INDEX

1. ACKNOWLEDGEMENT

2. INTRODUCTION

3. BLOCK DIAGRAM

4. CIRCUIT DAIGRAM AND DISCRIPTIONS

a. POWER SUPPLY

b. MICROCONTROLLER

c. LCD

d. PASSIVE INFRA RED SENSOR (PIR)

e. SOUND GENERATOR (APR9600)

f. AMPLIFIER

g. BUZZER

5. MICROCONTROLLER PROGRAM

6. PCB DESIGNING

7. SOLDERING

8. PCB LAYOUT

9. CONCLUSION

10. ORGANIZATION OF PROJECT

11. BIBILOGRAPHY

12. DATASHEET
ACKNOWLEDGEMENT
 INTRODUCTION

Anonymous helper is used to help the visitors to communicate with the

persons, when they are out of home. Normally there is no way to inform the unexpected guests

when we are out off home. But this system tells the visitor about the situation and helps him to

talk with the person he wants to meet.

 BLOCK DIAGRAM

PIR Sensor LCD

Buzzer Sound
Microcontro generator
ller (APR9600)
Mode
And
Switch
Amplifier
(LM386)
Play Button

Record
Speaker
Button
CIRCUIT DAIGRAM AND DISCRIPTIONS

POWER SUPPLAY

VCC_12V

U3
LM78M12C/TO
1 3
IN OUT
0/12-1.5A

GND
0.1µF
0.1µF

2
1

2 - + 4

4700MFD
3

4*IN 4001 VCC_5V

U5
LM78M05C/TO
1 3
IN OUT
GND

0.1µF 0.1µF
2

POWER SUPPLY
These form an important equipment of any Electronics laboratory. Power supplies
are essential for the testing and implementation of any useful electronic circuit. If power supplies
are not available then the only way to provide power to a circuit is the battery. For long-term use
and frequent manipulation these are not feasible. More over these are not as flexible as modern
day power supplies. They do not provide for overload protection and thermal protection.

The following units form the backbone of any modern day power supply

1. Full wave bridge rectifier

 2. Filter circuit
3. Voltage regulator

In the case if modern power supplies, the required power is derived from the AC
mains. For this at first the 230V/50 Hz is step down using a step down transformer. Then The
AC voltage is converted to DC using a rectifier circuit. The bridge rectifier is considered the apt
choice since it avoids the center-tapped transformer. The ripples from the rectifiers output are
removed by filtering.

The filter can be any of the following:

1. L filter
2. C filter
3. LC filter
4. CRC filter

And we use capacitive filtering.

The function of the voltage regulator is to provide a stable DC voltage for

powering other electronic circuits. The voltage regulator must be capable of providing
substantial output current. They must provide a constant voltage regardless of changes in load
current, temperature, and AC line voltage. Although voltage regulators can be designed using
opamps, it is quicker and easier to use IC Voltage regulators. Further more, IC voltage regulators
are versatile and relatively inexpensive and are available with features such as programmable
output, current / voltage boosting, internal short –circuit current limiting, thermal shut down, and
floating operation for high voltage applications.
Voltage regulator may be classified as:

1. Series regulator
2. Switching regulator

Series regulators use a power transistor connected in series between the

unregulated DC input and the load. The output voltage is controlled by the continuous voltage
drop-taking place across the series pass transistor. Since the transistor conducts in the active or
the linear region, these regulators are also called linear regulators. Linear regulators may have
fixed or variable output voltages and could be positive or negative. Voltage regulators such as
the 78XX series and the IC 723 are commonly used.

Switching regulators operate the power transistor as a HF on/off switch, so that

the power transistor does not conduct current continuously. This gives an improve efficiency
over the series regulator. The IC 723 can be used as a switching regulator too.

With the advent of microelectronics, it is now possible to incorporate the

complete circuit of a voltage regulator on a single monolithic silicon chip. These provide for high
reliability, low cost, reduced size and excellent performance. The 78XX, 79XX families and
IC723 are good examples of monolithic general-purpose regulators. Here we use the positive
voltage regulators 78XX series.

78XX

The 78XX series of regulators are 3 terminal, positive fixed voltage regulators.
There are 7 voltage options available like: 5V, 6V, 8V, 12V, 15V, 18V and 24V. The 79XX
series are negative fixed voltage regulators. These regulators are available in two types of
packages:
1. Metal Package (TO-3)
2. Plastic Package (TO-220)
 MICROCONTROLLER

VCC_5V

J4
1 VCC
2
10MF

40
U2
31 VCC 39
EA/VP P0.0 38 1
27pf 19 P0.1 37 2
X1 P0.2 36 3
12 MHZ P0.3 35 4 O/P PORT 0
18 P0.4 34 5
27pf X2 P0.5 33 6
P0.6 32 7
9 P0.7 8
RESET 21
P2.0 22 1
4.7K 12 P2.1 23 2
13 INT0 P2.2 24 3
14 INT1 89C52 P2.3 25 4
10MF 15 T0 P2.4 26 5 O/P PORT2
T1 P2.5 27 6
RESET SW P2.6 7
1 28
2 P1.0 P2.7 8
3 P1.1 17
4 P1.2 RD 16
5 P1.3 WR 29
470E 6 P1.4 PSEN 30
7 P1.5 ALE/P 11
P1.6 TXD
VSS

8 10
P1.7 RXD
20

The last decade has an existing revolution in the capabilities of microprocessor.

Manufacturers have produced 16 and 32 bit processor to answer the needs of even more
powerful CPU processing capabilities. Because of their processing power and speed, these
processors have found their way into the design of stand-alone products. Micro controller is
another branch in the evolution of microprocessor capability. It is a branch that manufacturers
have been developing with equal vigor. Instead of focusing upon larger word width and address
space the emphasis here has been upon exceedingly fast real-time control. It has focused upon
the integration of the facilities needed to support fast control into a single chip. In the past, the
highest performance real time control application have employed microprocessor with interrupt
handler chips, programmable timer chip and ROM and RAM chips to achieve what can now be
achieved in a single state-of-the-art micro controller chip.

The Intel 8031/8051/8751/8951 belonging to the MCS51 family is a stand –alone,

high performance single-chip computer fabricated with Intel’s highly – reliable + 5 Volt,
depletion load, N-channel, silicon gate MOS technology and packaged in a 40 pin. It provides
the hardware features, architectural enhancements and new instructions that are necessary to
make it a powerful and cost effective controller for applications requiring up to 64 K bites of
Program memory and/or up to 64 bytes of data storage.

The 8051/8751 contains a non-volatile 4K x 8 read-only program memory; a volatile

128 x 8 read/write data memory; 32 I/O lines; two 16 bit timer/counters; a 5v source, two-
priority-level, nested interrupt structure; a serial I/O port for either multi process communication;
I/O expansion or full duplex UART and on-chip oscillator and clock circuits.
The 8031 is identical, except that it takes for program memory. For systems that require extra
capability, 8051 can be expanded using standard TTL compatible memories and bytes oriented
MCS-80 and MCS-85 peripherals.

