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Microelectronic Engineering
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a r t i c l e i n f o a b s t r a c t
Article history: P3HT thin film transistors (TFT) have been fabricated using inkjet printing technique. The present work
Received 27 June 2008 aims at the systematic study of the impact of distributed contact resistance including field dependent
Received in revised form 7 March 2009 mobility. The coupled analysis is not yet explored for polymer organic thin film transistors. Numerical
Accepted 10 April 2009
simulations are performed to study the coupled influence of field mobility and distributed contact resis-
Available online 19 April 2009
tance on the FET device behavior. Considering the influence of field mobility and distributed contact
resistance, simulated results are consistent with our experimental results.
Keywords:
Published by Elsevier B.V.
Polymer transistor
Distributed contact resistance
Numerical modeling
Organic microelectronics and optoelectronics have a rapid Several devices were fabricated on heavily n-doped silicon,
development due to the attractive properties and applications of which also works as the gate electrode. A layer of 1000 Å thick
organic materials. P3HT is among popular organic materials silicon oxide was thermally grown for the gate insulator. Then
investigated [1,2]. Numerical solutions are used to study the source and drain (S/D) electrodes were deposited. After that,
physics of organic devices, such as the effects of traps [3–6], field 50 nm poly (3-hexylthiophene) (P3HT) was spin coated as a chan-
dependent mobility models [7,8], device structures (bottom con- nel material to form transistors as shown in Fig. 1. In this work,
tact and top contact) [8,9], channel length [10], electrode contact two types of contacting techniques were used. One is for long
[11], etc. channel (20 lm) using conducting polymer PEDOT-PSS as the
The impact of distributed resistance on the performance of the electrode material. The other is for short channel (5 lm) using
TFT has not been explored yet in conjunction with the field depen- gold as the electrode material. We have found that by modifying
dence mobility. In this paper, we report a two-dimensional simula- the commercial PEDOT-PSS, its contact resistance with P3HT is
tion of electrical characteristics of P3HT TFTs. The objective of the significantly lower than that of gold with P3HT. An n+-Si substrate
work is to study the coupled influence of field mobility, and dis- with thermally grown 100 nm silicon oxide was used as the sub-
tributed contact resistance on P3HT thin film transistors. The field strate. PEDOT-PSS was printed as the source and drain (S/D) elec-
dependent mobility and contact resistance models are incorpo- trodes. The gold S/D contact electrodes were formed by
rated in a numerical simulator for analysis. The technology com- lithography and lift-off processes. Finally, The PEDOT-PSS used
puter-aided design (TCAD) tool Taurus-device (SynopsysÒ) is was modified to be highly conductive as compared to the com-
employed to implement the simulation of the device characteris- mercial one [12]. The channel lengths are 20 lm and 5 lm for de-
tics. A field dependent mobility model is implemented in the vices with PEDOT-PSS and gold contacts, respectively. In both of
numerical simulator via the Taurus PMEI (physical model equation the devices, n+-Si serves as gate electrode. The devices were char-
interface) to include user defined mobility models. The simulation acterized on Keithley 236 source measure units at room temper-
results agree well with the experimental results. ature in air.
* Corresponding author. Tel.: +1 318 257 4483; fax: +1 318 257 5104. The schematic of the P3HT TFT at room temperature are shown
E-mail address: khaliq@latech.edu (A. Khaliq). in Fig. 1. The on/off current ratio is measured above 103. Field effect
Fig. 2. Simulation of output characteristics of long channel device with field Fig. 5. Simulation of output characteristics of short channel device with field
dependence mobility model. dependence mobility and contact resistance.
Table 1
Material properties used for numerical simulations.
is optimized for each bias step. The simulated and measure results
are in good agreement. The band diagrams of metal and organic
semiconductor and material properties of metal contact and organ-
ic semiconductor are listed in Table 1 (see Fig. 6).
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