKER
TP203 1-535-877-22 s CHIP, CHECKER
R2005 1-218-887-91 s RES, CHIP 47K (1608)
R2006 1-211-977-91 s RES, CHIP 22 (1608) TP900 1-535-877-22 s CHIP, CHECKER
R2007 1-211-977-91 s RES, CHIP 22 (1608)
R2008 1-218-847-91 s RES, CHIP 1.0K (1608) VDR120 1-802-245-11 s ESD SUPPRESSOR
VDR121 1-802-245-11 s ESD SUPPRESSOR
R2009 1-218-871-91 s RES, CHIP 10K (1608)
R2010 1-218-871-91 s RES, CHIP 10K (1608) X300 1-795-670-12 s OSCILLATOR, CRYSTAL (VCXO)3.3V
R2011 1-218-871-91 s RES, CHIP 10K (1608) X301 1-795-671-12 s OSCILLATOR, CRYSTAL (VCXO)3.3V
R2012 1-218-847-91 s RES, CHIP 1.0K (1608) X1200 1-813-942-11 s OSCILLATOR, CRYSTAL 27MHZ
R2013 1-218-871-91 s RES, CHIP 10K (1608)
R2014 1-218-887-91 s RES, CHIP 47K (1608)
R2015 1-218-871-91 s RES, CHIP 10K (1608)
R2016 1-218-871-91 s RES, CHIP 10K (1608)
R2018 1-216-864-91 s CONDUCTOR, CHIP (1608)
PMW-EX30 4-19
------------
CP-400 BOARD (CP-400 BOARD)
------------
Ref. No. Ref. No.
1pc A-1550-513-A s MOUNTED CIRCUIT BOARD, CP-400 Q102 6-550-232-01 s TRANSISTOR 2SA2029FS6T2LQ/R
Q103 8-729-231-72 s TRANSISTOR 2SC3326N-TE85L-AB
C29 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225 Q104 8-729-231-72 s TRANSISTOR 2SC3326N-TE85L-AB
C31 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
C100 1-162-923-91 s CAP, CERAMIC 47PF CH 1608 R6 1-216-864-91 s CONDUCTOR, CHIP (1608)
C101 1-162-923-91 s CAP, CERAMIC 47PF CH 1608 R100 1-218-871-91 s RES, CHIP 10K (1608)
C102 1-165-947-91 s CAP, CHIP CERAMIC 2.2MF B 3225 R101 1-218-871-91 s RES, CHIP 10K (1608)
R102 1-218-885-91 s RES, CHIP 39K (1608)
C103 1-165-947-91 s CAP, CHIP CERAMIC 2.2MF B 3225 R103 1-218-885-91 s RES, CHIP 39K (1608)
C105 1-100-880-91 s CAP, CERAMIC 100MF C (3225) R104 1-218-853-91 s RES, CHIP 1.8K (1608)
C106 1-135-960-91 s CAP, CHIP CERAMIC 10MF B(3225) R105 1-218-855-91 s RES, CHIP 2.2K (1608)
C107 1-100-672-91 s CAP, CERAMIC 10MF C (3216) R106 1-218-853-91 s RES, CHIP 1.8K (1608)
R107 1-218-855-91 s RES, CHIP 2.2K (1608)
C108 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225 R108 1-218-887-91 s RES, CHIP 47K (1608)
C110 1-124-779-21 s CAP, ELECT 10MF (4.3X5.5) R109 1-218-887-91 s RES, CHIP 47K (1608)
C111 1-124-779-21 s CAP, ELECT 10MF (4.3X5.5) R110 1-218-859-91 s RES, CHIP 3.3K (1608)
C112 1-162-919-91 s CAP, CERAMIC 22PF CH 1608 R111 1-218-859-91 s RES, CHIP 3.3K (1608)
R112 1-218-849-91 s RES, CHIP 1.2K (1608)
C113 1-162-919-91 s CAP, CERAMIC 22PF CH 1608 R113 1-218-851-91 s RES, CHIP 1.5K (1608)
C114 1-128-991-21 s CAP, ELECT 10MF (5.3X5.5)
C115 1-128-991-21 s CAP, ELECT 10MF (5.3X5.5) R114 1-218-851-91 s RES, CHIP 1.5K (1608)
C116 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608 R115 1-218-855-91 s RES, CHIP 2.2K (1608)
C117 1-100-566-91 s CAP, CHIP CERAMIC 0.1MF B 1608 R116 1-218-859-91 s RES, CHIP 3.3K (1608)