Features
The MCS51 contains the following features
Eight-bit CPU register A (Accumulator)
Sixteen-bit Program counter (PC) and data pointer (DTPR)
Eight-bit program status word (PSW)
Eight-bit stack pointer (SP)
Internal ROM (8051) or EPROM (8751) or EEPROM (8951)
Four register banks each contains eight registers
Sixteen bytes, which may be addressed at the bit level
Eight bytes of general-purpose data memory
Thirty-two input/output pins arranged as four 8-bit ports
The sixteen bit timer or counters: T0 and T1
Full duplex serial data receiver/transmitter
 Control Registers: TCON, TMOD, SCON, PCON, IP and IE
Two external and internal sources
Oscillator and clock circuit

The 8051 microcomputer, like its 8048 processor that is efficient both as a
controller and as an arithmetic processor. The 8051 has extensive facilitates for binary and BCD
arithmetic and excels in bit-handling capabilities. Efficient use of program memory results from
an instruction set consisting of 44% of one byte 41% of two byte, 15% three byte instructions.

THE 8051 FAMILY

The 8051 is a stand – alone high – performance single chip computer intended
for use in sophisticated real-time applications such as instrumentation, industrial control and
intelligent computer peripherals. It provides the hardware features, architectural enhancements
and new instructions that make it a powerful and cost effective controller for applications
requiring up to 64 K bytes of program memory and/or up to 64 K bytes of data storage. The
8031 is a control-oriented CPU without on –chip program memory. It can address 64K-bytes of
external program memory in addition to 64K-bytes of External Data Memory. For systems
requiring extra capability, each member of the 8051 family can be expanded using standard
memories. The 8051 is on 8031 with the lower 4K bytes of program memory filled with on-chip
mask programmable ROM while the 8751 has 4K-bytes of UV light erasable/electrically-
programmable ROM.

8051 CPU ARCHITECTURE

The 8051 CPU manipulates operands in four memory spaces. These are the 64
K-bytes program memory, 384-byte Internal data memory and 16-bit program counter spaces.
The internal data memory address space is further divided into the 256 byte Internal Data RAM
and 128 byte special Function Register (SFR) address spaces. Four Register Banks (each with
eight registers), 128 addressable bits, and the stock reside in the Internal Data RAM. The stock
depth is limited only by the available Internal Data RAM and its location is determined by the 8
–bit stack pointer. All Registers except the program counter and the four 8 Register Bank reside
in the special function Register address space. These memory mopped registers include
arithmetic registers, pointers I/O ports; interrupt system registers, timers and special port. 128
bit locations in the SFR address space are addressable as bits. The 8051 contain 128 bytes of
Internal Data RAM and 20 SFRs

The 8051 provide a non-paged program Memory address space to accommodate

relocatable code. Conditional branches are performed relative to the program counter. The
register indirect jump permits branching relative to a 16 bit base register with an offset provided
by an 8-bit index register. Sixteen-bit jumps and calls permit branching to any location in the
contiguous 64 K program Memory address space.

The 8051 is classified, as an 8-bit machine since the internal ROM, RAM, SFRs,
Arithmetic/Logic unit and external data has are each 8-bit wide. The 8051 perform operations on
bit, nibble, byte and double-byte data types. The 8051 has extensive qualities for byte transfer,
logic and integer arithmetic operations. It excels at bit handling since data transfer, logic and
conditional branch operations can be performed directly on Boolean variables.

U1
31 39
EA/VP P0.0 38
19 P0.1 37
X1 P0.2 36
P0.3 35
18 P0.4 34
X2 P0.5 33
P0.6 32
9 P0.7
RESET 21
P2.0 22
12 P2.1 23
13 INT0 P2.2 24
14 INT1 P2.3 25
15 T0 P2.4 26
T1 P2.5 27
1 P2.6 28
2 P1.0 P2.7
3 P1.1 17
4 P1.2 RD 16
5 P1.3 WR 29
6 P1.4 PSEN 30
7 P1.5 ALE/P 11
8 P1.6 TXD 10
P1.7 RXD
8051
PIN DESCRIPTION

Vss
Circuit ground potential
Vcc
+5V power supply during operation, programming and verification.
Port ‘O’
Port ‘O’ is an 8-bit open drain bi-directional O/O port. It is also the multiplexed low
order address and data bus when using external memory. It is used for data output and output
during programming and verification. Port O can sink/source two TTL loads.
Port 1
Port 1 is an 8-bit quasi-traditional I/O port. It also emits the low-order address byte
during programming and verification. Port 1 can sink/source one TTL Load.
Port 2
Port 2 is an 8-bit quasi-bi-directional I/O port. It also emits the high order address byte
when accessing external memory. It is used for the high-order address and the control signals
during programming and verification. Port 2 can sink/source one TTL load.

Port 3
Port 3 is an 8-bit quasi bi-directional I/O port. It also contains the interrupt, timer, serial
port and RD and WR pins that are used by various options. The output batch corresponding to a
secondary function must be programmed to a one (1) for that function to operate. Port 3 can
sink/source one TTL load. The secondary functions are assigned to the pins of port 3, as follows.

RXD/data (P3.0) - Serial Port’s receiver data input (asynchronous) or data input/output
(synchronous).
TXD/Clock (P3.1) - Serial ports transmitters data output (asynchronous) or clock output
(synchronous).
INTO (P3.2) - Interrupt O input or gate control input for counter 0.
INTI (P3.3) - Interrupt 1 input or gate control input for counter 1.
 T0 (P3.4) - Input to counter 0.
T1 (P3.5) - Input to counter 1.
WR (P3.6) - The write control signal batches the data byte from port 0 into the External
Data Memory to port 0.
RST/VPD
A low to high transition on this pin (at approximately 3V) resets the 8051. If VPD is held
within its space (approximately +5V), while Vcc drops below spec, VPD will provide stand by
power to the RAM. When VPD is low, the RAM’s current is drawn from Vcc. A small internal
resistor permits power on reset using only a capacitor connected to Vcc.

ALE/PROG
Provides Address Latch Enable output used for latching the address into external
memory during normal operation. Receives the program pulse input during EPROM
programming.

PSEN
The program store enable output is a control signal that enables the external
program memory to the bus during normal fetch operations.

EA/VDD
When held at a TTL high level, the 8051 executes instructions from the internal
ROM/EPROM when the PC is less than 4096. When held at a TTL low level, the 8051 fetches
all instructions from external program memory. The pin also receives the 21V EPROM
programming supply voltage.

XTAL1
Input to the oscillators high gain amplifier. A crystal or external source can be used.
APPLICATIONS OF MICROCONTROLLER

1) Hand-held instruments
a) Pagers
b) Electronic plan meter
c) Level meter
d) IC Tester
2) Peripheral Devices
a) Keyboard controller
b) Modem
c) Printer buffer
3) Stand-Alone devices
a) Color copier
b) Electronic typewriter
c) Cable TV terminal
4) Instrumental Sub-Functions
a) Digital oscilloscope
b) Dedicated front panel
c) Microwave computer
4) Automotive application
 LIQUID CRYSTAL DISPLAY

A liquid crystal display (LCD) is an electronically modulated optical amplification

device shaped into a thin, flat panel made up of any number of color or monochrome pixels filled
with liquid crystals and arrayed in front of a light source (backlight) or reflector. It is often
utilized in battery-powered electronic devices because it uses very small amounts of electric
power.

Pin number Symbol Level I/O Function

1 Vss - - Power supply (GND)
2 Vcc - - Power supply (+5V)
3 Vee - - Contrast adjust
4 RS 0/1 I 0 = Instruction input
1 = Data input
5 R/W 0/1 I 0 = Write to LCD module
1 = Read from LCD module
6 E 1, 1->0 I Enable signal
7 DB0 0/1 I/O Data bus line 0 (LSB)
8 DB1 0/1 I/O Data bus line 1
9 DB2 0/1 I/O Data bus line 2
10 DB3 0/1 I/O Data bus line 3
11 DB4 0/1 I/O Data bus line 4
12 DB5 0/1 I/O Data bus line 5
13 DB6 0/1 I/O Data bus line 6
14 DB7 0/1 I/O Data bus line 7 (MSB)
15 Vcc - - Power supply (+5V) for backlight
16 Vss - - Power supply (GND) for backlight
 PASSIVE INFRARED SENSOR (PIR)

A Passive Infrared sensor (PIR sensor) is an electronic device that measures infrared
(IR) light radiating from objects in its field of view. PIR sensors are often used in the
construction of PIR-based motion detectors (see below). Apparent motion is detected when an
infrared source with one temperature, such as a human, passes in front of an infrared source with
another temperature, such as a wall. All objects emit what is known as black body radiation. It is
usually infrared radiation that is invisible to the human eye but can be detected by electronic
devices designed for such a purpose. The term passive in this instance means that the PIR device
does not emit an infrared beam but merely passively accepts incoming infrared radiation.

Design

Infrared radiation enters through the front of the sensor, known as the sensor face. At the
core of a PIR sensor is a solid state sensor or set of sensors, made from an approximately 1/4
inch square of natural or artificial pyroelectric materials, usually in the form of a thin film, out of
gallium nitride (GaN), caesium nitrate (CsNO3), polyvinyl fluorides, derivatives of
phenylpyrazine, and cobalt phthalocyanine. (See pyroelectric crystals.) Lithium tantalate
(LiTaO3) is a crystal exhibiting both piezoelectric and pyroelectric properties.

The sensor is often manufactured as part of an integrated circuit and may consist of one
(1), two (2) or four (4) 'pixels' of equal areas of the pyroelectric material. Pairs of the sensor
pixels may be wired as opposite inputs to a differential amplifier. In such a configuration, the
PIR measurements cancel each other so that the average temperature of the field of view is
removed from the electrical signal; an increase of IR energy across the entire sensor is self-
cancelling and will not trigger the device. This allows the device to resist false indications of
change in the event of being exposed to flashes of light or field-wide illumination. (Continuous
bright light could still saturate the sensor materials and render the sensor unable to register
further information.) At the same time, this differential arrangement minimizes common-mode
interference, allowing the device to resist triggering due to nearby electric fields. However, a
differential pair of sensors cannot measure temperature in that configuration and therefore this
configuration is specialized for motion detectors, see below.

PIR-based motion detector

Cylindrical facet lens in front of PIR sensor. Each facet (rectangle) is a Fresnel lens

In a PIR-based motion detector (usually called a PID, for Passive Infrared Detector), the
PIR sensor is typically mounted on a printed circuit board containing the necessary electronics
required to interpret the signals from the pyroelectric sensor chip. The complete assembly is
contained within a housing mounted in a location where the sensor can view the area to be
monitored. Infrared energy is able to reach the pyroelectric sensor through the window because
the plastic used is transparent to infrared radiation (but only translucent to visible light). This
plastic sheet also prevents the intrusion of dust and/or insects from obscuring the sensor's field of
view, and in the case of insects, from generating false alarms.

A few mechanisms have been used to focus the distant infrared energy onto the sensor
surface. The window may have multiple Fresnel lenses molded into it.
Multi-Fresnel lens type of PID

PID front cover only with point

Typical residential and/or PID with front cover removed
light source behind to show
commercial PID with multi- showing location of pyroelectric
individual lenses.
Fresnel lens cover. sensor (green arrow).

Alternatively, some PIDs are manufactured with internal plastic, segmented parabolic
mirrors to focus the infrared energy. Where mirrors are used, the plastic window cover has no
Fresnel lenses molded into it. This filtering window may be used to limit the wavelengths to 8-14
micrometers which is closest to the infrared radiation emitted by humans (9.4 micrometers being
the strongest).

The PID can be thought of as a kind of infrared camera that remembers the amount of
infrared energy focused on its surface. Once power is applied to the PID, the electronics in the
PID shortly settle into a quiescent state and energize a small relay. This relay controls a set of
electrical contacts that are usually connected to the detection input of a burglar alarm control
panel. If the amount of infrared energy focused on the pyroelectric sensor changes within a
configured time period, the device will switch the state of the alarm relay. The alarm relay is
typically a "normally closed (NC)" relay, also known as a "Form B" relay.

A person entering a monitored area is detected when the infrared energy emitted from the
intruder's body is focused by a Fresnel lens or a mirror segment and overlaps a section on the
chip that had previously been looking at some much cooler part of the protected area. That
portion of the chip is now much warmer than when the intruder wasn't there. As the intruder
moves, so does the hot spot on the surface of the chip. This moving hot spot causes the
electronics connected to the chip to de-energize the relay, operating its contacts, thereby
activating the detection input on the alarm control panel. Conversely, if an intruder were to try to
defeat a PID, perhaps by holding some sort of thermal shield between himself and the PID, a
corresponding 'cold' spot moving across the face of the chip will also cause the relay to de-
energize — unless the thermal shield has the same temperature as the objects behind it.

Manufacturers recommend careful placement of their products to prevent false (non-

intruder caused) alarms. They suggest mounting the PIDs in such a way that the PID cannot 'see'
out of a window. Although the wavelength of infrared radiation to which the chips are sensitive
does not penetrate glass very well, a strong infrared source such as from a vehicle headlight or
sunlight reflecting from a vehicle window can overload the chip with enough infrared energy to
fool the electronics and cause a false alarm. A person moving on the other side of the glass
however would not be 'seen' by the PID.

They also recommended that the PID not be placed in such a position that an HVAC vent
would blow hot or cold air onto the surface of the plastic which covers the housing's window.
Although air has very low emissivity (emits very small amounts of infrared energy), the air
blowing on the plastic window cover could change the plastic's temperature enough to, once
again, fool the electronics.

PIDs come in many configurations for a wide variety of applications. The most common
used in home security systems has numerous Fresnel lenses or mirror segments and has an
effective range of about thirty feet. Some larger PIDs are made with single segment mirrors and
can sense changes in infrared energy over one hundred feet away from the PID. There are also
PIDs designed with reversible orientation mirrors which allow either broad coverage (110° wide)
or very narrow 'curtain' coverage.