R117 1-218-859-91 s RES, CHIP 3.3K (1608)
C118 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225 R118 1-218-849-91 s RES, CHIP 1.2K (1608)
C119 1-112-015-91 s CAP, CHIP CERAMIC 47MF B 3225
R119 1-218-851-91 s RES, CHIP 1.5K (1608)
CN1 1-573-584-11 s CONNECTOR, BNC (RECEPTACLE) 3P R120 1-218-851-91 s RES, CHIP 1.5K (1608)
CN2 1-573-590-22 s CONNECTOR, (S) TERMINAL 4P R121 1-218-855-91 s RES, CHIP 2.2K (1608)
CN3 1-770-080-12 s CONNECTOR, ASSY (BNC) 1P R122 1-218-887-91 s RES, CHIP 47K (1608)
CN4 1-778-650-31 s CONNECTOR, FFC/FPC(ZIF) ST 30P R123 1-218-895-91 s RES, CHIP 100K (1608)
CN100 1-819-853-11 s JACK, PIN 2P
R124 1-218-895-91 s RES, CHIP 100K (1608)
CN101 1-819-853-11 s JACK, PIN 2P R125 1-218-871-91 s RES, CHIP 10K (1608)
R126 1-218-895-91 s RES, CHIP 100K (1608)
D1 6-500-750-01 s DIODE NSAD500H-T1-A R127 1-211-977-91 s RES, CHIP 22 (1608)
D100 8-719-083-71 s DIODE UDZSNPTE-1730B R128 1-211-977-91 s RES, CHIP 22 (1608)
D101 8-719-083-71 s DIODE UDZSNPTE-1730B
D102 8-719-083-71 s DIODE UDZSNPTE-1730B R129 1-218-895-91 s RES, CHIP 100K (1608)
R131 1-218-889-91 s RES, CHIP 56K (1608)
D104 8-719-069-28 s DIODE 1SS400TE-61 R132 1-218-889-91 s RES, CHIP 56K (1608)
D105 8-719-069-28 s DIODE 1SS400TE-61 R133 1-218-894-91 s RES, CHIP 91K (1608)
D106 8-719-069-61 s DIODE UDZSNPTE-1710B
R136 1-218-895-91 s RES, CHIP 100K (1608)
D109 8-719-069-61 s DIODE UDZSNPTE-1710B R137 1-216-864-91 s CONDUCTOR, CHIP (1608)
R138 1-218-823-91 s RES, CHIP 100 (1608)
FB101 1-414-813-21 s FERRITE, EMI (SMD) (2012) R139 1-218-823-91 s RES, CHIP 100 (1608)
FB102 1-414-813-21 s FERRITE, EMI (SMD) (2012) R140 1-216-864-91 s CONDUCTOR, CHIP (1608)
FB103 1-414-813-21 s FERRITE, EMI (SMD) (2012) R141 1-218-847-91 s RES, CHIP 1.0K (1608)
R142 1-218-847-91 s RES, CHIP 1.0K (1608)
FL1 1-239-897-22 s FILTER, EMI (SMD) R143 1-218-853-91 s RES, CHIP 1.8K (1608)
FL2 1-239-897-22 s FILTER, EMI (SMD)
FL3 1-239-897-22 s FILTER, EMI (SMD) R144 1-218-853-91 s RES, CHIP 1.8K (1608)
FL4 1-239-896-22 s FILTER, EMI (SMD)
FL5 1-239-896-22 s FILTER, EMI (SMD) S100 1-572-992-11 s SWITCH, SLIDE
IC100 8-759-422-21 s IC NJM4580V(TE2) VDR1 1-803-974-21 s VARISTOR, CHIP (1608)
IC101 8-759-422-21 s IC NJM4580V(TE2) VDR2 1-803-974-21 s VARISTOR, CHIP (1608)
VDR3 1-803-974-21 s VARISTOR, CHIP (1608)
L8 1-416-510-21 s COIL, CHOKE 100UH
L10 1-416-510-21 s COIL, CHOKE 100UH
Q100 8-729-929-09 s TRANSISTOR DTC123JE-TL
Q101 6-550-232-01 s TRANSISTOR 2SA2029FS6T2LQ/R
4-20 PMW-EX30
-------------
DPR-297 BOARD (DPR-297 BOARD)
-------------
Ref. No. Ref. No.
1pc A-1550-516-A s MOUNTED CIRCUIT BOARD, DPR-297 C305 1-112-716-91 s CAP, CERAMIC 0.1UF B (0603)
C306 1-112-716-91 s CAP, CERAMIC 0.1UF B (0603)
C100 1-112-716-91 s CAP, CERAMIC 0.1UF B (0603) C307 1-112-716-91 s CAP, CERAMIC 0.1UF B (0603)
C101 1-112-717-91 s CAP, CERAMIC 1UF B (1005) C308 1-112-716-91 s CAP, CERAMIC 0.1UF B (0603)
C105 1-100-672-91 s CAP, CERAMIC 10MF C (3216) C312 1-112-716-91 s CAP, CERAMIC 0.1UF B (0603)
C110 1-128-627-91 s CAP, CERAMIC 1000PF B (0603) C317 1-112-716-91 s CAP, CERAMIC 0.1UF B (0603)
C121 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C122 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005 C325 1-112-716-91 s CAP, CERAMIC 0.1UF B (0603)
C133 1-112-716-91 s CAP, CERAMIC 0.1UF B (0603) C329 1-112-815-91 s CAP, CERAMIC 10MF C (1608)
C135 1-112-716-91 s CAP, CERAMIC 0.1UF B (0603) C330 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C331 1-100-436-91 s CAP, CERAMIC 33000PF B (1608)
C136 1-128-608-91 s CAP, CERAMIC 22PF CH (0603) C332 1-112-815-91 s CAP, CERAMIC 10MF C (1608)
C137 1-128-608-91 s CAP, CERAMIC 22PF CH (0603) C333 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C139 1-112-298-91 o CAP, CERAMIC 1MF B (1608)
C140 1-112-717-91 s CAP, CERAMIC 1UF B (1005) C336 1-162-964-91 s CAP,CHIP CERAMIC 1000PF B 1608
C203 1-112-716-91 s CAP, CERAMIC 0.1UF B (0603) C338 1-162-964-91 s CAP,CHIP CERAMIC 1000PF B 1608
C204 1-112-716-91 s CAP, CERAMIC 0.1UF B (0603) C339 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C207 1-112-716-91 s CAP, CERAMIC 0.1UF B (0603) C341 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C342 1-162-964-91 s CAP,CHIP CERAMIC 1000PF B 1608
C208 1-112-716-91 s CAP, CERAMIC 0.1UF B (0603) C343 1-162-964-91 s CAP,CHIP CERAMIC 1000PF B 1608
C209 1-128-623-91 s CAP, CERAMIC 220PF B (0603) C344 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C210 1-100-965-91 s CAP, CERAMIC 0.047MF B (0603 C345 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C213 1-112-716-91 s CAP, CERAMIC 0.1UF B (0603) C346 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C347 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C214 1-128-630-91 s CAP, CERAMIC 4700PF B (0603) C348 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C215 1-112-815-91 s CAP, CERAMIC 10MF C (1608) C349 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C352 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C225 1-112-300-91 s CAP, CERAMIC 4.7MF B (2012) C359 1-112-716-91 s CAP, CERAMIC 0.1UF B (0603)
PMW-EX30 4-21
(DPR-297 BOARD) (DPR-297 BOARD)
Ref. No. Ref. No.
C373 1-112-716-91 s CAP, CERAMIC 0.1UF B (0603) C510 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C405 1-100-881-91 s CAP, CERAMIC 47MF C (3216) C522 1-128-627-91 s CAP, CERAMIC 1000PF B (0603)
C406 1-112-716-91 s CAP, CERAMIC 0.1UF B (0603) C523 1-128-627-91 s CAP, CERAMIC 1000PF B (0603)
C409 1-128-627-91 s CAP, CERAMIC 1000PF B (0603) C526 1-128-627-91 s CAP, CERAMIC 1000PF B (0603)
C414 1-128-627-91 s CAP, CERAMIC 1000PF B (0603) C531 1-112-717-91 s CAP, CERAMIC 1UF B (1005)