PIDs can have more than one internal sensing element so that, with the appropriate
electronics and Fresnel lens, it can detect direction. Left to right, right to left, up or down and
provide an appropriate output signal.
How PIR Motion Sensors Work?

There are many different ways to create a motion sensor. Motion is detected when an
infrared emitting source with one temperature, such as a human body, passes in front of a source
with another temperature, such as a wall. It is common for stores to have a beam of light crossing
the room near the door, and a photosensor on the other side of the room. When a customer breaks
the beam, the photosensor detects the change in the amount of light and rings a bell. Many
grocery stores have automatic door openers that use a very simple form of radar to detect when
someone passes near the door. The box above the door sends out a burst of microwave radio
energy and waits for the reflected energy to bounce back. When a person moves into the field of
microwave energy, it changes the amount of reflected energy or the time it takes for the
reflection to arrive, and the box opens the door. Since these devices use radar, they often set off
radar detectors. The same thing can be done with ultrasonic sound waves, bouncing them off a
target and waiting for the echo.All of these are active sensors. They inject energy (light,
microwaves or sound) into the environment in order to detect a change of some sort.

The "motion sensing" feature on most lights (and security systems) is a passive system that
detects infrared energy. These sensors are therefore known as PIR (passive infrared) detectors or
pyroelectric sensors. Often, PIR technology will be paired with another model to maximise
accuracy and reduce energy usage. In order to make a sensor that can detect a human being, you
need to make the sensor sensitive to the temperature of a human body. Humans, having a skin
temperature of about 93 degrees F, radiate infrared energy with a wavelength between 9 and 10
micrometers. Therefore, the sensors are typically sensitive in the range of 8 to 12 micrometers.

The devices themselves are simple electronic components not unlike a photosensor. The infrared
light bumps electrons off a substrate, and these electrons can be detected and amplified into a
signal. You have probably noticed that your light is sensitive to motion, but not to a person who
is standing still. That's because the electronics package attached to the sensor is looking for a
fairly rapid change in the amount of infrared energy it is seeing. When a person walks by, the
amount of infrared energy in the field of view changes rapidly and is easily detected. You do not
want the sensor detecting slower changes, like the sidewalk cooling off at night.

Your motion sensing light has a wide field of view because of the lens covering the sensor.
Infrared energy is a form of light, so you can focus and bend it with plastic lenses. But it's not
like there is a 2-D array of sensors in there. There is a single (or sometimes two) sensors inside
looking for changes in infrared energy.

If you have a burglar alarm with motion sensors, you may have noticed that the motion sensors
cannot "see" you when you are outside looking through a window. That is because glass is not
very transparent to infrared energy. This, by the way, is the basis of a greenhouse. Light passes
through the glass into the greenhouse and heats things up inside the greenhouse. The glass is then
opaque to the infrared energy these heated things are emitting, so the heat is trapped inside the
greenhouse. It makes sense that a motion detector sensitive to infrared energy cannot see through
glass windows.
 SOUND GENERATOR (APR9600)

J1
1
2
v cc
VCC_ARROW
1k

J2 J3 U1 J4
1 J5
8 8 2 D1 28 1
7 7 3 D2 VCCD 1 2
6 6 4 D3 27 r 100k 2
led
5 5 5 D4 RECL 24 24 reset
4 4 D5 LEDa r

25
6 25
3 3 8 CE LED C1
2 2 9 D6 23 a 4.7µ J6
1 1 D7 PLAY
7 21 b 0.1µ 1
CON8 CON8 10 ROSC ANAOUT 20 220K C3 2
22k D8 ANAIN 19 22mf d led
11 ACC 17
100k 12 NU MICIN 18
13 VSS MICREF 16 4k7 1K
14 SP+ VCCA 15 0.1µ
SP- SP
led1
GN

J7
3

APR 9600 J8 J9
1 2 1
2 1 1
26

22

50k 2 2
J10 mic m1 m2
24

25
0.1µ
1
2 4k7
led 100k 100k

C6
100mf d 0.1µ
560e
6
1

2.2mf d LM386
3
7 + 5
4.7k 2
-
1000MFD/25V
4
8

J11
3

10E J12
1 2 J13 b
3 a 1
10K 1 2 0.1µ 2
2 1 3
0.1MFD mic switch
O/P a in 0.1µ
3

1 2

10K

It is a signal- chip voice recording and playback device of 60-second duration. The APR
9600 device offers true signal chip voice recording, non-volatile storage and playback capability
for 40 to 60-seconds. The device supports both random and sequential access of multiple
messages.
Sample rates are uses select able allowing designers to customize their design for unique
quality and storage time needs. Integrated out amplifier, microphone amplifier and AGC circuit
generally amplify system deign. The device is ideal for are in portable voice recorders, toys and
many other common and industrial applications.
ALUS integrated achieves these high levels of storage capability by using this property
analog / multilevel storage technology implemented in an advance flash non-volatile memory
process, where each memory cell can store 256 voltage levels.
This technology enable the APR9600 device to reproduce voice signal is their
natural form. It is eliminates the need for encoding and compression that often introduce
distance.

FEATURES

1. Single chip high quality voice recording and playback solutions.

2. No external Ic required
3. Minimum external components
4. Non-volatile flash memory technology
5. Uses selected managing options
6. Random access of multiple fixed –duration message.
7. Sequential access of multiple variable – duration message
8. Enable recording and it is pulled high for play back. To stack recording / playback,
switch the appropriate trigger pin.
PINOUT DIAGRAM

PIN DESCRIPTION

Pin No
PIN Pin Name
1 /M1-Message Message 1
2 /M2-Next Message 2
3 /M3-Message Message 3
4 /M4-Message Message 4
5 /M5-Message Message 5
6 /M6-Message Message 6
7 OCSR Oscillator resistance
8 /M7-END Message 7
9 /M7-OPTION Message 8
10 /BUSY Busy performance intended operation
11 BE Beep enable
12 VSSD Digital GND connection
13 VSSA Analog GND connection
14 SP+ Positive output for speaker connection
15 SP- Negative output for speaker connection
16 VCCA Analog positive power supply
17 MIC IN Microphone input
18 MIC REF Microphone GND reference
19 AGC Automatic gain control attack time
20 ANA-IN Analog in
 21 ANA-OUT Analog out
22 /STROBE Strobe
23 /CE Chip select
24 MSEL1 Mode select 1
25 MSEL2 Mode select 2
26 EXTCLK External clock
27 /RE Record enable
28 VCCD Digital positive power supply

MESSAGE MANAGEMENT
Playback and record operations are managed by on chip circuitry. There are several
available message modes depending upon desired operation. These message modes determine
message management style, message length and external part count. Therefore the designer must
select the appropriate operation modes refer engineering the design. Operation mode do not
affects voice quality.
The device support two types of modes Random access mode with 2,4 or 8 fixed duration
messages. Tape mode multiple- variable duration messages. This project uses the random access
mode.