C433 1-112-746-91 s CAP, CERAMIC 4.7MF B (1608) C550 1-128-627-91 s CAP, CERAMIC 1000PF B (0603)
C440 1-112-716-91 s CAP, CERAMIC 0.1UF B (0603) C604 1-112-197-91 s CAP, CERAMIC 10PF CH (0603)
4-22 PMW-EX30
Ref. No. Ref. No.
C615 1-112-541-21 s CAP, ELECT 10MF (4X5) C901 1-112-716-91 s CAP, CERAMIC 0.1UF B (0603)
C706 1-114-166-91 s CAP, CERAMIC 0.01MF B (0603) C1002 1-112-815-91 s CAP, CERAMIC 10MF C (1608)
C707 1-112-197-91 s CAP, CERAMIC 10PF CH (0603) C1003 1-114-569-11 s CAP, CERAMIC 0.01MF X7R 1608
C708 1-114-166-91 s CAP, CERAMIC 0.01MF B (0603) C1004 1-112-815-91 s CAP, CERAMIC 10MF C (1608)
C709 1-114-166-91 s CAP, CERAMIC 0.01MF B (0603) C1005 1-114-569-11 s CAP, CERAMIC 0.01MF X7R 1608
C715 1-112-716-91 s CAP, CERAMIC 0.1UF B (0603) C1011 1-114-569-11 s CAP, CERAMIC 0.01MF X7R 1608
C717 1-114-166-91 s CAP, CERAMIC 0.01MF B (0603) C1013 1-112-716-91 s CAP, CERAMIC 0.1UF B (0603)
C719 1-128-623-91 s CAP, CERAMIC 220PF B (0603) C1015 1-114-570-11 s CAP, CERAMIC 0.068MF X7R 1608
C800 1-128-605-91 s CAP, CERAMIC 12PF CH (0603) C1019 1-112-716-91 s CAP, CERAMIC 0.1UF B (0603)
C801 1-128-605-91 s CAP, CERAMIC 12PF CH (0603) C1020 1-112-716-91 s CAP, CERAMIC 0.1UF B (0603)
C821 1-112-717-91 s CAP, CERAMIC 1UF B (1005) C1041 1-112-815-91 s CAP, CERAMIC 10MF C (1608)
PMW-EX30 4-23
Ref. No. Ref. No.
C1048 1-114-569-11 s CAP, CERAMIC 0.01MF X7R 1608 D200 8-719-069-28 s DIODE 1SS400TE-61
C1049 1-114-569-11 s CAP, CERAMIC 0.01MF X7R 1608 D700 6-500-750-01 s DIODE NSAD500H-T1-A
C1050 1-112-197-91 s CAP, CERAMIC 10PF CH (0603) D1000 8-719-069-28 s DIODE 1SS400TE-61
C1051 1-114-569-11 s CAP, CERAMIC 0.01MF X7R 1608 D1001 8-719-069-28 s DIODE 1SS400TE-61
C1052 1-100-880-91 s CAP, CERAMIC 100MF C (3225) D1002 8-719-069-28 s DIODE 1SS400TE-61
C1053 1-100-880-91 s CAP, CERAMIC 100MF C (3225) E1100 1-535-757-21 s CHIP, CHECKER
C1054 1-112-716-91 s CAP, CERAMIC 0.1UF B (0603) E1101 1-535-757-21 s CHIP, CHECKER
C1056 1-100-881-91 s CAP, CERAMIC 47MF C (3216) FB100 1-400-580-21 s FERRITE, EMI (SMD)
C1057 1-100-881-91 s CAP, CERAMIC 47MF C (3216) FB101 1-400-462-21 s FERRITE, EMI (SMD) (1005)
C1059 1-112-716-91 s CAP, CERAMIC 0.1UF B (0603) FB105 1-400-462-21 s FERRITE, EMI (SMD) (1005)
C1061 1-128-627-91 s CAP, CERAMIC 1000PF B (0603) FB106 1-400-462-21 s FERRITE, EMI (SMD) (1005)
FB200 1-400-580-21 s FERRITE, EMI (SMD)
C1081 1-128-617-91 s CAP, CERAMIC 100PF CH (0603) FB400 1-400-580-21 s FERRITE, EMI (SMD)
C1082 1-128-623-91 s CAP, CERAMIC 220PF B (0603) FB401 1-400-580-21 s FERRITE, EMI (SMD)
C1083 1-128-623-91 s CAP, CERAMIC 220PF B (0603)
C1084 1-100-965-91 s CAP, CERAMIC 0.047MF B (0603 FB402 1-400-580-21 s FERRITE, EMI (SMD)
C1085 1-100-965-91 s CAP, CERAMIC 0.047MF B (0603 FB403 1-400-580-21 s FERRITE, EMI (SMD)
C1086 1-112-560-91 s CAP, CERAMIC 0.022MF B (0603) FB600 1-400-580-21 s FERRITE, EMI (SMD)