RANDOM ACCESS MODE

Random access mode supports 2,4 or 8 message segments of fixed duration. As

suggested recording or playback can be mode randomly in any of the selected messages. The
length of each message segment is the total recording length available divided by the total
number of segment enabled.

Functional Description of Recording in Random Access Mode

On power up, the device is ready to record or play back, in any of the enabled
message segments. To record, /CE must be set low to enable the device and /RE must be set low
to enable recording message segments.
When actual recording begins the device responds with a single beep (if the BE pin is

high to enable the beep tone) at the speaker outputs to indicate that it has started recording.
Recording continues as long as the message pin stays low. The rising edge of the same message

trigger pin during record stops the recording operation (indicated with a single beep).

After the message trigger pin returns to high, the chip enters standby mode. Any
subsequent high to low transition on the same message trigger pin will initiate recording from the
beginning of the same message segment. The entire previous message is then overwritten by the
new message, regardless of the duration of the new message.

Functional Description of Playback in Random Access Mode

The playback, /CE must be set low to enable the device and /RE must be set high to
disable cording & enable playback. You initiate playback by applying a high to low edge on the
message trigger pin that representing the message segment you intend to playback. Playback will
continue until the end of the message is reached.

If a high to low edge occurs on the same message trigger pin during playback, playback
of the current message stops immediately.

If a message trigger pin is held low, the selected message is played back repeatedly as
long as the trigger pin stays low.
 AMPLIFIER

The LM386 IC has been designed to work with low voltages...between 4 to 15 volts. The
current taken from the power source or the batteries when standing by, is also quite small,
something around 3 mA's. If you add to these qualities the possibility of changing the
amplification power, you realize that the LM386 chip is an attractive circuit to work with.

In the schematic to the right, you see that there is a capacitor between pins #1 and #8.
This capacitor can be varied from 0.5uF to 10uF. With higher values employed, greater
amplification can be obtain...though the risk of oscillation also increases.

To avoid oscillation of the circuit, it is a must to connect a 100uF electrolytic capacitor

between pin #6 and ground. This capacitor is shunted in parallel with another one of 0.1uF. It can
be either ceramic or Mylar. You can attach to the ouput of this circuit, speakers from 8 ohms to
16 ohms. I experimented with small speakers and even one of 7 inches in diameter showed
excellent results the picture to the left is all of the components used in the LM386 audio
amplifier project.
 The LM386 IC (Integrated Circuit) is manufactured in an 8 pin dual in-line package and
it is good practice to mount it onto an 8 pin socket. This IC can deliver up to 0.5 (audio power)
watts without any kind of heat sink. This is when a 16 ohm loudspeaker is attached to the output,
together with a 9 volt power supply.

The LM386 IC has an ample field of experimentation...not only as an audio amplifier, but
also as a Wien bridge oscillator and a square wave oscillator.
MICRO CONTROLLER PROGRAM
#include <lcd.h>
#define MAX_MSGS 3

sbit Playbtn = P3^5;

sbit Play1 = P0^1;
sbit Play2 = P0^2;
sbit Play3 = P0^3;
sbit RecordIn = P3^7;
sbit RecordOut = P2^2;
sbit Mode = P3^3;
sbit Pyro = P3^4;
sbit Buzzer = P2^0;
sbit WelcomeMsg = P0^0;

int Current = 0x0;

int Played = 0x0;
int pCurrent = 0x0;

void RecordMsg(int Msg)

{
RecordOut = 0x1;
Delay(1);
switch (Msg)
{
case 0x1:
Play1 = 0x0;
break;
case 0x2:
Play2 = 0x0;
break;
case 0x3:
Play3 = 0x0;
break;
}
Delay(15);
Play1 = 0x1;
Play2 = 0x1;
Play3 = 0x1;
Delay(1);
RecordOut = 0x0;
}

void Playmsgs(int Counts)

{
//int Count;

if (Counts > pCurrent)

{
Counts = 1;
Played = 1;
Current = 0;
}
else if( Counts == Current )
{
Current = 0;
}

lcd_clear();
lcd_write_string("ANONYMOUS HELPER");

lcd_line2(0);
lcd_write_string("MSG PLAYING :");

lcd_write_digit(Counts);

switch(Counts)
{
case 1:
Play1 = 0x0;
Delay(15);
Play1 = 0x1;
break;
case 2:
Play2 = 0x0;
Delay(15);
Play2 = 0x1;
break;
case 3:
Play3 = 0x0;
Delay(15);
Play3 = 0x1;
break;
}
}

void main()
{
int Flag = 0x0;
int Count = 0x0;
long int i;

Buzzer = 0x00;
WelcomeMsg = 0x1;
Play1 = 0x1;
Play2 = 0x1;
Play3 = 0x1;
RecordOut = 0x0;

lcd_clear();
lcd_initialize();
lcd_clear();

lcd_write_string("ANONYMOUS HELPER");
lcd_line2(0);
lcd_write_string("WARMING UP..WAIT");
Delay(25);
while (1)
{
if (Mode) //IN
{
if (Flag != 0x1)
{
lcd_clear();
lcd_write_string("ANONYMOUS HELPER");

lcd_line2(0);
lcd_write_string("MODE:IN");
Flag = 0x1;
lcd_line2(9);
lcd_write_string("MSGS:");
lcd_write_digit(Current);
}
if (!Playbtn)
{
Flag = 0x6;
Playmsgs(++Played);
while(!Playbtn);
}
else if (Pyro)
{
Buzzer = 1;
for ( Count=0; Count<10; Count++ )
{
Delay(1);
if (!Playbtn)
 {
Buzzer = 0;
Flag = 0x6;

Playmsgs(++Played);
while(!Playbtn);
Count = 0;
}
}

Buzzer = 0;
while(Pyro);
}
}
else
{
if (Flag != 0x2)
{
lcd_clear();
lcd_write_string("ANONYMOUS HELPER");

lcd_line2(0);
lcd_write_string("MODE:OUT");
lcd_line2(9);
lcd_write_string("MSGS:");
lcd_write_digit(Current);
Flag = 0x2;
}
if (Pyro)
{
Delay(2);
if ( Current == MAX_MSGS )
{
lcd_clear();
lcd_write_string("MESSAGE FULL...");
Flag = 0x5;
Delay(5);
}
else
{
WelcomeMsg = 0x0;
for (Count = 0; Count<15; Count++)
{
Delay(1);
if (Mode)
{
 WelcomeMsg = 0x1;
Flag = 0x3;
break;
}
}
if (Flag == 0x3)
{
continue;
}
WelcomeMsg = 0x1;
for (i=0; i<95000; i++)
{
if (!RecordIn)
{
lcd_clear();
lcd_write_string("RECORDING...");
RecordMsg(++Current);
pCurrent = Current;
Flag = 0x5;
break;
}
}
}
while(Pyro);
}
}
}
}
 PCB DESIGNING
PCB PREPARATION TECHNIQUES

You need to generate a positive (copper black) UV translucent artwork film. You
will never get a good board without good artwork, so it is important to get the best possible
quality at this stage. The most important thing is to get a clear sharp image with a very solid
opaque black. Nowadays, artwork is drawn using either a dedicated PCB CAD program or a
suitable drawing/graphics package. It is absolutely essential that your PCB software prints holes
in the middle of pads, which will act as center marks when drilling. It is virtually impossible to
accurately hand-drill boards without these holes. If you’re looking to buy PCB software at any
cost level and want to do hand-prototyping of boards before production, check that this facility is
available. If you’re using a general-purpose CAD or graphics package, define pads as either a
grouped object containing a black-filled circle with a smaller concentric white-filled circle on top
of it, or as an unfilled circle with a thick black line (i.e. a black ring). When defining pad and line
shapes, the minimum size recommended for vias (through-linking holes) for reliable results is 50
mil, assuming 0.8mm drill size; 1 mil = (1/1000)th of an inch. You can go smaller with smaller
drill sizes, but through-linking will be harder. 65mil round or square pads for normal components
and DIL ICs, with 0.8mm hole, will allow a 12.5 mil, down to 10 mil if you really need to.
Centre-to-centre spacing of 12.5mil tracks should be 25 mil—slightly less may be possible if
your printer can manage it. Take care to preserve the correct diagonal track-track spacing on
mitered corners; grid is 25 mil and track width 12.5 mil. The artwork must be printed such that
the printed side is in contact with the PCB surface when exposing, to avoid blurred edges. In
practice, this means that if you design the board as seen from the component side, the bottom
(solder side) layer should be printed the ‘correct’ way round, and the top side of a double-sided
board must be printed mirrored.

Media
Artwork quality is very dependent on both the output device and the media used. It is not
necessary to use a transparent artwork medium—as long as it is reasonably translucent to UV, its
fine-less translucent materials may need a slightly longer exposure time. Line definition, black
opaqueness and toner/ink retention are much more important. Tracing paper has good enough
UV translucency and is nearly as good as drafting film for toner retention. It stays flatter under
laser-printer heat than polyester or acetate film. Get the thickest you can find as thinner stuff can
crickle. It should be rated at least 90 gsm; 120 gsm is even better but harder to find. It is cheap
and easily available from office or art suppliers.

Output devices
Laser printers offer the best all-round solution. These are affordable, fast, and good-quality.
The printer used must have at least 600dpi resolution for all but the simplest PCBs, as you will
usually be working in multiples of 0.06cm (40 tracks per inch). 600 dpi divides into 40, so you
get consistent spacing and line width. It is very important that the printer produces a good solid
black with no toner pinholes. If you’re planning to buy a printer for PCB use, do some test prints
on tracing paper to check the quality first. If the printer has a density control, set it to the
blackest. Even the best laser printers don’t generally cover large areas well, but usually this isn’t
a problem as long as fine tracks are solid. When using tracing paper or drafting film, always use
manual paper feed and set the straightest possible paper output path to keep the artwork as flat as
possible and minimize jamming. For small PCBs, you can usually save paper by cutting the sheet
in half. You may need to specify a vertical offset in your PCB software to make it print on the
right part of the page. Some laser printers have poor dimensional accuracy, which can cause
problems for large PCBs. But as long as any error is linear, it can be compensated by scaling the
printout in software. Print accuracy is likely to be a noticeable problem when it causes
misalignment of the sides on double-sided PCBs—this can usually be avoided by careful
arrangement of the plots on the page to ensure the error is the same on both layers; for example,
choosing whether to mirror horizontally or vertically when reversing the top-side artwork.

Photo resist PCB laminates

Always use good-quality, pre-coated photo resist fiberglass (FR4) board. Check
carefully for scratches in the protective covering and on the surface after peeling off the
covering. You don’t need darkroom or subdued lighting when handling boards, as long as you
avoid direct sunlight, minimize unnecessary exposure, and develop immediately after UV
exposure. Instagraphic Microtrak board develops really quickly, gives excellent resolution, and is
available in thin (0.8mm) and heavy copper flavors. On using spray-on photoresist, you will
always get dust settling on the wet resist. So it is not recommended unless you have access to a
very clean area or drying oven, or you only want to make low-resolution PCBs.

Exposure
The photo resist board needs to be exposed to UV light through the artwork, using a UV
exposure box. UV exposure units can easily be made using standard fluorescent lamp ballasts
and UV tubes. For small PCBs, two or four 8-watt, 30.5cm tubes will be adequate. For larger
(A3) units, four 38cm tubes are ideal. To determine the tube-to-glass spacing, place a sheet of
tracing paper on the glass and adjust the distance to get the most even light level over the surface
of the paper. Even illumination is a lot easier to obtain with 4-tube units. The UV tubes you need
are sold as replacements for UV exposure units, ‘black light’ tubes for disco lighting, etc. These
look white, occasionally black/blue when off, and light up with a light purple. Do not use short-
wave UV lamps like EPROM eraser tubes and germicidal lamps that have clear glass, because
these emit short-wave UV which can cause eye and skin damage. A timer that switches off the
UV lamps automatically is essential, and should allow exposure times from 2 to 10 minutes in
15- to 30-second increments. It is useful if the timer has an audible indication when the timing
period has completed. A timer from a scrap microwave oven would be ideal. Use glass sheet
rather than plastic for the top of the UV unit, as it will flex less and be less prone to scratches. A
combined unit, with switchable UV and white tubes, doubles as an exposure unit and a light-box
for lining up double- sided artworks. If you do a lot of double-sided PCBs, it may be worth
making a double-sided exposure unit, where the PCB can be sandwitched between two light
sources to expose both sides simultaneously. To find the required exposure time for a particular
UV unit and laminate type, expose a test piece in 30-second increments from 2 to 8 minutes,
develop, and use the time which gave the best image. Generally speaking, overexposure is better
than underexposure. For a single-sided PCB, place the artwork’s toner side up on the UV box
glass, peel off the protective film from the laminate, and place its sensitive side down on top of
the artwork. The laminate must be pressed firmly down to ensure good contact all over the
artwork. To expose double-sided PCBs, print the solder-side artwork as normal and the
component side mirrored. Place the two sheets together with the toner sides facing, and carefully
line them up, checking all over the board area for correct alignment, using the holes in the pads
as a guide. A light box is very handy here, but exposure can also be done with daylight by
holding the sheets on the surface of a window. If printing errors have caused slight mis-
registration, align the sheets to average the errors across the whole PCB, to avoid breaking pad
edges or tracks when drilling. When these are correctly aligned, staple the sheets together on two
opposite sides, about 10 mm from the edge of the board, forming a sleeve or envelope. The gap
between the board edge and staples is important to stop the paper distorting at the edge. Use the
smallest stapler you can find, so that the thickness of the staple is not much more than that of the
PCB. Expose each side, covering up the top side with a reasonably light-proof soft cover when
exposing the underside. Be very careful when turning the board over, to avoid the laminate
slipping inside the artwork and ruining the alignment. After exposure, you can usually see a faint
image of the pattern in the photosensitive layer.