C1087 1-112-560-91 s CAP, CERAMIC 0.022MF B (0603) FB700 1-400-580-21 s FERRITE, EMI (SMD)
C1088 1-112-197-91 s CAP, CERAMIC 10PF CH (0603)
C1092 1-112-716-91 s CAP, CERAMIC 0.1UF B (0603) FB801 1-400-580-21 s FERRITE, EMI (SMD)
C1094 1-112-716-91 s CAP, CERAMIC 0.1UF B (0603) FB804 1-400-580-21 s FERRITE, EMI (SMD)
IC101 8-759-462-09 s IC TLV431AIDBVR
C3003 1-112-300-91 s CAP, CERAMIC 4.7MF B (2012) IC102 8-759-672-76 s IC AK9813BF-E2
IC103 6-703-858-01 s IC NJU7042F(TE1)
CN1 1-817-869-21 s PIN, CONNECTOR 10P IC104 6-703-879-01 s IC NJU7043RB1(TE2)
CN4 1-573-290-21 s PIN, CONNECTOR (1.5MM) (SMD)4P IC105 8-759-564-49 s IC TC7W53FU(TE12R)
CN5 1-778-649-31 s CONNECTOR, FFC/FPC(ZIF) ST 24P
CN200 1-820-560-21 s CONNECTOR, COAXIAL(RECEPTACLE) IC107 8-759-592-50 s IC TC7SZ126FU(TE85R)
CN600 1-818-513-21 s CONNECTOR (SQUARE TYPE)(USB)5P IC108 6-709-646-01 s IC TLC2933AIPWR
IC109 6-706-491-01 s IC TC7SH86FU(T5RSOYJF)
CN700 1-785-444-11 s CONNECTOR, SQUARE TYPE IC110 6-703-977-01 s IC R1114Q331D-TR-FA
IC201 6-703-721-01 s IC TPS54310PWPR
4-24 PMW-EX30
Ref. No. Ref. No.
IC205 6-708-903-01 s IC K4M56163LG-BN75T Q1003 8-729-929-27 s TRANSISTOR DTC114TE-TL
IC206 8-759-592-49 s IC TC7SZ125FU(TE85R) Q1004 8-729-929-27 s TRANSISTOR DTC114TE-TL
IC207 8-759-592-49 s IC TC7SZ125FU(TE85R) Q1005 8-729-929-27 s TRANSISTOR DTC114TE-TL
IC300 6-711-650-01 s IC HY5MS7B2BLFP-6EDR-C Q1006 8-729-929-27 s TRANSISTOR DTC114TE-TL
IC301 6-711-650-01 s IC HY5MS7B2BLFP-6EDR-C Q1007 8-729-929-27 s TRANSISTOR DTC114TE-TL
IC401 8-753-276-37 o IC CXD3195AGG-T6 Q1008 8-729-929-27 s TRANSISTOR DTC114TE-TL
IC402 6-710-306-01 o IC HYE18M256320CFX-7.5 Q1009 8-729-929-27 s TRANSISTOR DTC114TE-TL
IC500 6-710-299-01 s IC NT5TU64M16BM-37B Q1010 8-729-929-27 s TRANSISTOR DTC114TE-TL
IC501 6-710-299-01 s IC NT5TU64M16BM-37B Q1011 8-729-929-27 s TRANSISTOR DTC114TE-TL
IC602 6-702-628-01 s IC UPD720122F1-DN2-E2-A Q1012 6-550-239-01 s TRANSISTOR DTA144EMFS6T2L
IC603 8-759-592-49 s IC TC7SZ125FU(TE85R) R1 1-240-714-91 s RES, CHIP 47K (0603)
IC700 6-711-632-01 s IC UPD72873AGC-YEB-A R2 1-240-676-91 s RES, CHIP 22 (0603)
IC902 8-759-592-49 s IC TC7SZ125FU(TE85R) R3 1-240-676-91 s RES, CHIP 22 (0603)
IC1000 6-706-220-01 s IC LTC3411EMS#TR R4 1-240-714-91 s RES, CHIP 47K (0603)
IC1001 6-703-721-01 s IC TPS54310PWPR R5 1-694-535-91 s CONDCTOR, CHIP (0603)
IC1002 6-703-721-01 s IC TPS54310PWPR R6 1-240-676-91 s RES, CHIP 22 (0603)
IC1003 6-706-220-01 s IC LTC3411EMS#TR R7 1-240-676-91 s RES, CHIP 22 (0603)
R8 1-240-695-91 s RES, CHIP 1K (0603)
L100 1-469-549-21 s INDUCTOR, CHIP 1.0UH (LB2016) R9 1-240-830-91 s RES, CHIP 100K (0603)
L102 1-469-549-21 s INDUCTOR, CHIP 1.0UH (LB2016)
R13 1-240-808-91 s RES, CHIP 10K (0603)
L202 1-414-392-41 s INDUCTOR (SMD) 1.0UH R100 1-240-784-91 s RES, CHIP 1K (0603)
L203 1-400-489-11 s COIL, CHOKE 10UH R101 1-240-784-91 s RES, CHIP 1K (0603)
L204 1-456-622-21 s COIL, CHOKE 1UH
L400 1-414-400-41 s INDUCTOR (SMD) 22.0UH R102 1-240-736-91 s RES, CHIP 10 (0603)
R104 1-240-736-91 s RES, CHIP 10 (0603)
L600 1-456-799-11 s COIL, COMMON MODE CHOKE
L700 1-400-476-11 s COMMON MODE CHOKE COIL R107 1-240-736-91 s RES, CHIP 10 (0603)
L1000 1-457-339-12 s COIL, CHOKE 2.0UH R108 1-240-744-91 s RES, CHIP 22 (0603)
R109 1-240-714-91 s RES, CHIP 47K (0603)
R114 1-240-744-91 s RES, CHIP 22 (0603)
L1008 1-400-281-11 s COIL, CHOKE 10UH
L1009 1-457-339-12 s COIL, CHOKE 2.0UH R117 1-240-744-91 s RES, CHIP 22 (0603)
L1010 1-400-489-11 s COIL, CHOKE 10UH R118 1-240-794-91 s RES, CHIP 2.7K (0603)
R119 1-240-744-91 s RES, CHIP 22 (0603)
L1011 1-456-622-21 s COIL, CHOKE 1UH R120 1-240-744-91 s RES, CHIP 22 (0603)
L1013 1-456-622-21 s COIL, CHOKE 1UH
R123 1-240-744-91 s RES, CHIP 22 (0603)
Q200 6-550-119-01 s TRANSISTOR DTC144EMFS6T2L R124 1-240-744-91 s RES, CHIP 22 (0603)
Q202 6-551-266-01 s TRANSISTOR SI2304BDS-T1 R126 1-240-744-91 s RES, CHIP 22 (0603)
Q203 6-551-266-01 s TRANSISTOR SI2304BDS-T1
R128 1-240-744-91 s RES, CHIP 22 (0603)
Q600 6-550-832-01 s TRANSISTOR SI2301BDS-T1
R133 1-240-744-91 s RES, CHIP 22 (0603)
PMW-EX30 4-25
Ref. No. Ref. No.
R142 1-240-744-91 s RES, CHIP 22 (0603) R207 1-218-971-81 s RES, CHIP 33K
R149 1-240-683-91 s RES, CHIP 100 (0603) R216 1-694-535-91 s CONDCTOR, CHIP (0603)
R180 1-218-973-81 s RES, CHIP 47K R243 1-240-744-91 s RES, CHIP 22 (0603)
R185 1-245-581-91 s RES, CHIP 1M (0603) R302 1-240-808-91 s RES, CHIP 10K (0603)
4-26 PMW-EX30
Ref. No. Ref. No.
R402 1-211-899-91 s RES,SQUARE TYPE CHIP 0.22 3225 R539 1-240-808-91 s RES, CHIP 10K (0603)
R403 1-211-899-91 s RES,SQUARE TYPE CHIP 0.22 3225 R540 1-240-808-91 s RES, CHIP 10K (0603)
R413 1-694-535-91 s CONDCTOR, CHIP (0603) R608 1-218-990-81 s CONDUCTOR, CHIP (1005)
R418 1-694-535-91 s CONDCTOR, CHIP (0603) R614 1-208-895-81 s RES, CHIP 2.2K (1005)
PMW-EX30 4-27
Ref. No. Ref. No.
R750 1-240-706-91 s RES, CHIP 8.2K (0603) R912 1-218-973-81 s RES, CHIP 47K
R756 1-240-784-91 s RES, CHIP 1K (0603) R1003 1-694-535-91 s CONDCTOR, CHIP (0603)
R760 1-240-830-91 s RES, CHIP 100K (0603) R1007 1-211-899-91 s RES,SQUARE TYPE CHIP 0.22 3225
R761 1-240-808-91 s RES, CHIP 10K (0603) R1008 1-211-899-91 s RES,SQUARE TYPE CHIP 0.22 3225
R762 1-240-754-91 s RES, CHIP 56 (0603) R1009 1-211-899-91 s RES,SQUARE TYPE CHIP 0.22 3225
R763 1-240-754-91 s RES, CHIP 56 (0603) R1010 1-211-899-91 s RES,SQUARE TYPE CHIP 0.22 3225
R766 1-694-535-91 s CONDCTOR, CHIP (0603) R1013 1-240-808-91 s RES, CHIP 10K (0603)
R801 1-245-645-91 s RES, CHIP 4.7 (0603) R1021 1-694-535-91 s CONDCTOR, CHIP (0603)
R820 1-245-645-91 s RES, CHIP 4.7 (0603) R1032 1-218-959-81 s RES, CHIP 3.3K
R821 1-240-7