Developing
Do not use sodium hydroxides for developing photo resist laminates. It is a completely
and utterly dreadful stuff for developing PCBs. Apart from its causticity, it is very sensitive to
both temperature and concentration, and made-up solution doesn’t last long. When it’s too weak
it doesn’t develop at all, and when too strong it strips all the resist off. It is almost impossible to
get reliable and consistent results, especially when making PCBs in an environment with large
temperature variations. A much better developer is a silicate-based product that comes as a liquid
concentrate. You can leave the board in it for several times the normal developing time without
noticeable degradation. This also means that it is not temperature critical—no risk of stripping at
warmer temperatures. Made-up solution also has a very long shelf-life and lasts until it’s used
up. You can make the solution up really strong for very fast developing. The recommended mix
is 1 part developer to 9 parts water. You can check for correct development by dipping the board
in the ferric chloride very briefly—the exposed copper should turn dull pink almost instantly. If
any shiny copper-colored areas remain, rinse and develop for a few more seconds. If the board is
under-exposed, you will get a thin layer of resist which isn’t removed by the developer. You can
remove this by gently wiping with dry paper towel, without damaging the pattern. You can either
use a photographic developing tray or a vertical tank for developing.
Etching
Ferric chloride etchant is a messy stuff, but easily available and cheaper than most
alternatives. It attacks any metal including stainless steel. So when setting up a PCB etching area,
use a plastic or ceramic sink, with plastic fittings and screws wherever possible, and seal any
metal screws with silicone. Copper water pipes may get splashed or dripped-on, so sleeve or
cover them in plastic; heat-shrink sleeving is great if you’re installing new pipes. Fume
extraction is not normally required, although a cover over the tank or tray when not in use is a
good idea. You should always use the hex hydrate type of ferric chloride, which should be
dissolved in warm water until saturation. Adding a teaspoon of table salt helps to make the
etchant clearer for easier inspection. Avoid anhydrous ferric chloride. It creates a lot of heat
when dissolved. So always add the powder very slowly to water; do not add water to the powder,
and use gloves and safety glasses. The solution made from anhydrous ferric chloride doesn’t etch
at all, so you need to add a small amount of hydrochloric acid and leave it for a day or two.
Always take extreme care to avoid splashing when dissolving either type of ferric chloride, as it
tends to clump together and you often get big chunks coming out of the container and splashing
into the solution. It can damage eyes and permanently stain clothing. If you’re making PCBs in a
professional environment, where time is money, you should get a heated bubble-etch tank. With
fresh hot ferric chloride, a PCB will etch in well under five minutes. Fast etching produces better
edge-quality and consistent line widths. If you aren’t using a bubble tank, you need to agitate
frequently to ensure even etching. Warm the etchant by putting the etching tray inside a larger
tray filled with boiling water.

Tin plating
Tin-plating a PCB makes it a lot easier to solder, and is pretty much essential for surface
mount boards. Unless you have access to a roller tinning machine, chemical tinning is the only
option. Unfortunately, tin-plating chemicals are expensive but the results are usually worth it. If
you don’t tin-plate the board, either leave the photo resist coating on (most resists are intended to
act as soldering fluxes) or spray the board with rework flux to prevent the copper from oxidizing.
Room-temperature tin-plating crystals produce a good finish in a few minutes. There are other
tinning chemicals available, some of which require mixing with acid or high-temperature use.
Ensure that the temperature of the tinning solution is at least 25oC, but not more than 40oC. If
required, either put the bottle in a hot water bath or put the tinning tray in a bigger tray filled
with hot water to warm it up. Putting a PCB in cold tinning solution will usually prevent tinning,
even if the temperature is subsequently raised. For a good tinned finish, strip the photoresist
thoroughly. Although you can get special stripping solutions and hand applicators, most resists
can be dissolved off more easily and cleanly using methanol (methylated spirit). Hold the rinsed
and dried PCB horizontal, and dribble few drops of methanol on the surface, tilting the PCB to
allow it to run over the whole surface. Wait for about ten seconds and wipe off with a paper
towel dipped in methanol. Rub the copper surface all over with wire wool until it is bright and
shiny. Wipe with a paper towel to remove the wire wool fragments and immediately immerse the
board in the tinning solution. Don’t touch the copper surface after cleaning, as finger marks will
impair plating. The copper should turn silver in colour within about 30 seconds. Leave the board
for about five minutes, agitating occasionally; do not use bubble agitation. For double-sided
PCBs, prop the PCB at an angle to ensure the solution gets to both sides. Rinse the board
thoroughly and rub dry with paper towel to remove any tinning crystal deposits. If the board isn’t
going to be soldered for a day or two, coat it with either a rework flux spray or a flux pen.

Drilling
If you have fibreglass (FR4) board, you must use tungsten carbide drill bits. Fibreglass
eats normal high-speed steel (HSS) bits very rapidly, although HSS drills are all right for odd
larger sizes (>2 mm). Carbide drill bits are expensive and the thin ones snap very easily. When
using carbide drill bits below 1 mm, you must use a good vertical drill stand—you will break
drill very quickly without one. Carbide drill bits are available as straight-shank or thick
(sometimes called ‘turbo’) shank. In straight shank, the whole bit is the diameter of the hole, and
in thick shank, a standard-size (typically about 3.5 mm) shank tapers down to the hole size. The
straight-shank drills are usually preferred because they break less easily and are usually cheaper.
The longer thin section provides more flexibility. Small drills for PCB use usually come with
either a set of collets of arious sizes or a 3-jaw chuck. Sometimes the 3-jaw chuck is an optional
extra and is worth getting for the time it saves on changing collets. For accuracy, however, 3-jaw
chucks aren’t brilliant, and small drill sizes below 1 mm quickly form grooves in the jaws,
preventing good grip. Below 1 mm, you should use collets, and buy a few extra of the smallest
ones, keeping one collet per drill size, as using a larger drill in a collet will open it out and it no
longer grips smaller drills well. You need a good strong light on the board when drilling, to
ensure accuracy. A dichroic halogen lamp, under-run at 9V to reduce brightness, can be mounted
on a microphone gooseneck for easy positioning. It can be useful to raise the working surface
about 15 cm above the normal desk height for more comfortable viewing. Dust extraction is nice,
but not essential—an occasional blow does the trick! A foot-pedal control to switch the drill ‘off’
and ‘on’ is very convenient, especially when frequently changing bits. Avoid hole sizes less than
0.8 mm unless you really need them. When making two identical boards, drill them both together
to save time. To do this, carefully drill a 0.8mm hole in the pad near each corner of each of the
two boards, getting the centre as accurate as possible. For larger boards, drill a hole near the
centre of each side as well. Lay the boards on top of each other and insert a 0.8mm track pin in
two opposite corners, using the pins as pegs to line the PCBs up. Squeeze or hammer the pins
into the boards, and then into the remaining holes. The two PCBs are now ‘nailed’ together
accurately and can be drilled together.

Cutting
A small guillotine is the easiest way to cut fibreglass laminate. Ordinary saws (bandsaws,
jigsaws, and hacksaws) will be blunted quickly unless these are carbide-tipped, and the dust can
cause sink irritation. A carbide tile-saw blade in a jigsaw might be worth a try. It’s also easy to
accidentally scratch through the protective film when sawing, causing photoresist scratches and
broken tracks on the finished board. A sheet-metal guillotine is also excellent for cutting boards,
provided the blade is fairly sharp. To make cut-outs, drill a series of small holes, punch out the
blank, and file to size. Alternatively, use a fretsaw or small hacksaw, but be prepared to replace
blades often. With practice it’s possible to do corner cutouts with a guillotine but you have to be
very careful that you don’t over-cut!
 SOLDERING

Soldering is the joining together of two metals to give physical bonding and good
electrical conductivity. It is used primarily in electrical and electronic circuitry. Solder is a
combination of metals, which are solid at normal room temperatures and become liquid at
between 180 and 200°C. Solder bonds well to various metals, and extremely well to copper.
Soldering is a necessary skill you need to learn to successfully build electronics circuits.
It is the primary way how electronics components are connected to circuit boards, wires and
sometimes directly to other components.
To solder you need a soldering iron. A modern basic electrical soldering iron consists of a
heating element, a soldering bit (often called the tip), a handle and a power cord. The heating
element can be either a resistance wire wound around a ceramic tube, or a thick film resistance
element printed onto a ceramic base. The element is then insulated and placed into a metal tube
for strength and protection. This is then thermally insulated from the handle. The heating element
of soldering iron usually reaches temperatures of around 370 to 400°C (higher than needed to
melt the solder). The soldering bit is a specially shaped piece of copper plated with iron and then
usually plated with chrome or iron. The tip planting makes it very resistant to aggressive solders
and fluxes.
The strength or power of a soldering iron is usually expressed in Watts. Irons generally used in
electronics are typically in the range 12 to 25 Watts. Higher powered iron will not run hotter, but
it will have more power available to quickly replace heat drained from the iron during soldering.
Most irons are available in a variety of voltages, 12V, 24V, 115V, and 230V are the most
popular. Today most laboratories and repair shops use soldering irons, which operate at 24V
(powered by isolation transformer supplied with the soldering iron or by a separate low voltage
outlet). You should always use this low voltage where possible, as it is much safer. For advanced
soldering work (like very tiny very sensitive electronics components), you will need a soldering
iron with a temperature control. In this type of soldering irons the temperature may be usually set
between 200 degC and 450 degC. Many temperature-controlled soldering irons designed for
electronics have a power rating of around 40-50W. They will heat fast and give enough power
for operation, but are mechanically small (because the temperature controller stops them from
overheating when they are not used).
You will occasionally see gas-powered soldering irons which use butane rather than the
mains electrical supply to operate. They have a catalytic element which, once warmed up,
continues to glow hot when gas passes over them. Gas-powered soldering irons are designed for
occasional "on the spot" use for quick repairs, rather than for mainstream construction or
assembly work.
You need to be careful in soldering because most electronic components are fragile, and
heat sensitive. Usually our biggest concern is heat. Low enough soldering temperature and short
enough soldering time keeps components in good shape. Electronics components are designed so
that they can take high temperatures on their contacts/wires for some time without damage (to
withstand the soldering). Prolonged exposure to high temperature will heat up when inside of the
component can cause damage to it.
Currently, the best commonly available, workable, and safe solder alloy is 63/37. That is,
63% lead, 37% tin. It is also known as eutectic solder. Its most desirable characteristic is that its
solids ("pasty") state, and its liquid state occur at the same temperature -- 361 degrees F. The
combination of 63% lead and 37% tin melts at the lowest possible temperature. Nowadays there
is tendency to move to use lead free solders, but it will takes years until they will catch on
normal soldering work. Lead free solders are nowadays available, but they are generally more
expensive and/or harder to work on than traditional solders that have lead in then,
The metals involved are not the only things to consider in a solder. Flux is vital to a good
solder joint. Flux is an aggressive chemical that removes oxides and impurities from the parts to
be soldered. The chemical reactions at the point(s) of connection must take place for the metals
to fuse. RMA-type flux (Rosin Mildly Active) is the least corrosive of the readily available
materials, and provides an adequate oxide removal.
In electronics a 60/40 fluxed core solder is used. This consists of 60% Lead and 40% Tin,
with flux cores added through the length of the solder.
There are certain safety measures which you should keep in mind when soldering. The tin
material used in soldering contains dangerous substances like lead (40-60% of typical soldering
tins are lead and lead is poisonous). Also the various from the soldering flux can be dangerous.
While it is true that lead does not vaporize at the temperatures at which soldering is typically
done, particulate matter is just as dangerous as fumes would be in terms of poisoning and there is
particulate lead present to some extent in the fumes from your flux.
When soldering keep the room well ventilated and use a small fan or fume trap. A proper
fume trap or a fan will keep the most pollution away from your face. Professional electronics
workshops use expensive fume extraction systems to protect their workers (needed for working
safety reasons). Those fume extraction devices have a special filter, which filters out the
dangerous fumes. If you can connect a duct to the output from the trap to the outside, that would
be great.
Always wash hands prior to smoking, eating, drinking or going to the bathroom. When
you handle soldering tin, your hands will pick up lead, which needs to be washed out from it
before it gets to your body. Do not eat, drink or smoke whilst working with soldering iron. Do
not place cups, glasses or a plate of food near your working area.
Wash also the table sometimes. As you solder, at times there will be a bit of spitting and
sputtering. If you look you'll see tiny balls of solder that shoot out and can be found on your
soldering table.
The soldering iron will last longer with proper care. Before and during use wipe the bit
on a damp sponge. Most bench stands incorporate a sponge for this purpose. When using a new
bit, apply solder to it as it heats up. Always keep a hot iron in a bench stand, or suspended by the
hook, when not in use. Turn of the iron when you do not use it. Periodically remove the bit and
clear away any oxide build up. Regularly check the mains lead for burns or other damage
(change mains lead if necessary).
 PCB LAYOUT

Power supply

Micro controller
Sound generator and Amplifier
 CONCLUSION

In this modern world people are forced to use more and more electronics devices in their
daily life. Among these, electronic control systems deserve most importance. The strain and time
of people in their day-to-day life are reduced to the minimum by the use of such system

Here we introduce an advanced interesting project. The hardware unit consists of a PIR
sensor, mode switch, record switch, play switch, sound generator and amplifier circuit, LCD, and
micro controller circuitry as the main part
 ORGANIZATION OF PROJECT

Our project was broadly classified into six phases:

1. Idea development
2. Component identification
3. Bread board verification of designed circuit
4. Micro controller study and programming
5. PCB fabrication and soldering

We could successfully complete all the phases and develop the desired product in the given
time frame
 BIBILOGRAPHY

8051 programming using C -- WILLY

Website:

www.alldatasheet.com

www.electronicsforu.com

www.atmel.com
DATASHEET