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SOLID-STATE MEMORY RECORDER

指定以外の電池に交換すると，破裂する危険があり Lithiumbatteri-Eksplosionsfare ved fejlagtig

Danger of explosion if battery is incorrectly replaced. ADVARSEL

Replace only with the same or equivalent type Lithiumbatteri - Eksplosjonsfare.

Manual Structure 2. Replacement of Main Parts

Purpose of this manual .................................................................. 3 2-1. U Case ............................................................................. 2-1

AVP-11 ............................................................................ 6-2

EC-64 .............................................................................. 7-1

Purpose of this manual

. Operating Instructions (Supplied with the unit)

. “Semiconductor Pin Assignments” CD-ROM (Available on request)

1-1. Operating Conditions

1-2. Power Supply

Power voltage: 100 to 240 V AC (MPA-AC1)

1-3-1. Outside Dimensions

Ventilation and Installation Space for Servicing

1-3-3. Rack Mounting

Notes on Rack Mounting

1-4-1. Signal Inputs and Outputs

 VIDEO OUTPUT COMPOSITE: BNC Type

 PHONES: Stereo mini jack No. Signal I/O Specifications

(0 dBu = 0.775 V rms) 2 1 2 1 2 1

No. Signal I/O Specifications

(0 dBu = 0.775 V rms)

No. Signal I/O Specifications

No. Signal I/O Specifications

 : USB mini B connector (5P)

No. Signal I/O Specifications

1-5. Board Location

AVP-11 board CP-400 board

AVP-11 board (A side)

Ref. No. (address) Description Factory setting

1. Video signal system

2. Media recording and playback

<USB device controller>

<i.Link controller >

AVP-11 board (Audio block)

CP-400 board (Audio block)

HP-143 board (Audio block)

Switch/volume control/menu panel (Audio controller block)

KY-633 board (Audio block)

Out1 CLOCK DIV

Fig.1 Audio block diagram

Main functions of the system controller and peripherals

(2) Watch IC (RTC) control

(3) Infrared remote control demodulation

(4) Power supply voltage detection

(5) Power system control

SDI block (Input)

HDMI block (Output)

DVCAM OUT block (Output)

6. Power supply system

(1) Input power supply (UNREG) system operations

. Input overvoltage protection

. Input low-voltage protection

. Power supply reverse connection protection

(2) DC/DC converter function

. Short-circuit protection for each power supply system

1-8. Service Tools/Measuring Equipment List

1-8-1. Service Tools

Part No. Name Usage/Note

1-8-2. Measuring Equipment